TW202030504A - Prism, optical device, method for manufacturing prism, and method for manufacturing package device - Google Patents

Abstract

Provided is a prism such that the accuracy with which the prism is positioned is effectively increased. The prism is characterized by including a prism body 2 which has a bottom face 2a and an inclined face 2b that is connected to the bottom face 2a, and an adhesion film 3 which is provided on the bottom face 2a, wherein the adhesion film 3 has a first layer portion that is positioned on a most prism body 2 side and a second layer portion 6 that is stacked directly or indirectly on the first layer portion 5, and the second layer portion 6 includes at least one of an Au layer and a Sn layer.

Description

Manufacturing method of optical device, optical device, manufacturing method of optical device, and manufacturing method of packaging device

The present invention relates to a method for manufacturing a beam, an optical device, a method for manufacturing a beam, and a packaging device.

In recent years, in applications such as displays, car headlights, or projectors, there has been widespread use for reflecting or refracting light from a light source. The following Patent Document 1 discloses an example of an optical device including such a scallop. In Patent Document 1, a laser chip and a laser beam are arranged on a mounting substrate including a semiconductor disc. The laser chip and the beam are joined to the mounting substrate by solder. Prior art literature Patent literature

[Patent Document 1] Japanese Patent Laid-Open No. 2000-091688

[The problem to be solved by the invention]

In the optical device, since it is necessary to adjust the direction of the light path with higher accuracy, a higher position accuracy is required for the joint arrangement of the 稜鏡. However, when a high-output LD (Laser Diode) is used as the light source that emits light to the beam, if a resin-containing adhesive is used to connect the beam to the mounting substrate, etc. The adhesive is softened, causing the risk of shifting the position of the nail. On the other hand, the mounting using solder as described in Patent Document 1 is accompanied by the melt flow of the solder as a whole, so there is a risk of a position shift in the height direction before and after mounting. Therefore, it is relatively difficult to sufficiently improve the positional accuracy when bonding and arranging it on a mounting board or the like, as described in Patent Document 1. Moreover, there are problems even in terms of workability and cost of assembly.

The object of the present invention is to provide an optical device that can effectively improve the position accuracy of the optical device, the optical device using the optical device, the manufacturing method of the optical device, and the manufacturing method of the packaging device. [Technical means to solve the problem]

The characteristic of the scallop of the present invention is that it has: a scallop body having a bottom surface and an inclined surface connected to the bottom surface; and an adhesive film disposed on the bottom surface; and the adhesive film has a first layer part on the side of the scallop body, and a direct Or the second layer part is indirectly laminated on the first layer part, and the second layer part includes at least one of the Au layer and the Sn layer.

Preferably, in the second layer portion, Au layers and Sn layers are alternately laminated.

Preferably, the second layer portion has both an Au layer and a Sn layer, and an Au-Sn layer including an alloy of Au and Sn is arranged between the Au layer and the Sn layer.

In the lamination direction of the adhesive film, when the side away from the main body of the scallop is set to the outside, the outermost layer of the second layer portion is preferably an Au layer.

Preferably, the second layer part has a plurality of Au layers and a plurality of Sn layers, the Au layers and Sn layers are alternately laminated, and the second layer part has a stress relaxation layer, and the stress relaxation layer is a plurality of Au layers In the case of one of the layers, the thickness of the stress relaxation layer is different from the average thickness of other Au layers. When the stress relaxation layer is one of a plurality of Sn layers, the thickness of the stress relaxation layer is different from the average thickness of other Sn layers . In this case, the thickness of the stress relaxation layer is more preferably 1/2 or more and 5 times or less of the average thickness of other Au layers or other Sn layers. In addition, the thickness of the stress relaxation layer is more preferably 1/5 or more and 1/2 or less of the average thickness of other Au layers or other Sn layers.

Preferably, in the lamination direction of the adhesive film, when the side away from the main body is set to the outside, the outermost layer of the second layer portion is the thinnest layer in the second layer portion. In this case, in the second layer, it is more preferable that the layer on the outside is thinner

Preferably, the second layer portion has both of a plurality of Au layers and a plurality of Sn layers, and the thickness of the plurality of Au layers is the same as each other, and the thickness of the plurality of Sn layers is thicker the outside.

Preferably, the second layer portion has both of a plurality of Au layers and a plurality of Sn layers, and the thickness of the plurality of Au layers becomes thinner as they are located outside, and the thickness of the plurality of Sn layers is the same.

The total number of Au layers and Sn layers in the second layer portion is preferably 3 layers or more and 99 layers or less. In this case, the total number of layers of the Au layer and the Sn layer in the second layer portion is more preferably 15 layers or more and 35 layers or less.

The overall thickness of the adhesive film is preferably 1 μm or more and 10 μm or less.

The second layer part has both an Au layer and a Sn layer. In the second layer part, the total weight of Au is M _A , the total weight of Sn is M _S , and the weight of Au is relative to Au the ratio of the total weight of Sn and the set of _{M A / (M A + M} S) , the ratio _{M A / (M A + M} S) is preferably 0.65 or more and 0.78 or less, more preferably 0.60 or more and 0.75 or less.

In another aspect of the present invention, the bead is installed in a package, and it has: a bead body having a bottom surface and an inclined surface connected to the bottom surface; and an adhesive film provided on the bottom surface; and the adhesive film has an edge The first layer part of the mirror body side and the second layer part directly or indirectly laminated on the first layer part, and the second layer part is the Au-Sn layer containing the alloy of Au and Sn, and the second layer of the adhesive film The thickness of the layer is 2.5 μm or more and 5.9 μm or less.

Preferably, in the lamination direction of the adhesive film, when the side far from the main body of the adhesive film is set to the outside, the adhesive film has the outermost layer as the outermost layer of the adhesive film and is laminated on the second layer, and the outermost layer Part is Au layer.

In the layering direction of the adhesive film, when the side away from the main body of the adhesive film is set to the outside, the arithmetic average roughness Ra of the outermost layer of the adhesive film is preferably 0.20 μm or less.

The first layer portion is preferably a Cr layer, Ti layer, or Ta film.

The adhesive film preferably further has an intermediate layer portion laminated between the first layer portion and the second layer portion. In this case, the intermediate layer part is more preferably a Ni layer, a Pt layer, a Pd layer, a Ni-Cr mixed layer, or an alloy layer formed by combining them.

The main body has an upper surface, and the upper surface preferably faces the bottom surface and is connected to the inclined surface.

Preferably, a reflective film is provided on the inclined surface of the main body. Furthermore, it is preferable to provide a reflective film on the inclined surface and upper surface of the main body.

The optical device of the present invention is characterized by comprising: the above-mentioned beam; an optical element which emits light to the beam or receives light from the beam; and a package body which houses the beam and the optical element; The film is bonded to the package body.

The manufacturing method of the 稜鏡 of the present invention is characterized in that it is provided with a step of arranging an adhesive film on the bottom surface of the 稜鏡 body having a bottom surface and an inclined surface connected to the bottom surface, and the step of arranging the adhesion film includes: The step of the first layer part of the material; and the step of directly or indirectly laminating the second layer part containing the metal material on the first layer part; and the first layer part and the second layer part contain mutually different components The metal material, the second layer part includes at least one of an Au layer and a Sn layer.

The manufacturing method of the packaging device of the present invention is characterized by the step of preparing the above-mentioned ridge; the step of preparing the package body with the bonding surface to the ridge; and the bonding film abuts on the bonding surface of the package body to make the edge The step of abutting the mirror with the package body; and the step of heating the adhesive film to bond the stalk and the package body.

Preferably, an Au film is formed on the bonding surface of the package, and the adhesive film is heated at a temperature at which the entire adhesive film does not melt to bond the scallop to the package. [Effects of Invention]

According to the invention, the optical device, the manufacturing method of the optical device, and the manufacturing method of the packaging device can effectively improve the position accuracy of the optical device.

Hereinafter, preferred embodiments will be described. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments. In addition, in each drawing, there are cases in which members having substantially the same function are referred to with the same symbols.

(稜鏡) (First Embodiment) Figure 1 is a cross-sectional view of the first embodiment of the present invention. As shown in FIG. 1, the bead 1 includes a bead main body 2, an adhesion film 3, and a reflective film 4. The main body 2 has a generally trapezoidal cross-sectional shape. The main body 2 has a bottom surface 2a, an inclined surface 2b connected to the bottom surface 2a, and an upper surface 2c opposite to the bottom surface 2a and connected to the inclined surface 2b. Furthermore, the cross-sectional shape of the main body 2 is not limited to a substantially trapezoidal shape, and may be substantially triangular or the like. In this embodiment, the main body 2 contains a suitable glass material.

An adhesive film 3 is provided on the bottom surface 2 a of the main body 2. A reflective film 4 is provided on the inclined surface 2b of the main body 2 of the 稜鏡. The ridge 1 is bonded to the mounting substrate or package body of the optical device or the packaging device through the adhesive film 3.

Fig. 2 is an enlarged cross-sectional view showing the vicinity of the adhesive film of 稜鏡 in the first embodiment. As shown in FIG. 2, the adhesive film 3 is a laminate of a plurality of metal layers. Specifically, the adhesive film 3 has a first layer portion 5 located on the side closest to the main body 2 and a second layer portion 6 laminated on the first layer portion 5. In this embodiment, the second layer portion 6 is directly laminated on the first layer portion 5. Furthermore, the second layer portion 6 may be laminated on the first layer portion 5 indirectly via other layers.

The first layer is a 5-series Cr layer. Of course, the first layer portion 5 only needs to have a relatively high adhesiveness with the main body 2 of the adhesive film 3, and is not limited to the Cr layer. For example, the first layer portion 5 may also be a Ti layer or a Ta layer.

Furthermore, in the present invention, a small amount of impurities or additives are allowed in each metal layer. Specifically, the Cr layer is a metal layer containing 95% by weight or more of Cr. In addition, the Ti layer is a metal layer containing 95% by weight or more of Ti. In addition, the Ta layer is a metal layer containing 95% by weight or more of Ta. Cr, Ti, and Ta function as an adhesive layer with glass, and if the content of Cr, Ti, and Ta is within the above range, the effect of the present invention will not be impaired.

In this embodiment, the second layer portion 6 is a layered body in which a first layer 6a, a second layer 6b, a third layer 6c, a fourth layer 6d, and a fifth layer 6e are sequentially laminated. Here, in the lamination direction of the adhesive film 3, the side of the scallop main body 2 is set to the inside, and the side away from the scallop main body 2 is set to the outside. In the second layer portion 6, the fifth layer 6e is the outermost layer.

The first layer 6a is an Au layer, the second layer 6b is an Sn layer, the third layer 6c is an Au layer, and the fourth layer 6d is an Sn layer, and the fifth layer 6e is an Au layer as the outermost layer. In the second layer portion 6, Au layers and Sn layers are alternately laminated. In addition, the second layer portion 6 may include at least one of an Au layer and a Sn layer, and the number of layers is not limited to the above.

Furthermore, in the present invention, the Au layer contains a metal layer of 95% by weight or more Au. In addition, the Sn layer is a metal layer containing 95% by weight or more of Sn. Depending on the degree of refinement of Au or Sn, impurities may be mixed into the metal layer. The impurities are represented by Fe, Cr, Ni, etc., but if the content of each of Au and Sn is in the above range, the effect of the present invention will not be impaired.

The reflective film 4 includes, for example, a dielectric multilayer film in which a high refractive index film and a low refractive index film are alternately laminated. As the material of the high refractive index film, for example, TiO ₂ , Ta ₂ O ₅ , ZrO ₂ or HfO _{2 can be} cited. As the material of the low refractive index film, for example, SiO ₂ or MgF _{2 can be} cited. In addition, a metal film may also be used as the reflective film 4. The reflective film 4 can be provided on at least a part of the inclined surface 2b of the main body 2, for example, on the entire surface of the inclined surface 2b. Since the inclined surface 2b is provided with the reflective film 4, the light emitted from the light source can be better reflected. Furthermore, the reflection film 4 is not required to be included in the 稜鏡1.

The adhesion film 3 and the reflective film 4 can be formed by laminating each layer by, for example, a sputtering method or a vacuum evaporation method.

The feature of this embodiment is that the adhesive film 3 provided on the bottom surface 2a of the main body 2 has a first layer portion 5 and a second layer portion 6 including at least one of an Au layer and a Sn layer. In this way, the position accuracy of the pin 1 in the optical device can be effectively improved. The details will be described below.

The ridge 1 of the present embodiment can be joined to a package or the like without the melt flow of the entire adhesive film 3. Specifically, as shown in FIG. 9, first, the 稜鏡 1 is placed on a package or the like. Specifically, the bonding surface 1 is placed in a package or the like to adhere the bonding surface 1. At this time, it is preferable to provide a metal film such as an Au film as an auxiliary layer for assisting the bonding with the adhesion film 3 on the portion where the nail 1 is placed (the inner surface of the package in this embodiment). Next, the adhesive film 3 of the ridge 1 is heated at a temperature at which the entire adhesive film 3 does not melt. The heating temperature is not particularly limited, and for example, it may be heated at 300°C or higher and 350°C or lower. By heating the adhesive film 3, metals are mutually diffused in the Au layer and the Sn layer, and the adhesive film 3 is alloyed. At this time, the Au film, which is the metal film on the inner surface of the package, and the Au layer of the outermost layer of the adhesion film 3 are mutually diffused, and then the Au layer and the Sn layer constituting the adhesion film 3 are also mutually diffused and alloyed. Thereby, the adhesive film 3 is integrated with the metal film such as the package, and the scallop 1 is bonded to the package and the like. In this way, for example, a packaging device can be manufactured preferably. Alternatively, the optical device 1 used in the optical device may be mounted on a package or the like.

In this way, since the melting of the entire adhesive film 3 is not accompanied, the thickness of the adhesive film 3 does not change easily before and after the bonding of the adhesive film 1, so that the positional deviation of the height direction of the adhesive film body 2 is unlikely to occur. Similarly, since the entire adhesive film 3 is not melted, it is not easy to cause the horizontal position shift of the main body 2 before and after the joining of the main body 1. Therefore, the position accuracy of 稜鏡1 can be effectively improved. In addition, in the assembling step of the package, since the previous solder coating step can be omitted, that is, it is only necessary to place the scallop 1 with the adhesive film 3 on the package, etc., thereby improving workability and cost efficiency.

Furthermore, unlike the adhesive agent containing resin, the adhesive film 3 contains metal. Therefore, deterioration due to moisture or oxygen or deterioration due to light is less likely to occur, and reliability can be improved. In addition, since no gas is generated after the bonding of the ridge 1 and the package, etc., impurities are not likely to adhere to the reflective film 4 or the optical element 74 described later, and the reflectance or transmittance is not easily deteriorated.

Furthermore, in the above, there is an exemplified case of heating and bonding in a state where the scallop 1 is placed on the package. If the adhesive film 3 of the scallop 1 is in contact with the adhesive surface of the package, then bonding is performed. The shape or state of the package body and the frame 1 are not limited to the above. For example, it may be a state in which the package body is placed on the ridge 1, or a state in which the ridge 1 and the package in a contact state are clamped by a clamp device or the like.

In the adhesive film 3, the Au layer and the Sn layer are preferably laminated alternately. As a result, during mounting, metals can be more reliably interdiffused in the Au layer and the Sn layer, and the Au layer and the Sn layer can be alloyed more reliably. Therefore, when mounting the ridge 1 to a package or the like, the bonding force of the adhesive film 3 can be improved more reliably.

The thickness of the entire adhesive film 3 is preferably 1 μm or more, more preferably 3 μm or more. Thereby, the joining force can be improved more sufficiently. The thickness of the entire adhesive film 3 is preferably 10 μm or less, more preferably 5 μm or less. In this case, the layers of metal interdiffusion during installation can be thinned. Thereby, the time required for the mutual diffusion of metals in each layer of the adhesion film 3 to the extent that does not cause peeling can be shortened, and the time for alloying of the adhesion film 3 can be shortened. Therefore, productivity can be further improved. In addition, since the adhesive film 3 used is thinner, the positional deviation of the height direction of the scallop body 2 becomes smaller, so that the position accuracy of the scallop 1 can be further effectively improved.

The total number of layers of the Au layer and the Sn layer in the second layer portion 6 of the adhesive film 3 is preferably 3 layers or more, more preferably 15 layers or more. Thereby, the thickness of each layer in the second layer portion 6 can be further reduced. Therefore, during installation, the time for alloying the adhesive film 3 can be further shortened, and the productivity can be further improved.

The total number of Au layers and Sn layers in the second layer portion 6 is preferably 99 layers or less. In consideration of productivity, it is more preferably 39 layers or less, and still more preferably 35 layers or less. When the number of layers of the second layer portion 6 is too large, each layer becomes too thin, and it may be difficult to form each layer.

The second layer portion 6 may also have an Au-Sn layer laminated between the Au layer and the Sn layer and including an alloy of Au and Sn. In this case, it is possible to further effectively shorten the alloying time of the adhesive film 3 during installation, and to further effectively improve the productivity. Furthermore, the Au-Sn layer can be formed in a short time by two-source evaporation or two-source sputtering using a vacuum evaporation method or a sputtering method.

Furthermore, the Au-Sn layer can be formed by alloying a part of the adjacent Au layer and Sn layer when the adhesive film 3 is formed. For example, the Au-Sn layer can be formed by alloying a part of the Au layer and the Sn layer by the energy when the Au layer and the Sn layer are laminated under appropriate conditions such as a sputtering method or a vacuum evaporation method.

The outermost layer in the second layer portion 6 is preferably an Au layer. As a result, during mounting, the outermost layer in contact with the package body is less likely to be oxidized, and the bonding force can be improved more reliably.

Here, let the total weight of Au in the adhesive film 3 be M _A , let the total weight of Sn be M _S , and let the ratio of the weight of Au to the total weight of Au and Sn be M _A / (M _A + M _S ). At this time, the ratio M _A /(M _A +M _S ) is preferably greater than 0.78 and less than 0.82, particularly preferably 0.8. In this case, the melting point (eutectic temperature) of Au and Sn can be set to about 280°C, and the adhesion film 3 can be alloyed at a low temperature. Therefore, it is possible to bond the 稜鏡 1 to the package or the like at a low temperature.

Here, as described above, it is preferable that a metal film such as an Au film is formed on the package or the like on which the frame 1 is mounted. When bonding the 稜鏡 1 to the portion where the Au film is formed, such as a package, the Au film is sandwiched to the adhesion film 3. Therefore, the weight ratio M _A /(M _A +M _S ) of the adhesive film 3 after alloying becomes larger than that before alloying. Therefore, in this case, the ratio M _A /(M _A +M _S ) of the weight of Au in the adhesive film 3 is preferably 0.60 or more and 0.78 or less, and more preferably 0.68 or more and 0.75 or less. By setting the ratio M _A /(M _A +M _S ) of the adhesive film 3 before alloying within the above range, the ratio of the Au film and the adhesive film 3 after alloying M _A /(M _A + M _S ) is greater than 0.78 and less than 0.82. Thereby, the melting point (eutectic temperature) of Au and Sn can be set to about 280°C, and the adhesion film 3 can be alloyed at a low temperature. Therefore, it is possible to more surely bond the 稜鏡 1 to the package or the like at a low temperature.

As in the present embodiment, the main body 2 preferably has an upper surface 2c opposite to the bottom surface 2a and connected to the inclined surface 2b. In this case, since it is easy to hold the bead 1 when moving the bead 1, the bead 1 can be easily installed. Furthermore, the main body 2 does not have to have an upper surface 2c, and the cross-sectional shape may be substantially triangular or the like.

(Second Embodiment) Fig. 3 is an enlarged cross-sectional view showing the vicinity of the adhesive film of the scallop in the second embodiment of the present invention. As shown in FIG. 3, the ridge 11 of this embodiment differs from the first embodiment in that the layer located on the outer side of the second layer portion 16 of the adhesive film 13 becomes thinner. Specifically, in the thickness of the first layer 1 16a is set to T _a, the thickness of the second layer 2 16b is set to T _b, the thickness of the layer 3 16c to T _c, the thickness of the fourth layer 16d to T _d , when the thickness of the fifth layer 16e is set to T _e , it satisfies T _a > T _b > T _c > T _d > T _e . Except for the above-mentioned points, the 稜鏡 11 of this embodiment has the same structure as the 稜鏡 1 of the first embodiment.

Even in this embodiment, as in the first embodiment, the scallop 11 can be bonded to the package or the like without the melting of the adhesive film 13. Therefore, the position accuracy of the 稜鏡 11 can be effectively improved.

In addition, since the fifth layer 16e is the outermost layer, the layer adjacent to the fifth layer 16e is only the fourth layer 16d located inside. Therefore, when the adhesion film 13 is alloyed, the third layer 16c or the fourth layer 16d generates mutual diffusion through both the outer and inner surfaces, but the fifth layer 16e generates mutual diffusion only through the inner surface. Here, in this embodiment, the fifth layer 16e is the thinnest layer in the second layer portion 16. Therefore, since the interdiffusion time required for alloying in the fifth layer 16e can be effectively shortened, the fifth layer 16e can be alloyed more reliably, and the alloying time can be shortened. Therefore, the adhesion film 13 can be alloyed more reliably, the bonding force can be improved more reliably, and the productivity can be improved.

In addition, in the second layer portion 16 of the adhesive film 13, the layer located on the outside becomes thinner. Thereby, even if the fifth layer 16e is made thin, the layers other than the fifth layer 16e can be alloyed more reliably. Therefore, the adhesion film 13 can be alloyed more reliably, and the bonding force can be improved more reliably.

Furthermore, in the second layer portion 16, the fifth layer 16e may be the thinnest layer, and at least two layers have the same thickness. The relationship between the thickness of each layer of the second layer portion 16 can also be T _a ≧T _b ≧T _c ≧T _d >T _e .

(Third Embodiment) Fig. 4 is an enlarged cross-sectional view showing the vicinity of the adhesive film of the scallop in the third embodiment of the present invention. The thickness of each layer of the adhesive film can be changed from the thickness in the first embodiment as follows. For example, the 稜鏡 21 of this embodiment can also be configured as follows: in the second layer portion 26 of the adhesive film 23, the thickness of the plurality of Au layers is the same as each other, and the thickness of the plurality of Sn layers is located on the outer side The thicker. Specifically, in the thickness of the first layer 1 26a is set to T _a, the thickness of the second layer 2 26b is set to T _b, the thickness of the layer 3 26c to T _c, the thickness of the fourth layer 26d to T _d , when the thickness of the fifth layer 26e is set to T _e , the thickness of the Au layer is T _a =T _c =T _e , and the thickness of the Sn layer is T _b <T _d . In points other than the above, the 稜鏡 21 of the present embodiment has the same configuration as the 稜鏡 1 of the first embodiment.

Even in this embodiment, as in the first embodiment, the scallop 21 can be joined to the package or the like without being accompanied by the melt flow of the entire adhesive film 23. In addition, when the adhesion film 23 is alloyed, the weight ratio of Sn on the outer side can be increased compared to the inner side, and the position accuracy of the stalk 21 can be further effectively improved.

(Fourth Embodiment) Fig. 5 is an enlarged cross-sectional view showing the vicinity of the adhesive film of the scallop in the fourth embodiment of the present invention. The thickness of each layer of the adhesive film can be changed from the thickness in the first embodiment as follows. For example, the 稜鏡 31 of the present embodiment can also be configured as follows: In the second layer portion 36 of the adhesive film 33, the thickness of the plurality of Au layers becomes thinner as the outer side, and the thickness of the plurality of Sn layers They are the same. Specifically, in the thickness of the first layer 1 36a is set to T _a, the thickness of the second layer 2 36b is set to T _b, the thickness of the layer 3 36c to T _c, the thickness of the fourth layer 36d to when T _d, the thickness of the fifth layer 36e is set to T _e, the thickness of the Au layer as _{T a> T c> T e} , the thickness of the Sn layer is T _b = T _d. Except for the above-mentioned points, the 稜鏡 31 of the present embodiment has the same configuration as the 稜鏡 1 of the first embodiment.

Even in this embodiment, as in the first embodiment, the scallop 31 can be bonded to the package or the like without being accompanied by the melt flow of the entire adhesive film 33. In addition, when the adhesion film 33 is alloyed, the weight ratio of Sn on the outer side can be increased compared to the inner side, and the position accuracy of the stalk 31 can be further effectively improved.

(Fifth Embodiment) Fig. 6 is an enlarged cross-sectional view showing the vicinity of the adhesive film of the scallop in the fifth embodiment of the present invention. As shown in FIG. 6, the adhesive film 43 of the present embodiment has an intermediate layer portion 47 laminated between the first layer portion 5 and the second layer portion 6 in the adhesive film 43, which is different from the first embodiment. Except for the above-mentioned points, the 稜鏡 41 of the present embodiment has the same configuration as the 稜鏡 1 of the first embodiment.

In this embodiment, the second layer portion 6 is indirectly laminated on the first layer portion 5 via the intermediate layer portion 47. Since the adhesive film 43 has the intermediate layer portion 47, the metal of the second layer portion 6 is not easily diffused in the first layer portion 5. Therefore, the adhesive film 43 is not easily peeled off from the main body 2.

The intermediate layer portion 47 is preferably a Ni layer, a Pt layer, a Pd layer, a Ni-Cr mixed layer, or an alloy layer formed by combining them. Thereby, the metal of the second layer portion 6 is further less likely to diffuse in the first layer portion 5, and the adhesive film 43 is further less likely to be peeled off from the main body 2.

Furthermore, in the present invention, the Ni layer is a metal layer containing 90% by weight or more Ni. In addition, the Pt layer is a metal layer containing 90% by weight or more of Pt. In addition, the Pd layer is a metal layer containing 90% by weight or more of Pd. These functions as a barrier layer, and it is considered that by containing 90% by weight or more of Ni, Pt, Pd, or an alloy layer thereof, it can function as a barrier layer.

Except for this, as in the first embodiment, it is possible to bond the scallop 41 to the package or the like without being accompanied by the melt flow of the entire adhesive film 43. Therefore, the position accuracy of the 稜鏡 41 can be effectively improved.

(The sixth embodiment) Fig. 7 is a cross-sectional view of a scorpion in the sixth embodiment of the present invention. As shown in FIG. 7, the ridge 51 of this embodiment is different from the first embodiment at the point where the reflective film 4 is provided on the inclined surface 2 b and the upper surface 2 c of the ridge body 2. Specifically, the reflective film 4 is continuously provided from the inclined surface 2b to the upper surface 2c. Except for the points described above, the ridge 51 of the present embodiment has the same configuration as the ridge 1 of the first embodiment.

Even in this embodiment, since it has the same adhesive film 3 as that of the first embodiment, the position accuracy of the ridge 51 can be effectively improved.

It is more ideal to visually recognize the position of the ridge 51 with a camera, and implement the installation of the ridge 51 at the same time. In this way, the position accuracy of the 稜鏡 51 can be improved. Furthermore, in this embodiment, the reflective film 4 is provided on the upper surface 2c of the main body 2. Thereby, the light is reflected toward the camera side by the reflective film 4. Therefore, the brightness of the scallop 51 can be increased, and the scallop 51 can be easily visualized by the camera. Therefore, it is possible to more reliably confirm the position of the pinhole 51, and it is possible to more reliably improve the position accuracy of the pinhole 51.

In this embodiment, the reflective film 4 is provided on the entire surface of the upper surface 2c of the main body 2. Of course, the reflective film 4 can also be provided on a part of the upper surface 2c. In the ridge 61 of the modified example of the sixth embodiment shown in FIG. 8, the reflective film 4 reaches a part of the upper surface 2c from the inclined surface of the ridge body 2. Even in this case, the position can be confirmed more reliably at the time of installation, and the position accuracy of 稜鏡61 can be improved more reliably.

In the ridge 51 shown in FIG. 7, the inclined surface 2b and the reflective film 4 of the upper surface 2c are integrally provided. Furthermore, the reflective film 4 provided on the inclined surface 2b and the reflective film 4 provided on the upper surface 2c may also be different bodies.

(Light device) (The seventh embodiment) Fig. 9 is a cross-sectional view of an optical device according to a seventh embodiment of the present invention. As shown in FIG. 9, the optical device 70 includes the optical element 1, an optical element 74 of the first embodiment, and a package 75 that houses the optical element 1 and the optical element 74.

In this embodiment, the optical element 74 emits light to the light source of the beam 1. The light source is not particularly limited, and, for example, LD or LED (Light Emitting Diode) can be used. Furthermore, the optical element 74 may also be a light-receiving element that receives light from the beam 1.

The package body 75 is a container-shaped member having a bottom 76 and a side wall 77 disposed on the bottom 76. The package 75 includes, for example, a ceramic material, specifically, aluminum oxide, aluminum nitride, or the like. The bottom 76 has a mounting surface 76a. The mounting surface 76a of the bottom 76 is provided with the optical element 74 and the optical element 1. The side wall 77 has an inner surface 77a and an outer surface. A metal film 78 is provided on the mounting surface 76 a of the bottom 76 and the inner surface 77 a of the side wall 77. Specifically, in this embodiment, the metal film 78 is an Au film. In addition, the metal film 78 is not limited to an Au film.

The 稜鏡 1 is bonded to the mounting surface 76 a of the package body 75 by the adhesive film 3. The optical element 74 is not particularly limited. For example, it may be joined to the mounting surface 76a by solder or the like.

The package body 75 does not necessarily have the metal film 78 either. Of course, the package body 75 preferably has the metal film 78 as in the present embodiment. By alloying the adhesion film 3 of the metal film 1 and the metal film 78, the bonding force between the metal film 1 and the package body 75 can be improved more reliably and effectively. Such a configuration is particularly effective when the difference in thermal expansion coefficient between the core 1 and the package body 75 is relatively large.

The metal film 78 is preferably an Au film. Thereby, the metal film 78 is unlikely to be oxidized. Therefore, when the optical device 70 is manufactured, the bonding force between the horn 1 and the package body 75 can be improved more reliably.

In this embodiment, a metal film 78 is provided on the entire surface of the mounting surface 76 a of the bottom 76 and the inner surface 77 a of the side wall 77. Of course, the metal film 78 only needs to be provided at least on the part where the frame 1 is arranged.

On the side wall 77 of the package body 75, a cover 79 is provided in a manner of sealing the optical element 74 and the scallop 1. The lid body 79 is not particularly limited, and in this embodiment, it is a glass lid.

The method of joining the lid 79 and the package 75 is not particularly limited. In this embodiment, the joining is performed by, for example, SnNi joining. In this case, since gas is not likely to be generated after bonding, impurities are not easily attached to the reflective film 4 of the 稜鏡 1, and the reflectance is not easily deteriorated. The bonding method described above is an example, and bonding may be performed by SnAg bonding or SnAgCu bonding.

As shown in FIG. 9, the light A emitted from the optical element 74 is reflected on the light beam 1 and exits the light device 70 through the cover 79.

Since the optical device 70 has the ridge 1 of the first embodiment, the position accuracy of the ridge 1 in the optical device 70 can be effectively improved.

The optical device 70 can be used for multiple wafers. The multi-chip includes, for example, a mounting substrate and a plurality of optical devices 70 arranged on the mounting substrate. Since the multi-chip optical device has the ridge 1 of the first embodiment, even in a multi-chip, the position accuracy of the ridge 1 can be effectively improved.

(稜鏡) (Eighth Embodiment) Fig. 10 is a cross-sectional view of the eighth embodiment. As shown in FIG. 10, the second embodiment of this embodiment is different from the first embodiment in that the second layer portion 86A of the adhesion film 83A has a stress relaxation layer 87A. Specifically, the stress relaxation layer 87A corresponds to the third layer which is one of the Au layers. Except for the above-mentioned points, the 稜鏡 of this embodiment has the same structure as the 稜鏡 1 of the first embodiment.

The thickness of the stress relaxation layer 87A is different from the average thickness of the first layer 6a and the fifth layer 6e which are other Au layers. More specifically, the thickness of the stress relaxation layer 87A is thicker than the average thickness of the other Au layers in the second layer portion 86A.

Here, the Au layer and the Sn layer have stresses in opposite directions. When the stress of one of the Au layer and the Sn layer of the second layer portion is greater than the stress of the other, stress is applied to the package when bonding the stalk to the package. The more Au and Sn layers in the second layer portion, the greater the stress.

In contrast, in this embodiment, the second layer portion 86A has a stress relaxation layer 87A. Thereby, the magnitude relationship between the sum of the stresses of the plurality of Au layers and the sum of the stresses of the plurality of Sn layers can be close to an equal relationship. Therefore, the stress applied to the package body during mounting can be relieved. Therefore, it is not easy to peel off from the package.

Since the adhesion film 83A has the stress relaxation layer 87A, the total stress of the Au layer can be adjusted to be larger, so this embodiment is suitable for the case where the total stress of the Sn layer is larger. The thickness of the stress relaxation layer 87A is preferably 1/2 or more and 5 times or less of the average thickness of other Au layers. As a result, when mounting the screw on the package, etc., the stress applied to the package can be effectively relieved, and the peeling of the screw from the package can be effectively suppressed.

For example, the thickness of the Au layers other than the stress relaxation layer 87A can be made uniform, and the thickness of the Sn layers can be made uniform. In this case, when forming the adhesive film 93, only the thickness of the stress relaxation layer 87A may be different from the thickness of other Au layers. Therefore, the manufacturing steps can be simplified. Therefore, productivity can be improved, and it is not easy to peel from the package or the like. Of course, the thickness of the Au layers and the thickness of the Sn layers other than the stress relaxation layer 87A may also be uneven.

Furthermore, even in this embodiment, as in the first embodiment, it is possible to bond the scallop to the package or the like without the melting of the adhesive film 83A. Therefore, it can effectively improve the position accuracy of 稜鏡.

Hereinafter, there are shown the ninth to eleventh embodiments that differ only in the structure of the stress relaxation layer from this embodiment. Even in the ninth to eleventh embodiments, as in the present embodiment, the position accuracy of the scallops can be effectively improved, and the scallops are not easily peeled from the package or the like.

(Ninth Embodiment) Figure 11 is a cross-sectional view of the ninth embodiment. As shown in FIG. 11, even in this embodiment, the stress relaxation layer 87B in the second layer portion 86B of the adhesive film 83B corresponds to the third layer which is one of the plurality of Au layers. The thickness of the stress relaxation layer 87B is thinner than the average thickness of the Au layer in the second layer portion 86A except for the stress relaxation layer 87B.

Since the adhesion film 83B has the stress relaxation layer 87B, the total stress of the Au layer can be adjusted to a smaller side, so this embodiment is suitable for the case where the total stress of the Sn layer is smaller. The thickness of the stress relaxation layer 87B is preferably 1/5 or more and 1/2 or less of the average thickness of other Au layers, more preferably 1/5 or more and 1/4 or less. As a result, when mounting the screw on the package, etc., the stress applied to the package can be effectively relieved, and the peeling of the screw from the package can be effectively suppressed.

(Tenth Embodiment) Fig. 12 is a cross-sectional view of the tenth embodiment of the 稜鏡. As shown in FIG. 12, the stress relaxation layer 87C in the second layer portion 86C of the adhesive film 83C of this embodiment corresponds to the fourth layer which is one of the plural Sn layers. The thickness of the stress relaxation layer 87C is thicker than the average thickness of the Sn layer in the second layer portion 86C except for the stress relaxation layer 87C.

Since the adhesion film 83C has the stress relaxation layer 87C, the total stress of the Sn layer can be adjusted to the larger side, so this embodiment is suitable for the case where the total stress of the Au layer is larger. The thickness of the stress relaxation layer 87C is preferably 1/2 or more and 5 times or less of the average thickness of other Sn layers. As a result, when mounting the screw on the package, etc., the stress applied to the package can be effectively relieved, and the peeling of the screw from the package can be effectively suppressed.

(Eleventh embodiment) Figure 13 is a cross-sectional view of the eleventh embodiment. As shown in FIG. 13, even in this embodiment, the stress relaxation layer 87D in the second layer portion 86D of the adhesive film 83D corresponds to the fourth layer which is one of the plurality of Sn layers. The thickness of the stress relaxation layer 87D is thinner than the average thickness of the Sn layer in the second layer portion 86D except for the stress relaxation layer 87D.

Since the adhesion film 83D has the stress relaxation layer 87D, the total stress of the Sn layer can be adjusted to a smaller side, so this embodiment is suitable for the case where the total stress of the Au layer is smaller. The thickness of the stress relaxation layer 87D is preferably 1/5 or more and 1/2 or less of the average thickness of other Sn layers, more preferably 1/5 or more and 1/3 or less. As a result, when mounting the screw on the package, etc., the stress applied to the package can be effectively relieved, and the peeling of the screw from the package can be effectively suppressed.

In each of the foregoing embodiments, the second layer portion of the adhesive film has at least one of an Au layer and a Sn layer. Furthermore, in the second layer portion of the adhesive film, the Au layer and the Sn layer may also be alloyed. This example is shown below.

(12th embodiment) Figure 14 is a cross-sectional view of the twelfth embodiment. As shown in FIG. 14, this embodiment differs from the first embodiment in that the second layer portion 96 is an Au-Sn layer of an alloy of Au and Sn and the adhesive film 93 has the outermost portion 98. The outermost layer portion 98 is laminated on the second layer portion 96. The outermost portion 98 is an Au layer. Except for the above-mentioned points, the 稜鏡 91 of this embodiment has the same structure as the 稜鏡 1 of the first embodiment.

When forming the second layer portion 96 of the adhesive film 93, for example, the Au layer and the Sn layer are alternately laminated, and then the laminated Au layer and the Sn layer may be heated. Thereby, the second layer portion 96 can be formed by alloying the Au layer and the Sn layer.

In this embodiment, the outermost layer portion 98 is the outermost layer of the adhesive film 93. The outermost layer portion 98 can be formed by, for example, a sputtering method or a vacuum evaporation method. Furthermore, the adhesive film 93 may not have the outermost layer portion 98. In this case, the outermost layer of the second layer portion is the outermost layer of the adhesive film, similarly to the other first embodiment. Furthermore, specifically, as in this embodiment, when the second layer portion 96 is an Au-Sn layer and does not have the outermost portion 98, the Au-Sn layer is the outermost layer.

The pin 91 is mounted on the package and the like in the same way as the pin of the other embodiments. Even in this embodiment, it is possible to bond the scallop 91 to the package or the like without being accompanied by the melt flow of the entire adhesive film 93. Therefore, the accuracy of the position of the 稜鏡 91 can be effectively improved.

The thickness of the second layer portion 96 of the adhesive film 93 is preferably 2.5 μm or more and 5.9 μm or less. Thereby, when mounting the ridge 91 to a package or the like, the bonding force of the adhesive film 93 can be sufficiently improved. Furthermore, the thickness of the first layer portion is preferably 0.1 or more and 0.5 μm or less. The overall thickness of the adhesive film is preferably 3 μm or more and 6 μm or less.

It is preferable that the adhesive film 93 has the outermost layer part 98 like this embodiment. In this embodiment, the outermost layer portion 98 as the Au layer is laminated on the second layer portion 96 as the Au-Sn layer. In this case, the part that is in contact with the package body during installation is the outermost part 98. Therefore, during installation, the adhesion film 93 is less likely to be oxidized, and the adhesion force of the adhesion film 93 can be improved more reliably.

Even in this embodiment, as in the fifth embodiment, an intermediate layer portion may be laminated between the first layer portion 5 and the second layer portion 96. Thereby, the metal of the second layer portion 96 is not easily diffused in the first layer portion 5. Therefore, the adhesive film 93 is not easily peeled off from the main body 2.

(13th embodiment) Fig. 15 is a cross-sectional view of the thirteenth embodiment. As shown in FIG. 15, this embodiment is different from the first embodiment at the point where a protective film 105 is provided on the ridge line between the bottom surface 2a and the inclined surface 2b of the main body 2. Except for the above-mentioned points, the 稜鏡 of this embodiment has the same structure as the 稜鏡 1 of the first embodiment.

The protective film 105 is provided integrally with the reflective film 4. The protective film 105 is connected to the adhesive film 3. Furthermore, the protective film 105 does not necessarily need to be connected to the adhesive film 3. The protective film 105 can be formed by, for example, a sputtering method, a vacuum evaporation method, or the like. As in this embodiment, when the protective film 105 and the reflective film 4 are integrated, the protective film 105 and the reflective film 4 may be formed at the same time.

Of course, the protective film 105 can also be provided as a different body from the reflective film 4. Alternatively, the protective film 105 may be provided integrally with the adhesive film 3. In this case, the protective film 105 may be connected to the reflective film 4 or may not be connected to the reflective film 4. When the protective film 105 and the adhesive film 3 are integrated, the protective film 105 has at least one of the same plural layers as the adhesive film 3.

With the protective film 105, the main body 2 is not prone to defects. The protective film 105 is preferably connected to both the reflective film 4 and the adhesive film 3. Thereby, it is further less likely to cause defects in the main body 2.

Even in this embodiment, as in the first embodiment, the scallop can be bonded to the package or the like without the adhesion film 3 melting. Therefore, it can effectively improve the position accuracy of 稜鏡.

(Evaluation of bonding force) In the first embodiment shown in Fig. 1, the arithmetic average roughness Ra of the outermost layer of the second layer part 6, which is the outermost layer of the adhesive film 3, is different, and the adhesion with the package is confirmed. In addition, the outermost layer of the adhesive film 3 is an Au layer. Specifically, when the arithmetic mean roughness Ra of the outermost layer is set to Ra, Ra≦0.05, 0.05<Ra≦0.09, 0.09<Ra≦0.15, and 0.15<Ra≦0.20 are satisfied. Furthermore, the arithmetic average roughness Ra in this specification is based on JIS (Japanese Industrial Standards) B 0601:2013.

In the confirmation of bonding, an aluminum nitride substrate with a portion plated with Au was used as the package. The Au-plated portion of the aluminum nitride substrate was bonded to the aluminum nitride substrate by heating to about 320°C. After that, force is applied from the side of 稜鏡1. Specifically, force is applied to the ridge 1 until the adhesive film 3 of the ridge 1 peels from the aluminum nitride substrate, or the ridge body 2 peels from the adhesive film 3, or the ridge body 2 is broken without peeling. In each case where the arithmetic average roughness Ra is different, the bondability is checked 15 times. The results are shown in Table 1.

In Table 1, ⊚ is the highest, ◯ is the second highest, and △ is the lowest. The so-called "unpeeled" means that the adhesive film 3 has not been peeled off from the package, and includes the case where the main body 2 is destroyed or the case where the main body 2 is peeled from the adhesive film 3. The term "partial peeling" means that a part of the adhesive film 3 is peeled from the package.

[Table 1] Ra[μm] result Evaluation Ra≦0.05 Unstripped: 100% ◎ 0.05＜Ra≦0.09 Unpeeled: 50%, partly peeled: 50% 〇 0.09＜Ra≦0.15 Unpeeled: 25%, partly peeled: 75% 〇 0.15＜Ra≦0.20 Unpeeled: 10% or less, partly peeled: 90% or more △

As shown in Table 1, it can be seen that in any case where the arithmetic average roughness Ra of the outermost layer of the adhesive film 3 is different, it is "not peeled" or "partially peeled", and the adhesive film 3 is not completely peeled from the package. Furthermore, it can be seen that the smaller the value of the arithmetic mean roughness Ra of the outermost layer, the larger the ratio of "unpeeled".

The arithmetic average roughness Ra of the outermost layer of the adhesive film 3 is preferably 0.20 μm or less, more preferably 0.15 μm or less, still more preferably 0.09 μm or less, and particularly preferably 0.05 μm or less. Thereby, at the time of mounting, the adhesion between the package and the like and the adhesion film 93 can be further effectively improved. Therefore, the joining force can be further effectively improved.

Similarly, in the twelfth embodiment shown in FIG. 14, even when the adhesive film 93 does not have the outermost portion 98, it is preferable to be the arithmetic average roughness of the second layer portion 96 of the outermost layer of the adhesive film 93 Ra is within the above range. Thereby, the joining force can be further effectively improved.

(Evaluation of stress) Evaluate the stress of the adhesive film. As shown in FIG. 16, the base material 91A of the scallop extending in the direction of the two sides is attached to the cutting sheet. Next, along the single-point chain line I-I, the base material 91A of the scallop is cut into individual pieces. In addition, the singularized scallop has the same structure as that of the twelfth embodiment shown in FIG. 14. In the case where the stress of the adhesive film 93 with respect to the package body is large, since the impact when the stress is released during singulation is large, the scallop is easy to peel off. Therefore, the greater the rate of peeling, the greater the stress of the adhesive film 93.

The evaluation of the stress was performed under Condition 1 to Condition 4 by varying the thickness of the second layer portion 96 of the adhesive film 93. Specifically, in Condition 1, the thickness of the second layer portion 96 is set to 3 μm, and in Conditions 2 to 4, the thickness of the second layer portion 96 is set to 6 μm. Furthermore, in Condition 3 and Condition 4, heat treatment is performed before attaching the base material 91A of the scallop to the dicing sheet. Specifically, in condition 3, heat treatment was performed at 200°C for 2 hours under a nitrogen atmosphere. In condition 4, heat treatment was performed at 200°C for 5 hours in a nitrogen atmosphere. Table 2 shows the evaluation results of the magnitude of stress.

In Table 2, the stress is the smallest in the case of ◎, ○ is the second smallest, and △ is the largest.

[Table 2] Thickness of Au-Sn layer [μm] Heat treatment Peel rate Evaluation 3 - 10～30% 〇 6 - 30～50% △ 6 200℃/2 h under nitrogen atmosphere 20～40% △ 6 200℃/5 h under nitrogen atmosphere 0～5% ◎

As shown in Table 2, under Condition 1 to Condition 4, the peeling of 稜鏡91 from the package was suppressed to 50% or less. Furthermore, comparing condition 1 and condition 2 in which the thickness of the second layer portion 96 is different, the stress is further reduced in condition 1 where the second layer portion 96 is thinner. Thus, it can be seen that the thinner the second layer portion 96 is, the smaller the stress of the adhesive film 93 is. The thickness of the second layer portion 96 of the adhesive film 93 is preferably 6 μm or less, more preferably 3 μm or less. Thereby, the stress can be further reduced.

Comparing Condition 2 and Condition 3 where the thickness of the second layer portion 96 is the same, condition 3 where the heat treatment is performed before attaching the base material 91A of the scallop to the dicing sheet, the stress is even smaller. Furthermore, if the thickness of the second layer portion 96 is the same, and the conditions 3 and 4 of the heat treatment are performed, the stress is further reduced in the condition 4 where the heat treatment time is longer. In this way, it can be seen that the longer the time of the heating treatment, the more the stress can be suppressed. It is preferable to perform heating treatment before attaching the scallop to the dicing sheet, and the heating treatment is preferably performed for about 2 to 6 hours. Thereby, the stress can be further effectively suppressed.

1: 稜鏡 2: 稜鏡 body 2a: bottom surface 2b: inclined plane 2c: upper surface 3: Adhesive film 4: reflective film 5: Layer 1 part 6: Layer 2 part 6a: layer 1 6b: Layer 2 6c: layer 3 6d: layer 4 6e: layer 5 11: 鏡 13: Adhesive film 16: Layer 2 part 16a: layer 1 16b: Layer 2 16c: layer 3 16d: layer 4 16e: layer 5 21: 稜鏡 23: Adhesive film 26: Layer 2 part 26a: Level 1 26b: Layer 2 26c: layer 3 26d: layer 4 26e: layer 5 31: 鏡 33: Adhesive film 36: Layer 2 part 36a: Level 1 36b: Layer 2 36c: layer 3 36d: layer 4 36e: layer 5 41: 稜鏡 43: Adhesive film 47: middle layer part 51: Secret 61: Secret 70: Light Device 74: optical components 75: package body 76: bottom 76a: mounting surface 77: side wall 77a: inner surface 78: metal film 79: Lid 83A: Adhesive film 83B: Adhesive film 83C: Adhesive film 83D: Adhesive film 86A: Layer 2 part 86B: Layer 2 part 86C: Layer 2 part 86D: Layer 2 part 87A: Stress relaxation layer 87B: Stress relaxation layer 87C: Stress relaxation layer 87D: Stress relaxation layer 91: Secret 91A: The base material of 稜鏡 93: Adhesive film 96: Layer 2 part 98: The outermost part 105: Protective film

Figure 1 is a cross-sectional view of the first embodiment of the present invention. Fig. 2 is an enlarged cross-sectional view showing the vicinity of the adhesive film of 稜頡 in the first embodiment of the present invention. Fig. 3 is an enlarged cross-sectional view showing the vicinity of the adhesive film of the 稜頡 in the second embodiment of the present invention. Fig. 4 is an enlarged cross-sectional view showing the vicinity of the adhesive film of the 稜頡 in the third embodiment of the present invention. Fig. 5 is an enlarged cross-sectional view showing the vicinity of the adhesive film of the scallop in the fourth embodiment of the present invention. Fig. 6 is an enlarged cross-sectional view showing the vicinity of the adhesive film of the scallop in the fifth embodiment of the present invention. Fig. 7 is a cross-sectional view of a scorpion in the sixth embodiment of the present invention. Fig. 8 is a cross-sectional view of a modified example of the sixth embodiment of the present invention. Fig. 9 is a cross-sectional view of an optical device according to a seventh embodiment of the present invention. Fig. 10 is a cross-sectional view of an eighth embodiment of the present invention. Figure 11 is a cross-sectional view of the ninth embodiment of the present invention. Figure 12 is a cross-sectional view of the tenth embodiment of the present invention. Figure 13 is a cross-sectional view of the eleventh embodiment of the present invention. Figure 14 is a cross-sectional view of the twelfth embodiment of the present invention. Fig. 15 is a cross-sectional view of the thirteenth embodiment of the present invention. Figure 16 is a cross-sectional view of the base material used for stress evaluation.

Claims (28)

A kind of 騜鏡, which has: The main body of the 稜鏡, which has a bottom surface and an inclined surface connected to the bottom surface; and The adhesive film is arranged on the bottom surface; and The adhesive film has a first layer portion located on the side of the main body of the 稜鏡, and a second layer portion directly or indirectly laminated on the first layer portion, The second layer portion includes at least one of an Au layer and a Sn layer. Such as claim 1, wherein in the second layer portion, the Au layer and the Sn layer are alternately stacked. Such as claim 1 or 2, wherein the second layer portion has both the Au layer and the Sn layer, and Au-Sn containing an alloy of Au and Sn is arranged between the Au layer and the Sn layer Floor. Such as any one of claims 1 to 3, wherein in the lamination direction of the adhesive film, when the side away from the main body of the adhesive film is set to the outside, the outermost layer of the second layer part is the Au layer . According to any one of claims 2 to 4, wherein the second layer part has a plurality of the Au layers and a plurality of the Sn layers, and the Au layers and the Sn layers are alternately laminated, The above-mentioned second layer part has a stress relaxation layer, When the stress relaxation layer is one of the plurality of Au layers, the thickness of the stress relaxation layer is different from the average thickness of the other Au layers, When the stress relaxation layer is one of the plurality of Sn layers, the thickness of the stress relaxation layer is different from the average thickness of the other Sn layers. Such as claim 5, wherein the thickness of the stress relaxation layer is more than 1/2 and less than 5 times the average thickness of the other Au layers or the other Sn layers. Such as claim 5, wherein the thickness of the stress relaxation layer is more than 1/5 and less than 1/2 of the average thickness of the other Au layers or the other Sn layers. Such as the ridge of any one of claims 1 to 4, wherein in the lamination direction of the adhesive film, when the side away from the main body of the ridge is set to the outside, the outermost layer of the second layer part is on the second The thinnest layer in the layer part. Such as claim 8, in which the layer on the outside of the second layer is thinner. For example, the 稜鏡 of claim 4, wherein the second layer portion has a plurality of the Au layers and a plurality of the Sn layers, the thickness of the plurality of Au layers is the same as each other, and the thickness of the plurality of Sn layers is The thicker it is on the outside. For example, the 稜鏡 of claim 4, wherein the second layer portion has a plurality of the Au layers and a plurality of the Sn layers, and the thickness of the plurality of Au layers is thinner as the outer side, and the plurality of Sn The thickness of the layers are the same. For example, according to any one of claims 1 to 11, the total number of layers of the Au layer and the Sn layer in the second layer part is 3 layers or more and 99 layers or less. For example, in claim 12, the total number of layers of the Au layer and the Sn layer in the second layer portion is 15 layers or more and 35 layers or less. According to any one of claims 1 to 13, wherein the overall thickness of the adhesive film is 1 μm or more and 10 μm or less. For example, in the 稜鏡 of any one of claims 1 to 14, wherein the second layer portion has both the Au layer and the Sn layer, and the total weight of Au in the second layer portion is set to M _A 、When the total weight of Sn is set to M _S , and the ratio of the weight of Au to the total weight of Au and Sn is set to M _A /(M _A ＋M _S ), the ratio M _A /(M _A ＋M _S ) It is 0.60 or more and 0.78 or less. A kind of 鏡, which is installed in the package body, and has: The main body of the 稜鏡, which has a bottom surface and an inclined surface connected to the bottom surface; and The adhesive film is arranged on the bottom surface; and The adhesive film has a first layer portion located on the side of the main body of the 稜鏡, and a second layer portion directly or indirectly laminated on the first layer portion, The second layer is an Au-Sn layer containing an alloy of Au and Sn, The thickness of the second layer portion of the adhesive film is 2.5 μm or more and 5.9 μm or less. Such as claim 16, wherein in the lamination direction of the adhesive film, when the side away from the main body of the adhesive film is set to the outside, the adhesive film has the outermost layer as the adhesive film and is laminated on the second layer The outermost part on the part, The outermost part described above is an Au layer. Such as any one of claims 1 to 17, wherein in the lamination direction of the adhesive film, when the side away from the body of the adhesive film is set to the outside, the arithmetic average roughness Ra of the outermost layer of the adhesive film It is 0.20 μm or less. According to any one of claims 1 to 18, the first layer is a Cr layer, Ti layer, or Ta layer. According to any one of claims 1 to 19, wherein the adhesive film further has an intermediate layer portion laminated between the first layer portion and the second layer portion. For example, in claim 20, the intermediate layer is part of Ni layer, Pt layer, Pd layer, Ni-Cr mixed layer or alloy layer formed by combining them. For example, the 稜鏡 of any one of claims 1 to 21, wherein the 騜鏡 body has an upper surface, The upper surface faces the bottom surface and is connected to the inclined surface. For example, the bevel of any one of claims 1-22, wherein a reflective film is provided on the inclined surface of the bevel body. Such as claim 22, wherein a reflective film is provided on the inclined surface and the upper surface of the main body. An optical device including: Such as any one of claims 1 to 24: 稜鏡; An optical element that emits light to the above-mentioned ridge or receives light from the above-mentioned ridge; and A package that contains the above-mentioned ridge and the above-mentioned optical element; and The above-mentioned nipple is bonded to the above-mentioned package by the above-mentioned adhesive film. A method for manufacturing a scallop, which is provided with the step of arranging an adhesive film on the bottom surface of the scallop body having a bottom surface and an inclined surface connected to the bottom surface; and The step of providing the adhesive film includes: forming a first layer portion including a metal material on the bottom surface; and directly or indirectly laminating a second layer portion including a metal material on the first layer portion; and The first layer portion and the second layer portion contain metal materials of different compositions, The second layer portion includes at least one of an Au layer and a Sn layer. A manufacturing method of a packaging device, which includes: Prepare the steps of any one of claims 1 to 24; The step of preparing a package body with the bonding surface to the above-mentioned ridge; The step of contacting the scallop with the packaging body in such a way that the adhesive film abuts against the adhesive surface of the packaging body; and The step of heating the adhesive film to join the ridge and the package. The method of manufacturing a package device of claim 27, wherein an Au film is formed on the bonding surface of the package body, The heating is performed at a temperature at which the entire adhesive film does not melt, and the scallop is joined to the package.

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