JP6866907B2 - Light emitting device - Google Patents

Description

The present invention relates to a composite substrate, a light emitting device, and a method for manufacturing the light emitting device.

A ceramic substrate in which wiring is formed on a substrate made of ceramic is known. Then, as a method for manufacturing a light emitting device using such a ceramic substrate, after mounting electronic components such as a light emitting element on an aggregate of ceramic substrates, each electronic component is sealed with a sealing member and assembled in the final step. A method of cutting a body into a plurality of light emitting devices is known (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2008-205462

However, the ceramic substrate is more expensive than the resin substrate and the like. Further, in the above-mentioned conventional method, it may take time and cost to cut the aggregate in the final step.

The above problem is solved by the following.

The substrate includes a substrate and a covering member, and the substrate is provided on a substrate made of ceramic, a first wiring provided on the upper surface of the substrate, and a lower surface of the substrate, and is electrically connected to the first wiring. A composite substrate having a second wiring and the covering member covering the substrate so that the first wiring and the second wiring are exposed.

A light emitting device including the composite substrate and at least one light emitting element mounted on the first wiring.

A step of preparing a substrate assembly having a substrate made of ceramic and substrate assemblies having first wiring and second wiring on the upper and lower surfaces of the substrate, and cutting the substrate to separate the substrate assembly into a plurality of substrates. A step of placing the plurality of substrates on the sheet at a predetermined interval and adhering the plurality of substrates to the sheet using an adhesive, and a step of exposing each first wiring on the upper surface side of the plurality of substrates. A step of providing a covering member on the sheet to integrate the plurality of substrates, and removing the sheet from the integrated plurality of substrates to expose each second wiring on the lower surface side of the plurality of substrates. A step of forming a composite substrate assembly, a step of mounting a light emitting element on each first wiring on the upper surface side of the composite substrate aggregate, and a plurality of individualized composite substrate aggregates by cutting the covering member. A method for manufacturing a light emitting device, which comprises a step of making the light emitting device of the above.

According to the above configuration, it is possible to provide a composite substrate having the same strength as the ceramic substrate but capable of being manufactured in a shorter time and at a lower cost than the ceramic substrate, a light emitting device provided with the composite substrate, and a method for manufacturing the composite substrate.

It is a schematic top view of the composite substrate which concerns on Embodiment 1. FIG. It is a schematic bottom view of the composite substrate which concerns on Embodiment 1. FIG. FIG. 5 is a cross-sectional view taken along the line AA in FIG. 1A. It is a schematic diagram which shows an example of a stretched part. It is a schematic top view of the light emitting device which concerns on Embodiment 1. FIG. It is a schematic bottom view of the light emitting device which concerns on Embodiment 1. FIG. FIG. 2 is a cross-sectional view taken along the line BB in FIG. 2A. It is a schematic cross-sectional view of the composite substrate which concerns on Embodiment 2. FIG. It is a schematic cross-sectional view of the light emitting device which concerns on Embodiment 2. FIG. It is a schematic cross-sectional view of the composite substrate which concerns on Embodiment 3. FIG. It is a schematic sectional view of the light emitting device which concerns on Embodiment 3. FIG. It is a schematic cross-sectional view of the composite substrate which concerns on Embodiment 4. FIG. It is a schematic cross-sectional view of the light emitting device which concerns on Embodiment 4. FIG. FIG. 5 is a schematic cross-sectional view of the composite substrate according to the fifth embodiment. FIG. 5 is a schematic cross-sectional view of the light emitting device according to the fifth embodiment. It is a schematic cross-sectional view of the composite substrate which concerns on Embodiment 6. It is a schematic cross-sectional view of the light emitting device which concerns on Embodiment 6. It is a schematic cross-sectional view of the composite substrate which concerns on Embodiment 7. FIG. 5 is a schematic cross-sectional view of the light emitting device according to the seventh embodiment. It is a schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG. It is a schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on Embodiment 1. FIG.

[Composite substrate 1 according to the first embodiment]
1A is a schematic top view of the composite substrate according to the first embodiment, FIG. 1B is a schematic bottom view of the composite substrate according to the first embodiment, and FIG. 1C is a sectional view taken along the line AA in FIG. 1A. .. As shown in FIGS. 1A to 1C, the composite substrate 1 according to the first embodiment includes a substrate 12 and a covering member 30. The substrate 12 includes a substrate 14 made of ceramic, a first wiring 18 provided on the upper surface of the substrate 14, and a second wiring 24 provided on the lower surface of the substrate 14 and electrically connected to the first wiring 18. Have. The covering member 30 covers the substrate 14 so that the first wiring 18 and the second wiring 24 are exposed. Hereinafter, they will be described in order.

(Substrate 12: Substrate 14 made of ceramic)
The substrate 14 is a member that serves as a base material for the substrate 12. The substrate 14 is made of ceramic and has an insulating property. Specifically, for example, in addition to alumina, aluminum nitride, zirconia, silicon nitride, silicon carbide, aluminosilicate, etc., LTCC (low Temperature Co-fired Ceramics), or a member composed of a combination thereof is an example of the substrate 14. Become. The substrate 14 may be composed of a single layer or may be composed of a plurality of layers. When the substrate 14 is composed of a plurality of layers, an inner layer wiring may be provided between the layers.

(Board 12: 1st wiring 18, 2nd wiring 24)
The first wiring 18 is provided on the upper surface (uppermost surface) of the base 14, and the second wiring 24 electrically connected to the first wiring 18 is provided on the lower surface (lowermost surface) of the base 14. A light emitting element 34, which will be described later, is mounted on the first wiring 18, and the second wiring 24 is connected to an external electrode or the like. The first wiring 18 has a first region 20 and a second region 22 that are separated from each other, and the first region 20 and the second region 22 function as a pair of positive and negative electrodes. Similarly, the second wiring 24 has a first region 26 and a second region 28 that are separated from each other, and the first region 26 and the second region 28 function as a pair of positive and negative electrodes. The first region 20 of the first wiring 18 and the first region 26 of the second wiring 24 are electrically connected via, for example, a through hole (via) 16. Similarly, the second region 22 of the first wiring 18 and the second region 28 of the second wiring 24 are also electrically connected via, for example, through holes (vias) 16. In addition, these regions are formed by a method other than the through hole (via) 16 (for example, a metal that joins the first region 20 and the first region 26 to the side surface of the substrate 14, and the second region 22 and the second region 28. By providing a metal to join with), it can also be electrically connected.

The first wiring 18 and the second wiring 24 can be formed by using various metal materials. For example, in the first wiring 18 and the second wiring 24, for example, W and Cu are provided on the base 14, the base 14 is fired, and then the surfaces of W and Cu are surfaced with Au, Ag, and so on. It can be formed by plating with one or more of metals such as Pt, Pd, Rh, Ni, Cu, W, Mo, Cr, Ti, and Al and alloys thereof. The plating formed on the surface of W or Cu may be formed of a single layer or may be formed of a plurality of layers.

As shown in FIG. 1D, for example, a conductive member (hereinafter, referred to as an extension portion 32) electrically connected to the second wiring 24 may be provided on the lower surface of the composite substrate 1. The stretched portion 32 functions as a part of the wiring of the composite substrate 1. By extending the extending portion 32 from the lower surface of the second wiring 24 to the lower surface of the covering member 30 (example: extending in the lateral direction in FIG. 1D), the area of the wiring provided on the lower surface of the composite substrate 1 is reduced to the second wiring 24. It can be larger than the area of the lower surface of. By doing so, the bonding area of the wiring provided on the lower surface of the composite substrate 1 with respect to the external electrode can be increased, so that the solder mountability can be improved. In addition, the heat dissipation of the composite substrate 1 can be improved. The stretched portion 32 can be provided, for example, by plating, sputtering, or the like on the second wiring 24.

(Coating member 30: Material of covering member 30)
For the covering member 30, a resin having a strength lower than that of the substrate 14 and having a property of being less likely to crack or chip when cut (individualized) than the substrate 14 is used. The resin having such properties is, for example, one selected from the group consisting of triazine derivative epoxy resin, epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, urethane resin, and unsaturated polyester. Two or more kinds of resins can be mentioned as an example.

The coating member 30 has an acid anhydride, an antioxidant, a mold release material, a light reflecting member, an inorganic filler, a curing catalyst, a light stabilizer, and / or a lubricant in the resin. May be good. The total amount of the additive added is preferably 20 to 90 wt% with respect to the resin, but is not particularly limited. If titanium oxide (TiO ₂ ) is contained in the resin in an amount of 40 to 70 wt% as an additive, the reflectance of the composite substrate 1 can be improved. Further, if the resin contains 20 to 70 wt% of glass fiber as an inorganic filler, the strength of the composite substrate 1 can be improved. Examples of the light reflecting member used as an additive include titanium oxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, zinc oxide, boron nitride, and mullite.

(Coating member 30: Covering with the covering member 30)
The covering member 30 covers the substrate 14 so that the first wiring 18 and the second wiring 24 are exposed respectively. In other words, the covering member 30 covers the substrate 14 so as not to cover all of the first wiring 18 and the second wiring 24. The covering member 30 may cover at least one side surface of the substrate 14, and may cover all the side surfaces. For example, when the substrate 14 has four side surfaces, one side surface thereof can be covered with the covering member 30 and the other three side surfaces can be exposed. In this case, if recesses are provided below the three exposed side surfaces, the recesses serve as castings for the composite substrate 1. In this case, if a conductive member that is electrically connected to the first wiring 18 or the like is arranged on the inner wall of the casting, a solder fillet can be provided when the light emitting device provided with the composite substrate 1 is mounted on the secondary substrate using solder. It can be easily formed, and the light emitting device can be mounted on the secondary substrate with high reliability.

The covering member 30 preferably covers the entire or part of the upper surface of the substrate 14, the entire or part of the lower surface, or the entire or part of the upper surface and the entire or part of the lower surface. In this way, the adhesion between the covering member 30 and the substrate 14 is improved, so that the strength of the composite substrate 1 is improved. Further, since the reflectance of the composite substrate 1 is improved, the light output is improved in the light emitting device including the composite substrate 1.

The covering member 30 can be provided, for example, so that the surface of the first wiring 18 and the surface of the covering member 30 have the same height (including substantially the same height) on the upper surface of the composite substrate 1. In other words, the covering member 30 can be provided so as to fill the gap between the first wirings 18 on the upper surface of the substrate 14.

However, the covering member 30 may be provided so that the surface of the first wiring 18 is higher than the surface of the covering member 30. In this case, when the light emitting element 34 described later is mounted on the first wiring 18, the covering member 30 is provided. Does not buffer the light emitting element 34, so that the light emitting element 34 can be stably bonded and bonded to the first wiring 18. Further, in this case, since the height of the light emitting element 34 is higher than the case where the surface of the first wiring 18 is the same height as the surface of the covering member 30, it can be used as a surface light source or the like. It is possible to provide a light emitting device having a wide light distribution suitable for the above-mentioned applications.

Further, the covering member 30 can be provided so that the surface of the first wiring 18 is lower than the surface of the covering member 30. In this case, the side surface of the light emitting element 34 is covered with the covering member 30 so that the light emitting element 34 described later does not tilt. It becomes possible to support. Further, in this case, the height of the light emitting element 34 is lower than that when the surface of the first wiring 18 is the same height as the surface of the covering member 30, so that the lens or the reflector can be used. It is possible to provide a light emitting device having a narrow light distribution suitable for use as a point light source used in combination.

The covering member 30 can be provided, for example, so that the surface of the second wiring 24 and the surface of the covering member 30 have the same height (including substantially the same height) on the lower surface of the composite substrate 1. In other words, the covering member 30 can be provided so as to fill the gap between the second wirings 24 on the lower surface of the substrate 14. In this way, when the second wiring 24 and the external electrode are solder-bonded, it is possible to prevent the solder from spreading on the side surface of the second wiring 24. Therefore, the first regions 26 and the second of the second wiring 24 It is possible to prevent a short circuit between the region 28 and the region 28 due to solder leakage.

However, the covering member 30 may be provided so that the surface of the second wiring 24 is higher than the surface of the covering member 30. In this case, a solder fillet is formed on the side surface of the second wiring 24 to increase the bonding strength of the solder joint. Can be improved.

Further, the covering member 30 can be provided so that the surface of the second wiring 24 is lower than the surface of the covering member 30. In this case, when the second wiring 24 and the external electrode are solder-bonded, the light emitting element 100 is provided. Tilt can be suppressed.

(Coating member 30: Thickness of covering member 30)
The thickness of the covering member 30 on the side surface of the substrate 14 is, for example, about 100 μm to 1000 μm. The covering member 30 on the side surface of the substrate 14 may be thicker or thinner than the substrate 14, or may have the same thickness (including substantially the same thickness). However, when the composite substrate 1 is formed in a flat plate shape, it is preferable that the covering member 30 on the side surface of the substrate 14 has the same thickness as the substrate 14 (including substantially the same thickness).

According to the first embodiment described above, as will be described later, since the composite substrate assembly can be separated into individual pieces by cutting the covering member 30, it has the same strength as the ceramic substrate, but in a shorter time than the ceramic substrate. It is possible to provide a composite substrate 1 that can be manufactured at low cost. Further, according to the first embodiment, since the covering member 30 serves as a cushioning material and the warp of the substrate 14 is suppressed, various parts mounted on the composite substrate 1 due to the warp (eg, a light emitting element 34 described later) and the like. It is possible to prevent the sealing member 36 and the like from being damaged (cracked or the like). Further, according to the first embodiment, the upper surface area of the entire composite substrate 1 is expanded by expanding the width and depth of the covering member 30 on the side of the substrate 14 instead of the width and depth of the substrate 14, and the size is large. It is possible to arrange the sealing member 36 of the above on the composite substrate 1. Therefore, even a light emitting device provided with a large sealing member 36 can be provided at low cost. This is because the covering member 30 is generally cheaper than the substrate 14.

[Light emitting device 100 according to the first embodiment]
2A is a schematic top view of the light emitting device according to the first embodiment, FIG. 2B is a schematic bottom view of the light emitting device according to the first embodiment, and FIG. 2C is a sectional view taken along line BB in FIG. 2A. .. As shown in FIGS. 2A to 2C, the light emitting device 100 according to the first embodiment is a light emitting device including the composite substrate 1 according to the first embodiment and at least one light emitting element 34 mounted on the first wiring 18. Is.

(Light emitting element 34)
The light emitting element 34 is mounted on the first wiring 18. As the light emitting element 34, for example, one having a semiconductor laminate (n-side semiconductor layer, active layer, and p-side semiconductor layer sequentially laminated) on a growth substrate (for example, a sapphire substrate) can be used. In addition, a growth substrate from which the growth substrate has been removed by laser lift-off, chemical lift-off, grinding, or the like can also be used. The light emitting element 34 can be mounted on the first wiring 18 by, for example, wire bonding or flip chip mounting using bumps, but the mounting is not particularly limited.

(Seal member 36)
The light emitting device 100 may include a sealing member 36 that seals the light emitting element 34. The sealing member 36 is not particularly limited, but can be formed, for example, in a lens shape (for example, a convex lens shape) that collects the light emitted from the light emitting element 34.

(Protective element 38)
The light emitting device 100 may include a protective element. The protective element is mounted on, for example, the first wiring 18. When the protective element includes a positive electrode and a negative electrode, the positive electrode of the protective element is bonded and bonded to the first region 20 of the first wiring 18 with a conductive bonding agent such as Ag paste or AuSn, and the protective element is formed. The negative electrode is bonded and bonded to the second region 22 of the first wiring 18 by wire bonding, for example. It is preferable that a part of the protective element is covered with the covering member 30 so that the light absorption by the protective element is reduced, and it is more preferable that the protective element is completely covered.

[Composite substrate 2 according to the second embodiment]
FIG. 3 is a schematic cross-sectional view of the composite substrate according to the second embodiment. As shown in FIG. 3, the composite substrate 2 according to the second embodiment is different from the composite substrate 1 according to the first embodiment in that the substrate 14 has a recess X. As described above, as the substrate 14, not only flat plate-shaped members but also members having various shapes can be used. The inner side surface (inner side wall) of the recess X may be perpendicular to the bottom surface of the recess X or may be inclined. However, when inclining, it is preferable to incline so that the inner diameter of the recess X increases as it approaches the upper surface. In this way, when the light emitting element 34 is placed on the bottom surface of the recess X, the light from the light emitting element 34 is easily reflected upward by the inner side surface (inner side wall) of the recess X. The light distribution of the light emitting device can be adjusted by adjusting the inclination angle of the side surface (inner side wall). The covering member 30 is preferably provided particularly thick in the portion where the recess X is formed in order to improve the adhesion between the covering member 30 and the base material 14.

[Light emitting device 200 according to the second embodiment]
FIG. 4 is a schematic cross-sectional view of the light emitting device according to the second embodiment. As shown in FIG. 4, the light emitting device 200 according to the second embodiment is different from the light emitting device 100 according to the first embodiment in that the composite substrate 2 according to the second embodiment is provided. In the light emitting device 200 according to the second embodiment, the light emitting element 34 is placed on the bottom surface of the recess X of the substrate 14.

[Composite substrate 3 according to the third embodiment]
FIG. 5 is a schematic cross-sectional view of the composite substrate according to the third embodiment. As shown in FIG. 5, the composite substrate 3 according to the third embodiment is implemented in that a frame body Y made of the same material as the covering member 30 is integrally formed with the covering member 30 on the upper surface of the base 14. It is different from the composite substrate 1 according to the first embodiment. As described above, while using the flat plate-shaped substrate 14, the composite substrate 1 can be provided with the recess X (the region surrounded by the frame body Y) by using the covering member 30. As an example of the method of forming the frame body Y, for example, pasting, drawing, compression molding, transfer molding and the like can be mentioned.

[Light emitting device 300 according to the third embodiment]
FIG. 6 is a schematic cross-sectional view of the light emitting device according to the third embodiment. As shown in FIG. 6, the light emitting device 300 according to the third embodiment is different from the light emitting device 100 according to the first embodiment in that the composite substrate 3 according to the third embodiment is provided. In the light emitting device 300 according to the third embodiment, the light emitting element 34 is placed on the bottom surface of the recess X (the region surrounded by the frame body Y).

[Composite substrate 4 according to the fourth embodiment]
FIG. 7 is a schematic cross-sectional view of the composite substrate according to the fourth embodiment. As shown in FIG. 7, the composite substrate 4 according to the fourth embodiment is implemented in that a frame body Y made of a material 50 different from the covering member 30 is formed separately from the covering member 30 on the upper surface of the substrate 14. It is different from the composite substrate 1 according to the first embodiment. As described above, it is possible to provide the concave portion X (the region surrounded by the frame body Y) in the composite substrate 4 by using the material 50 different from the covering member 30 while using the flat plate-shaped substrate 14. As an example of the method of forming the frame body Y, for example, pasting, drawing, compression molding, transfer molding and the like can be mentioned.

[Light emitting device 400 according to the fourth embodiment]
FIG. 8 is a schematic cross-sectional view of the light emitting device according to the fourth embodiment. As shown in FIG. 8, the light emitting device 400 according to the fourth embodiment is different from the light emitting device 400 according to the first embodiment in that the composite substrate 4 according to the fourth embodiment is provided. In the light emitting device 400 according to the fourth embodiment, the light emitting element 34 is placed on the bottom surface of the recess X (the region surrounded by the frame body Y).

[Composite substrate 5 according to the fifth embodiment]
FIG. 9 is a schematic cross-sectional view of the composite substrate according to the fifth embodiment. As shown in FIG. 9, in the composite substrate 5 according to the fifth embodiment, the frame body Y is provided inside the outer edge of the composite substrate 5 in that the frame body Y formed separately from the covering member 30 is provided. This is different from the composite substrate 4 according to the fourth embodiment, which is provided along the outer edge of the composite substrate 4 and the side surface of the frame body Y is the side surface of the entire composite substrate 4. Even in this way, the recess X (the region surrounded by the frame body Y) can be provided in the composite substrate 1 by using a material different from that of the covering member 30 while using the flat plate-shaped substrate 14.

[Light emitting device 500 according to the fifth embodiment]
FIG. 10 is a schematic cross-sectional view of the light emitting device according to the fifth embodiment. As shown in FIG. 10, the light emitting device 500 according to the fifth embodiment is different from the light emitting device 400 according to the fourth embodiment in that the composite substrate 5 according to the fifth embodiment is provided. In the light emitting device 500 according to the fifth embodiment, the light emitting element 34 is placed on the bottom surface of the recess X (the region surrounded by the frame body Y).

[Composite substrate 6 according to embodiment 6]
FIG. 11 is a schematic cross-sectional view of the composite substrate according to the sixth embodiment. As shown in FIG. 11, the composite substrate 6 according to the sixth embodiment is different from the composite substrate 1 according to the first embodiment in that it includes a substrate 14 having a recess X1 and a covering member 30 having a frame body Y. According to the composite substrate 6 according to the sixth embodiment, by combining the recess X1 of the substrate 14 and the frame body Y of the covering member 30, a recess X2 larger than the recess X1 of the substrate 14 including the recess X1 of the substrate 14 is formed. (Hereinafter, the recess X1 of the substrate 14 is referred to as a first recess X1, and the recess X2 formed by combining the recess X1 of the substrate 14 and the frame body Y of the covering member 30 is referred to as a second recess X2). The side wall of the second recess X2 is composed of a substrate 14 (ceramic) on the lower side and a covering member 30 (resin) on the upper side. Therefore, the side wall of the second recess X2 is made of a member whose upper side and lower side are different. The inner side wall of the second recess X2 may be a continuous straight line or a curved surface having no step from the bottom surface side to the upper surface side of the second recess X2 in cross-sectional view, but may have a step. , The lower inner wall surface (inner wall surface of the base 14 portion) and the upper inner wall surface (inner wall surface of the covering member 30 portion) may have different angled surfaces.

[Light emitting device 600 according to the sixth embodiment]
FIG. 12 is a schematic cross-sectional view of the light emitting device 600 according to the sixth embodiment. As shown in FIG. 12, the light emitting device 600 according to the sixth embodiment is different from the light emitting device according to the other embodiment in that the composite substrate 6 according to the sixth embodiment is provided. In the light emitting device 600 according to the sixth embodiment, the light emitting element 34 is placed on the bottom surface of the second recess X2 (which is also the bottom surface of the first recess X1).

[Composite substrate 7 according to embodiment 7]
FIG. 13 is a schematic cross-sectional view of the composite substrate according to the seventh embodiment. As shown in FIG. 13, the composite substrate 7 according to the seventh embodiment is different from the composite substrate 1 according to the first embodiment including one substrate 12 (base 14) in that it includes a plurality of substrates 12 (base 14). To do. The plurality of substrates 12 (base 14) are integrated by the covering member 30.

[Light emitting device 700 according to the seventh embodiment]
FIG. 14 is a schematic cross-sectional view of the light emitting device according to the seventh embodiment. As shown in FIG. 14, the light emitting device 700 according to the seventh embodiment includes one substrate 12 (base 14) and one light emitting element in that it includes a plurality of substrates 12 (base 14) and a plurality of light emitting elements 34. It is different from the light emitting device 100 according to the first embodiment including 34. According to the light emitting device 700 according to the seventh embodiment, since the plurality of substrates 12 (base 14) are separated in one composite substrate 7, the warp of the substrate 12 (base 14) is alleviated by the covering member 30. Can be made to. Therefore, even if the width and depth of the composite substrate 7 are increased, cracks and the like are less likely to occur in the substrate 12 (base 14), and workability in the manufacturing process is improved.

[Manufacturing method of light emitting device 100 according to the first embodiment]
15A to 15H are schematic cross-sectional views showing a method of manufacturing the light emitting device according to the first embodiment. Hereinafter, description will be made with reference to FIGS. 15A to 15H.

(First step)
First, as shown in FIG. 15A, the substrate assembly L1 is prepared. The substrate assembly L1 is a plate-shaped member formed by connecting a plurality of substrates 12, and has a substrate 14 made of ceramic and a first wiring 18 and a second wiring 24. The first wiring 18 and the second wiring 24 are formed on the upper surface and the lower surface of the substrate 14, respectively. As the substrate 14, for example, one produced by firing ceramic green sheets laminated to each other can be used. Although not shown, the first region 20 of the first wiring 18 and the first region 26 of the second wiring 24 are electrically connected via, for example, a through hole (via) 16. Similarly, the second region 22 of the first wiring 18 and the second region 28 of the second wiring 24 are also electrically connected via, for example, through holes (vias) 16.

(Second step)
Next, as shown in FIG. 15B, the substrate assembly L1 is separated into a plurality of substrates 12 by cutting the substrate 14 by laser dicing, blade dicing, or the like. Since the light emitting element 34 and the resin material (eg, wavelength conversion layer, lens) are not yet mounted on the substrate 14, the substrate 14 is easy to use in a relatively short time by using a method such as laser dicing or blade dicing. Can be cut into. That is, if the substrate 14 is cut by laser dicing with the light emitting element 34 and the resin material mounted, the substrate 12 may become dirty due to the charring or fume of the resin material, so it is necessary to clean the individual substrates 12 after cutting. However, if the substrate 14 is cut before mounting the light emitting element 34, the resin material, or the like, it is not necessary to perform such cleaning. Further, when the substrate 14 is cut by blade dicing with the light emitting element 34 and the resin material mounted, the blade is clogged with the resin material and the resin material covering the substrate 14 is peeled off from the substrate 14. It is necessary to first dice the resin material on the substrate 14, and then dice the substrate 14 itself separately. However, if the substrate 14 is cut before mounting the light emitting element 34, the resin material, or the like, such two steps are taken. There is no need to do dicing. Therefore, in both cases of laser dicing and blade dicing, the time and cost required for individualizing the substrate assembly L1 can be reduced. Laser dicing and blade dicing are examples, and before mounting the light emitting element 34, the resin material, or the like, even if the substrate 14 is cut by another method, the substrate assembly L1 can be separated into individual pieces. The time and cost required can be reduced.

(Third step)
Next, as shown in FIG. 15C, a plurality of substrates 12 obtained by individualizing the substrate aggregate L1 are placed on the sheet 40 at predetermined intervals, and the sheet 40 is placed using an adhesive. Adhere to. The sheet 40 is, for example, polyimide, glass cloth, polyester, polypropylene or the like, but preferably polyimide or glass cloth having high heat resistance. The pressure-sensitive adhesive is, for example, an acrylic-based or silicone-based pressure-sensitive adhesive. Placement can be performed using a mounter or sorter. The distance between the substrate 12 and the substrate 12 can be expanded by using the expand after the substrate 12 is placed on the sheet 40 by transfer or the like.

(4th step)
Next, as shown in FIG. 15D, a covering member 30 is provided on the sheet 40 so that each of the first wirings 18 is exposed on the upper surface side of the plurality of substrates 12, and the plurality of substrates 12 are integrated. The covering member 30 can be provided by transfer molding, compression molding, or the like. The covering member 30 is preferably provided so as to cover the entire side surface of the substrate 14. In this way, as will be described later, by cutting the covering member 30 provided between the bases 14 and the bases 14, that is, the composite substrate 1 can be separated without cutting the bases 14. Since this is possible, the time and cost required for individualizing the composite substrate 1 can be reduced.

(Fifth step)
Next, as shown in FIG. 15E, the sheet 40 is removed from the plurality of integrated substrates 12 to expose each of the second wirings 24 on the lower surface side of the plurality of substrates 12 to form a composite substrate assembly L2.

(6th step)
Next, as shown in FIG. 15F, the light emitting element 34 is mounted on each of the first wirings 18 on the upper surface side of the composite substrate assembly L2. If necessary, as shown in FIG. 15G, each light emitting element 34 on the composite substrate assembly L2 may be sealed by the sealing member 36, respectively.

(7th step)
Next, as shown in FIG. 15H, the composite substrate assembly L2 is separated into a plurality of light emitting devices 100 by cutting the covering member 30 by laser dicing, blade dicing, or the like. Specifically, for example, the covering member 30 provided between the bases 14 and the bases 14 is cut without cutting the bases 14 at all or almost without cutting the bases 14. Since the covering member 30 having a strength lower than that of the substrate 14 is cut instead of the substrate 14, the time and cost required for individualizing the composite substrate assembly L2 can be reduced as compared with the case of cutting the substrate 14.

As described above, in the present embodiment, the substrate assembly L1 is individualized by cutting the substrate 14 at a stage where the light emitting element 34, the resin material (eg, the wavelength conversion layer, the lens), etc. are not yet mounted. To do. Further, the composite substrate assembly L2 is individualized by cutting the covering member 30 provided between the substrates 14 and the substrate 14 instead of the substrate 14. Therefore, according to the present embodiment, it is possible to reduce the time and cost required for manufacturing the light emitting device 100 provided with the composite substrate 1.

[Manufacturing method of light emitting device 200 according to the second embodiment]
The method for manufacturing the light emitting device 200 according to the second embodiment is different from the method for manufacturing the light emitting device 100 according to the first embodiment in that the substrate 14 having the recess X is prepared in the first step described above. Since other points are the same as the manufacturing method of the light emitting device 100 according to the first embodiment, the description thereof will be omitted.

[Manufacturing method of light emitting device 300 according to the third embodiment]
In the method for manufacturing the light emitting device 300 according to the third embodiment, in the fourth step described above, a mold having a cavity capable of forming the frame body Y is prepared, and the substrate 14 is made of the same material as the covering member 30. It differs from the manufacturing method of the light emitting device 100 according to the first embodiment in that the frame body Y is integrally formed on the upper surface with the covering member 30. Since other points are the same as the manufacturing method of the light emitting device 100 according to the first embodiment, the description thereof will be omitted.

[Manufacturing method of the light emitting device 400 according to the fourth embodiment]
In the method for manufacturing the light emitting device 400 according to the fourth embodiment, in the fourth step described above, a frame body Y separate from the covering member 30 is formed on the upper surface of the substrate 14 by using a material 50 different from the covering member 30. This is different from the manufacturing method of the light emitting device 100 according to the first embodiment. Since other points are the same as the manufacturing method of the light emitting device 100 according to the first embodiment, the description thereof will be omitted.

[Manufacturing method of the light emitting device 500 according to the fifth embodiment]
In the method for manufacturing the light emitting device 500 according to the fifth embodiment, in the fourth step described above, a frame body Y separate from the covering member 30 is formed on the upper surface of the substrate 14 by using a material different from the covering member 30. It differs from the manufacturing method of the light emitting device 100 according to the first embodiment in that it is formed inside the outer edge of 5. Since other points are the same as the manufacturing method of the light emitting device 100 according to the first embodiment, the description thereof will be omitted.

[Manufacturing method of the light emitting device 600 according to the sixth embodiment]
In the light emitting device 600 according to the sixth embodiment, the substrate 14 having the recess X1 is prepared in the first step described above, and the same material as the covering member 30 is used on the upper surface of the substrate 14 in the fourth step described above. It differs from the manufacturing method of the light emitting device 100 according to the first embodiment in that the frame body Y is formed integrally with the covering member 30. Here, in the covering member 30, the frame body Y of the covering member 30 is combined with the recess X1 of the substrate 14, so that the recess X2 larger than the recess X1 of the substrate 14 (the recess X2 includes the recess X1 of the substrate 14) is formed. Provided to be formed. Since other points are the same as the manufacturing method of the light emitting device 100 according to the first embodiment, the description thereof will be omitted.

[Manufacturing method of the light emitting device 700 according to the seventh embodiment]
The method for manufacturing the light emitting device 700 according to the seventh embodiment is as follows: (1) In the second step described above, the plurality of substrates 12 are connected by individualizing the substrate aggregate L1 with the plurality of substrates 12 as one unit. A point of obtaining a member (hereinafter referred to as a "board connecting body"), (2) In the fourth step described above, all the side surfaces of the individual board connecting bodies obtained by individualizing the board assembly L1 are covered with the covering member. A plurality of points covered with 30, (3) The composite substrate assembly L2 is separated into individual pieces by cutting the covering member 30 provided between the substrate connecting bodies and the substrate connecting bodies in the above-mentioned seventh step. It is different from the manufacturing method of the light emitting device 100 according to the first embodiment in that the light emitting device 700 of the above is obtained. Since other points are the same as the manufacturing method of the light emitting device 100 according to the first embodiment, the description thereof will be omitted. As described in the case of the light emitting device 700 according to the seventh embodiment, each light emitting device 700 has a plurality of substrates 12 (14) and a plurality of light emitting elements 34.

Although the embodiments have been described above, these descriptions relate to an example and do not limit the configuration described in the claims.

1, 2, 3, 4, 5, 6, 7 Composite substrate 12 Substrate 14 Substrate 16 Through hole (via)
18 1st wiring 20 1st region of 1st wiring 22 2nd region of 1st wiring 24 2nd wiring 26 1st region of 2nd wiring 28 2nd region of 2nd wiring 30 Covering member 32 Stretched portion 34 Light emitting element 36 Sealing member 40 Sheet 50 Material different from the covering member 100, 200, 300, 400, 500, 600, 700 Light emitting device L1 Substrate assembly L2 Composite substrate assembly X Recess X1 First recess X2 Second recess Y Frame

Claims (9)

A plurality of substrates including a plurality of substrates, a first wiring provided on the upper surface of the substrate, and a second wiring provided on the lower surface of the substrate and electrically connected to the first wiring.
A light emitting element arranged on each of the plurality of substrates,
A light emitting device including a coating member provided so as to expose a plurality of the first wirings on the upper surface side of the substrate.
The covering member is formed so as to fill the gaps of the plurality of first wirings on the upper surface side of the substrate.
The upper surface of the first wiring is provided so as to be lower than the upper surface of the covering member .
The substrate is made of ceramic with four sides.
The coating member is a light emitting device that contains a resin and covers the four side surfaces of the substrate. Below the exposed side surface of the substrate, a recess capable of forming a solder fillet is provided .
The light emitting device according to claim 1, wherein a conductive member electrically connected to the first wiring is arranged on the inner wall of the recess. The light emitting device according to claim 1 or 2 , wherein at least a part of the lower surface of the substrate is exposed from the covering member. The coating member contains one or more resins selected from the group consisting of triazine derivative epoxy resins, epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, urethane resins, and unsaturated polyesters. , The light emitting device according to any one of claims 1 to 3. The covering member is in the resin, as an additive material, acid anhydride, antioxidant, releasing agent, light reflecting member, comprising an inorganic filler, a curing catalyst, light stabilizer, and / or lubricants such as, claim The light emitting device according to 4. The light emitting device according to any one of claims 1 to 5, wherein the light emitting element is sealed with a sealing member. The light emitting device according to claim 6 , wherein the sealing member has a lens shape. The light emitting device according to any one of claims 1 to 7, wherein the light emitting element is connected by a bump. The light emitting device according to any one of claims 1 to 8 , wherein the light emitting device includes a protective element.

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