JP2011049325A - Light-emitting component and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting component which has satisfactory heat radiation property and ensures high reliability by using an LED of high luminance and high output as a light source. <P>SOLUTION: A light-emitting component is provided with: a light source; a metallic substrate A on which the light source is loaded; a wire bond connected to the light source; a metallic substrate B electrically connected to the light source by the wire bond, formed on the same plane as the metallic substrate A, and isolated from the metallic substrate A; a reflecting member installed at the metallic substrate A and the metallic substrate B and having an inclined face inside; and a mold part covering the light source. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light-emitting component that uses a high-luminance and high-power LED element as a light source and a method for manufacturing the same, and by increasing the heat dissipation effect, the service life of the LED element is extended, and the high-luminance and high-output are achieved. The present invention relates to a light emitting component improved so that it can be maintained and a method for manufacturing the same.

  In the conventional LED package, an LED element is mounted as a light source on a circuit board having a fixing electrode pattern, and a front surface of the board and a reflecting member having a radial reflection surface on the inner side and the size of the board are almost similar. It is a structure that is fixed integrally with an epoxy resin. Such a conventional LED package has a reflecting surface inclined through the reflecting member, and reflects light from the LED element to the front surface through the reflecting surface.

  However, since the conventional LED package as described above does not use a material having high thermal conductivity as a substrate material, that is, an excellent heat dissipation function, an excellent heat dissipation effect can be obtained during the light emitting operation of the LED element. I can't. Further, in the conventional LED package, since the reflecting member is fixed to the substrate in a separate process, it is difficult to simplify the manufacturing process, resulting in an increase in assembly cost.

 In order to eliminate these drawbacks, as an LED package manufacturing method, “LED package having a multilayer reflective surface structure and manufacturing method thereof” (Patent Document 1) has been proposed.

 The contents of Patent Document 1 will be described with reference to FIG. The invention according to Patent Document 1 includes a substrate 200 made of an aluminum material and having a multilayer reflective surface that is recessed on the side surface, a light source 400 mounted on the reflective surface and electrically connected to an electrode pattern, and the electrode pattern. And an anodizing insulating layer 210 formed between the substrate and a molding part 600 covered on the light source of the substrate, and the LED element of the light source forms an aluminum heat dissipation part on the lower surface thereof to dissipate heat. An LED package having a multilayer reflective surface structure configured to be superior to the above and a manufacturing method thereof are provided. According to the invention according to Patent Document 1, since the substrate is made of an aluminum material and an anodizing process is performed to form an insulating layer, an excellent heat dissipation effect of the LED element can be obtained through this, and thereby the LED package The service life and luminous efficiency can be greatly increased.

JP 2007-294966 A

 However, although the LED package uses aluminum with a thermal conductivity of 236 W / m · K, the anodized insulating layer is 32 W / m · K, which reduces the thermal conductivity. There is. In addition, since the insulating layer 210 that has been anodized has a porous structure, and the molding part 600 covers the insulating layer 210, bubbles are likely to be generated from the insulating layer part at the time of forming the molding part. There is a problem of generating. Furthermore, since a gas such as sulfide reaches the inside of the package through this insulating layer, there is a problem that the silver-coated reflective film rapidly deteriorates.

 In order to solve the above-described problems, the present invention provides the following means.

 A light source, a metal substrate A on which the light source is mounted, a wire bond connected to the light source, and electrically connected to the light source by wire bond, formed in the same plane as the metal substrate A, and insulated from the metal substrate A Provided is a light emitting component comprising: a metal substrate B, a metal substrate A and a reflective member that is provided on the metal substrate A and has an inclined surface inside, and a mold part that covers the light source.

 Further, the metal substrate A and the metal substrate B are formed of any one of copper, silver, gold, and aluminum. Further, the inclined surface of the reflecting member is formed of at least one of a cold mirror film, a silver film, and an aluminum film. The mold part is characterized by being hydrophobic.

 The method for manufacturing a light-emitting component according to the present invention includes a step of installing a reflective member having an inclined through hole on a metal substrate C, a step of mounting a light source on the metal substrate C, the metal substrate C and the light source. Are divided into a metal substrate B, which is a portion connected to the metal substrate A, which is a portion on which the light source is mounted, and a metal substrate A, which is a portion on which the light source is mounted. And a step of performing.

 Further, in the step of installing the reflection member on the metal substrate C, the reflection member is formed of glass, and the surfaces of the metal substrate A and the metal substrate B that are joined to the reflection member are formed of an aluminum thin film or a silicon thin film, The metal substrate A and the metal substrate B are anodically bonded.

 Further, in the step of installing the reflection member on the metal substrate C, the reflection member is formed of glass, and the surfaces of the metal substrate A and the metal substrate B that are joined to the reflection member are formed of an aluminum thin film or a silicon thin film, The metal substrate A and the metal substrate B are anodically bonded.

 Further, the step of installing the light source on the metal substrate C is characterized in that the metal substrate C and the light source are joined by firing metal nanoparticles.

 Further, the method includes a step of separating a plurality of light emitting components formed on the metal substrate C at once. At this time, in the step of bonding or bonding the reflecting member and the metal substrate C, the reflecting member having the groove and the metal substrate C are bonded or bonded to each other, whereby the singulation can be easily performed.

 By adopting such means, a heat radiation path without a portion that lowers the thermal conductivity is secured, and thus a light emitting component with high heat dissipation can be provided. In addition, since the reflecting member does not have a porous structure, it is possible to provide a light-emitting component that is free from defects during formation of the mold part and has high reliability.

 According to the present invention, an LED element as a light source is bonded to one of the divided metal substrates, and an excellent heat dissipation effect can be obtained, thereby greatly increasing the service life and light emission efficiency of the light emitting component. Has an effect.

  Further, according to the present invention, since a large number of metal substrates and reflection members are simultaneously formed and separated into pieces in the final process, an effect of reducing the manufacturing cost can be obtained.

It is sectional drawing of the light emitting component which concerns on this invention. It is a figure which shows the manufacturing process of the light emitting component which concerns on this invention. It is a top view in the manufacturing process of the light emitting component according to the present invention. It is a figure which shows the manufacturing process of the light emitting component which concerns on this invention. It is a figure which shows sectional drawing of a prior art example.

 Embodiments of the present invention will be described with reference to the drawings.

 FIG. 1 is a cross-sectional view of a light emitting component according to the present invention. The light emitting component 1 includes a metal substrate A21 on which a light source 40 is mounted. Further, the metal substrate B <b> 22 is electrically connected to the light source 40 by a wire bond 50. Further, the metal substrate A21 and the metal substrate B22 are insulated. Further, the reflecting member 31 is installed on the metal substrate A21 and the metal substrate B22. In addition, the mold part 60 covers the light source 40. The reflecting member 31 has an inclined surface that reflects light from the light source. The inclined surface is a side surface of a through hole formed inside the reflecting member 31, and has a structure in which a light source is mounted in the through hole. Further, the metal substrate A and the metal substrate B are connected by a reflecting member.

 The material of the metal substrate A21 and the metal substrate B22 is, for example, aluminum having a thermal conductivity of 236 W / m · K, gold having a thermal conductivity of 320 W / m · K, silver having a thermal conductivity of 420 W / m · K, heat Copper having a conductivity of 398 W / m · K. Further, the thickness of the metal substrate A21 and the metal substrate B22 is suitably 10 μm to 100 μm in consideration of heat dissipation, structural strength, ease of manufacture, and the like.

 As a material of the reflecting member 31, for example, glass or ceramics can be used. Further, by forming, for example, a silver film, an aluminum film, or a cold mirror film on the inclined surface of the reflecting member 31, the reflection efficiency can be increased.

 As a method of installing the reflecting member 31 on the metal substrate A21 and the metal substrate B22, it is possible to bond them using an epoxy resin, an acrylic resin, or the like.

 Further, when the material of the reflecting member 31 is glass, a silicon thin film or aluminum thin film of 1000 to 5000 mm, for example, is formed on the surface of the metal substrate A21 and the metal substrate B22, and bonded by anodic bonding. Is also possible. However, when the metal substrate A21 and the metal substrate B22 are formed of aluminum, anodic bonding can be performed without forming the thin film.

 Further, when the material of the reflecting member 31 is ceramics, it can be brazed using, for example, silver brazing.

 By adopting the method as described above, a highly reliable component can be produced rather than bonding with an adhesive.

 The material of the mold part 60 is preferably transparent and hydrophobic. For example, a transparent resin can be used, and a transparent resin such as epoxy, acrylic, silicone, polysiloxane, or the like can be used. Moreover, you may mix a fluorescent substance etc. in the said resin.

 The light source 40 and the metal substrate A21 are bonded using a conductive adhesive such as a silver paste called a die bond agent. In addition, the light source 40 and the metal substrate A21 have high thermal conductivity without a resin component by sintering and joining metal nanoparticles such as silver, gold-tin alloy, gold, and copper in consideration of heat dissipation. Joining.

 Next, the manufacturing method according to the present invention will be described with reference to FIGS.

 FIG. 2 is a diagram showing a manufacturing process of a light emitting component according to the present invention, and shows means for manufacturing a plurality of light emitting components in units of wafers and separating them in a final process.

 FIG. 2A shows a metal substrate C20 for forming the metal substrate A21 and the metal substrate B22. A thin film (not shown) is formed on the metal substrate C20 according to the material of the reflecting member 30 in which a plurality of inclined through-holes are integrally formed and the installation method such as bonding or adhesion to the reflecting member 30. Further, the mounting pattern of the light source 40 and the wire bond 50 may be formed of a gold film or the like.

 FIG. 2B shows a step of installing the reflecting member 30 in which a plurality of inclined through holes are integrally formed on the metal substrate C20 by bonding or bonding. The inclined through hole is formed by blasting, etching, drilling, powder firing or the like according to the material of the reflecting member 30.

 FIG. 2C shows a process of mounting the light source 40 on the metal substrate C20. At this time, the light source is mounted on a portion of the metal substrate C20 where the metal substrate A is formed. In this step, the metal substrate C20 and the light source 40 are joined by sintering metal nanoparticles such as silver, gold-tin alloy, gold, and copper. By this step, a bonding layer made of the above metal is formed between the metal substrate C20 and the light source 40. In addition, the metal substrate C20 and the light source 40 can be joined using a conductive adhesive such as a silver paste called a die bond agent.

 FIG. 2D shows a step of forming the wire bond 50 and electrically connecting the light source 40 and the portion of the metal substrate C where the metal substrate B is formed.

 FIG. 2E shows a process of forming a mold part 60 for molding the light source 40 and the wire bond 50. At this time, the mold part 60 is preferably transparent and hydrophobic. Moreover, the mold part 60 may be mixed with a mixture such as a phosphor.

 FIG. 2F shows a split part forming step in which the split part 23 is formed on the metal substrate C20 in order to split the electrode to the light source 40. As a method for forming the divided portion 23, an appropriate method can be selected from laser processing, machining, and the like. Further, by making the mold part 60 hydrophobic and water repellent, processing by wet etching becomes possible. Further, at this time, the thickness of the metal substrate C20 can be reduced by wet etching, and heat dissipation can be further improved. A top view at this time is shown in FIG.

 FIG. 2G shows a light emitting component forming process in which individual light emitting components are manufactured by dividing a plurality of metal substrates C20 formed at the same time into pieces by dicing or the like. By this step, the metal substrate C20 is completely divided into the metal substrate A and the metal substrate B.

 Through the above steps, after a plurality of light emitting components are collectively formed on the metal substrate C20, it is possible to divide into individual light emitting components, and an effect of reducing the manufacturing cost can be obtained.

 The present embodiment is not limited to the case where a plurality of light emitting components are simultaneously formed, and can be applied to the case where one light emitting component is formed. In that case, the process of FIG. 2G is not necessary, and the metal substrate C20 is divided into the metal substrate A and the metal substrate B by the process of FIG.

 A method of manufacturing a light emitting component more easily will be described with reference to FIG.

 As shown in FIG. 4 (b1), in the step of installing the reflecting member 30 on the metal substrate C20, the reflecting member 32 having a groove portion at a place where the light emitting component 1 is separated is used to join or adhere to the metal substrate C20. Installed on metal substrate C20. Thereafter, the steps from FIG. 2C to FIG. 2E are performed as described above.

 As shown in FIG. 4 (f <b> 1), in the divided portion forming step, the divided portion 23 that divides the metal substrate A <b> 21 and the metal substrate B <b> 22 is formed, and the divided portion 23 is also formed in the portion corresponding to the groove portion of the reflecting member 32. In this step, when the material of the metal substrate C20 is copper, the metal substrate A21 and the metal substrate B22 are subjected to rust prevention treatment such as gold plating or Sn plating in order to suppress corrosion. Note that either the step of FIG. 4B1 or the step of FIG. 4F1 may be performed.

 In this way, in the light emitting component forming process shown in FIG. 4 (g1), it is only necessary to cut the reflecting member, and it is not necessary to cut different materials, so that accuracy can be improved and cost can be reduced. There are many choices. Further, since the groove portion is formed, the stress is concentrated, so that it can be cut into pieces, and a special device is not required and can be separated into pieces quickly.

1 Light-Emitting Component 20 Metal Substrate C
21 Metal substrate A
22 Metal substrate B
23 Dividing part 30 Reflecting member 31 in which a plurality of inclined through holes are integrally formed Reflecting member 32 Reflecting member having groove part 40 Light source 50 Wire bond 60 Mold part 100 LED package 200 Aluminum substrate 210 Anodizing insulating layer 300 Electrode pattern 400 Light source 500 Wire 600 molding part

Claims (14)

  A light source, a metal substrate A on which the light source is mounted, a wire bond connected to the light source, and electrically connected to the light source by the wire bond, formed in the same plane as the metal substrate A, and the metal A light emitting component comprising: a metal substrate B that is insulated from the substrate A; a reflective member that is installed on the metal substrate A and the metal substrate B and has an inclined surface inside; and a mold portion that covers the light source.   The light emitting component according to claim 1, wherein the metal substrate A and the metal substrate B are formed of any one of copper, silver, gold, and aluminum.   The reflective member is formed of glass, and the surfaces of the metal substrate A and the metal substrate B that are joined to the reflective member are formed of an aluminum thin film or a silicon thin film. The reflective member, the metal substrate A, and the metal substrate B The light-emitting component according to claim 2, wherein and are anodically bonded.   The light-emitting component according to claim 2, wherein the reflection member is made of ceramics, and the reflection member, the metal substrate A, and the metal substrate B are brazed.   The said metal substrate A and the said light source are joined by baking a metal nanoparticle, The light emitting component as described in any one of Claim 1 to 4 characterized by the above-mentioned.   The light-emitting component according to claim 5, wherein the metal nanoparticles are any one of silver, gold-tin alloy, gold, and copper.   The light emitting component according to claim 6, wherein the inclined surface of the reflecting member is formed of at least one of a cold mirror film, a silver film, and an aluminum film.   The light emitting component according to claim 7, wherein the mold part is hydrophobic.   A step of installing a reflective member formed with an inclined through hole on the metal substrate C, a step of mounting a light source on the metal substrate C, and a step of electrically connecting the metal substrate C and the light source by wire bonding; A step of forming a mold part, and a step of dividing the metal substrate C into a metal substrate A which is a portion on which the light source is mounted and a metal substrate B which is a portion electrically connected to the light source through the wire bond. A method for manufacturing a light-emitting component, comprising:   In the step of installing the reflecting member on the metal substrate C, the reflecting member is formed of glass, and a surface of the metal substrate C to be joined to the reflecting member is formed of an aluminum thin film or a silicon thin film, and the reflecting member and the The method for manufacturing a light-emitting component according to claim 9, wherein the metal substrate C is anodically bonded.   The light-emitting component according to claim 9, wherein in the step of installing the reflective member on the metal substrate C, the reflective member is formed of ceramics, and the reflective material and the metal substrate C are brazed. Production method.   The step of mounting the light source on the metal substrate C joins the metal substrate C and the light source by firing metal nanoparticles. Manufacturing method of light emitting component.   13. The method for manufacturing a light-emitting component according to claim 9, wherein a plurality of light-emitting components are collectively formed on the metal substrate C and then separated into individual light-emitting components.   The method of manufacturing a light emitting component according to claim 13, wherein in the step of installing the reflective member on the metal substrate C, the reflective member having at least one groove is disposed on the metal substrate C.

Images