TW202335195A - Package and method of manufacturing the same - Google Patents

Abstract

The invention provides a package and a method for manufacturing the same, wherein electrical connection between an upper surface and a lower surface can be ensured, and solder can be prevented from unnecessarily flowing out of a large amount to a side surface. The metallization portion (200) includes a sealing metallization layer (210) on the sealing surface (SS), a lower surface metallization layer (220) on the lower surface (P2) of the ceramic portion (100), and a side surface metallization layer (230) on the side surface (P3) of the ceramic portion (100). The side metallization layer (230) has an upper portion (231) connected to the sealing metallization layer (210), a lower portion (232) connected to the lower surface metallization layer (220), and an intermediate portion (233) connecting the upper portion (231) and the lower portion (232) to each other. The metal layer (300) is made of a metal material having higher wettability with respect to the brazing material (930) than the metallization material. The metal layer (300) covers the sealing metallization layer (210) of the metallization portion (200), and the middle portion (233) of the side metallization layer (230) of the metallization portion (200) is not covered.

Description

Package and manufacturing method

The present invention relates to a package and a manufacturing method thereof, in particular to a package for electronic components and a manufacturing method thereof.

Japanese Patent Application Laid-Open No. 2000-312060 (Patent Document 1) discloses an electronic component mounting substrate for mounting electronic components such as a crystal oscillator. The electronic component mounting substrate has a lower insulating layer and an upper insulating layer. The lower insulating layer has a mounting portion for mounting electronic components on the top surface, and is covered with a plurality of metallized conductor layers for connecting electrodes of the electronic components to the outside from the mounting portion to the bottom surface. The upper insulating layer is frame-shaped, laminated on the lower insulating layer to surround the mounting portion, and is covered with a sealing metallization layer for joining the cover to its top surface. A notch is formed on the outer peripheral surface of the upper insulating layer, allowing the upper insulating layer to penetrate vertically. The metallized conductor post that electrically connects the metallized conductor layer and the sealing metallized layer is buried in the notch so that its upper end surface is flush with the top surface of the upper insulating layer.

According to the above structure, the sealing metallized layer is electrically connected to the metallized conductor layer via the metallized conductor pillar. Therefore, by connecting the metallized conductor layer to ground potential, the sealing metallization layer can also be connected to ground potential.

Furthermore, the above-mentioned publication discloses that the exposed surfaces of the metallized conductor layer, the sealing metallized layer and the metallized conductor post are coated with a metal having excellent wettability with solder, such as gold (Au), by electroplating. Furthermore, by this electroplating, the sealing metallization layer and the metal cover can be firmly connected through the solder. The solder is made of gold-tin (Au-Sn) alloy, for example. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2000-312060

[Problem to be solved by the invention]

According to the technology described in the above-mentioned publication, a metal layer excellent in wettability with solder is provided so as to cover the exposed surfaces of the metallized conductor layer, the sealing metallized layer, and the metallized conductor pillar. Thereby, as mentioned above, the connection between the sealing metallization layer and the cover body through the solder can be made strong. On the other hand, since it is covered with a metal layer that has excellent wettability with solder, it is easy for solder to flow out from the sealing metallized layer on the top surface to the metallized conductor pillars on the side, without effective use. . In particular, the content of expensive materials such as gold in solder is often high. Therefore, in this case, a large amount of solder flowing out without effective utilization will significantly increase the material cost.

The present invention is made to solve the above problems, and its purpose is to provide a package and a manufacturing method thereof that can prevent unnecessary large amounts of solder from flowing from the top surface to the side while ensuring electrical connection between the top surface and the bottom surface. [Means to solve the problem]

A type of package for electronic components, with a cover installed using solder. The package body has a ceramic part, a metallized part and a metal layer. The ceramic part has an outer edge when viewed from above. The ceramic part has a top surface, a bottom surface opposite to the top surface, and a side surface arranged on the outer edge when viewed from above and connecting the top surface and the bottom surface to each other. The top surface includes a sealing surface for supporting the cover, and a cavity for storing electronic components is provided inside the sealing surface. The metallized part is provided on the ceramic part and is made of metallized material. The metallization part includes: a sealing metallization layer, located on the sealing surface; a bottom metallization layer, located on the bottom surface of the ceramic part; and a side metallization layer, located on the side of the ceramic part. The side metallization layer has an upper part connected to the sealing metallization layer; a lower part connected to the bottom metallization layer; and a middle part connecting the upper part and the lower part to each other. The metal layer is composed of a metal material that has higher wettability to solder than the metallized material. The metal layer covers the sealing metallization of the metallization, but does not cover the middle portion of the side metallization of the metallization.

In addition, the metal material constituting the metal layer may be either a pure metal or an alloy. The metal layer can also cover the upper portion of the side metallization layer. The metal layer may also have ends with gradually smaller thicknesses. When viewed from above, the outer edge of the ceramic part has: a first corner, a second corner, and a side connecting the first corner and the second corner to each other. The side metallization layer can also be separated from the first corner and the second corner. Connected to one side. A surface oxide film composed of an oxide of metallization material may also be provided in the middle part of the side metallization layer. The surface of the middle part of the side metallization layer is the fracture surface. The outer edge may also include recesses provided with side metallization layers. Within the height range of the middle portion provided with the side metallization layer, the recess can be completely filled by the side metallization layer. Within the height range of the middle portion where the side metallization layer is arranged, the recessed portion can be completely filled with the side metallization layer and a filling portion made of ceramic that faces the ceramic portion across the side metallization layer.

The method for manufacturing a package in the above aspect includes the following steps: (a) forming a green laminate having a ceramic green portion including a portion to become a ceramic portion, and a portion including a metallized portion. A metallized green part that is a part of the ceramic part, wherein the ceramic green part and the metallized green part each cross an imaginary line that becomes at least part of the outer edge of the ceramic part; (b) along the imaginary line, on the green part The green laminate forms trenches; (c) By calcining the green laminate, a calcined body including a ceramic part and a metallized part is formed; (d) In order to form a metal layer, the metallized part of the calcined body is Electroplating; and (e) after the step of electroplating the metallized part, cracks are made in the calcined body starting from the trench, thereby breaking the ceramic part and forming the middle part of the side metallized layer of the metallized part. surface. [Effects of the invention]

According to the above aspect of the package, first, the metallization part includes: a sealing metallization layer provided on the sealing surface; a bottom surface metallization layer provided on the bottom surface of the ceramic part; and a side metallization layer provided on the ceramic part. on the side of the head. This ensures an electrical connection between the top surface provided with the sealing metallization layer and the bottom surface provided with the bottom surface metallization layer. Secondly, the metal layer composed of a metal material with high wettability to the solder in the molten state does not cover the side metallization of the metallized part while covering the sealing metallized layer of the metallized part. middle part of the layer. This prevents the solder from flowing out unnecessarily from the top surface to the sides. It can be seen from the above that while ensuring the electrical connection between the top surface and the bottom surface, the solder can be prevented from flowing out unnecessarily in large amounts from the top surface to the side.

The purpose, characteristics, aspects and advantages of this invention can be more clearly understood through the following detailed description and attached drawings.

Hereinafter, embodiments will be described based on the drawings.

<Embodiment 1> FIG. 1 is a schematic plan view of the structure of an electronic device 900 according to the first embodiment. FIG. 2 is a schematic partial cross-sectional view along line II-II in FIG. 1 . The electronic device 900 includes a package 801 , electronic components 910 , solder 930 and a cover 920 .

FIG. 3 is a schematic plan view of the structure of the package 801. FIGS. 4 and 5 are respectively schematic partial cross-sectional views along lines IV-IV and V-V in FIG. 3 . The package 801 is used for the electronic component 910, and in this embodiment, has an electrode pad 400 bonded to the electronic component 910. As shown in FIGS. 1 and 2 , solder 930 is used to install the cover 920 on the package 801 . The cover 920 is preferably made of a metal with a thermal expansion coefficient similar to that of ceramics. Specifically, it is preferably made of an alloy containing Fe (iron) and Ni (nickel) as main components, such as Fe-Ni-Co (cobalt) alloy. Or Fe-Ni alloy composition. The main component of solder 930 is preferably Au, and Au alloy is even better, typically Au-Sn alloy. In addition, the material of the solder 930 is not limited to these, and may be, for example, Ag (silver)-Cu (copper) alloy, Pb (lead)-Sn solder, or Pb-free solder. The shape of the cover body may also be flat.

The package 801 has a ceramic part 100, a metallized part 200 provided on the ceramic part 100, and a plating layer 300 (metal layer). The metallization part 200 includes a sealing metallization layer 210 , a bottom metallization layer 220 , and a side metallization layer 230 . The electroplating layer 300 has an upper electroplating layer 310 and a lower electroplating layer 320 . The upper electroplating layer 310 and the lower electroplating layer 320 are separated from each other.

The ceramic part 100 is made of ceramic, for example, aluminum oxide or aluminum nitride. In the case of ceramics made of alumina, 10 to 20 wt% of zirconium dioxide can also be added in order to improve the mechanical strength. As shown in FIG. 3 , the ceramic part 100 has an outer edge EO when viewed from above. Moreover, as shown in FIG. 4 , the ceramic part 100 has a top surface P1, a bottom surface P2 opposite to the top surface P1, and a side surface P3 that connects the top surface P1 and the bottom surface P2 to each other. The side P3 is arranged on the outer edge EO when viewed from above (Fig. 3). The outer edge EO has a concave portion CC. In this embodiment, the concave portion CC is approximately semicircular. The top surface P1 includes a sealing surface SS for supporting the cover 920 ( FIG. 2 ) across the metallized portion 200 and the upper electroplating layer 310 . Furthermore, the top surface P1 is provided with a cavity CV for accommodating the electronic component 910 inside the sealing surface SS. The ceramic part 100 has a frame part surrounding the cavity CV when viewed from above ( FIG. 3 ). Furthermore, the ceramic part 100 is provided with internal wiring (not shown) that connects the inside and outside of the cavity CV. The internal wiring connects, for example, the electrode pad 400 provided in the cavity CV and the electrode pad (not shown) provided on the bottom surface P2 to each other.

The metallized portion 200 is composed of metallized material. The main component of the metallization material is preferably a high melting point metal, such as W (tungsten), Mo (molybdenum), or a mixture of these metals. Alternatively, the main component of the metallized material may be an alloy composed of W and Mo. The sealing metallization layer 210 is provided on the sealing surface SS. The bottom metallization layer 220 is provided on the bottom surface P2 of the ceramic part 100 . The side metallization layer 230 is provided on the side surface P3 of the ceramic part 100 . Specifically, the side metallization layer 230 is disposed in the concave portion CC of the outer edge EO. In this embodiment, within the height range of the middle portion 233 where the side metallization layer 230 is disposed, the concave portion CC is filled with the side metallization layer 230 ( FIG. 4 ). Here, the direction mentioned in the above-mentioned "height range" is the thickness direction of the package 801 (the longitudinal direction in FIG. 4 ). The side metallization layer 230 has an upper portion 231 connected to the sealing metallization layer 210, a lower portion 232 connected to the bottom metallization layer 220, and a middle portion 233 connecting the upper portion 231 and the lower portion 232 to each other. The surface of the middle portion 233 of the side metallization layer 230 is not a fired surface, but a fracture surface SF (FIG. 18) formed by the breaking step described below.

When viewed from above (Fig. 3), the outer edge EO of the ceramic part 100 has a rectangular shape with four sides and four corners. Also, a square is a type of rectangle. Specifically, the outer edge EO has a first corner N1 (the upper right corner in the figure), a second corner N2 (the lower right corner in the figure), and a side connecting the first corner N1 and the second corner N2 (the upper right corner in the figure). to the right). The side metallization layer 230 is away from the first corner N1 and the second corner N2 and connected to one side. Correspondingly, the concave portion CC is separated from the first corner N1 and the second corner N2 and is connected to one side. Furthermore, in this embodiment, the side metallization layer 230 (and the concave portion CC thereof) is connected to the side opposite to this side, that is, the left side in the figure. In addition, the number of side metallization layers (and the number of concave portions CC) included in one package is arbitrary.

The electroplating layer 310 above the electroplating layer 300 covers the sealing metallization layer 210 of the metallization part 200 . On the other hand, the electroplating layer 300 does not cover the middle portion 233 of the side metallization layer 230 of the metallization portion 200 . In this embodiment, the upper electroplating layer 310 covers the upper portion 231 of the side metallization layer 230 . The interface between the upper portion 231 and the upper electroplating layer 310 may also include an inclined surface with respect to the thickness direction (the longitudinal direction in FIG. 4 ). The interface may also be composed only of the inclined surface. In addition, the electroplating layer 320 below the electroplating layer 300 covers the bottom metallization layer 220 of the metallization part 200 . In addition, the lower plating layer 320 of the plating layer 300 covers the lower portion 232 of the side metallization layer 230 of the metallization portion 200 .

The electroplating layer 310 above the electroplating layer 300 has an end portion (the right end portion in FIG. 4 ) with a gradually smaller thickness. Similarly, the electroplating layer 320 below the electroplating layer 300 has an end portion (the right end portion in FIG. 4 ) with a gradually smaller thickness.

Compared with the metallized material, the electroplating layer 300 is composed of a metal material with high wettability to the solder 930 in the molten state. In other words, the wettability of the metal material of the electroplating layer 300 is higher than the wettability of the metallized material. The metal material of the electroplating layer 300 is preferably made of Au as its main component, for example, it is essentially Au.

In addition, in order to prevent the plating layer 300 from peeling off easily, it is preferable to form a base layer (not shown) made of a conductive material different from the above-mentioned metal material between the plating layer 300 and the metallized portion 200 . The base layer can also be an electroplating layer. The material of the base layer may have Ni as its main component, for example, Ni or Ni—Co alloy.

Fig. 5 is a partial cross-sectional view of a place where no recessed portion CC is provided.

Next, a method of collectively manufacturing a plurality of packages 801 will be described below with reference to FIGS. 6 to 18 . 6, 8, 10, 12, 14 and 16 are schematic partial top views of the first to sixth steps respectively. In addition, in Figures 7, 9, 11, 13, 15 and 17, lines VII-VII (Fig. 6), lines IX-IX (Fig. 8) and lines XI-XI (Fig. 10) are respectively connected. Schematic partial cross-sectional views of lines XIII-XIII (Fig. 12), lines XV-XV (Fig. 14) and lines XVII-XVII (Fig. 16). In addition, FIG. 18 is a schematic partial cross-sectional view of the seventh step.

Referring to FIGS. 6 and 7 , a ceramic green portion 100G is formed by laminating a plurality of green sheets. The ceramic green part 100G includes the part which becomes the ceramic part 100 (FIG. 4) by the baking process mentioned later. Although illustration is omitted, the ceramic green portion 100G may be provided with portions that serve as internal wiring (not shown) of the ceramic portion 100 .

Referring to FIGS. 8 and 9 , a through hole HL extending in the thickness direction is formed in the ceramic green portion 100G. The through hole HL spans an imaginary line LV that forms at least a part of the outer edge EO of the ceramic portion 100 . The through hole HL includes a portion that becomes the concave portion CC (Fig. 3). The through hole HL is formed by machining using a mold. In addition, as a modified example, the through hole HL may be formed by processing using laser light.

Referring to Figures 10 and 11, metallization including a sealing metallized green layer 210G, a bottom metallized green layer 220G and a side metallized green layer 230G is formed on the ceramic green part 100G by printing metal paste. Green part 200G. The metallized green portion 200G includes a portion that becomes the metallized portion 200 through the sintering step described below. Specifically, the sealing metallized green layer 210G, the bottom metallized green layer 220G and the side metallized green layer 230G each include the sealing metallized layer 210, the bottom metallized layer 220 and the side surface formed by the calcination step described below. portion of metallization layer 230 . As a result, a green laminate 500G is formed, which has a ceramic green portion 100G including a portion that becomes the ceramic portion 100 and a metallized green portion 200G that includes a portion that becomes the metallized portion 200 .

The ceramic green portion 100G and the side metallized green layer 230G of the metallized green portion 200G each cross an imaginary line LV that forms at least part of the outer edge EO of the ceramic portion 100 ( FIG. 10 ). Specifically, the ceramic green portion 100G crosses the imaginary line LV outside the through hole HL. In addition, the side metallized green layer 230G of the metallized green portion 200G spans the imaginary line LV in the through hole HL.

Referring to FIGS. 12 and 13 , a trench TR is formed in the green laminate 500G along the imaginary line LV ( FIG. 10 ). The step of forming the trench TR is performed by pressing the blade against the green laminate 500G along the imaginary line LV. Furthermore, as a modified example, the step of forming the trench TR may be performed by irradiating the green laminate 500G with laser light along the imaginary line LV.

Next, the green laminate 500G (Fig. 12 and Fig. 13) is fired. Referring to FIGS. 14 and 15 , by this calcining, a calcined body 500 including the ceramic part 100 and the metallized part 200 is formed. Referring to FIGS. 16 and 17 , the metallized portion 200 of the calcined body 500 is electroplated. Thereby, the plating layer 300 is formed.

Referring to FIG. 18 , after the above electroplating process, cracks are generated in the calcined body 500 starting from the trench TR. Thereby, while dividing the ceramic part 100, the surface (fracture surface SF) of the middle part 233 of the side metallization layer 230 of the metallization part 200 is formed. Through the above method, a plurality of packages 801 are obtained.

FIG. 19 is a schematic partial cross-sectional view of the structure of electronic device 990 in the comparative example. In this comparative example, unlike the electronic device 900 ( FIG. 2 ) in the embodiment, a plating layer 390 is provided on the entire side surface of the side metallization layer 230 . As a result, when the cover 920 is installed using the solder 930, as shown by the arrows in the figure, the solder 930 tends to flow out unnecessarily in large amounts from the top surface to the side surfaces. Furthermore, adding a member for stopping the flow of the solder 930 as shown by the arrow in the figure will complicate the structure and manufacturing method.

Although illustration is omitted, as another comparative example, in a plan view similar to that shown in FIG. 3 , a penetration can be formed in the frame of the ceramic part 100 that is far away from either the outer edge EO or the cavity CV. hole, and a conductive member for electrically connecting the top surface P1 and the bottom surface P2 is formed in the through hole. In this case, the size of the through hole must be very small compared to the width of the frame. Therefore, when the width of the frame portion is small, it is difficult to form the through hole. For example, in the case of machining using a mold having micro pins, the micro pins corresponding to the micro through holes are easily bent. When laser light is used to replace molds, productivity drops significantly. Furthermore, even if fine through holes can be formed, filling them with conductive members is difficult.

According to the package 801 of this embodiment, first, the metallized part 200 ( FIG. 4 ) includes: a sealing metallized layer 210 provided on the sealing surface SS; and a bottom surface metallized layer 220 provided on the bottom surface P2 of the ceramic part 100 ; And the side metallization layer 230 is provided on the side P3 of the ceramic part 100. Thereby, the electrical connection between the top surface P1 disposed with the sealing metallization layer 210 and the bottom surface P2 disposed with the bottom surface metallization layer 220 can be ensured. Second, although the electroplating layer 300 composed of a metal material with high wettability to the solder 930 (FIG. 2) in the molten state covers the sealing metallization layer 210 of the metallization portion 200, it does not cover the metal. The middle portion 233 of the side metallization layer 230 of the metallization portion 200 . Thereby, unlike the comparative example (FIG. 19), the solder 930 can be prevented from flowing out unnecessarily in large amounts from the top surface to the side surfaces. According to the above, the electrical connection between the top surface P1 and the bottom surface P2 can be ensured, and the solder 930 can be prevented from flowing out unnecessarily in large amounts from the top surface to the side.

An upper plating layer 310 (Fig. 4) covers the upper portion 231 of the side metallization layer 230. Therefore, the range in which the solder 930 ( FIG. 2 ) easily flows out from the edge of the sealing metallization layer 210 is limited to the upper portion 231 of the side metallization layer 230 . Therefore, by making the size of the upper portion 231 of the side metallization layer 230 very small, the amount of solder 930 flowing out can be suppressed. Furthermore, by slightly extending the solder 930 from the edge of the sealing metallization layer 210 , the solder 930 is more firmly bonded to the plating layer 300 . In addition, the surface of the middle portion 233 of the side metallization layer 230 is formed by the breaking step (FIG. 18) after the calcining step, and the trench TR (FIG. 12) defining the position of the dividing step is formed before the calcining step. In the case of formation, the formation of the electroplated layer 300 is most efficiently performed by the electroplating step (FIG. 17) after the calcining step and before the breaking step. In this case, the portion of the plating layer 300 formed in the trench TR corresponds to the portion covering the upper portion 231 of the side metallization layer 230 . Therefore, by allowing the electroplating layer 300 to cover the upper portion 231 of the side metallization layer 230, the electroplating layer 300 in this embodiment can be formed efficiently.

The upper electroplating layer 310 has an end portion (the right end portion in FIG. 4 ) with a gradually decreasing thickness. Thereby, peeling of the plating layer 300 in the end portion can be suppressed. In addition, when the plating layer 300 is made of expensive Au, the raw material cost can be reduced. In addition, the surface of the middle portion 233 of the side metallization layer 230 is formed by the breaking step (FIG. 18) after the calcining step, and the trench TR (FIG. 12) defining the position of the dividing step is formed before the calcining step. In the case of formation, the formation of the electroplated layer 300 is most efficiently performed by the electroplating step (FIG. 17) after the calcining step and before the breaking step. In this case, the end portion of the plating layer 300 included in the completed package 801 is located at the bottom of the trench TR at the time of the plating step. Since electroplating is gradually difficult to perform at the bottom of the trench TR, the electroplated layer 300 has an end portion whose thickness gradually becomes smaller. Therefore, by allowing the electroplated layer 300 to have an end portion with a gradually smaller thickness, the electroplated layer 300 in this embodiment can be formed efficiently.

Regarding the outer edge EO of the ceramic part 100 ( FIG. 3 ), the side metallization layer 230 is away from the first corner N1 and the second corner N2 and is connected to one side of the outer edge EO. This structure can suppress the occurrence of peeling of the side metallization layer 230 at the corners of the outer edge EO, where peeling is likely to occur. In particular, compared with the case where the side metallization layer 230 is located at the corner of the outer edge EO, damage to the side metallization layer 230 caused by the cutting step ( FIG. 18 ) for forming the outer edge EO of the ceramic part 100 can be suppressed. damage. However, when this effect is not particularly necessary, that is, when the adhesion strength between the side metallization layer 230 and the ceramic part 100 is very high, the arrangement of the side metallization layer 230 is not limited to this, and the side metallization layer 230 may also be used. Configurable in corners.

The surface of the middle portion 233 of the side metallization layer 230 is the fracture plane SF (Fig. 18). Thereby, the surface can be formed by a breaking step.

The side metallization layer 230 is arranged in the concave portion CC of the outer edge EO (FIG. 3). Thereby, the side metallization layer 230 can be prevented from protruding from the outer edge EO of the ceramic part 100 .

Within the height range of the middle portion 233 ( FIG. 4 ) where the side metallization layer 230 is disposed, the recess CC ( FIG. 3 ) is completely filled by the side metallization layer 230 . Thereby, it is not necessary to form components other than the side metallization layer 230 as a component that completely fills the concave portion CC. In addition, by completely filling the recessed portion CC, it is possible to prevent the area where the cover 920 is joined from becoming smaller due to the recessed portion CC and thereby causing sealing failure. Furthermore, since the rigidity is increased, it is also possible to prevent the frame portion surrounding the cavity CV starting from the concave portion CC from being damaged. This is effective when the width dimension of the frame portion surrounding the cavity CV of the ceramic portion 100 is only 100 μm or less even at a distance away from the concave portion CC. In addition, especially in ultra-small packages that have an outer edge EO that is as small as being included in a square area of 1 mm on each side, the width of the frame is often required to be 100 μm or less in terms of design. Typically, when the electronic component 910 (FIG. 1) is an ultra-small crystal blank (with electrodes), such an ultra-small package is required.

According to the manufacturing method of the package 801 of this embodiment, the package 801 can be manufactured in a simple manner. Specifically, the fracture surface SF ( FIG. 18 ) formed in the breaking step serves as a surface that inhibits further flow of the solder 930 . Therefore, it is not necessary to form a special member for suppressing the flow of the solder 930 . In addition, the through-hole HL (Fig. 8 and Fig. 9) is divided into recessed portions CC (Fig. 3) for castellated electrodes. Therefore, compared with the case where, unlike the present embodiment, a through-hole distant from either the outer edge EO or the cavity CV is formed in the frame portion of the ceramic portion 100 for use as a through-hole electrode, the through-hole HL The diameter can be set larger. Therefore, the diameter of the pin of the mold used to form the through hole HL can also be set to be large. Therefore, the through-hole HL can be easily formed by machining using a mold. This can improve productivity compared to the case of using laser processing.

According to the manufacturing method of the electronic device 900 of this embodiment, first, the package 801 is manufactured in the above manner. Next, the electronic component 910 is bonded to the electrode pad 400 of the package 801 . Next, the cover 920 is mounted to the package 801 by brazing using solder 930 . Thereby, the electronic device 900 can be obtained. Brazing can be performed by a known method. In this case, Au alloy, especially Au-Sn alloy, is typically used as the solder 930 . However, the brazing method is not limited to this. For example, the brazing method may also be performed as follows. First, a solder layer composed of Ag—Cu alloy is formed on one surface of the cover 920 . Next, the cover 920 provided with the solder layer is placed on the sealing metallization layer 210 in such a manner that the solder layer contacts the sealing metallization layer 210 . Secondly, the solder is melted by applying electricity and heating. In this way, electronic device 900 is obtained.

Furthermore, as described above, the electronic device 900 (FIG. 2) is mounted on the external substrate (not shown) using the electrode pads (not shown) provided on the bottom surface P2. In this installation, the electrode pads are bonded to the external substrate using solder. In this solder bonding, if the solder flows out unnecessarily from the bottom surface to the side surface, the bonding between the electrode pad and the external substrate is likely to deteriorate. According to this embodiment, although the electroplating layer 300 composed of a metal material with high wettability to solder in a molten state covers the bottom metallization layer 220 of the metallization part 200, it does not cover the metallization part 200. The middle portion 233 of the side metallization layer 230. This prevents molten solder from flowing out unnecessarily from the bottom surface to the side surfaces.

<Embodiment 2> FIG. 20 is a schematic plan view of the structure of the package 802 in the second embodiment. Fig. 21 is a schematic partial cross-sectional view along line XXI-XXI of Fig. 20. In this embodiment, within the height range of the middle portion 233 where the side metallization layer 230 is disposed, the concave portion CC is completely filled with the side metallization layer 230 and the filling portion 150 . The filling portion 150 faces the ceramic portion 100 via the side metallization layer 230 and is made of ceramic. The main component of the material of the filling part 150 is preferably the same as the main component of the material of the ceramic part 100 . For example, the filling part 150 and the ceramic part 100 may both be made of aluminum oxide, or the filling part 150 and the ceramic part 100 may both be made of aluminum nitride. The surface of the filling portion 150 is not the calcined surface but the fracture surface SG. In addition, the cross-section shown in Fig. 21 is along the line XXI-XXI (Fig. 20), and the partial cross-section (not shown) along the line AA (Fig. 20) is the same as that in Fig. 4 (Embodiment 1) Much the same.

Next, a method of collectively manufacturing the plurality of packages 802 will be described below. In addition, since the first and second steps (Figs. 6 to 9) in the above-mentioned Embodiment 1 are also performed in common in this embodiment, their description is omitted. Figures 22, 24, 26, 28, 30 and 32 are respectively schematic partial top views of the third to eighth steps. In addition, Figure 23, Figure 25, Figure 27, Figure 29, Figure 31 and Figure 33 are respectively along the line XXIII-XXIII (Figure 22), the line XXV-XXV (Figure 24), and the line XXVII-XXVII (Figure 26) , schematic partial cross-sectional views of line XXIX-XXIX (Fig. 28), line XXXI-XXXI (Fig. 30) and line XXXIII-XXXIII (Fig. 32). In addition, FIG. 34 is a schematic partial cross-sectional view of the ninth step.

Referring to FIGS. 22 and 23 , a side metallized green layer 230G is formed on the inner surface of the through hole HL of the ceramic green part 100G by printing the metal paste so that the through hole HL is only partially filled. Next, referring to FIGS. 24 and 25 , by printing the ceramic paste, the filled green part 150G is filled into the through hole HL through the side metallized green layer 230G so that the through hole HL is completely filled. Referring to FIGS. 26 and 27 , a sealing metallized green layer 210G and a bottom metallized green layer 220G are formed on the ceramic green part 100G by printing metal paste. As described above, through the steps of FIGS. 22 to 27 , the metallized green portion 200G including the portion that becomes the metallized portion 200 is formed on the ceramic green portion 100G. As a result, a green laminate 500G is formed, which has a ceramic green portion 100G including a portion that becomes the ceramic portion 100; a metallized green portion 200G that includes a portion that becomes the metallized portion 200; and The filled green portion 150G includes a portion that becomes the filled portion 150 .

The ceramic green portion 100G, the side metallized green layer 230G of the metallized green portion 200G, and the filled green portion 150G each cross the imaginary line LV (Fig. 26). Specifically, the ceramic green portion 100G crosses the imaginary line LV outside the through hole HL. In addition, the side metallized green layer 230G and the filled green portion 150G each cross the imaginary line LV in the through hole HL.

Referring to FIGS. 28 and 29 , a trench TR is formed in the green laminate 500G along the imaginary line LV ( FIG. 26 ). The step of forming the trench TR is performed by pressing the blade against the green laminate 500G along the imaginary line LV. When the trench TR is formed using a blade, as shown in FIG. 29 , the sealing metallized green layer 210G easily extends to the side surfaces of the trench TR. This is caused by the sealing metallization green layer 210G being rolled into the blade when forming the trench TR. As a result, the electroplating layer 300 can be easily formed on the surface of the filling portion 150 made of ceramic in the electroplating step (Fig. 32 and Fig. 33) described later.

Next, the green laminated body 500G (Fig. 28 and Fig. 29) is fired. Referring to FIGS. 30 and 31 , using this calcination, a calcined body 500 including the ceramic part 100 and the metallized part 200 is formed.

Referring to FIGS. 32 and 33 , the metallized portion 200 of the calcined body 500 is electroplated. Thereby, the plating layer 300 is formed.

Referring to FIG. 34 , after the above electroplating, cracks are generated in the calcined body 500 starting from the trench TR. Thereby, while dividing (breaking) the ceramic part 100 and the filling part 150, the surface of the middle part 233 of the side metallization layer 230 of the metallization part 200 is formed (fracture surface SF in FIG. 20). Through the above method, multiple packages 802 are obtained.

In addition, except for the above description, since it is substantially the same as the above-described Embodiment 1, the same or corresponding requirements are given the same reference numerals, and the description thereof will not be repeated.

According to the package 802 of this embodiment, within the height range of the middle portion 233 (Fig. 21) where the side metallization layer 230 is arranged, the concave portion CC (Fig. 20) is formed by the side metallization layer 230 and the side metallization layer. 230 and the filling part 150 made of ceramic facing the ceramic part 100 is completely filled. Thereby, the side metallization layer 230 can be protected by the filling portion 150 . In addition, since the filling portion 150 made of ceramic is formed in the through-hole HL including the portion that becomes the recessed portion CC (Fig. 33), the ratio of the material constituting the frame portion to ceramic becomes higher and the homogeneity is improved, so that it can be made In the breaking step (Fig. 34), cracks in the concave portion CC are more stably generated.

According to the manufacturing method of the package 802 of this embodiment, a cutting edge is used to form the trench TR (Fig. 29). Thereby, as described above, the sealing metallization green layer 210G easily extends to the side of the trench TR. The sealing metallization green layer 210G extends to the sides of the trench TR, resulting in the sealing metallization layer 210 of the package 802 also extending to the sides of the trench TR. Thereby, as in the case of FIG. 4 (Embodiment 1), an upper plating layer 310 having an end portion with a gradually smaller thickness can be obtained on the side surface of the trench TR (FIG. 21).

<Modification of Embodiment 2> FIG. 35 is a schematic partial cross-sectional view of a modified example of the procedure of FIG. 29 . In the step of FIG. 29 , the trench TR is formed using a blade, but in this modification, the trench TR is formed by laser processing (that is, irradiation of laser light). In this case, unlike the case of FIG. 29 , the sealing metallization green layer 210G cannot easily extend to the side surfaces of the trench TR. According to this modification, by using laser light instead of the blade, fine trenches TR can be formed.

＜Embodiment 3＞ Fig. 36 is a schematic partial cross-sectional view of the structure of the package 801M in the third embodiment. In this embodiment, a surface oxide film 233X composed of an oxide of metallization material is provided on the middle portion 233 of the side metallization layer 230 . The surface oxide film 233X may be a natural oxide film of the middle portion 233 . In addition, since the other configurations are substantially the same as those of the above-mentioned Embodiment 1 (FIG. 4), the same or corresponding elements are given the same reference numerals, and description thereof will not be repeated.

According to this embodiment, substantially the same effect as that of Embodiment 1 can be obtained. Furthermore, according to this embodiment, the wettability of the middle portion 233 to the solder 930 can be further reduced by the surface oxide film 233X. In particular, when the surface oxide film 233X is a natural oxide film of the middle portion 233, the surface oxide film 233X can be easily formed.

<Embodiment 4> FIG. 37 is a schematic plan view of the structure of the package 802M in the fourth embodiment. In this embodiment, a surface oxide film 233X composed of an oxide of metallization material is provided on the middle portion 233 of the side metallization layer 230 . The surface oxide film 233X may be a natural oxide film of the middle portion 233 . In addition, since the other configurations are substantially the same as those of the above-mentioned Embodiment 2, the same or corresponding elements are given the same reference numerals, and description thereof will not be repeated.

According to this embodiment, substantially the same effect as that of Embodiment 2 can be obtained. Furthermore, according to this embodiment, the same effects as those unique to the above-mentioned Embodiment 3 can be obtained.

＜Embodiment 5＞ FIG. 38 is a schematic partial cross-sectional view of the structure of the electronic device 900M in Embodiment 5 in the field of view corresponding to FIG. 2 (Electronic device 900: Embodiment 1). The electronic device 900M further has a metal frame 940 in addition to the components included in the electronic device 900 . The shape of the metal frame 940 is substantially the same as the shape of the sealing metallization layer 210 when viewed from above. Therefore, the metal frame 940 surrounds the cavity CV when viewed from above.

The metal frame 940 is preferably made of a metal with a thermal expansion coefficient similar to that of ceramics. Specifically, it is preferably made of an alloy containing Fe (iron) and Ni (nickel) as main components, such as Fe-Ni-Co (cobalt). System alloy or Fe-Ni series alloy.

Next, the manufacturing method of the electronic device 900M will be described. First, the package 801 described in the first embodiment is prepared. Next, solder 930 is used to install the metal frame 940 on the sealing metallization layer 210 of the package 801 . In other words, the metal frame 940 is brazed to the sealing metallization layer 210 . The brazing method may be the same as the method of brazing the cover 920 to the sealing metallized layer 210 in the first embodiment or its modification. In particular, in this embodiment, the material of the solder 930 is preferably Ag-Cu alloy. Next, the cover 920 is installed on the metal frame 940 . This installation should be carried out by hard welding.

In this embodiment, the cover 920 is installed on the package 801 using solder 930 and a metal frame 940 brazed to the solder 930 . In other words, the package 801 is a package in which the lid 920 is installed using the solder 930 and the metal frame 940 brazed to the solder 930 . Therefore, in this embodiment, the sealing surface SS of the package 801 is used to support the sealing surface of the cover 920 via the metal frame 940 .

Furthermore, as a modified example, the package 801 in the electronic device 900M may be replaced with any package other than the package 801 of the first to fourth embodiments and their modifications.

The above-described embodiments and modifications can be freely combined with each other. The invention has been described in detail, but the above description is an illustration in all respects, and the invention is not limited thereto. Numerous modifications that have not been illustrated are considered conceivable without exceeding the scope of the invention.

100: Ceramics Department 100G: Ceramic green body department 150: Filling part 150G: Filling the green part 200:Metalization Department 200G:Metalization green part 210:Sealing metallization layer 210G: Sealed metallized green layer 220: Bottom metallization layer 220G: Bottom metallized green layer 230: Side metallization layer 230G: Side metallized green layer 231: Upper part 232: Lower part 233:Middle part 233X: Surface oxide film 300: Electroplating layer (metal layer) 310: Upper electroplating layer 320: Lower electroplating layer 390:Electroplating layer 400:Electrode pad 500: Calcined body 500G: green laminate 801,801M,802,802M: package 900,900M,990: Electronic equipment 910:Electronic parts 920: Cover 930:Solder 940:Metal frame CC: Concave CV: cavity EO: outer edge HL: through hole LV: imaginary line N1, N2: 1st and 2nd corners P1: Top surface P2: Bottom P3: Side SF: fracture surface SG: fracture surface SS: sealing surface TR:gulou

[Fig. 1] A schematic plan view of the structure of an electronic device in Embodiment 1. [Fig. 2] A schematic partial cross-sectional view along line II-II in Fig. 1. [Fig. 3] A schematic plan view of the structure of the package in Embodiment 1. [Fig. 4] A schematic partial cross-sectional view along line IV-IV in Fig. 3. [Fig. 5] A schematic partial cross-sectional view along line V-V in Fig. 3. [Fig. 6] A schematic partial plan view of the first step of the package manufacturing method in Embodiment 1. [Fig. [Fig. 7] A schematic partial cross-sectional view along line VII-VII in Fig. 6. [Fig. 8] A schematic partial plan view of the second step of the package manufacturing method in Embodiment 1. [Fig. [Fig. 9] A schematic partial cross-sectional view along line IX-IX in Fig. 8. [Fig. 10] A schematic partial plan view of the third step of the package manufacturing method in Embodiment 1. [Fig. [Fig. 11] A schematic partial cross-sectional view along line XI-XI in Fig. 10. [Fig. 12] A schematic partial plan view of the fourth step of the package manufacturing method in Embodiment 1. [Fig. [Fig. 13] A schematic partial cross-sectional view along line XIII-XIII in Fig. 12. [Fig. 14] A schematic partial plan view of the fifth step of the package manufacturing method in Embodiment 1. [Fig. [Fig. 15] A schematic partial cross-sectional view along line XV-XV in Fig. 14. [Fig. 16] A schematic partial plan view of the sixth step of the package manufacturing method in Embodiment 1. [Fig. [Fig. 17] A schematic partial cross-sectional view along line XVII-XVII in Fig. 16. [Fig. 18] A schematic partial cross-sectional view of the seventh step of the package manufacturing method in Embodiment 1. [Fig. 19] A schematic partial cross-sectional view of the structure of an electronic device in a comparative example. [Fig. 20] A schematic plan view of the structure of the package in Embodiment 2. [Fig. [Fig. 21] A schematic partial cross-sectional view along line XXI-XXI in Fig. 20. [Fig. 22] A schematic partial plan view of the third step of the package manufacturing method in Embodiment 2. [Fig. 23] A schematic partial cross-sectional view along line XXIII-XXIII in Fig. 22. [Fig. 24] A schematic partial plan view of the fourth step of the package manufacturing method in Embodiment 2. [Fig. 25] A schematic partial cross-sectional view along line XXV-XXV in Fig. 24. [Fig. 26] A schematic partial plan view of the fifth step of the package manufacturing method in Embodiment 2. [Fig. [Fig. 27] A schematic partial cross-sectional view along line XXVII-XXVII in Fig. 26. [Fig. 28] A schematic partial plan view of the sixth step of the package manufacturing method in Embodiment 2. [Fig. 29] A schematic partial cross-sectional view along line XXIX-XXIX in Fig. 28. [Fig. 30] A schematic partial plan view of the seventh step of the package manufacturing method in Embodiment 2. [Fig. [Fig. 31] A schematic partial cross-sectional view along line XXXI-XXXI in Fig. 30. [Fig. 32] A schematic partial plan view of the eighth step of the package manufacturing method in Embodiment 2. [Fig. [Fig. 33] A schematic partial cross-sectional view along line XXXIII-XXXIII in Fig. 32. [Fig. 34] A schematic partial cross-sectional view of the ninth step of the package manufacturing method in Embodiment 2. [Fig. 35] A schematic partial cross-sectional view of a modified example of the sixth step (Fig. 29) of the package manufacturing method in Embodiment 2. [Fig. 36] A schematic partial cross-sectional view of the structure of the package in Embodiment 3. [Fig. [Fig. 37] A schematic plan view of the structure of the package in Embodiment 4. [Fig. [Fig. 38] A schematic partial cross-sectional view of the structure of the electronic device in Embodiment 5 in the field of view corresponding to Fig. 2.

900: Electronic equipment

910:Electronic parts

920: Cover

930:Solder

CV: cavity

Claims (10)

A package is a package for electronic components that uses solder to install a cover; The package includes: a ceramic part with an outer edge when viewed from above; The Ceramics Division has: The top surface includes a sealing surface for supporting the cover, and a cavity for storing the electronic components is provided inside the sealing surface; The bottom surface is opposite to the top surface; and The side surface is arranged on the outer edge when viewed from above, and connects the top surface and the bottom surface to each other; The package further includes: a metallization part, which is provided on the ceramic part and is composed of metallization material; The metallization department contains: A sealing metallization layer is provided on the sealing surface; A bottom metallization layer is provided on the bottom surface of the ceramic part; A side metallization layer is provided on the side of the ceramic part and has an upper portion connected to the sealing metallization layer, a lower portion connected to the bottom metallization layer, and the upper portion and the lower portion are connected to each other. the middle part; The package further includes: a metal layer composed of a metal material with higher wettability to the solder than the metallized material; The metal layer covers the sealing metallization layer of the metallization portion but does not cover the middle portion of the side metallization layer of the metallization portion; The metal layer covers the upper portion of the side metallization layer. Such as the encapsulation body of request item 1, where, The metal layer has ends with tapering thickness. Such as the encapsulation body of request item 1, where, In the plan view, the outer edge of the ceramic part has a first corner, a second corner, and a side connecting the first corner and the second corner to each other, and the side metallization layer is connected to the first corner away from the second corner and connected to the side. Such as the encapsulation body of request item 1, where, A surface oxide film composed of an oxide of the metallization material is provided on the middle portion of the side metallization layer. Such as the encapsulation body of request item 1, where, The surface of the middle portion of the side metallization layer is a fracture surface. Such as the encapsulation body of request item 1, where, The outer edge includes a recess disposed with the side metallization layer. Such as the encapsulation body of request item 6, where, Within the height range of the middle portion where the side metallization layer is disposed, the recess is completely filled by the side metallization layer. Such as the encapsulation body of request item 6, where, Within the height range of the middle portion where the side metallization layer is arranged, the recessed portion is completed by the side metallization layer and a filling portion made of ceramic that faces the ceramic portion across the side metallization layer. landfill. Such as the encapsulation body of request item 1, where, The packaging system uses the solder and a metal frame hard-welded to the solder to install the package body of the cover, The sealing surface is used to support the cover through the metal frame. A method of manufacturing a package, The manufacturing method of the package according to any one of claims 1 to 9 includes the following steps: (a) Forming a green laminate having a ceramic green portion including a portion that becomes the ceramic portion, and a metallized green portion including a portion that becomes the metallized portion, wherein the The ceramic green portion and the metallized green portion each span an imaginary line that becomes at least a portion of the outer edge of the ceramic portion; (b) Form grooves in the green laminate along the imaginary line; (c) By calcining the green laminate, a calcined body including the ceramic part and the metallized part is formed; (d) In order to form the metal layer, the metallized portion of the calcined body is electroplated; and (e) After the step of electroplating the metallized part, cracks are made in the calcined body starting from the trench, thereby breaking the ceramic part and forming the side metallized layer of the metallized part. The surface of this middle part.

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