CN114696777A - Package and method for manufacturing the same - Google Patents

Abstract

The invention provides a package and a method for manufacturing the same, which can ensure electrical connection between an upper surface and a lower surface and prevent solder from flowing out to a side surface in a large amount unnecessarily. The metallization (200) comprises a sealing metallization layer (210) on the Sealing Surface (SS), a lower surface metallization layer (220) on the lower surface (P2) of the ceramic part (100), and a side surface metallization layer (230) on the side surface (P3) of the ceramic part (100). The side metallization layer (230) has an upper portion (231) connected to the seal metallization layer (210), a lower portion (232) connected to the lower surface metallization layer (220), and an intermediate portion (233) connecting the upper portion (231) and the lower portion (232) to each other. The metal layer (300) is made of a metal material having higher wettability with respect to the brazing material (930) than the metallized material. The metal layer (300) covers the sealing metallization layer (210) of the metallization (200), and the middle section (233) of the side metallization layer (230) of the metallization (200) is uncovered.

Description

Package and method for manufacturing the same

Technical Field

The present invention relates to a package and a method for manufacturing the same, and more particularly to a package for electronic components and a method for manufacturing the same.

Background

Jp 2000 a-312060 a (patent document 1) discloses an electronic component mounting substrate for mounting an electronic component such as a crystal oscillator. The electronic component mounting board has a lower insulating layer and an upper insulating layer. The lower insulating layer has a mounting portion for mounting an electronic component on the upper surface, and a plurality of metallized conductor layers for connecting electrodes of the electronic component to the outside are formed so as to cover the mounting portion from the mounting portion to the lower surface. The upper insulating layer is frame-shaped, is laminated on the lower insulating layer so as to surround the mounting portion, and has a sealing metallized layer formed on the upper surface thereof for bonding to the lid body. A notch portion penetrating the upper insulating layer vertically is formed on the outer peripheral surface of the upper insulating layer. A metalized conductor post electrically connecting the metalized conductor layer and the sealing metalized layer is embedded in the notch portion so that the upper end surface of the metalized conductor post is flush with the upper surface of the upper insulating layer.

According to the above configuration, the sealing metallization layer is electrically connected to the metallization conductor layer via the metallization conductor pillar. Therefore, by connecting the metalized conductor layer to the ground potential, the sealing metalized layer can also be connected to the ground potential.

Further, the above publication discloses a technique of: the exposed surfaces of the metallized conductor layer, the metallized layer for sealing, and the metallized conductor post are coated with a metal having excellent wettability with the solder, for example, gold (Au) by plating. By this plating, oxidation corrosion can be prevented. Further, the plating can firmly bond the sealing metallized layer and the metal lid body via the brazing material. The solder is made of, for example, gold-tin (Au — Sn) alloy.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2000-312060

Disclosure of Invention

(problems to be solved by the invention)

According to the technique described in the above publication, a metal layer having excellent wettability with the solder is provided so as to cover the exposed surfaces of the metallized conductor layer, the metallized layer for sealing, and the metallized conductor post. As a result, as described above, the bonding between the sealing metallized layer and the metal lid body via the brazing material can be made strong. On the other hand, since the solder is covered with the metal layer having excellent wettability with the solder, the solder easily flows from the upper surface of the sealing metallized layer to the side surface of the metallized conductor post in an unnecessarily large amount. In particular, the brazing filler metal often has a high content of expensive materials such as gold, and in this case, the brazing filler metal unnecessarily flows out in a large amount, which leads to a significant increase in material cost.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a package and a method of manufacturing the same, which can ensure electrical connection between an upper surface and a lower surface and prevent a solder from flowing out in an unnecessarily large amount from the upper surface to a side surface.

(means for solving the problems)

One embodiment of the package is a package for electronic components, and a lid is attached using a brazing material. The package body is provided with a ceramic part, a metalized part and a metal layer. The ceramic portion has an outer edge in a plan view. The ceramic part has: the upper surface, a lower surface opposite to the upper surface, and a side surface disposed at an outer edge in a plan view and connecting the upper surface and the lower surface to each other. The upper surface includes a sealing surface for supporting the lid, and a cavity for receiving an electronic component is provided inside the sealing surface. The metalized portion is disposed on the ceramic portion and is made of a metalized material. The metallization includes: a seal metallization layer disposed on the sealing face; a lower surface metallization layer disposed on a lower surface of the ceramic portion; and a side surface metallization layer provided on a side surface of the ceramic portion. The side metallization layer has: an upper portion connected to the seal metallization layer, a lower portion connected to the lower surface metallization layer, and an intermediate portion connecting the upper and lower portions to each other. The metal layer is made of a metal material having higher wettability with respect to the brazing material than the metallized material. The metal layer covers the sealing metallization layer of the metallization, the middle portion of the side metallization layer of the metallization being uncovered.

The metal material constituting the metal layer may be any of a pure metal and an alloy. The metal layer may cover an upper portion of the side metallization layer. The metal layer may have an end portion with a gradually decreasing thickness. The outer edge of the ceramic portion has a first corner, a second corner, and one side connecting the first corner and the second corner to each other in a plan view, and the side metallization layer may be separated from the first corner and the second corner to meet the one side. A surface oxide film made of an oxide of the metallization material may be provided in the middle portion of the side metallization layer. The surface of the middle portion of the side metallization layer is a fracture surface. The outer edge may have a recess configured with a side metallization layer. The recess may be filled with the side metallization layer over a height of the intermediate portion in which the side metallization layer is arranged. The recess may be filled with the side surface metallization layer and a filling portion facing the ceramic portion through the side surface metallization layer and made of ceramic within a height range of an intermediate portion where the side surface metallization layer is arranged.

The method for manufacturing a package according to the above aspect includes: (a) a step of forming a green laminate having a ceramic green part and a metalized green part, the ceramic green part including a portion to be a ceramic part, the metalized green part including a portion to be a metalized part, the ceramic green part and the metalized green part each crossing an imaginary line to be at least a part of an outer edge of the ceramic part, the method for manufacturing a package further comprising: (b) forming a groove in the green laminate along the virtual line; (c) forming a fired body including a ceramic portion and a metallized portion by firing the green laminated body; (d) a step of plating the fired metallized portion to form a metal layer; and (e) forming a surface of an intermediate portion of the side surface metallization layer of the metallization portion while breaking the ceramic portion by generating a crack in the fired body from the groove as a starting point after the step of plating the metallization portion.

(effect of the invention)

In the package according to the above aspect, the metallization includes: a seal metallization layer disposed on the sealing face; a lower surface metallization layer disposed on a lower surface of the ceramic portion; and a side surface metallization layer provided on a side surface of the ceramic portion. This ensures electrical connection between the upper surface on which the seal metallization layer is disposed and the lower surface on which the lower surface metallization layer is disposed. Second, the sealing metallization layer of the metallization is covered with a metal layer made of a metal material having high wettability with respect to the molten solder, but the middle portion of the side metallization layer of the metallization is not covered. This prevents the brazing material from flowing out in an unnecessarily large amount from the upper surface to the side surface. As described above, the solder can be prevented from flowing out from the upper surface to the side surface in an unnecessarily large amount while ensuring electrical connection between the upper surface and the lower surface.

The objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description and the accompanying drawings.

Drawings

Fig. 1 is a plan view schematically showing the structure of an electronic device in embodiment 1.

Fig. 2 is a diagrammatic partial sectional view along the line II-II in fig. 1.

Fig. 3 is a plan view schematically showing the structure of the package according to embodiment 1.

Fig. 4 is a diagrammatic partial sectional view along the line IV-IV of fig. 3.

Fig. 5 is a schematic partial sectional view along line V-V of fig. 3.

Fig. 6 is a partial plan view schematically showing a first step of the method for manufacturing a package according to embodiment 1.

Fig. 7 is a schematic partial sectional view along the line VII-VII of fig. 6.

Fig. 8 is a partial plan view schematically showing a second step of the method for manufacturing a package according to embodiment 1.

Fig. 9 is a diagrammatic partial sectional view along the line IX-IX of fig. 8.

Fig. 10 is a partial plan view schematically showing a third step of the method for manufacturing a package according to embodiment 1.

Fig. 11 is a diagrammatic partial sectional view along line XI-XI of fig. 10.

Fig. 12 is a partial plan view schematically showing a fourth step of the method for manufacturing a package according to embodiment 1.

Fig. 13 is a diagrammatic, partial cross-sectional view along line XIII-XIII of fig. 12.

Fig. 14 is a partial plan view schematically showing a fifth step of the method for manufacturing a package according to embodiment 1.

Fig. 15 is a schematic partial sectional view taken along line XV-XV of fig. 14.

Fig. 16 is a partial plan view schematically illustrating a sixth step of the method for manufacturing a package according to embodiment 1.

Fig. 17 is a schematic partial sectional view taken along line XVII-XVII of fig. 16.

Fig. 18 is a partial cross-sectional view schematically showing a seventh step of the method for manufacturing a package according to embodiment 1.

Fig. 19 is a partial sectional view schematically showing the structure of an electronic device in a comparative example.

Fig. 20 is a plan view schematically showing the structure of a package according to embodiment 2.

Fig. 21 is a diagrammatic, partial cross-sectional view taken along line XXI-XXI of fig. 20.

Fig. 22 is a partial plan view schematically showing a third step of the method for manufacturing a package according to embodiment 2.

Fig. 23 is a diagrammatic, partial cross-sectional view taken along line XXIII-XXIII of fig. 22.

Fig. 24 is a partial plan view schematically showing a fourth step of the method for manufacturing a package according to embodiment 2.

Fig. 25 is a schematic partial sectional view along line XXV-XXV of fig. 24.

Fig. 26 is a partial plan view schematically showing a fifth step of the method for manufacturing a package according to embodiment 2.

Fig. 27 is a diagrammatic, partial cross-sectional view along line XXVII-XXVII of fig. 26.

Fig. 28 is a partial plan view schematically showing a sixth step of the method for manufacturing a package according to embodiment 2.

Fig. 29 is a diagrammatic, partial cross-sectional view along line XXIX-XXIX of fig. 28.

Fig. 30 is a partial plan view schematically showing a seventh step of the method for manufacturing a package according to embodiment 2.

Fig. 31 is a schematic partial cross-sectional view along line XXXI-XXXI of fig. 30.

Fig. 32 is a partial plan view schematically illustrating an eighth step of the method for manufacturing a package according to embodiment 2.

Fig. 33 is a schematic partial cross-sectional view taken along line XXXIII-XXXIII of fig. 32.

Fig. 34 is a partial cross-sectional view schematically showing a ninth step of the method of manufacturing a package according to embodiment 2.

Fig. 35 is a partial cross-sectional view schematically showing a modification of the sixth step (fig. 29) of the method for manufacturing a package according to embodiment 2.

Fig. 36 is a partial sectional view schematically showing the structure of a package according to embodiment 3.

Fig. 37 is a plan view schematically showing the structure of a package according to embodiment 4.

Fig. 38 is a partial sectional view schematically showing the configuration of the electronic device according to embodiment 5 in a field of view corresponding to fig. 2.

Detailed Description

Hereinafter, embodiments will be described with reference to the drawings.

< embodiment 1 >

Fig. 1 is a plan view schematically showing the configuration of an electronic apparatus 900 in embodiment 1. Fig. 2 is a diagrammatic partial sectional view along the line II-II in fig. 1. Electronic device 900 includes package 801, electronic component 910, solder 930, and cover 920.

Fig. 3 is a plan view schematically showing the structure of the package 801. Fig. 4 and 5 are schematic partial sectional views taken along the line IV-IV and the line V-V of fig. 3, respectively. The package 801 is a package for the electronic component 910, and in the present embodiment, includes the electrode pad 400 bonded to the electronic component 910. As shown in fig. 1 and 2, lid 920 is attached to package 801 using solder 930. The lid 920 is preferably made of a metal having a thermal expansion coefficient similar to that of ceramics, specifically, an alloy containing Fe (iron) and Ni (nickel) as main components, for example, an Fe — Ni — Co (cobalt) alloy or an Fe — Ni alloy. The solder 930 is preferably made of Au as a main component, more preferably Au alloy, typically Au — Sn alloy. The material of the solder 930 is not limited to these, and may be, for example, Ag (silver) -Cu (copper) alloy, Pb (lead) -Sn solder, or Pb-free solder. The cover may be shaped as a flat plate.

The package 801 includes a ceramic part 100, a metallized part 200 provided on the ceramic part 100, and a plating layer 300 (metal layer). The metallization 200 comprises a sealing metallization layer 210, a lower surface metallization layer 220, and a side metallization layer 230. The plating layer 300 has an upper plating layer 310 and a lower plating layer 320. The upper plating layer 310 and the lower plating layer 320 are separated from each other.

The ceramic portion 100 is made of ceramic, for example, alumina or aluminum nitride. In the case of ceramics made of alumina, 10 to 20 wt% of zirconia may be added to improve mechanical strength. As shown in fig. 3, the ceramic portion 100 has an outer edge EO in a plan view. Further, as shown in fig. 4, the ceramic part 100 has an upper surface P1, a lower surface P2 opposite to the upper surface P1, and a side surface P3 connecting the upper surface P1 and the lower surface P2 to each other. The side face P3 is disposed on the outer edge EO (fig. 3) in a plan view. The outer edge EO has a recess CC. In the present embodiment, the concave portion CC has a substantially semicircular shape. The upper surface P1 includes a sealing surface SS for supporting the lid 920 (fig. 2) via the metallization 200 and the upper plating layer 310. Further, on the upper surface P1, a cavity CV for housing the electronic component 910 is provided inside the sealing surface SS. The ceramic part 100 has a frame surrounding the chamber CV in a plan view (fig. 3). Further, the ceramic part 100 is provided with internal wiring (not shown) for connecting the inside and the outside of the chamber CV. The internal wiring connects, for example, the electrode pad 400 provided in the chamber CV and the electrode pad (not shown) provided on the lower surface P2.

The metallization 200 is made of a metallization material. The main component of the metallization material is preferably a high melting point metal, for example, W (tungsten), Mo (molybdenum), or a mixture thereof. Alternatively, the main component of the metallized material may be an alloy composed of W and Mo. The seal metallization layer 210 is disposed on the sealing surface SS. The lower surface metallization layer 220 is disposed on the lower surface P2 of the ceramic portion 100. The side metallization layer 230 is disposed on the side P3 of the ceramic portion 100. Specifically, the side surface metallization layer 230 is disposed in the recess CC of the outer edge EO. In the present embodiment, the recess CC is filled with the side surface metallization layer 230 (fig. 4) within the height range of the middle portion 233 where the side surface metallization layer 230 is disposed. Here, the direction referred to by the above "height range" is the thickness direction (longitudinal direction in fig. 4) of the package body 801. The side metallization layer 230 has an upper portion 231 connected to the seal metallization layer 210, a lower portion 232 connected to the lower surface metallization layer 220, and a middle portion 233 connecting the upper portion 231 and the lower portion 232 to each other. The surface of the intermediate portion 233 of the side metallization layer 230 is not an as-fired surface but a fracture surface SF formed by a fracture step (described later) (fig. 18).

The outer edge EO of the ceramic portion 100 has a rectangular shape having 4 sides and 4 corners in a plan view (fig. 3). In addition, a square is one of rectangles. Specifically, the outer edge EO has: a first corner N1 (upper right corner in the figure), a second corner N2 (lower right corner in the figure), and an edge (right side in the figure) connecting the first corner N1 and the second corner N2 to each other. The side metallization layer 230 borders an edge away from the first corner N1 and the second corner N2. Correspondingly, the concave portion CC is separated from the first corner N1 and the second corner N2 and comes into contact with one side. In the present embodiment, the other side surface metallization layer 230 (and the concave portion CC in which the side surface metallization layer is disposed) is in contact with the side opposite to the one side, i.e., the left side in the drawing. The number of side surface metallization layers (and the number of recesses CC) included in one package is arbitrary.

The upper plating layer 310 of the plating layer 300 covers the seal metallization layer 210 of the metallization 200. On the other hand, the plating layer 300 does not cover the middle portion 233 of the side metallization layer 230 of the metallization 200. In this embodiment, the upper plating layer 310 covers the upper portion 231 of the side metallization layer 230. The interface of the upper portion 231 and the upper plating layer 310 may include an inclined surface with respect to the thickness direction (longitudinal direction in fig. 4). The interface may be formed only by the inclined surface. Further, the lower plating layer 320 of the plating layer 300 covers the lower surface metallization layer 220 of the metallization 200. Furthermore, the lower plating layer 320 of the plating layer 300 covers the lower portion 232 of the side metallization layer 230 of the metallization 200.

The upper plating layer 310 of the plating layer 300 has an end portion (right end portion in fig. 4) having a gradually reduced thickness. Likewise, the lower plating layer 320 of the plating layer 300 has an end portion (right end portion in fig. 4) having a gradually reduced thickness.

The plating layer 300 is made of a metal material having higher wettability with respect to the solder 930 in a molten state than the metallization material. In other words, the wettability of the metallic material of the plating layer 300 is higher than the wettability of the metallization material. The metal material of the plating layer 300 preferably contains Au as a main component, and is substantially Au, for example.

In order to make it difficult for the plating layer 300 to peel off, a base layer (not shown) made of a conductive material different from the metal material is preferably formed between the plating layer 300 and the metallized portion 200. The base layer may also be a plating layer. The material of the base layer may contain Ni as a main component, and for example, Ni or a Ni — Co alloy.

Fig. 5 is a partial sectional view of a portion where the recess CC is not provided.

Next, a method of collectively manufacturing a plurality of packages 801 will be described below with reference to fig. 6 to 18. Fig. 6, 8, 10, 12, 14, and 16 are partial plan views schematically showing the first to sixth steps, respectively. Fig. 7, 9, 11, 13, 15, and 17 are schematic partial sectional views taken along line VII-VII (fig. 6), line IX-IX (fig. 8), line XI-XI (fig. 10), line XIII-XIII (fig. 12), line XV-XV (fig. 14), and line XVII-XVII (fig. 16), respectively. Fig. 18 is a partial cross-sectional view schematically showing the seventh step.

Referring to fig. 6 and 7, a plurality of green sheets are stacked to form a ceramic green part 100G. The ceramic green part 100G includes a portion that becomes the ceramic part 100 (fig. 4) through a firing step described later. Although not shown, the ceramic green part 100G may be provided with a portion to be an internal wiring (not shown) of the ceramic part 100.

Referring to fig. 8 and 9, a through hole HL extending in the thickness direction is formed in the ceramic green part 100G. The through hole HL extends across a virtual line LV that is at least a part of the outer edge EO of the ceramic portion 100. The through-hole HL includes a portion to be the recess CC (fig. 3). The through-hole HL is formed by machining using a die. In addition, as a modification, the through-hole HL may be formed by processing using a laser.

Referring to fig. 10 and 11, a green ceramic portion 100G is printed with a metal paste to form a green metallized portion 200G including a seal metallized green layer 210G, a lower metallized green layer 220G, and a side metallized green layer 230G. The green metallized portion 200G includes a portion to be the metallized portion 200 in a firing step described later. Specifically, the seal metalized green layer 210G, the lower surface metalized green layer 220G, and the side surface metalized green layer 230G include portions which become the seal metalized layer 210, the lower surface metalized layer 220, and the side surface metalized layer 230, respectively, through a firing process described later. As a result, a green laminate 500G having a ceramic green part 100G including a portion to be the ceramic part 100 and a metalized green part 200G including a portion to be the metalized part 200 is formed.

The side surface metallization layers 230G of the ceramic green part 100G and the metalized green part 200G respectively span a virtual line LV (fig. 10) which becomes at least a part of the outer edge EO of the ceramic part 100. Specifically, the ceramic green part 100G crosses the virtual line LV outside the through hole HL. Further, the side surface metallization green layer 230G of the metallization green part 200G crosses the virtual line LV in the through hole HL.

Referring to fig. 12 and 13, a trench TR is formed in the green laminate 500G along a virtual line LV (fig. 10). The step of forming the groove TR is performed by pressing the cutting edge of the green laminate 500G along the virtual line LV. As a modification, the step of forming the grooves TR may be performed by irradiating the green laminate 500G with laser light along the virtual line LV.

Next, the green laminate 500G (fig. 12 and 13) is fired. Referring to fig. 14 and 15, a fired body 500 including the ceramic portion 100 and the metalized portion 200 is formed by the firing. Referring to fig. 16 and 17, the metallization 200 of the fired body 500 is plated. Thereby, the plating layer 300 is formed.

Referring to fig. 18, after the plating treatment, cracks are generated in the fired body 500 from the trenches TR. Thereby, the surface (fracture surface SF) of the middle portion 233 of the side surface metallization layer 230 of the metallization 200 is formed while the ceramic portion 100 is fractured. Through the above steps, a plurality of packages 801 are obtained.

Fig. 19 is a partial sectional view schematically showing the structure of an electronic device 990 in a comparative example. In this comparative example, unlike the electronic apparatus 900 (fig. 2) in the embodiment, the plating layer 390 is provided on the entire side surface of the side surface metallization layer 230. As a result, when the lid 920 is attached using the brazing material 930, the brazing material 930 tends to flow out from the upper surface to the side surface in an unnecessarily large amount as indicated by arrows in the drawing. Further, if a member for stopping the flow of the brazing material 930 in the middle as indicated by an arrow in the figure is added, the structure and the manufacturing method become complicated.

Although not shown, as another comparative example, in a plan view similar to fig. 3, a through hole is formed in the frame portion of the ceramic portion 100 so as to be separated from both the outer edge EO and the chamber CV, and a conductor member for electrically connecting the upper surface P1 and the lower surface P2 is formed in the through hole. In this case, the size of the through hole needs to be sufficiently smaller than the width of the frame portion. Therefore, when the width of the frame portion is small, the process of forming the through-holes is difficult. For example, in the case of machining using a die having minute pins, the minute pins corresponding to the minute through holes are easily broken. When a laser is used instead of the die, productivity is greatly reduced. Further, even if a minute through hole can be formed, the process of filling the conductor member therein is difficult.

According to the package 801 of the present embodiment, the first metallization 200 (fig. 4) includes: a seal metallization layer 210 disposed on the seal face SS; a lower surface metallization layer 220 disposed on the lower surface P2 of the ceramic portion 100; and a side metallization layer 230 disposed on the side P3 of the ceramic portion 100. This ensures electrical connection between the upper surface P1 on which the seal metallization layer 210 is disposed and the lower surface P2 on which the lower surface metallization layer 220 is disposed. Second, the plating layer 300 made of a metal material having high wettability with the molten solder 930 (fig. 2) covers the seal metallization layer 210 of the metallization 200, but does not cover the middle portion 233 of the side metallization layer 230 of the metallization 200. Thus, unlike the comparative example (fig. 19), the brazing material 930 can be prevented from flowing out from the upper surface to the side surface in an unnecessarily large amount. As described above, the electrical connection between the upper surface P1 and the lower surface P2 can be ensured, and the solder 930 can be prevented from flowing out in an unnecessarily large amount from the upper surface to the side surface.

An upper plating layer 310 (fig. 4) covers the upper portion 231 of the side metallization layer 230. Thus, the range in which the solder 930 (fig. 2) easily flows out from the edge of the seal metallization layer 210 is limited to the range of the upper portion 231 of the side metallization layer 230. Therefore, by sufficiently reducing the size of the upper portion 231 of the side metallization layer 230, the amount of the solder 930 flowing out can be suppressed. Further, the solder 930 is slightly spread from the edge of the seal metallization layer 210, so that the solder 930 is more firmly joined to the plating layer 300. In addition, when the surface of the intermediate portion 233 of the side metallization layer 230 is formed by the breaking step (fig. 18) after the firing step and the trench TR (fig. 12) defining the position of the breaking step is formed in advance before the firing step, the formation of the plating layer 300 is efficiently performed by the plating step (fig. 17) after the firing step and before the breaking step. In this case, the portion of the plating layer 300 formed within the trench TR corresponds to a portion covering the upper portion 231 of the side metallization layer 230. Therefore, by allowing the plating layer 300 to cover the upper portion 231 of the side surface metallization layer 230, the plating layer 300 in the present embodiment can be formed efficiently.

The upper plating layer 310 has an end portion (right end portion in fig. 4) having a gradually decreasing thickness. This can suppress the peeling of the plating layer 300 at the end portion. Further, when the plating layer 300 is made of expensive Au, the raw material cost can be reduced. In addition, when the surface of the intermediate portion 233 of the side metallization layer 230 is formed by the breaking step (fig. 18) after the firing step and the trench TR (fig. 12) defining the position of the breaking step is formed in advance before the firing step, the formation of the plating layer 300 is efficiently performed by the plating step (fig. 17) after the firing step and before the breaking step. In this case, a portion which becomes an end portion of the plating layer 300 included in the completed package 801 is located at the bottom of the trench TR at the time point of the plating process. Since it is difficult to perform plating at the bottom of the trench TR, the plating layer 300 has an end portion with a gradually decreasing thickness. Therefore, by allowing the plating layer 300 to have an end portion with a gradually decreasing thickness, the plating layer 300 in the present embodiment can be efficiently formed.

With respect to the outer edge EO (fig. 3) of the ceramic section 100, the side metallization layer 230 is separated from and meets one side at the first corner N1 and the second corner N2. Peeling of the side metallization layer 230 is easily caused at the corners of the outer edge EO, and such peeling can be suppressed by this structure. In particular, as compared with the case where side surface metallization layer 230 is located at the corner of outer edge EO, damage to side surface metallization layer 230 due to the breaking process (fig. 18) for forming outer edge EO of ceramic portion 100 can be suppressed. However, when this effect is not particularly required, that is, when the adhesion strength between the side surface metallization layer 230 and the ceramic portion 100 is sufficiently high, the arrangement of the side surface metallization layer 230 is not limited thereto, and the side surface metallization layer 230 may be arranged at a corner portion.

The surface of the middle portion 233 of the side metallization layer 230 is a fracture surface SF (fig. 18). This enables the surface to be formed by a breaking step.

The side metallization layer 230 is disposed in the recess CC of the outer edge EO (fig. 3). This can prevent the side surface metallization layer 230 from protruding from the outer edge EO of the ceramic portion 100.

The recess CC (fig. 3) is filled with the side surface metallization layer 230 within a height range of the middle portion 233 (fig. 4) where the side surface metallization layer 230 is disposed. Accordingly, as a member for filling the recess CC, a member other than the side surface metallization layer 230 does not need to be formed. Further, by filling the recess CC, it is possible to avoid a situation in which the area where the lid 920 is joined is reduced by the recess CC and a sealing failure occurs. Further, since the rigidity is improved, the frame portion surrounding the chamber CV starting from the recess CC can be prevented from being broken. This is effective when the width of the frame portion of the ceramic portion 100 surrounding the chamber CV is only 100 μm or less even at a portion distant from the recess CC. In particular, in a subminiature package having an outer edge EO as small as being included in a region of 1mm square, it is often required in design that the width of the frame portion is 100 μm or less. Typically, when the electronic component 910 (fig. 1) is a micro crystal blank (provided with an electrode), such a micro package is desired.

According to the method for manufacturing the package 801 of the present embodiment, the package 801 can be manufactured by a simple method. Specifically, the fracture surface SF (fig. 18) formed in the fracture step serves as a surface for suppressing further flow of the brazing material 930. Therefore, it is not necessary to form a special member for suppressing the flow of the filler metal 930. The through-hole HL (fig. 8 and 9) is divided into the recess CC for the castellation electrode (fig. 3). Therefore, the diameter of the through hole HL can be set relatively large compared to the case where a through hole is formed in the frame of the ceramic portion 100 so as to be separated from both the outer edge EO and the chamber CV and used as a via electrode, unlike the present embodiment. Therefore, the diameter of the pin of the die for forming the through-hole HL can also be set large. Therefore, the through-hole HL can be easily formed by machining using a die. This can improve productivity as compared with the case of using laser processing.

According to the method of manufacturing the electronic device 900 of the present embodiment, the package 801 is first manufactured as described above. Next, the electronic component 910 is bonded to the electrode pad 400 of the package 801. Next, the lid 920 is attached to the package 801 by soldering using the solder 930. Thereby, the electronic apparatus 900 is obtained. The brazing may be performed by a known method, and in this case, as the brazing material 930, typically, an Au alloy, particularly an Au — Sn alloy, is used. However, the brazing method is not limited to this, and may be performed, for example, as follows. First, a layer of a brazing material made of an Ag — Cu alloy is formed on one surface of the lid 920. Next, the lid 920 provided with the layer of solder is placed on the seal metallization layer 210 so that the layer of solder is in contact with the seal metallization layer 210. Subsequently, the brazing material is melted by energization and heating. Thereby, the electronic apparatus 900 is obtained.

The electronic apparatus 900 (fig. 2) is mounted on an external substrate (not shown) using the electrode pads (not shown) provided on the lower surface P2 as described above. In this mounting, the electrode pads are bonded to an external substrate using solder. In this solder bonding, if the solder unnecessarily flows out from the lower surface to the side surface, the bonding between the electrode pad and the external substrate is liable to become poor. According to the present embodiment, the plating layer 300 made of a metal material having high wettability with respect to the molten solder covers the lower surface metallization layer 220 of the metallization 200, but the middle portion 233 of the side surface metallization layer 230 of the metallization 200 is not covered. This prevents the solder in a molten state from unnecessarily flowing out from the lower surface to the side surface.

< embodiment 2 >

Fig. 20 is a plan view schematically showing the structure of a package 802 in embodiment 2. Fig. 21 is a diagrammatic, partial cross-sectional view taken along line XXI-XXI of fig. 20. In the present embodiment, the recess CC is filled with the side surface metallization layer 230 and the filling portion 150 within the height range of the middle portion 233 where the side surface metallization layer 230 is disposed. The filling part 150 faces the ceramic part 100 through the side surface metallization layer 230, and is made of ceramic. The main component of the material of the filling part 150 is preferably the same as the main component of the material of the ceramic part 100. For example, the filling part 150 and the ceramic part 100 may be both made of alumina, or the filling part 150 and the ceramic part 100 may be both made of aluminum nitride. The surface of the filling part 150 is not a fired surface but a fracture surface SG. The cross section shown in fig. 21 is a cross section along the line XXI-XXI (fig. 20), and a partial cross section (not shown) along the line a-a (fig. 20) is substantially the same as that of fig. 4 (embodiment 1).

Next, a method of collectively manufacturing a plurality of packages 802 will be described below. The first step and the second step (fig. 6 to 9) in embodiment 1 described above are performed in common in the present embodiment, and therefore, the description thereof is omitted. Fig. 22, 24, 26, 28, 30 and 32 are partial plan views schematically showing the third to eighth steps, respectively. Further, fig. 23, 25, 27, 29, 31, and 33 are schematic partial sectional views along lines XXIII-XXIII (fig. 22), XXV-XXV (fig. 24), XXVII-XXVII (fig. 26), XXIX-XXIX (fig. 28), XXXI-XXXI (fig. 30), and XXXIII-XXXIII (fig. 32), respectively. Fig. 34 is a partial sectional view schematically showing the ninth step.

Referring to fig. 22 and 23, the side surface metallization green layer 230G is formed on the inner surface of the through hole HL of the ceramic green sheet portion 100G by printing the metal paste so as to fill the through hole HL only partially. Referring to fig. 24 and 25, the through hole HL is filled with the green filler portion 150G through the side surface metallization green layer 230G by printing the ceramic paste so as to fill the through hole HL. Referring to fig. 26 and 27, a seal metallization layer 210G and a lower surface metallization layer 220G are formed on the ceramic green part 100G by printing of the metal paste. As described above, through the steps of fig. 22 to 27, the metalized green sheet portion 200G including the portion to be the metalized portion 200 is formed on the ceramic green sheet portion 100G. As a result, a green laminate 500G including the ceramic green part 100G, the metalized green part 200G, and the filler green part 150G is formed, the ceramic green part 100G including the portion to be the ceramic part 100, the metalized green part 200G including the portion to be the metalized part 200, and the filler green part 150G including the portion to be the filler part 150.

The side-metalized green layer 230G and the filler green part 150G of the ceramic green part 100G and the metalized green part 200G, respectively, cross the imaginary line LV (fig. 10). Specifically, the ceramic green part 100G crosses the virtual line LV outside the through hole HL. Further, the side surface metallization green layer 230G and the green filler portion 150G cross the virtual line LV in the through hole HL.

Referring to fig. 28 and 29, the grooves TR are formed in the green laminate 500G along the virtual line LV (fig. 26). The step of forming the groove TR is performed by pressing the cutting edge of the green laminate 500G along the virtual line LV. In the case where the tip is used to form the groove TR, as shown in fig. 29, the seal metallization green layer 210G easily extends onto the side surface of the groove TR. This is because the seal metallization layer 210G is drawn into the cutting edge when the groove TR is formed. As a result, the plating layer 300 is easily formed on the surface of the filling part 150 made of ceramic also in the plating step (fig. 32 and 33) described later.

Next, the green laminate 500G (fig. 28 and 29) is fired. Referring to fig. 30 and 31, a fired body 500 including the ceramic portion 100 and the metalized portion 200 is formed by the firing.

Referring to fig. 32 and 33, the metallization 200 of the fired body 500 is plated. Thereby, the plating layer 300 is formed.

Referring to fig. 34, after the plating, cracks are generated in the fired body 500 from the trenches TR. Thereby, the surface of the middle portion 233 of the side surface metallization layer 230 of the metallization 200 (fracture surface SF in fig. 20) is formed while breaking (snap) the ceramic portion 100 and the filling portion 150. In this way, a plurality of packages 802 are obtained.

Since the components other than the above are substantially the same as those in embodiment 1, the same or corresponding components are denoted by the same reference numerals, and description thereof will not be repeated.

According to package 802 of the present embodiment, recess CC (fig. 20) is filled with side surface metallization layer 230 and filling portion 150 made of ceramic facing ceramic portion 100 via side surface metallization layer 230, within the height range of intermediate portion 233 (fig. 21) where side surface metallization layer 230 is disposed. This allows the side surface metallization layer 230 to be protected by the filler 150. Further, since the filling portion 150 (fig. 33) made of ceramic is formed in the through hole HL including the portion to be the concave portion CC, the proportion of the material constituting the frame portion made of ceramic increases, and homogeneity improves, so that cracks in the concave portion CC in the breaking step (fig. 34) can be more stably generated.

According to the method of manufacturing the package 802 of the present embodiment, the cutting edge forming groove TR is used (fig. 29). Thereby, as described above, the seal metallization green layer 210G easily extends to the side surfaces of the trench TR. As a result of the extension of the seal metallization layer 210G onto the side faces of the trench TR, the seal metallization layer 210 of the package 802 also extends onto the side faces of the trench TR. Thereby, as in the case of fig. 4 (embodiment 1), the upper plating layer 310 having the end portion with the gradually decreasing thickness on the side surface of the trench TR can be obtained (fig. 21).

< modification of embodiment 2 >

Fig. 35 is a partial sectional view schematically showing a modification of the process of fig. 29. In the step of fig. 29, the groove TR is formed using a cutting edge, but in the present modification, the groove TR is formed by laser processing (i.e., irradiation of laser light). In this case, unlike the case of fig. 29, the seal metallization green layer 210G hardly extends onto the side faces of the trench TR. According to this modification, the fine grooves TR can be formed by using the laser beam instead of the cutting edge.

< embodiment 3 >

Fig. 36 is a partial sectional view schematically showing the structure of a package 801M according to embodiment 3. In this embodiment, a surface oxide film 233X made of an oxide of a metallization material is provided in the middle portion 233 of the side metallization layer 230. The surface oxide film 233X may be a natural oxide film of the middle portion 233. Since the other configurations are substantially the same as those of embodiment 1 (fig. 4), the same or corresponding elements are denoted by the same reference numerals, and description thereof will not be repeated.

Also according to the present embodiment, substantially the same effects as those of embodiment 1 can be obtained. Further, according to the present embodiment, the wettability of the intermediate portion 233 of the solder 930 by the surface oxide film 233X can be further reduced. In particular, when the surface oxide film 233X is a natural oxide film of the intermediate portion 233, the surface oxide film 233X can be easily formed.

< embodiment 4 >

Fig. 37 is a plan view schematically showing the structure of a package 802M according to embodiment 4. In this embodiment, a surface oxide film 233X made of an oxide of a metallization material is provided in the middle portion 233 of the side metallization layer 230. The surface oxide film 233X may be a natural oxide film of the middle portion 233. Since the other configurations are substantially the same as those of embodiment 2 described above, the same or corresponding elements are denoted by the same reference numerals, and description thereof will not be repeated.

Also according to this embodiment, substantially the same effects as those of embodiment 2 can be obtained. Further, according to the present embodiment, the same effects as those peculiar to embodiment 3 can be obtained.

< embodiment 5 >

Fig. 38 is a partial cross-sectional view schematically showing the configuration of an electronic device 900M in embodiment 5, with a view corresponding to fig. 2 (electronic device 900: embodiment 1). The electronic apparatus 900M includes a metal housing 940 in addition to the components included in the electronic apparatus 900. The shape of the metal frame 940 is substantially the same as the shape of the seal metallization layer 210 in a plan view. Therefore, the metal frame 940 surrounds the chamber CV in a plan view.

The metal frame 940 is preferably made of a metal having a thermal expansion coefficient similar to that of ceramics, and more specifically, is preferably made of an alloy containing Fe (iron) and Ni (nickel) as main components, for example, an Fe — Ni — Co (cobalt) alloy or an Fe — Ni alloy.

Next, a method for manufacturing the electronic apparatus 900M will be described. First, the package 801 described in embodiment 1 is prepared. Next, the metal frame 940 is mounted on the sealing metallization layer 210 of the package 801 using the solder 930. In other words, the metal frame 940 is soldered to the sealing metallization layer 210. The brazing method may be the same as the brazing method of the lid 920 to the sealing metallization layer 210 in embodiment 1 or the modification thereof. In particular, in the present embodiment, the material of the filler metal 930 is preferably an Ag — Cu alloy. Next, the lid 920 is attached to the metal housing 940. The mounting is preferably performed by welding.

In the present embodiment, the lid 920 is attached to the package 801 using the brazing material 930 and the metal frame 940 brazed with the brazing material 930. In other words, the package 801 is a package in which the lid 920 is attached using the brazing material 930 and the metal frame 940 soldered to the brazing material 930. Therefore, in the present embodiment, the sealing surface SS of the package 801 is used to support the lid 920 via the metal frame 940.

As a modification, the package 801 in the electronic apparatus 900M may be replaced with any of the packages of embodiments 1 to 4 and the modifications thereof other than the package 801.

The above-described embodiments and modifications can be freely combined with each other. The present invention has been described in detail, but the above description is illustrative in all aspects, and the present invention is not limited thereto. It is to be understood that numerous modifications, not illustrated, can be devised without departing from the scope of the invention.

Description of the symbols

100: ceramic part

100G: ceramic green part

150: filling part

150G: filling the green part

200: metallization

200G: metallization of green part

210: sealing metallization layer

210G: sealing a metallization green layer

220: lower surface metallization layer

220G: lower surface metallization of green layer

230: side metallization layer

230G: side metallization green layer

231: upper part

232: lower part

233: middle part

233X: surface oxide film

300: coating (Metal layer)

310: upper plating layer

320: lower plating layer

500: fired body

500G: green body laminate

801. 801M, 802M: package body

900. 900M: electronic device

910: electronic component

920: cover body

940: metal frame

930: brazing filler metal

CC: concave part

CV (constant value) is as follows: chamber

EO: outer edge

HL: through hole

LV: imaginary line

N1, N2: a first angle and a second angle

P1: upper surface of

P2: lower surface

P3: side surface

SF: fracture surface

SG: fracture surface

And SS: sealing surface

TR: and (4) a groove.

Claims (11)

1. A package for electronic components, in which a lid is mounted using a solder,

the package is provided with a ceramic part having an outer edge in a plan view,

the ceramic portion has:

an upper surface including a sealing surface for supporting the lid body, a cavity for housing the electronic component being provided inside the sealing surface;

a lower surface opposite the upper surface; and

a side surface disposed on the outer edge in the plan view and connecting the upper surface and the lower surface to each other,

the package further includes a metallized portion formed of a metallized material and provided on the ceramic portion,

the metallization comprises:

a seal metallization layer disposed on the sealing face;

a lower surface metallization layer provided on the lower surface of the ceramic portion; and

a side surface metallization layer provided on the side surface of the ceramic portion and having an upper portion connected to the seal metallization layer, a lower portion connected to the lower surface metallization layer, and an intermediate portion connecting the upper portion and the lower portion to each other,

the package further includes a metal layer made of a metal material having higher wettability with respect to the solder than the metallization material, the metal layer covering the seal metallization layer of the metallization, and the middle portion of the side metallization layer of the metallization being uncovered.

2. The package of claim 1,

the metal layer covers the upper portion of the side metallization layer.

3. The package of claim 1 or 2,

the metal layer has an end portion with a gradually decreasing thickness.

4. The package of any one of claims 1 to 3,

the outer edge of the ceramic portion has a first corner, a second corner, and one side connecting the first corner and the second corner to each other in the plan view, and the side metallization layer is separated from the first corner and the second corner and connected to the one side.

5. The package of any one of claims 1 to 4,

a surface oxide film made of an oxide of the metallization material is provided in the middle portion of the side metallization layer.

6. The package of any one of claims 1 to 5,

the surface of the middle portion of the side metallization layer is a fracture surface.

7. The package of any one of claims 1 to 6,

the outer edge has a recess configured with the side metallization layer.

8. The package of claim 7,

the recess is filled with the side metallization layer over a height of the intermediate portion in which the side metallization layer is arranged.

9. The package of claim 7,

the recess is filled with the side surface metallization layer and a filling portion made of ceramic within a height range of the intermediate portion in which the side surface metallization layer is disposed, the filling portion facing the ceramic portion through the side surface metallization layer.

10. The package of any one of claims 1 to 9,

the package is obtained by mounting the lid body using the brazing material and a metal frame brazed with the brazing material,

the sealing surface is used to support the lid via the metal frame.

11. A method of manufacturing a package according to any one of claims 1 to 10, the method comprising:

(a) a step of forming a green laminate having a ceramic green part including a portion to be the ceramic part and a metalized green part including a portion to be the metalized part, the ceramic green part and the metalized green part each crossing an imaginary line that is at least a part of the outer edge of the ceramic part,

the manufacturing method of the package body further includes:

(b) forming a groove in the green laminate along the virtual line;

(c) forming a fired body including the ceramic part and the metallized part by firing the green laminated body;

(d) plating the metallization of the fired body to form the metal layer; and

(e) and forming a surface of the intermediate portion of the side surface metallization layer of the metallization portion while breaking the ceramic portion by causing a crack in the fired body from the trench as a starting point after the step of plating the metallization portion.

Images