JP7427888B2 - Prism, optical device, prism manufacturing method, and package device manufacturing method - Google Patents

Description

The present invention relates to a prism, an optical device, a method for manufacturing a prism, and a method for manufacturing a package device.

In recent years, prisms for reflecting or refracting light from a light source have been widely used in applications such as displays, automobile headlamps, and projectors. An example of an optical device including such a prism is disclosed in Patent Document 1 below. In Patent Document 1, a laser chip and a prism are arranged on a mounting board made of a semiconductor disk. The laser chip and prism are bonded to the mounting board using solder.

Japanese Patent Application Publication No. 2000-091688

In optical devices, it is necessary to adjust the direction of the optical path with high precision, so high positional precision is required for the joining arrangement of prisms. However, when using a high-output LD (Laser Diode) or the like as a light source that emits light to the prism, if the prism is bonded to a mounting board using a resin adhesive, the adhesive will soften and the position of the prism will change. Misalignment may occur. On the other hand, since mounting using solder as described in Patent Document 1 involves melting and flowing of the entire solder, there is a risk that the prism will be misaligned in the height direction before and after mounting. Therefore, with the prism described in Patent Document 1, it is difficult to sufficiently improve the positional accuracy when the prism is bonded to a mounting board or the like. Further, there are also problems in terms of assembly workability and cost.

An object of the present invention is to provide a prism, an optical device using the prism, a method for manufacturing a prism, and a method for manufacturing a package device, which can effectively improve positional accuracy in an optical device.

The prism of the present invention includes a prism main body having a bottom surface and a slope connected to the bottom surface, an adhesive film provided on the bottom surface, and a first layer portion where the adhesive film is located on the prism main body side; and a second layer portion laminated directly or indirectly on the first layer portion, and the second layer portion includes at least one of an Au layer and a Sn layer. .

In the second layer portion, it is preferable that Au layers and Sn layers are alternately stacked.

Preferably, the second layer portion has both an Au layer and a Sn layer, and an Au--Sn layer made of an alloy of Au and Sn is provided between the Au layer and the Sn layer.

In the stacking direction of the adhesive film, when the side away from the prism body is defined as the outside, it is preferable that the outermost layer of the second layer portion is an Au layer.

The second layer portion has both a plurality of Au layers and a plurality of Sn layers, the Au layers and the Sn layers are laminated alternately, the second layer portion has a stress relaxation layer, and the stress relaxation layer When is one of the plurality of Au layers, the thickness of the stress relaxation layer is different from the average thickness of the other Au layers, and when the stress relaxation layer is one of the plurality of Sn layers, The thickness of the stress relaxation layer is preferably different from the average thickness of the other Sn layers. In this case, the thickness of the stress relaxation layer is more preferably 1/2 or more and 5 times or less of the average thickness of other Au layers or other Sn layers. Alternatively, the thickness of the stress relaxation layer is more preferably 1/5 or more and 1/2 or less of the average thickness of other Au layers or other Sn layers.

In the stacking direction of the adhesive film, the outermost layer of the second layer portion is preferably the thinnest layer in the second layer portion, when the side away from the prism body is defined as the outside. In this case, in the second layer portion, it is more preferable that the outer layer is thinner.

It is preferable that the second layer portion has both a plurality of Au layers and a plurality of Sn layers, the thicknesses of the plurality of Au layers are the same, and the thickness of the plurality of Sn layers is thicker as they are located on the outer side. .

It is preferable that the second layer portion has both a plurality of Au layers and a plurality of Sn layers, the thickness of the plurality of Au layers is thinner toward the outer side, and the thickness of the plurality of Sn layers is preferably the same. .

It is preferable that the total number of Au layers and Sn layers in the second layer portion is 3 or more and 99 or less. In this case, it is more preferable that the total number of Au layers and Sn layers in the second layer portion is 15 or more and 35 or less.

It is preferable that the total thickness of the adhesive film is 1 μm or more and 10 μm or less.

The second layer portion has both an Au layer and a Sn layer, M _A is the sum of the weights of Au in the second layer portion, M _S is the sum of the weights of Sn, and Au is the sum of the weights of Au and Sn. When the ratio of the weight of is M _A /(M _A + M _S ), the ratio M _A /(M _A + M _S ) is preferably 0.65 or more and 0.78 or less, and 0.60 or more, More preferably, it is 0.75 or less.

A prism according to another aspect of the present invention is a prism that is mounted in a package, and includes a prism body having a bottom surface and an inclined surface connected to the bottom surface, and an adhesive film provided on the bottom surface. , has a first layer portion located on the prism body side, and a second layer portion laminated directly or indirectly on the first layer portion, and the second layer portion is made of Au and Sn. It is an Au-Sn layer made of an alloy, and the thickness of the second layer portion of the adhesive film is 2.5 μm or more and 5.9 μm or less.

In the stacking direction of the adhesive film, when the side away from the prism body is defined as the outer side, the adhesive film is the outermost layer of the adhesive film, has an outermost layer portion laminated on the second layer portion, and has an outermost layer portion laminated on the second layer portion. It is preferable that the outer layer portion is an Au layer.

In the stacking direction of the adhesive film, the outermost layer of the adhesive film preferably has an arithmetic mean roughness Ra of 0.20 μm or less, when the side away from the prism body is defined as the outside.

Preferably, the first layer portion is a Cr layer, a Ti layer, or a Ta film.

Preferably, the adhesive film further includes an intermediate layer portion laminated between the first layer portion and the second layer portion. In this case, it is more preferable that the intermediate layer portion is a Ni layer, a Pt layer, a Pd layer, a Ni--Cr mixed layer, or an alloy layer that is a combination of these.

Preferably, the prism body has a top surface, the top surface facing the bottom surface and connected to the slope.

Preferably, a reflective film is provided on the slope of the prism body. Further, it is preferable that a reflective film is provided on the slope and the upper surface of the prism body.

The optical device of the present invention includes the above prism, an optical element that emits light to the prism or receives light from the prism, and a package that houses the prism and the optical element, and the prism is bonded to the package by an adhesive film. It is characterized by being

The prism manufacturing method of the present invention is a prism manufacturing method comprising a step of providing an adhesive film on the bottom surface of a prism body having a bottom surface and an inclined surface connected to the bottom surface, the step of providing the adhesive film includes the step of providing an adhesive film on the bottom surface. forming a first layer portion made of a metal material; and laminating a second layer portion made of a metal material directly or indirectly on the first layer portion; The first layer portion and the second layer portion are made of metal materials having different components, and the second layer portion includes at least one of an Au layer and a Sn layer.

The method for manufacturing a packaged device of the present invention includes the steps of preparing the prism, preparing a package having an adhesive surface for contacting the prism, and applying the prism and the package so that the adhesive film contacts the adhesive surface of the package. The method is characterized by comprising a step of bringing the prism into contact with the package, and a step of heating the adhesive film to join the prism and the package.

An Au film is formed on the adhesive surface of the package, and it is preferable to heat the prism and the package at a temperature at which the entire adhesive film does not melt.

According to the prism, optical device, prism manufacturing method, and package device manufacturing method of the present invention, the positional accuracy of the prism can be effectively improved.

FIG. 1 is a cross-sectional view of a prism according to a first embodiment of the present invention. FIG. 2 is an enlarged cross-sectional view showing the vicinity of the adhesive film of the prism according to the first embodiment of the present invention. FIG. 7 is an enlarged sectional view showing the vicinity of the adhesive film of the prism according to the second embodiment of the present invention. FIG. 7 is an enlarged cross-sectional view showing the vicinity of an adhesive film of a prism according to a third embodiment of the present invention. FIG. 7 is an enlarged cross-sectional view showing the vicinity of an adhesive film of a prism according to a fourth embodiment of the present invention. FIG. 7 is an enlarged cross-sectional view showing the vicinity of an adhesive film of a prism according to a fifth embodiment of the present invention. FIG. 7 is a sectional view of a prism according to a sixth embodiment of the present invention. FIG. 7 is a sectional view of a prism according to a modification of the sixth embodiment of the present invention. FIG. 7 is a cross-sectional view of an optical device according to a seventh embodiment of the present invention. FIG. 7 is a sectional view of a prism according to an eighth embodiment of the present invention. FIG. 7 is a sectional view of a prism according to a ninth embodiment of the present invention. FIG. 7 is a cross-sectional view of a prism according to a tenth embodiment of the present invention. FIG. 7 is a sectional view of a prism according to an eleventh embodiment of the present invention. FIG. 7 is a sectional view of a prism according to a twelfth embodiment of the present invention. FIG. 7 is a sectional view of a prism according to a thirteenth embodiment of the present invention. FIG. 3 is a cross-sectional view of the base material of the prism used for stress evaluation.

Preferred embodiments will be described below. However, the following embodiments are merely illustrative, and the present invention is not limited to the following embodiments. Further, in each drawing, members having substantially the same function may be referred to by the same reference numerals.

(prism)
(First embodiment)
FIG. 1 is a sectional view of a prism according to a first embodiment of the invention. As shown in FIG. 1, the prism 1 includes a prism body 2, an adhesive film 3, and a reflective film 4. The prism body 2 has a substantially trapezoidal cross-sectional shape. The prism body 2 has a bottom surface 2a, a slope 2b connected to the bottom surface 2a, and a top surface 2c facing the bottom surface 2a and connected to the slope 2b. Note that the cross-sectional shape of the prism body 2 is not limited to a substantially trapezoidal shape, but may be substantially triangular or the like. In this embodiment, the prism body 2 is made of a suitable glass material.

An adhesive film 3 is provided on the bottom surface 2a of the prism body 2. A reflective film 4 is provided on the slope 2b of the prism body 2. The prism 1 is bonded to a mounting board, a package, etc. in an optical device or a package device through an adhesive film 3.

FIG. 2 is an enlarged sectional view showing the vicinity of the adhesive film of the prism according to the first embodiment. As shown in FIG. 2, the adhesive film 3 is a laminate of a plurality of metal layers. Specifically, the adhesive film 3 includes a first layer portion 5 located closest to the prism body 2 and a second layer portion 6 laminated on the first layer portion 5 . In this embodiment, the second layer part 6 is laminated directly onto the first layer part 5. Note that the second layer portion 6 may be laminated indirectly on the first layer portion 5 via another layer.

The first layer portion 5 is a Cr layer. However, the first layer portion 5 only needs to have relatively high adhesion to the prism body 2 in each layer of the adhesive film 3, and is not limited to a Cr layer. For example, the first layer portion 5 may be a Ti layer or a Ta layer.

Note that in the present invention, a small amount of impurity or additive is allowed in each metal layer. Specifically, the Cr layer is a metal layer containing 95% by weight or more of Cr. Further, the Ti layer is a metal layer containing 95% by weight or more of Ti. Further, the Ta layer is a metal layer containing 95% by weight or more of Ta. Cr, Ti, and Ta function as an adhesion layer with glass, but as long as the content of Cr, Ti, and Ta is within the above range, the effects of the present invention are not impaired.

In this embodiment, the second layer portion 6 is a laminated layer in which a first layer 6a, a second layer 6b, a third layer 6c, a fourth layer 6d, and a fifth layer 6e are laminated in this order. It is the body. Here, in the stacking direction of the adhesive film 3, the side facing the prism body 2 is defined as the inside, and the side away from the prism body 2 is defined as the outside. In the second layer portion 6, the fifth layer 6e is the outermost layer.

The first layer 6a is an Au layer, the second layer 6b is an Sn layer, the third layer 6c is an Au layer, the fourth layer 6d is an Sn layer, and the outermost layer is the fifth layer. The layer 6e is an Au layer. In the second layer portion 6, Au layers and Sn layers are alternately stacked. Note that the second layer portion 6 only needs to include at least one of the Au layer and the Sn layer, and the number of layers is not limited to the above.

Note that in the present invention, the Au layer is a metal layer containing 95% by weight or more of Au. Further, the Sn layer is a metal layer containing 95% by weight or more of Sn. Depending on the degree of purification of Au or Sn, impurities may be mixed into the metal layer. Typical impurities include, for example, Fe, Cr, Ni, etc., but as long as the content of each of Au and Sn is within the above range, the effects of the present invention will not be impaired.

The reflective film 4 is made of, for example, a dielectric multilayer film in which high refractive index films and low refractive index films are alternately laminated. Examples of the material of the high refractive index film include TiO ₂ , Ta ₂ O ₅ , ZrO ₂ or HfO ₂ . Examples of the material for the low refractive index film include SiO ₂ or MgF ₂ . Furthermore, a metal film may be used as the reflective film 4. The reflective film 4 only needs to be provided on at least a portion of the slope 2b of the prism body 2, and may be provided on the entire surface of the slope 2b, for example. By providing the reflective film 4 on the slope 2b, the light emitted from the light source can be appropriately reflected. Note that the prism 1 does not necessarily have to include the reflective film 4.

The adhesive film 3 and the reflective film 4 can be formed by laminating each layer by, for example, a sputtering method, a vacuum evaporation method, or the like.

The feature of this embodiment is that the adhesive film 3 provided on the bottom surface 2a of the prism body 2 has a first layer portion 5 and a second layer portion 6 including at least one of an Au layer and a Sn layer. It consists in having the following. Thereby, the positional accuracy of the prism 1 in the optical device can be effectively improved. Details of this will be explained below.

The prism 1 of this embodiment can be bonded to a package or the like without melting and flowing the entire adhesive film 3. Specifically, as shown in FIG. 9, first, the prism 1 is placed on a package or the like. Specifically, the prism 1 is placed on an adhesive surface of a package or the like to which the prism 1 is to be adhered. At this time, a metal film such as an Au film may be provided as an auxiliary layer on the part where the prism 1 is placed (in this embodiment, the inner surface of the package) to assist in bonding with the adhesive film 3. preferable. Next, the adhesive film 3 of the prism 1 is heated at a temperature that does not melt the entire adhesive film 3. Although the heating temperature is not particularly limited, it may be heated at, for example, 300° C. or higher and 350° C. or lower. By heating the adhesive film 3, metals are interdiffused in the Au layer and the Sn layer, and the adhesive film 3 is alloyed. At this time, the Au film, which is a metal film on the inner surface of the package, and the outermost Au layer of the adhesive film 3 interdiffuse and adhere to each other, and the Au layer and the Sn layer that constitute the adhesive film 3 also interdiffuse and become alloyed. . Thereby, the adhesive film 3 and the metal film of the package or the like are integrated, and the prism 1 is bonded to the package or the like. In this way, for example, packaged devices and the like can be suitably manufactured. Alternatively, the prism 1 used in the optical device can be mounted on a package or the like.

In this way, since the entire adhesive film 3 is not melted, the thickness of the adhesive film 3 is unlikely to change before and after the prism 1 is bonded, and displacement of the prism body 2 in the height direction is unlikely to occur. Similarly, since the entire adhesive film 3 is not melted, horizontal displacement of the prism body 2 is unlikely to occur before and after the prism 1 is bonded. Therefore, the positional accuracy of the prism 1 can be effectively improved. Further, in the package assembly process, the conventional solder application process can be omitted, that is, it is only necessary to place the prism 1 having the adhesive film 3 on the package, etc., so that workability and cost efficiency can be improved.

Furthermore, unlike adhesives made of resin, the adhesive film 3 is made of metal. Therefore, deterioration due to moisture or oxygen or deterioration due to light is less likely to occur, and reliability can be improved. In addition, since no gas is generated after the prism 1 is bonded to the package or the like, impurities are less likely to adhere to the reflective film 4 and the optical element 74, which will be described later, and deterioration of reflectance and transmittance is less likely to occur.

In the above example, the prism 1 is heated and bonded with the prism 1 placed on the package, but if the adhesive film 3 of the prism 1 is in contact with the adhesive surface of the package, the package at the time of bonding Also, the attitude and state of the prism 1 are not limited to the above. For example, the package may be placed on the prism 1, or the prism 1 and the package may be held in contact with each other by a clamp device or the like.

In the adhesive film 3, it is preferable that Au layers and Sn layers are alternately laminated. Thereby, during mounting, metal can be more reliably interdiffused in the Au layer and the Sn layer, and the Au layer and the Sn layer can be alloyed more reliably. Therefore, when mounting the prism 1 on a package or the like, the bonding force by the adhesive film 3 can be more reliably increased.

The total thickness of the adhesive film 3 is preferably 1 μm or more, more preferably 3 μm or more. This allows the bonding force to be increased more fully. The total thickness of the adhesive film 3 is preferably 10 μm or less, more preferably 5 μm or less. In this case, each layer in which metal interdiffuses during mounting can be made thinner. Thereby, the time required for the metals to mutually diffuse in each layer of the adhesive film 3 to an extent that does not cause peeling can be shortened, and the time for alloying the adhesive film 3 can be shortened. Therefore, productivity can be further improved. Further, since the adhesive film 3 used is thin, the positional deviation of the prism body 2 in the height direction is reduced, so that the positional accuracy of the prism 1 can be further effectively improved.

The total number of Au layers and Sn layers in the second layer portion 6 of the adhesive film 3 is preferably 3 or more, more preferably 15 or more. Thereby, the thickness of each layer in the second layer portion 6 can be made even thinner. Therefore, during mounting, the time for alloying the adhesive film 3 can be further shortened, and productivity can be further improved.

The total number of Au layers and Sn layers in the second layer portion 6 is preferably 99 or less. In consideration of productivity, the number of layers is more preferably 39 or less, and even more preferably 35 or less. If the number of layers in the second layer portion 6 is too large, each layer becomes too thin, which may make it difficult to form each layer.

The second layer portion 6 is laminated between the Au layer and the Sn layer, and may include an Au--Sn layer made of an alloy of Au and Sn. In this case, during mounting, the time for alloying the adhesive film 3 can be further effectively shortened, and productivity can be further effectively increased. Note that the Au--Sn layer can be formed in a short time by two-source evaporation or two-source sputtering using a vacuum evaporation method or a sputtering method.

Note that the Au-Sn layer can be formed by alloying parts of the adjacent Au layer and Sn layer when forming the adhesive film 3. For example, under appropriate conditions such as a sputtering method or a vacuum evaporation method, a part of the Au layer and the Sn layer is alloyed by the energy when the Au layer and the Sn layer are laminated to form an Au-Sn layer. Can be done.

The outermost layer in the second layer portion 6 is preferably an Au layer. Thereby, the outermost layer in contact with the package etc. during mounting is less likely to be oxidized, and the bonding strength can be increased more reliably.

Here, the total weight of Au in the adhesive film 3 is M _A , the total weight of Sn is M _S , and the ratio of the weight of Au to the total weight of Au and Sn is M _A /(M _A +M _S ) . At this time, the ratio M _A /(M _A +M _S ) is preferably larger than 0.78 and smaller than 0.82, and particularly preferably 0.8. In this case, the melting point (eutectic temperature) of Au and Sn can be set to about 280° C., and the adhesive film 3 can be alloyed at a low temperature. Therefore, the prism 1 can be bonded to a package or the like at a low temperature.

Here, as described above, it is preferable that a metal film such as an Au film is formed on the package or the like in which the prism 1 is mounted. When the prism 1 is bonded to a portion of a package or the like on which an Au film is formed, Au is brought into the adhesive film 3 from the Au film. Therefore, the weight ratio M _A /(M _A +M _S ) of Au in the adhesive film 3 after alloying becomes larger than before alloying. Therefore, in such a case, the weight ratio M _A /(M _A +M _S ) of Au in the adhesive film 3 is preferably 0.60 or more and 0.78 or less, and 0.68 or more and 0. More preferably, it is .75 or less. By setting the ratio M _A /(M _A +M _S ) of the adhesive film 3 before alloying within the above range, the ratio M _A /(M _A +M S ) of the adhesive film 3 after alloying between the Au film and the adhesive film 3 _S ) can be in the range greater than 0.78 and less than 0.82. Thereby, the melting point (eutectic temperature) of Au and Sn can be set to about 280° C., and the adhesive film 3 can be alloyed at a low temperature. Therefore, the prism 1 can be more reliably bonded to a package or the like at a low temperature.

As in this embodiment, the prism body 2 preferably has an upper surface 2c that faces the bottom surface 2a and is connected to the slope 2b. In this case, since the prism 1 is easily chucked when moving, the prism 1 can be easily mounted. Note that the prism body 2 does not necessarily have the upper surface 2c, and may have a substantially triangular cross-sectional shape.

(Second embodiment)
FIG. 3 is an enlarged sectional view showing the vicinity of the adhesive film of a prism according to the second embodiment of the present invention. As shown in FIG. 3, the prism 11 of this embodiment differs from the first embodiment in that the outer layer of the second layer portion 16 of the adhesive film 13 is thinner. Specifically, the thickness of the first layer 16a is T _a , the thickness of the second layer 16b is T _b , the thickness of the third layer 16 c is T _c , the thickness of the fourth layer 16 d is T d , and the thickness of the fourth layer 16 d is T _d . When the thickness of the layer 16e of No. 5 is T _e , Ta > _{T b >} T _c > T _d > T _e . In other respects than the above, the prism 11 of this embodiment has the same configuration as the prism 1 of the first embodiment.

Also in this embodiment, as in the first embodiment, the prism 11 can be bonded to a package or the like without melting the adhesive film 13. Therefore, the positional accuracy of the prism 11 can be effectively improved.

By the way, since the fifth layer 16e is the outermost layer, the only layer adjacent to the fifth layer 16e is the fourth layer 16d located inside. Therefore, when alloying the adhesive film 13, mutual diffusion occurs through both the outer and inner surfaces in the third layer 16c and the fourth layer 16d, but in the fifth layer 16e, interdiffusion occurs only through the inner surface. mutual diffusion occurs. Here, in this embodiment, the fifth layer 16e is the thinnest layer in the second layer portion 16. Therefore, since the interdiffusion time required for alloying in the fifth layer 16e can be effectively shortened, the fifth layer 16e can be alloyed more reliably, and the alloying time can be shortened. can do. Therefore, the adhesive film 13 can be alloyed more reliably, the bonding force can be more reliably increased, and productivity can be increased.

In addition, the outer layer of the second layer portion 16 of the adhesive film 13 is thinner. Thereby, even if the fifth layer 16e is made thinner, layers other than the fifth layer 16e can be alloyed more reliably. Therefore, the adhesive film 13 can be alloyed more reliably, and the bonding strength can be increased even more reliably.

Note that in the second layer portion 16, the fifth layer 16e may be the thinnest layer, and at least two layers may have the same thickness. The thickness relationship of each layer of the second layer portion 16 may be T _a ≧T _b ≧T _c ≧T _d >T _e .

(Third embodiment)
FIG. 4 is an enlarged sectional view showing the vicinity of the adhesive film of a prism according to the third embodiment of the present invention. The thickness of each layer of the adhesive film may be changed from the thickness in the first embodiment as described below. For example, the prism 21 of the present embodiment may have a configuration in which the plurality of Au layers have the same thickness in the second layer portion 26 of the adhesive film 23, and the thickness of the plurality of Sn layers becomes thicker as they are located on the outer side. good. Specifically, the thickness of the first layer 26a is T _a , the thickness of the second layer 26b is T _b , the thickness of the third layer 26 c is T _c , the thickness of the fourth layer 26 d is T d , and the thickness of the fourth layer 26 d is T _d . When the thickness of the layer 26e of No. 5 is T _e , the thickness of the Au layer is T _a =T _c =T _e and the thickness of the Sn layer is T _b <T _d . In other respects than the above, the prism 21 of this embodiment has the same configuration as the prism 1 of the first embodiment.

In this embodiment as well, as in the first embodiment, the prism 21 can be bonded to a package or the like without melting and flowing the entire adhesive film 23. Further, when the adhesive film 23 is alloyed, the weight ratio of Sn on the outside can be increased compared to the inside, and the positional accuracy of the prism 21 can be further effectively improved.

(Fourth embodiment)
FIG. 5 is an enlarged sectional view showing the vicinity of the adhesive film of a prism according to the fourth embodiment of the present invention. The thickness of each layer of the adhesive film may be changed from the thickness in the first embodiment as described below. For example, the prism 31 of the present embodiment may have a structure in which the thickness of the plurality of Au layers is thinner toward the outer side in the second layer portion 36 of the adhesive film 33, and the thickness of the plurality of Sn layers is the same. good. Specifically, the thickness of the first layer 36a is T _a , the thickness of the second layer 36b is T _b , the thickness of the third layer 36 c is T _c , the thickness of the fourth layer 36 d is T d , and the thickness of the fourth layer 36 d is T _d . When the thickness of the layer 36e of No. 5 is T _e , the thickness of the Au layer is T _a > T _c > T _e and the thickness of the Sn layer is T _b = T _d . In other respects than the above, the prism 31 of this embodiment has the same configuration as the prism 1 of the first embodiment.

In this embodiment, as in the first embodiment, the prism 31 can be bonded to a package or the like without melting and flowing the entire adhesive film 33. Further, when the adhesive film 33 is alloyed, the weight ratio of Sn on the outside can be increased compared to the inside, and the positional accuracy of the prism 31 can be further effectively improved.

(Fifth embodiment)
FIG. 6 is an enlarged sectional view showing the vicinity of the adhesive film of the prism according to the fifth embodiment of the present invention. As shown in FIG. 6, the prism 41 of this embodiment has a first layer in that the adhesive film 43 has an intermediate layer portion 47 laminated between the first layer portion 5 and the second layer portion 6. This embodiment differs from the embodiment of . In other respects than the above, the prism 41 of this embodiment has the same configuration as the prism 1 of the first embodiment.

In this embodiment, the second layer portion 6 is laminated indirectly on the first layer portion 5 via the intermediate layer portion 47. Since the adhesive film 43 has the intermediate layer portion 47, the metal of the second layer portion 6 is difficult to diffuse into the first layer portion 5. Therefore, the adhesive film 43 is difficult to peel off from the prism body 2.

The intermediate layer portion 47 is preferably a Ni layer, a Pt layer, a Pd layer, a Ni--Cr mixed layer, or an alloy layer combining these layers. This makes it even more difficult for the metal of the second layer portion 6 to diffuse into the first layer portion 5, making it even more difficult for the adhesive film 43 to peel off from the prism body 2.

Note that in the present invention, the Ni layer is a metal layer containing 90% by weight or more of Ni. Further, the Pt layer is a metal layer containing 90% by weight or more of Pt. Further, the Pd layer is a metal layer containing 90% by weight or more of Pd. This functions as a barrier layer, but it is thought that it can function as a barrier layer by containing 90% by weight or more of Ni, Pt, Pd, or an alloy layer thereof.

In addition, as in the first embodiment, the prism 41 can be bonded to a package or the like without melting and flowing the entire adhesive film 43. Therefore, the positional accuracy of the prism 41 can be effectively improved.

(Sixth embodiment)
FIG. 7 is a sectional view of a prism according to a sixth embodiment of the invention. As shown in FIG. 7, the prism 51 of this embodiment differs from the first embodiment in that the reflective film 4 is provided on the slope 2b and upper surface 2c of the prism body 2. Specifically, the reflective film 4 is continuously provided from the slope 2b to the upper surface 2c. In other respects than the above, the prism 51 of this embodiment has the same configuration as the prism 1 of the first embodiment.

Also in this embodiment, since the same adhesive film 3 as in the first embodiment is provided, the positional accuracy of the prism 51 can be effectively improved.

It is desirable that the prism 51 be mounted while visually checking the position of the prism 51 using a camera. Thereby, the positional accuracy of the prism 51 can be improved. Furthermore, in this embodiment, a reflective film 4 is provided on the upper surface 2c of the prism body 2. As a result, the light is reflected by the reflective film 4 toward the camera. Therefore, the brightness of the prism 51 can be increased, and the prism 51 can be easily recognized by a camera. Therefore, the position of the prism 51 can be confirmed more reliably, and the positional accuracy of the prism 51 can be improved more reliably.

In this embodiment, the reflective film 4 is provided on the entire upper surface 2c of the prism body 2. However, the reflective film 4 may be provided on a part of the upper surface 2c. In a prism 61 according to a modification of the sixth embodiment shown in FIG. 8, the reflective film 4 extends from the slope of the prism body 2 to a part of the upper surface 2c. Even in this case, the position can be confirmed more reliably during mounting, and the positional accuracy of the prism 61 can be more reliably improved.

In the prism 51 shown in FIG. 7, the reflective film 4 on the slope 2b and the upper surface 2c is provided as one piece. Note that the reflective film 4 provided on the slope 2b and the reflective film 4 provided on the upper surface 2c may be separate bodies.

(optical device)
(Seventh embodiment)
FIG. 9 is a cross-sectional view of an optical device according to a seventh embodiment of the present invention. As shown in FIG. 9, the optical device 70 includes the prism 1 of the first embodiment, an optical element 74, and a package 75 that accommodates the prism 1 and the optical element 74.

In this embodiment, the optical element 74 is a light source that emits light to the prism 1. Although the light source is not particularly limited, for example, an LD, an LED (Light Emitting Diode), or the like can be used. Note that the optical element 74 may be a light receiving element that receives light from the prism 1.

The package 75 is a container-shaped member having a bottom portion 76 and a side wall portion 77 disposed on the bottom portion 76 . The package 75 is made of, for example, a ceramic material, and specifically, made of alumina, aluminum nitride, or the like. The bottom portion 76 has a mounting surface 76a. The optical element 74 and the prism 1 are arranged on the mounting surface 76a of the bottom part 76. The side wall portion 77 has an inner surface 77a and an outer surface. A metal film 78 is provided on the mounting surface 76a of the bottom portion 76 and the inner surface 77a of the side wall portion 77. Specifically, in this embodiment, the metal film 78 is an Au film. Note that the metal film 78 is not limited to an Au film.

The prism 1 is bonded to the mounting surface 76a of the package 75 via the adhesive film 3. The optical element 74 may be bonded to the mounting surface 76a by, for example, solder, although this is not particularly limited.

The package 75 does not necessarily have to include the metal film 78. However, it is preferable that the package 75 has the metal film 78 as in this embodiment. By alloying the adhesive film 3 of the prism 1 and the metal film 78, the bonding force between the prism 1 and the package 75 can be increased more reliably and effectively. Such a configuration is particularly effective when the difference in thermal expansion coefficient between the prism 1 and the package 75 is relatively large.

Preferably, the metal film 78 is an Au film. Thereby, the metal film 78 is difficult to oxidize. Therefore, when manufacturing the optical device 70, the bonding force between the prism 1 and the package 75 can be increased more reliably.

In this embodiment, a metal film 78 is provided on the entire surface of the mounting surface 76a of the bottom portion 76 and on the inner surface 77a of the side wall portion 77. However, it is sufficient that the metal film 78 is provided at least in the portion where the prism 1 is arranged.

A lid 79 is provided on the side wall portion 77 of the package 75 so as to seal the optical element 74 and the prism 1. Although the lid body 79 is not particularly limited, it is a glass lid in this embodiment.

Although the method of joining the lid 79 and the package 75 is not particularly limited, in this embodiment, for example, they are joined by SnNi bonding. In this case, since no gas is generated after bonding, impurities are less likely to adhere to the reflective film 4 of the prism 1, and reflectance is less likely to deteriorate. The above bonding method is an example, and bonding may be performed by SnAg bonding or SnAgCu bonding.

As shown in FIG. 9, light A emitted from the optical element 74 is reflected by the prism 1, passes through the lid 79, and is emitted to the outside of the optical device 70.

Since the optical device 70 includes the prism 1 of the first embodiment, the positional accuracy of the prism 1 in the optical device 70 can be effectively improved.

The optical device 70 may be used as a multi-chip. The multi-chip includes, for example, a mounting board and a plurality of optical devices 70 arranged on the mounting board. Since a multi-chip optical device includes the prism 1 of the first embodiment, the positional accuracy of the prism 1 can be effectively improved even in a multi-chip device.

(prism)
(Eighth embodiment)
FIG. 10 is a cross-sectional view of a prism according to the eighth embodiment. As shown in FIG. 10, the prism of this embodiment differs from the first embodiment in that the second layer portion 86A of the adhesive film 83A includes a stress relaxation layer 87A. Specifically, the stress relaxation layer 87A corresponds to the third layer, which is one of the plurality of Au layers. In other respects than the above, the prism of this embodiment has the same configuration as the prism 1 of the first embodiment.

The thickness of the stress relaxation layer 87A is different from the average thickness of the other Au layers, the first layer 6a and the fifth layer 6e. More specifically, the thickness of the stress relaxation layer 87A is thicker than the average thickness of the other Au layers in the second layer portion 86A.

Here, the Au layer and the Sn layer have stresses in opposite directions. If the stress in one of the Au layer and the Sn layer in the second layer portion is greater than the stress in the other, stress will be applied to the package when the prism is joined to the package. As the number of Au layers and Sn layers in the second layer portion increases, the stress increases.

In contrast, in this embodiment, the second layer portion 86A has a stress relaxation layer 87A. Thereby, the magnitude relationship between the total stress of the plurality of Au layers and the total stress of the plurality of Sn layers can be brought close to being equal. Therefore, stress applied to the package when the prism is mounted can be alleviated. Therefore, the prism is difficult to peel off from the package.

Since the adhesive film 83A has the stress relaxation layer 87A, the total stress of the Au layer can be adjusted to a large value, so this embodiment is suitable when the total stress of the Sn layer is large. The thickness of the stress relaxation layer 87A is preferably 1/2 or more and 5 times or less of the average thickness of the other Au layers. Thereby, when the prism is mounted on a package or the like, stress applied to the package or the like can be effectively alleviated, and peeling of the prism from the package or the like can be effectively suppressed.

For example, the thicknesses of the plurality of Au layers other than the stress relaxation layer 87A may be made uniform, and the thicknesses of the plurality of Sn layers may be made uniform. In this case, when forming the adhesive film 93, only the thickness of the stress relaxation layer 87A may be made different from the thickness of the other Au layers. Therefore, the manufacturing process can be simplified. Therefore, productivity can be increased, and the prism is less likely to peel off from the package or the like. However, the thicknesses of the plurality of Au layers and the thicknesses of the plurality of Sn layers other than the stress relaxation layer 87A may not be uniform.

Furthermore, in this embodiment as well, as in the first embodiment, the prism can be bonded to a package or the like without melting the adhesive film 83A. Therefore, the positional accuracy of the prism can be effectively improved.

Below, ninth to eleventh embodiments that differ from this embodiment only in the structure of the stress relaxation layer will be shown. In the ninth to eleventh embodiments, as in the present embodiment, the positional accuracy of the prism can be effectively improved, and the prism is difficult to peel off from the package or the like.

(Ninth embodiment)
FIG. 11 is a sectional view of a prism according to the ninth embodiment. As shown in FIG. 11, also in this embodiment, the stress relaxation layer 87B in the second layer portion 86B of the adhesive film 83B corresponds to the third layer, which is one of the plurality of Au layers. The thickness of the stress relaxation layer 87B is thinner than the average thickness of the Au layers other than the stress relaxation layer 87B in the second layer portion 86A.

Since the adhesion film 83B has the stress relaxation layer 87B, the total stress of the Au layer can be adjusted to a smaller value, so this embodiment is suitable when the total stress of the Sn layer is small. The thickness of the stress relaxation layer 87B is preferably 1/5 or more and 1/2 or less, more preferably 1/5 or more and 1/4 or less of the average thickness of the other Au layers. Thereby, when the prism is mounted on a package or the like, stress applied to the package or the like can be effectively alleviated, and peeling of the prism from the package or the like can be effectively suppressed.

(Tenth embodiment)
FIG. 12 is a cross-sectional view of a prism according to the tenth embodiment. As shown in FIG. 12, the stress relaxation layer 87C in the second layer portion 86C of the adhesive film 83C of this embodiment corresponds to a fourth layer that is one of the plurality of Sn layers. The thickness of the stress relaxation layer 87C is thicker than the average thickness of the Sn layers other than the stress relaxation layer 87C in the second layer portion 86C.

Since the adhesive film 83C has the stress relaxation layer 87C, the total stress of the Sn layer can be adjusted to be large, so this embodiment is suitable when the total stress of the Au layer is large. The thickness of the stress relaxation layer 87C is preferably 1/2 or more and 5 times or less of the average thickness of the other Sn layers. Thereby, when the prism is mounted on a package or the like, stress applied to the package or the like can be effectively alleviated, and peeling of the prism from the package or the like can be effectively suppressed.

(Eleventh embodiment)
FIG. 13 is a cross-sectional view of a prism according to the eleventh embodiment. As shown in FIG. 13, also in this embodiment, the stress relaxation layer 87D in the second layer portion 86D of the adhesive film 83D corresponds to the fourth layer, which is one of the plurality of Sn layers. The thickness of the stress relaxation layer 87D is thinner than the average thickness of the Sn layers other than the stress relaxation layer 87D in the second layer portion 86D.

Since the adhesion film 83D has the stress relaxation layer 87D, the total stress of the Sn layer can be adjusted to a smaller value, so this embodiment is suitable when the total stress of the Au layer is small. The thickness of the stress relaxation layer 87D is preferably 1/5 or more and 1/2 or less, more preferably 1/5 or more and 1/3 or less of the average thickness of the other Sn layers. Thereby, when the prism is mounted on a package or the like, stress applied to the package or the like can be effectively alleviated, and peeling of the prism from the package or the like can be effectively suppressed.

In each of the embodiments described above, examples have been given in which the second layer portion of the adhesive film includes at least one of the Au layer and the Sn layer. Note that in the second layer portion of the adhesive film, the Au layer and the Sn layer may be alloyed. An example of this is shown below.

(12th embodiment)
FIG. 14 is a cross-sectional view of a prism according to the twelfth embodiment. As shown in FIG. 14, this embodiment is different from the first layer in that the second layer portion 96 is an Au-Sn layer made of an alloy of Au and Sn and that the adhesive film 93 has an outermost layer portion 98. Different from the embodiment. The outermost layer portion 98 is laminated onto the second layer portion 96. The outermost layer portion 98 is an Au layer. In other respects than the above, the prism 91 of this embodiment has the same configuration as the prism 1 of the first embodiment.

In forming the second layer portion 96 of the adhesive film 93, for example, Au layers and Sn layers may be alternately stacked, and then the stacked Au layers and Sn layers may be heated. Thereby, the second layer portion 96 can be formed by alloying the Au layer and the Sn layer.

In this embodiment, the outermost layer portion 98 is the outermost layer of the adhesive film 93. The outermost layer portion 98 can be formed by, for example, a sputtering method, a vacuum evaporation method, or the like. Note that the adhesive film 93 does not need to have the outermost layer portion 98. In this case, similarly to the other first embodiments, the outermost layer of the second layer portion is the outermost layer of the adhesive film. Specifically, when the second layer portion 96 is an Au-Sn layer and does not have the outermost layer portion 98 as in this embodiment, the Au-Sn layer is the outermost layer.

The prism 91 is mounted in a package or the like like the prisms of other embodiments. Also in this embodiment, the prism 91 can be bonded to a package or the like without melting and flowing the entire adhesive film 93. Therefore, the positional accuracy of the prism 91 can be effectively improved.

The thickness of the second layer portion 96 of the adhesive film 93 is preferably 2.5 μm or more and 5.9 μm or less. Thereby, when mounting the prism 91 on a package or the like, the bonding force of the adhesive film 93 can be sufficiently increased. Note that the thickness of the first layer portion is preferably 0.1 or more and 0.5 μm or less. The total thickness of the adhesive film is preferably 3 μm or more and 6 μm or less.

It is preferable that the adhesive film 93 has an outermost layer portion 98 as in this embodiment. In this embodiment, an outermost layer portion 98, which is an Au layer, is laminated on a second layer portion 96, which is an Au-Sn layer. In this case, the portion that comes into contact with the package etc. during mounting is the outermost layer portion 98. Therefore, the adhesive film 93 is less likely to be oxidized during mounting, and the bonding force of the adhesive film 93 can be increased more reliably.

Also in this embodiment, as in the fifth embodiment, an intermediate layer portion may be laminated between the first layer portion 5 and the second layer portion 96. This makes it difficult for the metal of the second layer portion 96 to diffuse into the first layer portion 5. Therefore, the adhesive film 93 is difficult to peel off from the prism body 2.

(13th embodiment)
FIG. 15 is a cross-sectional view of a prism according to the thirteenth embodiment. As shown in FIG. 15, this embodiment differs from the first embodiment in that a protective film 105 is provided on the ridgeline between the bottom surface 2a and the slope 2b of the prism body 2. In other respects than the above, the prism of this embodiment has the same configuration as the prism 1 of the first embodiment.

The protective film 105 is provided integrally with the reflective film 4. The protective film 105 is connected to the adhesive film 3. Note that the protective film 105 does not necessarily have to be connected to the adhesive film 3. The protective film 105 can be formed by, for example, a sputtering method, a vacuum evaporation method, or the like. When the protective film 105 is integrated with the reflective film 4 as in this embodiment, the protective film 105 can be formed at the same time as the reflective film 4.

However, the protective film 105 may be provided separately from the reflective film 4. Alternatively, the protective film 105 may be provided integrally with the adhesive film 3. In this case, the protective film 105 may or may not be connected to the reflective film 4. When the protective film 105 is integrated with the adhesive film 3, the protective film 105 has at least one layer among the plurality of layers similar to the adhesive film 3.

Since the prism has the protective film 105, the prism body 2 is less likely to be chipped. It is preferable that the protective film 105 is connected to both the reflective film 4 and the adhesive film 3. This makes it even more difficult for the prism body 2 to be chipped.

Also in this embodiment, as in the first embodiment, the prism can be bonded to a package or the like without melting the adhesive film 3. Therefore, the positional accuracy of the prism can be effectively improved.

(Evaluation of bonding force)
In the prism 1 of the first embodiment shown in FIG. 1, the arithmetic mean roughness Ra of the outermost layer of the second layer portion 6 as the outermost layer of the adhesive film 3 was varied to check the bondability with the package. did. Note that the outermost layer of the adhesive film 3 was an Au layer. Specifically, when the arithmetic mean roughness Ra of the outermost layer is Ra, Ra≦0.05, 0.05<Ra≦0.09, 0.09<Ra≦0.15, 0.15< Ra≦0.20. Note that the arithmetic mean roughness Ra in this specification is based on JIS B 0601:2013.

In checking the bondability, an aluminum nitride substrate having an Au-plated portion was used as a package. The prism 1 was bonded to the Au-plated portion of the aluminum nitride substrate by heating it to about 320°C. After that, force was applied from the side of prism 1. Specifically, the prism 1 is heated until the adhesive film 3 of the prism 1 peels off from the aluminum nitride substrate, or until the prism body 2 peels off from the adhesive film 3, or until no peeling occurs and the prism body 2 is destroyed. added force. Confirmation of bondability was performed 15 times in each case with different arithmetic mean roughness Ra. The results are shown in Table 1.

In Table 1, the evaluation of bondability is the highest for ◎, the second highest for ○, and the lowest for Δ. "No peeling" means that the adhesive film 3 has not peeled off from the package, and includes cases where the prism body 2 is destroyed or where the prism body 2 is peeled off from the adhesive film 3. "Partially peeled off" means that a part of the adhesive film 3 has peeled off from the package.

As shown in Table 1, in all cases where the arithmetic mean roughness Ra of the outermost layer of the adhesive film 3 was changed, there was "no peeling" or "partial peeling", and the adhesive film 3 was completely removed from the package. It can be seen that it has not peeled off. Furthermore, it can be seen that the smaller the value of the arithmetic mean roughness Ra of the outermost layer, the higher the percentage of "no peeling".

The arithmetic mean roughness Ra of the outermost layer of the adhesive film 3 is 0.20. It is preferably at most μm, more preferably at most 0.15 μm, even more preferably at most 0.09 μm, particularly preferably at most 0.05 μm. Thereby, the adhesion between the package and the like and the adhesive film 93 can be further effectively increased during mounting. Therefore, the bonding force can be increased even more effectively.

Similarly, in the twelfth embodiment shown in FIG. 14, even when the adhesive film 93 does not have the outermost layer portion 98, the arithmetic mean roughness Ra of the second layer portion 96 as the outermost layer of the adhesive film 93 is preferably within the above range. Thereby, the bonding force can be increased even more effectively.

(Evaluation of stress)
The magnitude of stress on the prism adhesion film was evaluated. A prism base material 91A shown in FIG. 16 with both side surfaces extending in opposing directions was attached to a dicing sheet. Next, the prism base material 91A was cut along the dashed line II to separate the prism into individual pieces. Note that the prism after being singulated has the same configuration as the prism of the twelfth embodiment shown in FIG. 14. If the stress of the adhesive film 93 on the package is large, the prisms are likely to peel off because the impact when the stress is released during singulation is large. Therefore, the greater the rate of peeling, the greater the stress in the adhesive film 93.

The stress evaluation was performed under Conditions 1 to 4 while varying the thickness of the second layer portion 96 of the adhesive film 93. Specifically, in Condition 1, the thickness of the second layer portion 96 was 3 μm, and in Conditions 2 to 4, the thickness of the second layer portion 96 was 6 μm. Furthermore, under conditions 3 and 4, heat treatment was performed before attaching the prism base material 91A to the dicing sheet. Specifically, under condition 3, the heat treatment was performed at 200° C. for 2 hours in a nitrogen atmosphere. Under condition 4, heat treatment was performed at 200° C. for 5 hours under a nitrogen atmosphere. Table 2 shows the results of stress magnitude evaluation.

In Table 2, the stress is the smallest in the case of ◎, the next smallest in the case of ◯, and the largest in the case of △.

As shown in Table 2, under all conditions 1 to 4, the peeling of the prism 91 from the package was suppressed to 50% or less. Furthermore, when comparing conditions 1 and 2 in which the second layer portion 96 has a different thickness, the stress is even smaller in condition 1 where the second layer portion 96 is thin. Thus, it can be seen that the thinner the second layer portion 96 is, the smaller the stress in the adhesive film 93 is. The thickness of the second layer portion 96 of the adhesive film 93 is preferably 6 μm or less, more preferably 3 μm or less. Thereby, stress can be further reduced.

Comparing conditions 2 and 3 in which the thickness of the second layer portion 96 is the same, stress is even smaller in condition 3 in which heat treatment is performed before the prism base material 91A is attached to the dicing sheet. Furthermore, when comparing conditions 3 and 4 in which the thickness of the second layer portion 96 is the same and the heat treatment is performed, the stress is even smaller in condition 4 where the heat treatment takes a longer time. Thus, it can be seen that the longer the heat treatment time is, the more stress can be suppressed. It is preferable to perform heat treatment before pasting the prism on the dicing sheet, and it is preferable to perform the above heat treatment for about 2 to 5 hours. Thereby, stress can be suppressed even more effectively.

1, 11, 21, 31, 41, 51, 61, 91... Prism 2... Prism body 2a... Bottom surface 2b... Slope 2c... Top surface 3, 13, 23, 33, 43, 83A to 83D, 93... Adhesive film 4... Reflective film 5...First layer portion 6, 16, 26, 36, 86A to 86D, 96...Second layer portion 6a, 16a, 26a, 36a...First layer 6b, 16b, 26b, 36b...Second Layers 6c, 16c, 26c, 36c... Third layer 6d, 16d, 26d, 36d... Fourth layer 6e, 16e, 26e, 36e... Fifth layer 47... Intermediate layer portion 70... Optical device 74... Optical Element 75...Package 76...Bottom 76a...Mounting surface 77...Side wall 77a...Inner surface 78...Metal film 79...Lid 87A to 87D...Stress relaxation layer 98...Outermost layer portion 91A...Prism base material 105...Protective film

Claims (22)

a prism body having a bottom surface and a slope connected to the bottom surface;
an adhesive film provided on the bottom surface;
Equipped with
The adhesive film has a first layer portion located on the prism body side and a second layer portion laminated directly or indirectly on the first layer portion,
The first layer portion is a Cr layer, a Ti layer or a Ta layer,
The second layer portion has both a plurality of Au layers and a plurality of Sn layers,
In the stacking direction of the adhesive film, when the side away from the prism body is defined as the outside, the outermost layer of the second layer portion is the Au layer ,
A prism , wherein the Au layer and the Sn layer are alternately stacked, and an Au-Sn layer made of an alloy of Au and Sn is provided between the Au layer and the Sn layer. The second layer portion includes both the plurality of Au layers and the plurality of Sn layers, the Au layers and the Sn layers are alternately stacked,
the second layer portion has a stress relaxation layer;
When the stress relaxation layer is one of the plurality of Au layers, the thickness of the stress relaxation layer is different from the average thickness of the other Au layers,
The prism according to claim 1 , wherein when the stress relaxation layer is one of the plurality of Sn layers, the thickness of the stress relaxation layer is different from the average thickness of the other Sn layers. The prism according to claim 2 , wherein the stress relaxation layer has a thickness that is 1/2 or more and 5 times or less of the average thickness of the other Au layer or the other Sn layer. The prism according to claim 2 , wherein the stress relaxation layer has a thickness that is 1/5 or more and 1/2 or less of the average thickness of the other Au layer or the other Sn layer. According to claim 1, the outermost layer of the second layer portion is the thinnest layer in the second layer portion when the side away from the prism body is defined as the outer side in the stacking direction of the adhesive film. prism. The prism according to claim 5 , wherein in the second layer portion, the outer layer is thinner. The second layer portion includes both the plurality of Au layers and the plurality of Sn layers,
The prism according to claim 1 , wherein the plurality of Au layers have the same thickness, and the thickness of the plurality of Sn layers increases as they are located on the outer side. The second layer portion includes both the plurality of Au layers and the plurality of Sn layers,
The prism according to claim 1 , wherein the thickness of the plurality of Au layers is thinner toward the outer side, and the thickness of the plurality of Sn layers is the same. The prism according to any one of claims 1 to 8 , wherein the total number of the Au layer and the Sn layer in the second layer portion is 3 or more and 99 or less. The prism according to claim 9 , wherein the total number of the Au layer and the Sn layer in the second layer portion is 15 or more and 35 or less. The prism according to any one of claims 1 to 10, wherein the total thickness of the adhesive film is 1 μm or more and 10 μm or less. the second layer portion has both the Au layer and the Sn layer,
The total weight of Au in the second layer portion is M _A , the total weight of Sn is M _S , and the ratio of the weight of Au to the total weight of Au and Sn is M _A /(M _A +M _S ). The prism according to any one of claims 1 to 11 , wherein the ratio M _A /(M _A +M _S ) is 0.65 or more and 0.78 or less. Any one of claims 1 to 12 , wherein in the stacking direction of the adhesive film, the outermost layer of the adhesive film has an arithmetic mean roughness Ra of 0.20 μm or less, when the side away from the prism body is defined as the outside. The prism described in Section. The prism according to any one of claims 1 to 13 , wherein the adhesive film further includes an intermediate layer portion laminated between the first layer portion and the second layer portion. The prism according to claim 14 , wherein the intermediate layer portion is a Ni layer, a Pt layer, a Pd layer, a Ni-Cr mixed layer, or an alloy layer combining these. the prism body has an upper surface;
The prism according to any one of claims 1 to 15 , wherein the top surface faces the bottom surface and is connected to the slope. The prism according to any one of claims 1 to 16 , wherein a reflective film is provided on the slope of the prism body. The prism according to claim 16 , wherein a reflective film is provided on the slope and the upper surface of the prism body. The prism according to any one of claims 1 to 18 ,
an optical element that emits light to the prism or receives light from the prism;
a package containing the prism and the optical element;
Equipped with
An optical device, wherein the prism is bonded to the package by the adhesive film. A method for manufacturing a prism, comprising the step of providing an adhesive film on the bottom surface of a prism body having a bottom surface and a slope connected to the bottom surface,
The step of providing the adhesive film includes forming a first layer portion made of a metal material on the bottom surface, and directly or indirectly forming a second layer portion made of a metal material on the first layer portion. including a step of laminating,
The first layer portion and the second layer portion are made of metal materials with mutually different components,
The first layer portion is a Cr layer, a Ti layer or a Ta layer,
The second layer portion has both a plurality of Au layers and a plurality of Sn layers,
In the stacking direction of the adhesive film, when the side away from the prism body is defined as the outside, the outermost layer of the second layer portion is the Au layer ,
A method for manufacturing a prism , wherein the Au layer and the Sn layer are alternately stacked, and an Au--Sn layer made of an alloy of Au and Sn is provided between the Au layer and the Sn layer. preparing a prism according to any one of claims 1 to 18 ;
preparing a package having an adhesive surface with the prism;
bringing the prism and the package into contact so that the adhesive film comes into contact with the adhesive surface of the package;
heating the adhesive film to bond the prism and the package;
A method for manufacturing a packaged device, comprising: An Au film is formed on the adhesive surface of the package,
22. The method for manufacturing a packaged device according to claim 21 , wherein the heating is performed at a temperature that does not melt the entire adhesive film to bond the prism and the package.

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