TW202028865A - 感光性絕緣膜組成物 - Google Patents

感光性絕緣膜組成物 Download PDF

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Publication number
TW202028865A
TW202028865A TW108136533A TW108136533A TW202028865A TW 202028865 A TW202028865 A TW 202028865A TW 108136533 A TW108136533 A TW 108136533A TW 108136533 A TW108136533 A TW 108136533A TW 202028865 A TW202028865 A TW 202028865A
Authority
TW
Taiwan
Prior art keywords
group
photosensitive resin
resin composition
general formula
carbon atoms
Prior art date
Application number
TW108136533A
Other languages
English (en)
Chinese (zh)
Inventor
服部隼人
大橋拓矢
臼井友輝
澤田和宏
遠藤雅久
坂口崇洋
平佐田一樹
Original Assignee
日商日產化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日產化學股份有限公司 filed Critical 日商日產化學股份有限公司
Publication of TW202028865A publication Critical patent/TW202028865A/zh

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW108136533A 2018-10-15 2019-10-09 感光性絕緣膜組成物 TW202028865A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018194130 2018-10-15
JP2018-194130 2018-10-15

Publications (1)

Publication Number Publication Date
TW202028865A true TW202028865A (zh) 2020-08-01

Family

ID=70283803

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108136533A TW202028865A (zh) 2018-10-15 2019-10-09 感光性絕緣膜組成物

Country Status (3)

Country Link
JP (1) JP7331860B2 (https=)
TW (1) TW202028865A (https=)
WO (1) WO2020080207A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7431241B2 (ja) * 2019-07-29 2024-02-14 旭化成株式会社 ネガ型感光性樹脂組成物、ポリイミドの製造方法、硬化レリーフパターンの製造方法、及び半導体装置
JPWO2022162895A1 (https=) * 2021-01-29 2022-08-04
JP7683276B2 (ja) * 2021-03-30 2025-05-27 味の素株式会社 感光性樹脂組成物
JPWO2023106101A1 (https=) * 2021-12-09 2023-06-15
KR102803377B1 (ko) * 2022-02-17 2025-05-02 아사히 가세이 가부시키가이샤 감광성 수지 조성물, 폴리이미드 경화막, 및 이들의 제조 방법
EP4503100A4 (en) * 2022-03-31 2026-03-18 Nissan Chemical Corp POLYMER FILM FORMING COMPOSITION AND SELECTIVE POLYMER FILM FORMING PROCESS

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5125747B2 (ja) * 2007-05-25 2013-01-23 東レ株式会社 感光性樹脂組成物
JP2010211095A (ja) * 2009-03-12 2010-09-24 Toray Ind Inc 感光性カバーレイ
TWI440656B (zh) 2009-11-16 2014-06-11 Asahi Kasei E Materials Corp A polyimide precursor and a photosensitive resin composition comprising the polyimide precursor
KR101913997B1 (ko) 2009-12-04 2018-10-31 도레이 카부시키가이샤 감광성 수지 조성물, 그것을 이용한 적층체 및 고체 촬상 장치
JP6782298B2 (ja) * 2016-08-31 2020-11-11 富士フイルム株式会社 樹脂組成物およびその応用

Also Published As

Publication number Publication date
JP7331860B2 (ja) 2023-08-23
WO2020080207A1 (ja) 2020-04-23
JPWO2020080207A1 (ja) 2021-10-07

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