TW202016240A - 硬化性薄膜狀接著劑及裝置的製造方法 - Google Patents

硬化性薄膜狀接著劑及裝置的製造方法 Download PDF

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Publication number
TW202016240A
TW202016240A TW108126577A TW108126577A TW202016240A TW 202016240 A TW202016240 A TW 202016240A TW 108126577 A TW108126577 A TW 108126577A TW 108126577 A TW108126577 A TW 108126577A TW 202016240 A TW202016240 A TW 202016240A
Authority
TW
Taiwan
Prior art keywords
adhesive
film
activation temperature
compound
reaction activation
Prior art date
Application number
TW108126577A
Other languages
English (en)
Chinese (zh)
Other versions
TWI844553B (zh
Inventor
長谷川樹
西嶋健太
小宮山幹夫
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202016240A publication Critical patent/TW202016240A/zh
Application granted granted Critical
Publication of TWI844553B publication Critical patent/TWI844553B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/06—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW108126577A 2018-07-27 2019-07-26 硬化性薄膜狀接著劑及裝置的製造方法 TWI844553B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-140884 2018-07-27
JP2018140884 2018-07-27

Publications (2)

Publication Number Publication Date
TW202016240A true TW202016240A (zh) 2020-05-01
TWI844553B TWI844553B (zh) 2024-06-11

Family

ID=69180574

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108126577A TWI844553B (zh) 2018-07-27 2019-07-26 硬化性薄膜狀接著劑及裝置的製造方法

Country Status (5)

Country Link
JP (1) JP7372916B2 (ja)
KR (1) KR102687767B1 (ja)
CN (1) CN112469800B (ja)
TW (1) TWI844553B (ja)
WO (1) WO2020022485A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230234333A1 (en) * 2020-06-11 2023-07-27 Showa Denko Materials Co., Ltd. Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008074969A (ja) * 2006-09-21 2008-04-03 Toray Fine Chemicals Co Ltd 接着剤組成物
WO2008084843A1 (ja) * 2007-01-12 2008-07-17 Sekisui Chemical Co., Ltd. 電子部品用接着剤
TWI529186B (zh) * 2009-11-05 2016-04-11 日立化成股份有限公司 熱聚合系起始劑系統及黏著劑組成物
JP5693288B2 (ja) 2011-02-21 2015-04-01 日東電工株式会社 粘接着剤組成物、粘接着剤層、および粘接着シート
JP5796502B2 (ja) 2012-01-31 2015-10-21 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂の製造方法及びエポキシ樹脂組成物
US10047257B2 (en) * 2013-09-27 2018-08-14 Daicel Corporation Adhesive agent composition for multilayer semiconductor
JP2015038991A (ja) 2014-09-03 2015-02-26 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
WO2016158760A1 (ja) * 2015-03-31 2016-10-06 東レ株式会社 電子部品用樹脂シート、保護フィルム付電子部品用樹脂シートならびに半導体装置およびその製造方法
WO2017043405A1 (ja) * 2015-09-10 2017-03-16 ナミックス株式会社 樹脂組成物
TWI751989B (zh) * 2015-12-01 2022-01-11 日商琳得科股份有限公司 接著劑組成物、封密板片及封密體
JP2018046038A (ja) * 2016-09-12 2018-03-22 東レ株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JPWO2020022485A1 (ja) 2021-08-02
KR102687767B1 (ko) 2024-07-23
CN112469800B (zh) 2022-11-01
KR20210037604A (ko) 2021-04-06
TWI844553B (zh) 2024-06-11
JP7372916B2 (ja) 2023-11-01
WO2020022485A1 (ja) 2020-01-30
CN112469800A (zh) 2021-03-09

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