TW202003616A - Moisture-curable urethane hot melt resin composition and multilayer body - Google Patents

Moisture-curable urethane hot melt resin composition and multilayer body Download PDF

Info

Publication number
TW202003616A
TW202003616A TW108116170A TW108116170A TW202003616A TW 202003616 A TW202003616 A TW 202003616A TW 108116170 A TW108116170 A TW 108116170A TW 108116170 A TW108116170 A TW 108116170A TW 202003616 A TW202003616 A TW 202003616A
Authority
TW
Taiwan
Prior art keywords
moisture
general formula
resin composition
group
mass
Prior art date
Application number
TW108116170A
Other languages
Chinese (zh)
Inventor
三浦隆志
藤原豐邦
二宮淳
Original Assignee
日商Dic股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Dic股份有限公司 filed Critical 日商Dic股份有限公司
Publication of TW202003616A publication Critical patent/TW202003616A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/40Layered products comprising a layer of synthetic resin comprising polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • C08G18/32Polyhydroxy compounds; Polyamines; Hydroxyamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67Unsaturated compounds having active hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/17Amines; Quaternary ammonium compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Polyurethanes Or Polyureas (AREA)

Abstract

The present invention provides: a moisture-curable polyurethane hot melt resin composition which is characterized by containing (i) a urethane prepolymer having an isocyanate group, which uses, as essential starting materials, (A) a polyol, (B) a polyisocyanate and (C) a compound that has one or more polymerizable unsaturated groups and two or more hydroxyl groups, (ii) a photopolymerization initiator and (iii) a light stabilizer; and a multilayer body which comprises a layer of a cured product of this moisture-curable polyurethane hot melt resin composition. The present invention also provides a multilayer body which is characterized by comprising a base material and a layer of a cured product of the above-described moisture-curable urethane hot melt resin composition. It is preferable that the light stabilizer (iii) contains a hindered amine compound (iii-X) and/or a nitrogen-containing heterocyclic compound (iii-Y).

Description

濕氣硬化型胺基甲酸酯熱熔樹脂組成物、及積層體 Moisture-curable urethane hot-melt resin composition and laminate

本發明係關於一種濕氣硬化型胺基甲酸酯熱熔樹脂組成物、及積層體。 The present invention relates to a moisture-curable urethane hot-melt resin composition and a laminate.

將胺基甲酸酯預聚物作為主成分之濕氣硬化型胺基甲酸酯熱熔樹脂組成物係廣泛利用於金屬材料、木質材料、塑膠、橡膠、纖維製品、合成皮革、紙製品等接著,且在建材鑲板、裝飾板、汽車內裝材、衣料等各式各樣的領域活用。 Moisture-curable urethane hot-melt resin composition with urethane prepolymer as the main component is widely used in metal materials, wood materials, plastics, rubber, fiber products, synthetic leather, paper products, etc. Then, it is used in various fields such as building material paneling, decorative panels, automotive interior materials, and clothing.

濕氣硬化型胺基甲酸酯熱熔樹脂組成物的特徵有:與其它的熱熔接著劑同樣地為無溶劑,且除了藉由冷卻固化得到初期的接著強度之外,更藉由在接著後24~72小時左右的時間內,與空氣中或被接著體的濕氣進行反應,得到其它的熱熔接著劑無法展現之最終接著強度及耐熱性。然而,與其它的熱熔接著劑同樣地僅藉由冷卻固化,並不容易進一步提升初期的接著強度。 The characteristics of the moisture-curable urethane hot-melt resin composition are: it is solvent-free like other hot-melt adhesives, and in addition to the initial adhesive strength obtained by cooling and solidification, In the next 24 to 72 hours, it reacts with the moisture in the air or the adherend to obtain the final adhesion strength and heat resistance that other hot-melt adhesives cannot show. However, it is not easy to further improve the initial adhesive strength by cooling and solidifying like other hot-melt adhesives.

作為可解決該問題的方法,揭示一種使用丙烯酸2-羥乙酯等,在胺基甲酸酯預聚物的末端導入聚合性不飽和基的方法(參考例如,專利文獻1。)。該方法中,雖藉由紫外線硬化而可得到充分的初期接著強度,但有最終接著強度差之問題點。 As a method for solving this problem, there is disclosed a method of introducing a polymerizable unsaturated group at the end of a urethane prepolymer using 2-hydroxyethyl acrylate or the like (refer to, for example, Patent Document 1.). In this method, although sufficient initial adhesive strength can be obtained by ultraviolet curing, there is a problem that the final adhesive strength is poor.

再者,為了促進在各式各樣的領域之利用,對於紫外線暴露之耐候性的需要也提高,且要求滿足該等全部的材料之開發。 In addition, in order to promote the use in various fields, the need for weather resistance of ultraviolet exposure has also increased, and the development of materials satisfying all of them is required.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

專利文獻1 國際公開第2008/093653號 Patent Literature 1 International Publication No. 2008/093653

本發明欲解決的課題在於提供一種初期接著強度、及最終接著強度優異之濕氣硬化型胺基甲酸酯熱熔樹脂組成物。 The problem to be solved by the present invention is to provide a moisture-curable urethane hot-melt resin composition excellent in initial adhesive strength and final adhesive strength.

本發明提供一種濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物,其特徵為含有將多元醇(A)、聚異氰酸酯(B)、及具有1個以上之聚合性不飽和基,而且,具有2個以上之羥基的化合物(C)作為必要原料之具有異氰酸酯基的胺基甲酸酯預聚物(i)、及光聚合起始劑(ii);及具有其硬化物層之積層體。 The invention provides a moisture-curable polyurethane hot-melt resin composition, which is characterized by containing a polyol (A), a polyisocyanate (B), and one or more polymerizable unsaturated groups, and , A compound (C) having two or more hydroxyl groups as an essential raw material, an isocyanate group-containing urethane prepolymer (i), and a photopolymerization initiator (ii); and a laminate having its hardened layer body.

本發明的濕氣硬化型胺基甲酸酯熱熔樹脂組成物係初期接著強度、及最終接著強優異。又,在添加光安定劑時,進一步耐候性也優異。 The moisture-curable urethane hot-melt resin composition of the present invention is excellent in initial adhesion strength and final adhesion strength. In addition, when a light stabilizer is added, further weather resistance is also excellent.

[實施發明的形態] [Forms for carrying out the invention]

本發明的濕氣硬化型胺基甲酸酯熱熔樹脂組成物含有將多元醇(A)、聚異氰酸酯(B)、及具有1個以上之聚合性不飽和基,而且,具有2個以上之羥基的化合物(C)作為必要原料之具有異氰酸酯基的胺基甲酸酯預聚物(i)、及光聚合起始劑(ii)。 The moisture-curable urethane hot-melt resin composition of the present invention contains a polyol (A), a polyisocyanate (B), and one or more polymerizable unsaturated groups, and more than two A hydroxy compound (C) is used as an essential raw material, a urethane prepolymer (i) having an isocyanate group, and a photopolymerization initiator (ii).

前述胺基甲酸酯預聚物(i)為將多元醇(A)、聚異氰酸酯(B)、及具有1個以上之聚合性不飽和基,而且,具有2個以上之羥基的化合物(C)作為必要原料而得者,且具有異氰酸酯基。 The aforementioned urethane prepolymer (i) is a compound (C) comprising a polyol (A), a polyisocyanate (B), and one or more polymerizable unsaturated groups and more than two hydroxyl groups ) Is obtained as a necessary raw material and has an isocyanate group.

作為前述多元醇(A),可使用例如,聚酯多元醇、聚己內酯多元醇、聚醚多元醇、聚碳酸酯多元醇、丙烯酸多元醇、及聚胺基甲酸酯多元醇等。該等之多元醇可單獨使用,亦可併用2種以上。 As the above-mentioned polyol (A), for example, polyester polyol, polycaprolactone polyol, polyether polyol, polycarbonate polyol, acrylic polyol, polyurethane polyol, and the like can be used. These polyols can be used alone or in combination of two or more.

從可得到更為優異之皮膜的機械強度之觀點而言,作為前述多元醇(A)的數量平均分子量,較佳為300~150,000的範圍,更佳為500~100,000的範圍。再者,前述多元醇(A)的數量平均分子量表示藉由凝膠滲透層析(GPC)法測定的數值。 From the viewpoint of obtaining a more excellent mechanical strength of the film, the number average molecular weight of the polyol (A) is preferably in the range of 300 to 150,000, and more preferably in the range of 500 to 100,000. In addition, the number average molecular weight of the said polyol (A) shows the value measured by the gel permeation chromatography (GPC) method.

從可得到更為優異的接著強度、及皮膜的機械強度之觀點而言,作為前述多元醇(A)的使用量,較佳為濕氣硬化型胺基甲酸酯熱熔樹脂組成物中50~95質量%的範圍,更佳為60~90質量%的範圍。 From the viewpoint of obtaining more excellent adhesive strength and the mechanical strength of the film, the amount of the polyol (A) used is preferably 50% in the moisture-curable urethane hot-melt resin composition. The range of ~95 mass% is more preferably 60~90 mass%.

作為前述聚異氰酸酯(B),可使用例如,六亞甲基二異氰酸酯、環己烷二異氰酸酯、異佛酮二異氰酸酯、二環己基甲烷二異氰酸酯、四甲基苯二甲基二異氰酸酯等脂肪族聚異氰酸酯或脂環式聚異氰酸酯;聚亞甲基聚苯基聚異氰酸酯、二苯基甲烷二異氰酸酯、碳二亞胺改質二苯基甲烷二異氰酸酯異氰酸酯、二甲苯二異氰酸酯、苯二異氰酸酯、甲苯二異氰酸酯、萘二異氰酸酯等之芳香族聚異氰酸酯;該等之三聚異氰酸酯體等。該等之聚異氰酸酯可單獨使用,亦可併用2種以上。 As the polyisocyanate (B), for example, aliphatics such as hexamethylene diisocyanate, cyclohexane diisocyanate, isophorone diisocyanate, dicyclohexylmethane diisocyanate, and tetramethyl xylylene diisocyanate can be used. Polyisocyanate or alicyclic polyisocyanate; polymethylene polyphenyl polyisocyanate, diphenylmethane diisocyanate, carbodiimide modified diphenylmethane diisocyanate isocyanate, xylene diisocyanate, benzene diisocyanate, toluene Aromatic polyisocyanates such as diisocyanate, naphthalene diisocyanate, etc.; these three polyisocyanates. These polyisocyanates may be used alone or in combination of two or more.

從可得到更為優異的接著強度、及皮膜的機械強度之觀點而言,作為前述聚異氰酸酯(B)的使用量,較佳為濕氣硬化型胺基甲酸酯熱熔樹脂組成物中1~50質量%的範圍,更佳為3~40質量%的範圍。 From the viewpoint of obtaining more excellent adhesive strength and the mechanical strength of the film, the amount of the polyisocyanate (B) used is preferably moisture curable urethane hot-melt resin composition 1 The range of ~50% by mass, more preferably the range of 3~40% by mass.

前述化合物(C)具有1個以上之聚合性不飽和基,而且,具有2個以上之羥基。藉由將該化合物(C)作為胺基甲酸酯預聚物(i)的原料使用,可在胺基甲酸酯預聚物(i)的分子內部導入聚合性不飽和基,且藉由紫外線等照射,可得到優異的初期接著強度。再者,在胺基甲酸酯預聚物(i)的分子末端具有異氰酸酯基,因此藉由濕氣硬化,可得到優異的最終接著強度。 The aforementioned compound (C) has one or more polymerizable unsaturated groups and more than two hydroxyl groups. By using the compound (C) as a raw material for the urethane prepolymer (i), a polymerizable unsaturated group can be introduced into the molecule of the urethane prepolymer (i), and by Irradiation with ultraviolet rays or the like can provide excellent initial adhesion strength. In addition, since the urethane prepolymer (i) has an isocyanate group at the molecular terminal, it can be cured by moisture to obtain excellent final adhesion strength.

作為前述化合物(C),可使用例如,下述通式(1)所示之化合物、下述通式(2)所示之化合物、下述通式(3)所示之化合物、下述通式(4)所示之化合物、下述通式(5)所示之化合物、及下述通式(6)所示之化合物等。 As the aforementioned compound (C), for example, a compound represented by the following general formula (1), a compound represented by the following general formula (2), a compound represented by the following general formula (3), and the following general compounds can be used The compound represented by the formula (4), the compound represented by the following general formula (5), the compound represented by the following general formula (6), and the like.

HO-RHO-R 11 -OH (1)-OH (1)

(通式(1)中,R1表示在碳原子數1~9之直鏈伸烷基的側鏈具有1個以上之包含聚合性不飽和基的原子團之結構。) (In the general formula (1), R 1 represents a structure having at least one atomic group containing a polymerizable unsaturated group in the side chain of a linear alkylene group having 1 to 9 carbon atoms.)

HO-RHO-R 22 O-RO-R 33 -OR-OR 44 -OH (2)-OH (2)

(通式(2)中,R2及R4各自獨立且表示在伸乙基的側鏈具有包含聚合性不飽和基的原子團之結構,R3表示碳原子數1~5的伸烷基。) (In the general formula (2), R 2 and R 4 are independent of each other and represent a structure having an atomic group containing a polymerizable unsaturated group in the ethylidene side chain, and R 3 represents an alkylene group having 1 to 5 carbon atoms. )

Figure 108116170-A0202-12-0005-1
Figure 108116170-A0202-12-0005-1

(通式(3)中,R5及R6各自獨立且表示氫原子或甲基,n表示1~3的整數。) (In the general formula (3), R 5 and R 6 are each independently and represent a hydrogen atom or a methyl group, and n represents an integer of 1 to 3.)

Figure 108116170-A0202-12-0005-3
Figure 108116170-A0202-12-0005-3

(通式(4)中,R7表示氫原子或甲基,n表示2~3的整數。) (In the general formula (4), R 7 represents a hydrogen atom or a methyl group, and n represents an integer of 2 to 3.)

Figure 108116170-A0202-12-0005-4
Figure 108116170-A0202-12-0005-4

(通式(5)中,R8、R9、及R10各自表示氫原子或甲基。) (In the general formula (5), R 8 , R 9 , and R 10 each represent a hydrogen atom or a methyl group.)

Figure 108116170-A0202-12-0005-7
Figure 108116170-A0202-12-0005-7

(通式(6)中,R11、R12、R13、及R14各自表示氫原子或甲基。) (In the general formula (6), R 11 , R 12 , R 13 , and R 14 each represent a hydrogen atom or a methyl group.)

前述通式(1)中的R1表示在碳原子數1~9之直鏈伸烷基的側鏈具有2個以上之包含聚合性不飽和基的原子團之結構。例如,新戊四醇二(甲基)丙烯酸酯,通式(1)中的R1為在碳原子數3之伸丙基的側鏈具有2個包含聚合性不飽和基的原子團之結構。 R 1 in the aforementioned general formula (1) represents a structure having two or more atomic groups including a polymerizable unsaturated group in the side chain of a linear alkylene group having 1 to 9 carbon atoms. For example, in neopentaerythritol di(meth)acrylate, R 1 in the general formula (1) is a structure having two atomic groups containing a polymerizable unsaturated group on the side chain of a propylene group having 3 carbon atoms.

作為前述通式(1)所示之化合物的具體例,可使用例如,新戊四醇二(甲基)丙烯酸酯[二羥甲基丙烷二(甲基)丙烯酸酯]、二羥甲基甲烷二(甲基)丙烯酸酯(通式(1)中的R1為碳原子數3者,且具有2個具有聚合性不飽和基之原子團。)、二羥乙基甲烷二(甲基)丙烯酸酯、二羥乙基丙烷二(甲基)丙烯酸酯(通式(1)中的R1為碳原子數5者,且具有2個具有聚合性不飽和基之原子團。)、二丙醇甲烷二(甲基)丙烯酸酯、二丙醇丙烷二(甲基)丙烯酸酯(通式(1)中的R1為碳原子數7者,且具有2個具有聚合性不飽和基之原子團。)、二丁醇甲烷二(甲基)丙烯酸酯、二丁醇丙烷二(甲基)丙烯酸酯(通式(1)中的R1為碳原子數9者,且具有2個具有聚合性不飽和基之原子團。)等。該等之化合物可單獨使用,亦可併用2種以上。從可得到更為優異的初期接著強度之觀點而言,該等之中,較佳為使用新戊四醇二(甲基)丙烯酸酯、及/或二羥甲基甲烷二(甲基)丙烯酸酯。 As specific examples of the compound represented by the aforementioned general formula (1), for example, neopentyl alcohol di(meth)acrylate [dimethylolpropane di(meth)acrylate], dimethylolmethane can be used Di(meth)acrylate (R 1 in the general formula (1) has 3 carbon atoms and has 2 atomic groups having a polymerizable unsaturated group.), dihydroxyethylmethane di(meth)acrylic acid Ester, dihydroxyethylpropane di(meth)acrylate (R 1 in the general formula (1) is 5 carbon atoms, and has two atomic groups having a polymerizable unsaturated group.), dipropanol methane Di(meth)acrylate, dipropanol propane di(meth)acrylate (R 1 in the general formula (1) is a carbon atom having 7 atoms, and has 2 atomic groups having a polymerizable unsaturated group.) , Dibutanol methane di (meth) acrylate, dibutanol propane di (meth) acrylate (R 1 in the general formula (1) is 9 carbon atoms, and has 2 with polymerizable unsaturated Radicals.) etc. These compounds may be used alone or in combination of two or more. From the viewpoint of obtaining more excellent initial adhesion strength, among these, it is preferable to use neopentaerythritol di(meth)acrylate and/or dimethylolmethane di(meth)acrylic acid ester.

再者,在本發明中,所謂「(甲基)丙烯酸酯」,係指丙烯酸酯及甲基丙烯酸酯之任一方或雙方。 In addition, in this invention, "(meth)acrylate" means either or both of acrylate and methacrylate.

前述通式(2)中的R2及R4為在伸乙基的側鏈具有包含聚合性不飽和基的原子團之結構。在前述通式(2)中,具有合計2個以上之在前述伸乙基的側鏈具有包含聚合性不飽和基的原子團之結構,較佳為具有2個以上5個以下的範圍,更佳為具有2個以上3個以下的範圍。 R 2 and R 4 in the general formula (2) have a structure having an atomic group containing a polymerizable unsaturated group in the ethylidene side chain. In the general formula (2), a structure having a total of 2 or more of the side chains of the ethylidene group having a polymerizable unsaturated group, preferably having a range of 2 or more and 5 or less, more preferably It has a range of 2 or more and 3 or less.

又,前述通式(2)中的R3表示碳原子數1~5的伸烷基,可舉出例如,亞甲基、伸乙基、伸丙基、伸丁基、戊基等。 In addition, R 3 in the general formula (2) represents an alkylene group having 1 to 5 carbon atoms, and examples thereof include methylene group, ethyl group, propyl group, butyl group, and pentyl group.

作為前述通式(2)所示之化合物的具體例,可使用例如,雙(3-丙烯醯氧基-2-羥基丙氧基)甲烷(通式(2)中的R2及 R4為碳原子數2者,且具有1個具有聚合性不飽和基之原子團,R3為碳原子數1者。)、1,2-雙(3-丙烯醯氧基-2-羥基丙氧基)乙烷(通式(2)中的R2及R4為碳原子數2者,且具有1個具有聚合性不飽和基之原子團,R3為碳原子數2者。)、1,3-雙(3-丙烯醯氧基-2-羥基丙氧基)丙烷(通式(2)中的R2及R4為碳原子數2者,且具有1個具有聚合性不飽和基之原子團,R3為碳原子數3者。)、1,4-雙(3-丙烯醯氧基-2-羥基丙氧基)丁烷(通式(2)中的R2及R4為碳原子數2者,且具有1個具有聚合性不飽和基之原子團,R3為碳原子數4者。)、1,5-雙(3-丙烯醯氧基-2-羥基丙氧基)戊烷(通式(2)中的R2及R4為碳原子數2者,且具有1個具有聚合性不飽和基之原子團,R3為碳原子數5者。)等。該等化合物可單獨使用,亦可併用2種以上。從可得到更為優異的初期接著強度之觀點而言,該等之中,較佳為使用1,4-雙(3-丙烯醯氧基-2-羥基丙氧基)丁烷。 As specific examples of the compound represented by the general formula (2), for example, bis(3-propenyloxy-2-hydroxypropoxy)methane (R 2 and R 4 in the general formula (2) are Those with 2 carbon atoms and one atomic group with a polymerizable unsaturated group, R 3 is one with 1 carbon atom.), 1,2-bis(3-propenyloxy-2-hydroxypropoxy) Ethane (R 2 and R 4 in the general formula (2) are 2 carbon atoms and have an atomic group having a polymerizable unsaturated group, and R 3 is 2 carbon atoms.), 1,3- Bis(3-propenyloxy-2-hydroxypropoxy)propane (R 2 and R 4 in the general formula (2) are those having 2 carbon atoms and one atomic group having a polymerizable unsaturated group, R 3 is those with 3 carbon atoms.), 1,4-bis(3-propenyloxy-2-hydroxypropoxy)butane (R 2 and R 4 in the general formula (2) are the number of carbon atoms 2 of which have an atomic group having a polymerizable unsaturated group, and R 3 is one having 4 carbon atoms.), 1,5-bis(3-propenyloxy-2-hydroxypropoxy)pentane ( In the general formula (2), R 2 and R 4 are those having 2 carbon atoms and one atomic group having a polymerizable unsaturated group, and R 3 is those having 5 carbon atoms.) and the like. These compounds may be used alone or in combination of two or more. From the viewpoint of obtaining more excellent initial adhesion strength, among these, 1,4-bis(3-propenyloxy-2-hydroxypropoxy)butane is preferably used.

從可得到更為優異的初期接著強度之觀點而言,作為前述化合物(C)的使用量,較佳為濕氣硬化型胺基甲酸酯熱熔樹脂組成物中0.01~50質量%的範圍,更佳為0.1~30質量%的範圍,進一步更佳為0.5~20質量%的範圍,特佳為1~15質量%的範圍。 From the viewpoint of obtaining more excellent initial adhesion strength, the amount of the compound (C) used is preferably in the range of 0.01 to 50% by mass in the moisture-curable urethane hot-melt resin composition. It is more preferably in the range of 0.1 to 30% by mass, still more preferably in the range of 0.5 to 20% by mass, and particularly preferably in the range of 1 to 15% by mass.

前述胺基甲酸酯預聚物(i)為使前述多元醇(A)與前述聚異氰酸酯(B)及前述化合物(C)進行反應而得者,且藉由使前述化合物(C)的羥基與聚異氰酸酯(B)進行反應,在分子內部導入聚合性不飽和基,而且,在分子末端具有可與存在於空氣中或塗布有胺基甲酸酯預聚物的基體中之水分進行反應而形成交聯結構之異氰酸酯基。 The urethane prepolymer (i) is obtained by reacting the polyol (A) with the polyisocyanate (B) and the compound (C), and by using the hydroxyl group of the compound (C) Reacts with polyisocyanate (B), introduces polymerizable unsaturated groups into the molecule, and has moisture at the molecular end that can exist in the air or the substrate coated with the urethane prepolymer An isocyanate group forming a cross-linked structure.

作為前述胺基甲酸酯預聚物(i)的製造方法,例如,可藉由在加入前述多元醇(A)及化合物(C)的反應容器,加入聚異氰酸酯(B),並以前述聚異氰酸酯(B)具有的異氰酸酯基,相對於前述多元醇(A)及化合物(C)具有的羥基變過剩的條件進行反應而製造。 As a method for producing the urethane prepolymer (i), for example, a polyisocyanate (B) may be added to the reaction vessel into which the polyol (A) and the compound (C) are added, and the The isocyanate group of the isocyanate (B) is produced by reacting under the conditions where the hydroxyl groups of the polyol (A) and the compound (C) become excessive.

從可得到更為優異的初期接著強度及最終接著強度之觀點而言,作為製造前述胺基甲酸酯預聚物(i)之際的前述聚異氰酸酯(B)具有之異氰酸酯基與前述多元醇(A)及化合物(C)具有之羥基的當量比(異氰酸酯基/羥基),較佳為1.1~10的範圍,更佳為1.15~8的範圍。 From the viewpoint of obtaining more excellent initial adhesion strength and final adhesion strength, the isocyanate group and the polyol which the polyisocyanate (B) has when producing the urethane prepolymer (i) The equivalent ratio of hydroxyl groups (isocyanate group/hydroxyl group) possessed by (A) and compound (C) is preferably in the range of 1.1 to 10, more preferably in the range of 1.15 to 8.

從可得到更為優異的最終接著強度之觀點而言,作為前述胺基甲酸酯預聚物(i)的異氰酸酯基含有率(以下簡稱為「NCO%」。),較佳為1~10質量%的範圍,更佳為1.5~8質量%的範圍。再者,前述胺基甲酸酯預聚物(i)的NCO%表示依據JISK1603-1:2007,藉由電位差滴定法測定的數值。 From the viewpoint that more excellent final adhesion strength can be obtained, the isocyanate group content of the urethane prepolymer (i) (hereinafter abbreviated as "NCO%") is preferably 1 to 10. The mass% range is more preferably 1.5 to 8 mass% range. In addition, the NCO% of the said urethane prepolymer (i) shows the value measured by the potentiometric titration method based on JISK1603-1:2007.

作為前述胺基甲酸酯預聚物(i)的聚合性不飽和基濃度,較佳為0.0004~2mol/kg的範圍,更佳為0.001~1mol/kg的範圍。再者,前述胺基甲酸酯預聚物(i)的聚合性不飽和基濃度表示基於使用的反應原料而算出的數值。 The concentration of the polymerizable unsaturated group in the urethane prepolymer (i) is preferably in the range of 0.0004 to 2 mol/kg, and more preferably in the range of 0.001 to 1 mol/kg. In addition, the polymerizable unsaturated group concentration of the said urethane prepolymer (i) shows the numerical value calculated based on the reaction raw material used.

作為前述光聚合起始劑(ii),可使用例如,1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥基乙氧基)苯基]-2-羥基-2-甲基-1-丙烷-1-酮、噻噸酮、噻噸酮衍生物、2,2’-二甲氧基-1,2-二苯基乙烷-1-酮、2,4,6-三甲基苯甲醯基二苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、2-甲基-1-[4-(甲硫基)苯基]-2-

Figure 108116170-A0202-12-0008-21
啉基-1-丙酮、2-苄基-2-二甲基 胺基-1-(4-
Figure 108116170-A0202-12-0009-20
啉基苯基)-丁烷-1-酮等。該等之光聚合起始劑可單獨使用,亦可併用2種以上。 As the aforementioned photopolymerization initiator (ii), for example, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 1-[4-(2 -Hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propane-1-one, thioxanthone, thioxanthone derivatives, 2,2'-dimethoxy-1,2 -Diphenylethane-1-one, 2,4,6-trimethylbenzyl diphenylphosphine oxide, bis(2,4,6-trimethylbenzyl) phenylphosphine oxide , 2-methyl-1-[4-(methylthio)phenyl]-2-
Figure 108116170-A0202-12-0008-21
Plinyl-1-acetone, 2-benzyl-2-dimethylamino-1-(4-
Figure 108116170-A0202-12-0009-20
Phenylphenyl)-butane-1-one and the like. These photopolymerization initiators may be used alone or in combination of two or more.

從可得到更為優異的紫外線硬化性之觀點而言,作為前述光聚合起始劑(ii)的使用量,較佳為多元醇(A)、聚異氰酸酯(B)、化合物(C)、光聚合起始劑(ii)及光安定劑(iii)之合計質量中0.0001~10質量%的範圍,更佳為0.005~5質量%的範圍。 From the viewpoint of obtaining more excellent ultraviolet curability, the amount of the photopolymerization initiator (ii) used is preferably polyol (A), polyisocyanate (B), compound (C), and light The total mass of the polymerization initiator (ii) and the light stabilizer (iii) is in the range of 0.0001 to 10% by mass, more preferably in the range of 0.005 to 5% by mass.

以得到更為優異的耐候性為前提,作為本發明的濕氣硬化型胺基甲酸酯熱熔樹脂組成物,較佳為含有光安定劑(iii)。再者,所謂本發明中之耐候性,意指尤其是太陽光的繼時照射所致之耐變色性,本發明的實施例係表示利用搭載最忠實模擬太陽光的短波長區域之295~365nm的UVA-340燈之QUV促進耐候性試驗機(Q-LAB Corporation公司製)之耐候性試驗的結果。 On the premise of obtaining more excellent weather resistance, the moisture-curable urethane hot-melt resin composition of the present invention preferably contains a light stabilizer (iii). Furthermore, the weather resistance in the present invention means especially the resistance to discoloration caused by the continuous irradiation of sunlight. The embodiments of the present invention indicate that the short-wavelength region equipped with the most faithful simulated sunlight is used at 295 to 365 nm. The result of the weather resistance test of the QUA accelerated weather resistance tester (manufactured by Q-LAB Corporation) of the UVA-340 lamp.

作為前述光安定劑(iii),可使用例如,受阻胺化合物(iii-X)、含氮雜環式化合物(iii-Y)、硫醇化合物、硫醚化合物、二苯甲酮化合物、苯甲酸酯化合物等。該等之光安定劑(iii)可單獨使用,亦可併用2種以上。從可得到更為優異的耐候性之觀點而言,該等之中,較佳為使用受阻胺化合物(iii-X)、及/或含氮雜環式化合物(iii-Y),更佳為併用受阻胺化合物(iii-X)與含氮雜環式化合物(iii-Y)。 As the aforementioned light stabilizer (iii), for example, a hindered amine compound (iii-X), a nitrogen-containing heterocyclic compound (iii-Y), a thiol compound, a thioether compound, a benzophenone compound, benzophenone can be used Ester compounds, etc. These light stabilizers (iii) may be used alone or in combination of two or more. From the viewpoint of obtaining more excellent weather resistance, among these, it is preferable to use a hindered amine compound (iii-X) and/or a nitrogen-containing heterocyclic compound (iii-Y), and more preferably The hindered amine compound (iii-X) and the nitrogen-containing heterocyclic compound (iii-Y) are used in combination.

作為前述受阻胺化合物(iii-X),可使用例如,癸二酸雙(2,2,6,6-四甲基-4-哌啶基)、癸二酸雙(1,2,2,6,6-五甲基哌啶-4-基)、肆(2,2,6,6-四甲基-4-哌啶基)1,2,3,4-丁烷四羧酸酯、肆(1,2,2,6,6-五甲基-4-哌啶基)1,2,3,4-丁烷四羧酸酯、(混 合2,2,6,6-四甲基-4-哌啶基/十三基)1,2,3,4-丁烷四羧酸酯、(混合1,2,2,6,6-五甲基-4-哌啶基/十三基)1,2,3,4-丁烷四羧酸酯、8-乙醯基-3-十二基-7,7,9,9-四甲基-1,3,8-三氮雜螺[4.5]癸烷-2,4-二酮等。該等之化合物可單獨使用,亦可併用2種以上。 As the hindered amine compound (iii-X), for example, sebacic acid bis(2,2,6,6-tetramethyl-4-piperidyl), sebacic acid bis(1,2,2, 6,6-pentamethylpiperidin-4-yl), (2,2,6,6-tetramethyl-4-piperidinyl) 1,2,3,4-butane tetracarboxylate, (1,2,2,6,6-pentamethyl-4-piperidinyl) 1,2,3,4-butane tetracarboxylate, (mixed 2,2,6,6-tetramethyl -4-piperidinyl/tridecyl) 1,2,3,4-butane tetracarboxylate, (mixed 1,2,2,6,6-pentamethyl-4-piperidinyl/tridecyl Group) 1,2,3,4-butane tetracarboxylate, 8-acetyl-3-dodecyl-7,7,9,9-tetramethyl-1,3,8-triaza Spiro[4.5]decane-2,4-dione, etc. These compounds may be used alone or in combination of two or more.

作為前述含氮雜環式化合物(iii-Y),使用例如,N,N-雙(2-乙基己基)-[(1,2,4-三唑-1-基)甲基]胺、2-[2-羥基-3,5-雙(α,α-二甲基苄基)苯基]-2H-苯并三唑、2-(2’-羥基-3’,5’-二-三級丁基苯基)-5-氯苯并三唑、2-(2’-羥基-3’-三級丁基-5’-甲基苯基)-5-氯苯并三唑、2-(2’-羥基-3’-三級戊基-5’-異丁基苯基)-5-氯苯并三唑、2-(2’-羥基-3’-異丁基-5’-甲基苯基)-5-氯苯并三唑、2-(2’-羥基-3’-異丁基-5’-丙基苯基)-5-氯苯并三唑、2-(2’-羥基-3’,5’-二-三級丁基苯基)苯并三唑、2-(2’-羥基-5’-甲基苯基)苯并三唑、2-[2’-羥基-5’-(1,1,3,3-四甲基)苯基]苯并三唑等苯并三唑化合物或{混合2-[4-[2-羥基-3-十二基氧基丙基]氧基]-2-羥基苯基]-4,6-雙(2,4-二甲基苯基)-1,3,5-三

Figure 108116170-A0202-12-0010-17
}2-[4-[2-羥基-3-十二基氧基丙基]氧基]氧基]-2-羥基苯基]-4,6-雙(2,4-二甲基苯基)-1,3,5-三
Figure 108116170-A0202-12-0010-18
等三
Figure 108116170-A0202-12-0010-19
化合物等。該等之三唑化合物可單獨使用,亦可併用2種以上。 As the aforementioned nitrogen-containing heterocyclic compound (iii-Y), for example, N,N-bis(2-ethylhexyl)-[(1,2,4-triazol-1-yl)methyl]amine, 2-[2-Hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(2'-hydroxy-3',5'-di- Tertiary butylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3'-tertiarybutyl-5'-methylphenyl)-5-chlorobenzotriazole, 2 -(2'-Hydroxy-3'-tertiary pentyl-5'-isobutylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3'-isobutyl-5' -Methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3'-isobutyl-5'-propylphenyl)-5-chlorobenzotriazole, 2-( 2'-hydroxy-3',5'-di-tertiary butylphenyl)benzotriazole, 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-[2 '-Hydroxy-5'-(1,1,3,3-tetramethyl)phenyl]benzotriazole and other benzotriazole compounds or {mixed 2-[4-[2-hydroxy-3-dodecane Yloxypropyl]oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-tri
Figure 108116170-A0202-12-0010-17
}2-[4-[2-Hydroxy-3-dodecyloxypropyl]oxy]oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl )-1,3,5-three
Figure 108116170-A0202-12-0010-18
Wait three
Figure 108116170-A0202-12-0010-19
Compounds etc. These triazole compounds may be used alone or in combination of two or more.

從可得到更為優異的耐候性之觀點而言,作為前述光安定劑(iii)的使用量,相對於前述胺基甲酸酯預聚物(i)100質量份,較佳為0.001~20質量份的範圍,更佳為0.01~10質量份的範圍,進一步更佳為0.1~5質量份的範圍,特佳為0.5~3質量份的範圍。 From the viewpoint of obtaining more excellent weather resistance, the amount of the light stabilizer (iii) used is preferably 0.001 to 20 relative to 100 parts by mass of the urethane prepolymer (i). The range of parts by mass is more preferably 0.01 to 10 parts by mass, further more preferably 0.1 to 5 parts by mass, and particularly preferably 0.5 to 3 parts by mass.

從可得到更為優異的耐候性之觀點而言,在併用前述受阻胺化合物(iii-X)與前述含氮雜環式化合物(iii-Y)時,其質量比[(iii-X)/(iii-Y)],較佳為90/10~10/90的範圍,更佳為20/80~80/20的範圍,進一步更佳為75/25~25/75的範圍。 From the viewpoint of obtaining more excellent weather resistance, when the hindered amine compound (iii-X) and the nitrogen-containing heterocyclic compound (iii-Y) are used in combination, the mass ratio [(iii-X)/ (iii-Y)], preferably in the range of 90/10 to 10/90, more preferably in the range of 20/80 to 80/20, even more preferably in the range of 75/25 to 25/75.

從可得到更為優異的耐候性之觀點而言,作為前述受阻胺化合物(iii-X)與前述含氮雜環式化合物(iii-Y)之合計質量,較佳為前述光安定劑(iii)中70質量%以上,更佳為80質量%以上,進一步更佳為90質量%以上。 From the viewpoint of obtaining more excellent weather resistance, the total mass of the hindered amine compound (iii-X) and the nitrogen-containing heterocyclic compound (iii-Y) is preferably the light stabilizer (iii) ) 70% by mass or more, more preferably 80% by mass or more, and still more preferably 90% by mass or more.

本發明的濕氣硬化型胺基甲酸酯熱熔樹脂組成物,為了將前述胺基甲酸酯預聚物(i)、及前述光聚合起始劑(ii)作為必要成分,且進一步提升耐候性,較佳為含有前述光安定劑(iii),但視需要亦可含有其它的添加劑。 The moisture-curable urethane hot-melt resin composition of the present invention is further improved in order to use the urethane prepolymer (i) and the photopolymerization initiator (ii) as essential components The weather resistance preferably contains the aforementioned light stabilizer (iii), but may contain other additives as necessary.

作為前述其它的添加劑,可使用例如,硬化觸媒、黏著賦予劑、塑化劑、安定劑、填充材、染料、顏料、螢光增白劑、矽烷偶合劑、蠟、熱塑性樹脂等。該等之添加劑可單獨使用,亦可併用2種以上。 As the aforementioned other additives, for example, hardening catalysts, adhesion-imparting agents, plasticizers, stabilizers, fillers, dyes, pigments, fluorescent whitening agents, silane coupling agents, waxes, and thermoplastic resins can be used. These additives can be used alone or in combination of two or more.

接著,針對本發明的積層體進行說明。 Next, the laminate of the present invention will be described.

本發明的積層體具有基材、及前述濕氣硬化型胺基甲酸酯熱熔樹脂組成物的硬化物層。 The laminate of the present invention has a substrate and a cured layer of the moisture-curable urethane hot-melt resin composition.

作為前述基材,可使用例如,合板、MDF(medium density fiberboard)、塑合板等之木質基材;鋁、鐵等之金屬基材;使用聚酯、聚醯胺、聚苯乙烯、聚碳酸酯、氯乙烯、乙烯-乙酸乙烯酯共聚物、聚乙烯醇、聚乙烯、聚丙烯等樹脂而得之薄片基材;矽酸鈣板;紙;金屬箔;薄板;不織布、織布等纖維基材;合成皮革;紙;橡膠基材;玻璃基材等。作為前述基材的厚度,因應使用的用途而決定,但例如為1~500mm的範圍。 As the aforementioned substrate, for example, wood substrates such as plywood, MDF (medium density fiberboard), plastic plywood, etc.; metal substrates such as aluminum and iron; polyester, polyamide, polystyrene, and polycarbonate are used , Vinyl chloride, ethylene-vinyl acetate copolymer, polyvinyl alcohol, polyethylene, polypropylene and other resin-made sheet substrates; calcium silicate board; paper; metal foil; sheet; non-woven fabric, woven fabric and other fiber substrates ; Synthetic leather; paper; rubber substrate; glass substrate, etc. The thickness of the aforementioned substrate is determined according to the intended use, but it is, for example, in the range of 1 to 500 mm.

作為在前述基材上塗布前述濕氣硬化型胺基甲酸酯熱熔樹脂組成物的方法,可舉出例如,將在70~200℃熔融的濕氣硬化型胺基甲酸酯熱熔樹脂組成物,使用輥塗機、噴塗機、T型模塗機、刀塗機、缺角輪塗機等塗機方式;分配器、噴灑、噴墨印刷、網版印刷、平版印刷等精密方式等,塗布於基材的方法。 As a method of applying the moisture-curable urethane hot-melt resin composition on the substrate, for example, a moisture-curable urethane hot-melt resin that melts at 70 to 200°C may be mentioned. Composition, using roller coater, sprayer, T-die coater, knife coater, corner wheel coater and other coating methods; dispenser, spraying, inkjet printing, screen printing, lithography and other precision methods, etc. , Method of coating on substrate.

作為前述濕氣硬化型胺基甲酸酯熱熔組成物的硬化物層,因應使用的用途而適當決定,但例如為0.001~3cm的範圍。 The cured layer of the moisture-curable urethane hot-melt composition is appropriately determined according to the application to be used, but it is, for example, in the range of 0.001 to 3 cm.

前述塗布的濕氣硬化型胺基甲酸酯熱熔組成物,藉由照射活性能量線,可得到優異的初期接著強度。作為前述活性能量線,可舉出例如,紫外線、電子束、X射線、紅外線、可見光線等。從可簡便地得到初期接著強度之觀點而言,該等之中,較佳為紫外線。 The moisture-curable urethane hot-melt composition applied as described above can obtain excellent initial adhesive strength by irradiating active energy rays. Examples of the active energy rays include ultraviolet rays, electron beams, X-rays, infrared rays, and visible rays. From the viewpoint of easily obtaining the initial adhesion strength, among these, ultraviolet rays are preferred.

在照射前述紫外線之際,可使用例如,低壓汞燈、高壓汞燈、超高壓汞燈、氫燈、氘燈、鹵素燈、氙燈、碳弧燈、螢光燈等光源。 When irradiating the aforementioned ultraviolet rays, light sources such as low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, hydrogen lamps, deuterium lamps, halogen lamps, xenon lamps, carbon arc lamps, and fluorescent lamps can be used.

從可得到更為優異的初期接著強度之觀點而言,作為前述紫外線的照射量,可為0.05~5J/cm2的範圍,更佳為0.1~3J/cm2,特佳為0.3~1.5J/cm2。再者,前述紫外線的照射量係將使用GS Yuasa International Ltd.製UV檢驗器「UVR-N1」,在300~390nm之波長區域中進行測定的數值作為基準。 From the viewpoint of obtaining more excellent initial adhesion strength, the irradiation amount of the ultraviolet rays may be in the range of 0.05 to 5 J/cm 2 , more preferably 0.1 to 3 J/cm 2 , and particularly preferably 0.3 to 1.5 J /cm 2 . In addition, the above-mentioned ultraviolet irradiation amount is based on the value measured using the UV tester "UVR-N1" by GS Yuasa International Ltd. in the wavelength range of 300-390 nm.

前述紫外線照射後,為了進行前述胺基甲酸酯預聚物(i)的異氰酸酯基之熟化,較佳為在20~40℃的溫度下進行養護1~3天。 After the ultraviolet irradiation, in order to cure the isocyanate group of the urethane prepolymer (i), it is preferable to perform curing at a temperature of 20 to 40°C for 1 to 3 days.

以上本發明的濕氣硬化型胺基甲酸酯熱熔樹脂組成物,係初期接著強度、最終接著強度、及耐候性優異。 The moisture-curable urethane hot-melt resin composition of the present invention described above is excellent in initial adhesion strength, final adhesion strength, and weather resistance.

[實施例] [Example]

以下使用實施例更詳細地說明本發明。 The present invention is explained in more detail below using examples.

[合成例1]胺基甲酸酯預聚物(i-1)之合成 [Synthesis Example 1] Synthesis of urethane prepolymer (i-1)

在具備攪拌機、溫度計之2公升4口燒瓶,進料二羥甲基甲烷二丙烯酸酯4質量份、及聚酯多元醇(1,6-己二醇與己二酸之反應物,數量平均分子量:4,500,以下簡稱為「PEs」。)76.6質量份,並於減壓加熱條件下,進行脫水至相對於燒瓶內的全量之水分成為0.05質量%。 In a 2-liter 4-neck flask equipped with a stirrer and a thermometer, 4 parts by mass of dimethylol methane diacrylate and polyester polyol (reaction product of 1,6-hexanediol and adipic acid, number average molecular weight) : 4,500, hereinafter abbreviated as "PEs".) 76.6 parts by mass, and dehydrated under reduced pressure heating conditions until the total amount of water in the flask becomes 0.05% by mass.

接著,冷卻至70℃後,加入4,4’-二苯基甲烷二異氰酸酯(以下簡稱為「MDI」。)18.9質量份,升溫至100℃後,加入光聚合起始劑(1-羥基環己基苯基酮,以下簡稱為「Irg184」。)0.5質量份,並於氮氣環境下,在110℃反應約3小時至異氰酸酯基含量成為一定,藉以得到胺基甲酸酯預聚物(i-1)(聚合性不飽和基濃度:0.37mol/kg、NCO%:3.2%)。 Next, after cooling to 70°C, 1,4 parts by mass of 4,4′-diphenylmethane diisocyanate (hereinafter referred to as “MDI”) was added. After the temperature was raised to 100°C, a photopolymerization initiator (1-hydroxy ring) was added Hexyl phenyl ketone, hereinafter referred to as "Irg184".) 0.5 parts by mass, and reacted under nitrogen atmosphere at 110 ℃ for about 3 hours until the isocyanate group content becomes constant, thereby obtaining a urethane prepolymer (i- 1) (polymerizable unsaturated group concentration: 0.37 mol/kg, NCO%: 3.2%).

[合成例2]胺基甲酸酯預聚物(i-2)之合成 [Synthesis Example 2] Synthesis of urethane prepolymer (i-2)

在具備攪拌機、溫度計之2公升4口燒瓶,進料1,4-雙(3-丙烯醯氧基-2-羥基丙氧基)丁烷4質量份、及PEs 79.9質量份,並於減壓加熱條件下,進行脫水至相對於燒瓶內的全量之水分成為0.05質量%。 In a 2-liter 4-neck flask equipped with a stirrer and a thermometer, feed 4 parts by mass of 1,4-bis(3-propenyloxy-2-hydroxypropoxy)butane and 79.9 parts by mass of PEs, and depressurize Under heating conditions, dehydration was performed until the total amount of water in the flask became 0.05% by mass.

接著,冷卻至70℃後,加入MDI 15.6質量份,升溫至100℃後,加入Irg184 0.5質量份,並於氮氣環境下,在110℃反應 約3小時至異氰酸酯基含量成為一定,藉以得到胺基甲酸酯預聚物(i-2)(聚合性不飽和基濃度:0.23mol/kg、NCO%:2.6%)。 Next, after cooling to 70°C, 15.6 parts by mass of MDI was added, after raising the temperature to 100°C, 0.5 parts by mass of Irg184 was added, and reacted at 110°C for about 3 hours under a nitrogen atmosphere until the content of isocyanate groups became constant, thereby obtaining amine groups Formate prepolymer (i-2) (polymerizable unsaturated group concentration: 0.23 mol/kg, NCO%: 2.6%).

[合成例3]胺基甲酸酯預聚物(i-3)之合成 [Synthesis Example 3] Synthesis of urethane prepolymer (i-3)

在具備攪拌機、溫度計之2公升4口燒瓶,進料化合物(3-1)(在通式(3)中,R5表示氫原子,R6表示甲基,n表示1的整數。)4質量份、及PEs 79.5質量份,並於減壓加熱條件下,進行脫水至相對於燒瓶內的全量之水分成為0.05質量%。 In a 2-liter 4-neck flask equipped with a stirrer and a thermometer, compound (3-1) (in the general formula (3), R 5 represents a hydrogen atom, R 6 represents a methyl group, and n represents an integer of 1) 4 mass Parts and 79.5 parts by mass of PEs, and under reduced pressure heating conditions, dehydration was performed until the total amount of water in the flask became 0.05% by mass.

接著,冷卻至70℃後,加入MDI 16質量份,升溫至100℃後,加入Irg184 0.5質量份,並於氮氣環境下,在110℃反應約3小時至異氰酸酯基含量成為一定,藉以得到胺基甲酸酯預聚物(i-3)(聚合性不飽和基濃度:0.24mol/kg、NCO%:2.7%)。 Next, after cooling to 70°C, 16 parts by mass of MDI was added, and after raising the temperature to 100°C, 0.5 parts by mass of Irg184 was added and reacted at 110°C for about 3 hours under a nitrogen atmosphere until the content of isocyanate groups became constant, thereby obtaining amine groups Formate prepolymer (i-3) (polymerizable unsaturated group concentration: 0.24 mol/kg, NCO%: 2.7%).

[合成例4]胺基甲酸酯預聚物(i-4)之合成 [Synthesis Example 4] Synthesis of urethane prepolymer (i-4)

在具備攪拌機、溫度計之2公升4口燒瓶,進料化合物(3-2)(在通式(3)中,R5表示甲基,R6表示氫原子,n表示1的整數。)4質量份、及PEs 79.9質量份,並於減壓加熱條件下,進行脫水至相對於燒瓶內的全量之水分成為0.05質量%。 In a 2-liter 4-neck flask equipped with a stirrer and a thermometer, the compound (3-2) was fed (In the general formula (3), R 5 represents a methyl group, R 6 represents a hydrogen atom, and n represents an integer of 1.) 4 mass Parts and 79.9 parts by mass of PEs, and under reduced pressure heating conditions, dehydration is performed until the total amount of water in the flask becomes 0.05% by mass.

接著,冷卻至70℃後,加入MDI 15.6質量份,升溫至100℃後,加入Irg184 0.5質量份,並於氮氣環境下,在110℃反應約3小時至異氰酸酯基含量成為一定,藉以得到胺基甲酸酯預聚物(i-4)(聚合性不飽和基濃度:0.23mol/kg、NCO%:2.5%)。 Next, after cooling to 70°C, 15.6 parts by mass of MDI was added, after raising the temperature to 100°C, 0.5 parts by mass of Irg184 was added, and reacted at 110°C for about 3 hours under a nitrogen atmosphere until the content of isocyanate groups became constant, thereby obtaining amine groups Formate prepolymer (i-4) (polymerizable unsaturated group concentration: 0.23 mol/kg, NCO%: 2.5%).

[合成例5]胺基甲酸酯預聚物(i-5)之合成 [Synthesis Example 5] Synthesis of urethane prepolymer (i-5)

在具備攪拌機、溫度計之2公升4口燒瓶,進料化合物(4-1)(在通式(4)中,R7表示氫原子,n表示3的整數。)4質量份、及PEs 79.9質量份,並於減壓加熱條件下,進行脫水至相對於燒瓶內的全量之水分成為0.05質量%。 In a 2-liter 4-neck flask equipped with a stirrer and a thermometer, compound (4-1) (in the general formula (4), R 7 represents a hydrogen atom and n represents an integer of 3) 4 parts by mass and 79.9 parts by mass of PEs Parts, and under reduced pressure heating conditions, dehydration was performed until the total amount of water in the flask became 0.05% by mass.

接著,冷卻至70℃後,加入MDI 15.6質量份,升溫至100℃後,加入Irg184 0.5質量份,並於氮氣環境下,在110℃反應約3小時至異氰酸酯基含量成為一定,藉以得到胺基甲酸酯預聚物(i-5)(聚合性不飽和基濃度:0.23mol/kg、NCO%:2.6%)。 Next, after cooling to 70°C, 15.6 parts by mass of MDI was added, after raising the temperature to 100°C, 0.5 parts by mass of Irg184 was added, and reacted at 110°C for about 3 hours under a nitrogen atmosphere until the content of isocyanate groups became constant, thereby obtaining amine groups Formate prepolymer (i-5) (polymerizable unsaturated group concentration: 0.23 mol/kg, NCO%: 2.6%).

[合成例6]胺基甲酸酯預聚物(i-6)之合成 [Synthesis Example 6] Synthesis of urethane prepolymer (i-6)

在具備攪拌機、溫度計之2公升4口燒瓶,進料化合物(5-1)(在通式(5)中,R8表示氫原子,R9及R10表示甲基。)4質量份、及PEs 81.5質量份,並於減壓加熱條件下,進行脫水至相對於燒瓶內的全量之水分成為0.05質量%。 In a 2-liter 4-neck flask equipped with a stirrer and a thermometer, compound (5-1) (in the general formula (5), R 8 represents a hydrogen atom, R 9 and R 10 represent a methyl group.) 4 parts by mass, and 81.5 parts by mass of PEs were dehydrated under reduced pressure heating conditions until the total amount of water in the flask became 0.05% by mass.

接著,冷卻至70℃後,加入MDI 14質量份,升溫至100℃後,加入Irg184 0.5質量份,並於氮氣環境下,在110℃反應約3小時至異氰酸酯基含量成為一定,藉以得到胺基甲酸酯預聚物(i-6)(聚合性不飽和基濃度:0.16mol/kg、NCO%:2.2%)。 Next, after cooling to 70°C, 14 parts by mass of MDI was added, after raising the temperature to 100°C, 0.5 parts by mass of Irg184 was added, and reacted at 110°C for about 3 hours under a nitrogen atmosphere until the content of isocyanate groups became constant, thereby obtaining amine groups Formate prepolymer (i-6) (polymerizable unsaturated group concentration: 0.16 mol/kg, NCO%: 2.2%).

[合成例7]胺基甲酸酯預聚物(i-7)之合成 [Synthesis Example 7] Synthesis of urethane prepolymer (i-7)

在具備攪拌機、溫度計之2公升4口燒瓶,進料化合物(6-1)(在通式(6)中,R11、R12、R13及R14全部表示甲基。)4質量份、及PEs 82.5質量份,並於減壓加熱條件下,進行脫水至相對於燒瓶內的全量之水分成為0.05質量%。 In a 2-liter 4-neck flask equipped with a stirrer and a thermometer, compound (6-1) (in the general formula (6), R 11 , R 12 , R 13 and R 14 all represent methyl groups.) 4 parts by mass, And 82.5 parts by mass of PEs, and under reduced pressure heating conditions, dehydration until the total amount of water in the flask becomes 0.05% by mass.

接著,冷卻至70℃後,加入MDI 13質量份,升溫至100℃後,加入Irg184 0.5質量份,並於氮氣環境下,在110℃反應約3小時至異氰酸酯基含量成為一定,藉以得到胺基甲酸酯預聚物(i-7)(聚合性不飽和基濃度:0.13mol/kg、NCO%:2.1%)。 Next, after cooling to 70°C, 13 parts by mass of MDI was added, after raising the temperature to 100°C, 0.5 parts by mass of Irg184 was added, and reacted at 110°C for about 3 hours under a nitrogen atmosphere until the isocyanate group content became constant, thereby obtaining amine groups Formate prepolymer (i-7) (polymerizable unsaturated group concentration: 0.13 mol/kg, NCO%: 2.1%).

[比較合成例1]胺基甲酸酯預聚物(iR-1)之合成 [Comparative Synthesis Example 1] Synthesis of urethane prepolymer (iR-1)

在具備攪拌機、溫度計之2公升4口燒瓶,進料PEs 89.5質量份,並於減壓加熱條件下,進行脫水至相對於燒瓶內的全量之水分成為0.05質量%。 In a 2-liter 4-neck flask equipped with a stirrer and a thermometer, 89.5 parts by mass of PEs were fed, and dehydration was carried out under reduced pressure heating conditions until the total amount of water in the flask became 0.05% by mass.

接著,冷卻至70℃後,加入MDI 10.5質量份,升溫至100℃後,於氮氣環境下,在110℃反應約3小時至異氰酸酯基含量成為一定,藉以得到胺基甲酸酯預聚物(iR-1)(聚合性不飽和基濃度:0mol/kg、NCO%:1.7%)。 Next, after cooling to 70°C, 10.5 parts by mass of MDI was added, and after raising the temperature to 100°C, the reaction was carried out at 110°C for about 3 hours under a nitrogen atmosphere until the isocyanate group content became constant, thereby obtaining a urethane prepolymer ( iR-1) (polymerizable unsaturated group concentration: 0 mol/kg, NCO%: 1.7%).

[比較合成例2]胺基甲酸酯預聚物(iR-2)之合成 [Comparative Synthesis Example 2] Synthesis of urethane prepolymer (iR-2)

在具備攪拌機、溫度計之2公升4口燒瓶,進料PEs 87.2質量份,並於減壓加熱條件下,進行脫水至相對於燒瓶內的全量之水分成為0.05質量%。 In a 2-liter 4-neck flask equipped with a stirrer and a thermometer, 87.2 parts by mass of PEs were fed and dehydrated under reduced pressure heating conditions until it became 0.05% by mass relative to the total amount of water in the flask.

接著,冷卻至70℃後,加入MDI 10.3質量份,升溫至100℃後,加入Irg184 0.5質量份,並於氮氣環境下,在110℃反應約3小時至異氰酸酯基含量成為一定後,加入丙烯酸2-羥乙酯(以下簡稱為「HEA」。)2質量份,進行反應約1小時,藉以得到胺基甲酸酯預聚物(iR-2)(聚合性不飽和基濃度:0.17mol/kg、NCO%:1.0%)。 Next, after cooling to 70°C, 10.3 parts by mass of MDI was added, after raising the temperature to 100°C, 0.5 parts by mass of Irg184 was added, and reacted at 110°C for about 3 hours under a nitrogen atmosphere until the isocyanate group content became constant, and acrylic acid 2 was added -Hydroxyethyl ester (hereinafter abbreviated as "HEA") 2 parts by mass, the reaction is carried out for about 1 hour, thereby obtaining a urethane prepolymer (iR-2) (polymerizable unsaturated group concentration: 0.17mol/kg , NCO%: 1.0%).

[實施例1] [Example 1]

摻合合成例1所得到之胺基甲酸酯預聚物(i-1)100質量份、及光聚合起始劑(1-羥基環己基苯基酮)0.5質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 By blending 100 parts by mass of the urethane prepolymer (i-1) obtained in Synthesis Example 1, and 0.5 parts by mass of a photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone), a moisture hardening type was obtained Polyurethane hot-melt resin composition.

[實施例2] [Example 2]

摻合合成例1所得到之胺基甲酸酯預聚物(i-1)100質量份、光聚合起始劑(1-羥基環己基苯基酮)0.5質量份、癸二酸雙(1,2,2,6,6-五甲基哌啶-4-基)(以下簡稱為「受阻胺(1)」。)1質量份、及2-[2-羥基-3,5-雙(α,α-二甲基苄基)苯基]-2H-苯并三唑(以下簡稱為「苯并三唑(1)」。)1質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 Blended with 100 parts by mass of the urethane prepolymer (i-1) obtained in Synthesis Example 1, 0.5 parts by mass of a photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone), and bis(1 sebacate) ,2,2,6,6-pentamethylpiperidin-4-yl) (hereinafter referred to as "hindered amine (1)".) 1 part by mass, and 2-[2-hydroxy-3,5-bis( α,α-dimethylbenzyl)phenyl]-2H-benzotriazole (hereinafter abbreviated as "benzotriazole (1)".) 1 part by mass to obtain moisture-curable polyurethane Hot melt resin composition.

[實施例3] [Example 3]

摻合合成例2所得到之胺基甲酸酯預聚物(i-2)100質量份、光聚合起始劑(1-羥基環己基苯基酮)0.5質量份、受阻胺(1)1質量份、及三

Figure 108116170-A0202-12-0017-15
化合物(BASF公司製「Tinuvin(註冊商標)400」,以下簡稱為「三
Figure 108116170-A0202-12-0017-16
(1)」。)1質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 100 parts by mass of the carbamate prepolymer (i-2) obtained in Synthesis Example 2, 0.5 parts by mass of photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone), and hindered amine (1) 1 Quality parts, and three
Figure 108116170-A0202-12-0017-15
Compound ("Tinuvin (registered trademark) 400" manufactured by BASF, hereinafter referred to as "Three
Figure 108116170-A0202-12-0017-16
(1)". ) 1 part by mass to obtain a moisture-curable polyurethane hot-melt resin composition.

[實施例4] [Example 4]

摻合合成例3所得到之胺基甲酸酯預聚物(i-3)100質量份、光聚合起始劑(1-羥基環己基苯基酮)0.5質量份、受阻胺(2)1質量份、及苯并三唑(1)1質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 100 parts by mass of the carbamate prepolymer (i-3) obtained in Synthesis Example 3, 0.5 parts by mass of photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone), and hindered amine (2) 1 1 part by mass and benzotriazole (1) 1 part by mass to obtain a moisture-curable polyurethane hot-melt resin composition.

[實施例5] [Example 5]

摻合合成例4所得到之胺基甲酸酯預聚物(i-4)100質量份、光聚合起始劑(1-羥基環己基苯基酮)0.5質量份、受阻胺(2)1質量份、及三

Figure 108116170-A0202-12-0018-14
(1)1質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 100 parts by mass of the carbamate prepolymer (i-4) obtained in Synthesis Example 4, 0.5 parts by mass of photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone), and hindered amine (2) 1 Quality parts, and three
Figure 108116170-A0202-12-0018-14
(1) 1 part by mass to obtain a moisture-curable polyurethane hot-melt resin composition.

[實施例6] [Example 6]

摻合合成例5所得到之胺基甲酸酯預聚物(i-5)100質量份、光聚合起始劑(1-羥基環己基苯基酮)0.5質量份、受阻胺(1)1.5質量份、及苯并三唑(1)1.5質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 Blended with 100 parts by mass of the carbamate prepolymer (i-5) obtained in Synthesis Example 5, 0.5 parts by mass of photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone), and hindered amine (1) 1.5 The mass part and 1.5 mass parts of benzotriazole (1) obtained the moisture hardening type polyurethane hot-melt resin composition.

[實施例7] [Example 7]

摻合合成例6所得到之胺基甲酸酯預聚物(i-6)100質量份、光聚合起始劑(1-羥基環己基苯基酮)0.5質量份、受阻胺(1)1質量份、及苯并三唑(1)1.5質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 100 parts by mass of the carbamate prepolymer (i-6) obtained in Synthesis Example 6, 0.5 parts by mass of photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone), and hindered amine (1) 1 The mass part and 1.5 mass parts of benzotriazole (1) obtained the moisture hardening type polyurethane hot-melt resin composition.

[實施例8] [Example 8]

摻合合成例7所得到之胺基甲酸酯預聚物(i-7)100質量份、光聚合起始劑(1-羥基環己基苯基酮)0.5質量份、受阻胺(1)1.5質量份、及苯并三唑(1)1質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 100 parts by mass of the carbamate prepolymer (i-7) obtained in Synthesis Example 7, 0.5 parts by mass of photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone), and hindered amine (1) 1.5 1 part by mass and benzotriazole (1) 1 part by mass to obtain a moisture-curable polyurethane hot-melt resin composition.

[比較例1] [Comparative Example 1]

摻合比較合成例1所得到之胺基甲酸酯預聚物(iR-1)100質量份、受阻胺(1)1質量份、及苯并三唑(1)1質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 100 parts by mass of the urethane prepolymer (iR-1) obtained in Comparative Synthesis Example 1, 1 part by mass of the hindered amine (1), and 1 part by mass of the benzotriazole (1) were obtained. Hardened polyurethane hot-melt resin composition.

[比較例2] [Comparative Example 2]

摻合比較合成例2所得到之胺基甲酸酯預聚物(iR-2)100質量份、光聚合起始劑(1-羥基環己基苯基酮)0.5質量份、受阻胺(1)1質量份、及苯并三唑(1)1質量份,得到濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物。 100 parts by mass of the urethane prepolymer (iR-2) obtained in Comparative Synthesis Example 2, 0.5 parts by mass of photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone), and hindered amine (1) 1 part by mass and 1 part by mass of benzotriazole (1) gave a moisture-curable polyurethane hot-melt resin composition.

[數量平均分子量之測定方法] [Measurement method of number average molecular weight]

合成例及比較合成例所使用的多元醇等的數量平均分子量係表示藉由凝膠滲透層析(GPC)法,以下述的條件進行測定的數值。 The number average molecular weights of polyols and the like used in Synthesis Examples and Comparative Synthesis Examples represent values measured by gel permeation chromatography (GPC) method under the following conditions.

測定裝置:高速GPC裝置(Tosoh股份有限公司製「HLC-8220GPC」) Measuring device: High-speed GPC device ("HLC-8220GPC" manufactured by Tosoh Corporation)

管柱:將Tosoh股份有限公司製之下述的管柱串聯使用。 Tubing: The following tubing made by Tosoh Corporation was used in series.

「TSKgel G5000」(7.8mmI.D.×30cm)×1支 "TSKgel G5000" (7.8mmI.D.×30cm)×1

「TSKgel G4000」(7.8mmI.D.×30cm)×1支 "TSKgel G4000" (7.8mmI.D.×30cm)×1

「TSKgel G3000」(7.8mmI.D.×30cm)×1支 "TSKgel G3000" (7.8mmI.D.×30cm)×1

「TSKgel G2000」(7.8mmI.D.×30cm)×1支 "TSKgel G2000" (7.8mmI.D.×30cm)×1

檢測器:RI(示差折射計) Detector: RI (Differential Refractometer)

管柱溫度:40℃ Column temperature: 40℃

溶析液:四氫呋喃(THF) Eluent: Tetrahydrofuran (THF)

流速:1.0mL/分鐘 Flow rate: 1.0mL/min

注入量:100μL(試料濃度0.4質量%的四氫呋喃溶液) Injection volume: 100 μL (sample concentration of 0.4% by mass in tetrahydrofuran solution)

標準試料:使用下述的標準聚苯乙烯,作成檢量線。 Standard sample: Use the following standard polystyrene to make a calibration line.

(標準聚苯乙烯) (Standard polystyrene)

Tosoh股份有限公司製「TSKgel標準聚苯乙烯A-500」 "TSKgel Standard Polystyrene A-500" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯A-1000」 "TSKgel Standard Polystyrene A-1000" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯A-2500」 "TSKgel Standard Polystyrene A-2500" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯A-5000」 "TSKgel Standard Polystyrene A-5000" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-1」 "TSKgel Standard Polystyrene F-1" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-2」 "TSKgel Standard Polystyrene F-2" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-4」 "TSKgel Standard Polystyrene F-4" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-10」 "TSKgel Standard Polystyrene F-10" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-20」 "TSKgel Standard Polystyrene F-20" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-40」 "TSKgel Standard Polystyrene F-40" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-80」 "TSKgel Standard Polystyrene F-80" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-128」 "TSKgel Standard Polystyrene F-128" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-288」 "TSKgel Standard Polystyrene F-288" manufactured by Tosoh Corporation

Tosoh股份有限公司製「TSKgel標準聚苯乙烯F-550」 "TSKgel Standard Polystyrene F-550" manufactured by Tosoh Corporation

[初期接著強度的評價方法] [Evaluation method of initial bonding strength] (1)初期剝離性的試驗方法 (1) Test method for initial peelability

使實施例及比較例所得到之濕氣硬化型胺基甲酸酯熱熔樹脂組成物各自在120℃熔融1小時後,在厚度200μm之完成電 暈處理的聚對苯二甲酸乙二酯基材上,使用輥塗機以成為100μm的厚度之方式進行塗布。之後,對該塗布面使用高壓汞燈,照射0.65J/cm2的紫外線,並在該照射面進一步貼合厚度200μm之完成電暈處理的聚對苯二甲酸乙二酯基材,且在貼合3分鐘後,依據JISK7311-1995,測定180°剝離強度(N/吋),如以下進行評價。 After the moisture-curable urethane hot-melt resin compositions obtained in Examples and Comparative Examples were each melted at 120°C for 1 hour, a polyethylene terephthalate group with a thickness of 200 μm corona-treated On the material, a roll coater was used to apply a thickness of 100 μm. Then, using a high-pressure mercury lamp on the coated surface, irradiated with 0.65 J/cm 2 of ultraviolet rays, and a polyethylene terephthalate substrate having a thickness of 200 μm corona treatment was further laminated on the irradiated surface, and After 3 minutes, the 180° peel strength (N/inch) was measured according to JISK7311-1995, and evaluated as follows.

「T」:60N/吋以上 "T": 60N/inch or more

「F」:小於60N/吋 "F": less than 60N/inch

(2)初期耐熱蠕變性的試驗方法 (2) Test method for initial heat creep resistance

使實施例及比較例所得到之濕氣硬化型胺基甲酸酯熱熔樹脂組成物各自在120℃熔融1小時後,在聚對苯二甲酸乙二酯基材上,使用輥塗機以成為50μm的厚度之方式進行塗布。之後,對該塗布面使用高壓汞燈,照射0.65J/cm2的紫外線,並於該照射面載置MDF(medium density fiberboard),且進行貼合。在貼合後5分鐘後,於35℃的環境下,對於25mm寬,朝90°方向施加75g的荷重,測定經過15分鐘後之聚對苯二甲酸乙二酯基材的剝離長度,如以下進行評價。 After each of the moisture-curable urethane hot-melt resin compositions obtained in Examples and Comparative Examples was melted at 120° C. for 1 hour, on a polyethylene terephthalate substrate, a roll coater was used to The coating is applied to a thickness of 50 μm. After that, a high-pressure mercury lamp was used on the coated surface, and ultraviolet rays of 0.65 J/cm 2 were irradiated, and MDF (medium density fiberboard) was placed on the irradiated surface and bonded. After 5 minutes after bonding, under a 35°C environment, apply a load of 75g to the 90mm direction for a width of 25mm, and measure the peeling length of the polyethylene terephthalate substrate after 15 minutes, as follows Make an evaluation.

「T」:小於5mm "T": less than 5mm

「F」:5mm以上 "F": 5mm or more

[最終接著強度的評價方法] [Evaluation method of final strength]

使實施例及比較例所得到之濕氣硬化型胺基甲酸酯熱熔樹脂組成物各自在120℃熔融1小時後,在聚對苯二甲酸乙二酯基材上,使用輥塗機以成為50μm的厚度之方式進行塗布。之後, 對該塗布面使用高壓汞燈,照射0.65J/cm2的紫外線,並於該照射面載置MDF(medium density fiberboard),且進行貼合。在23℃、濕度50%的環境下將該試驗片養護72小時後,於80℃的環境下,對於25mm寬,朝90°方向施加500g的荷重,測定經過1小時後之經過15分鐘後之聚對苯二甲酸乙二酯基材的剝離長度,如以下進行評價。 After each of the moisture-curable urethane hot-melt resin compositions obtained in Examples and Comparative Examples was melted at 120° C. for 1 hour, on a polyethylene terephthalate substrate, a roll coater was used to The coating is applied to a thickness of 50 μm. After that, a high-pressure mercury lamp was used on the coated surface, and ultraviolet rays of 0.65 J/cm 2 were irradiated, and MDF (medium density fiberboard) was placed on the irradiated surface, and bonded. After curing the test piece for 72 hours in an environment of 23°C and a humidity of 50%, a load of 500g is applied to the 90mm direction at an environment of 80°C for a width of 25 mm, and the measurement is made after 15 minutes have passed after 1 hour The peeling length of the polyethylene terephthalate substrate was evaluated as follows.

「T」:小於5mm "T": less than 5mm

「F」:5mm以上 "F": 5mm or more

[耐候性的評價方法] [Evaluation method of weather resistance]

使實施例及比較例所得到之濕氣硬化型胺基甲酸酯熱熔樹脂組成物各自在120℃熔融1小時後,在放置於預先加溫至120℃之熱板上的離型紙上,以成為100μm的厚度之方式進行塗布。藉由將該塗布品以25℃、濕度50%保管24小時且進行硬化而得到薄膜。使用該薄膜,並使用搭載有UVA-340電球(UV照射量:0.78W/m2、溫度45℃)之QUV促進耐候性試驗機「QUV/basic」進行UV照射試驗,根據UV照射前後的變色之差(△E),如以下進行評價耐候性的評價。 After the moisture-curable urethane hot-melt resin compositions obtained in Examples and Comparative Examples were each melted at 120°C for 1 hour, they were placed on release paper placed on a hot plate previously heated to 120°C. The coating is applied so as to have a thickness of 100 μm. A film was obtained by storing the coated product at 25°C and 50% humidity for 24 hours and curing. Using this film, a UVA weather resistance tester "QUV/basic" equipped with a UVA-340 electric ball (UV exposure: 0.78W/m 2 and a temperature of 45°C) was used to perform the UV irradiation test according to the color change before and after UV irradiation The difference (ΔE) was evaluated as follows for weather resistance.

「1」:△E為1以下。 "1": △E is 1 or less.

「2」:△E超過1且為5以下。 "2": △E exceeds 1 and is 5 or less.

「3」:△E超過5且為7.5以下。 "3": △E exceeds 5 and is 7.5 or less.

「4」:△E超過7.5。 "4": △E exceeds 7.5.

Figure 108116170-A0202-12-0023-8
Figure 108116170-A0202-12-0023-8

Figure 108116170-A0202-12-0024-9
Figure 108116170-A0202-12-0024-9

本發明的濕氣硬化型胺基甲酸酯熱熔樹脂組成物,可知:優異的初期接著強度、及最終接著強度優異。若進一步摻合光安定劑,則可知:具有優異的耐候性。 The moisture-curable urethane hot-melt resin composition of the present invention is known to have excellent initial adhesive strength and final adhesive strength. If the light stabilizer is further blended, it is known that it has excellent weather resistance.

另一方面,比較例1為未使用化合物(C),且未在胺基甲酸酯預聚物(i)導入聚合性不飽和基的態樣,但初期接著強度不良。 On the other hand, in Comparative Example 1, the compound (C) was not used, and a polymerizable unsaturated group was not introduced into the urethane prepolymer (i), but the initial adhesion strength was poor.

比較例2為使用丙烯酸2-羥乙酯代替化合物(C)作為原料的態樣,但最終接著強度為不良。 Comparative Example 2 is a case where 2-hydroxyethyl acrylate is used instead of the compound (C) as a raw material, but the final adhesion strength is poor.

Claims (8)

一種濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物,其特徵為含有將多元醇(A)、聚異氰酸酯(B)、及具有1個以上之聚合性不飽和基,而且,具有2個以上之羥基的化合物(C)作為必要原料之具有異氰酸酯基的胺基甲酸酯預聚物(i)、及光聚合起始劑(ii)。 A moisture-curable polyurethane hot-melt resin composition, which is characterized by containing polyol (A), polyisocyanate (B), and having at least one polymerizable unsaturated group, and having 2 A urethane prepolymer (i) having an isocyanate group and a photopolymerization initiator (ii) having at least one hydroxy compound (C) as essential raw materials. 如請求項1之濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物,其中該化合物(C)為選自於包含下述通式(1)所示之化合物、下述通式(2)所示之化合物、下述通式(3)所示之化合物、下述通式(4)所示之化合物、下述通式(5)所示之化合物、及下述通式(6)所示之化合物的群組之1種以上; HO-R 1 -OH (1)(通式(1)中,R 1表示在碳原子數1~9之直鏈伸烷基的側鏈具有1個以上之包含聚合性不飽和基的原子團之結構); HO-R 2 O-R 3 -OR 4 -OH (2)(通式(2)中,R 2及R 4各自獨立且表示在伸乙基的側鏈具有包含聚合性不飽和基的原子團之結構,R 3表示碳原子數1~5的伸烷基);
Figure 108116170-A0202-13-0001-10
(通式(3)中,R 5及R 6各自獨立且表示氫原子或甲基,n表示1~3的整數);
Figure 108116170-A0202-13-0002-11
(通式(4)中,R 7表示氫原子或甲基,n表示2~3的整數);
Figure 108116170-A0202-13-0002-12
(通式(5)中,R 8、R 9、及R 10各自表示氫原子或甲基);
Figure 108116170-A0202-13-0002-13
(通式(6)中,R 11、R 12、R 13、及R 14各自表示氫原子或甲基)。
The moisture-curable polyurethane hot-melt resin composition according to claim 1, wherein the compound (C) is selected from the group consisting of compounds represented by the following general formula (1) and the following general formula (2 ), the compound represented by the following general formula (3), the compound represented by the following general formula (4), the compound represented by the following general formula (5), and the following general formula (6) One or more of the group of compounds shown; HO-R 1 -OH (1) (In the general formula (1), R 1 represents that the side chain of a linear alkylene group having 1 to 9 carbon atoms has 1 The structure of more than one atom group containing polymerizable unsaturated groups); HO-R 2 OR 3 -OR 4 -OH (2) (In the general formula (2), R 2 and R 4 are each independent and represent the ethyl group The side chain of has a structure of an atomic group containing a polymerizable unsaturated group, R 3 represents an alkylene group having 1 to 5 carbon atoms);
Figure 108116170-A0202-13-0001-10
(In the general formula (3), R 5 and R 6 are each independent and represent a hydrogen atom or a methyl group, and n represents an integer of 1 to 3);
Figure 108116170-A0202-13-0002-11
(In the general formula (4), R 7 represents a hydrogen atom or a methyl group, and n represents an integer of 2 to 3);
Figure 108116170-A0202-13-0002-12
(In the general formula (5), R 8 , R 9 , and R 10 each represent a hydrogen atom or a methyl group);
Figure 108116170-A0202-13-0002-13
(In the general formula (6), R 11 , R 12 , R 13 , and R 14 each represent a hydrogen atom or a methyl group).
如請求項1或2之濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物,其中該胺基甲酸酯預聚物(i)的聚合性不飽和基濃度為0.0004~2mol/kg的範圍。 The moisture-curable polyurethane hot-melt resin composition according to claim 1 or 2, wherein the concentration of the polymerizable unsaturated group of the urethane prepolymer (i) is 0.0004 to 2 mol/kg range. 如請求項1至3中任一項之濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物,其中該胺基甲酸酯預聚物(i)的異氰酸酯基含有率為1~10質量%的範圍。 The moisture-curable polyurethane hot-melt resin composition according to any one of claims 1 to 3, wherein the isocyanate group content of the urethane prepolymer (i) is 1 to 10 mass % Range. 如請求項1至4中任一項之濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物,其係更含有光安定劑(iii)。 The moisture-curable polyurethane hot-melt resin composition according to any one of claims 1 to 4, which further contains a light stabilizer (iii). 如請求項5之濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物,其中該光安定劑(iii)含有受阻胺化合物(iii-X)、及/或含氮雜環式化合物(iii-Y)。 The moisture-curable polyurethane hot-melt resin composition according to claim 5, wherein the light stabilizer (iii) contains a hindered amine compound (iii-X), and/or a nitrogen-containing heterocyclic compound (iii) -Y). 如請求項5或6之濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物,其中該光安定劑(iii)的含量,相對於該胺基甲酸酯預聚物(i)100質量份為0.001~20質量份的範圍。 The moisture-curable polyurethane hot-melt resin composition according to claim 5 or 6, wherein the content of the light stabilizer (iii) is relative to 100 masses of the polyurethane prepolymer (i) The part is in the range of 0.001 to 20 parts by mass. 一種積層體,其特徵為具有基材、及如請求項1至7中任一項之濕氣硬化型胺基甲酸酯熱熔樹脂組成物的硬化物層。 A laminated body characterized by having a substrate and a cured layer of a moisture-curable urethane hot-melt resin composition according to any one of claims 1 to 7.
TW108116170A 2018-05-24 2019-05-10 Moisture-curable urethane hot melt resin composition and multilayer body TW202003616A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-099646 2018-05-24
JP2018099646 2018-05-24

Publications (1)

Publication Number Publication Date
TW202003616A true TW202003616A (en) 2020-01-16

Family

ID=68615559

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108116170A TW202003616A (en) 2018-05-24 2019-05-10 Moisture-curable urethane hot melt resin composition and multilayer body

Country Status (3)

Country Link
CN (1) CN112262164B (en)
TW (1) TW202003616A (en)
WO (1) WO2019225148A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114634789A (en) * 2022-04-15 2022-06-17 韦尔通(厦门)科技股份有限公司 Light/moisture dual-curing polyurethane hot melt adhesive composition with high initial bonding strength and preparation method thereof

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0352913A (en) * 1989-07-19 1991-03-07 Somar Corp Curable adhesive composition
JP5013585B2 (en) * 2006-09-06 2012-08-29 日立化成ポリマー株式会社 Reactive hot melt adhesive composition and bonding method using the same
JP5228370B2 (en) * 2007-04-27 2013-07-03 東亞合成株式会社 One-part moisture-curing urethane hot melt adhesive composition and method of using the same
DE102010028870A1 (en) * 2010-05-11 2011-11-17 Henkel Ag & Co. Kgaa Film-forming radiation-crosslinking adhesive
CN103080167B (en) * 2010-09-06 2015-07-22 Dic株式会社 Active-energy-ray-curable hot-melt urethane resin composition, member for electronic device which comprises the composition, and packing
JP5696551B2 (en) * 2011-03-23 2015-04-08 Dic株式会社 Moisture curable polyurethane hot melt adhesive and fabricated parts using the same
US8859674B2 (en) * 2011-03-31 2014-10-14 Momentive Performance Materials Inc. Moisture curable silylated polymer compositions with improved adhesion to concrete
JP2013159767A (en) * 2012-02-08 2013-08-19 Toyo Ink Sc Holdings Co Ltd Pressure-sensitive adhesive composition, and laminated body using the same
JP5907377B2 (en) * 2012-02-09 2016-04-26 Dic株式会社 Moisture curable polyurethane hot melt resin composition
JP2015086291A (en) * 2013-10-30 2015-05-07 東亞合成株式会社 Reactive hot-melt adhesive composition for edge pasting and molded wood material using the same, and manufacturing method of molded wood material with edge pasting agent
CN105814095B (en) * 2014-05-30 2019-03-22 积水化学工业株式会社 Light moisture-curable resin combination, electronic component-use bonding agent and display element bonding agent
WO2016047415A1 (en) * 2014-09-26 2016-03-31 Dic株式会社 Aqueous urethane resin composition, coating agent and article
JP6510788B2 (en) * 2014-10-03 2019-05-08 積水化学工業株式会社 Light moisture curable resin composition
JP6510790B2 (en) * 2014-10-03 2019-05-08 積水化学工業株式会社 Light moisture curable resin composition
JP2016074893A (en) * 2014-10-03 2016-05-12 積水化学工業株式会社 Photo-and moisture-curable resin composition, electronic component adhesive, and display element adhesive
JP2016074891A (en) * 2014-10-03 2016-05-12 積水化学工業株式会社 Photo-and moisture-curable resin composition, electronic component adhesive, and display element adhesive
CN105255435B (en) * 2015-10-19 2017-12-19 烟台德邦科技有限公司 A kind of preparation method of light/wet double solidification polyurethane hot melts
CN105255434B (en) * 2015-11-24 2018-01-02 上海天洋热熔粘接材料股份有限公司 A kind of modified moisture-curable polyurethane hot melt adhesive and preparation method thereof

Also Published As

Publication number Publication date
CN112262164A (en) 2021-01-22
WO2019225148A1 (en) 2019-11-28
CN112262164B (en) 2022-07-22

Similar Documents

Publication Publication Date Title
JP4399159B2 (en) Multi-stage curable reactive adhesive with low monomer content
JP2010535909A5 (en)
WO2006118078A1 (en) Adhesive composition curable with actinic energy ray
US11912867B2 (en) Polyurethane and UV-moisture dual cure PU reactive hotmelt comprising the same
CA3094414A1 (en) Curable compositions for use as adhesives having properties capable of being altered based on external stimuli and methods of making and using the same
WO2018088575A1 (en) Polycarbonate diol, polycarbonate diol–containing composition, polycarbonate diol production method, and polyurethane
EP1930362B1 (en) Reactive composition containing an unsaturated backbone
JP6132139B2 (en) Moisture-curing polyurethane hot melt resin composition and cosmetic product
JPH0232133A (en) Ultraviolet-curing paint for polycarbonate molding
TW202003616A (en) Moisture-curable urethane hot melt resin composition and multilayer body
JP6557957B2 (en) LAMINATE MANUFACTURING METHOD AND COSMETIC PRODUCTION MEMBER
JP2020094101A (en) Moisture-curable polyurethane hot-melt resin composition, adhesive, and article
EP0175474A2 (en) Polyurethane adhesive compositions
JP6583595B1 (en) Moisture curable urethane hot melt resin composition and laminate
JP2021075657A (en) Moisture-curable polyurethane hot melt resin composition, adhesive, fixture member, and flush panel
JP2000219712A (en) Acrylate composition, cured article thereof, and composition for floor coating
JP7228092B2 (en) Moisture-curable urethane hot-melt resin composition and laminate
JP6566175B1 (en) Moisture curable urethane hot melt resin composition and laminate
JP7040321B2 (en) Goods
JPH02274713A (en) Photocurable resin
JP7484090B2 (en) Active energy ray-curable resin composition, and coating agent and sheet using the same
JP7139928B2 (en) Moisture-curable urethane hot-melt resin composition and laminate
JP7363124B2 (en) Moisture-curable urethane hot melt resin composition and laminate
JP2019203083A (en) Moisture-curable urethane hot-melt resin composition and laminate
JP2020094126A (en) Moisture-curable urethane hot-melt resin composition and laminate