TW201941965A - Laminating device and method of manufacturing flexible printed circuit board including a chamber, a vacuum pump, a heating plate, a stretching plate, a temporary bonding body supply source, a release film supply source and a tension applying mechanism - Google Patents

Abstract

A laminating device and a method of manufacturing a flexible printed circuit board provided by the present invention can prevent wrinkles or bulging from occurring in the release film and can improve the irregularity followability of the release film. The laminating device (100) is provided with: a chamber (102) that is hermetically sealed against the outside; a vacuum pump (121) that evacuates the interior of the chamber (102); a heating plate (116) for heating a temporary bonding body (40) and a release film (30); a stretching plate (137) pressing the temporary bonding body (40) and the release film (30) in a pressurized state; a temporary bonding body supply source (140) for supplying the temporary bonding body (40); a release film supply source (150) for supplying the release film (30) having a thermal expansion coefficient larger than that of a protective film (20) to at least one of the surface side and the back side of the temporary bonding body (40); and a tension applying mechanism (200) that applies a tensile force to the heated release film (30).

Description

Laminating device and manufacturing method of flexible printed circuit board

The present invention relates to a method for manufacturing a lamination device and a flexible printed circuit board.

The manufacturing process of a flexible printed circuit board has a lamination process. In the laminating step, a protective film is laminated on a base film having a pattern layer formed by etching a copper foil. At this time, not only the protective film is laminated, but also the release film is peeled off after the release film is laminated. This suppresses the adhesive material from flowing out of the adhesive material layer present in the protective film.

Examples of the laminating device for laminating the cover film to the base film include those shown in Patent Documents 1 and 2. In the structures disclosed in Patent Documents 1 and 2, a roll-shaped base film is formed into a sheet shape and is intermittently drawn out, and a long cover film is formed from the roll-shaped cover film. Then, the strip-shaped cover film is temporarily crimped to the sheet-shaped base film by a temporary crimping device. In addition, Patent Documents 1 and 2 also disclose the use of a release film. (Prior Art Literature) (Patent Literature)

Patent Document 1: Japanese Patent No. 4097679 Patent Document 2: Japanese Patent No. 4929551

However, in the current manufacturing process, a product called a multi-layer product with three or more copper foil layers is manually overlapped in a state where the base film, the protective film and the release film are cut into strips. , And then laminated using a laminating device. In addition, in a flexible printed circuit board other than a multilayer product, a lamination device disclosed in Patent Documents 1 and 2 may be used, and lamination may be performed in a state where at least a base film is not cut into strips and connected.

However, there are the following problems when laminating in a state where all films are connected without being cut into long strips. Specifically, it is being studied to use a laminate having an introduction device when laminating a laminate in which a temporary adhesive body of a base film and a protective film overlaps with a release film in a connected state. Continuous vacuum pressing device for heating and pressing the heating and pressurizing part. A cooling mechanism having a cooling tube is arranged near the entrance of the heating and pressurizing section in the continuous vacuum pressing device. This cooling mechanism can prevent heat from being transmitted from the heating and pressurizing section to the film existing on the upstream side in the conveying direction, and thermally solidify the adhesive material of the base film or the protective film in the temporary adherend.

Based on this knowledge, lamination was performed using an experimental continuous vacuum pressing apparatus, and as a result, the following problems occurred. That is, when the release film cooled by the cooling mechanism is moved to the heating and pressurizing section, the release film is heated to thermally expand and expand, and wrinkles or bulges are generated on the release film. When the release film is laminated on the protective film and the base film in a state where the wrinkles or ridges are generated, the wrinkles or ridges are transferred to a laminate of the base film and the protective film.

In addition, if the release film cannot follow the uneven portions on the base film or the protective film well, the outflow of the adhesive material cannot be prevented well. However, in the structures disclosed in Patent Documents 1 and 2, as described in paragraph 0014 of the specification, only temporary crimping is performed, and a formal vacuum crimping requires preparation of a separate vacuum punch. Therefore, it is also difficult to improve the followability with respect to the uneven portions using the structures disclosed in Patent Documents 1 and 2.

Here, in a single-sided substrate having only one layer of copper foil on the base film or a double-sided substrate having copper foil on the front and back sides of the base film, the depth of the uneven portion is usually shallow, and in most cases, There are also fewer uneven portions. However, in a multilayer substrate in which three or more copper foils are present on the base film, uneven portions such as holes and recesses are also present in the internal copper foil. Therefore, generally, the uneven portions are deep and there are many uneven portions. Therefore, in the structures disclosed in Patent Documents 1 and 2, it is particularly difficult for the release film to follow the uneven portions in the multilayer substrate.

The present invention has been made based on the above-mentioned circumstances, and an object thereof is to provide a release film capable of preventing wrinkles or bulges in a release film, and capable of making the release film follow the unevenness of the uneven portion existing on the temporary adhesive body. Good laminating device and manufacturing method of flexible printed circuit board.

In order to solve the above-mentioned problems, a laminating device provided in a first aspect of the present invention is used to superimpose a release film on a temporary adhesive body formed by temporarily bonding a base laminate and a protective film, and perform thermal compression bonding. The invention includes a chamber formed by butting a first sealing member provided in the first chamber and a second sealing member provided in the second chamber, and sealingly sealing the outside from the outside; a suction unit, It is used to evacuate the inside of the chamber; the heating unit is arranged inside the chamber and heats the temporary adhesive body and the release film; the extrusion unit is arranged inside the chamber and is added The temporary adhesive body and the release film are squeezed in a compressed state; the temporary adhesive body supply source is used to supply a temporary adhesive body formed by temporarily bonding the base laminate and the protective film, wherein the base laminate has conductivity A plurality of pattern layers and an insulating resin layer existing between the pattern layers, the protective film includes an adhesive material layer deformed by heating; a release film supply source for the front side and the back side of the temporary adhesive body of Feeding the release film at least one side greater than the thermal expansion coefficient of the protective film; and a tension applying mechanism for applying a tensile force to the release film after heat through the heating unit.

In addition, in another aspect of the present invention, in the above invention, it is preferable that, in the outer peripheral side of the first chamber, a position for upstream of the release film and the temporary adherend in the conveying direction is provided for the release. A cooling mechanism for cooling the mold film and the temporary adhesive body.

Furthermore, another aspect of the present invention is the above-mentioned invention. Preferably, the tension applying mechanism is disposed between the release film supply source and the chamber.

In addition, another aspect of the present invention is the above-mentioned invention. Preferably, the tension applying mechanism includes a clamping mechanism for clamping the release film, and a pressing mechanism for pushing the clamping mechanism toward a side opposite to a conveying direction of the release film. A unit, and an adjusting unit that adjusts the pressing force of the pressing unit.

Furthermore, in another aspect of the present invention, in the above invention, it is preferable that the tension applying mechanism includes driving for applying a tensile force to the release film by driving the release film toward a side opposite to a conveying direction thereof. A unit, and a tension detecting mechanism for detecting a tensile force acting on the release film through driving of the driving unit.

In addition, another aspect of the present invention is the above-mentioned invention. Preferably, the tension applying mechanism includes a step roller which can move in the vertical direction and applies a predetermined load to the release film by adjusting the weight.

In addition, in the method for manufacturing a flexible printed circuit board provided by the second aspect of the present invention, a release film is superimposed on a temporary bonding body formed by temporarily bonding a base laminate and a protective film, and then thermal compression bonding is performed to form The flexible printed circuit board is characterized in that it includes a heating step of temporarily bonding a protective film formed by temporarily bonding a protective film to a base laminate having an insulating resin layer and a pattern layer, and superimposing a thermal expansion coefficient larger than that of the protective film. The state of the mold film is heated; the tension applying step: applying a tensile force to the release film that is heated and thermally expanded in the heating step; the clamping step: the first sealing member provided in the first chamber and the second sealing member The second sealing member of the chamber is abutted to form a chamber which is airtightly closed from the outside, and is formed in a state where the temporary adhesive body and the release film are sandwiched by the first sealing member and the second sealing member; The inside of the chamber is evacuated; and a pressurizing step: pressurizing the temporary adherend and the release film. (Effect of invention)

According to the present invention, it is possible to provide a laminating device and a flexible printed circuit that can prevent wrinkles or bulges in a release film, and can improve the unevenness followability of the release film with respect to the uneven portions existing in the temporary adhesive body. Manufacturing method of plate.

Hereinafter, a laminating apparatus 100 for a flexible printed circuit board and a method for manufacturing a flexible printed circuit board according to an embodiment of the present invention will be described. In the following description, first, the base laminate 10, the protective film 20, and the release film 30 that are the objects to be laminated will be described, and then the laminated body 50 will be described.

<About the structure of a base laminated body and a protective film> FIG. 1: is sectional drawing which shows the structure of the base laminated body 10, the protective film 20, and the release film 30. FIG. As shown in FIG. 1, the base laminate 10 is a multilayer substrate having three pattern layers 11. That is, the base laminate 10 includes a pattern layer 11, an insulating resin layer 12, and an adhesive material layer 13 interposed therebetween.

The pattern layer 11 is formed by subjecting a metal foil having a predetermined thickness such as a copper foil to an etching process, and forming the metal foil into a desired pattern shape. As described above, in the configuration shown in FIG. 1, there are three pattern layers 11. The insulating resin layer 12 has a predetermined thickness and is made of polyimide having electrical insulation properties. However, the material of the insulating resin layer 12 may be an insulating resin other than polyimide. In the configuration shown in FIG. 1, the insulating resin layer 12 is interposed between the three pattern layers 11, and thus there are two layers in total. The bonding material layer 13 is a portion for bonding the pattern layer 11 and the insulating resin layer 12.

The protective film 20 laminated on the above-mentioned base laminate 10 includes a protective layer 21 and an adhesive material layer 22. The material of the protective layer 21 is, for example, polyimide. However, the material of the protective layer 21 may be an insulating resin other than polyimide. In addition, the main material of the adhesive material layer 22 is, for example, an epoxy-based adhesive material. In addition, a polyurethane-based adhesive material or an acrylic-based adhesive material may also be used.

As shown in FIG. 1, an opening 23 is provided in the protective film 20. The opening portion 23 is a portion formed by, for example, laser processing or punching processing using a die or punching.

In addition, the above-mentioned base laminate 10 and the protective film 20 are temporarily bonded in a state in which they are aligned. In the following description, an object formed by temporarily bonding the base laminate 10 and the protective film 20 is referred to as a temporary bonding body 40.

Next, the configuration of the release film 30 will be described. As shown in FIG. 1, the release film 30 includes a base layer 31, a buffer layer 32, and an adhesive layer (not shown) interposed therebetween. The thermal expansion coefficient of the release film 30 is greater than the thermal expansion coefficient of the protective film 20.

The base layer 31 is made of, for example, a polyester-based resin as a main component. Examples of the polyester-based resin include resins containing PET (Polyethylene Terephthalate) as a main component, and PBT (Polybutylene Terephthalate) as a main component. Resin based on resin, resin based on PTT (Polytrimethylene Terephtalate), resin based on PEN (Polyethylene Naphthalate, polyethylene naphthalate), resin based on PBN (Polybutylene Naphthalate) , Polybutylene naphthalate), and a mixture in which a resin selected from the above-mentioned resins is a main component. However, as long as it is a polyester-based resin, the listed component or other components other than the main component may be used.

In addition, the buffer layer 32 covers the protective film 20 from the protective film 20 side (upper side; Z1 side) when the protective film 20 and the base laminate 10 are laminated by heating and pressing, and follows the protective film 20 and A portion where the unevenness of the base laminate 10 is deformed. That is, when the protective layer 20 is laminated on the base laminate 10, the buffer layer 32 follows the unevenness existing between the protective film 20 and the base laminate 10 and deforms well, thereby preventing the adhesive material from moving from the adhesive material layer. 22 outflow.

The main component of the buffer layer 32 is, for example, an olefin-based resin, and examples of the olefin-based resin include a polypropylene-based resin, a polyethylene-based resin, and a polypentene-based resin.

The main material of the adhesive layer (not shown) is, for example, an epoxy-based adhesive material. In addition, a polyurethane-based adhesive material or an acrylic-based adhesive material may be used. Alternatively, an adhesive material layer may be provided instead of the adhesive material layer. Examples of the adhesive material layer include an acrylic resin, a rubber adhesive made by adding an adhesion promoter to natural rubber, a silicone adhesive made by adding an adhesion promoter to silicone rubber, and polyurethane as a main component. The urethane-based adhesive and the like are components of the adhesive material layer.

Here, in the laminating device 100 described later, the temporary bonding body 40 is superposed while being pressurized while heating the temporary bonding body 40 in a state in which the temporary bonding body 40 is overlapped with the release film 30. Then, the molten buffer layer 32 enters the opening 23 and occupies the opening 23 before the molten bonding material layer 22. Therefore, it is possible to suppress the adhesive material layer 22 from flowing out into the opening portion 23. Similarly, at the end of the base laminate 10, the molten buffer layer 32 also spreads to the end of the base laminate 10 and covers the sides thereof before the melted adhesive material layer 22, thereby suppressing the adhesive material layer 22 Outflow.

After the above-mentioned main bonding is performed, the release film 30 is peeled from the laminate 50. Thereby, only the laminated body 50 shown in FIG. 2 is left, and this laminated body 50 is wound. In addition, FIG. 2 is a cross-sectional view showing a configuration of a laminated body 50 formed by the laminating apparatus 100.

However, the release film 30 is provided to be more easily thermally expanded than the temporary adhesive body 40. Therefore, when the temporary adhesive body 40 and the release film 30 are heated by the heating plate 116 described later, the thermal expansion range of the release film 30 is larger than that of the temporary adhesive body 40, and thus wrinkles or bulges are generated on the release film 30. In order to prevent the above-mentioned wrinkles or bulges, a temporary bonding body 40 and a release film 30 are formally bonded using a laminating device 100 described later.

Here, the laminated body 50 corresponds to a flexible printed circuit board, but it can also be understood that an object formed by performing various processes on the laminated body 50 corresponds to a flexible printed circuit board.

<About the structure of a lamination apparatus> Hereinafter, the structure of the lamination apparatus 100 for forming the said laminated body 50 is demonstrated. FIG. 3 is a diagram showing a schematic configuration of the laminating apparatus 100. FIG. 4 is a schematic perspective view showing the lower chamber 110 and the upper chamber 130 constituting the main body portion 101 of the laminating apparatus 100. FIG. 5 is a schematic cross-sectional view showing a main part of a configuration of the laminating apparatus 100. FIG. 6 is a plan view showing the configuration when the lower chamber 110 is viewed from above. As shown in FIG. 3, the laminating apparatus 100 includes a main body portion 101, an FPC supply source 140, a release film supply source 150, a cloth sheet supply source 160, an FPC winding portion 170, and a release film winding portion. 180 and cloth sheet winding section 190.

The main body portion 101 is a portion where the temporary adhesive body 40 and the release film 30 are overlapped, and then the cloth sheet 60 is superimposed to perform thermal compression bonding, thereby forming the laminated body 50 from the temporary adhesive body 40. Here, the cloth sheet 60 is a cloth sheet containing a material with low adhesiveness with respect to the adhesive material layer 22, for example, glass cloth containing glass fiber, and the cloth sheet 60 is used to prevent the laminate 50 from sticking to The sheet on the upper chamber 130 or the lower chamber 110 will be described later.

After the main bonding is performed by the laminating apparatus 100, the release film 30 is peeled from the laminated body 50 taken out from the chamber 102. Accordingly, the laminated body 50 can be formed in a state where the outflow of the adhesive material layer 22 toward the opening 23 is suppressed.

The main body portion 101 of the laminating apparatus 100 includes a lower chamber 110 made of aluminum and an upper chamber 130 also made of aluminum, and a chamber 102 is formed through the lower chamber 110 and the upper chamber 130 (see FIG. 5). . The lower chamber 110 includes a lower abutment 111 and a chamber block 112. The lower base 111 is a part which supports the lower chamber 110 from a lower side, and is attached to the up-and-down driving mechanism 119 mentioned later.

The chamber block 112 is mounted on the lower base 111 via a positioning mechanism 113 such as a latch or a V-shaped block. The chamber block 112 is formed of a metal (for example, aluminum) having good thermal conductivity as a material. A concave storage portion 114 is provided on the upper surface side of the chamber block 112. A heat insulating material 115 is stored in the storage portion 114. As the heat insulating material 115, for example, a silicon compound, alumina, or a mixture thereof may be used, and other inorganic compounds may be used.

Further, a heating plate 116 is housed in an upper portion of the heat insulating material 115, and a cushion member M1 made of an elastic member such as rubber is arranged in an upper portion of the heating plate 116. Here, a heater 116a such as a cartridge heater is built in the heating plate 116, and a laminate including the temporary adhesive body 40 and the release film 30 is heated through the heater 116a. Thereby, the heating plate 116 can thermocompression-bond the temporary bonding body 40 and the release film 30 from the lower side (Z2 side) via the gasket member M1. The heating plate 116 corresponds to a heating unit.

In addition, as shown in FIGS. 4 to 6, a cooling mechanism 117 is provided in the lower chamber 110 at a position closer to the outer peripheral side than the storage portion 114. The cooling mechanism 117 is a mechanism for preventing the temporary adhesion body 40 from being thermally solidified at a position closer to the upstream side than the chamber 102. That is, the temporary adhesive body 40 and the release film 30 are thermally pressure-bonded inside the chamber 102. However, if the heat at this time is transmitted to the upstream side of the temporary adhesive body 40, it is closer to the chamber 102 than the chamber 102. At the upstream side, the bonding material layer 22 of the temporary bonding body 40 starts to be thermally cured. The cooling mechanism 117 is provided in order to prevent the thermal curing.

The cooling mechanism 117 includes a cooling water path 117 a through which cooling water passes. A plurality of cooling water paths 117 a are provided in the transport direction of the temporary adherend 40 and the release film 30. In addition, the cooling water path 117a can also be provided in a zigzag manner in the lower chamber 110 by passing one cooling water path 117a, so that there are multiple in the above-mentioned conveying direction, and a plurality of other can be provided in the lower chamber 110. Cooling water path 117a.

By providing the cooling mechanism 117, the temperature of the cooling region A (see FIG. 6) in which the cooling mechanism 117 is present is significantly lower than that of the lamination region B in which the lamination is performed in the chamber 102. As an example, if the laminated body 50 is formed at 180 ° C. in the laminated area B, the temporary adhesive body 40 and the release film 30 can be maintained at a temperature far below 180 ° C. (for example, 60 ° C.) in the cooling area A ).

A lower seal member 118 is mounted in the lower chamber 110. The portion on the upstream side in the conveyance direction of the lower seal member 118 is disposed within the arrangement range of the cooling mechanism 117 in the conveyance direction. Therefore, the part on the upper surface side of the lower chamber 110 cooled by the cooling mechanism 117 is divided into two by the lower sealing member 118. Therefore, there is a state in which the portion of the temporary bonded body 40 and the laminated body 50 is cooled by the cooling mechanism 117 in the interior surrounded by the lower sealing member 118.

In addition, the mounting position of the lower seal member 118 in the lower chamber 110 is set such that, when the expansion plate 137 described later is expanded during extrusion, the expansion of the expansion plate 137 is not hindered, and the chamber 102 is When the inside of the chamber is evacuated, the vacuum degree of the chamber 102 can be sufficiently ensured.

The lower seal member 118 is formed of a material that can be elastically deformed, such as rubber or elastomer. The lower seal member 118 is a member that abuts on an upper seal member described later and sandwiches the temporary adhesive body 40 and the release film 30. Through the docking, a cavity 102 closed to the outside is formed. In addition, by operating a vacuum pump 121 described later, the inside of the chamber 102 can be evacuated.

The lower sealing member 118 may be, for example, a lip seal, an O-ring, or other members.

In addition, the main body portion 101 is provided with an up-and-down driving mechanism 119, and the lower chamber 110 is moved up and down by the operation of the up-and-down driving mechanism 119. In addition, the up-and-down driving mechanism 119 may be configured to include, for example, a hydraulic cylinder 119a, and generate a driving force for moving the lower chamber 110 up and down by the operation of the hydraulic cylinder 119a. However, the vertical driving mechanism 119 may move the lower chamber 110 up and down by driving a motor, and may also move the lower chamber 110 up and down by using a pneumatic cylinder.

In addition, an air release valve 120a is provided in the main body portion 101, and the air release valve 120a is provided in the middle portion of the air introduction passage 120b. In addition, one end portion of the air introduction passage 120b is opened at a predetermined portion of the lower chamber 110 surrounded by the lower sealing member 118. Therefore, when the atmosphere release valve 120a is opened after the inside of the chamber 102 is evacuated, the internal pressure of the chamber 102 can be made equal to the atmospheric pressure via the air introduction passage 120b.

A vacuum pump 121 is provided in the main body portion 101, and the vacuum pump 121 is connected to the air exhaust passage 122. An end portion of the air exhaust passage 122 is opened at a predetermined portion of the lower chamber 110 surrounded by the lower sealing member 118. Therefore, when the vacuum pump 121 is operating, the inside of the chamber 102 is evacuated via the air discharge passage 122. Thereby, the air remaining in the unevenness inside the temporary adherend 40 can be exhausted. The vacuum pump 121 may be provided outside the main body portion 101. The vacuum pump 121 corresponds to a suction unit.

In addition, the upper chamber 130 facing the lower chamber 110 includes an upper base 131 and a chamber block 132. The upper base 131 is a portion that supports the chamber block 132 from the upper side. In addition, the upper base 131 is attached to a fixing portion (not shown). The chamber block 132 is mounted on the upper base 131 via a positioning mechanism 133 such as a latch or a V-shaped block. Like the chamber block 112, the chamber block 132 is also formed of a metal (for example, aluminum) having good thermal conductivity as a material.

In addition, a concave storage portion 131a is provided on the upper surface side of the upper base 131, and a heat insulating material 131b is stored in the storage portion 131a. Similar to the heat-insulating material 115, for example, a silicon compound, alumina, or a mixture thereof may be used as the heat-insulating material 131b, but other inorganic compounds may be used. The heat insulating material 131b is a member that prevents heat from a heating plate 133 described below from being transmitted to the upper side of the laminating apparatus 100.

A heating plate 133 is arranged below the upper base 131. A heater 133a such as a cartridge heater is built in the heating plate 133, and a telescopic plate 137 to be described later is heated via the chamber block 132 through the heater 133a. The laminated body formed with the release film 30 is heated. Thereby, the temporary bonding body 40 and the release film 30 can be thermocompression-bonded from the upper side (Z1 side).

In addition, the upper chamber 130 is also provided with a cooling mechanism 135 similar to the cooling mechanism 117, and through the cooling mechanism 135, thermal solidification is prevented from occurring in the temporary adhesive body 40 closer to the upstream side than the chamber 102 from the upper side. This cooling mechanism 135 has a cooling water path 135a similar to the cooling water path 117a. A plurality of cooling water paths 135 a are also provided in the transport direction of the temporary adherend 40 and the release film 30. In addition, the cooling water path 135a may be provided in a zigzag manner in the upper chamber 130 by passing one cooling water path 135a, so that there are multiple in the above-mentioned conveying direction, and there may also be multiple in the upper chamber 130. Cooling water path 135a.

An upper-side sealing member 136 is mounted in the upper-side chamber 130. The upper seal member 136 is formed of a material that can be elastically deformed, such as rubber or elastomer, like the lower seal member 118. The upper seal member 136 may be, for example, a lip seal, an O-ring, or other members. The upper-side sealing member 136 and the lower-side sealing member 118 are docked with the temporary adhesive body 40 and the release film 30 sandwiched therebetween, thereby forming a cavity 102 closed to the outside. In addition, by operating the vacuum pump 121, the inside of the chamber 102 can be evacuated. The lower seal member 118 corresponds to a first seal member, and the upper seal member 136 corresponds to a second seal member. However, the lower seal member 118 may correspond to the second seal member, and the upper seal member 136 may correspond to the first seal member.

A telescopic plate 137 is attached to the upper chamber 130. The telescopic plate 137 is a sheet-like member formed of a stretchable material such as silicone rubber, polyurethane, or natural rubber. The outer peripheral edge portion of the telescopic plate 137 is continuously and tightly fixed to the upper chamber 130. On the other hand, the portion surrounded by the outer peripheral edge portion of the telescopic plate 137 is not tightly fixed to the upper chamber 130. Therefore, a closed space 137 a that is closed to the outside is formed between the upper chamber 130 and the telescopic plate 137, and this closed space 137 a cannot allow air to flow downward through the telescopic plate 137. The telescopic plate 137 corresponds to a pressing unit. However, the telescopic plate 137 and the vacuum pump 139b or the air introduction channel 138a may correspond to a squeezing unit.

In addition, an end portion of the air introduction passage 138 a is opened on the upper bottom portion 132 a of the chamber block 132, and an end portion of the air discharge passage 139 a is also opened on the upper bottom portion 132 a of the chamber block 132. The air introduction passage 138a is a flow passage that introduces air into the closed space 137a. The air introduction passage 138a is connected to the pressurizing mechanism 138b, so that the closed space 137a can be pressurized by the operation of the pressurizing mechanism 138b. Therefore, when the inside of the chamber 102 is evacuated, the pressurizing mechanism 138b is operated to introduce air into the closed space 137a for pressurization, and the telescopic plate 137 expands.

The pressurizing mechanism 138b is preferably a compressor or a booster valve capable of applying a predetermined pressure. In addition, when the pressure does not need to be too large, the pressure release mechanism 138b may use an atmospheric release valve.

The air discharge passage 139a is connected to a vacuum pump 139b. Therefore, when the vacuum pump 139b is operated, the air inside the closed space 137a is exhausted through the air exhaust passage 139a. Therefore, when the vacuum pump 139b is operated with the expansion plate 137 expanded, the expansion plate 137 can be contracted. In addition, at least one of the pressurizing mechanism 138b and the vacuum pump 139b may be provided in the main body portion 101 or may be provided outside the main body portion 101.

In addition, the lower chamber 110 corresponds to a first chamber, and the upper chamber 130 corresponds to a second chamber. However, the lower chamber 110 may correspond to the second chamber, and the upper chamber 130 may correspond to the first chamber.

In addition, the laminating apparatus 100 is provided with an FPC supply source 140, a release film supply source 150, and a cloth sheet supply source 160. A supply roller 141 is provided in the FPC supply source 140, and the temporary bonding body 40 is held on the supply roller 141 in a state of being wound into a roll shape. Therefore, the temporary bonded body 40 can be drawn out from the supply roller 141 toward the main body 101 side and supplied. The FPC supply source 140 corresponds to a temporary adhesive supply source.

In addition, as shown in FIG. 3, the release film supply source 150 is provided on the upper side (one side; Z1 side) and the lower side (the other side; Z2 side) with the temporary adhesive 40 interposed therebetween. A supply roll 151 is also provided in the release film supply source 150, and the release film 30 is held on the supply roll 151 in a state of being wound into a roll. Therefore, the release film 30 can be drawn out from the supply roller 151 toward the main body 101 side and supplied.

In addition, the cloth sheet supply source 160 is also provided on the upper side (one side; Z1 side) and the lower side (the other side; Z2 side) with the temporary adhesive body 40 therebetween. The cloth sheet supply source 160 is also provided with a supply roller 161, and the cloth sheet 60 is held on the supply roller 161 in a state of being wound into a roll. Here, the cloth sheet supply source 160 located on the upper side (one side; Z1 side) supplies the cloth sheet 60 in a state of being disposed on the upper side (one side; Z1 side) of the release film 30. In addition, the cloth sheet supply source 160 located on the lower side (the other side; the Z2 side) supplies the cloth sheet 60 in a state of being disposed on the lower side (the other side; the Z2 side) of the release film 30. Thereby, the cloth sheet 60 can be drawn out from the supply roller 161 toward the main body 101 side and supplied.

In addition, the laminating apparatus 100 is provided with an FPC winding section 170, a release film winding section 180, and a cloth sheet winding section 190. The FPC winding section 170 is provided with a winding roller 171 and a driving motor 172. Therefore, the laminated body 50 is wound on the winding roller 171 by the driving of the driving motor 172.

The release film winding unit 180 is also provided with a winding roller 181 and a drive motor 182. Therefore, the release film 30 is wound on the winding roller 181 by the driving of the driving motor 182. Similarly, the cloth sheet winding section 190 is also provided with a winding roller 191 and a driving motor 192. Therefore, the cloth sheet 60 is wound around the winding roller 191 by the driving of the driving motor 192.

Here, the laminating apparatus 100 includes a tension applying mechanism 200. The tension applying mechanism 200 is a mechanism that applies tension to the release film 30 by stretching the release film 30. Examples of such a tension applying mechanism 200 include a first configuration example to a third configuration example described below.

(First Configuration Example of Tension Application Mechanism) FIG. 7 is a diagram showing a first configuration example of the tension application mechanism 200. In the following description, the tension applying mechanism 200 according to the first configuration example will be described as a tension applying mechanism 200A. However, when it is not necessary to distinguish between the tension application mechanism 200A according to the first configuration example, the tension application mechanism 200B according to the second configuration example described later, and the tension application mechanism 200C according to the third configuration example described later, the tension application mechanism 200A to 200C are collectively referred to as a tension applying mechanism 200. As shown in FIG. 7, the tension applying mechanism 200A includes a clamping mechanism 210, a squeeze cylinder 220, and an adjuster 230. The clamp mechanism 210 includes a pair of clamp members 211 and 212, a clamp cylinder 213, and a slide rail 214.

The pair of clamp members 211 and 212 are long plate-shaped members. The pair of clamp members 211 and 212 are composed of an upper clamp member 211 and a lower clamp member 212. The upper clamping member 211 is arranged on the upper side (one side; Z1 side) with the release film 30 interposed therebetween. The lower clamping member 212 is disposed on the lower side (the other side; the Z2 side) with the release film 30 interposed therebetween.

The clamping cylinder 213 is, for example, a mechanism that moves the upper clamping member 211 toward the lower clamping member 212 in a state where pressure is applied. Specifically, the cylinder 213 a of the clamping cylinder 213 is fixed to a fixing portion (not shown), and the upper clamping member 211 is attached to a lower end of a piston (not shown) of the clamping cylinder 213. Therefore, by operating the clamping cylinder 213 in the pressurizing direction, the upper clamping member 211 is moved toward the lower clamping member 212 with a pressure applied, and the upper clamping member 211 and the lower clamping member 212 can be used. Clip the release film 30.

The upper clamp member 211 can be moved in the up-down direction (Z direction) with respect to the lower clamp member 212 through a guide mechanism (not shown).

The slide rail 214 is a rail-like portion for sliding the entire clamping mechanism 210. In addition, as the slide rail 214, for example, a mechanism having a small sliding load such as a linear rail is preferable.

The squeeze cylinder 220 is a portion that applies a driving force to move the clamp mechanism 210 along the slide rail 214. The squeeze cylinder 220 is provided with a cylinder 221 similarly to the clamp cylinder 213, and the piston 222 can be moved in and out of the cylinder 221. In the configuration shown in FIG. 7, a baffle plate 215 protruding from the lower clamping member 212 toward the lower side (Z2 side) is fixed to the lower clamping member 212, and the front end side of the piston 222 abuts against the stop Board 215 (or connected to it). However, a configuration in which the front end side of the piston 222 directly abuts on (or is connected to) the lower clamping member 212 or the upper clamping member 211 may be adopted.

Here, the pressing cylinder 220 is operated in a state where the clamping cylinder 213 is operated and the release film 30 is sandwiched by a pair of clamping members 211 and 212, so that the orientation film is applied to the release film 30. Tension on the roller 151 side (upstream side).

In addition, the regulator 230 is a mechanism that measures the squeezing force of the squeezing cylinder 220 during operation and adjusts the squeezing force of the squeezing cylinder 220. Therefore, by adjusting the pressing force of the pressing cylinder 220 with high accuracy through the regulator 230, the tension applied to the release film 30 can be adjusted with high accuracy. In addition, the regulator 230 corresponds to an adjustment unit.

In the tension applying mechanism 200A according to the above-mentioned first configuration example, the clamping roller is used in a state in which the winding roller 181 on the release film winding portion 180 side is not rotated (or a state in which a large torque is required for rotation). The cylinder 213 operates to sandwich the release film 30 by a pair of clamping members 211 and 212. In this state, the squeeze cylinder 220 is operated while the squeeze force is adjusted by the regulator 230, so that the piston 222 is pushed out. Then, tension is applied to the release film 30 toward the upstream side in the conveyance direction.

By applying the tension and adjusting the tension by the regulator 230, it is possible to prevent wrinkles or bulges from occurring on the release film 30 that is thermally expanded by being heated by the heating plate 116.

(Second Configuration Example of the Tension Application Mechanism) FIG. 8 is a diagram showing a second configuration example of the tension application mechanism 200. In the following description, the tension applying mechanism 200 according to the second configuration example will be described as a tension applying mechanism 200B. As shown in FIG. 8, the tension applying mechanism 200B according to the second configuration example includes a driving roller 240 and a tension detector 250. The driving roller 240 is a roller that applies a driving force to the release film 30 at least from the downstream side toward the upstream side in the conveyance direction. Therefore, the driving force is applied to the driving roller 240 through the driving motor 241. In addition, in the configuration shown in FIG. 8, a driven roller 242 is provided in addition to the driving roller 240. However, a configuration in which the driven roller 242 is omitted may be adopted. The drive motor 241 corresponds to a drive unit.

The tension detector 250 includes a roller portion 251 and a sensor portion 252. The roller portion 251 is a roller that follows the conveyance of the release film 30 in a state where tension is applied to the release film 30. The sensor section 252 is a sensor that measures the tension applied to the roller section 251. The sensor unit 252 includes a sensor unit using, for example, a strain gauge method. Alternatively, the release film 30 may be wound around a roll portion 251 at a predetermined angle, and the pressure applied from the release film 30 may be measured. Load, and other types of sensors.

In the tension applying mechanism 200B according to the second configuration example described above, a tension is applied to the release film 30 toward the upstream side in the conveyance direction by the operation of the drive motor 241. At this time, the tension applied to the release film 30 can be measured by the tension detector 250. Therefore, it is not necessary to clamp the release film 30, and it is possible to measure the tension applied to the release film 30 while conveying the release film 30 toward the upstream side in the conveying direction, so that the tension applied to the release film 30 can be directly measured, and Adjust the tension immediately.

By adjusting this tension, it is possible to prevent wrinkles or bulges from occurring on the release film 30 that is thermally expanded by being heated by the heating plate 116.

(Third Configuration Example of Tension Application Mechanism) FIG. 9 is a diagram showing a third configuration example of the tension application mechanism 200. In the following description, the tension applying mechanism 200 according to the third configuration example will be described as a tension applying mechanism 200C. As shown in FIG. 9, the tension applying mechanism 200C includes a step roller 260. The step roller 260 is a roller provided so that it can move to a lower side in a free state via a moving mechanism (not shown). However, the moving mechanism can lift the step roller 260 toward the upper side, thereby releasing the stretched state of the release film 30. An adjustment weight of a predetermined weight (not shown) is connected to the step roller 260. The adjustment weight is set to a weight that can remove wrinkles or bulges when the release film 30 is thermally expanded by being heated by the heating plate 116.

A tension is applied to the release film 30 toward the upstream side in the conveyance direction via the step roller 260. In addition, through the adjustment of the weight described above, tension is applied to the release film 30 to the extent that wrinkles or bulges can be removed when the release film 30 is thermally expanded by heating with the heating plate 116. Therefore, it is possible to prevent wrinkles or bulges from occurring on the release film 30 that is thermally expanded by being heated by the heating plate 116.

＜ About the manufacturing method of flexible printed circuit board ＞

Hereinafter, a method for manufacturing a flexible printed circuit board using the lamination device 100 configured as described above will be described. In the following description, the description will be made in the order of the first step to the tenth step, but it goes without saying that various other steps may exist.

(1) First step: heating the new temporary adhesive body 40 (corresponding to the heating step) First, the temporary adhesive body 40, the release film 30, and the cloth sheet 60 in a state that has not yet been formed into the laminated body 50. It is supplied to the upper part of the heating plate 116 together. At this time, the temperature of the heating plate 116 is set to such an extent that the adhesive material layer 22 and the buffer layer 32 are melted. In addition, by heating using the heating plate 116, the temporary bonding body 40 and the release film 30 are thermally expanded. At this time, the thermal expansion of the release film 30 is larger than that of the temporary adhesive body 40. Therefore, since the size of the release film 30 is larger than the size of the temporary bonding body 40, wrinkles or ridges are formed on the release film 30.

(2) Second step: Applying tension to the release film 30 through the tension applying mechanism 200 (corresponding to the tension applying step) Next, a predetermined time elapses after the temporary adhesive body 40 and the release film 30 are heated using the heating plate 116 After that, the tension applying mechanism 200 is operated to move the release film 30 toward the upstream side in the conveying direction by a predetermined distance. At this time, on the downstream side in the conveying direction of the main body portion 101, the winding roller 181 of the release film winding portion 180 is in a state where it does not operate and does not rotate. Then, the release film 30 is stretched in the conveyance direction. At this time, a tensile force is also applied to the release film 30 that is particularly present on the upper part of the heating plate 116 and becomes flexible, and the release film 30 is stretched in the conveying direction by the tensile force.

On the other hand, in the width direction of the release film 30, the release film 30 shrinks slightly in response to elongation in the conveying direction. At this time, the tensile force applied by the tension applying mechanism 200 is such that wrinkles or bulges generated in the release film 30 can be eliminated.

In the case of the tension applying mechanism 200A according to the first configuration example, the clamping mechanism 210 is operated, and the release film 30 is sandwiched by a pair of clamping members 211 and 212. In this state, when the pressing force is adjusted by the regulator 230 and the pressing cylinder 220 is operated, it is possible to apply a stretching force to the wrinkle or swelling to the release film 30.

In addition, in the case of the tension applying mechanism 200B according to the second configuration example, the driving motor 241 is operated to apply a tensile force to the release film 30 through the driving roller 240. At this time, by measuring the tension applied to the release film 30 with the tension detector 250 and driving the driving roller 240, it is possible to apply a stretching force to the release film 30 to eliminate wrinkles or bulges.

In the case of the tension applying mechanism 200C according to the third configuration example, a tensile force can be applied to the release film 30 via the step roller 260. At this time, by adjusting the weight of the adjustment weight, the wrinkle or bulge in the release film 30 can be eliminated by applying a stretching force to the wrinkle or bulge to the release film 30 through the step roller 260.

(3) Third step: raising the lower chamber 110 (corresponding to the clamping step) Next, the up-and-down driving mechanism 119 is operated to raise the lower chamber 110. At this time, the vacuum pump 139b is operated to discharge the air in the closed space 137a. Thereby, the telescopic plate 137 can be contracted, and even if the up-and-down driving mechanism 119 is operated, the telescopic plate 137 can be in a retracted state that does not apply pressure to the temporary adhesive body 40 and the release film 30.

Then, after lowering the lower chamber 110 toward the upper chamber 130 by a predetermined distance, the lower sealing member 118 and the upper sealing member 136 are docked in a state of sandwiching the temporary adhesive body 40, the release film 30, and the cloth sheet 60. . As a result, the cavity 102 closed to the outside is formed.

(4) Fourth step: evacuating the chamber 102 (corresponding to the suction step) Next, the vacuum pump 121 is operated to evacuate the inside of the chamber 102. As a result, air that has entered the uneven portions (including the openings 23) of the temporary adherend 40 is discharged.

(5) Fifth step: pressurizing by the operation of the pressurizing mechanism 138b (corresponding to the pressurizing step) Next, the pressurizing mechanism 138b is operated to introduce air into the closed space 137a in a pressurized state. As a result, the expansion and contraction plate 137 is stretched, and the release film 30 is pressed toward the temporary adhesive body 40 in a pressurized state via the cloth sheet 60. During this pressurization, the adhesive layer 22 of the protective film 20 and the buffer layer 32 of the release film 30 are melted by heating by the heating plate 116 described above. In addition, the buffer layer 32 is melted before the adhesive material layer 22 is melted, and deforms following the uneven portions including the opening 23. Therefore, the adhesive material layer 22 can be prevented from flowing out to the remaining portions such as the opening 23 and the protective film 20 can be adhered to the base laminate 10. Thereby, the laminated body 50 in the state in which the release film 30 was closely adhered was formed.

(6) Sixth step: releasing the tensile force applied by the tension applying mechanism 200 to the release film 30 Next, the tensile force applied by the tension applying mechanism 200 to the release film 30 is released. Here, in the case of the tension applying mechanism 200A according to the first configuration example, the clamping mechanism 210 is operated to release the pair of clamping members 211 and 212 from the release film 30 to release the release film. 30 tensile force.

In addition, in the case of the tension applying mechanism 200B according to the second configuration example, the driving motor 241 is stopped and the rotation torque is not applied from the driving motor 241 to release the stretching of the release film 30. force. In the case of the tension applying mechanism 200C according to the third configuration example, the step roller 260 is lifted by the moving mechanism to release the tensile force of the release film 30.

(7) Seventh step: exhausting the air in the closed space 137a Next, the vacuum pump 139b is operated to exhaust the air in the closed space 137a. As a result, the telescopic plate 137 is separated from the cloth sheet 60. Therefore, the state in which the laminated body 50 and the release film 30 are pressure-bonded via the cloth sheet 60 is released.

(8) Eighth step: release air into the chamber 102 Next, the air release valve 120a is opened so that the internal pressure of the chamber 102 is the same as the atmospheric pressure. By this atmospheric release, the state where the lower seal member 118 and the upper seal member 136 are firmly abutted is released.

(9) Ninth step: lowering the lower chamber 110 Next, the upper and lower driving mechanisms 119 are operated to lower the lower chamber 110. Thereby, the laminated body 50 becomes a state which can be moved to a downstream side.

(10) Tenth step: outputting the laminated body 50 (supplying a new temporary adhesive body 40 to the heating plate 116) Next, the drive motor 172 of the FPC winding section 170 is operated, and a layer to be formed inside the chamber 102 The pressure body 50 is output toward the downstream side. At this time, the driving motor 192 of the cloth sheet winding section 190 is also operated. Thereby, the cloth sheet 60 and the release film 30 are separated and wound on the winding roll 191. In addition, the drive motor 182 of the release film winding part 180 is also operated together with the drive motor 172. Thereby, the release film 30 is peeled from the laminated body 50, and it is wound by the winding roll 181.

Thereby, a laminated body 50 corresponding to a flexible printed circuit board is formed.

<About effects> According to the laminated device 100 and the method for manufacturing a flexible printed circuit board having the above-mentioned configuration, the following effects can be produced.

That is, the laminating apparatus 100 according to this embodiment includes a chamber 102 and a vacuum pump 121 (suction unit) that evacuates the inside of the chamber 102. The chamber 102 is provided in the lower chamber 110 (the first chamber). ) And the lower sealing member 118 (the first sealing member) and the upper sealing member 136 (the second sealing member) provided in the upper chamber 130 (the second chamber) are abutted, and are airtight from the outside. Closed. In addition, the laminating apparatus 100 according to this embodiment includes a heating plate 116 (heating unit) and a telescopic plate 137 (extrusion unit). The heating plate 116 is disposed inside the chamber 102 and is configured to temporarily adhere to the bonded body 40 and the release film 30. Heating; the telescopic plate 137 is arranged inside the chamber 102 and presses the temporary adhesive body 40 and the release film 30 in a pressurized state; and further includes an FPC supply source 140 (temporary adhesive body) for supplying the temporary adhesive body 40 Supply source), the temporary bonding body 40 is formed by temporarily bonding the base laminate 10 and the protective film 20, wherein the base laminate 10 includes a plurality of pattern layers 11 having conductivity, and the pattern layers 11 are present in the pattern layers 11. The insulating resin layer 12 and the protective film 20 are provided with an adhesive material layer 22 deformed by heating. In addition, the laminating apparatus 100 includes a release film supply source 150 for supplying a thermal expansion coefficient greater than a protective film to at least one of the front side and the back side of the temporary bonding body 40 and a tension applying mechanism 200. The release film 30 of 20, and the tension applying mechanism 200 applies a tensile force to the release film 30 heated by the heating plate 116 (heating means).

Therefore, the temporary bonded body 40 can be thermocompression-bonded in a state of being connected without being cut into long strips, thereby forming a laminated body 50. Further, by applying a tensile force to the release film 30 by using the tension applying mechanism 200, wrinkles or bulges caused by thermal expansion of the release film 30 are stretched in the conveyance direction of the release film 30. In addition, in the width direction of the release film 30, the release film 30 is slightly contracted in response to elongation in the conveying direction. Therefore, the release film 30 can be prevented from being wrinkled or raised due to thermal expansion.

Thereby, the occurrence of wrinkles or bulges on the release film 30 can be prevented, and the wrinkles or bulges can be prevented from being transferred to the laminate 50. Therefore, the laminated body 50 can be prevented from becoming a defective product.

The laminating apparatus 100 according to the present embodiment includes a vacuum pump 121 (suction unit), and evacuates the inside of the chamber 102. Therefore, the buffer layer 32 of the release film 30 can be deformed so as to follow the uneven portions of the temporary adhesive body 40 well. Thus, even a multilayer substrate having three or more pattern layers 11 and having a large size of the uneven portions, the buffer layer 32 of the release film 30 can be deformed to follow the uneven portions well. Therefore, it is possible to prevent the adhesive material layer 22 from flowing out well.

In addition, in the present embodiment, the release film 30 is provided on the outer peripheral side of the lower chamber 110 (first chamber) at a position upstream of the release film 30 and the temporary adhesive body 40 in the conveying direction. A cooling mechanism 117 that cools the temporary bonded body 40. Thus, by providing the cooling mechanism 117, it is possible to prevent heat from being transmitted to the release film 30 and the temporary adhesive body 40 which are closer to the upstream side in the conveyance direction than the lower chamber 110 (the first chamber). Therefore, it is possible to prevent the release film 30 and the temporary bonding body 40 on the upstream side in the conveyance direction from being cured by being transferred with heat.

In the present embodiment, the tension applying mechanism 200 is disposed between the release film supply source 150 and the chamber 102. Therefore, it is possible to apply a tensile force to the release film 30 toward the side opposite to its conveyance direction through the tension applying mechanism 200. Therefore, wrinkles or bulges on the release film 30 can be prevented well.

Furthermore, the tension applying mechanism 200A according to the first configuration example includes a clamping mechanism 210 that holds the release film 30, and a pressing cylinder 220 (squeeze) that pushes the clamping mechanism 210 toward the side opposite to the conveying direction of the release film 30. Pressure unit) and a regulator 230 (adjustment unit) that adjusts the pressing force of the squeeze cylinder 220 (pressing unit).

Therefore, the pressing force of the pressing cylinder 220 (pressing unit) can be adjusted with high precision by the regulator 230 (adjusting unit), and thereby wrinkles or bulges of the release film 30 can be favorably eliminated.

In addition, the tension applying mechanism 200B according to the second configuration example includes a driving motor 241 (driving unit) and a tension detector 250 (tension detecting unit). The driving motor 241 transmits the release film 30 toward the side opposite to the conveying direction thereof. The driving force is applied to apply a tensile force to the release film 30, and the tension detector 250 is configured to detect the tensile force applied to the release film 30 through the driving of the driving motor 241 (drive unit).

Therefore, it is possible to measure the pressing force of the drive motor 241 (drive unit) with high accuracy using the tension detector 250 (tension detection unit), so that wrinkles or bulges of the release film 30 can be eliminated well.

Furthermore, the tension applying mechanism 200C according to the third configuration example includes a step roller 260 that can move in the vertical direction and applies a predetermined load to the release film 30 by adjusting the weight. Therefore, it is possible to favorably apply a tensile force to the release film 30 via the step roller 260. Thereby, wrinkles and bulges of the release film 30 can be satisfactorily eliminated.

In addition, the method for manufacturing a flexible printed circuit board according to this embodiment includes a heating step of heating the temporary adhesive body 40 in a state in which the release film 30 is overlapped, wherein the temporary adhesive body 40 temporarily adheres the protective film 20 to The insulating resin layer 12 and the pattern layer 11 are formed on the base laminate 10. The thermal expansion coefficient of the release film 30 is greater than the thermal expansion coefficient of the protective film 20. The tension application step is a release film that is heated and thermally expanded in the heating step. 30. Apply a tensile force; the clamping process causes the lower sealing member 118 (first sealing member) provided in the lower chamber 110 (first chamber) and the lower sealing member 118 (first sealing member) provided in the upper chamber 130 (second chamber) The upper sealing member 136 (second sealing member) is abutted to form a chamber 102 which is airtightly closed from the outside, and the lower chamber 110 (first sealing member) and the upper chamber 130 (second sealing member) are used. ) A state in which the temporary adhesive body 40 and the release film 30 are sandwiched; a suction process, which evacuates the inside of the chamber 102; and a pressurizing process, which presses the temporary adhesive body 40 and the release film 30.

Therefore, the temporary bonded body 40 can be thermocompression-bonded in a state of being connected without being cut into long strips, thereby forming a laminated body 50. In addition, by applying a tensile force to the release film 30 in the tension applying step, wrinkles or bulges caused by thermal expansion of the release film 30 are stretched in the conveyance direction of the release film 30. In addition, in the width direction of the release film 30, the release film 30 is slightly contracted in response to elongation in the conveying direction. Therefore, the release film 30 can be prevented from being wrinkled or raised due to thermal expansion.

Thereby, the occurrence of wrinkles or bulges on the release film 30 can be prevented, and the wrinkles or bulges can be prevented from being transferred to the laminate 50. Therefore, the laminated body 50 can be prevented from becoming a defective product.

In the present embodiment, the inside of the chamber 102 is evacuated in the suction step. Therefore, the buffer layer 32 of the release film 30 can be deformed so as to follow the uneven portions of the temporary adhesive body 40 well. Thus, even a multilayer substrate having three or more pattern layers 11 and having a large size of the uneven portions, the buffer layer 32 of the release film 30 can be deformed to follow the uneven portions well. Therefore, it is possible to prevent the adhesive material layer 22 from flowing out well.

<Modifications> An embodiment of the present invention has been described above, but the present invention can be modified in various ways. This will be described below.

In the above-described embodiment, three pattern layers 11 are present in the base laminate 10. However, as long as the base laminate 10 has two or more pattern layers 11, it may have any number of pattern layers 11. In addition, the insulating resin layer 12 and the adhesive material layer 13 may be appropriately changed according to the total number of the pattern layers 11.

The base laminate 10 may be a so-called single-sided substrate having a single pattern layer 11. The structure of a laminating apparatus 100B for laminating a protective film 20 on the base laminate 10 is shown in FIG. 10. In the laminating apparatus 100B shown in FIG. 10, the protective film 20 is laminated on one side (for example, the front side) of the base laminate 10, and is not laminated on the other side (for example, the back side) of the base laminate 10.压 保护 膜 20。 The protective film 20. In addition, in correspondence with the protective film 20, the release film 30 is also disposed on one surface side (for example, the surface side) of the base laminate 10, and is laminated in the cavity 102.

By using the laminating apparatus 100B shown in FIG. 10, the protective film 20 can be laminated well on one side of the base laminate 10. Further, similar to the above-mentioned embodiment, by applying a tensile force to the release film 30 by the tension applying mechanism 200, wrinkles or bulges caused by the thermal expansion of the release film 30 are stretched in the conveying direction of the release film 30. . In addition, in the width direction of the release film 30, the release film 30 is slightly contracted in response to elongation in the conveying direction. Therefore, the release film 30 can be prevented from being wrinkled or raised due to thermal expansion.

Moreover, in the said embodiment, the structure provided with the control apparatus may be employ | adopted. In this case, the control device can respond to, for example, the heating of the heating plate 116, the operation of the cooling mechanism 117, the operation of the up-and-down driving mechanism 119, the operation of the atmospheric release valve 120a, the operation of the vacuum pump 121, the operation of the pressure mechanism 138b, and the vacuum pump 139b The operation of at least one of the operations of the driving motors 172, 182, and 192, the operation of the clamping cylinder 213, the operation of the squeeze cylinder 220, and the operation of the driving motor 241 is controlled.

10‧‧‧ substrate laminate

11‧‧‧ pattern layer

12‧‧‧ insulating resin layer

13‧‧‧ Adhesive material layer

20‧‧‧ protective film

21‧‧‧ protective layer

22‧‧‧ Adhesive material layer

23‧‧‧ opening

30‧‧‧ release film

31‧‧‧ basal layer

32‧‧‧ buffer layer

40‧‧‧Temporary Adhesive

50‧‧‧Laminate

60‧‧‧ Cloth Sheet

100, 100B‧‧‧Laminating device

101‧‧‧Main body

102‧‧‧ Chamber

110‧‧‧ lower chamber (corresponding to the first chamber)

111‧‧‧lower abutment

112‧‧‧ Chamber Block

113‧‧‧ Positioning agency

114‧‧‧Storage

115‧‧‧Insulation material

116‧‧‧Heating plate (corresponding to heating unit)

116a‧‧‧heater

117‧‧‧cooling mechanism

117a‧‧‧Cooling water path

118‧‧‧Lower side seal

119‧‧‧Up and down drive mechanism

119a‧‧‧hydraulic cylinder

120a‧‧‧ Atmospheric release valve

120b‧‧‧air introduction channel

121‧‧‧Vacuum pump (corresponding to suction unit)

122‧‧‧air exhaust passage

130‧‧‧ upper chamber (corresponding to the second chamber)

131‧‧‧ Upper Abutment

132‧‧‧ Chamber Block

133‧‧‧heating plate

133a‧‧‧heater

135‧‧‧cooling mechanism

136‧‧‧upper side seal

137‧‧‧Telescopic plate (corresponding to extrusion unit)

137a‧‧‧Confined space

138a‧‧‧air introduction channel

138b‧‧‧Pressure mechanism

139a‧‧‧Air exhaust passage

139b‧‧‧Vacuum pump

140‧‧‧FPC supply source (corresponding to temporary cement supply source)

141, 151, 161‧‧‧ supply roller

150‧‧‧ Release film supply source

160‧‧‧ cloth sheet supply source

170‧‧‧FPC winding section

171, 181, 191‧‧‧ Winding roller

172, 182, 192‧‧‧Drive motor

180‧‧‧ Release film winding section

190‧‧‧ Cloth sheet winding section

200, 200A, 200B, 200C‧‧‧Tension applying mechanism

210‧‧‧ Clamping mechanism

211‧‧‧upper side clamp

212‧‧‧Lower side clamping part

213‧‧‧clamping cylinder

213a‧‧‧cylinder

214‧‧‧Sliding guide

215‧‧‧ Bezel

220‧‧‧ Extrusion cylinder

221‧‧‧ cylinder

222‧‧‧Piston

230‧‧‧ Regulator (corresponds to the adjustment unit)

240‧‧‧Drive roller

241‧‧‧Drive motor (corresponding to drive unit)

242‧‧‧Driven roller

250‧‧‧ Tension detector

251‧‧‧roller

252‧‧‧Sensor Section

260‧‧‧step roller

M1‧‧‧ gasket parts

FIG. 1 is a cross-sectional view showing the structure of a base laminate, a protective film, and a release film according to an embodiment of the present invention. FIG. 2 is a sectional view showing the structure of a laminate according to an embodiment of the present invention. FIG. 3 is a diagram showing a schematic configuration of a laminating apparatus according to an embodiment of the present invention. FIG. 4 is a schematic perspective view showing a lower chamber and an upper chamber constituting a main body portion of the laminating apparatus shown in FIG. 3. Fig. 5 is a schematic cross-sectional view showing a main part of a configuration of the laminating apparatus shown in Fig. 3. FIG. 6 is a plan view showing a configuration when the lower chamber of the laminating apparatus shown in FIG. 3 is viewed from above. FIG. 7 is a perspective view showing a schematic configuration of a first configuration example of a tension applying mechanism of the laminating apparatus shown in FIG. 3. FIG. Fig. 8 is a perspective view showing a schematic configuration of a second configuration example of a tension applying mechanism of the laminating apparatus shown in Fig. 3. FIG. 9 is a diagram showing a schematic configuration of a third configuration example of the tension applying mechanism of the laminating apparatus shown in FIG. 3. FIG. 10 is a diagram showing a schematic configuration of a laminating apparatus according to a modification of the present invention.

Claims (7)

A laminating device for laminating a release film on a temporary adhesive body temporarily bonded by a base laminate and a protective film and performing thermal compression bonding, the laminating device is characterized by comprising: a cavity, It is formed by butting a first sealing member provided in the first chamber and a second sealing member provided in the second chamber, and is hermetically sealed from the outside; The inside of the chamber is evacuated; a heating unit is arranged inside the chamber and heats the temporary adhesive body and the release film; a squeezing unit is arranged inside the chamber And pressing the temporary adhesive body and the release film in a pressurized state; a temporary adhesive body supply source for supplying the temporary adhesive body temporarily bonded by a base laminate and a protective film, wherein The base laminate includes a plurality of conductive pattern layers and an insulating resin layer existing between the pattern layers, the protective film includes a bonding material layer deformed by heating; a release film supply source, For temporarily bonding At least one of a front side and a back side of the junction body supplies the release film having a thermal expansion coefficient greater than the protective film; and a tension applying mechanism for applying the release film heated by the heating unit. Tensile force. The laminating device according to claim 1, wherein, in the outer peripheral side of the first chamber, a position for upstream of the release film and the temporary adhesive in the conveying direction is provided for A cooling mechanism for cooling the release film and the temporary adherend. The laminating device according to claim 1 or 2, wherein the tension applying mechanism is disposed between the release film supply source and the chamber. The laminating device according to claim 3, wherein the tension applying mechanism includes: a clamping mechanism for clamping the release film; and a pressing unit for conveying the release film toward the release film. An opposite side of the direction pushes the clamping mechanism; and an adjustment unit for adjusting a pressing force of the pressing unit. The laminating device according to claim 3, wherein the tension applying mechanism includes: a driving unit that drives the release film by driving the release film toward a side opposite to a conveyance direction of the release film, thereby operating the release film Applying a tensile force; and a tension detecting unit for detecting a tensile force acting on the release film through driving of the driving unit. The laminating device according to claim 3, wherein the tension applying mechanism includes a step roller, and the step roller can move in the vertical direction, and a predetermined load is applied to the release film by adjusting a weight. A method for manufacturing a flexible printed circuit board, which comprises forming a flexible printed circuit board by superimposing a release film on a temporary adhesive body temporarily bonded by a base laminate and a protective film, and performing thermal compression bonding. The circuit board is characterized in that it includes: a heating step: for a temporary adhesive body formed by temporarily adhering a protective film on a base laminate having an insulating resin layer and a pattern layer, superimposing a release coefficient having a thermal expansion coefficient larger than the protective film The state of the film is heated; the tension application step: applying a tensile force to the release film that is heated and thermally expanded in the heating step; the clamping step: the first sealing member and the installation provided in the first chamber The second sealing member on the second chamber abuts to form a cavity which is airtightly closed from the outside, and is formed as the temporary adhesive body and the release film by the first sealing member and the second A state in which the sealing member is clamped; a suction step: evacuating the inside of the chamber; and a pressure step: pressing the temporary adherend and the release film.