WO1996039294A1

WO1996039294A1 - Vacuum lamination device and vacuum lamination method

Info

Publication number: WO1996039294A1
Application number: PCT/JP1996/001387
Authority: WO
Inventors: Masahiko Ogawa; Masanobu Zama
Original assignee: Kabushiki Kaisha Meiki Seisakusho; Du Pont Kabushiki Kaisha
Priority date: 1995-06-06
Filing date: 1996-05-24
Publication date: 1996-12-12
Also published as: KR19990022438A; KR100417081B1; JPH08332646A; TW440747B; JP3546333B2

Abstract

Lamination of films of plastics to one another, and a film to a base plate of wood, metal and other composite material (in particular, lamination of a photoresist forming layer to a circuit board) is continuously performed by vacuum heating and pressurization without leaving bubbles between layers. A laminated, molded product (L) is obtained by defining a closed chamber by an upper plate (1) provided with a fixed film (3), a lower plate (2) provided with a movable film (4), and a frame body (6) provided between the upper and lower plates, continuously feeding a material (H) being molded into and receiving the same in the chamber, effecting suction to not higher than one atmospheric pressure through pipes (14, 25), effecting pressurization to 2 to 10 atmospheric pressure through the pipe (25) while continuing suction through the pipe (14), pressing the material against the fixed film (3) with the movable film (4) therebetween, and heating the material by means of heating means (12, 22) provided on the upper and lower plates.

Description

Details ΐ

Technical field

The present invention relates to a vacuum laminating apparatus and a vacuum laminating method for laminating a molding material by heating and pressurizing in a vacuum atmosphere, and more particularly, in a step of manufacturing a molding material, for example, in a process of manufacturing a printed wiring board. When a film-like photoresist forming layer is laminated on the surface of a circuit board having irregularities due to circuit lines, or when a film for decoration is laminated on the surface of a flat plate-like substrate, The present invention relates to a vacuum laminating apparatus and a vacuum laminating method used when laminating molding materials. Dungeon technology

For example, when manufacturing a printed wiring board, in order to protect the electric circuit of the circuit board from etching, plating, soldering, etc., a film-like photoresist forming layer comprising a support film and a photosensitive layer is formed on the circuit board. There is a process of thermocompression bonding to the surface. The photoresist forming layer has tackiness when heated, and is pressed and laminated on the surface of the circuit board.

By the way, since the surface of the circuit board on which the film-like photoresist forming layer is laminated has an uneven sound due to the circuit lines, especially when the photosensitive layer is thinner than the circuit lines, the circuit board and the circuit board can be separated. Voids in which bubbles and the like remain between the film-like photoresist forming layer and the film-like resist forming layer are easily generated. The generated voids may expand during a high-temperature treatment in a subsequent process, for example, in a molten solder bath, and may damage the film-like photoresist forming layer, which may result in poor protection of the circuit board and poor insulation. is there.

As described above, when laminating various molding materials, the lamination is conventionally performed by heating and calo-pressing the molding materials in a vacuum atmosphere so as not to generate voids between the molding materials. Have been done.

As a conventional technique for laminating molding materials, Japanese Patent Publication No. Hei 1-14-1016 As a method for laminating a film-like photoresist forming layer on a circuit board, a film-like photoresist forming layer is brought into contact with the circuit board by a guide roll, and is sandwiched by the circuit board. It is known to laminate a film-shaped photoresist forming layer in a sealed state by applying heat and pressure with a thermocompression roll. An apparatus used in this method includes a bonding mechanism including a circuit board supply roll, a film-shaped photoresist forming layer supply roll, a guide roll, and a heat bonding roll; a chamber for sealing the entirety of the bonding mechanism; It is composed of an exhaust mechanism that reduces the pressure inside the chamber.

Further, as another conventional vacuum laminating apparatus, as disclosed in Japanese Patent Application Laid-Open No. 63-29582 / 1992, An upper plate and a lower plate which constitute an openable and closable chamber having: a rubber sheet which is provided in the chamber and which accommodates a material to be molded in a sealable manner; and a vacuum source connected to a rubber sheet. What is provided is known. In this vacuum laminating apparatus, a material to be molded is housed in a rubber sheet, the chamber is closed, the rubber sheet is sealed, and the rubber sheet in which the material to be molded is housed is evacuated by suction driving a vacuum source. The material is pressed with calo by reducing the volume in the rubber sheet as well as the atmosphere, and the material is heated by a calo-heating mechanism.

Further, as disclosed in Japanese Patent Publication No. 55-133431, a vacuum laminating method for laminating a film-like photoresist forming layer on the surface of a circuit board having irregularities has been proposed. The film is positioned adjacent to the surface of the circuit board, and the absolute ma between the uneven portion of the substrate and the photoresist forming layer of the film and the support side is reduced to 1 atm or less, and the unevenness of the circuit board and the photo resist of the film are reduced. A method that achieves pneumatic contact between the uneven portions of the substrate and the photoresist forming layer of the film by releasing the reduced pressure on the support side of the film while maintaining the reduced pressure between the forming layers. . The vacuum laminating apparatus used in this vacuum laminating method is composed of an upper plate and a "" plate which form a chamber which is divided by a film-like photoresist forming layer so as to face each other. Are provided with holes for evacuation and opening to the atmosphere, respectively.

Among the above-mentioned conventional techniques, the one disclosed in Japanese Patent Publication No. 11-140166 discloses that the inside of a chamber that seals the entire bonding mechanism is depressurized. You Therefore, there is a problem that the string cannot be satisfactorily formed due to a large volume to be evacuated and a low sealing power of the chamber. Furthermore, since the guide roll and the heat-adhesive roll make a line contact when the film-shaped photoresist forming layer is brought into contact with the circuit board and heated and pressed, the film-shaped photoresist is formed on the surface of the circuit board having irregularities. There is also a problem that the embedding property in the case of laminating layers is not sufficient. In addition, when the above-mentioned roll is used, it is very difficult to press with an appropriate pressure so that the photo resist layer strength is not damaged by the edge of the uneven portion on the substrate surface.

Among the above conventional techniques, those disclosed in Japanese Patent Application Laid-Open Nos. Sho 63-29595 and No. Sho 63-299895 require a molding material. The rubber sheet to be accommodated hangs down due to its own weight, and there was a problem in that the material to be formed inadvertently contacted. In addition, the sealed rubber sheet is subjected to a vacuum bow I to create a vacuum atmosphere in the rubber sheet containing the material to be molded, and reduce the volume in the rubber sheet to add the material to be molded. Due to the pressure, there was a problem that the pressurization was started when the atmospheric force in the rubber sheet was not s vacuum. In addition, there is a problem that the heated material having tackiness is adhered to the rubber sheet by being pressed.

Among the above-mentioned conventional techniques, in the technique disclosed in Japanese Patent Publication No. 55-133341, one of the divided chambers is opened to the atmosphere while one of the divided chambers is evacuated. As a result, the material to be molded is pressurized, so that the material to be molded cannot be sufficiently pressurized, and there is a problem that the generation of voids cannot be reduced. Among the above-mentioned conventional techniques, Japanese Patent Application Laid-Open Nos. Sho 63-29595, JP-A-63-299895, and Japanese Patent Publication No. Sho 55-133334 In the structure disclosed in the above, a sealing member for forming a chamber having airtightness when the upper plate and the lower plate are closed must be provided on at least one of the opposing surfaces of the upper plate and the lower plate. I had to. In addition, there is a large amount of waste between parts that are not compatible with the size of the upper and lower plates of the material to be molded, that is, there is much waste between adjacent molded products. In order to reduce waste, it was necessary to replace the upper and lower plates with suitable sizes. Furthermore, since the entire upper plate and lower plate are heated, there is a problem in that the energy required for heating is wasted if the size is not adapted to the size of the blank plate and the lower plate. . The present invention has been made in view of the above-described conventional technology, and prevents inadvertent contact with a material to be formed due to sagging of a film body of an upper plate and poor deaeration in a chamber, and is performed under an appropriate vacuum atmosphere. It is an object of the present invention to provide a vacuum laminating apparatus that can perform lamination so as not to generate a void by reliably pressing a molding material. Further, the present invention can easily change the size of the frame in accordance with the size of the molded product, reduce waste of the molding material, and reduce the size of the frame to a frame having a different size. It is an object of the present invention to provide a vacuum laminating apparatus capable of ensuring airtightness of a chamber formed when the chamber is replaced.

A further object of the present invention is to prevent adhesion of a molded material which has been heated and has adhesiveness to a film body which presses the molded material.

Still another object of the present invention is to heat the heat treatment in accordance with the size of the material to be formed, heat only necessary portions, and thereby save energy.

Another object of the present invention is that it is not necessary to replace the frame in accordance with the size of the molded article, and that the arrangement of the molding materials can be reduced regardless of the size of the frame. Accordingly, an object of the present invention is to provide a vacuum laminating apparatus capable of reducing waste of a molding material.

The present invention also relates to a method for bonding film-like materials to each other, and when bonding the film-like material to another substrate, even if the substrate surface has irregularities, air trapping or voids may occur between the layers. A vacuum laminating method that does not occur, allows continuous laminating operations, and can easily respond to changes in the size of the material to be laminated, and can reduce material and operation costs. Providing is an issue.

Further, the present invention provides a film-shaped photoresist forming layer on a substrate such as a circuit board for manufacturing a printed circuit board without leaving bubbles or voids between the substrate and the resist layer efficiently and reliably. It has been made to provide a vacuum lamination method that can be bonded to a substrate. Disclosure of the invention

In order to achieve the above object, the invention according to claim 1 is provided with an upper plate and a T plate, which are provided so as to be able to approach and retreat from each other, and are provided with a heating means for heating the surfaces facing each other. An elastic membrane fixed on the opposing surface, and an elastic film placed on the opposing surface of the lower plate. A film body having flexibility and elasticity; and a chamber placed on the film body of the lower plate and accommodating a continuous molding material by being sandwiched between the film bodies of the upper plate and the lower plate. A frame body having a predetermined size, a suction means connected to the chamber to vacuum-chamber the chamber, an opposing surface to the upper plate of the lower plate, and mounted on the opposing surface. When the inside of the chamber is evacuated by the suction unit, the film is sucked to hold the film body of the lower plate on the opposing surface, and the molding material is connected to the film body of the upper plate. And a suction / pressurizing means for expanding the film body of the lower plate so as to pressurize between the two.

In order to achieve the above object, an invention according to claim 2 includes an upper plate and a lower plate, which are provided so as to be able to approach and retreat to each other and are provided with heating means for heating the surfaces facing each other. Or the lower plate, which is located between the upper plate and the lower plate so that the upper plate and the lower plate are close to each other. A frame that forms a chamber for accommodating the molding materials to be laminated by being sandwiched between the plates, a suction unit that evacuates the chamber, and a case that the chamber is evacuated by the suction unit. At the same time, the pressure film is sucked so as to be in close contact with either the upper plate or the lower plate, and pressurized between the upper plate and the lower plate to laminate the material to be formed. Then, separate the pressurized membrane from either the upper plate or the lower plate, and inflate it. That it is characterized in that a suction-pressure unit.

According to a third aspect of the present invention, in order to achieve the above object, in the second aspect of the present invention, the film body is fixed to the opposing surface of the upper plate or the lower plate which faces the other pressurized film body. It is characterized by having.

According to a fourth aspect of the present invention, in order to achieve the above object, in the invention described in any one of the second and third aspects, the pressurized film body and an upper plate or a lower plate provided with the pressurized film body are provided. A seal film is provided between the two.

According to a fifth aspect of the present invention, in order to achieve the above object, in the third aspect of the present invention, a seal is provided between the pressurized film body and the upper plate or the lower plate to which the pressurized film body is applied. A film body is provided, and the combined thickness of the pressurized film body and the seal film body is made substantially the same as the thickness of the film body fixed to the other of the upper plate and the lower plate. . According to a sixth aspect of the present invention, in order to achieve the above object, in the fourth aspect of the present invention, at least one of the surfaces of the pressurized film body and the seal film body that are in contact with each other is formed by the pressurized film body. It is characterized by having an uneven surface so as to exert the suction and pressurizing action over almost the entire surface of the device.

According to a seventh aspect of the present invention, in order to achieve the above object, in the invention according to any one of the second to sixth aspects, the pressurized film body and an upper plate or a lower plate provided with the pressurized film body are provided. In the meantime, an interval forming member for forming a predetermined interval is provided so as to exert a suction / pressing action over substantially the entire surface of the film body.

In order to achieve the above object, the invention according to claim 8 is characterized in that, in the invention according to any one of claims 2 to 7, the pressure film includes an upper plate or a lower plate provided with the pressure film. An irregular surface is formed on the contact surface so as to exert a suction / pressing action over substantially the entire surface of the film body.

According to a ninth aspect of the present invention, in order to achieve the above object, in any one of the first to eighth aspects, a cushion and a seal are provided at least on a portion of the frame body on a side where a continuous molded product force is transmitted. It is characterized in that a material is provided.

According to a tenth aspect of the present invention, in order to achieve the above object, in the invention according to the ninth aspect, the cushion 'seal member is formed of a rod having a substantially circular cross section, and the cushion' s groove for holding the seal member. A groove is formed in the frame, and the width of the opening is smaller than the diameter of the cushion 'seal material, and the width of the bottom is larger than the width of the opening.

In order to achieve the above object, the invention according to claim 11 is characterized in that, in the invention according to any one of claims 9 and 10, a portion of the frame body on which a continuous molded product force is transmitted is provided on the molded product. A notch is provided to prevent contact.

In order to achieve the above object, the invention according to claim 12 is characterized in that, in the invention according to any one of claims 9 to 11, a continuous strip-shaped film material force s a cooling-off P means for cooling the laminated molded product. It is characterized by having.

In order to achieve the above object, the invention according to claim 13 is the invention according to any one of claims 1 to 12, wherein the suction means is provided on an inner periphery of an abutting frame of the upper plate or the lower plate. It is characterized by being connected so as to open in the vicinity.

In order to achieve the above object, the invention of claim 14 is the invention according to any one of claims 1 to 13, wherein the suction and pressure means is provided with a pressure film and the pressure film. Was It is characterized in that it is connected so as to be opened near the inner periphery of the frame body to be in contact with the upper plate or the lower plate and at Z or substantially at the center.

According to a fifteenth aspect of the present invention, in order to achieve the above object, in the invention according to any one of the first to fourteenth aspects, an engaging portion for positioning the frame with respect to the lower plate is provided. Is what you do.

In order to achieve the above object, in the invention according to claim 16, in the invention according to any one of claims 1 to 15, there is provided an engagement portion for immovably engaging the frame with the lower plate. It is specially characterized.

In order to achieve the above object, the invention according to claim 17 is characterized in that, in the invention according to any one of claims 2 to 16, the pressure film is provided so as to sandwich and fix the periphery of the pressure film. The frame is detachably attached to one of the upper plate and the lower plate.

In order to achieve the above object, the invention according to claim 18 is the invention according to any one of claims 1 to 17, comprising a rubber having a film physical strength% / heat resistance, and having a rubber hardness of 40 to 6. It is characterized by being 0.

According to a nineteenth aspect of the present invention, in order to achieve the above object, in the invention according to any one of the first to eighteenth aspects, plain fabrics are respectively formed on surfaces of opposed film bodies. It is.

In order to achieve the above object, the invention according to claim 20 is the invention according to any one of claims 1 to 19, wherein the heating means heats the upper plate and the lower plate by dividing the opposing surfaces thereof. It is characterized by being provided in Koto River Noh.

In order to achieve the above object, the invention of claim 21 is the invention according to any one of claims 1 to 20, wherein a roller force for supporting a material formed of a roll around which a continuous band-shaped film material is wound is used. The roller is provided with a width-direction adjusting mechanism so that the force can be adjusted in the width direction of the roll.

According to a second aspect of the present invention, in order to achieve the above object, in the invention according to any one of the first to second aspects, a roller for supporting a material formed of a roll around which a continuous band-shaped film material is wound is provided. The roller is provided with a brake so as to apply a predetermined tension to the film material. In order to achieve the above object, the invention according to claim 23 is characterized in that, in the invention described in any one of claims 1 to 22, a material formed of a continuous band-like film material is interposed between an upper plate and a lower plate. It is characterized by having a film entrance guide plate for guiding and feeding.

The invention of claim 24 is a vacuum laminating method for laminating the same or different film-like materials or a film-like material and a base material, in order to achieve the above object, wherein another film-like material is formed on the film-like material. An object or a substrate, or a film-like object on a substrate, positioned facing or in contact with the substrate,

The absolute pressure of the space between the film-like materials or between the film-like material and the substrate and the space around them is reduced to 1 atm or less,

Heating the film-like material and, if necessary, the substrate, and

While maintaining the reduced pressure, the facing film-like material or the film-like material and the substrate are pressurized at a pressure higher than 1 atm from either the upper surface side or the lower surface side of the substrate, and the film-like materials or Laminating the film and substrate,

It is characterized by the following.

The invention of claim 25 is a vacuum laminating method for bonding a film-like photoresist forming layer having an unexposed photosensitive layer and a substrate having irregularities on the surface, in order to achieve the above object,

The photosensitive layer surface of the photo resist forming layer and the uneven surface of the substrate face each other in close proximity or in contact with each other, and the other is positioned on one side,

Reducing the absolute pressure of the space between and around the photoresist formation layer and the substrate to 1 atm or less;

The photoresist forming layer is heated to soften the photosensitive layer, and while maintaining the reduced pressure, the photoresist forming layer and the substrate facing each other are removed from either the upper surface or the lower surface of the substrate. Pressurizing at a pressure higher than the atmospheric pressure to bond the photoresist forming layer and the substrate,

It is characterized by the following.

The invention according to claim 26 is a vacuum lamination method for bonding a film-like photoresist forming layer having an unexposed photosensitive layer and a substrate having irregularities on the surface, in order to achieve the above object, The photosensitive layer surface of the photoresist forming layer and the uneven surface of the substrate face each other in close proximity or in contact with each other, and the other is positioned on one side,

Reducing the absolute pressure of the space between and around the photoresist forming layer and the substrate to 1 atm or less;

The photoresist forming layer is heated to soften the photosensitive layer, and while maintaining the reduced pressure, each of the facing photoresist forming layer and the substrate is either one of the upper surface side or the lower surface side. Using a film body having elasticity, flexibility, and elasticity that presses while being in contact with almost the entire surface, presses them at a pressure higher than 1 atm to bond the photoresist forming layer and the substrate.

That is the feature.

In order to achieve the above object, the invention of claim 27 provides the invention according to any one of claims 25 and 26, wherein the pressure at the time of pressurization is 2 atm or more and 10 atm or less. It is characterized by the following.

In order to achieve the above object, in the invention according to claim 28, in the invention according to any one of claims 25 to 27, the temperature at the time of heating is 30 ° C or more and 200 ° C or less. It is characterized by the following.

In order to achieve the above object, the invention according to claim 29 is the invention according to any one of claims 25 to 28, wherein the substrate having an uneven surface on both front and back sides has an unexposed light-sensitive layer on both surfaces. It is characterized by laminating a film-like photoresist forming layer.

Preferred embodiments of the vacuum lamination method of the present invention,

A fixed film (for example, a film made of heat-resistant rubber or the like) is located above, and a movable film (for example, a heat-resistant, flexible and stretchable film made of rubber or the like) that can be deformed or expanded by pressure change. ) Force The members to be bonded are supplied into the closed chamber, and the surfaces are brought close to or in contact with each other.

Reducing the absolute pressure in the closed chamber to 1 atm or less,

Heating the member in the closed chamber; and

A pressure higher than 1 atm, particularly a pressure of 2 atm or more and 10 atm or less is applied upward to the movable membrane while the pressure in the closed chamber is reduced, and the member is fixed to the fixed membrane via the movable membrane. By pressing against both members, that is, film-like objects 0 or laminating the film and substrate

Consisting of

During the above process, before the pressure in the closed chamber is reduced, if the distance between the member to be bonded and the upper and lower films is set to be 2-3 mm, the upper and lower films, especially the lower The wrinkles generated when the movable film is deformed can be prevented, and the volume of the vacuum bow can be reduced.

In this preferred embodiment, the closed chamber has an upper plate provided with a fixed film, a lower plate, a frame having a predetermined size installed between the upper and lower plates, and a movable film installed between the frame and the lower plate. And the force s is particularly preferred. By region Ru der sealed Chiyanba performed ^s vacuum lamination force such a configuration,

• It is possible to respond to changes in the size of the material to be laminated simply by replacing the frame

• Because the pressure is pushed up from below, good bonding is possible without causing degassing failure.

• The fixed membrane and the dynamic membrane also act as sealing materials, eliminating the need for special sealing mechanisms.

And so on. In addition, if the upper plate and the lower plate are provided with heating means, respectively, so that the fixed film and the movable film can be heated, they are heated at the time of pressurization, and the bonding can be performed efficiently and reliably.

When the closed chamber is configured as described above, the fixed film may be fixed to the upper plate, and the fixed film and the moving film are installed on the surface h of the sealing film body fixed to the upper plate or the lower plate, respectively. You may.

Here, by making the thicknesses of the fixed film and the seal film (if used) and the thickness of the movable film and the seal film (if used) approximately equal, the thickness of the frame is reduced.

-The upper and lower plates and the frame are compensated for surface accuracy, and the degree of vacuum is improved. Specifically, a fixed film with a thickness of 3 mm is baked and fixed on the upper plate, and a sealing film with a thickness of 2 mm is baked and fixed on the lower plate, and then a movable film with a thickness of 1 mm is placed on it. Can be provided.

In the vacuum lamination method of the present invention, after facing the members to be bonded, the absolute pressure between the members and the space around them is reduced to 1 atm or less, preferably to 5 mmHg or less. Reduce. This ensures that the two members are separated from each other. However, when the surface facing the other member is sticky, undesired coupling is prevented. The temperature at the time of heating in the vacuum lamination method of the present invention is not particularly limited, and is appropriately selected according to the material of the film-like material or the base material to be bonded. For example, when a film-like material made of a thermoplastic resin is used, the heating temperature is a temperature necessary for the resin to be converted, and when a film-like material made of a thermosetting resin is selected, the curing is performed. Needless to say, this is the temperature required for However, when laminating the photoresist forming layer and the substrate, the temperature is preferably 30 ° C. or more and 200 ° C. or less. This is because the conventional photoresist-forming layer softens in this temperature range to such a degree that it can be pressed against the substrate without deteriorating its characteristics.

In the vacuum laminating method of the present invention, the pressure at the time of pressurization is higher than 1 atm, and the pressure is higher than 1 atm. If the pressure is 1 atm or less, a sufficient pressure for bonding members cannot be obtained. Because. In the case of bonding the photoresist forming layer and the substrate, the pressure is preferably 2 to 10 atm. This is because if the pressure is less than 2 atm, the photoresist formation layer may not be sufficiently embedded in the substrate, and if the pressure exceeds 1 atm, the photoresist layer and the substrate may be damaged. is there. In this case, the pressure is preferably 2 to 5 atm. Further, in the vacuum laminating method of the present invention in which the above-mentioned frame is used as a sealed chamber, by providing a cushioning material on the molded article delivery side portion of the frame, there is no trace due to pressing on the molded article, There is no need to change the frame according to the size of the molded product. A similar effect can also be obtained by forming one of the sealing surfaces sandwiching the two members to be stuck together with a metal solid layer.

Furthermore, in the case of laminating the photoresist forming layer and the base material, one or both of the upper plate and the plate are cooled on the side where the laminated molded product is sent out, so that the substrate is heated by lamination. Traces of the photoresist layer in a softened state due to pressure can be prevented from remaining. For example, the molded product delivery side of the upper plate and the lower plate is water-cooled, and an air-cooled air outlet is provided on the molded product delivery side of the outer periphery of the upper plate. It is desirable that the air cooling fan used here should have static electricity removed.

The vacuum forming method of the present invention can also be applied for bonding a film-like photoresist forming layer having an unexposed photosensitive layer on both sides of a substrate having an uneven surface on both sides. The photoresist forming layer-substrate system and the photoresist forming layer-substrate-photoresist forming layer system laminated according to the laminating method of the present invention may then be subjected to the following operations:

• imagewise exposing the photo resist forming layer by UV irradiation;

'Removing the support film from the exposed photoresist-forming layer; and • (in the case of a negative-type photoresist) removing the imagewise unexposed photoresist-forming layer with an aqueous solution or the like. And developing to form a photoresist image on the surface having irregularities.

Thus, the present invention includes a method for forming a resist image on a substrate, including a method for forming a resist image after laminating a photoresist forming layer according to the present invention.

In a preferred method of the present invention, molten solder, solder paste, metal plating such as solder or gold, or pre-flux is applied to the surface when all of the image forming process force s of the photoresist forming layer is completed. The bubble-free protection resist image according to the present invention acts as a solder resist, which protects the electrical circuit of the substrate from high temperatures, chemicals, etc. in each of the above processes.

In the vacuum laminating apparatus according to the present invention, a frame having a size suitable for the size of the molded article is positioned on the film body of the lower plate and placed immovably, and the molded material is placed between the frame and the upper plate. The upper plate and the lower plate are brought close to each other, and the frame is placed between the upper and lower plate films, and sealed by the elasticity of the film in a state where a continuous molding material is stored. To form a chiyamba. Suction ・ The suction means drives the pressure means to hold the film body of the lower plate on the opposing surface, and the suction means vacuum-chambers the chamber! To The workpiece is placed under a vacuum atmosphere without changing the chamber volume. At this time, the film bodies of the upper plate and the lower plate retain heat by heating of the heating means in a section corresponding to the frame having a size suitable for the size of the formed material. Thereafter, when the suction drive of the suction / pressing means is switched to the pressure drive to expand the film body of the lower plate, the molding material is pressed between the film body of the upper plate. At this time, the molding material is heated by the heat of the film body. Even when the molding material is heated and pressurized and adheres to the film body, the mold is easily released because the plain material is formed on the film body.

Further, in the vacuum laminating apparatus according to the present invention, the other one of the upper plate and the lower plate is used. A frame is arranged between the pressurized film body provided so as to be able to contact and separate from the opposite surface of the upper plate and the other opposing surface of the upper plate or the lower plate. A chamber is formed in a state that accommodates a young person. The suction means is driven in a state where the pressure in the chamber is kept unchanged by causing the pressure film to be in close contact with either the upper plate or the lower plate by causing the pressure means to perform a suction action. The inside of the chamber is evacuated, and then the suction / pressurizing means is switched to separate the pressurized membrane from either the upper plate or the lower plate, and pressurize it so that it expands. The material to be formed is pressed between the film body and the upper or lower plate, and heated by the heat of the heating means.

In the case where one surface of the material to be formed has a smooth surface and the other surface has irregularities, the opposite surface of either the upper plate or the lower plate, which is not provided with the film pressure, is made a smooth surface. You. Further, in the case where the material to be molded has a double-sided convexity, the film body is fixed to the other surface of the upper plate or the lower plate, on which the pressure film body is not provided, on the other side.

When a sealing film is provided between the pressure film and the upper or lower plate on which the pressure film is provided, the sealing performance of the frame when the chamber is formed is improved. . Further, in this case, if the surfaces of the pressurized film body and the seal film body that come into contact with each other are made uneven, the suction / pressing force is evenly applied over the entire inner surface of the frame. When a pressurized membrane is provided on one of the opposing surfaces of the upper and lower plates so as to be able to contact and separate from the other, and when the other is fixed, the pressurized membrane provided on one of the upper and lower plates When the combined thickness of the body and the sealing film is substantially the same as the thickness of the other film, the sealing performance is further improved. When a gap forming member that forms a predetermined gap is provided between the pressurized film body and the upper plate or the lower plate provided with the pressurized film body, or the pressurized film body, In the case where an uneven surface is formed on the surface in contact with the upper plate or the lower surface provided with, the suction / pressing action is evenly spread over the entire inner surface of the frame.

When the suction means is connected to the upper plate or the lower plate so as to open near the inner periphery of the abutted frame, the suction force s is evenly applied over the entire inner surface of the frame. In addition, the suction pressure means is opened in the vicinity of the inner periphery and / or substantially at the center of the abutting frame body between the pressure film body and the upper or lower plate provided with the pressure film body. In such a case, the suction and pressurizing action is performed over the entire surface of the pressurized membrane.

The frame body is positioned with respect to the lower plate by the engagement portion, and is immovably engaged. You. Further, the frame may be detachably attached to one of the upper plate and the lower plate provided with the pressure film so as to sandwich and fix the periphery of the pressure film.

Each membrane body is made of rubber having heat resistance, the rubber hardness Rukoto force ^s desirable 4 0-6 0. Further, it is preferable to provide a heating means for the heating function so as to separately heat the opposing surfaces of the upper plate and the lower plate.

Molded product force When pressure may be applied in addition to the pressure applied by the S film body, it has approximately the same size as the film body, and a cushion / sealant is provided at the part where the molded product is sent out. Use a frame. When the upper plate and the lower plate are brought close to each other and the frame is sandwiched between the upper plate and the plate film, the cushion's sealing material is placed between the molded product laminated in the previous process and the upper plate film. A chamber is formed by sealing while being elastically sandwiched. The molding material of the continuous molded article can be fed at a pitch corresponding to the width of the feeding portion of the frame, and the wasted portion of the molding material can be reduced. In addition, since the laminated product is elastically pressed by the cushion's sealing material, there is no trace of the pressing.

If the cushioning material is placed horizontally on at least the part of the frame where the continuous molded product is delivered, the chamber is used to deliver the continuous molded product and stack the next molded material. When formed, the continuous molded product is sandwiched and pressed between the cushion / seal material and the upper or lower plate facing the same, so that traces due to this pressing hardly adhere.

Cushion 'When the sealing material is a rod with a substantially circular cross section, a continuous molded product is sent out, a chamber is formed for laminating the next molded material, and the continuous molded product is cushioned. 'When pressed between the sealing material and the upper plate or lower plate facing the sealing material, the width of the pressing is narrowed, so that traces due to the pressing are less likely to be formed. Also, when a groove for holding the cushion seal material is formed in the frame body, the width of the opening of the groove is smaller than the diameter of the cushion seal material, and the width of the bottom is larger than the width of the opening. The cushion's seal material is held without protruding from the groove, and the cushion's seal material is pressed when the cushion and seal material is pressed against the upper or lower plate facing to form the chamber. Does not hinder the deformation of the material. When a notch is provided in the part on the side where the continuous molded product is sent out of the frame, a chamber is formed for laminating the next molded material, and the continuous molded product is There is no pressing of the molded product between the upper plate or the lower plate opposed to the molded product.

Continuous strip-shaped film material strength s Cooling of laminated molded products! ] Means is provided, the molded product in the softened state is heated by the heating at the time of lamination, and then cooled, so that a continuous molded product is sent out and the next molding material is laminated. When a chamber is formed, a continuous molded product is sandwiched between the cushion / seal material and the upper plate or the lower plate facing the cushion / seal material and pressed to prevent traces due to the pressure from being left.

If a roller is provided to support the material to be formed, consisting of a roll of continuous belt-shaped film material wound thereon, and the roller is provided with a width direction adjustment mechanism, the material is formed due to the displacement of the roll in the width direction. When a wrinkle force ^{s is} generated on the material, the position in the width direction is adjusted.

When a roller is provided for supporting a material formed of a roll formed by winding a continuous belt-shaped film material, and when the roller is provided with a brake, a predetermined tension is applied to the film material to thereby provide the film material. Prevents wrinkles.

In the case where a film entrance guide plate is provided to guide and feed a material formed of a continuous strip of film material between the upper plate and the lower plate, the film is placed near the upper plate or the lower plate. The molding material is guided.

Further, according to the vacuum laminating method of the present invention, since the members are bonded not by linear pressure as in a pressure roll or the like but by a pressure higher than 1 atm uniformly over the entire member to be laminated, Even when a thin film-like material is laminated on the surface of the member having the uneven portion, the lamination can be performed without leaving air / void between the layers. In addition, since the members to be laminated can be supplied and laminated without interruption, continuous lamination processing is possible. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a longitudinal sectional front view showing an embodiment in which a vacuum laminating apparatus according to the present invention is used for laminating a continuous film-like photoresist forming layer on the surface of a circuit board.

FIG. 2 is an enlarged vertical sectional side view of the vacuum laminating apparatus shown in FIG.

FIG. 3 is a plan view showing a state where the frame is placed on a lower plate.

Fig. 4 shows the frame of the vacuum laminator shown in Fig. 2 between the upper and lower plates. FIG.

FIG. 5 is a diagram showing a state in which the chamber is vacuum-vacuated I from the state of FIG. 4, and the film material of the lower plate is expanded to heat and press the material to be molded.

FIG. 6 is a view showing an embodiment using another frame of the vacuum laminating apparatus according to the present invention.

FIG. 7 is a diagram showing a state in which the frame is sandwiched between the film bodies of the upper plate and the lower plate from the state of FIG.

FIG. 8 shows another example of use of the vacuum laminating apparatus according to the present invention shown in FIG.

FIG. 9 is a view showing another example of use of the vacuum laminating apparatus according to the present invention shown in FIG.

FIG. 10 is a vertical sectional side view showing a third embodiment of the vacuum laminating apparatus according to the present invention.

FIG. 11 is a vertical sectional front view showing a fourth embodiment of the vacuum laminating apparatus according to the present invention.

FIG. 12 is a bottom view of the upper plate shown in FIG.

FIG. 13 is a plan view of the lower plate shown in FIG.

FIG. 14 is a partially enlarged cross-sectional view of the lower plate shown in FIG.

FIG. 15 is a sectional view of the roller shown in FIG.

FIG. 16 is a time chart showing one embodiment of an operation cycle of the vacuum laminating apparatus according to the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

Next, an embodiment of the present invention will be described in detail with reference to the drawings. The invention is not limited to the embodiment. The same reference numerals in the drawings denote the same or corresponding parts.

The vacuum laminating apparatus according to the present invention comprises, as shown in FIG. 1, an upper plate 1 and a lower plate 2 which are disposed so as to face each other so as to be able to approach and retreat, and the upper plate 1 and the lower plate 2 are opposed to each other. The film bodies 3 and 4 respectively provided on the surface and the film body 4 of the lower plate 2 are placed on the film body 4 and are sandwiched between the film bodies 3 and 4 by bringing the upper plate 1 and the lower plate 2 close to each other, A continuous material H is stored A frame 6 forming the chamber 5; suction means for evacuating the formed chamber 5 (FIG. 4); and a film 4 fixed to the opposite surface of the lower plate 2 or a film of the upper plate 1 Suction / pressurizing means to inflate to the 3 side is provided. In this embodiment, the upper plate is fixed, the lower plate is supported by elevating means (not shown), and the lower plate is configured to move toward and away from the upper plate.

The upper plate 1 is a substantially rectangular plate-like body as shown in the cross-sectional view of FIG. 2, and has a concave portion 10 s on its lower surface. It is formed so as to extend in the direction (the left-right direction in FIGS. 1 and 4) over the side where the product L is sent out. Heating means 12 s are provided in the recess 10 via a heat insulating material 11, and a surface plate 13 s forming an opposing surface is provided. The film body 3 is fixed to the surface of the surface plate 13 so as to be exposed below the concave side surface 10a of the upper plate 1. The fixing of the film body 3 to the surface plate 13 is performed by bonding or the like, but the means is not limited as long as the film body 3 does not fall off the surface plate 13. Further, a suction pipe 14 is attached to the upper plate 1 by a nut 15 so as to open to the surface near the corner of the fl 3 and the suction pipe 14 is connected to a vacuum pump or the like via an on-off valve. The bow I means force is connected (not shown).

The lower plate 2 is made of a substantially rectangular plate having a size matching the upper plate 1, and the upper surface thereof, like the upper plate 1, has a concave portion 20 s and feeds the material H to be formed. It is formed so as to extend in the direction (the left-right direction in FIGS. 1 and 4) that extends from the side to the side where the laminated articles L are sent out. A heating means 22 is provided in the recess 20 via a heat insulating material 21, and a surface plate 23 forming an opposing surface is provided. The film body 4 is mounted on the surface of the surface plate 23. The concave side surface 20a of the lower plate 2 is formed so as to be higher than the surface of the film body 4 (see FIG. 2), and the stacked molded products L are sent out from the side where the material H is fed. An engagement groove 24 is provided extending in a direction perpendicular to the direction extending over the side (see FIG. 3). The lower plate 2 is further provided with a suction pipe 25 by means of a nut 26 so as to open between the membrane 4 and the surface plate 23 in the vicinity of the corner of the membrane 4 (see FIG. 3). A suction / pressurizing means such as a vacuum / compression pump is connected to the suction / pressurizing pipe 25 via an open / close valve (not shown). The frame body 6 is made of a rigid metal body such as stainless steel, chrome plating, or other metal that can withstand pressure, or aluminum, and is mounted on the film body 4 of the lower plate 2. Therefore, when the upper plate 1 and the lower plate 2 are brought close to each other, an annular main body 30 forming the chamber 5 sandwiched between the film bodies 3 and 4 provided on the respective platens 13 and 23, A rib 31 is formed on the outer periphery to withstand the pressure and is positioned on the lower plate 2. The main body 30 conforms to the pitch for laminating the molding L from the continuous molding material H (see FIG. 3), and each of the suction pipe 14 and the suction calo-pressure pipe 25. It has a size surrounding at least one opening, has a relatively small width (plate thickness), and has a height protruding from the surface of the concave side surface 20a of the lower plate 2 by a predetermined amount. . The side 31a of the rib 31 parallel to the direction from the side into which the material to be molded H is supplied to the side to which the laminated molded article L is delivered is engaged with the rib 31 for positioning the frame 6 with respect to the lower plate 2. The lower plate 2 is formed to have a width that engages with the side wall of the recess 20 so as to form a portion. Further, an engagement portion 32 that is engaged with the engagement groove 24 of the lower plate 2 is formed on the side 31a of the rib of the frame 6.

In the case of this embodiment, the heating means 12 and 22 are constituted by a plurality of electric heaters which are divided in a direction from a side where the material to be molded H is supplied to a side where the laminated molded products L are delivered. ing. By connecting a power supply to a predetermined electric heater, the size of the frame used, that is, the size of the molded product L to be laminated, and the lamination of the molded product L from the continuous formed material H The film bodies 3 and 4 are heated in accordance with the pitch to prevent unnecessary portions from being heated, ensuring reliable lamination of the molding material H and saving energy. The heating means 12 and 22 are not limited to this embodiment using an electric heater, and may be, for example, oil or oil, as long as they can heat a desired portion of the film body as needed. A flow path for circulating a heating fluid such as steam can be formed, or electromagnetic induction heating or the like can be used.

The film body 3 in this embodiment has at least heat resistance and elasticity, and is made of, for example, silicon rubber (rubber hardness Hs (JISA): about 40 to 60). The film body 4 is made of silicone rubber having flexibility and elasticity in addition to heat resistance and elasticity similar to those of the film body 3. On each of the opposing surfaces of the film bodies 3 and 4, a ground without fine surface roughness is formed (not shown). The material of the film bodies 3 and 4 is not limited to this embodiment, and may be made of synthetic resin or the like as long as it has heat resistance, elasticity, and in addition, flexibility and elasticity. You can also. Next, as an example of using the vacuum laminating apparatus according to the present invention configured as described above, a continuous film-like photoresist forming layer composed of a support film and a photosensitive layer is formed on the surface of the circuit board 40 as the molding material H. The case of stacking 41 will be described. In this case, as shown in FIG. 1, a positioning work support table 42 is placed on the side (right side in the drawing) of the vacuum laminating apparatus where the molding material H is fed, and the film-shaped photoresist forming layer 41 is wound. A roller 43 is provided for supporting the roll on which the circuit board is mounted, and a roller 45 for supporting a roll on which a film 44 on which the circuit board 40 is placed is wound. For laminating the photoresist on one side of the circuit board 40, a carrier film is used. When laminating the photoresist on both sides of the circuit board 40, a film-like photoresist forming layer 41 is used. Similar ones are used. The positioning work support base 42 has a width (the left-right direction in FIG. 1) on which a plurality of (for example, two) circuit boards 40 can be mounted. In addition, in the vicinity of the roll 43, there is provided a tape carrier (not shown) for peeling off and winding the protective film attached to the photosensitive layer of the film-like photoresist forming layer 41.

On the delivery side (left side in the drawing) of the laminated molded articles of the vacuum laminating apparatus, a molded article support table 50 is arranged, and as a molding material H, a film-like film comprising a support film and a photosensitive layer is formed on the surface of the circuit board 40. There is provided a sending means (not shown) provided with a chuck or the like for feeding a continuous molded product in which the resist forming layer 41 is heated and pressurized and stretched and fed.

Each of the rollers 43 and 45 supporting the rolls of the films 41 and 44 is provided with a brake (not shown), and when the continuous molding force is pulled by the feeding means, the film-like fore register is provided. The forming layer 41 is stretched slightly apart from the film body 3 of the upper plate 1 via the guide roller 46, and the film 44 is formed by the self-weight of the circuit board 40 on which the force is applied. The braking force is adjusted so as to be slightly separated from the photoresist forming layer 41.

Here, a film-like photoresist forming layer, a substrate, and the like that can be used in the present invention will be described.

The film-like photoresist forming layer used in the present invention is usually referred to as a "dry film resist", and is obtained by removing an unexposed portion or an exposed portion of the resist layer after imagewise exposure to UV irradiation. To generate a registry image The photosensitive layer usually has a three-layer structure in which one surface is covered with a support film made of polyester or the like, and the other surface is covered with a protective film made of polyethylene or the like, When applied to a substrate, the protective film is usually removed. If the photosensitive layer consists of a negatively acting substance, the unexposed portions are removed and the exposed portions remain as a resist image. On the other hand, when the photosensitive layer is made of a material that acts positively, the unexposed portion forms a resist image. These materials that form the photosensitive layer are much stronger than the support film to be coated, and are very soft and sticky when applied at high temperatures. Therefore, for the application of the photoresist forming layer in the vacuum lamination method of the present invention, it is usually used in a two-layer structure of a support film and a photoresist layer. The support film enables the photoresist-forming layer to be held away from the substrate surface, which may have irregularities, and the pressure transmission to force the photosensitive layer (photoresist layer) to conform to the irregularities. Acts as a body.

Useful materials for forming the photosensitive layer in the practice of the present invention are described in detail in U.S. Pat. Nos. 3,469,982 and 3,526,504. The photoresist layer comprises a negative-acting photocurable material or a positive-acting photosoluble or photosensitizing material. Any of these photosensitive materials can be coated as a layer on a film-like support to form a photosensitive layer.

The photocurable material is one that cures when exposed to UV radiation, and is preferably selected from photopolymerizable, photocrosslinkable and photodimerizable materials. Such materials are usually characterized as having ethylenically unsaturated or benzophenone type groups, and these are described, for example, in U.S. Pat. Nos. 2,760,633 and 3,418,82. No. 95, No. 3 6 4 9 2 6 8, No. 3 0 7 2 6 4, No. 3 6 2 2 3 3 4 and French Patent 7 2 1 1 6 5 8 It is described in detail in the description. Particularly preferred are photopolymerizable substances comprising an addition-polymerizable ethylenically unsaturated compound (monomer), a high molecular weight organic polymer and a polymerization initiator which can be activated by UV irradiation. The above patents disclose a variety of suitable ethylenically unsaturated compounds, thermoplastic polymers, addition polymerization initiators that can be activated by UV irradiation, and other components. Other suitable ethylenically unsaturated monomers are described in U.S. Patent Nos. 3,600,203, 3,226,686 and 3,380,831. It is disclosed in the specification. In the case of a photopolymerizable substance, a crosslinking agent is not always necessary, but a small amount may be used. In addition to the polymerization initiator, other components such as a plasticizer, a thermal polymerization inhibitor, a coloring agent, a filler, and the like can be present as is well known in the art. Also, as taught in the patent specification, certain components may play a dual role. For example, an ethylenically unsaturated monomer can also act as a plasticizer for a thermoplastic polymer in a monomer-crosslinker system.

Examples of the photo-soluble or photo-desensitizing substance include those obtained by esterifying o-naphthoquinonediazidosulfonic acid to a novolak resin or those esterified to trihydroxybenzophenone or tetrahydroxybenzophenone, for example, There is a mixture with a cresol type novolak resin.

Conventionally, the self-photoresist forming layer is laminated on a surface to be applied such as a substrate by a pressure roll or other methods. However, in the conventional method, when the substrate surface has an uneven portion, and particularly when there is a corner portion between the surface and the side wall of the uneven portion thereon, a small bubble is generated. Tends to occur on the side wall of the uneven portion. When the exposed part of the substrate surface is processed after the completion of resist image formation by, for example, plating, soldering, etc., the substances used for the surface treatment, for example, acid, solder, etc., are resisted in the area where bubbles exist. It penetrates beneath the birds, and invades the surface intended to be protected, but in the case of the present invention, since no air bubbles remain between the layers, such a problem does not occur.

The thickness of the photoresist forming layer is not particularly limited, but is preferably about 10 to about 100 um. The height of the uneven portion on the substrate surface to which the photoresist forming layer is applied is generally in this range. This photoresist-forming layer must conform to the high part of the substrate surface to which it is applied, but the photoresist-forming layer having a thickness smaller than the height of the uneven part is formed by the method of the present invention. As described above, the layers can be stacked without being captured. Therefore, according to the method of the present invention, the photoresist forming layer can be adapted to the uneven portion without destroying the resist at the uneven portion and without leaving the bubble generating portion without protection.

As the substrate having an uneven surface on which it is laminated according to the vacuum lamination method of the present invention, any substrate commonly used in the art can be used. For example, a copper-clad laminate, a metal core wiring board And circuit boards for manufacturing printed wiring boards such as boards, composite wiring boards, flexible wiring boards, and high-density wiring boards. Further, these substrates may have an uneven portion on only one surface, or may have an uneven portion on both surfaces. It should be noted that the present invention is not limited to laminating the film-like photoresist forming layer on a substrate, but may be applied to other film-like materials, such as thermoplastic or thermosetting resin films, or the film-like material. Needless to say, the present invention can also be applied to bonding a base material, for example, a sheet made of a wood plate, a metal plate, an organic material, an inorganic material, or a composite material. Here, the above film-like materials may be laminated in the same type or different types in two or three or more layers, and the film-like material may be laminated on the substrate only on one side or on both sides. May be performed.

Next, referring again to the drawings, a specific example of the vacuum laminating apparatus according to the present invention in the case of laminating a continuous film-like photoresist forming layer 41 composed of a support film and a photosensitive layer on the surface of a circuit board 40 will be described. A typical usage example will be described.

The circuit board 40 is positioned and mounted on the film 44 of the positioning work support base 42 formed to have a width capable of mounting two or more circuit boards 40. At this time, the positioning of the circuit board 40 can be performed by separating a predetermined number of the circuit boards 40 from the feeding side of the frame 6 placed on the lower plate 2, or Since it can be performed by leaving a predetermined interval with reference to the rear end of the circuit board 40 already mounted on the film 44 located on the work support 42, the positioning of the circuit board 40 is visually confirmed. Can be

Next, while the lower plate 2 is lowered, the continuous film-like photoresist forming layer 41 and the film 44 are pulled by a sending means, and the unlaminated materials are placed on the upper plate 1 and the lower plate 2. Into the frame 6. At this time, by adjusting the braking force of the rollers 43 and 45, a slight surface of the circuit board 40 placed on the film 44 and the photosensitive layer of the photo-resist forming layer 41 are slightly contacted with the uneven surface of the circuit board 40. Are separated from each other.

When the lower plate 2 was raised, the continuous film-like photoresist forming layer 41 and the film 44 were fixed to the lower surface of the frame 6 placed on the film body 4 of the lower plate 2 and the platen 13 of the upper plate 1. The circuit board 40 is housed in the chamber 5 formed and sandwiched between the film body 3 (see FIG. 4). Suction / pressure pipe opening between the film body 4 of the lower plate 2 and the surface plate 23 Suction is performed by the suction means via the pressure means, and the film body 4 of the lower plate 2 is kept from the platen 23, and is suctioned by the suction means via the suction pipe 14 opened into the chamber 5. The chamber 5 is evacuated without changing the volume. Thereafter, a pressurized working fluid such as compressed air is supplied between the film body 4 of the lower plate 2 and the surface plate 23 through a suction / pressure pipe 25 by means of suction and pressure to inflate the film body 4. Then, the surface of the circuit board 40 having the uneven portion between the elastic film bodies 3 and 4 and the photosensitive layer of the film-shaped photoresist j-jf41 are pressed against each other (see FIG. 5). Since the film bodies 3 and 4 are heated by the heating means 12 and 22 via the platens 13 and 23, the circuit board 40 and the film-like photoresist forming layer 41 are heated simultaneously with the pressurization. When a small frame 6 is used depending on the size of the circuit board 40 (see a chain line in FIG. 3), the suction pipe 14 and the suction / pressurization pipe 25 located outside the frame 6 are connected to the on-off valve. Has been closed by

After the molding is completed, the air is supplied into the chamber 5 through the suction pipe 14, and the pressurized working fluid such as compressed air supplied between the platen 23 of the lower plate 2 and the membrane 4 is removed. The film body 4 is returned to a state in which it is in close contact with the surface plate 23. Next, the lower plate 2 is lowered to separate the frame body 6 from the film body 3 of the upper plate 1, and the continuous film-like photoresist forming layer 41 and the film 44 are pulled by the sending means, and the laminated molded product is removed. The paper is sent out from between the frame 6 placed on the upper plate 1 and the lower plate 2.

Next, another embodiment (second embodiment) of the vacuum laminating apparatus according to the present invention will be described with reference to FIGS. 6 and 7. FIG. Note that the same or corresponding parts as those in the above-described embodiment are denoted by the same reference numerals in the drawings, and description thereof will be omitted. This embodiment is different from the previous embodiment in the structure of the frame body 60 mounted on the film body 4 of the lower plate 2. The frame body 60 is used in a case where the laminated molded article may be pressurized in addition to the pressurization by the film bodies 3 and 4.

The frame body 60 is formed to be slightly smaller in overall size than the film body 4 of the lower plate 2, and when the frame body 60 is sandwiched between the film body 3 of the upper plate 1 and the film body 4 of the lower plate 2, The part on the side where the continuous molded product is sent out (left side in the drawing) is formed low so as not to abut on the film body 3 of the upper plate 1. Outside this part, a cushioning sealing material 61 having a rectangular cross section is framed. It is installed horizontally across the entire 60 width directions. Cushion 'seal material 61 is made of an elastic and airtight material such as a single-cell (泡 cellular) sponge, and its height has a crushing allowance. It is set higher than the height of the frame body 60 as shown in FIG.

The material to be laminated according to this embodiment includes a continuous film 71 having adhesiveness by heating the plate-shaped substrate 70 and a continuous carrier film 74 on which the plate-shaped substrate 70 is placed. The substrate 70 is positioned on the carrier film 74 at an interval equal to or greater than the width of the main body of the portion of the frame body 60 on the side to which the molding material is continuously fed (right side in the drawing).

The molding material is positioned between the film body 3 of the upper plate 1 and the frame body 60 so that the substrate 70 is not positioned at the portion of the frame body 60 on the side where the continuous molding material is fed. As shown in FIG. 7, the upper plate 1 and the lower plate 2 are brought close to each other, and the frame body 60 is sandwiched between the film bodies 3 and 4. The cushion 'seal material 61 which has contacted the film 3 of the upper plate 1 is crushed in the height direction with the molded product laminated in the previous step sandwiched therebetween, and the airtightness of the chamber 5 is maintained. As a result, the frame 60 having a fixed size does not remain on the substrate 70 to be laminated with the cushioning and sealing material 61 due to the clogging force of the sealing material 61 and regardless of the size of the substrate 70 to be laminated. Thus, the lamination can be performed, and the force required for positioning the substrate 70 on the carrier film 74 can be narrowed, so that the amount of the films 71 and 74 used can be reduced. '

'The vacuum laminating apparatus according to the present invention is not limited to the above-described embodiment. For example, the frames 6 and 60 are fixed and the upper plate 1 and the lower plate 2 are You can also make them move closer and farther. In this case, as shown in FIG. 8, a film mounted on a circuit board 40 from the lower side of the sending side (right side in the drawing) of the frame 6 to the upper side of the sending side (left side in the drawing). 44, the film-like photoresist forming layer 41 and the circuit board 40 can be largely separated. Similarly, as shown in FIG. 9, from the lower side of the feeding side (right side in the drawing) of the frame body 60 according to the second embodiment, to the upper side of the sending side (left side in the drawing), the substrate 70 force s With the carrier film 74 placed thereon, the film 71 and the substrate 70 can be largely separated from each other.

Further, the vacuum laminating apparatus according to the present invention is not limited to laminating a material having rigidity such as a substrate and a film as a material to be molded and a material having flexibility as a material to be molded. It can also be used when laminating flexible thin layers so as to be bonded to each other.

Example 1 Furthermore, in order to more clearly show the effects of the present invention, the embedding property of the photoresist layer when a photoresist layer was actually applied to a circuit board was examined using the vacuum laminating apparatus of the present invention. Examples of the tests performed are shown below.

A film-like photoresist type fi¾f is attached to a circuit board having circuit lines of various heights by the vacuum lamination method of the present invention comprising the following steps (1) to (3):

(1) A photosensitive layer of a photoresist forming layer and a circuit board of a circuit board are placed in a closed chamber formed of a fixed film, a frame, and a movable film provided below the frame, which are provided on the upper plate. The photo resist forming layer and the circuit board are arranged in close proximity to each other,

(2) The absolute pressure in the region between the circuit board and the photoresist forming layer and in the region around them is reduced to 5 mmHg or less, and

(3) While maintaining the reduced pressure in the step (2), pressurize at a predetermined pressure through the movable film to press the photoresist forming layer and the circuit board against the fixed film on the upper plate to form a photo resist. Match the layers with the circuit lines on the circuit board surface.

The photosensitive layer of the photoresist forming layer used in this test example contains an addition-polymerizable ethylenically unsaturated acrylic resin, a monomer, and a photoinitiator, and is developed with an aqueous sodium carbonate solution. Thus, an image can be formed.

The results obtained are summarized in Table 1 below.

For comparison, a circuit board and a photoresist forming layer similar to the above were used as a control, and a vacuum laminating apparatus described in Japanese Patent Publication No. 55-133341 was used. Table 1 also shows the results of bonding under atmospheric pressure without applying forced pressure.

Below margin 【table 1】

As is clear from the results shown in Table 1, according to the present invention, the height of the circuit line on the circuit board, that is, the height of the projections of the unevenness on the surface of the base material is determined by the thickness of the photoresist forming layer. Even when the force is the same or high, it can be bonded with a good embedding property without generating any bubbles or voids. On the other hand, in the conventional method, when the thickness of the photo resist is larger than the height of the circuit line (test numbers 10 and 11), there is no problem, but when the thickness is the same or smaller (test numbers 6 to 9), Bubbles etc. are generated, which is inappropriate.

Next, still another embodiment (third embodiment) of the vacuum laminating apparatus according to the present invention will be described with reference to FIG. Note that the same or corresponding parts as those in the above-described embodiment are denoted by the same reference numerals in the drawings, and description thereof will be omitted. FIG. 10 is a vertical sectional side view of the vacuum laminating apparatus according to this embodiment, and this embodiment is largely different from the above-described embodiment. In other words, the membrane 4 of the lower plate functions as a pressure membrane, and another sealing membrane 80 is placed between the pressure membrane 4 and the platen 23.

The film body 3 of the upper plate 1 is fixed to the lower surface of the surface plate 13 facing the lower plate 2 by baking. On the base plate 23 of the lower plate 2, a sealing film 80 is mounted. On the sealing film 80, the film 4 as a pressurized film is mounted. The thickness of the membrane 3, the seal membrane 80, and the membrane 4 in this embodiment is set, for example, to 3 mm in the thickness of the membrane 3 and the thickness of the membrane 4 is 2 mm in the seal membrane 80. The thickness is set to 1 mm, and the combined thickness of both membranes 80, 4 of lower plate 2 is the same as the thickness of membrane 3 of upper plate 1. By making the thickness the same, the lower plate 2 is raised and the frame 6 is formed when the frame 6 is sandwiched between the film 3 of the upper plate 1 and the film 4 of the lower plate 2. The sealing performance will be improved. The distal end of the suction / pressure pipe 25 is provided so as to open between the sealing film body 80 and the film body 4.

The opposing surfaces of the membrane 3 and the membrane 4 are each formed in the form of a ground force s mesh, and the contact surface of the seal membrane 80 and the membrane 4 is formed with a grid-like uneven force s. When the film-like photoresist forming layer 41 is laminated between the film bodies 3 and 4 due to the bases formed on the opposing surfaces of the film bodies 3 and 4, respectively, the film-like photoresist is used. The pressurized pressure distribution of the film body 3 and the film body 4 with respect to the formation layer 41 can be made uniform, and when the stacked molded article L is carried out, the film body 3 and the film body 4 of the molded article L Can be easily released. In addition, since the contact surface between the seal film body 80 and the film body 4 is formed with irregularities, the film body 4 is brought into close contact with the seal film body 80 by suction and pressure means, or is formed from the seal film body 80. The suction and pressurizing action for separating and expanding the body 4 can be exerted uniformly over the entire surface of the film body 4. The blanks formed on the opposing surfaces of the film body 3 and the film body 4 may be of a cloth shape or the like, as long as the uniform pressure distribution and the easy releasability described above can be satisfied. Good. The depth of the blank formed on the opposing surfaces of the film body 3 and the film body 4 is set in a range of about 30 to 45] um, for example, 37 m. Further, the depth of the lattice-like unevenness formed on the contact surface between the seal film body 80 and the film body 4 is set in a range of about 90 to 110 m, for example, 100.

Holes 81 are formed on both sides 31a of the ribs 31 of the frame 6, and engagement pins 82 are provided upright on the side edges of the lower plate so as to align with the holes. When positioning Both of them constitute an engaging portion that is immovably held. And, at the position of the lower surface of the upper plate 1 which is aligned with the pin 82, there is provided a hole 83 capable of engaging the pin 82. In this embodiment, an example in which the film body 3 is fixed to the surface plate 13 of the upper plate 1 and the material H is heated and pressed by the film body 3 and the film body 4 of the lower plate 2 will be described. However, for example, when the substrate 40 having a copper foil pattern forming a circuit on one surface as the molding material H and the film-like photoresist forming layer 44 are laminated, the copper foil pattern force s of the substrate 40 is provided. the film-like Fuotorejisu Bok forming layer 44 on the surface that is, laminated by the film body so as not to cause catching Ya void air and smoothly form a surface not provided copper foil pattern power ^s of the substrate 40 In this case, a flat plate having rigidity can be provided on the lower surface of the film body 3 of the upper plate 1.

Next, still another embodiment (fourth embodiment) of the vacuum laminating apparatus according to the present invention will be described with reference to FIGS. 11 to 15. FIG. The same or corresponding parts as those in the above-described embodiment are denoted by the same reference numerals in the drawings, and description thereof will be omitted. The major difference between the vacuum laminating apparatus of this embodiment and the above-described embodiment is that the suction means is connected so that a plurality of openings are formed along the inner periphery of the upper plate 1 with which the frame 85 is in contact. That the suction means is connected so as to open a plurality and / or substantially at the center along the inner circumference where the frame 85 abuts between the membrane 4 and the lower plate 2 The suction / pressing action of bringing the film body 4 into close contact with the surface plate 23 by the suction / pressure means, or separating the film body 4 from the surface plate 23 and inflating the film body 4 evenly over the entire surface of the film body 4 A gap forming member 86 for forming a predetermined gap between the film body 4 and the surface plate 23 is provided so as to be able to exert the force. It is detachably mounted so that it can be clamped and fixed between it and the top when the chamber 5 is formed. A cushion consisting of an annular rod with a circular cross section to ensure airtightness between the plate 1 and the frame 85.Seal material 88-force s Provided on the frame 85, and a continuous strip film material The cooling means 89, 90 force s is provided in the part on the side where the laminated molded articles L are sent out (left side in FIG. 11). On the lower surface of the upper plate 1, a concave portion 100 is formed along the inner periphery of the frame 85 to be abutted. In the concave portion 100, a heat insulating material 101, a heater 12, a platen 13 and a film 3 are formed. The recess 100 is accommodated so as to have a gap S between itself and the side wall surface. As shown in FIG. 11, the upper surface of the suction pipe 14 corresponding to the suction pipe of the above-described embodiment and the upper surface of the plate 1 As shown by the broken line in the bottom view of FIG. 12, the upper surface of the heat insulating material 101 provided in the recess 100 of the upper plate 1 has a groove 102 And a suction passage force s is formed between the upper plate 1 and the upper plate 1. The suction conduit 14 is connected吸弓I means force s such as a vacuum pump, thereby,吸弓to among plural openings along the circumference of the frame body 85 force ^s contact of the upper plate 1 I It is supposed to be connected by means power. When the suction means i is driven in a state where the chamber 5 is formed, the suction between the groove 102 and the recess 100 of the upper plate 1 is generated from the gap S between the outer peripheral side surface of the heat insulating material 101 and the side wall surface of the recess. The air in the chamber 5 is sucked through the bow 1 passage and the sucking I pipe 14. In this embodiment, the force described in the example in which the suction passage is formed by forming the grooves 102 in the heat insulating material 101 in a grid shape, for example, the grooves are formed in a grid shape on the surface of the upper plate 1 which is in contact with the heat insulating material 101. The shape is not limited to this as long as the suction means can be connected so that a plurality of openings are formed along the inner periphery of the frame body 85 of the upper plate 1 that is in contact with the upper body 1.

A cooling water circulation pipe 105 and a cooling air passage 106 serving as a cooling means 89 are provided on the side (the left side in FIG. 11) on which the continuous molded product L is fed (the left side in FIG. 11). Have been. As shown in FIG. 12, the cooling water circulation pipe 105 is connected to a plurality of pipes 105a, 105b- An inlet port 105c and an outlet port 105d to be connected are formed.A chamber 5 is formed by a frame 85 by bringing the upper plate 1 and the lower plate 2 close to each other for laminating the workpiece H. In this case, the heat of the heater 12 of the upper plate 1 is prevented from being transmitted to the belt-like film material sandwiched between the upper plate 1 and the frame 85. The cooling air passage 106 has an outlet 106a opened in a gap S between the outer peripheral side surface of the heat insulating material 101 and the side wall surface of the concave portion 100, and separates the upper plate 1 and the lower plate 2 from each other to form a chamber 5. When is released, cooling air is blown out to the continuous molded product L by continuous heating of the strip-shaped film material by heating and pressurizing to cool. The cooling air ejected from the ejection port 106a, it forces ^s desirable to prevent adhesion of dust to the molded article is obtained is Ion reduction to static elimination. Reference numeral 107 shown in FIG. 11 indicates feed knock control for supplying electricity to the heating means 12 such as an electric heater and for detecting the temperature of the platen 13 heated by the heating means 12. This is the terminal for the thermocouple to be connected. As shown in Fig. 11, the lower plate is formed so as to penetrate through the pressure line 25 plate 2, which corresponds to the suction / calo pressure pipe of the above-described embodiment, Further, the suction line 110 is in communication with the suction line 25 between the suction line I and the pressure line 25. Between the suction passage 110 and the suction means, a valve (not shown) is provided so that the intermittent connection can be made. The suction passage 110 is connected to the suction passage 14 of the upper plate 1 or connected to another suction suction I means (not shown). The suction passage 110 is connected to the suction passage 110 when the chamber 5 is evacuated. The valve is opened so that the membrane body 4 does not separate from the surface plate 23. When supplying the fluid to the suction / pressure line 25, the valve is closed. A punching metal 86 is formed between the surface plate 23 and the film body 4 as a space forming member by punching a hole 86a in a plate material by a punch to form a predetermined space force between the surface plate 23 and the film body 4. Have been. In this embodiment, the area ratio between the hole 86a in which the punching metal 86 is formed and the remaining portion of the plate is set to about 50%. The reason is that when the area ratio of the holes 86a is higher than 50%, the strength of the punching metal 86 becomes weaker, and when the area ratio is lower than 50%, suction and pressurization are performed. This is because applying the action evenly over the entire surface of the membrane 4 causes pharyngitis. Further, the diameter of the hole 86a formed is such that the film body 4 is not deformed when the film body 4 is sucked by the driving of the suction / calo pressure means. The punching metal 86 removes the burrs formed on one surface when the hole 86a is formed by punching to make a smooth surface, and as shown in FIG. The upper surface is in contact with the body 4, and the tapered concave portion 86 b formed on the opposite surface when the hole 86 a is formed by the punch is arranged as the lower surface so as to be in contact with the surface plate 23. With this arrangement, the suction and pressurizing action by the suction and pressurizing means is exerted over the entire surface between the film body 4 and the surface plate 23, and the heat of the heater 22 is efficiently transmitted to the film body 4 via the surface plate. be able to. In this embodiment, the spacing member has been described using an example in which the punching metal 86 is used. However, the present invention is not limited to this. For example, a wire mesh may be used. In addition to or instead of the arrangement of the space forming members, the surface of the film body 4 that is in contact with the surface plate 23 may be formed as a concave and convex surface.

As with the heat insulating material 101 of the upper plate 1, the heat insulating material 115 of the lower plate 2 116 is formed in the shape of a force grid, and a suction / pressure passage force S is formed between the lower plate and the lower plate. Thus, the suction and pressure means are connected so that a plurality of openings are formed along the inner circumference where the frame 85 between the film body 4 and the lower plate 2 abuts. Further, as shown by broken lines in the cross-sectional view of FIG. 11 and the plan view of FIG. 13, the suction / pressure pipe 25 and the punching metal 86 are arranged on the heat insulating material 115, the heater 22, and the surface plate 23. A hole 117 is provided so as to communicate with the suction / pressure line 25 so as to communicate with the substantially center of the space between the formed membrane 4 and the surface plate 23. In this way, the suction and pressure means are connected so that the frame 85 between the membrane body 4 and the lower plate 2 comes into contact with the frame 85 so that a plurality of openings are formed along the inner circumference. Providing a hole 117 communicating with the film body 4 on which the punching metal 86 is arranged and the center of the space between the surface plate 23 and forming a predetermined space between the surface plate 23 and the film body 4 By appropriately combining the above, when the chamber 5 is formed and the suction カロ calo pressure means is driven, the suction 加圧 pressing action is evenly spread from the outer peripheral side surface of the heat insulating material 115 to the entire surface of the membrane 4. Becomes Like the suction passage of the upper plate 1, the suction / pressurizing passage is formed by forming a groove in the lower plate 2, for example, where the frame 85 between the film body 4 and the lower plate 2 abuts. The present invention is not limited to this as long as the suction and pressure means can be connected so that a plurality of openings are formed along the line.

The frame 85 in this embodiment can be easily replaced when it needs to be replaced due to the deterioration of the film body 4, and moreover, when the chamber 5 is formed, the airtightness is further maintained. As shown in a dashed line in FIG. 11 and in FIG. 13, it is detachably attached to the lower plate 2 by bolts 118 so that the periphery of 4 is sandwiched and fixed between the lower plate 2 and the lower plate 2. As shown in FIG. 14, the distance K between the upper surface of the frame 85 and the workpiece H fed into the chamber 5 is determined by expanding the film 4 after the chamber 5 has been evacuated. When the material is pressed, the thickness is set to 2 to 3 mm so that a wrinkle does not occur in the film material due to deformation due to swelling of the film body 4. As shown in FIG. 13, in the case of this embodiment, a groove 119 for holding the cushion 'seal material 88 is formed on the entire upper surface of the frame body 85, and the cushion seal material 88 is cut off. It is formed in an annular shape composed of a bar with a plane circular shape. The groove 119 is formed such that the width of the opening is slightly smaller than the diameter of the cushion seal material 88 and the width of the bottom is slightly larger than the width of the opening, so that the cushion having a circular cross-section is formed. 88 is retained without jumping out of groove 119. Also, when forming chamber 5, When the cushion 'seal material 88 is elastically deformed by being pressed against the upper plate 1, the deformation of the cushion / seal material 88 is not hindered. When the continuous strip-shaped film material is laminated, the molded product L in which the continuous strip-shaped film material is laminated is sandwiched between the upper plate 1 and the frame body 85 when the continuous strip-shaped film material is laminated. Thus, no trace due to the pressing is formed on the molded article L, and the airtightness of the chamber 5 can be reliably maintained.

The side of the frame 85 that sends out the molded product L on which the continuous band-shaped film material ^{5 is} laminated (the left side in FIG. 11) should not contact with the continuous band-shaped film material when the chamber 5 is formed. It has a notch of 120 force s. When the upper plate 1 and the lower plate 2 are brought close to each other and the channel 5 is formed, the continuous strip film is not pressed between the upper plate 1 and the frame 85 and has a circular cross section with the upper plate 1. The force to be pressed between the cushion and the sealing material 85, and the portion pressed by the cushion 'sealing material 85 having a circular cross section becomes a narrow Itoizumi dog.

On the side of the lower plate 2 where the continuous strip-shaped film material is to be delivered (the left side in Fig. 11), the upper plate 1 and the lower plate 2 are placed close to each other to laminate the material to be molded. When the chamber 5 is formed by sandwiching the frame 85, the cooling means 90 is used as a cooling means 90 so that the heat of the heater 22 of the lower plate 2 does not propagate to the band-shaped film material sandwiched between the upper plate 1 and the frame 85. The cooling water circulation pipe 125 of the plate 1 is provided similarly to the cooling water circulation path 105 of the plate 1. In this way, the continuous strip-shaped film material of the upper plate 1 and the lower plate 2 is provided with cooling means 89, 90 on the side where the laminated molded product is sent out, so that a continuous strip-shaped film material can be obtained. In the case of laminating the film-like photo-resist forming layer on a substrate and laminating the same, the laminated product is sent out of the opened chamber 5 after the lamination is completed, and the chamber is formed to start the next molding cycle. When 5 is formed, the photoresist layer of the laminated product L, which is in a softened state due to heating during bonding, is sandwiched between the upper plate 1 and the cushion 'seal material 85, and is pressed. Traces can be prevented from remaining.

In the vacuum laminating apparatus according to this embodiment, a roller 43 supporting a roll wound around a continuous band-shaped film material 41 similar to that of the above-described first embodiment, and a continuous band-shaped film material A film inlet guide plate 130, which is located between the upper frame and the upper frame, is set on the side of the vacuum laminating apparatus where the material H is fed in (right side in Fig. 11). Have been killed. The roller 43 is provided with a brake for applying a predetermined tension to the continuous band-shaped film material in order to prevent the generation of wrinkles in the continuous band-shaped film material, and in the width direction of the roll in order to cope with the case where wrinkles are generated. It has a width direction adjustment mechanism for adjusting the position. As shown in FIG. 15, the roller 43 includes a shaft 131, a roller body 132 that is provided so as to be rotatable around an axis with respect to the shaft 131 through a roll force wound around the continuous band-shaped film material 41, An adjusting member 133 for moving the roller body 132 in the axial direction with respect to the shaft 131 is schematically constituted. In this embodiment, the force for explaining the roller 43 is, for example, a film for laminating a film-like photoresist forming layer on both sides of the circuit board 40 as described in the first embodiment. Alternatively, a roller 45 (see FIG. 1) that supports a roll of continuous film 44 such as a carrier film for transporting the circuit board 40 may have the same structure as the roller 43. Of course it is. The shaft 131 is provided with a hollow 131a at an intermediate portion, and a screw portion 131b at one end (the left side in FIG. 15). The adjusting member 133 is externally fitted to the shaft 131 so as to be movable in the vehicle direction and not to be rotatable around the axis by the key 134. The adjusting member 133 has a threaded portion 133a formed on the outer periphery at one end, and the other end. A collar 133b is provided on the side. The roller main body 132 is rotatably fitted around the shaft 131 and an adjusting member 133 externally fitted to the shaft 131. The roller body 132 has a shaft 131 at the other end (the right side in FIG. 15). A collar 132a having a sliding surface against the adjusting member 133 is provided on the inner periphery of the intermediate portion.

The collar 133b of the adjusting member 133 is located between the collar 131a of the shaft 131 and the bush 132b of the roller body 132, and both collars 131a are located between the collar 131a of the shaft 131 and the force roller 133b of the adjusting member 133. , 133b, which is provided to bias the one end surface of the adjustment member 133 against the biasing force of the compression spring 135. The widthwise adjustment nut 136 is a screw portion of the shaft 131. Screwed to 131b. A pair of friction rings 138 and 139 made of cork or the like are fitted on the intermediate portion of the adjusting member 133 so as to be located on both sides of the bush 132b of the roller body 132, and the tension is adjusted on the screw portion 133a of the adjusting member 133. The nut 140 is screwed into the tension adjusting nut 140 and the friction ring 138 on the side where the tension adjusting nut 140 has accumulated the force so that the pressing member 141 can move in the axial direction of the force adjusting member 133. And with key 142 The roller body 132 is fitted between the tension adjusting nut 140 and the pressing member 141 via the friction rings 138 and 139 by the collar 133b of the adjusting member 133 and the pressing member 141 between the tension adjusting nut 140 and the pressing member 141. A compression spring 143 is provided to urge the bush 132b of both sides so as to sandwich the bush 132b from both sides.

When the width adjustment nut 136 is tightened so as to move to the right in FIG. 15, the adjustment member 133 moves to the right in FIG. 15 against the spring 135, and the width adjustment nut 136 is moved to the 15th position. When the adjusting member 133 is loosened so as to move to the left side in the figure, the adjusting member 133 moves to the left side in FIG. The bush 132b sandwiched between the roller body 132 and the pressing member 141 moves, and the position of the roller body 132 in the width direction is adjusted. Further, when the tension adjusting nut 140 is tightened so as to move to the right side in FIG. 15, the force of the pressing member 141 is moved via the spring 143 to the right side of FIG. The force that presses the bush 132b of the roller body 132 with the collar 133b through the friction rings 138 and 139 s The force s increases, and the frictional force increases. Become. On the other hand, when the tension adjusting nut 140 is loosened so as to be moved to the left side in FIG. The urging force pressing against 132b is slightly reduced and the frictional force is reduced, and the tensile force ^{s of} the continuous film film is reduced.

The film entrance guide plate 130 is formed to have at least a rounded tip portion in contact with the film material in order to reduce resistance due to friction and prevent abrasion of the film material, and to form tetrafluoroethylene on the surface. It is a plate-like material formed by forming a layer of fluororesin such as resin. In this embodiment, a thin plate-shaped guide plate is used in place of the guide roller 46 (see FIG. 1) having the predetermined suspicion as described above, so that the guide roller 46 is arranged close to the upper plate 1. Therefore, waste of the film material can be reduced.

In this embodiment, similarly to the third embodiment described above, the film 3 is fixed to the surface plate 13 of the upper plate 1 by baking or the like, and the film 3 and the film In the above description, the molding material H is heated and pressurized in accordance with 4 and the like. For example, as the molding material H, a substrate 40 having a copper foil pattern forming a circuit on one surface and a film-shaped photo resister are used. In the case of stacking with the dist formation layer 44, the film-like photoresist formation layer 44 is stacked on the surface of the substrate 40 on which the copper foil pattern is provided, so as not to trap air or generate voids, and When the copper foil pattern force of the substrate 40 is not provided, and when the surface is to be formed smoothly, a rigid smooth plate is provided on the lower surface of the film body 3 of the upper plate 1, or the upper plate 1 By exposing the smooth surface of the surface plate 13 without providing the film body 3, the surface of the substrate 40 on which the copper foil pattern force is not provided may be pressed.

Next, an embodiment of an operation cycle of the vacuum laminating apparatus according to the present invention configured as in each embodiment will be described with reference to FIG. In the vacuum laminating apparatus according to the present invention, the lower plate 2 descends with respect to the upper plate 1 as an initial state, so that the chamber 5 for accommodating the formed material is opened. If the material to be molded is a continuous belt-shaped film material and the sending means is to be pulled while holding the film material with a chuck, the chuck of the sending means is moved and the film material is pulled to form the material. Move the material to a position where it can be stored in the chamber 5 (6 seconds). Then, the lower plate 2 is raised to form the chamber 5 (2 seconds), and the evacuation is started by the suction means. When the evacuation of the chamber 5 is completed (40 seconds), the film 4 of the lower plate 2 is inflated by driving the pressure / suction means to press the material to be molded (5 seconds). Lower 2 to open chamber 5. In the adjustment time, positioning of the molding material is performed for the next molding cycle (4 seconds). Note that the time shown in this operation cycle is an example, and the present invention is not limited to this. In addition, the positioning of the workpiece for the next molding cycle can be performed by force when the lower plate is lifted by completing the movement of the chuck of the feeding means. Example 2

In order to more clearly show the effects of the present invention, a cushion and a seal were used when a photoresist layer was actually applied to a circuit board using the vacuum laminating apparatus according to the fourth embodiment of the present invention. The surface appearance of the photo resist layer pressed between the material and the upper plate and the change in the thickness of the photo resist layer were examined.

In this embodiment, when the film-like photoresist forming layer is bonded to the circuit board by the steps (1) to (3) in the same manner as in the first embodiment, the vacuum laminating apparatus is used. Table 2 shows the results of pressing the molded product laminated in the previous cycle with a cushion 'seal material consisting of a rod with a circular cross section on the delivery side. For comparison purposes, a circuit board and a photo-resist forming layer similar to those described above were used as a control in the same manner as in Example 1 described in Japanese Patent Publication No. 55-133341. Table 2 also shows the results of bonding using a vacuum laminating apparatus, that is, holding the photoresist-forming layer with a seal during bonding.

[Table 2]

As is evident from the results shown in Table 2, a cushion made of a rod having a circular cross section according to the present invention was bonded by sandwiching a molded product laminated on the delivery side of the vacuum laminating apparatus with a sealing material. There is no change in appearance, and almost no change in the thickness of the photo resist is observed. On the other hand, in the conventional method, there is almost no photoresist force s left on the substrate, and if there is a partial force s of a circuit or the like in this portion, the formation will be defective, which is inappropriate. Industrial applicability

As described above, in the vacuum laminating apparatus according to the present invention, since the film body of the upper plate is fixed and the film body of the lower plate is expanded, the film body of the upper plate hangs due to its own weight or the like. Therefore, careless contact of the molding material and Lamination can be performed under an appropriate vacuum because no bad feeling occurs. In addition, since the chamber is formed by sandwiching the frame between the film bodies of the upper plate and the plate, the size of the frame can be easily changed according to the size of the molded product. Frames of different sizes can be reliably sealed. In addition to this, the interval of positioning of the molding material can be narrowed, and waste of the molding material can be reduced.

Further, according to the vacuum laminating apparatus according to the present invention, as described above, the pressurized film body provided so as to be able to contact and separate from the surface facing either one of the upper plate and the lower plate, A frame is arranged between the other facing surface of the plate and the upper plate and the lower plate are brought close to each other to form a chamber in a state in which the stacked materials are accommodated. The selection can easily accommodate the size of the laminate. Furthermore, the inside of the chamber is evacuated without changing the volume in the chamber by sucking the caro-pressure film so as to be in close contact with either the upper plate or the lower plate, and then forming the formed material by the pressurized film. Since the layers are stacked, the layers can be stably stacked without leaving air between the molding materials.

In the case where one surface of the material to be formed has a smooth surface and the other surface has irregularities, the opposite surface of the upper plate or the lower plate is not provided with the pressurized film, and the other surface of the upper plate or the lower plate is a smooth surface As a result, the smooth surface side force of the material to be molded is pressed against the smooth surface of either the upper plate or the lower plate, and the other uneven surface of the material to be molded is pressed by the pressure film. Laminated. Further, in the case where both surfaces of the molding material have irregularities, the film is fixed to the other opposing surface of the upper plate or the lower plate on which the pressure film is not provided. However, both the concave and convex surface forces of the material to be molded are pressed and laminated by the pressurized film body. In this way, the molding materials can be laminated according to the mode of the molding material.

When a sealing film is provided between the pressurized film and the upper or lower plate on which the pressurized film is provided, the sealing performance of the frame when the chamber is formed should be improved. Can be. In this case, if the surfaces of the pressurized film and the seal film that come into contact with each other are made uneven, if the surface of the pressurized film is brought into contact with the frame body, the absorption I It can be spread evenly and can be laminated evenly without wrinkling of the molding material. When a pressurized film body is provided on one of the opposing surfaces of the upper plate and the lower plate so as to be able to contact and separate, and the film body is fixed on the other surface, the pressure film provided on one of the upper plate and the lower plate By making the combined thickness of the pressure film body and the seal film body substantially the same as the thickness of the other film body, the sealing performance can be further improved.

In the case where an interval forming member that forms a predetermined interval is provided between the pressurized film body and the upper plate or the lower plate on which the pressurized film body is provided, the frame of the pressurized film body is The suction / pressing action is applied uniformly over the entire inner surface that comes into contact with the material, and the material can be laminated uniformly without causing wrinkles. Further, when an uneven surface is formed on a surface of the pressurized film body, which is in contact with the upper plate or the lower plate on which the pressurized film body is provided, so as to exert a suction / calopressure effect over substantially the entire surface of the film body. If so, the suction / pressing action can be exerted more uniformly.

If the suction means is connected to the upper or lower plate so as to open near the inner periphery of the frame body to be abutted, the suction action force S spreads evenly over the entire inner surface of the frame, and Vacuum can be drawn uniformly and stably. In addition, the suction / pressurizing means is opened in the vicinity of the inner periphery and Z or substantially in the center of the abutted frame between the pressurized film and the upper plate or the lower plate provided with the pressurized film. In such a case, the suction pressure is applied to the entire surface from the periphery and Z or the center of the pressure membrane, so that the caropressure membrane can be uniformly and stably adhered or expanded.

Since the chamber can be formed by sandwiching the frame between the upper plate and the lower plate, the frame can be selected according to the size of the laminated product, and the position is determined with respect to the lower plate. In addition, in the case where an engaging portion that engages immovably is provided, the selected frame plate can be easily positioned and fixed to the lower plate. Further, the frame body can be detachably attached to either the upper plate or the lower plate provided with the pressurized film body strength s so as to sandwich and fix the periphery of the caro pressure film body.

Each of the above-mentioned film bodies is made of a heat-resistant rubber, and when the rubber hardness is set to 40 to 60, it is necessary to press the material to be molded and maintain the sealing property when the chamber is formed. Flexibility, elasticity and elasticity are ensured.

Further, when a plain fabric is formed on the surface of the film body in contact with the material to be molded, the film body can be released from the laminated molded article without bonding.

If heating means is provided so that the upper plate and the lower plate can be heated separately, heating can be performed according to the size of the frame that matches the size of the molded product. With this, it is possible to prevent unnecessary parts from being heated and save energy. Energy can be achieved.

In the case where a cushioning / sealing material is laid laterally on at least the part of the frame body where the continuous molded product is sent, in order to deliver the continuous molded product and laminate the next molded material When the chamber is formed, the continuous molded product is sandwiched between the cushion / seal material and the upper or lower plate facing it, and pressed, so that no trace of the molded product remains and the molding is completed. There is no need to adjust the size of the frame body according to the size of the product, and there is no limitation on the pitch at which the material is fed, so that waste of the material can be reduced.

Cushion 'When the sealing material is a rod with a substantially circular cross section, a continuous molded product is sent out, a chamber is formed for laminating the next molded material, and the continuous molded product is cushioned. 'When pressed between the sealing material and the upper plate or lower plate facing the sealing material, the width of the pressing is narrowed, so that traces due to the pressing are less likely to be formed. Also, when the groove for holding the cushion seal material is formed in the frame, the width of the opening of the groove is smaller than the diameter of the cushion seal material, and the width of the bottom is larger than the width of the opening. In addition to holding the cushion seal material without protruding from the groove, the cushion seal material is pressed when the cushion seal material is pressed against the upper plate or lower plate facing to form a chamber. Does not hinder the deformation of Therefore, when laminating continuous strip-shaped film materials, when the chamber is formed, even if the continuous strip-shaped film material is sandwiched between the laminated molded products L, a trace due to pressing is formed on the molded product. In addition, the sealing force can reliably maintain the airtightness of the chamber.

In the case of providing a notch in the continuous molded article strength ^s side of the portion to be delivered in the frame to form a chamber for laminating the next object to be profiled, the frame and which successive moldings There is no pressing of the molded product between the upper plate or the lower plate opposed to the molded product.

In the case where a cooling means is provided to cool the continuous strip-shaped film material, the molded product in the softened state is cooled by heating during laminating. When a product is delivered, a chamber is formed for laminating the next material to be formed, and a continuous product is sandwiched between the cushion's sealing material and the upper plate or lower plate facing it, and pressed, Traces are prevented from remaining.

A mouthpiece for supporting a molding material consisting of a roll wound with a continuous band-like film material When a roller is provided with a width-direction adjusting mechanism, when the roll material generates a wrinkling force due to a shift in the width direction of the roll, the position in the width direction is adjusted. Can be.

In the case where a roller is provided for supporting a material formed of a roll of continuous belt-shaped film material wound thereon, and the roller is provided with a brake, a predetermined tension is applied to the film material to thereby reduce the film material. The generation of wrinkles can be prevented.

In the case where a film entrance guide plate is provided to guide and feed a material formed of a continuous strip of film material between the upper plate and the lower plate, the film is placed near the upper plate or the lower plate. The molding material can be guided, so that the waste of the molding material can be reduced.

In addition, the vacuum lamination method of the present invention can bond the same or different kinds of film-like materials or a film-like material and another base material without trapping air between their layers. Even when a very thin film material such as a photoresist is bonded to the surface of a substrate having an uneven surface, such as a circuit board for a substrate, no air is trapped between the layers and voids are not generated. According to the present invention, it is possible to surely protect the electric circuit of the circuit board by the resist without causing the appearance failure and the adhesion failure in the laminated molded article.

According to the method of the present invention, the bonding force can be continuously obtained according to the method of the present invention. Further, by adopting a frame in the processing chamber for performing the lamination, the processing operation can be simplified and the material to be laminated can be formed. The simplification of responding to the change in the size of the material is promoted, and the operating cost and the material cost can be significantly reduced.

Claims

The scope of the claims

1. An upper plate and a lower plate which are provided so as to be able to approach and retreat in opposition to each other and are provided with heating means for heating the surfaces facing each other; and a film body having elasticity fixed to the opposing surfaces of the upper plate. A film having elasticity, flexibility and elasticity placed on the opposite surface of the lower plate; and being placed on the film of the lower plate and being sandwiched between the films of the upper plate and the lower plate. A frame having a predetermined size forming a chamber for accommodating a continuous material to be formed therein, suction means connected to the chamber and evacuating the chamber, and a surface facing the upper plate of the lower plate. When the inside of the chamber is evacuated by the suction means, the film is sucked to hold the film body of the lower plate on the facing surface, and is connected between the film body mounted on the facing surface and the suction means. Suction and pressurizing means for inflating the lower plate film body to press the self-molded material between the upper plate film body and Vacuum lamination apparatus characterized by comprising.

2. An upper plate and a plate provided so as to be able to approach and retreat in opposition to each other and to heat the surfaces facing each other, and opposing the upper plate or the lower plate to either one of the upper plate and the lower plate. The pressurized film body provided so as to be able to contact and separate from the surface, is disposed between the upper plate and the lower plate, and the upper plate and the lower plate are stacked by being sandwiched between the upper plate and the lower plate in close proximity. Forming a chamber for accommodating a molding material to be formed, suction means for evacuating the chamber, and applying a vacuum film to the chamber when the chamber is evacuated by the suction means. Is pressed so as to be in close contact with one of the lower plates and pressurized between the upper and lower plates so that the material to be formed is laminated with the upper or lower plate. A suction / pressurizing means for expanding the plate by separating it from one of the forces of the plate. Vacuum lamination apparatus.

3. The vacuum laminating apparatus according to claim 2, wherein the film body is fixed to a surface of the upper plate or the lower plate which faces the other one of the pressurized film bodies.

4. The vacuum according to claim 2, wherein a seal film is provided between the pressurized film and the upper plate or the lower plate to which the pressurized film is applied. Laminated packaging

5. A seal film is provided between the pressurized film and the upper or lower plate provided with the pressurized film, and the combined thickness of the pressurized film and the seal film is set to the upper plate. 4. The method according to claim 3, wherein the thickness of the film fixed to the other one of the lower plate and the lower plate is substantially the same.

6. At least one of the surfaces of the pressurizing film body and the sealing film body that are in contact with each other is an uneven surface so as to exert suction and pressurizing actions over substantially the entire surface of the caropressure film body. 5. The vacuum laminating apparatus according to 4.

7. An interval for forming a predetermined interval between the pressurized film body and the upper or lower plate provided with the pressurized film strength so as to exert a suction / pressing action over substantially the entire surface of the film body. The vacuum laminating apparatus according to any one of claims 2 to 6, wherein a forming material is provided.

8. An uneven surface is formed on the surface of the pressurized film body, which is in contact with the upper plate or the lower plate provided with the pressurized film strength S, so as to exert suction and pressurization actions over substantially the entire surface of the film body. The vacuum laminating apparatus according to any one of claims 2 to 7, which is characterized in that:

9. The vacuum product according to any one of claims 1 to 8, wherein a cushion and a sealing material are provided laterally at least on a portion of the frame body on a side where a continuous molded product force is transmitted.

10. Cushion 'The sealing material is made of a rod with a substantially circular cross section, and a groove for holding the cushion sealing material is formed in the frame body. The width of the groove is the diameter of the cushion sealing material. 10. The vacuum laminating apparatus according to claim 9, wherein the width is smaller than the width of the bottom and the width of the bottom is larger than the width of the opening.

11. A continuous molded article of the frame body, wherein a cut-out force is provided at a portion on the side to be fed out so as not to contact the molded article.

12. The vacuum laminating apparatus according to any one of claims 9 to 11, further comprising a cooling means for cooling the continuous strip-shaped film material.

13. The vacuum according to claim 1, wherein the suction means is connected to the upper plate or the lower plate so as to open near an inner periphery of the frame body to be contacted. Product

14. Suction: The pressurizing means is opened between the pressurized film body and the upper or lower plate provided with the pressurized film body, in the vicinity of the inner periphery of the frame abutted and at Z or substantially at the center. The vacuum laminating apparatus according to any one of claims 1 to 13, wherein the vacuum laminating apparatus is connected to the vacuum laminating apparatus.

15. The vacuum laminating apparatus according to claim 1, further comprising an engaging portion for positioning the frame with respect to the lower plate.

16. The vacuum laminating apparatus according to any one of claims 1 to 15, further comprising: an engagement portion for immovably engaging the frame with the lower plate.

17. A frame is detachably attached to one of the upper plate and the lower plate provided with the pressure film body force S so as to sandwich and fix the periphery of the pressure film body. The vacuum laminating apparatus according to any one of 2 to 16.

18. The vacuum laminating apparatus according to any one of claims 1 to 17, wherein each film is made of a rubber having thermal properties and has a rubber hardness of 40 to 60.

19. The vacuum laminating apparatus according to any one of claims 1 to 18, wherein plain fabrics are formed on the surfaces of the film bodies facing each other.

20. The vacuum product according to any one of claims 1 to 19, wherein the heating means is provided in the power station for heating the upper plate and the opposing surface of the plate separately.

21. A roller force s is provided to support a material formed of a roll of continuous belt-shaped film material wound thereon, and the roller is adjusted in the width direction so that the position of the roller can be adjusted in the width direction of the roll. The vacuum laminating apparatus according to any one of claims 1 to 20, further comprising a mechanism.

22. A roller is provided for supporting a material formed of a roll of continuous belt-shaped film material wound thereon, and the roller is provided with a brake so as to apply a predetermined tension to the film material. The vacuum according to any one of claims 1 to 21,

23. The apparatus according to claim 1, further comprising: a film entrance guide plate for guiding a workpiece formed of a continuous band-shaped film material between the upper plate and the lower plate and feeding the material. 5. The vacuum laminating apparatus according to 1.

24. A vacuum lamination method in which the same or different types of film-like materials or a film-like material and a substrate are laminated,

Place another film-like material or substrate on the film-like material, or face the film-like material on the substrate in close proximity or contact,

Heating the film-like material and, if necessary, the substrate, and

While maintaining the reduced pressure, the facing film-like material or the film-like material and the substrate are pressurized at a pressure higher than 1 atm from either the upper surface side or the lower surface side of the substrate, and the film-like materials or the film-like materials are pressed against each other. Laminating the substrate and the substrate,

A vacuum lamination method characterized by the above-mentioned.

25. A vacuum lamination method in which a film-like photoresist forming layer having an unexposed photosensitive layer and a substrate having an uneven surface are attached to each other,

The photosensitive layer surface of the photoresist forming layer and the uneven surface of the substrate face each other in close proximity or in contact with each other, and the other is positioned on one side, Reducing the absolute pressure of the space between and around the photoresist forming layer and the substrate to 1 atm or less;

The photoresist forming layer is heated to soften the photosensitive layer, and while maintaining the reduced pressure, the photoresist forming layer and the substrate facing each other are removed from either the upper side or the lower side. Is applied at a pressure higher than 1 atm, and the photoresist forming layer and the substrate are bonded together.

A vacuum lamination method characterized by the above-mentioned.

26. A vacuum lamination method in which a film-like photoresist forming layer having an unexposed photosensitive layer and a substrate having an uneven surface are bonded to each other,

The photosensitive layer surface of the photoresist forming layer and the uneven surface of the substrate face each other in close proximity or in contact with each other, and the other is positioned on one side,

The photoresist forming layer is heated to soften the photosensitive layer, and, while maintaining the reduced pressure, the photoresist forming layer and the substrate facing each other are substantially depressed from either one of the upper surface side or the lower surface side. Using a film body having elasticity, flexibility, and elasticity that presses while contacting over the entire surface, pressurizing them at a pressure higher than 1 atm, and bonding the photoresist forming layer and the substrate together;

A vacuum lamination method characterized by the above-mentioned.

27. The vacuum laminating method according to claim 25, wherein the pressure at the time of pressurization is 2 atm or more and 10 atm or less.

28. The vacuum lamination method according to any one of claims 25 to 27, wherein the temperature at the time of heating is 30 ° C or more and 200 ° C or less.

29. The vacuum lamination according to any one of claims 25 to 28, wherein a film-like photoresist forming layer having an unexposed photosensitive layer is bonded to both sides of a substrate having an uneven surface on both sides. Method.