KR101301524B1

KR101301524B1 - Lamination device and lamination method

Info

Publication number: KR101301524B1
Application number: KR1020120026498A
Authority: KR
Inventors: 토모아키 히로세; 타카유키 야마모토
Original assignee: 가부시키가이샤 메이키 세이사쿠쇼
Priority date: 2011-11-21
Filing date: 2012-03-15
Publication date: 2013-09-04
Also published as: TW201321189A; TWI492845B; KR20130056153A

Abstract

In a simple configuration, at least the film-like laminate is pierced on the surface having the protruding portion of the layer to be laminated reliably, and molded to a uniform thickness without generating voids.
The lamination apparatus is provided with the heating means 1 and 2 which heat at least the insulating resin film F, and the upper side board 3 and the lower side board 4 which are provided so that opening and closing are possible, and when they are closed, they form the closed chamber 34. ), A receiving member 5 having elasticity opposed to the insulating resin film F polymerized on the side where the bump B of the semiconductor wafer W is formed on the upper half 3, and the lower half. (4), the elastic membrane body (6) facing the semiconductor wafer (W) on which the insulating resin film (F) is polymerized, the vacuum suction means (7) for vacuum suction inside the chamber (34), and the elastic membrane body ( It is provided with the pressurizing means 8 which expands 6) and presses the semiconductor wafer W and the insulating resin film F between the receiving members 5.

Description

Lamination Method and Lamination Device {LAMINATION DEVICE AND LAMINATION METHOD}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a laminating method and a laminating apparatus, and in particular, polymerizing a laminated body having protrusions such as an electronic component having a bump and a film-like laminate such as a resin layer, for example. The present invention relates to a method and an apparatus for laminating such that the protruding portion penetrates at least the film-like laminate by heating, pressing and heating.

As a laminated body, such as an electronic component which has a protrusion part, bumps which consist of metals, such as solder, copper, and gold, are formed in the surface of a semiconductor wafer, for example. This bump protrudes from the surface of the semiconductor wafer, and is generally formed in a cylindrical or egg shape whose tip is close to a spherical surface, and has a height (protrusion amount) of 0.01 to 0.04 mm and a diameter of about 0.01 to 0.04 mm. . Moreover, the space | interval with the mutually adjacent bump is 0.03-0.10 mm. The plating method, paste printing method, ball mounting method, etc. are employ | adopted for formation of such a bump.

The semiconductor wafer on which such bumps are formed is generally made of silicon, molded into a circle, has a diameter of 4, 8, 12, or 16 inches, and has a thickness of 0.025 to 0.800 mm.

On the other hand, the insulating resin film as a film-like laminated body is generally comprised by thermosetting resins, such as epoxy, as a main component. Moreover, the insulating resin film may be comprised by the thermoplastic resin and the mixture of a thermosetting resin and a thermoplastic resin. And as shown to Fig.3 (a), as for flexible resin film F, protective films P1 and P2 which consist of PET etc. are laminated | stacked on both surfaces generally, and lamination | stacking with the semiconductor wafer W When the protective film P2 is peeled off as shown in Fig. 3 (b), and when mounting the package after lamination, for example, as shown in Fig. 3 (c), the other protective film (P1) is also peeled. The thickness of insulating resin film F is about 0.01-0.06 mm, for example. When the tip of bump B penetrates and the other protective film P1 is peeled off as shown in FIG.3 (c), it is generally selected so that it may expose from the surface of insulating resin film F. FIG.

Patent documents 1-4 are known as a conventional technique for laminating | stacking the to-be-laminated body W and film-like laminated body F which have such a protrusion part B. As shown in FIG. Patent Literature 1 discloses that a conductive foil having an electrically conductive bump formed therein and an insulating resin layer are laminated, and the conductive bump is allowed to penetrate the insulating resin layer by heating and pressurizing between press plates of a flat press machine (0012, etc.). In addition, Patent Document 1 also discloses that a conductive bump, an insulating resin layer, and a release sheet are passed between a pair of rolls, pressurized, heated, and the conductive bump penetrates the insulating resin layer (0064, etc.).

In addition, Patent Document 2 discloses that a synthetic resin sheet is opposed to a conductor bump of a supporting gas, passed through a roller constituted by a metallic roller and a flexible rubber roller, and is primarily pressed to penetrate the conductive bump through the synthetic resin sheet. (0020, etc.).

Moreover, as another conventional technique, patent document 3 is comprised by the elastic member, such as rubber | gum, and the pressing means provided in the curved or inclined surface shape in which the center part is located below the outer peripheral part in the lower surface side is disclosed. According to this shape, when the adhesive sheet S is affixed to the wafer W, it is described that it is possible to affix while pushing out the air existing between the adhesive sheet S and the wafer W to the outside. (0017). Further, Patent Document 3 describes that the pressing means may be a hollow elastic member, in which the elastic member is expanded by compressed air or a reduced pressure atmosphere, and the adhesive sheet may be attached to the wafer (0036). ). And in patent document 3, while mounting a semiconductor wafer and a ring frame to a support means, an adhesive sheet is located above these, and an adhesive sheet is clamped by a press means, and a semiconductor wafer and a ring frame are carried out. Press against.

As another conventional technique, Patent Document 4 discloses a synthetic resin sheet by laminating and pressing a synthetic resin sheet on a conductive support in a state in which air between a conductive support having a bump and a synthetic resin sheet is forcibly sucked and discharged. The second lamination pressurizing step of performing a first lamination pressurizing step through which the tip of the bump is exposed and exposed, followed by laminating and pressing the conductive support on the synthetic resin sheet to press the tip of the bump exposed from the synthetic resin sheet to the conductor layer. Is disclosed. Patent Document 4 discloses a pressurizing device including an upper plate free to move up and down, a storage chamber hermetically closed by the upper plate, and a pair of rubber pressing members provided at the bottom of the storage chamber. .

Japanese Patent Laid-Open No. 11-4076 Japanese Patent Laid-Open No. 9-307230 Japanese Patent Publication No. 2009-32853 Japanese Patent Publication No. 2005-150273

In the said patent document 1, when using a flat press machine, the mechanical parallelism for maintaining both press plates in parallel cannot be maintained correctly, or the parallelism of the pressing surface itself of both press plates cannot be maintained correctly. Problems such as the inability to form a film-like laminate laminated on the laminated body to a uniform thickness, or the like, such that protrusions such as bumps are crushed due to partial pressure, or the film-like laminate becomes thinner than the set thickness. There was.

In addition, as disclosed in Patent Literature 1 or Patent Literature 2, when pressing and heating between a pair of rollers, the laminated body W and the film-like laminate F are shown in FIG. 4. To be pressed and heated sequentially between the rollers R1 and R2 from the front in the conveying direction (left in FIG. 4), so that the rollers R1 and the laminated body W and the film-like laminate F Since the contact of R2 becomes a line contact and presses the laminated body W and the film laminated body F sequentially according to rotation of the roller R1, R2, the laminated body W And the film-like laminate F cannot be pressed for a predetermined time or more over the whole. Moreover, the tip of the protrusion B may deform so as to fall toward the rear in the conveying direction (right in FIG. 4), or the protrusion B may be crushed. In addition, when pressurizing between roll R1 and R2, the place where the pressurized part W and the film-form laminated body F pressurize will move, and as shown in FIG. Lack of embedding of the film-like laminate F occurs, and as a result, voids K occur around the protrusion B, in particular, between the laminated body W and the film-like laminate F. In addition, when the laminated body W is shape | molded circularly like a semiconductor wafer, by the conveyance position of the laminated body W and the film-like laminated body F with respect to the roller R1 and R2, Since the lengths in which the rollers R1 and R2 are in line contact with the laminated body W and the film-like laminated body F are different, the surface pressure does not become constant and changes.

In patent document 3, since only the shape of the lower surface of a press means is affixed while pushing out air which exists between an adhesive sheet and a wafer, air does not exist reliably between a laminated body and a film-like laminated body. It is not possible to bury the film-like laminate so as to penetrate the protrusions of the layered body. Moreover, in patent document 3, since a semiconductor wafer and a ring frame are mounted to a support means, an adhesive sheet is located above these, and an adhesive sheet is clamped, it presses against a semiconductor wafer and a ring frame, and is adhesive The surface of the sheet is not flat and the thickness is not uniform. Therefore, patent document 3 is not applicable to laminating | stacking a film-like laminated body with uniform thickness on the surface which has the protrusion part of the to-be-laminated body which has a protrusion part.

In patent document 4, since the core board | substrate and a prepreg system sheet | seat are pressurized between a top plate and the bottom part of a storage chamber through a pair of rubber press members, both presses of the flat press machine of patent document 1 Like the plate, parallelism cannot be guaranteed and the prepreg sheet cannot be laminated to a uniform thickness. In addition, in Patent Document 4, it is not clearly described how to lower the top plate, but if the top plate is lowered by discharging air in the storage chamber, the core substrate is sufficiently sucked before the air between the core substrate and the prepreg system sheet is sufficiently sucked. Since the pressurization of the prepreg sheet is started, the synthetic resin sheet cannot be laminated and pressurized on the conductive support while the air between the conductive support having the bumps and the synthetic resin sheet is reliably sucked out. Moreover, since pressurization is performed by the rubber pressing member only by vacuum suction, sufficient pressing force may not be ensured.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and in a simple configuration, the film laminated body can be reliably laminated through a surface having a projecting portion of a layer to be laminated, and can be molded to a uniform thickness without generating voids. It is an object of the present invention to provide a method and apparatus.

The invention according to the lamination method of claim 1, in order to achieve the above object, a method of laminating the laminated body having a protrusion and the film-like laminate so as to penetrate at least the film-like laminate by polymerizing, heating and pressing. As the side in which the protrusion part of the said laminated body is formed, and the said film laminated body are opposed, it superposes | polymerizes a laminated body and a film shaped laminated body, and between the elastic receiving member and an elastic membrane body, The polymerized laminate and the film-like laminate are disposed so that the film-like laminate faces the receiving member and the laminate is opposite to the elastic membrane, and at least the laminate and the film-like laminate The laminated body and the film-like laminated body are expanded with the elastic membrane body by expanding the elastic membrane body in a vacuum suction therebetween. It characterized in that the pressure between the two members.

The invention according to the lamination method of claim 2 is characterized in that, in order to achieve the above object, in the invention according to claim 1, a harder one than the hardness of the elastic membrane body is disposed as the receiving member.

The invention according to the lamination method of claim 3, in order to achieve the above object, in the invention according to any one of claims 1 or 2, the laminated body is placed on a carrier film, and the film-like laminate The laminated body is conveyed between the receiving member and the elastic membrane body, and the elastic membrane body is pressed against the receiving member through the carrier film toward the receiving member.

In addition, the invention according to the lamination apparatus of claim 4, in order to achieve the above object, the laminated body having the protrusions and the film-like laminate is polymerized, heated and pressed to laminate the protrusions so as to penetrate the film-like laminate. An apparatus comprising: a heating means for heating at least the film-like laminate, a pair of vanes which are provided to be openable and close, and which form a closed chamber when closed, and are provided in one of the vanes, and the laminated layer A receiving member having elasticity opposed to the film-like laminate polymerized on the side where the protrusion of the body is formed, an elastic membrane body provided on the other side of the half, and opposed to the laminated body to which the film-like laminate is polymerized; And vacuum suction means for vacuum suction in the chamber and the elastic membrane body to pressurize the laminated body and the film-shaped laminate between the receiving member. It characterized in that comprises a pressing means.

According to the lamination method of claim 1, the surface on the side where the protrusion of the laminated body is formed and the film-like laminate are opposed to each other to polymerize each other so that the film-like laminate faces the receiving member and the laminate is opposed to the elastic membrane body. It is arranged between the receiving member and the elastic membrane body having a structure, and the inside of the chamber installed so as to surround them is decompressed to at least vacuum suction between the laminated body and the film-like laminate, and in this state, the elastic membrane body is expanded. Pressing is performed by pressing the laminated body and the film-like laminated body against the receiving member. Since the protrusion of the laminated body is pressed against the elastic membrane body and pressed toward the member receiving the film-shaped laminate under at least vacuum suction between the laminated body and the film-like laminate, the film-like laminate is laminated. The protruding portion of is penetrated and laminated with the laminated body with a uniform thickness reliably without generating a void.

According to invention of Claim 2, in the invention of Claim 1, the elastic membrane body was expanded and pressurized by arrange | positioning the receiving member harder than an elastic membrane body so that it may oppose a laminated body and the film-form laminated body superposed | polymerized. At this time, at least the protrusion of the laminated body can be penetrated through the film-like laminate, thereby laminating the film-like laminate with the laminate with a uniform thickness without generating voids.

According to invention of Claim 3, in the invention as described in any one of Claim 1 or 2 WHEREIN: It is easy to convey between a receiving member and an elastic membrane body with a polymerized film-like laminated body by mounting a laminated body on a carrier film. In addition, since the carrier film is interposed when the laminated body and the film-like laminate are pressed against the receiving member and pressed by the elastic membrane, the film-like laminate is not adhered to the elastic membrane. . In addition, when a carrier film is arrange | positioned also on the laminated body and the film-form laminated body superposed | polymerized, it can also prevent that a film-shaped laminated body adheres to a receiving member.

Further, according to the invention according to the lamination apparatus of claim 4, the surface on the side on which the protrusion of the laminated body is formed and the film-like laminate are opposed to each other to polymerize with each other, so that the film-like laminate is opposite to the receiving member provided in one half. And the laminated body is disposed between the receiving member having elasticity and the elastic membrane body so as to face the elastic membrane body installed in the other half, and the two halves are brought into close proximity to form a sealed chamber, and the chamber is evacuated by vacuum suction means. Aspiration. In this state, the elastic membrane is expanded, pressed to press the laminated body and the film-like laminate to the receiving member, and heated by heating means. Since the projection of the laminated body is pressed against the elastic membrane body and pressed toward the receiving member under the vacuum suction atmosphere, the film-shaped laminate has a uniform thickness without penetrating through the projection of the laminated body. It is reliably laminated with the laminated body.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which showed schematically in order to demonstrate one Embodiment of the lamination apparatus of this invention.
Fig. 2 is a partially enlarged cross-sectional view shown for explaining a state in which a laminate and a film-like laminate are laminated according to the present invention.
3 is a cross-sectional view for explaining the general procedure for laminating the layered object and the film-like laminate.
It is sectional drawing shown in order to demonstrate the conventional technique at the time of pressurizing and heating between a pair of rollers, and laminating | stacking a to-be-laminated body and a film-shaped laminated body.
FIG. 5 is an enlarged cross-sectional view illustrating a state in which voids are generated in the film-like laminate laminated with the laminated body by FIG. 4. FIG.

First, one Embodiment of the lamination apparatus of this invention is described in detail based on FIG. 1 and FIG. In addition, in this embodiment, the laminated body which has a protrusion part is the semiconductor wafer W which has bump B (henceforth a protrusion part is called bump, and a laminated body is called a semiconductor wafer), and a film-like laminated body is shown in FIG. As shown in FIG. 8, an insulating resin film (hereinafter, referred to as an insulating resin film) provided with a protective film P1 on at least a surface opposite to the surface to be laminated when the semiconductor wafer W is laminated (F) Will be explained.

The stacking apparatus of the present invention is laminated so that the bumps B penetrate at least the insulating resin film F by polymerizing, heating and pressing the semiconductor wafer W having the bumps B and the insulating resin film F. In order to do so, at least the heating means (1, 2) for heating the insulating resin film (F), and the upper side and the lower side (3) are provided so as to be openable and close, and form a closed chamber (34) when closed. 4) and the upper side half 3, which have an elasticity opposite to the insulating resin film F polymerized on the side where the bump B of the semiconductor wafer W is formed, and the surface is substantially planar. The vacuum member which is provided in the receiving member 5, the lower side board 4, and the elastic membrane body 6 which opposes the semiconductor wafer W by which the insulating resin film F was superposed | polymerized, and the vacuum which sucks the inside of the chamber 34 by vacuum The suction means 7 and the elastic membrane body 6 are expanded to receive the semiconductor wafer W and the insulating resin film F. And a pressing means (8) for pressing and from the material (5).

The upper side plate 3 is a plate shape formed so that the periphery of the lower surface facing the lower side plate 4 protrudes in a frame shape, and a heat insulating material (not shown) and a heating means (not shown) inside the portion 30 protruding in the frame shape. The receiving member 5 is provided through 1). The heating means 1 can be comprised, for example by installing a cartridge heater in the upper heat plate which consists of blocks with the smooth surface of steel, or providing a plate-shaped rubber heater on the surface of an upper heat plate. In the following description, the heating means 1 is called the upper side heating plate 1. The receiving member 5 has a larger area than the semiconductor wafer W and the insulating resin film F. For example, the receiving member 5 is made of a rubber material having heat resistance such as silicon rubber or fluorine rubber, and has a thickness of 0.5 to 4.0. mm (more preferably 1.0 to 4.0 mm) and hardness (measured by JIS K-6253) to durometer type A hardness (Shore A hardness) of 20 to 70 degrees (more preferably 45 to 60 degrees). It is. The receiving member 5 is affixed on the surface on which the upper side heat plate 1 was smooth. In addition, since the receiving member 5 is provided on the surface of the upper side heat plate 1, it is not necessarily limited to sticking.

The lower side 4 is attached to the frame 40 which hold | maintains the circumferential edge part of the elastic membrane body 6 around the upper surface which opposes the upper side 1. The inner side of the frame 40 has a larger area than the semiconductor wafer W and the insulating resin film F. The inner side of the frame 40 is a heat insulating material not shown on the upper surface of the lower half 4 and heating. The means 2 is provided so that the elastic membrane body 6 held by the frame body 40 may be covered. On the upper surface of the frame 40, when the upper half 3 and the lower half 4 are closed, an O-ring, which is hermetically closed in contact with the frame-shaped portion 30 protruding to the peripheral edge of the upper half 3, etc. Sealing member 41 is provided. Similar to the upper hot plate 1, the heating means 2 can be constructed by, for example, a cartridge heater being installed in a lower heating plate made of a block having a smooth surface of steel, or by installing a plate-shaped rubber heater on the surface of the lower heating plate. Can be. In the following description, the heating means 2 is called the lower heating plate 2. Like the receiving member 5, the elastic membrane body 6 is comprised by the rubber material which has heat resistance, such as silicone rubber and fluororubber, for example, and thickness is 1.5-5.0 mm (more preferably 2.0-4.0 mm). The hardness (measured by JIS K-6253) has a durometer type A hardness (Shore A hardness) of 10 to 40 degrees (more preferably 15 to 30 degrees). In addition, although the elastic membrane body 6 can be comprised by the rubber layer of the single | mono layer of the same hardness as a whole, this invention is not limited to this embodiment, The hardness is set low (softly) only in the center part, and the frame body ( The hardness of the peripheral edge portion fixed by 40 may be set high (hard), and the whole may be made of rubber having high hardness (for example, 40 to 60 degrees), and the hardness of the upper surface may be low ( For example, it can also be comprised by the multilayer which bonded rubber of about 20 degrees).

In addition, on the surfaces of the receiving member 5 and the elastic membrane body 6, in order to facilitate air bleeding during vacuum suction in the chamber 34 to be described later and peeling of the carrier films C1 and C2 after molding, fine Unevenness may also be formed. In addition, the receiving member 5 may be formed by bonding an elastically deformable stainless plate having a thickness of, for example, about 0.5 to 2.0 mm on the surface thereof, and in such a way that it can swell like the elastic membrane body 6. It can also be configured. In addition, as described later, in this embodiment, in order to arrange | position so that insulating resin film F may be laminated | stacked on the semiconductor wafer W, while providing the receiving member 5 in the upper side board 3, the lower side board 4 Although the elastic membrane body 6 is provided in the above, when the insulating resin film F is laminated so as to be laminated under the semiconductor wafer W, the receiving member 5 is provided in the lower half 4. The elastic membrane body 6 is provided in the upper half 1, but not limited to this embodiment.

Moreover, in this embodiment, the passage 31 is formed in the part 30 which protruded in the frame shape of the outer peripheral edge of the upper side board 3, and this passage 31 is a vacuum pump (as a vacuum suction means 7). The pipe line 70 connected to the (not shown) is connected. Moreover, in this embodiment, the channel | path 42 and 22 are formed in the lower side board 4, the heat insulating material which is not shown in figure, and the lower side heat plate 2, and the press means 8 is provided in the channel | path 42 of the lower side board 4. As shown in FIG. As an example, a pipe line 80 connected to an air compressor or the like is connected. In addition, in order to prevent inadvertent expansion of the elastic membrane body 6 when the inside of the chamber 34 is vacuum sucked, in addition to the pressurizing means 8 such as an air compressor, the pipe 80 is adsorbed by a vacuum pump or the like. A means (not shown) may be connected so that replacement is possible.

Moreover, in this embodiment, the upper side board 3 is being fixed, the lower side board 4 is connected to a cylinder, etc., and it is comprised so that lifting and lowering movement is possible so that the lower side board 4 may open and close with respect to the upper side board 3. have. However, while fixing the lower side board 4 and supporting the upper side board 3 so that a lowering movement is possible, you may comprise so that the upper side board 3 may open and close with respect to the lower side board 4, and the upper side board 3 It can also be configured to support both of the lower side and the lower side (4) to be movable up and down to open and close each other.

In this embodiment, in the vicinity of the upper side board 3 and the lower side board 4, the roll for sending out the carrier film C2 by which the semiconductor wafer W by which the insulating resin film F was superposed | positioned is conveyed ( 10) and the roll 12 for winding this carrier film C2 are arrange | positioned, and also arrange | positioned so that it may contact the insulating resin film F superimposed on the semiconductor wafer W, and the lower carrier film ( The roll 9 for sending out the carrier film C1 conveyed and sandwiched between C2) and the roll 11 for winding this carrier film C1 are arrange | positioned. And the pinch roller 13 for changing the direction of the carrier films C1 and C2 between each delivery roll 9 and 10 and the winding rolls 11 and 12, and the upper half 3 and the lower half 4, respectively. , 14, 15 and 16 are provided respectively. The delivery roll 10, the winding roll 12, and the pinch rollers 14 and 16 of the lower carrier film C2 are the delivery roll 9, the winding roll 11, and the pinch roller of the upper carrier film C1. It is arrange | positioned away from the upper side board 3 and the lower side board 4 from (13, 15). Therefore, in the part where the carrier film C1 does not exist above the lower carrier film C2, the set stage for placing the semiconductor wafer W and superposing | polymerizing the insulating resin film F (in FIG. 1) is shown. The right side (SS) and the extraction stage (left side in FIG. 1) TS for taking out the laminated | multilayer product of the semiconductor wafer W and the insulating resin film F are comprised. Each feeding roll 9, 10, winding rolls 11, 12, and pinch rollers 13, 14, 15, 16 synchronously move the conveying direction while giving appropriate tension to the upper and lower carrier films C1, C2, respectively. It is configured to send along. In this embodiment, the upper and lower carrier films C1 and C2 consist of polyethylene terephthalate films as an example, and the thing whose thickness is 0.02-0.10 mm is used.

Next, one embodiment of the lamination method of the present invention is a semiconductor wafer W having a bump B as a laminated body having a protrusion, and a film-like laminate using a lamination device configured as described above. When the film in which the protective film P1 peeled off after lamination is laminated | stacked on the insulating resin film F is laminated | stacked, it demonstrates in detail with the operation | movement.

The lamination method of the present invention schematically stacks the semiconductor wafer W having the bumps B and the insulating resin film F so that at least the bumps B penetrate the insulating resin film F by heating and pressing the insulating resin film F. In order to do so, the surface on the side where the bump B of the semiconductor wafer W is formed and the insulating resin film F are opposed to each other so as to polymerize with each other, and the insulating resin film F and the receiving member 5 The polymerized semiconductor wafer W and the insulating resin film F are arranged between the receiving member 5 and the elastic film body 6 having elasticity so that the semiconductor wafer W faces the elastic film body 6 while being opposed to each other. In the state which arrange | positioned, heating is started and the semiconductor film W and the insulating resin film F are expanded by expanding the elastic membrane body 6 in the state which vacuum-sucked at least between the semiconductor wafer W and the insulating resin film F. FIG. Pressure between the elastic membrane body 6 and the receiving member 5 It is a thermal loads. In addition, in the lamination method of the present invention, an insulating resin film (F) polymerized on the semiconductor wafer (W) is prepared so as to prepare a receiving member (5) that is harder than the elastic membrane body (6) and to face the receiving member (5). ). In addition, according to the lamination method of the present invention, the semiconductor wafer W is placed on a carrier film C2 (C1), and the receiving member 5 and the elastic membrane body are polymerized with the insulating resin film F and the semiconductor wafer W. It conveys between (6), and presses with respect to the receiving member 5 by the elastic membrane body 6 through the carrier film C2 (C1).

In laminating the insulating resin film F and the semiconductor wafer W, the surface on which the bump B of the semiconductor wafer W is first formed face up, and the surface on which the bump B of the semiconductor wafer W is formed. The rectangular insulating resin film F whose one side is larger than the diameter of the semiconductor wafer W is polymerized and placed on the carrier film C2 below the set stage SS. At this time, when the protective films P1 and P2 are provided on both surfaces of the insulating resin film F, as shown to Fig.3 (a), peeling off the protective film P2 located below, and this implementation is carried out. In the form, it is superposed | polymerized on the semiconductor wafer W after making the protective film P1 affix only on the upper side of insulating resin film F. FIG. In addition, this invention is not limited to this embodiment, Since the semiconductor wafer W is mounted on the carrier film C2 below in the set stage SS, it is insulating to this semiconductor wafer W You may polymerize resin film (F).

Next, as shown in FIG. 1, in the state where the upper side 3 and the lower side 4 are separated (open state), both the carrier films C1 and C2 are synchronized and sent out to polymerize the semiconductor wafer ( W) and the insulating resin film F are conveyed between the receiving member 5 of the upper half 3 and the elastic membrane body 6 of the lower half 4, and then the upper half 3 and the lower half 4 ) Is closed to form a closed chamber 34. At this time, the upper side heat plate 1 and the lower side heat plate 2 are preferably heated to 50-120 degreeC as an example. The detection of the temperature for controlling the heating may be to detect the temperature of the upper heating plate 1 and the lower heating plate 2, or may be to detect the temperature of the semiconductor wafer W or the like. At this time, both carrier films C1 and C2 are formed in the protruding frame portion 30 of the circumferential edge of the upper half 3 and the seal member 41 provided in the frame 40 of the lower half 4. The semiconductor wafer W and the insulating resin film F, which are sandwiched between the gaps and are polymerized, are accommodated in the sealed chamber 34. The insulating resin film F faces the receiving member 5 via the protective film P1 and the upper carrier film C1, and the semiconductor wafer W passes through the lower carrier film C2. It is opposed to the elastic membrane body 6. After the insulating resin film F polymerized on the semiconductor wafer W is accommodated in the chamber 34 heated to the predetermined temperature, the thermal conduction from the upper heat plate 1 and the lower heat plate 2 is started and melted. To start.

In this state, the inside of the chamber 34 is vacuumed by vacuum suction means 7 such as a vacuum pump connected to the conduit 70 through the passage 31 shown in FIG. 1. As an example, 0.1-10.0 hPa is preferable and, as for the vacuum degree in the chamber 34 at this time, 0.1-5.0 hPa is more preferable. At this time, the lower half board 4 and the elastic membrane body through the conduit 80 connected to the passage 42 so that the elastic membrane body 6 does not inadvertently swell in a state where the vacuum suction in the chamber 34 is not sufficient. The vacuum between the spaces (6) is sucked in vacuum, and the elastic membrane body (6) is adsorbed on the surface of the lower heating plate (2), and the upper and lower carrier films (C1, C2), the elastic membrane body (6), and the receiving member (5) are held. It is desirable to keep it in a non-contact state. As a result of vacuum suction in the chamber 34, air is also sucked between the surface on which the bumps B of the semiconductor wafers W to be laminated and the insulating resin film F is brought into a vacuum suction state. At this time, the upper heating plate 1 and the lower heating plate 2 are heated to the predetermined temperature, and the heat receiving member 5 and the elastic membrane body 6 are also received, and the inside of the chamber 34 is also heated. It is heated up. Therefore, melting of insulating resin film F advances.

In this state, as shown in FIG. 2, the connection to the pipe line 80 of the lower side board 4 is switched from adsorption means, such as a vacuum pump (not shown) to pressurization means 8, such as an air compressor, and a pipe line Compressed air is supplied to the space between the lower side board 4 and the elastic membrane body 6 through the passages 42 and 22 connected to the 80 to expand the elastic membrane body 6. In addition, the present invention is not limited to supplying compressed air to the space between the lower half 4 and the elastic membrane 6 so as to swell the elastic membrane 6, and the lower half 4 and the elastic membrane body ( The space between 6) may be in communication with the atmosphere, and the elastic membrane body 6 may be expanded by a negative pressure or the like which vacuums the inside of the chamber 34. At this time, the pressing force (surface pressure) by the elastic membrane body 6 is preferably 0.1 to 1.5 MPa, and more preferably 0.5 to 0.9 MPa. In addition, the pressing force does not need to be constant from the start of pressurization to the completion | finish, and may be changed, such as increasing or decreasing along the way as needed.

When the elastic film 6 swells, the semiconductor wafer W is pressed through the lower carrier film C2, and the insulating resin film F polymerized thereon is the protective film P1 and the upper carrier film C1. It is pressed against the receiving member 5 through). That is, the polymerized semiconductor wafer W and the insulating resin film F are pressed between the elastic film body 6 and the receiving member 5 through the carrier films C1 and C2, respectively, so that the elastic film body 6 and the receiving plate are pressed. The insulating resin film F softened by being heated by the heat through the member 5 flows so that the bumps B formed on the surface of the semiconductor wafer W are embedded and laminated through the insulating resin film F. . Heating by the elastic film body 6 can be performed uniformly with respect to each area | region of the semiconductor wafer W and the insulating resin film F, and if there is a slight abnormality in the parallelism of the upper half 3 and the lower half 4, Even if it was not affected. In the case where the semiconductor wafers W having a large diameter are laminated and formed one by one, in the initial stage of pressurization by the elastic membrane body 6, the region where the elastic membrane body 6 expands is expanded from the center portion toward the peripheral portion. Thus, the pressurized portion is widened from the center portion of the semiconductor wafer W and the insulating resin film F to the circumference. As a result, even if bubbles or the like remain between the semiconductor wafer W and the insulating resin film F, a force that drives them outward acts, making it difficult to produce bubbles or the like.

At this time, since the tip of the bump B formed on the surface of the semiconductor wafer W elastically deforms the receiving member 5 so as to enter or depress the receiving member 5 having elasticity, The bump b is not crushed, and the surface other than the part in contact with the bump B of the receiving member 5 forms the surface of the insulating resin film F (layer). At this time, the tip of bump B is assumed to pass through insulating resin film F as shown in Fig. 2 but not to pass through protective film P1, and to pass through both of F and P1. And since the hardness of the receiving member 5 is set higher (harder) than the hardness of the elastic membrane body 6, the surface of the insulating resin film F (layer) is smooth, and the insulating resin film F ( Layer) to a uniform thickness. Then, the inside of the chamber 34 is vacuum sucked, and the semiconductor wafer W and the insulating resin film F are projected from the receiving member 5 and the elastic film body 6 for a predetermined time over the entire surface. Since it is pressurized sufficiently along the direction to become, the bump B is deformed so that it inclines like the conventional technique shown in FIG. 4, or voids K do not generate | occur | produce in the insulating resin film F as shown in FIG. In addition, it is preferable to set it as 20-200 second as an example about pressurization time.

In addition, since the semiconductor wafer W and the insulating resin film F are pressed between the receiving member 5 and the elastic membrane body 6 through the upper and lower carrier films C1 and C2, they are softened by being heated and flowable. Existing insulating resin film F (layer) flows out to the surroundings, and is prevented from adhering to the receiving member 5 or the elastic membrane body 6 to contaminate it.

When the insulating resin film F is laminated on the semiconductor wafer W, the upper half 3 and the lower half 4 are relatively separated and opened, and both carrier films C1 and C2 are sent out in synchronization with each other. The laminated article formed by laminating the W) and the insulating resin film F is carried out between the receiving member 5 of the upper half 3 and the elastic membrane body 6 of the lower half 4 to the take-out stage TS. Return. At this time, the insulating resin film F and the semiconductor wafer W superposed | polymerized for next lamination | stacking are conveyed simultaneously between the receiving member 5 of the upper side board 3, and the elastic membrane body 6 of the lower side board 4. You may also And the excess part of the insulating resin film F laminated | stacked on the semiconductor wafer W in the extraction stage TS or a post process is cut off. And the protective film P1 is peeled after that, and the layer of the insulating resin film F which is a film-like laminated body is finally laminated | stacked on the semiconductor wafer W. Then, as shown in FIG.

The present invention is not limited to the above-described embodiment, and can be applied to a wiring board (TSV) with a silicon through via, a microelectromechanical system wafer (MEMS wafer), or the like as a laminated body having a protrusion. Moreover, depending on the material of the semiconductor wafer W and the insulating resin film F, the thing of the range which deviates from the conditions (temperature, pressure, molding time, etc.) described in the said embodiment is also assumed. Moreover, when the insulating resin film F is laminated | stacked on the semiconductor wafer W, it is common that the bump B penetrates the insulating resin film F, However, this lamination apparatus can also be used even if it embeds without penetrating. Can be. Moreover, as a film-shaped laminated body, it is applicable also when laminating | stacking things other than insulating resin film (F), such as a photoresist layer, for example. Moreover, the insulating resin film F may be a continuous one like the upper and lower carrier films C1 and C2.

B ... Bump
W ... Semiconductor Wafer (Laminate)
F ... Insulating resin film (film laminate)
C1, C2... Carrier film
P1, P2 ... Protective film
One… Upper side heating plate (heating means)
2… Lower heating plate (heating means)
3 ... Upper half (one of a pair of half)
4… Lower half (the other half of pair)
5 ... Receiving member
6 ... Elastic membrane
7 ... Vacuum suction means
8… Pressurizing means
34 ... chamber

Claims

A method of laminating such a laminated body having a protruding portion and a film-shaped laminate by heating, pressing and pressing the film-shaped laminate so as to penetrate at least the film-shaped laminate,
The side in which the protrusion part of the said laminated body is formed, and the said film laminated body are made to oppose, and a laminated body and a film laminated body will superpose | polymerize,
Between the receiving member having elasticity and the elastic membrane body, the polymerized laminated body and the film laminated body are disposed so that the film-like laminate faces the receiving member and the laminated body faces the elastic membrane body. and,
Pressing the said laminated body and a film-shaped laminated body between the said elastic film body and a receiving member by swelling the said elastic film body in the state which carried out the vacuum suction at least between the said laminated body and a film-shaped laminated body,
Laminating method, characterized in that the receiving member is arranged to be harder than the hardness of the elastic membrane body.

A method of laminating such a laminated body having a protruding portion and a film-shaped laminate by heating, pressing and pressing the film-shaped laminate so as to penetrate at least the film-shaped laminate,
The side in which the protrusion part of the said laminated body is formed, and the said film laminated body are made to oppose, and a laminated body and a film laminated body will superpose | polymerize,
Between the receiving member having elasticity and the elastic membrane body, the polymerized laminated body and the film laminated body are disposed so that the film-like laminate faces the receiving member and the laminated body faces the elastic membrane body. and,
Pressing the said laminated body and a film-shaped laminated body between the said elastic film body and a receiving member by swelling the said elastic film body in the state which carried out the vacuum suction at least between the said laminated body and a film-shaped laminated body,
The laminated body is placed on a carrier film, and the polymerized film-like laminated body and the laminated body are conveyed between the receiving member and the elastic membrane body,
And the elastic film body presses the laminated body and the film-like laminate toward the receiving member through the carrier film.

An apparatus for laminating such a laminated body having a protruding portion and a film-shaped laminate by polymerizing, heating, and pressing the projection so as to penetrate at least the film-shaped laminate,
Heating means for heating at least the film-like laminate,
A pair of halves provided to open and close and form a closed chamber when closed,
A receiving member provided in one of these halves and having elasticity opposed to the film-like laminated body polymerized on the side where the protrusions of the laminated body are formed;
An elastic membrane body provided at the other half of the half and opposed to the laminated body to which the film-like laminate is polymerized;
Vacuum suction means for vacuum suction in the chamber;
Pressurizing means for expanding said elastic membrane body to pressurize said laminated body and said film-shaped laminate between said receiving member,
A lamination apparatus, wherein the receiving member is arranged to be harder than the hardness of the elastic membrane body.

An apparatus for laminating such a laminated body having a protruding portion and a film-shaped laminate by polymerizing, heating, and pressing the projection so as to penetrate at least the film-shaped laminate,
Heating means for heating at least the film-like laminate,
A pair of halves provided to open and close and form a closed chamber when closed,
A receiving member provided in one of these halves and having elasticity opposed to the film-like laminated body polymerized on the side where the protrusions of the laminated body are formed;
An elastic membrane body provided at the other half of the half and opposed to the laminated body to which the film-like laminate is polymerized;
Vacuum suction means for vacuum suction in the chamber;
Pressing means for expanding the elastic membrane body to press the laminated body and the film-shaped laminate between the receiving member and
With a carrier film,
The laminated body is placed on the carrier film, and the polymerized film-like laminate and the laminated body are conveyed between the receiving member and the elastic membrane body,
And the elastic membrane body presses the laminated body and the film-like laminate toward the receiving member through the carrier film.