TW201935635A - Semiconductor chip pickup device, semiconductor chip packaging device and packaging method capable of stably peeling a semiconductor chip from an adhesive sheet - Google Patents

Abstract

This invention aims to stably peel a semiconductor chip from an adhesive sheet. This invention relates to a semiconductor chip pickup device that picks up a semiconductor chip t adhered and held on an adhesive sheet 11 from the adhesive sheet 11, comprising: a pickup mechanism 40 for picking up the semiconductor chip t from the adhesive sheet 11; a push-up mechanism 60 having a plurality of push-up bodies 62a to 62d disposed so as to be movable relative to each other in the axial direction to have the same axial center, wherein a negative pressure is applied to the portion of the adhesive sheet 11 where the semiconductor chip t to be picked up is located from the side opposite to the semiconductor chip t, when the semiconductor chip t is picked up by the pickup mechanism, the semiconductor chip t is pushed upward by the plurality of push-up bodies 62a to 62d; and a negative pressure adjustment mechanism 63b for setting the magnitude of the negative pressure to -85 kPa or less in gauge pressure.

Description

Pickup device for semiconductor wafer, packaging device and packaging method for semiconductor wafer

The invention relates to a pickup device for a semiconductor wafer, a packaging device for a semiconductor wafer, and a packaging method.

Packaging steps for packaging a semiconductor wafer on a substrate such as a lead frame, a wiring substrate, or a plug-in substrate are known. In this packaging step, the semiconductor wafers are taken out one by one from the wafer ring and transferred to the substrate for packaging. The wafer ring is a ring-shaped member that holds an adhesive sheet to which a semiconductor wafer cut into individual semiconductor wafers and singulated is attached. When taking out a semiconductor wafer from a wafer ring, a pick-up device is used, which includes: a pick-up mechanism having a suction nozzle that sucks the semiconductor wafer; and an upper ejection mechanism that uses an upper ejector pin to adsorb the suction nozzle from the lower surface. Semiconductor wafers, and assist in peeling and taking out semiconductor wafers from the adhesive sheet.

However, recent semiconductor wafers are thinned as if the thickness is 50 μm or less. When only such a thin semiconductor wafer is pushed up by a tip pin with a tip, there is a concern that damage such as cracking of the semiconductor wafer may occur. Therefore, as shown in Patent Document 1, a pickup device having a plurality of push-up bodies has been developed. The plurality of pushers are provided so that the axes are aligned and concentric, and the peeling of the adhesive sheet attached to the lower surface of the semiconductor wafer is performed slowly from the peripheral portion to the center portion of the semiconductor wafer. The upper surface shape of the plurality of push-up bodies is generally formed into the same shape as the picked-up semiconductor wafer, for example, a quadrangle.

In such a pick-up device, first, a plurality of push-up bodies are simultaneously raised to a predetermined height, and the entire lower surface of the picked-up semiconductor wafer is pushed up. After that, the push-up body located at the outermost side is left, and the other push-up bodies are further raised to a predetermined height. Then, the second push-up body is left and the other push-up bodies are raised. The support of the lower surface of the semiconductor wafer by the push-up body is sequentially opened from the periphery toward the center. Therefore, the adhesive sheet is slowly peeled from the outer peripheral side of the semiconductor wafer. Furthermore, in order to promote the peeling of the adhesive sheet from the lower surface of the semiconductor wafer, it is proposed to provide a recessed portion on the contact surface (upper surface) of the pusher with the adhesive sheet, the recessed portion being used to make a suction force act on the contact Between the face (upper surface) and the adhesive sheet. The recessed portion provided on the push-up body becomes a part where the adhesive sheet starts to peel from the semiconductor wafer, and the peeling of the adhesive sheet from the semiconductor wafer can be promoted. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-056466

[Problems to be Solved by the Invention] However, the inventors of the present application have discovered that even when a pickup device as described above is used, breakage may occur in a semiconductor wafer. That is, the inventors of the present application confirmed that in a packaging device used for experiments, as a result of a packaging experiment using a plurality of types of semiconductor wafers, there was a semiconductor wafer that was broken when it was peeled from the adhesive sheet and picked up.

As a result of diligent research by the inventors of the present application, it was found that a semiconductor wafer having a thickness of about 30 μm or less is more likely to be damaged. Therefore, experiments using a plurality of types of semiconductor wafers of 30 μm or less in picking up semiconductor wafers of a predetermined unit number were performed. As a result, it was found that even with semiconductor wafers of the same type, the frequency of occurrence of breakage may be significantly different in each unit number. Specifically, for a semiconductor wafer having a thickness of 27 μm, the occurrence rate of breakage in a pick-up experiment performed before noon on a certain day was 92%. In contrast, in a pick-up experiment using the same type of semiconductor wafer before noon of the next day, the frequency of damage was 4%. In addition, in an experiment performed on another day, among the predetermined number of units, the damage was concentrated in the first half, and in the latter half, there were few people who saw the damage.

The inventors have obtained these results and made further research, and ascertained the change in the suction force acting on the push-up body and the adhesive sheet during the push-up. That is, the suction force is obtained from the piping equipment for negative pressure supply provided in the laboratory. The negative pressure of the piping equipment varies depending on the use conditions of other experimental devices that also use the negative pressure. That is, the inventors of the present application have found that there is a close relationship between the breakage of the semiconductor wafer and the suction force at the time of lifting.

An object of the present invention is to provide a pickup device for a semiconductor wafer, a semiconductor wafer packaging device, and a packaging method capable of stably peeling a semiconductor wafer from a self-adhesive sheet.

[Means for Solving the Problems] The semiconductor wafer pickup device of this embodiment is a semiconductor wafer pickup device that picks up and holds a semiconductor wafer adhered and held on an adhesive sheet, and includes a pickup mechanism for picking up from the adhesive sheet. The semiconductor wafer; a top-up mechanism having a plurality of push-up bodies arranged in the axial center direction so as to be arranged to be the same as the center of the axis and to move mutually freely, and from a side opposite to the semiconductor wafer, a negative pressure acts on the A portion of the semiconductor wafer picked up by the pick-up mechanism in the adhesive sheet, when the semiconductor wafer is picked up by the pick-up mechanism, the semiconductor wafer is pushed up by the plurality of push-up bodies; and a negative pressure An adjustment mechanism sets the magnitude of the negative pressure to -85 kPa or less with a gauge.

The packaging device for a semiconductor wafer according to this embodiment includes a supply device that holds an adhesive sheet to which the semiconductor wafer is attached and held; a substrate platform on which a substrate is placed; and the pick-up device picks up from the adhesive sheet held by the supply device. The semiconductor wafer; and a packaging mechanism that packages the semiconductor wafer taken out by the pickup device on the substrate.

The method of packaging a semiconductor wafer according to this embodiment is a method of packaging a semiconductor wafer adhered and held on an adhesive sheet from the adhesive sheet, and packaging the picked-up semiconductor wafer on a substrate. When picking up the semiconductor wafer on the adhesive sheet and picking up the semiconductor wafer from the adhesive sheet, a negative pressure is applied to the adhesive sheet from the side opposite to the semiconductor wafer, and the axis is made the same When a plurality of push-up bodies arranged in the axial direction are arranged and can move mutually to push up the semiconductor wafer, the magnitude of the negative pressure is set to -85 kPa or less with a gauge.

[Effects of the Invention] According to the present invention, a semiconductor wafer can be stably peeled from an adhesive sheet.

Hereinafter, embodiments of the present invention (hereinafter, referred to as embodiments) will be specifically described with reference to the drawings. In addition, the position and size of each component are just expedient expressions for easy understanding of the structure.

FIG. 1 is a side view showing a schematic configuration of a packaging device for a semiconductor wafer according to the embodiment. A semiconductor wafer packaging device 1 includes a supply device 10 for supplying a semiconductor wafer t, a substrate stage 20 on which a substrate K for packaging the semiconductor wafer t is placed, and an intermediate stage 30 disposed between the supply device 10 and the substrate stage 20 and placed thereon. Semiconductor wafer t; Pickup mechanism 40 picks up semiconductor wafer t one by one from feeder 10 and transfers it to intermediate stage 30; and packaging mechanism 50 sucks and holds semiconductor wafer t placed on intermediate stage 30 and packages it At a predetermined position on the substrate K placed on the substrate stage 20; the top-up mechanism 60 is arranged in the supply device 10 and pushes the semiconductor wafer t picked up by the pickup mechanism 40 upward; and the control device 70 controls the The supply device 10, the substrate stage 20, the pickup mechanism 40, the packaging mechanism 50, the top-up mechanism 60, and the like. The pickup mechanism 40 and the top mechanism 60 are constituent elements of a pickup device.

The supply device 10 includes a wafer stage 13 for supplying adhesion to a plurality of semiconductor wafers t to which the semiconductor wafer W is cut and singulated by a wafer ring supply device (not shown). The wafer 11 holds the wafer ring 12. The wafer stage 13 can be moved in the X direction, the Y direction, and the θ (horizontal rotation) direction by an XYθ direction driving device (not shown). The X and Y directions are horizontal directions orthogonal to each other. The Z direction shown in the figure is a direction perpendicular to the horizontal direction.

The substrate stage 20 supplies a substrate K before packaging by a substrate carrying-in device (not shown), and the substrate K after the semiconductor wafer t is packaged is taken out by a substrate carrying-out device (not shown). The substrate stage 20 is supported by a XYθ-direction driving device (not shown), and is movable in the X direction, the Y direction, and the θ (horizontal rotation) direction.

The intermediate stage 30 is a stage on which the semiconductor wafer t is temporarily placed when the semiconductor wafer t picked up by the pickup mechanism 40 is transferred to the packaging mechanism 50.

The pick-up mechanism 40 includes a suction nozzle 41 that sucks and holds the semiconductor wafer t, and a driving device (not shown) that moves the suction nozzle 41 between the supply device 10 and the intermediate platform 30 as shown by a dotted arrow in FIG. .

The packaging mechanism 50 includes a packaging tool 51 that sucks and holds the semiconductor wafer t, and pressurizes the semiconductor wafer t that is held and held (there is also a case where heating is used together) to package the semiconductor wafer t at a predetermined position on the substrate K; A device (not shown) that moves the packaging tool 51 between the intermediate stage 30 and the substrate stage 20 as shown by a dotted arrow.

Next, the top mechanism 60 will be described further using FIG. 2 and FIG. 3.

The upper mechanism 60 includes a support body 61 provided to face the lower surface of the adhesive sheet 11 supported by the wafer stage 13, and a push-up mechanism 62 built into the support body 61 and attached to the upper surface of the adhesive sheet 11. Of the semiconductor wafer t.

The support body 61 is fixedly arranged with respect to the position where the suction nozzle 41 picks up the semiconductor wafer t. The support body 61 is formed in a hollow cylindrical shape whose upper and lower surfaces are closed, and the upper surface thereof is set as a support surface 61 a that sucks and supports the adhesive sheet 11 from the lower side. The hollow portion of the support body 61 is an internal space 61b.

A ring-shaped suction groove 61 c and a plurality of suction holes 61 d are provided on the support surface 61 a around the picked-up semiconductor wafer t to suck the adhesive sheet 11. The suction groove 61c and the plurality of suction holes 61d communicate with the internal space 61b of the support body 61 via a communication groove 61e or a communication hole (not shown). That is, the vacuum piping 63a communicating with the suction pump 63 is connected to the internal space 61b of the support body 61, and a negative pressure can be supplied into the internal space 61b. By making the internal space 61b into a negative pressure, the negative pressure can be applied to the suction groove 61c and the plurality of suction holes 61d. In addition, the vacuum piping 63a is provided with a pressure control device 63b such as an electric air regulator and an on-off valve 63c such as a solenoid valve in order from the suction pump 63 side to control the suction tank 61c and a plurality of suctions. The on / off of the negative pressure in the hole 61d and the magnitude of the negative pressure. The pressure control device 63b functions as a negative pressure adjustment mechanism. The pressure control device 63b is preferably set in such a manner that a negative pressure of -85 kPa or less, preferably -90 kPa or less with a gauge pressure acts on the suction groove 61c and the plurality of suction holes 61d. In this embodiment, an example of -90 kPa will be described. Here, the gauge pressure refers to a relative pressure based on atmospheric pressure (0 kPa). Therefore, a gauge pressure of -85 kPa or less means a pressure including 85 kPa lower than atmospheric pressure and a degree of vacuum higher than the pressure (-85 kPa). That is, -90 kPa is a pressure with a degree of vacuum higher than -85 kPa. In addition, expressions such as "negative pressure below -85 kPa" and "setting the magnitude of the negative pressure to -85 kPa" may be used, but all refer to pressure values in terms of gauge pressure.

Furthermore, it can be considered that the pressure set in the pressure control device 63b directly acts on the internal space 61b, the suction groove 61c, and the suction hole 61d. Therefore, in this embodiment, a pressure detector 63d is provided in a portion between the on-off valve 63c and the internal space 61b in the vacuum pipe 63a. The control pressure of the pressure control device 63b is set so that the detection value of the pressure detector 63d becomes -90 kPa. Furthermore, the pressure acting on the internal space 61b, the suction groove 61c, or the plurality of suction holes 61d may be detected, and the control pressure of the pressure control device 63b may be set so that the detected value becomes the pressure range. In addition, the suction pump 63 may be assembled into the packaging device 1 as a part, but it is not limited to this, and it may be prepared separately from the packaging device 1, for example, it may be a factory, etc. Equipped with piping equipment for negative pressure supply. In short, any negative pressure source may be used as long as it can stably supply a negative pressure of -85 kPa or less to the pressure control device 63b.

The push-up mechanism 62 includes: a first push-up body to a fourth push-up body (62a, 62b, 62c, 62d); and a first lift driving device to a fourth lift driving device (62e, 62f, 62g, 62h), corresponding to The first push-up body 62a to the fourth push-up body 62d are provided, and the first push-up body 62a to the fourth push-up body 62d are individually moved up and down.

Among the first push-up body 62a to the fourth push-up body 62d, the first push-up body 62a to the third push-up body 62c are formed in a rectangular tube shape in a plan view, and have a triple structure in which the axes are the same. The fourth push-up bodies 62d are formed in an angular columnar shape, and the axes thereof are the same as those of the first push-up bodies 62a to the third push-up bodies 62c and are arranged at the centers of these push-up bodies. Moreover, in this embodiment, four push-up bodies (62a-62d) are provided, but it is not limited to these four, and may be two, three, or five or more.

The first push-up body 62a is a push-up body located at the outermost side, and is provided in the rectangular opening portion 61f provided on the upper surface of the support body 61, that is, the center of the support surface 61a, and the edge of the opening portion 61f Clearance to configure. That is, the shape of the opening 61f is similar to the outer shape of the first push-up body 62a, and is formed slightly larger than the outer shape of the first push-up body 62a. In addition, the shape of the front end surface of the first push-up body 62a is similar to that of the semiconductor wafer t to be pushed-up in a plan view, and is formed to be slightly smaller than the semiconductor wafer t. Therefore, when the semiconductor wafer t is pushed up, the edge portion of the semiconductor wafer t is slightly exposed from the periphery of the first push-up body 62a.

The second push-up body 62b is disposed inside the first push-up body 62a in a state of being guided to the inner side surface of the first push-up body 62a. The third push-up body 62c is disposed inside the second push-up body 62b in a state of being guided to the inner side surface of the second push-up body 62b. The fourth push-up body 62d is disposed inside the third push-up body 62c in a state of being guided to the inner side surface of the third push-up body 62c.

The push-up bodies 62a to 62d are moved up and down by the first lift driving device 62e to the fourth lift driving device 62h according to a preset operating condition. In this embodiment, all the pushers (62a to 62d) are raised from the height of the support surface 61a to a height that protrudes by a predetermined amount. Thereafter, in order from the outer side, that is, in the order of the first push-up body, the second push-up body, the third push-up body, and the fourth push-up body in order from the outside to the height of the support surface 61a, Set the operating conditions. In addition, the operation conditions may be set to operations corresponding to the semiconductor wafer t to be picked up, the type of the adhesive sheet 11 to which the semiconductor wafer t is attached, and the like.

In addition, as shown in FIG. 4 (A), the upper end portions of the first push-up body 62a to the third push-up body 62c are provided with convex portions 64, convex portions 65, and concave portions 66, respectively. In addition, in FIGS. 4 (A) and 4 (B), diagonal lines are added to the positions where the recessed portions 66 are formed to make the differences from the protruding portions 64 and the protruding portions 65 clear. A convex portion 64A is formed on each of the four corner portions of the upper end surface of the first push-up body 62a that form a rectangular frame shape. In addition, a plurality of convex portions 65A are provided on the four side portions of the rectangular frame-shaped upper end surface of the first push-up body 62a at approximately even intervals. Further, a concave portion 66A is provided between the convex portion 64A and the convex portion 65A and between the convex portions 65A. The four corner portions of the rectangular frame-shaped upper end surface of the second push-up body 62b are formed with convex portions 64B, respectively. In addition, a plurality of convex portions 65B are provided on the four side portions of the rectangular frame-shaped upper end surface of the second push-up body 62b at approximately even intervals. Further, recessed portions 66B are provided between the convex portions 64B and 65B and between the convex portions 64B. The arrangement of the convex portions 65B and the recessed portions 66B of the second push-up body 62b is different from the arrangement of the convex portions 65A and the recessed portions 66A of the first push-up body 62a. On the rectangular frame-shaped upper end surface of the third push-up body 62c, like the first push-up body 62a and the second push-up body 62b, convex portions 64C, convex portions 65C, and concave portions 66C are also formed. The arrangement of the convex portions 65C and the concave portions 66C of the third push-up body 62c is different from the arrangement of the convex portions 65B and the concave portions 66B of the second push-up body 62b. The convex surfaces 64A to 64C, the upper surfaces of the convex portions 65A to 65C, and the upper surface of the fourth pusher 62d are formed so as to support the adhesive sheet 11 on the same plane as the support surface 61a. The surface accuracy of a plane formed by the upper surfaces of the convex portions 64A to 64C, the upper surfaces of the convex portions 65A to 65C, and the upper surface of the fourth pusher 62d is 20 μm or less.

In addition, each convex portion (65A to 65C) provided in the side portion is preferably formed so that the length in the direction along the side portion becomes 0.4 mm or more and 2.0 mm or less. In addition, the length of each recessed portion (66A to 66C) in the direction along the side portion may be the same as or different from the length of the protruding portion 65A to 65C, but it is preferably the same as that of the protruding portion 65A to 65C. Similarly, it is formed so that the length of the direction along a side part may become 0.4 mm or more and 2.0 mm or less. In addition, the adjacent recessed portions 66A and 66B and the recessed portions 66B and 66C may be arranged as overlapping portions, but it is preferable that the length of the overlapping portions is recessed portions 66A to 66C in the direction along the side portion. Less than 20% of the length. Therefore, it is preferable that the length of the recessed portions 66A to 66C is formed so that the length of the recessed portions 65A to 65C becomes 0.8 times or more and 1.2 times or less.

Furthermore, in a state in which the first and second push-up bodies 62a to 62d support the adhesive sheet 11 together with the support body 61, negative pressure can be applied to the first and fourth push-up bodies 62a to 62d. Between the end surface and the adhesive sheet 11. That is, the opening portion 61f of the support body 61 communicates with the internal space 61b, and there is a gap between the first push-up body 62a and the edge of the opening portion 61f. There is also a gap between the push-up bodies 62a to 62d. Therefore, the negative pressure in the internal space 61b passes through these gaps and acts between the upper end surfaces of the first and fourth push-up bodies 62a to 62d and the adhesive sheet 11. That is, it is comprised so that the negative pressure set to the said pressure range, specifically, a negative pressure of -90 kPa acts between the top mechanism 60 and the adhesive sheet 11.

The control device 70 includes a storage unit 71. The storage unit 71 stores data necessary for the operation of the packaging device 1 such as the operating conditions of the push-up bodies 62a to 62d. The control device 70 controls the supply device 10, the substrate stage 20, the pickup mechanism 40, the packaging mechanism 50, the top mechanism 60, and the like with reference to the data stored in the storage unit 71. (Description of Operation) Next, operations of the packaging device 1 and the pick-up device will be described with reference to FIGS. 1 and 5 (A) to 7 (B).

First, a wafer ring 12 having a plurality of semiconductor wafers t adhered to an adhesive sheet 11 is set on a wafer stage 13 of a supply device 10. The substrate K before packaging is placed on the substrate stage 20 by a substrate carrying-in device (not shown).

In this state, the suction nozzle 41 of the pickup mechanism 40 picks up the semiconductor wafer t positioned at the pickup position on the supply device 10 and transfers it to the intermediate stage 30. The packaging tool 51 of the packaging mechanism 50 receives the semiconductor wafer t transferred to the intermediate stage 30, and packages the semiconductor wafer t at a predetermined packaging position of the substrate K placed on the substrate stage 20. Such operations are repeatedly performed, and the semiconductor wafer t is sequentially packaged at each package position of the substrate K.

When picking up by the pick-up device, that is, when picking up the semiconductor wafer t by the suction nozzle 41, the top mechanism 60 operates as follows.

As shown in FIG. 5 (A), if the semiconductor wafer t to be picked up is positioned directly above the top-up mechanism 60, that is, at the pick-up position, the top-up device 60 supports the lower surface of the adhesive sheet 11 via the support surface 61a. . Then, by opening the on-off valve 63c, a predetermined negative pressure (negative pressure of -90 kPa) is applied to the suction groove 61c and the suction hole 61d to adsorb and hold the adhesive sheet 11.

When the adhesive sheet 11 is sucked and held by the support surface 61a, as shown in FIG. 5 (B), the suction nozzle 41 is lowered to abut against the semiconductor wafer t, and the semiconductor wafer t is sucked and held.

When the suction nozzle 41 sucks the semiconductor wafer t, as shown in FIG. 5 (C), the first push-up body 62a to the fourth push-up body 62d are raised only by a predetermined height. At this time, the suction nozzle 41 is raised synchronously. Thereby, the adhesive sheet 11 is pushed up into a convex shape from the first push-up body 62a to the fourth push-up body 62d. At this time, a negative pressure of -90 kPa acts between the adhesive sheet 11 and the upper end surfaces of the support surface 61a and the first push-up bodies 62a to 62d. Therefore, the force of pulling down by the negative pressure acts on the portion 11a of the adhesive sheet 11 which is inclined upward by the first push-up body 62a to the fourth push-up body 62d. Accordingly, at the outer edge portion of the semiconductor wafer t, more specifically, at the outer edge portion of the semiconductor wafer t exposed from the first push-up body 62a, a force to be peeled from the semiconductor wafer t acts on the adhesive sheet 11. on. Thereby, the adhesive sheet 11 is peeled from the said outer edge part of the semiconductor wafer t. In addition, since the exposed amount of the semiconductor wafer t is small at this time, even if peeling of the adhesive sheet t is started at the same time on the entire area of each side of the semiconductor wafer t, the semiconductor wafer t will not be damaged.

In addition, a negative pressure of -90 kPa also acts on the recessed portion 66A of the first push-up body 62a at this time. Therefore, the portion of the edge of the semiconductor wafer t facing the recessed portion 66A promotes the peeling of the adhesive sheet 11 from the semiconductor wafer t by the negative pressure acting on the adhesive sheet 11 than the other edges. FIG. 4 (B) is a plan view schematically showing a state in which the peeling of the adhesive sheet 11 in the recessed portion 66 has proceeded, and a substantially crescent shape (shown by diagonal lines) indicated by the symbol P in the recessed portion 66 is generated (A blank portion in the recessed portion 66). In addition, in FIG. 4 (B), the peeling part P is shown in all the recessed parts (66A, 66B, 66C), but at this stage, peeling may occur only in the part of the recessed part 66A of the first push-up body 62a Department P. In addition, the peeling portion P is expanded so as to be extended toward the second push-up body 62b by a negative pressure during a period before the second push-up body 62b described later starts to descend.

After a predetermined standby time has elapsed since the first push-up body 62a to the fourth push-up body 62d are raised, as shown in FIG. 6 (A), the first push-up body 62a is lowered. The first push-up body 62a is lowered to a position where the upper end surface of the first push-up body 62a is lower than the support surface 61a by a predetermined height. Thereby, the first push-up body 62a is separated from the semiconductor wafer t. By the first push-up body 62a falling, in the direction pulled down by its own tension and negative pressure, that is, in the direction of peeling from the semiconductor wafer t, a force acts on the adhesive sheet 11 so far from the first On the part supported by the push body 62a. By this force, the adhesive sheet 11 is peeled toward the center of the semiconductor wafer t. The state shown in FIG. 6 (A) is a state where the adhesive sheet 11 supported by the first push-up body 62a has been peeled from the semiconductor wafer t. In addition, at this time, the negative pressure is also applied to the recessed portion 66B of the second push-up body 62b, so that the adhesive sheet 11 is peeled off at a portion facing the recessed portion 66B. Thereby, as shown in FIG.4 (B), the peeling part P is produced in the part corresponding to the recessed part 66B of the 2nd push-up body 62b.

Furthermore, after a predetermined standby time has elapsed, as shown in FIG. 6 (B), the second push-up body 62b is lowered to the position of the first push-up body 62a. At this time, similarly to when the first push-up body 62a is lowered, the part of the adhesive sheet 11 supported by the second push-up body 62b is also peeled. In addition, as shown in FIG. 6 (B), the adhesive sheet 11 is peeled off at a portion facing the recessed portion 66C of the third push-up body 62c, and a peeling portion P is generated. In addition, after a predetermined standby time has elapsed, as shown in FIG. 6 (C), the third push-up body 62c descends to the positions of the first push-up body 62a and the second push-up body 62b. At this time, similarly to when the first push-up body 62a and the second push-up body 62b are lowered, the part of the adhesive sheet 11 supported by the third push-up body 62c is also peeled.

After a predetermined standby time has elapsed after the third push-up body 62c descends, as shown in FIG. 7 (A), the fourth push-up body 62d drops to the positions of the first push-up body 62a to the third push-up body 62c. . Thereby, the part of the adhesive sheet 11 supported by the 4th push-up body 62d is peeled. The state shown in FIG. 7 (A) shows the progress of this peeling.

In addition, the standby time before lowering each of the pushers (62a to 62d) may be set to the same time, or an individual time may be set. However, setting this waiting time to a long time leads to a decrease in productivity, so it is appropriate to set it in consideration of productivity. That is, in the packaging device 1 used in the packaging step of the semiconductor wafer t, the unit capacity (Unit Per Hour (UPH)) indicating the number of semiconductor wafers t that can be packaged per hour is an important factor affecting productivity. Therefore, in order to improve productivity, the UPH value is preferably high. In order to increase this value, the individual semiconductor wafers t must be packaged in a very short time. At this time, it is not possible to shorten the time for press-bonding (and sometimes heating) the semiconductor wafer t on the substrate K, that is, the so-called bonding time. Therefore, it is required that the time required for transferring the semiconductor wafer t, which is performed in parallel with the pressurization bonding of the semiconductor wafer t, be included in the bonding time. The time required for transfer refers to the time from when the suction nozzle 41 is located directly above the pick-up position to when the semiconductor wafer t positioned at the pick-up position is lowered, the semiconductor wafer t is picked up, and it is transferred and placed on the intermediate platform 30. The time needed.

Therefore, it is required to set the standby time on the condition that the time required for the transfer becomes within the engagement time. For example, when the bonding time is 1.2 seconds, the time until the suction nozzle 41 located directly above the pickup position is lowered to the semiconductor wafer t and the time until the semiconductor wafer t picked up by the suction nozzle 41 is transferred and placed on the intermediate stage 30. When the total time is 0.5 seconds, the time available for pushing the semiconductor wafer t on the push-up mechanism 62 becomes less than 1.2 seconds-0.5 seconds = 0.7 seconds. In this case, the standby time must be set to less than about 0.1 seconds to about 0.3 seconds. That is, the standby time is a range in which the settable range is limited to an extremely short time due to the bonding time, and the pickup device is required to peel the adhesive sheet 11 from the semiconductor wafer t within this short time.

As in this embodiment, a negative pressure set in the pressure range is applied between the top mechanism 60 and the adhesive sheet 11, so that even if the standby time is set to a short time of less than about 0.1 second to 0.3 second, During this period, it is possible to sufficiently exert only the force that can peel off the portion of the push-up body 62a to the push-up body 62c that supports the released adhesive sheet 11 from the semiconductor wafer t.

After a predetermined standby time has elapsed since the fourth push-up body 62d descends, as shown in FIG. 7 (B), the suction nozzle 41 is raised and the semiconductor wafer t is picked up. In addition, the on-off valve 63c is closed to stop the negative pressure, and the first upper pusher 62a to the fourth upper pusher 62d are raised to the original height, that is, the height at which the upper end coincides with the support surface 61a. (Effects and Effects) The packaging device 1 according to this embodiment includes a pickup device having a pickup mechanism 40 and a top-up mechanism 60, and the semiconductor wafer t is picked up from the adhesive sheet 11 by the suction nozzle 41 of the pickup mechanism 40. At this time, using the push-up mechanism 62 of the push-up mechanism 60, the picked-up semiconductor wafer t is lifted from the lower side of the adhesive sheet 11. At the time of this lifting, the magnitude of the negative pressure acting between the lifting mechanism 60 and the adhesive sheet 11 is set to -85 kPa or less with a gauge. The so-called negative pressure acting between the upper mechanism 60 and the adhesive sheet 11 specifically means the suction groove 61c and the suction hole 61d acting on the support body 61, and each of the pushing bodies (62a to 62d) and The negative pressure in the concave portions 66A to 66C of the push-up bodies 62a to 62d between the adhesive sheets 11.

By making such negative pressure work, when the semiconductor wafer t is lifted up from below the adhesive sheet 11 by the push-up mechanism 62, the area of the semiconductor wafer t can be supported in stages by a plurality of push-up bodies (62a to 62d). When the ground is reduced, the adhesive sheet is peeled from the semiconductor wafer t following the decrease in the support area.

In addition, since the pressure range of the set negative pressure is set to -85 kPa or less, even if one of the plurality of push-up bodies (62a to 62d) is separated from the semiconductor wafer t until the next push-up body is separated. The time (the standby time) is a short time of less than about 0.1 seconds to about 0.3 seconds. During this period, it is also possible to peel off the pressure-sensitive adhesive sheet 11 whose support of the push-up bodies 62a to 62c is released from the semiconductor wafer t. section. Therefore, even a semiconductor wafer having a thickness of 30 μm or less can be quickly peeled off from the adhesive sheet 11, thereby preventing productivity from being impaired.

In addition, convex portions 64, convex portions 65, and concave portions 66 are alternately formed on the upper end portions of the first push-up body 62a to the third push-up body 62c. As a result, a negative pressure (negative pressure of -85 kPa or less) set in the pressure range acts on the adhesive sheet 11 facing the concave portion 66 provided between the convex portion 64 and the convex portion 65 and between the convex portions 65. On the site. Therefore, in the portion of the adhesive sheet 11 corresponding to the recessed portion 66, the adhesive sheet 11 can be peeled from the semiconductor wafer t without waiting for the push-up bodies 62a to 62c to fall (separation from the semiconductor wafer t). As a result, when the push-up bodies 62a to 62c are lowered, peeling of the adhesive sheet 11 from the semiconductor wafer t can be performed more quickly. When the push-up bodies 62a to 62c have begun to descend, the portion of the adhesive sheet 11 corresponding to the recessed portion 66 of the push-up bodies 62a to 62c is peeled from the semiconductor wafer t. Therefore, the peeling of the adhesive sheet 11 of the portion supported by the push-up bodies 62a to 62c is divided into two, so it is the same as the case where the peel-off of the portion is started after the push-up bodies 62a to 62c have fallen. In addition, the stress acting on the semiconductor wafer t can be reduced particularly. Therefore, even a thin semiconductor wafer t that is prone to damage, such as a semiconductor wafer t having a thickness of 30 μm or less, can be picked up satisfactorily. Furthermore, when the portion of the adhesive sheet 11 corresponding to the recessed portion 66 is peeled from the semiconductor wafer t, both sides of the recessed portion 66 (both sides along the direction of the side of the semiconductor wafer t) are raised by the protruding portions 64 and the protruding portions 65. The semiconductor wafer t is supported on three sides with the center side. Therefore, even if a force in a direction peeled from the semiconductor wafer t acts on the adhesive sheet 11, compared with a case where the force acts on the adhesive sheet 11 in a state where the support of the entire area of the peripheral portion of the semiconductor wafer t is released It is also possible to particularly reduce the stress generated in the semiconductor wafer t.

In addition, the length of the recessed portion 66 provided at the upper end portion of the rectangular first push-up body 62a to the third push-up body 62c along the circumferential direction, that is, the length along the side portion, is 0.4 mm or more and 2.0 Formed below mm. When the length of the recessed portion 66 is shorter than 0.4 mm, even if a negative pressure of -85 kPa or less is applied to the recessed portion 66, the area where the negative pressure acts on the adhesive sheet 11 becomes too small, and it is difficult to form a peel well. Department P. On the other hand, when the length of the recessed portion 66 is longer than 2.0 mm, the area where the negative pressure acts in the adhesive sheet 11 becomes too large, and when the peeling portion P is formed, excessive stress is applied to the semiconductor wafer t and is generated. Risk of breakage. By setting the length of the recessed portion 66 to be 0.4 mm or more and 2.0 mm or less, the supportability of the semiconductor wafer t can be secured, and the peelability of the adhesive sheet 11 can be secured. As a result, the stress applied to the semiconductor wafer t can be suppressed and the peeling portion P can be formed favorably, and the semiconductor wafer t can be quickly and favorably peeled off from the adhesive sheet 11.

In addition, the length in the circumferential direction of the recessed portion 66 provided at the upper end of the first push-up body 62a to the third push-up body 62c of the quadrangle, that is, the length in the direction along the side portion, relative to the convex portion 65 The length in the direction of the side portion is set to be 0.8 times or more and 1.2 times or less. When it is smaller than 0.8 times, the ratio of the area where the peeling part P is formed with respect to the length of the side part of each push-up body (62a-62c) becomes small. Therefore, when the adhesive sheet 11 is peeled by the descending of the push-up body 62a, the push-up body 62b, and the push-up body 62c thereafter, the peeling part P which becomes a starting point of peeling is small, and the probability of delaying the progress of peeling becomes high. Conversely, when the ratio is larger than 1.2 times, the proportion of the area supported by the convex portion 64 and the convex portion 65 with respect to the length of the side portion of each of the push-up bodies (62a to 62c) is reduced. Therefore, when the peeling portion P is formed, the stress applied to the semiconductor wafer t becomes large, and the probability of breakage of the semiconductor wafer t becomes high. In addition, by forming the recessed portions 66A, 66B, and 66C in mutually different positional relationships, the peeling portion P is prevented from being continuously formed up to the center of the semiconductor wafer t, and the stress applied to the semiconductor wafer t is reduced. However, when the length of the recessed portion 66 exceeds 1.2 times, the peeling portion P easily spreads to the center of the semiconductor wafer t along the adjacent recessed portions 66A, 66B, 66B, and 66C. As a result, the effect of suppressing damage caused by forming the recessed portions 66A, 66B, and 66C differently from each other is reduced. Therefore, it is preferable to set the concave portion 66 to a length of 0.8 times or more and 1.2 times or less of the convex portion 65.

(Other Embodiments) The present invention is not limited to the above-mentioned embodiments. For example, in the package form, the operations of the first push-up body 62a to the fourth push-up body 62d of the upper mechanism 60 are set to raise the first push-up body 62a to the fourth push-up body 62d together, An example in which the first upward pusher 62a located on the outer side sequentially descends is not limited to this. For example, the first push-up body 62a to the fourth push-up body 62d may be moved upward so that the push-up body located further inside becomes higher. That is, the first push-up body 62a to the fourth push-up body 62d may be raised only by a predetermined height, and then the second push-up body 62b to the fourth push-up body 62d may be further raised to a predetermined height, and then the third push-up body 62b The pusher 62c to the fourth upper pusher 62d are further raised by a predetermined height, and finally the fourth upper pusher 62d is further raised by a predetermined height. In short, it suffices to operate so that a plurality of pushers (62a to 62d) are sequentially separated from the semiconductor wafer t.

Moreover, in the said embodiment, although the example of the substrate stage 20 which moved the board | substrate K in the XY (theta) direction was demonstrated as a board stage, it is not limited to this. For example, a configuration may be adopted in which a pair of guide rails are arranged in a direction crossing the arrangement direction of the supply device 10 and the intermediate platform 30, and the substrate K is transported and positioned on the packaging work position of the packaging mechanism 50 on the guide rails. That is, the substrate K is carried into the packaging operation position of the packaging mechanism 50 and positioned at the packaging operation position, and the transfer section carried out from the packaging operation position is also included in the substrate platform.

(Examples and Comparative Examples) Next, examples and evaluation results of the present invention will be described.

With the packaging device 1 of the embodiment, a pick-up test was performed under the following conditions. In addition, the semiconductor wafer t picked up by the picking-up mechanism 40 is arrange | positioned on the glass substrate for a test mounted on the substrate stage 20 by the packaging mechanism 50. First, an adhesive film is adhered to the glass substrate, so that the arranged semiconductor wafer t does not move during the movement of the substrate platform 20. The top mechanism uses the top mechanism 60 shown in FIG. 3 and performs the top movement in the operations shown in FIGS. 5 (A) to 7 (B).

Fifty semiconductor wafers t were picked up from a wafer having a diameter of 300 mm, and the number of semiconductor wafers t that were cracked during the pickup was measured. Specifically, before picking, confirm that there are no cracks in the 50 semiconductor wafers t to be picked up, and count the number of cracked semiconductor wafers t among the 50 semiconductor wafers t arranged on the glass substrate. The number of semiconductor wafers t that were cracked at the time of pickup.

<Test conditions> ・ Semiconductor wafer size: 3 × 4 mm ・ Thickness of semiconductor wafer: 35 μm, 25 μm, and 15 μm Five conditions of 90 kPa, -88 kPa, -85 kPa, -83 kPa, and -80 kPa ・ Upper: 1 mm ~ The amount by which the fourth push-up body 62d rises.・ Standby time: 0.2 seconds

(Example 1) The magnitude of the negative pressure in the test conditions was set to -90 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 35 μm. The results are shown in Table 1. (Example 2) The magnitude of the negative pressure in the test conditions was set to -90 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 25 μm. The results are shown in Table 1. Example 3 The magnitude of the negative pressure in the test conditions was set to −90 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 15 μm. The results are shown in Table 1. (Example 4) The magnitude of the negative pressure in the test conditions was set to -88 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 35 μm. The results are shown in Table 1. Example 5 The magnitude of the negative pressure in the test conditions was set to −88 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 25 μm. The results are shown in Table 1. (Example 6) The magnitude of the negative pressure in the test conditions was set to -88 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 15 μm. The results are shown in Table 1. (Example 7) The magnitude of the negative pressure in the test conditions was set to -85 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 35 μm. The results are shown in Table 1. (Example 8) The magnitude of the negative pressure in the test conditions was set to -85 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 25 μm. The results are shown in Table 1. (Example 9) The magnitude of the negative pressure in the test conditions was set to -85 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 15 μm. The results are shown in Table 1.

Comparative Example 1 The magnitude of the negative pressure in the test conditions was set to -83 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 35 μm. The results are shown in Table 1. Comparative Example 2 The magnitude of the negative pressure in the test conditions was set to -83 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 25 μm. The results are shown in Table 1. (Comparative Example 3) The magnitude of the negative pressure in the test conditions was set to -83 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 15 μm. The results are shown in Table 1. Comparative Example 4 The magnitude of the negative pressure in the test conditions was set to -80 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 35 μm. The results are shown in Table 1. (Comparative Example 5) The magnitude of the negative pressure in the test conditions was set to -80 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 25 μm. The results are shown in Table 1. (Comparative Example 6) The magnitude of the negative pressure in the test conditions was set to -80 kPa, and a pickup test was performed using a semiconductor wafer t having a thickness of 15 μm. The results are shown in Table 1.

[Table 1]

The embodiments, examples, and comparative examples of the present invention have been described above, but these embodiments, examples, and comparative examples are not intended to limit the scope of the invention. The new embodiment can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments or modifications thereof are included in the scope or spirit of the invention, and are included in the invention described in the scope of the patent application.

1‧‧‧Packaging device

10‧‧‧ supply device

11‧‧‧ Adhesive sheet

11a‧‧‧inclined part

12‧‧‧wafer ring

13‧‧‧Wafer Table

20‧‧‧ substrate platform

30‧‧‧ intermediate platform

40‧‧‧Pick up mechanism

41‧‧‧Adsorption nozzle

50‧‧‧Packaging mechanism

51‧‧‧Packaging tools

60‧‧‧Upper mechanism / upper device

61‧‧‧Support

61a‧‧‧bearing surface

61b‧‧‧Internal space

61c‧‧‧Suction trough

61d‧‧‧suction hole

61e‧‧‧ communication slot

61f‧‧‧ opening

62‧‧‧ Push up mechanism

62a‧‧‧The first push up

62b‧‧‧ 2nd push up

62c‧‧‧3rd Push Up

62d‧‧‧4th push up

62e‧‧‧Lifting drive

62f‧‧‧Lifting drive device

62g‧‧‧Lifting drive device

62h‧‧‧Lifting drive

63‧‧‧Suction pump

63a‧‧‧vacuum piping

63b‧‧‧Pressure control device (negative pressure adjustment mechanism)

63c‧‧‧On-off valve

63d‧‧‧Pressure Detector

64, 64A, 64B, 64C‧‧‧ convex

65, 65A, 65B, 65C‧‧‧ convex

66, 66A, 66B, 66C ‧‧‧ recess

70‧‧‧control device

71‧‧‧Storage Department

P‧‧‧Peeling Department

K‧‧‧ substrate

t‧‧‧semiconductor wafer

W‧‧‧ Wafer

X, Y, Z, θ‧‧‧ directions

FIG. 1 is a side view showing a schematic configuration of a packaging device for a semiconductor wafer according to the embodiment. FIG. 2 is a perspective view showing a top mechanism of a semiconductor wafer pickup device according to the embodiment. FIG. 3 is a schematic cross-sectional view showing the top mechanism shown in FIG. 2. 4 (A) and 4 (B) are plan views showing a push-up body of the push-up mechanism shown in FIG. 3. 5 (A) to 5 (C) are cross-sectional views showing operations of the pickup device according to the embodiment. 6 (A) to 6 (C) are cross-sectional views showing operations of the pickup device according to the embodiment. 7 (A) and 7 (B) are cross-sectional views showing the operation of the pickup device according to the embodiment.

Claims (7)

A pick-up device for a semiconductor wafer, which is a pick-up device for picking up a semiconductor wafer adhered and held on an adhesive sheet from the adhesive sheet, characterized in that it includes a pick-up mechanism for picking up the semiconductor wafer from the adhesive sheet; The top mechanism has a plurality of pushers arranged in the same axis direction and arranged freely in the direction of the axis, and the negative pressure acts on the pickup mechanism from the side opposite to the semiconductor wafer. A portion of the picked-up semiconductor wafer in the adhesive sheet, when the semiconductor wafer is picked up by the pickup mechanism, the semiconductor wafer is pushed up by the plurality of push-up bodies; The mechanism sets the magnitude of the negative pressure to -85 kPa or less with a gauge. The pick-up device for a semiconductor wafer according to item 1 of the scope of patent application, wherein the plurality of push-up bodies include a push-up body having an angular columnar shape arranged at the center, and the shaft center and the push-up body having the angular-pillar shape are changed into At least one rectangular cylindrical push-up body arranged in the same way. The semiconductor wafer pick-up device according to item 2 of the scope of the patent application, wherein the angular cylindrical push-up bodies are provided in a plurality, and the shaft centers are made the same and multiplely arranged. According to the second or third aspect of the patent application scope of the application for picking up a semiconductor wafer, the rectangular cylindrical push-up body is formed by alternately providing convex portions and concave portions along a circumferential direction at an upper end portion thereof. The pickup device for a semiconductor wafer according to item 4 of the scope of patent application, wherein the length of the concave portion in the circumferential direction is set to 0.8 times the length of the convex portion in the circumferential direction. Above and below 1.2 times. A packaging device for a semiconductor wafer, comprising: a supply device for holding an adhesive sheet attached to and holding the semiconductor wafer; a substrate platform on which a substrate is placed; and a pickup device for picking up a place from the adhesive sheet held by the supply device. The semiconductor wafer; and a packaging mechanism for packaging the semiconductor wafer taken out by the pick-up device on the substrate; Pickup device. A method for packaging a semiconductor wafer, which is a method for packaging a semiconductor wafer attached to and held on an adhesive sheet from the adhesive sheet, and packaging the picked-up semiconductor wafer on a substrate. The method is characterized by: When a pickup mechanism that picks up the semiconductor wafer from the adhesive sheet and picks up the semiconductor wafer from the adhesive sheet, a negative pressure is applied to the adhesive sheet from the side opposite to the semiconductor wafer, and the shaft is made by When the cores are the same, a plurality of push-up bodies arranged in the axial center direction and arranged to move freely are used to lift the semiconductor wafer, and the magnitude of the negative pressure is set to -85 kPa or less with a gauge.