JP7259714B2 - Semiconductor manufacturing equipment - Google Patents

Description

The present invention relates to semiconductor manufacturing equipment.

Patent Document 1 discloses a rotating stirring rod used for stirring solder in the mounting process of semiconductor manufacturing. The stirring rod is lowered toward the solder from right above the solder while being rotationally driven. As a result, the tip of the stirring rod is pressed against the solder. After holding the state for a predetermined time, the stirring bar is raised. By pressing the end face of the stirring bar against the solder, the solder can be pushed and spread.

JP-A-5-182998

Generally, in a solder agitating spanker as disclosed in Patent Document 1, the shape and size of the agitating part are fixed according to the size of the semiconductor chip to be soldered. Therefore, spankers may need to be replaced and adjusted for different sized semiconductor chips. Therefore, there was a possibility that productivity would fall.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor manufacturing apparatus capable of handling semiconductor chips of a plurality of sizes.

A semiconductor manufacturing apparatus according to the present disclosure has a first pressing portion having a first solder pressing surface at its lower end and a second solder pressing surface at its lower end, and is provided so as to be vertically movable independently of the first pressing portion. and the second solder pressing surface is positioned at a first position at the same height as the first solder pressing surface or at a second position above the first position . a fixing portion for fixing the pressing portion , the first solder pressing surface and the second solder pressing surface fixed at the first position form a continuous plane .

A semiconductor manufacturing apparatus according to the present disclosure has a first solder pressing surface at its lower end, a first pressing portion provided so as to be movable up and down, and a second solder pressing surface at its lower end. a second pressing portion provided so as to be vertically movable independently of the soldering surface; and a fixing part for fixing the second pressing part so that the position of the second solder pressing surface is at the first position or the second position, the fixing part fixed at the first position The first solder pressing surface and the second solder pressing surface fixed at the first position form a continuous plane .

The semiconductor manufacturing apparatus according to the present invention can handle semiconductor chips of a plurality of sizes by selecting the pressing portion to be used from among the first pressing portion and the second pressing portion.

1 is a perspective view of a semiconductor manufacturing apparatus according to Embodiment 1; FIG. 4A and 4B are diagrams showing a usage state of the first pressing portion according to Embodiment 1; FIG. 4A and 4B are diagrams showing usage states of the first pressing portion and the second pressing portion according to the first embodiment; FIG. 4A and 4B are diagrams showing usage states of a first pressing portion, a second pressing portion, and a third pressing portion according to Embodiment 1; FIG. 1 is a cross-sectional view of a semiconductor device according to a first embodiment; FIG. 4 is a flow chart showing a method for manufacturing a semiconductor device according to Embodiment 1; FIG. 8 is a diagram showing a method of wetting and spreading solder according to a comparative example of the first embodiment; FIG. 10 is a diagram showing solder after stirring; FIG. 11 is a perspective view of a semiconductor manufacturing apparatus according to Embodiment 2; FIG. 11 is a diagram showing a usage state of a first pressing portion according to Embodiment 2; FIG. 10 is a diagram showing a usage state of a first pressing portion and a second pressing portion according to Embodiment 2; FIG. 10 is a diagram showing usage states of a first pressing portion and a third pressing portion according to Embodiment 2; 8A and 8B are diagrams showing usage states of a first pressing portion, a second pressing portion, a third pressing portion, and a fourth pressing portion according to Embodiment 2; FIG. FIG. 11 is a perspective view of a semiconductor manufacturing apparatus according to Embodiment 3; FIG. 11 is a cross-sectional view of an air inflow path according to Embodiment 3;

A semiconductor manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings. The same reference numerals are given to the same or corresponding components, and repetition of description may be omitted.

Embodiment 1.
FIG. 1 is a perspective view of a semiconductor manufacturing apparatus 100 according to Embodiment 1. FIG. A semiconductor manufacturing apparatus 100 includes a first pressing portion 10 , a second pressing portion 20 and a third pressing portion 30 . The first pressing portion 10, the second pressing portion 20 and the third pressing portion 30 constitute a spanker. The first pressing portion 10 has a first solder pressing surface 12 at its lower end. The second pressing portion 20 has a second solder pressing surface 22 at its lower end. The third pressing portion 30 has a third solder pressing surface 32 at its lower end. The first pressing portion 10, the second pressing portion 20 and the third pressing portion 30 are also called stirring portions.

The first pressing portion 10 is arranged on the innermost side among the first pressing portion 10 , the second pressing portion 20 and the third pressing portion 30 . The first pressing part 10 is arranged in the central part of the spanker. The first pressing portion 10 is, for example, a quadrangular prism. The first solder pressing surface 12 constitutes a solder stirring surface. The first solder pressing surface 12 is rectangular.

The second pressing portion 20 is arranged outside the first pressing portion 10 . The second pressing portion 20 surrounds the first pressing portion 10 . The second pressing portion 20 has, for example, a rectangular frame shape. A second solder pressing surface 22 surrounds the first solder pressing surface 12 . The second solder pressing surface 22 constitutes a solder stirring surface. The second pressing portion 20 is provided so as to be vertically movable independently of the first pressing portion 10 . The second pressing part 20 can slide upward from the position shown in FIG.

The third pressing portion 30 is arranged outside the second pressing portion 20 . The third pressing portion 30 surrounds the second pressing portion 20 . The third pressing portion 30 has, for example, a rectangular frame shape. The third solder pressing surface 32 surrounds the second solder pressing surface 22 . The third solder pressing surface 32 constitutes a solder stirring surface. The third pressing portion 30 is provided so as to be vertically movable independently of the first pressing portion 10 and the second pressing portion 20 . The third pressing part 30 can slide upward from the position shown in FIG.

The first pressing portion 10, the second pressing portion 20, and the third pressing portion 30 are combined so that their centers overlap each other. The first pressing portion 10, the second pressing portion 20, and the third pressing portion 30 are each made of a material that cannot be soldered or a material that does not get wet with solder. The material forming the first pressing portion 10, the second pressing portion 20 and the third pressing portion 30 is, for example, a superhard material.

Fixing portions 52 and 53 are provided on side surfaces of the second pressing portion 20 and the third pressing portion 30, respectively. The fixing parts 52, 53 are provided with screws, for example. The fixing portion 52 fixes the second pressing portion 20 so that the position of the second solder pressing surface 22 is at the first position or at a second position above the first position. The first position is at the same height as the first solder pressing surface 12 . The fixing portion 52 fixes the second pressing portion 20 by screwing while the second pressing portion 20 is slid upward from the first position.

The fixing portion 53 fixes the third pressing portion 30 so that the position of the third solder pressing surface 32 is at the first position or the second position. The fixing portion 53 fixes the third pressing portion 30 by screwing while the third pressing portion 30 is slid upward from the first position. In FIG. 1, the second solder pressing surface 22 and the third solder pressing surface 32 are provided at the first position.

Next, how to use the semiconductor manufacturing apparatus 100 will be described with reference to FIGS. FIG. 2 is a diagram showing a usage state of the first pressing portion 10 according to Embodiment 1. FIG. 3A and 3B are diagrams showing usage states of the first pressing portion 10 and the second pressing portion 20 according to Embodiment 1. FIG. 4A and 4B are diagrams showing usage states of the first pressing portion 10, the second pressing portion 20, and the third pressing portion 30 according to Embodiment 1. FIG.

The second solder pressing surface 22 is movable to a second position with the first position as the lower limit. Similarly, the third solder pressing surface 32 can move from the first position to the second position. The first position is the bottom dead center of the second solder pressing surface 22 and the third solder pressing surface 32 . The second position is the top dead center of the second solder pressing surface 22 and the third solder pressing surface 32 . In the state of use of the semiconductor manufacturing apparatus 100, the first position is closer to the lead frame, which will be described later, than the second position.

In the state shown in FIG. 2, only the first solder pressing surface 12 among the plurality of solder pressing surfaces is provided at the first position. In this state, only the first solder pressing surface 12 among the plurality of solder pressing surfaces presses the solder.

In the state shown in FIG. 3, the first solder pressing surface 12 and the second solder pressing surface 22 of the plurality of solder pressing surfaces are provided at the first position. The first solder pressing surface 12 and the second solder pressing surface 22 fixed at the first position form a continuous plane. In this state, the first solder pressing surface 12 and the second solder pressing surface 22 of the plurality of solder pressing surfaces press the solder. Thus, the second solder pressing surface 22 presses the solder when fixed at the first position, and does not press the solder when fixed at the second position.

In the state shown in FIG. 4, the first solder pressing surface 12, the second solder pressing surface 22 and the third solder pressing surface 32 are provided at the first position. The first solder pressing surface 12 and the second solder pressing surface 22 and the third solder pressing surface 32 fixed at the first position form a continuous plane. In this state, the first solder pressing surface 12, the second solder pressing surface 22 and the third solder pressing surface 32 press the solder. The third solder pressing surface 32 presses the solder when fixed at the first position, and does not press the solder when fixed at the second position.

Next, a method for manufacturing the semiconductor device 80 according to the first embodiment will be described. FIG. 5 is a cross-sectional view of semiconductor device 80 according to the first embodiment. A semiconductor manufacturing apparatus 100 of the present embodiment is used for manufacturing a semiconductor device 80 as shown in FIG. 6, for example. In semiconductor device 80 , lead frame 82 is provided on insulating sheet 81 . The lead frame 82 has a die pad 82a and leads 82b. The lead frame 82 is made of Cu, for example.

The semiconductor chip 84 is bonded to the upper surface of the die pad 82a with solder 83. As shown in FIG. A wire 85 connects the semiconductor chip 84 and the lead 82b. The wire 85 is made of Al, for example. The lead frame 82, semiconductor chip 84 and wires 85 are sealed by transfer molding. Lead frame 82 , semiconductor chip 84 and wires 85 are covered with mold resin 86 . The semiconductor device 80 is, for example, a power module.

The semiconductor manufacturing apparatus 100 is used to wet and spread the solder 83 mounted on the lead frame 82 in the process of soldering the semiconductor chip 84 and the lead frame 82 . The semiconductor manufacturing apparatus 100 forms the solder 83 into a shape suitable for the semiconductor chip 84 .

FIG. 6 is a flow chart showing the method for manufacturing the semiconductor device 80 according to the first embodiment. First, solder is applied. Here, melted solder 83 is dripped onto a position of lead frame 82 where semiconductor chip 84 is to be mounted and soldered. The solder 83 in this state is in the shape of an upturned bowl, as shown in FIG.

On the other hand, the semiconductor chip 84 mounted on the lead frame 82 is generally diced into squares. In order to perform solder joints properly, it is necessary to spread the solder 83 over the lead frame 82 in a shape slightly larger than the semiconductor chip 84 . Therefore, as the next step, the spanker is lowered to wet and spread the solder 83 .

In this embodiment, the semiconductor manufacturing apparatus 100 is operated so as to hit the solder 83 from above. As a result, the solder 83 can be wetted and spread in a shape corresponding to the shape of the bottom surface of the spanker. Also, the solder 83 is agitated by being pressed by the spanker. The semiconductor manufacturing apparatus 100 may wet and spread the solder 83 so as to have the same shape as the bottom surface of the spanker.

In the present embodiment, the shape of the bottom surface of the spanker is determined by the solder pressing surface arranged at the first position among the first solder pressing surface 12, the second solder pressing surface 22 and the third solder pressing surface 32. In the state of FIG. 2 , the solder 83 spreads out in a shape corresponding to the first solder pressing surface 12 . In the state of FIG. 3 , the solder 83 spreads out in a shape corresponding to the plane formed by the first solder pressing surface 12 and the second solder pressing surface 22 . In the state of FIG. 4, the solder 83 spreads out in a shape corresponding to the plane formed by the first solder pressing surface 12, the second solder pressing surface 22, and the third solder pressing surface 32. As shown in FIG.

Then raise the spanker. This separates the solder 83 from the spanker.

FIG. 7 shows a method of wetting and spreading solder 83 according to a comparative example of the first embodiment. A semiconductor manufacturing apparatus 101 according to a comparative example is composed of one basic spanker. The semiconductor manufacturing apparatus 101 has only one solder pressing surface 112 .

FIG. 8 is a diagram showing solder 83 after stirring. By being pressed and agitated by the solder pressing surface 112 , the solder 83 wets and spreads in a shape corresponding to the solder pressing surface 112 .

Here, in order to wet and spread the solder 83 in a shape suitable for the semiconductor chip 84 mounted on the solder 83, a semiconductor manufacturing apparatus 101 having a solder pressing surface having a size or shape corresponding to the semiconductor chip 84 is used. There is a need. Therefore, it is necessary to prepare a plurality of semiconductor manufacturing apparatuses 101 for semiconductor chips 84 of a plurality of sizes or shapes.

In contrast, in this embodiment, one semiconductor manufacturing apparatus 100 can handle semiconductor chips 84 of a plurality of sizes. Specifically, the semiconductor manufacturing apparatus 100 can stir the solder 83 for mounting the semiconductor chips 84 of three different sizes. That is, according to the size of the semiconductor chip 84, it is possible to select an appropriate state from FIGS. Therefore, it is not necessary to prepare the semiconductor manufacturing apparatus 100 for each size or shape of the semiconductor chip 84 . Therefore, manufacturing costs can be suppressed.

Moreover, in the semiconductor manufacturing apparatus 101 according to the comparative example, in order to mount a semiconductor chip 84 having a different shape, it is necessary to replace the spanker and perform the initial setting again. The initial settings are, for example, fine tuning of flatness and position. Therefore, there is a possibility that the productivity of the semiconductor device 80 is lowered.

In contrast, in this embodiment, it is not necessary to replace the spanker for each size or shape of the semiconductor chip 84 . In addition, once the initial setting is performed, the size of the solder agitating surface can be changed simply by sliding one of the pressing portions up and down. Therefore, it is possible to produce a wide variety of products without performing spanker replacement and setting operations according to the chip size. Therefore, it is possible to shorten the preparation time when producing different types of products, and to improve productivity.

The first solder pressing surface 12 may be formed so as to correspond to the smallest size semiconductor chip 84 expected to be manufactured by the semiconductor manufacturing apparatus 100 . In this case, the size of the first solder pressing surface 12 is designed, for example, between 1.0 to 2.0 mm×1.0 to 2.0 mm so as to correspond to the minimum chip size. When stirring the solder 83 for the semiconductor chip 84 of the minimum size, only the first pressing portion 10 is set at the first position.

The second solder pressing surface 22 may be formed so as to correspond to an intermediate size semiconductor chip 84 that is expected to be manufactured by the semiconductor manufacturing apparatus 100 . In this case, the size of the second solder pressing surface 22 is set to a size corresponding to an intermediate size semiconductor chip. When stirring the solder 83 for the intermediate-sized semiconductor chip 84, the first pressing portion 10 and the second pressing portion 20 are set at the first position, and the third pressing portion 30 is set at the second position.

The third solder pressing surface 32 may be formed so as to correspond to the maximum size of the semiconductor chip 84 expected to be manufactured by the semiconductor manufacturing apparatus 100 . In this case, the size of the third solder pressing surface 32 is designed, for example, between 5.0-6.0 mm×5.0-6.0 mm so as to correspond to the maximum chip size. When stirring the solder 83 for the semiconductor chip 84 of the maximum size, the first pressing portion 10, the second pressing portion 20 and the third pressing portion 30 are set at the first position.

As a modification of the present embodiment, the shape of the first solder pressing surface 12 or the shape of a plane formed by combining a plurality of solder pressing surfaces may be quadrangle, square, rectangle, polygon, circle, ellipse, or the like. good.

Moreover, the semiconductor manufacturing apparatus 100 may rotate, swing, or move the spanker in the horizontal direction while the spanker is in contact with the solder 83 . Thereby, the solder 83 can be spread. Also, the oxide film of the solder 83 can be removed.

Further, in the present embodiment, the position of the solder pressing surface is switched by shifting the second pressing portion 20 or the third pressing portion 30 . The present invention is not limited to this, and each pressing portion may expand and contract to switch the position of the solder pressing surface.

Moreover, the fixed portions 52 and 53 are not limited to those shown in FIG. The fixing portions 52 and 53 only need to fix the second solder pressing surface 22 and the third solder pressing surface 32 at the first position or the second position.

These modifications can be appropriately applied to semiconductor manufacturing apparatuses according to the following embodiments. Since semiconductor manufacturing apparatuses according to the following embodiments have many points in common with the first embodiment, differences from the first embodiment will be mainly described.

Embodiment 2.
FIG. 9 is a perspective view of a semiconductor manufacturing apparatus 200 according to Embodiment 2. FIG. The semiconductor manufacturing apparatus 200 includes a first pressing portion 210 , a second pressing portion 220 , a third pressing portion 230 and a fourth pressing portion 240 . The first pressing portion 210 to the fourth pressing portion 240 constitute a spanker. The first pressing portion 210 has a first solder pressing surface 212 at its lower end. The second pressing portion 220 has a second solder pressing surface 222 at its lower end. The third pressing portion 230 has a third solder pressing surface 232 at its lower end. The fourth pressing portion 240 has a fourth solder pressing surface 242 at its lower end.

At least one of the first solder pressing surface 212, the second solder pressing surface 222, the third solder pressing surface 232 and the fourth solder pressing surface 242 constitutes a solder stirring surface. The first pressing portion 210, the second pressing portion 220, the third pressing portion 230, and the fourth pressing portion 240 are provided so as to be vertically movable independently of each other. The first pressing portion 210 to the fourth pressing portion 240 are each slidable from a first position to a second position.

The first pressing portion 210 to the fourth pressing portion 240 are composed of square poles of the same size. The first solder pressing surface 212 to the fourth solder pressing surface 242 are each rectangular. The first solder pressing surface 212 to the fourth solder pressing surface 242 have the same shape.

The first solder pressing surface 212 and the second solder pressing surface 222 are arranged in the first direction. The third solder pressing surface 232 and the fourth solder pressing surface 242 are arranged in the first direction. The first solder pressing surface 212 and the third solder pressing surface 232 are arranged in a second direction intersecting the first direction. The second solder pressing surface 212 and the fourth solder pressing surface 242 are arranged in the second direction. The first direction and the second direction are orthogonal. The first direction and the second direction are perpendicular to the directions in which the first to fourth pressing portions 210 to 240 shift.

A storage portion 255 is provided above the first to fourth pressing portions 210 to 240 . A part of the upper end side of each of the first pressing portion 210 to the fourth pressing portion 240 is housed in the housing portion 255 .

A plurality of fixing portions 250 are provided on the side surface of the storage portion 255 . A plurality of fixing portions 250 are provided to correspond to the first pressing portion 210 to the fourth pressing portion 240, respectively. Two fixing portions 250 shown in FIG. 9 fix the third pressing portion 230 and the fourth pressing portion 240 respectively. Two fixing portions 250 for fixing the first pressing portion 210 and the second pressing portion 220 are provided in the storage portion 255 at positions facing the two fixing portions 250 shown in FIG.

The first pressing portion 210 is fixed by the fixing portion 250 so that the position of the first solder pressing surface 212 is at the first position or the second position. The second pressing portion 220 is fixed by the fixing portion 250 so that the position of the second solder pressing surface 222 is at the first position or the second position. Third pressing portion 230 is fixed by fixing portion 250 such that third solder pressing surface 232 is positioned at the first position or the second position. The fourth pressing portion 240 is fixed by the fixing portion 250 so that the position of the second solder pressing surface 222 is at the first position or the second position.

Each fixing part 250 includes, for example, a screw. Each of the first pressing portion 210, the second pressing portion 220, the third pressing portion 230, and the fourth pressing portion 240 is slid upward from the first position and fixed to the fixing portion 250 by screwing.

Next, how to use the semiconductor manufacturing apparatus 200 will be described with reference to FIGS. 10 to 13. FIG. 10A and 10B are diagrams showing the state of use of the first pressing portion 210 according to the second embodiment. 11A and 11B are diagrams showing usage states of the first pressing portion 210 and the second pressing portion 220 according to the second embodiment. 12A and 12B are diagrams showing usage states of the first pressing portion 210 and the third pressing portion 230 according to the second embodiment. 13A and 13B show usage states of the first pressing portion 210, the second pressing portion 220, the third pressing portion 230, and the fourth pressing portion 240 according to the second embodiment. Each of the first solder pressing surface 212 to the fourth solder pressing surface 242 is movable to a second position with the first position as the lower limit.

In the state shown in FIG. 10, only the first solder pressing surface 212 among the plurality of solder pressing surfaces is provided at the first position. In this state, only the first solder pressing surface 212 among the plurality of solder pressing surfaces presses the solder.

In the state shown in FIG. 11, the first solder pressing surface 212 and the second solder pressing surface 222 of the plurality of solder pressing surfaces are provided at the first position. The first solder pressing surface 212 and the second solder pressing surface 222 fixed at the first position form a continuous plane. In this state, only the first solder pressing surface 212 and the second solder pressing surface 222 of the plurality of solder pressing surfaces press the solder.

In the state shown in FIG. 12, the first solder pressing surface 212 and the third solder pressing surface 232 of the plurality of solder pressing surfaces are provided at the first position. The first solder pressing surface 212 and the third solder pressing surface 232 fixed at the first position form a continuous plane. In this state, only the first solder pressing surface 212 and the third solder pressing surface 232 of the plurality of solder pressing surfaces press the solder.

In the state shown in FIG. 13, the first solder pressing surface 212 to the fourth solder pressing surface 242 are provided at the first position. The first solder pressing surface 212 to the fourth solder pressing surface 242 fixed at the first position form a continuous plane. In this state, all of the first solder pressing surface 212 to the fourth solder pressing surface 242 press the solder.

In the present embodiment, by arranging the four pressing portions vertically and horizontally, four solder stirring surfaces shown in FIGS. 10 to 13 can be configured. In other words, the same semiconductor manufacturing apparatus 200 can be used to stir the solder 83 corresponding to four different sizes or shapes of the semiconductor chips 84 .

The size of the first solder pressing surface 212 to the fourth solder pressing surface 242 is, for example, 1.0 mm×1.0 mm. The first solder pressing surface 212 to the fourth solder pressing surface 242 may be formed so as to correspond to the smallest size semiconductor chip 84 expected to be manufactured by the semiconductor manufacturing apparatus 200 .

When stirring the solder 83 for the minimum size semiconductor chip 84, as shown in FIG. 10, only the first solder pressing surface 212 is set at the first position.

When stirring the solder 83 for the vertically long semiconductor chip 84, the first solder pressing surface 212 and the second solder pressing surface 222 are set at the first position, as shown in FIG. 11, for example.

When stirring the solder 83 for the oblong semiconductor chip 84, the first solder pressing surface 212 and the third solder pressing surface 232 are set at the first position, as shown in FIG. 12, for example. The solder stirring surface shown in FIG. 12 can stir the solder 83 for the semiconductor chip 84 which has the same area as the semiconductor chip 84 corresponding to the solder stirring surface shown in FIG. 11 and is rotated by 90 degrees.

When stirring the solder 83 for the semiconductor chip 84 of the maximum size assumed to be manufactured by the semiconductor manufacturing apparatus 200, for example, as shown in FIG. to the first position.

In this embodiment, by combining a plurality of solder pressing surfaces, it is possible not only to change the size of the solder stirring surface but also to change the aspect ratio. Therefore, it is possible to deal with semiconductor chips 84 having different aspect ratios. Specifically, one semiconductor manufacturing apparatus 200 can handle square, horizontally long and vertically long semiconductor chips 84 .

The semiconductor manufacturing apparatus 200 of this embodiment has four pressing units. The semiconductor manufacturing apparatus 200 is not limited to this, and may be provided with a plurality of pressing portions. For example, the size of the pressing portion may be reduced and the number of pressing portions may be increased. The pressing portions may be arranged, for example, in 3×3 or 4×4. As a result, the semiconductor manufacturing apparatus 200 can be made compatible with semiconductor chips 84 having more shapes. Also, the plurality of pressing portions may have different shapes.

10 to 13, the first solder pressing surface 212 is always arranged at the first position and presses the solder 83. As shown in FIG. Alternatively, the first solder pressing surface 212 may be arranged at the second position, and the other solder pressing surfaces may be arranged at the first position.

Each pressing portion has a position where the solder pressing surface faces the screw of the fixing portion 250 in the first position, and a position in which the solder pressing surface faces the screw of the fixing portion 250 in the second position. , screw holes may be formed. As a result, the pressing portion can be fixed with screws so that the position of the solder pressing surface is at the first position or the second position.

In addition, as the fixing portion 250, any configuration that can fix the pressing portion to the first position or the second position can be adopted. As the fixed portion 250, for example, a fitting portion may be provided between the pressing portion and the storage portion 255. FIG. Also, a fitting portion may be provided between adjacent pressing portions.

Embodiment 3.
FIG. 14 is a perspective view of a semiconductor manufacturing apparatus 300 according to Embodiment 3. FIG. FIG. 15 is a cross-sectional view of the air inflow path 357 according to Embodiment 3. As shown in FIG. FIG. 15 is a horizontal cross-sectional view of the portion indicated by frame 62 in FIG. The semiconductor manufacturing apparatus 300 differs from the semiconductor manufacturing apparatus 100 in that an air supply section is provided. Other configurations are the same as those of the first embodiment. The air supply unit includes an air inflow tube 356 and an air inflow path 357 .

One end of the air inflow tube 356 is connected to a supply device (not shown) for supplying air to the air inflow tube 356 . The other end of the air inflow tube 356 is connected to the air inflow path 357 . The air inflow path 357 extends downward from the upper surface of the first pressing portion 10 . The air inflow path 357 is provided so that the air 63 can flow from above into the gaps between the first pressing portion 10 to the third pressing portion 30 .

The air inflow path 357 is formed between the first pressing portion 10 and the second pressing portion 20, for example, from the upper surface of the first pressing portion 10 so that the air 63 flows between the first pressing portion 10 and the second pressing portion 20. It connects to the gap between them. In addition, the air inflow path 357 is formed so that the air 63 flows between the second pressing portion 20 and the third pressing portion 30, for example, from the upper surface of the first pressing portion 10, the second pressing portion 20 and the third pressing portion connected to the gap between

As shown in FIG. 14 , the air supply unit supplies air 63 downward between the second solder pressing surface 22 and the third solder pressing surface 32 . Similarly, the air supply unit supplies air 63 downward between the first solder pressing surface 12 and the second solder pressing surface 22 .

In Embodiments 1 and 2, there are actually small gaps between the plurality of pressing portions that allow the pressing portions to slide. Since the material of the pressing portion is a superhard material, the solder 83 does not wet and spread. Therefore, the solder 83 is less likely to adhere to the pressing portion. However, there is a possibility that the solder 83 may get into the slight gap between the pressing parts due to capillary action.

In the present embodiment, air 63 is caused to flow from above into the gaps between the first pressing portion 10 to the third pressing portion 30 by the air supply portion. The amount of air 63 is set so as to prevent the solder 83 from creeping up due to capillary action. Air 63 may always flow. By forming an air curtain with the air 63, the solder 83 can be suppressed from creeping up. Thereby, maintenance of the semiconductor manufacturing apparatus 300 can be facilitated.

Also, the small amount of air 63 can prevent the solder 83 from creeping up due to capillary action. Furthermore, the spanker operation is, for example, on the order of 0.5 seconds. Therefore, it is possible to prevent the temperature of the solder 83 from being greatly lowered by the air 63 or the solder 83 from being blown off.

Note that the technical features described in each embodiment may be used in combination as appropriate.

10 first pressing portion 12 first solder pressing surface 20 second pressing portion 22 second solder pressing surface 30 third pressing portion 32 third solder pressing surface 52, 53 fixing portion 63 air 80 semiconductor Device, 81 insulating sheet, 82 lead frame, 82a die pad, 82b lead, 84 semiconductor chip, 85 wire, 86 mold resin, 100, 101 semiconductor manufacturing equipment, 112 solder pressing surface, 200 semiconductor manufacturing equipment, 210 first pressing part, 212 first solder pressing surface, 220 second pressing portion, 222 second solder pressing surface, 230 third pressing portion, 232 third solder pressing surface, 240 fourth pressing portion, 242 fourth solder pressing surface, 250 fixing portion, 255 Storage Part 300 Semiconductor Manufacturing Equipment 356 Air Inflow Tube 357 Air Inflow Path

Claims (11)

a first pressing portion having a first solder pressing surface at its lower end;
a second pressing portion having a second solder pressing surface at the lower end and provided so as to be vertically movable independently of the first pressing portion;
a fixing portion that fixes the second pressing portion so that the position of the second solder pressing surface is at a first position at the same height as the first solder pressing surface or at a second position above the first position; ,
with
A semiconductor manufacturing apparatus , wherein the first solder pressing surface and the second solder pressing surface fixed at the first position form a continuous plane . 2. The semiconductor manufacturing apparatus according to claim 1 , wherein said second solder pressing surface presses solder while being fixed at said first position. 3. The semiconductor manufacturing apparatus according to claim 1 , wherein said second solder pressing surface surrounds said first solder pressing surface. 4. A semiconductor manufacturing apparatus according to claim 3 , wherein said first solder pressing surface is rectangular. a first pressing portion having a first solder pressing surface at its lower end and provided so as to be vertically movable;
a second pressing portion having a second solder pressing surface at the lower end and provided so as to be vertically movable independently of the first pressing portion;
The first pressing portion is fixed so that the position of the first solder pressing surface is at the first position or a second position above the first position, and the position of the second solder pressing surface is at the first position or at a second position above the first position. a fixing portion that fixes the second pressing portion so as to be at the second position;
with
A semiconductor manufacturing apparatus, wherein the first solder pressing surface fixed at the first position and the second solder pressing surface fixed at the first position form a continuous plane. 6. The semiconductor manufacturing apparatus according to claim 5 , wherein the first solder pressing surface and the second solder pressing surface press the solder while being fixed at the first position. 7. The semiconductor manufacturing apparatus according to claim 5, wherein said first solder pressing surface and said second solder pressing surface are arranged in the first direction. A third pressing portion having a third solder pressing surface at its lower end and a fourth pressing portion having a fourth solder pressing surface at its lower end,
The first pressing portion, the second pressing portion, the third pressing portion, and the fourth pressing portion are provided so as to be vertically movable independently of each other,
The fixing portion fixes the third pressing portion so that the position of the third solder pressing surface is the first position or the second position, and the position of the fourth solder pressing surface is the first position or the second position. fixing the fourth pressing portion so as to be at the second position;
the first solder pressing surface and the third solder pressing surface are arranged in a second direction crossing the first direction;
8. The semiconductor manufacturing apparatus according to claim 7 , wherein said third solder pressing surface and said fourth solder pressing surface are arranged in said first direction. 9. The semiconductor manufacturing apparatus according to claim 5 , wherein said first solder pressing surface and said second solder pressing surface are square. 10. The semiconductor manufacturing apparatus according to claim 5 , wherein said first solder pressing surface and said second solder pressing surface have the same shape. 11. The semiconductor manufacturing method according to any one of claims 1 to 10 , further comprising an air supply unit for supplying air downward between the first solder pressing surface and the second solder pressing surface. Device.

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