TW201933706A - Laser control device capable of suppressing deviation of pulse energy - Google Patents
Laser control device capable of suppressing deviation of pulse energy Download PDFInfo
- Publication number
- TW201933706A TW201933706A TW107146056A TW107146056A TW201933706A TW 201933706 A TW201933706 A TW 201933706A TW 107146056 A TW107146056 A TW 107146056A TW 107146056 A TW107146056 A TW 107146056A TW 201933706 A TW201933706 A TW 201933706A
- Authority
- TW
- Taiwan
- Prior art keywords
- laser
- pulse
- value
- pulse width
- time
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lasers (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
本發明有關一種雷射控制裝置。The invention relates to a laser control device.
在印刷配線板的鑽孔加工等中使用利用了脈衝雷射光之加工技術。在專利文獻1中揭示出一種能夠輸出具有所期望的脈衝寬度之脈衝雷射光之雷射加工裝置。在該雷射加工裝置中,導通向雷射共振器輸出脈衝雷射光之脈衝控制電源之後,依據從雷射共振器實際輸出之脈衝雷射光束的輸出時序及脈衝寬度指令,斷開脈衝控制電源。即便導通脈衝控制電源之後至實際輸出脈衝雷射光束為止的時間產生偏差,亦能夠將脈衝寬度維持為所指示之值。
[先前技術文獻]
[專利文獻]A processing technique using pulsed laser light is used in drilling processing of a printed wiring board or the like. Patent Document 1 discloses a laser processing apparatus capable of outputting pulsed laser light having a desired pulse width. In the laser processing apparatus, after the pulse control power source that outputs the pulsed laser light to the laser resonator is turned on, the pulse control power source is turned off according to the output timing and the pulse width command of the pulsed laser beam actually outputted from the laser resonator. . Even if the time from the on-pulse control power supply to the actual output of the pulsed laser beam is varied, the pulse width can be maintained at the indicated value.
[Previous Technical Literature]
[Patent Literature]
[專利文獻1] 國際公開第2014/010046號專利公報[Patent Document 1] International Publication No. 2014/010046
[發明欲解決之課題][Questions to be solved by the invention]
在使用脈衝雷射光束進行加工時,將每一脈衝的能量(脈衝能量)設為恆定是重要的。依本案的發明人等的評價實驗,明確出有時即便將脈衝寬度維持為所指示之值,抑制脈衝能量的偏差之效果亦不充分。When processing with a pulsed laser beam, it is important to set the energy (pulse energy) of each pulse to be constant. According to the evaluation experiment by the inventors of the present invention, it is clarified that even if the pulse width is maintained at the indicated value, the effect of suppressing variations in pulse energy is insufficient.
本發明的目的在於,提供一種能夠抑制脈衝能量的偏差之雷射控制裝置。
[解決課題之手段]An object of the present invention is to provide a laser control apparatus capable of suppressing variations in pulse energy.
[Means for solving the problem]
依本發明的一觀點,提供一種雷射控制裝置,其中,
求出從輸出脈衝雷射光束之雷射振盪器的激勵開始至雷射脈衝的上升為止的經過時間亦即累積時間而將其設為測定值;
依據前述累積時間的測定值,計算從前述雷射振盪器輸出之雷射脈衝的脈衝寬度的指令值;
以成為計算出當前輸出之雷射脈衝的脈衝寬度之指令值那般,控制前述雷射振盪器。
[發明效果]According to an aspect of the present invention, a laser control apparatus is provided, wherein
Obtaining the elapsed time from the start of the excitation of the laser oscillator that outputs the pulsed laser beam to the rise of the laser pulse, that is, the cumulative time, and setting it as the measured value;
Calculating a command value of a pulse width of a laser pulse outputted from the laser oscillator according to the measured value of the accumulated time;
The laser oscillator is controlled so as to be a command value for calculating the pulse width of the currently output laser pulse.
[Effect of the invention]
依據累積時間的測定值,使從雷射振盪器輸出之雷射脈衝的脈衝寬度的指令值發生變化,經此,與將脈衝寬度設為恆定之情況下相比,能夠減少脈衝能量的偏差。The command value of the pulse width of the laser pulse output from the laser oscillator is changed in accordance with the measured value of the accumulated time, whereby the variation in pulse energy can be reduced as compared with the case where the pulse width is made constant.
參閱圖1~圖7B,對基於實施例之雷射控制裝置進行說明。A laser control apparatus according to an embodiment will be described with reference to Figs. 1 to 7B.
圖1為搭載了基於實施例之雷射控制裝置30之雷射加工裝置的概略圖。雷射振盪器20從雷射控制裝置30接收振盪指令訊號S0而輸出脈衝雷射光束。作為雷射振盪器20,能夠使用各種脈衝雷射振盪器,例如,進行脈衝振盪之二氧化碳雷射振盪器等。雷射振盪器20包括:光諧振器、放電電極、放電電極驅動電路等。FIG. 1 is a schematic view of a laser processing apparatus equipped with a laser control device 30 according to an embodiment. The laser oscillator 20 receives the oscillation command signal S0 from the laser control device 30 and outputs a pulsed laser beam. As the laser oscillator 20, various pulsed laser oscillators can be used, for example, a carbon dioxide laser oscillator that performs pulse oscillation. The laser oscillator 20 includes an optical resonator, a discharge electrode, a discharge electrode drive circuit, and the like.
從雷射振盪器20輸出之脈衝雷射光束通過第1光學系統21,被反射鏡22反射,通過第2光學系統23而射入到被保持在載臺24的加工對象物25。加工對象物25例如是印刷配線基板,並藉由脈衝雷射光束來進行鑽孔加工。The pulsed laser beam output from the laser oscillator 20 is reflected by the mirror 22 through the first optical system 21, and is incident on the object 25 held by the stage 24 by the second optical system 23. The object to be processed 25 is, for example, a printed wiring board, and is drilled by a pulsed laser beam.
射入到反射鏡22的脈衝雷射光束的一部分,係透過反射鏡22而射入到光檢測器26。光檢測器26檢測所射入的雷射脈衝,並輸出與雷射脈衝的光強度對應之電訊號亦即檢測訊號S1。作為光檢測器26,能夠使用追隨脈衝波形的變化之具有響應速度之紅外線感測器,例如碲化鎘汞感測器(MCT感測器)等。另外,可以緊接著雷射振盪器20的雷射射出口之後配置光檢測器26。A portion of the pulsed laser beam incident on the mirror 22 is incident on the photodetector 26 through the mirror 22. The photodetector 26 detects the incident laser pulse and outputs a signal corresponding to the light intensity of the laser pulse, that is, the detection signal S1. As the photodetector 26, an infrared sensor having a response speed following a change in the pulse waveform, such as a cadmium telluride mercury sensor (MCT sensor) or the like can be used. In addition, the photodetector 26 can be disposed immediately after the laser exit of the laser oscillator 20.
第1光學系統21包括:光束擴展器、非球面透鏡、孔口等。光束擴展器使雷射光束的光束直徑及發散角發生變化。非球面透鏡使射束輪廓從高斯形狀變化為平頂形狀。孔口對光束剖面形狀進行整形。The first optical system 21 includes a beam expander, an aspherical lens, an orifice, and the like. The beam expander changes the beam diameter and divergence angle of the laser beam. The aspherical lens changes the beam profile from a Gaussian shape to a flat top shape. The aperture shapes the beam profile.
第2光學系統23包括:光束掃描器、fθ透鏡等。光束掃描器例如包括一對電流鏡,藉由來自雷射控制裝置30的指令將雷射光束沿二維方向掃描。fθ透鏡使由光束掃描器掃描之雷射光束在加工對象物25的表面聚光。另外,可以設為使孔口的位置在加工對象物25的表面縮小投影之構造。The second optical system 23 includes a beam scanner, an fθ lens, and the like. The beam scanner, for example, includes a pair of current mirrors that are scanned in a two dimensional direction by commands from the laser control device 30. The fθ lens condenses the laser beam scanned by the beam scanner on the surface of the object 25. Further, a configuration may be adopted in which the position of the orifice is reduced and projected on the surface of the object 25 to be processed.
載臺24例如能夠沿水平的保持面保持加工對象物25,使加工對象物25沿水平面內的兩個方向移動。雷射控制裝置30控制載臺24的移動。關於載臺24,例如使用XY載臺。The stage 24 can hold the object 25 on the horizontal holding surface, for example, and move the object 25 in two directions in the horizontal plane. The laser control device 30 controls the movement of the stage 24. Regarding the stage 24, for example, an XY stage is used.
雷射控制裝置30依據基於光檢測器26之雷射脈衝的檢測訊號S1,以脈衝能量為恆定之方式,按雷射脈衝進行從雷射振盪器20輸出之脈衝雷射光束的脈衝寬度之調整。The laser control device 30 adjusts the pulse width of the pulsed laser beam output from the laser oscillator 20 according to the laser pulse based on the detection signal S1 of the laser pulse of the photodetector 26 in a manner that the pulse energy is constant. .
圖2為表示從雷射控制裝置30(圖1)被發送至雷射振盪器20(圖1)之振盪指令訊號S0及從光檢測器26(圖1)向雷射控制裝置30(圖1)賦予之檢測訊號S1的波形之圖表。2 is a view showing an oscillation command signal S0 transmitted from the laser control device 30 (FIG. 1) to the laser oscillator 20 (FIG. 1) and from the photodetector 26 (FIG. 1) to the laser control device 30 (FIG. 1). A graph of the waveform of the detection signal S1 given.
在時刻t0,若振盪指令訊號S0上升,則雷射振盪器20開始向放電電極供給高頻電力。藉由開始向放電電極供給高頻電力,開始激勵雷射振盪器20的雷射介質。亦即,振盪指令訊號S0的上升相當於雷射振盪器20的振盪開始指令,振盪指令訊號S0的上升時間點相當於雷射振盪器20的激勵開始的時間點。At time t0, when the oscillation command signal S0 rises, the laser oscillator 20 starts supplying high frequency power to the discharge electrode. The laser medium that excites the laser oscillator 20 is started by starting to supply high frequency power to the discharge electrode. That is, the rise of the oscillation command signal S0 corresponds to the oscillation start command of the laser oscillator 20, and the rising time point of the oscillation command signal S0 corresponds to the time point at which the excitation of the laser oscillator 20 starts.
在時刻t1,雷射脈衝從激勵開始的時刻t0延遲上升。檢測訊號S1亦與雷射脈衝的上升對應而上升。將從激勵開始的時刻t0至雷射脈衝的上升的時刻t1為止的經過時間設為累積時間BU。在雷射脈衝上升時,出現基於增益開關之極短時間的峰值波形,之後維持大致恆定的光強度。將維持大致恆定的光強度之部分設為脈衝波形的主要部分。At time t1, the laser pulse is delayed from the time t0 at which the excitation starts. The detection signal S1 also rises in response to the rise of the laser pulse. The elapsed time from the time t0 at which the excitation starts to the time t1 at which the laser pulse rises is referred to as the accumulation time BU. When the laser pulse rises, a peak waveform based on the gain switch for a very short time occurs, and then a substantially constant light intensity is maintained. The portion that maintains a substantially constant light intensity is set as the main portion of the pulse waveform.
在時刻t2,若振盪指令訊號S0下降,則雷射振盪器20停止向放電電極供給高頻電力。若停止向放電電極供給高頻電力,則變得無法進行雷射振盪器20的雷射介質的激勵。亦即,振盪指令訊號S0的下降表示雷射振盪器20的激勵停止的指令。若停止雷射振盪器20的激勵,則從雷射振盪器20輸出之雷射脈衝的強度急劇降低。At time t2, when the oscillation command signal S0 falls, the laser oscillator 20 stops supplying high frequency power to the discharge electrode. When the supply of the high-frequency power to the discharge electrode is stopped, the excitation of the laser medium of the laser oscillator 20 cannot be performed. That is, the falling of the oscillation command signal S0 indicates an instruction to stop the excitation of the laser oscillator 20. When the excitation of the laser oscillator 20 is stopped, the intensity of the laser pulse output from the laser oscillator 20 is drastically lowered.
以時間對檢測訊號S1的1個脈衝波形進行積分之值藉由每一脈衝的能量(脈衝能量)來確定。在本說明書中,將藉由脈衝能量來確定之該積分值設為「脈衝能量依存物理量」。The value obtained by integrating the one pulse waveform of the detection signal S1 with time is determined by the energy (pulse energy) of each pulse. In the present specification, the integral value determined by the pulse energy is referred to as "pulse energy dependent physical quantity".
與整體的脈衝寬度相比,基於增益開關之極短時間的峰值波形的時間間隔非常短,可以將從脈衝波形除去基於增益開關之極短時間的峰值波形之部分的積分值作為脈衝能量依存物理量而採用。又,激勵停止之後的尾部部分的時間間隔亦與雷射脈衝的脈衝寬度相比非常短,並且尾部部分的光強度隨著時間的經過而急劇降低,因此可以將除去尾部部分之脈衝波形的積分值作為脈衝能量依存物理量而採用。如此,可以將脈衝波形的主要部分的積分值作為脈衝能量依存物理量而採用。Compared with the overall pulse width, the time interval of the peak waveform based on the extremely short time of the gain switch is very short, and the integral value of the portion of the peak waveform based on the extremely short time of the gain switch can be removed from the pulse waveform as the pulse energy dependent physical quantity. And adopted. Further, the time interval of the tail portion after the energization is stopped is also very short compared to the pulse width of the laser pulse, and the light intensity of the tail portion is drastically lowered with the passage of time, so that the integral of the pulse waveform of the tail portion can be removed. The value is used as the pulse energy dependent physical quantity. In this way, the integral value of the main portion of the pulse waveform can be used as the pulse energy dependent physical quantity.
圖3A為表示脈衝寬度在恆定的條件下的雷射振盪器20的放電電壓與脈衝能量的關係之圖表。若放電電壓變高,則向雷射振盪器20投入之高頻電力變大。若放電電壓變高且投入之高頻電力變大,則更強地激勵雷射介質。其結果,脈衝能量變高。因此,放電電壓、高頻電力等能夠稱為激勵強度。Fig. 3A is a graph showing the relationship between the discharge voltage of the laser oscillator 20 and the pulse energy under the condition that the pulse width is constant. When the discharge voltage is increased, the high-frequency power input to the laser oscillator 20 is increased. When the discharge voltage becomes high and the input high-frequency power becomes large, the laser medium is excited more strongly. As a result, the pulse energy becomes high. Therefore, the discharge voltage, high frequency power, and the like can be referred to as excitation intensity.
圖3B為表示放電電壓與累積時間的關係之圖表。若放電電壓變高,則雷射介質的激勵狀態更早地達到振盪閾值,因此累積時間變短。Fig. 3B is a graph showing the relationship between the discharge voltage and the accumulation time. If the discharge voltage becomes high, the excitation state of the laser medium reaches the oscillation threshold earlier, and thus the accumulation time becomes shorter.
圖3C為表示脈衝寬度在恆定的條件下的累積時間與脈衝能量的關係之圖表。從圖3A所示之放電電壓與脈衝能量的關係及圖3B所示之放電電壓與累積時間的關係可知,隨著累積時間變長,脈衝能量降低。相反地,若累積時間變短,則脈衝能量變大。Fig. 3C is a graph showing the relationship between the accumulation time and the pulse energy under the condition that the pulse width is constant. From the relationship between the discharge voltage and the pulse energy shown in FIG. 3A and the relationship between the discharge voltage and the accumulation time shown in FIG. 3B, it is understood that the pulse energy is lowered as the accumulation time becomes longer. Conversely, if the accumulation time becomes shorter, the pulse energy becomes larger.
在圖3A~圖3C中,作為一例,示出了累積時間因放電電壓而發生變化之例子,但使累積時間發生變化之因素並非僅只是放電電壓。累積時間亦因其他的因素而發生變化,但脈衝寬度在恆定的條件下,通常,如圖3C所示,示出隨著累積時間變長,脈衝能量降低之傾向。In FIGS. 3A to 3C, an example in which the accumulation time changes due to the discharge voltage is shown as an example. However, the factor that changes the accumulation time is not only the discharge voltage. The accumulation time is also changed by other factors, but under the condition that the pulse width is constant, generally, as shown in Fig. 3C, the tendency of the pulse energy to decrease as the accumulation time becomes longer is shown.
圖4A為基於實施例之雷射控制裝置30的框圖的一例。雷射控制裝置30包括:雷射脈衝檢測部31、訊號發送部32、脈衝寬度調整部33、及記憶部34。FIG. 4A is an example of a block diagram of the laser control device 30 according to the embodiment. The laser control device 30 includes a laser pulse detecting unit 31, a signal transmitting unit 32, a pulse width adjusting unit 33, and a memory unit 34.
雷射脈衝檢測部31接收來自光檢測器26的檢測訊號S1,並檢測雷射脈衝的上升時刻。訊號發送部32向雷射振盪器20發送振盪指令訊號S0。The laser pulse detecting unit 31 receives the detection signal S1 from the photodetector 26 and detects the rising timing of the laser pulse. The signal transmitting unit 32 transmits the oscillation command signal S0 to the laser oscillator 20.
在記憶部34中記憶有累積時間的測定值與脈衝寬度的指令值的對應關係。The memory unit 34 stores a correspondence relationship between the measured value of the accumulated time and the command value of the pulse width.
圖4B為以圖表表示記憶於記憶部34中之累積時間的測定值與脈衝寬度的指令值的對應關係之圖。當累積時間的測定值為基準值BUref 時,脈衝寬度的指令值與基準值PWref 建立對應關聯。隨著累積時間的測定值變得比基準值BUref 長,脈衝寬度的指令值變得比基準值PWref 長,並且以隨著累積時間的測定值變得比基準值BUref 短,脈衝寬度PW的指令值變得比基準值PWref 短之方式,而定義兩者的對應關係。4B is a graph showing the correspondence relationship between the measured value of the accumulated time stored in the memory unit 34 and the command value of the pulse width. When the measured value of the accumulated time is the reference value BU ref , the command value of the pulse width is associated with the reference value PW ref . As the measured value of the accumulation time becomes longer than the reference value BU ref , the command value of the pulse width becomes longer than the reference value PW ref , and becomes shorter than the reference value BU ref as the measured value of the cumulative time becomes shorter, the pulse width The command value of the PW becomes shorter than the reference value PW ref , and the correspondence between the two is defined.
脈衝寬度調整部33(圖4A)從訊號發送部32獲取表示振盪指令訊號S0的上升時間點(圖2的t0)之資訊,並從雷射脈衝檢測部31獲取表示雷射脈衝的上升時間點(圖2的t1)之資訊。脈衝寬度調整部33從所獲取之該等資訊求出累積時間(圖2),並將其設為累積時間的測定值。而且,依據累積時間的測定值及記憶於記憶部34中之對應關係,計算雷射脈衝的脈衝寬度的指令值。The pulse width adjusting unit 33 (FIG. 4A) acquires information indicating the rising time point (t0 of FIG. 2) of the oscillation command signal S0 from the signal transmitting unit 32, and acquires the rising time point indicating the laser pulse from the laser pulse detecting unit 31. (t1 of Figure 2) information. The pulse width adjustment unit 33 obtains the accumulation time (FIG. 2) from the acquired information, and sets it as the measurement value of the accumulation time. Then, the command value of the pulse width of the laser pulse is calculated based on the measured value of the accumulated time and the correspondence relationship stored in the memory unit 34.
訊號發送部32獲取由脈衝寬度調整部33計算之脈衝寬度的指令值。而且,訊號發送部32以當前輸出之雷射脈衝的脈衝寬度與脈衝寬度的指令值一致之方式,使向雷射振盪器20發送之振盪指令訊號S0(圖2)下降。藉此,從雷射振盪器20輸出之雷射脈衝的脈衝寬度與指令值大致一致。The signal transmitting unit 32 acquires the command value of the pulse width calculated by the pulse width adjusting unit 33. Further, the signal transmitting unit 32 lowers the oscillation command signal S0 (FIG. 2) transmitted to the laser oscillator 20 so that the pulse width of the currently output laser pulse coincides with the command value of the pulse width. Thereby, the pulse width of the laser pulse output from the laser oscillator 20 substantially coincides with the command value.
圖5為基於實施例之雷射控制裝置30(圖4A)所執行之處理的流程圖。
訊號發送部32對雷射振盪器20發送振盪開始指令(步驟SA1)。具體而言,使振盪指令訊號S0(圖2)上升。藉此,從雷射振盪器20輸出之雷射光束上升。雷射脈衝檢測部31(圖4)獲取檢測訊號S1(圖2),並檢測雷射脈衝的上升(步驟SA2)。FIG. 5 is a flow chart of the processing performed by the laser control device 30 (FIG. 4A) based on the embodiment.
The signal transmitting unit 32 transmits an oscillation start command to the laser oscillator 20 (step SA1). Specifically, the oscillation command signal S0 (Fig. 2) is raised. Thereby, the laser beam output from the laser oscillator 20 rises. The laser pulse detecting unit 31 (Fig. 4) acquires the detection signal S1 (Fig. 2) and detects the rise of the laser pulse (step SA2).
若檢測到雷射光束的上升,則脈衝寬度調整部33計算累積時間的測定值(步驟SA3)。而且,脈衝寬度調整部33依據累積時間的測定值,參閱記憶於記憶部34中之對應關係而計算脈衝寬度的指令值(步驟SA4)。之後,訊號發送部32以當前的雷射脈衝的脈衝寬度與指令值一致之方式,對雷射振盪器20發送振盪停止指令(步驟SA5)。具體而言,使振盪指令訊號S0(圖2)下降。When the rise of the laser beam is detected, the pulse width adjustment unit 33 calculates the measured value of the accumulation time (step SA3). Further, the pulse width adjusting unit 33 calculates a command value of the pulse width by referring to the correspondence relationship stored in the memory unit 34 based on the measured value of the accumulated time (step SA4). Thereafter, the signal transmitting unit 32 transmits an oscillation stop command to the laser oscillator 20 such that the pulse width of the current laser pulse coincides with the command value (step SA5). Specifically, the oscillation command signal S0 (Fig. 2) is lowered.
直至雷射加工結束為止,重複從步驟SA1至步驟SA5為止的處理(步驟SA6)。The processing from step SA1 to step SA5 is repeated until the end of the laser processing (step SA6).
圖6為表示步驟SA4(圖5)的處理之流程圖。首先,脈衝寬度調整部33將累積時間的測定值與基準值BUref(圖4B)進行比較(步驟SA41)。而且,脈衝寬度調整部33依據比較結果及記憶於記憶部34中之對應關係,計算脈衝寬度的指令值(步驟SA42)。Fig. 6 is a flow chart showing the processing of step SA4 (Fig. 5). First, the pulse width adjustment unit 33 compares the measured value of the accumulated time with the reference value BUref (FIG. 4B) (step SA41). Further, the pulse width adjustment unit 33 calculates a command value of the pulse width based on the comparison result and the correspondence relationship stored in the storage unit 34 (step SA42).
接著,對藉由以基於上述實施例之雷射控制裝置30控制雷射加工裝置而得到之優異之效果進行說明。Next, an excellent effect obtained by controlling the laser processing apparatus by the laser control device 30 according to the above embodiment will be described.
如圖3C所示,在二氧化碳雷射振盪器等的脈衝雷射振盪器中,示出即便脈衝寬度恆定,亦會隨著累積時間變長而脈衝能量降低之傾向。在實施例中,如圖4B所示,藉由隨著累積時間的測定值變長而加長當前輸出之雷射脈衝的脈衝寬度的指令值,從而補償脈衝能量的降低。因此,與以脈衝寬度變得恆定之方式進行控制之情況相比,能夠減少脈衝能量的偏差。As shown in FIG. 3C, in a pulsed laser oscillator such as a carbon dioxide laser oscillator, it is shown that even if the pulse width is constant, the pulse energy tends to decrease as the accumulation time becomes longer. In the embodiment, as shown in FIG. 4B, the decrease in the pulse energy is compensated by lengthening the command value of the pulse width of the currently output laser pulse as the measured value of the accumulation time becomes longer. Therefore, the variation of the pulse energy can be reduced as compared with the case where the control is performed such that the pulse width becomes constant.
接著,參閱圖7A及圖7B,對藉由評價實驗來確認藉由使用基於上述實施例之雷射控制裝置30而得到之效果而得之結果進行說明。Next, the results obtained by using the laser control device 30 according to the above embodiment will be confirmed by an evaluation experiment with reference to FIGS. 7A and 7B.
圖7A為表示不依賴於累積時間而將脈衝寬度設為恆定時的累積時間的測定值與脈衝能量的測定值的關係之圖表。横軸以任意單位表示累積時間,縱軸以任意單位表示脈衝能量。以1個圓圈記號來表示與1個雷射脈衝有關之測定值。可知,隨著累積時間變長而得到脈衝能量降低之傾向。FIG. 7A is a graph showing the relationship between the measured value of the accumulated time and the measured value of the pulse energy when the pulse width is made constant regardless of the accumulation time. The horizontal axis represents the accumulation time in arbitrary units, and the vertical axis represents the pulse energy in arbitrary units. The measured value associated with one laser pulse is indicated by one circle mark. It can be seen that as the accumulation time becomes longer, the pulse energy tends to decrease.
圖7B為表示使用了基於上述實施例之雷射控制裝置30時的累積時間的測定值與脈衝能量的測定值的關係之圖表。此時的脈衝能量的分布的標準偏差小於圖7A所示之脈衝能量的標準偏差。確認到,藉由使用基於實施例之雷射控制裝置30,脈衝能量的偏差變小。Fig. 7B is a graph showing the relationship between the measured value of the cumulative time and the measured value of the pulse energy when the laser control device 30 according to the above-described embodiment is used. The standard deviation of the distribution of the pulse energy at this time is smaller than the standard deviation of the pulse energy shown in Fig. 7A. It is confirmed that the deviation of the pulse energy becomes small by using the laser control device 30 according to the embodiment.
接著,參閱圖8A~圖12,對基於另一實施例之雷射控制裝置進行說明。以下,對基於與圖1~圖7B所示之實施例之雷射控制裝置相同的構造,省略說明。在本實施例中,不僅使雷射脈衝的脈衝寬度發生變化,而且使向雷射振盪器20賦予之激勵強度發生變化。為了使激勵強度發生變化,例如可以使向放電電極施加之放電電壓的大小發生變化,亦可以使向放電電極供給之高頻電流的能率(Duty)發生變化。在以下的說明中,藉由使放電電壓發生變化,來使激勵強度發生變化。Next, a laser control device according to another embodiment will be described with reference to Figs. 8A to 12 . Hereinafter, the description of the same structure as that of the laser control device according to the embodiment shown in FIGS. 1 to 7B will be omitted. In the present embodiment, not only the pulse width of the laser pulse is changed but also the excitation intensity given to the laser oscillator 20 is changed. In order to change the excitation intensity, for example, the magnitude of the discharge voltage applied to the discharge electrode may be changed, and the energy rate (Duty) of the high-frequency current supplied to the discharge electrode may be changed. In the following description, the excitation intensity is changed by changing the discharge voltage.
圖8A為基於本實施例之雷射控制裝置30的框圖。基於本實施例之雷射控制裝置30除了基於圖4A所示之實施例之雷射控制裝置30的各部分之外,還具有平均輸出計算部35及平均輸出調整部36。而且,在記憶部34中記憶有平均輸出的測定值與激勵強度的指令值的對應關係。FIG. 8A is a block diagram of the laser control device 30 based on the present embodiment. The laser control device 30 according to the present embodiment has an average output calculation unit 35 and an average output adjustment unit 36 in addition to the respective portions of the laser control device 30 according to the embodiment shown in FIG. 4A. Further, the memory unit 34 stores a correspondence relationship between the measured value of the average output and the command value of the excitation intensity.
圖8B為表示平均輸出的測定值與放電電壓的指令值的對應關係之圖表。當平均輸出的測定值為基準值Pref 時,放電電壓的指令值與基準值Vref 對應。示出隨著平均輸出的測定值變得比基準值Pref 高而放電電壓的指令值降低之傾向。相反地,示出隨著平均輸出的測定值變得比基準值Pref 低而放電電壓的指令值變高之傾向。Fig. 8B is a graph showing the correspondence relationship between the measured value of the average output and the command value of the discharge voltage. When the measured value of the average output is the reference value P ref , the command value of the discharge voltage corresponds to the reference value V ref . It is shown that the measured value of the average output is higher than the reference value P ref and the command value of the discharge voltage is lowered. Conversely, it is shown that the measured value of the discharge voltage becomes higher as the measured value of the average output becomes lower than the reference value P ref .
平均輸出計算部35(圖8A)依據來自光檢測器26的檢測訊號S1(圖2),計算某一恆定期間的平均輸出,而將其設為平均輸出的測定值。在恆定期間所獲取之脈衝波形的積分值的合計值除以恆定期間的長度,藉此,可以計算出平均輸出。The average output calculation unit 35 (Fig. 8A) calculates the average output of a certain constant period based on the detection signal S1 (Fig. 2) from the photodetector 26, and sets it as the measured value of the average output. The total value of the integrated values of the pulse waveforms acquired during the constant period is divided by the length of the constant period, whereby the average output can be calculated.
平均輸出調整部36依據平均輸出的測定值與記憶於記憶部34中之對應關係(圖8B),計算放電電壓的指令值。例如,隨著平均輸出的測定值變得比基準值Pref 大,使放電電壓的指令值比基準值Vref 小,且隨著平均輸出的測定值變得比基準值Pref 小,使放電電壓的指令值比基準值Vref 大。The average output adjustment unit 36 calculates a command value of the discharge voltage based on the correlation between the measured value of the average output and the memory (34B) stored in the memory unit 34. For example, as the measured value of the average output becomes larger than the reference value P ref , the command value of the discharge voltage is made smaller than the reference value V ref , and as the measured value of the average output becomes smaller than the reference value P ref , the discharge is made The command value of the voltage is larger than the reference value V ref .
訊號發送部32依據由平均輸出調整部36求出之放電電壓的指令值,向雷射振盪器20發送指示放電電壓之訊號S2。雷射振盪器20在激勵雷射介質時,向放電電極施加由訊號S2指示之放電電壓。The signal transmitting unit 32 transmits a signal S2 indicating the discharge voltage to the laser oscillator 20 based on the command value of the discharge voltage obtained by the average output adjusting unit 36. When the laser oscillator 20 excites the laser medium, the discharge voltage indicated by the signal S2 is applied to the discharge electrode.
圖9為基於本實施例之雷射控制裝置30(圖8A)控制放電電壓之處理的流程圖。Fig. 9 is a flow chart showing the process of controlling the discharge voltage by the laser control device 30 (Fig. 8A) according to the present embodiment.
若啟動雷射控制裝置30,則將放電電壓的指令值設定為基準值Vref (步驟SB1)。在輸出雷射光束時,依據當前的放電電壓的指令值,對雷射振盪器20進行激勵(步驟SB2)。放電電壓的指令值在恆定期間被固定。將固定有放電電壓的指令值之恆定期間設為「放電電壓固定期間」。在放電電壓固定期間內,亦按雷射脈衝進行基於圖4所示之累積時間之脈衝寬度的調整。When the laser control device 30 is activated, the command value of the discharge voltage is set to the reference value V ref (step SB1). When the laser beam is output, the laser oscillator 20 is excited in accordance with the command value of the current discharge voltage (step SB2). The command value of the discharge voltage is fixed during a constant period. The constant period in which the command value of the discharge voltage is fixed is referred to as "discharge voltage fixed period". During the period in which the discharge voltage is fixed, the adjustment of the pulse width based on the accumulation time shown in FIG. 4 is also performed in accordance with the laser pulse.
若在設定放電電壓的指令值之後經過放電電壓固定期間,則平均輸出計算部35(圖8A)計算放電電壓固定期間的平均輸出,而將其設為平均輸出的測定值(步驟SB3)。平均輸出調整部36(圖8A)依據平均輸出的測定值與記憶於記憶部34中的對應關係(圖8B)來更新放電電壓的指令值(步驟SB4)。訊號發送部32向雷射振盪器20發送所更新之指令值。直至雷射加工結束為止,重複從步驟SB2至步驟SB4為止的處理(步驟SB5)。When the discharge voltage is fixed after the command value of the discharge voltage is set, the average output calculation unit 35 (FIG. 8A) calculates the average output of the discharge voltage constant period, and sets it as the average output measurement value (step SB3). The average output adjustment unit 36 (FIG. 8A) updates the command value of the discharge voltage based on the measured value of the average output and the correspondence relationship (FIG. 8B) stored in the memory unit 34 (step SB4). The signal transmitting unit 32 transmits the updated command value to the laser oscillator 20. Until the end of the laser processing, the processing from step SB2 to step SB4 is repeated (step SB5).
圖10為圖5的步驟SA4的流程圖。步驟SA41及步驟SA42與圖6所示之實施例所對應之步驟相同。在圖6所示之實施例中,累積時間的基準值BUref 不變。本實施例中,週期性地將累積時間的基準值BUref 更新為累積時間的測定值。例如,在計算了脈衝寬度的指令值之後,若從累積時間的基準值BUref 的前一個更新經過更新週期(步驟SA43),則將累積時間的基準值BUref 更新為前一個一週期的雷射脈衝的累積時間的平均值。在更新了累積時間的基準值BUref 之後,執行步驟SA5(圖5)。FIG. 10 is a flowchart of step SA4 of FIG. 5. Steps SA41 and SA42 are the same as the steps corresponding to the embodiment shown in FIG. 6. In the embodiment shown in Fig. 6, the reference value BU ref of the accumulation time does not change. In the present embodiment, the reference value BU ref of the accumulation time is periodically updated to the measured value of the accumulation time. For example, after the command value of the pulse width is calculated, if the update period is passed from the previous update of the reference value BU ref of the accumulation time (step SA43), the reference value BU ref of the accumulation time is updated to the mine of the previous cycle. The average of the cumulative time of the shot pulses. After the reference value BU ref of the accumulation time is updated, step SA5 (Fig. 5) is performed.
接著,在對藉由採用基於圖8A~圖10的實施例之雷射控制裝置30而得到之優異之效果進行說明之前,參閱圖11,對將累積時間的基準值設為不變之情況,亦即對不執行步驟SA43及步驟SA44(圖10)之情況進行說明。Next, before describing the excellent effects obtained by using the laser control device 30 based on the embodiment of FIGS. 8A to 10, referring to FIG. 11, the case where the reference value of the accumulation time is set to be unchanged, That is, the case where step SA43 and step SA44 (FIG. 10) are not performed will be described.
圖11為表示將累積時間的基準值BUref 設為不變時的放電電壓的指令值、雷射振盪器20的平均輸出的測定值、累積時間的測定值及脈衝寬度的指令值的時間變化的一例之圖表。另外,累積時間的測定值及脈衝寬度的指令值按雷射脈衝而發生變化,但在圖11中,示出累積時間的基準值BUref 的每一更新週期的平均值。在初始狀態下,放電電壓的指令值被設定為基準值Vref ,脈衝寬度的指令值被設定為基準值PWref 。平均輸出的測定值與基準值Pref 大致一致,累積時間的測定值與基準值BUref 大致一致。11 is a timing chart showing a command value of a discharge voltage when the reference value BU ref of the accumulation time is constant, a measured value of the average output of the laser oscillator 20, a measured value of the accumulated time, and a command value of the pulse width. An example of a chart. Further, the measured value of the accumulated time and the command value of the pulse width are changed by the laser pulse. However, in FIG. 11, the average value of each update period of the reference value BU ref of the accumulated time is shown. In the initial state, the command value of the discharge voltage is set to the reference value V ref , and the command value of the pulse width is set as the reference value PW ref . The measured value of the average output substantially coincides with the reference value P ref , and the measured value of the accumulated time substantially coincides with the reference value BU ref .
若平均輸出的測定值因某些因素而降低至比基準值Pref 低(t10),則進行使放電電壓的指令值上升之控制(t11)(圖9的步驟SB4)。若放電電壓的指令值上升,則雷射振盪器20的輸出變高,因此平均輸出的測定值上升(t12),並且累積時間的測定值變短(t13)。When the measured value of the average output is lowered to be lower than the reference value P ref by some factors (t10), control (t11) of increasing the command value of the discharge voltage is performed (step SB4 of FIG. 9). When the command value of the discharge voltage rises, the output of the laser oscillator 20 becomes high, so that the measured value of the average output rises (t12), and the measured value of the accumulated time becomes short (t13).
若累積時間的測定值變得比基準值BUref 短,則進行使脈衝寬度的指令值比基準值PWref 短之控制(t14)(圖5的步驟SA4)。脈衝寬度的指令值變短,將作用於降低平均輸出之方向。因此,平均輸出的測定值降低(t15)。若平均輸出的測定值降低,則放電電壓的指令值與在時刻t10時同樣地上升(t16)。其結果,平均輸出的測定值返回基準值Pref (t17)。放電電壓的上升作用於縮短累積時間之方向,因此累積時間的測定值進一步變短(t18)。若累積時間的測定值變短,則累積時間的基準值BUref 與測定值之差擴大,因此脈衝寬度的指令值進一步變短(t19)。When the measured value of the accumulated time becomes shorter than the reference value BU ref , the control (t14) of making the command value of the pulse width shorter than the reference value PW ref is performed (step SA4 of FIG. 5 ). The pulse width command value becomes shorter and will act to reduce the direction of the average output. Therefore, the measured value of the average output is lowered (t15). When the measured value of the average output decreases, the command value of the discharge voltage rises in the same manner as at time t10 (t16). As a result, the measured value of the average output returns to the reference value Pref (t17). The rise of the discharge voltage acts in the direction of shortening the accumulation time, so the measured value of the accumulation time is further shortened (t18). When the measured value of the accumulated time is shortened, the difference between the reference value BU ref of the accumulated time and the measured value is expanded, and therefore the command value of the pulse width is further shortened (t19).
如此,藉由持續執行縮短脈衝寬度的指令值之處理,脈衝寬度的指令值達到容許下限值PWmin 。在脈衝寬度的指令值達到容許下限值PWmin 之後,脈衝寬度的指令值被固定在容許下限值PWmin 。如此,有時即便倂用放電電壓的調整及脈衝寬度的調整,亦會導致調整脈衝寬度之功能無法起作用。這是因為,相比由放電電壓的變化而引起之脈衝能量的變化,從放電電壓的變化至經由累積時間的變化及脈衝寬度的調整之脈衝能量的變化為止的增益更大。若調整脈衝寬度之功能不起作用,則會導致無法得到抑制脈衝能量的偏差之效果。Thus, the processing performed by continuously shortening the pulse width of the command value, the command pulse width value reaches the allowable lower limit PW min. After the pulse width command value reaches the allowable lower limit PW min, the pulse width of the command value is fixed at the allowable lower limit value PW min. As a result, even if the discharge voltage is adjusted and the pulse width is adjusted, the function of adjusting the pulse width may not function. This is because the gain of the pulse energy due to the change in the discharge voltage is larger from the change in the discharge voltage to the change in the pulse energy through the change in the accumulation time and the adjustment of the pulse width. If the function of adjusting the pulse width does not work, the effect of suppressing variations in pulse energy cannot be obtained.
圖12為表示使用了基於本實施例之雷射控制裝置30時的放電電壓的指令值、雷射振盪器20的平均輸出的測定值、累積時間的測定值及脈衝寬度的指令值的時間變化的一例之圖表。從時刻t10至t17為止的放電電壓的指令值、雷射振盪器20的平均輸出的測定值、累積時間的測定值及脈衝寬度的指令值的時間變化與圖11所示之例子相同。Fig. 12 is a view showing temporal changes of a command value of a discharge voltage, a measured value of an average output of the laser oscillator 20, a measured value of an accumulated time, and a command value of a pulse width when the laser control device 30 according to the present embodiment is used. An example of a chart. The time change of the command value of the discharge voltage from the time t10 to t17, the measured value of the average output of the laser oscillator 20, the measured value of the cumulative time, and the command value of the pulse width is the same as the example shown in FIG.
若放電電壓上升(t16),則累積時間的測定值變短(t21)。此時,將累積時間的基準值BUref 更新為前一個週期的測定值的平均值(步驟SA44)。在圖12中,以虛線表示累積時間的基準值BUref 。更新累積時間的基準值BUref ,因此例如時刻t21的累積時間的測定值和基準值BUref 之差與時刻t13的累積時間的測定值和基準值BUref 之差大致相等。因此,脈衝寬度的指令值實質上不發生變化(t22)。When the discharge voltage rises (t16), the measured value of the accumulation time becomes shorter (t21). At this time, the reference value BU ref of the accumulation time is updated to the average value of the measured values of the previous cycle (step SA44). In Fig. 12, the reference value BU ref of the accumulation time is indicated by a broken line. Update the accumulated value of the time reference BU ref, and thus, for example, the measured value of the reference cumulative time difference between the time t21 BU ref value of the cumulative time difference between the time t13 BU ref of the measured value and the reference value are substantially equal. Therefore, the command value of the pulse width does not substantially change (t22).
若累積時間的基準值BUref 的更新週期從時刻t21經過,則累積時間的基準值BUref 被更新(t23),累積時間的測定值變得與累積時間的基準值BUref 大致相等。因此,進行使脈衝寬度的指令值大致返回基準值PWref 之控制(t24)(步驟SA4)。加長脈衝寬度之控制作用於提高平均輸出之方向,因此平均輸出的測定值上升(t25)。When the update period of the reference value BU ref of the accumulation time elapses from the time t21, the reference value BU ref of the accumulation time is updated (t23), and the measured value of the accumulation time becomes substantially equal to the reference value BU ref of the accumulation time. Therefore, control (t24) of substantially returning the command value of the pulse width to the reference value PW ref is performed (step SA4). The control of the extended pulse width acts to increase the direction of the average output, so the measured value of the average output rises (t25).
若平均輸出的測定值上升,則進行降低放電電壓的指令值之控制(t26)(圖9的步驟SB4)。若放電電壓的指令值降低,則平均輸出的測定值降低(t27),並且累積時間的測定值變長(t28)。累積時間的基準值BUref 被更新為前一個週期的累積時間的測定值的平均值,因此累積時間的測定值變得比基準值BUref 長。因此,進行加長脈衝寬度的指令值之控制(t29)(圖10的步驟SA42)。When the measured value of the average output rises, control of the command value for decreasing the discharge voltage is performed (t26) (step SB4 of FIG. 9). When the command value of the discharge voltage is lowered, the measured value of the average output is lowered (t27), and the measured value of the accumulated time becomes long (t28). The reference value BU ref of the accumulation time is updated to the average value of the measured values of the accumulation time of the previous cycle, and thus the measured value of the accumulation time becomes longer than the reference value BU ref . Therefore, control of the command value for lengthening the pulse width is performed (t29) (step SA42 of Fig. 10).
若脈衝寬度的指令值變長,則平均輸出的測定值與在時刻t24時同樣地變大(t30),之後,進行降低放電電壓的指令值之控制(t31)。其結果,平均輸出的測定值降低(t32),並且累積時間的測定值變長(t33)。累積時間的基準值BUref 被更新為前一個週期的累積時間的測定值的平均值,因此累積時間的測定值和基準值BUref 之差與在時刻t28時的累積時間的測定值和基準值BUref 之差變得大致相等。其結果,脈衝寬度的指令值實質上未發生變化(t34)。When the command value of the pulse width becomes long, the measured value of the average output becomes larger as in the case of time t24 (t30), and thereafter, the control value of the discharge voltage is controlled (t31). As a result, the measured value of the average output is lowered (t32), and the measured value of the cumulative time becomes long (t33). The reference value BU ref of the accumulation time is updated to the average value of the measured values of the accumulation time of the previous cycle, and therefore the difference between the measured value of the accumulated time and the reference value BU ref and the measured value and the reference value of the accumulated time at the time t28 The difference between BU ref becomes approximately equal. As a result, the command value of the pulse width does not substantially change (t34).
如此,本實施例中,依據測定值更新累積時間的基準值BUref ,因此能夠防止脈衝寬度的指令值固定在容許下限值PWmin 。因此,即便係併用放電電壓的調整及脈衝寬度的調整之情況下,亦能夠有效地使調整脈衝寬度之功能起作用。因此,能夠得到輸出穩定及脈衝能量的偏差降低這兩個效果。As described above, in the present embodiment, since the reference value BU ref of the accumulation time is updated based on the measured value, it is possible to prevent the command value of the pulse width from being fixed to the allowable lower limit value PW min . Therefore, even when the discharge voltage is adjusted and the pulse width is adjusted in combination, the function of adjusting the pulse width can be effectively made effective. Therefore, it is possible to obtain two effects of stable output and reduced deviation of pulse energy.
上述各實施例係例示,當然亦能夠進行不同之實施例中示出之構造的局部的替換或組合。不會按每一實施例而提及複數個實施例的基於相同的構造之相同的作用效果。而且,本發明並不限制於上述實施例。例如,能夠進行各種變更、改良、組合等,這對本案發明所屬技術領域中具有通常知識者來講是顯而易見的。The various embodiments described above are illustrative, and of course, a partial substitution or combination of the configurations shown in the different embodiments. The same effects of the plural embodiments based on the same configuration will not be mentioned in every embodiment. Moreover, the invention is not limited to the above embodiments. For example, various changes, modifications, combinations, and the like can be made, which will be apparent to those of ordinary skill in the art to which the invention pertains.
20‧‧‧雷射振盪器20‧‧‧Laser oscillator
21‧‧‧第1光學系統 21‧‧‧1st optical system
22‧‧‧反射鏡 22‧‧‧Mirror
23‧‧‧第2光學系統 23‧‧‧2nd optical system
24‧‧‧載臺 24‧‧‧ stage
25‧‧‧加工對象物 25‧‧‧Processing objects
26‧‧‧光檢測器 26‧‧‧Photodetector
30‧‧‧雷射控制裝置 30‧‧‧Road control unit
31‧‧‧雷射脈衝檢測部 31‧‧‧Laser pulse detection unit
32‧‧‧訊號發送部 32‧‧‧Signal Transmission Department
33‧‧‧脈衝寬度調整部 33‧‧‧ Pulse width adjustment unit
34‧‧‧記憶部 34‧‧‧Memory Department
35‧‧‧平均輸出計算部 35‧‧‧Average Output Calculation Department
36‧‧‧平均輸出調整部 36‧‧‧Average Output Adjustment Department
[圖1] 圖1為搭載了基於實施例之雷射控制裝置之雷射加工裝置的概略圖。Fig. 1 is a schematic view showing a laser processing apparatus equipped with a laser control device according to an embodiment.
[圖2] 圖2為表示從基於實施例之雷射控制裝置被發送至雷射振盪器之振盪指令訊號S0及從光檢測器向雷射控制裝置賦予之檢測訊號S1的波形之圖表。 2 is a graph showing waveforms of an oscillation command signal S0 transmitted from a laser control device according to an embodiment to a laser oscillator and a detection signal S1 supplied from a photodetector to a laser control device.
[圖3] 圖3A為表示脈衝寬度在恆定的條件下的放電電壓與脈衝能量的關係之圖表,圖3B為表示放電電壓與累積時間的關係之圖表,圖3C為表示脈衝寬度在恆定的條件下的累積時間與脈衝能量的關係之圖表。 3] FIG. 3A is a graph showing the relationship between the discharge voltage and the pulse energy under the condition that the pulse width is constant, FIG. 3B is a graph showing the relationship between the discharge voltage and the accumulation time, and FIG. 3C is a graph showing the condition that the pulse width is constant. A graph of the relationship between cumulative time and pulse energy.
[圖4] 圖4A為基於實施例之雷射控制裝置的框圖的一例,圖4B為以圖表表示記憶於基於實施例之雷射控制裝置的記憶部中之累積時間的測定值與脈衝寬度的指令值的對應關係之圖。 4A is an example of a block diagram of a laser control apparatus according to an embodiment, and FIG. 4B is a graph showing measured values and pulse widths of accumulated time stored in a memory section of the laser control apparatus according to the embodiment. A diagram of the correspondence between the command values.
[圖5] 圖5為基於實施例之雷射控制裝置所執行之處理的流程圖。 Fig. 5 is a flowchart of processing performed by a laser control apparatus according to an embodiment.
[圖6] 圖6為表示步驟SA4(圖5)的處理之流程圖。 Fig. 6 is a flow chart showing the processing of step SA4 (Fig. 5).
[圖7] 圖7A為表示不依賴於累積時間而將脈衝寬度設為恆定時的累積時間的測定值與脈衝能量的測定值的關係之圖表,圖7B為表示使用了基於實施例之雷射控制裝置時的累積時間的測定值與脈衝能量的測定值的關係之圖表。 7A is a graph showing a relationship between a measured value of an accumulated time and a measured value of pulse energy when the pulse width is constant irrespective of the accumulation time, and FIG. 7B is a view showing a laser using the embodiment. A graph showing the relationship between the measured value of the accumulated time and the measured value of the pulse energy when the device is controlled.
[圖8] 圖8A為基於另一實施例之雷射控制裝置的框圖,圖8B為表示平均輸出的測定值與放電電壓的指令值的對應關係之圖表。 8] Fig. 8A is a block diagram of a laser control apparatus according to another embodiment, and Fig. 8B is a graph showing a correspondence relationship between a measured value of an average output and a command value of a discharge voltage.
[圖9] 圖9為基於圖8A所示之實施例之雷射控制裝置控制放電電壓之處理的流程圖。 9] FIG. 9 is a flowchart of a process of controlling a discharge voltage by a laser control apparatus according to the embodiment shown in FIG. 8A.
[圖10] 圖10為基於圖8A所示之實施例之步驟SA4(圖5)的流程圖。 FIG. 10 is a flow chart based on step SA4 (FIG. 5) of the embodiment shown in FIG. 8A.
[圖11] 圖11為表示將累積時間的基準值設為不變時的放電電壓的指令值、雷射振盪器20的平均輸出的測定值、累積時間的測定值及脈衝寬度的指令值的時間變化的一例之圖表。 [Fig. 11] Fig. 11 is a view showing a command value of a discharge voltage when the reference value of the accumulation time is constant, a measured value of the average output of the laser oscillator 20, a measured value of the accumulated time, and a command value of the pulse width. A chart of an example of time change.
[圖12] 圖12為表示使用了基於圖8A所示之實施例之雷射控制裝置時的放電電壓的指令值、雷射振盪器的平均輸出的測定值、累積時間的測定值及脈衝寬度的指令值的時間變化的一例之圖表。 [Fig. 12] Fig. 12 is a view showing a command value of a discharge voltage, a measured value of an average output of a laser oscillator, a measured value of an accumulated time, and a pulse width when a laser control device based on the embodiment shown in Fig. 8A is used. A graph of an example of the time change of the command value.
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018013218A JP6957113B2 (en) | 2018-01-30 | 2018-01-30 | Laser control device |
JP2018-013218 | 2018-01-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201933706A true TW201933706A (en) | 2019-08-16 |
TWI750434B TWI750434B (en) | 2021-12-21 |
Family
ID=67443723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107146056A TWI750434B (en) | 2018-01-30 | 2018-12-20 | Laser control device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6957113B2 (en) |
KR (1) | KR102500651B1 (en) |
CN (1) | CN110091081B (en) |
TW (1) | TWI750434B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022063595A (en) * | 2020-10-12 | 2022-04-22 | 住友重機械工業株式会社 | Control device of laser processing machine, laser processing machine, and laser processing method |
JP7519333B2 (en) | 2021-07-02 | 2024-07-19 | 住友重機械工業株式会社 | Laser control device and laser pulse extraction method |
CN115686012B (en) * | 2022-10-31 | 2024-04-12 | 北京小米机器人技术有限公司 | Robot anti-disturbance method, device, equipment and medium |
CN118630567A (en) * | 2024-08-12 | 2024-09-10 | 深圳市安众电气有限公司 | Pulse width modulation energy feedback method |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5291505A (en) * | 1993-01-21 | 1994-03-01 | Hughes Aircraft Company | Active energy control for diode pumped laser systems using pulsewidth modulation |
US5339323A (en) * | 1993-04-30 | 1994-08-16 | Lumonics Corporation | Laser system for controlling emitted pulse energy |
US5982800A (en) * | 1997-04-23 | 1999-11-09 | Cymer, Inc. | Narrow band excimer laser |
JP2000126879A (en) * | 1998-10-26 | 2000-05-09 | Matsushita Electric Ind Co Ltd | Laser beam machining device and its control method |
JP3837626B2 (en) * | 1998-10-29 | 2006-10-25 | ミヤチテクノス株式会社 | Laser processing equipment |
JP4543272B2 (en) * | 2001-03-30 | 2010-09-15 | 澁谷工業株式会社 | Laser oscillation method |
WO2002090037A1 (en) * | 2001-05-09 | 2002-11-14 | Electro Scientific Industries, Inc. | Micromachining with high-energy, intra-cavity q-switched co2 laser pulses |
JP2007054853A (en) * | 2005-08-23 | 2007-03-08 | Sumitomo Heavy Ind Ltd | Laser beam machining device and machining method |
JP2011014685A (en) * | 2009-07-01 | 2011-01-20 | Sumitomo Heavy Ind Ltd | Laser irradiation device and laser irradiation method |
GB2485985B (en) * | 2010-11-30 | 2015-07-22 | Powerphotonic Ltd | Laser pulse generation method and apparatus |
JPWO2014010046A1 (en) * | 2012-07-11 | 2016-06-20 | 三菱電機株式会社 | Laser resonator control power supply, laser oscillator and laser oscillation system |
JP5988903B2 (en) * | 2013-03-19 | 2016-09-07 | 住友重機械工業株式会社 | Laser processing apparatus and laser processing method |
TWI523357B (en) * | 2013-03-19 | 2016-02-21 | Sumitomo Heavy Industries | Laser processing device and laser processing method |
JP5995767B2 (en) * | 2013-03-28 | 2016-09-21 | 住友重機械工業株式会社 | Laser processing apparatus and laser processing method |
JP2015153917A (en) * | 2014-02-17 | 2015-08-24 | 住友重機械工業株式会社 | Laser processing device |
JP6355496B2 (en) * | 2014-09-17 | 2018-07-11 | 住友重機械工業株式会社 | Laser processing apparatus and pulse laser beam output method |
WO2016080067A1 (en) * | 2014-11-19 | 2016-05-26 | 日立オートモティブシステムズ株式会社 | Drive device for fuel injection device |
-
2018
- 2018-01-30 JP JP2018013218A patent/JP6957113B2/en active Active
- 2018-12-20 TW TW107146056A patent/TWI750434B/en active
- 2018-12-27 KR KR1020180170029A patent/KR102500651B1/en active IP Right Grant
-
2019
- 2019-01-03 CN CN201910004435.6A patent/CN110091081B/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP6957113B2 (en) | 2021-11-02 |
CN110091081A (en) | 2019-08-06 |
TWI750434B (en) | 2021-12-21 |
CN110091081B (en) | 2021-03-12 |
JP2019130547A (en) | 2019-08-08 |
KR102500651B1 (en) | 2023-02-15 |
KR20190092254A (en) | 2019-08-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201933706A (en) | Laser control device capable of suppressing deviation of pulse energy | |
US7656913B2 (en) | Fiber pulse laser apparatus and method of controlling the same | |
TWI577482B (en) | Laser processing device and laser processing method | |
TWI523357B (en) | Laser processing device and laser processing method | |
JP5025391B2 (en) | Laser processing apparatus and processing method | |
JP2009279631A (en) | Laser beam machining controller and laser beam machining apparatus | |
JP5988903B2 (en) | Laser processing apparatus and laser processing method | |
JP4619146B2 (en) | Laser oscillator output correction method and laser oscillator | |
CN110091052B (en) | Evaluation device, evaluation method, and display device | |
JP5995767B2 (en) | Laser processing apparatus and laser processing method | |
JP2018099692A (en) | Laser processing device and laser processing method | |
WO2020235222A1 (en) | Passive q switching laser device, control method, and laser processing device | |
JP3400957B2 (en) | Laser synchronization pulse delay device and control method | |
US20050117614A1 (en) | Mode-locked laser method and apparatus | |
JP2000052069A (en) | Start up method of laser marking device, and its device | |
JP6370517B1 (en) | Laser processing equipment | |
JP2007287946A (en) | Q switch laser device and method for adjusting the q switch laser device | |
JP2010080957A (en) | Method for generating laser and pulsed laser emission | |
JP2007335900A (en) | Laser device, method of controlling power feed for the same, power feed control circuit for the same, and method of adjusting power feed control circuit for the same | |
JPH06237028A (en) | Laser monitor device | |
JP2001287056A (en) | Laser beam machining device | |
TW201531363A (en) | Apparatus for processing laser | |
JP2015095536A (en) | Pulse laser device | |
JP2003023198A (en) | Wavelength controller and controlling method for laser device | |
JP2016207758A (en) | Laser processing apparatus |