TWI523357B - Laser processing device and laser processing method - Google Patents
Laser processing device and laser processing method Download PDFInfo
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- TWI523357B TWI523357B TW103106477A TW103106477A TWI523357B TW I523357 B TWI523357 B TW I523357B TW 103106477 A TW103106477 A TW 103106477A TW 103106477 A TW103106477 A TW 103106477A TW I523357 B TWI523357 B TW I523357B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Description
本申請主張基於2013年3月19日申請之日本專利申請第2013-056217號,以及2013年3月28日申請之日本專利申請第2013-067746號的優先權。該申請的全部內容通過參閱援用於本說明書中。 The present application claims priority based on Japanese Patent Application No. 2013-056217, filed on March 19, 2013, and Japanese Patent Application No. 2013-067746, filed on March 28, 2013. The entire contents of this application are incorporated herein by reference.
本發明係有關一種射出脈衝雷射而進行雷射加工之雷射加工裝置以及雷射加工方法。 The present invention relates to a laser processing apparatus and a laser processing method for performing laser processing by emitting a pulsed laser.
在二氧化碳雷射等氣體雷射中,雷射介質氣體中的雜質等會影響放電。因此,射出之每個雷射脈衝的脈衝能量會發生偏差。將雷射脈衝用於鑽孔加工時,若脈衝能量發生偏差,則導致加工品質不一致。 In gas lasers such as carbon dioxide lasers, impurities in the laser medium gas may affect the discharge. Therefore, the pulse energy of each of the laser pulses emitted is deviated. When the laser pulse is used for drilling, if the pulse energy is deviated, the processing quality will be inconsistent.
下述專利文獻1中揭示出減少脈衝能量的偏差之雷射振盪方法。專利文獻1所揭示之方法中,在1次的脈衝激發中測定複數次從雷射振盪器射出之雷射光的能量值。將所測定之複數個能量值加總,預測藉由該脈衝激發所振盪之雷射光的總能量估計值。根據該總能量估計值控制激發時間。藉此,能夠使總能量值(脈衝能量)穩定。 Patent Document 1 listed below discloses a laser oscillation method that reduces variations in pulse energy. In the method disclosed in Patent Document 1, the energy value of the laser light emitted from the laser oscillator is measured in a plurality of pulse excitations. The measured plurality of energy values are summed to predict the total energy estimate of the oscillated laser light excited by the pulse. The excitation time is controlled based on the total energy estimate. Thereby, the total energy value (pulse energy) can be stabilized.
專利文獻1:日本特開2002-299736號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-299736
脈衝寬度比較長時,例如為數百μs左右時,即使從雷射振盪指令到雷射脈衝的上升為止的延遲時間有所偏差,亦能夠利用上述專利文獻1中公開之方法調節脈衝能量。然而,脈衝寬度較短時,例如為數十μs時,考慮到能量檢測靈敏度、運算時間,則很難控制激發時間。 When the pulse width is relatively long, for example, when it is about several hundred μs, the pulse energy can be adjusted by the method disclosed in Patent Document 1 even if the delay time from the laser oscillation command to the rise of the laser pulse is varied. However, when the pulse width is short, for example, several tens of μs, it is difficult to control the excitation time in consideration of the energy detection sensitivity and the calculation time.
本發明的目的為提供一種雷射加工裝置以及雷射加工方法,即使脈衝寬度較短時,亦能夠使每個脈衝的脈衝能量穩定。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a laser processing apparatus and a laser processing method capable of stabilizing the pulse energy of each pulse even when the pulse width is short.
依本發明的一觀點,提供一種雷射加工裝置,係具有:雷射光源,與從外部接收之雷射振盪開始觸發同步開始進行雷射振盪,並與雷射振盪停止觸發同步停止雷射振盪;檢測器,檢測取決於對前述雷射光源施加之電力以及從前述雷射光源射出之雷射脈衝的至少一方之物理量;以及 控制裝置,對前述雷射光源施加前述雷射振盪開始觸發,並且根據前述檢測器所檢測之前述物理量的檢測結果,對前述雷射光源施加前述振盪停止觸發。 According to an aspect of the present invention, a laser processing apparatus is provided, comprising: a laser light source, starting with a laser oscillation received from an external start to trigger a laser oscillation, and stopping the laser oscillation in synchronization with a laser oscillation stop trigger a detector that detects a physical quantity of at least one of a power applied to the aforementioned laser light source and a laser pulse emitted from the aforementioned laser light source; The control device applies the aforementioned laser oscillation start trigger to the laser light source, and applies the oscillation stop trigger to the laser light source based on the detection result of the physical quantity detected by the detector.
依本發明的另一觀點,提供一種雷射加工方法,係具有以下製程:對雷射光源施加從外部接收之振盪開始觸發之製程,該雷射光源是與前述振盪開始觸發同步開始進行雷射振盪,並與振盪停止觸發同步停止雷射振盪;檢測取決於對前述雷射光源施加之電力以及從前述雷射光源射出之雷射脈衝的至少一方之物理量之製程;以及根據前述物理量的檢測結果,對前述雷射光源施加前述振盪停止觸發之製程。 According to another aspect of the present invention, a laser processing method is provided, which has a process of applying an externally received oscillation start trigger to a laser light source, and the laser light source starts the laser in synchronization with the aforementioned oscillation start trigger. Oscillation, and stopping the laser oscillation in synchronization with the oscillation stop trigger; detecting a process depending on the power applied to the aforementioned laser light source and the physical quantity of at least one of the laser pulses emitted from the aforementioned laser light source; and the detection result according to the aforementioned physical quantity And applying the aforementioned oscillation stop triggering process to the aforementioned laser light source.
根據檢測器所檢測之物理量的檢測結果對雷射光源施加振盪停止觸發,藉此能使脈衝能量穩定。 The oscillation stop trigger is applied to the laser light source based on the detection result of the physical quantity detected by the detector, whereby the pulse energy can be stabilized.
1‧‧‧雷射光源 1‧‧‧Laser light source
10‧‧‧雷射振盪器 10‧‧‧Laser oscillator
11‧‧‧驅動電路 11‧‧‧Drive circuit
12‧‧‧光點位置穩定化光學系統 12‧‧‧ Spot Position Stabilization Optical System
13‧‧‧非球面透鏡 13‧‧‧Aspherical lens
14‧‧‧準直透鏡 14‧‧‧ Collimating lens
15‧‧‧光罩 15‧‧‧Photomask
16‧‧‧場透鏡 16‧‧ ‧ field lens
17‧‧‧反射鏡 17‧‧‧Mirror
18‧‧‧光束掃描器 18‧‧‧ Beam Scanner
19‧‧‧fθ透鏡 19‧‧‧fθ lens
20‧‧‧控制裝置 20‧‧‧Control device
20A‧‧‧接收物理量的計測值之功能塊 20A‧‧‧ Function block for receiving measured values of physical quantities
20B‧‧‧使脈衝能量恆定之條件資料 20B‧‧‧ Conditions data for constant pulse energy
20C‧‧‧調整發送振盪停止觸發之時刻之功能塊 20C‧‧‧Modify the function block at the moment of transmitting the oscillation stop trigger
20D‧‧‧觸發生成功能塊 20D‧‧‧Trigger generation function block
21‧‧‧部份反射鏡 21‧‧‧Partial mirror
22‧‧‧光檢測器 22‧‧‧Photodetector
25‧‧‧載台 25‧‧‧ stage
30‧‧‧加工對象物 30‧‧‧Processing objects
40‧‧‧送風機 40‧‧‧Air blower
41‧‧‧放電電極 41‧‧‧Discharge electrode
42‧‧‧放電空間 42‧‧‧Discharge space
43‧‧‧導電構件 43‧‧‧Electrical components
44‧‧‧陶瓷構件 44‧‧‧Ceramic components
46‧‧‧熱交換器 46‧‧‧ heat exchanger
50‧‧‧腔室 50‧‧‧ chamber
51‧‧‧端子 51‧‧‧ terminals
52‧‧‧腔室內電流路 52‧‧‧In-chamber current circuit
55‧‧‧腔室外電流路 55‧‧‧Outdoor outdoor current path
56‧‧‧檢測器 56‧‧‧Detector
第1圖係實施例1之雷射加工裝置的概略圖。 Fig. 1 is a schematic view showing a laser processing apparatus of the first embodiment.
第2圖係實施例1之雷射加工裝置的雷射振盪器的剖面圖以及驅動電路的方塊圖。 Fig. 2 is a cross-sectional view showing a laser oscillator of the laser processing apparatus of the first embodiment and a block diagram of the drive circuit.
第3圖係從控制裝置對雷射光源施加之觸發信號、施加於雷射振盪器的放電電極之高頻電壓、流經放電電極之放電電流、以及來自雷射振盪器的光輸出的時序圖。 Figure 3 is a timing diagram of a trigger signal applied from a control device to a laser source, a high frequency voltage applied to a discharge electrode of a laser oscillator, a discharge current flowing through a discharge electrode, and a light output from a laser oscillator. .
第4圖係表示將從對雷射光源施加雷射振盪開始觸發之時刻到施加雷射振盪停止觸發之時刻為止的觸發時間寬度設為恆定之條件下,雷射脈衝上升為止的延遲時間與脈衝能量的關係之曲線圖。 Fig. 4 is a diagram showing the delay time and pulse until the laser pulse rises from the time when the laser oscillation is applied to the laser light source to the time when the triggering time width of the laser oscillation stop trigger is set to be constant. A graph of the relationship of energy.
第5圖係實施例1之雷射加工裝置的控制裝置所執行之處理的流程圖。 Fig. 5 is a flow chart showing the processing executed by the control device of the laser processing apparatus of the first embodiment.
第6圖係從控制裝置對雷射光源施加之觸發信號、施加於雷射振盪器的放電電極之高頻電壓、流經放電電極之放電電流,以及來自雷射振盪器的光輸出的時序圖。 Figure 6 is a timing diagram of a trigger signal applied from a control device to a laser source, a high frequency voltage applied to a discharge electrode of a laser oscillator, a discharge current flowing through a discharge electrode, and a light output from a laser oscillator. .
第7圖係實施例2之雷射加工裝置的概略圖。 Fig. 7 is a schematic view showing a laser processing apparatus of the second embodiment.
第8圖係實施例2之雷射加工裝置所使用之雷射振盪器的剖面圖以及控制系統的方塊圖。 Figure 8 is a cross-sectional view showing a laser oscillator used in the laser processing apparatus of Embodiment 2 and a block diagram of the control system.
第9圖係觸發信號、高頻電壓、放電電流以及光輸出的時序圖。 Figure 9 is a timing diagram of the trigger signal, high frequency voltage, discharge current, and light output.
第10圖中,第10圖A係表示放電電流的峰值與脈衝能量的關係之曲線圖,第10圖B係表示高頻電壓施加時間與脈衝能量的關係之曲線圖。 In Fig. 10, Fig. 10A is a graph showing the relationship between the peak value of the discharge current and the pulse energy, and Fig. 10B is a graph showing the relationship between the application time of the high-frequency voltage and the pulse energy.
第11圖係表示將脈衝能量設為恆定之條件下的放電電流的峰值與高頻電壓施加時間的關係之曲線圖。 Fig. 11 is a graph showing the relationship between the peak value of the discharge current and the application time of the high-frequency voltage under the condition that the pulse energy is made constant.
第12圖係實施例2之雷射加工裝置的控制裝置所執行之處理的流程圖。 Fig. 12 is a flow chart showing the processing executed by the control device of the laser processing apparatus of the second embodiment.
第13圖係觸發信號、高頻電壓、放電電流以及光輸出的時序圖。 Figure 13 is a timing diagram of the trigger signal, high frequency voltage, discharge current, and light output.
第1圖中示出實施例1之雷射加工裝置的概略圖。雷射光源1與從控制裝置20接收之雷射振盪開始觸發同步開始進行雷射振盪,並與雷射振盪停止觸發同步停止雷射振盪。若開始雷射振盪,則雷射光源1射出雷射脈衝。 Fig. 1 is a schematic view showing a laser processing apparatus of the first embodiment. The laser light source 1 starts the laser oscillation with the start of the laser oscillation received from the control device 20, and stops the laser oscillation in synchronization with the laser oscillation stop trigger. If the laser oscillation is started, the laser light source 1 emits a laser pulse.
雷射光源1包括雷射振盪器10以及驅動電路11。雷射振盪器10是使用例如二氧化碳雷射振盪器等氣體雷射振盪器。從控制裝置20對驅動電路11施加雷射振盪開始觸發以及雷射振盪停止觸發。若驅動電路11接收雷射振盪開始觸發,則開始對雷射振盪器10供給電力。若接收雷射振盪停止觸發,則停止對雷射振盪器10供給電力。 The laser light source 1 includes a laser oscillator 10 and a drive circuit 11. The laser oscillator 10 is a gas laser oscillator using, for example, a carbon dioxide laser oscillator. A laser oscillation start trigger and a laser oscillation stop trigger are applied to the drive circuit 11 from the control device 20. When the drive circuit 11 receives the laser oscillation start trigger, power supply to the laser oscillator 10 is started. When the laser oscillation stop trigger is received, the supply of power to the laser oscillator 10 is stopped.
從雷射光源1射出之雷射光束藉由部份反射鏡21分歧為透射光束和反射光束。反射光束射入光檢測器22。若光檢測器22對光進行檢測,則對控制裝置20發送檢測信號。控制裝置20以從光檢測器22接收檢測信號之時刻、亦即雷射脈衝的上升時刻為基準,決定對雷射光源1施加雷射振盪停止觸發之時刻。在所決定之時刻,對雷射光源1施加雷射振盪停止觸發。 The laser beam emitted from the laser light source 1 is divided into a transmitted beam and a reflected beam by a partial mirror 21. The reflected beam is incident on the photodetector 22. When the photodetector 22 detects light, it transmits a detection signal to the control device 20. The control device 20 determines the timing at which the laser oscillation stop trigger is applied to the laser light source 1 based on the timing at which the detection signal is received from the photodetector 22, that is, the rising timing of the laser pulse. At the determined time, a laser oscillation stop trigger is applied to the laser light source 1.
直接穿過部份反射鏡21之透射光束透過光點位置穩定化光學系統12而射入非球面透鏡13。光點位置穩定化光學系統12包括複數個凸透鏡,即使從雷射光源1射出之雷射光束的行進方向偏離,亦可使配置有非球面透鏡13之位置之電子束光點的位置穩定。非球面透鏡13可改變雷射光束的輪廓。例如,可將高斯形狀的光束輪廓改變 成平頂形狀的光束輪廓。 The transmitted light beam directly passing through the partial mirror 21 passes through the spot position stabilizing optical system 12 and enters the aspherical lens 13. The spot position stabilization optical system 12 includes a plurality of convex lenses, and even if the traveling direction of the laser beam emitted from the laser light source 1 is deviated, the position of the electron beam spot where the aspherical lens 13 is disposed can be stabilized. The aspherical lens 13 can change the profile of the laser beam. For example, a Gaussian shaped beam profile can be changed A beam profile in the shape of a flat top.
透過非球面透鏡13之雷射光束,利用準直透鏡14進行準直之後,射入光罩15。光罩15包括透過窗以及遮光部,將雷射光束的光束截面進行整形。透過光罩15的透過窗之雷射光束經由場透鏡16、反射鏡17射入光束掃描器18。光束掃描器18沿二維方向掃描雷射光束。作為光束掃描器18,可使用例如電流掃描器。 The laser beam transmitted through the aspherical lens 13 is collimated by the collimator lens 14, and then incident on the mask 15. The photomask 15 includes a transmission window and a light shielding portion to shape a beam cross section of the laser beam. The laser beam transmitted through the transmission window of the reticle 15 is incident on the beam scanner 18 via the field lens 16 and the mirror 17. The beam scanner 18 scans the laser beam in a two dimensional direction. As the beam scanner 18, for example, a current scanner can be used.
藉由光束掃描器18掃描之雷射光束藉由fθ透鏡19聚光而射入加工對象物30。加工對象物30保持在載台25上。場透鏡16以及fθ透鏡19使光罩15的透過窗在加工對象物30的表面成像。載台25使加工對象物30朝與其表面平行的方向移動。 The laser beam scanned by the beam scanner 18 is condensed by the fθ lens 19 and incident on the object 30. The object 30 is held on the stage 25. The field lens 16 and the fθ lens 19 image the transmission window of the mask 15 on the surface of the object 30. The stage 25 moves the object 30 in a direction parallel to the surface thereof.
第2圖中示出實施例1之雷射振盪器10的剖面圖以及驅動電路的方塊圖。在腔室50的內部容納有送風機40、一對放電電極41、熱交換器46以及雷射介質氣體。在一對放電電極41之間界定有放電空間42。雷射介質氣體藉由在放電空間42內產生放電而被激發。第2圖中示出與放電電極41的長邊方向正交之截面。送風機40使用例如渦輪鼓風機。另外,亦可用橫流風扇、軸流風扇等代替渦輪鼓風機。各放電電極41包括導電構件43和陶瓷構件44。陶瓷構件44隔離導電構件43與放電空間42。 Fig. 2 is a cross-sectional view showing the laser oscillator 10 of the first embodiment and a block diagram of the driving circuit. A blower 40, a pair of discharge electrodes 41, a heat exchanger 46, and a laser medium gas are housed inside the chamber 50. A discharge space 42 is defined between the pair of discharge electrodes 41. The laser medium gas is excited by generating a discharge in the discharge space 42. In the second drawing, a cross section orthogonal to the longitudinal direction of the discharge electrode 41 is shown. The blower 40 uses, for example, a turbo blower. In addition, a cross flow fan, an axial fan, or the like may be used instead of the turbo blower. Each of the discharge electrodes 41 includes a conductive member 43 and a ceramic member 44. The ceramic member 44 isolates the conductive member 43 from the discharge space 42.
在腔室50內形成有循環路徑,該循環路徑是從送風機40經由放電電極41之間的放電空間42以及熱交換器46返回送風機40。熱交換器46用來冷卻藉由放電而成為 高溫之雷射介質氣體。 A circulation path is formed in the chamber 50, and the circulation path is returned from the blower 40 through the discharge space 42 between the discharge electrodes 41 and the heat exchanger 46 to the blower 40. The heat exchanger 46 is used for cooling to become discharged by discharge High temperature laser medium gas.
在腔室50的壁面安裝有一對端子51。放電電極41的導電構件43分別藉由腔室內電流路52與端子51連接。端子51藉由腔室外電流路55與驅動電路11連接。 A pair of terminals 51 are mounted on the wall surface of the chamber 50. The conductive members 43 of the discharge electrodes 41 are connected to the terminals 51 via the intra-chamber current paths 52, respectively. The terminal 51 is connected to the drive circuit 11 via the outdoor cavity current path 55.
第3圖中示出從控制裝置20(第1圖)對驅動電路11(第1圖)施加之觸發信號、施加於放電電極41(第2圖)之高頻電壓、流經放電電極41之放電電流,以及從雷射振盪器10(第1圖)射出之光輸出的時序圖。 Fig. 3 shows a trigger signal applied to the drive circuit 11 (Fig. 1) from the control device 20 (Fig. 1), a high-frequency voltage applied to the discharge electrode 41 (Fig. 2), and a discharge electrode 41. The discharge current and the timing diagram of the light output from the laser oscillator 10 (Fig. 1).
觸發信號在時刻t1上升。觸發信號的上升相當於雷射振盪開始觸發。在時刻t1,若驅動電路11接收雷射振盪開始觸發,則驅動電路11對放電電極41施加高頻電壓。高頻電壓的頻率為例如2MHz。施加高頻電壓後,若在時刻t2開始放電,則放電電流開始流動。 The trigger signal rises at time t1. The rise of the trigger signal is equivalent to the start of the laser oscillation. At time t1, when the drive circuit 11 receives the laser oscillation start trigger, the drive circuit 11 applies a high-frequency voltage to the discharge electrode 41. The frequency of the high frequency voltage is, for example, 2 MHz. When a high-frequency voltage is applied, if discharge starts at time t2, the discharge current starts to flow.
放電開始後,光輸出(雷射脈衝)在雷射振盪器10的光共振器內的增益超過損耗之時刻t3上升。亦即,雷射脈衝在從施加雷射振盪開始觸發之時刻t1經過延遲時間Td後之時刻t3上升。光輸出在上升時瞬間顯示尖銳的峰值之後穩定。若雷射脈衝上升,則藉由光檢測器22(第1圖)檢測出光,將檢測信號發送至控制裝置20(第1圖)。 After the start of discharge, the light output (laser pulse) rises at a time t3 when the gain in the optical resonator of the laser oscillator 10 exceeds the loss. That is, the laser pulse rises at time t3 after the delay time Td elapses from the time t1 at which the application of the laser oscillation is triggered. The light output is stable after a sharp peak is displayed momentarily as it rises. When the laser pulse rises, light is detected by the photodetector 22 (Fig. 1), and the detection signal is transmitted to the control device 20 (Fig. 1).
控制裝置20以從光檢測器22接收檢測信號之時刻、亦即雷射脈衝的上升時刻t3為基準,決定對雷射光源1施加雷射振盪停止觸發之時刻t4。例如,以從雷射脈衝的檢測時刻t3到時刻t4為止的脈衝寬度Pd成為恆定之方 式決定時刻t4。 The control device 20 determines the timing t4 at which the laser oscillation stop trigger is applied to the laser light source 1 based on the timing at which the detection signal is received from the photodetector 22, that is, the rising timing t3 of the laser pulse. For example, the pulse width Pd from the detection time t3 to the time t4 of the laser pulse becomes constant. The formula determines the time t4.
控制裝置20在時刻t4使觸發信號下降,藉此對雷射光源1施加雷射振盪停止觸發。若驅動電路11從控制裝置20接收雷射振盪停止觸發,則驅動電路11中止高頻電壓的施加。若不對放電電極41施加高頻電壓,則放電停止,放電電流不會流動,並且光輸出成為0(雷射脈衝下降)。從時刻t3到時刻t4為止的時間寬度相當於雷射脈衝的脈衝寬度Pd。將從施加雷射振盪開始觸發之時刻t1到施加雷射振盪停止觸發之時刻t4為止的經過時間稱為觸發時間寬度Te。 The control device 20 lowers the trigger signal at time t4, thereby applying a laser oscillation stop trigger to the laser light source 1. When the drive circuit 11 receives the laser oscillation stop trigger from the control device 20, the drive circuit 11 stops the application of the high frequency voltage. If a high-frequency voltage is not applied to the discharge electrode 41, the discharge is stopped, the discharge current does not flow, and the light output becomes 0 (the laser pulse falls). The time width from time t3 to time t4 corresponds to the pulse width Pd of the laser pulse. The elapsed time from the time t1 at which the start of the laser oscillation is triggered to the time t4 at which the laser oscillation stop trigger is applied is referred to as the trigger time width Te.
第4圖中示出在觸發時間寬度Te為恆定條件下進行控制時的延遲時間Td與雷射脈衝的脈衝能量的關係。橫軸表示延遲時間Td,縱軸表示脈衝能量。觸發時間寬度Te為恆定,因此延遲時間Td與脈衝寬度Pd(第3圖)之和恆定。因此,若延遲時間Td變長,則脈衝寬度Pd變短。脈衝能量藉由脈衝寬度Pd變短而降低。可知若以觸發時間寬度Te成為恆定之方式對雷射振盪進行控制,會因延遲時間Td的偏差而導致脈衝能量不均一。 Fig. 4 shows the relationship between the delay time Td when the control is performed under the condition that the trigger time width Te is constant, and the pulse energy of the laser pulse. The horizontal axis represents the delay time Td, and the vertical axis represents the pulse energy. The trigger time width Te is constant, so the sum of the delay time Td and the pulse width Pd (Fig. 3) is constant. Therefore, if the delay time Td becomes long, the pulse width Pd becomes short. The pulse energy is reduced by the pulse width Pd becoming shorter. It can be seen that if the laser oscillation is controlled such that the trigger time width Te becomes constant, the pulse energy is not uniform due to the variation of the delay time Td.
接著,參閱第5圖以及第6圖對使用實施例1之雷射加工裝置之雷射加工方法進行說明。進行雷射加工之前,首先將加工對象物30保持在載台25(第1圖)上並移動載台25,藉此進行加工對象物30的定位。在加工對象物30中,在能夠利用光束掃描器18掃描的範圍內定義有複數個被加工點。雷射加工中,控制裝置20控制光束掃描 器18而對加工對象物30上的被加工點依序射入雷射脈衝,藉此進行鑽孔加工。 Next, a laser processing method using the laser processing apparatus of the first embodiment will be described with reference to FIGS. 5 and 6. Before the laser processing, the object to be processed 30 is first held on the stage 25 (first drawing) and the stage 25 is moved, whereby the object 30 is positioned. In the object 30, a plurality of processed points are defined in a range that can be scanned by the beam scanner 18. In laser processing, control device 20 controls beam scanning The device 18 sequentially injects a laser pulse into the workpiece to be processed on the object 30, thereby performing drilling processing.
第5圖中示出實施例1之雷射加工裝置的控制裝置20(第1圖)所執行之處理的流程圖。第6圖中示出觸發信號、高頻電壓、放電電流以及光輸出的時序圖。若將加工對象物30保持在載台25上並完成加工對象物30的定位,則以將雷射脈衝射入最初應加工之被加工點之方式對光束掃描器18進行控制。在步驟S1中待機到完成光束掃描器18的定位為止。若完成光束掃描器18的定位,則在步驟S2中對雷射光源1施加雷射振盪開始觸發。步驟S2相當於第6圖所示之時刻t11、t21、t31。 Fig. 5 is a flow chart showing the processing executed by the control device 20 (Fig. 1) of the laser processing apparatus of the first embodiment. A timing chart of the trigger signal, the high frequency voltage, the discharge current, and the light output is shown in FIG. When the object 30 is held on the stage 25 and the positioning of the object 30 is completed, the beam scanner 18 is controlled so that the laser pulse is incident on the workpiece to be processed. Standby in step S1 until the positioning of the beam scanner 18 is completed. If the positioning of the beam scanner 18 is completed, a laser oscillation start trigger is applied to the laser light source 1 in step S2. Step S2 corresponds to times t11, t21, and t31 shown in Fig. 6.
若對雷射光源1施加雷射振盪開始觸發,則高頻電壓施加到雷射振盪器10(第1圖),放電電流流動。在從被施加雷射振盪開始觸發之時刻t11、t21、t31分別經過延遲時間Td1、Td2、Td3之時刻t12、t22、t32,雷射脈衝Lp1、Lp2、Lp3上升。因光共振器的反射鏡的振動、雷射介質氣體所含有之雜質等的影響,延遲時間Td1、Td2、Td3不一定全部相等。第6圖中示有延遲時間的大小關係為Td3<Td1<Td2之例子。 When a laser oscillation start trigger is applied to the laser light source 1, a high frequency voltage is applied to the laser oscillator 10 (Fig. 1), and a discharge current flows. The laser pulses Lp1, Lp2, and Lp3 rise at times t12, t22, and t32 at which the delay times Td1, Td2, and Td3 have elapsed from the times t11, t21, and t31 at which the laser oscillation is started. The delay times Td1, Td2, and Td3 are not necessarily all equal due to the influence of the vibration of the mirror of the optical resonator or the impurities contained in the laser medium gas. Fig. 6 shows an example in which the magnitude relationship of the delay time is Td3 < Td1 < Td2.
在步驟S3中計測從被施加雷射振盪停止觸發起到雷射脈衝上升為止的延遲時間Td1、Td2、Td3。具體而言,控制裝置20計測從對雷射光源1施加雷射振盪開始觸發之時刻到由光檢測器22接收檢測信號為止的經過時間。 In step S3, the delay times Td1, Td2, and Td3 from the application of the laser oscillation stop trigger to the rise of the laser pulse are measured. Specifically, the control device 20 measures an elapsed time from the time when the laser light source 1 is applied to start the trigger of the laser oscillation to the time when the detection signal is received by the photodetector 22.
在步驟S4中判定延遲時間Td是否在規格內。延遲時 間Td在規格外時,在步驟S8中對雷射光源1施加雷射振盪停止觸發。藉此,停止對放電電極41(第1圖)供給電力。藉由停止電力的供給,能夠防止異常振盪。 It is determined in step S4 whether or not the delay time Td is within the specification. Delay When the inter-Td is outside the specification, a laser oscillation stop trigger is applied to the laser light source 1 in step S8. Thereby, the supply of electric power to the discharge electrode 41 (Fig. 1) is stopped. By stopping the supply of electric power, abnormal oscillation can be prevented.
延遲時間Td在規格內時,在步驟S5中,以雷射脈衝的上升時刻t12、t22、t32(第6圖)為基準,算出對雷射光源1施加雷射振盪停止觸發之時刻t13、t23、t33(第6圖)。具體而言,將從雷射脈衝的上升時刻t12、t22、t32經過與目標脈衝寬度Pd相當之時間後之時刻作為施加雷射振盪停止觸發之時刻t13、t23、t33。目標脈衝寬度Pd預先儲存於控制裝置20中。 When the delay time Td is within the specification, in step S5, the timings t13 and t23 at which the laser oscillation stop trigger is applied to the laser light source 1 are calculated based on the rising times t12, t22, and t32 (Fig. 6) of the laser pulses. , t33 (Fig. 6). Specifically, the time after the rising time t12, t22, and t32 of the laser pulse passes the time corresponding to the target pulse width Pd is taken as the timings t13, t23, and t33 at which the laser oscillation stop trigger is applied. The target pulse width Pd is previously stored in the control device 20.
在步驟S6中,在由步驟S5算出之時刻t13、t23、t33(第6圖)對雷射光源1施加雷射振盪停止觸發。藉此使雷射脈衝Lp1、Lp2、Lp3下降。 In step S6, a laser oscillation stop trigger is applied to the laser light source 1 at times t13, t23, and t33 (Fig. 6) calculated in step S5. Thereby, the laser pulses Lp1, Lp2, and Lp3 are lowered.
在步驟S7(第5圖)中判定加工是否結束。還剩下未加工的被加工點時,以將雷射脈衝射入到下一個應加工之被加工點之方式對光束掃描器18進行控制,返回步驟S1。若已完成所有被加工點的加工,則結束雷射加工處理。 It is determined in step S7 (Fig. 5) whether or not the machining is finished. When the unprocessed machined point remains, the beam scanner 18 is controlled to inject the laser pulse into the next processed point to be processed, and the process returns to step S1. If the machining of all the machining points has been completed, the laser processing is ended.
第6圖所示之例子中,若以觸發時間寬度Te1、Te2、Te3成為相同之方式進行時序控制,則從雷射脈衝的上升時刻到下降時刻為止的脈衝寬度受到延遲時間Td1、Td2、Td3的偏差的影響而導致不均一。 In the example shown in Fig. 6, when the timing control is performed such that the trigger time widths Te1, Te2, and Te3 are the same, the pulse width from the rising time to the falling time of the laser pulse is subjected to the delay times Td1, Td2, and Td3. The effect of the deviation leads to inhomogeneity.
上述實施例1中,以雷射脈衝的上升時刻t12、t22、t32(第6圖)為基準,決定對雷射光源1施加雷射振盪 停止觸發之時刻t13、t23、t33(第6圖)。因此,雷射脈衝的脈衝寬度Pd不受延遲時間Td1、Td2、Td3的偏差的影響。從而,即使延遲時間Td1、Td2、Td3有所偏差,亦能夠使脈衝寬度Pd恆定。其結果,脈衝能量的偏差變少。若將從雷射脈衝的上升時刻t12、t22、t32到施加雷射振盪停止觸發之時刻t13、t23、t33為止的經過時間設為恆定,則能夠使脈衝能量大致均一。 In the first embodiment, it is determined that laser light is applied to the laser light source 1 based on the rising timings t12, t22, and t32 (Fig. 6) of the laser pulses. The timings at which the triggering is stopped are t13, t23, and t33 (Fig. 6). Therefore, the pulse width Pd of the laser pulse is not affected by the deviation of the delay times Td1, Td2, and Td3. Therefore, even if the delay times Td1, Td2, and Td3 are deviated, the pulse width Pd can be made constant. As a result, the variation in pulse energy is small. When the elapsed time from the rising timings t12, t22, and t32 of the laser pulse to the times t13, t23, and t33 at which the laser oscillation stop trigger is applied is made constant, the pulse energy can be made substantially uniform.
由於脈衝寬度Pd預先儲存於控制裝置20(第1圖)中,因此在檢測出雷射脈衝的上升之後,無需進行用於決定作為目標之脈衝寬度之運算等。根據雷射脈衝的上升後的測定結果進行用於決定該雷射脈衝的脈衝寬度之運算之方法,無法適用於採用具有比運算時間更短的脈衝寬度之雷射脈衝之雷射加工中。上述實施例1中無需進行用於決定脈衝寬度之運算,因此脈衝寬度Pd不會受到運算時間之限制。又,上述實施例1中,無需測定雷射脈衝上升後的光能等,只要檢測是否有雷射脈衝即可。因此,亦無需確保用於進行高精度的光能測定之測定時間。藉由上述理由,上述實施例1亦能夠適用於脈衝寬度Pd較短的雷射加工,例如脈衝寬度比數十μs短的雷射加工中。 Since the pulse width Pd is stored in advance in the control device 20 (Fig. 1), it is not necessary to perform calculation for determining the target pulse width or the like after detecting the rise of the laser pulse. The method for determining the pulse width of the laser pulse based on the measurement result after the rise of the laser pulse is not applicable to laser processing using a laser pulse having a pulse width shorter than the calculation time. In the above-described first embodiment, the calculation for determining the pulse width is not required, and therefore the pulse width Pd is not limited by the calculation time. Further, in the first embodiment described above, it is not necessary to measure the light energy or the like after the rise of the laser pulse, and it is only necessary to detect whether or not there is a laser pulse. Therefore, it is not necessary to ensure the measurement time for performing high-accuracy light energy measurement. For the above reasons, the first embodiment described above can also be applied to laser processing in which the pulse width Pd is short, for example, in laser processing in which the pulse width is shorter than several tens of μs.
第7圖中示出實施例2之雷射加工裝置的概略圖。雷射振盪器10從驅動電路11接受電力的供給而射出脈衝雷射光束。雷射振盪器10是使用例如二氧化碳雷射振盪器等氣體雷射振盪器。驅動電路11與來自控制裝置20的觸發信號同步進行對雷射振盪器10的電力的供給以及停 止。 Fig. 7 is a schematic view showing a laser processing apparatus of the second embodiment. The laser oscillator 10 receives the supply of electric power from the drive circuit 11 and emits a pulsed laser beam. The laser oscillator 10 is a gas laser oscillator using, for example, a carbon dioxide laser oscillator. The drive circuit 11 supplies and supplies power to the laser oscillator 10 in synchronization with a trigger signal from the control device 20. stop.
從雷射振盪器10射出之雷射光束透過光點位置穩定化光學系統12而射入非球面透鏡13。從光點位置穩定化光學系統12至載台25為止的光學系統的結構與第1圖所示之從光點位置穩定化光學系統12到載台25為止的光學系統的結構相同。 The laser beam emitted from the laser oscillator 10 passes through the spot position stabilization optical system 12 and enters the aspherical lens 13. The configuration of the optical system from the spot position stabilization optical system 12 to the stage 25 is the same as that of the optical system from the spot position stabilization optical system 12 to the stage 25 shown in Fig. 1 .
接著,對控制裝置20的結構進行簡單說明。關於控制裝置20所進行之詳細的處理,隨後參閱第12圖以及第13圖進行說明。控制裝置20具有功能塊20A,該功能塊20A接收供給於雷射振盪器10之電流以及電壓的至少一方的物理量的計測值。控制裝置20中儲存有使脈衝能量恆定之條件資料20B。控制裝置20的調整發送振盪停止觸發之時刻之功能塊20C,是根據物理量的計測值以及使脈衝能量恆定之條件資料20B調整發送振盪停止觸發之時刻。 Next, the configuration of the control device 20 will be briefly described. The detailed processing performed by the control device 20 will be described later with reference to FIGS. 12 and 13. The control device 20 has a function block 20A that receives a measured value of a physical quantity supplied to at least one of a current and a voltage of the laser oscillator 10. The control device 20 stores condition data 20B that makes the pulse energy constant. The function block 20C that adjusts the timing at which the oscillation stop trigger is transmitted by the control device 20 is a timing at which the transmission oscillation stop trigger is adjusted based on the measured value of the physical quantity and the condition data 20B that makes the pulse energy constant.
控制裝置20的觸發生成功能塊20D,在藉由調整發送振盪停止觸發之時刻之功能塊20C調整後之時刻,對驅動電路11發送振盪停止觸發。藉由調整發送振盪停止觸發之時刻,可抑制脈衝能量的偏差,使脈衝能量均一化。 The trigger generation function block 20D of the control device 20 transmits an oscillation stop trigger to the drive circuit 11 at the timing when the function block 20C at the timing of transmitting the oscillation stop trigger is adjusted. By adjusting the timing at which the transmission oscillation stops triggering, the variation of the pulse energy can be suppressed, and the pulse energy can be made uniform.
第8圖中示出實施例2之雷射振盪器10的剖面圖以及控制系統的方塊圖。腔室50的內部以及腔室外電流路55的結構與第2圖所示之腔室50的內部以及腔室外電流路55的結構相同。 Fig. 8 is a cross-sectional view showing the laser oscillator 10 of the second embodiment and a block diagram of the control system. The structure of the inside of the chamber 50 and the outdoor current path 55 is the same as that of the inside of the chamber 50 and the outdoor current path 55 shown in Fig. 2 .
檢測器56計測流經腔室外電流路55之電流。檢測器 56所計測之電流的計測值輸入控制裝置20。控制裝置20根據檢測器56所檢測之電流的計測值控制驅動電路11。 The detector 56 measures the current flowing through the outdoor circuit 55 of the chamber. Detector The measured value of the 56 measured current is input to the control device 20. The control device 20 controls the drive circuit 11 based on the measured value of the current detected by the detector 56.
第9圖中示出從控制裝置20(第7圖)對驅動電路11(第7圖)施加之觸發信號、施加於放電電極41(第8圖)之高頻電壓、流經放電電極41之放電電流,以及從雷射振盪器10(第7圖)射出之光輸出的時序圖。 Fig. 9 shows a trigger signal applied to the drive circuit 11 (Fig. 7) from the control device 20 (Fig. 7), a high-frequency voltage applied to the discharge electrode 41 (Fig. 8), and flowing through the discharge electrode 41. The discharge current, and the timing diagram of the light output from the laser oscillator 10 (Fig. 7).
觸發信號在時刻t1上升。觸發信號的上升相當於振盪開始觸發。在時刻t1,若驅動電路11接收振盪開始觸發,則驅動電路11對放電電極41施加高頻電壓。高頻電壓的頻率為例如2MHz。施加高頻電壓後,若在時刻t2開始放電,則放電電流開始流動。 The trigger signal rises at time t1. The rise of the trigger signal is equivalent to the start of the oscillation. At time t1, when the drive circuit 11 receives the oscillation start trigger, the drive circuit 11 applies a high-frequency voltage to the discharge electrode 41. The frequency of the high frequency voltage is, for example, 2 MHz. When a high-frequency voltage is applied, if discharge starts at time t2, the discharge current starts to flow.
放電開始後,光輸出(雷射脈衝)在雷射振盪器10的光共振器內的增益超過損耗之時刻t3上升。光輸出在上升時瞬間顯示尖銳的峰值之後穩定。 After the start of discharge, the light output (laser pulse) rises at a time t3 when the gain in the optical resonator of the laser oscillator 10 exceeds the loss. The light output is stable after a sharp peak is displayed momentarily as it rises.
在放電剛開始後的過渡狀態下,放電電流的振幅小於穩定狀態時的振幅,伴隨時間的經過而逐漸變大。光輸出在時刻t3上升之後,放電電流成為振幅大致恆定的穩定狀態。 In the transient state immediately after the start of the discharge, the amplitude of the discharge current is smaller than the amplitude at the steady state, and gradually increases as time elapses. After the light output rises at time t3, the discharge current becomes a stable state in which the amplitude is substantially constant.
觸發信號在時刻t4下降。觸發信號的下降相當於振盪停止觸發。若驅動電路11從控制裝置20接收振盪停止觸發,則驅動電路11中止高頻電壓的施加。若不對放電電極41施加高頻電壓,則放電停止,放電電流不會流動,並且光輸出成為0(雷射脈衝下降)。從時刻t3到時刻t4為止的時間寬度相當於雷射脈衝的脈衝寬度。 The trigger signal drops at time t4. The falling of the trigger signal is equivalent to the oscillation stop trigger. When the drive circuit 11 receives the oscillation stop trigger from the control device 20, the drive circuit 11 stops the application of the high-frequency voltage. If a high-frequency voltage is not applied to the discharge electrode 41, the discharge is stopped, the discharge current does not flow, and the light output becomes 0 (the laser pulse falls). The time width from time t3 to time t4 corresponds to the pulse width of the laser pulse.
雷射介質氣體的激發強度與所投入之電力成正比。從雷射振盪器射出之脈衝雷射光束的脈衝能量在脈衝寬度為恆定的條件下與激發強度成正比。因此,能夠根據所投入之電力、亦即高頻電壓以及放電電流來預測脈衝能量。 The excitation intensity of the laser medium gas is proportional to the power input. The pulse energy of the pulsed laser beam emitted from the laser oscillator is proportional to the excitation intensity under a condition that the pulse width is constant. Therefore, the pulse energy can be predicted based on the input power, that is, the high frequency voltage and the discharge current.
第10圖A中示出高頻電壓施加時間(從時刻t1到時刻t4為止的時間)恆定的條件下的放電電流的峰值Ipp與脈衝能量的關係。在此,放電電流的峰值Ipp相當於放電電流的振幅的2倍。第10圖A的橫軸表示穩定狀態時的峰值Ipp,縱軸表示脈衝能量。隨著放電電流的峰值Ipp變大,脈衝能量亦增大,二者之間大致為線性關係。 FIG. 10A shows the relationship between the peak value Ipp of the discharge current and the pulse energy under the condition that the high-frequency voltage application time (time from time t1 to time t4) is constant. Here, the peak value Ipp of the discharge current corresponds to twice the amplitude of the discharge current. The horizontal axis of Fig. 10A indicates the peak value Ipp in the steady state, and the vertical axis indicates the pulse energy. As the peak Ipp of the discharge current becomes larger, the pulse energy also increases, and there is a substantially linear relationship between the two.
放電電流成為穩定狀態後,放電電流的峰值Ipp大致恆定,因此藉由計測從放電開始到放電停止前的某一時刻為止的放電電流的峰值Ipp,能夠預測該雷射脈衝的脈衝能量。 When the discharge current is in a steady state, the peak value Ipp of the discharge current is substantially constant. Therefore, the pulse energy of the laser pulse can be predicted by measuring the peak value Ipp of the discharge current from the start of discharge to the time before the stop of the discharge.
第10圖B中示出放電電流的峰值Ipp為恆定條件下的高頻電壓施加時間(第9圖的時刻t1到t4為止的時間)與脈衝能量的關係。橫軸表示高頻電壓施加時間,縱軸表示脈衝能量。隨著高頻電壓施加時間變長,脈衝能量變大,二者之間大致為線性關係。 In Fig. 10B, the relationship between the peak value Ipp of the discharge current and the high-frequency voltage application time (time from time t1 to t4 in Fig. 9) under constant conditions and the pulse energy is shown. The horizontal axis represents the high frequency voltage application time, and the vertical axis represents the pulse energy. As the application time of the high-frequency voltage becomes longer, the pulse energy becomes larger, and there is a substantially linear relationship between the two.
根據第10圖A以及第10圖B所示之曲線圖可推導出以下現象。若放電電流的峰值Ipp變小,則脈衝能量亦變小。若將高頻電壓施加時間增長以補償脈衝能量的減少量,則能夠使脈衝能量維持為恆定。根據第10圖A以及第10圖B所示之曲線圖,能夠求出用於將脈衝能量維持 為恆定之放電電流的峰值Ipp與高頻電壓施加時間的對應關係。 The following phenomenon can be derived from the graphs shown in Fig. 10A and Fig. 10B. When the peak value Ipp of the discharge current becomes small, the pulse energy also becomes small. If the high-frequency voltage application time is increased to compensate for the amount of reduction in pulse energy, the pulse energy can be maintained constant. According to the graphs shown in FIG. 10A and FIG. 10B, it can be found that the pulse energy is maintained. It is a correspondence relationship between the peak Ipp of the constant discharge current and the application time of the high-frequency voltage.
第11圖中示出用於將脈衝能量維持為恆定之放電電流的峰值Ipp與高頻電壓施加時間的對應關係。橫軸表示放電電流的峰值Ipp,縱軸表示高頻電壓施加時間。隨著放電電流的峰值Ipp變大,高頻電壓施加時間變短。第11圖所示之對應關係預先儲存於控制裝置20(第7圖)中。該對應關係相當於第7圖所示之使脈衝能量恆定之條件資料20B。 Fig. 11 shows the correspondence relationship between the peak Ipp of the discharge current for maintaining the pulse energy constant and the high-frequency voltage application time. The horizontal axis represents the peak value Ipp of the discharge current, and the vertical axis represents the high-frequency voltage application time. As the peak value Ipp of the discharge current becomes larger, the application time of the high-frequency voltage becomes shorter. The correspondence shown in Fig. 11 is stored in advance in the control device 20 (Fig. 7). This correspondence relationship corresponds to the condition data 20B which makes the pulse energy constant as shown in Fig. 7.
接著,參閱第12圖以及第13圖,對使用實施例2之雷射加工裝置之雷射加工方法進行說明。在進行雷射加工之前,首先將加工對象物30保持在載台25(第7圖)上並移動載台25,藉此進行加工對象物30的定位。在加工對象物30中,在能夠利用光束掃描器18掃描的範圍內定義有複數個被加工點。雷射加工中,控制裝置20控制光束掃描器18,對加工對象物30上的被加工點依序射入雷射脈衝,藉此進行鑽孔加工。 Next, a laser processing method using the laser processing apparatus of the second embodiment will be described with reference to Figs. 12 and 13. Before the laser processing, the object 30 is first held on the stage 25 (Fig. 7) and the stage 25 is moved, whereby the object 30 is positioned. In the object 30, a plurality of processed points are defined in a range that can be scanned by the beam scanner 18. In the laser processing, the control device 20 controls the beam scanner 18 to sequentially project a laser pulse on the workpiece to be processed on the object 30, thereby performing drilling processing.
第12圖中示出實施例2之雷射加工裝置的控制裝置20(第7圖)所執行之處理的流程圖。第13圖中示出觸發信號、高頻電壓、放電電流以及光輸出的時序圖。若加工對象物30保持在載台25上並完成加工對象物30的定位,則以將雷射脈衝射入最初應加工之被加工點之方式對光束掃描器18進行控制。在步驟S11中待機到完成光束掃描器18的定位為止。若完成了光束掃描器18的定位, 則在步驟S12中對驅動電路11施加振盪開始觸發(電力供給開始的指令)。步驟S12相當於第13圖所示之時刻t11、t21、t31。 Fig. 12 is a flow chart showing the processing executed by the control device 20 (Fig. 7) of the laser processing apparatus of the second embodiment. A timing chart of the trigger signal, the high frequency voltage, the discharge current, and the light output is shown in FIG. When the object 30 is held on the stage 25 and the positioning of the object 30 is completed, the beam scanner 18 is controlled to inject the laser pulse into the processed point to be processed first. Standby in step S11 until the positioning of the beam scanner 18 is completed. If the positioning of the beam scanner 18 is completed, Then, in step S12, an oscillation start trigger (a command for starting the power supply) is applied to the drive circuit 11. Step S12 corresponds to times t11, t21, and t31 shown in Fig. 13.
各雷射脈衝Lp1、Lp2、Lp3在高頻電壓的施加開始時刻t11、t21、t31之後上升。 Each of the laser pulses Lp1, Lp2, and Lp3 rises after the application start timings t11, t21, and t31 of the high-frequency voltage.
在步驟S13中計測放電電流的峰值Ipp,直到經過預先決定之判定時間Tj(第13圖)為止。該計測是利用檢測器56(第8圖)進行。判定時間Tj比應射出之雷射脈衝的額定脈衝寬度短。作為一個例子,額定脈衝寬度為50μs、判定時間Tj為5μs。高頻電壓的頻率為2MHz時,5μs的判定時間Tj相當於高頻電壓的10個週期的量。 The peak Ipp of the discharge current is measured in step S13 until a predetermined determination time Tj (Fig. 13) is passed. This measurement is performed using the detector 56 (Fig. 8). The determination time Tj is shorter than the rated pulse width of the laser pulse to be emitted. As an example, the rated pulse width is 50 μs and the determination time Tj is 5 μs. When the frequency of the high-frequency voltage is 2 MHz, the determination time Tj of 5 μs corresponds to the amount of 10 cycles of the high-frequency voltage.
放電電流的峰值Ipp的計測是從放電電流成為穩定狀態之後開始進行。放電電流於約3個週期成為穩定狀態時,計測從第4個週期到第10個週期為止的峰值Ipp。 The measurement of the peak value Ipp of the discharge current is started after the discharge current has reached a steady state. When the discharge current is in a steady state at about three cycles, the peak Ipp from the fourth cycle to the tenth cycle is measured.
分別以Ipp1、Ipp2、Ipp3表示第13圖所示之時刻t11、t21、t31的振盪開始觸發所產生之放電電流的峰值。第13圖所示之例子中,3個峰值的大小關係為Ipp2<Ipp1<Ipp3。 The peaks of the discharge currents generated by the oscillation start triggers at times t11, t21, and t31 shown in Fig. 13 are indicated by Ipp1, Ipp2, and Ipp3, respectively. In the example shown in Fig. 13, the magnitude relationship of the three peaks is Ipp2 < Ipp1 < Ipp3.
在步驟S14(第12圖)中,判定放電電流的峰值Ipp是否在規格內。若所計測之峰值Ipp在規格外時,在步驟S18中停止對放電電極41(第7圖)供給電力。藉由停止電力的供給,能夠防止異常振盪。 In step S14 (Fig. 12), it is determined whether or not the peak value Ipp of the discharge current is within the specification. When the measured peak value Ipp is outside the specification, the supply of electric power to the discharge electrode 41 (Fig. 7) is stopped in step S18. By stopping the supply of electric power, abnormal oscillation can be prevented.
所計測之峰值Ipp在規格內時,在步驟S15中根據峰值Ipp算出從振盪開始觸發到振盪停止觸發為止的時間寬 度。以下,對步驟S15的處理的一個例子進行說明。例如求出在判定時間Tj(第13圖)期間所計測之複數個峰值Ipp的平均值。根據峰值Ipp的平均值與第11圖所示之對應關係求出高頻電壓施加時間。 When the measured peak Ipp is within the specification, the time width from the oscillation start trigger to the oscillation stop trigger is calculated based on the peak Ipp in step S15. degree. Hereinafter, an example of the processing of step S15 will be described. For example, the average value of the plurality of peaks Ipp measured during the determination time Tj (Fig. 13) is obtained. The high-frequency voltage application time is obtained from the correspondence between the average value of the peak Ipp and the relationship shown in FIG.
由第11圖所示之對應關係得到對應於峰值Ipp1、Ipp2、Ipp3之各時間寬度Pd1、Pd2、Pd3。該些時間寬度的大小關係為Pd3<Pd1<Pd2。 The time widths Pd1, Pd2, and Pd3 corresponding to the peaks Ipp1, Ipp2, and Ipp3 are obtained from the correspondence shown in Fig. 11. The magnitude relationship of these time widths is Pd3 < Pd1 < Pd2.
在步驟S16(第12圖)中,在從振盪開始觸發起經過由步驟S15求出之時間寬度後之時點,發送振盪停止觸發(電力供給停止的指令)。第13圖中,在時刻t12、t22、t32發送振盪停止觸發。從時刻t11到t12為止的時間寬度與Pd1相等,從時刻t21到t22為止的時間寬度與Pd2相等,從時刻t31到t32為止的時間寬度與Pd3相等。在時刻t12、t22、t32停止放電,使各雷射脈衝Lp1、Lp2、Lp3下降。 In step S16 (Fig. 12), the oscillation stop trigger (command for stopping the power supply) is transmitted at a point in time after the time width obtained in step S15 has elapsed from the start of the oscillation. In Fig. 13, the oscillation stop trigger is transmitted at times t12, t22, and t32. The time width from time t11 to time t12 is equal to Pd1, the time width from time t21 to time t22 is equal to Pd2, and the time width from time t31 to t32 is equal to Pd3. The discharge is stopped at times t12, t22, and t32, and the respective laser pulses Lp1, Lp2, and Lp3 are lowered.
在步驟S17(第12圖)中,判定加工是否結束。還剩下未加工的被加工點時,以將雷射脈衝射入到下一個應加工之被加工點之方式對光束掃描器18進行控制,返回步驟S11。若已完成所有被加工點的加工,則結束雷射加工處理。 In step S17 (Fig. 12), it is determined whether or not the machining is finished. When the unprocessed machined point remains, the beam scanner 18 is controlled to inject the laser pulse into the next processed point to be processed, and the process returns to step S11. If the machining of all the machining points has been completed, the laser processing is ended.
穩定狀態下之雷射脈衝Lp2的光輸出低於雷射脈衝Lp1的光輸出。藉由使雷射脈衝Lp2的脈衝寬度比雷射脈衝Lp1的脈衝寬度更長,可補償光輸出的降低量。又,穩定狀態下之雷射脈衝Lp3的光輸出高於雷射脈衝Lp1的光 輸出。藉由使雷射脈衝Lp3的脈衝寬度比雷射脈衝Lp1的脈衝寬度更短,可補償光輸出的增加量。根據第11圖所示之對應關係決定從振盪開始觸發到振盪停止觸發為止的時間寬度,因此能夠使雷射脈衝Lp1、Lp2、Lp3的脈衝能量均一。 The light output of the laser pulse Lp2 in the steady state is lower than the light output of the laser pulse Lp1. By making the pulse width of the laser pulse Lp2 longer than the pulse width of the laser pulse Lp1, the amount of decrease in the light output can be compensated. Moreover, the light output of the laser pulse Lp3 in a steady state is higher than that of the laser pulse Lp1 Output. By making the pulse width of the laser pulse Lp3 shorter than the pulse width of the laser pulse Lp1, the amount of increase in the light output can be compensated. Since the time width from the oscillation start trigger to the oscillation stop trigger is determined according to the correspondence relationship shown in FIG. 11, the pulse energies of the laser pulses Lp1, Lp2, and Lp3 can be made uniform.
當放電電流的峰值Ipp越大越縮短從振盪開始觸發到振盪停止觸發為止的時間寬度,藉此能夠使雷射脈衝的脈衝能量接近均一。 When the peak value Ipp of the discharge current is larger, the time width from the oscillation start trigger to the oscillation stop trigger is shortened, whereby the pulse energy of the laser pulse can be made nearly uniform.
與光輸出相比,能夠輕鬆地、以短時間計測放電電流的峰值Ipp。因此,與計測光輸出而調節脈衝寬度之情況相比,實施例2之方法能夠縮短判定時間Tj(第13圖)。因此,即使應射出之雷射脈衝的脈衝寬度為100μs以下,亦能夠適用上述實施例2之方法。 The peak Ipp of the discharge current can be easily measured in a short time compared to the light output. Therefore, the method of the second embodiment can shorten the determination time Tj (FIG. 13) as compared with the case where the pulse width is adjusted by measuring the light output. Therefore, the method of the above-described second embodiment can be applied even if the pulse width of the laser pulse to be emitted is 100 μs or less.
上述實施例2中,在判定時間Tj的期間計測了放電電流的峰值Ipp,但亦可以計測取決於對放電電極41(第8圖)供給之電力之其他物理量。例如,可計測放電電流的有效值。 In the second embodiment described above, the peak value Ipp of the discharge current is measured during the determination period Tj, but other physical quantities depending on the power supplied to the discharge electrode 41 (Fig. 8) may be measured. For example, the effective value of the discharge current can be measured.
若放電狀態變化,則施加於一對放電電極41之間之電壓亦變化。該電壓的變化追隨對放電電極41供給之電力的變化。因此,作為取決於對放電電極41(第8圖)供給之電力之其他物理量,亦可採用施加於放電電極41之間之電壓的峰值或有效值。如此,只要計測對放電電極41施加之電壓或電流的至少一方的物理量即可。 When the discharge state changes, the voltage applied between the pair of discharge electrodes 41 also changes. This change in voltage follows a change in the power supplied to the discharge electrode 41. Therefore, as another physical quantity depending on the electric power supplied to the discharge electrode 41 (Fig. 8), a peak value or an effective value of a voltage applied between the discharge electrodes 41 may be employed. In this manner, it is sufficient to measure at least one physical quantity of the voltage or current applied to the discharge electrode 41.
依以上實施例對本發明進行了說明,但本發明並非限 定於該等實施例。例如,能夠進行各種變更、改良以及組合等,這對所屬技術領域具有通常知識者是顯而易見的。 The present invention has been described based on the above embodiments, but the present invention is not limited thereto. These embodiments are set forth. For example, various changes, modifications, combinations, and the like can be made, as will be apparent to those of ordinary skill in the art.
1‧‧‧雷射光源 1‧‧‧Laser light source
10‧‧‧雷射振盪器 10‧‧‧Laser oscillator
11‧‧‧驅動電路 11‧‧‧Drive circuit
12‧‧‧光點位置穩定化光學系統 12‧‧‧ Spot Position Stabilization Optical System
13‧‧‧非球面透鏡 13‧‧‧Aspherical lens
14‧‧‧準直透鏡 14‧‧‧ Collimating lens
15‧‧‧光罩 15‧‧‧Photomask
16‧‧‧場透鏡 16‧‧ ‧ field lens
17‧‧‧反射鏡 17‧‧‧Mirror
18‧‧‧光束掃描器 18‧‧‧ Beam Scanner
19‧‧‧fθ透鏡 19‧‧‧fθ lens
20‧‧‧控制裝置 20‧‧‧Control device
21‧‧‧部份反射鏡 21‧‧‧Partial mirror
22‧‧‧光檢測器 22‧‧‧Photodetector
25‧‧‧載台 25‧‧‧ stage
30‧‧‧加工對象物 30‧‧‧Processing objects
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