CN104057203A - Laser processing apparatus and laser processing method - Google Patents
Laser processing apparatus and laser processing method Download PDFInfo
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- CN104057203A CN104057203A CN201410090728.8A CN201410090728A CN104057203A CN 104057203 A CN104057203 A CN 104057203A CN 201410090728 A CN201410090728 A CN 201410090728A CN 104057203 A CN104057203 A CN 104057203A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
The invention provides a laser processing apparatus and a laser processing method. The laser processing apparatus can enable the pulse energy of each pulse to be stable even in a wide pulse width. A laser light source and laser oscillation starting trigger signals received from the external synchronously start laser oscillation, and the laser light source and laser oscillation stopping trigger signals synchronously stop the laser oscillation. A detector detects the electric power dependent on being applied to the laser light source and at least one of the physical quantities of the laser pulse ejected from the laser light source. A control device applies the laser oscillation starting trigger signals to the laser light source and applies the oscillation stopping trigger signals to the laser light source according to the detection result of the physical quantities detected by the detector.
Description
The application advocates Japanese patent application based on March 19th, 2013 application No. 2013-056217, and the priority of No. 2013-067746th, the Japanese patent application of application on March 28th, 2013.The full content of this Japanese publication is by reference to being applied in this description.
Technical field
The present invention relates to a kind of laser processing device and laser processing that penetrates pulse laser and carry out Laser Processing.
Background technology
In the gas lasers such as carbon dioxide laser, the impact such as the impurity in laser gas medium electric discharge.Therefore, the pulse energy generation deviation of each laser pulse of ejaculation.Laser pulse is added to man-hour for perforate, if pulse energy generation deviation causes processing quality inconsistent.
In following patent documentation 1, disclose the laser generation method of the deviation that reduces pulse energy.In the disclosed method of patent documentation 1, in the pulse excitation of 1 time, repeatedly measure the energy value of the laser penetrating from laser oscillator.Measured multiple energy values are added together, predict the gross energy estimated value of the laser vibrating because of this pulse excitation.According to this gross energy estimated value control firing time.Thus, can make total energy value (pulse energy) stable.
Patent documentation 1: TOHKEMY 2002-299736 communique
When pulse width is relatively long, for example, while being hundreds of μ s left and right, even from laser generation instruction till the time delay of the rising of laser pulse deviation to some extent, also can utilize disclosed method regulating impulse energy in above-mentioned patent documentation 1.For example, but pulse width more in short-term, while being tens μ s, if consider energy measuring sensitivity, operation time, is difficult to control firing time.
Summary of the invention
Even if the object of the present invention is to provide one pulse width more in short-term, also can make stable laser processing device and the laser processing of pulse energy of each pulse.
According to a viewpoint of the present invention, a kind of laser processing device is provided, wherein, have:
LASER Light Source, starts triggering signal with the laser generation receiving from outside and synchronizes and start laser generation, and stops triggering signal with laser generation and synchronize and stop laser generation;
Detector, detects at least physical quantity of one of them that depends on the electric power applying to described LASER Light Source and the laser pulse penetrating from described LASER Light Source; And
Control device, applies described laser generation to described LASER Light Source and starts triggering signal, and according to the testing result of the described physical quantity of utilizing described detector to detect, applies described vibration stop triggering signal to described LASER Light Source.
According to another viewpoint of the present invention, a kind of laser processing is provided, wherein, there is following operation:
To synchronizeing and start laser generation with the starting of oscillation triggering signal receiving from outside, and stop triggering signal with vibration and synchronize the LASER Light Source that stops laser generation and apply the operation of described starting of oscillation triggering signal;
Detection depends at least operation of the physical quantity of one of them of the electric power applying to described LASER Light Source and the laser pulse penetrating from described LASER Light Source; And
According to the testing result of described physical quantity, apply described vibration and stop the operation of triggering signal to described LASER Light Source.
According to the testing result of physical quantity of utilizing detector to detect, can stop triggering signal and make pulse energy stable by apply vibration to LASER Light Source.
Brief description of the drawings
Fig. 1 is the schematic diagram of the laser processing device based on embodiment 1.
Fig. 2 is the cutaway view of laser oscillator and the block diagram of drive circuit of the laser processing device based on embodiment 1.
Fig. 3 is the discharge current of the triggering signal applying to LASER Light Source from control device, the high frequency voltage that puts on the sparking electrode of laser oscillator, the sparking electrode of flowing through, and the sequential chart of exporting from the light of laser oscillator.
Fig. 4 be represent by apply to LASER Light Source laser generation start triggering signal time be carved into the triggering signal time width applying till the moment that laser generation stops triggering signal and be made as under constant condition, the curve map of the time delay till laser pulse rises and the relation between pulse energy.
Fig. 5 is the flow chart of the performed processing of the control device of the laser processing device based on embodiment 1.
Fig. 6 is the discharge current of the triggering signal applying to LASER Light Source from control device, the high frequency voltage that puts on the sparking electrode of laser oscillator, the sparking electrode of flowing through and the sequential chart from the light output of laser oscillator.
Fig. 7 is the schematic diagram of the laser processing device based on embodiment 2.
Fig. 8 is the cutaway view of laser oscillator and the block diagram of control system using in the laser processing device based on embodiment 2.
Fig. 9 is the sequential chart of triggering signal, high frequency voltage, discharge current and light output.
Figure 10 A is the curve map that represents the relation between peak value and the pulse energy of discharge current, and Figure 10 B is the curve map that represents the relation between high frequency voltage application time and pulse energy.
Figure 11 is the curve map that represents pulse energy to be made as the relation between peak value and the high frequency voltage application time of the discharge current under constant condition.
Figure 12 is the flow chart of the performed processing of the control device of the laser processing device based on embodiment 2.
Figure 13 is the sequential chart of triggering signal, high frequency voltage, discharge current and light output.
In figure: 1-LASER Light Source, 10-laser oscillator, 11-drive circuit, 12-light spot position stabilized optical system, 13-non-spherical lens, 14-collimation lens, 15-mask, 16-field lens, 17-retroreflector, 18-optical beam scanner, 19-f θ lens, 20-control device, 20A-receives the functional module of the measured value of physical quantity, 20B-makes the condition data that pulse energy is constant, 20C-send vibration stop triggering signal moment adjust functional module, 20D-trigger message systematic function module, 21-partially reflecting mirror, 22-photodetector, 25-objective table, 30-workpiece, 40-pressure fan, 41-sparking electrode, 42-discharge space, 43-conductive component, 44-ceramic component, 46-heat exchanger, 50-chamber, 51-terminal, current path in 52-chamber, 55-chamber extrinsic current path, 56-detector.
Detailed description of the invention
The schematic diagram of the laser processing device based on embodiment 1 shown in Fig. 1.LASER Light Source 1 and the laser generation receiving from control device 20 start triggering signal and synchronize and start laser generation, and stop triggering signal with laser generation and synchronize and stop laser generation.If beginning laser generation, LASER Light Source 1 penetrates laser pulse.
LASER Light Source 1 comprises laser oscillator 10 and drive circuit 11.Laser oscillator 10 uses the gas laser oscillators such as such as carbon dioxide laser oscillator.Apply from control device 20 to drive circuit 11 that laser generation starts triggering signal and laser generation stops triggering signal.Start triggering signal if drive circuit 11 receives laser generation, start to supply with electric power to laser oscillator 10.Stop triggering signal if receive laser generation, stop supplying with electric power to laser oscillator 10.
The laser beam penetrating from LASER Light Source 1 is partially reflected mirror 21 and is divided into transmitted light beam and folded light beam.Folded light beam is injected in photodetector 22.If photodetector 22 detects light, send detection signal to control device 20.Control device 20 is to receive the moment of detection signal from photodetector 22, the rising moment of laser pulse is benchmark, determines to apply laser generation and stop to LASER Light Source 1 moment of triggering signal.In the determined moment, apply laser generation to LASER Light Source 1 and stop triggering signal.
Directly see through light spot position stabilized optical system 12 and inject in non-spherical lens 13 through the transmitted light beam of partially reflecting mirror 21.Light spot position stabilized optical system 12 comprises multiple convex lens, even if the direct of travel of the laser beam that LASER Light Source 1 penetrates departs from, also can make the position stability of the laser beam spots of the position that disposes non-spherical lens 13.Non-spherical lens 13 can change the profile of laser beam.For example, the beam profile of gaussian shape can be changed over to the beam profile of flat-top shape.
See through the laser beam of non-spherical lens 13 and utilize after collimation lens 14 collimates, inject in mask 15.Mask 15 comprises transmissive window and light shielding part, and the beam cross section of laser beam is carried out to shaping.The laser beam that sees through the transmissive window of mask 15 is injected in optical beam scanner 18 via field lens 16, retroreflector 17.Optical beam scanner 18 is along two-dimensional directional scanning laser beam.As optical beam scanner 18, can use for example current scanning instrument.
The laser beam being scanned by optical beam scanner 18 is injected in workpiece 30 by f θ lens 19 light harvestings.Workpiece 30 remains on objective table 25.Field lens 16 and f θ lens 19 make the transmissive window of mask 15 in the surperficial imaging of workpiece 30.Objective table 25 makes workpiece 30 move to the direction parallel with its surface.
The cutaway view of laser oscillator 10 based on embodiment 1 shown in Fig. 2 and the block diagram of drive circuit.Accommodate pressure fan 40, pair of discharge electrodes 41, heat exchanger 46 and laser gas medium in the inside of chamber 50.Between pair of discharge electrodes 41, delimit and have discharge space 42.Laser gas medium is by being excited in the interior generation electric discharge of discharge space 42.Shown in Fig. 2 with the orthogonal cross section of the length direction of sparking electrode 41.In pressure fan 40, use for example turbo-blower.In addition, available cross flow fan, aerofoil fan etc. replace turbo-blower.Each sparking electrode 41 comprises respectively conductive component 43 and ceramic component 44.Ceramic component 44 isolate conductive parts 43 and discharge space 42.
In chamber 50, be formed with the circulating path that returns to pressure fan 40 from pressure fan 40 via the discharge space 42 between sparking electrode 41 and heat exchanger 46.The cooling laser gas medium that becomes high temperature by electric discharge of heat exchanger 46.
At the wall of chamber 50, pair of terminal 51 is installed.The conductive component 43 of sparking electrode 41 is connected with terminal 51 by current path in chamber 52 respectively.Terminal 51 is connected with drive circuit 11 by chamber extrinsic current path 55.
Shown in Fig. 3 from control device 20(Fig. 1) to drive circuit 11(Fig. 1) triggering signal that applies, put on sparking electrode 41(Fig. 2) high frequency voltage, the discharge current of the sparking electrode 41 of flowing through, and from laser oscillator 10(Fig. 1) sequential chart of the light output penetrated.
Triggering signal rises at moment t1.The rising of triggering signal is equivalent to laser generation and starts triggering signal.At moment t1, if receiving laser generation, drive circuit 11 starts triggering signal, drive circuit 11 applies high frequency voltage to sparking electrode 41.The frequency of high frequency voltage is for example 2MHz.Apply after high frequency voltage, if start electric discharge at moment t2, discharge current starts to flow.
After electric discharge starts, the moment t3 that the gain of light output (laser pulse) in the optical resonator of laser oscillator 10 exceedes loss rises., laser pulse is starting the moment t1 of triggering signal through the moment t3 rising of Td time delay from applying laser generation.Light output moment in the time rising stablizes after showing sharp-pointed peak value.If laser pulse rises, light is by photodetector 22(Fig. 1) detected, detection signal is sent to control device 20(Fig. 1).
Control device 20 is to receive the moment of detection signal from photodetector 22, the rising moment t3 of laser pulse is benchmark, determines to apply laser generation and stop to LASER Light Source 1 the moment t4 of triggering signal.For example, with the detection moment t3 from laser pulse till the pulse width Pd of moment t4 becomes constant mode decisive time t4.
Control device 20 declines triggering signal at moment t4, applies laser generation thus stop triggering signal to LASER Light Source 1.Stop triggering signal if drive circuit 11 receives laser generation from control device 20, drive circuit 11 is ended applying of high frequency voltage.If do not apply high frequency voltage to sparking electrode 41, electric discharge stops, and discharge current can not flow, and light output becomes the decline of 0(laser pulse).From moment t3 till the time width of moment t4 is equivalent to the pulse width Pd of laser pulse.To start the moment t1 of triggering signal and be called triggered time width Te till apply the elapsed time that laser generation stops the moment t4 of triggering signal from applying laser generation.
Shown in Fig. 4 triggered time width Te be while controlling under controlled condition time delay Td and the pulse energy of laser pulse between relation.Transverse axis represents Td time delay, and the longitudinal axis represents pulse energy.Triggered time width Te is constant, therefore time delay Td and pulse width Pd(Fig. 3) sum is constant.Therefore,, if time delay, Td was elongated, pulse width Pd shortens.Pulse energy is shortened and is reduced by pulse width Pd.Become constant mode if known with triggered time width Te laser generation controlled, because of time delay Td deviation cause pulse energy inequality.
Then, with reference to figure 5 and Fig. 6, the laser processing that uses the laser processing device based on embodiment 1 is described.Before carrying out Laser Processing, first workpiece 30 is remained on to objective table 25(Fig. 1) go up and moving stage 25, carry out thus the location of workpiece 30.In workpiece 30, in the scope that can utilize optical beam scanner 18 to scan, definition has multiple processed points.In Laser Processing, optical beam scanner 18 controlled by control device 20 and processed point on workpiece 30 is injected laser pulse successively, carries out thus perforate processing.
Control device 20(Fig. 1 of laser processing device based on embodiment 1 shown in Fig. 5) flow chart of performed processing.The sequential chart of triggering signal shown in Fig. 6, high frequency voltage, discharge current and light output.If workpiece 30 is remained on on the objective table 25 and location that completes workpiece 30, the mode that makes laser pulse be injected into the processed point of answering first processing is controlled optical beam scanner 18.Standby in step S1 is till complete the location of optical beam scanner 18.If complete the location of optical beam scanner 18, in step S2, apply laser generation to LASER Light Source 1 and start triggering signal.Step S2 is equivalent to moment t11, t21, the t31 shown in Fig. 6.
Start triggering signal if apply laser generation to LASER Light Source 1, high frequency voltage is applied to laser oscillator 10(Fig. 1), discharge current flows.Starting moment t11, the t21 of triggering signal, moment t12, t22, t32 that t31 passes through respectively Td1 time delay, Td2, Td3 from being applied in laser generation, laser pulse Lp1, Lp2, Lp3 rise.Be subject to the impact of the impurity that contains in the vibration, laser gas medium of the speculum of optical resonator etc., time delay, Td1, Td2, Td3 not necessarily all equated.The magnitude relationship that is shown with time delay in Fig. 6 is the example of Td3 < Td1 < Td2.
In step S3, measure from being applied in laser generation and stop Td1 time delay, Td2, the Td3 till triggering signal plays laser pulse rising.Particularly, control device 20 measure from apply to LASER Light Source 1 laser generation start triggering signal time be carved into by photodetector 22 and receive the elapsed time till detection signal.
In step S4, whether decision delay time T d is within standard.When time delay, Td was outside standard, in step S8, applies laser generation to LASER Light Source 1 and stop triggering signal.Thus, stop Fig. 1 to sparking electrode 41() supply electric power.By stopping the supply of electric power, can prevent abnormal vibration.
When time delay, Td was within standard, in step S5, taking rising moment t12, t22, t32(Fig. 6 of laser pulse), as benchmark, calculate and apply to LASER Light Source 1 moment t13, t23, t33(Fig. 6 that laser generation stops triggering signal).Particularly, using the rising moment t12 from laser pulse, t22, t32 through moment of the time suitable with target pulse width Pd as moment t13, the t23, the t33 that apply laser generation and stop triggering signal.Target pulse width Pd is pre-stored within control device 20.
In step S6, at the moment t13, the t23 that are calculated by step S5, t33(Fig. 6) apply laser generation to LASER Light Source 1 and stop triggering signal.Laser pulse Lp1, Lp2, Lp3 decline thus.
At step S7(Fig. 5) in judge processing whether finish.Also remaining unprocessed processed some time, so that laser pulse is injected into the mode of the processed point that the next one should process, optical beam scanner 18 is controlled, and returned to step S1.If completed the processing of all processed points, finish Laser Processing processing.
In example shown in Fig. 6, carry out timing controlled if become identical mode with triggered time width Te1, Te2, Te3, during from the rising of laser pulse, be carved into pulse width till the moment that declines be subject to Td1 time delay, Td2, Td3 deviation impact and cause inequality.
In above-described embodiment 1, taking rising moment t12, t22, t32(Fig. 6 of laser pulse), as benchmark, determine to apply to LASER Light Source 1 moment t13, t23, t33(Fig. 6 that laser generation stops triggering signal).Therefore, the pulse width Pd of laser pulse is not subject to the impact of the deviation of Td1 time delay, Td2, Td3.Thereby, even time delay Td1, Td2, Td3 deviation to some extent, also can make pulse width Pd constant.Its result, the deviation of pulse energy tails off.If till apply the elapsed time of moment t13, t23 that laser generation stops triggering signal, t33 and be made as constantly, can make pulse energy roughly even the rising moment t12 from laser pulse, t22, t32.
Because pulse width Pd is pre-stored within control device 20(Fig. 1) in, therefore after the rising that detects laser pulse, without carrying out for determining computing as the pulse width of target etc.According to the measurement result after the rising of laser pulse, for determining that the method for computing of pulse width of this laser pulse cannot be applicable to adopt the Laser Processing of the laser pulse with the pulse width shorter than operation time.In above-described embodiment 1, without the computing of carrying out for determining pulse width, therefore pulse width Pd can not be subject to the restriction because of operation time.In addition, in above-described embodiment 1, the luminous energy after rising without mensuration laser pulse etc., need only having or not of detection laser pulse.Therefore, also without the minute of guaranteeing for carrying out high-precision actinometry.For the above reasons, above-described embodiment 1 also can be applicable to the Laser Processing that pulse width Pd is shorter, for example, in the Laser Processing that pulse width ratio tens μ s are short.
The schematic diagram of the laser processing device based on embodiment 2 shown in Fig. 7.Laser oscillator 10 is accepted the supply of electric power and is penetrated pulse laser beam from drive circuit 11.Laser oscillator 10 uses the gas laser oscillators such as such as carbon dioxide laser oscillator.Drive circuit 11 is synchronizeed with the triggering signal of carrying out self-control device 20 and is carried out to the supply of the electric power of laser oscillator 10 and stop.
The laser beam penetrating from laser oscillator 10 sees through light spot position stabilized optical system 12 and injects in non-spherical lens 13.The structure of the optical system till from light spot position stabilized optical system 12 to objective table 25 with shown in Fig. 1 from light spot position stabilized optical system 12 till the structure of the optical system of objective table 25 is identical.
Then, the structure of control device 20 is briefly described.The detailed processing of carrying out about control device 20, after describe with reference to Figure 12 and Figure 13.Control device 20 has functional module 20A, and this functional module 20A receives and is supplied in the electric current of laser oscillator 10 and at least measured value of the physical quantity of one of them of voltage.In control device 20, store the condition data 20B that makes pulse energy constant.The adjustment of control device 20 sends the functional module 20C in moment that vibration stops triggering signal according to the measured value of physical quantity and condition data 20B that pulse energy is constant is adjusted the moment that sends vibration and stop triggering signal.
The triggering signal systematic function module 20D of control device 20, in the controlled moment of functional module 20C in moment that sends vibration by adjustment and stop triggering signal, sends vibration to drive circuit 11 and stops triggering signal.Send vibration by adjustment and stop moment of triggering signal, the deviation of pulse energy is suppressed, and pulse energy is homogenized.
The cutaway view of laser oscillator 10 based on embodiment 2 shown in Fig. 8 and the block diagram of control system.The structure of the inside of chamber 50 and chamber extrinsic current path 55 is identical with the inside of the chamber 50 shown in Fig. 2 and the structure of chamber extrinsic current path 55.
Detector 56 is measured the electric current of the chamber extrinsic current path 55 of flowing through.Utilize the measured value of the electric current that detector 56 measures to be imported into control device 20.Control device 20 is according to the measured value control drive circuit 11 of the electric current that utilizes detector 56 to detect.
Shown in Fig. 9 from control device 20(Fig. 7) to drive circuit 11(Fig. 7) triggering signal that applies, put on sparking electrode 41(Fig. 8) high frequency voltage, the discharge current of the sparking electrode 41 of flowing through, and from laser oscillator 10(Fig. 7) sequential chart of the light output penetrated.
Triggering signal rises at moment t1.The rising of triggering signal is equivalent to starting of oscillation triggering signal.At moment t1, if drive circuit 11 receives starting of oscillation triggering signal, drive circuit 11 applies high frequency voltage to sparking electrode 41.The frequency of high frequency voltage is for example 2MHz.Apply after high frequency voltage, if start electric discharge at moment t2, discharge current starts to flow.
After electric discharge starts, the moment t3 that the gain of light output (laser pulse) in the optical resonator of laser oscillator 10 exceedes loss rises.Light output moment in the time rising stablizes after showing sharp-pointed peak value.
In transition state in electric discharge after just having started, the amplitude when amplitude of discharge current is less than stable state, follow the time through becoming gradually large.Light output is after moment t3 rises, and discharge current becomes the stable state of amplitude constant.
Triggering signal declines at moment t4.The decline of triggering signal is equivalent to vibration and stops triggering signal.Stop triggering signal if drive circuit 11 receives vibration from control device 20, drive circuit 11 is ended applying of high frequency voltage.If do not apply high frequency voltage to sparking electrode 41, electric discharge stops, and discharge current can not flow, and light output becomes the decline of 0(laser pulse).From moment t3 till the time width of moment t4 is equivalent to the pulse width of laser pulse.
The excitation intensity of laser gas medium is directly proportional to inputted electric power.The pulse energy of the pulse laser beam penetrating from laser oscillator is directly proportional to excitation intensity pulse width is constant condition.Therefore, can be by inputted electric power, i.e. high frequency voltage and discharge current prediction pulse energy.
Relation peak I pp and the pulse energy of the discharge current the constant condition of high frequency voltage application time shown in Figure 10 A (from moment t1 till the time of moment t4).At this, the peak I pp of discharge current is equivalent to 2 times of amplitude of discharge current.Peak I pp when the transverse axis of Figure 10 A represents stable state, the longitudinal axis represents pulse energy.Along with the peak I pp of discharge current becomes large, pulse energy also increases, and is roughly linear relationship between the two.
Discharge current becomes after stable state, and therefore the peak I pp constant of discharge current starts, till electric discharge stops the peak I pp of the discharge current in previous a certain moment, can predict the pulse energy of this laser pulse by measuring from electric discharge.
High frequency voltage application time (the moment t1 of Fig. 9 is till the time of t4) under the constant condition of the peak I pp of discharge current shown in Figure 10 B and the relation between pulse energy.Transverse axis represents high frequency voltage application time, and the longitudinal axis represents pulse energy.Along with high frequency voltage application time is elongated, it is large that pulse energy becomes, and is roughly linear relationship between the two.
Can derive following situation by the curve map shown in Figure 10 A and Figure 10 B.If the peak I pp of discharge current diminishes, pulse energy also diminishes.If extend the reduction of high frequency voltage application time with compensated pulse energy, can make pulse energy be maintained constant.By the curve map shown in Figure 10 A and Figure 10 B, can obtain the corresponding relation between peak I pp and the high frequency voltage application time for pulse energy being maintained to constant discharge current.
Shown in Figure 11 for pulse energy being maintained to the corresponding relation between peak I pp and the high frequency voltage application time of constant discharge current.Transverse axis represents the peak I pp of discharge current, and the longitudinal axis represents high frequency voltage application time.Along with the peak I pp of discharge current becomes large, high frequency voltage application time shortens.Corresponding relation shown in Figure 11 is pre-stored within control device 20(Fig. 7) in.This corresponding relation is equivalent to the condition data 20B that pulse energy is constant that makes shown in Fig. 7.
Then,, with reference to Figure 12 and Figure 13, the laser processing that uses the laser processing device based on embodiment 2 is described.Before carrying out Laser Processing, first workpiece 30 is remained on to objective table 25(Fig. 7) go up and moving stage 25, carry out thus the location of workpiece 30.In workpiece 30, in the scope that can utilize optical beam scanner 18 to scan, definition has multiple processed points.In Laser Processing, control device 20 is controlled optical beam scanner 18, and the processed point on workpiece 30 is injected laser pulse successively, carries out thus perforate processing.
Control device 20(Fig. 7 of laser processing device based on embodiment 2 shown in Figure 12) flow chart of performed processing.The sequential chart of triggering signal shown in Figure 13, high frequency voltage, discharge current and light output.If workpiece 30 remains on the objective table 25 and location that completes workpiece 30, so that laser pulse is injected in the mode of processed point that should first processing that optical beam scanner 18 is controlled.Standby in step S11 is till complete the location of optical beam scanner 18.If completed the location of optical beam scanner 18, in step S12, apply starting of oscillation triggering signal (electric power is supplied with the instruction starting) to drive circuit 11.Step S12 is equivalent to moment t11, t21, the t31 shown in Figure 13.
Each laser pulse Lp1, Lp2, Lp3 high frequency voltage apply the t11 zero hour, t21, t31 after rise.
In step S13, measure the peak I pp of discharge current, until the judgement time T j(Figure 13 through predetermining).This measurement utilizes detector 56(Fig. 8) carry out.Judge that time T j is shorter than the nominal pulse width of the laser pulse that should penetrate.As an example, nominal pulse width is 50 μ s, judges that time T j is as 5 μ s.When the frequency of high frequency voltage is 2MHz, the judgement time T j of 5 μ s is equivalent to the amount in 10 cycles of high frequency voltage.
The peak I pp of discharge current starts to measure after discharge current becomes stable state.When discharge current becomes stable state by approximately 3 cycles, measure from the peak I pp till 10 cycles of the 4th cycle to the.
Represent respectively the peak value of the discharge current being produced by starting of oscillation triggering signal of moment t11, the t21 shown in Figure 13, t31 with Ipp1, Ipp2, Ipp3.In example shown in Figure 13, the magnitude relationship of 3 peak values is Ipp2 < Ipp1 < Ipp3.
At step S14(Figure 12) in, judge that the peak I pp of discharge current is whether within standard.If measured peak I pp outside standard time, stops Fig. 7 to sparking electrode 41(in step S18) supply with electric power.By stopping the supply of electric power, can prevent abnormal vibration.
Measured peak I pp within standard time, calculates from starting of oscillation triggering signal till vibration stops the time width of triggering signal according to peak I pp in step S15.Below, the processing to step S15 example describes.For example obtain and judging time T j(Figure 13) during the mean value of measured multiple peak I pp.Obtain high frequency voltage application time by the corresponding relation shown in mean value and Figure 11 of peak I pp.
Corresponding relation as shown in Figure 11 obtains each time width Pd1, Pd2, the Pd3 with respect to peak I pp1, Ipp2, Ipp3.The magnitude relationship of these time widths is Pd3 < Pd1 < Pd2.
At step S16(Figure 12) in, in the moment through the time width obtained by step S15 from starting of oscillation triggering signal, send vibration and stops triggering signal (electric power is supplied with the instruction stopping).In Figure 13, send vibration at moment t12, t22, t32 and stop triggering signal.From moment t11 till the time width of t12 equate with Pd1, from moment t21 till the time width of t22 equate with Pd2, from moment t31 till the time width of t32 equate with Pd3.Stop electric discharge at moment t12, t22, t32, each laser pulse Lp1, Lp2, Lp3 decline.
At step S17(Figure 12) in, judge whether processing finishes.Also remaining unprocessed processed some time, in the mode that laser pulse is injected into the processed point that the next one should process, optical beam scanner 18 is controlled, returned to step S11.If completed the processing of all processed points, finish Laser Processing processing.
The light output of laser pulse Lp2 under stable state is lower than the light output of laser pulse Lp1.By making the pulse width of laser pulse Lp2 be longer than the pulse width of laser pulse Lp1, the reducing amount of compensating light output.In addition, the output of the light of the laser pulse Lp3 under stable state is higher than the light output of laser pulse Lp1.By making the pulse width of laser pulse Lp3 be shorter than the pulse width of laser pulse Lp1, the recruitment of compensating light output.Determine from starting of oscillation triggering signal till vibration stops the time width of triggering signal according to the corresponding relation shown in Figure 11, therefore can make the pulse energy of laser pulse Lp1, Lp2, Lp3 even.
Peak I pp by discharge current is larger, more shortens from starting of oscillation triggering signal till vibration stops the time width of triggering signal, thereby can make the pulse energy of laser pulse approach evenly.
Compared with light output, can be like a cork, with the peak I pp of short time measurement discharge current.Therefore, compared with the situation of regulating impulse width, the method based on embodiment 2 can shorten judges time T j(Figure 13 with measuring light output).Therefore,, even if the pulse width of the laser pulse that should penetrate is below 100 μ s, also can be suitable for the method based on above-described embodiment 2.
In above-described embodiment 2, during judging time T j, measure the peak I pp of discharge current, depended on Fig. 8 to sparking electrode 41(but also can measure) other physical quantitys of the electric power supplied with.For example, can measure the virtual value of discharge current.
If discharge condition changes, the voltage putting between pair of discharge electrodes 41 also changes.The variation of the electric power of supplying with to sparking electrode 41 is followed in the variation of this voltage.Therefore, as depending on Fig. 8 to sparking electrode 41() other physical quantitys of the electric power supplied with, also can adopt the peak value or the virtual value that put on the voltage between sparking electrode 41.As above, as long as the voltage that measurement applies to sparking electrode 41 or at least physical quantity of one of them of electric current.
Describe the present invention according to above embodiment, but the present invention is not limited to these.For example, can carry out various changes, improvement and combination etc., this is apparent to those skilled in the art.
Claims (11)
1. a laser processing device, wherein, has:
LASER Light Source, synchronizes and starts laser generation with the starting of oscillation triggering signal receiving from outside, and stops triggering signal with vibration and synchronize and stop laser generation;
Detector, detects at least physical quantity of one of them that depends on the electric power applying to described LASER Light Source and the laser pulse penetrating from described LASER Light Source; And
Control device, applies described starting of oscillation triggering signal to described LASER Light Source, and according to the testing result of the described physical quantity of utilizing described detector to detect, applies described vibration stop triggering signal to described LASER Light Source.
2. laser processing device according to claim 1, wherein,
Described detector detects the laser pulse penetrating from described LASER Light Source,
Described control device is taking detection moment of the laser pulse that utilizes described detector and detect as benchmark, in the moment that determines to apply described vibration and stop to described LASER Light Source triggering signal, apply described vibration in the determined moment to described LASER Light Source and stop triggering signal.
3. laser processing device according to claim 2, wherein,
The target pulse width of the laser pulse that described control device storage should be penetrated, in the moment of the time equating with described target pulse width in the detection moment of the laser pulse from utilizing described detector detection process, apply described vibration to described LASER Light Source and stop triggering signal.
4. laser processing device according to claim 1, wherein,
Described LASER Light Source has:
Laser gas medium;
Sparking electrode, excites described laser gas medium; And
Drive circuit, by receiving described starting of oscillation triggering signal, starts to supply with electric power to described sparking electrode, and stops triggering signal by receiving described vibration, stops supplying with electric power to described sparking electrode,
Described physical quantity be put on the voltage of described sparking electrode and electric current at least one of them,
Described control device, after applying described starting of oscillation triggering signal to described drive circuit, according to the detected value of the described physical quantity of utilizing described detector to detect, applies described vibration to described drive circuit and stops triggering signal.
5. laser processing device according to claim 4, wherein,
Described control device is after applying described starting of oscillation triggering signal to described drive circuit, according to the testing result of utilizing described detector to detect detecting before the judgement time through predetermining, calculate the time width that stops triggering signal from applying described starting of oscillation triggering signal till applying described vibration.
6. according to the laser processing device described in claim 4 or 5, wherein,
Described control device is controlled as follows: the described physical quantity that described detector detects is larger, make from described starting of oscillation triggering signal till described vibration to stop the time width of triggering signal shorter.
7. according to the laser processing device described in any one in claim 4 to 6, wherein,
Described in described control device memory by using the described physical quantity of detector measures with from described starting of oscillation triggering signal till described vibration stops the corresponding relation of the time of triggering signal,
According to the detected value of the described physical quantity of utilizing described detector to detect and described corresponding relation, obtain from described starting of oscillation triggering signal till described vibration stops the time width of triggering signal.
8. a laser processing, wherein, has following operation:
Apply the operation of starting of oscillation triggering signal to LASER Light Source, described LASER Light Source is synchronizeed and is started laser generation with the described starting of oscillation triggering signal receiving from outside, and stops triggering signal with vibration and synchronize and stop laser generation;
Detection depends at least operation of the physical quantity of one of them of the electric power applying to described LASER Light Source and the laser pulse penetrating from described LASER Light Source; And
According to the testing result of described physical quantity, apply described vibration and stop the operation of triggering signal to described LASER Light Source.
9. laser processing according to claim 8, wherein,
Detecting in the operation of described physical quantity, detect the rising moment of the described laser pulse penetrating from described LASER Light Source,
Stop in the operation of triggering signal applying described vibration, in the moment of the rising moment from described laser pulse through the time suitable with predefined target pulse width, apply described vibration to described LASER Light Source and stop triggering signal.
10. laser processing according to claim 8, wherein,
Described LASER Light Source comprises sparking electrode,
Detect the described physical quantity detecting in the operation of described physical quantity be put on the voltage of described sparking electrode or electric current at least one of them,
Applying the operation that described vibration stops triggering signal comprising:
According to the detected value of described physical quantity, calculate operation from the time width of electric power to described sparking electrode that supply with, and
In the moment through the described time width that calculates moment from applying described starting of oscillation triggering signal, apply described vibration and stop the operation of triggering signal to described LASER Light Source.
11. laser processings according to claim 10, wherein,
Calculating in the operation of described time width, according to from applied described starting of oscillation triggering signal time be carved into described voltage till the judgement time through predetermining or the detected value of electric current, calculate described time width.
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| JP2013056217A JP5988903B2 (en) | 2013-03-19 | 2013-03-19 | Laser processing apparatus and laser processing method |
| JP2013-067746 | 2013-03-28 | ||
| JP2013067746A JP5995767B2 (en) | 2013-03-28 | 2013-03-28 | Laser processing apparatus and laser processing method |
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| CN105624609A (en) * | 2014-11-21 | 2016-06-01 | 三星显示有限公司 | Deposition mask, method of manufacturing deposition mask, and method of manufacturing display apparatus |
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| KR101617080B1 (en) | 2016-04-29 |
| TW201438361A (en) | 2014-10-01 |
| CN104057203B (en) | 2016-04-20 |
| KR20140115250A (en) | 2014-09-30 |
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