TW201932749A - Lighting appliance characterized by suppressing temperature increase of electrolytic capacitor - Google Patents

Abstract

A purpose of the present invention is to provide a lighting appliance capable of suppressing temperature increase of an electrolytic capacitor. The lighting appliance 100 is equipped with: a light source 30 and a circuit substrate 210 installed with a power supply circuit 220 providing electric power to the light source 30. The power supply circuit 220 is provided with an electrolytic capacitor 221 and electronic components 222 other than the electrolytic capacitor 221. The circuit substrate 210 is provided with: a first mounting portion 211 installed with the electronic components 222; and a second mounting portion 212 which is formed as being protruded out from an end edge of the first mounting portion 211 while looking down the circuit substrate 210 and is installed with the electrolytic capacitor 221.

Description

Lighting appliances

The present invention relates to lighting equipment.

A lamp device (lighting fixture) having a flat and thin structure is known (for example, refer to Patent Document 1). Patent Document 1 discloses a lighting fixture having a lamp cap structure such as a GX53 type. The lighting fixture includes a light-emitting module on which a light-emitting element is mounted on a substrate; a power circuit that supplies power to the light-emitting module; and a housing that houses the light-emitting module. And power circuits.
[Previous Technical Literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-174601

[Problems to be Solved by Invention]

An electrolytic capacitor may be installed in a power supply circuit included in a lighting fixture. Since electrolytic capacitors are not heat resistant, it is desirable for electrolytic capacitors to suppress temperature rise.

The present invention aims to provide a lighting fixture capable of suppressing a temperature rise of an electrolytic capacitor.
[Methods for solving problems]

An aspect of the present invention includes a light source, and a light source; and a circuit board configured with a power supply circuit for supplying power to the light source, the power supply circuit having an electrolytic capacitor and electronic components other than the electrolytic capacitor; the circuit board having: The first mounting portion is provided with the electronic component; and the second mounting portion is formed to protrude from an end edge of the first mounting portion when the circuit board is viewed in a plan view, and the electrolytic capacitor is disposed.
[Inventive effect]

According to one aspect of the present invention, a temperature rise of an electrolytic capacitor can be suppressed.

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. The embodiments described below are general or specific examples. The numerical values, shapes, materials, constituent elements, etc. shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, in the constituent elements in the following embodiments, constituent elements that are not described in the independent claim item representing the highest-level concept are described as arbitrary constituent elements.

In addition, each picture is a schematic diagram, not necessarily a rigorous diagram. In addition, in each figure, the same code | symbol is attached | subjected to substantially the same structure, and description is abbreviate | omitted or it may abbreviate briefly.

In the drawings of the following embodiments, the Y-axis direction is, for example, the up-down direction (vertical direction), and the Y-axis positive direction side may be described as the lower side. The negative Y-axis side may be described as the upper side or the ceiling side. In a plane (horizontal plane) perpendicular to the Y axis, the X-axis direction and the Z-axis direction are perpendicular to each other.

In addition, in this specification, "approximately" means the error which arises at the time of manufacture or arrangement | positioning. For example, "substantially vertical" does not mean completely vertical, but means an error of several% or so.

(Implementation form)
[Construction of lighting equipment]
The structure of the luminaire 100 according to the embodiment will be described in detail with reference to FIGS. 1A to 8.

FIG. 1A is an external perspective view when viewed from the lower side of the lighting fixture 100 according to the embodiment. FIG. 1B is an external perspective view when viewed from the upper side of the lighting fixture 100 according to the embodiment. FIG. 2 is an exploded perspective view of the lighting fixture 100 according to the embodiment. FIG. 3 is an exploded perspective view for explaining the arrangement of the frame body 60, the reflection plate 20, and the translucent cover 10 in the lighting fixture 100 according to the embodiment. FIG. 4 is a cross-sectional view of the luminaire 100 according to the embodiment on the line IV-IV in FIG. 1A.

The lighting fixture 100 of FIGS. 1A to 4 includes a light transmitting cover 10, a reflecting plate 20, a light source 30, a heat sink 40, a cover member 50, a frame 60, and a circuit unit 200. A power circuit 220 is installed on the circuit board 210 of the circuit unit 200. The power circuit 220 is electrically connected to an external commercial power source through the lamp pin 240 and the wiring 241.

The luminaire 100 is a luminaire that emits illumination light. In the lighting fixture 100, for example, the bottom 67 side of the housing 60 is attached to a structural material such as a ceiling. In the luminaire 100, a wiring 241 formed by a metal or the like electrically connected to the lamp pin 240 is connected to an external commercial power source or the like (not shown). Power supplied from an external commercial power source (not shown) passes through the circuit section 200 and is supplied to the light source 30. The light source 30 converts the supplied electric power into light (illumination light), and emits the illumination light toward the positive Y-axis side. In this embodiment, the lighting fixture 100 is a lighting fixture having a GX53-1a base structure as an example.

The translucent cover 10 is disposed on the frame body 60 and is a cover member that can transmit the illumination light emitted from the light source 30. The translucent cover 10 is attached to the frame 60 so as to cover the light source 30. The light transmissive cover 10 is, for example, white or milky white, and has light diffusivity (light scattering property) and light transmittance.

The translucent cover 10 is disposed on the side where the illumination light from the light source 30 is emitted, and is attached to the frame 60. Specifically, as shown in FIG. 3, the light-transmitting cover 10 has a claw portion 11, and the claw portion 11 is engaged with a first groove portion 65 in the groove portion 64 formed in the groove formed on the inner surface of the frame 60, and is attached to the groove portion 64. Frame body 60.

A T-shaped notch portion 12 is formed on the periphery of the translucent cover 10. The translucent cover 10 and the frame 60 are adhered by an adhesive such as resin. The adhesive for bonding the light-transmitting cover 10 to the frame body 60 is applied to the light-transmitting cover 10 and the frame body 60 in a semi-solid (gel-like) state, and then cured. Specifically, the adhesive is applied to the entire circumferential surface of the transparent cover 10 and the adjacent frame 60. As a result, the transparent cover 10 and the frame 60 are adhered to each other and cannot be easily released. In addition, the light-transmitting cover 10 is provided with a notch portion 12, and is used for curing when the semi-solid adhesive is located in the notch portion 12, so that the light-transmitting cover 10 and the frame 60 are not easily loosened.

The shape of the notch portion 12 is not limited to a T-shape, and may be, for example, an L-shape in a direction in which the transparent cover 10 is engaged with the frame 60 (in this embodiment, the Y-axis direction) The structure of the notch is provided in the crossing direction.

The light-transmitting cover 10 is formed of glass, for example, but may be formed of a silicone resin, an acrylic resin, or a polycarbonate resin. In addition, the translucent cover 10 may have light diffusibility by screen printing on the surface. The light-transmitting cover 10 may have light-diffusing properties by containing a light-diffusing material (fine particles) such as silicon dioxide or calcium carbonate. In addition, the light-transmitting cover 10 can be made to have a light-diffusing property by forming a milky white light-diffusing film containing a light-diffusing material or the like on the surface (inside or outside) of the light-transmitting cover 10. In addition, the light-transmitting cover 10 can be made light-diffusive by forming fine irregularities on the surface of the light-transmitting cover 10 or by printing a dot pattern on the surface of the light-transmitting cover 10 by using a texture processing process or the like without using a light-diffusing material. . Further, the light-transmitting cover 10 may be made to have a light-diffusing property by combining the above-mentioned materials, shapes, and the like having light-diffusing properties.

The reflecting plate 20 is a reflecting member that reflects the illumination light from the light source 30 to the light transmitting cover 10 side. The reflecting plate 20 has a shape in which the diameter gradually decreases from the light transmitting cover 10 side to the light source 30 side. The reflection plate 20 is attached to the frame body 60. Specifically, as shown in FIG. 3, the reflecting plate 20 has a claw portion 21, and is attached by engaging the claw portion 21 to a groove formed on the inner surface of the frame 60, that is, the second groove portion 66 in the groove portion 64.于 箱体 60。 The frame 60. In addition, the translucent cover 10 has an engaging portion such as a groove that engages with the claw portion 21 of the reflection plate 20, and the reflection plate 20 can also be mounted by engaging the claw portion 21 with the engagement portion of the light transmission cover 10.于 光 盖 10。 In the transparent cover 10.

Further, in a plan view, an opening is formed in a central portion of the reflection plate 20, and a member that emits illumination light from the light source 30 is disposed in the opening. For example, when the light source 30 includes an LED (Light Emitting Diode) as a member that emits illumination light, the LED is disposed in the opening of the reflection plate 20.

The “plan view” refers to a case of viewing from the normal direction of the main surface 210 a of the circuit board 210. In the present embodiment, “plan view” refers to a case where the lighting fixture 100 is viewed from the Y axis.

The light source 30 is a light source that emits illumination light. The light source 30 emits, for example, white light as illumination light. In this embodiment, the light source 30 is a light-emitting module including a substrate and an LED mounted on the substrate as an example. The light source 30 is housed in the frame 60.

The light source 30 is not particularly limited as long as it can emit illumination light. The light source 30 may be, for example, a light-emitting module in which a substrate called a SMD (Surface Mount) device is mounted on a substrate. In addition, the light source 30 may be, for example, a COB (Chip On Board) module. The COB module directly mounts a bare LED chip that emits blue light on a substrate, and contains blue light as a component. The bare resin of the LED is sealed by a sealing resin that emits yellow fluorescent light by exciting light. The light source 30 emits white light generated by mixing the blue light emitted from the LED bare chip and the yellow fluorescent light emitted from the phosphor.

The heat sink 40 is a heat radiating member for radiating heat generated by the light source 30. The heat sink 40 is, for example, a sheet, and is disposed between the cover member 50 and the light source 30, and is in contact with the light source 30 and the frame 60 and is disposed in the frame 60. The heat sink 40 dissipates heat generated from the light source 30 to the frame 60. The material of the heat sink 40 is not particularly limited, and may be, for example, a metal such as aluminum.

The cover member 50 is an insulating member having an electrical insulation property for preventing the light source 30 and the circuit portion 200 from being electrically connected to each other from an expected place. The cover member 50 is, for example, a flat plate, is disposed between the light source 30 and the road portion 200 (the circuit board 210), and is disposed inside the frame 60. The cover member 50 is formed of, for example, a resin, and is not particularly limited as long as it can electrically insulate the light source 30 from the circuit portion 200.

The lamp pin 240 is supported by the cover member 50 and the frame 60 by sandwiching a part of the cover member 50 and the frame 60. Specifically, the lamp pin 240 is supported by the frame body 60 by being sandwiched between the protruding portion 51 protruding to the outside of the cover member 50 and the frame body 60 when the cover member 50 is viewed in plan. At least a part of the lamp pin 240 is exposed from the frame body 60 and is electrically connected through the power circuit 220 and the wiring 241. The lamp pin 240 is formed of, for example, a conductive metal material.

A hole is formed in each of the heat sink 40 and the cover member 50, and a metal wiring (not shown) for electrically connecting the light source 30 and the circuit portion 200 is disposed in each of the holes. The arrangement of the metal wiring for electrically connecting the light source 30 and the circuit unit 200 is not particularly limited. For example, a notch groove may be provided on each outer peripheral surface (peripheral edge) of the heat sink 40 and the cover member 50. A metal wiring is arranged in the notch groove.

The housing 60 is a housing for housing the circuit unit 200 including the circuit board 210, the power supply circuit 220, and the like, the light source 30, and the like. The housing 60 has a bottomed cylindrical shape and houses the circuit portion 200 so that the main surface 210 a of the circuit board 210 included in the circuit portion 200 and the bottom portion 67 are not in contact with each other and are substantially parallel.

The frame body 60 is formed with lamp pin hole portions 63 that are only the number of the lamp pin 240. The lamp pin hole portions 63 are holes for exposing the lamp pin 240 to the outside of the lighting device 100. In this embodiment, it is shown that the lighting fixture 100 has two lamp pins 240 and a lamp pin hole portion 63, respectively. The lamp pin 240 is disposed in the lamp pin hole portion 63.

The material of the frame 60 is not particularly limited, and may be, for example, a resin material such as PBT (Polybutylene terephthalate) containing glass fibers.

In addition, a wall portion 61 is formed inside the frame body 60 so as to space the interior of the frame body 60 into two regions.

FIG. 5 is a perspective view for explaining the inside of the lighting fixture 100 according to the embodiment. FIG. 6 is a bottom view for explaining the inside of the lighting fixture 100 according to the embodiment. FIG. 7 is a bottom view of a circuit board 210 included in the lighting fixture 100 according to the embodiment. FIG. 8 is a partial cross-sectional view for explaining the interior of the lighting fixture 100 according to the embodiment. In addition, in FIG. 8, for convenience of explanation, some illustrations of constituent elements such as the electronic component 222 are omitted.

The wall portion 61 is a plate-shaped wall, which is erected from the bottom 67 in the positive Y-axis direction, and is not electrically connected to the electronic components included in the lighting device 100 such as the power circuit 220. Specifically, the wall portion 61 extends from the bottom portion 67 of the frame body 60 in a direction substantially parallel to the normal line of the main surface 210 a of the circuit board 210.

An electrolytic capacitor 221 included in the power supply circuit 220 is disposed in a space partitioned by the wall portion 61 of the frame 60; and in another space, electrons that generate heat when being energized other than the electrolytic capacitor 221 included in the power circuit 220 are disposed Part 222. In other words, the wall portion 61 is disposed between the electrolytic capacitor 221 and the electronic component 222.

Further, a slit 61 a may be provided in the wall portion 61, and the slit 61 a is formed in a direction substantially parallel to a direction provided upright from the bottom portion 67 in the positive direction of the Y axis. In this embodiment, one slit 61a is provided in a direction substantially parallel to the direction in which the wall portion 61 is erected from the bottom 67. The number of slits 61a formed in the wall portion 61 is not particularly limited, and may be two or more.

Further, a hole portion 62 is formed in the bottom portion 67 of the frame body 60, and the hole portion 62 is a hole that allows the inside of the frame body 60 to communicate with the outside. Specifically, the bottom portion 67 of the frame 60 is a bottom portion 67 on the space side where the electrolytic capacitor 221 partitioned by the wall portion 61 of the frame 60 is disposed, and a hole portion 62 is provided. In other words, when viewed from the wall portion 61, a part of the frame 60 on the electrolytic capacitor 221 side forms a hole portion 62 that communicates the inside of the frame 60 and the outside of the lighting fixture 100. Thereby, for example, when the electrolytic capacitor 221 fails and the liquid contained in the main body portion 221a of the electrolytic capacitor 221 leaks out, the gas generated by the liquid vaporization can be dissipated to the outside of the housing 60.

In the present embodiment, two hole portions 62 are formed in the bottom portion 67. However, the number of the hole portions 62 is not particularly limited, and it may be one, or three or more.

The circuit unit 200 is a circuit for supplying power supplied from an external commercial power source to the light source 30. The circuit unit 200 includes a circuit board 210, a power circuit 220, and a lamp pin 240.

The circuit board 210 is a board on which electronic components constituting the power supply circuit 220 are mounted and which have metal wiring or the like (not shown). Specifically, the circuit board 210 is provided with a power source circuit 220 that supplies power to the light source 30. The power source circuit 220 includes an electrolytic capacitor 221 and electronic components 222 other than the electrolytic capacitor 221.

The power supply circuit 220 is a circuit for supplying power to the light source 30. Specifically, the power supply circuit 220 is a power supply circuit that converts power supplied from an external commercial power supply via the lamp pin 240 and the wiring 241 to the light source 30. The power circuit 220 is electrically connected to the light source 30 through a metal wiring (not shown). The components constituting the power supply circuit 220 include, for example, an electrolytic capacitor 221 and electronic components 222 such as a choke coil that generates heat when being energized, for electronic components other than the electrolytic capacitor 221.

As shown in FIG. 7, the electrolytic capacitor 221 is a radial lead type electrolytic capacitor having a cylindrical body portion 221 a and a lead 221 b connected to the body portion 221 a. Specifically, the electrolytic capacitor 221 has a structure in which the lead wire 221 b is present only on one surface side of the main body portion 221 a of the electrolytic capacitor 221 in the axial direction. In this embodiment, the main body portion 221a of the electrolytic capacitor 221 is cylindrical, and the axial direction of the main body portion 221a of the electrolytic capacitor 221 is parallel to the X-axis direction. A member useful as a capacitor is disposed inside the cylindrical body portion 221a.

As shown in FIG. 8, the lead 221 b is connected to the circuit board 210 by bending the axial direction of the main body portion 221 a and the main surface 210 a of the circuit board 210 in parallel.

In the present embodiment, the circuit board 210 is a component on which the power circuit 220 is mounted on the main surface 210a side of the circuit substrate 210, but electronic components may be mounted on a surface opposite to the main surface 210a.

As shown in FIG. 7, the circuit board 210 includes a first mounting section 211 in which electronic components 222 are arranged, and a second mounting section 212 formed from the first mounting section 211 when the circuit board 210 is viewed in plan. An end edge of the electrode protrudes, and an electrolytic capacitor 221 is disposed. When the circuit board 210 is viewed in a plan view, the direction in which the second mounting portion 212 protrudes from the first mounting portion 211 is substantially perpendicular to the axial direction of the main body portion 221a. In this embodiment, when the circuit board 210 is viewed in plan, the area of the second mounting portion 212 is smaller than the area of the first mounting portion 211. The second mounting portion 212 is provided with metal wiring and one end of the lead 221b of the electrolytic capacitor 221 and is not provided with the electronic component 222. Therefore, the area of the second mounting portion 212 can be smaller than that of the first mounting portion when viewed from above. The area of the mounting portion 211.

When the circuit board 210 is viewed in a plan view, the main body portion 221 a is disposed so as not to overlap the circuit board 210.

Further, for example, when the circuit board 210 is viewed in a plan view, a gap 230 is formed between the main body portion 221 a and the first mounting portion 211. The wall portion 61 is formed on the bottom portion 67 of the frame body 60 so as to be positioned in the gap 230.

In addition, the height of the wall portion 61 is not particularly limited, and for example, at least half the height of the electrolytic capacitor 221 may be used. In this embodiment, the height of the wall portion 61 refers to the width in the Y-axis direction.

As shown in FIG. 8, in the present embodiment, a case where the height of the wall portion 61 is approximately half the height of the body portion 221 a of the electrolytic capacitor 221 is taken as an example.

The depth of the slit 61a is not particularly limited, and may be formed to the bottom 67 as shown in FIG.

8 illustrates a case where the main surface 210a of the circuit board 210 is flush with the upper side (the negative side of the Y axis) of the main body portion 221a of the electrolytic capacitor 221, but the positional relationship between the main surface 210a and the main body portion 221a is not limited this. For example, when viewed from a direction parallel to the main surface 210 a of the circuit board 210, the main body portion 221 a may be disposed so as to partially overlap the circuit board 210. That is, the bending rate, length, and the like of the lead 221b may be adjusted so that the main body portion 221a is further positioned on the bottom 67 side.

[Effects, etc.]
As described above, the lighting fixture 100 includes the light source 30 and the circuit board 210, and the power circuit 220 for supplying power to the light source 30 is disposed. The power circuit 220 includes the electrolytic capacitor 221 and electronic components 222 other than the electrolytic capacitor 221. The circuit board 210 includes a first mounting portion 211 in which electronic components 222 are arranged, and a second mounting portion 212 formed so as to protrude from an end edge of the first mounting portion 211 when the circuit substrate 210 is viewed in plan view, and is disposed thereon. Electrolytic capacitor 221.

With such a configuration, the electronic components 222 and the electrolytic capacitor 221 can be separated from each other and arranged on the circuit board 210. Therefore, it is difficult for the heat generated in the electronic component 222 to reach the electrolytic capacitor 221. Therefore, according to the lighting fixture 100, the temperature rise of the electrolytic capacitor 221 can be suppressed.

For example, the electrolytic capacitor 221 may be a radial lead type electrolytic capacitor having a cylindrical body portion 221a and a lead 221b connected to the body portion 221a. In this case, the lead wire 221b may be connected to the circuit substrate 210 by bending the axial direction of the main body portion 221a and the main surface 210a of the circuit substrate 210 in a substantially parallel manner.

Even if the lead 221b is bent so that the main body portion 221a approaches the circuit substrate 210 side, the electrolytic capacitor 221 is separated from the electronic component 222 and disposed on the circuit substrate 210, so the heat generated by the electronic component 222 does not easily reach the electrolytic capacitor. 221. Therefore, by bending the lead 221b and bringing the main body portion 221a closer to the circuit substrate 210 side, it is possible to suppress the temperature rise of the electrolytic capacitor 221 and reduce the height of the circuit portion 200 at the same time.

In addition, for example, when the circuit board 210 is viewed in a plan view, the direction in which the second mounting portion 212 protrudes from the first mounting portion 211 is substantially perpendicular to the axial direction of the main body portion 221a.

With this configuration, the area of the circumscribed circle of the circuit portion 200 can be reduced when the circuit portion 200 is viewed in plan. Therefore, the lighting fixture 100 can be miniaturized.

In addition, for example, when the circuit board 210 is viewed in a plan view, the main body portion 221 a and the circuit board 210 may not overlap.

With this configuration, the heat of the circuit board 210 is not easily reached by the main body portion 221a of the electrolytic capacitor 221. Therefore, the temperature rise of the electrolytic capacitor 221 can be further suppressed.

Further, for example, when viewed from a direction parallel to the main surface 210a of the circuit board 210, the main body portion 221a and the circuit board 210 may partially overlap.

With this configuration, the circuit portion 200 can be made thinner.

For example, the lighting fixture 100 may further include a wall portion 61 disposed between the electrolytic capacitor 221 and the electronic component 222.

With this configuration, the heat generated in the electronic component 222 does not easily reach the electrolytic capacitor 221 through the wall portion 61. Therefore, according to the lighting fixture 100, the temperature rise of the electrolytic capacitor 221 can be further suppressed.

For example, when the circuit board 210 is viewed in a plan view, a gap 230 may be formed between the main body portion 221 a and the first mounting portion 211, and the wall portion 61 may be located in the gap 230.

For example, although the wall portion 61 may be formed on the circuit board 210, the configuration in which the wall portion 61 is disposed in the gap 230 makes it difficult for the heat generated by the electronic component 222 to reach the wall portion 61. Therefore, the temperature rise of the electrolytic capacitor 221 can be further suppressed.

Further, for example, a slit 61 a may be formed in the wall portion 61, and the slit 61 a extends in a direction parallel to the normal line of the main surface 210 a of the circuit board 210.

According to this structure, the wall portion 61 has stronger elasticity than the case where the slit 61a is not formed, and the wall portion 61 is less likely to be broken.

In addition, for example, the lighting fixture 100 may further include a frame 60 in which a wall portion 61 is formed and a circuit board 210 is housed.

With this configuration, the wall portion 61 can be more easily formed in the lighting fixture 100.

Further, for example, the frame body 60 may have a bottomed cylindrical shape, and the circuit board 210 may be disposed on the frame body 60 so that the main surface 210 a of the circuit board 210 and the bottom portion 67 of the frame body 60 are substantially parallel. In this case, the wall portion 61 may be extended from the bottom portion 67 of the frame body 60 in a direction parallel to the normal line of the main surface 210 a of the circuit board 210.

By extending the wall portion 61 from the bottom of the frame body 60 in a direction parallel to the normal line of the main surface 210 a of the circuit board 210, the wall portion 61 can be easily located in the electrolytic capacitor when the circuit portion 200 is arranged in the frame body 60. 221 and electronic parts 222. Therefore, according to this structure, assembly of the lighting fixture 100 can be facilitated.

For example, the lighting fixture 100 may further include a cover member 50 between the circuit board 210 and the light source 30 and having insulation properties; and a lamp pin 240 supported by the cover member 50 and the frame 60, at least A part is exposed from the housing 60 and is electrically connected to the power circuit 220.

With this configuration, the lamp pin 240 can be easily attached to the frame 60. In particular, according to such a configuration, it is possible to attach the light pin 240 to the frame 60 without using a member for supporting the light pin 240 to the frame 60.

For example, the lighting fixture 100 may further include a sheet-like heat sink 40 between the cover member 50 and the light source 30.

With this configuration, the heat generated in the light source 30 does not easily reach the electrolytic capacitor 221 side. Therefore, the temperature rise of the electrolytic capacitor 221 can be further suppressed.

In addition, for example, when viewed from the wall portion 61, it may be a part of the frame 60 on the electrolytic capacitor 221 side, and a hole portion 62 may be formed to communicate the inside of the frame 60 and the outside of the lighting fixture.

According to this structure, when the electrolytic capacitor 221 fails, danger such as explosion can be reduced.

In addition, for example, the lighting device 100 may further include: a light transmitting cover 10 covering the light source 30 and mounted on the frame 60; and an adhesive agent for adhering the frame 60 and the light transmitting cover 10. In addition, a notch-shaped notch portion 12 in which an adhesive is arranged may be formed on an end edge of the light-transmitting cover 10.

With this configuration, the light-transmitting cover 10 is less likely to come off the frame body 60.

In addition, for example, the frame 60 may be formed of a resin containing glass fibers.

The housing of a lighting fixture such as a downlight can be made of a metal material such as aluminum die-casting. In this way, the heat emitted from the light source inside the lighting fixture and the electronic components that generate heat from the power supply circuit is easily dissipated to the housing 60. This makes it possible to suppress the failure of components such as electrolytic capacitors which are liable to fail due to heat.

On the other hand, although resin materials such as PBT are lighter than metal materials, they do not easily dissipate heat. However, since the wall portion 61 is formed like the lighting fixture 100, the electrolytic capacitor 221 is not easily affected by heat. Therefore, even if a resin material is used for the housing 60, the electrolytic capacitor 221 is unlikely to fail. Therefore, according to the lighting fixture 100, by using a resin material for the frame 60, it is possible to suppress the temperature rise of the electrolytic capacitor 221 and to reduce the weight.

(Other embodiments)
As mentioned above, although the lighting fixture of embodiment was demonstrated, this invention is not limited to this embodiment.

The shape of the lighting fixture described in the above embodiment is an example. For example, in the embodiment described above, the shape of the lighting device in a plan view is circular, but the shape of the lighting device in a plan view may be a polygon such as a rectangle.

Moreover, in the said embodiment, although the light emitting module with LED was used as a light source, the aspect of a light source is not specifically limited. For example, the light source may also use a fluorescent lamp, a metal halide lamp, a sodium lamp, a halogen lamp, a xenon lamp, or a neon lamp, instead of the LED light emitting module. The light source may be inorganic electroluminescence, organic electroluminescence, chemiluminescence, semiconductor laser, or the like.

Further, the electronic component mounted on the first mounting portion of the circuit board may include an electrolytic capacitor. That is, at least one electrolytic capacitor to be mounted (arranged) on the circuit board of the lighting fixture of this embodiment may be mounted on the second mounting portion.

Although one or more lighting fixtures have been described based on the embodiment, the present invention is not limited to this embodiment. As long as the gist of the present invention is not exceeded, various modifications considered by a person having ordinary knowledge in the technical field to the present embodiment, or a configuration constructed by combining constituent elements of different embodiments, may also be included in the present embodiment. Within the scope of one or more aspects of the invention.

10‧‧‧Translucent cover

11, 21‧‧‧ claw

12‧‧‧ gap

20‧‧‧Reflector

30‧‧‧ light source

40‧‧‧ heat sink

50‧‧‧ cover member

51‧‧‧ protrusion

60‧‧‧Frame

61‧‧‧Wall

61a‧‧‧Slit

62‧‧‧ Hole

63‧‧‧light pin hole

64‧‧‧Gully

65‧‧‧The first groove

66‧‧‧The second groove

67‧‧‧ bottom

100‧‧‧lighting appliances

200‧‧‧Circuit Department

210‧‧‧circuit board

210a‧‧‧Main face

211‧‧‧The first installation department

212‧‧‧Second installation department

220‧‧‧Power circuit

221‧‧‧ electrolytic capacitor

221a‧‧‧Body

221b‧‧‧Leader

222‧‧‧Electronic parts

230‧‧‧ Clearance

240‧‧‧light pin

241‧‧‧Wiring

[Fig. 1A] Fig. 1A is an external perspective view when viewed from the lower side of the lighting fixture according to the embodiment.

[FIG. 1B] FIG. 1B is an external perspective view when viewed from the upper side of the lighting fixture according to the embodiment.

[Fig. 2] Fig. 2 is an exploded perspective view of the lighting fixture according to the embodiment.

[Fig. 3] Fig. 3 is an exploded perspective view for explaining the arrangement of a frame body, a reflecting plate, and a light transmitting cover in the lighting fixture according to the embodiment.

[FIG. 4] FIG. 4 is a cross-sectional view of the lighting fixture according to the embodiment in the line IV-IV in FIG.

[Fig. 5] Fig. 5 is a perspective view for explaining the interior of the lighting fixture according to the embodiment.

[FIG. 6] FIG. 6 is a bottom view for explaining the interior of the lighting fixture according to the embodiment.

[Fig. 7] Fig. 7 is a bottom view of a circuit board provided in the lighting fixture according to the embodiment.

[FIG. 8] FIG. 8 is a partial cross-sectional view for explaining the interior of the lighting fixture according to the embodiment.

Claims (15)

A lighting appliance comprising: Light source; and The circuit board is provided with a power supply circuit for supplying power to the light source, and the power supply circuit includes an electrolytic capacitor and electronic components other than the electrolytic capacitor; The circuit substrate has: A first installation section where the electronic component is arranged; and The second mounting portion is formed to protrude from an end edge of the first mounting portion when the circuit board is viewed in a plan view, and the electrolytic capacitor is arranged. For example, the lighting fixtures under the scope of patent application No. 1 in which: The electrolytic capacitor is a radial lead type electrolytic capacitor, and has a cylindrical body portion and a lead connected to the body portion. The lead is bent and connected to the circuit board so that the axial direction of the main body portion is substantially parallel to the main surface of the circuit board. For example, the lighting appliance in the scope of patent application No. 2 wherein, When the circuit board is viewed in a plan view, a direction in which the second mounting portion protrudes from the first mounting portion is substantially perpendicular to an axial direction of the main body portion. If you apply for a lighting device in the scope of patent application 2 or 3, When the circuit board is viewed from above, The body portion does not overlap the circuit substrate. If you apply for a lighting device in the scope of patent application 2 or 3, When viewed from a direction parallel to the main surface of the circuit board, The body portion partially overlaps the circuit substrate. If the patent application scope of the lighting equipment 2 or 3, including: A wall portion is disposed between the electrolytic capacitor and the electronic component. For example, the lighting device under the scope of application for patent No. 6 wherein: When the circuit board is viewed from above, A gap is formed between the body portion and the first installation portion, The wall portion is located in the gap. For example, the lighting device under the scope of application for patent No. 6 wherein: A slit is formed in the wall portion, and the slit extends in a direction parallel to a normal line of the main surface of the circuit substrate. For example, the lighting fixtures under the scope of patent application No. 6 include: The frame is formed with the wall portion and houses the circuit board. For example, the lighting fixtures under the scope of patent application No. 9 in which: The frame system has a bottom tube shape, The circuit board is disposed on the frame such that the main surface of the circuit board is substantially parallel to the bottom of the frame. The wall portion extends from the bottom of the frame toward a direction parallel to the normal line of the main surface of the circuit board. For example, the lighting fixtures under the scope of patent application No. 9 include: A cover member located between the circuit substrate and the light source and having insulation properties; and The lamp pin is supported by the cover member and the frame. At least a part of the lamp pin is exposed from the frame and is electrically connected to the power circuit. For example, the lighting fixtures under the scope of patent application No. 11 in which: A thin sheet-shaped heat sink is further included between the cover member and the light source. For example, the lighting fixtures under the scope of patent application No. 9 in which: When viewed from the wall portion, a hole is formed in a part of the casing on the electrolytic capacitor side to communicate the inside of the casing and the outside of the lighting fixture. For example, the lighting fixtures under the scope of patent application No. 9 include: A light-transmitting cover covering the light source and mounted on the frame; and An adhesive for adhering the frame to the transparent cover; A notch-shaped notch portion is formed on an end edge of the transparent cover to arrange the adhesive. For example, the lighting fixtures under the scope of patent application No. 9 in which: The frame system is formed of a resin containing glass fibers.