JP2019133766A - Lighting device - Google Patents

Abstract

To provide a lighting device which inhibits temperature rise of an electrolytic capacitor.SOLUTION: A lighting device 100 includes: a light source 30; and a circuit board 210 in which a power supply circuit 220 which supplies electric power to the light source 30 and has an electrolytic capacitor 221 and electronic components 222 other than the electrolytic capacitor 221 is disposed. The circuit board 210 has: a first mounting part 211 in which the electronic components 222 are disposed; and a second mounting part 212 which is formed protruding from an end edge of the first mounting part 211 when the circuit board 210 is viewed in a plan view and in which the electrolytic capacitor 221 is disposed.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a lighting fixture.

  Conventionally, there is a lamp device (lighting fixture) having a flat thin structure (see, for example, Patent Document 1). Patent Document 1 includes a light emitting module in which a light emitting element is mounted on a substrate, a power supply circuit that supplies power to the light emitting module, and a housing that houses the light emitting module and the power supply circuit, and has a base structure such as a GX53 type. A lighting fixture is disclosed.

JP 2017-174601 A

  An electrolytic capacitor may be mounted on a power supply circuit included in the lighting fixture. Since the electrolytic capacitor is vulnerable to heat, the electrolytic capacitor is required to suppress the temperature rise.

  The present invention provides a lighting fixture in which the temperature rise of the electrolytic capacitor is suppressed.

  A lighting apparatus according to an aspect of the present invention includes a light source, a power supply board that supplies power to the light source, and a circuit board on which a power supply circuit including an electrolytic capacitor and an electronic component other than the electrolytic capacitor is disposed. The circuit board is formed so as to protrude from an edge of the first mounting part when the circuit board is viewed in plan, and the electrolytic capacitor is disposed on the circuit board. And a second mounting portion to be arranged.

  According to the lighting apparatus according to one aspect of the present invention, the temperature increase of the electrolytic capacitor is suppressed.

FIG. 1A is an external perspective view of the lighting apparatus according to the embodiment when viewed from the lower side. FIG. 1B is an external perspective view when seen from the upper side of the lighting apparatus according to the embodiment. FIG. 2 is an exploded perspective view of the lighting fixture according to the embodiment. FIG. 3 is an exploded perspective view for explaining the arrangement of the housing, the reflecting plate, and the light-transmitting cover in the lighting apparatus according to the embodiment. 4 is a cross-sectional view of the lighting apparatus according to the embodiment, taken along line IV-IV in FIG. 1A. FIG. 5 is a perspective view for explaining the inside of the lighting fixture according to the embodiment. FIG. 6 is a bottom view for explaining the inside of the lighting fixture according to the embodiment. FIG. 7 is a bottom view showing a circuit board provided in the lighting fixture according to the embodiment. FIG. 8 is a partial cross-sectional view for explaining the inside of the lighting fixture according to the embodiment.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. Numerical values, shapes, materials, components, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements.

  Each figure is a mimetic diagram and is not necessarily illustrated strictly. In each figure, substantially the same configuration is denoted by the same reference numeral, and redundant description may be omitted or simplified.

  In the drawings of the following embodiments, the Y-axis direction is, for example, the vertical direction (vertical direction), and the Y-axis positive direction side may be described as the lower side. Moreover, the Y-axis negative direction side may be described as an upper side or a ceiling side. The X-axis direction and the Z-axis direction are directions orthogonal to each other on a plane (horizontal plane) perpendicular to the Y-axis.

  Further, in this specification, “substantially” means including an error that occurs during manufacture or arrangement. For example, “substantially orthogonal” means not only completely orthogonal but also includes an error of about several percent.

(Embodiment)
[Configuration of lighting equipment]
With reference to FIG. 1A-FIG. 8, the structure of the lighting fixture 100 which concerns on embodiment is demonstrated in detail.

  FIG. 1A is an external perspective view when viewed from the lower side of lighting apparatus 100 according to the embodiment. FIG. 1B is an external perspective view when viewed from above the lighting apparatus 100 according to the embodiment. FIG. 2 is an exploded perspective view of the lighting fixture 100 according to the embodiment. FIG. 3 is an exploded perspective view for explaining the arrangement of the housing 60, the reflecting plate 20, and the translucent cover 10 in the lighting fixture 100 according to the embodiment. FIG. 4 is a cross-sectional view of the luminaire 100 according to the embodiment, taken along line IV-IV in FIG. 1A.

  The luminaire 100 shown in FIGS. 1A to 4 includes a translucent cover 10, a reflecting plate 20, a light source 30, a heat sink 40, a cover member 50, a housing 60, and a circuit unit 200. A power supply circuit 220 is mounted on the circuit board 210 of the circuit unit 200, and the power supply circuit 220 is electrically connected to an external commercial power supply via the lamp pin 240 and the wiring 241.

  The luminaire 100 is a luminaire that emits illumination light. As for the lighting fixture 100, the bottom 67 side of the housing | casing 60 is attached to construction materials, such as a ceiling, for example. In the luminaire 100, a wiring 241 formed of metal or the like electrically connected to the lamp pin 240 is connected to an external commercial power source. The electric power supplied from the external commercial power supply is supplied to the light source 30 via the circuit unit 200. The light source 30 converts the supplied power into light (illumination light), and emits illumination light toward the Y axis positive direction. In the present embodiment, as the lighting fixture 100, a lighting fixture having a GX53-1a base structure is illustrated.

  The translucent cover 10 is a cover member that is disposed in the housing 60 and transmits the illumination light emitted from the light source 30. The translucent cover 10 is attached to the housing 60 so as to cover the light source 30. The translucent cover 10 is, for example, white or milky white and has light diffusibility (light scattering) and translucency.

  The translucent cover 10 is disposed on the side from which the illumination light from the light source 30 is emitted, and is attached to the housing 60. Specifically, as shown in FIG. 3, the translucent cover 10 has a claw portion 11, and the claw portion 11 is a first groove portion of the groove portions 64 that are grooves formed on the inner surface of the housing 60. By being engaged with 65, it is attached to the housing 60.

  Further, a cutout portion 12 that is a T-shaped cutout is formed on the periphery of the translucent cover 10. The translucent cover 10 and the housing | casing 60 are adhere | attached with adhesive agents, such as resin. The adhesive that bonds the translucent cover 10 and the housing 60 is applied to the translucent cover 10 and the housing 60 in a semi-solid state (gel), and then solidified. Specifically, the adhesive is applied to the entire circumferential surface between the translucent cover 10 and the casing 60 that is in close proximity. Thereby, the translucent cover 10 and the housing | casing 60 become difficult to remove | deviate by adhere | attaching. Furthermore, by providing the cutout portion 12 in the translucent cover 10, the translucent cover 10 and the housing 60 are solidified in a state where the semi-solid adhesive is positioned in the cutout portion 12. It becomes difficult to come off.

  Note that the shape of the notch 12 is not limited to a T-shape, but is an L-shape or the like, for example, in a direction in which the translucent cover 10 is engaged with the housing 60 (in the present embodiment, A structure in which a notch is provided in a direction crossing (Y-axis direction) is preferable.

  The translucent cover 10 is formed of, for example, glass, but may be formed of silicone resin, acrylic resin, or polycarbonate resin. Moreover, the translucent cover 10 may have a light diffusibility by performing silk printing on the surface. Moreover, the translucent cover 10 may have a light diffusibility by containing light diffusing materials (fine particles) such as silica or calcium carbonate. Moreover, the translucent cover 10 may have a light diffusibility by forming the milky white light-diffusion film containing a light-diffusion material etc. on the surface (inner surface or outer surface) of the translucent cover 10. FIG. Further, the light-transmitting cover 10 is formed by forming minute irregularities on the surface of the light-transmitting cover 10 by using a texture processing or the like instead of using a light diffusing material or printing a dot pattern on the surface of the light-transmitting cover 10. May have light diffusibility. Moreover, the translucent cover 10 may have light diffusibility by combining the material, shape, etc. which give the light diffusivity mentioned above.

  The reflecting plate 20 is a reflecting member that reflects the illumination light from the light source 30 toward the translucent cover 10. The reflecting plate 20 is shaped like a wax whose diameter is reduced from the light transmitting cover 10 side toward the light source 30 side. The reflection plate 20 is attached to the housing 60. Specifically, as shown in FIG. 3, the reflector 20 has a claw portion 21, and the claw portion 21 is a second groove portion 66 of the groove portions 64 that are grooves formed on the inner surface of the housing 60. It is attached to the housing | casing 60 by engaging. The translucent cover 10 has an engaging portion such as a groove that engages with the claw portion 21 of the reflecting plate 20, and the reflecting plate 20 is engaged with the engaging portion of the translucent cover 10 and the claw portion 21. By doing so, it may be attached to the translucent cover 10.

  Further, when viewed in a plan view, an opening is formed in the central portion of the reflecting plate 20, and a member that emits illumination light from the light source 30 is disposed in the opening. For example, when the light source 30 includes an LED (Light Emitting Diode) as a member that emits illumination light, the LED is disposed in the opening of the reflection plate 20.

  Note that the “plan view” indicates a case when viewed from the normal direction of the main surface 210a of the circuit board 210. In the present embodiment, “plan view” indicates a case where the luminaire 100 is viewed from the Y-axis direction.

  The light source 30 is a light source that emits illumination light. For example, the light source 30 emits white light as illumination light. In the present embodiment, as the light source 30, a light emitting module including a substrate and an LED mounted on the substrate is illustrated. The light source 30 is accommodated in the housing 60.

  Note that the light source 30 is not particularly limited as long as it can emit illumination light. The light source 30 may be, for example, a light emitting module in which a so-called SMD (Surface Mount Device) type LED device is mounted on a substrate. In addition, the light source 30 is a so-called LED bare chip that is mounted directly on a substrate, for example, an LED bare chip that emits blue light, and is sealed with a sealing resin that includes a phosphor that emits yellow fluorescence using blue light as excitation light. A COB (Chip On Board) module may be used. The light source 30 emits white light generated by mixing blue light emitted from the LED bare chip and yellow fluorescence emitted from the phosphor.

  The heat sink 40 is a heat radiating member for radiating heat generated by the light source 30. The heat sink 40 has, for example, a sheet shape, and is disposed between the cover member 50 and the light source 30 and in contact with the light source 30 and the housing 60 in the housing 60. The heat sink 40 releases heat generated by the light source 30 to the housing 60. Although the material of the heat sink 40 is not specifically limited, For example, they are metals, such as aluminum.

  The cover member 50 is an insulating member having an electrical insulating property for preventing the light source 30 and the circuit unit 200 from being electrically connected at an unintended location. The cover member 50 is, for example, a flat plate shape, and is disposed in the housing 60 between the light source 30 and the circuit unit 200 (circuit board 210). The cover member 50 is formed of, for example, resin, but is not limited as long as the light source 30 and the circuit unit 200 can be electrically insulated.

  The lamp pin 240 is supported by the cover member 50 and the housing 60 by being partially sandwiched between the cover member 50 and the housing 60. Specifically, the lamp pin 240 is supported by the housing 60 by being sandwiched between the projection 51 and a housing 60 partially protruding outward from the cover member 50 when the cover member 50 is viewed in plan view. Has been. The lamp pin 240 is at least partially exposed from the housing 60 and is electrically connected to the power supply circuit 220 via the wiring 241. The lamp pin 240 is made of, for example, a conductive metal material.

  Holes are formed in the heat sink 40 and the cover member 50, respectively, and metal wirings (not shown) that electrically connect the light source 30 and the circuit unit 200 are disposed in the respective holes. The arrangement of the metal wirings that electrically connect the light source 30 and the circuit unit 200 is not particularly limited. For example, a notch groove is formed on each outer peripheral surface (periphery) of the heat sink 40 and the cover member 50. The metal wiring may be provided in the notch groove.

  The case 60 is a case that houses the circuit unit 200 including the circuit board 210, the power supply circuit 220, and the like, the light source 30, and the like. The casing 60 has a bottomed cylindrical shape, and accommodates the circuit unit 200 so that the main surface 210a of the circuit board 210 included in the circuit unit 200 and the bottom 67 are not in contact with each other and are substantially parallel to each other. Yes.

  The housing 60 is formed with lamp pin holes 63, which are holes for exposing the lamp pins 240 to the outside of the lighting fixture 100, as many as the number of the lamp pins 240. In the present embodiment, the case where the lighting fixture 100 has two lamp pins 240 and two lamp pin holes 63 is shown. The lamp pin 240 is disposed in the lamp pin hole 63.

  Although the material of the housing | casing 60 is not specifically limited, For example, it is resin materials, such as PBT (Polybutylene terephthalate) in which the glass fiber was included.

  In addition, a wall portion 61 that partitions the internal space of the housing 60 into two is formed inside the housing 60.

  FIG. 5 is a perspective view for explaining the inside of the lighting fixture 100 according to the embodiment. FIG. 6 is a bottom view for explaining the inside of the lighting fixture 100 according to the embodiment. FIG. 7 is a bottom view showing a circuit board 210 provided in the lighting fixture 100 according to the embodiment. FIG. 8 is a partial cross-sectional view for explaining the inside of the luminaire 100 according to the embodiment. In FIG. 8, some components such as the electronic component 222 are not shown for the sake of explanation.

  The wall portion 61 is a plate-like wall that is erected from the bottom portion 67 in the positive Y-axis direction and is not electrically connected to the electronic components included in the lighting apparatus 100 such as the power supply circuit 220. Specifically, the wall 61 extends from the bottom 67 of the housing 60 in a direction substantially parallel to the normal line of the main surface 210 a of the circuit board 210.

  An electrolytic capacitor 221 provided in the power supply circuit 220 is disposed in one space partitioned by the wall portion 61 of the housing 60, and an electronic component 222 that generates heat when energized other than the electrolytic capacitor 221 provided in the power supply circuit 220 in the other space. Is placed. In other words, the wall portion 61 is disposed between the electrolytic capacitor 221 and the electronic component 222.

  The wall portion 61 may be provided with a slit 61a formed in a direction substantially parallel to the direction erected from the bottom portion 67 in the positive Y-axis direction. In the present embodiment, one slit 61 a is provided in a direction substantially parallel to the direction in which the wall portion 61 stands from the bottom portion 67. The number of slits 61a formed in the wall portion 61 is not particularly limited, and may be two or more.

  In addition, a hole portion 62 that is a hole for communicating the inside and the outside of the housing 60 is formed in the bottom 67 of the housing 60. Specifically, a hole 62 is formed in the bottom 67 of the housing 60 and on the space 67 where the electrolytic capacitor 221 partitioned by the wall 61 of the housing 60 is disposed. In other words, as viewed from the wall portion 61, a hole portion 62 that connects the inside of the housing 60 and the outside of the lighting fixture 100 is formed in a part of the housing 60 on the electrolytic capacitor 221 side. In this way, for example, when the liquid contained in the main body portion 221a of the electrolytic capacitor 221 leaks when the electrolytic capacitor 221 fails, the gas generated by the vaporization of the liquid is removed from the housing 60. Can escape to the outside.

  In the present embodiment, two holes 62 are formed in the bottom 67, but the number of holes 62 is not particularly limited, and may be one or three or more.

  The circuit unit 200 is a circuit for supplying power supplied from an external commercial power source to the light source 30. The circuit unit 200 includes a circuit board 210, a power supply circuit 220, and a lamp pin 240.

  The circuit board 210 is a board on which electronic components constituting the power supply circuit 220 are mounted, and has metal wiring (not shown). Specifically, the circuit board 210 is a power supply circuit 220 that supplies power to the light source 30, and is a circuit board on which the power supply circuit 220 including the electrolytic capacitor 221 and the electronic component 222 other than the electrolytic capacitor 221 is disposed.

  The power supply circuit 220 is a circuit for supplying power to the light source 30. Specifically, the power supply circuit 220 is a power supply circuit that converts the power supplied from the external commercial power supply via the lamp pin 240 and the wiring 241 and supplies the converted power to the light source 30. The power supply circuit 220 is electrically connected to the light source 30 via a metal wiring (not shown). The components constituting the power supply circuit 220 include, for example, an electrolytic capacitor 221 and electronic components 222 other than the electrolytic capacitor 221 such as a choke coil that generates heat when energized.

  As shown in FIG. 7, the electrolytic capacitor 221 is a radial lead type electrolytic capacitor having a cylindrical main body 221a and a lead wire 221b connected to the main body 221a. Specifically, the electrolytic capacitor 221 has a structure in which the lead wire 221b exists only on one surface side in the axial direction of the main body 221a of the electrolytic capacitor 221. In the present embodiment, body portion 221a of electrolytic capacitor 221 is cylindrical, and the axial direction of body portion 221a of electrolytic capacitor 221 is a direction parallel to the X-axis direction. A member that functions as a capacitor is disposed inside the cylindrical main body 221a.

  As shown in FIG. 8, the lead wire 221b is bent and connected to the circuit board 210 so that the axial direction of the main body portion 221a and the main surface 210a of the circuit board 210 are substantially parallel.

  In the present embodiment, the circuit board 210 has components constituting the power supply circuit 220 mounted on the main surface 210a side of the circuit board 210, but the electronic component is mounted on the surface opposite to the main surface 210a. May be implemented.

  In addition, as shown in FIG. 7, the circuit board 210 is formed so as to protrude from the edge of the first mounting part 211 when the circuit board 210 is viewed in plan and the first mounting part 211 on which the electronic component 222 is arranged. And a second mounting part 212 in which the electrolytic capacitor 221 is disposed. In addition, when the circuit board 210 is viewed in plan, the direction in which the second mounting portion 212 protrudes from the first mounting portion 211 and the axial direction of the main body portion 221a are substantially orthogonal. In the present embodiment, when the circuit board 210 is viewed in plan, the area of the second mounting part 212 is smaller than the area of the first mounting part 211. The second mounting portion 212 is provided with a metal wiring, and since the electronic component 222 is not disposed except for one end of the lead wire 221b of the electrolytic capacitor 221 being connected, The area of the part 212 can be made smaller than the area of the first mounting part 211.

  Further, when the circuit board 210 is viewed in a plan view, the main body 221 a is disposed so as not to overlap the circuit board 210.

  For example, when the circuit board 210 is viewed in plan, a gap 230 is formed between the main body portion 221a and the first mounting portion 211. The wall 61 is formed on the bottom 67 of the housing 60 so as to be positioned in the gap 230.

  In addition, the height of the wall part 61 is not specifically limited, For example, the height of the electrolytic capacitor 221 should be at least half the height. In the present embodiment, the height of the wall portion 61 is the width in the Y-axis direction.

  As shown in FIG. 8, in the present embodiment, the case where the height of the wall portion 61 is located approximately half the height of the main body portion 221 a of the electrolytic capacitor 221 is illustrated.

  Further, the depth of the slit 61a is not particularly limited, but may be formed up to the bottom 67 as shown in FIG.

  8 illustrates the case where the main surface 210a of the circuit board 210 and the upper side (Y-axis negative direction side) of the main body 221a of the electrolytic capacitor 221 are flush with each other, The positional relationship with the main body 221a is not limited to this. For example, when viewed from a direction parallel to the main surface 210a of the circuit board 210, the main body portion 221a may be disposed so as to partially overlap the circuit board 210. That is, the bending rate, length, and the like of the lead wire 221b may be adjusted so that the main body portion 221a is positioned on the bottom 67 side.

[Effects]
As described above, the lighting apparatus 100 includes the light source 30 and the power supply circuit 220 that supplies power to the light source 30, and the power supply circuit 220 including the electrolytic capacitor 221 and the electronic component 222 other than the electrolytic capacitor 221 is disposed. Circuit board 210. The circuit board 210 is formed so as to protrude from the edge of the first mounting part 211 when the circuit board 210 is viewed in plan, and the electrolytic capacitor 221 is arranged. And a second mounting unit 212.

  According to such a configuration, the electronic component 222 and the electrolytic capacitor 221 can be arranged on the circuit board 210 at a distance from each other. Therefore, the heat generated in the electronic component 222 is difficult to reach the electrolytic capacitor 221. Therefore, according to the lighting fixture 100, the temperature rise of the electrolytic capacitor 221 is suppressed.

  For example, the electrolytic capacitor 221 may be a radial lead type electrolytic capacitor having a cylindrical main body portion 221a and a lead wire 221b connected to the main body portion 221a. In this case, the lead wire 221b may be bent and connected to the circuit board 210 so that the axial direction of the main body 221a and the main surface 210a of the circuit board 210 are substantially parallel.

  Even if the lead wire 221b is bent so that the main body 221a approaches the circuit board 210, the electrolytic capacitor 221 and the electronic component 222 are separated from each other and disposed on the circuit board 210. Is difficult to reach the electrolytic capacitor 221. Therefore, by bending the lead wire 221b and bringing the main body portion 221a closer to the circuit board 210, the temperature rise of the electrolytic capacitor 221 can be suppressed and the height of the circuit portion 200 can be reduced.

  For example, when the circuit board 210 is viewed in plan, the direction in which the second mounting portion 212 protrudes from the first mounting portion 211 and the axial direction of the main body portion 221a may be substantially orthogonal.

  According to such a configuration, the area of the circumscribed circle of the circuit unit 200 can be reduced when the circuit unit 200 is viewed in plan. Therefore, the lighting fixture 100 can be reduced in size.

  For example, when the circuit board 210 is viewed in plan, the main body 221 a does not have to overlap with the circuit board 210.

  According to such a configuration, the heat of the circuit board 210 is less likely to reach the main body 221a of the electrolytic capacitor 221. Therefore, the temperature rise of the electrolytic capacitor 221 is further suppressed.

  For example, when viewed from a direction parallel to the main surface 210a of the circuit board 210, the main body 221a may partially overlap the circuit board 210.

  According to such a configuration, the circuit unit 200 is further reduced in height.

  In addition, for example, the lighting fixture 100 may further include a wall portion 61 disposed between the electrolytic capacitor 221 and the electronic component 222.

  According to such a configuration, the heat generated in the electronic component 222 is difficult to reach the electrolytic capacitor 221 by the wall portion 61. Therefore, according to the lighting fixture 100, the temperature rise of the electrolytic capacitor 221 is further suppressed.

  Further, for example, when the circuit board 210 is viewed in plan, a gap 230 is formed between the main body part 221 a and the first mounting part 211, and the wall part 61 may be positioned in the gap 230. .

  For example, the wall 61 may be formed on the circuit board 210, but by configuring the wall 61 in the gap 230, the heat generated in the electronic component 222 reaches the wall 61. It becomes difficult. Therefore, the temperature rise of the electrolytic capacitor 221 is further suppressed.

  In addition, for example, the wall 61 may be formed with a slit 61 a extending in a direction parallel to the normal line of the main surface 210 a of the circuit board 210.

  According to such a structure, since the wall part 61 has a strong spring property compared with the case where the slit 61a is not formed, the wall part 61 can be made hard to break.

  Further, for example, the lighting apparatus 100 may further include a housing 60 in which the wall portion 61 is formed and the circuit board 210 is accommodated.

  According to such a structure, the wall part 61 can be simply formed in the lighting fixture 100. FIG.

  Further, for example, the casing 60 may have a bottomed cylindrical shape, and the circuit board 210 is disposed in the casing 60 so that the main surface 210a of the circuit board 210 is substantially parallel to the bottom 67 of the casing 60. May be. In this case, the wall portion 61 may extend from the bottom portion 67 of the housing 60 in a direction parallel to the normal line of the main surface 210a of the circuit board 210.

  The wall 61 is extended from the bottom of the housing 60 in a direction parallel to the normal line of the main surface 210a of the circuit board 210, so that the electrolytic capacitor 221 and the electronic component are disposed when the circuit unit 200 is disposed in the housing 60. The wall portion 61 can be easily positioned between the second wall 222 and the second wall 222. Therefore, according to such a structure, the assembly of the lighting fixture 100 becomes easy.

  Further, for example, the luminaire 100 further includes a cover member 50 that is located between the circuit board 210 and the light source 30 and has an insulating property, and a lamp pin 240 that is supported by the cover member 50 and the housing 60. The lamp pin 240 may be provided with at least a part of the lamp pin 240 exposed from the housing 60 and electrically connected to the power supply circuit 220.

  According to such a configuration, the lamp pin 240 can be easily attached to the housing 60. In particular, according to such a configuration, the lamp pin 240 can be attached to the housing 60 without using a member for supporting the lamp pin 240 on the housing 60.

  Further, for example, the lighting apparatus 100 may further include a sheet-like heat sink 40 between the cover member 50 and the light source 30.

  According to such a configuration, the heat generated by the light source 30 does not easily reach the electrolytic capacitor 221 side. Therefore, the temperature rise of the electrolytic capacitor 221 is further suppressed.

  Further, for example, as viewed from the wall portion 61, a hole portion 62 that communicates the inside of the housing 60 and the outside of the lighting fixture may be formed in a part of the housing 60 on the electrolytic capacitor 221 side.

  According to such a configuration, when the electrolytic capacitor 221 fails, the risk of explosion or the like can be reduced.

  For example, the lighting fixture 100 may further include a light-transmitting cover 10 that covers the light source 30 and is attached to the housing 60, and an adhesive that bonds the housing 60 and the light-transmitting cover 10. Good. Moreover, the notch-shaped notch part 12 in which an adhesive agent is arrange | positioned may be formed in the edge of the translucent cover 10. FIG.

  According to such a configuration, the translucent cover 10 is less likely to be detached from the housing 60.

  For example, the housing | casing 60 may be formed with resin which includes glass fiber.

  A metal material such as aluminum die casting may be used for a housing of a lighting fixture such as a downlight. By doing so, it is possible to easily release the heat generated from the heat generating electronic components constituting the light source and the power supply circuit located inside the lighting fixture to the housing 60. Thereby, failure of components, such as an electrolytic capacitor which is easy to fail by heat, can be controlled.

  On the other hand, resin materials such as PBT are lighter than metal materials, but are less likely to dissipate heat. However, since the electrolytic capacitor 221 is hardly affected by heat by forming the wall portion 61 as in the lighting fixture 100, the electrolytic capacitor 221 is unlikely to fail even if a resin material is used for the housing 60. Therefore, according to the lighting fixture 100, by using a resin material for the housing 60, the temperature rise of the electrolytic capacitor 221 can be suppressed and the weight can be reduced.

(Other embodiments)
As mentioned above, although the lighting fixture which concerns on embodiment was demonstrated, this invention is not limited to such embodiment.

  The shape of the lighting fixture described in the above embodiment is an example. For example, in the above-described embodiment, the planar view shape of the lighting fixture is circular, but the planar view shape of the lighting fixture may be a polygon such as a rectangle.

  Moreover, in the said embodiment, although the light emitting module which has LED was used as a light source, the aspect of a light source is not specifically limited. For example, instead of a light emitting module using an LED, a fluorescent lamp, a metal halide lamp, a sodium lamp, a halogen lamp, a xenon lamp, a neon lamp, or the like may be used as the light source. Moreover, inorganic electroluminescence, organic electroluminescence, chemiluminescence (chemiluminescence), a semiconductor laser, or the like may be used as the light source.

  The electronic component mounted on the first mounting portion of the circuit board may include an electrolytic capacitor. That is, it is only necessary that at least one electrolytic capacitor mounted on the circuit board of the lighting fixture according to the present embodiment is mounted (arranged) on the second mounting portion.

  As mentioned above, although the lighting fixture which concerns on one or several aspects was demonstrated based on embodiment, this invention is not limited to this embodiment. Unless it deviates from the gist of the present invention, various modifications conceived by those skilled in the art have been made in this embodiment, and forms constructed by combining components in different embodiments are also within the scope of one or more aspects. May be included.

DESCRIPTION OF SYMBOLS 10 Translucent cover 11, 21 Nail | claw part 12 Notch part 20 Reflector 30 Light source 40 Heat sink 50 Cover member 51 Projection part 60 Case 61 Wall part 61a Slit 62 Hole part 63 Lamp pin hole part 67 Bottom part 100 Lighting fixture 210 Circuit board 210a Main surface 211 First mounting portion 212 Second mounting portion 220 Power supply circuit 221 Electrolytic capacitor 221a Main body portion 221b Lead wire 222 Electronic component 230 Gap 240 Lamp pin 241 Wiring

Claims (15)

A light source;
A power supply board for supplying power to the light source, and a circuit board on which a power supply circuit having an electrolytic capacitor and an electronic component other than the electrolytic capacitor is disposed,
The circuit board is
A first mounting portion on which the electronic component is disposed;
A lighting apparatus comprising: a second mounting portion that is formed so as to protrude from an edge of the first mounting portion when the circuit board is viewed in plan, and in which the electrolytic capacitor is disposed. The electrolytic capacitor is a radial lead type electrolytic capacitor having a cylindrical main body and a lead wire connected to the main body.
The lighting apparatus according to claim 1, wherein the lead wire is bent and connected to the circuit board so that an axial direction of the main body portion and a main surface of the circuit board are substantially parallel to each other. The lighting fixture according to claim 2, wherein when the circuit board is viewed in plan, a direction in which the second mounting portion protrudes from the first mounting portion and an axial direction of the main body portion are substantially orthogonal. When the circuit board is viewed in plan view,
The lighting device according to claim 2, wherein the main body portion does not overlap the circuit board. When viewed from a direction parallel to the main surface of the circuit board,
The lighting apparatus according to claim 2, wherein the main body part partially overlaps the circuit board. Furthermore, the lighting fixture of any one of Claims 2-5 provided with the wall part arrange | positioned between the said electrolytic capacitor and the said electronic component. When the circuit board is viewed in plan view,
A gap is formed between the main body portion and the first mounting portion,
The lighting apparatus according to claim 6, wherein the wall portion is located in the gap. The lighting fixture according to claim 6 or 7, wherein a slit extending in a direction parallel to a normal line of a main surface of the circuit board is formed in the wall portion. The lighting apparatus according to claim 6, further comprising a housing in which the wall portion is formed and the circuit board is accommodated. The housing is cylindrical with a bottom,
The circuit board is disposed on the casing such that a main surface of the circuit board is substantially parallel to a bottom portion of the casing.
The lighting fixture according to claim 9, wherein the wall portion extends from a bottom portion of the housing in a direction parallel to a normal line of a main surface of the circuit board. further,
A cover member located between the circuit board and the light source and having an insulating property;
The lamp pin supported by the cover member and the housing, wherein at least a part of the lamp pin is exposed from the housing and is electrically connected to the power supply circuit. Or the lighting fixture of 10. The lighting apparatus according to claim 11, further comprising a sheet-like heat sink between the cover member and the light source. The hole part which connects the inside of the said housing | casing and the exterior of the said lighting fixture is formed in a part of said housing | casing by the side of the said electrolytic capacitor seeing from the said wall part. The lighting fixture of Claim 1. further,
A translucent cover that covers the light source and is attached to the housing;
An adhesive that bonds the housing and the translucent cover; and
The lighting fixture of any one of Claims 9-13 in which the notch-shaped notch part by which the said adhesive agent is arrange | positioned is formed in the edge of the said translucent cover. The lighting fixture according to any one of claims 9 to 14, wherein the casing is formed of a resin containing glass fiber.

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