TW201911966A - heating equipment - Google Patents

heating equipment Download PDF

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Publication number
TW201911966A
TW201911966A TW107124434A TW107124434A TW201911966A TW 201911966 A TW201911966 A TW 201911966A TW 107124434 A TW107124434 A TW 107124434A TW 107124434 A TW107124434 A TW 107124434A TW 201911966 A TW201911966 A TW 201911966A
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Taiwan
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heating
heating furnace
heater
right direction
heating device
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TW107124434A
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Chinese (zh)
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TWI679918B (en
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羽田浩二
田淵雅尚
大塚康弘
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日商斯庫林集團股份有限公司
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/62Heating elements specially adapted for furnaces
    • H05B3/64Heating elements specially adapted for furnaces using ribbon, rod, or wire heater
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/62Heating elements specially adapted for furnaces
    • H05B3/66Supports or mountings for heaters on or in the wall or roof

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  • Furnace Details (AREA)
  • Resistance Heating (AREA)

Abstract

The present invention provides a heating device capable of reducing the space to be secured on the left and right sides of a heating furnace for inserting and removing a heater. The heating device 1 of the present invention includes a heating furnace 10 and a plurality of rod-like heaters 20. The plurality of rod-like heaters 20 are disposed inside the heating furnace 10 along the surface of a substrate 9. In addition, the plurality of rod-like heaters 20 are arranged at intervals in the left-right direction. Each rod-like heater 20 can be inserted and removed in the front-rear direction via an insertion hole defined in the rear wall 12 of the heating furnace 10. Therefore, it is able to reduce the space to be secured on the left and right sides of the heating furnace 10 for inserting and removing the rod-like heaters 20, whereby a plurality of heating devices 1 can be densely arranged in the left-right direction.

Description

加熱裝置heating equipment

本發明是有關於一種利用棒狀加熱器對多個基板進行加熱的加熱裝置。The present invention relates to a heating device for heating a plurality of substrates by using a rod heater.

近年來,作為柔性顯示器(flexible display)用基板,聚醯亞胺膜受到關注。現有的聚醯亞胺膜例如已記載在專利文獻1中。如專利文獻1的段落0004及段落0124中記載那樣,製造聚醯亞胺膜時,在載體基板上形成聚醯亞胺膜。另外,如專利文獻1的段落0110中記載那樣,聚醯亞胺樹脂是通過將聚醯亞胺樹脂前驅物、或四羧酸二酐及二異氰酸酯化合物在存在溶劑的條件下加熱(加熱醯亞胺化)而獲得。In recent years, polyimide films have attracted attention as substrates for flexible displays. A conventional polyfluoreneimide film is described in Patent Document 1, for example. As described in paragraphs 0004 and 0124 of Patent Document 1, when manufacturing a polyimide film, a polyimide film is formed on a carrier substrate. In addition, as described in paragraph 0110 of Patent Document 1, the polyimide resin is heated by heating a polyimide resin precursor, a tetracarboxylic dianhydride, and a diisocyanate compound in the presence of a solvent (heating the Amination).

另外,如專利文獻1的段落0126中記載那樣,在對聚醯亞胺膜要求無色透明性的情況下,為了抑制著色,優選在氮氣等惰性環境下進行加熱。In addition, as described in paragraph 0126 of Patent Document 1, when colorless transparency is required for a polyimide film, in order to suppress coloring, it is preferred to heat in an inert environment such as nitrogen.

另一方面,對基板進行加熱的現有裝置例如已記載在專利文獻2中。專利文獻2的熱處理裝置具有能夠裝載多個基板的腔室、及設置在腔室內的多個加熱器。如專利文獻2的段落0055中記載那樣,多個加熱器是以覆蓋基板的整個面積的方式配置在各基板的上方及下方。另外,專利文獻2的段落0069中記載有對腔室內供給氮氣等環境氣體。 [現有技術文獻] [專利文獻]On the other hand, a conventional device for heating a substrate is described in Patent Document 2, for example. The heat treatment apparatus of Patent Document 2 includes a chamber capable of mounting a plurality of substrates, and a plurality of heaters provided in the chamber. As described in paragraph 0055 of Patent Document 2, the plurality of heaters are arranged above and below each substrate so as to cover the entire area of the substrate. In addition, paragraph 0069 of Patent Document 2 describes that an ambient gas such as nitrogen is supplied into the chamber. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2015-165491號公報 [專利文獻2]日本專利第5973728號公報[Patent Document 1] Japanese Patent Laid-Open No. 2015-165491 [Patent Document 2] Japanese Patent No. 5973728

[發明所要解決的問題] 作為可用於聚醯亞胺膜的加熱醯亞胺化的裝置,例如想到專利文獻2那樣的裝置。但是,專利文獻2的裝置中,多個棒狀加熱器在相對於基板的搬入搬出方向而垂直的方向(左右方向)上延伸。對於此種構成來說,在將已使用的加熱器更換為新加熱器時,需要在左右方向上插拔加熱器。此情況下,需要預先在裝置的左右確保加熱器的左右方向的長度以上的空間。因此,無法將多個裝置在左右方向上緊密地配置。[Problems to be Solved by the Invention] As a device which can be used for heating / imidization of a polyimide film, for example, a device such as Patent Document 2 is conceived. However, in the device of Patent Document 2, a plurality of rod-shaped heaters extend in a direction (left-right direction) that is perpendicular to the loading-unloading direction of the substrate. With such a configuration, when the used heater is replaced with a new heater, the heater needs to be inserted and removed in the left-right direction. In this case, it is necessary to secure a space equal to or longer than the length of the heater in the left-right direction on the left and right sides of the device. Therefore, a plurality of devices cannot be closely arranged in the left-right direction.

本發明是鑒於此種情況而成,其目的在於提供一種加熱裝置,此加熱裝置能夠減小為了插拔加熱器而應在加熱爐的左右確保的空間。The present invention has been made in view of such a situation, and an object thereof is to provide a heating device capable of reducing a space to be secured on the left and right sides of a heating furnace in order to insert and remove a heater.

[解決問題的技術手段] 為了解決所述問題,本申請的第一發明為一種加熱裝置,對多個基板進行加熱,且所述加熱裝置具備:加熱爐,能夠在上下方向上多段地收納所述多個基板;以及多個棒狀加熱器,在所述加熱爐的內部沿著所述基板的表面而配置,且在左右方向上空開間隔而排列,並且所述加熱爐具有設有用於搬入及搬出所述基板的搬入搬出口的前壁、及隔著收容所述多個基板的空間而與所述前壁在前後方向上相向的後壁,所述後壁具有多個插入孔,所述多個棒狀加熱器能夠分別經由所述插入孔而插入到所述加熱爐中或從所述加熱爐中拔出。[Technical Means for Solving the Problem] In order to solve the problem, a first invention of the present application is a heating device that heats a plurality of substrates, and the heating device includes a heating furnace capable of accommodating a plurality of sections in a vertical direction The plurality of substrates; and a plurality of rod-shaped heaters arranged along the surface of the substrate inside the heating furnace and arranged at intervals in the left-right direction, and the heating furnace is provided with And a front wall that carries the substrate in and out, and a rear wall that faces the front wall in the front-to-rear direction across a space that houses the plurality of substrates, the rear wall has a plurality of insertion holes, so The plurality of rod-shaped heaters can be inserted into or removed from the heating furnace via the insertion holes, respectively.

本申請的第二發明為第一發明的加熱裝置,且所述多個棒狀加熱器彼此平行地排列。The second invention of the present application is the heating device of the first invention, and the plurality of rod-shaped heaters are arranged in parallel with each other.

本申請的第三發明為第一發明或第二發明的加熱裝置,且具有多個加熱器群,所述加熱器群是通過將所述棒狀加熱器在所述左右方向上排列多個而構成,在所述加熱爐的內部,將所述加熱器群與所述基板在上下方向上交替地配置。The third invention of the present application is the heating device of the first invention or the second invention, and has a plurality of heater groups. The heater group is formed by arranging a plurality of rod-shaped heaters in the left-right direction. The heater is configured such that the heater group and the substrate are alternately arranged in the vertical direction inside the heating furnace.

本申請的第四發明為第三發明的加熱裝置,且所述加熱器群所含的多個所述棒狀加熱器中,位於所述左右方向的兩端部附近的棒狀加熱器彼此的間隔比位於所述左右方向的中央附近的棒狀加熱器彼此的間隔窄。The fourth invention of the present application is the heating device of the third invention, and among the plurality of rod-shaped heaters included in the heater group, the rod-shaped heaters located near the both ends in the left-right direction are adjacent to each other. The interval is narrower than the interval between the rod-shaped heaters located near the center in the left-right direction.

本申請的第五發明為第一發明至第四發明中任一發明的加熱裝置,且具備:多個主加熱器,為所述棒狀加熱器;以及多個次加熱器,為與所述多個主加熱器不同的棒狀加熱器,在俯視時相對於所述主加熱器而垂直地配置,且沿著所述加熱爐的壁面而延伸,並且所述加熱爐具有隔著收容所述多個基板的空間而在所述左右方向上相向的一對側壁,一部分所述次加熱器在所述一對側壁中的一者與所述加熱爐的所述左右方向的中央之間在所述左右方向上延伸,其他所述次加熱器在所述一對側壁中的另一者與所述加熱爐的所述左右方向的中央之間在所述左右方向上延伸。A fifth invention of the present application is the heating device of any one of the first to fourth inventions, and includes: a plurality of main heaters, which are the rod-shaped heaters; and a plurality of sub-heaters, which are the same as the above A plurality of rod-shaped heaters having different main heaters are arranged vertically with respect to the main heater in a plan view, and extend along a wall surface of the heating furnace, and the heating furnace has a space to accommodate the Space of a plurality of substrates and a pair of side walls facing in the left-right direction, a part of the secondary heater is located between one of the pair of side walls and a center of the heating furnace in the left-right direction. The left-right direction extends, and the other secondary heater extends in the left-right direction between the other of the pair of side walls and a center of the heating furnace in the left-right direction.

本申請的第六發明為第五發明的加熱裝置,且所述次加熱器的所述左右方向的長度比所述加熱爐的所述左右方向的一半長度短。A sixth invention of the present application is the heating device of the fifth invention, and a length of the secondary heater in the left-right direction is shorter than a half length of the heating furnace in the left-right direction.

本申請的第七發明為第一發明至第六發明中任一發明的加熱裝置,且還具備向所述加熱爐內供給氣體的供氣部,所述供氣部連接於所述後壁。A seventh invention of the present application is the heating device according to any one of the first to sixth inventions, and further includes a gas supply unit that supplies gas into the heating furnace, and the gas supply unit is connected to the rear wall.

本申請的第八發明為第一發明至第七發明中任一發明的加熱裝置,且還具備將所述加熱爐內的氣體排出的排氣部,所述排氣部連接於所述後壁。An eighth invention of the present application is the heating device according to any one of the first to seventh inventions, and further includes an exhaust portion for exhausting gas in the heating furnace, and the exhaust portion is connected to the rear wall. .

本申請的第九發明為第一發明至第八發明中任一發明的加熱裝置,且在所述左右方向上並排設置。The ninth invention of the present application is the heating device of any one of the first to eighth inventions, and is arranged side by side in the left-right direction.

本申請的第十發明為第一發明至第九發明中任一發明的加熱裝置,且加熱前的所述基板在上表面具有包含有機溶劑的薄膜。The tenth invention of the present application is the heating device of any one of the first to ninth inventions, and the substrate before heating has a thin film containing an organic solvent on an upper surface.

本申請的第十一發明為第十發明的加熱裝置,且所述薄膜包含聚醯亞胺前驅物。An eleventh invention of the present application is the heating device of the tenth invention, and the film includes a polyfluorene imide precursor.

[發明的效果] 根據本申請的第一發明~第十一發明,能夠減小為了插拔棒狀加熱器而應在加熱爐的左右確保的空間。因此,能將多個加熱裝置在左右方向上緊密地配置。[Effects of the Invention] According to the first to eleventh inventions of the present application, it is possible to reduce the space that should be secured on the left and right of the heating furnace in order to insert and remove the rod-shaped heater. Therefore, a plurality of heating devices can be closely arranged in the left-right direction.

尤其根據本申請的第四發明,能夠減小基板的中央部與端緣部的加熱量之差。In particular, according to the fourth invention of the present application, it is possible to reduce a difference in heating amount between the central portion and the edge portion of the substrate.

尤其根據本申請的第五發明,能夠在加熱裝置的左右減小插拔次加熱器所需要的空間。因此,能將多個加熱裝置在左右方向上緊密地排列。In particular, according to the fifth invention of the present application, it is possible to reduce the space required for inserting and removing the secondary heater on the left and right of the heating device. Therefore, a plurality of heating devices can be closely arranged in the left-right direction.

尤其根據本申請的第七發明,與將供氣部連接於左右的側壁的情況相比,能夠擴大使用者在裝置的左右空間中的可動範圍。In particular, according to the seventh invention of the present application, it is possible to expand the movable range of the user in the left and right spaces of the device as compared with the case where the air supply portion is connected to the left and right side walls.

尤其根據本申請的第八發明,與將排氣部連接於左右的側壁的情況相比,能夠擴大使用者在裝置的左右空間中的可動範圍。In particular, according to the eighth invention of the present application, it is possible to expand the movable range of the user in the left and right spaces of the device as compared with the case where the exhaust portion is connected to the left and right side walls.

以下,一面參照圖式一面對本發明的實施形態進行說明。此外,本申請的各圖中,為了容易掌握方向關係而示出共同的xyz正交坐標系。x方向相當於加熱裝置的左右方向。y方向相當於加熱裝置的前後方向。z方向相當於加熱裝置的上下方向。此外,加熱裝置是設置在水準的地板面上。因此,前後方向及左右方向均為水準方向。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing of the present application, a common xyz orthogonal coordinate system is shown in order to easily grasp the directional relationship. The x direction corresponds to the left-right direction of the heating device. The y direction corresponds to the front-rear direction of the heating device. The z direction corresponds to the vertical direction of the heating device. The heating device is installed on a level floor surface. Therefore, the front-rear direction and the left-right direction are horizontal directions.

<1.加熱裝置的構成> 圖1為本發明的一實施形態的加熱裝置1的外觀立體圖。圖2為以相對於左右方向而正交的平面切斷的加熱裝置1的縱截面圖。圖3為以相對於上下方向而正交的平面切斷的加熱裝置1的橫截面圖。此加熱裝置1為統一加熱多個基板9的裝置。加熱裝置1例如是用於柔性顯示器中所用的聚醯亞胺膜的製造工序。在加熱前的基板9的上表面,形成有包含聚醯亞胺前驅物及有機溶劑的薄膜。若在加熱裝置1中加熱基板9,則薄膜中的聚醯亞胺前驅物經醯亞胺化而成為聚醯亞胺。<1. Configuration of Heating Device> FIG. 1 is an external perspective view of a heating device 1 according to an embodiment of the present invention. FIG. 2 is a longitudinal sectional view of the heating device 1 cut in a plane orthogonal to the left-right direction. FIG. 3 is a cross-sectional view of the heating device 1 cut in a plane orthogonal to the vertical direction. This heating device 1 is a device that collectively heats a plurality of substrates 9. The heating device 1 is used for the manufacturing process of the polyimide film used for a flexible display, for example. On the upper surface of the substrate 9 before heating, a thin film containing a polyimide precursor and an organic solvent is formed. When the substrate 9 is heated in the heating device 1, the polyimide precursor in the film is subjected to amidation to form a polyimide.

如圖1~圖3所示那樣,本實施形態的加熱裝置1具備加熱爐10、多個主加熱器20、多個外管30、多個次加熱器40、供氣部50、排氣部60及控制部70。As shown in FIGS. 1 to 3, the heating device 1 according to this embodiment includes a heating furnace 10, a plurality of main heaters 20, a plurality of outer tubes 30, a plurality of sub heaters 40, an air supply unit 50, and an exhaust unit. 60 和 控制 部 70。 60 and the control section 70.

加熱爐10為包含耐熱性的材料的框體。在加熱爐10的內部,設有能夠在上下方向上多段地收納多個基板9的處理空間19。本實施形態的加熱爐10具有大致長方體狀的外形。具體而言,加熱爐10具有前壁11、後壁12、右側壁13、左側壁14、底板部15及頂板部16。前壁11與後壁12隔著處理空間19而在前後方向(y方向)上相向。右側壁13與左側壁14隔著處理空間19而在左右方向(x方向)上相向。底板部15與頂板部16隔著處理空間19而在上下方向(z方向)上相向。The heating furnace 10 is a frame including a heat-resistant material. A processing space 19 is provided in the heating furnace 10 so that a plurality of substrates 9 can be stored in a plurality of stages in the vertical direction. The heating furnace 10 of this embodiment has a substantially rectangular parallelepiped shape. Specifically, the heating furnace 10 includes a front wall 11, a rear wall 12, a right wall 13, a left wall 14, a bottom plate portion 15, and a top plate portion 16. The front wall 11 and the rear wall 12 face each other in the front-rear direction (y direction) via the processing space 19. The right wall 13 and the left wall 14 face each other in the left-right direction (x direction) with the processing space 19 interposed therebetween. The bottom plate portion 15 and the top plate portion 16 face each other in the vertical direction (z direction) with the processing space 19 interposed therebetween.

在前壁11中設有多個搬入搬出口17、及開閉各搬入搬出口17的多個擋閘18。擋閘18是由省略圖示的驅動機構開閉。若打開擋閘18,則能夠經由搬入搬出口17而搬入或搬出基板9。另一方面,若關閉擋閘18,則阻斷經由搬入搬出口17的氣體進出。The front wall 11 is provided with a plurality of loading / unloading ports 17 and a plurality of shutters 18 which open and close each loading / unloading port 17. The shutter 18 is opened and closed by a driving mechanism (not shown). When the shutter 18 is opened, the substrate 9 can be carried in and out through the carrying in / out port 17. On the other hand, when the shutter 18 is closed, the entry and exit of gas through the carry-in / out port 17 is blocked.

主加熱器20為用於對配置在加熱爐10的內部的基板9進行加熱的加熱器。對於主加熱器20,使用棒狀的紅外線加熱器(棒狀加熱器)。主加熱器20例如具有借由通電而發熱的Fe-Cr-Al系加熱絲。多個主加熱器20沿著基板9的上表面及下表面而彼此平行地排列。另外,多個主加熱器20在左右方向上空開間隔而排列。各主加熱器20在前後方向上延伸。各主加熱器20的基端部21位於後壁12的附近。各主加熱器20的前端部22位於前壁11的附近。此外,也可使用鎳鉻(Ni-Cr)絲代替所述Fe-Cr-Al系加熱絲。The main heater 20 is a heater for heating the substrate 9 disposed inside the heating furnace 10. For the main heater 20, a rod-shaped infrared heater (rod-shaped heater) is used. The main heater 20 has, for example, a Fe-Cr-Al heating wire that generates heat by being energized. The plurality of main heaters 20 are arranged in parallel with each other along the upper and lower surfaces of the substrate 9. The plurality of main heaters 20 are arranged at intervals in the left-right direction. Each main heater 20 extends in the front-rear direction. A base end portion 21 of each main heater 20 is located near the rear wall 12. The front end portion 22 of each main heater 20 is located near the front wall 11. Alternatively, a nickel-chromium (Ni-Cr) wire may be used instead of the Fe-Cr-Al-based heating wire.

在加熱爐10的後壁12中設有多個插入孔120。主加熱器20能夠經由此插入孔120而插入到加熱爐10中或從加熱爐10中拔出。主加熱器20必須每隔一定使用時間更換為新品。在更換主加熱器20時,首先將已使用的主加熱器20從加熱爐10的內部經由插入孔120向加熱爐10的後方抽出。然後,從加熱爐10的後方經由插入孔120向加熱爐10的內部插入新的主加熱器20。A plurality of insertion holes 120 are provided in the rear wall 12 of the heating furnace 10. The main heater 20 can be inserted into or removed from the heating furnace 10 through the insertion hole 120. The main heater 20 must be replaced with a new one at regular intervals. When replacing the main heater 20, the used main heater 20 is first pulled out from the inside of the heating furnace 10 to the rear of the heating furnace 10 through the insertion hole 120. Then, a new main heater 20 is inserted into the heating furnace 10 from the rear of the heating furnace 10 through the insertion hole 120.

如此,若在加熱爐10的後方在前後方向上插拔主加熱器20,則與在左右方向上插拔主加熱器20的情況相比,能夠在加熱爐10的右方及左方減小為了插拔主加熱器20而應確保的空間。因此,能夠將多個加熱裝置1在左右方向上緊密地配置。即,能夠減少一台加熱裝置1所需要的左右方向的地板尺寸。In this way, if the main heater 20 is inserted and removed in the front-rear direction behind the heating furnace 10, the right and left sides of the heating furnace 10 can be reduced compared to the case where the main heater 20 is inserted and removed in the left-right direction. A space to be secured for inserting and removing the main heater 20. Therefore, the plurality of heating devices 1 can be closely arranged in the left-right direction. That is, the floor size in the left-right direction required for one heating device 1 can be reduced.

本實施形態中,在同一高度位置將多個主加熱器20排列在左右方向上,由此構成一個加熱器群20G。在加熱爐10的內部,在上下方向上空開間隔而排列有多個此種加熱器群20G。在已將多個基板9搬入至加熱爐10的內部時,加熱器群20G與基板9在上下方向上交替地配置。另外,加熱器群20G不僅配置於在上下方向上相鄰的基板9之間,而且也配置在最上段的基板9的上方及最下段的基板9的下方。因此,在所有基板9的上方及下方配置有加熱器群20G。In this embodiment, a plurality of main heaters 20 are arranged in the left-right direction at the same height position, thereby forming one heater group 20G. A plurality of such heater groups 20G are arranged inside the heating furnace 10 at intervals in the vertical direction. When a plurality of substrates 9 have been carried into the heating furnace 10, the heater group 20G and the substrates 9 are alternately arranged in the vertical direction. In addition, the heater group 20G is arranged not only between the substrates 9 adjacent in the vertical direction, but also above the substrate 9 at the uppermost stage and below the substrate 9 at the lowermost stage. Therefore, the heater groups 20G are arranged above and below all the substrates 9.

基板9的端緣部與中央部相比而散熱量較多,所以與中央部相比溫度不易上升。因此,如圖3所示那樣,本實施形態中,加熱器群20G所含的多個主加熱器20中,位於左右方向的兩端部附近的主加熱器20彼此的間隔d1比位於左右方向的中央附近的主加熱器20彼此的間隔d2窄。若如此設定,則能夠對基板9的左右方向的端緣部供給比中央部多的熱量。因此,能夠在基板9的左右方向的端緣部與中央部之間降低加熱後的溫度差。Since the edge portion of the substrate 9 has a larger amount of heat radiation than the center portion, the temperature is less likely to rise than the center portion. Therefore, as shown in FIG. 3, in the present embodiment, among the plurality of main heaters 20 included in the heater group 20G, the interval d1 between the main heaters 20 located near the both ends in the left-right direction is more than in the left-right direction The interval d2 between the main heaters 20 near the center is narrow. With this setting, it is possible to supply more heat to the edge portion in the left-right direction of the substrate 9 than in the center portion. Therefore, it is possible to reduce the temperature difference after heating between the edge portion in the left-right direction of the substrate 9 and the center portion.

外管30為包覆各主加熱器20的構件。外管30是由能夠使紅外線穿透的材料(例如玻璃)所形成。多個外管30分別固定於加熱爐10。各外管30具有以下形狀:從後壁12的所述插入孔120向前壁11側呈管狀地延伸,且其前端部經封閉。外管30的基端部的開口成為接受從下文將述的供氣部50供給的氮氣的供氣口31。即,外管30在主加熱器20的基端部21的附近具有供氣口31。The outer tube 30 is a member that covers each main heater 20. The outer tube 30 is formed of a material (for example, glass) capable of transmitting infrared rays. Each of the plurality of outer tubes 30 is fixed to the heating furnace 10. Each of the outer tubes 30 has a shape that extends from the insertion hole 120 of the rear wall 12 to a front wall 11 side in a tubular shape, and a front end portion thereof is closed. The opening of the base end portion of the outer tube 30 is a gas supply port 31 for receiving nitrogen gas supplied from a gas supply unit 50 to be described later. That is, the outer pipe 30 has an air supply port 31 near the base end portion 21 of the main heater 20.

主加熱器20能夠經由插入孔120而插入到外管30中或從外管30中拔出。加熱裝置1的使用者能夠在主加熱器20及外管30中僅更換作為消耗品的主加熱器20。在加熱裝置1運轉時,對主加熱器20供給驅動電流,由此主加熱器20發熱。而且,從主加熱器20輻射的紅外線穿透外管30而照射至基板9的表面。由此對基板9進行加熱。The main heater 20 can be inserted into or pulled out from the outer tube 30 via the insertion hole 120. A user of the heating device 1 can replace only the main heater 20 as a consumable in the main heater 20 and the outer tube 30. When the heating device 1 is operated, a driving current is supplied to the main heater 20, and thereby the main heater 20 generates heat. In addition, infrared rays radiated from the main heater 20 penetrate the outer tube 30 and irradiate the surface of the substrate 9. Thereby, the substrate 9 is heated.

圖4為主加熱器20及外管30的前端部附近的截面圖。如圖4所示,外管30在主加熱器20的前端部22的附近具有多個噴出口32。噴出口32為用於向基板9的表面噴出外管30的內部的氣體的開口。噴出口32在主加熱器20的前端部22的上方及下方,在上下方向上貫穿外管30。然而,噴出口32的位置、噴出口32的個數及噴出口32的形狀也可未必如圖4那樣。FIG. 4 is a cross-sectional view near the front ends of the main heater 20 and the outer tube 30. As shown in FIG. 4, the outer pipe 30 has a plurality of ejection ports 32 near the front end portion 22 of the main heater 20. The ejection port 32 is an opening for ejecting the gas inside the outer tube 30 toward the surface of the substrate 9. The discharge port 32 penetrates the outer tube 30 in the up-and-down direction above and below the front end portion 22 of the main heater 20. However, the positions of the ejection ports 32, the number of the ejection ports 32, and the shape of the ejection ports 32 may not necessarily be as shown in FIG. 4.

另外,如圖2所示那樣,在外管30的外表面設有多個基板支撐部33。搬入到加熱爐10的內部的基板9載置在多個基板支撐部33上。而且,基板9是由多個基板支撐部33支撐為水準姿勢。若如此將用於支撐基板9的基板支撐部33的至少一部分設于外管30,則無需在加熱爐10的內部與外管30無關而另設置用於設置基板支撐部33的梁等。因此,能夠減少加熱裝置1的零件數,並且容易使加熱裝置1小型化。As shown in FIG. 2, a plurality of substrate support portions 33 are provided on the outer surface of the outer tube 30. The substrate 9 carried into the heating furnace 10 is placed on a plurality of substrate support portions 33. The substrate 9 is supported in a horizontal posture by a plurality of substrate support portions 33. If at least a part of the substrate support portion 33 for supporting the substrate 9 is provided in the outer tube 30 in this way, it is not necessary to provide a beam or the like for providing the substrate support portion 33 independently of the outer tube 30 inside the heating furnace 10. Therefore, the number of parts of the heating device 1 can be reduced, and the heating device 1 can be easily miniaturized.

多個次加熱器40為用於輔助加熱基板9的前後方向的端緣部的加熱器。對於次加熱器40,使用棒狀的紅外線加熱器(棒狀加熱器)。次加熱器40例如具有借由通電而發熱的Fe-Cr-Al系加熱絲。如圖2及圖3所示那樣,多個次加熱器40沿著加熱爐10的前壁11及後壁12的壁面在左右方向上延伸。即,多個次加熱器40在俯視時相對於主加熱器20而垂直地配置。此外,也可使用鎳鉻(Ni-Cr)絲代替所述Fe-Cr-Al系加熱絲。The plurality of secondary heaters 40 are heaters for assisting heating the edge portions in the front-rear direction of the substrate 9. For the secondary heater 40, a rod-shaped infrared heater (rod-shaped heater) is used. The secondary heater 40 has, for example, a Fe-Cr-Al based heating wire that generates heat by being energized. As shown in FIGS. 2 and 3, the plurality of secondary heaters 40 extend in the left-right direction along the wall surfaces of the front wall 11 and the rear wall 12 of the heating furnace 10. That is, the plurality of secondary heaters 40 are arranged vertically with respect to the main heater 20 in a plan view. Alternatively, a nickel-chromium (Ni-Cr) wire may be used instead of the Fe-Cr-Al-based heating wire.

如上文已述那樣,基板9的端緣部與中央部相比而散熱量較多,所以與中央部相比溫度不易上升。但是,本實施形態中,基板9的前後方向的端緣部是由主加熱器20與次加熱器40兩者進行加熱。若如此設定,則能夠對基板9的前後方向的端緣部供給比中央部多的熱量。因此,能夠在基板9的前後方向的端緣部與中央部之間降低加熱後的溫度差。As described above, since the edge portion of the substrate 9 has a larger amount of heat radiation than the central portion, the temperature is less likely to rise than the central portion. However, in the present embodiment, the edge portion in the front-rear direction of the substrate 9 is heated by both the main heater 20 and the sub-heater 40. With this setting, it is possible to supply more heat to the edge portion in the front-rear direction of the substrate 9 than in the center portion. Therefore, the temperature difference after heating can be reduced between the edge part of the front-back direction of the board | substrate 9, and the center part.

多個次加熱器40包含多個右側次加熱器41和多個左側次加熱器42。右側次加熱器41從設於加熱爐10的右側壁13中的插入孔130向加熱爐10的內部插入。左側次加熱器42從設於加熱爐10的左側壁14中的插入孔140向加熱爐10的內部插入。所述主加熱器20經外管30包覆,相對於此,次加熱器40未經外管30包覆,而在加熱爐10內的空間中露出。The plurality of secondary heaters 40 include a plurality of right secondary heaters 41 and a plurality of left secondary heaters 42. The right secondary heater 41 is inserted into the heating furnace 10 from an insertion hole 130 provided in the right wall 13 of the heating furnace 10. The left side heater 42 is inserted into the heating furnace 10 from an insertion hole 140 provided in the left side wall 14 of the heating furnace 10. The main heater 20 is covered by the outer tube 30, while the secondary heater 40 is not covered by the outer tube 30 and is exposed in the space in the heating furnace 10.

另外,各次加熱器40的左右方向的長度比加熱爐10的左右方向的一半長度略短。多個右側次加熱器41分別在右側壁13與加熱爐10的左右方向的中央之間在左右方向上延伸。多個左側次加熱器42分別在左側壁14與加熱爐10的左右方向的中央之間在左右方向上延伸。而且,右側次加熱器41的前端部與左側次加熱器42的前端部在加熱爐10的左右方向的中央附近,在左右方向上相向。The length in the left-right direction of each of the heaters 40 is slightly shorter than a half length in the left-right direction of the heating furnace 10. The plurality of right-side secondary heaters 41 extend in the left-right direction between the right-side wall 13 and the center of the heating furnace 10 in the left-right direction, respectively. Each of the plurality of left side heaters 42 extends in the left-right direction between the left-side wall 14 and the center in the left-right direction of the heating furnace 10. The front end portion of the right secondary heater 41 and the front end portion of the left secondary heater 42 face each other near the center in the left-right direction of the heating furnace 10 in the left-right direction.

圖5為表示將兩台加熱裝置1並排配置在左右方向上時的狀況的圖。如圖5所示那樣,在相鄰的加熱裝置1之間設有維護用的空間100。在將已使用的次加熱器40更換為新的次加熱器40時,利用此空間100進行次加熱器40的插拔。此處,如上文所述那樣,各次加熱器40的左右方向的長度比加熱爐10的左右方向的一半長度短。由此,能夠減小插拔次加熱器40所需要的空間100的左右方向的長度d3。因此,能夠將多個加熱裝置1在左右方向上緊密地排列。FIG. 5 is a diagram showing a state when two heating devices 1 are arranged side by side in the left-right direction. As shown in FIG. 5, a maintenance space 100 is provided between adjacent heating devices 1. When the used secondary heater 40 is replaced with a new secondary heater 40, the space 100 is used to insert and remove the secondary heater 40. Here, as described above, the length in the left-right direction of each heater 40 is shorter than the half length in the left-right direction of the heating furnace 10. Thereby, the length d3 in the left-right direction of the space 100 required for inserting and removing the secondary heater 40 can be reduced. Therefore, the plurality of heating devices 1 can be arranged closely in the left-right direction.

供氣部50為用於對加熱爐10內的多個外管30供給氮氣的配管系統。如圖2所示那樣,供氣部50具有一根主配管51、多個分支配管52及第一開閉閥53。主配管51的上游側的端部連接於氮氣供給源54,此氮氣供給源54能夠供給壓力高於環境壓力的氮氣。在主配管51的下游側的端部,連接著多個分支配管52各自的上游側的端部。多個分支配管52各自的下游側的端部連接于外管30的供氣口31。另外,第一開閉閥53插入到主配管51的路徑上。因此,若打開第一開閉閥53,則從氮氣供給源54經過主配管51及多個分支配管52對多個外管30各自的內部供給氮氣。The gas supply unit 50 is a piping system for supplying nitrogen to the plurality of outer pipes 30 in the heating furnace 10. As shown in FIG. 2, the air supply unit 50 includes one main pipe 51, a plurality of branch pipes 52, and a first on-off valve 53. An end portion on the upstream side of the main pipe 51 is connected to a nitrogen supply source 54 capable of supplying nitrogen having a pressure higher than the ambient pressure. An end portion on the upstream side of each of the plurality of branch pipes 52 is connected to an end portion on the downstream side of the main pipe 51. The downstream end of each of the plurality of branch pipes 52 is connected to the air supply port 31 of the outer pipe 30. The first on-off valve 53 is inserted into the path of the main pipe 51. Therefore, when the first on-off valve 53 is opened, nitrogen is supplied from the nitrogen supply source 54 to each of the plurality of outer pipes 30 through the main pipe 51 and the plurality of branch pipes 52.

如此,此加熱裝置1中,供氣部50連接於加熱爐10的後壁12。因此,與將供氣部50連接於右側壁13或左側壁14的情況相比,能夠擴大使用者在所述空間100中的可動範圍。因此,能夠更容易地進行對加熱爐10插拔次加熱器40的作業。As such, in this heating device 1, the air supply portion 50 is connected to the rear wall 12 of the heating furnace 10. Therefore, compared with the case where the air supply part 50 is connected to the right wall 13 or the left wall 14, the movable range of the user in the space 100 can be enlarged. Therefore, the operation of inserting and removing the secondary heater 40 into and from the heating furnace 10 can be performed more easily.

排氣部60為用於向外部排出加熱爐10內的氣體的配管系統。如圖2所示那樣,排氣部60具有多個個別配管61、一根集合配管62及第二開閉閥63。多個個別配管61各自的上游側的端部連接于設於加熱爐10的後壁12中的排氣口121。多個個別配管61的下游側的端部連接于集合配管62的上游側的端部。集合配管62的下游側的端部連接于作為氣流產生機構的鼓風機(圖示省略)。另外,第二開閉閥63插入到集合配管62的路徑上。因此,若打開第二開閉閥63並使鼓風機動作,則加熱爐10內的氣體經過多個個別配管61及集合配管62而向加熱爐10的外部排出。The exhaust unit 60 is a piping system for exhausting the gas in the heating furnace 10 to the outside. As shown in FIG. 2, the exhaust unit 60 includes a plurality of individual pipes 61, one collective pipe 62, and a second on-off valve 63. The upstream end of each of the plurality of individual pipes 61 is connected to an exhaust port 121 provided in the rear wall 12 of the heating furnace 10. The downstream-side end of the plurality of individual pipes 61 is connected to the upstream-side end of the collective pipe 62. An end portion on the downstream side of the collecting pipe 62 is connected to a blower (not shown) as an airflow generating mechanism. The second on-off valve 63 is inserted into the path of the collecting pipe 62. Therefore, when the second on-off valve 63 is opened and the blower is operated, the gas in the heating furnace 10 is discharged to the outside of the heating furnace 10 through the plurality of individual pipes 61 and the collective pipes 62.

如此,此加熱裝置1中,排氣部60連接於加熱爐10的後壁12。因此,與將排氣部60連接於右側壁13或左側壁14的情況相比,能夠擴大使用者在所述空間100中的可動範圍。因此,能夠更容易地進行對加熱爐10插拔次加熱器40的作業。As described above, in the heating device 1, the exhaust portion 60 is connected to the rear wall 12 of the heating furnace 10. Therefore, compared with the case where the exhaust portion 60 is connected to the right wall 13 or the left wall 14, the movable range of the user in the space 100 can be enlarged. Therefore, the operation of inserting and removing the secondary heater 40 into and from the heating furnace 10 can be performed more easily.

如圖2所示那樣,本實施形態中,在後壁12中與基板9相同的高度位置設有排氣口121。即,排氣口121是設於後壁12中上下相鄰的插入孔120之間的高度位置。因此,若使排氣部60動作,則在加熱爐10的內部產生沿著基板9的表面從前方朝向後方的氣流。As shown in FIG. 2, in this embodiment, an exhaust port 121 is provided in the rear wall 12 at the same height position as the substrate 9. That is, the exhaust port 121 is provided at a height position between the upper and lower adjacent insertion holes 120 in the rear wall 12. Therefore, when the exhaust unit 60 is operated, an air flow is generated inside the heating furnace 10 from the front to the rear along the surface of the substrate 9.

控制部70為對加熱裝置1內的各部進行動作控制的機構。圖6為表示控制部70與加熱裝置1內的各部的連接的方塊圖。如圖6中概念性地表示,控制部70是由具有中央處理器(Central Processing Unit,CPU)等處理器71、隨機存取記憶體(Random Access Memory,RAM)等記憶體72及硬碟驅動器等存儲部73的電腦所構成。在存儲部73內安裝有用於控制加熱裝置1的動作的電腦程式P。The control unit 70 is a mechanism that controls the operation of each unit in the heating device 1. FIG. 6 is a block diagram showing the connection between the control section 70 and each section in the heating device 1. As shown conceptually in FIG. 6, the control unit 70 includes a processor 71 such as a central processing unit (CPU), a memory 72 such as a random access memory (RAM), and a hard disk drive. The computer such as the storage unit 73 is configured. A computer program P for controlling the operation of the heating device 1 is installed in the storage unit 73.

另外,如圖6所示那樣,控制部70與所述多個擋閘18、多個主加熱器20、多個次加熱器40、第一開閉閥53及第二開閉閥63分別可通信地連接。As shown in FIG. 6, the control unit 70 is communicably connected to the plurality of shutters 18, the plurality of main heaters 20, the plurality of secondary heaters 40, the first on-off valve 53, and the second on-off valve 63. connection.

控制部70將存儲部73中存儲的電腦程式P或資料暫且讀取到記憶體72中,處理器71根據此電腦程式P進行運算處理,由此對所述各部進行動作控制。借此,進行加熱裝置1中的基板9的加熱處理。The control unit 70 temporarily reads the computer program P or data stored in the storage unit 73 into the memory 72, and the processor 71 performs arithmetic processing according to the computer program P, thereby controlling the operations of the respective units. Thereby, the heating process of the board | substrate 9 in the heating apparatus 1 is performed.

<2.處理流程> 接下來,對所述加熱裝置1中的加熱處理的流程進行說明。圖7為表示加熱處理的流程的流程圖。<2. Processing Flow> Next, the flow of the heating processing in the heating device 1 will be described. FIG. 7 is a flowchart showing a flow of a heating process.

在加熱裝置1中對多個基板9進行加熱時,首先打開加熱爐10的多個擋閘18。然後,經由搬入搬出口17向加熱爐10的內部搬入加熱前的基板9(步驟S1)。此基板9的搬入例如是由專用的搬送機器人進行。將各基板9載置在設于外管30的多個基板支撐部33上。借此,成為在加熱爐10的內部在上下方向上空開間隔而排列有多個基板9的狀態。若多個基板9的搬入完成,則關閉多個擋閘18。When the plurality of substrates 9 are heated in the heating device 1, the plurality of shutters 18 of the heating furnace 10 are first opened. Then, the substrate 9 before heating is carried into the heating furnace 10 through the carrying in / out port 17 (step S1). This substrate 9 is carried in, for example, by a dedicated transfer robot. Each substrate 9 is placed on a plurality of substrate support portions 33 provided in the outer tube 30. As a result, a plurality of substrates 9 are arranged in the heating furnace 10 with a space in the vertical direction. When the loading of the plurality of substrates 9 is completed, the plurality of shutters 18 are closed.

然後,對多個主加熱器20及多個次加熱器40供給驅動電流。於是,多個主加熱器20及多個次加熱器40升溫,從各加熱器向基板9的表面照射紅外線。借此對基板9進行加熱(步驟S2)。Then, a driving current is supplied to the plurality of main heaters 20 and the plurality of sub heaters 40. Then, the plurality of main heaters 20 and the plurality of sub heaters 40 are heated, and infrared rays are radiated from the heaters to the surface of the substrate 9. The substrate 9 is thereby heated (step S2).

若規定時間的加熱處理完成,則停止向多個主加熱器20及多個次加熱器40供給驅動電流。然後,再次打開多個擋閘18,經由搬入搬出口17將加熱後的基板9向加熱爐10的外部搬出(步驟S3)。此基板9的搬出例如也是由所述搬送機器人進行。When the heating process for a predetermined time is completed, the supply of the drive current to the plurality of main heaters 20 and the plurality of sub heaters 40 is stopped. Then, the plurality of shutters 18 are opened again, and the heated substrate 9 is carried out to the outside of the heating furnace 10 through the carrying in / out port 17 (step S3). This substrate 9 is also unloaded, for example, by the transfer robot.

圖8表示在步驟S2的基板9的加熱中形成於加熱裝置1內的氣體流的流程圖。此外,圖8中以流程圖的形式來表示著眼于特定氣體分子時的時序變化,但實際上在加熱裝置1內的各部,步驟S21~步驟S25同時進行。FIG. 8 shows a flowchart of a gas flow formed in the heating device 1 during the heating of the substrate 9 in step S2. In addition, in FIG. 8, a time series change when focusing on a specific gas molecule is shown in the form of a flowchart. However, steps S21 to S25 are performed simultaneously in each part of the heating device 1.

若向加熱爐10的基板9的搬入完成,則控制部70打開供氣部50的第一開閉閥53及排氣部60的第二開閉閥63,使鼓風機動作。於是,從氮氣供給源54經過主配管51及多個分支配管52對多個外管30各自的內部供給氮氣(步驟S21)。When the loading of the substrate 9 into the heating furnace 10 is completed, the control unit 70 opens the first on-off valve 53 of the air supply unit 50 and the second on-off valve 63 of the exhaust unit 60 to operate the blower. Then, nitrogen is supplied from the nitrogen supply source 54 to each of the plurality of outer pipes 30 through the main pipe 51 and the plurality of branch pipes 52 (step S21).

供給至外管30的內部的氮氣沿著主加熱器20向前方流動。此時,氮氣被主加熱器20的熱所加熱(步驟S22)。然後,流到主加熱器20的前端附近的氮氣從外管30的噴出口32向基板9的表面噴出(步驟S23)。所噴出的氮氣因來自排氣部60的抽吸壓力而形成沿著基板9的表面朝向後方的氣流(步驟S24)。The nitrogen gas supplied to the inside of the outer pipe 30 flows forward along the main heater 20. At this time, the nitrogen gas is heated by the heat of the main heater 20 (step S22). Then, the nitrogen gas flowing near the front end of the main heater 20 is ejected toward the surface of the substrate 9 from the ejection port 32 of the outer tube 30 (step S23). The ejected nitrogen gas forms a gas flow toward the rear along the surface of the substrate 9 due to the suction pressure from the exhaust portion 60 (step S24).

若利用從主加熱器20及次加熱器40輻射的紅外線將基板9加熱,則由形成於基板9的上表面的薄膜產生不需要的氣體(有機溶劑等)。此不需要的氣體與所述氮氣一起向後方流動。結果將不需要的氣體從基板9的表面除去。另外,沿著基板9的表面流動的是經加熱的高溫氮氣。因此,由氮氣與基板9接觸所致的基板9的溫度降低得到抑制。另外,也不易發生所述不需要的氣體的液化。When the substrate 9 is heated by infrared rays radiated from the main heater 20 and the secondary heater 40, an unnecessary gas (organic solvent, etc.) is generated from a thin film formed on the upper surface of the substrate 9. This unwanted gas flows backward with the nitrogen. As a result, unnecessary gas is removed from the surface of the substrate 9. In addition, heated high-temperature nitrogen flows along the surface of the substrate 9. Therefore, a decrease in the temperature of the substrate 9 caused by the nitrogen gas contacting the substrate 9 is suppressed. In addition, liquefaction of the unwanted gas is less likely to occur.

然後,包含氮氣及所述不需要的氣體的氣體經過排氣口121、多個個別配管61及集合配管62而向加熱爐10的外部排出(步驟S25)。Then, the gas including the nitrogen gas and the unnecessary gas passes through the exhaust port 121, the plurality of individual pipes 61, and the manifold pipes 62 and is discharged to the outside of the heating furnace 10 (step S25).

如以上那樣,此加熱裝置1中,向基板9的表面噴出在外管30的內部經加熱的氮氣,並利用此氮氣將基板9的表面附近的不需要的氣體向加熱爐10的外部排出。因此,能夠抑制基板9的溫度降低或發生不需要的氣體的液化,並且將不需要的氣體從基板9的表面附近除去。As described above, in this heating device 1, the heated nitrogen gas inside the outer tube 30 is sprayed onto the surface of the substrate 9, and the nitrogen gas is used to discharge unnecessary gas near the surface of the substrate 9 to the outside of the heating furnace 10. Therefore, it is possible to suppress the temperature drop of the substrate 9 or the liquefaction of an unnecessary gas, and to remove the unnecessary gas from the vicinity of the surface of the substrate 9.

尤其此加熱裝置1中,主加熱器20發揮加熱基板9的作用與加熱氮氣的作用此兩個作用。因此,與分別設置加熱基板9的加熱器與加熱氮氣的加熱器的情況相比,容易使加熱裝置1小型化。In particular, in the heating device 1, the main heater 20 performs two functions of heating the substrate 9 and heating nitrogen. Therefore, as compared with a case where the heater for heating the substrate 9 and the heater for heating nitrogen are separately provided, the heating device 1 can be easily miniaturized.

另外,本實施形態中,噴出經加熱的氮氣的噴出口32設于外管30的前端部附近,另一方面在加熱爐10的後壁12中設有排出氣體的排氣口121。因此,從外管30的噴出口32噴出的氮氣從基板9的前端緣向後端緣流動。借此,能夠進一步提高基板9的表面附近的氣體的置換效率。In addition, in the present embodiment, an outlet 32 for emitting heated nitrogen gas is provided near the front end portion of the outer tube 30, and an exhaust port 121 for exhausting gas is provided in the rear wall 12 of the heating furnace 10. Therefore, the nitrogen gas ejected from the ejection port 32 of the outer pipe 30 flows from the front end edge to the rear end edge of the substrate 9. Thereby, the gas replacement efficiency in the vicinity of the surface of the substrate 9 can be further improved.

另外,從外管30的噴出口32噴出的氮氣向遠離搬入搬出口17及擋閘18的方向流動。因此,利用氮氣加以除去的不需要的氣體也向遠離搬入搬出口17及擋閘18的方向流動。若如此設定,則能夠抑制不需要的氣體所含的不需要的成分附著於擋閘18而形成顆粒。In addition, the nitrogen gas discharged from the discharge port 32 of the outer pipe 30 flows in a direction away from the loading / unloading port 17 and the shutter 18. Therefore, the unnecessary gas removed by the nitrogen gas also flows in a direction away from the loading / unloading port 17 and the shutter 18. With this setting, it is possible to prevent unnecessary components contained in the unnecessary gas from adhering to the shutter 18 to form particles.

<3.變形例> 以上,對本發明的一實施形態進行了說明,但本發明不限定於所述實施形態。<3. Modifications> An embodiment of the present invention has been described above, but the present invention is not limited to the embodiment.

所述實施形態的加熱裝置1具備包覆主加熱器20的外管30。但是,本發明的加熱裝置也可未必具備外管。從供氣部供給的氮氣也可由與主加熱器不同的加熱機構加熱並向加熱爐的內部導入。The heating device 1 according to the embodiment includes an outer tube 30 that covers the main heater 20. However, the heating device of the present invention may not necessarily include an outer tube. The nitrogen gas supplied from the air supply unit may be heated by a heating mechanism different from the main heater and introduced into the heating furnace.

另外,所述實施形態中,從供氣部50供給氮氣。然而,從供氣部50供給的氣體也可為氮氣以外的氣體。但是,為了抑制不需要的化學反應,從供氣部50供給的氣體優選氮氣或氬氣等惰性氣體。In the above-mentioned embodiment, nitrogen is supplied from the gas supply unit 50. However, the gas supplied from the gas supply unit 50 may be a gas other than nitrogen. However, in order to suppress unnecessary chemical reactions, the gas supplied from the gas supply unit 50 is preferably an inert gas such as nitrogen or argon.

另外,加熱爐內能夠配置的基板的個數、主加熱器的個數、次加熱器的個數、外管的形狀等細節部分的構成也可與本申請的各圖不同。另外,也可將所述實施形態或變形例中出現的各要素在不產生矛盾的範圍內適當組合。In addition, the detailed configuration of the details such as the number of substrates that can be arranged in the heating furnace, the number of main heaters, the number of secondary heaters, and the shape of the outer tube may be different from the drawings of this application. In addition, each element appearing in the embodiment or the modification may be appropriately combined within a range where no contradiction occurs.

1‧‧‧加熱裝置1‧‧‧Heating device

9‧‧‧基板9‧‧‧ substrate

10‧‧‧加熱爐10‧‧‧Heating furnace

11‧‧‧前壁11‧‧‧ front wall

12‧‧‧後壁12‧‧‧ back wall

13‧‧‧右側壁13‧‧‧ right wall

14‧‧‧左側壁14‧‧‧left wall

15‧‧‧底板部15‧‧‧ floor section

16‧‧‧頂板部16‧‧‧Top plate department

17‧‧‧搬入搬出口17‧‧‧ moved in and out

18‧‧‧擋閘18‧‧‧ Block

19‧‧‧處理空間19‧‧‧ Processing space

20‧‧‧主加熱器(棒狀加熱器)20‧‧‧Main heater (rod heater)

20G‧‧‧加熱器群20G‧‧‧heater group

21‧‧‧基端部21‧‧‧ base end

22‧‧‧前端部22‧‧‧ front end

30‧‧‧外管30‧‧‧ Outer tube

31‧‧‧供氣口31‧‧‧air supply port

32‧‧‧噴出口32‧‧‧ spout

33‧‧‧基板支撐部33‧‧‧ substrate support

40‧‧‧次加熱器40‧‧‧times heater

41‧‧‧右側次加熱器41‧‧‧ Right secondary heater

42‧‧‧左側次加熱器42‧‧‧Left secondary heater

50‧‧‧供氣部50‧‧‧Gas supply department

51‧‧‧主配管51‧‧‧main piping

52‧‧‧分支配管52‧‧‧ branch piping

53‧‧‧第一開閉閥53‧‧‧The first opening and closing valve

54‧‧‧氮氣供給源54‧‧‧ Nitrogen Supply Source

60‧‧‧排氣部60‧‧‧Exhaust

61‧‧‧個別配管61‧‧‧Individual piping

62‧‧‧集合配管62‧‧‧collection piping

63‧‧‧第二開閉閥63‧‧‧Second on-off valve

70‧‧‧控制部70‧‧‧Control Department

71‧‧‧處理器71‧‧‧ processor

72‧‧‧記憶體72‧‧‧Memory

73‧‧‧存儲部73‧‧‧Storage Department

100‧‧‧空間100‧‧‧ space

120、130、140‧‧‧插入孔120, 130, 140‧‧‧ insertion holes

121‧‧‧排氣口121‧‧‧ exhaust port

d1、d2‧‧‧間隔d1, d2‧‧‧ interval

d3‧‧‧長度d3‧‧‧ length

P‧‧‧電腦程式P‧‧‧Computer Program

S1~S3、S21~S25‧‧‧步驟S1 ~ S3, S21 ~ S25‧‧‧step

圖1為加熱裝置的外觀立體圖。 圖2為加熱裝置的縱截面圖。 圖3為加熱裝置的橫截面圖。 圖4為主加熱器及外管的局部截面圖。 圖5為表示將兩台加熱裝置並排配置在左右方向上時的狀況的圖。 圖6為表示控制部與加熱裝置內的各部的連接的方塊圖。 圖7為表示加熱處理的流程的流程圖。 圖8為表示形成於加熱裝置內的氣體流的流程圖。FIG. 1 is an external perspective view of a heating device. Fig. 2 is a longitudinal sectional view of a heating device. Fig. 3 is a cross-sectional view of the heating device. Fig. 4 is a partial sectional view of the main heater and the outer pipe. FIG. 5 is a diagram showing a state when two heating devices are arranged side by side in the left-right direction. Fig. 6 is a block diagram showing the connection between the control unit and each unit in the heating device. FIG. 7 is a flowchart showing a flow of a heating process. FIG. 8 is a flowchart showing a gas flow formed in the heating device.

Claims (11)

一種加熱裝置,對多個基板進行加熱,且所述加熱裝置包括: 加熱爐,能夠在上下方向上多段地收納多個所述基板;以及 多個棒狀加熱器,在所述加熱爐的內部沿著所述基板的表面而配置,且在左右方向上空開間隔而排列,並且 所述加熱爐具有: 前壁,設有用於搬入及搬出所述基板的搬入搬出口;以及 後壁,隔著收容多個所述基板的空間而與所述前壁在前後方向上相向, 所述後壁具有多個插入孔, 多個所述棒狀加熱器能夠分別經由所述插入孔而插入到所述加熱爐中或從所述加熱爐中拔出。A heating device for heating a plurality of substrates, and the heating device includes: a heating furnace capable of accommodating a plurality of the substrates in a plurality of sections in an up-down direction; and a plurality of rod-shaped heaters inside the heating furnace They are arranged along the surface of the substrate and are arranged at intervals in the left-right direction, and the heating furnace has: a front wall provided with a carry-in / out port for carrying in and out of the substrate; A space accommodating a plurality of the substrates faces the front wall in the front-rear direction, the rear wall has a plurality of insertion holes, and a plurality of the rod-shaped heaters can be inserted into the through the insertion holes. In or out of a heating furnace. 如申請專利範圍第1項所述的加熱裝置,其中多個所述棒狀加熱器彼此平行地排列。The heating device according to item 1 of the patent application range, wherein a plurality of the rod-shaped heaters are arranged parallel to each other. 如申請專利範圍第1項或第2項所述的加熱裝置,其中具有多個加熱器群,所述加熱器群是通過將所述棒狀加熱器在所述左右方向上排列多個而構成,且 在所述加熱爐的內部,將所述加熱器群與所述基板在上下方向上交替地配置。The heating device according to item 1 or 2 of the scope of patent application, which has a plurality of heater groups, and the heater group is configured by arranging a plurality of the rod-shaped heaters in the left-right direction. And in the heating furnace, the heater group and the substrate are alternately arranged in the vertical direction. 如申請專利範圍第3項所述的加熱裝置,其中所述加熱器群所含的多個所述棒狀加熱器中, 位於所述左右方向的兩端部附近的棒狀加熱器彼此的間隔比位於所述左右方向的中央附近的棒狀加熱器彼此的間隔窄。The heating device according to item 3 of the scope of patent application, wherein among the plurality of rod-shaped heaters included in the heater group, the interval between the rod-shaped heaters located near both ends in the left-right direction is The interval between the rod-shaped heaters located near the center in the left-right direction is narrower. 如申請專利範圍第1項或第2項所述的加熱裝置,包括: 多個主加熱器,為所述棒狀加熱器;以及 多個次加熱器,為與多個所述主加熱器不同的棒狀加熱器,在俯視時相對於所述主加熱器而垂直地配置,且沿著所述加熱爐的壁面而延伸,且 所述加熱爐具有隔著收容多個所述基板的空間而在所述左右方向上相向的一對側壁, 一部分所述次加熱器在所述一對側壁中的一者與所述加熱爐的所述左右方向的中央之間在所述左右方向上延伸, 其他所述次加熱器在所述一對側壁中的另一者與所述加熱爐的所述左右方向的中央之間在所述左右方向上延伸。The heating device according to item 1 or 2 of the scope of patent application, comprising: a plurality of main heaters, which are the rod-shaped heaters; and a plurality of sub-heaters, which are different from the plurality of the main heaters The rod-shaped heater is vertically arranged with respect to the main heater in plan view, and extends along a wall surface of the heating furnace, and the heating furnace has a space across a plurality of the substrates. A pair of side walls facing in the left-right direction, a part of the sub heater extends in the left-right direction between one of the pair of side walls and a center of the heating furnace in the left-right direction, The other secondary heater extends in the left-right direction between the other of the pair of side walls and a center of the heating furnace in the left-right direction. 如申請專利範圍第5項所述的加熱裝置,其中所述次加熱器的所述左右方向的長度比所述加熱爐的所述左右方向的一半長度短。The heating device according to item 5 of the scope of patent application, wherein a length of the secondary heater in the left-right direction is shorter than a half length of the heating furnace in the left-right direction. 如申請專利範圍第1項或第2項所述的加熱裝置,還包括向所述加熱爐內供給氣體的供氣部, 所述供氣部連接於所述後壁。The heating device according to item 1 or item 2 of the scope of patent application, further comprising a gas supply portion for supplying gas into the heating furnace, and the gas supply portion is connected to the rear wall. 如申請專利範圍第1項或第2項所述的加熱裝置,還包括將所述加熱爐內的氣體排出的排氣部, 所述排氣部連接於所述後壁。The heating device according to item 1 or item 2 of the scope of patent application, further comprising an exhaust portion that exhausts gas in the heating furnace, and the exhaust portion is connected to the rear wall. 如申請專利範圍第1項或第2項所述的加熱裝置,其中在所述左右方向上並排設置。The heating device according to item 1 or item 2 of the scope of patent application, wherein the heating devices are arranged side by side in the left and right directions. 如申請專利範圍第1項或第2項所述的加熱裝置,其中加熱前的所述基板在上表面具有包含有機溶劑的薄膜。The heating device according to claim 1 or claim 2, wherein the substrate before heating has a thin film containing an organic solvent on an upper surface. 如申請專利範圍第10項所述的加熱裝置,其中所述薄膜包含聚醯亞胺前驅物。The heating device according to claim 10, wherein the thin film comprises a polyimide precursor.
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Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
JPS6133447Y2 (en) * 1980-09-29 1986-09-30
JPH01281394A (en) * 1988-05-06 1989-11-13 Shimadzu Corp Heat treatment furnace
JPH10149994A (en) * 1996-11-15 1998-06-02 Kokusai Electric Co Ltd Substrate heating device for semiconductor-manufacturing device
JP3929239B2 (en) * 2000-12-06 2007-06-13 株式会社ノリタケカンパニーリミテド Far-infrared thin heater and substrate heating furnace
US20050166844A1 (en) * 2004-02-03 2005-08-04 Nicholas Gralenski High reflectivity atmospheric pressure furnace for preventing contamination of a work piece
JP2006084109A (en) * 2004-09-16 2006-03-30 Dainippon Screen Mfg Co Ltd Substrate baking device
TWI508178B (en) * 2008-07-16 2015-11-11 Tera Semicon Corp Batch type heat treatment apparatus
JP5732655B2 (en) * 2008-12-03 2015-06-10 東海高熱工業株式会社 Batch type firing furnace
JP5858891B2 (en) * 2012-09-27 2016-02-10 オリジン電気株式会社 Heat treatment equipment
KR101547458B1 (en) * 2012-12-18 2015-08-26 주식회사 나래나노텍 Improved Heat Treatment Chamber and Method of Substrate, and Heat Treatment Apparatus of Substrate Having the Same
JP6170340B2 (en) * 2013-05-21 2017-07-26 東京エレクトロン株式会社 Gas supply head, gas supply mechanism, and substrate processing apparatus
KR101527158B1 (en) * 2013-10-24 2015-06-09 주식회사 테라세미콘 Batch type apparatus for processing substrate
JP2015165491A (en) * 2014-02-06 2015-09-17 三菱化学株式会社 Organic electroluminescent device and method for manufacturing the same
KR20150110206A (en) * 2014-03-24 2015-10-02 주식회사 테라세미콘 Apparatus for heat processing
JP6679364B2 (en) * 2015-04-02 2020-04-15 東京エレクトロン株式会社 Substrate heating device
JP6639867B2 (en) * 2015-10-30 2020-02-05 東京応化工業株式会社 Substrate heating apparatus and substrate heating method
CN205946213U (en) * 2016-08-12 2017-02-08 东莞市海新金属科技有限公司 Heating tube modular structure and use oven of this structure convenient to dismouting
JP6388041B2 (en) * 2017-01-27 2018-09-12 株式会社九州日昌 Heating apparatus and heating method

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