JP2006084109A - Substrate baking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate baking device capable of reducing equipment cost and running cost, by improving energy efficiency, in a substrate baking processing device having a substrate shelf part composed of a plurality of stages. <P>SOLUTION: This substrate baking device has a kiln 20 for forming a baking chamber V on the inside, an upstream side carrying passage for carrying a substrate toward this kiln, and a downstream side carrying passage for receiving and carrying the baking processing-finished substrate derived from the kiln. The kiln is internally attached with a substrate storage device 30 having a plurality of stages of substrate storage shelf stages 34 for successively receiving and holding the substrate carried by the upstream side carrying passage, and a lifting device 40 for lifting this substrate storage device. The lifting device successively lifts the substrate storage device for turning the substrate storage shelf stages for storing the baking processing-completed substrate to a position opposed to the downstream side carrying passage. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate baking apparatus that performs a baking process on a substrate.

  Conventionally, a substrate heat treatment apparatus (substrate baking apparatus) as described in Patent Document 1 is known. This heat treatment apparatus includes a heating furnace that performs heat treatment (firing process) on a substrate, a transport rack that is provided in a plurality of stages in the heating furnace, and that can carry a substrate into and out of each stage of the heating furnace, and raise and lower the heating furnace. And an elevating device to be configured. An upstream conveyance path and a downstream conveyance path are disposed at predetermined height positions on the upstream side and the downstream side of the heating furnace.

Such a heat treatment apparatus raises and lowers the heating furnace with an elevating apparatus, and stores the substrates in all the transport racks by repeating the operation of receiving the substrates into the heating furnace by causing the empty transport rack to face the upstream transport path. It is like that. And in the process of holding the substrate on the transport rack of each stage while raising and lowering the heating furnace, the baking process is completed in order from the first substrate received in the heating furnace, so the baking process is completed by the lifting device The transport rack holding the substrate is sequentially carried out so as to face the downstream transport rack.
JP 2003-317627 A

  However, in the substrate heat treatment apparatus described in Patent Document 1, it is necessary to raise and lower the heating furnace. For this purpose, it is necessary to provide an opening and a shutter for loading and unloading the substrate at each stage in the heating furnace. In addition, there is a problem that the lifting device becomes large-scale and the equipment cost is inevitably increased, and a great amount of energy is consumed for the lifting operation and the running cost is increased.

  The present invention has been made in view of such a situation, and an object of the present invention is to provide a substrate baking apparatus that can contribute to a reduction in equipment cost and running cost while achieving an efficient baking process of the substrate. It is said.

  The invention according to claim 1 is a firing furnace having a space inside and a substrate loading / unloading portion formed on a side wall, and an upstream side conveyance connected to the substrate loading / unloading portion and carrying the substrate to the firing furnace. And a downstream conveyance path that is connected to the substrate carry-in / carry-out unit and conveys the substrate after baking downstream, and the baking furnace includes a plurality of stages of shelves that hold the substrate therein, and the shelf And an elevating mechanism for elevating the unit for each stage.

  According to such a configuration, the substrate that has been sequentially held by being carried from the upstream transport means to the shelf of each stage provided in the firing furnace is exposed to the firing atmosphere in the firing furnace. Sintering is performed sequentially. The shelf holding the substrate on which the baking process has been completed is raised and lowered by driving the lifting device to face the downstream transport means, and the substrate held on the shelf in this state is transferred to the downstream transport means. It will be done. By changing the height position of the emptied shelf and being matched with the upstream transport means, it is possible to carry in the substrate transported from the upstream side. In this way, by raising and lowering the shelf, it is possible to simultaneously execute a plurality of baking processes in the baking furnace while feeding the substrate from the upstream transfer means to the downstream transfer means through the baking furnace at a normal transfer speed. Thus, the efficiency of the substrate baking process can be improved and the tact time can be shortened.

  And since the raising / lowering apparatus is made to raise / lower only a shelf part, it becomes a simple structure compared with what raises / lowers the conventional baking furnace itself, and while the equipment cost is reduced correspondingly, baking furnace itself The energy cost is reduced as compared with the case of moving up and down.

  According to a second aspect of the present invention, in the first aspect of the invention, the substrate carry-in / carry-out unit includes a substrate carry-in unit that carries in a substrate and a substrate carry-out unit that carries out the substrate, and the substrate carry-in unit and the substrate carry-out unit The portion includes an opening having a dimension that allows the substrate to pass therethrough and an opening / closing portion that opens and closes the opening.

  According to such a configuration, the inside of the firing furnace is sealed by closing the opening with the opening / closing part, so that the substrate is efficiently fired.

  The invention according to claim 3 is the invention according to claim 1 or 2, wherein each step of the shelf is a plurality of transport rollers arranged in parallel in the substrate transport direction in the upstream transport path and the downstream transport path. And a drive source for rotating at least one of the transport rollers.

  According to such a configuration, the substrate directed from the upstream transport means to the shelf is carried onto the shelf by the rotation of the transport roller by driving of the drive source provided in the shelf, and the substrate is moved to the shelf. The substrate on the shelf is carried out toward the downstream transport means by the rotation of the transport roller driven by the drive source.

  As described above, by providing a plurality of transport rollers for placing the substrates arranged in parallel in the substrate transport direction on the shelf and a drive source for driving the transport rollers, a substrate loading / unloading device such as a work robot can be provided. Even if it is not provided, it becomes possible to carry in and out the substrate with respect to the shelf, and the equipment cost is reduced.

  According to a fourth aspect of the present invention, in the third aspect of the invention, the substrate carry-in portion and the substrate carry-out portion are formed above and below the one side wall, and the upstream conveyance path and the downstream conveyance path are arranged above and below. It is characterized by being provided.

  According to such a configuration, the site area for installing the substrate baking apparatus can be reduced by laying the upstream conveying means and the downstream conveying means so as to face each other vertically.

  The invention according to claim 5 is the invention according to claim 1 or 2, further comprising substrate delivery means for delivering a substrate, wherein the substrate delivery means is between the upstream transport path and the substrate carry-in / out section, and Arranged between the downstream conveyance path and the substrate carry-in / out section, and transfers the substrate between the upstream conveyance path and the shelf and between the downstream conveyance path and the shelf. It is characterized by doing.

  According to such a configuration, the substrate sent from the upstream transport unit is moved to the shelf by a predetermined operation of the substrate delivery unit, and the substrate stored in the shelf is a predetermined operation of the substrate delivery unit. Therefore, it is possible to minimize the layout restrictions such as arranging the upstream conveyance unit and the downstream conveyance unit facing each other on the same plane, and freedom in layout in the device design. The degree is improved.

  A sixth aspect of the invention is characterized in that, in the fifth aspect of the invention, the upstream-side transport path and the downstream-side transport path are arranged substantially linearly.

  According to such a configuration, since the upstream transport unit and the downstream transport unit are arranged substantially linearly, the operation range of the substrate transfer unit can be narrowed, and the structure of the substrate transfer unit can be simplified. In addition, the substrate is reliably carried into and out of the firing furnace.

  According to the first aspect of the present invention, since the lifting device is configured to lift and lower only the shelf in the substrate firing chamber of the firing furnace, the structure is simpler than that of the conventional firing furnace itself. As a result, it is possible to contribute to the reduction of the equipment cost and to the reduction of the energy cost as compared with the case where the firing furnace itself is moved up and down.

  According to the second aspect of the present invention, since the opening / closing part that can close the opening provided in the firing furnace in a sealed state is provided, the inside of the firing furnace can be sealed by closing the opening / closing part, and the efficiency Calcination treatment can be realized.

  According to the invention described in claim 3, by providing a plurality of transport rollers for placing the substrates arranged in parallel in the substrate transport direction on the shelf and a drive source for driving the transport rollers, in particular, a work robot or the like Even if the substrate carrying-in / out apparatus is not provided, the substrate can be carried in / out with respect to the shelf portion, which can contribute to the reduction of the equipment cost.

  According to the fourth aspect of the present invention, since the upstream conveying means and the downstream conveying means can be laid so as to face each other in the vertical direction, the site area for installing the substrate baking apparatus can be reduced and Effective use of the branch site can be achieved.

  According to the fifth aspect of the present invention, since the carry-in / out of the substrate with respect to the shelf is performed by a predetermined operation of the substrate delivery means, the layout is such that the upstream-side conveyance means and the downstream-side conveyance means are arranged opposite to each other on the same plane. The above-mentioned restrictions are minimized, and this increases the degree of freedom in layout in the construction of the apparatus, and the substrate baking apparatus can be properly arranged according to the local conditions.

  According to the sixth aspect of the present invention, since the upstream transport unit and the downstream transport unit are arranged substantially linearly, it is possible to narrow the operating range of the substrate transfer unit, and the substrate transfer unit In addition to simplifying the structure, it is possible to reliably carry the substrate into and out of the firing furnace.

  FIG. 1 is a partially cutaway perspective view showing a substrate baking apparatus 10 according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the substrate baking apparatus 10 shown in FIG. In these drawings, the XX direction is referred to as the width direction, and the YY direction is referred to as the front-rear direction. In particular, the -X direction is referred to as the left, the + X direction is referred to as the right, the -Y direction is referred to as the front, and the + Y direction is referred to as the rear. .

  As shown in FIGS. 1 and 2, the substrate baking apparatus 10 according to the first embodiment includes a baking furnace 20 having a vertically long box shape for subjecting a substrate B to a predetermined baking process, and this baking. A substrate storage device (shelf) 30 that is installed in the furnace 20 so as to be movable up and down, a lift device 40 that moves the substrate storage device 30 up and down, and a high-temperature non-oxidizing gas (nitrogen gas in this embodiment) in the baking furnace 20. ), A pretreatment device 60 that performs a predetermined pretreatment on the substrate B prior to the baking process in the baking furnace 20, and a predetermined value for the substrate B that has been subjected to the baking process in the baking furnace 20. And a post-processing device 70 that performs post-processing.

  The firing furnace 20 includes a bottom plate 21 having a rectangular shape in plan view, a pair of side plates 22 extending in the width direction of the bottom plate 21, and a front edge of the bottom plate 21. A front plate 23, a rear plate 24 erected from the rear edge of the bottom plate 21, and a top plate 25 installed between the side plates 22, the front plate 23 and the upper edge of the rear plate 24. A baking chamber (space) V for baking the substrate B is provided inside, which is formed in a vertically long box shape. By introducing the high-temperature non-oxidizing gas G from the gas supply unit 50 into the baking chamber V, the substrate B held in the substrate storage device 30 is subjected to a baking process.

  A gas introduction hole 231 for introducing the non-oxidizing gas G is provided at the bottom of the front plate 23 of the firing furnace 20, and the non-oxidizing gas G is led to the same top plate 25. The non-oxidizing gas G supplied from the gas supply unit 50 is circulated through the gas introducing hole 231 and the outlet hole 251.

  In addition, guide rails 26 made of an angle material are provided at the four corners of the baking chamber V and extend in the vertical direction. The substrate storage device 30 can move up and down while the four corners are guided by the guide rails 26. ing.

  Further, a substrate B from the pretreatment device 60 is carried into the substrate storage device 30 in the baking chamber V at a position slightly above the central position in the vertical direction of the rear plate (one side wall) 24 of the baking furnace 20. A carry-in port (opening, substrate carry-in part) 27 is provided, and a slightly lower position is a carry-out port for carrying out the substrate B after baking processing from the substrate storage device 30 toward the post-processing device 70. (Opening, substrate carry-out part) 28 is provided.

  The substrate storage device 30 is interposed between a rectangular bottom board 31 slightly smaller than the bottom plate 21, a top board 32 having the same size as the bottom board 31, and the bottom board 31 and the corners of the top board 32. And four support columns 33 made of square bars and a plurality of substrate storage shelves (steps) 34 formed in a state of being supported by the support columns 33. Each support 33 is brought into contact with the inside of each guide rail 26, whereby the substrate storage device 30 can be moved up and down while sliding with the guide rail 26.

  Such a substrate storage device 30 is set so that its vertical dimension is slightly shorter than ½ of the inner dimension between the bottom plate 21 and the top plate 25 of the firing furnace 20, and is positioned at the lowest position in the uppermost stage. The substrate storage shelf 34 is opposed to the carry-out port 28, and the lowermost substrate storage shelf 34 can correspond to the carry-in port 27 in the state set at the uppermost position. Thus, by adjusting the height position of the substrate storage device 30, the substrate storage shelf steps 34 of all the stages can be opposed to the carry-in entrance 27 and the carry-out exit 28.

  FIG. 3 is a perspective view showing an embodiment of the substrate storage shelf stage 34. As shown in this figure, the substrate storage shelf 34 includes a pair of lateral beam members 341 spanned between columns 33 opposed to each other in the front and rear direction, and a lateral beam member constructed between columns 33 opposed to each other in the width direction. A pair of longitudinal beam members 342 in the front-rear direction at the same height as 341, a plurality of (in this embodiment, five) shelf conveyance rollers 35 laid between the transverse beam members 341 at an equal pitch, and one transverse beam A drive motor (drive source) 36 that drives the shelf conveyance roller 35 mounted on the material 341 is provided.

  The shelf conveyance roller 35 is supported so as to be concentrically and integrally rotatable around a roller shaft 351 provided between a pair of cross beam members 341. Further, in the present embodiment, the drive motor 36 is fixed to the left horizontal beam member 341 in a state corresponding to the foremost shelf conveying roller 35, and a drive shaft (not shown) of the drive motor 36 is the frontmost row. Are connected concentrically to a roller shaft 351 of the shelf conveying roller 35 of the rack so as to be integrally rotatable. Accordingly, the drive rotation of the drive motor 36 is transmitted to the frontmost shelf conveyance roller 35 via the drive shaft and the roller shaft 351, whereby the frontmost shelf conveyance roller 35 rotates together around the roller shaft 351. It is like that.

  A gear mechanism 37 is interposed between one of the horizontal beam members 341 (in this embodiment, the left horizontal beam member 341) and the end surface of the shelf conveyance roller 35, and the drive rotation of the drive motor 36 is as follows. The gear mechanism 37 is adapted to transmit to each shelf transport roller 35 other than the front row (the front-row shelf transport roller 35 receives the driving force of the shelf transport roller 35 without passing through the gear mechanism 37. Transmitted directly).

  The gear mechanism 37 includes a drive gear 371 that is concentrically and integrally fitted to the roller shaft 351 in the front row, and a driven gear 372 that is concentrically and integrally fitted to the roller shafts 351 other than the front row. The drive gear 371 includes an idle gear 373 interposed between each drive gear 372 and between the drive gear 372 adjacent to the drive gear 371. Accordingly, the drive rotation of the drive motor 36 is transmitted to each driven gear 372 via the drive gear 371 and the idle gear 373, whereby all the shelf conveyance rollers 35 rotate simultaneously in the same direction. ing.

  When the substrate B is received into the substrate storage shelf stage 34 via the carry-in port 27 (FIG. 2), the drive motor 36 is rotated in the clockwise direction in FIG. When the substrate B placed on the substrate storage shelf 34 is carried out via the carry-out port 28 (FIG. 2), it is guided to the clockwise rotation of the substrate and loaded onto the substrate storage shelf 34. The drive motor 36 is driven and rotated counterclockwise in FIG. 3, whereby the substrate B on the substrate storage shelf stage 34 is guided by the rotation of each shelf transport roller 35 in the counterclockwise direction, and passes through the carry-out port 28. It will be carried out to the post-processing device 70 through.

  As shown in FIGS. 1 and 2, the elevating device 40 is concentric with an elevating motor 41 arranged vertically in a position below the floor on which the firing furnace 20 is installed, and a drive shaft 411 of the elevating motor 41. A spline shaft 42 that is connected so as to be integrally rotatable, a spiral rod 43 that is concentrically rotated integrally with the spline shaft 42 and is externally fitted so as to be movable up and down, and a firing furnace so that the spiral rod 43 can be screwed. A nut member 44 fixed to the lower surface side of the bottom plate 21 of the 20 and a cylindrical body 45 fixed to the center position of the lower surface of the bottom board 31 of the substrate storage device 30 and into which the top portion of the spiral rod 43 is fitted in a sliding contact state. It is prepared for.

  The elevating motor 41 is installed at a position directly below the cylindrical body 45, and the spiral rod 43 penetrates through the bottom plate 21 while being screwed to the nut member 44, and enters the firing chamber V. The top portion is fitted into the cylindrical body 45 so as to be relatively rotatable. The length of the spiral rod 43 is set to be approximately the same as the vertical dimension of the substrate storage device 30, and the length of the spline shaft 42 is set slightly longer than the spiral rod 43.

  According to the elevating device 40, by rotating the spline shaft 42 around the axis by driving the roller shaft 41, this rotation is transmitted to the spiral rod 43 and the spiral rod 43 is also rotated around the axis. Since the spiral rod 43 is screwed to the nut member 44, the spiral rod 43 is moved up and down by its rotation, and this lift is transmitted to the substrate storage device 30 via the cylindrical body 45, and the substrate storage device 30 is Will go up and down.

  The gas supply unit 50 includes a gas source 51 such as a gas tank for storing the non-oxidizing gas G, and the non-oxidizing gas G heated from the gas source 51 by heating the non-oxidizing gas G in the baking chamber V. A baking gas supply unit 52 that supplies G to perform a baking process on the substrate B, and supplies the non-oxidizing gas G from the gas source 51 to the pre-processing apparatus 60 and the post-processing apparatus 70. And an atmospheric gas supply unit 53 for making the inside of the processing apparatus 70 a non-oxidizing gas atmosphere.

  The firing gas supply unit 52 includes a first air supply blower 522 provided in a heated gas supply pipe 521 provided from the gas source 51 toward the gas introduction hole 231 of the firing furnace 20, and the first air supply blower. A temperature control device 523 provided on the downstream side of 522, a first control valve 524 provided on the downstream side of the temperature control device 523, and a first air supply blower from the outlet hole 251 of the top plate 25 of the baking furnace 20. A gas recovery pipe 525 provided to the heated gas supply pipe 521 between the temperature control device 523 and the temperature control device 523 is provided.

  The temperature control device 523 adjusts the temperature of the non-oxidizing gas G to a temperature suitable for the baking process of the substrate B. In the present embodiment, the gas source 51 is driven by driving the first air supply blower 522. The non-oxidizing gas G led out through the heated gas supply pipe 521 is heated to 250 ° C. to 350 ° C., which is a temperature suitable for the baking treatment of the substrate B. The non-oxidizing gas G after the heat treatment is introduced into the firing chamber V of the firing furnace 20 via the first control valve 524, and the airflow is placed on the substrate storage shelf 34 of each stage of the substrate storage device 30. The substrate B is subjected to a baking treatment by contacting the placed substrate B.

  In the present embodiment, the pressure in the firing chamber V is set to normal pressure by adjusting the amount of the non-oxidizing gas G introduced into the firing chamber V by controlling the opening of the first control valve 524. However, the present invention is not limited to the inside of the firing chamber V being normal pressure, and is set to a positive pressure higher than normal pressure or a negative pressure lower than normal pressure depending on the situation. May be.

  The non-oxidizing gas G after being subjected to the baking treatment of the substrate B in the baking chamber V is a heated gas supply pipe 521 between the first air blower 522 and the temperature control device 523 through the gas recovery pipe 525. It is returned to and recycled.

  The atmosphere gas supply unit 53 includes the gas source 51 (the gas source 51 is shared by the firing gas supply unit 52 and the atmosphere gas supply unit 53), the gas source 51, the pre-processing device 60, and the post-processing device. 70, and an atmosphere gas supply pipe 531 that is piped between the second gas supply pipe 531 and a second air supply blower 532 provided at an appropriate position of the atmosphere gas supply pipe 531. The non-oxidizing gas G supplied to the pre-processing device 60 and the post-processing device 70 is discharged to the outside after making the pre-processing device 60 and the post-processing device 70 a non-oxidizing gas atmosphere.

  The pretreatment device 60 includes an upper casing 61 that is long in the front-rear direction and is fixed to the rear plate 24 so that the downstream end (front end) faces the carry-in port 27 of the firing furnace 20, and the inside of the upper casing 61. Are provided with an upstream replacement chamber 62, a first UV chamber 63, and a second UV chamber 64, which are sequentially formed from the upstream (front) side. In each of these chambers 62, 63, 64, a transport roller 65 in the upper casing is provided in parallel along the substrate transport direction. Each upper casing transport roller 65 is synchronously rotated by driving a transport motor (not shown). An upstream conveyance path 12 that conveys the substrate B toward the baking furnace 20 is formed by the conveyance roller 65 in the upper casing and the upstream conveyance roller 11 arranged in parallel behind the upper casing 61.

  The upstream replacement chamber 62 is for replacing the gas containing oxygen that has entered from the outside with the non-oxidizing gas G from the gas source 51 to make the inside of the pretreatment device 60 a non-oxidizing gas atmosphere. . On the upstream wall of the upstream replacement chamber 62, there is provided an openable / closable shutter (opening / closing portion) 66 pivotally supported around a predetermined axis for opening and closing the substrate carry-in port, and upstream replacement The partition wall between the chamber 62 and the first UV chamber 63 is provided with a gate valve (opening / closing part) 67 having a higher degree of sealing than the shutter 66 that opens and closes the substrate passage opening.

  Then, the downstream end gate valve 67 is closed, and the upstream replacement chamber 62 in which the upstream end shutter 66 is opened is loaded with the substrate B in the downstream end of the atmospheric gas supply pipe 531. The gas in the upstream replacement chamber 62 is replaced with the non-oxidizing gas G by opening the second control valve 533.

  The first UV chamber 63 and the second UV chamber 64 are obtained by subjecting the substrate B to the first and second ultraviolet irradiation processes, and an ultraviolet lamp 68 is provided therein. The partition wall between the first UV chamber 63 and the second UV chamber 64 and the rear plate 24 at the downstream end of the second UV chamber 64 are provided with shutters 66 for opening and closing the substrate passage port and the carry-in port 27, respectively. ing. The first and second UV chambers 63 and 64 are also supplied with the non-oxidizing gas G from the gas source 51 via the branch pipe branched from the atmospheric gas supply pipe 531, thereby the first and second UV chambers 63 and 64. The inside of 64 is always a non-oxidizing gas environment.

  Then, the substrate B that has been subjected to the second ultraviolet irradiation process in the second UV chamber 64 is driven and rotated by the upper casing transport roller 65 and the shelf transport roller 35 with the shutter 66 at the downstream end opened. It is guided to the drive rotation and is carried into the substrate storage shelf 34 of the substrate storage device 30.

  The post-treatment device 70 performs a predetermined post-treatment on the substrate B that has been subjected to the firing process in a state of being placed on the substrate storage shelf 34 in the firing chamber V of the firing furnace 20. A lower casing 71 elongated in the front-rear direction fixed to the rear plate 24 so that the upstream end (front end) faces the carry-out port 28 of the firing furnace 20 at a position slightly below 61, and in the lower casing 71 The first cooling chamber 72, the second cooling chamber 73, and the downstream replacement chamber 74 are sequentially formed from the upstream (front) side. In each of the chambers 72, 73, and 74, a lower casing transport roller 75 is provided in parallel along the substrate transport direction. Each upper casing transport roller 75 is synchronously rotated by driving a transport motor (not shown). Then, the downstream-side conveyance path 14 for carrying the substrate B toward the next process is formed by the conveyance roller 75 in the upper casing and the downstream-side conveyance roller 13 arranged in parallel behind the lower casing 71.

  The first cooling chamber 72 and the second cooling chamber 73 are for performing a cooling process on the baked substrate B derived from the substrate storage shelf 34 of the substrate storage device 30. A cool plate 76 is fixed to the ceiling surface of each of the cooling chambers 72 and 73, and a substrate lifting mechanism 77 that lifts the substrate B supported by the lower case transport roller 75 and contacts the cool plate 76. Is provided.

  The substrate lifting mechanism 77 has a plurality of substrate support pins 771 for supporting the substrate B provided between the plurality of lower case conveyance rollers 75. Then, by raising the substrate support pin 771 by driving the substrate lifting mechanism 77, the substrate B is lifted by the substrate support pin 771 and brought into surface contact with the cool plate 76 and subjected to a cooling process, while the substrate lifting mechanism 77. The substrate support pin 771 is lowered by the reverse driving of the substrate B so that the substrate B is supported by the lower in-case conveyance roller 75 and can be conveyed by driving the in-lower case conveyance roller 75.

  Each of the cool plates 76 is supplied with a coolant from a cold heat source (not shown) so that a low temperature for cooling the substrate B can be maintained. The cool plate 76 on the second cooling chamber 73 side has a lower temperature than the cool plate 76 on the first cooling chamber 72 side. Therefore, after the substrate B carried out from the baking furnace 20 is subjected to the first cooling process in the first cooling chamber 72, the second cooling process is performed so that the temperature becomes lower than that in the second cooling chamber 73. The two-stage cooling process prevents thermal damage to the substrate B due to a rapid temperature change.

  A carrying plate for carrying the substrate B out of the baking furnace 20 is placed on the rear plate 24 of the baking furnace 20 facing the upstream end of the first cooling chamber 72 and the partition wall between the first and second cooling chambers 72 and 73. A shutter (opening / closing portion) 78 for opening and closing the outlet 28 and the passage opening for allowing the substrate to pass therethrough is provided. The shutter 78 has the same structure as the shutter 66 provided in the preprocessing device 60.

  On the other hand, the partition wall that partitions the second cooling chamber 73 and the downstream replacement chamber 74 is provided with a gate valve (opening / closing portion) 79 for opening and closing the substrate passage opening provided in the partition wall. ing. The gate valve 79 has the same structure as the gate valve 67 provided in the pretreatment device 60 and has a high degree of airtightness. Therefore, by closing the gate valves 67 and 79, the first UV chamber 63, the second UV chamber 64, the baking chamber V, the first cooling chamber 72, and the second cooling chamber 73 include pre-processing and post-processing. Thus, a highly sealed space for the substrate baking process is formed.

  The downstream replacement chamber 74 is for replacing the atmosphere containing oxygen entering from the outside with the non-oxidizing gas G when the substrate B is carried out of the system. The downstream end wall of the downstream side replacement chamber 74 is provided with a shutter 78 for opening and closing a substrate carry-out port formed in the downstream end wall. Then, after the gate valve 79 is opened, the substrate B is loaded into the downstream substitution chamber 74 and then the gate valve 79 is closed. In this state, the shutter 78 is opened and the substrate B is carried out of the system. Sometimes the outside air containing oxygen enters the downstream side replacement chamber 74 and the downstream side replacement chamber 74 becomes an atmosphere environment containing oxygen. The atmosphere in the downstream replacement chamber 74 is replaced with a non-oxidizing gas atmosphere by the replacement with the non-oxidizing gas G after the shutter 78 is closed.

  FIG. 4 is an explanatory diagram for explaining the operation of the baking furnace 20 in the substrate baking apparatus 10 of the first embodiment. In FIG. 4A, the first substrate B is carried into the uppermost substrate storage shelf 34. (B) is a state in which the substrates B are carried into all the substrate storage shelves 34, and (c) is a state in which the first loaded substrate B is being carried out of the uppermost substrate storage shelves 34. In a certain state, (d) shows a state where the substrate storage device 30 is being lifted to bring the substrate B into the empty substrate storage shelf 34.

  First, at the beginning of the operation of the substrate baking apparatus 10, the height of the substrate storage apparatus 30 is set so that the uppermost substrate storage shelf 34 faces the second UV chamber 64 of the pretreatment apparatus 60 by driving the lifting motor 41. Is set. In this state, the shutter 66 at the downstream end of the second UV chamber 64 is opened, and at the same time, the transport roller 65 in the upper housing is driven, and the drive motor 36 of the uppermost substrate storage shelf stage 34 is driven to transport the shelf portion. The roller 35 is rotated. As a result, the substrate B in the second UV chamber 64 is carried into the substrate storage shelf stage 34 through the carry-in port 27 as shown in FIG. When the loading of the substrate B onto the substrate storage shelf 34 is completed, the drive motor 36 is stopped, whereby the substrate B is held on the uppermost substrate storage shelf 34.

  Next, the substrate storage device 30 is raised by one pitch by the rotation of the spiral rod 43 around the spline shaft 42 driven by the lift motor 41, and the next substrate is placed on the second substrate storage shelf 34 from the top. When B is loaded and this operation is repeated, as shown in FIG. 4B, all the substrate storage shelves 34 are loaded with the substrate B.

  In this embodiment, the elevating motor 41 completes the firing process of the first loaded substrate B when the substrate B is loaded on all the substrate storage shelves 34 (that is, when one cycle has elapsed). Thus, the firing processing of the uppermost substrate B is completed when the substrate B is loaded into the lowermost substrate storage shelf 34.

  In this state, the substrate storage device 30 is lowered by driving the lifting motor 41, and as shown in FIG. 4C, the uppermost substrate storage shelf 34 is opposed to the carry-out port 28. In this state, the substrate B is Then, it is carried out toward the first cooling chamber 72 through the opened shutter 78. As a result, the uppermost substrate storage shelf 34 is emptied.

  Next, in order to carry the substrate B into the empty uppermost substrate storage shelf 34, the substrate storage device 30 is raised by driving the lifting motor 41, and as shown in FIG. The uppermost substrate storage shelf 34 is made to face the carry-in port 27. In this state, the substrate B in the second UV chamber 64 is carried into the uppermost substrate storage shelf 34, and the loading / unloading operation of such a substrate B with respect to the substrate storage shelf 34 is the second substrate storage shelf from the top. 34 and the third substrate storage shelf 34 are sequentially repeated, so that the substrate B sequentially supplied from the pretreatment device 60 to the firing furnace 20 is sequentially subjected to a firing process in the firing furnace 20 and finished. Are sequentially carried out to the post-processing device 70.

  As described above in detail, the substrate baking apparatus 10 according to the first embodiment includes a baking furnace 20 having a baking chamber V formed therein, and an upstream transfer path for transferring the substrate B toward the baking furnace 20. 12 and a downstream transport path 14 that receives and transports the baked substrate B derived from the firing furnace 20, and the firing furnace 20 receives the substrate B transported by the upstream transport path 12. A substrate storage device 30 having a plurality of substrate storage shelves 34 that are sequentially received and held, and a lifting device 40 that lifts and lowers the substrate storage device 30 are incorporated, and the lifting device 40 is a substrate B that has undergone a baking process. The substrate storage device 30 is moved up and down sequentially so that the substrate storage shelf 34 storing the substrate is directed to a position facing the downstream conveyance path 14.

  Therefore, the substrate B that has been sequentially held by being carried from the upstream transport path 12 to each substrate storage shelf stage 34 of the substrate storage device 30 provided in the baking furnace 20 is a baking atmosphere in the baking furnace 20. As a result, the baking process is sequentially performed. The substrate storage shelf 34 holding the substrate B that has been subjected to the baking process is aligned with the downstream transport path 14 by raising and lowering the substrate storage device 30 in the baking furnace 20 by driving the lifting device 40. In this state, the substrates B held on the substrate storage shelf stage 34 are sequentially transferred to the downstream transport path 14. If the substrates B transported by the upstream transport path 12 to the emptied substrate storage shelves 34 are sequentially loaded based on the lifting / lowering operation of the substrate storage device 30 by the lifting / lowering device 40, the substrates B are transported upstream. It becomes possible to carry out the firing process in the firing furnace 20 while feeding at a normal transport speed from the path 12 to the downstream transport path 14 via the firing furnace 20 and to improve the firing efficiency of the substrate B. Can do.

  And since the raising / lowering apparatus 40 raises / lowers only the substrate storage apparatus 30 in the baking chamber V of the baking furnace 20, it makes it a simple structure compared with what raises / lowers the conventional baking furnace 20 itself. As a result, it contributes to the reduction of the equipment cost and can contribute to the reduction of the energy cost as compared with the case where the firing furnace 20 itself is moved up and down.

  The substrate storage shelf 34 is provided with a plurality of shelf transport rollers 35 for placing the substrates B arranged in parallel in the substrate transport direction, and a drive motor 36 for driving the shelf transport rollers 35. Therefore, the substrate B directed from the upstream transport path 12 to the substrate storage shelf stage 34 of the substrate storage device 30 is rotated by the shelf transport roller 35 driven by the drive motor 36 provided in the substrate storage shelf stage 34. The substrate is loaded onto the substrate storage shelf 34, and the substrate B is stored by the rotation of the shelf transport roller 35 driven by the drive motor 36 when the substrate B is unloaded from the substrate storage shelf 34 toward the downstream transport path 14. The substrate B on the shelf stage 34 is carried out toward the downstream transport path 14.

  In this way, by providing the plurality of shelf transport rollers 35 for placing the substrates B arranged in the substrate transport direction on the substrate storage shelf 34 and the drive motor 36 for driving the shelf transport rollers 35. In particular, the substrate B can be carried into and out of the substrate storage shelf 34 without providing a substrate carrying-in / out device such as a work robot, which can contribute to a reduction in equipment costs.

  Furthermore, since the upstream conveyance path 12 and the downstream conveyance path 14 are laid so as to face each other in the vertical direction, the site area for installing the substrate baking apparatus 10 is reduced, and the site is effectively used. be able to.

  FIG. 5 is a partially cutaway perspective view showing a substrate baking apparatus 10 ′ according to a second embodiment of the present invention, and FIG. 6 is a sectional view taken along line BB of the substrate baking apparatus 10 ′ shown in FIG. is there. In these drawings, the XX direction is referred to as the width direction, and the YY direction is referred to as the front-rear direction. In particular, the -X direction is referred to as the left, the + X direction is referred to as the right, the -Y direction is referred to as the front, and the + Y direction is referred to as the rear. .

  As shown in FIGS. 5 and 6, the substrate baking apparatus 10 ′ of the second embodiment includes a baking furnace 20 having a vertically long box shape for subjecting the substrate B to a predetermined baking process, A substrate storage device 30 ′ (FIG. 6) installed in the firing furnace 20 so as to be movable up and down, a lift device 40 for lifting and lowering the substrate storage device 30 ′, and a high-temperature non-oxidizing gas (this embodiment) Gas supply unit 50 for supplying nitrogen gas), a pretreatment device 60 for performing a predetermined pretreatment on the substrate B prior to the firing treatment in the firing furnace 20, and a substrate for which the firing treatment in the firing furnace 20 has been completed. A post-processing device 70 that performs a predetermined post-processing on B, and a substrate loading / unloading device (substrate delivery) for loading / unloading the substrate B from the pre-processing device 60 to the substrate storage device 30 ′ and from the substrate storage device 30 ′ to the post-processing device 70. Means) having a basic configuration with 80

  Among these components constituting the substrate baking apparatus 10 ′, the baking furnace 20, the lifting device 40, the gas supply unit 50, the pretreatment device 60 and the posttreatment device 70 are the same as those in the first embodiment. Whereas the substrate storage device 30 ′ is employed, the substrate storage device 30 ′ is slightly different from that of the first embodiment. In terms of layout, the pre-processing device 60 and the post-processing device 70 are vertically arranged in the first embodiment in the first embodiment, whereas in the second embodiment, the pre-processing device 60 and the rear processing device 70 are rear-mounted. The processing apparatus 70 is different from the first embodiment in that the processing apparatus 70 is arranged in series in the front-rear direction on the same plane with the substrate carry-in / out part 15 interposed therebetween. Accordingly, the rear plate 24 of the baking furnace 20 is provided with only one loading / unloading port 29 for loading / unloading the substrate B in place of the loading port 27 and the loading / unloading port 28 of the first embodiment.

  As shown in FIG. 6, the board storage device 30 ′ includes a bottom board 31, a top board 32, four support columns 33 provided at four corners between the boards 31 and 32, and these support columns 33. The plurality of substrate storage shelves 34 supported at equal pitches in the vertical direction are the same as those of the substrate storage device 30 of the first embodiment. It differs from the substrate storage device 30 of the first embodiment in that four substrate support pins 38 are erected in place of the shelf conveyance roller 35.

  The substrate support pins 38 are erected on the substrate storage shelf 34 so that the line connecting them forms a quadrilateral. The substrate support pins 38 are set to have a length that is considerably shorter than the gap between adjacent substrate storage shelves 34 in the vertical direction. 38 is supported with sufficient margin without interfering with the upper substrate storage shelf 34.

  The substrate loading / unloading section 15 (FIG. 7) is for securing a space in which the substrate loading / unloading device 80 can operate. The downstream end (front end) of the pretreatment device 60 and the upstream of the posttreatment device 70 are provided. It extends between the end (rear end) and toward the firing furnace 20 provided on the right side thereof. The substrate loading / unloading unit 15 includes a bottom plate 151 having the same level as the bottoms of the preprocessing device 60 and the postprocessing device 70, a left surface plate 152 that is flush with the left surface of the preprocessing device 60 and the postprocessing device 70, and a front plate. A pair of front-rear installation plates 153 installed between the right surfaces of the processing device 60 and the post-processing device 70 and the portions protruding to the left of the side plates 22 of the firing furnace 20, and the pair of installation plates 153 A top plate 154 extending from the upper edge portion to the left surface plate 152 and extending to the rear plate 24 through the upper edge portion of the side plate 22 projecting to the left is provided.

  A relay chamber V1 for relaying the substrate B is formed by a space surrounded by the bottom plate 151, the left surface plate 152, the pair of installation plates 153, and the top plate 154. The relay chamber V <b> 1 includes a substrate lift chamber V <b> 11 in which a later-described lift mechanism 81 for lifting the substrate B loaded from the pretreatment apparatus 60 is installed, and the substrate B between the substrate lift chamber V <b> 11 and the baking furnace 20. It is divided into a robot room V12 in which a robot 85, which will be described later, is mounted. A partition plate 155 is provided between the substrate lift chamber V11 and the robot chamber V12. A gap for allowing the substrate B to pass is formed between the partition plate 155 and the top plate 154.

  FIG. 7 is a perspective view showing details of the substrate carry-in / out device 80. In addition, the direction display by X and Y in FIG. 7 is the same as that in FIG. As shown in FIG. 7, the substrate carry-in / out device 80 includes a lift mechanism 81 that lifts the substrate B provided on the left side of the center portion in the width direction of the bottom plate 151 of the substrate carry-in / out portion 15, and the lift mechanism 81. A robot (substrate transfer means) 85 that stores the lifted substrate B in the substrate storage device 30 ′ in the baking furnace 20 and takes out the substrate B from the substrate storage device 30 ′ and delivers it to the lift mechanism 81 is provided. Configured.

  The lift mechanism 81 drives a lift plate 82 that lifts the substrate B carried into the relay chamber V <b> 1 from the pretreatment device 60, an eccentric cam mechanism 83 that raises and lowers the lift plate 82, and the eccentric cam mechanism 83. And a drive mechanism 84. The lift plate 82 has a substantially square shape, and lift pins 821 for lifting the substrate B are provided upright at the four corners. On the other hand, between the left surface plate 152 and the partition plate 155 of the substrate carry-in / out unit 15, a predetermined number of lift chamber transport rollers 16 are installed. These lift chamber transfer rollers 16 are rotated by a drive motor (not shown).

  Then, the substrate B carried in from the pre-processing device 60 is located in the center of the substrate lift chamber V11 without interfering with the lift pins 821 due to the drive rotation of the lift chamber transport roller 16 with the lift plate 82 positioned at the lower position. The four lift pins 821 lift the substrate B with the lift plate 82 positioned at the upper position.

  The eccentric cam mechanism 83 includes a pair of front and rear cam shafts 831 installed between the left surface plate 152 and the partition plate 155 at the lower part of the lift plate 82, and one externally fitted integrally with each cam shaft 831. The cam shaft 831 includes two eccentric cams 832. The eccentric cam 832 is formed in a circular shape, and the eccentric position is set so as to have the same phase. The lift plate 82 is supported by the four eccentric cams 832 so as to be vertically movable in a positioning state with respect to the front-rear and left-right directions. Therefore, when each cam shaft 831 is rotated around its axis, the four eccentric cams 832 rotate around the cam shaft 831 while synchronizing the eccentric state, whereby the lift plate 82 is moved to the lower position and the upper position. Will move up and down.

  The driving mechanism 84 is concentrically integrated with a lift motor 841 installed on a gantry 17 projecting leftward from the front-rear direction center of the bottom plate 151 of the substrate loading / unloading portion 15 and a drive shaft 842 of the lift motor 841. A drive gear 843 fitted to each of the cam shafts 8, a driven gear 844 concentrically and integrally fitted to each of the cam shafts 831, and an idle gear interposed between each driven gear 844 and the drive gear 843. 845. Therefore, when the lift motor 841 is driven, this driving force is transmitted to the cam shaft 831 via the drive shaft 842, the drive gear 843, the idle gear 845, and the driven gear 844, and is rotated by the rotation of the cam shaft 831 around the axis. The eccentric cam 832 rotates eccentrically around the cam shaft 831, whereby the lift plate 82 supported by the eccentric cam 832 moves up and down between the lower position and the upper position.

  The robot 85 is mounted on the top of the rotating rod 852, an actuator 851 penetrating and fixed from below at the center position of the bottom plate 151 of the robot chamber V12, a rotating rod 852 protruding upward from the actuator 851. The base end side arm 853 that extends in the horizontal direction, and the front end side arm 854 that is rotatably connected to the tip end portion of the base end side arm 853 around the connecting shaft 855 is configured.

  The actuator 851 has a function of rotating the rotating rod 852 around the axis. The proximal end arm 853 and the distal end side arm 854 are connected to each other so as to bend and stretch while interlocking with a link mechanism (not shown) formed therein. The rotating operation of the rotating rod 852 and the bending / extending operation of the arms 853 and 854 are performed according to the state of the substrate B carried into the baking chamber V (whether the substrate B in the substrate lift chamber V11 is transferred to the baking furnace 20 or baking). Whether the substrate B in the furnace 20 is taken out into the baking chamber V or the like) is set in advance.

  8-10 is explanatory drawing for demonstrating the effect | action of the board | substrate carrying-in / out apparatus 80 in the board | substrate baking apparatus 10 'of 2nd Embodiment, (a) of FIG. 8 is that each arm 853,854 is home. FIG. 8B shows a state in which the tip side arm 854 scoops the substrate B, and FIG. 9B shows a state where the tip side arm 854 has carried the substrate B to the robot chamber V12. 9B shows a state in which the front arm 854 has inserted the substrate B into the substrate storage device 30 ′ in the baking furnace 20, and FIG. 10B shows that the substrate B supported by the front arm 854. FIG. 10B shows a state in which the front end side arm 854 is being pulled out from the firing furnace 20, respectively. In these drawings, “a” indicates a plan view, and “b” indicates a side cross-sectional view.

  First, in the state shown in FIG. 8A, the substrate B carried into the substrate lift chamber V11 by driving the lift chamber conveyance roller 16 from the pretreatment device 60 is lifted by the lift pins 821 driven by the lift motor 841. It is in a lifted state. In this state, when the actuator 851 is driven and the rotating rod 852 rotates clockwise around the axis, the arms 853 and 854 are straightened toward the left as shown in FIG. As a result, the distal arm 854 enters under the substrate B. Next, the lift motor 841 is reversely driven, and the substrate B is lifted (supported) by the front end side arm 854 when the lift pins 821 are lowered.

  Subsequently, the actuator 851 is reversely driven, and the substrate B supported by the distal arm 854 by the rotation of the rotating rod 852 in the counterclockwise direction thereby causes the substrate lift chamber V11 as shown in FIG. 9 to the robot chamber V12, and the rotation of the rotating rod 852 is continued, so that the substrate storage shelf 34 of the substrate storage device 30 'in the baking furnace 20 as shown in FIG. It is inserted in the upper position.

  Next, the substrate storage device 30 ′ is slightly lifted upward by driving the elevating motor 41 (FIG. 6), whereby the substrate B is supported by the substrate support pins 38 as shown in FIG. It becomes a state. In this state, the arms 853 and 854 are pulled out of the baking furnace 20 by the positive drive of the actuator 851, as shown in FIG. 10B, thereby completing the loading of the substrate B into the substrate storage device 30 ′. To do.

  When the arms 853 and 854 are pulled out from the baking furnace 20, the substrate storage device 30 ′ is moved up and down to support the substrate B on which the baking process has been completed. The substrate B that has been subjected to the baking process is scraped by the front end side arm 854, and is subsequently pulled out to the substrate lift chamber V11 by driving the rotating rod 852, and transferred to the substrate lift chamber V11. After being received by the shelf conveyance roller 35, it is carried out toward the post-processing device 70 by driving rotation of the shelf conveyance roller 35.

  By repeating such a series of operations, the substrate B sequentially carried into the relay chamber V1 from the pretreatment device 60 is inserted into the firing furnace 20 one by one by the robot 85, and the firing process is completed in the firing furnace 20. The substrate B is transferred to the post-processing apparatus 70 one by one by the robot 85 via the relay chamber V1, and as a result, the baking process for one substrate B is completed in the baking furnace 20 as in the conventional complete batch process. Then, compared with the method of loading the next substrate B into the baking furnace 20, the baking process time is greatly shortened, and the workability of the baking process is improved in each stage.

  As described in detail above, according to the substrate baking apparatus 10 ′ of the second embodiment, the substrate B transferred from the pretreatment apparatus 60 is baked between the pretreatment apparatus 60 and the posttreatment apparatus 70. A substrate loading / unloading device 80 is provided for loading the substrate B on the substrate storage shelf 30 ′ of the substrate storage device 30 ′ installed in the substrate 20 and unloading the substrate B that has been subjected to the baking process from the substrate storage shelf 34 to the post-processing device 70. Therefore, the substrate B sent from the pretreatment device 60 is moved to the substrate storage shelf 34 by the predetermined operation of the robot 85 of the substrate carry-in / out device 80 and is stored in the substrate storage shelf 34. The substrate B after completion of the baking process is transferred to the post-processing apparatus 70 by a predetermined operation of the robot 85. Therefore, layout restrictions such as arranging the pre-processing device 60 and the post-processing device 70 to face each other on the same plane can be minimized, and the degree of freedom in layout in device design can be improved.

  Further, the pre-processing device 60 and the post-processing device 70 are substantially linear on the same plane and are disposed at opposite positions with a predetermined space (the substrate lift chamber V11 of the relay chamber V1) sandwiched between them, and a firing furnace. Since the substrate loading / unloading device 80 is provided in the robot chamber V12, the structure of the substrate loading / unloading device 80 is simplified, and the firing furnace 20 is provided. It is possible to reliably carry in and out the substrate B with respect to.

  Further, the baking furnace 20 is provided with a loading / unloading port 29 for loading and unloading the substrate B. The loading / unloading port 29 is provided with an openable / closable shutter 66 capable of sealing the inside of the baking furnace 20. By closing the shutter 66, the inside of the firing furnace 20 can be sealed, thereby realizing an efficient firing process.

  The present invention is not limited to the above embodiment, and includes the following contents.

  (1) In the above embodiment, the lifting device 40 having the spline shaft 42 and the spiral rod 43 is employed, but the present invention is limited to the lifting device having the spiral rod 43. For example, the substrate storage devices 30 and 30 'may be moved up and down by driving the cylinder device by hydraulic pressure.

  (2) In the above embodiment, the pre-treatment device 60 is provided with the upstream replacement chamber 62, the first UV chamber 63, and the second UV chamber 64, and the post-treatment device 70 includes the first cooling chamber 72 and the second cooling chamber 72. Although the cooling chamber 73 and the downstream replacement chamber 74 are provided, the present invention is not limited to such a layout of the pre-processing device 60 and the post-processing device 70. The number of cooling chambers may be increased or decreased.

  (3) In the above embodiment, the substrate B is fired by introducing the heated non-oxidizing gas G into the firing furnace 20. For example, a heating source such as an energization heating element may be provided, and the substrate B may be baked by this heating source, or the heating source and the heated non-oxidizing gas G may be used in combination.

  (4) In the above embodiment, the heated gas supply pipe 521 and the atmospheric gas supply pipe 531 are provided with the first air supply blower 522 and the second air supply blower 532, respectively, and the non-oxidizing gas G from the gas source 51 is supplied. However, when the gas source 51 is a high-pressure gas cylinder, for example, the gas source 51 is led out from the gas source 51 with a confident gas pressure. Therefore, the air supply blowers 522 and 523 need not be provided.

  (5) In the first embodiment, the substrate storage shelf 34 has seven stages, and in the second embodiment, the substrate storage shelf 34 has 17 stages. The number of stages 34 is not limited to 7 or 17, and various stages can be selected according to the situation.

1 is a partially cutaway perspective view showing a substrate baking apparatus according to a first embodiment of the present invention. It is AA sectional view taken on the line of the board | substrate baking apparatus shown in FIG. It is a perspective view which shows one Embodiment of the board | substrate storage shelf stage applied to the board | substrate baking apparatus of 1st Embodiment. It is explanatory drawing for demonstrating the effect | action of the baking furnace in the board | substrate baking apparatus of 1st Embodiment, (a) is the state in which the first board | substrate is being carried in to the highest board | substrate storage shelf, (b) is The state in which the substrates are loaded into all the substrate storage shelves, (c) is the state in which the first loaded substrate is being unloaded from the uppermost substrate storage shelf, and (d) is empty Each of the figures shows a state where the substrate storage device is being raised to bring the substrate into the substrate storage shelf. It is a partially notched perspective view which shows the board | substrate baking apparatus of 2nd Embodiment which concerns on this invention. FIG. 6 is a cross-sectional view of the substrate baking apparatus shown in FIG. It is a perspective view which shows the detail of a board | substrate carrying in / out apparatus. It is explanatory drawing for demonstrating the effect | action of the board | substrate carrying in / out apparatus in the board | substrate baking apparatus of 2nd Embodiment, (a) is the state in which each arm was located in the home position, (b), the front end side arm is a board | substrate. Each of the scooped states is shown. It is explanatory drawing for demonstrating the effect | action of the board | substrate carrying in / out apparatus in the board | substrate baking apparatus of 2nd Embodiment, (a) is the state which the front end side arm carried the board | substrate to the robot chamber, (b) is the front end side. Each of the arms shows a state in which the substrate is inserted into the substrate storage device in the baking furnace. It is explanatory drawing for demonstrating the effect | action of the board | substrate carrying in / out apparatus in the board | substrate baking apparatus of 2nd Embodiment, (A) is the state by which the board | substrate B supported by the front end side arm was moved to the board | substrate storage shelf stage, (B) shows a state in which the tip side arm is being pulled out from the firing furnace.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,10 'Board | substrate baking apparatus 11 Upstream conveyance roller 12 Upstream conveyance path 13 Downstream conveyance roller 14 Downstream conveyance path 15 Substrate carrying-in / out part 16 Lift indoor conveyance roller 17 Base 20 Firing furnace 21 Bottom plate 22 Side plate 23 Front plate 231 Gas introduction hole 24 Rear plate (one side wall)
25 Top plate 251 Lead-out hole 26 Guide rail 27 Carriage entrance (opening, board carry-in part)
28 Unloading port (opening, substrate unloading part)
29 Loading / unloading (opening, substrate loading / unloading section)
30, 30 'substrate storage device (shelf)
31 Bottom board 32 Top board 33 Prop 34 Substrate storage shelf (stage)
341 Horizontal beam material 342 Vertical beam material 35 Shelf conveying roller 351 Roller shaft 36 Drive motor (drive source) 37 Gear mechanism 371 Drive gear 372 Driven gear 373 Idle gear 38 Substrate support pin 40 Lifting device 41 Lift motor 411 Drive shaft 42 Spline shaft 43 Spiral rod 44 Nut member 45 Cylindrical body 50 Gas supply unit 51 Gas source 52 Firing gas supply unit 521 Heated gas supply pipe 522 First air supply blower 523 Temperature controller 524 First control valve 53 Atmospheric gas supply unit 531 Atmospheric gas supply Pipe 532 Second air supply blower 533 Second control valve 60 Pre-processing device 61 Upper housing 62 Upstream substitution chamber 63 First UV chamber 64 Second UV chamber 65 Upper housing conveyance roller 66 Shutter (opening / closing section) 67 Gate valve (opening / closing) Part)
70 Post-Processing Device 71 Lower Housing 72 First Cooling Chamber 73 Second Cooling Chamber 74 Downstream Replacement Chamber 75 Lower Housing Transport Roller 76 Cool Plate 77 Substrate Lifting Mechanism 771 Substrate Support Pin 78 Shutter (Opening / Closing Unit)
79 Gate valve (opening / closing part) 80 Substrate loading / unloading device 81 Lift mechanism 82 Lift plate 821 Lift pin 83 Eccentric cam mechanism 831 Cam shaft 832 Eccentric cam 84 Drive mechanism 841 Lift motor 842 Drive shaft 843 Drive gear 844 Drive gear 845 Idle gear 85 Robot 851 Actuator 852 Rotating rod 853 Proximal arm 854 Distal arm 855 Connecting shaft B Substrate V Baking chamber (space)
V1 Relay room V11 Substrate lift room V12 Robot room

Claims (6)

A firing furnace having a space inside and having a substrate loading / unloading portion formed on a side wall, an upstream conveyance path connected to the substrate loading / unloading portion and carrying the substrate to the firing furnace, and the substrate loading / unloading portion And a downstream conveyance path that conveys the substrate after firing downstream,
The said baking furnace was equipped with the shelf part which consists of a several step | level which hold | maintains a board | substrate inside, and the raising / lowering mechanism which raises / lowers the said shelf part for every step | paragraph, The substrate baking apparatus characterized by the above-mentioned. The substrate loading / unloading unit includes a substrate loading unit for loading a substrate and a substrate unloading unit for unloading the substrate,
2. The substrate baking apparatus according to claim 1, wherein each of the substrate carry-in portion and the substrate carry-out portion includes an opening having a dimension through which the substrate can pass and an opening / closing portion that opens and closes the opening.   Each step portion of the shelf includes a plurality of conveyance rollers arranged in parallel in the substrate conveyance direction in the upstream conveyance path and the downstream conveyance path, and a drive source that rotates at least one of the conveyance rollers. 3. The substrate baking apparatus according to claim 1, wherein the substrate baking apparatus. The substrate carry-in portion and the substrate carry-out portion are formed above and below the one side wall,
The substrate baking apparatus according to claim 3, wherein the upstream conveyance path and the downstream conveyance path are arranged vertically. Provided with substrate delivery means for delivering the substrate,
The substrate delivery means is disposed between the upstream conveyance path and the substrate carry-in / carry-out unit and between the downstream conveyance path and the substrate carry-in / carry-out unit, and the upstream conveyance path and the shelf unit. The substrate baking apparatus according to claim 1, wherein the substrate is transferred between and between the downstream conveyance path and the shelf.   The substrate baking apparatus according to claim 5, wherein the upstream conveyance path and the downstream conveyance path are arranged substantially linearly.

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