TW201841384A - Semiconductor light-emitting device - Google Patents

Abstract

A semiconductor light-emitting device comprises a epitaxial stack having a first semiconductor layer, a second semiconductor layer and an active layer between the first semiconductor layer and second semiconductor layer for emitting a light; and a main light extracting surface on the first semiconductor layer, wherein the light passes through the major light extracting surface. The main light extracting surface comprises a first light-extraction region, a second light-extraction region and a maximum near-field luminous intensity. The distribution of the near-field luminous intensity in the first light-extraction region is between 70% and 100% of the maximum near-field luminous intensity, the distribution of the near-field luminous intensity in the second light-extraction region is between 0% and 70% of the maximum near-field luminous intensity.

Description

Semiconductor light-emitting element

The invention relates to the structural design of a light-emitting diode.

1 is a schematic diagram of a conventional light-emitting diode structure, including a substrate 5b, an epitaxial structure 1b, and two electrodes 2 and 9b, wherein the epitaxial structure 1b includes a a first semiconductor stack 11b, an active layer 10b and a second semiconductor stack 12b. The electrode 2 is formed on the upper surface of the epitaxial structure 1b for connection to an external power source through the metal wire 2b, and the electrode 9b is formed under the substrate 5b. The electrode 2 and the electrode 9b are configured to conduct an external current through the active layer 10b to recombine the electron holes in the active layer 10b, and release photons of a certain peak wavelength to cause the light emitting diode 100 to emit light. However, when the volume of the light-emitting diode is reduced, the lattice defects caused by the etching of the grain sidewalls cause the influence of the non-radiative recombination to become remarkable, so that the luminous efficiency is lowered.

The present invention provides a semiconductor light emitting device including an epitaxial layer having a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer for generating a light wave And a main light-emitting surface is located on the first semiconductor layer, the light wave penetrates the main light-emitting surface; wherein the main light-emitting surface comprises a first light-emitting area, a second light-emitting area, and a maximum near-field light-emitting intensity, The near-field luminous intensity distribution in the first light-emitting region is between 70% and 100% of the maximum near-field luminous intensity, and the near-field luminous intensity distribution in the second light-emitting region is between the maximum near-field luminous intensity 0% to 70%.

First embodiment

Fig. 2A is a schematic view of the semiconductor light emitting element 1A according to the first embodiment of the present application. The semiconductor light emitting device 1A includes an epitaxial structure 1 , wherein the epitaxial structure 1 includes a first semiconductor stack 11 , an active layer 10 , and a second semiconductor stack 12 . A front electrode 21 is located on the first semiconductor stack 11 . The central position of the upper surface 11a is in ohmic contact with the first semiconductor laminate 11, and the portion of the upper surface 11a of the first semiconductor laminate 11 not covered by the front electrode 21 is a roughened surface for increasing the light extraction rate; The second ohmic contact structure 22 is located at a central position of the lower surface 12a of the second semiconductor laminate 12 to form an ohmic contact with the second semiconductor stack 12; a reflective laminate 3 is disposed on the lower surface 12a of the second semiconductor stack 12, Covering the second semiconductor stack 12 and the second ohmic contact structure 22, wherein the reflective layer 3 comprises a transparent conductive layer 31 covering the second semiconductor layer 12 and the second ohmic contact structure 22, and a metal reflective layer 32 covering the transparent conductive layer 31 and a barrier layer 33 are overlaid on the metal reflective layer 32; a conductive substrate 5 is bonded to the reflective laminate 3 by an adhesive layer 4; and a back electrode 9 is disposed on the conductive substrate 5 with respect to the reflective laminate 3. On the side, a current can be introduced through the front electrode 21 and the back electrode 9, so that the active layer 10 emits a light that can penetrate the first semiconductor stack 11 and the second semiconductor stack 12, the first semiconductor stack 11 and the energy gap of the second semiconductor layer 12 is greater than the energy gap of the active layer 10. Therefore, the transparency of the light emitted by the first semiconductor layer 11 and the second semiconductor layer 12 to the active layer 10 exceeds 50%, and the light can be directly The first semiconductor laminate 11 is penetrated from the upper surface 11a or the side surface 1S of the epitaxial structure 1 or is first reflected from the reflective layer 3 and then emitted from the upper surface 11a of the epitaxial structure 1 or the side surface 1S of the epitaxial structure 1. .

The active layer 10 includes a multiple quantum well (Whole Quantum Wells) structure; the first semiconductor stack 11 includes a first electrically confining layer 111, a first electrical cladding layer 112, and a first An electrical window layer 113 and a first electrical contact layer 114; the second semiconductor stack 12 includes a second electrical confinement layer 121, a second electrical cladding layer 122, and a second a first window layer 123 and a second electrical contact layer 124; wherein the first and second electrical cladding layers 112, 122 respectively provide electrons and holes in the active layer 10 to be combined to emit light and have a specific active layer 10 a larger energy gap; the first and second electrical confinement layers 111, 121 are used to enhance the probability of recombination of electrons and holes in the active layer 10 and have a larger energy gap than the active layer 10; first and second The electrical window layers 113, 123 have a smaller sheet resistance than the cladding layer to increase current dispersion and light extraction rate from the active layer 10; the first and second electrical contact layers 114, 124 are respectively The front electrode 21 and the second ohmic contact structure 22 form an ohmic contact. A first semiconductor stack 11, active layer 10 and _(1-xy of the second semiconductor material 12 may comprise a laminate Ⅲ-Ⅴ semiconductor materials, for example _{Al x In y Ga (1-} xy) N , or Al _x In _y Ga _{) P, 0 ≦ x, y} ≦ 1; (x + y) ≦ 1, wherein the first electrical resistance and the second electrical line according to the different elements can be doped with different electrical properties, for example, a first electrically The second semiconductor layer 11 is an n-type semiconductor, and the second semiconductor layer 12 is a p-type semiconductor. According to the material of the active layer 10, the epitaxial structure 1 can emit red light with a peak wavelength between 610 nm and 650 nm, green light with a peak wavelength between 530 nm and 570 nm, or a peak wavelength of 440. Blue light between nm and 490 nm.

3 is a top view of the semiconductor light emitting element 1A according to the present embodiment, the semiconductor light emitting element 1A has an edge 8 to define the shape of the upper surface 11a, and the shape of the upper surface 11a is circular in this embodiment, in other In the embodiment, the shape of the upper surface 11a may also be a polygon, such as a rectangle, a unequal length pentagon, a unequal length hexagon, or the like, or a regular polygon, such as a square, a regular pentagon, a regular hexagon, or the like. The front electrode 21 and the second ohmic contact structure 22 are respectively located at the center positions of the upper surface 11a and the lower surface 12a to reduce the current flowing through the side 1S ratio of the epitaxial structure 1; in the embodiment, the front electrode 21 is in contact with the second ohmic The area of the structure 22 is between about 1% and 10% of the area of the upper surface 11a of the first semiconductor layer 11 and the lower surface 12a of the second semiconductor layer 12, respectively, to avoid the front electrode 21 and the second ohmic contact structure 22. If the area is too large, the shading is caused, and the forward electrode 21 is prevented from being too small, causing the forward threshold voltage to be too high, so that the luminous efficiency is lowered, wherein the areas of the front electrode 21 and the second ohmic contact structure 22 occupy the upper surface 11a and When the area of the lower surface 12a is about 2%, optimum luminous efficiency can be obtained.

In the present embodiment, the area of the upper surface 11a of the semiconductor light emitting element 1A is less than 10000 μm ² , or the circumference of the upper surface 11a is less than 400 μm, and the front electrode 21 is located at the center of the upper surface 11a and the minimum distance between the front electrode 21 and the edge 8 When the thickness of the epitaxial structure 1 is 10 μm or more, the ratio of the thickness of the epitaxial layer 1 to the circumference of the upper surface 11a is at least 2.5%, and the current is easily dispersed in the epitaxial structure 1 so that the semiconductor light is emitted. The current ratio of the side surface 1S of the epitaxial structure 1 of the element 1A is increased. In this embodiment, the total thickness of the epitaxial structure 1 is reduced to less than 3 μm or between 1 μm and 3 μm, preferably between 1 μm and 2 μm, so that the thickness of the epitaxial structure 1 and the upper surface 11a are The length ratio is reduced to at least less than 0.75% to reduce the non-radiative recombination effect of the semiconductor light-emitting element 1A and to improve luminous efficiency. The total thickness of the first semiconductor stack 11 is the total thickness of all the epitaxial structures between the active layer 10 and the upper surface 11a, and the total thickness of the second semiconductor stack 12 is below the active layer 10 and below the lower surface 12a. In the present embodiment, the total thickness of the first semiconductor stack 11 is between no more than 1 μm or preferably 1000 Å to 5000 Å and/or a second semiconductor stack 12 The total thickness is not more than 1 μm or preferably between 1000 Å and 5000 Å, wherein the first electrical limiting layer 111 of the first semiconductor stack 11 , the first electrical cladding layer 112 and the first electrical window The thickness of each layer of the layer 113 is not more than 2000 Å or preferably between 500 Å and 1500 Å; the second electrical limiting layer 121 of the second semiconductor laminate 12, the second electrical cladding layer 122 and the second electricity The thickness of each layer of the window layer 123 is not more than 2000 Å or preferably between 500 Å and 1500 Å. The thickness of the first and second electrical contact layers 114, 124 is no more than 2000 Å or preferably between 300 Å and 1500 Å. Since the total thickness of the first semiconductor stack 11 is between 1000 Å and 5000 Å, the roughened surface of the first semiconductor stack 11 can be wet etched or dry etched, and the depth of the etch can be accurately grasped. An inductively coupled plasma (ICP) etching method to prevent a poor penetration depth control from causing a structure to penetrate the first semiconductor stacked layer 11 to generate a leakage path, wherein the roughened surface of the first semiconductor stacked layer 11 The distance between the adjacent high point and the low point in the vertical direction is between 500 Å and 3,000 Å.

In this embodiment, the shape of the upper surface 11a of the semiconductor light emitting element 1A is preferably a circular shape, and the side surface 1S of the epitaxial structure 1 is formed by bombardment by an ICP etching process, so that the side surface 1S of the epitaxial structure 1 is As a rough or uneven surface, the proportion of current flowing through the side surface 1S of the epitaxial structure 1 of the semiconductor light emitting element 1A is increased, and the influence of the surface non-radiative recombination effect is increased, resulting in a decrease in luminous efficiency. In order to reduce the area of the side surface 1S of the epitaxial structure 1 , for the semiconductor light emitting element 1A having an area of the upper surface 11 a of 10000 μm ² , when the shape of the upper surface 11 a is circular, the circumference is about 354 μm, which is smaller than that of the upper surface. The shape of 11a is a square having a circumference of 400 μm, and the shorter the circumference, the smaller the area of the side surface 1S of the epitaxial structure 1 can reduce the non-radiative recombination effect of the rough side surface 1S; and when the shape of the upper surface 11a is circular, the upper surface The distance between the front electrode 21 and the edge 8 of the center of 11a is the same, which also helps to control the current path to be confined to the inner region of the epitaxial structure 1.

As shown in FIG. 3, the upper surface 11a of the semiconductor light emitting element 1A includes a first light exiting area 71 and a second light exiting area 72, wherein the first light exiting area 71 is located at a central portion of the upper surface 11a, and the second light exiting area 72 is located at the first Between the light exiting area 71 and the edge 8. When the light-emitting element 1A is applied to a small current driving device such as a display panel, for example, the driving current density is between 0.1 and 1 A/cm ² , and the upper surface 11 a has a near-field luminous intensity distribution S, which is the largest. The near-field luminous intensity is 100% in the first light-emitting region 71, and the near-field luminous intensity in the first light-emitting region 71 is greater than 70% of the maximum near-field luminous intensity, and the near-field luminous intensity in the second light-emitting region 72 is between The maximum near-field luminous intensity is between 30% and 70%; in this embodiment, since the total thickness of the epitaxial structure 1 is greatly reduced, the distance of the current through the epitaxial structure 1 is reduced, and the current can be confined inside the epitaxial structure 1 And the front electrode 21 and the second ohmic contact structure 22 are respectively located at the center positions of the upper surface 11a and the lower surface 12a, thereby reducing the ratio of current spreading to the side surface 1S of the epitaxial structure 1 to reduce non-radiative recombination. The resulting loss of luminous efficiency. The shape of the first light exiting region 71 is approximately circular in shape of the upper surface 11a, and the area ratio of the first light exiting region 71 to the second light exiting region 72 is between 0.25 and 0.45.

In the present embodiment, the area of the upper surface 11a of the semiconductor light emitting element 1A is less than 10000 μm ² , and when the shape of the upper surface 11a is square, the circumference is less than 400 μm, and when the shape of the upper surface 11a is circular, the circumference is less than about 354 μm. In order to introduce an external current, if a metal wire having a width of about 5 to 10 μm is connected to the front surface electrode 21 on the upper surface 11a, the portion of the upper surface 11a covered by the metal wire will occupy at least 2.5% or more, reducing the positive light-emitting surface. Therefore, as shown in FIG. 2B, when the semiconductor light emitting element 1A is applied, the back electrode 9 can be further bonded to a circuit structure on a sub-mount 6B, such as a lead frame, to form an electric And connected to the front electrode 21 of the semiconductor light emitting element 1A by an external transparent electrode 6A to introduce an external current, wherein the material of the transparent electrode 6A comprises a conductive oxide such as indium zinc oxide, indium zinc oxide, indium gallium zinc oxide. , zinc oxide or zinc oxide. In other embodiments, the plurality of semiconductor light-emitting elements 1A and the circuit structure on the sub-substrate 6B are electrically connected, and the front electrodes 21 of the plurality of semiconductor light-emitting elements 1A are simultaneously connected through the transparent electrode 6A to form parallel, series or string. in parallel. The first semiconductor laminate 11 of the present embodiment is, for example, an n-type semiconductor, and the transparent electrode 6A is in ohmic contact with the front surface electrode 21. The front electrode 21 is made of a metal material and includes germanium (Ge), gold (Au), nickel (Ni), a bismuth alloy, or a bismuth nickel alloy. The second ohmic contact structure 22 is located on the lower surface 12a of the epitaxial structure 1 with respect to the upper surface 11a and is in ohmic contact with the second semiconductor stack 12, wherein the second electrical second contact layer of the second semiconductor stack 12 The doping concentration of 124 is about 1*10 ¹⁹ /cm ³ , and the second ohmic contact structure 22 can be made of a transparent oxidized metal material, such as indium tin oxide, to form an ohmic contact with the second semiconductor stack 12, and can increase light penetration. The ratio of the lower surface 12a of the second semiconductor stack 12. The material of the transparent conductive layer 31 on the second ohmic contact structure 22 includes, but is not limited to, indium zinc oxide, indium gallium zinc oxide, zinc oxide or aluminum zinc oxide, and the metal reflective layer 32 material on the transparent conductive layer 31 contains silver (Ag). a material having a light reflectance of greater than 95% for the active layer, such as aluminum (Al) or gold (Au), wherein the transparent conductive layer 31 is used to separate the metal reflective layer 32 from direct contact with the second semiconductor laminate 12. It is avoided that when the semiconductor light-emitting element 1A is driven by current for a long period of time, the metal reflective layer 32 and the second semiconductor laminate 12 are physically or chemically reacted to cause a decrease in reflectance or conductivity, and further, the transparent conductive layer 31 can assist in spreading current to the reflective stack. Layer 3, to prevent heat from being concentrated on a partial region of the reflective laminate 3; the refractive index of the transparent conductive layer 31 is smaller than the refractive index of the second semiconductor laminate 12 by at least 1.0 or more, and therefore, the difference in refractive index between the two is caused by The reflective interface reflects a portion of the light emitted from the active layer 10, and the unreflected light passes through the transparent conductive layer 31 and is reflected by the metal reflective layer 32. The material of the barrier layer 33 covering the metal reflective layer 32 comprises titanium (Ti), platinum (Pt), gold (Au), tungsten (W), cadmium (Cr), an alloy thereof or a laminate thereof for separating the metal The reflective layer 32 and the adhesive layer 4 maintain the stability of the metal reflective layer 32, and prevent the metal reflective layer 32 from physically or chemically reacting with the adhesive layer 4 to cause a decrease in reflectance or conductivity. The adhesive layer 4 is used for bonding the conductive substrate 5 to the reflective laminate 3, and allows current to flow between the reflective laminate 3 and the conductive substrate 5. The adhesive layer 4 comprises indium (In), titanium (Ti), and nickel (Ni). ), tin (Sn), gold (Au), a laminate thereof or an alloy thereof; the conductive substrate 5 includes but is not limited to germanium (Si), gallium arsenide (GaAs), copper tungsten alloy (CuW), copper (Cu) or Molybdenum (Mo); the back electrode 9 disposed on the conductive substrate 5 on the other side with respect to the reflective laminate 3 contains gold (Au) for introducing an external current.

Second embodiment

4A and 4B are schematic views of the semiconductor light-emitting elements 1B and 1C according to the second embodiment of the present application. The difference between the second embodiment and the first embodiment is that the epitaxial structure 1 comprises a control layer 13, wherein the semiconductor light-emitting element 1B as shown in FIG. 4A, the control layer 13 can be located in the first semiconductor layer 11, or In the semiconductor light emitting element 1C shown in FIG. 4B, the control layer 13 may be located in the second semiconductor stacked layer 12. The control layer 13 has a conductive region 13b and an oxidized region 13a, wherein the oxidized region 13a surrounds the conductive region 13b and is exposed on the side surface 1S of the epitaxial structure 1. The material of the conductive region 13b may be (Al _x Ga _1-x )As having conductivity, wherein 0.9 < x ≤ 1; the material of the oxidized region 13a may be electrically insulating Al _y O, where 0 < y < 1. The conductive region 13b overlaps the front surface electrode 21 and the second ohmic contact structure 22 in a vertical direction for controlling the current distribution in a partial range of the epitaxial structure 1. As the semiconductor light emitting element 1D of another embodiment of FIG. 4C, the second ohmic contact structure 22 may cover the lower surface 12a of the second semiconductor layer 12 over the entire surface, and then the transparent conductive layer 31 covers the second ohmic contact structure 22, and is transparent. The conductive layer 31 can be used to bond the second ohmic contact structure 22 and the metal reflective layer 32 in addition to the lateral diffusion current. In this embodiment, the materials of the second ohmic contact structure 22, the transparent conductive layer 31 and the metal reflective layer 32 are the same as those in the first embodiment.

The examples of the invention are intended to be illustrative only and not to limit the scope of the invention. Any changes or modifications of the present invention to those skilled in the art will be made without departing from the spirit and scope of the invention.

1A‧‧‧Semiconductor light-emitting components

1B‧‧‧Semiconductor light-emitting components

1C‧‧‧Semiconductor light-emitting components

100‧‧‧Lighting diode

1‧‧‧ epitaxial structure

1S‧‧‧ side

1b‧‧‧ epitaxial structure

10‧‧‧ active layer

10b‧‧‧ active layer

11‧‧‧First semiconductor stack

111‧‧‧First electrical limiting layer

112‧‧‧First electrical coating

113‧‧‧First electrical window layer

114‧‧‧First electrical contact layer

11a‧‧‧ upper surface

11b‧‧‧First semiconductor stack

12‧‧‧Second semiconductor stack

121‧‧‧Second electrical limiting layer

122‧‧‧Second electrical coating

123‧‧‧Second electrical window layer

124‧‧‧Second electrical contact layer

12a‧‧‧ lower surface

12b‧‧‧Second semiconductor stack

13‧‧‧Control layer

13a‧‧‧Oxidized area

13b‧‧‧Electrical area

2‧‧‧electrode

21‧‧‧Front electrode

22‧‧‧Second ohmic contact structure

3‧‧‧Reflective laminate

31‧‧‧Transparent conductive layer

32‧‧‧Metal reflector

33‧‧ ‧ barrier layer

4‧‧‧Adhesive layer

5‧‧‧Electrical substrate

5b‧‧‧Substrate

6A‧‧‧Transparent electrode

6B‧‧‧substrates

71‧‧‧First light exit area

72‧‧‧Second light exit area

8‧‧‧ edge

9‧‧‧ Back electrode

9b‧‧‧electrode

S‧‧‧ Near-field luminous intensity distribution

Figure 1 is a schematic view showing the structure of a conventional semiconductor light-emitting element;

2A-2B are schematic views of a semiconductor light emitting device according to a first embodiment of the present application;

3 is a top view of a semiconductor light emitting element according to a first embodiment of the present application;

4A to 4C are schematic views of a semiconductor light emitting element according to a second embodiment of the present application.

no

Claims (10)

A semiconductor light emitting device comprising: an epitaxial structure having a first thickness and an upper surface, and comprising: a first semiconductor stack; an active layer on the first semiconductor stack; and a second semiconductor a laminate on the active layer and having a second thickness; wherein the upper surface has a length of one week, and the ratio of the first thickness to the perimeter is greater than 2.5%, and the second thickness is no greater than 1 μm. The semiconductor light-emitting device of claim 1, wherein the upper surface has an area of less than 10000 μm ² . The semiconductor light-emitting device of claim 1, wherein the perimeter is less than 400 μm. The semiconductor light-emitting device of claim 1, wherein the epitaxial structure has a total thickness of less than 3 μm. The semiconductor light-emitting device of claim 1, wherein the upper surface is circular or square. A semiconductor light emitting device comprising: an epitaxial structure having a first thickness and an upper surface, and comprising: a first semiconductor stack; an active layer on the first semiconductor stack; and a second semiconductor a laminate on the active layer and having a second thickness; wherein the upper surface has a circumference and the ratio of the first thickness to the perimeter is less than 0.75%, and the second thickness is no greater than 1 μm. The semiconductor light-emitting device of claim 1, wherein the upper surface has an area of less than 10000 μm ² . The semiconductor light-emitting device of claim 1, wherein the perimeter is less than 400 μm. The semiconductor light-emitting device of claim 1, wherein the epitaxial structure has a total thickness of less than 3 μm. The semiconductor light-emitting device of claim 1, wherein the upper surface is circular or square.