TW201834509A - Conductive Cover Plate - Google Patents

Abstract

A conductive cover plate comprises a metal substrate and a conductive lubrication layer. The conductive lubrication layer is disposed on the metal substrate, and includes a lubrication resin, a combining resin and a plurality conductive particle. The conductive particles are dispersed in the lubrication resin and the combining resin. The lubrication resin occupies 40 to 60 wt% of the conductive lubrication layer. The combining resin occupies 20 to 36 wt% o f the conductive lubrication layer. The conductive particles occupies 4 to 20 wt% of the conductive lubrication layer. The conductive lubrication layer provides lubrication and conductive function. While the drilling, a drill pin can be caddied by the lubrication resin to provide lubrication and reduce the impact of drilling into the metal substrate. In addition, the conductive particles provides conductive function for detecting broken of the drilling pin or other abnormal conditions, therefore, the trouble shooting can be start immediately.

Description

Conductive cover

The invention relates to a circuit board manufacturing technology, in particular to a conductive cover plate used in a circuit board drilling process.

At present, due to the development of integrated circuits, the number of electronic components in the same electronic product has increased significantly, and the volume of electronic components has been greatly reduced. That is, the density of electronic components per unit area on the circuit board is greatly increased. In the production of circuit boards, it is necessary to cooperate with high-density electronic components, often through drilling and filling, to make the circuit stack three-dimensional. Due to the reduction of line width, the specifications of the aperture are becoming smaller and smaller, and the requirements for the shape of the aperture and the roughness of the hole wall are becoming stricter.

In addition, the current mechanical drilling uses an infrared sensor to detect the state of the drill bit, and issues a warning signal when the drill pin breaks or other abnormal conditions. However, infrared is easily misjudged by the influence of heat, and failure to issue a warning signal for troubleshooting at the first time is likely to cause increased drill bit loss and subsequent product failure.

In order to provide conductive function and better drilling quality than pure aluminum, a conductive cover is provided here. The conductive cover includes a metal substrate and a lubricating conductive layer. The lubricating conductive layer is located on the metal substrate. The lubricating conductive layer includes a lubricating resin, a binding resin, and a plurality of conductive particles. The conductive particles are dispersed in a mixture of a lubricating resin and a bonding resin, the lubricating resin accounts for 40 to 60 wt% of the lubricating conductive layer, the bonding resin accounts for 20 to 36 wt% of the lubricating conductive layer, and the conductive particles account for 4 to 20% of the lubricating conductive layer.

In some embodiments, the metal substrate includes at least one of aluminum, tin, an aluminum alloy, and a tin alloy, and the conductive particles are carbon black. Further, the carbon black includes at least one of graphite powder, scaly graphite powder, expanded graphite powder, activated carbon powder, and conductive carbon black.

In some embodiments, the metal substrate includes at least one of aluminum, tin, an aluminum alloy, and a tin alloy, and the conductive particles are metal powder.

In some embodiments, the thickness of the metal substrate is 60 to 180 um, and the thickness of the lubricating conductive layer is 20 to 150 um.

In some embodiments, the particle size of the conductive particles is 1 to 100 um.

In some embodiments, the lubricating resin includes nonyl phenol polyethylene glycol ether, polyethylene glycol (PEG), polyethylene oxide (PEO), and polyvinyl alcohol (polyvinyl alcohol). At least one of alcohol (PVA) and acrylic acid; the binding resin system includes epoxy resin, acrylic resin, orientated polypropylene (OPP), and polyethylene terephthalate Esters (polyethylene terephthalate (PET), polyurethane (PU), polymerized siloxanes, polyether-siloxane copolymers, branched-chain siloxane copolymers, and polyvinyl pyrrolidone (PVP) At least one of them.

In some embodiments, the conductive cover further includes a metal intermediate layer and a thermally conductive adhesive layer. The intermediate layer is located between the metal substrate and the lubricating conductive layer, and the thermally conductive adhesive layer is located between the metal intermediate layer and the metal substrate. The thermally conductive adhesive layer includes a plurality of thermally conductive particles and an adhesive resin. The thermally conductive particles are dispersed in the adhesive resin. The adhesive resin accounts for 30 to 50% by weight of the thermally conductive adhesive layer, and the thermally conductive particles account for 50 to 70% by weight of the thermally conductive adhesive layer.

In some embodiments, the adhesive resin includes a cycloepoxy resin, an acrylic resin, an oriented polypropylene (OPP), a polyethylene terephthalate (PET), and a polyurethane (Polyurethane). (PU), polymerized siloxanes, polyether-siloxane copolymer branched siloxane copolymers, and at least one of polyvinyl pyrrolidone (PVP).

In some embodiments, the thermally conductive particles include molybdenum thiocarbamate, Copper Oleate, aluminum stearate, zinc stearate, lithium stearate, zinc stearate, molybdenum disulfide, graphite, mica , At least one of tungsten disulfide and hexagonal boron nitride, polytetrafluoroethylene, polyetherester, polyethylene glycol, and polyvinyl alcohol.

In some embodiments, the hardness of the metal intermediate layer is less than the hardness of the metal substrate.

In the above embodiment, the lubricating and conductive layer of the conductive cover plate provides both conductivity and lubrication effects. When the drill bit enters, the lubricating resin can cover the drill pin, provide cushioning and lubrication, and reduce the impact when drilling into the metal substrate. . In addition, the conductive particles in the lubricating conductive layer can provide a conductive effect, so that during the drilling process, a small amount of driving voltage can be used to detect whether there are broken needles or abnormal phenomena, and faults can be performed in a short time. exclude.

FIG. 1 is a schematic structural diagram of a conductive cover plate according to the first embodiment. Referring to FIG. 1, a conductive cover 1 according to a first embodiment includes a metal substrate 10 and a lubricating conductive layer 20. The lubricating conductive layer 20 is located on the metal substrate 10. The rigidity is provided by the metal substrate 10, and the conductive and lubricating effects are achieved by lubricating the conductive layer 20.

The lubricating conductive layer 20 includes a mixed resin 21 and a plurality of conductive particles 23. The mixed resin 21 includes a lubricating resin that provides a lubricating effect, and a bonding resin for adhering the lubricating conductive layer 20 to the metal substrate 10. The conductive particles 23 are dispersed in the mixed resin 21. The lubricating resin accounts for 40 to 60 wt% of the lubricating conductive layer, the bonding resin accounts for 20 to 36 wt% of the lubricating conductive layer, and the conductive particles account for 4 to 20% of the lubricating conductive layer. Preferably, the conductive particles account for 7 to 16% of the lubricating conductive layer. Here, when the proportion of the conductive particles 23 is less than 3%, it is impossible to conduct electricity at all, and more than 20% may adversely affect the bonding.

In some embodiments, the lubricating conductive layer 20 can be tightly disposed on the metal substrate 10 by means of roller coating, coating, hot pressing, or the like, so as to avoid the phenomenon of delamination when the drill pin 500 drills.

In some embodiments, the metal substrate 10 includes at least one of aluminum, tin, an aluminum alloy, and a tin alloy. In some embodiments, the thickness of the metal substrate is 60 to 180um, preferably 70-150um, and more preferably 70um, 100um, 140um. The thickness of the lubricating conductive layer 20 is 20 to 150 um, preferably 40 to 100 um. In some embodiments, the conductive particles 23 may be carbon black or metal powder. The carbon black may be graphite powder, scaly graphite powder, expanded graphite powder, activated carbon powder, conductive carbon black, and the like. The metal powder may be aluminum powder, silver powder, copper powder, or the like. This is only an example, and is not intended to be a limitation. Other metallic materials that can provide rigidity, or conductive powders are all feasible ways.

Further, the particle diameter of the conductive particles 23 is 1 to 100 um, and preferably 30 to 75 um. This particle size helps to disperse the conductive particles 23 in the mixed resin 21 and also avoids clustering of particles.

The lubricating resin in the mixed resin 21 includes nonyl phenol polyethylene glycol ether, polyethylene glycol (PEG), polyethylene oxide (PEO), and polyvinyl alcohol. , PVA), and at least one of acrylic acid. The bonding resins in the mixed resin 21 include epoxy resin, acrylic resin, directional polypropylene (OPP), polyethylene terephthalate (PET), and polyurethane (Polyurethane, PU). At least one of polysiloxanes, polymerized siloxanes, polyether-siloxane copolymers, branched-chain siloxane copolymers, and polyvinyl pyrrolidone (PVP).

By lubricating the conductive layer 20, when the drill pin 500 enters, it can cover and lubricate the drill pin 500, reduce the rigid impact of the drill pin 500 and the metal substrate 10, and help guide the drill pin 500 into the metal substrate 10 and below. The circuit board 600 can avoid needle entanglement, reduce wear of the drill pin 500, and can provide conductive effect through the conductive particles 23. The drilling machine can make the lubricating conductive layer 20 conductive when applying a small driving voltage, for example, 3V, 5V, 7V, and then detect the status of the drill pin 500. Stop the machine for a while to troubleshoot to avoid subsequent machine or product failure.

FIG. 2 is a schematic structural diagram of a conductive cover plate according to a second embodiment. Referring to FIG. 1, the conductive cover plate 2 of the second embodiment includes a metal substrate 10, a lubricating conductive layer 20, a metal intermediate layer 30, and a thermally conductive adhesive layer 40. The lubricating conductive layer 20 is located on the metal substrate 10. The metal intermediate layer 30 is located between the metal substrate 10 and the lubricating conductive layer 20. The thermally conductive adhesive layer 40 is located between the metal intermediate layer 30 and the metal substrate 10.

The components of the metal substrate 10 and the lubricating conductive layer 20 in the conductive cover 2 of the second embodiment are substantially the same as those of the first embodiment. The thermally conductive adhesive layer 40 includes an adhesive resin 41 and a plurality of thermally conductive particles 43. The thermally conductive particles 43 are dispersed in the adhesive resin 41. The adhesive resin 41 accounts for 30 to 50% by weight of the thermally conductive adhesive layer 40, and the thermally conductive particles 43 account for 50 to 70% by weight of the thermally conductive adhesive layer 40.

In some embodiments, the hardness of the metal intermediate layer 30 is less than the hardness of the metal substrate 10. Further, the metal intermediate layer 30 may be selected from a metal material having a hardness lower than that of the metal substrate 10, or may be selected from the same metal material and adjusted to have a hardness lower than that of the metal substrate 10 through a manufacturing process.

In some embodiments, the thermally conductive particles 43 include molybdenum thiocarbamate, Copper Oleate, aluminum stearate, zinc stearate, lithium stearate, zinc stearate, molybdenum disulfide, graphite, At least one of mica, tungsten disulfide and hexagonal boron nitride, polytetrafluoroethylene, polyetherester, polyethylene glycol, and polyvinyl alcohol.

In some embodiments, the adhesive resin includes a cycloepoxy resin, an acrylic resin, an oriented polypropylene (OPP), a polyethylene terephthalate (PET), and a polyurethane (Polyurethane). (PU), polymerized siloxanes, polyether-siloxane copolymer branched siloxane copolymers, and at least one of polyvinyl pyrrolidone (PVP).

Here, the drill pin 500 enters the metal intermediate layer 30 from the lubricating conductive layer 20, and then enters the thermal conductive adhesive layer 40 and the metal substrate 10. Since the hardness of the metal intermediate layer 30 is smaller than that of the metal substrate 10, and the upper and lower sides of the metal intermediate layer 30 have resin, the drill pin 500 will form a point depression before penetrating the metal intermediate layer 30, which can make the drill pin 500 difficult to shift. . In addition, the thermally conductive particles 43 through the thermally conductive adhesive layer 40 can prevent the heat generated by the drill pin 500 from being accumulated on the conductive cover plate 1 and the circuit board 600, avoiding adverse effects on the circuit board 600, and extending the service life of the drill pin 500. .

In any of the above embodiments, the lubricating conductive layer 20 of the conductive cover plate 1 simultaneously provides the effects of conduction and lubrication. When the drill pin 500 enters, the lubricating resin that lubricates the conductive layer 20 can cover the drill pin 500 to provide cushioning and lubrication. , Can reduce the rigid impact when drilling into the metal substrate 10, and can extend the service life of the drill pin. In addition, lubricating the conductive particles 23 in the conductive layer 20 can provide a conductive effect, so that during the drilling process, a small amount of driving voltage can be used to detect whether there is a broken needle or a stuck phenomenon, and it can be performed in a short time. Perform troubleshooting within the system to avoid subsequent machine or product failure. Furthermore, the metal substrate 10 can be recovered and melted, and the environmental impact can be effectively reduced.

Although the preferred embodiment is disclosed as described above, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the scope of the present invention. Therefore, the scope of patent protection of the present invention Subject to the scope of the patent application attached to this specification.

1‧‧‧ conductive cover

2‧‧‧ conductive cover

10‧‧‧ metal substrate

20‧‧‧Lubricating conductive layer

21‧‧‧ mixed resin

23‧‧‧ conductive particles

30‧‧‧Metal intermediate layer

40‧‧‧ Thermal conductive adhesive layer

41‧‧‧Adhesive resin

43‧‧‧Conductive particles

500‧‧‧ drill pin

600‧‧‧Circuit Board

[Fig. 1] A schematic structural diagram of a conductive cover plate of the first embodiment. FIG. 2 is a schematic structural diagram of a conductive cover plate according to a second embodiment.

Claims (11)

A conductive cover plate includes: a metal substrate; and a lubricating conductive layer on the metal substrate, wherein the lubricating conductive layer includes a mixed resin and a plurality of conductive particles, and the conductive particles are dispersed in the mixed resin. The mixed resin includes a lubricating resin and a bonding resin. The lubricating resin accounts for 40 to 60 wt% of the lubricating conductive layer, the bonding resin accounts for 20 to 36 wt% of the lubricating conductive layer, and the conductive particles occupy 4 to 20% of the lubricating conductive layer. The conductive cover according to claim 1, wherein the metal substrate includes at least one of aluminum, tin, an aluminum alloy, and a tin alloy, and the conductive particles are carbon black. The conductive cover according to claim 2, wherein the carbon black comprises at least one of graphite powder, scaly graphite powder, expanded graphite powder, activated carbon powder, and conductive carbon black. The conductive cover according to claim 1, wherein the metal substrate includes at least one of aluminum, tin, an aluminum alloy, and a tin alloy, and the conductive particles are metal powder. The conductive cover according to claim 1, wherein the particle size of the conductive particles is 1 to 100um. The conductive cover according to claim 1, wherein the thickness of the metal substrate is 60 to 180um, and the thickness of the lubricating conductive layer is 20 to 150um. The conductive cover according to claim 1, wherein the lubricating resin comprises nonyl phenol polyethylene glycol ether, polyethylene glycol (PEG), and polyethylene oxide (PEO) ), At least one of polyvinyl alcohol (PVA), and acrylic acid; the bonding resin system comprises epoxy resin, acrylic resin, orientated polypropylene (OPP) , Polyethylene terephthalate (PET), polyurethane (Polyurethane, PU), silicone resins (polymerized siloxanes), polyether-siloxane copolymers, branched-chain siloxane copolymers, and polyethylene At least one of polyvinyl pyrrolidone (PVP). The conductive cover according to claim 1, further comprising a metal intermediate layer and a thermally conductive adhesive layer, the metal intermediate layer is located between the metal substrate and the lubricating conductive layer, and the thermally conductive adhesive layer is located between the metal intermediate layer and Between the metal substrates, the thermally conductive adhesive layer includes a plurality of thermally conductive particles and an adhesive resin, and the thermally conductive particles are dispersed in the adhesive resin, wherein the adhesive resin accounts for 30 to 50% by weight of the thermally conductive adhesive layer, The thermally conductive particles account for 50 to 70% by weight of the thermally conductive adhesive layer. The conductive cover according to claim 8, wherein the adhesive resin comprises a cycloepoxy resin, an acrylic resin, an oriented polypropylene (OPP), and a polyethylene terephthalate At least one of PET, Polyurethane (PU), polymerized siloxanes, polyether-siloxane copolymer branched siloxane copolymer, and polyvinyl pyrrolidone (PVP) . The conductive cover according to claim 8, wherein the thermally conductive particles include molybdenum thiocarbamate, Copper Oleate, aluminum stearate, zinc stearate, lithium stearate, zinc stearate, At least one of molybdenum disulfide, graphite, mica, tungsten disulfide, and hexagonal boron nitride, polytetrafluoroethylene, polyetherester, polyethylene glycol, and polyvinyl alcohol. The conductive cover according to claim 8, wherein the hardness of the metal intermediate layer is less than the hardness of the metal substrate.