TWI764772B - Board for pcb drilling and manufacturing method thereof - Google Patents

Abstract

A board for PCB drilling includes an aluminum-manganese alloy substrate, a lubrication layer, and a hardened layer. The range of the thickness of the aluminum-manganese alloy substrate is between 150 μm and 200 μm. The lubrication layer is disposed on the aluminum-manganese alloy substrate, and the range of the thickness of the lubrication layer is between 25 μm and 70 μm. The lubrication layer includes a lubrication resin and a combining resin. The lubrication resin occupies 40 wt% to 60 wt% of the lubrication layer, and the combining resin occupies 20 wt% to 36 wt% of the lubrication layer. The hardened layer is disposed on one side of the aluminum-manganese alloy substrate opposite to the lubrication layer. The range of the thickness of the hardened layer is between 1 μm and 6 μm. The hardened layer includes a hard resin and a hardening reagent mixed with each other. The hard resin includes at least one selected from the group consisting of acrylic, polyurethane, and epoxy resin, and the hardening reagent includes at least one selected from the group consisting of amine-based hardening reagent and isocyanate hardening reagent.

Description

Upper cover plate for drilling circuit board and its manufacturing method

The invention relates to a process jig for a printed circuit board, in particular to an upper cover plate for drilling a circuit board and a manufacturing method thereof.

In recent years, due to the evolution of integrated circuit manufacturing technology, the number of electronic components in a single electronic product has greatly increased, and the volume of the electronic components has been greatly reduced. That is to say, the density of electronic components per unit area on the circuit board is greatly increased.

In order to achieve high-density electronic component configuration, multilayer circuit boards are stacked on each other, and a drilling process is used to penetrate the contacts between the layers, so that the circuits are connected and the electronic components are connected in series.

When drilling, it is necessary to use the board to locate the position to be drilled on the circuit board. Generally speaking, the urea plate is used as the upper cover plate for drilling, and the thickness is about 200 μm to 400 μm. However, its hardness is limited, and it needs to be adjusted through an additional process, thereby increasing the cost.

In view of this, an embodiment of the present invention provides an upper cover plate for drilling a circuit board, which includes an aluminum-manganese alloy substrate and a lubricating layer. The thickness of the aluminum-manganese alloy substrate ranges from 70 μm to 200 μm. The lubricating layer is located on the aluminum-manganese alloy substrate, and the thickness of the lubricating layer is 25 μm to 70 μm. The lubricating layer includes lubricating resin and binding resin, the weight percentage of the lubricating resin in the lubricating layer is 45% to 75%, and the weight percentage of the binding resin in the lubricating layer is 25% to 55%.

In some embodiments, the thickness of the aluminum-manganese alloy substrate is 180 μm.

In some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate is 0.3% to 1.5%. Further, in some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate is 1.0% to 1.5%.

In some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate is 0.01% to 1.0%. Further, in some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate is 0.5% to 1.0%.

In some embodiments, the upper cover plate for drilling the circuit board further includes a hardened layer, which is located on a side of the aluminum-manganese alloy substrate opposite to the lubricating layer. The thickness of the hardened layer ranges from 1 μm to 6 μm, and the hardened layer includes a hard resin and a hardener, and the hard resin and the hardener are mixed. The hard resin includes at least one of acrylic, polyurethane, and epoxy resin, and the hardener includes at least one of amine-based hardener and isocyanate hardener.

In some embodiments, the weight percentage of the hard resin in the hardened layer is 80% to 95%, and the weight percentage of the hardener in the hardened layer is 5% to 20%.

Furthermore, another embodiment of the present invention provides a method for manufacturing an upper cover plate for drilling a circuit board, which includes a lubricating component adding step and a lubricating component drying step. The additional step of lubricating components includes adding lubricating components on the aluminum-manganese alloy substrate to form the semi-finished product of the upper cover plate for drilling, wherein the lubricating components include lubricating resin and binding resin, and the weight percentage of the lubricating resin in the lubricating components is 45% to 75%, and the combination The weight percentage of resin to lubricating component is 25% to 55%. The drying step of the lubricating component includes drying the lubricating component of the semi-finished product of the upper cover plate for drilling at a drying temperature to obtain the upper cover plate for drilling, wherein the drying temperature is 80°C to 180°C. The upper cover plate for drilling includes an aluminum-manganese alloy substrate and a lubricating layer, the thickness of the aluminum-manganese alloy substrate is in the range of 70 μm to 200 μm, and the thickness of the lubricating layer is in the range of 25 μm to 70 μm.

In some embodiments, the manufacturing method of the upper cover plate for drilling a circuit board further includes a step of adding a hardening component and a drying step of the hardening component. The additional step of the hardening component includes adding a hardening component on the side of the aluminum-manganese alloy substrate opposite to the lubricating component, wherein the hardening component comprises a hard resin and a hardener, the hard resin is mixed with the hardener, wherein the hard resin comprises acrylic, polyurethane, ring At least one of the oxygen resins, and the hardener includes at least one of an amine-based hardener and an isocyanate hardener. The drying step of the hardened component includes drying the hardened component at a drying temperature to obtain a hardened layer, wherein the drying temperature is 60° C. to 180° C., the drying time is 1 minute to 2 minutes, and the thickness of the hardened layer is 1 μm to 6 μm. .

In some embodiments, the lubricating resin comprises nonyl phenol polyethylene glycol ether (nonyl phenol polyethylene glycol ether), polyethylene glycol (PEG), polyethylene oxide (PEO), polyvinyl alcohol (polyvinyl alcohol) At least one of alcohol, PVA), and polyacrylic acid (acrylic acid); the binding resin system includes epoxy resin, acrylic resin, oriented polypropylene (Oriented Poly Propylene, OPP), polyethylene terephthalate Polyethylene terephthalate (PET), Polyurethane (PU), polymerized siloxanes, polyether-siloxane copolymers, branched chain siloxane copolymers, and polyvinyl pyrrolidone (PVP) at least one of them.

To sum up, in one or more embodiments of the present invention, the circuit board drilling The cover plate can provide appropriate hardness through the aluminum-manganese alloy substrate; in some embodiments, the upper cover plate for circuit board drilling can not only provide the hardness of the material of the aluminum-manganese alloy substrate itself, but also further improve the hardness through the configuration of the hardened layer , so that it can be applied to different drilling operation requirements.

S40~S43: Steps

100, 200: Upper cover for drilling circuit board

10: Aluminum-manganese alloy substrate

20: Lubrication layer

21: Lubricating resin

22: Bonding resin

30: Hardened layer

31: Hard resin

32: Hardener

1 is a schematic cross-sectional view of an upper cover for drilling a circuit board according to a first embodiment of the present invention.

2 is a schematic cross-sectional view of an upper cover for drilling a circuit board according to a second embodiment of the present invention.

FIG. 3 is a flow chart showing a method for manufacturing an upper cover for drilling a circuit board according to a third embodiment of the present invention.

FIG. 4 is a flow chart illustrating a method for manufacturing an upper cover for drilling a circuit board according to a fourth embodiment of the present invention.

Please refer to FIG. 1 , which is a schematic cross-sectional view of an upper cover for drilling a circuit board according to a first embodiment of the present invention. As shown in FIG. 1 , in this embodiment, the upper cover 100 for drilling a circuit board includes an aluminum-manganese alloy substrate 10 and a lubricating layer 20 . Wherein, the lubricating layer 20 is located on the aluminum-manganese alloy substrate 10 . In this way, rigidity can be provided through the aluminum-manganese alloy substrate 10 , and the lubricating effect can be achieved through the lubricating layer 20 .

In some embodiments, the thickness of the aluminum-manganese alloy substrate 10 ranges from 70 μm to 200 μm, and the thickness of the lubricating layer 20 ranges from 25 μm to 70 μm.

In some embodiments, the thickness of the aluminum-manganese alloy substrate 10 is 180 μm.

In some embodiments, the aluminum-manganese alloy substrate 10 is made of 3 series aluminum alloy materials. In other words, the weight percentage of manganese in the aluminum-manganese alloy substrate 10 is 0.3% to 1.5%. Furthermore, in some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate 10 is 1.0% to 1.5%.

In some embodiments, the aluminum-manganese alloy substrate 10 is made of a 5-series aluminum alloy material. In other words, the weight percentage of manganese in the aluminum-manganese alloy substrate 10 is 0.01% to 1.0%. Furthermore, in some embodiments, the weight percentage of manganese in the aluminum-manganese alloy substrate 10 is 0.5% to 1.0%.

Therefore, by using the aluminum-manganese alloy substrate 10 with different ratios, it can be applied to the drilling process of circuit boards with different hardnesses, thereby improving the flexibility of the process.

The lubricating layer 20 includes a lubricating resin 21 and a binding resin 22 . The weight percentage of the lubricating resin 21 in the lubricating layer 20 is 45% to 75%, and the weight percentage of the binding resin 22 in the lubricating layer 20 is 25% to 55%.

In some embodiments, the lubricating layer 20 can be closely arranged on the aluminum-manganese alloy substrate 10 by means of coating head, roller coating, spin coating, lamination, spraying, screen printing, etc. Degumming occurs when drilling.

In some embodiments, the lubricating resin 21 comprises nonyl phenol polyethylene glycol ether (nonyl phenol polyethylene glycol ether), polyethylene glycol (PEG), polyethylene oxide (PEO), polyvinyl alcohol ( At least one of polyvinyl alcohol, PVA) and polyacrylic acid (acrylic acid); the binding resin 22 comprises epoxy resin, acrylic resin, oriented polypropylene (Oriented Polypropylene) Poly Propylene, OPP), polyethylene terephthalate (polyethylene terephthalate, PET), polyurethane (Polyurethane, PU), silicone resin (polymerized siloxanes), polyether-siloxane copolymer, branched chain siloxane At least one of a copolymer and polyvinyl pyrrolidone (PVP).

Through the lubricating layer 20, when the drill needle enters, the drill needle can be covered and lubricated, thereby reducing the rigid impact of the drill needle and the aluminum-manganese alloy substrate 10, and helping to guide the drill needle into the aluminum-manganese alloy substrate 10 and the circuit board. Reduce drill wear.

Please refer to FIG. 2 , which is a schematic structural diagram of an upper cover plate for drilling a circuit board according to a second embodiment of the present invention. As shown in FIG. 2 , in this embodiment, the upper cover plate 200 for drilling the circuit board further includes a hardened layer 30 located on the side of the aluminum-manganese alloy substrate 10 opposite to the lubricating layer 20 .

In this embodiment, the thickness of the hardened layer 30 ranges from 1 μm to 6 μm, and the hardened layer 30 includes a hard resin 31 and a hardener 32 , and the hard resin 31 and the hardener 32 are mixed. The hard resin 31 includes at least one of acrylic, polyurethane, and epoxy resin, and the hardener 32 includes at least one of an amine-based hardener and an isocyanate hardener.

In some embodiments, the weight percentage of the hard resin 31 in the hardened layer 30 is 80% to 95%, and the weight percentage of the hardener 32 in the hardened layer 30 is 5% to 20%.

In this embodiment, through the configuration of the hardened layer 30 , the hardness of the upper cover plate 200 for drilling the circuit board can be further improved, so as to meet different process requirements.

Please refer to FIG. 3 again, which is a flow chart of a method for manufacturing an upper cover for drilling a circuit board according to a third embodiment of the present invention. As shown in FIG. 3 , in this embodiment, the method for manufacturing an upper cover for drilling a circuit board includes a lubricating component adding step S40 and a lubricating component drying step S41 .

Please refer to FIG. 3 , the aforementioned step S40 of adding lubricating components includes: adding lubricating components on the aluminum-manganese alloy substrate to form a semi-finished upper cover plate for drilling. Lubricating components include lubricating resins and binding resins. In addition, the lubricating component will form a lubricating layer after the subsequent drying step S41 of the lubricating component, and the proportions of the components in the lubricating layer have been described in the foregoing embodiments, and will not be repeated. It should be noted that, in this step, the lubricating component can be arranged on the aluminum-manganese alloy substrate by means of coating head, roller coating, spin coating, lamination, spray coating, screen printing and other film forming methods.

Referring to FIG. 3 , the aforementioned drying step S41 of the lubricating component includes: drying the lubricating component of the semi-finished product of the upper cover plate for drilling at the drying temperature to obtain the upper cover plate for drilling, and the drying temperature is 80°C to 180°C. For example, the drying step S41 of the lubricating component can be achieved by configuring a heating device (eg, an oven) with a conveyor belt on the production line, and the drying time can also be adjusted by controlling the speed of the conveyor belt and changing the size of the heating device. In one or more embodiments, the drying time may be 2 to 5 minutes; in one or more embodiments, the drying time may be further 3 minutes.

Please refer to FIG. 4 , which is a flowchart illustrating a method for manufacturing a top cover for drilling a circuit board according to a fourth embodiment of the present invention. As shown in FIG. 4 , in the present embodiment, the above-mentioned manufacturing method of the upper cover plate for drilling a circuit board further includes a step S42 of adding a hardening component and a step S43 of drying the hardening component.

Referring to FIG. 4 , the aforementioned step S42 of adding hardening components includes: adding hardening components on the side of the aluminum-manganese alloy substrate opposite to the lubricating components. The hardening component includes a hard resin and a hardener mixed with the hard resin. In addition, the hardened component will form a hardened layer after the subsequent hardened component drying step S43, and the ratio of each component in the hardened layer has been described in the foregoing embodiment. In the description, it will not be repeated.

Referring to FIG. 4 , the above-mentioned drying step S43 of the hardened component includes: drying the hardened component at a drying temperature to obtain a hardened layer, wherein the drying temperature is 60°C to 180°C, and the drying time is 1 minute to 2 minutes. Similarly, the hardened component drying step S43 can be achieved by configuring a heating device (eg, an oven) with a conveyor belt on the production line, and the drying time can also be adjusted by controlling the speed of the conveyor belt and changing the size of the heating device.

It should be noted that, if there is no logical error in the foregoing steps, the steps may be performed simultaneously or the order may be reversed. For example, the lubricating component adding step S40 and the lubricating component drying step S41 may be performed first, and then the hardening component adding step S42 may be performed. And the hardening component drying step S43, or the hardening component adding step S42 and the hardening component drying step S43 may be performed first, and then the lubricating component adding step S40 and the lubricating component drying step S41 may be performed.

In an experimental example, the components and The proportions are shown in Table 1 below. After the water in it is dissipated, the lubricating layer 20 can be obtained with the weight percent of the lubricating resin 21 and the binding resin 22 being the above-mentioned proportions. And it can be seen from Table 1 that the sample 1 board, the sample 2 board and the sample 3 board all have higher Shore hardness (Shore D) compared to the opposite panel (general urea board).

In another experimental example, the components and their ratios used in the manufacturing process of multiple finished panels (hereinafter referred to as control panel, sample 4 panel, sample 5 panel, and sample 6 panel respectively) are as follows in Table 2 , when the water therein is dissipated, the lubricating layer 20 with the weight percent of the lubricating resin 21 and the binding resin 22 in the above-mentioned proportion range can be obtained, and the hardened layer 30 with the weight percent of the hard resin 31 and the hardener 32 in the above-mentioned proportion range can be obtained. And it can be seen from Table 2 that the sample 4 board, the sample 5 board and the sample 6 board all have higher Shore hardness compared to the counter-assembled board (general urea board).

In addition, the top cover 100/200 for drilling a circuit board disclosed in one or more embodiments of the present invention can be applied to different drilling processes. Specifically, one method is a back-drilling process, that is, one side of the circuit board corresponds to the lubricating layer 20 of the upper cover 100/200 for drilling the circuit board, and the drill bit is drilled from the other side of the circuit board. Another way is that the circuit board corresponds to the hardened layer 30 , and the drill needle is drilled from the side of the upper cover plate 100 / 200 for drilling the circuit board that has the lubricating layer 20 .

To sum up, in one or more embodiments of the present invention, the upper cover for circuit board drilling can provide appropriate hardness through the aluminum-manganese alloy substrate; in some embodiments, the upper cover for circuit board drilling can not only In addition to providing the hardness of the material of the aluminum-manganese alloy substrate itself, the hardness can be further improved by the configuration of the hardened layer, so that it can be applied to different drilling operations. beg.

Although the preferred embodiments are disclosed as above, they are not intended to limit the present invention. Anyone who is familiar with the related art can make some changes and modifications without departing from the scope of the present invention. Therefore, the scope of patent protection of the present invention is The scope of the patent application attached to this specification shall prevail.

100: Upper cover for drilling holes in circuit boards

10: Aluminum-manganese alloy substrate

20: Lubrication layer

21: Lubricating resin

22: Bonding resin

Claims (7)

An upper cover plate for drilling a circuit board, comprising: an aluminum-manganese alloy substrate, wherein the thickness of the aluminum-manganese alloy substrate ranges from 70 μm to 200 μm; a lubricating layer is located on the aluminum-manganese alloy substrate, and the thickness of the lubricating layer is in the range of is 25 μm to 70 μm, wherein the lubricating layer includes a lubricating resin and a binding resin, the weight percentage of the lubricating resin in the lubricating layer is 45% to 75%, and the weight percentage of the binding resin in the lubricating layer is 25% to 55% %; and a hardened layer, located on the side of the aluminum-manganese alloy substrate opposite to the lubricating layer, the thickness of the hardened layer is 1 μm to 6 μm, wherein the hardened layer includes a hard resin and a hardener, the hard resin and The hardener is mixed, wherein the hard resin includes at least one of acrylic, polyurethane, and epoxy resin, wherein the hardener includes at least one of amine-based hardener and isocyanate hardener. The upper cover plate for drilling a circuit board according to claim 1, wherein the weight percentage of manganese in the aluminum-manganese alloy substrate is 0.3% to 1.5%. The upper cover plate for drilling a circuit board according to claim 2, wherein the weight percentage of manganese in the aluminum-manganese alloy substrate is 1.0% to 1.5%. The upper cover plate for drilling a circuit board according to claim 1, wherein the weight percentage of manganese in the aluminum-manganese alloy substrate is 0.01% to 1.0%. The upper cover plate for drilling a circuit board according to claim 4, wherein the weight percentage of manganese in the aluminum-manganese alloy substrate is 0.5% to 1.0%. The upper cover plate for drilling a circuit board according to claim 1, wherein the weight percentage of the hard resin in the hardened layer is 80% to 95%, and the weight percentage of the hardener in the hardened layer is 5% to 20% . A manufacturing method of an upper cover plate for drilling a circuit board, comprising: a lubricating component adding step: adding a lubricating component on an aluminum-manganese alloy substrate to form a semi-finished product of an upper cover plate for drilling, wherein the lubricating component includes a lubricating component Resin and a binding resin, the weight percentage of the lubricating resin in the lubricating component is 45% to 75%, and the weight percentage of the binding resin in the lubricating component is 25% to 55%; a lubricating component drying step: at a drying temperature Dry the lubricating component of the semi-finished product of the upper cover plate for drilling to obtain an upper cover plate for drilling, wherein the drying temperature is 80°C to 180°C, and the upper cover plate for drilling includes the aluminum-manganese alloy substrate and a lubricant layer, the thickness of the aluminum-manganese alloy substrate is in the range of 70 μm to 200 μm, and the thickness of the lubricating layer is in the range of 25 μm to 70 μm; an additional step of hardening components: adding a hardening component to the side of the aluminum-manganese alloy substrate opposite to the lubricating component above, wherein the hardening component comprises a hard resin and a hardener, the hard resin is mixed with the hardener, wherein the hard resin comprises at least one of acrylic, polyurethane, epoxy resin, wherein the hardener comprises an amine group at least one of a hardener and an isocyanate hardener; and a drying step of a hardening component: drying the hardening component at a drying temperature to obtain a hardened layer, wherein the drying temperature is 60°C to 180°C, and the drying time The thickness of the hardened layer ranges from 1 μm to 6 μm for 1 minute to 2 minutes.

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