TWI650054B - Cover plate, cover manufacturing method and flexible circuit board manufacturing method - Google Patents

Cover plate, cover manufacturing method and flexible circuit board manufacturing method Download PDF

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TWI650054B
TWI650054B TW106142719A TW106142719A TWI650054B TW I650054 B TWI650054 B TW I650054B TW 106142719 A TW106142719 A TW 106142719A TW 106142719 A TW106142719 A TW 106142719A TW I650054 B TWI650054 B TW I650054B
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hole
drilling
lubricating material
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TW201822601A (en
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赤尾悠
田中秀明
伊藤保之
浦充貴
梅澤榮一
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日商日本美可多龍股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B35/00Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B41/00Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B47/00Constructional features of components specially designed for boring or drilling machines; Accessories therefor
    • B23B47/28Drill jigs for workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10Arrangements for cooling or lubricating tools or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16Perforating by tool or tools of the drill type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M107/00Lubricating compositions characterised by the base-material being a macromolecular compound
    • C10M107/02Hydrocarbon polymers; Hydrocarbon polymers modified by oxidation
    • C10M107/04Polyethene
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M107/00Lubricating compositions characterised by the base-material being a macromolecular compound
    • C10M107/38Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
  • Lubricants (AREA)

Abstract

本發明提供一種透過抑制鑽頭損壞而延長鑽頭壽命,使鑽孔加工後的通孔質量優化的鑽孔加工用蓋板、鑽孔加工用蓋板之製造方法以及柔性電路板之製造方法;本發明之鑽孔加工用蓋板係在基材的至少一個表面上塗覆由潤滑材料和黏合劑構成的非水溶性潤滑層而形成。 The present invention provides a drilling processing cover plate, a method for manufacturing a drilling processing cover plate, and a method for manufacturing a flexible circuit board, which are capable of extending the life of the drill bit by suppressing the damage of the drill bit, and optimizing the quality of the through hole after the drilling process; The drilling processing cover is formed by coating a water-insoluble lubricating layer composed of a lubricating material and a binder on at least one surface of the substrate.

Description

蓋板、蓋板之製造方法以及柔性電路板之製造方法 Cover plate, cover manufacturing method and flexible circuit board manufacturing method

本發明係有關於蓋板(entry sheet)、蓋板之製造方法以及柔性電路板之製造方法。 The present invention relates to an entry sheet, a method of manufacturing the cover, and a method of manufacturing the flexible circuit board.

在批量生產柔性印刷電路板(Flexible Printed Circuit,FPC)時,作為批量生產方式已知有卷對卷(roll to roll)方式。作為通孔構造的柔性電路板之製造工序的最初階段,存在有通孔鑽孔工序、通孔電鍍工序。之後,經過抗蝕劑塗覆工序、圖案形成工序、蝕刻工序以及端子部表面處理工序等後製成柔性電路板。 In the mass production of a Flexible Printed Circuit (FPC), a roll to roll method is known as a mass production method. In the initial stage of the manufacturing process of the flexible wiring board having the through-hole structure, there are a through hole drilling process and a through hole plating process. Thereafter, a flexible circuit board is produced after a resist coating step, a pattern forming step, an etching step, and a terminal portion surface treatment step.

在這些工序中,通孔鑽孔工序係製造通孔構造的柔性電路板之最初工序,在該工序中,應用的是使用具備卷對卷輸送功能的NC鑽孔裝置的鑽孔方法(鑽孔加工方法)。NC鑽孔裝置能夠鑽出最小達40μm左右的孔,該NC鑽孔裝置設有主軸,且在將複數塊鍍銅疊層板(Flexible Cupper Clad Laminate,FCCL:基板)重疊後進行鑽孔處理。關於鍍銅疊層板之重疊數量,通常為兩塊(兩層)、四塊(四層)、五塊(五層)、八塊(八層)。 In these processes, the through hole drilling process is an initial process of manufacturing a flexible circuit board having a through hole structure, and in this process, a drilling method using an NC drilling device having a roll-to-roll conveying function is applied (drilling processing methods). The NC drilling apparatus is capable of drilling a hole of at least about 40 μm. The NC drilling apparatus is provided with a main shaft, and is subjected to drilling processing after overlapping a plurality of flexible cupper Clad Laminates (FCCL: substrates). Regarding the number of overlaps of the copper-plated laminate, it is usually two (two layers), four (four layers), five (five), and eight (eight) layers.

另外,鍍銅疊層板係構成柔性印刷電路板之主要部件,其形成為如下結構,即:在厚度為12μm~100μm的薄膜狀絕緣體“底膜(base film)(例如聚醯亞胺薄膜(polyimide film))”上形成黏合層,進而在其上部進一步黏貼有厚度為12μm~50μm左右的導體箔(例如銅箔)。端子部或焊接部以外的其他部位處用絕緣體覆蓋進行保護。作為絕緣體之材料,使用聚醯亞胺或聚酯(PET:Polyethylene Terephthalate)等的複數種塑料。導體箔通常使用銅箔。黏合層主要使用環氧樹脂、丙烯樹脂類的黏合劑等。由於柔性印刷電路板能夠折疊,因此成為攜帶式電話機、個人電腦或數位相機等的連接部中不可缺少的材料。 Further, the copper-clad laminate constitutes a main component of the flexible printed circuit board, and is formed into a structure in which a film-like insulator "base film" (for example, a polyimide film (for example, a polyimide film) has a thickness of 12 μm to 100 μm. A polyimide film is formed on the polyimide film)), and a conductor foil (for example, a copper foil) having a thickness of about 12 μm to 50 μm is further adhered to the upper portion. The terminal portion or other portions other than the welded portion are covered with an insulator for protection. As the material of the insulator, a plurality of plastics such as polyimine or polyester (PET: Polyethylene Terephthalate) are used. The conductor foil is usually copper foil. The adhesive layer mainly uses an epoxy resin or an acrylic resin adhesive. Since the flexible printed circuit board can be folded, it is an indispensable material in the connection portion of a portable telephone, a personal computer, or a digital camera.

作為鍍銅疊層板之鑽孔加工方法,通常採用的是:使鍍銅疊層板重疊後,在其最上部配置鋁箔等,然後進行鑽孔加工之方法。近年來,隨著對印刷配線板材料之可靠性的要求提高以及高密度化的發展,需要提高孔位置精度或降低孔壁粗糙度等的高品質的鑽孔加工,並且,為了應對這種需求,提出了使用聚乙二醇(polyethylene glycol)的鑽孔用蓋板之鑽孔加工法(例如,參照專利文獻1)、或者從鋁板薄膜的回收再利用的容易度考慮而以水溶性的潤滑劑作為主要成分的蓋板等,並已得到實用。近年來,為了提高柔性以及防止劃痕(scratch),在柔性印刷電路板之NC鑽孔用蓋板中使用具有硬度的PET(Polyethylene Terephthalate)薄膜。 As a method of drilling a copper-plated laminated board, a method of drilling a copper-clad laminate is carried out, and an aluminum foil or the like is placed on the uppermost portion thereof, followed by drilling. In recent years, with the development of the reliability of printed wiring board materials and the development of high density, it is necessary to improve the hole position accuracy or reduce the hole wall roughness and the like, and to cope with such demands. A drilling method for drilling a cover plate using polyethylene glycol (for example, refer to Patent Document 1), or a water-soluble lubrication from the viewpoint of ease of recovery and reuse of an aluminum plate film A cover plate or the like as a main component has been put into practical use. In recent years, in order to improve flexibility and prevent scratches, a PET (Polyethylene Terephthalate) film having hardness has been used for a cover plate for NC drilling of a flexible printed circuit board.

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

專利文獻1:JP特開平4-92488號公報 Patent Document 1: JP-A-4-92488

但是,水溶性潤滑材料發黏,一觸碰就會黏上指紋,使得操作性變差。另外,近年來,為了實現印刷配線版之小型化和輕量化,不斷推進配線圖案之微細化和通孔之小徑化,伴隨於此,PET薄膜中所使用之樹脂成分會附著在鑽頭之壁面上,尤其在進行0.1mmΦ以下的小徑加工時,還存在鑽頭折損之情況,此時會引起鑽頭折損的不良情況而使鑽頭壽命縮短,並且,通孔壁面之凹凸、毛刺變得顯著。 However, the water-soluble lubricating material is sticky, and the fingerprint is adhered at the touch, which deteriorates the operability. In addition, in recent years, in order to reduce the size and weight of the printed wiring board, the wiring pattern is refined and the diameter of the through hole is increased. Accordingly, the resin component used in the PET film adheres to the wall surface of the drill. In particular, when the small-diameter processing of 0.1 mm Φ or less is performed, the drill bit is broken. In this case, the drill bit is broken and the life of the drill is shortened, and the unevenness and burr of the wall surface of the through hole are remarkable.

本發明之課題係在於:提供一種透過抑制鑽頭折損而延長鑽頭壽命,從而抑制鑽孔加工後的通孔壁面之凹凸、毛刺的鑽孔加工用蓋板、鑽孔加工用蓋板之製造方法以及柔性電路板之製造方法。 An object of the present invention is to provide a method for manufacturing a hole for drilling a hole, a method for manufacturing a hole for drilling a hole, and a method for producing a cover plate for drilling a hole, which can reduce the life of the drill by suppressing the breakage of the drill bit, thereby suppressing the unevenness and burr of the wall surface of the through hole after the drilling process. A method of manufacturing a flexible circuit board.

為了解決上述課題,本發明之鑽孔加工用蓋板之特徵在於:在基材的至少一個表面上塗覆由潤滑材料和黏合劑構成的非水溶性潤滑層而形成。 In order to solve the above problems, the cover plate for drilling according to the present invention is characterized in that a water-insoluble lubricating layer composed of a lubricating material and a binder is applied to at least one surface of the substrate.

在上述發明中,較佳為:潤滑材料以聚乙烯為主要成分,該聚乙烯之平均粒徑為5μm~7μm,分子量為4000~5000,熔點為95℃~130℃。 In the above invention, it is preferable that the lubricating material contains polyethylene as a main component, and the polyethylene has an average particle diameter of 5 μm to 7 μm, a molecular weight of 4000 to 5000, and a melting point of 95 ° C to 130 ° C.

在上述發明中,較佳為:潤滑材料以聚乙烯和聚四氟乙烯為主要成分。 In the above invention, it is preferred that the lubricating material contains polyethylene and polytetrafluoroethylene as main components.

在上述發明中,較佳為:由潤滑材料和黏合劑構成的非水溶性潤滑層之厚度為5μm~30μm。 In the above invention, it is preferable that the water-insoluble lubricating layer composed of the lubricating material and the binder has a thickness of 5 μm to 30 μm.

在上述發明中,較佳為:潤滑材料之固體成分相對於潤滑層之總固體成分的比例為13.0wt%~23.1wt%。 In the above invention, it is preferred that the ratio of the solid content of the lubricating material to the total solid content of the lubricating layer is from 13.0% by weight to 23.1% by weight.

在上述發明中,作為能夠應用的基材,除了樹脂組成薄膜(厚度為125μm~250μm)外,還可以舉出金屬薄膜(0.1mm~0.2mm)或酚醛紙板等。 In the above-mentioned invention, as the base material which can be applied, in addition to the resin composition film (having a thickness of 125 μm to 250 μm), a metal thin film (0.1 mm to 0.2 mm) or a phenolic paperboard or the like can be given.

另外,為了解決上述課題,本發明之鑽孔加工用蓋板之製造方法之特徵在於:透過在基材的至少一個表面上塗覆由潤滑材料和黏合劑構成的非水溶性潤滑層並使其乾燥而形成。 Further, in order to solve the above problems, a method for producing a cover plate for drilling according to the present invention is characterized in that a water-insoluble lubricating layer composed of a lubricating material and a binder is applied to at least one surface of a substrate and dried. And formed.

在上述發明中,較佳為:潤滑材料以聚乙烯為主要成分,該聚乙烯之平均粒徑為5μm~7μm,分子量為4000~5000,熔點為95℃~130℃。 In the above invention, it is preferable that the lubricating material contains polyethylene as a main component, and the polyethylene has an average particle diameter of 5 μm to 7 μm, a molecular weight of 4000 to 5000, and a melting point of 95 ° C to 130 ° C.

在上述發明中,較佳為:潤滑材料以聚乙烯和聚四氟乙烯為主要成分。 In the above invention, it is preferred that the lubricating material contains polyethylene and polytetrafluoroethylene as main components.

在上述發明中,較佳為:由潤滑材料和黏合劑構成的非水溶性潤滑層之厚度為5μm~30μm。 In the above invention, it is preferable that the water-insoluble lubricating layer composed of the lubricating material and the binder has a thickness of 5 μm to 30 μm.

在上述發明中,較佳為:潤滑材料之固體成分相對於潤滑層之總固體成分的比例為13.0wt%~23.1wt%。 In the above invention, it is preferred that the ratio of the solid content of the lubricating material to the total solid content of the lubricating layer is from 13.0% by weight to 23.1% by weight.

在上述發明中,作為能夠應用的基材,除了樹脂組成薄膜(厚度為125μm~250μm)外,還可以舉出金屬薄膜(0.1mm~0.2mm)或酚醛紙板等。 In the above-mentioned invention, as the base material which can be applied, in addition to the resin composition film (having a thickness of 125 μm to 250 μm), a metal thin film (0.1 mm to 0.2 mm) or a phenolic paperboard or the like can be given.

另外,為了解決上述課題,本發明之柔性印刷電路板之製造方法之特徵在於:在通孔鑽孔工序中,在基材的至少一個表面上塗覆由潤滑材料和黏合劑構成的非水溶性潤滑層而形成鑽孔加工用蓋板。 Further, in order to solve the above problems, the manufacturing method of the flexible printed circuit board of the present invention is characterized in that in the through hole drilling process, at least one surface of the substrate is coated with a water-insoluble lubricating material composed of a lubricating material and a binder. A layer is formed to form a cover for drilling.

在上述發明中,較佳為:潤滑材料以聚乙烯為主要成分,該聚乙烯之平均粒徑為5μm~7μm,分子量為4000~5000,熔點為95℃~130℃。 In the above invention, it is preferable that the lubricating material contains polyethylene as a main component, and the polyethylene has an average particle diameter of 5 μm to 7 μm, a molecular weight of 4000 to 5000, and a melting point of 95 ° C to 130 ° C.

在上述發明中,較佳為:潤滑材料以聚乙烯和聚四氟乙烯為主要成分。 In the above invention, it is preferred that the lubricating material contains polyethylene and polytetrafluoroethylene as main components.

在上述發明中,較佳為:由潤滑材料和黏合劑構成的非水溶性潤滑層之厚度為5μm~30μm。 In the above invention, it is preferable that the water-insoluble lubricating layer composed of the lubricating material and the binder has a thickness of 5 μm to 30 μm.

在上述發明中,較佳為:潤滑材料之固體成分相對於潤滑層之總固體成分的比例為13.0wt%~23.1wt%。 In the above invention, it is preferred that the ratio of the solid content of the lubricating material to the total solid content of the lubricating layer is from 13.0% by weight to 23.1% by weight.

在上述發明中,作為能夠應用的基材,除了樹脂組成薄膜(厚度為125μm~250μm)外,還可以舉出金屬薄膜(0.1mm~0.2mm)或酚醛紙板等。 In the above-mentioned invention, as the base material which can be applied, in addition to the resin composition film (having a thickness of 125 μm to 250 μm), a metal thin film (0.1 mm to 0.2 mm) or a phenolic paperboard or the like can be given.

根據本發明,透過抑制鑽頭損壞(折損),能夠延長鑽頭壽命,從而使鑽孔加工後的通孔質量得到優化。 According to the present invention, by suppressing the damage (demagnetization) of the drill bit, the life of the drill can be prolonged, and the quality of the through hole after the drilling process can be optimized.

5‧‧‧鑽頭 5‧‧‧ drill bit

10‧‧‧蓋板 10‧‧‧ Cover

12‧‧‧潤滑層 12‧‧‧Lubricating layer

14、15‧‧‧PET 14, 15‧‧‧PET

16‧‧‧預鑽孔 16‧‧‧Pre-drilling

17‧‧‧通孔 17‧‧‧through hole

20‧‧‧鍍銅疊層體 20‧‧‧copper laminate

30‧‧‧PET薄膜 30‧‧‧PET film

圖1係顯示本發明所涉及之鑽孔加工用蓋板之結構的剖面圖。 Fig. 1 is a cross-sectional view showing the structure of a cover plate for drilling according to the present invention.

圖2中的(a)係顯示預鑽孔加工處理後和通孔加工處理後的疊層體的剖面圖,(b)係顯示省略預鑽孔加工而直接實施通孔加工處理後的疊層體的剖面圖。 (a) of FIG. 2 shows a cross-sectional view of the laminate after the pre-drilling processing and the through-hole processing, and (b) shows the lamination after directly performing the through-hole processing without omitting the pre-drilling processing. A sectional view of the body.

圖3中的(a)和(b)係例示通孔質量的圖,(c)係顯示鑽頭之磨損狀態的圖。 (a) and (b) in Fig. 3 are diagrams showing the quality of the through holes, and (c) are diagrams showing the wear state of the drill.

圖4係顯示試驗No.1的蓋板之鑽孔加工後的通孔表面狀態的圖。 Fig. 4 is a view showing the state of the surface of the through hole after the drilling of the cover of Test No. 1.

圖5係顯示試驗No.2的蓋板之鑽孔加工後的通孔表面狀態的圖。 Fig. 5 is a view showing the state of the surface of the through hole after the drilling of the cover of Test No. 2.

圖6係顯示試驗No.3的蓋板之鑽孔加工後的通孔表面狀態的圖。 Fig. 6 is a view showing the state of the surface of the through hole after the drilling of the cover of Test No. 3.

圖7係顯示試驗No.4的蓋板之鑽孔加工後的通孔表面狀態的圖。 Fig. 7 is a view showing the state of the surface of the through hole after the drilling of the cover of Test No. 4.

圖8係顯示試驗No.5的蓋板之鑽孔加工後的通孔表面狀態的圖。 Fig. 8 is a view showing the state of the surface of the through hole after the drilling of the cover of Test No. 5.

圖9係顯示試驗No.6的蓋板之鑽孔加工後的通孔表面狀態的圖。 Fig. 9 is a view showing the state of the surface of the through hole after the drilling of the cover of Test No. 6.

圖10係顯示試驗No.7的蓋板之鑽孔加工後的通孔表面狀態的圖。 Fig. 10 is a view showing the state of the surface of the through hole after the drilling of the cover of Test No. 7.

圖11係顯示試驗No.8的蓋板之鑽孔加工後的通孔表面狀態的圖。 Fig. 11 is a view showing the state of the surface of the through hole after the drilling of the cover of Test No. 8.

圖12係顯示試驗No.9的蓋板之鑽孔加工後的通孔表面狀態的圖。 Fig. 12 is a view showing the state of the surface of the through hole after the drilling of the cover of Test No. 9.

圖13係顯示鑽孔數量、鑽頭折損率以及通孔質量之間的關係的圖表。 Figure 13 is a graph showing the relationship between the number of drill holes, the bit breakage rate, and the quality of the through holes.

〔蓋板〕[cover]

以下,參照附圖對本發明一實施方式所涉及之蓋板(entry sheet)進行說明。 Hereinafter, an entry sheet according to an embodiment of the present invention will be described with reference to the drawings.

圖1係顯示本發明之鑽孔用蓋板10塗覆在由複數塊鍍銅疊層板構成的鍍銅疊層體20上的狀態的剖面示意圖。 Fig. 1 is a schematic cross-sectional view showing a state in which the drilling cover 10 of the present invention is applied to a copper-clad laminate 20 composed of a plurality of copper-clad laminates.

本發明之鑽孔用蓋板10由PET薄膜14和形成於PET薄膜14之上側表面上的非水溶性潤滑層12構成。當鑽頭5朝下方移動時,依次貫通潤滑層12、PET薄膜14以及鍍銅疊層體20,在到達規定深度後,鑽頭5朝上方移動並從孔(通孔)中脫離。另外,在圖1中,在鍍銅疊層體20之下側表面上形成有PET薄膜30。 The entry sheet 10 for drilling according to the present invention comprises a PET film 14 and a water-insoluble lubricating layer 12 formed on the upper surface of the PET film 14. When the drill 5 is moved downward, the lubricating layer 12, the PET film 14, and the copper-plated laminate 20 are sequentially passed through, and after reaching a predetermined depth, the drill 5 is moved upward and detached from the hole (through hole). In addition, in FIG. 1, a PET film 30 is formed on the lower side surface of the copper-plated laminate 20.

構成本發明之蓋板10的PET薄膜14之厚度為125μm~250μm,進一步較佳為125μm。由潤滑材料和黏合劑(binder)構成的非水溶性潤滑層之厚度(塗覆厚度)較佳為5μm~30μm。 The thickness of the PET film 14 constituting the cover 10 of the present invention is from 125 μm to 250 μm, and more preferably 125 μm. The thickness (coating thickness) of the water-insoluble lubricating layer composed of the lubricating material and the binder is preferably from 5 μm to 30 μm.

潤滑層12由潤滑材料和黏合劑構成,作為其溶劑較佳為醋酸丁酯(butyl acetate)、醋酸乙酯(ethyl acetate)、甲苯(toluene)。潤滑材料為聚乙烯(polyethylene),其平均粒徑較佳為5μm~7μm。作為黏合劑較佳為異氰酸酯改性聚丁二烯(isocyanate denaturation polybutadiene)或煮沸改性聚丁二烯(boil denaturation polybutadiene)。關於這些物質之混合方法,只要是工業上使用的公知方法,便沒有特別限制。具體而言,使用軋輥、捏合機(kneader)或其他混合裝置,將上述組成物適當地加溫或加熱而形成為均勻的混合物。 The lubricating layer 12 is composed of a lubricating material and a binder, and as a solvent thereof, butyl acetate, ethyl acetate, and toluene are preferable. The lubricating material is polyethylene, and the average particle diameter thereof is preferably 5 μm to 7 μm. As the binder, isocyanate denaturation polybutadiene or boil denaturation polybutadiene is preferred. The mixing method of these substances is not particularly limited as long as it is a well-known method used industrially. Specifically, the above composition is appropriately heated or heated using a roll, a kneader or other mixing device to form a homogeneous mixture.

〔蓋板之製造方法〕[Method of Manufacturing Cover Plate]

蓋板係經過攪拌工序搅拌工序、塗覆‧乾燥工序而製成。 The cover plate is produced by a stirring step, a coating step, and a drying step.

首先,以潤滑材料之固體成分相對於潤滑層之總固體成分的比例為13.0wt%~23.1wt%之方式,使用混合裝置攪拌10分鐘得到混合物。此時,潤滑材料呈分散於溶劑中的狀態。 First, the mixture was stirred for 10 minutes using a mixing device in such a manner that the ratio of the solid content of the lubricating material to the total solid content of the lubricating layer was from 13.0% by weight to 23.1% by weight. At this time, the lubricating material is in a state of being dispersed in a solvent.

接著,使用塗覆機(JP株式會社小林製作所製、COATER KS-001)對被攪拌後的混合物實施塗覆‧乾燥工序,使混合物中的溶劑揮發後得到膜厚為5μm~20μm的蓋板。 Then, the mixture after stirring was subjected to a coating and drying step using a coating machine (manufactured by Kobayashi Kobayashi Co., Ltd., COATER KS-001) to volatilize the solvent in the mixture to obtain a cover having a film thickness of 5 μm to 20 μm.

製造蓋板時,將塗覆機設定為以下所示之條件,但並不限於此。 When the cover is manufactured, the coater is set to the conditions shown below, but is not limited thereto.

<塗覆機之條件設定><conditioner setting of coating machine>

線速度(line speed)設定為7(m/min)、MR/AR速度設定為6.5/8.0、對於張力(tension),第一開卷機(unwinder)設定為7kg、乾燥機設定為12kg、DR設定為3kg/cm2、收卷設定為1N,乾燥機溫度設定為120℃、150℃。在所使用之塗覆機中,乾燥機溫度存在第一範圍和第二範圍,實施時,第一範圍設定為120℃、第二範圍設定為150℃。在此,MR(metering roll)係為計量輥之縮寫,AR(applicator roll)係為塗覆輥之縮寫,MR、AR之速度無單位,係為相對於線速度之相對值(所使用之塗覆機所特有的值)。另外,DR(dancer roll)係鬆緊調節輥之縮寫。 The line speed is set to 7 (m/min), the MR/AR speed is set to 6.5/8.0, and for the tension, the first unwinder is set to 7 kg, the dryer is set to 12 kg, and the DR setting is set. It was 3 kg/cm 2 , the winding was set to 1 N, and the dryer temperature was set to 120 ° C and 150 ° C. In the coating machine used, the dryer temperature has a first range and a second range, and when implemented, the first range is set to 120 ° C and the second range is set to 150 ° C. Here, MR (metering roll) is an abbreviation of metering roller, AR (applicator roll) is an abbreviation of coating roller, and MR and AR speed are unitless, which is a relative value with respect to linear velocity (coating used) The value that is unique to the machine). In addition, DR (dancer roll) is an abbreviation for elastic adjusting roller.

另外,本發明之蓋板中作為潤滑材料使用的聚乙烯,可以適當地使用平均粒徑為5μm~7μm的聚乙烯。若粒徑過小,則對潤滑層賦予潤滑性的功能會降低,而另一方面,若粒徑過大,則切削屑容易附著在鑽頭上。另外,聚乙烯顆粒之形狀可以為球形、方形、柱形、針形、板狀或不定形狀等,但在本發明中,從對潤滑層賦予潤滑性之觀點出發,較佳為採用球形顆粒之形態,由此,能夠在賦予高潤滑性的同時,使切削屑不易附著在鑽頭上。透過將聚乙烯之平均粒徑設定在上述範圍之內,使聚乙烯從潤滑層之表面突出,從而使蓋板具有適當的潤滑性。 Further, as the polyethylene used as the lubricating material in the cover of the present invention, polyethylene having an average particle diameter of 5 μm to 7 μm can be suitably used. When the particle diameter is too small, the function of imparting lubricity to the lubricating layer is lowered, and on the other hand, if the particle diameter is too large, the chips are likely to adhere to the drill. Further, the shape of the polyethylene particles may be a spherical shape, a square shape, a cylindrical shape, a needle shape, a plate shape or an indefinite shape. However, in the present invention, from the viewpoint of imparting lubricity to the lubricating layer, it is preferred to use spherical particles. According to the form, it is possible to impart high lubricity and to prevent the chips from adhering to the drill. By setting the average particle diameter of the polyethylene within the above range, the polyethylene is protruded from the surface of the lubricating layer, so that the cover sheet has appropriate lubricity.

較佳為以相對於潤滑層之總固體成分(100wt%)為13.0wt%~23.1wt%的混合比例含有聚乙烯顆粒。若其含有量過少,則潤滑層之潤滑性降低,另外,若其含有量過多,則切削屑容易附著在鑽頭上。 It is preferred to contain polyethylene particles in a mixing ratio of from 13.0% by weight to 23.1% by weight based on the total solid content (100% by weight) of the lubricating layer. If the content is too small, the lubricity of the lubricating layer is lowered, and if the content is too large, the chips are likely to adhere to the drill.

另外,聚乙烯之熔點較佳為95℃~130℃。若其熔點過低,則蓋板之保存性降低,或者在潤滑層塗覆後的乾燥工序中,聚乙烯本身熔化掉,從而阻礙潤滑層之潤滑性,而另一方面,若其熔點過高,則潤滑層之表面凹凸會變得顯著。另外,關於熔點之測量,可以使用現有公知的方法,例如使用差示掃描量熱儀(DSC)來測量。另外,聚乙烯之分子量較佳為4000~5000。 Further, the melting point of the polyethylene is preferably from 95 ° C to 130 ° C. If the melting point is too low, the preservability of the cover plate is lowered, or the polyethylene itself is melted in the drying process after the application of the lubricating layer, thereby hindering the lubricity of the lubricating layer, and on the other hand, if the melting point is too high Then, the surface unevenness of the lubricating layer becomes remarkable. Further, regarding the measurement of the melting point, it can be measured using a conventionally known method, for example, using a differential scanning calorimeter (DSC). Further, the molecular weight of the polyethylene is preferably from 4,000 to 5,000.

〔柔性印刷電路板之製造方法〕[Method of Manufacturing Flexible Printed Circuit Board]

作為將本發明之蓋板層疊在鍍銅疊層體20上批量生產柔性印刷電路板(Flexible Printed Circuit)之方法,採用卷對卷(roll to roll)的方法。在經過通孔鑽孔工序、通孔電鍍工序、抗蝕劑(rasist)塗覆工序、圖案曝光工序、蝕刻(etching)工序以及端子表面處理工序等之後,製成柔性電路板。 As a method of mass-producing a flexible printed circuit on a copper-clad laminate 20 by laminating a cover plate of the present invention, a roll-to-roll method is employed. After passing through the through hole drilling process, the via plating process, the resist coating process, the pattern exposure process, the etching process, the terminal surface treatment process, etc., it is set as the flexible circuit board.

通孔鑽孔工序使用具備卷對卷輸送功能的NC鑽孔裝置(未圖示)進行。該NC鑽孔裝置能夠鑽出0.1mm左右的孔,並且設有主軸(spindle)。在以夾住鍍銅疊層體20之方式,在鍍銅疊層體20之上側重疊配置本發明之蓋板10且下側重疊配置PET薄膜30之後,如圖2中的(b)所示,驅動鑽頭(未圖示)旋轉,並使鑽頭從蓋板10之上方朝下方移動,從而形成通孔17。 The through hole drilling process is performed using an NC drilling device (not shown) having a roll-to-roll conveying function. The NC drilling device is capable of drilling a hole of about 0.1 mm and is provided with a spindle. The cover sheet 10 of the present invention is placed on the upper side of the copper-plated laminate 20 and the PET film 30 is placed on the lower side so as to sandwich the copper-plated laminate 20, as shown in (b) of FIG. The driving drill (not shown) is rotated, and the drill is moved downward from above the cover 10 to form the through hole 17.

在現有技術下,係在實施如圖2中的(a)所示之預鑽孔加工處理(形成預鑽孔16的處理)之後再進行通孔加工處理,但在本發明中,對於層疊有本發明之蓋板10的鍍銅疊層體20,可以省略預鑽孔加工處理而直接實施通孔加工處理。因 此,因為可以省略預鑽孔加工處理工序,所以能夠縮短製造處理時間,並且由此能夠實現低成本化。 In the prior art, the through hole processing is performed after the pre-drill processing (the process of forming the pre-drill 16) as shown in (a) of FIG. 2 is performed, but in the present invention, for the lamination In the copper-plated laminate 20 of the cover 10 of the present invention, the through-hole processing can be directly performed by omitting the pre-drilling processing. because Since the pre-drilling processing step can be omitted, the manufacturing processing time can be shortened, and thus cost reduction can be achieved.

在使用鑽頭對柔性印刷電路板等進行鑽孔加工時,將本發明之蓋板配置在柔性印刷電路板等的最上層(鑽頭進入側),並且,根據需要在最下層配置托板(也稱為墊板(back up board)),使這些板重疊後進行鑽孔加工。所加工之柔性印刷電路板沒有特別限定,可以為單面電路板、雙面電路板、多層電路板中的任意一種。另外,關於柔性印刷電路板之材質,可以為酚醛樹脂(phenol resin)、環氧樹脂(epoxy resin)、聚醯亞胺樹脂(polyimide resin)、聚酯樹脂(polyester resin)、三嗪樹脂(triazine resin)、氟樹脂等中的任意一種,或者,也可以為利用玻璃纖維等將這些樹脂強化後的纖維增強樹脂。 When the flexible printed circuit board or the like is drilled using a drill, the cover of the present invention is placed on the uppermost layer of the flexible printed circuit board or the like (the drill entering side), and the pallet is placed on the lowermost layer as needed (also called For the back up board, the boards are overlapped and drilled. The processed flexible printed circuit board is not particularly limited and may be any one of a single-sided circuit board, a double-sided circuit board, and a multilayer circuit board. In addition, the material of the flexible printed circuit board may be a phenol resin, an epoxy resin, a polyimide resin, a polyester resin, or a triazine resin. Any one of a resin, a fluororesin, and the like, or a fiber-reinforced resin obtained by reinforcing these resins with glass fibers or the like.

另外,根據本發明之蓋板,即使在如下所述那樣利用小直徑的鑽頭進行鑽孔時也很少發生橫向滑動,能夠進行位置精度高(向心度高)的鑽孔加工,因此使用於孔徑為1mm~6mm左右的鑽孔加工自不用說,還可以適宜地使用於小孔徑的鑽孔加工,尤其適宜使用於孔徑為0.1mm~0.4mm的鑽孔加工,更適宜使用於孔徑為0.1mm~0.3mm的鑽孔加工,最適宜使用於孔徑為0.1mm~0.2mm的鑽孔加工。 Further, according to the cover plate of the present invention, even when drilling with a small-diameter drill as described below, lateral sliding rarely occurs, and drilling with high positional accuracy (high centripetality) can be performed, so that it is used for Drilling processing with a hole diameter of about 1mm~6mm can be suitably used for drilling with small apertures, especially for drilling with a hole diameter of 0.1mm~0.4mm, and it is more suitable for use with a hole diameter of 0.1. Drilling with mm~0.3mm is most suitable for drilling with a hole diameter of 0.1mm~0.2mm.

〔蓋板之性能試驗一〕[Performance test of cover plate 1]

以下,對不含有潤滑材料的蓋板、以及改變三種潤滑材料之混合比例、塗覆厚度、乾燥條件製成的蓋板進行NC鑽孔加工,對第1個孔、第5000個孔、第10000個孔和第100000個孔之壁面凹凸的有無、壁面毛刺的有無、介面剝離的有無,第1個孔和第100000個孔之通孔鍍層剝落的有無,第1個孔和第100000孔之通孔銅箔 變形的有無,鑽頭之折損(鑽頭的耐久性)的有無、鑽頭上切削屑之附著程度、鑽頭之磨損程度以及向心度(鑽孔位置精度)進行了評價。 In the following, the cover plate not containing the lubricating material, and the cover plate made by changing the mixing ratio, coating thickness, and drying conditions of the three lubricating materials are subjected to NC drilling processing, for the first hole, the 5000th hole, and the 10000th. The presence or absence of the wall surface of the 100,000th hole, the presence or absence of the wall burr, the presence or absence of the interface peeling, the presence or absence of the peeling of the through hole of the first hole and the 100,000th hole, and the passage of the first hole and the 100,000th hole Hole copper foil The presence or absence of deformation, the presence or absence of breakage of the drill (durability of the drill), the degree of adhesion of the chips on the drill, the degree of wear of the drill, and the centripetality (drilling position accuracy) were evaluated.

對總共九種蓋板(試驗板No.1~No.9)進行了試驗,其評價結果記載於下述表1中。 A total of nine kinds of cover plates (test plates No. 1 to No. 9) were tested, and the evaluation results are shown in Table 1 below.

接著,對評價之基準進行說明。 Next, the criteria for evaluation will be described.

在壁面凹凸之評價中,基本沒有壁面凹凸的用“◎”表示,有凹凸但基本無屑附著於鑽頭等影響的用“○”表示,有凹凸但屑附著於鑽頭等的影響較小的用“△”表示,有凹凸且因屑附著於鑽頭等的影響而可能造成電鍍不良等,從而不能使用的用“×”表示。例如,圖3中的(a)左側的圖表示沒有壁面凹凸的狀態,右側的圖表示存在壁面凹凸的狀態。 In the evaluation of the wall surface unevenness, the wall surface unevenness is substantially indicated by "◎", and the unevenness is observed, but the influence of the drill is affected by the "○", and the unevenness is observed. "△" indicates that there is unevenness and the plating may be caused by adhesion to the drill or the like, which may cause plating failure or the like, and the use of "X" is indicated. For example, the diagram on the left side of (a) in FIG. 3 shows a state in which there is no wall surface unevenness, and the diagram on the right side shows a state in which the wall surface is uneven.

在毛刺之評價中,沒有毛刺的用“◎”表示,多少有些毛刺但不影響通孔質量的用“○”表示,有毛刺但對通孔質量所帶來的影響較小的用“△”表示,有毛刺且對通孔質量所帶來的影響不小的用“×”表示。 In the evaluation of burrs, the absence of burrs is indicated by "◎", and some burrs are used, but the quality of the through holes is not indicated by "○". If there is burr but the influence on the quality of the through holes is small, "△" is used. Indicates that there is a burr and the influence on the quality of the through hole is not small represented by "x".

在介面剝離之評價中,No.1~No.9的全部蓋板中都沒有剝離,在銅箔變形之評價中,No.1~No.9的全部蓋板中都沒有變形,在鑽頭折損之評價中,No.1~No.9的全部蓋板中都沒有折損。 In the evaluation of the interface peeling, none of the cover sheets of No. 1 to No. 9 were peeled off, and in the evaluation of the deformation of the copper foil, all the cover sheets of No. 1 to No. 9 were not deformed, and the drill was broken. In the evaluation, none of the covers of No. 1 to No. 9 were damaged.

<實施例一(試驗板No.1)><Example 1 (Test Plate No. 1)>

作為構成實施例一所涉及之蓋板的潤滑材料,使用聚乙烯(商品名:ZJ-22,JP株式會社岐阜紫膠製造所製),作為黏合劑使用異氰酸酯改性聚丁二烯(isocyanate denaturation polybutadiene)(商品名:TP-1001,日本曹達株式會社製),使潤滑材料之含有比例為50%。該蓋板之塗覆厚度(膜厚)為20μm,且是在經過聚乙烯和黏合劑之攪拌處理後,在150℃下乾燥五分鐘形成。 As a lubricating material constituting the cover plate according to the first embodiment, polyethylene (trade name: ZJ-22, manufactured by JP Co., Ltd.) was used, and isocyanate-denatured polybutadiene (isocyanate denaturation) was used as a binder. Polybutadiene) (trade name: TP-1001, manufactured by Nippon Soda Co., Ltd.), and the content of the lubricating material is 50%. The cover sheet had a coating thickness (film thickness) of 20 μm and was formed by drying at 150 ° C for five minutes after being subjected to agitation treatment with polyethylene and a binder.

圖4中的(a)係從上方觀察第1個通孔的圖,圖4中的(b)係從斜上方觀察第1個通孔的圖。圖4中的(c)係從上方觀察第5000個通孔的圖,圖4中的(d)係從斜上方觀察第5000個通孔的圖。圖4中的(e)係從上方觀察第10000個通孔的圖,圖4中的(f)係從斜上方觀察第10000個通孔的圖。圖4中的(g)係從上方觀察第100000個通孔的圖,圖4中的(h)係從斜上方觀察第100000個通孔的圖。 (a) of FIG. 4 is a view of the first through hole as viewed from above, and (b) of FIG. 4 is a view of the first through hole viewed obliquely from above. (c) of FIG. 4 is a view of the 5000th through hole viewed from above, and (d) of FIG. 4 is a view of the 5000th through hole viewed obliquely from above. (e) of FIG. 4 is a view of the 10000th through hole viewed from above, and (f) of FIG. 4 is a view of the 10000th through hole viewed obliquely from above. (g) in Fig. 4 is a view of the 100,000th through hole viewed from above, and (h) in Fig. 4 is a view of the 100,000th through hole as viewed obliquely from above.

參照表1可知,試驗板No.1的蓋板,直到第5000個孔基本沒有壁面凹凸(參照圖4中的(b)、(d)),並且,關於通孔鍍層剝落的有無、鑽頭上切削屑之附著程度以及鑽頭之磨損程度,其結果均為良好。 Referring to Table 1, it is understood that the cover plate of the test plate No. 1 has substantially no wall surface unevenness until the 5,000th hole (refer to (b), (d) in Fig. 4), and the presence or absence of peeling of the through-hole plating layer on the drill bit The degree of adhesion of the chips and the degree of wear of the drills were all good.

<實施例二(試驗板No.2)><Example 2 (test plate No. 2)>

作為構成實施例二所涉及之蓋板的潤滑材料,使用聚乙烯(商品名:ZJ-22,JP株式會社岐阜紫膠製造所製),作為黏合劑使用異氰酸酯改性聚丁二烯(商品名:TP-1001,日本曹達株式會社製),使潤滑材料之含有比例為33%。該蓋板之塗覆厚度(膜厚)為10μm,且是在經過聚乙烯和黏合劑之攪拌處理後,在120℃下乾燥兩分鐘,進而在150℃下乾燥三分鐘形成。 As a lubricating material constituting the cover plate according to the second embodiment, polyethylene (trade name: ZJ-22, manufactured by JP Co., Ltd.) is used, and isocyanate-modified polybutadiene (trade name) is used as a binder. : TP-1001, manufactured by Nippon Soda Co., Ltd., so that the content of the lubricating material is 33%. The cover sheet had a coating thickness (film thickness) of 10 μm and was formed by drying at 120 ° C for two minutes after being subjected to agitation treatment with polyethylene and a binder, and further drying at 150 ° C for three minutes.

圖5中的(a)係從上方觀察第1個通孔的圖,圖5中的(b)係從斜上方觀察第1個通孔的圖。圖5中的(c)係從上方觀察第5000個通孔的圖,圖5中的(d)係從斜上方觀察第5000個通孔的圖。圖5中的(e)係從上方觀察第10000個通孔的圖,圖5中的(f)係從斜上方觀察第10000個通孔的圖。圖5中的(g)係從上方觀察第100000個通孔的圖,圖5中的(h)係從斜上方觀察第100000個通孔的圖。 (a) of FIG. 5 is a view of the first through hole viewed from above, and (b) of FIG. 5 is a view of the first through hole viewed obliquely from above. (c) of FIG. 5 is a view of the 5000th through hole viewed from above, and (d) of FIG. 5 is a view of the 5000th through hole viewed obliquely from above. (e) of FIG. 5 is a view of the 10000th through hole viewed from above, and (f) of FIG. 5 is a view of the 10000th through hole viewed obliquely from above. (g) in Fig. 5 is a view of the 100,000th through hole as viewed from above, and (h) in Fig. 5 is a view of the 100,000th through hole as viewed obliquely from above.

參照表1可知,試驗板No.2的蓋板,直到第10000個孔都能看到稍微存在的壁面凹凸(參照圖5中的(b)、(d)、(f))。關於通孔鍍層剝落的有無以及向心度,其結果基本良好。關於鑽頭上切削屑之附著程度,與實施例一相比稍微變多,但是其程度為對通孔質量所帶來的影響較小的程度。關於鑽頭之磨損程度,多少發生磨損但還沒到進行更換的程度。 Referring to Table 1, it can be seen that the cover plate of the test plate No. 2 can see a slight wall unevenness until the 10000th hole (see (b), (d), (f) in Fig. 5). Regarding the presence or absence of the peeling of the via plating and the centripetality, the results were basically good. The degree of adhesion of the chips on the drill bit is slightly increased as compared with the first embodiment, but to the extent that the influence on the quality of the through hole is small. Regarding the degree of wear of the drill bit, how much wear occurs but has not yet been replaced.

<實施例三(試驗板No.3)><Example 3 (test plate No. 3)>

作為構成實施例三所涉及之蓋板的潤滑材料,使用聚乙烯(商品名:ZJ-22,JP株式會社岐阜紫膠製造所製),作為黏合劑使用異氰酸酯改性聚丁二烯(商品名:TP-1001,日本曹達株式會社製),使潤滑材料之含有比例為33%。該蓋板之塗覆厚度(膜厚)為20μm,且是在經過聚乙烯和黏合劑之攪拌處理後,在120℃下乾燥兩分鐘,進而在150℃下乾燥三分鐘形成。 As a lubricating material constituting the cover plate according to the third embodiment, polyethylene (trade name: ZJ-22, manufactured by JP Co., Ltd.) is used, and isocyanate-modified polybutadiene (trade name) is used as a binder. : TP-1001, manufactured by Nippon Soda Co., Ltd., so that the content of the lubricating material is 33%. The cover sheet had a coating thickness (film thickness) of 20 μm and was formed by drying at 120 ° C for two minutes after being subjected to agitation treatment with polyethylene and a binder, and further drying at 150 ° C for three minutes.

圖6中的(a)係從上方觀察第1個通孔的圖,圖6中的(b)係從斜上方觀察第1個通孔的圖。圖6中的(c)係從上方觀察第5000個通孔的圖,圖6中的(d)係從斜上方觀察第5000個通孔的圖。圖6中的(e)係從上方觀察第10000個通孔的圖,圖6中的(f)係從斜上方觀察第10000個通孔的圖。圖6中的(g)係從上方觀察第100000個通孔的圖,圖6中的(h)係從斜上方觀察第100000個通孔的圖。 (a) of FIG. 6 is a view of the first through hole as viewed from above, and (b) of FIG. 6 is a view of the first through hole viewed obliquely from above. (c) of FIG. 6 is a view of the 5000th through hole viewed from above, and (d) of FIG. 6 is a view of the 5000th through hole viewed obliquely from above. (e) of FIG. 6 is a view of the 10000th through hole viewed from above, and (f) of FIG. 6 is a view of the 10000th through hole viewed obliquely from above. (g) in Fig. 6 is a view of the 100,000th through hole as viewed from above, and (h) in Fig. 6 is a view of the 100,000th through hole as viewed obliquely from above.

參照表1可知,試驗板No.3的蓋板,直到第10000個孔都能看到稍微存在的壁面凹凸(參照圖6中的(b)、(d)、(f))。關於通孔鍍層剝落的有無、鑽頭上切削屑之附著程度、鑽頭之磨損程度以及向心度,其結果基本良好。 Referring to Table 1, it can be seen that the cover plate of the test plate No. 3 can see a slight wall unevenness until the 10000th hole (see (b), (d), (f) in Fig. 6). Regarding the presence or absence of peeling of the via plating, the degree of adhesion of the chips on the drill, the degree of wear of the drill, and the centripetality, the results were basically good.

<實施例四(試驗板No.4)><Example 4 (Test Plate No. 4)>

作為構成實施例四所涉及之蓋板的潤滑材料,使用聚乙烯(商品名:ZJ-22,JP株式會社岐阜紫膠製造所製),作為黏合劑使用異氰酸酯改性聚丁二烯(商品名:TP-1001,日本曹達株式會社製),使潤滑材料之含有比例為50%。該蓋板之塗覆厚度(膜厚)為10μm,且是在經過聚乙烯和黏合劑之攪拌處理後,在120℃下乾燥兩分鐘,進而在150℃下乾燥三分鐘形成。 As a lubricating material constituting the cover plate according to the fourth embodiment, polyethylene (trade name: ZJ-22, manufactured by JP Co., Ltd.) was used, and isocyanate-modified polybutadiene (trade name) was used as a binder. : TP-1001, manufactured by Nippon Soda Co., Ltd., so that the content of the lubricating material is 50%. The cover sheet had a coating thickness (film thickness) of 10 μm and was formed by drying at 120 ° C for two minutes after being subjected to agitation treatment with polyethylene and a binder, and further drying at 150 ° C for three minutes.

圖7中的(a)係從上方觀察第1個通孔的圖,圖7中的(b)係從斜上方觀察第1個通孔的圖。圖7中的(c)係從上方觀察第5000個通孔的圖,圖7中的(d)係從斜上方觀察第5000個通孔的圖。圖7中的(e)係從上方觀察第10000個通孔的圖,圖7中的(f)係從斜上方觀察第10000個通孔的圖。圖7中的(g)係從上方觀察第100000個通孔的圖,圖7中的(h)係從斜上方觀察第100000個通孔的圖。 (a) of FIG. 7 is a view of the first through hole viewed from above, and (b) of FIG. 7 is a view of the first through hole viewed obliquely from above. (c) of FIG. 7 is a view of the 5000th through hole viewed from above, and (d) of FIG. 7 is a view of the 5000th through hole viewed obliquely from above. (e) of FIG. 7 is a view of the 10000th through hole viewed from above, and (f) of FIG. 7 is a view of the 10000th through hole viewed obliquely from above. (g) in Fig. 7 is a view of the 100,000th through hole as viewed from above, and (h) in Fig. 7 is a view of the 100,000th through hole as viewed obliquely from above.

參照表1可知,試驗板No.4的蓋板,直到第10000個孔基本都看不到壁面凹凸,而在第100000個孔稍微看到壁面凹凸(參照圖7中的(b)、(d)、(f)、(h))。毛刺稍微地存在,但對通孔質量所帶來的影響較小。另外,關於通孔鍍層剝落的有無,多少能看到一些剝落,但是其程度為對通孔質量所帶來的影響較小的程度。 Referring to Table 1, it can be seen that the cover plate of the test plate No. 4 does not substantially see the wall surface unevenness until the 10000th hole, and the wall surface unevenness is slightly seen in the 100,000th hole (refer to (b), (d in Fig. 7). ), (f), (h)). The burrs are slightly present, but have less impact on the quality of the vias. In addition, as for the presence or absence of the peeling of the through-hole plating, some peeling can be seen, but the degree is such that the influence on the quality of the through-hole is small.

<實施例五(試驗板No.5)><Example 5 (test plate No. 5)>

作為構成實施例五所涉及之蓋板的潤滑材料,使用聚乙烯(商品名:ZJ-22,JP株式會社岐阜紫膠製造所製),作為黏合劑使用異氰酸酯改性聚丁二烯(商品名:TP-1001,日本曹達株式會社製),使潤滑材料之含有比例為50%。該蓋板之塗覆厚度(膜厚)為20μm,且是在經過聚乙烯和黏合劑之攪拌處理後,在120℃下乾燥兩分鐘,進而在150℃下乾燥三分鐘形成。 As a lubricating material constituting the cover plate according to the fifth embodiment, polyethylene (trade name: ZJ-22, manufactured by JP Co., Ltd.) was used, and isocyanate-modified polybutadiene was used as a binder (trade name: TP-1001, manufactured by Nippon Soda Co., Ltd., so that the content of the lubricating material is 50%. The cover sheet had a coating thickness (film thickness) of 20 μm and was formed by drying at 120 ° C for two minutes after being subjected to agitation treatment with polyethylene and a binder, and further drying at 150 ° C for three minutes.

圖8中的(a)係從上方觀察第1個通孔的圖,圖8中的(b)係從斜上方觀察第1個通孔的圖。圖8中的(c)係從上方觀察第5000個通孔的圖,圖8中的(d)係從斜上方觀察第5000個通孔的圖。圖8中的(e)係從上方觀察第10000個通孔的圖,圖8中的(f)係從斜上方觀察第10000個通孔的圖。圖8中的(g)係從上方觀察第100000個通孔的圖,圖8中的(h)係從斜上方觀察第100000個通孔的圖。 (a) of FIG. 8 is a view of the first through hole viewed from above, and (b) of FIG. 8 is a view of the first through hole viewed obliquely from above. (c) of FIG. 8 is a view of the 5000th through hole viewed from above, and (d) of FIG. 8 is a view of the 5000th through hole viewed obliquely from above. (e) of FIG. 8 is a view of the 10000th through hole viewed from above, and (f) of FIG. 8 is a view of the 10000th through hole viewed obliquely from above. (g) in Fig. 8 is a view of the 100,000th through hole as viewed from above, and (h) in Fig. 8 is a view of the 100,000th through hole as viewed obliquely from above.

參照表1可知,試驗板No.5的蓋板,直到第5000個孔基本都看不到壁面凹凸,而在第10000個孔和第100000個孔稍微地看到壁面凹凸(參照圖8中的(b)、(d)、(f)、(h))。關於通孔鍍層剝落的有無,其結果基本良好。關於鑽頭上切削屑之附著程度,與實施例一相比稍微變多,但是其程度為對通孔質量所帶來的 影響較小的程度。關於鑽頭之磨損程度,多少發生磨損但還沒到進行更換的程度。 Referring to Table 1, it can be seen that the cover plate of the test plate No. 5 does not substantially see the wall surface irregularities until the 5,000th hole, and the wall surface unevenness is slightly seen in the 10000th hole and the 100,000th hole (refer to FIG. 8 (b), (d), (f), (h)). Regarding the presence or absence of peeling of the via plating, the result was basically good. Regarding the degree of adhesion of the chips on the drill bit, it is slightly more than that of the first embodiment, but the degree is brought about by the quality of the through hole. The extent of the impact is small. Regarding the degree of wear of the drill bit, how much wear occurs but has not yet been replaced.

<實施例六(試驗板No.6)><Example 6 (test plate No. 6)>

作為構成實施例六所涉及之蓋板的潤滑材料,使用聚乙烯(商品名:ZJ-24FA,JP株式會社岐阜紫膠製造所製),作為混合用的黏合劑使用異氰酸酯改性聚丁二烯(商品名:TP-1001,日本曹達株式會社製),使聚乙烯(潤滑材料)之含有比例為33%。該蓋板之塗覆厚度(膜厚)為10μm,且是在經過聚乙烯和黏合劑之攪拌處理後,在120℃下乾燥兩分鐘,進而在150℃下乾燥三分鐘形成。 As a lubricating material constituting the cover plate according to the sixth embodiment, polyethylene (trade name: ZJ-24FA, manufactured by JP Co., Ltd.) was used, and isocyanate-modified polybutadiene was used as a binder for mixing. (trade name: TP-1001, manufactured by Nippon Soda Co., Ltd.), and the content ratio of polyethylene (lubricating material) was 33%. The cover sheet had a coating thickness (film thickness) of 10 μm and was formed by drying at 120 ° C for two minutes after being subjected to agitation treatment with polyethylene and a binder, and further drying at 150 ° C for three minutes.

圖9中的(a)係從上方觀察第1個通孔的圖,圖9中的(b)係從斜上方觀察第1個通孔的圖。圖9中的(c)係從上方觀察第5000個通孔的圖,圖9中的(d)係從斜上方觀察第5000個通孔的圖。圖9中的(e)係從上方觀察第10000個通孔的圖,圖9中的(f)係從斜上方觀察第10000個通孔的圖。圖9中的(g)係從上方觀察第100000個通孔的圖,圖9中的(h)係從斜上方觀察第100000個通孔的圖。 (a) of FIG. 9 is a view of the first through hole as viewed from above, and (b) of FIG. 9 is a view of the first through hole viewed obliquely from above. (c) of FIG. 9 is a view of the 5000th through hole viewed from above, and (d) of FIG. 9 is a view of the 5000th through hole viewed obliquely from above. (e) of FIG. 9 is a view of the 10000th through hole viewed from above, and (f) of FIG. 9 is a view of the 10000th through hole viewed obliquely from above. (g) in FIG. 9 is a view of the 100,000th through hole viewed from above, and (h) in FIG. 9 is a view of the 100,000th through hole viewed obliquely from above.

參照表1可知,試驗板No.6的蓋板,在第5000個孔稍微看到壁面凹凸,而在第10000個孔基本看不到壁面凹凸(參照圖9中的(b)、(d)、(f)、(h))。關於通孔鍍層剝落的有無,其結果基本良好。另外,毛刺能夠稍微地看到,但是其程度為對通孔質量所帶來的影響較小的程度。關於鑽頭上切削屑之附著程度,與實施例一相比稍微變多,但是其程度為對通孔質量所帶來的影響較小的程度。 Referring to Table 1, it is understood that the cover plate of the test plate No. 6 has a slight unevenness in the wall surface in the 5,000th hole, and the wall surface unevenness is hardly observed in the 10000th hole (refer to (b) and (d) in Fig. 9 , (f), (h)). Regarding the presence or absence of peeling of the via plating, the result was basically good. In addition, the burrs can be seen slightly, but to the extent that the effect on the quality of the through holes is small. The degree of adhesion of the chips on the drill bit is slightly increased as compared with the first embodiment, but to the extent that the influence on the quality of the through hole is small.

<實施例七(試驗板No.7)><Example 7 (test plate No. 7)>

作為構成實施例七所涉及之蓋板的潤滑材料,使用聚乙烯(商品名:XD-448(微晶石蠟),JP株式會社岐阜紫膠製造所製),作為黏合劑使用異氰酸酯改性聚丁二烯(商品名:TP-1001,日本曹達株式會社製),使潤滑材料之含有比例為33%。該蓋板之塗覆厚度(膜厚)為10μm,且是在經過聚乙烯和黏合劑之攪拌處理後,在120℃下乾燥兩分鐘,進而在150℃下乾燥三分鐘形成。 As a lubricating material constituting the cover plate according to the seventh embodiment, polyethylene (trade name: XD-448 (microcrystalline paraffin), manufactured by JP Co., Ltd.) is used, and isocyanate-modified polybutylene is used as a binder. Diene (trade name: TP-1001, manufactured by Nippon Soda Co., Ltd.), the content of the lubricating material was 33%. The cover sheet had a coating thickness (film thickness) of 10 μm and was formed by drying at 120 ° C for two minutes after being subjected to agitation treatment with polyethylene and a binder, and further drying at 150 ° C for three minutes.

圖10中的(a)係從上方觀察第1個通孔的圖,圖10中的(b)係從斜上方觀察第1個通孔的圖。圖10中的(c)係從上方觀察第5000個通孔的圖,圖10中的(d)係從斜上方觀察第5000個通孔的圖。圖10中的(e)係從上方觀察第10000個通孔的圖,圖10中的(f)係從斜上方觀察第10000個通孔的圖。圖10中的(g)係從上方觀察第100000個通孔的圖,圖10中的(h)係從斜上方觀察第100000個通孔的圖。 (a) of FIG. 10 is a view of the first through hole viewed from above, and (b) of FIG. 10 is a view of the first through hole viewed obliquely from above. (c) of FIG. 10 is a view of the 5000th through hole viewed from above, and (d) of FIG. 10 is a view of the 5000th through hole viewed obliquely from above. (e) of FIG. 10 is a view of the 10000th through hole viewed from above, and (f) of FIG. 10 is a view of the 10000th through hole viewed obliquely from above. (g) in FIG. 10 is a view of the 100,000th through hole viewed from above, and (h) in FIG. 10 is a view of the 100,000th through hole viewed obliquely from above.

參照表1可知,試驗板No.7的蓋板,直到第5000個孔都能稍微地看到壁面凹凸,而在第10000個孔和第100000個孔基本看不到壁面凹凸(參照圖10中的(b)、(d)、(f)、(h))。毛刺稍微地存在,但是其程度為對通孔質量所帶來的影響較小的程度。關於通孔鍍層剝落的有無,多少能看到剝落,但是其程度為對通孔質量所帶來的影響較小的程度。關於通孔銅箔變形,在第10000個孔中能夠零星地看到變形部位,但是其程度為對通孔質量所帶來的影響較小的程度。關於鑽頭上切削屑之附著程度,與實施例一相比稍微變多,但是其程度為對通孔質量所帶來的影響較小的程度。關於鑽頭之磨損程度,多少發生磨損但還沒到進行更換的程度。 Referring to Table 1, it can be seen that the cover plate of the test plate No. 7 can slightly see the wall surface irregularities until the 5,000th hole, and the wall surface unevenness is substantially not seen in the 10000th hole and the 100,000th hole (refer to FIG. 10 (b), (d), (f), (h)). The burrs are slightly present, but to the extent that they have a lesser effect on the quality of the through holes. Regarding the presence or absence of the peeling of the through-hole plating, some peeling can be seen, but the extent is such that the influence on the quality of the through-hole is small. Regarding the deformation of the through-hole copper foil, the deformed portion can be seen sporadically in the 10,000th hole, but the degree is such that the influence on the quality of the through-hole is small. The degree of adhesion of the chips on the drill bit is slightly increased as compared with the first embodiment, but to the extent that the influence on the quality of the through hole is small. Regarding the degree of wear of the drill bit, how much wear occurs but has not yet been replaced.

<實施例八(試驗板No.9)><Example 8 (test plate No. 9)>

作為構成實施例八所涉及之蓋板的潤滑材料,使用聚乙烯(商品名:ZJ-22,JP株式會社岐阜紫膠製造所製),作為黏合劑使用異氰酸酯改性聚丁二烯(商品名:TP-1001,日本曹達株式會社製),使潤滑材料之含有比例為33%。該蓋板之塗覆厚度(膜厚)為30μm,且是在經過聚乙烯和黏合劑之攪拌處理後,在120℃下乾燥兩分鐘,進而在150℃下乾燥三分鐘形成。 As a lubricating material constituting the cover plate according to the eighth embodiment, polyethylene (trade name: ZJ-22, manufactured by JP Co., Ltd.) was used, and isocyanate-modified polybutadiene (trade name) was used as a binder. : TP-1001, manufactured by Nippon Soda Co., Ltd., so that the content of the lubricating material is 33%. The cover sheet had a coating thickness (film thickness) of 30 μm and was formed by drying at 120 ° C for two minutes after being subjected to agitation treatment with polyethylene and a binder, and further drying at 150 ° C for three minutes.

圖12中的(a)係從上方觀察第1個通孔的圖,圖12中的(b)係從斜上方觀察第1個通孔的圖。圖12中的(c)係從上方觀察第5000個通孔的圖,圖12中的(d)係從斜上方觀察第5000個通孔的圖。圖12中的(e)係從上方觀察第10000個通孔的圖,圖12中的(f)係從斜上方觀察第10000個通孔的圖。圖12中的(g)係從上方觀察第100000個通孔的圖,圖12中的(h)係從斜上方觀察第100000個通孔的圖。 (a) of FIG. 12 is a view of the first through hole viewed from above, and (b) of FIG. 12 is a view of the first through hole viewed obliquely from above. (c) of FIG. 12 is a view of the 5000th through hole viewed from above, and (d) of FIG. 12 is a view of the 5000th through hole viewed obliquely from above. (e) of FIG. 12 is a view of the 10000th through hole viewed from above, and (f) of FIG. 12 is a view of the 10000th through hole viewed obliquely from above. (g) in Fig. 12 is a view of the 100,000th through hole viewed from above, and (h) in Fig. 12 is a view of the 100,000th through hole viewed obliquely from above.

參照表1可知,試驗板No.9的蓋板,直到第10000個孔都能看到稍微存在的壁面凹凸(參照圖12中的(b)、(d)、(f))。關於通孔鍍層剝落的有無、鑽頭上切削屑之附著程度、鑽頭之磨損程度以及向心度,其結果基本良好。 Referring to Table 1, it can be seen that the cover plate of the test plate No. 9 can see a slight wall unevenness until the 10000th hole (see (b), (d), (f) in Fig. 12). Regarding the presence or absence of peeling of the via plating, the degree of adhesion of the chips on the drill, the degree of wear of the drill, and the centripetality, the results were basically good.

<比較例一(試驗板No.8)><Comparative Example 1 (test plate No. 8)>

比較例一所涉及之蓋板係使用250μm的PET薄膜形成,並且不含有潤滑材料。 The cover sheet of Comparative Example 1 was formed using a 250 μm PET film and did not contain a lubricating material.

圖11中的(a)係從上方觀察第1個通孔的圖,圖11中的(b)係從斜上方觀察第1個通孔的圖。圖11中的(c)係從上方觀察第5000個通孔的圖,圖11中的(d) 係從斜上方觀察第5000個通孔的圖。圖11中的(e)係從上方觀察第10000個通孔的圖,圖11中的(f)係從斜上方觀察第10000個通孔的圖。圖11中的(g)係從上方觀察第100000個通孔的圖,圖11中的(h)係從斜上方觀察第100000個通孔的圖。 (a) of FIG. 11 is a view of the first through hole viewed from above, and (b) of FIG. 11 is a view of the first through hole viewed obliquely from above. (c) in Fig. 11 is a view of the 5000th through hole viewed from above, (d) in Fig. 11 A diagram of the 5000th through hole is observed from obliquely above. (e) of FIG. 11 is a view of the 10000th through hole viewed from above, and (f) of FIG. 11 is a view of the 10000th through hole viewed obliquely from above. (g) in Fig. 11 is a view of the 100,000th through hole as viewed from above, and (h) in Fig. 11 is a view of the 100,000th through hole as viewed obliquely from above.

參照表1和圖11可知,試驗板No.8的蓋板,從第1個孔便能夠看到壁面凹凸,同樣地,在第5000個孔、第10000個孔以及第100000個孔中也能夠看到壁面凹凸(參照圖11中的(b)、(d)、(f)、(h))。可以確認到毛刺的存在,關於通孔鍍層剝落的有無,可以零星地看到剝落,鑽頭之磨損程度較高,通孔之偏心量也大。 Referring to Table 1 and Fig. 11, it can be seen that the cover of the test plate No. 8 can see the wall surface irregularities from the first hole, and similarly, in the 5,000th hole, the 10,000th hole, and the 100,000th hole. The wall surface unevenness is seen (refer to (b), (d), (f), (h) in Fig. 11). It can be confirmed that the burr is present, and the peeling of the plating of the through hole can be seen sporadically, the degree of wear of the drill bit is high, and the amount of eccentricity of the through hole is also large.

〔評價結果及研究〕[Evaluation Results and Research]

根據將潤滑材料和黏合劑混合得到的實施例一~七所涉及之蓋板的上述試驗項目(壁面凹凸的有無、壁面毛刺的有無、通孔鍍層剝落的有無、鑽頭上切削屑之附著程度以及鑽頭之磨損程度)的評價結果進行了研究。 According to the above test items of the cover sheets according to Examples 1 to 7 obtained by mixing the lubricating material and the binder (the presence or absence of wall irregularities, the presence or absence of wall burrs, the presence or absence of peeling of the through-hole plating, the degree of adhesion of the chips on the drill, and The evaluation results of the degree of wear of the drill bit were studied.

另外,由於基本沒有銅箔變形,因此能夠實現通孔質量之提高,進而實現柔性印刷電路板品質之提高。另外,與位於潤滑層下層的PET薄膜僅由現有技術下的PET薄膜構成之蓋板相比,PET薄膜之厚度可以變薄,因此能夠降低材料成本。 In addition, since there is substantially no deformation of the copper foil, the quality of the through hole can be improved, and the quality of the flexible printed circuit board can be improved. Further, since the thickness of the PET film can be made thinner than the cover film composed of the PET film of the prior art in the PET film located under the lubricating layer, the material cost can be reduced.

關於壁面凹凸,在為第5000個孔時實施例四、五之結果呈良好,在為第10000個孔時實施例四、六、七之結果呈良好。由此可知,當潤滑材料為ZJ-22時,使潤滑材料之含有比例為50%之情況下能夠減少壁面凹凸。 Regarding the wall unevenness, the results of Examples 4 and 5 were good in the case of the 5,000th hole, and the results of Examples 4, 6, and 7 in the case of the 10000th hole were good. From this, it can be seen that when the lubricating material is ZJ-22, the wall surface unevenness can be reduced when the content ratio of the lubricating material is 50%.

關於通孔鍍層剝落的有無,在為第10000個孔時實施例三、五、六之結果呈良好。由此可知,當潤滑材料為ZJ-22時,使塗覆厚度為20μm之情況下能夠減少通孔鍍層的剝落。 Regarding the presence or absence of peeling of the via plating, the results of Examples 3, 5, and 6 were good at the 10,000th hole. From this, it can be seen that when the lubricating material is ZJ-22, peeling of the via plating can be reduced with a coating thickness of 20 μm.

關於鑽頭上切削屑之附著程度,實施例一、三之結果呈良好。由此可知,當潤滑材料為ZJ-22時,使塗覆厚度為20μm之情況下能夠減少鑽頭上切削屑之附著程度。 Regarding the degree of adhesion of the chips on the drill, the results of Examples 1 and 3 were good. From this, it can be seen that when the lubricating material is ZJ-22, the degree of adhesion of the chips on the drill can be reduced with a coating thickness of 20 μm.

〔蓋板之性能試驗二〕[Performance test of cover plate 2]

接下來,進行對本發明和現有蓋板之鑽頭折損率和鑽孔品質進行評價的試驗。 Next, tests for evaluating the bit breakage rate and the drilling quality of the present invention and the conventional cover were carried out.

作為構成本發明之蓋板的潤滑材料,使用聚乙烯(商品名:ZJ-22,JP株式會社岐阜紫膠製造所製),作為黏合劑使用異氰酸酯改性聚丁二烯(商品名:TP-1001,日本曹達株式會社製),使潤滑材料之含有比例為33%。該蓋板之塗覆厚度(膜厚)為5μm,且是在經過聚乙烯和黏合劑之攪拌處理後,在150℃下乾燥五分鐘形成。 As a lubricating material constituting the cover sheet of the present invention, polyethylene (trade name: ZJ-22, manufactured by JP Co., Ltd.) is used, and isocyanate-modified polybutadiene (trade name: TP-) is used as a binder. 1001, manufactured by Nippon Soda Co., Ltd.), the content of the lubricating material is 33%. The cover sheet had a coating thickness (film thickness) of 5 μm and was formed by drying at 150 ° C for five minutes after being subjected to agitation treatment with polyethylene and a binder.

現有的蓋板係由250μm的PET層構成,並且不含有潤滑材料。 The existing cover is composed of a 250 μm PET layer and does not contain a lubricating material.

評價結果如圖13所示。圖13係顯示鑽孔數量與鑽頭折損率(%)及通孔質量之間的關係的圖表,其中,橫軸為鑽孔數量(×1000),縱軸為鑽頭折損率(%)和通孔質量。 The evaluation results are shown in Fig. 13. Figure 13 is a graph showing the relationship between the number of drill holes and the bit breakage rate (%) and the quality of the through hole, wherein the horizontal axis is the number of holes (×1000), and the vertical axis is the bit breakage rate (%) and the through hole. quality.

通孔質量是對通孔壁面的凹凸、鍍層剝落以及變形等綜合評價後的值,且其數值越大品質越佳。另外,通孔質量利用按照規定基準定量化後的數值表示。 “-○-”線係表示本發明蓋板之鑽頭折損率(%)的曲線,“-□-”線係表示本發明蓋板之通孔質量的曲線。“-△-”線係表示現有蓋板(比較例)之鑽頭折損率(%)的曲線,“-×-”線係表示現有蓋板之通孔質量的曲線。 The through-hole quality is a value obtained by comprehensive evaluation of the unevenness of the wall surface of the through-hole, peeling of the plating layer, and deformation, and the larger the value, the better the quality. In addition, the quality of the through hole is represented by a numerical value quantified according to a predetermined standard. The "-○-" line indicates the curve of the bit breakage rate (%) of the cover of the present invention, and the "-□-" line indicates the curve of the through hole quality of the cover of the present invention. The "-?-" line indicates the curve of the bit breakage rate (%) of the conventional cover (Comparative Example), and the "-X-" line indicates the curve of the through hole quality of the conventional cover.

〔評價結果及研究〕[Evaluation Results and Research]

關於鑽頭折損,在本發明之蓋板的情況下,超過10000個孔也沒有發生鑽頭的折損,而在現有蓋板的情況下,從大約超過10000個孔時鑽頭折損率開始上升。 Regarding the bit breakage, in the case of the cover of the present invention, the bit breakage does not occur in more than 10,000 holes, and in the case of the conventional cover plate, the bit breakage rate starts to rise from about 10,000 holes.

關於通孔質量,本發明之蓋板和現有蓋板,在初期多少有些差別,但隨著鑽孔數量增多,兩者的品質均緩慢地發生劣化,品質程度上基本沒有差別。 Regarding the quality of the through hole, the cover plate of the present invention and the conventional cover plate are somewhat different in the initial stage, but as the number of drilled holes increases, the quality of both of them deteriorates slowly, and the quality is substantially the same.

由以上說明可知,根據本發明之蓋板,能夠在維持一定的通孔質量的同時抑制鑽頭折損,從而能夠延長鑽頭之壽命。 As apparent from the above description, according to the cover of the present invention, it is possible to suppress the breakage of the drill while maintaining a certain quality of the through hole, and it is possible to extend the life of the drill.

以上,對本發明之一實施方式進行了說明,但本發明除此之外,還可以進行各種變形。 Although an embodiment of the present invention has been described above, the present invention can be variously modified in addition to the above.

Claims (12)

一種鑽孔加工用蓋板,其特徵在於,在基材的至少一個表面上塗覆由潤滑材料和黏合劑構成的非水溶性潤滑層而形成,所述潤滑材料以聚乙烯為主要成分,該聚乙烯之平均粒徑為5μm~7μm,分子量為4000~5000,熔點為95℃~130℃。 A cover plate for drilling processing, characterized in that at least one surface of a substrate is formed by coating a water-insoluble lubricating layer composed of a lubricating material and a binder, and the lubricating material is mainly composed of polyethylene. The average particle diameter of ethylene is 5 μm to 7 μm, the molecular weight is 4000 to 5000, and the melting point is 95 ° C to 130 ° C. 如請求項1所述之鑽孔加工用蓋板,其中,所述潤滑材料以聚乙烯和聚四氟乙烯為主要成分。 The cover plate for drilling according to claim 1, wherein the lubricating material is mainly composed of polyethylene and polytetrafluoroethylene. 如請求項1所述之鑽孔加工用蓋板,其中,由潤滑材料和黏合劑構成的所述非水溶性潤滑層之厚度為5μm~30μm。 The cover sheet for drilling according to claim 1, wherein the water-insoluble lubricating layer composed of a lubricating material and a binder has a thickness of 5 μm to 30 μm. 如請求項1至3中任一項所述之鑽孔加工用蓋板,其中,所述潤滑材料之固體成分相對於潤滑層之總固體成分的比例為13.0wt%~23.1wt%。 The cover sheet for drilling according to any one of claims 1 to 3, wherein a ratio of a solid content of the lubricating material to a total solid content of the lubricating layer is from 13.0% by weight to 23.1% by weight. 一種鑽孔加工用蓋板之製造方法,其特徵在於,在基材的至少一個表面上塗覆由潤滑材料和黏合劑構成的非水溶性潤滑層後使其乾燥而形成,所述潤滑材料以聚乙烯為主要成分,該聚乙烯之平均粒徑為5μm~7μm,分子量為4000~5000,熔點為95℃~130℃。 A method for manufacturing a cover plate for drilling, characterized in that a water-insoluble lubricating layer composed of a lubricating material and a binder is coated on at least one surface of a substrate and dried, and the lubricating material is aggregated Ethylene is the main component, and the polyethylene has an average particle diameter of 5 μm to 7 μm, a molecular weight of 4000 to 5000, and a melting point of 95 ° C to 130 ° C. 如請求項5所述之鑽孔加工用蓋板之製造方法,其中,所述潤滑材料以聚乙烯和聚四氟乙烯為主要成分。 The method for producing a cover plate for drilling according to claim 5, wherein the lubricating material is mainly composed of polyethylene and polytetrafluoroethylene. 如請求項5所述之鑽孔加工用蓋板之製造方法,其中, 由潤滑材料和黏合劑構成的所述非水溶性潤滑層之厚度為5μm~30μm。 The method of manufacturing a cover plate for drilling according to claim 5, wherein The water-insoluble lubricating layer composed of a lubricating material and a binder has a thickness of 5 μm to 30 μm. 如請求項5至7中任一項所述之鑽孔加工用蓋板之製造方法,其中,所述潤滑材料之固體成分相對於潤滑層之總固體成分的比例為13.0wt%~23.1wt%。 The method for producing a cover sheet for drilling according to any one of claims 5 to 7, wherein a ratio of a solid content of the lubricating material to a total solid content of the lubricating layer is from 13.0% by weight to 23.1% by weight. . 一種柔性印刷電路板之製造方法,其包括通孔鑽孔工序,所述柔性印刷電路板之製造方法之特徵在於,在所述通孔鑽孔工序中,在基材的至少一個表面上塗覆由潤滑材料和黏合劑構成的非水溶性潤滑層而形成鑽孔加工用蓋板,所述潤滑材料以聚乙烯為主要成分,該聚乙烯之平均粒徑為5μm~7μm,分子量為4000~5000,熔點為95℃~130℃。 A manufacturing method of a flexible printed circuit board, comprising: a through hole drilling process, wherein the manufacturing method of the flexible printed circuit board is characterized in that, in the through hole drilling process, coating on at least one surface of the substrate a water-soluble lubricating layer composed of a lubricating material and a binder to form a cover plate for drilling, wherein the lubricating material is mainly composed of polyethylene, and the polyethylene has an average particle diameter of 5 μm to 7 μm and a molecular weight of 4000 to 5000. The melting point is 95 ° C ~ 130 ° C. 如請求項9所述之柔性印刷電路板之製造方法,其中,所述潤滑材料以聚乙烯和聚四氟乙烯為主要成分。 The method of manufacturing a flexible printed circuit board according to claim 9, wherein the lubricating material is mainly composed of polyethylene and polytetrafluoroethylene. 如請求項9所述之柔性印刷電路板之製造方法,其中,由潤滑材料和黏合劑構成的所述非水溶性潤滑層之厚度為5μm~30μm。 The method of manufacturing a flexible printed circuit board according to claim 9, wherein the water-insoluble lubricating layer composed of a lubricating material and a binder has a thickness of 5 μm to 30 μm. 如請求項9至11中任一項所述之柔性印刷電路板之製造方法,其中,所述潤滑材料之固體成分相對於潤滑層之總固體成分的比例為13.0wt%~23.1wt%。 The method of manufacturing a flexible printed circuit board according to any one of claims 9 to 11, wherein a ratio of a solid content of the lubricating material to a total solid content of the lubricating layer is from 13.0% by weight to 23.1% by weight.
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020004841A (en) * 2018-06-28 2020-01-09 日本メクトロン株式会社 Entry sheet for boring, method for manufacturing entry sheet for boring, and method for manufacturing electronic substrate
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CN112720680A (en) * 2020-12-01 2021-04-30 生益电子股份有限公司 Drilling assistance structure and drilling assistance method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008045019A (en) * 2006-08-14 2008-02-28 Asahi Kasei Chemicals Corp Sheet for drill boring processing
JP2012178550A (en) * 2011-02-04 2012-09-13 Kobe Steel Ltd Resin-coated metal plate
TWI435205B (en) * 2011-05-12 2014-04-21 Subtron Technology Co Ltd Cover structure and manufacturing method thereof
TWI538573B (en) * 2013-12-31 2016-06-11 臻鼎科技股份有限公司 The flexible printed circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1047716C (en) * 1991-02-07 1999-12-22 霍尔德斯科技有限公司 Drilling printed circuit boards and entry and backing boards therefor
EP1724104A4 (en) * 2004-03-09 2007-07-25 Nakata Coating Co Ltd Coated metal formed article and method for producing coated metal formed article
JP5011823B2 (en) * 2006-05-30 2012-08-29 三菱瓦斯化学株式会社 Method of manufacturing entry sheet for drilling
KR100889702B1 (en) * 2008-06-06 2009-03-20 주식회사 아이에스테크 Vibration adsorption sheet for drilling
KR20110128860A (en) * 2009-03-25 2011-11-30 듀폰-미츠이 폴리케미칼 가부시키가이샤 Film with attached metal layer for electronic components, production method thereof, and applications thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008045019A (en) * 2006-08-14 2008-02-28 Asahi Kasei Chemicals Corp Sheet for drill boring processing
JP2012178550A (en) * 2011-02-04 2012-09-13 Kobe Steel Ltd Resin-coated metal plate
TWI435205B (en) * 2011-05-12 2014-04-21 Subtron Technology Co Ltd Cover structure and manufacturing method thereof
TWI538573B (en) * 2013-12-31 2016-06-11 臻鼎科技股份有限公司 The flexible printed circuit board

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