CN108419432A - The manufacturing method of cover board, the manufacturing method of cover board and flexible PCB - Google Patents
The manufacturing method of cover board, the manufacturing method of cover board and flexible PCB Download PDFInfo
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- CN108419432A CN108419432A CN201780003034.8A CN201780003034A CN108419432A CN 108419432 A CN108419432 A CN 108419432A CN 201780003034 A CN201780003034 A CN 201780003034A CN 108419432 A CN108419432 A CN 108419432A
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- China
- Prior art keywords
- cover board
- hole
- lubriation material
- polyethylene
- manufacturing
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B47/00—Constructional features of components specially designed for boring or drilling machines; Accessories therefor
- B23B47/28—Drill jigs for workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
- C10M107/02—Hydrocarbon polymers; Hydrocarbon polymers modified by oxidation
- C10M107/04—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
- C10M107/38—Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
The present invention provides one kind and extending bit life by inhibiting bit damage, drilling processing cover board, the manufacturing method of drilling processing cover board and the manufacturing method of flexible PCB for so that the thru-hole quality after drilling processing is optimized.The drilling processing of the present invention is to coat the water-insoluble lubricant layer being made of lubriation material and adhesive at least one surface of a substrate and formed with cover board.
Description
Technical field
The present invention relates to cover board (entry sheet), the manufacturing methods of the manufacturing method of cover board and flexible PCB.
Background technology
When producing flexible printed circuit board (Flexible Printed Circuit, FPC) in batches, as batch production
It has been known that there is roll-to-roll modes for mode.The initial period of the manufacturing process of flexible PCB as through-hole structure, there are through-holes
Drilling operating, through-hole plating process.Later, by resist coating process, pattern formation process, etching work procedure and portion of terminal
Flexible PCB is made in surface treatment procedure etc..
In these processes, through-hole drilling operating is the initial process for the flexible PCB for manufacturing through-hole structure, in the work
In sequence, application is the boring method (drilling method) for using the NC drilling equipments for having roll-to-roll conveying function.NC is bored
Aperture apparatus can drill out the minimum hole up to 40 μm or so can be overlapped multiple copper clad laminates (Flexible equipped with vertical shaft
Cupper Clad Laminate, FCCL：Substrate) carry out drilling processing.About the overlapping quantity of copper clad laminate, usually two
Open (two layers), four (four layers), five (five layers), eight (eight layers).
In addition, copper clad laminate is the critical piece for constituting flexible printed circuit board, for such as lower structure：It is 12 in thickness
μm~100 μm of film-form insulator " counterdie (such as Kapton) " on form adhesive layer, and then at an upper portion thereof into one
Step is fitted with the conductor foil (such as copper foil) that thickness is 12 μm~50 μm or so.Portion of terminal or weld part are covered with external application insulator
It is protected.As the material of insulator, polyimides or polyester (PET are used：Polyethylene Terephthalate)
Etc. a variety of plastics.Conductor is usually using copper foil.Adhesive layer mainly uses the adhesive etc. of epoxy resin, crylic acid resin.
Since flexible printed circuit board can fold, becoming can not in the interconnecting piece of mobile phone, personal computer or digital camera etc.
The material lacked.
As the drilling method of copper clad laminate, the following method of generally use：So that copper clad laminate is overlapped, its most
Top configures the method that aluminium foil etc. carries out drilling processing.In recent years, as the requirement of the reliability to printed wiring plate material carries
High and densification development needs the drilling processing for the high quality for improving hole site precision or reducing Hole Wall Roughness etc.,
In order to cope with this demand, it is proposed that use the Drilling operation method of the cover plate for drilling hole of polyethylene glycol (for example, referring to patent document
1) or consider from the recycling easiness of aluminium sheet overlay film and cover board as main component is made with water-soluble lubricant
Deng, and obtained practicality.In recent years, in order to improve flexibility and prevent cut, in the boring lids of the NC of flexible printed circuit board
PET (Polyethylene Terephthalate) film with hardness is used in plate.
Existing technical literature
Patent document
Patent document 1：JP Laid-Open 4-92488 bulletins
Invention content
But water-soluble lubricating material is tacky, one touches and will be stained with fingerprint so that operability is deteriorated.In addition, in recent years
Come, in order to realize the miniaturization and lighting of printed wiring version, is sent out with the pathization of fining and through-hole to Wiring pattern
It opens up, the resin component used in PET film can be attached on the wall surface of drill bit, especially carried outPath below
When processing, the case where being lost there is also drill bit, drill bit can be caused to lose the bad, lost of life at this time, and through-hole wall surface is recessed
Convex, burr becomes notable.
The project of the present invention is to be：Offer is a kind of to extend bit life by inhibiting drill bit to lose, and drilling is inhibited to add
The manufacturing method and flexible electrical of the bumps of through-hole wall surface after work, the drilling processing cover board of burr, drilling processing cover board
The manufacturing method of road plate.
In order to solve the above problems, drilling processing cover board of the invention is characterized in that：In at least one table of base material
The water-insoluble lubricant layer being made of lubriation material and adhesive is coated on face and is formed.
In the present invention as stated above, preferably lubriation material is using polyethylene as main component, and the average grain diameter of the polyethylene is 5 μm~
7 μm, molecular weight is 4000~5000, and fusing point is 95 DEG C~130 DEG C.
In the present invention as stated above, preferably lubriation material is using polyethylene and polytetrafluoroethylene (PTFE) as main component.
In the present invention as stated above, the thickness for the water-insoluble lubricant layer being preferably made of lubriation material and adhesive be 5 μm~
30μm。
In the present invention as stated above, preferably the solid constituent of lubriation material is relative to the ratio of the total solid content of lubricant layer
13.0wt%~23.1wt%.
In the present invention as stated above, as the base material that can be applied, in addition to resin composition film (thickness is 125 μm~250 μm)
Outside, metallic film (0.1mm~0.2mm) or phenolic aldehyde cardboard etc. can also be enumerated.
In addition, in order to solve the above problems, the manufacturing method of drilling processing cover board of the invention is characterized in that：Pass through
Be dried after coating the water-insoluble lubricant layer being made of lubriation material and adhesive at least one surface of a substrate and
It is formed.
In the present invention as stated above, preferably lubriation material is using polyethylene as main component, and the average grain diameter of the polyethylene is 5 μm~
7 μm, molecular weight is 4000~5000, and fusing point is 95 DEG C~130 DEG C.
In the present invention as stated above, preferably lubriation material is using polyethylene and polytetrafluoroethylene (PTFE) as main component.
In the present invention as stated above, the thickness for the water-insoluble lubricant layer being preferably made of lubriation material and adhesive be 5 μm~
30μm。
In the present invention as stated above, preferably the solid constituent of lubriation material is relative to the ratio of the total solid content of lubricant layer
13.0wt%~23.1wt%.
In the present invention as stated above, as the base material that can be applied, in addition to resin composition film (thickness is 125 μm~250 μm)
Outside, metallic film (0.1mm~0.2mm) or phenolic aldehyde cardboard etc. can also be enumerated.
In addition, in order to solve the above problems, the manufacturing method of flexible printed circuit board of the invention is characterized in that：Logical
In hole drilling process, the water-insoluble lubricant layer being made of lubriation material and adhesive is coated at least one surface of a substrate
And form drilling processing cover board.
In the present invention as stated above, preferably lubriation material is using polyethylene as main component, and the average grain diameter of the polyethylene is 5 μm~
7 μm, molecular weight is 4000~5000, and fusing point is 95 DEG C~130 DEG C.
In the present invention as stated above, preferably lubriation material is using polyethylene and polytetrafluoroethylene (PTFE) as main component.
In the present invention as stated above, the thickness for the water-insoluble lubricant layer being preferably made of lubriation material and adhesive be 5 μm~
30μm。
In the present invention as stated above, preferably the solid constituent of lubriation material is relative to the ratio of the total solid content of lubricant layer
13.0wt%~23.1wt%.
In the present invention as stated above, as the base material that can be applied, in addition to resin composition film (thickness is 125 μm~250 μm)
Outside, metallic film (0.1mm~0.2mm) or phenolic aldehyde cardboard etc. can also be enumerated.
Invention effect
Bit life can be extended, after making drilling processing by inhibiting bit damage (losing) according to the present invention
Thru-hole quality is optimized.
Description of the drawings
Fig. 1 is the sectional view for the structure for indicating drilling processing cover board according to the present invention.
(a) in Fig. 2 is the sectional view with the laminated body after through-hole working process after indicating bottom outlet working process, is (b)
It indicates the processing of omission bottom outlet and directly implements the sectional view of the laminated body after through-hole working process.
(a) and (b) in Fig. 3 is the figure for illustrating thru-hole quality, is (c) figure for the state of wear for indicating drill bit.
Fig. 4 is the figure for indicating to test through-hole surfaces state of the cover board of No.1 after drilling processing.
Fig. 5 is the figure for indicating to test through-hole surfaces state of the cover board of No.2 after drilling processing.
Fig. 6 is the figure for indicating to test through-hole surfaces state of the cover board of No.3 after drilling processing.
Fig. 7 is the figure for indicating to test through-hole surfaces state of the cover board of No.4 after drilling processing.
Fig. 8 is the figure for indicating to test through-hole surfaces state of the cover board of No.5 after drilling processing.
Fig. 9 is the figure for indicating to test through-hole surfaces state of the cover board of No.6 after drilling processing.
Figure 10 is the figure for indicating to test through-hole surfaces state of the cover board of No.7 after drilling processing.
Figure 11 is the figure for indicating to test through-hole surfaces state of the cover board of No.8 after drilling processing.
Figure 12 is the figure for indicating to test through-hole surfaces state of the cover board of No.9 after drilling processing.
Figure 13 is the chart for indicating the relationship between drilling hole amount, drill bit damage rate and thru-hole quality.
Symbol description
5 ... drill bits
10 ... cover boards
12 ... lubricant layers
14、15…PET
16 ... bottom outlets
17 ... through-holes
20 ... copper-clad laminated boards
30 ... PET films
Specific implementation mode
[cover board]
Hereinafter, being illustrated to the cover board involved by an embodiment of the present invention with reference to attached drawing.
Fig. 1 is to indicate that the cover plate for drilling hole 10 of the present invention is coated in the copper clad layers stack 20 being made of multiple copper clad laminates
On state diagrammatic cross-section.The cover plate for drilling hole 10 of the present invention is by PET film 14 and the upside table for being formed in PET film 14
Water-insoluble lubricant layer 12 on face is constituted.When drill bit 5 moves downward, successively penetrate through lubricant layer 12, PET film 14 and
Copper clad layers stack 20, after reaching prescribed depth, drill bit 5 is moved and is detached from from hole (through-hole) upward.In addition, in Fig. 1,
PET film 30 is formed on the downside surface of copper clad layers stack 20.
The thickness for constituting the PET film 14 of the cover board 10 of the present invention is 125 μm~250 μm, further preferably 125 μm.
The thickness (coating thickness) for the water-insoluble lubricant layer being made of lubriation material and adhesive is preferably 5 μm~30 μm.
Lubricant layer 12 is made of lubriation material and adhesive, is preferably butyl acetate, ethyl acetate, first as its solvent
Benzene.Lubriation material is polyethylene, and average grain diameter is preferably 5 μm~7 μm.It it is preferably isocyanate-modified gather as adhesive
The polybutadiene that butadiene or boiling are modified.About the mixed method of these substances, as long as the known method industrially used,
Just it is not particularly limited.Specifically, using roll, kneader or other kneading devices, above-mentioned composition is suitably heated
Or it heats and is formed as uniform mixture.
[manufacturing method of cover board]
Cover board be by agitating procedure agitating procedure, coating, drying process and be made.
First, with the solid constituent of lubriation material relative to the total solid content of lubricant layer ratio for 13.0wt%~
The mode of 23.1wt% is stirred 10 minutes using kneading device and obtains mixture.At this point, lubriation material is in be scattered in solvent
State.
Then, using coating machine (JP Kobayashi Engineering Works, Ltd. system, COATER KS-001) to the mixing after being stirred
Object implements coating, drying process, and the cover board that film thickness is 5 μm~20 μm is obtained after so that the solvent in mixture is volatilized.
When manufacturing cover board, coating machine is set as condition as shown below, but it is not limited to this.
The condition of ＜ coating machines sets ＞
Linear velocity is set as 7 (m/min), and MR/AR speed is set as 6.5/8.0, and for tension, the first uncoiler is set as
7kg, drying machine are set as 12kg, and DR is set as 3kg/cm2, winding is set as 1N, dryer temperature be set as 120 DEG C, 150
℃.In used coating machine, dryer temperature is there are the first range and the second range, and when implementation, the first range is set as
120 DEG C, the second range be set as 150 DEG C.Here, MR is the abbreviation of metering roll, AR is the abbreviation for applicator roll, the speed of MR, AR
Degree is the relative value (value specific to used coating machine) relative to linear velocity without unit.In addition, DR is the contracting of dancer roll
It writes.
In addition, the polyethylene used as lubriation material in the cover board of the present invention, it is 5 that average grain diameter, which can be suitably used,
μm~7 μm of polyethylene.If grain size is too small, the function of lubricity is assigned to lubricant layer to be reduced, and on the other hand, if grain size
Excessive, then chip is liable to stick on drill bit.In addition, the shape of polyethylene particle can be spherical, rectangular, cylindricality, aciculiform, plate
Shape is unsetting etc., but in the present invention, from the viewpoint of assigning lubricity to lubricant layer, preferably uses spheric granules
Form, thereby, it is possible to while assigning high-lubricity, chip be made to be not easy to be attached on drill bit.Pass through being averaged polyethylene
Grain size is set within the above range, and polyethylene is made to be protruded from the surface of lubricant layer, to make cover board have lubricity appropriate.
It is preferred that with the mixed proportion that the total solid content (100wt%) relative to lubricant layer is 13.0wt%~23.1wt%
Contain polyethylene particle.If its amount is very few, the lubricity of lubricant layer reduces, if in addition, its amount is excessive, chip
It is liable to stick on drill bit.In addition, the fusing point of polyethylene is preferably 95 DEG C~130 DEG C.If its fusing point is too low, the preservation of cover board
Property reduce, or lubricant layer coating after drying process in, polyethylene itself melts away, to hinder the lubrication of lubricant layer
Property, on the other hand, if its fusing point is excessively high, the concave-convex surface of lubricant layer can become notable.In addition, the measurement about fusing point, it can
To use conventionally known method, such as measured using differential scanning calorimeter (DSC).In addition, the molecular weight of polyethylene is excellent
It is selected as 4000~5000.
[manufacturing method of flexible printed circuit board]
As the cover board of the present invention to be layered in the method for producing flexible printed circuit board on copper-clad laminated body 20 in batches, adopt
With roll-to-roll mode.By through-hole drilling operating, through-hole plating process, resist coating process, pattern exposure process, erosion
After carving process and terminal surfaces treatment process etc., flexible PCB is made.
Through-hole drilling operating is carried out using the NC drilling equipments (non-icon) for having roll-to-roll conveying function.NC drilling dresses
The hole of 0.1mm or so can be drilled out by setting, and be equipped with vertical shaft.In a manner of clamping copper clad layers stack 20, in copper clad layers stack 20
Upside overlapping the present invention cover board 10 and downside overlapping PET film 30 after, as shown in Fig. 2 (b), driving drill bit (non-icon)
Rotation, and drill bit is made to be moved downward from the top of cover board 10, to form through-hole 17.In the prior art, implementing such as Fig. 2
(a) through-hole working process is carried out again after bottom outlet working process shown in (processing for forming bottom outlet 16), but in the present invention, it is right
In be laminated with the present invention cover board 10 copper clad layers stack 20, it is convenient to omit bottom outlet working process and directly implement at through-hole processing
Reason.Therefore, because bottom outlet processing operation is can be omitted, so manufacture processing time can be shortened, and thus, it is possible to realities
It is existing cost effective.
When carrying out drilling processing to flexible printed circuit board etc. using drill bit, the cover board configuration of the present invention is printed in flexibility
Top layer's (drill bit approaching side) of printed circuit board etc., also, as needed supporting plate (also referred to as backing plate (back is configured in lowest level
Up board)), carry out drilling processing after so that these plates is overlapped.The flexible printed circuit board processed is not particularly limited, can be with
For any one in single-sided circuit board, double-sided PCB, multilayer circuit board.In addition, the material about flexible printed circuit board,
Can be any one in phenolic resin, epoxylite, polyimide resin, polyester resin, cyanate resin, fluorine resin etc.
Kind, or, or utilize the fiber-reinforced resin after the reinforcings such as glass fibre.
In addition, the cover board of the present invention is seldom sent out when being drilled as described as follows using the drill bit of minor diameter
Life slides laterally, and can carry out the drilling processing of positional precision high (centering degree is high), thus may of course be used for aperture for 1mm~
The drilling processing of 6mm or so can be applicable to the drilling processing of small-bore, and it is 0.1mm~0.4mm's to be particularly suitable for aperture
Drilling processing is more suitable for the drilling processing that aperture is 0.1mm~0.3mm, is best suited for the brill that aperture is 0.1mm~0.2mm
Hole machined.
[performance test 1 of cover board]
Hereinafter, to without containing lubriation material cover board and change the mixed proportions of three kinds of lubriation materials, coating thickness,
Cover board made of drying condition carries out NC drilling processings, to the 1st hole, the 5000th hole, the 10000th hole and the 100000th
Whether there is or not, wall surface burrs that whether there is or not, interface peel, whether there is or not, the 1st holes and the 100000th hole through-hole coating stripping for the wall surface bumps in hole
Whether there is or not, the 1st hole and the 100000th hole through-hole copper foil deformations whether there is or not, drill bit loses (durability of drill bit) whether there is or not cut on, drill bit
The degree of adhesion of bits, the degree of wear of drill bit and centering degree (bore position precision) are evaluated.To nine kinds of cover boards in total
(breadboard No.1~No.9) is tested, and evaluation result is recorded in following table 1.
Table 1
Then, the benchmark of evaluation is illustrated.In the evaluation of wall surface bumps, the basic use " ◎ " without wall surface bumps
Indicate there is concave-convex but basic chipless to be attached to being indicated with "○" for the influences such as drill bit, there is concave-convex but chip to be attached to drill bit etc.
The smaller use " △ " of influence indicate there are bumps and plating may be caused bad etc. because chip is attached to the influence of drill bit etc.,
It is indicated with "×" to non-serviceable.For example, the figure on the left of Fig. 3 (a) indicates the state of no wall surface bumps, the chart on right side
Show that there are the states of wall surface bumps.
In the evaluation of burr, not use " ◎ " expression of burr, more or less burr but the use for not influencing thru-hole quality
"○" indicates, jagged but indicate influencing smaller use " △ " caused by thru-hole quality, jagged and to thru-hole quality institute
The influence that brings is no small to be indicated with "×".
It in the evaluation of interface peel, is not all removed in whole cover boards of No.1~No.9, in the evaluation of copper foil deformation
In, it is not all deformed in whole cover boards of No.1~No.9, in the evaluation that drill bit is lost, in whole cover boards of No.1~No.9
All do not lose.
＜ embodiments 1 (breadboard No.1) ＞
As the lubriation material for constituting the cover board involved by embodiment 1, polyethylene (trade name is used：ZJ-22, JP plants of formulas
Commercial firm's qi mound lac manufacture is made), isocyanate-modified polybutadiene (trade name is used as adhesive：TP-1001, day
This Cao reaches Co. Ltd. system), it is 50% to make the content ratio of lubriation material.The coating thickness (film thickness) of the cover board is 20 μm,
After the stir process of polyethylene and adhesive, formed within dry five minutes at 150 DEG C.
Fig. 4 (a) is the figure of the 1st through-hole viewed from above, and Fig. 4 (b) is the figure from oblique upper.Fig. 4 (c) is from upper
The figure of the 5000th through-hole of side's observation, Fig. 4 (d) is the figure from oblique upper.Fig. 4 (e) is 10000th viewed from above logical
The figure in hole, Fig. 4 (f) are the figures from oblique upper.Fig. 4 (g) is the figure of the 100000th through-hole viewed from above, and Fig. 4 (h) is
Figure from oblique upper.
With reference to table 1 it is found that the cover board of breadboard No.1, until the 5000th hole substantially without wall surface it is concave-convex (with reference to Fig. 4
(b), (d)), also, about the stripping of through-hole coating whether there is or not the degree of adhesion of chip and the degree of wear of drill bit on, drill bit, knots
Fruit is good.
＜ embodiments 2 (breadboard No.2) ＞
As the lubriation material for constituting the cover board involved by embodiment 2, polyethylene (trade name is used：ZJ-22, JP plants of formulas
Commercial firm's qi mound lac manufacture is made), isocyanate-modified polybutadiene (trade name is used as adhesive：TP-1001, day
This Cao reaches Co. Ltd. system), it is 33% to make the content ratio of lubriation material.The coating thickness (film thickness) of the cover board is 10 μm,
It is two minutes dry at 120 DEG C after the stir process of polyethylene and adhesive, and then dry three minutes at 150 DEG C form.
Fig. 5 (a) is the figure of the 1st through-hole viewed from above, and Fig. 5 (b) is the figure from oblique upper.Fig. 5 (c) is from upper
The figure of the 5000th through-hole of side's observation, Fig. 5 (d) is the figure from oblique upper.Fig. 5 (e) is 10000th viewed from above logical
The figure in hole, Fig. 5 (f) are the figures from oblique upper.Fig. 5 (g) is the figure of the 100000th through-hole viewed from above, and Fig. 5 (h) is
Figure from oblique upper.
With reference to table 1 it is found that the cover board of breadboard No.2, until the 10000th hole can see that slightly existing wall surface is recessed
Convex (with reference to Fig. 5 (b), (d), (f)).About through-hole coating stripping whether there is or not and centering degree, as a result substantially well.About on drill bit
The degree of adhesion of chip slightly becomes more compared with Example 1, but to influence lesser extent to thru-hole quality.About drill bit
The degree of wear, it is how many that abrasion occurs but is also less than the degree replaced.
＜ embodiments 3 (breadboard No.3) ＞
As the lubriation material for constituting the cover board involved by embodiment 3, polyethylene (trade name is used：ZJ-22, JP plants of formulas
Commercial firm's qi mound lac manufacture is made), isocyanate-modified polybutadiene (trade name is used as adhesive：TP-1001, day
This Cao reaches Co. Ltd. system), it is 33% to make the content ratio of lubriation material.The coating thickness (film thickness) of the cover board is 20 μm,
It is two minutes dry at 120 DEG C after the stir process of polyethylene and adhesive, and then dry three minutes at 150 DEG C form.
Fig. 6 (a) is the figure of the 1st through-hole viewed from above, and Fig. 6 (b) is the figure from oblique upper.Fig. 6 (c) is from upper
The figure of the 5000th through-hole of side's observation, Fig. 6 (d) is the figure from oblique upper.Fig. 6 (e) is 10000th viewed from above logical
The figure in hole, Fig. 6 (f) are the figures from oblique upper.Fig. 6 (g) is the figure of the 100000th through-hole viewed from above, and Fig. 6 (h) is
Figure from oblique upper.
With reference to table 1 it is found that the cover board of breadboard No.3, until the 10000th hole can see that slightly existing wall surface is recessed
Convex (with reference to Fig. 6 (b), (d), (f)).About the stripping of through-hole coating, whether there is or not degree of adhesion, the abrasion journeys of drill bit of chip on, drill bit
Degree and centering degree, result are substantially good.
＜ embodiments 4 (breadboard No.4) ＞
As the lubriation material for constituting the cover board involved by embodiment 4, polyethylene (trade name is used：ZJ-22, JP plants of formulas
Commercial firm's qi mound lac manufacture is made), isocyanate-modified polybutadiene (trade name is used as adhesive：TP-1001, day
This Cao reaches Co. Ltd. system), it is 50% to make the content ratio of lubriation material.The coating thickness (film thickness) of the cover board is 10 μm, is
It is two minutes dry at 120 DEG C after the stir process of polyethylene and adhesive, and then dry three minutes at 150 DEG C form.
Fig. 7 (a) is the figure of the 1st through-hole viewed from above, and Fig. 7 (b) is the figure from oblique upper.Fig. 7 (c) is from upper
The figure of the 5000th through-hole of side's observation, Fig. 7 (d) is the figure from oblique upper.Fig. 7 (e) is 10000th viewed from above logical
The figure in hole, Fig. 7 (f) are the figures from oblique upper.Fig. 7 (g) is the figure of the 100000th through-hole viewed from above, and Fig. 7 (h) is
Figure from oblique upper.
With reference to table 1 it is found that breadboard No.4 cover board, until the 10000th hole be all substantially not visible wall surface bumps, and
Slightly see that wall surface is concave-convex (with reference to Fig. 7 (b), (d), (f), (h)) in 100000th hole.Burr slightly exists, but to through-hole
Quality influences smaller.In addition, about the stripping of through-hole coating, how much whether there is or not can see some strippings, but be to thru-hole quality shadow
Ring lesser extent.
＜ embodiments 5 (breadboard No.5) ＞
As the lubriation material for constituting the cover board involved by embodiment 5, polyethylene (trade name is used：ZJ-22, JP plants of formulas
Commercial firm's qi mound lac manufacture is made), isocyanate-modified polybutadiene (trade name is used as adhesive：TP-1001, day
This Cao reaches Co. Ltd. system), it is 50% to make the content ratio of lubriation material.The coating thickness (film thickness) of the cover board is 20 μm,
It is two minutes dry at 120 DEG C after the stir process of polyethylene and adhesive, and then dry three minutes at 150 DEG C form.
Fig. 8 (a) is the figure of the 1st through-hole viewed from above, and Fig. 8 (b) is the figure from oblique upper.Fig. 8 (c) is from upper
The figure of the 5000th through-hole of side's observation, Fig. 8 (d) is the figure from oblique upper.Fig. 8 (e) is 10000th viewed from above logical
The figure in hole, Fig. 8 (f) are the figures from oblique upper.Fig. 8 (g) is the figure of the 100000th through-hole viewed from above, and Fig. 8 (h) is
Figure from oblique upper.
With reference to table 1 it is found that breadboard No.5 cover board, until the 5000th hole be all substantially not visible wall surface bumps, and
10000th hole and the 100000th hole slightly see that wall surface is concave-convex (with reference to Fig. 8 (b), (d), (f), (h)).About through-hole
Whether there is or not result is substantially good for coating stripping.About the degree of adhesion of chip on drill bit, slightly become more compared with Example 1, but
It is to influence lesser extent to thru-hole quality.It is how many that abrasion occurs but is also less than to be replaced about the degree of wear of drill bit
Degree.
＜ embodiments 6 (breadboard No.6) ＞
As the lubriation material for constituting the cover board involved by embodiment 6, polyethylene (trade name is used：ZJ-24FA, JP plants
The qi mound lac manufacture of formula commercial firm is made), the adhesive as mixing uses isocyanate-modified polybutadiene (trade name：
TP-1001, Tso Tat Co., Ltd., Japan's system), it is 33% to make the content ratio of polyethylene (lubriation material).The coating of the cover board is thick
It is 10 μm to spend (film thickness), two minutes dry at 120 DEG C after the stir process of polyethylene and adhesive, and then at 150 DEG C
It is formed within dry three minutes.
Fig. 9 (a) is the figure of the 1st through-hole viewed from above, and Fig. 9 (b) is the figure from oblique upper.Fig. 9 (c) is from upper
The figure of the 5000th through-hole of side's observation, Fig. 9 (d) is the figure from oblique upper.Fig. 9 (e) is 10000th viewed from above logical
The figure in hole, Fig. 9 (f) are the figures from oblique upper.Fig. 9 (g) is the figure of the 100000th through-hole viewed from above, and Fig. 9 (h) is
Figure from oblique upper.
With reference to table 1 it is found that the cover board of breadboard No.6, slightly sees wall surface bumps in the 5000th hole, and the 10000th
It is concave-convex (with reference to Fig. 9 (b), (d), (f), (h)) that a hole is substantially not visible wall surface.About the stripping of through-hole coating, whether there is or not result bases
This is good.In addition, can slightly see burr, but to influence lesser extent to thru-hole quality.About chip on drill bit
Degree of adhesion, compared with Example 1 slightly become it is more, but on thru-hole quality influence lesser extent.
＜ embodiments 7 (breadboard No.7) ＞
As the lubriation material for constituting the cover board involved by embodiment 7, polyethylene (trade name is used：XD-448 (microlites
Wax), the qi mound lac manufacture of JP Co., Ltd. is made), isocyanate-modified polybutadiene (trade name is used as adhesive：
TP-1001, Tso Tat Co., Ltd., Japan's system), it is 33% to make the content ratio of lubriation material.The coating thickness (film thickness) of the cover board
It is 10 μm, it is two minutes dry at 120 DEG C after the stir process of polyethylene and adhesive and then three points dry at 150 DEG C
It is bell at.
Figure 10 (a) is the figure of the 1st through-hole viewed from above, and Figure 10 (b) is the figure from oblique upper.Figure 10 (c) is
The figure of 5000th through-hole viewed from above, Figure 10 (d) is the figure from oblique upper.Figure 10 (e) is viewed from above
The figure of 10000 through-holes, Figure 10 (f) are the figures from oblique upper.Figure 10 (g) is the 100000th through-hole viewed from above
Figure, Figure 10 (h) is the figure from oblique upper.
With reference to table 1 it is found that breadboard No.7 cover board, until the 5000th hole can slightly see wall surface bumps, and
It is concave-convex (0 (b), (d), (f), (h) referring to Fig.1) it to be substantially not visible wall surface in the 10000th hole and the 100000th hole.Burr is slightly
Micro- presence, but to influence lesser extent to thru-hole quality.About through-hole coating stripping whether there is or not, how much can see stripping, but
It is to influence lesser extent to thru-hole quality.It is deformed about through-hole copper foil, deformation can be sporadicly seen in the 10000th hole
Position, but to influence lesser extent to thru-hole quality.About the degree of adhesion of chip on drill bit, compared with Example 1 slightly
Be slightly variable it is more, but on thru-hole quality influence lesser extent.It is how many that abrasion occurs but is also less than about the degree of wear of drill bit
The degree replaced.
＜ embodiments 8 (breadboard No.9) ＞
As the lubriation material for constituting the cover board involved by embodiment 8, polyethylene (trade name is used：ZJ-22, JP plants of formulas
Commercial firm's qi mound lac manufacture is made), isocyanate-modified polybutadiene (trade name is used as adhesive：TP-1001, day
This Cao reaches Co. Ltd. system), it is 33% to make the content ratio of lubriation material.The coating thickness (film thickness) of the cover board is 30 μm,
It is two minutes dry at 120 DEG C after the stir process of polyethylene and adhesive, and then dry three minutes at 150 DEG C form.
Figure 12 (a) is the figure of the 1st through-hole viewed from above, and Figure 12 (b) is the figure from oblique upper.Figure 12 (c) is
The figure of 5000th through-hole viewed from above, Figure 12 (d) is the figure from oblique upper.Figure 12 (e) is viewed from above
The figure of 10000 through-holes, Figure 12 (f) are the figures from oblique upper.Figure 12 (g) is the 100000th through-hole viewed from above
Figure, Figure 12 (h) is the figure from oblique upper.
With reference to table 1 it is found that the cover board of breadboard No.9, until the 10000th hole can see that slightly existing wall surface is recessed
Convex (2 (b), (d), (f) referring to Fig.1).About the stripping of through-hole coating, whether there is or not the abrasions of the degree of adhesion, drill bit of chip on, drill bit
Degree and centering degree are as a result substantially good.
＜ comparative examples 1 (breadboard No.8) ＞
Cover board involved by comparative example 1 is to be formed using 250 μm of PET film, and do not contain lubriation material.
Figure 11 (a) is the figure of the 1st through-hole viewed from above, and Figure 11 (b) is the figure from oblique upper.Figure 11 (c) is
The figure of 5000th through-hole viewed from above, Figure 11 (d) is the figure from oblique upper.Figure 11 (e) is viewed from above
The figure of 10000 through-holes, Figure 11 (f) are the figures from oblique upper.Figure 11 (g) is the 100000th through-hole viewed from above
Figure, Figure 11 (h) is the figure of the 100000th through-hole from oblique upper.
With reference to table 1 and Figure 11 it is found that the cover board of breadboard No.8, from the 1st hole just it can be seen that wall surface is concave-convex, equally
Ground, can also be seen that in the 5000th hole, the 10000th hole and the 100000th hole wall surface it is concave-convex (referring to Fig.1 1 (b),
(d)、(f)、(h)).It can be confirmed that burr exists, whether there is or not can sporadically see stripping, drill bit about the stripping of through-hole coating
The degree of wear it is higher, the eccentricity of through-hole is also big.
[evaluation result and investigation]
The above-mentioned pilot project of cover board involved by the Examples 1 to 7 for being mixed to get lubriation material and adhesive
(whether there is or not, wall surface burrs that whether there is or not, through-hole coating stripping, whether there is or not the degree of adhesion of chip and the mills of drill bit on, drill bit for wall surface bumps
Damage degree) evaluation result investigated.
In addition, due to being deformed substantially without copper foil, it can realize that thru-hole quality improves, and then realize flexible printed circuit board
Quality advance.In addition, with positioned at the PET film of lubricant layer lower layer only by the cover board that the PET film of the prior art is constituted compared with,
The thickness of PET film can be thinning, therefore can reduce material cost.
About wall surface bumps, the result of embodiment 4,5 is good when for the 5000th hole, for the 10000th Kong Shishi
The result of example 4,6,7 is applied in good.It follows that when lubriation material is ZJ-22, it is 50% to make the content ratio of lubriation material
In the case of can reduce wall surface bumps.About the stripping of through-hole coating, whether there is or not the embodiments 3,5,6 when for the 10000th hole
As a result it is in good.It follows that when lubriation material is ZJ-22, through-hole can be reduced in the case of making coating thickness be 20 μm
Coating is removed.
About the degree of adhesion of chip on drill bit, the result of embodiment 1,3 is good.It follows that when lubriation material is ZJ-
When 22, the degree of adhesion of chip on drill bit can be reduced in the case of making coating thickness be 20 μm.
[performance test 2 of cover board]
Next, carrying out the experiment that drill bit damage rate and drilling quality to the present invention and existing cover board are evaluated.
As the lubriation material for the cover board for constituting the present invention, polyethylene (trade name is used：ZJ-22, JP Co., Ltd. qi are abundant
Lac manufacture is made), isocyanate-modified polybutadiene (trade name is used as adhesive：TP-1001, Japanese Cao reach strain
Formula commercial firm system), it is 33% to make the content ratio of lubriation material.The coating thickness (film thickness) of the cover board is 5 μm, in polyethylene and is glued
After the stir process of mixture, formed within dry five minutes at 150 DEG C.Existing cover board is made of 250 μm of pet layer, and not
Contain lubriation material.
Evaluation result is as shown in figure 13.Figure 13 is to indicate to close between drilling hole amount and drill bit damage rate (%) and thru-hole quality
The chart of system, wherein horizontal axis is drilling hole amount (× 1000), and the longitudinal axis is drill bit damage rate (%) and thru-hole quality.Thru-hole quality
It is the value after the overall merits such as, coating stripping concave-convex to through-hole wall surface and deformation, and its numerical value is bigger, quality is better.In addition,
Thru-hole quality is utilized to be indicated according to the numerical value after regulation benchmark quantification."-zero-" line is the drill bit folding for indicating cover board of the present invention
The curve of loss rate (%), "- -" line are the curves for the thru-hole quality for indicating cover board of the present invention."-△-" line is to indicate existing
There is the curve of the drill bit damage rate (%) of cover board (comparative example), "-×-" line is the song for the thru-hole quality for indicating existing cover board
Line.
[evaluation result and investigation]
It is lost about drill bit, in the case of the cover board of the present invention, more than 10000 holes are also without the folding of generation drill bit
Damage, and in the case of existing cover board, drill bit damage rate is begun to ramp up when from about more than 10000 holes.About thru-hole quality,
The cover board and existing cover board of the present invention, more or less difference in the early stage, but as drilling hole amount increases, the quality of the two is slow
Ground deteriorates, and is had essentially no difference in degree.
As known from the above, cover board according to the present invention can inhibit drill bit folding while maintaining certain thru-hole quality
Damage, so as to extend the service life of drill bit.
More than, one embodiment of the present invention is illustrated, but the present invention is in addition to this it is possible to carry out various changes
Shape.
Claims (15)
1. a kind of drilling processing cover board, which is characterized in that
The water-insoluble lubricant layer being made of lubriation material and adhesive is coated at least one surface of a substrate and is formed.
2. drilling processing cover board according to claim 1, which is characterized in that
The lubriation material is using polyethylene as main component, and the average grain diameter of the polyethylene is 5 μm~7 μm, molecular weight 4000
~5000, fusing point is 95 DEG C~130 DEG C.
3. drilling processing cover board according to claim 1, which is characterized in that
The lubriation material is using polyethylene and polytetrafluoroethylene (PTFE) as main component.
4. drilling processing cover board according to any one of claim 1 to 3, which is characterized in that
The thickness for the water-insoluble lubricant layer being made of lubriation material and adhesive is 5 μm~30 μm.
5. drilling processing cover board according to any one of claim 1 to 4, which is characterized in that
The solid constituent of the lubriation material is 13.0wt%~23.1wt% relative to the ratio of the total solid content of lubricant layer.
6. a kind of manufacturing method of drilling processing cover board, which is characterized in that
It is done after coating the water-insoluble lubricant layer being made of lubriation material and adhesive at least one surface of a substrate
It is dry and formed.
7. the manufacturing method of drilling processing cover board according to claim 6, which is characterized in that
The lubriation material is using polyethylene as main component, and the average grain diameter of the polyethylene is 5 μm~7 μm, molecular weight 4000
~5000, fusing point is 95 DEG C~130 DEG C.
8. the manufacturing method of drilling processing cover board according to claim 6, which is characterized in that
The lubriation material is using polyethylene and polytetrafluoroethylene (PTFE) as main component.
9. the manufacturing method of the drilling processing cover board according to any one of claim 6 to 8, which is characterized in that
The thickness for the water-insoluble lubricant layer being made of lubriation material and adhesive is 5 μm~30 μm.
10. the manufacturing method of the drilling processing cover board according to any one of claim 6 to 9, which is characterized in that
The solid constituent of the lubriation material is 13.0wt%~23.1wt% relative to the ratio of the total solid content of lubricant layer.
11. a kind of manufacturing method of flexible printed circuit board, including through-hole drilling operating, which is characterized in that
In the through-hole drilling operating, coat at least one surface of a substrate be made of lubriation material and adhesive it is non-
Water-soluble lubricating layer and form drilling processing cover board.
12. the manufacturing method of flexible printed circuit board according to claim 11, which is characterized in that
The lubriation material is using polyethylene as main component, and the average grain diameter of the polyethylene is 5 μm~7 μm, molecular weight 4000
~5000, fusing point is 95 DEG C~130 DEG C.
13. the manufacturing method of flexible printed circuit board according to claim 11, which is characterized in that
The lubriation material is using polyethylene and polytetrafluoroethylene (PTFE) as main component.
14. the manufacturing method of the flexible printed circuit board according to any one of claim 11 to 13, which is characterized in that
The thickness for the water-insoluble lubricant layer being made of lubriation material and adhesive is 5 μm~30 μm.
15. the manufacturing method of the flexible printed circuit board according to any one of claim 11 to 14, which is characterized in that
The solid constituent of the lubriation material is 13.0wt%~23.1wt% relative to the ratio of the total solid content of lubricant layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016239287 | 2016-12-09 | ||
| JP2016-239287 | 2016-12-09 | ||
| PCT/JP2017/030404 WO2018105176A1 (en) | 2016-12-09 | 2017-08-24 | Entry sheet, entry sheet production method, and flexible substrate production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108419432A true CN108419432A (en) | 2018-08-17 |
| CN108419432B CN108419432B (en) | 2021-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780003034.8A Active CN108419432B (en) | 2016-12-09 | 2017-08-24 | Cover plate, method for manufacturing cover plate, and method for manufacturing flexible circuit board |
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| Country | Link |
|---|---|
| JP (1) | JP6351865B1 (en) |
| CN (1) | CN108419432B (en) |
| TW (1) | TWI650054B (en) |
| WO (1) | WO2018105176A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112720680A (en) * | 2020-12-01 | 2021-04-30 | 生益电子股份有限公司 | Drilling assistance structure and drilling assistance method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020004841A (en) * | 2018-06-28 | 2020-01-09 | 日本メクトロン株式会社 | Entry sheet for boring, method for manufacturing entry sheet for boring, and method for manufacturing electronic substrate |
| CN109760133A (en) * | 2019-01-29 | 2019-05-17 | 深圳市柳鑫实业股份有限公司 | A kind of cover board and the preparation method and application thereof |
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| TWI435205B (en) * | 2011-05-12 | 2014-04-21 | Subtron Technology Co Ltd | Cover structure and manufacturing method thereof |
| CN104754855B (en) * | 2013-12-31 | 2018-01-30 | 鹏鼎控股(深圳)股份有限公司 | Flexible PCB and preparation method thereof |
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- 2017-08-24 CN CN201780003034.8A patent/CN108419432B/en active Active
- 2017-08-24 JP JP2017545417A patent/JP6351865B1/en active Active
- 2017-08-24 WO PCT/JP2017/030404 patent/WO2018105176A1/en active Application Filing
- 2017-12-06 TW TW106142719A patent/TWI650054B/en active
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| CN1063833A (en) * | 1991-02-07 | 1992-08-26 | 霍尔德斯科技有限公司 | Printed circuit board drilling and used lead-in plate and backing plate |
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| CN101081389B (en) * | 2006-05-30 | 2010-09-22 | 三菱瓦斯化学株式会社 | Process for the production of entry sheet for drilling and use method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2018105176A1 (en) | 2018-12-06 |
| CN108419432B (en) | 2021-09-07 |
| TWI650054B (en) | 2019-02-01 |
| JP6351865B1 (en) | 2018-07-04 |
| WO2018105176A1 (en) | 2018-06-14 |
| TW201822601A (en) | 2018-06-16 |
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