CN211763949U

CN211763949U - Coated aluminum cover plate based on PCB drilling processing

Info

Publication number: CN211763949U
Application number: CN201921912381.5U
Authority: CN
Inventors: 邹向东
Original assignee: Guangdong Zhongchen Electronic Technology Co ltd
Current assignee: Guangdong Zhongchen Electronic Technology Co ltd
Priority date: 2019-11-07
Filing date: 2019-11-07
Publication date: 2020-10-27
Anticipated expiration: 2029-11-07

Abstract

The utility model relates to a coating film aluminium apron based on processing of PCB drilling, including aluminium base plate layer, the upper surface on aluminium base plate layer is electroplated with the copper rete, the surface coating on copper rete has graphite alkene layer, the lower surface coating on aluminium base plate layer has the tie coat. Make the aluminium apron possess the characteristic of copper apron through electroplating the copper rete on the aluminium apron, recycle new material graphite alkene simultaneously as the outward appearance rete of just contacting for it is more accurate to bore the position down, guarantees the precision of drilling position. Organic film layer, pressure sensitive resin layer or lubricating layer between aluminium apron and the PCB board can be better play fixed aluminium apron and lubricated effect improve the drilling precision. The drilling quality is improved on the premise of limiting the cost.

Description

Coated aluminum cover plate based on PCB drilling processing

Technical Field

The utility model relates to a PCB drilling processing field especially relates to coating film aluminium apron based on PCB drilling processing.

Background

The printed circuit board is an essential part in modern electronic equipment, and is widely applied to various fields such as communication, digital products, instruments and meters, medical equipment, aerospace, military industry and the like. With the development of electronic technology, PCBs are being developed in a direction of multilayering, thinning, densification, and high speed. Drilling in the manufacturing process of the PCB is an important process, the drilling is to drill a required through hole on the copper-clad plate, and the processing cost usually accounts for 30-40% of the manufacturing cost of the PCB. When mechanical drilling is carried out, in order to protect a PCB (printed circuit board) and improve the quality of drilling, a layer of cover plate material, generally called a cover plate, is often required to be placed, the cover plate material is one of three materials in drilling processing, and accounts for about 15-30% of the drilling processing cost of the PCB, the quality of the cover plate directly influences the drilling processing quality, the yield and the reliability of the printed circuit board, and particularly in the drilling processing of micro-aperture, the performance of the cover plate is more important.

The ideal material for the cover plate is copper cover plate, however, the copper price is too high to apply to mass production and processing. The aluminum cover plate which is widely applied at present has a plurality of defects, firstly, the heat conducting property of copper is close to twice of that of aluminum, and the heat radiating property of aluminum is not as good as that of copper. Secondly, the heating performance of aluminum is poor, the problem that the aluminum is easily heated to be soft under the action of a high-speed drill point is easily caused, the texture of the aluminum is soft, and the aluminum is easily warped at an orifice due to the influence of a pressure angle, drilling force and the like, so that the processing precision is influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problem, the utility model adopts the following technical scheme: the utility model provides a coating film aluminium apron based on PCB drilling processing which characterized in that: the aluminum substrate comprises an aluminum substrate layer, wherein a copper film layer is electroplated on the upper surface of the aluminum substrate layer, a graphene layer is coated on the surface of the copper film layer, and an adhesive layer is coated on the lower surface of the aluminum substrate layer.

Further, the adhesive layer is a pressure-sensitive resin layer.

Further, the thickness of the pressure-sensitive resin layer is 5-15 μm.

Further, the bonding layer is an organic film layer with viscosity.

Furthermore, the thickness of the organic film layer is 20-50 μm.

Further, the lower surface of the aluminum substrate layer is coated with a lubricating layer.

Furthermore, the thickness of the lubricating layer is 15-50 mu m.

Further, the thickness of the copper film layer is 50-100 μm.

Further, the thickness of the graphene layer is 10-50 μm.

Further, the thickness of the aluminum substrate layer is 100-300 μm.

The utility model discloses a theory of operation does: a copper-plated layer and a graphene layer are added on the basis of the aluminum cover plate, and an aluminum substrate layer is used as a base material, so that the cost is controlled. Copper rete is electroplated as supporting layer and heat-conducting layer at the upper surface on aluminium base board layer, finally at the surperficial spraying graphite alkene layer of copper rete, graphite alkene has electrically conductive characteristic, and its hardness is less than copper and aluminium again simultaneously for the drill point is more difficult for skidding when the initial contact apron of drilling down. The lower surface of the aluminum substrate layer is coated with the organic film layer, the pressure-sensitive resin layer or the lubricating layer, so that the relative position of the cover plate and the PCB can be fixed, and the sliding is avoided. Wherein the organic film layer and the lubricating layer can be heated and melted into a lubricating agent in the drilling process, and the drilling quality is improved.

Wherein the organic film layer is prepared by coating and drying a solution system compounded by 1-10 parts of polytetrafluoroethylene ultrafine powder, 50-100 parts of amphiphilic block copolymer and 80-200 parts of organic solvent, and the thickness of the organic film layer is 20-50 mu m.

Wherein the lubricating layer is prepared by coating and drying a solution system compounded by 1-10 parts of polytetrafluoroethylene ultrafine powder, 50-100 parts of amphiphilic block copolymer and 80-200 parts of organic solvent, and the thickness of the lubricating layer is 15-50 mu m.

The pressure-sensitive resin layer is prepared by coating and drying a solution system which is prepared by adding 5% of an auxiliary agent into one of viscous epoxy resin, ketone-aldehyde resin, polyvinyl alcohol resin or acrylic resin and uniformly mixing, and the thickness of the solution system is 5-15 mu m.

The utility model has the advantages that: make the aluminium apron possess the characteristic of copper apron through electroplating the copper rete on the aluminium apron, recycle new material graphite alkene simultaneously as the outward appearance rete of just contacting for it is more accurate to bore the position down, guarantees the precision of drilling position. Organic film layer, pressure sensitive resin layer or lubricating layer between aluminium apron and the PCB board can be better play fixed aluminium apron and lubricated effect improve the drilling precision. The drilling quality is improved on the premise of limiting the cost.

Drawings

The figures further illustrate the invention, but the embodiments in the figures do not constitute any limitation of the invention.

Fig. 1 is a schematic view of an aluminum cover plate structure using a pressure sensitive resin layer according to an embodiment of the present invention.

Fig. 2 is a schematic view of an aluminum cover plate structure using an organic film layer according to an embodiment of the present invention.

Fig. 3 is a schematic view of an aluminum cover plate structure using a lubricant layer according to an embodiment of the present invention.

Legend:

1 an aluminum substrate; 2, a copper film layer; 3 a graphene layer; 4 a pressure-sensitive resin layer; 5, an organic film layer; 6 lubricating layer.

Detailed Description

As shown in fig. 1-3, an embodiment of the present invention provides a coated aluminum cover plate based on PCB drilling, which is characterized in that: the aluminum substrate layer comprises an aluminum substrate layer 1, wherein a copper film layer 2 is electroplated on the upper surface of the aluminum substrate layer 1, a graphene layer 3 is coated on the surface of the copper film layer 2, and an adhesive layer is coated on the lower surface of the aluminum substrate layer 1.

Further, the adhesive layer is a pressure-sensitive resin layer 4.

Further, the thickness of the pressure-sensitive resin layer 4 is 5-15 μm.

Further, the bonding layer is an organic film layer 5 with adhesiveness.

Further, the thickness of the organic film layer 5 is 20-50 μm.

Further, the lower surface of the aluminum substrate layer 1 is coated with a lubricating layer 6.

Further, the thickness of the lubricating layer 6 is 15-50 μm.

Further, the thickness of the copper film layer 2 is 50-100 μm.

Further, the thickness of the graphene layer 3 is 10-50 μm.

Further, the thickness of the aluminum substrate layer 1 is 100-300 μm.

Example 1:

the thickness of the aluminum substrate layer 1 is 100 μm, the copper film layer 2 with the thickness of 50 μm is electroplated on the upper surface of the aluminum substrate layer, the graphene layer 3 with the thickness of 50 μm is sprayed on the surface of the copper film layer 2, and the pressure-sensitive resin layer 4 with the thickness of 15 μm is coated on the lower surface of the aluminum substrate layer 1.

Example 2:

the thickness of the aluminum substrate layer 1 is 300 microns, the copper film layer 2 with the thickness of 100 microns is electroplated on the upper surface of the aluminum substrate layer, the graphene layer 3 with the thickness of 50 microns is sprayed on the surface of the copper film layer 2, and the organic film layer 5 with the thickness of 50 microns is coated on the lower surface of the aluminum substrate layer 1.

Example 3:

the thickness of the aluminum substrate layer 1 is 200 μm, the copper film layer 2 with the thickness of 75 μm is electroplated on the upper surface of the aluminum substrate layer, the graphene layer 3 with the thickness of 30 μm is sprayed on the surface of the copper film layer 2, and the lubricating layer 6 with the thickness of 37 μm is coated on the lower surface of the aluminum substrate layer 1.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a coating film aluminium apron based on PCB drilling processing which characterized in that: the aluminum substrate comprises an aluminum substrate layer, wherein a copper film layer is electroplated on the upper surface of the aluminum substrate layer, a graphene layer is coated on the surface of the copper film layer, and an adhesive layer is coated on the lower surface of the aluminum substrate layer.

2. The coated aluminum cover plate based on PCB drilling processing of claim 1, wherein: the adhesive layer is a pressure sensitive resin layer.

3. The coated aluminum cover plate based on PCB drilling processing of claim 2, wherein: the thickness of the pressure-sensitive resin layer is 5-15 mu m.

4. The coated aluminum cover plate based on PCB drilling processing of claim 1, wherein: the bonding layer is an organic film layer with viscosity.

5. The coated aluminum cover plate based on PCB drilling processing of claim 4, wherein: the thickness of the organic film layer is 20-50 mu m.

6. The coated aluminum cover plate based on PCB drilling processing of claim 1, wherein: the lower surface of the aluminum substrate layer is coated with a lubricating layer.

7. The coated aluminum cover plate based on PCB drilling of claim 6, wherein: the thickness of the lubricating layer is 15-50 mu m.

8. The coated aluminum cover plate based on PCB drilling processing of claim 1, wherein: the thickness of the copper film layer is 50-100 mu m.

9. The coated aluminum cover plate based on PCB drilling processing of claim 1, wherein: the thickness of the graphene layer is 10-50 mu m.

10. The coated aluminum cover plate based on PCB drilling processing of claim 1, wherein: the thickness of the aluminum substrate layer is 100-300 mu m.