CN210777534U - Polyimide label material with electromagnetic shielding function - Google Patents
Polyimide label material with electromagnetic shielding function Download PDFInfo
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- CN210777534U CN210777534U CN201922448622.1U CN201922448622U CN210777534U CN 210777534 U CN210777534 U CN 210777534U CN 201922448622 U CN201922448622 U CN 201922448622U CN 210777534 U CN210777534 U CN 210777534U
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Abstract
The utility model discloses a polyimide label material with electromagnetic shield function, include the polyimide film layer and leave the type rete the upper surface coating on polyimide film layer has the conductive printing layer that is used for printing the label pattern the lower surface on polyimide film layer is formed with the metallic shield layer, this metallic shield layer pass through conductive adhesive layer with bond mutually from the type rete. The remarkable effects are as follows: conductive polymers are added into the surface printing layer and the adhesive layer to form a conductive printing layer and a conductive adhesive layer, and a metal conductive layer is formed on the polyimide film through magnetron sputtering, so that the printing identification function of the material is realized, and the conductive shielding function of the material is realized.
Description
Technical Field
The utility model relates to electromagnetic shield label technical field, concretely relates to polyimide label material with electromagnetic shield function.
Background
At present, in the Surface Mount Technology (SMT) process of PCB, the labels of the components and the main chip are all polyimide labels that are used to withstand the harsh environment of high temperature and solvents. The existing polyimide label can only realize the functions of high temperature resistance and solvent resistance at present. With the rapid development of the 5G industry, the problem of electromagnetic interference between high-frequency parts and devices becomes more serious, and the requirements of related products on electromagnetic shielding become higher and higher. However, the conventional polyimide tag cannot solve the problem of electromagnetic shielding.
Disclosure of Invention
The utility model aims at providing a polyimide label material with electromagnetic shield function, can also reach electromagnetic shield effect under the prerequisite that can realize the sign to prior art not enough.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a polyimide label material with electromagnetic shielding function is characterized in that: the upper surface of the polyimide film layer is coated with a conductive printing layer for printing label patterns, and a metal shielding layer is formed on the lower surface of the polyimide film layer and is bonded with the release film layer through a conductive adhesive layer.
Furthermore, the thickness of the polyimide film layer is 25-50 mu m.
Further, the conductive printing layer is a single-layer structure or a double-layer structure, wherein the single-layer structure is a film layer formed by mixing printing resin and a conductive polymer; the double-layer mechanism is formed by overlapping a conductive layer coated on the upper surface of the polyimide film layer and a printing layer coated on the conductive layer.
Furthermore, the thickness of the conductive printing layer is 10-15 microns.
Furthermore, the metal shielding layer is a metal layer formed by rolling metal foil or magnetron sputtering, and the thickness of the metal shielding layer is 200-300 nm.
Furthermore, the conductive adhesive layer is a film layer formed by mixing viscose and conductive polymer.
The utility model discloses a show the effect and be: the conductive printing layer and the conductive adhesive layer are formed by adding a conductive polymer in the surface printing layer and the adhesive layer, and a metal conductive layer is formed on the polyimide film through magnetron sputtering, so that the conductive shielding function of the material is realized, and the shielding performance can reach (10MHz-1GHz):60 db.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the present invention.
Detailed Description
The following provides a more detailed description of the embodiments and the operation of the present invention with reference to the accompanying drawings.
Example 1:
as shown in fig. 1, a polyimide label material with an electromagnetic shielding function comprises a polyimide film layer 2 and a release film layer 5, wherein a conductive printing layer 1 for printing a label pattern is coated on the upper surface of the polyimide film layer 2, a metal shielding layer 3 is formed on the lower surface of the polyimide film layer 2, and the metal shielding layer 3 is bonded with the release film layer 5 through a conductive adhesive layer 4.
Wherein the thickness of the polyimide film layer 2 is 25-50 μm; the conductive printing layer 1 is of a single-layer film structure formed by mixing printing resin and conductive polymer, the thickness of the conductive printing layer 1 is 10-15 microns, and the electromagnetic shielding effect of the material is further ensured by the arrangement of the conductive printing layer 1; the metal shielding layer 3 is a metal layer formed by magnetron sputtering, and the thickness of the metal layer is 200-300 nm; the conductive adhesive layer 4 is a film layer formed by mixing viscose glue and conductive polymers.
The conductive printing layer 1 and the conductive adhesive layer 4 are formed by adding a conductive polymer in the surface printing layer and the adhesive layer, and a metal conductive layer is formed on the polyimide film through magnetron sputtering, so that the conductive shielding function of the material is realized, and the shielding performance can reach (10MHz-1GHz):60 db.
Example 2:
referring to the attached drawing 2, the polyimide label material with the electromagnetic shielding function comprises a polyimide film layer 2 and a release film layer 5, wherein a conductive printing layer 1 for printing a label pattern is coated on the upper surface of the polyimide film layer 2, a metal shielding layer 3 is formed on the lower surface of the polyimide film layer 2, and the metal shielding layer 3 is bonded with the release film layer 5 through a conductive adhesive layer 4. Specifically, the method comprises the following steps:
the thickness of the polyimide film layer 2 is 25-50 mu m;
the conductive printing layer 1 is a double-layer mechanism, the double-layer structure is formed by overlapping a conductive layer 22 coated on the upper surface of the polyimide film layer 2 and a printing layer 21 coated on the conductive layer 22, the thickness of the conductive printing layer 1 is 10-15 mu m, the printing layer also has a conductive function, and the electromagnetic shielding effect of the material is further ensured by the arrangement of the conductive printing layer 1;
the metal shielding layer 3 is a metal layer formed by rolling metal foil or magnetron sputtering, and the thickness of the metal shielding layer is 200-300 nm;
the conductive adhesive layer 4 is a film layer formed by mixing viscose glue and conductive polymers.
In the embodiment, the conductive polymer is added into the surface printing layer and the adhesive layer, so that the conductive printing layer 1 and the conductive adhesive layer 4 are formed, and meanwhile, a metal conductive layer, namely the metal shielding layer 3, is formed on the polyimide film layer 2 through magnetron sputtering, so that the conductive shielding function of the material is realized, and the shielding performance can reach (10MHz-1GHz):60 db.
The technical scheme provided by the utility model is introduced in detail above. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
Claims (6)
1. A polyimide label material with electromagnetic shielding function is characterized in that: the upper surface of the polyimide film layer is coated with a conductive printing layer for printing label patterns, and a metal shielding layer is formed on the lower surface of the polyimide film layer and is bonded with the release film layer through a conductive adhesive layer.
2. The polyimide label material with electromagnetic shielding function according to claim 1, wherein: the thickness of the polyimide film layer is 25-50 mu m.
3. The polyimide label material with electromagnetic shielding function according to claim 1, wherein: the conductive printing layer is of a single-layer structure or a double-layer structure, wherein the single-layer structure is a film layer formed by mixing printing resin and a conductive polymer; the double-layer mechanism is formed by overlapping a conductive layer coated on the upper surface of the polyimide film layer and a printing layer coated on the conductive layer.
4. The polyimide label material with electromagnetic shielding function according to claim 1 or 3, wherein: the thickness of the conductive printing layer is 10-15 mu m.
5. The polyimide label material with electromagnetic shielding function according to claim 1, wherein: the metal shielding layer is a metal layer formed by rolling metal foil or magnetron sputtering, and the thickness of the metal shielding layer is 200-300 nm.
6. The polyimide label material with electromagnetic shielding function according to claim 1, wherein: the conductive adhesive layer is a film layer formed by mixing viscose glue and conductive polymers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922448622.1U CN210777534U (en) | 2019-12-31 | 2019-12-31 | Polyimide label material with electromagnetic shielding function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922448622.1U CN210777534U (en) | 2019-12-31 | 2019-12-31 | Polyimide label material with electromagnetic shielding function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210777534U true CN210777534U (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922448622.1U Active CN210777534U (en) | 2019-12-31 | 2019-12-31 | Polyimide label material with electromagnetic shielding function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210777534U (en) |
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2019
- 2019-12-31 CN CN201922448622.1U patent/CN210777534U/en active Active
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