CN112720680A - Drilling assistance structure and drilling assistance method - Google Patents
Drilling assistance structure and drilling assistance method Download PDFInfo
- Publication number
- CN112720680A CN112720680A CN202011389153.1A CN202011389153A CN112720680A CN 112720680 A CN112720680 A CN 112720680A CN 202011389153 A CN202011389153 A CN 202011389153A CN 112720680 A CN112720680 A CN 112720680A
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- China
- Prior art keywords
- circuit board
- plate
- drilling
- base plate
- auxiliary
- Prior art date
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- 238000005553 drilling Methods 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000003825 pressing Methods 0.000 claims abstract description 41
- 239000003822 epoxy resin Substances 0.000 claims description 45
- 229920000647 polyepoxide Polymers 0.000 claims description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 33
- 239000011889 copper foil Substances 0.000 claims description 32
- 239000003292 glue Substances 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 229920006335 epoxy glue Polymers 0.000 claims description 16
- 238000002955 isolation Methods 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 26
- 229920006332 epoxy adhesive Polymers 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/0006—Means for guiding the cutter
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a drilling auxiliary structure and a drilling auxiliary method, which are suitable for auxiliary drilling of a circuit board, wherein the drilling auxiliary structure comprises an auxiliary pressing plate and a base plate, the circuit board, the auxiliary pressing plate and the base plate are sequentially stacked to form an integral plate, the auxiliary pressing plate comprises a filling layer, and the filling layer is used for filling a gap between a warping part of the circuit board and the base plate. The auxiliary drilling structure can effectively prevent the cutter face burrs, burrs and orifice cracks generated by warping of the circuit board in the drilling process, and effectively improve the yield of the circuit board.
Description
Technical Field
The invention relates to the field of circuit board processing and manufacturing, in particular to a drilling auxiliary structure and a drilling auxiliary method.
Background
With the development of science and technology, higher requirements are put forward on the layer number of the circuit board. The more layers of circuit boards, the more space for designing circuit lines, and thus, the more widely used circuit boards with 28 layers or more are used in various industries.
However, as the number of layers of the circuit board increases, the probability of warping of the circuit board increases, and the difficulty of drilling holes in the warped circuit board is very high. The mode that prior art adopted aluminum sheet + circuit board + backing plate carries out drilling operation to the circuit board, and the backing plate is arranged in below the circuit board in order to support circuit board, produces knife face and drape over one's shoulders cutting edge of a knife and burr at the circuit board when preventing to drill, and the aluminum sheet can play radiating effect above arranging the circuit board in, improves the hole site precision to can prevent that the knife face from beating the circuit board of spending. When the circuit board warps, the backing plate can not support the warping part of the circuit board, so that a gap exists between the warping part and the backing plate, the circuit board can not be flatly placed above the backing plate, and the knife outlet face is easy to cause serious knife outlet burrs, burrs and orifice breakage of the circuit board in the drilling process, so that the circuit board is scrapped, the yield of the circuit board is greatly reduced, and the development of the circuit board is seriously restricted.
Therefore, a solution to the above problem is needed.
Disclosure of Invention
The invention aims to provide a drilling auxiliary structure which can effectively prevent a knife face burr, burr and orifice fracture of a circuit board caused by warping in the drilling process and effectively improve the yield of the circuit board.
Another objective of the present invention is to provide a drilling assisting method, which can effectively prevent the occurrence of burr, burr and hole cracking on the tool face of the circuit board due to warping during the drilling process, and effectively improve the yield of the circuit board.
In order to achieve the purpose, the invention discloses a drilling auxiliary structure which is suitable for auxiliary drilling of a circuit board.
Compared with the prior art, the auxiliary drilling structure has the advantages that the auxiliary pressing plate is additionally arranged between the circuit board and the base plate and comprises the filling layer, the gap between the warping part of the circuit board and the base plate is filled by utilizing the filling characteristic of the filling layer, so that the circuit board and the base plate are in a flat structure, knife face burrs, burrs and hole opening cracks caused by warping of the circuit board in the drilling process are avoided, and the yield of the circuit board is effectively improved.
Preferably, the material of the filling layer is epoxy resin glue, the epoxy resin glue is heated and applies pressure to the integrated board along the stacking direction, so that the epoxy resin glue is melted and flows to fill the gap between the warping portion of the circuit board and the backing plate, and the epoxy resin glue is solidified after being cooled to form a flat structure between the circuit board and the backing plate.
Specifically, the auxiliary pressing plate further comprises two isolation layers, wherein one of the two isolation layers is stacked between the circuit board and the epoxy resin adhesive, and the other isolation layer is stacked between the backing plate and the epoxy resin adhesive.
Specifically, the isolation layer is made of copper foil, the copper foil comprises a rough surface and a polished surface, the rough surface is mutually attached to the epoxy resin glue, and the polished surface is mutually attached to the circuit board/the base plate.
Preferably, the thickness of the copper foil is less than or equal to 17 micrometers.
Preferably, the auxiliary structure of driling still includes the pin, whole board along stacking the direction seted up with pin interference fit's fixed orifices, the fixed orifices runs through in proper order circuit board and supplementary clamp plate to along running through the direction part penetrate the backing plate, circuit board, supplementary clamp plate and backing plate borrow by the interference fit of pin and fixed orifices is closely stacking.
Preferably, the auxiliary drilling structure further comprises a protection plate, the protection plate is stacked on the surface, away from the backing plate, of the integral plate, and the circuit board is provided with a positioning hole for positioning the drilling hole along the stacking direction.
Correspondingly, the invention also discloses a drilling auxiliary method, which comprises the following steps:
s1, providing a circuit board, an auxiliary pressing plate and a backing plate, wherein the auxiliary pressing plate comprises epoxy resin glue and two copper foils, the epoxy resin glue and the two copper foils are arranged in a stacked mode, and the epoxy resin layer is stacked between the two copper foils;
s2, stacking the circuit board, the auxiliary pressure plate and the backing plate in sequence to form an integral plate;
s3, heating the epoxy resin adhesive and applying pressure to the integrated board along the stacking direction to enable the epoxy resin adhesive to be melted and flow to fill the gap between the warping part of the circuit board and the backing board, and solidifying the epoxy resin adhesive after cooling to enable a flat structure to be formed between the circuit board and the backing board;
s4, drilling the circuit board;
and S5, removing the auxiliary pressure plate and the backing plate to obtain the circuit board after drilling.
Preferably, step (2) is preceded by:
s201, pre-drilling a circuit board, an auxiliary pressure plate and a base plate respectively to form fixing holes penetrating through the circuit board and the auxiliary pressure plate on the circuit board and the auxiliary pressure plate respectively and form fixing holes penetrating through the base plate partially on the base plate;
the step (2) is followed by:
s21, adjusting the stacking positions of the circuit board, the auxiliary pressure plate and the base plate so as to align the fixing holes of the circuit board, the auxiliary pressure plate and the base plate;
and S22, inserting pins which are in interference fit with the fixing holes into the fixing holes so as to enable the circuit board, the auxiliary pressure plate and the base plate to be tightly stacked.
Preferably, step (2) is preceded by:
s202, pre-drilling the circuit board to form a positioning hole for auxiliary drilling on the circuit board;
the step (4) comprises the following steps:
s41, stacking aluminum sheets on one surface of the integral plate, which is far away from the backing plate;
and S42, after aligning the positioning holes, drilling the aluminum sheet and then drilling the circuit board along the positioning holes.
Drawings
Fig. 1 is a schematic view of the structure of the drilling assistance structure of the present invention before the voids are filled.
Fig. 2 is a schematic diagram of the drilling assistance structure of the present invention after the voids are filled.
Fig. 3 is an exploded schematic view of fig. 1.
Fig. 4 is a schematic view of the fixing hole of the present invention in a drilling assistant structure.
Fig. 5 is a schematic view of the structure of fig. 4 after a pin is inserted into the fixing hole.
FIG. 6 is a flow chart of a drill assist method of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1, the auxiliary drilling structure 100 of the present embodiment is suitable for performing auxiliary drilling operation on a circuit board 10, and can effectively prevent the circuit board 10 from generating a knife-face burr, a burr and an aperture crack at a drilling position due to the whole or partial warping of the circuit board 10 during the drilling process. The circuit board 10 according to the present embodiment is mainly a multilayer circuit board 10, and of course, the same applies to a single-layer or double-layer circuit board 10. The drilling assistance structure 100 of the present embodiment will be described in detail below.
Referring to fig. 1-3, the auxiliary drilling structure 100 of the present embodiment includes an auxiliary pressing plate 20 and a backing plate 30, wherein the circuit board 10, the auxiliary pressing plate 20 and the backing plate 30 are sequentially stacked to form an integral board 1, the auxiliary pressing plate 20 includes a filling layer 21, and the filling layer 21 is used to fill a gap 2 between a warping portion 11 of the circuit board 10 and the backing plate 30, so that a flat structure is formed between the circuit board 10 and the backing plate 30, and blade burrs, burrs and orifice cracks generated by warping of the circuit board 10 during the drilling process are avoided. It is to be understood that the warping portion 11 of the circuit board 10 according to the present embodiment may be a single or a plurality of local warps that the circuit board 10 has, or may be a warp formed on the entire circuit board 10.
Preferably, the material of the filling layer 21 is epoxy glue, the epoxy glue 21 is heated and pressure is applied to the entire board 1 along the stacking direction, so that the epoxy glue 21 is melted and flows to fill the gap 2 between the warping portion 11 of the circuit board 10 and the pad 30, and the epoxy glue 21 is solidified after cooling to form a flat structure between the circuit board 10 and the pad 30. Of course, the filling layer 21 may be made of other materials with filling characteristics, and the gap 2 between the warping portion 11 of the circuit board 10 and the pad 30 may be filled according to the filling characteristics of the filling layer 21 in actual operation.
According to the self-owned characteristics of the epoxy resin glue 21, the epoxy resin glue 21 at normal temperature can be in a solid state by adjusting the proportion of the epoxy resin glue 21, and when the temperature reaches the preset temperature, the epoxy resin glue 21 can be melted into a liquid state, so that the flowing gap 2 can be filled and bonded. Therefore, the present embodiment utilizes the above-mentioned characteristics of the epoxy resin paste 21 to form the epoxy resin paste 21 at normal temperature into a sheet shape and stack the sheet between the circuit board 10 and the board 30, and applies a pressure to the entire board 1 in the stacking direction in order to melt the solid epoxy resin paste 21, and to cause the epoxy resin paste 21 in the molten state to flow under the compression between the circuit board 10 and the board 30, thereby filling the gap 2 between the warpage portion 11 of the circuit board 10 and the board 30 by the flow. The heating is stopped and the pressure is applied to the whole board 1, and the epoxy resin glue 21 gradually cools to be solid again, so that the epoxy resin glue 21 can be filled in the gap 2 between the warping part 11 of the circuit board 10 and the backing plate 30 in a solid form to form a fixed support for the gap 2, and a flat structure is formed between the circuit board 10 and the backing plate 30. It should be noted that in the above operation, the thickness of the epoxy glue 21 needs to be properly controlled to prevent the epoxy glue 21 in the molten state from seeping out of the integrated board 1 under the pressure.
Referring to fig. 1-3, since the epoxy adhesive 21 has a certain viscosity, in order to avoid the epoxy adhesive 21 from adhering to the circuit board 10 and the pad 30, the auxiliary pressing plate 20 of the present embodiment further includes two isolation layers 22, one of the two isolation layers 22 is stacked between the circuit board 10 and the epoxy adhesive 21 to prevent the epoxy adhesive 21 from adhering to the circuit board 10, and the other of the two isolation layers 22 is stacked between the pad 30 and the epoxy adhesive 21 to prevent the epoxy adhesive 21 from adhering to the pad 30, and the isolation layer 22 separates the epoxy adhesive 21 from the direct adhesion of the pad 30 of the circuit board 10/board, so as to facilitate the detachment of the circuit board 10, the epoxy adhesive 21 and the pad 30 after the subsequent drilling.
Preferably, the material of the isolation layer 22 of the present embodiment is specifically copper foil, and the copper foil 22 has low surface oxygen characteristics and can be attached to various substrates, so that the copper foil 22 can be attached to the circuit board 10, the epoxy glue 21 and the pad 30 respectively to prevent the epoxy glue 21 and the pad 30 from being bonded to each other. Preferably, the thickness of the copper foil 22 is less than or equal to 17 μm, so that the copper foil 22 has a better shape covering capability and can be tightly attached to the warping portion 11 of the circuit board 10 along with the filling of the epoxy resin adhesive 21, thereby ensuring that the epoxy resin adhesive 21 can be completely filled in the gap 2 between the warping portion 11 of the circuit board 10 and the pad 30.
Further, the copper foil 22 comprises a rough surface 221 and a smooth surface 222, the rough surface 221 of the copper foil 22 is attached to the epoxy resin adhesive 21, and the smooth surface 222 of the copper foil 22 is attached to the circuit board 10/the pad 30. Because the rough surface 221 of the copper foil 22 has a rough surface, the epoxy resin glue 21 and the rough surface 221 of the copper foil 22 have a large friction force, and the epoxy resin glue 21 is easily attached to the rough surface 221 of the copper foil 22, so that the rough surface 221 of the copper foil 22 and the epoxy resin glue 21 can be well bonded, and the epoxy resin glue 21 is not easily seeped out of the integral board 1 under the action of the rough surface 221. On the other hand, if the smooth surface 222 of the copper foil 22 and the epoxy glue 21 are adhered to each other, the epoxy glue 21 is difficult to adhere to the smooth surface 222 of the copper foil 22 due to the small friction between the epoxy glue 21 and the smooth surface 222 of the copper foil 22, and the epoxy glue 21 is easy to seep out of the integrated board 1 under pressure. The copper foil 22 is stacked with the circuit board 10/pad 30 through the smooth surface 222, which facilitates the subsequent separation of the copper foil 22 from the circuit board 10/pad 30.
Referring to fig. 1 to 5, in order to prevent the misalignment between the circuit board 10, the auxiliary pressing plate 20 and the backing plate 30, the drilling auxiliary structure 100 of the present embodiment further includes a pin 40, the whole board 1 is provided with a fixing hole 3 in interference fit with the pin 40 along the stacking direction, the fixing hole 3 sequentially penetrates through the circuit board 10 and the auxiliary pressing plate 20, and partially penetrates through the backing plate 30 along the penetrating direction, the circuit board 10, the auxiliary pressing plate 20 and the backing plate 30 are tightly stacked by the interference fit of the pin 40 and the fixing hole 3, so as to avoid the drilling failure caused by the misalignment between the circuit board 10, the auxiliary pressing plate 20 and the backing plate 30 in the subsequent drilling process.
During specific operation, pre-drilling treatment is respectively carried out on the circuit board 10, the auxiliary pressing plate 20 and the base plate 30, so that fixing holes 3 penetrating through the circuit board 10 and the auxiliary pressing plate 20 are respectively formed in the circuit board 10 and the auxiliary pressing plate 20, and fixing holes 3 partially penetrating through the base plate 30 are formed in the base plate 30. The hole positions of the fixing holes 3 can be arranged at any position of the integrated board 1 according to actual production requirements, and in actual operation, a plurality of fixing holes 3 are generally arranged at the excess positions of the circuit board 10, the auxiliary pressing board 20 and the backing board 30 so as to reduce damage to the board body of the circuit board 10.
Further, the auxiliary drilling structure 100 of the present embodiment further includes a protection sheet 50, the protection sheet 50 is stacked on a surface of the integrated board 1 away from the pad 30, and a positioning hole (not shown) for positioning a drilling hole is formed in advance on a surface of the circuit board 10 away from the pad 30 in the stacking direction. The protective sheet 50 is provided to prevent the circuit board 10 from being scratched by a knife surface during the drilling process, so as to improve the yield of the circuit board 10. The diameter of the positioning hole is generally smaller than the diameter of the hole to be drilled, and the positioning hole is generally only formed on the surface of the circuit board 10 without drilling through the circuit board 10, so as to reduce the damage to the circuit board 10 when drilling the positioning hole. Preferably, the protective sheet 50 of the present embodiment is specifically an aluminum sheet, which is light in weight and strong in plasticity, and can effectively prevent the circuit board 10 from being scratched by a knife during drilling. Of course, the protective sheet 50 may also be a metal such as a copper sheet, a zinc sheet, etc., and the type of the protective sheet 50 is not limited herein.
With reference to fig. 1-5, the auxiliary drilling structure 100 of the present invention adds an auxiliary pressure plate 20 between the circuit board 10 and the pad 30, where the auxiliary pressure plate 20 includes a filling layer 21, and fills the gap 2 between the warped portion 11 of the circuit board 10 and the pad 30 by using the filling property of the filling layer 21, so that the circuit board 10 and the pad 30 are in a flat structure, thereby preventing the circuit board 10 from generating a knife edge, burr and aperture crack due to warping during the drilling process, and effectively improving the yield of the circuit board 10.
Referring to fig. 6, correspondingly, the present invention further discloses a drilling assisting method 1000, which includes the following steps:
s1, providing a circuit board, an auxiliary pressing plate and a backing plate, wherein the auxiliary pressing plate comprises epoxy resin glue and two copper foils, the epoxy resin glue and the two copper foils are arranged in a stacked mode, and the epoxy resin layer is stacked between the two copper foils;
s2, stacking the circuit board, the auxiliary pressure plate and the backing plate in sequence to form an integral plate;
s3, heating the epoxy resin adhesive and applying pressure to the integrated board along the stacking direction to enable the epoxy resin adhesive to be melted and flow to fill the gap between the warping part of the circuit board and the backing board, and solidifying the epoxy resin adhesive after cooling to enable a flat structure to be formed between the circuit board and the backing board;
s4, drilling the circuit board;
and S5, removing the auxiliary pressure plate and the backing plate to obtain the circuit board after drilling.
Preferably, step (2) is preceded by:
s201, pre-drilling a circuit board, an auxiliary pressure plate and a base plate respectively to form fixing holes penetrating through the circuit board and the auxiliary pressure plate on the circuit board and the auxiliary pressure plate respectively and form fixing holes penetrating through the base plate partially on the base plate;
the step (2) is followed by:
s21, adjusting the stacking positions of the circuit board, the auxiliary pressure plate and the base plate so as to align the fixing holes of the circuit board, the auxiliary pressure plate and the base plate;
and S22, inserting pins which are in interference fit with the fixing holes into the fixing holes so as to enable the circuit board, the auxiliary pressure plate and the base plate to be tightly stacked.
Preferably, step (2) is preceded by:
s202, pre-drilling the circuit board to form a positioning hole for auxiliary drilling on the circuit board;
the step (4) comprises the following steps:
s41, stacking aluminum sheets on one surface of the integral plate, which is far away from the backing plate;
and S42, after aligning the positioning holes, drilling the aluminum sheet and then drilling the circuit board along the positioning holes.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. The utility model provides a drilling auxiliary structure is suitable for carrying out supplementary drilling to the circuit board which characterized in that: the drilling auxiliary structure comprises an auxiliary pressing plate and a base plate, the circuit board, the auxiliary pressing plate and the base plate are sequentially stacked to form an integral plate, the auxiliary pressing plate comprises a filling layer, and the filling layer is used for filling the warping portion of the circuit board and a gap between the base plates.
2. The drilling assistance structure of claim 1, wherein: the material of filling layer is epoxy glue, heats epoxy glue and is right along the direction of stacking whole board applys pressure, so that epoxy glue melts and is the filling that flows the warpage part of circuit board with space between the backing plate, epoxy glue cooling postcure and make form between circuit board and the backing plate and level the structure.
3. The drilling assistance structure according to claim 2, wherein: the auxiliary pressure plate further comprises two isolation layers, one of the two isolation layers is stacked between the circuit board and the epoxy resin adhesive, and the other isolation layer is stacked between the backing plate and the epoxy resin adhesive.
4. The drilling assistance structure according to claim 3, wherein: the isolation layer is made of copper foil, the copper foil comprises a hair side and a polished surface, the hair side is attached to the epoxy resin adhesive, and the polished surface is attached to the circuit board/base plate.
5. The drilling assistance structure according to claim 4, wherein: the thickness of the copper foil is less than or equal to 17 micrometers.
6. The drilling assistance structure of claim 1, wherein: still include the pin, whole board along stack the direction seted up with pin interference fit's fixed orifices, the fixed orifices runs through in proper order circuit board and supplementary clamp plate to penetrate along running through the direction part the backing plate, circuit board, supplementary clamp plate and backing plate borrow by the interference fit of pin and fixed orifices is closely to stack.
7. The drilling assistance structure of claim 1, wherein: the drilling auxiliary structure further comprises a protection plate, the protection plate is stacked on the whole plate and is far away from one surface of the base plate, and the circuit board is provided with a positioning hole for drilling positioning along the stacking direction.
8. A method of assisting in drilling, comprising the steps of:
providing a circuit board, an auxiliary pressing plate and a base plate, wherein the auxiliary pressing plate comprises epoxy resin glue and two copper foils, the epoxy resin glue and the two copper foils are arranged in a stacked mode, and the epoxy resin layer is stacked between the two copper foils;
stacking the circuit board, the auxiliary pressing plate and the base plate in sequence to form an integral plate;
heating the epoxy resin adhesive and applying pressure to the integrated board along the stacking direction so that the epoxy resin adhesive is melted and flows to fill a gap between the warping part of the circuit board and the base plate, and solidifying the epoxy resin adhesive after cooling to form a flat structure between the circuit board and the base plate;
drilling the circuit board;
and removing the auxiliary pressing plate and the base plate to obtain the circuit board after drilling.
9. The drilling assistance method of claim 8, comprising:
the circuit board, the auxiliary pressing plate and the base plate are sequentially stacked to form an integral plate, and the integrated plate comprises the following components:
pre-drilling a circuit board, an auxiliary pressing plate and a base plate respectively to form fixing holes penetrating through the circuit board and the auxiliary pressing plate on the circuit board and the auxiliary pressing plate respectively and form fixing holes partially penetrating through the base plate on the base plate;
the circuit board, the auxiliary pressing plate and the base plate are sequentially stacked to form an integral plate, and then the circuit board, the auxiliary pressing plate and the base plate further comprise:
adjusting the stacking positions of the circuit board, the auxiliary pressing plate and the base plate so as to align the fixing holes of the circuit board, the auxiliary pressing plate and the base plate;
and inserting pins which are in interference fit with the fixing holes into the fixing holes so as to enable the circuit board, the auxiliary pressing plate and the base plate to be tightly stacked.
10. The drilling assistance method of claim 8, comprising:
the circuit board, the auxiliary pressing plate and the base plate are sequentially stacked to form an integral plate, and the integrated plate comprises the following components:
pre-drilling the circuit board to form a positioning hole for assisting in drilling on the circuit board;
the drilling process to the circuit board includes:
stacking aluminum sheets on one surface of the integral plate, which is far away from the base plate;
and after the aluminum sheet is aligned to the positioning hole, drilling the circuit board along the positioning hole after the aluminum sheet is drilled through.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011389153.1A CN112720680A (en) | 2020-12-01 | 2020-12-01 | Drilling assistance structure and drilling assistance method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011389153.1A CN112720680A (en) | 2020-12-01 | 2020-12-01 | Drilling assistance structure and drilling assistance method |
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| CN112720680A true CN112720680A (en) | 2021-04-30 |
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| CN202011389153.1A Pending CN112720680A (en) | 2020-12-01 | 2020-12-01 | Drilling assistance structure and drilling assistance method |
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