TWM545418U - Conductive cover plate - Google Patents

Description

Conductive cover

The novel creation relates to a circuit board manufacturing technology, and more particularly to a conductive cover plate used in a circuit board drilling process.

Nowadays, due to the development of integrated circuits, the number of electronic components in the same electronic product has increased significantly, and the size of electronic components has been greatly reduced. That is, the density of electronic components per unit area on the board is greatly increased. In the production of the circuit board, it is necessary to match the high-density electronic components, and the circuit stack is usually three-dimensionally formed by drilling and filling. Due to the reduction in line width, the specifications for the aperture are getting smaller and smaller, and the requirements for the shape of the aperture and the roughness of the hole wall are also stricter.

In addition, at present, the mechanical drilling is performed by an infrared sensor to detect the bur, and a warning signal is issued when the bur is broken or other abnormal state. However, the infrared ray is easily misjudged by the influence of heat, and the warning signal is not issued at the first time for troubleshooting, which tends to cause an increase in the burring loss and a defect in the subsequent product.

In order to provide a conductive function and better drilling quality than pure aluminum, a conductive cover is provided herein. The conductive cover plate includes a metal substrate and a lubricating conductive layer. The lubricating conductive layer is on the metal substrate, wherein the lubricating conductive layer comprises a lubricating resin, a binding resin, and a plurality of conductive particles. The conductive particles are dispersed in the mixture of the lubricating resin and the bonding resin, the lubricating resin accounts for 40 to 60% by weight of the lubricating conductive layer, the bonding resin accounts for 20 to 36% by weight of the lubricating conductive layer, and the conductive particles account for 4 to 20% of the lubricating conductive layer.

In some embodiments, the metal substrate comprises at least one of aluminum, tin, an aluminum alloy, and a tin alloy, and the conductive particles are carbon black. Further, the carbon black contains at least one of graphite powder, scaly graphite powder, expanded graphite powder, activated carbon powder, and conductive carbon black.

In some embodiments, the metal substrate comprises at least one of aluminum, tin, an aluminum alloy, and a tin alloy, and the conductive particles are metal powder.

In some embodiments, the metal substrate has a thickness of 60 to 180 um and the lubricating conductive layer has a thickness of 20 to 150 um.

In some embodiments, the conductive particles have a particle size of from 1 to 100 um.

In some embodiments, the lubricating resin comprises nonyl phenol polyethylene glycol ether, polyethylene glycol (PEG), polyethylene oxide (PEO), polyvinyl alcohol (polyvinyl) At least one of alcohol, PVA) and acrylic acid; the binder resin comprises epoxy resin, acrylic resin, Oriented Poly Propylene (OPP), polyethylene terephthalate Polyethylene terephthalate (PET), polyurethane (PU), polymerized siloxanes, polyether-oxyalkylene copolymer branched alkane copolymer, and polyvinyl pyrrolidone (PVP) At least one of them.

In some embodiments, the conductive cover further comprises a metal intermediate layer and a thermally conductive adhesive layer. The intermediate layer is located between the metal substrate and the lubricating conductive layer, and the thermal conductive adhesive layer is located between the metal intermediate layer and the metal substrate. The thermal conductive adhesive layer comprises a plurality of thermal conductive particles and a binder resin, and the heat conductive particles are dispersed in the adhesive resin, wherein the adhesive resin accounts for 30 to 50% by weight of the thermal conductive adhesive layer, and the thermal conductive particles occupies 50 to 70% by weight of the thermal conductive adhesive layer.

In some embodiments, the adhesive resin comprises a ring epoxy resin, an acrylic resin, an oriented polypropylene (OPP), a polyethylene terephthalate (PET), a polyurethane (Polyurethane). , PU), polymerized siloxanes, a polyether-xane copolymer, a branched alkane copolymer, and at least one of polyvinyl pyrrolidone (PVP).

In some embodiments, the thermally conductive particles comprise molybdenum thiocarbamate, copper oleate, aluminum stearate, zinc stearate, lithium stearate, zinc stearate, molybdenum disulfide, graphite, mica. And at least one of tungsten disulfide and hexagonal boron nitride, polytetrafluoroethylene, polyether ester, polyethylene glycol, and polyvinyl alcohol.

In some embodiments, the hardness of the metal intermediate layer is less than the hardness of the metal substrate.

In the above embodiment, the lubricating conductive layer of the conductive cover plate simultaneously provides the function of conduction and lubrication. When the drill needle enters, the lubricating resin can cover the drill needle, provide buffering and lubrication, and can reduce the impact when drilling the metal substrate. . In addition, the conductive particles in the lubricating conductive layer can provide a conductive effect, so that during the drilling process, a small amount of driving voltage can be detected to detect whether there is a broken needle or an abnormal phenomenon, and the fault can be performed in a short time. exclude.

1 is a schematic structural view of a conductive cover of a first embodiment. Referring to FIG. 1, the conductive cover 1 of the first embodiment includes a metal substrate 10 and a lubricating conductive layer 20, and the lubricating conductive layer 20 is located on the metal substrate 10. The rigidity is provided by the metal substrate 10, and the conductive and lubricating effect is achieved by lubricating the conductive layer 20.

The lubricating conductive layer 20 includes a mixed resin 21 and a plurality of conductive particles 23. The mixed resin 21 contains a lubricating resin that provides a lubricating action, and a bonding resin that bonds the lubricating conductive layer 20 to the metal substrate 10. The conductive particles 23 are dispersed in the mixed resin 21. The lubricating resin accounts for 40 to 60% by weight of the lubricating conductive layer, the bonding resin accounts for 20 to 36% by weight of the lubricating conductive layer, and the conductive particles constitute 4 to 20% of the lubricating conductive layer. Preferably, the electrically conductive particles comprise from 7 to 16% of the lubricating conductive layer. Here, the proportion of the conductive particles 23 is completely incapable of conducting electricity when it is less than 3%, and higher than 20% may have an adverse effect on the bonding.

In some embodiments, the lubricating conductive layer 20 can be tightly disposed on the metal substrate 10 by means of roll coating, lamination, hot pressing, etc., to avoid delamination during drilling of the drill 500.

In some embodiments, the metal substrate 10 comprises at least one of aluminum, tin, an aluminum alloy, and a tin alloy. In some embodiments, the metal substrate has a thickness of from 60 to 180 um, preferably from 70 to 150 um, more preferably from 70 um, 100 um, and 140 um. The lubricating conductive layer 20 has a thickness of 20 to 150 um, preferably 40 to 100 um. In some embodiments, the conductive particles 23 may be carbon black or a metal powder. The carbon black may be graphite powder, scaly graphite powder, expanded graphite powder, activated carbon powder, and conductive carbon black. The metal powder may be aluminum powder, silver powder, copper powder or the like. This is merely an example, and is not intended to be limiting, and other metal materials that can provide rigidity, or conductive powders, are all implementable.

Further, the conductive particles 23 have a particle diameter of from 1 to 100 μm, preferably from 30 to 75 μm. This particle size contributes to the dispersion of the conductive particles 23 to the mixed resin 21 while also avoiding the phenomenon of particle clustering.

The lubricating resin in the mixed resin 21 comprises nonyl phenol polyethylene glycol ether, polyethylene glycol (PEG), polyethylene oxide (PEO), polyvinyl alcohol (polyvinyl alcohol). At least one of PVA) and acrylic acid. The binder resin in the mixed resin 21 comprises an epoxy resin, an acrylic resin, an oriented polypropylene (OPP), a polyethylene terephthalate (PET), a polyurethane (PU), and a polyurethane (PU). And at least one of polymerized siloxanes, a polyether-xane copolymer, a branched alkane copolymer, and a polyvinyl pyrrolidone (PVP).

By lubricating the conductive layer 20, when the drill 500 is inserted, the drill 500 can be coated and lubricated, and the rigid impact of the drill 500 and the metal substrate 10 is reduced, which helps guide the drill 500 into the metal substrate 10 and below. The circuit board 600 can avoid the winding of the needle, reduce the wear of the drill 500, and provide electrical conductivity by the conductive particles 23. When the drilling machine can apply a small driving voltage, for example, 3V, 5V, 7V, the lubricating conductive layer 20 can be turned on, thereby detecting the state of the drilling pin 500, and the needle 500 can be broken when the needle is broken. Stop the machine for a time, and troubleshoot to avoid the subsequent machine or product.

2 is a schematic structural view of a conductive cover of the second embodiment. Referring to FIG. 1, the conductive cover 2 of the second embodiment includes a metal substrate 10, a lubricating conductive layer 20, a metal intermediate layer 30, and a thermal conductive adhesive layer 40. The lubricating conductive layer 20 is located on the metal substrate 10. The metal intermediate layer 30 is located between the metal substrate 10 and the lubricating conductive layer 20. The thermal conductive adhesive layer 40 is located between the metal intermediate layer 30 and the metal substrate 10.

The metal substrate 10 and the lubricating conductive layer 20 in the conductive cover 2 of the second embodiment have substantially the same composition as the first embodiment. The thermal conductive adhesive layer 40 includes an adhesive resin 41 and a plurality of thermally conductive particles 43. The thermally conductive particles 43 are dispersed in the adhesive resin 41, the adhesive resin 41 occupies 30 to 50% by weight of the thermal conductive adhesive layer 40, and the thermally conductive particles 43 constitute 50 to 70% by weight of the thermal conductive adhesive layer 40.

In some embodiments, the hardness of the metal intermediate layer 30 is less than the hardness of the metal substrate 10. Further, the metal intermediate layer 30 may be made of a metal material having a hardness lower than that of the metal substrate 10, or may be selected from the same metal material, and is adjusted to be smaller than the hardness of the metal substrate 10 by a process.

In some embodiments, the thermally conductive particles 43 comprise molybdenum thiocarbamate, copper oleate, aluminum stearate, zinc stearate, lithium stearate, zinc stearate, molybdenum disulfide, graphite, At least one of mica, tungsten disulfide and hexagonal boron nitride, polytetrafluoroethylene, polyether ester, polyethylene glycol, and polyvinyl alcohol.

In some embodiments, the adhesive resin comprises a ring epoxy resin, an acrylic resin, an oriented polypropylene (OPP), a polyethylene terephthalate (PET), a polyurethane (Polyurethane). , PU), polymerized siloxanes, a polyether-xane copolymer, a branched alkane copolymer, and at least one of polyvinyl pyrrolidone (PVP).

Here, the burr 500 enters the metal intermediate layer 30 from the lubricating conductive layer 20, and enters the thermal conductive adhesive layer 40 and the metal substrate 10. Since the hardness of the metal intermediate layer 30 is smaller than that of the metal substrate 10, and the upper and lower sides of the metal intermediate layer 30 have resin, the drill pin 500 will first form a depression and then penetrate the metal intermediate layer 30, so that the drill pin 500 is not easily offset. . In addition, the heat-conducting particles 43 of the thermal conductive adhesive layer 40 can prevent the heat generated by the drill 500 from accumulating on the conductive cover 1 and the circuit board 600, thereby avoiding adverse effects on the circuit board 600 and prolonging the service life of the drill 500. .

In any of the above embodiments, the lubricating conductive layer 20 of the conductive cover plate 1 simultaneously provides the function of conduction and lubrication. When the burr 500 enters, the lubricating resin of the lubricating conductive layer 20 can cover the burr 500 to provide buffering and lubrication. It can reduce the rigid impact when drilling into the metal substrate 10, and can extend the service life of the drill. In addition, the conductive particles 23 in the lubricating conductive layer 20 can provide a conductive effect, so that during the drilling process, a small amount of driving voltage can be detected to detect whether there is a broken needle or a stuck phenomenon, and can be in a short time. Troubleshoot within the machine to avoid subsequent machine or product defects. Further, the metal substrate 10 can recover the characteristics of melting and remanufacturing, and can effectively reduce the impact on the environment.

While the preferred embodiment is disclosed above, it is not intended to limit the present invention, and anyone skilled in the art can make some modifications and refinements without departing from the scope of the present invention. It is subject to the definition of the scope of the patent application attached to this specification.

1‧‧‧ Conductive cover
2‧‧‧ Conductive cover
10‧‧‧Metal substrate
20‧‧‧Lubricating conductive layer
21‧‧‧ Mixed resin
23‧‧‧Electrical particles
30‧‧‧Metal intermediate layer
40‧‧‧thermal adhesive layer
41‧‧‧Adhesive resin
43‧‧‧thermal particles
500‧‧‧Drills
600‧‧‧ boards

Fig. 1 is a schematic cross-sectional view showing a first embodiment of a drilled cover plate. Fig. 2 is a schematic cross-sectional view showing a second embodiment of the drilled cover plate.

1‧‧‧ Conductive cover

10‧‧‧Metal substrate

20‧‧‧Lubricating conductive layer

21‧‧‧ Mixed resin

23‧‧‧Electrical particles

500‧‧‧Drills

600‧‧‧ boards

Claims (11)

A conductive cover comprising: a metal substrate; and a lubricating conductive layer on the metal substrate, wherein the lubricating conductive layer comprises a mixed resin and a plurality of conductive particles, and the conductive particles are dispersed in the mixed resin, The mixed resin comprises a lubricating resin comprising 40 to 60% by weight of the lubricating conductive layer, 20% to 36% by weight of the lubricating conductive layer, and 4 to 20% of the conductive conductive layer. The conductive cover of claim 1, wherein the metal substrate comprises at least one of aluminum, tin, an aluminum alloy, and a tin alloy, and the conductive particles are carbon black. The conductive cover of claim 2, wherein the carbon black comprises at least one of graphite powder, scaly graphite powder, expanded graphite powder, activated carbon powder, and conductive carbon black. The conductive cover of claim 1, wherein the metal substrate comprises at least one of aluminum, tin, an aluminum alloy, and a tin alloy, and the conductive particles are metal powder. The conductive cover of claim 1, wherein the conductive particles have a particle diameter of 1 to 100 um. The conductive cover of claim 1, wherein the metal substrate has a thickness of 60 to 180 um, and the lubricating conductive layer has a thickness of 20 to 150 um. The conductive cover of claim 1, wherein the lubricating resin comprises nonyl phenol polyethylene glycol ether, polyethylene glycol (PEG), polyethylene oxide (PEO), PEO And at least one of polyvinyl alcohol (PVA) and acrylic acid; the bonding resin comprises epoxy resin, acrylic resin, orientated polypropylene (OPP) , polyethylene terephthalate (PET), polyurethane (PU), polymerized siloxanes, polyether-xane copolymer, branched alkane copolymer, and polyethylene At least one of polyvinyl pyrrolidone (PVP). The conductive cover of claim 1, further comprising a metal intermediate layer and a thermal adhesive layer, the metal intermediate layer being located between the metal substrate and the lubricating conductive layer, wherein the thermal adhesive layer is located in the metal intermediate layer Between the metal substrates, wherein the thermal conductive adhesive layer comprises a plurality of thermally conductive particles and an adhesive resin, wherein the thermally conductive particles are dispersed in the adhesive resin, wherein the adhesive resin accounts for 30 to 50% by weight of the thermal conductive adhesive layer. The thermally conductive particles comprise from 50 to 70% by weight of the thermally conductive adhesive layer. The conductive cover of claim 8, wherein the adhesive resin comprises a ring epoxy resin, an acrylic resin, an oriented polypropylene (OPP), and a polyethylene terephthalate. , PET), Polyurethane (PU), polymerized siloxanes, polyether-oxyalkylene copolymer branched alkane copolymer, and at least one of polyvinyl pyrrolidone (PVP) . The conductive cover of claim 8, wherein the thermally conductive particles comprise molybdenum thiocarbamate, copper oleate, aluminum stearate, zinc stearate, lithium stearate, zinc stearate, At least one of molybdenum disulfide, graphite, mica, tungsten disulfide and hexagonal boron nitride, polytetrafluoroethylene, polyether ester, polyethylene glycol, and polyvinyl alcohol. The conductive cover of claim 8, wherein the metal intermediate layer has a hardness less than a hardness of the metal substrate.