CN104066265A - Multilayer printed circuit board structure - Google Patents
Multilayer printed circuit board structure Download PDFInfo
- Publication number
- CN104066265A CN104066265A CN201310094105.3A CN201310094105A CN104066265A CN 104066265 A CN104066265 A CN 104066265A CN 201310094105 A CN201310094105 A CN 201310094105A CN 104066265 A CN104066265 A CN 104066265A
- Authority
- CN
- China
- Prior art keywords
- prepreg
- resin
- circuit board
- printed circuit
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a multilayer printed circuit board structure which is obtained through successively stacking the components of: an aluminum foil base layer, a first prepreg, an aluminum foil middle layer, a second prepreg and a copper foil surface layer, wherein the first prepreg and the second prepreg are respectively prepared through dipping fiber cloth into a heat-conductive material, so that the heat-conductive material can be filled in the gaps of the fiber cloth, wherein the heat-conductive material is prepared through mixing a resin and a filler at least. According to the multilayer printed circuit board structure, through stacking and combining the aluminum foil base layer, the first prepreg, the aluminum foil middle layer, the second prepreg and the copper foil surface layer, and through the resin component contained in the first prepreg and the second prepreg, the multilayer printed circuit board structure can possess the advantages of: high heat conductivity, low moisture absorption property, high heat resistance, high melting point, low dielectric constant, low dielectric loss coefficient, no easy board delamination, etc.
Description
Technical field
The present invention is about a kind of board structure of circuit, espespecially one have that thermal conductivity, agent of low hygroscopicity, heat-resisting effect are good, high-melting-point, low-k, low-dielectric loss coefficient and be difficult for forming the advantages such as plate bursting, be specially adapted to the Multilayer printed circuit board structure that light emitting diode base plate uses.
Background technology
In recent years, electronic instrument trend is towards high function, and less weight, thickness, length and size, and printed wiring board is progressive fast, as more multi-layered, insulating barrier is thinner, density is higher.For this reason, the material utmost point that forms printed wiring board need be strengthened quality in water absorption and heat resistance, high-dimensional stability, long-term insulating properties etc.
Printed circuit board (PCB) normally floods a kind of textile with a kind of liquid-state epoxy resin at present, simultaneously above-mentioned light for coordinating, thin, short, the high function trend of little electronic instrument and in the thinner printed wiring board implemented, therefore the glass fabric that uses light weight is prepared prepreg for main base material, therefore be known in while manufacturing multilayer circuit board, first a copper clad laminate to be carried out to Darkening process, make the Copper Foil roughening on copper clad laminate two sides, on a Copper Foil, resin glass fiber cloth and another layer of Copper Foil are set therein again, finally again by copper clad laminate, resin glass fiber cloth and another layer of Copper Foil pressing, and produce a circuit board with multilayer copper foil.
But this manufacture method is to utilize copper clad laminate to process and make, except Copper Foil cost height, after preimpregnation, often cause prepreg bond area to dwindle, make the problem that causes reduced viscosity, heat conduction and moisture-proof poor, and in actual load process, easily have plate bursting problem.
Summary of the invention
In view of this, main purpose of the present invention be to provide a kind of cost low and have that thermal conductivity, agent of low hygroscopicity, heat-resisting effect are good, high-melting-point, low-k, low-dielectric loss coefficient and be difficult for forming the Multilayer printed circuit board structure of plate bursting.
For reaching above-mentioned object, a kind of Multilayer printed circuit board structure provided by the present invention, it comprises: an aluminum foil substrate; One first prepreg, it is incorporated on this aluminum foil substrate; One aluminium foil intermediate layer, it is incorporated on this first prepreg; One second prepreg, it is incorporated on this aluminium foil intermediate layer; An and Copper Foil top layer, it is incorporated on this second prepreg, wherein, this first prepreg and the second prepreg are all formed by flooding a Heat Conduction Material by a fiber cloth, this Heat Conduction Material is filled in the space of this fiber cloth, and this Heat Conduction Material at least comprises that resin and filler are allocated and forms.
When enforcement, the warp thread that this fiber cloth is 15～25 numbers and the weft yarn of 15～25 numbers are woven formation, and this fiber cloth is glass fabric, quartz fibre, nylon fiber, yarn fiber and shuffling fiber one wherein.
When enforcement, this filler can be aluminium oxide, aluminium nitride, magnesium oxide, boron nitride, aluminium hydroxide, magnesium hydroxide one wherein.
When enforcement, this resin is to add the resin of phenol, wherein at least one of its phenol aralkyl resin that is selected from phenol phenolic resins, cresols phenolic resins, naphthols aralkyl resin, triphenol methane resin, terpene upgrading phenol resin, bicyclopentadiene upgrading phenol resin and tool benzene skeleton.
When enforcement, this resin is that tool agent of low hygroscopicity and stable on heating perfluorinated thermoplastic resin, aralkyl type epoxy resin are wherein a kind of.
When enforcement, this resin is the epoxy resin that is added with the phenol addition product of conjugated diene polymer.
When enforcement, in the Heat Conduction Material of the first prepreg, this filler accounts for 1% ~ 80% ratio, in conjunction with resin account for 20 ~ 99% ratio, and in the Heat Conduction Material of the second prepreg, this filler accounts for 1% ~ 70% ratio, in conjunction with resin account for 30 ~ 99% ratio.
The present invention is by the stacked combination on aluminum foil substrate, the first prepreg, aluminium foil intermediate layer, the second prepreg and Copper Foil top layer, and the resin constituent wherein comprising, can reach there is thermal conductivity, agent of low hygroscopicity, heat-resisting effect are good, high-melting-point, low-k, low-dielectric loss coefficient and be difficult for forming the advantages such as plate bursting.
Brief description of the drawings
Fig. 1 is the sectional view of Multilayer printed circuit board structure embodiment of the present invention.
Description of reference numerals
1, aluminum foil substrate
2, the first prepreg
3, aluminium foil intermediate layer
4, the second prepreg
5, Copper Foil top layer.
Embodiment
For further understanding the present invention, below lift preferred embodiment, coordinate accompanying drawing, figure number, concrete constitution content of the present invention and effect of reaching thereof are described in detail as follows.
Refer to Fig. 1, its configuration diagram that is one of them embodiment of the present invention, it is made up of an aluminum foil substrate 1, one first prepreg 2, an aluminium foil intermediate layer 3, one second prepreg 4 and a Copper Foil top layer 5.
Refer to Fig. 1, this first prepreg 2 is incorporated on aluminum foil substrate 1, and this aluminium foil intermediate layer 3 is incorporated on the first prepreg 2; This second prepreg 4 is incorporated on aluminium foil intermediate layer 3, and this Copper Foil top layer 5 is incorporated on the second prepreg 4.
This first prepreg 2 and the second prepreg 4 are all formed by flooding a Heat Conduction Material by a fiber cloth, the thickness that thickness part is greater than the second prepreg 4 taking the first prepreg 2 thickness is as good, the warp thread that wherein this fiber cloth is 15～25 numbers and the weft yarn of 15～25 numbers are woven formation, this fiber cloth is glass fabric, quartz fibre, nylon fiber, yarn fiber or shuffling fiber one wherein, and this Heat Conduction Material can be filled in the space of this fiber cloth.
Above-mentioned Heat Conduction Material at least comprises that resin and filler are allocated and forms, and it is actual in allotment, filler in this Heat Conduction Material and resin can be allocated according to user demand, the ratio of for example allocating is identical, can make the Heat Conduction Material ratio in this first prepreg 2 and the second prepreg 4 just the same, or with different ratio allotments, for example, in the Heat Conduction Material of the first prepreg 2, this filler accounts for 1% ~ 80% ratio, in conjunction with resin account for 20 ~ 99% ratio, and in the Heat Conduction Material of the second prepreg 4, this filler accounts for 1% ~ 70% ratio, in conjunction with resin account for 30 ~ 99% ratio, so as to making the heat conduction intensity of the second prepreg 4 be greater than the first prepreg 2.
This filler can be aluminium oxide, aluminium nitride, magnesium oxide, boron nitride, aluminium hydroxide, magnesium hydroxides etc. are wherein a kind of, so as to filling and leading up hole, and can increase adherence and dielectric strength, be difficult for occurring to separate plate bursting and the bad problem of heat conduction, and because glass fabric is woven and formed by the warp thread of one 15～25 numbers and the weft yarn of 15～25 numbers, therefore the space between warp thread and weft yarn can provide more Heat Conduction Material combined thereon in the time of preimpregnation, make after pressing, integrally-built viscosity and heat-conducting effect all improve because the bonded area of Heat Conduction Material increases, make to be applied in the LED matrix that needs high-termal conductivity good, in the products such as load system, can significantly improve thermal diffusivity and the high reliability of electronic product.
In the present embodiment Heat Conduction Material, resin can select to add the resin of phenol, low elasticity during with acquisition high temperature and the superior effect of agent of low hygroscopicity, the resin of this interpolation phenol is selected from the phenol aralkyl resin of phenol phenolic resins, cresols phenolic resins, naphthols aralkyl resin, triphenol methane resin, terpene upgrading phenol resin, bicyclopentadiene upgrading phenol resin, tool benzene skeleton etc., these resins can be used alone one, also can merge use more than two kinds, and use low viscosity person better.
Or Choice of Resin is that tool agent of low hygroscopicity and stable on heating perfluorinated thermoplastic resin, aralkyl type epoxy resin are wherein a kind of, wherein perfluorinated thermoplastic resin can be for example: polytetrafluoroethylene; Tetrafluoroethene and hexafluoropropylene, vinyl ethers, ethene; Poly-(ether-ether-one); Poly-(ether-one-one); And poly-(ether-one); Polyester such as poly-(Polyethyleneglycol Terephthalate), poly-(NDA second diester) and be derived from the polyester of bisphenol-A and M-phthalic acid/terephthalic acid (TPA); Merlon, especially has a glass transition temperature of higher temperatures; Poly-4-methylpentene; Poly-(aryl sulphur); Poly-(ether-acid imide); Poly-(aryl ether); Be preferably (per) fluoropolymer, make it can there is moisture absorption, high-melting-point, low-k and low-dielectric loss coefficient texts.And in aralkyl type epoxy resin especially with biphenyl type epoxy resin the best, can improve whereby moisture-proof effect, and can obtain good thermal endurance.Resin in the present invention also can be the epoxy resin of the phenol addition product that is added with conjugated diene polymer.
Whereby, to be applied on light-emitting diode, by above-mentioned composition structure, when the light-emitting diodes route of pipe line is fixed on behind Copper Foil top layer 5, its heat can be transmitted to aluminium foil intermediate layer 3 by the second prepreg 4 fast and dispel the heat, continue again and pass to the first prepreg 2 and to aluminum foil substrate 1, except meeting heat conduction and radiating effect, can reach again the requirement of thickness and intensity simultaneously.
The above is specific embodiments of the invention and the technological means used, can derive and derive many changes and correction according to exposure herein or instruction, still can be considered that the equivalence that conception of the present invention is done changes, its effect producing does not exceed the connotation that specification and accompanying drawing are contained yet, all should be considered as within technology category of the present invention.
Claims (8)
1. a Multilayer printed circuit board structure, is characterized in that, it comprises:
One aluminum foil substrate;
One first prepreg, it is incorporated on this aluminum foil substrate;
One aluminium foil intermediate layer, it is incorporated on this first prepreg;
One second prepreg, it is incorporated on this aluminium foil intermediate layer;
One Copper Foil top layer, it is incorporated on this second prepreg;
Wherein, this first prepreg and the second prepreg are all formed by flooding a Heat Conduction Material by a fiber cloth, and this Heat Conduction Material is filled in the space of this fiber cloth, and this Heat Conduction Material at least comprises that resin and filler are allocated and forms.
2. Multilayer printed circuit board structure as claimed in claim 1, is characterized in that, the warp thread that this fiber cloth is 15～25 numbers and the weft yarn of 15～25 numbers are woven formation.
3. Multilayer printed circuit board structure as claimed in claim 2, is characterized in that, this fiber cloth is glass fabric, quartz fibre, nylon fiber, yarn fiber and shuffling fiber one wherein.
4. Multilayer printed circuit board structure as claimed in claim 1, is characterized in that, this filler is aluminium oxide, aluminium nitride, magnesium oxide, boron nitride, aluminium hydroxide, magnesium hydroxide one wherein.
5. Multilayer printed circuit board structure as claimed in claim 1, it is characterized in that, this resin is to add the resin of phenol, wherein at least one of its phenol aralkyl resin that is selected from phenol phenolic resins, cresols phenolic resins, naphthols aralkyl resin, triphenol methane resin, terpene upgrading phenol resin, bicyclopentadiene upgrading phenol resin and tool benzene skeleton.
6. Multilayer printed circuit board structure as claimed in claim 1, is characterized in that, this resin is that tool agent of low hygroscopicity and stable on heating perfluorinated thermoplastic resin, aralkyl type epoxy resin are wherein a kind of.
7. Multilayer printed circuit board structure as claimed in claim 1, is characterized in that, this resin is the epoxy resin that is added with the phenol addition product of conjugated diene polymer.
8. Multilayer printed circuit board structure as claimed in claim 1, it is characterized in that, in the Heat Conduction Material of described the first prepreg, this filler accounts for 1% ~ 80% ratio, in conjunction with resin account for 20 ~ 99% ratio, and in the Heat Conduction Material of described the second prepreg, this filler accounts for 1% ~ 70% ratio, in conjunction with resin account for 30 ~ 99% ratio.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094105.3A CN104066265A (en) | 2013-03-22 | 2013-03-22 | Multilayer printed circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310094105.3A CN104066265A (en) | 2013-03-22 | 2013-03-22 | Multilayer printed circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104066265A true CN104066265A (en) | 2014-09-24 |
Family
ID=51553724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310094105.3A Pending CN104066265A (en) | 2013-03-22 | 2013-03-22 | Multilayer printed circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104066265A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106480735A (en) * | 2015-08-28 | 2017-03-08 | 广东生益科技股份有限公司 | Circuit substrate and preparation method thereof |
| CN108541137A (en) * | 2017-03-03 | 2018-09-14 | 合正科技股份有限公司 | Conductive cover plate |
| CN108701683A (en) * | 2016-02-18 | 2018-10-23 | 科锐 | The wherein semiconductor package part based on PCB of integrated impedance matching network element |
| CN110089202A (en) * | 2016-12-28 | 2019-08-02 | 株式会社藤仓 | The manufacturing method of circuit board and circuit board |
| WO2019228104A1 (en) * | 2018-05-30 | 2019-12-05 | 奇酷互联网络科技（深圳）有限公司 | Prepreg, prepreg preparation method, circuit board and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090288874A1 (en) * | 2005-03-04 | 2009-11-26 | Sanmina Sci Corporation | Simultaneous and Selective Partitioning of Via Structures Using Plating Resist |
| CN101902875A (en) * | 2009-05-19 | 2010-12-01 | 松下电器产业株式会社 | Multilayer wiring board |
| CN102365310A (en) * | 2009-03-27 | 2012-02-29 | 日立化成工业株式会社 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same |
| CN202396087U (en) * | 2011-12-08 | 2012-08-22 | 合正科技股份有限公司 | Substrate structure of printed circuit board |
| CN203313513U (en) * | 2013-03-22 | 2013-11-27 | 叶云照 | Structure of multiple layers of printed circuit boards |
-
2013
- 2013-03-22 CN CN201310094105.3A patent/CN104066265A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090288874A1 (en) * | 2005-03-04 | 2009-11-26 | Sanmina Sci Corporation | Simultaneous and Selective Partitioning of Via Structures Using Plating Resist |
| CN102365310A (en) * | 2009-03-27 | 2012-02-29 | 日立化成工业株式会社 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same |
| CN101902875A (en) * | 2009-05-19 | 2010-12-01 | 松下电器产业株式会社 | Multilayer wiring board |
| CN202396087U (en) * | 2011-12-08 | 2012-08-22 | 合正科技股份有限公司 | Substrate structure of printed circuit board |
| CN203313513U (en) * | 2013-03-22 | 2013-11-27 | 叶云照 | Structure of multiple layers of printed circuit boards |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106480735A (en) * | 2015-08-28 | 2017-03-08 | 广东生益科技股份有限公司 | Circuit substrate and preparation method thereof |
| CN106480735B (en) * | 2015-08-28 | 2019-06-14 | 广东生益科技股份有限公司 | Circuit substrate and preparation method thereof |
| CN108701683A (en) * | 2016-02-18 | 2018-10-23 | 科锐 | The wherein semiconductor package part based on PCB of integrated impedance matching network element |
| CN108701683B (en) * | 2016-02-18 | 2021-08-13 | 科锐 | PCB-based semiconductor package with integrated impedance matching network elements therein |
| CN110089202A (en) * | 2016-12-28 | 2019-08-02 | 株式会社藤仓 | The manufacturing method of circuit board and circuit board |
| CN108541137A (en) * | 2017-03-03 | 2018-09-14 | 合正科技股份有限公司 | Conductive cover plate |
| WO2019228104A1 (en) * | 2018-05-30 | 2019-12-05 | 奇酷互联网络科技（深圳）有限公司 | Prepreg, prepreg preparation method, circuit board and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104066265A (en) | Multilayer printed circuit board structure | |
| CN101974208A (en) | High thermal conductivity resin composition and high thermal conductivity coated metal foil board manufactured by using same | |
| CN101735456A (en) | High weather-proof thermosetting resin composite and prepreg and copper-clad laminate prepared thereby | |
| JP5598190B2 (en) | Thermosetting resin composition for circuit board | |
| CN101848604A (en) | Preparation method of CEM-3 copper clad plate with high heat conductivity | |
| JP2011213784A (en) | Epoxy resin precursor composition, prepreg, laminated board, resin sheet, printed wiring board, and semiconductor device | |
| CN205755052U (en) | There is laser direct forming structuring function and the aluminium base of Rotating fields insulating barrier | |
| CN107429067B (en) | Laminate for insulation | |
| KR20110028672A (en) | The method for producing circuit board with high heat sink | |
| US20110274877A1 (en) | Method for manufacturing metal base laminate | |
| US8415004B2 (en) | Low thermal-impedance insulated metal substrate and method for manufacturing the same | |
| CN203313513U (en) | Structure of multiple layers of printed circuit boards | |
| JP2010189614A (en) | Resin composition, support material with insulative layer, prepreg, laminated board for light-emitting element, circuit board for light emitting element, and light emitting device | |
| JP2017028128A (en) | Substrate for power module, circuit board for power module, and power module | |
| JP2013235897A (en) | Method for manufacturing optical semiconductor device substrate, optical semiconductor device substrate and optical semiconductor device | |
| CN103770436B (en) | A kind of preparation method and applications of halogen-free high-thermal-conductivity resin matrix composite | |
| KR101704793B1 (en) | Printed circuit boards using the epoxy resin composition and its manufacturing method | |
| TW201529308A (en) | Carrier material with resin layer, laminate board, circuit board, and electronic device | |
| JP3184422U (en) | Multilayer printed circuit board structure | |
| CN209448967U (en) | A kind of high thermal conductivity power supply board and device | |
| US20140262450A1 (en) | Multilayer Printed Circuit Board Structure | |
| JPH10321974A (en) | Board for forming circuit | |
| JP5729336B2 (en) | Epoxy compound, resin composition, resin sheet, laminate and printed wiring board | |
| KR101238238B1 (en) | Thin ceramic pcb module and thermally conductive adhesive composition | |
| CN104708869A (en) | Aluminum-based copper-clad plate with high thermal conductivity and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140924 |