M371379 五、新型說明： 【新型所屬之技術4員域】 本創作是有關於—種蓋板結構，且特別是有關於一種 鑽孔用之散熱辅助的蓋板結構。 【先前技術】 線路基板主要是由圖案化線路層（patterned circuit layer)以及核心層（c〇re iayer)交替疊合所構成，其中線 路基板通常具有導電貫孔（platingThr〇ughH〇le，pTH)結 構’而相疊之圖案化線路層之間可透過導電貫孔結構而彼 此電性連接。-般而言，是以機械鑽孔的方式先於線路基 板上形成多個貫孔，接著，以篇銅的方式軸一電鍛展 於貫孔之關壁上，之後，再填人—絕緣材料於貫孔中， 而形成所謂的導電貫孔（pTH)結構。 詳細而言，以機械鑽孔的方式於線路基板上形成貫孔 的步驟’首先i於線路基板的上方放置—錄板，其中叙 蓋板是由-織板與形成於㈣板上的—水溶性樹脂 組成。之後’措由鑽針貫穿紹蓋板以及線路基板而形成貫 孔。然而，由於銘蓋板的厚度較厚且硬度較高，使复能接 供給鑽針的缓衝效果有限，因此當使用刀雜細或研 數㈣導致強度較弱的鑽針，且欲—次貫穿减板時，ς 了銘盖板的穩定度仍顯不足外，鑽針亦容易發生斷 象’因此鋁蓋板的成本也變得較高。 疋 M371379 【新型内容】 與散熱功能的蓋板結構。 板上。蓋板結胁1孔時配置於-基 樹脂層。導電層具有_卜二;树脂層以及-第二 面。第-樹脂層覆蓋導電層的下表—面相^於上^的下表 板之間。第二樹脂層覆罢導位於導電層與基 層的厚度小於第-樹的上表面’其中第二樹腊 在本創作之一實施例中，上述之 膏、銀膏、紹膏、導電樹脂或上述組合之包括銅 屬粒ί本創作之—實施例中，上述之導電層更包括多顆金 =創作之—實_中，上述之第—樹脂層的材質包 括艰她自旨（PC)或聚乙埽對苯二曱酸_(ρΕτ)。、 於實施财，上狀第—靠層的厚度介 於35姣未至200微米之間。 括創作之—實施财，上述之第二樹脂層的材質包 基㈣酸甲醋（ΡΜΜΑ)、聚氨醋（ρυ)或上述組 5之複合材料。 在本創作之一實施例中，上述之第二樹脂層的厚度介 於5微米至50微米之間。 在本創作之一實施例中，上述之第二樹脂層的鉛筆硬 度規格小於或等於1Η。 基於上述，由於本創作之蓋板結構是由二樹脂層與一 M371379 導電層的搭配所組成，因此當基板需進 於基板上放置此蓋板結構，城供科 且可避免騎回針時殘膠域脂層軸技基 題。換言之’本齡之蓋板結構除了具 熱的能力外，亦可達__針與增加下力與用政 徵和優减㈣ 舉η施例，亚配合所附圖式作詳細說明如下。M371379 V. New description: [New technology 4 member field] This creation is about a kind of cover structure, and especially related to a heat dissipation auxiliary cover structure for drilling. [Prior Art] The circuit substrate is mainly composed of a patterned circuit layer and a core layer (c〇re iayer), wherein the circuit substrate usually has a conductive through hole (platingThr〇ughH〇le, pTH). The structure's stacked circuit layers are electrically connected to each other through a conductive via structure. Generally speaking, a plurality of through holes are formed on the circuit substrate by means of mechanical drilling, and then the shaft is electrically forged on the closed wall of the through hole in the form of copper, and then refilled with insulation. The material is in the via and forms a so-called conductive via (pTH) structure. In detail, the step of forming a through hole on the circuit substrate by means of mechanical drilling is first placed on top of the circuit substrate - the recording plate, wherein the cover plate is formed by the - weaving plate and the water formed on the (four) plate. Resin composition. Then, the boring needle passes through the cover plate and the circuit substrate to form a through hole. However, because the thickness of the cover plate is thick and the hardness is high, the buffering effect of the multi-energy connection to the drill pin is limited, so when the use of the knife or the number of grinding (four) results in a weaker drill needle, and When the plate is cut through, the stability of the cover plate is still insufficient, and the drill pin is also prone to breakage. Therefore, the cost of the aluminum cover plate is also higher.疋 M371379 [New content] Cover structure with heat dissipation function. On the board. When the cover plate is covered with one hole, it is disposed on the -based resin layer. The conductive layer has a resin layer and a second surface. The first-resin layer covers the lower surface of the conductive layer - the surface is between the upper and lower plates. The second resin layer is coated and the thickness of the conductive layer and the base layer is smaller than the upper surface of the first tree. The second tree wax is in the embodiment of the present invention, the above-mentioned paste, silver paste, scented paste, conductive resin or the above The combination includes a copper granule. In the embodiment, the conductive layer further includes a plurality of gold=created-real_, and the material of the first-resin layer includes a hard-to-use (PC) or poly Ethylene terephthalic acid _(ρΕτ). In the implementation of the financial, the upper layer - the thickness of the layer is between 35 姣 and 200 microns. Including the creation-implementation, the material of the second resin layer mentioned above is a composite material of (4) acid methyl vinegar (ΡΜΜΑ), polyurethane (ρυ) or the above group 5. In an embodiment of the present invention, the second resin layer has a thickness of between 5 microns and 50 microns. In an embodiment of the present invention, the second resin layer has a pencil hardness specification of less than or equal to 1 Torr. Based on the above, since the cover structure of the present invention is composed of a combination of a two-resin layer and a conductive layer of M371379, when the substrate needs to be placed on the substrate, the cover structure is placed, and the city can be prevented from riding back. Glue domain lipid layer axis technology. In other words, the cover structure of this age can be used in addition to the heat capacity, and can also be used to increase the force and use of the tactics and the advantages and disadvantages.
【實施方式】 ^1為本創作之-實施例之_種蓋板結構的示意圖， 圖=圖1之蓋板結構配置於—基板上的示意圖。請同時 二θ 1與圖2 ’在本實施例中，蓋板結構1〇〇適於配置 =基板10上，其中基板10例如是由二線路層14 (或兩 =路板以上）與-核心層12交錯堆疊所形成（或未加工 之土版），且核心層12是位於這些線路層14之間，但不[Embodiment] ^1 is a schematic view of a cover structure of the present invention-embodiment, and Fig. 1 is a schematic view of the cover structure of Fig. 1 disposed on a substrate. Please simultaneously two θ 1 and FIG. 2 'In this embodiment, the cover structure 1 〇〇 is adapted to be disposed on the substrate 10, wherein the substrate 10 is, for example, composed of two circuit layers 14 (or two = road plates or more) and - core Layer 12 is formed by staggered stacking (or unprocessed soil version), and core layer 12 is located between these circuit layers 14, but not
以此為限。蓋板結構1〇〇包括—導電層、一第一樹脂 層120以及一第二樹脂層13〇。 詳細而言，導電層110具有—上表面n2與一相對於 上表，112的下表面in，其中導電層11〇的材質例如是 金，@，其包括銅貧、銀貧、鋁膏、導電樹脂或上述組合This is limited to this. The cover structure 1 includes a conductive layer, a first resin layer 120, and a second resin layer 13A. In detail, the conductive layer 110 has an upper surface n2 and a lower surface in with respect to the upper surface, 112, wherein the material of the conductive layer 11 is, for example, gold, @, which includes copper lean, silver lean, aluminum paste, conductive Resin or combination of the above
之合金貧。於較佳實施例中，導電層11()的材質例如是鋁 膏或铜膏。 H 第一樹脂層120覆蓋導電層11〇的下表面U4，且位 於導電層110舆基板1〇之間，其中第一樹脂層120為一非 M371379 水溶性樹脂層，其材質例如是聚碳酸酯（pc)或聚乙烯對 苯二曱酸酯（PET)。在本實施例中，第一樹脂層12〇的 厚度介於35微米至2〇〇微米之間。 —第二樹脂層130覆蓋導電層110的上表面112，其中 第一樹脂層130為一非水溶性樹脂層，其材質例如是聚甲 ^丙烯酸曱S旨（PMMA)、聚氨醋（pu)或上述組合之複 :椅料。在本實施例中，第二樹脂層13〇的厚度小於第— m層120的厚度，第二樹脂層130的錯筆硬度規格小於 或^於1H，較佳地，第二樹脂層13〇的厚度介於 至 50微米之間。 ，必__是，本實關之蓋板結構⑽的形 月以Ϊ —樹脂層12G作為—基材。接著，於第—樹 並經由紫外屬貧可加人光起始劑， 由$外先（其波長介於奈米至45()奈 ，合反應，而形成所謂的導電層11〇。之後，^；導電The alloy is poor. In a preferred embodiment, the material of the conductive layer 11 () is, for example, an aluminum paste or a copper paste. The first resin layer 120 covers the lower surface U4 of the conductive layer 11 , and is located between the conductive layer 110 and the substrate 1 , wherein the first resin layer 120 is a non-M371379 water-soluble resin layer, and the material thereof is, for example, polycarbonate. (pc) or polyethylene terephthalate (PET). In the present embodiment, the thickness of the first resin layer 12 is between 35 μm and 2 μm. The second resin layer 130 covers the upper surface 112 of the conductive layer 110, wherein the first resin layer 130 is a water-insoluble resin layer, and the material thereof is, for example, polymethyl acrylate (PMMA), polyurethane (pu) Or a combination of the above: chair material. In the present embodiment, the thickness of the second resin layer 13A is smaller than the thickness of the first m layer 120, and the wrong hardness of the second resin layer 130 is less than or equal to 1H, preferably, the second resin layer 13 is The thickness is between 50 microns. It must be __ Yes, the shape of the cover structure (10) of the present embodiment is made of Ϊ-resin layer 12G as the substrate. Then, in the first tree and via a UV-depleted human photoinitiator, from the external (the wavelength is between nanometer and 45 (), the reaction is formed to form a so-called conductive layer 11〇. Thereafter, ^; Conductive
k j㈣滾輪塗佈的方式塗佈—非水溶性樹腊層，I 射及降溫冷較後，並㈣紫外光照 13〇。另外，上诚之^成/、有南平整度的第二樹脂層 卜上处之蓋板結構之带 層120與第二樹脂層13〇 电曰=、苐一樹脂 不以此為限。 成丨跡，僅絲例說明，並 本貫施例之蓋板結構1〇 二樹脂層130的形成過程中加二广黾^ 110與第 例中，亦可以有選擇性的加二^ M371379 第Μ月曰層13〇的形成過程中未加人光起始劑時，可選擇 1用紅外線或H烤的方式，來HHb金屬膏與非水溶性樹 月曰層’以形成所需之導電層110與第二樹脂層130，仍屬 於本創作可採用的技術方案，不脫離本創作所欲保護的範 圍。 ’ 由於在此所述之導電層110是由金屬膏加熱固化所形 1成#因此於導電層110的形成過程中，可藉由調整金屬膏 • 喊度、煤烤溫度（或照射溫度）或烘烤時間（或照射時 間來調整導電層110的硬度。換言之，本實施例之導電 f 110可任意難其硬度。第二樹脂層m亦可以藉由溶 與固成分比例、烘烤溫度（或照射溫度）或烘烤時間（或 =射時間）來調整第二樹脂層13G的硬度。此外，由於導 龟層110的材貝為金屬貧，且其材質硬度比金屬軟，因此 除了可作為-緩衝材料外，同日夺亦具有散熱的功能。另外， 於其他實施例中，導電層110可更包括多顆金屬粒子，可 _ 有效加強提升蓋板結構100的散熱效果。 * 此外，當基板10進行鑽孔製程時，鑽針會依序穿過 —位於基板10上方之蓋板結構100的第二樹脂層130、導電 層110與第一樹脂層120。由於第—樹脂層12〇所選擇材 Γ 質其硬度較高，而第二樹脂層13〇所選擇的材質可於形成 過私中藉由溶劑與固成分比例、烘烤溫度（ ，或(或照射時間）來調整其硬度，因;:當 -人貝穿蓋板結構100與基板10時’第二樹脂層13〇可供鑽 ^ 針較佳地緩衝效果，而導電層no可提供鑽針良好的散熱 M371379 的效果’當鑽針抽離蓋板結構⑽與基板1〇時，因第一樹 脂層120硬度較硬，可避免騎回針時的殘膠，且第一樹 脂層⑽也不會_至基板1Q上。簡言之，本實施例之蓋 板結構100具有較佳地缓衝與散熱的能力。 ㈣= 所述’由於本創作之蓋板結構是由二樹脂層與-¥電層的搭配所組成，因此#基板需 :基=置:蓋板結構，以提供鑽針缓衝 =，且可避免鑽針殘膠及樹脂層黏附至基板上的問題。換 :之，本創作之蓋板結構除了具有較佳地緩衝與散熱的能 力之外，亦可達__針與增加下針醉料功用。此 1，本創作之蓋板結構的導電層亦可以包含多顆金屬粒 子，可有效加強提升散熱效果外。 雖然本創作已以實施例揭露如上，然其並 本創作，任何所屬技術領域中具有通常知識者，在不脫離 本創作之精神和範_，當可作些許之更動與_，故本 創作之保護範®當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為本創作之-實施例之—種蓋板結構的示意圖。 圖2為圖1之蓋板結構配置於一基板上的示意圖。 【主要元件符號說明】 1〇 ·基板 12 :核心層 M371379 14 :線路層 100 :蓋板結構 110 :導電層 112 :上表面 114 :下表面 120 :第一樹脂層 130 :第二樹脂層k j (four) roller coating method coating - water-insoluble tree wax layer, I shot and cooling after cooling, and (four) ultraviolet light 13 〇. In addition, the layer 120 and the second resin layer 13 of the cover layer structure of the second resin layer having the flatness of the upper layer are not limited thereto. Into the traces, only the wire example, and the cover structure of the present embodiment, the formation of the second resin layer 130 in the process of adding the second 黾 ^ 110 and the first case, can also be selectively added two ^ M371379 When the photoinitiator is not added during the formation of the 13〇 layer of the Μ月曰 layer, you can choose 1 to use the infrared or H-bake method to form the desired conductive layer with the HHb metal paste and the water-insoluble tree layer. The 110 and the second resin layer 130 are still in the technical solution that can be used in the present invention without departing from the scope of the present invention. Since the conductive layer 110 described herein is formed by heat curing of a metal paste, it can be adjusted during the formation of the conductive layer 110 by adjusting the metal paste, the coal baking temperature (or the irradiation temperature), or Baking time (or irradiation time to adjust the hardness of the conductive layer 110. In other words, the conductive f 110 of the present embodiment can be arbitrarily difficult to have hardness. The second resin layer m can also be obtained by ratio of dissolution to solid content, baking temperature (or The irradiation temperature) or the baking time (or the injection time) is used to adjust the hardness of the second resin layer 13G. Further, since the material of the turtle layer 110 is poor in metal and its material hardness is softer than metal, it can be used as - In addition, in other embodiments, the conductive layer 110 may further include a plurality of metal particles, which can effectively enhance the heat dissipation effect of the lifting cover structure 100. During the drilling process, the drill pins are sequentially passed through the second resin layer 130 of the cover structure 100 above the substrate 10, the conductive layer 110 and the first resin layer 120. The material selected by the first resin layer 12 Γ quality The degree is higher, and the material selected by the second resin layer 13 can be adjusted in the form of solvent and solid content, baking temperature (or (or irradiation time)), and the hardness is adjusted; When the manhole wears the cover structure 100 and the substrate 10, the second resin layer 13 can provide a better buffering effect, and the conductive layer no can provide the effect of the good heat dissipation of the drill pin M371379 'When the drill needle is pulled away from the cover When the plate structure (10) and the substrate 1 are hard, since the hardness of the first resin layer 120 is hard, the residual glue when riding the needle can be avoided, and the first resin layer (10) is not _ to the substrate 1Q. In short, the present embodiment For example, the cover structure 100 has the ability to better buffer and dissipate heat. (4) = The 'covering structure of the present invention is composed of a combination of a two-resin layer and a -¥ electric layer, so the #substrate needs: = set: cover structure to provide drill pin cushion =, and can avoid the problem of the residual glue of the drill and the adhesion of the resin layer to the substrate. In other words, the cover structure of the present invention has better cushioning and heat dissipation. In addition to the ability, it can also reach the __ needle and increase the needle drunk effect. This 1, the cover structure of the creation The electric layer may also contain a plurality of metal particles, which can effectively enhance the heat-dissipating effect. Although the present invention has been disclosed above by way of example, it can be found that any person having ordinary knowledge in the technical field does not deviate from the creation. Spirit and Fan _, when a little change and _ can be made, the protection of this creation is defined by the scope of the patent application attached to it. [Simplified illustration] Figure 1 is the creation of the embodiment - Figure 2 is a schematic view showing the cover structure of Figure 1 disposed on a substrate. [Main component symbol description] 1 〇 · substrate 12 : core layer M371379 14 : circuit layer 100 : cover structure 110 : conductive layer 112 : upper surface 114 : lower surface 120 : first resin layer 130 : second resin layer