JP3134127U - Heat dissipation auxiliary plate for high speed drilling - Google Patents

Heat dissipation auxiliary plate for high speed drilling Download PDF

Info

Publication number
JP3134127U
JP3134127U JP2007003851U JP2007003851U JP3134127U JP 3134127 U JP3134127 U JP 3134127U JP 2007003851 U JP2007003851 U JP 2007003851U JP 2007003851 U JP2007003851 U JP 2007003851U JP 3134127 U JP3134127 U JP 3134127U
Authority
JP
Japan
Prior art keywords
auxiliary plate
speed drilling
drilling
heat radiation
drilling according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2007003851U
Other languages
Japanese (ja)
Inventor
銘證 蕭
Original Assignee
合正科技股▲ふん▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 合正科技股▲ふん▼有限公司 filed Critical 合正科技股▲ふん▼有限公司
Application granted granted Critical
Publication of JP3134127U publication Critical patent/JP3134127U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2250/00—Compensating adverse effects during turning, boring or drilling
    • B23B2250/12—Cooling and lubrication
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

Abstract

【課題】印刷回路基板の穴あけ加工において、ドリルの研磨と潤滑及び伝熱効果を発揮する高速穴あけ用放熱補助板材を提供する。
【解決手段】高速穴あけ用放熱補助板材１は、硫化物、ハロゲン化物、セレン化物などからなるナノ微粉末を含む複合材料層１１を支持材１３に塗布し、該複合材料層上に更に脂肪族ポリマーやエステル類のコポリマーなどからなる潤滑層１２を形成することによって、印刷回路基板２の穴あけ加工中にドリルの研磨、潤滑および伝熱の作用を達成し、切削屑の飛散やドリルの折損を防止する。
【選択図】図２Disclosed is a heat radiation auxiliary plate for high-speed drilling that exhibits drilling, lubrication, and heat transfer effects in drilling a printed circuit board.
A heat dissipation auxiliary plate 1 for high-speed drilling includes applying a composite material layer 11 containing nano fine powders of sulfide, halide, selenide, etc. to a support material 13, and further forming an aliphatic group on the composite material layer. By forming the lubrication layer 12 made of a polymer or a copolymer of esters, the drilling, lubrication, and heat transfer functions are achieved during drilling of the printed circuit board 2 to reduce the scattering of cutting waste and breakage of the drill. To prevent.
[Selection] Figure 2

Description

本考案は、印刷回路基板の穴あけに使用されるカバープレートの板材に関し、特に、穴あけ加工において、研磨とドリルの潤滑及び伝熱の作用を達成する、複合材料層を設けてなる高速穴あけ用放熱補助板材に関する。   TECHNICAL FIELD The present invention relates to a plate material for a cover plate used for drilling a printed circuit board, and in particular, in a drilling process, heat dissipation for high-speed drilling provided with a composite material layer that achieves polishing, drill lubrication and heat transfer. The auxiliary plate material.

近年から、電子技術の日進月歩の発展に従い、多くの先端技術産業が相継いで登場し、そのため、より人間的で、機能の優れた電子製品が、絶え間なく更新され、また、このような電子製品は、更に絶え間なく軽薄短小へ向かって、設計発展する傾向がある。各電子製品は、いずれも少なくとも、多くの電子素子と回路基板から構成されるマザーボードを有し、回路基板の機能は、各電子素子を搭載して電気的に接続し、これらの電子素子が、互いに電気的に接続されるようにすることにあり、現在において、よく見られる回路基板は、印刷回路基板（Printed Circuit Board: PCB）である。 In recent years, along with the progress of electronic technology, many advanced technology industries have appeared in succession, and as a result, more human and functional electronic products are constantly being updated, and such electronic products There is a tendency for the design and development to continue to lighter, smaller and smaller continuously. Each electronic product has at least a mother board composed of many electronic elements and a circuit board, and the function of the circuit board is to mount and electrically connect each electronic element. At present, a circuit board that is often used is to be electrically connected to each other, and is a printed circuit board (PCB).

印刷回路基板は、電子部品を１つに接続して全体としての機能を発揮させることができるので、電子情報製品にとって、不可欠の基本構成要素である。しかし、印刷回路基板の構造品質が均一ではないため、その適否が直接に電子製品の信頼度に悪影響を与えるだけではなく、システム製品の競争力も左右するため、PCBは、良く、「電子システム製品の母」や「3C産業の基」と言われる。印刷回路基板は、絶縁性の材料で作製した平板であり、この平板に、通常、チップ或いは他の電子素子を実装するための穴が形成される。素子の穴より、予めに板面に印刷された金属配線が、電気的に接続され、電子素子のピンを、PCBに通した後、導電性金属であるハンダ材料によりPCBに結合して回路が形成される。   A printed circuit board is an indispensable basic component for an electronic information product because an electronic component can be connected to one to exhibit an overall function. However, since the structural quality of printed circuit boards is not uniform, its suitability not only directly affects the reliability of electronic products, but also affects the competitiveness of system products. "Mother" and "3C industry foundation". The printed circuit board is a flat plate made of an insulating material, and a hole for mounting a chip or other electronic element is usually formed on the flat plate. Metal wiring previously printed on the plate surface is electrically connected from the hole of the element, and after passing the pin of the electronic element through the PCB, the circuit is connected to the PCB by the solder material which is a conductive metal It is formed.

しかし、回路基板において穴あけをする時、アパーチャが小さい穴について、対応して比較的に小さいドリルを使用する必要があるため、これにより、ドリルが切断されることが良く発生する。既存の一般技術による印刷回路基板の穴あけ方法は、印刷回路基板上にアルミニウムカバープレートを設け（図３参照）て、穴あけの時、ドリルの緩衝や放熱に供する。当該アルミニウムカバープレートは、一般にアルミ箔層と、多孔繊維層と、潤滑層とからなる。   However, when drilling in a circuit board, it is necessary to use a correspondingly smaller drill for holes with small apertures, which often results in the drill being cut. In the conventional method for drilling a printed circuit board, an aluminum cover plate is provided on the printed circuit board (see FIG. 3), and when drilling, the drill is buffered or radiated. The aluminum cover plate generally includes an aluminum foil layer, a porous fiber layer, and a lubricating layer.

このアルミニウムカバープレートは、穴あけの時、当該多孔繊維層が、固体で、且つ、容易に溶解しないため、穴あけの過程において、穿孔した孔の中に屑が生成されて、ドリルの切断や印刷回路基板の穴あけ部分の内壁の粗雑化を引き起こす。   In this aluminum cover plate, since the porous fiber layer is solid and does not easily dissolve when drilling, scraps are generated in the drilled holes in the drilling process, and drill cutting and printing circuits are performed. This causes roughening of the inner wall of the holed portion of the substrate.

当該多孔繊維層は、ドリルの回転数を上昇して穴あけの速度を向上する時、ドリルが高速摩擦により生成した熱エネルギーを効果的に放熱することができなくなり、これにより、ドリルの使用寿命が短縮される。   When the perforated fiber layer increases the rotation speed of the drill to increase the drilling speed, the drill cannot effectively dissipate the thermal energy generated by the high-speed friction, which increases the service life of the drill. Shortened.

また、当該アルミニウムカバープレートのアルミ箔層は、穴あけの過程において、ドリルの潤滑が不十分であると、穴あけの時、ドリルの高速回転により大量に生じた金属屑が容易に印刷回路基板の上に落ち、それを清浄に処理しないと、印刷回路基板が、使用する時、回路短絡を生じて製品の信頼度に悪影響を与える。
特開２００５−１６９５３８号公報 In addition, if the aluminum foil layer of the aluminum cover plate is not sufficiently lubricated in the drilling process, metal scrap generated in large quantities due to the high-speed rotation of the drill during drilling can be easily removed from the printed circuit board. Otherwise, if it is not treated cleanly, the printed circuit board will cause a short circuit when used, adversely affecting the reliability of the product.
JP 2005-169538 A

本考案の目的は、構成が簡単で、コストが低廉で、印刷回路基板の穴あけ加工に適用される高速穴あけ用放熱補助板材を提供することである。 An object of the present invention is to provide a heat radiation auxiliary plate for high-speed drilling that is simple in construction, low in cost, and applied to drilling of a printed circuit board.

本考案の他の目的は、穴あけの過程において、同時に、ドリルの研磨と潤滑ができる高速穴あけ用放熱補助板材を提供することである。   Another object of the present invention is to provide a heat radiation auxiliary plate for high speed drilling which can simultaneously polish and lubricate a drill in the drilling process.

本考案の更に他の目的は、穴あけの過程において、穴あけ部分の内壁が荒くなることやドリルが切断されることを防止できる高速穴あけ用放熱補助板材を提供することである。   Still another object of the present invention is to provide a heat radiation auxiliary plate for high-speed drilling that can prevent the inner wall of the drilled part from becoming rough and the drill from being cut during the drilling process.

本考案の他の目的は、効果的にドリルの熱エネルギーを伝導できる高速穴あけ用放熱補助板材を提供することである。 Another object of the present invention is to provide a heat dissipation auxiliary plate for high speed drilling which can effectively conduct the thermal energy of a drill.

上記の目的を達成するために、本考案の高速穴あけ用補助板材は、支持材と複合材料層及び潤滑層からなり、当該複合材料層は、ナノ微粉末が含有され、当該複合材料層が、当該支持材の上に塗布され、当該潤滑層が当該複合材の上に塗布され、これにより、穴あけ加工の時、ドリルが上記の高速穴あけ用放熱補助板材によって、ドリルの研磨と潤滑そして伝熱の目的を実現する。   In order to achieve the above object, the auxiliary plate material for high-speed drilling of the present invention comprises a support material, a composite material layer, and a lubrication layer, and the composite material layer contains nano fine powder, and the composite material layer comprises: It is applied on the support material, and the lubricating layer is applied on the composite material. Thus, when drilling, the drill is polished, lubricated and heat-transferred by the high-speed drilling heat dissipation plate. Realize the purpose.

本考案は、次の利点が得られる。 The present invention has the following advantages.

１、本考案は、構成が簡単で、低いコストにより印刷回路基板の穴あけ加工に適用される高速穴あけ用放熱補助板材を提供できる。 1. The present invention can provide a heat radiation auxiliary plate for high-speed drilling, which is simple in configuration and applied to drilling a printed circuit board at a low cost.

２、本考案は、複合材に含有されるナノ微粉末により、穴あけの過程において、同時にドリルの研磨と潤滑ができる高速穴あけ用放熱補助板材を提供できる。 2. The present invention can provide a heat radiating auxiliary plate for high-speed drilling that can simultaneously grind and lubricate the drill in the drilling process by the nano fine powder contained in the composite material.

３、本考案は、固体耐磨耗潤滑塗層の構造により、従来の多孔繊維層の構造と比較すると、穴あけの過程において、屑の生成により、穴あけ部分の内壁面が荒くなることやドリルが切断されることを防止できる高速穴あけ用放熱補助板材を提供できる。 3. Compared with the structure of the conventional porous fiber layer, the present invention has a structure of solid wear-resistant lubricating coating layer. It is possible to provide a heat dissipation auxiliary plate for high speed drilling that can be prevented from being cut.

４、本考案は、当該支持材が、プラスチック板材とした時、効果的に作製のコストが低減できる他、導電しない特性によって金属屑が発生する短絡の問題を回避でき、本考案に係わる支持材を金属箔板としても、本考案の潤滑屑潤滑構造によって、良好な潤滑を達成し、穴あけ時、金属屑の周囲への噴散を効果的に減少させる。 4. When the support material is a plastic plate material, the present invention can effectively reduce the cost of production, and can also avoid the problem of short-circuiting due to non-conductive properties. Even when a metal foil plate is used, the lubricating scrap lubricating structure of the present invention achieves good lubrication and effectively reduces the splattering of the metallic scrap when drilling.

図１は、本考案に係わる高速穴あけ用放熱補助板材１のより良い実施例で、支持材１３と複合材１１と潤滑層１２からなる。   FIG. 1 shows a better embodiment of the heat-dissipating auxiliary plate 1 for high-speed drilling according to the present invention.

当該複合材１１は、ナノ微粉末層からなり、当該支持材１３の上に塗布形成される。本考案に係わる好適な実施例において、当該ナノ微粉末は、ハロゲン化合物または二硫化モリブデンMoS2、二セレン化モリブデンMoSe2、二硫化タングステンWS2、二セレン化タングステンWSe2、二硫化ニオブNbS2、二セレン化ニオブNbSe2、二硫化タンタルTaS2、二セレン化タンタルTa Se2、および二硫化チタンTi S2のうちの1種であり、ハロゲン化合物は、フッ化セリウムCeF3、塩化カドミウムCdCl2、塩化コロイドCoCl2、塩化ジルコニウムZrCl2、塩化鉛PbCl2を含むものから選択する。穴あけ加工により生成した熱エネルギーが、放熱され、穴あけの時、摩擦による発熱が印刷回路基板２の材質に対して及ぼす影響が低減され、ドリルの使用寿命が延長される。 The composite material 11 is composed of a nano fine powder layer, and is formed on the support material 13 by coating. In a preferred embodiment according to the present invention, the nano fine powder is a halogen compound or molybdenum disulfide MoS 2 , molybdenum diselenide MoSe 2 , tungsten disulfide WS 2 , tungsten diselenide WSe 2 , niobium disulfide NbS 2. , Niobium diselenide NbSe 2 , tantalum disulfide TaS 2 , tantalum diselenide Ta Se 2 , and titanium disulfide Ti S 2 , halogen compounds are cerium fluoride CeF 3 , cadmium chloride CdCl 2 , selected from those containing colloidal chloride CoCl 2 , zirconium chloride ZrCl 2 , lead chloride PbCl 2 . The thermal energy generated by the drilling process is dissipated, and when drilling, the influence of heat generated by friction on the material of the printed circuit board 2 is reduced, and the service life of the drill is extended.

当該潤滑層１２は、上記の複合材１１の表面に塗布され、本考案のより良い実施例において、当該潤滑層１２は、脂肪族アルコールポリマー、混合脂肪酸エステル、ケトンおよび酸類のコポリマーおよびケトンおよびエステル類のコポリマーから選択し、界面活性剤と併合使用し、そのうち、該脂肪族アルコールポリマーは、ポリエチレングリコール、ポリオキシエタンまたはポリエチレンアルコールのうちの、1種である。該混合脂肪酸エステルは、ステアリン酸塩、グリセリンステアリン酸塩または、ポリオキシエタンのうちの、一種である。該ケトンおよび酸類のコポリマーは、ポリビニルピロリドン、ピロリドンカルボン酸ナトリウム、ビニルピロリドン、ビニルアセテートのコポリマー中の1種である。該ケトンおよびエステル類のコポリマーは、ビニルピロリドンまたはメタクリル酸メチルポリマーのうち、1種であり、界面活性剤は、スルフォ琥珀酸アルコール類、アルキル燐酸エステル塩、アルキルエーテル硫酸塩、アルキルスルフォ酸塩、アルキルアミン類、アルキルアミド、ポリオキシエチレンエーテル、ポリオキシエチレンエステル等のマイナスイオン、プラスイオンまたは非イオン型のうちの、一種である。   The lubricating layer 12 is applied to the surface of the composite 11 and in a better embodiment of the invention, the lubricating layer 12 is composed of an aliphatic alcohol polymer, a mixed fatty acid ester, a copolymer of ketone and acids, and a ketone and ester. Selected from the class of copolymers and used in combination with a surfactant, wherein the aliphatic alcohol polymer is one of polyethylene glycol, polyoxyethane or polyethylene alcohol. The mixed fatty acid ester is one of stearate, glycerine stearate, and polyoxyethane. The copolymer of ketone and acid is one of polyvinyl pyrrolidone, sodium pyrrolidone carboxylate, vinyl pyrrolidone and vinyl acetate. The copolymer of ketone and ester is one of vinyl pyrrolidone or methyl methacrylate polymer, and surfactants are sulfosuccinic alcohols, alkyl phosphate esters, alkyl ether sulfates, alkyl sulfonates. , Alkylamines, alkylamides, polyoxyethylene ethers, polyoxyethylene esters, and the like, which are one of negative ions, positive ions, and nonionic types.

当該支持材１３は、プラスチック板材や金属箔板であり、本実施例において、金属箔板をより好適な実施例とし、当該支持材１３により、上記の複合材１１と潤滑層１２とが支持される。   The support material 13 is a plastic plate material or a metal foil plate. In the present embodiment, the metal foil plate is a more preferable embodiment, and the composite material 11 and the lubricating layer 12 are supported by the support material 13. The

したがって、図４に示すように、実施時、上記の完成した高速穴あけ用放熱補助板材１を印刷回路基板２の上に覆って、穴あけ作業を行い、穴あけ装置は、予定の穴あけ位置に到達すると、ドリル４を下降して穴あけを実行し、ドリル４が、降下すると、本考案に係わる潤滑層１２により、潤滑され、そして、ドリルとの摩擦力が緩和され、これにより、穴のずれやドリルの切断が避けられ、また、当該ドリル４が、更に降下して、本考案に係わる複合材１１に着き、当該複合材１１にナノ微粉末が含有され、ナノ微粉末の特殊な構造による量子サイズ効果や巨視的量子トンネル効果、表面効果及び体積効果等の四つの効果が得られ、そのため、潤滑且つ耐磨耗の特性が良くなり、同時にドリル４に対する研磨と潤滑が実現されることにより、ドリル４の切れ味を保持し、即時に、ドリル４の高速回転により生成した熱エネルギーを放熱する。   Therefore, as shown in FIG. 4, during implementation, the completed heat dissipation auxiliary plate 1 for high speed drilling is covered on the printed circuit board 2 to perform a drilling operation, and the drilling device reaches a predetermined drilling position. The drill 4 is lowered and drilling is performed. When the drill 4 is lowered, the drill is lubricated by the lubricating layer 12 according to the present invention, and the frictional force with the drill is alleviated. The drill 4 is further lowered to arrive at the composite material 11 according to the present invention. The composite material 11 contains nano fine powder, and the quantum size due to the special structure of the nano fine powder. Four effects such as effect, macroscopic quantum tunnel effect, surface effect, and volume effect are obtained. Therefore, the lubrication and wear resistance characteristics are improved, and at the same time, polishing and lubrication for the drill 4 are realized. Holding the sharpness of the drill 4, immediately, radiating heat energy generated by the high-speed rotation of the drill 4.

ドリルが、更に降下すると、本考案に係わる支持材１３を通す。本考案のより良い実施例において、当該支持材１３が、金属箔板であり、ドリルが当該支持材１３を貫通する時、金属の屑の周囲への噴散が低減される。   When the drill is further lowered, the support material 13 according to the present invention is passed. In a better embodiment of the present invention, the support member 13 is a metal foil plate, and when the drill penetrates the support member 13, the splattering of metal debris around is reduced.

本考案に係わる高速穴あけ用放熱補助板材の断面図である。It is sectional drawing of the heat dissipation auxiliary board material for high-speed drilling concerning this invention. 本考案に係わる高速穴あけ用放熱補助板材を印刷回路基板の上に覆って穴あけする時の使用状態の断面図である。It is sectional drawing of the use condition when the heat-dissipating auxiliary plate material for high-speed drilling concerning this invention is covered on a printed circuit board and drilled. 従来の穴あけカバープレートの断面図である。It is sectional drawing of the conventional drilling cover plate.

符号の説明Explanation of symbols

１ 高速穴あけ用放熱補助板材
１１ 複合材
１２ 潤滑層
１３ 支持材
２ 印刷回路基板
３ 従来の穴あけカバープレート
３１ 多孔繊維層
３２ 潤滑層
３３ アルミ箔層
４ ドリル DESCRIPTION OF SYMBOLS 1 Heat dissipation auxiliary | assistant board | plate material 11 for high-speed drilling Composite material 12 Lubrication layer 13 Support material 2 Printed circuit board 3 Conventional drilling cover plate 31 Porous fiber layer 32 Lubrication layer 33 Aluminum foil layer 4 Drill

Claims (11)

支持材と、
ナノ微粉末を含む複合材料層であって、該ナノ微粉末が、ハロゲン化合物または二硫化モリブデンMoS2、二セレン化モリブデンMoSe2、二硫化タングステンWS2、二セレン化タングステンWSe2、二硫化ニオブNbS2、二セレン化ニオブNbSe2、二硫化タンタルTaS2、二セレン化タンタルTa Se2、および二硫化チタンTi S2のうちの1種であって上記支持材上に結合する複合材料層と、
上記複合材料層表面上に塗布形成された潤滑層と
からなり、
印刷回路基板の穴あけ加工に際して、該印刷回路基板状に配置されてドリルの研磨、潤滑および伝熱する高速穴あけ用放熱補助板材。 A support material;
A composite material layer comprising nano fine powder, the nano fine powder comprising a halogen compound or molybdenum disulfide MoS 2 , molybdenum diselenide MoSe 2 , tungsten disulfide WS 2 , tungsten diselenide WSe 2 , niobium disulfide A composite material layer that is one of NbS 2 , niobium diselenide NbSe 2 , tantalum disulfide TaS 2 , tantalum diselenide Ta Se 2 , and titanium disulfide Ti S 2 , and is bonded onto the support material; ,
It consists of a lubricating layer coated and formed on the surface of the composite material layer,
A heat-dissipating auxiliary plate material for high-speed drilling that is arranged in the printed circuit board shape and drills, lubricates and transfers heat when drilling a printed circuit board. 前記支持材が、プラスチックである請求項１記載の高速穴あけ用放熱補助板材。 The heat radiation auxiliary plate for high-speed drilling according to claim 1, wherein the support material is plastic. 前記支持材が、金属箔板である請求項１記載の高速穴あけ用放熱補助板材。 The heat radiation auxiliary plate for high-speed drilling according to claim 1, wherein the support material is a metal foil plate. 前記潤滑層が、脂肪族アルコールポリマー、混合脂肪酸エステル、ケトンおよび酸類のコポリマーおよびケトンおよびエステル類のコポリマーから選択し、界面活性剤と合併使用してなる請求項１記載の高速穴あけ用放熱補助板材。 The heat-dissipating auxiliary plate material for high-speed drilling according to claim 1, wherein the lubricating layer is selected from aliphatic alcohol polymers, mixed fatty acid esters, copolymers of ketones and acids, and copolymers of ketones and esters and used in combination with a surfactant. . 前記脂肪アルコールポリマーは、ポリエチレングリコール、ポリオキシエタンまたはポリエチレンアルコールのうち、1種である請求項４記載の高速穴あけ用放熱補助板材。 The heat radiation auxiliary plate for high-speed drilling according to claim 4, wherein the fatty alcohol polymer is one of polyethylene glycol, polyoxyethane, or polyethylene alcohol. 前記混合脂肪酸エステルは、ステアリン酸塩、グリセリンステアリン酸塩または、ポリオキシエタンのうち、一種である請求項４記載の高速穴あけ用放熱補助板材。 The heat-dissipating auxiliary plate material for high-speed drilling according to claim 4, wherein the mixed fatty acid ester is one of stearate, glycerin stearate, or polyoxyethane. 前記ケトンおよび酸類のコポリマーは、ポリビニルピロリドン、ピロリドンカルボン酸ナトリウム、ビニルピロリドン、ビニルアセテートのコポリマー中の1種である請求項４記載の高速穴あけ用放熱補助板材。 The heat radiation auxiliary plate for high-speed drilling according to claim 4, wherein the copolymer of ketone and acid is one of polyvinyl pyrrolidone, sodium pyrrolidone carboxylate, vinyl pyrrolidone, and vinyl acetate. 前記ケトンおよびエステル類のコポリマーは、ビニルピロリドンまたはメタクリル酸メチルポリマーのうち、1種である請求項４記載の高速穴あけ用放熱補助板材。   The heat radiation auxiliary plate for high-speed drilling according to claim 4, wherein the copolymer of ketone and ester is one kind of vinyl pyrrolidone or methyl methacrylate polymer. 前記界面活性剤は、スルフォ琥珀酸アルコール類、アルキル燐酸エステル塩、アルキルエーテル硫酸塩、アルキルスルフォ酸塩、アルキルアミン類、アルキルアミド、ポリオキシエチレンエーテル、ポリオキシエチレンエステル等の陰イオン、陽イオンまたは非イオン型のうち、一種である請求項４記載の高速穴あけ用放熱補助板材。 The surfactants include sulfosuccinic alcohols, alkyl phosphate esters, alkyl ether sulfates, alkyl sulfonates, alkyl amines, alkyl amides, polyoxyethylene ethers, polyoxyethylene esters, and other anions, cations. The heat radiation auxiliary plate for high-speed drilling according to claim 4, which is one of an ion type and a non-ion type. 前記複合材料層が塗布方式で支持材上に結合してなる請求項１記載の高速穴あけ用放熱補助板材。   The heat radiation auxiliary plate for high speed drilling according to claim 1, wherein the composite material layer is bonded on a support material by a coating method. 前記ハロゲン化合物は、フッ化セリウムCeF3、塩化カドミウムCdCl2、塩化コロイドCoCl2、塩化ジルコニウムZrCl2、塩化鉛PbCl2を含むものから選択する請求項１記載の高速穴あけ用放熱補助板材。 The heat radiation auxiliary plate for high-speed drilling according to claim 1, wherein the halogen compound is selected from those containing cerium fluoride CeF 3 , cadmium chloride CdCl 2 , colloidal chloride CoCl 2 , zirconium chloride ZrCl 2 , and lead chloride PbCl 2 .
JP2007003851U 2007-04-23 2007-05-25 Heat dissipation auxiliary plate for high speed drilling Expired - Lifetime JP3134127U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096206474U TWM320275U (en) 2007-04-23 2007-04-23 Heat-dissipation auxiliary board for high-speed drilling

Publications (1)

Publication Number Publication Date
JP3134127U true JP3134127U (en) 2007-08-02

Family

ID=39202813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007003851U Expired - Lifetime JP3134127U (en) 2007-04-23 2007-05-25 Heat dissipation auxiliary plate for high speed drilling

Country Status (3)

Country Link
JP (1) JP3134127U (en)
KR (1) KR100978719B1 (en)
TW (1) TWM320275U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013146612A1 (en) * 2012-03-27 2013-10-03 三菱瓦斯化学株式会社 Entry sheet for drilling
US10674609B2 (en) 2014-03-31 2020-06-02 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103820738A (en) * 2014-02-28 2014-05-28 江苏大学 WSe2-containing Fe-based high-temperature self-lubricating spherical plain bearing and preparation method thereof
CN109291135A (en) * 2014-10-22 2019-02-01 合正科技股份有限公司 Cover plate for drilling hole

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000095907A (en) * 1998-09-22 2000-04-04 Idemitsu Petrochem Co Ltd Holding plate for use in machining printed base board
SG115399A1 (en) * 2000-09-04 2005-10-28 Mitsubishi Gas Chemical Co Lubricant sheet for making hole and method of making hole with drill
US6866450B2 (en) * 2001-10-31 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling hole
TWI298007B (en) 2006-04-03 2008-06-11 Uniplus Electronics Co Ltd Heat-dissipating accessory plate for high speed drilling

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013146612A1 (en) * 2012-03-27 2013-10-03 三菱瓦斯化学株式会社 Entry sheet for drilling
JPWO2013146612A1 (en) * 2012-03-27 2015-12-14 三菱瓦斯化学株式会社 Entry sheet for drilling holes
US10159153B2 (en) 2012-03-27 2018-12-18 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling
US10674609B2 (en) 2014-03-31 2020-06-02 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling

Also Published As

Publication number Publication date
TWM320275U (en) 2007-10-01
KR100978719B1 (en) 2010-08-30
KR20080095160A (en) 2008-10-28

Similar Documents

Publication Publication Date Title
US7439617B2 (en) Capillary underflow integral heat spreader
EP1793949B1 (en) Nano-sized metals and alloys, and methods of assembling packages containing same
KR100789098B1 (en) Heat-dissipating accessory plate for high speed drilling
JP3134127U (en) Heat dissipation auxiliary plate for high speed drilling
KR20130043210A (en) Semiconductor device bonding material
EP1472916B1 (en) Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board
US20170325356A1 (en) Ultrathin heat dissipation structure and a method for manufacturing same
US20110061848A1 (en) Heat Dissipation Module and the Manufacturing Method Thereof
JP4873332B2 (en) Lead frame and manufacturing method thereof, method of improving fatigue characteristics, electronic component and electronic device using the same
JP2005095977A (en) Circuit device
WO2018154802A1 (en) Method for producing hollow structure, plated composite and hollow structure
JP3134128U (en) Auxiliary materials that extend the life of high-speed drill bits
CN201061926Y (en) Heat-dissipation sub-plate for high-speed drilling
JP2002314013A (en) Heat dissipating material and method for manufacturing the same
CN112708400A (en) Thermal interface material and manufacturing method thereof
CN102049550A (en) Substrate for assisting drilling circuit board and manufacturing method thereof
CN105472883A (en) Circuit board manufacturing method and circuit board
CN111246668B (en) Manufacturing method of high-density micro-spacing high-heat-conductivity ultrathin copper base line circuit board
JP3153156U (en) Heat dissipation auxiliary plate for high speed drilling
EP0111599A1 (en) Method of processing through-holes
JP5422337B2 (en) Manufacturing method of electronic component mounting substrate and electronic component mounting substrate
JP2009277992A (en) Substrate for power module, power module, and method of manufacturing substrate for power module
JPS58501648A (en) Semiconductor assembly with cooling means
CN101053938A (en) Heat radiation assistant board used for high speed drilling
JP2007277619A (en) Method of depositing particle according to electrophoresis

Legal Events

Date Code Title Description
R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100711

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100711

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110711

Year of fee payment: 4

A624 Registrability report (other person)

Free format text: JAPANESE INTERMEDIATE CODE: A624

Effective date: 20110322

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110711

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120711

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130711

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term