JP2000095907A - Holding plate for use in machining printed base board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively provide a good printed base board which is free from the occurrence of defects and resin smears in its hole protions. SOLUTION: A holding plate for use in machining a printed base board comprises a thermoplastic resin material having a tensile modulus of elasticity of more than 2 GPa and less than 15 GPa, a breaking extension of 0.5-3%, and a melting point(Tm) of 225 deg.C or above. The thermoplastic resin material pref. comprises (a) a syndiotactic polystyrene, (b) an elastomer and/or a thermoplastic resin other than the syndiotactic polystyrene, (c) a polymer having a compatibility or affinity to component (a) as well as a polar group, and (d) an inorganic filler.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holding plate for processing a printed circuit board, and more particularly, to a thermoplastic resin, in particular, a styrenic polymer mainly having a syndiotactic structure (hereinafter referred to as "syndiotactic polystyrene" or "SP").
S ". ) As a material for the same.

[0002]

2. Description of the Related Art At present, in many electronic devices, printed wiring boards are frequently used for mounting electronic components and electrically connecting them. Such a printed wiring board is roughly classified into a single-sided printed wiring board and a double-sided printed wiring board. However, a single-sided printed wiring board requires holes for mounting electronic components, and a double-sided printed wiring board requires a printed board. Holes are required to obtain electrical continuity on both sides. As described above, in the manufacture of printed wiring boards, the step of drilling holes in a printed circuit board is essential and extremely important. The demands are becoming very large.

[0003] By the way, the diameter of a hole formed in a printed circuit board is usually very small, ranging from 0.1 mm to 0.4 mm. Therefore, when using the method of drilling holes by directly drilling on the printed circuit board, a phenomenon called so-called smear, in which the corners of the drilled holes collapse or crack, or chips are left attached And as a result, there is a possibility that a contact failure of the printed wiring board may be caused.

In order to prevent such corner loss and smearing, in the drilling step, the printed circuit board is sandwiched between two pressing plates from above and below, and then a drill is applied to the upper pressing plate. A method has been adopted in which three superposed upper holding plates, printed circuit boards, and lower holding plates are integrated to form a hole. In this way, the corners are not chipped, and the chips are discharged together with the chips of the holding plate and can be prevented from adhering and remaining on the printed circuit board.

Hitherto, a phenolic resin such as bakelite has been used as the above-mentioned holding plate because it has heat resistance and is hard and brittle. However, since phenolic resin is a thermosetting resin, once used, it cannot be melted and reused, so it must be disposable as industrial waste and effective use of resources However, it has become a major problem from the viewpoint of environmental protection.

[0006]

SUMMARY OF THE INVENTION The present invention has been made from this point of view. By using a thermoplastic resin, in particular, a specific styrene resin as its material, defects or smears are formed in the holes. It is an object of the present invention to provide a good printed board free of occurrence at low cost.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies from such a viewpoint, and as a result, have obtained a specific syndiotactic polystyrene-based resin having excellent heat resistance, hardness and brittleness and recyclability. It has been found that the use can solve the above problem. The present invention has been made based on such findings.

That is, the present invention provides a press board for processing a printed circuit board made of the following resin material. (1) A holding plate for processing a printed circuit board, which is made of a thermoplastic resin material and satisfies the following conditions: The tensile modulus is 2 GPa or more and less than 15 GPa. Elongation at break is 0.5-3%. The melting point (Tm) is 225 ° C or higher. (2) The processing of the printed circuit board according to the above (1), wherein the thermoplastic resin material is a resin composition containing a styrene-based polymer mainly having a syndiotactic structure or a styrene-based polymer mainly having a syndiotactic structure. Holding plate. (3) The thermoplastic resin material comprises (a) a styrenic polymer 60 to 10 having mainly a syndiotactic structure.
0% by weight, (b) 40 to 0% by weight of a thermoplastic resin other than a rubbery elastic body and / or a styrene-based polymer mainly having a syndiotactic structure, and the total amount of the above components (a) and (b) The holding plate for processing a printed circuit board according to the above (1) or (2), comprising the inorganic filler (d) in an amount of 0 to 40 parts by weight based on 100 parts by weight. (4) The thermoplastic resin material is (a) a styrenic polymer 60 to 10 having mainly a syndiotactic structure.
0% by weight, (b) 40 to 0% by weight of a thermoplastic resin other than a rubbery elastic body and / or a styrene-based polymer mainly having a syndiotactic structure, and component (a) and (b)
(C) 0.1 to 10 parts by weight of a polymer having compatibility or affinity with component (a) and having a polar group, based on 100 parts by weight of the total of components, The printed board processing press plate according to the above (1) or (2), comprising the inorganic filler (d) in an amount of 0 to 40 parts by weight based on 100 parts by weight of the total amount of the component (c).

[0009]

Embodiments of the present invention will be described below. I. Properties of the printed board processing press plate according to the present invention In the printed board processing press plate according to the present invention,
The following properties must be satisfied. (1) The tensile modulus is 2 GPa or more, preferably 2.5 G
Pa or more and less than 15 GPa, preferably less than 13 GPa.

[0010] Here, the tensile modulus of elasticity is ASTM D88.
If the value is less than 2 GPa, smear is likely to occur due to softness, and 15 G
If it exceeds Pa, the drill is too hard, and wear and deformation of the drill are likely to occur, which is not preferable. (2) Elongation at break is 0.5-3%, preferably 0.7-2.8.
%. Here, the elongation at break was measured according to ASTM D88.
It is a value measured according to 2 , and if it is less than 0.5%,
Cracks are likely to occur during drill cutting, and if it exceeds 3%, chips during cutting tend to remain, and smear may easily occur. (3) The melting point (Tm) is 225 ° C. or higher.

The melting point (Tm) is determined by differential thermal analysis (DS)
This is a value determined from the peak position at a heating rate of 20 ° C./min. If the temperature is lower than 225 ° C., melting may occur due to heat generated during cutting, and shavings may easily remain. II. Suitable Material Used for Electronic Component According to the Present Invention The electronic component according to the present invention is not particularly limited as long as it is a thermoplastic resin, and as the preferable material, a styrene-based material mainly having a syndiotactic structure described below is used. A polymer or a resin composition containing the styrene-based polymer is used. 1. Styrene polymer mainly having a syndiotactic structure Syndiotactic structure in a styrene polymer mainly having a syndiotactic structure means that the stereochemical structure is a syndiotactic structure, that is, a main chain formed from carbon-carbon bonds. Has a steric structure in which phenyl groups, which are side chains, are alternately located in opposite directions, and its tacticity is determined by nuclear magnetic resonance (13C)
-NMR). Tacticity measured by the 13C-NMR method can be represented by the existence ratio of a plurality of continuous structural units, for example, a dyad for two, a triad for three, and a pentad for five. The styrenic polymer having a predominantly syndiotactic structure as referred to in the present invention generally means at least 75%, preferably at least 85%, in racemic diad, or at least 30%, preferably 50%, in racemic pentad.
Polystyrene, poly (alkyl styrene), poly (aryl styrene), poly (halogenated styrene), poly (halogenated alkyl styrene), poly (alkoxy styrene), poly (vinyl benzoate) having the above syndiotacticity , These hydrogenated polymers and mixtures thereof, or copolymers containing these as main components. Here, the poly (alkyl styrene) includes poly (methyl styrene), poly (ethyl styrene), poly (isopropyl styrene), poly (tertiary butyl styrene), and the like. There are poly (phenylstyrene), poly (vinylnaphthalene), poly (vinylstyrene), etc., and as poly (halogenated styrene), there are poly (chlorostyrene), poly (bromostyrene), poly (fluorostyrene), etc. . Further, as poly (halogenated alkylstyrene), poly (chloromethylstyrene) and the like, and as poly (alkoxystyrene),
Poly (methoxystyrene), poly (ethoxystyrene)
and so on.

Among these, preferred styrene polymers include polystyrene, poly (p-methylstyrene), poly (m-methylstyrene), poly (p-tert-butylstyrene), and poly (p-chlorostyrene). ), Poly (m-chlorostyrene), poly (p-fluorostyrene), hydrogenated polystyrene and copolymers containing these structural units.

Such a styrenic polymer having a predominantly syndiotactic structure can be prepared, for example, by using a titanium compound and a condensation product of water and a trialkylaluminum as a catalyst in an inert hydrocarbon solvent or in the absence of a solvent.
It can be produced by polymerizing a styrene-based monomer (a monomer corresponding to the above-mentioned styrene-based polymer) (JP-A-62-187708). For poly (halogenated alkylstyrene), see JP-A-1-4691.
No. 2, these hydrogenated polymers are disclosed in JP-A-1-1785.
It can be obtained by the method described in JP-A-05-2005.

Among these styrenic polymers having a syndiotactic structure, in the present invention, in terms of heat resistance and mechanical strength, tacticity is particularly 70% or more in racemic pentad, and weight average molecular weight. Is 5-8
A thing of 100,000 is preferable. 2. Resin Composition Containing Syndiotactic Polystyrene As the material for a press plate for processing a printed board according to the present invention, not only the above-mentioned syndiotactic polystyrene but also a resin composition containing syndiotactic polystyrene can be suitably used. In this resin composition, it is necessary that (a) syndiotactic polystyrene is contained as a resin component. However, in order to prevent cracking or to obtain smoothness, (b) a rubber-like elastic material is further required. And / or a thermoplastic resin other than a styrene-based polymer having a mainly syndiotactic structure,
(C) An inorganic filler may be included. Furthermore, various additives within a range that does not inhibit the object of the present invention, for example, an antiblocking agent, an antioxidant, a nucleating agent, an antistatic agent,
Process oil, plasticizer, release agent, compatibilizer, flame retardant,
Flame retardant aids, pigments and the like can be blended.

As for the kneading of each component, there are various methods such as a method of blending and melt-kneading at any stage of the syndiotactic polystyrene production process, and a method of blending and melt-kneading each component constituting the composition. It can be done by the method. (1) Rubber-like elastic body Specific examples of the rubber-like elastic body include, for example, natural rubber, polybutadiene, polyisoprene, polyisobutylene, neoprene, polysulfide rubber, thiochol rubber, acrylic rubber, urethane rubber, silicone rubber, epichlorohydrin rubber Styrene-butadiene block copolymer (SBR), hydrogenated styrene-butadiene block copolymer (SEB), styrene-butadiene-styrene block copolymer (SBS), hydrogenated styrene-butadiene-styrene block copolymer ( SEBS), styrene-isoprene block copolymer (SIR), hydrogenated styrene-isoprene block copolymer (SEP), styrene-isoprene-styrene block copolymer (SI
S), hydrogenated styrene-isoprene-styrene block copolymer (SEPS), or ethylene propylene rubber (EPM), ethylene propylene diene rubber (EPD)
M), an olefin rubber such as a linear low-density polyethylene elastomer, or butadiene-acrylonitrile-styrene-core-shell rubber (ABS), methyl methacrylate-butadiene-styrene-core-shell rubber (MBS), methyl methacrylate-butyl acrylate-styrene Core-shell rubber (MAS), octyl acrylate-butadiene-styrene-core-shell rubber (MABS), alkyl acrylate-butadiene-acrylonitrile-styrene-core-shell rubber (AAB)
S), butadiene-styrene-core-shell rubber (SB
R), a core-shell type particulate elastic material such as a siloxane-containing core-shell rubber such as methyl methacrylate-butyl acrylate-siloxane, or a rubber obtained by modifying the same, for example, maleic anhydride-modified hydrogenated styrene-butadiene-styrene block copolymer. Polymer (MA
-SEBS) and the like.

Among these rubber-like elastic materials, in the present invention, hydrogenated styrene-butadiene-styrene block copolymer (SEB) is used in view of heat resistance and dielectric properties.
S) is preferred. (2) Thermoplastic resins other than syndiotactic polystyrene Examples of thermoplastic resins other than syndiotactic polystyrene include linear high-density polyethylene, linear low-density polyethylene, high-pressure low-density polyethylene, isotactic polypropylene, and syndoxy. Otactic polypropylene, block polypropylene, random polypropylene, polybutene, 1,2-polybutadiene, 4-methylpentene, cyclic polyolefins and polyolefin resins represented by these copolymers, atactic polystyrene, isotactic polystyrene, HIPS, A
BS, AS, styrene-methacrylic acid copolymer, styrene-methacrylic acid / alkyl ester copolymer, styrene-methacrylic acid / glycidyl ester copolymer, styrene-acrylic acid copolymer, styrene-acrylic acid / alkyl ester copolymer Polystyrene resins such as polymers, styrene-maleic acid copolymers and styrene-fumaric acid copolymers, polyester resins such as polycarbonate, polyethylene terephthalate and polybutylene terephthalate, polyamide 6, polyamide 6,6 And other polyamide resins, polyphenylene ether, polyarylene sulfide, poly-4
-Any known materials such as fluorinated polyethylene resins such as fluorinated ethylene (PTFE) can be used. Among them, polyolefins such as polyethylene and polypropylene or polyphenylene ethers are preferred.
In addition, these thermoplastic resins can be used alone or in combination of two or more. (3) Polymer having compatibility or affinity with syndiotactic polystyrene and having a polar group Syndiotactic polystyrene and thermoplastic resin and / or
Alternatively, it is blended to improve the affinity between the rubber-like elastic body and effectively compatibilize it, and to improve the affinity between the syndiotactic polystyrene and the inorganic filler.

Here, the polymer having compatibility or affinity with syndiotactic polystyrene refers to a polymer having a chain showing compatibility or affinity with syndiotactic polystyrene in a polymer chain. Examples of the polymer exhibiting such compatibility or affinity include, for example, syndiotactic polystyrene, atactic polystyrene, isotactic polystyrene, styrene-based copolymer, polyphenylene ether, polyvinyl methyl ether, and the like. , A block or a graft chain.

The polar group referred to herein may be any group which improves the adhesiveness with an inorganic filler, and specifically includes an acid anhydride group, a carboxylic acid group, a carboxylic ester group, and a carboxylic acid group. Chloride group, carboxylic acid amide group, carboxylic acid group, sulfonic acid group, sulfonic acid ester group, sulfonic acid chloride group, sulfonic acid amide group, sulfonic acid group, epoxy group, amino group, imide group, oxazoline group, etc. No.

This compatibilizer can be obtained by reacting a polymer having compatibility or affinity with the above-mentioned syndiotactic polystyrene and a modifier described below in the presence or absence of a solvent or other resin. it can. As the modifier, for example, a compound containing an ethylenic double bond and a polar group in the same molecule can be used. Specifically, maleic anhydride, maleic acid, maleic ester, maleimide and its N-substituted product, maleic acid derivatives such as maleic acid salt, fumaric acid, fumaric acid ester, and fumaric acid such as fumaric acid salt Derivatives, itaconic anhydride, itaconic acid, itaconic acid esters, itaconic acid derivatives including itaconic acid salts, acrylic acid, acrylic acid esters,
Acrylic acid derivatives such as acrylamide and acrylate, methacrylic acid, methacrylic acid esters, methacrylic acid amides, methacrylic acid salts, and methacrylic acid derivatives such as glycidyl methacrylate are exemplified. Among them, maleic anhydride, fumaric acid and glycidyl methacrylate are particularly preferably used.

A known method is used for the modification.
150 using a mill, Banbury mixer, extruder, etc.
A method of melt-kneading and reacting at a temperature of from 0 to 350 ° C, and a method of heating and reacting in a solvent such as benzene, toluene, and xylene can be exemplified. In order to further facilitate these reactions, benzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, t-butyl peroxybenzoate, azobisisobutyronitrile, azobisisovaleronitrile, It is effective to use a radical generator such as 2,3-diphenyl-2,3-dimethylbutane. Of these, 2,3-diphenyl-2,3-dimethylbutane is particularly preferably used.

A preferred modification method is a method of melt-kneading in the presence of a radical generator. Further, at the time of modification, another resin may be added. Specific examples of the compatibilizer include a styrene-maleic anhydride copolymer (SM
A), a styrene-glycidyl methacrylate copolymer,
Carboxylic acid-modified polystyrene, epoxy-modified polystyrene, oxazoline-modified polystyrene, amine-modified polystyrene, sulfonated polystyrene, styrene ionomer, styrene-methyl methacrylate
To-graft polymer, (styrene-glycidyl methacrylate) -methyl methacrylate-graft copolymer, acid-modified acryl-styrene-graft polymer,
(Styrene-glycidyl methacrylate) -styrene-
Graft polymer, polybutylene terephthalate-polystyrene-graft polymer, maleic anhydride-modified P
S, fumaric acid-modified PS, glycidyl methacrylate-modified PS, amine-modified PS and other modified styrenic polymers,
Modified polyphenylene ethers such as (styrene-maleic anhydride) -polyphenylene ether-grafted polymer, maleic anhydride-modified polyphenylene ether, glycidyl methacrylate-modified polyphenylene ether, and amine-modified polyphenylene ether And the like.

Of these, modified PS and modified polyphenylene ether are preferably used. Further, two or more of the above polymers can be used in combination. The polar group content in the compatibilizer is preferably 10
It is in the range of 0.05 to 20% by weight, more preferably 0.05 to 10% by weight, based on 0% by weight. If the content is less than 0.01% by weight, it is necessary to add a large amount of a compatibilizing agent in order to exert an adhesive effect with the inorganic filler, and the mechanical properties, heat resistance, and moldability of the composition may be reduced. Absent. On the other hand, if it exceeds 20% by weight, the compatibility with syndiotactic polystyrene may be undesirably reduced. (4) Inorganic filler The inorganic filler may be fibrous, granular or powdery. As the fibrous filler,
For example, glass fiber, carbon fiber, whisker and the like can be mentioned. The shape is a cross shape, mat shape, focused cut shape,
There are short fibers, filaments, whiskers, etc., and in the case of a bundle cut, those having a length of 0.05 mm to 50 mm and a fiber diameter of 5 to 20 μm are preferred.

On the other hand, as the granular or powdery filler, for example, talc, carbon black, graphite, titanium dioxide, silica, mica, calcium carbonate, calcium sulfate, barium carbonate, magnesium carbonate, magnesium sulfate, barium sulfate, Oxysulfate, tin oxide,
Examples include alumina, kaolin, silicon carbide, metal powder, glass powder, glass flake, glass beads and the like.

Among the various fillers described above, particulate and powdery fillers such as glass powder and glass free
, Glass beads, talc, carbon black, graphite, titanium dioxide, silica, mica, calcium carbonate, calcium sulfate, barium carbonate, kaolin, and silicon carbide are preferred. As these fillers, those subjected to surface treatment are preferable. The coupling agent used for the surface treatment is used for improving the adhesiveness between the filler and the resin, and includes a so-called silane-based coupling agent, a titanium-based coupling agent, and the like. Any one can be selected and used. Among them, γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, β
Preferred are aminosilanes such as-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, epoxysilane, and isopropyltri (N-amidoethyl, aminoethyl) titanate.

As the film former, a conventionally known one can be used, and among them, urethane type, epoxy type, polyether type and the like are preferably used. In addition, these inorganic fillers can be used alone or in combination of two or more. (5) Various additives As long as the object of the present invention is not impaired, various additives exemplified below can be blended.

Antiblocking Agent (AB Agent) Examples of the antiblocking agent include the following inorganic particles or organic particles. As the inorganic particles, IA
, IIA, IVA, VIA, VIIA, VIII, IB
Oxides, hydroxides, sulfides, nitrides, halides, carbonates, sulfates, acetates, phosphates, phosphites, organic carboxylate salts of Group IIB, IIIB, IIIB and IVB elements, Examples thereof include silicates, titanates, borates and hydrates thereof, composite compounds centered on them, and natural mineral particles.

More specifically, compounds of Group IA such as lithium fluoride, borax (sodium borate hydrate), magnesium carbonate, magnesium phosphate, magnesium oxide (magnesia), magnesium chloride, magnesium acetate, magnesium fluoride, titanium Magnesium silicate, magnesium silicate, magnesium silicate hydrate (talc), calcium carbonate, calcium phosphate, calcium phosphite, calcium sulfate (gypsum), calcium acetate, calcium terephthalate, calcium hydroxide, calcium silicate, calcium fluoride, titanate Group IIA compounds such as calcium, strontium titanate, barium carbonate, barium phosphate, barium sulfate, barium sulfite, titanium dioxide (titania), titanium monoxide, titanium nitride, zirconium dioxide (zirconia), dimonoxide Group VIA element compounds such as group IVA element compounds such as conium, molybdenum dioxide, molybdenum trioxide, and molybdenum sulfide; group VIA element compounds such as manganese chloride and manganese acetate; group VIII element compounds such as cobalt chloride and cobalt acetate; Group IB element compounds such as cuprous chloride, group IIB compounds such as zinc oxide and zinc acetate, aluminum oxide (alumina), aluminum hydroxide, aluminum fluoride, alumina silicate (alumina silicate, kaolin, kaolinite), etc. III Group B element compounds, silicon oxide (silica, silica gel), graphite, carbon, graphite, glass, etc., Group IVB element compounds, kernalite, kainite, mica (mica, kinunmo), and particles of natural minerals such as byrose ore. Can be

Examples of the organic particles include Teflon, melamine resin, styrene / divinylbenzene copolymer, acrylic resin, and cross-linked products thereof. Antioxidant As the antioxidant, any known antioxidant such as phosphorus-based, phenol-based, and sulfur-based can be used. In addition, these antioxidants may be used alone, or
Two or more can be used in combination.

Nucleating Agents As nucleating agents, metal salts of carboxylic acids such as aluminum di (pt-butylbenzoate) and phosphoric acids such as sodium methylenebis (2,4-di-t-butylphenol) acid phosphate Any of known metal salts, talc, phthalocyanine derivatives and the like can be used. These nucleating agents can be used alone or in combination of two or more. Plasticizers Examples of the plasticizer include polyethylene glycol, polyamide oligomer, ethylene bisstearamide, phthalic acid ester, polystyrene oligomer, and the like. Any known materials such as polyethylene wax and silicone oil can be arbitrarily selected and used. These plasticizers can be used alone or in combination of two or more.

Release Agent The release agent may be arbitrarily selected from known materials such as polyethylene wax, silicone oil, long-chain carboxylic acid, and metal salt of long-chain carboxylic acid. These release agents may be used alone or in combination of two or more.

Process Oil In the present invention, a process oil may be further added. Process oils are roughly classified into paraffin-based oils, naphthenic-based oils, and aroma-based oils, depending on the type of oil. As the viscosity of the process oil, the kinematic viscosity at 40 ° C. is 15 to 600.
cs is preferable, and 15 to 500 cs is more preferable.

These process oils can be used alone or in combination of two or more. (5) Mixing ratio of each component Regarding the mixing ratio of each component, (a) 60 to 100% by weight, preferably 70% by weight of syndiotactic polystyrene is used.
-100% by weight, even 80-95% by weight,
(B) The thermoplastic resin other than the rubbery elastic body and / or the styrene-based polymer mainly having a syndiotactic structure is 40 to 0% by weight, preferably 30 to 0% by weight, and more preferably 20 to 5% by weight. If the amount of the component (b) is more than 40% by weight, smear may occur when a hole is drilled. Further, when a polymer (c) having compatibility or affinity with the component (a) and having a polar group is blended, the ratio of the component (c) is determined by comparing the ratio of the component (a) with the component (b). ) 0.1 to 10 parts by weight, preferably 0.5 to 8 parts by weight, more preferably 1 to 5 parts by weight, based on 100 parts by weight of the total of components. If the amount is less than 0.1 part by weight, the effect of bonding with the inorganic filler is small, and insufficient adhesion between the resin and the inorganic filler occurs. become. (D) The inorganic filler is the component (a)
The amount is 0 to 40 parts by weight, preferably 5 to 35 parts by weight, and more preferably 5 to 35 parts by weight based on 100 parts by weight of the total amount of the component (c). If the amount of the inorganic filler is more than 40 parts by weight, it becomes too brittle and cracks easily occur. III. Method for Manufacturing Pressing Plate for Processing Printed Circuit Board According to the Present Invention The method for manufacturing the holding plate for processing printed circuit board according to the present invention is not particularly limited. For example, a known method such as cast molding or injection molding may be used. May be appropriately selected according to the conditions.

[0033]

Next, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples. Example 1 SPS (Syndiotactic polystyrene homopolymer, Tm = 270 ° C., MI = 13 (300
C., 1.2 kgf))), 60 parts by weight, SEBS (hydrogenated styrene-butadiene copolymer, "Septon 8006" manufactured by Kuraray) as a rubbery elastic body, 18 parts by weight, and calcium carbonate as an inorganic filler (Product name : Shiraishi Industry
20 parts by weight of Whiten P-30 ") and 2 parts by weight of fumaric acid-modified polyphenylene ether (modification ratio: 1.5% by weight) were dry-blended and melt-kneaded with a 65 mmφ twin-screw extruder to obtain pellets.

The fumaric acid-modified polyphenylene ether was prepared by the following method. Polyphenylene ether (intrinsic viscosity 0.45 dl / g, in chloroform, 25
C) 1 kg, 30 g of fumaric acid, and 20 g of 2,3-dimethyl-2,3-diphenylbutane (Nippon Oil & Fat, NOFMA-BC) as a radical generator were dry-blended and screwed using a 30 mm twin screw extruder. Rotation speed 20
Melt kneading was performed at 0 rpm and a set temperature of 300 ° C. The strand was cooled and pelletized to obtain a fumaric acid-modified polyphenylene ether. To measure the modification rate, 1 gram of the resulting modified polyphenylene ether was dissolved in ethylbenzene, reprecipitated in methanol, and the recovered polymer was dissolved in methanol.
After extraction with Soxhlet and drying, the denaturation rate was determined by carbonyl absorption intensity in the IR spectrum and titration.

Next, the material was cast-formed under the conditions of a T-die temperature of 300 ° C. and a roll temperature of 90 ° C. to produce a press plate for processing a printed circuit board. The properties of the printed board processing press plate were as follows. (1) The tensile modulus was 2.6 MPa. (2) The breaking elongation was 2.6%. (3) The melting point (Tm) was 269 ° C.

This press plate for processing a printed circuit board (having a thickness of 1.5
(mm, 300 mm x 300 mm), an epoxy printed circuit board (1.6 mm thick) was sandwiched from above and below, and then a hole was drilled using a 0.2 mm diameter drill. At this time, there was no defect in the corner of the hole, and no generation of smear was observed. [Embodiment 2] Instead of SPS in Embodiment 1, SP
As S, syndiotactic styrene-p-methylstyrene copolymer ((p-methylstyrene content: 12 mol%), Tm = 241 ° C., MI = 3 (300 ° C., 1.2 k
gf))) was carried out in the same manner as in Example 1 except that gf))) was used.

The properties of the press board for processing a printed circuit board were as follows. (1) The tensile modulus was 2.6 MPa. (2) The breaking elongation was 2.7%. (3) The melting point (Tm) was 240 ° C. As a result, there was no defect in the corner of the hole, and no generation of smear was observed.

[0038]

According to the present invention, it is possible to obtain a good holding plate for processing a printed circuit board, which does not have any loss or smear in the hole.

Continued on front page F-term (reference) 4J002 AA011 AA012 AC002 AC012 AC032 AC042 AC062 AC082 AC092 AC112 AC122 BB002 BB032 BB122 BB152 BB172 BB182 BC011 BC023 BC031 BC032 BC033 BC042 BC062 BC072 BC081 BC111 BD152 BN 012 BF111 BN152 BN 012 CL012 CL032 CN012 CN022 CP032 CP162 DA016 DA026 DA036 DA066 DE096 DE136 DE146 DE236 DG046 DG056 DJ006 DJ016 DJ036 DJ046 DJ056 DL006 FA036 FD016 GM00

Claims (4)

[Claims] 1. A holding plate for processing a printed circuit board, which is made of a thermoplastic resin material and satisfies the following (1) to (3). (1) The tensile modulus is 2 GPa or more and less than 15 GPa. (2) The elongation at break is 0.5-3%. (3) The melting point (Tm) is 225 ° C. or higher. 2. The printed circuit board according to claim 1, wherein the thermoplastic resin material is a styrene-based polymer having a predominantly syndiotactic structure or a resin composition containing a styrene-based polymer having a predominantly syndiotactic structure. Holding plate for processing. 3. The thermoplastic resin material comprises: (a) a styrenic polymer 6 mainly having a syndiotactic structure;
0 to 100% by weight, and (b) 40 to 0% by weight of a thermoplastic resin other than a rubbery elastic body and / or a styrene-based polymer mainly having a syndiotactic structure, and (a)
0 to 4 based on 100 parts by weight of the total amount of the component and the component (b)
The press plate for processing a printed circuit board according to claim 1 or 2, comprising 0 parts by weight of an inorganic filler (d). 4. The thermoplastic resin material comprises: (a) a styrenic polymer 6 mainly having a syndiotactic structure;
0 to 100% by weight, and (b) 40 to 0% by weight of a thermoplastic resin other than a rubbery elastic body and / or a styrene polymer mainly having a syndiotactic structure, and (a) component and (b) component. (C) for a total of 100 parts by weight
With respect to 0.1 to 10 parts by weight of a polymer having compatibility or affinity with the component (a) and having a polar group, and 100 parts by weight of the total of the components (a) to (c), The press plate for processing a printed circuit board according to claim 1 or 2, comprising a mineral filler (d) in an amount of 0 to 40 parts by weight.