TW201812654A - Management system and method comprising a management device, an additional means, and an authentication means - Google Patents

Abstract

This invention provides a novel structure for providing a third party regarded as a poor irregular product in the past to realize flexible application, and capable of providing a novel technology with a novel value for a customer of a semiconductor manufacturing device. A management system comprises a management device, an additional means and an authentication means; the management device issues one or a plurality of kinds of identification information and the managing state information showing the state of each issued identification information; the additional means is for additionally providing the issued identification information for a replaceable member used on the semiconductor manufacturing device and manufactured according to the design information provided by a first main body of the management device; and the authentication means is for reading the identification information attached to the replaceable member, and judging whether the replaceable member is allowed to be used on the semiconductor manufacturing device according to the state of the read identification information obtained by reference to the state information from the management device.

Description

   Management system and management method   

The present invention relates to a management system including a semiconductor manufacturing apparatus and a management method for managing replaceable components used in the semiconductor manufacturing apparatus.

Generally, in a semiconductor manufacturing apparatus, various interchangeable members (for example, a molding die, a conveyance kit, etc.) are selectively mounted in accordance with a model or manufacturing conditions. Such a replaceable member may also be a consumable, and it is necessary to appropriately manage a usage history and the like.

As a technique regarding the management method of such a replaceable member, for example, Japanese Patent Application Laid-Open No. 2003-001340 discloses that when registering mold information of a mold purchased by a user, the user side and the sales source of the mold are connected via a network. Then, the ID of the purchased mold is used to access the sales source, thereby transferring and registering the mold information of the mold stored in the sales source to the user. By adopting such a configuration, input of mold information which is troublesome every time a user purchases a mold is not required. Therefore, it is possible to reduce input operation errors that occur when complicated data input is performed, and it is possible to use in-use The mold information exchanged between the devices included in the mold management system on the other side can be unified, and further, it can be verified whether the mold supplied by the sales source is completely consistent with the mold delivered to the user.

In this way, with the advancement of information and communication technology, manufacturing sites equipped with semiconductor manufacturing equipment are also being networked.

Regarding the replaceable components of the forming molds or conveyance kits used in semiconductor manufacturing equipment, there are some so-called regular products provided by manufacturers or related companies that do not manufacture and sell semiconductor manufacturing equipment. The behavior of changing informal products. Such an irregular product cannot reflect the design information and the like used in the production of the regular product, so it cannot maintain the same quality as the regular product, which may cause defective products or cause some defects in the semiconductor manufacturing device itself.

The object of the present invention is to provide a technology that can maintain the quality of a certain quality even if it is a replaceable component provided by a semiconductor manufacturing device manufacturer or a replaceable component provided by a third party other than its affiliated company. Make up.

According to one aspect of the present invention, a management system including a semiconductor manufacturing apparatus is provided. The management system includes: a management device that issues one or more types of identification information, and manages status information indicating the status of each of the issued identification information; and an additional means for the use of a semiconductor manufacturing device based on 1 The replaceable component produced by the design information provided by the main body is added with the issued identification information; and the authentication means is obtained by reading the identification information attached to the replaceable component and obtained by referring to the status information from the management device The state of the read identification information determines whether or not the use of replaceable components is allowed in the semiconductor manufacturing apparatus.

Depending on the relationship between the first subject and the second subject that adds identification information to the exchangeable component, it is better to determine whether it is possible to issue the identification information to the second subject or the identification information issued to the second subject.

The certification means decides not to allow the operation of the semiconductor manufacturing device to be stopped while the semiconductor manufacturing device is using the replaceable component, to display a warning message on the semiconductor manufacturing device, and to the management device regarding the switchable component that is not allowed to be used At least one kind of information transmission is better.

The authentication means is to obtain the status information of the read identification information by exchanging data with the management device via the network.

The authentication means refers to a copy memory means stored in at least a part of the status information managed by the management device, and it is better to obtain the status information stored in the management device corresponding to the read identification information.

Preferably, the additional means is to mount a member having a pattern representing the issued identification information on the surface by an electroforming process to the replaceable member; the authentication means includes optically reading the pattern formed on the replaceable member, A means of optically identifying the pattern-specific identification information.

Preferably, the authentication means includes: a light receiving unit that receives light from a pattern formed on the replaceable member; and an optical member that responds to the use position of the replaceable member in the semiconductor manufacturing device, so that the pattern from the replaceable member The optical path to the light receiving section is curved.

Preferably, the management system further includes a collection and transmission means that collects information on the use history of the semiconductor manufacturing device using the replaceable component and transmits it to the management device; the management device is based on the information about the use history of the semiconductor manufacturing device To update the status information of the corresponding identification information with the replaceable components used in the semiconductor manufacturing device.

It is preferable that the replaceable member includes at least one of a forming die and a transfer kit prepared for a model manufactured by a semiconductor manufacturing apparatus.

According to another aspect of the present invention, a management method for managing a replaceable component used in a semiconductor manufacturing apparatus is provided. The management method includes: a issuing step for issuing one or more types of identification information; a management step for managing status information indicating the status of each issued identification information; and an additional step for managing the basis for use in a semiconductor manufacturing device. The replaceable component produced by the design information provided by the main body of the status information is added with the issued identification information; and the decision step is to read the identification information attached to the replaceable component, and according to the information obtained by referring to the status information, The status of the read identification information determines whether the use of replaceable components is allowed in the semiconductor manufacturing apparatus.

According to another aspect of the present invention, a management system including a semiconductor manufacturing apparatus is provided. The management system includes a management device. The management device is arranged in a management body, issues one or more types of identification information to the replaceable components used in the semiconductor manufacturing device, and manages a state indicating the status of each issued identification information. Information. The identification information is issued in accordance with the relationship between the supply entity and the management entity that make the replaceable components. The management system includes authentication means. When the replaceable component to which identification information is added is installed in a semiconductor manufacturing device, the identification information of the installed replaceable component is read, and the status information from the management device is referred by referring to The status of the read identification information obtained determines whether or not the use of replaceable components is allowed in the semiconductor manufacturing apparatus.

According to another aspect of the present invention, a management method for managing a replaceable member used in a semiconductor manufacturing apparatus is provided. The management method includes a issuing step of issuing one or more types of identification information to a replaceable component for use in a semiconductor manufacturing apparatus at a management entity. The identification information is issued in accordance with the relationship between the supply subject and the management subject who produce the replaceable components. The management method includes: a management step of managing status information indicating the status of each issued identification information; and a reading step of reading the mounted components when the replaceable component to which the identification information is added is installed in a semiconductor manufacturing apparatus The identification information of the replacement component; and the determination step, based on the status of the read identification information obtained by referring to the status information, to decide whether to allow the use of the replaceable component in the semiconductor manufacturing apparatus.

The above and other objects, features, aspects, and advantages of the present invention will be understood from the following detailed description of the present invention understood in association with the attached drawings.

1‧‧‧ Management System

2‧‧‧ Replaceable components

10‧‧‧Management subject

20, 20A, 20B, 20C ...

22, 511‧‧‧Identification information

24‧‧‧Design Information

26‧‧‧ Sales Information

30, 30A, 30B, 30C ...

100‧‧‧ management device

102‧‧‧ Status Information

104‧‧‧Trader Management Information

112‧‧‧Processor

114‧‧‧ main memory

116‧‧‧Input Department

118‧‧‧Display

120‧‧‧Output Department

122‧‧‧Status Information Database

124‧‧‧Management Information Database

126‧‧‧ secondary memory device

128‧‧‧ Release Program Module

130‧‧‧Certified Program Module

132‧‧‧ Ministry of Communications

134‧‧‧ Internal bus

200‧‧‧ production equipment

210‧‧‧ Additional Agency

300‧‧‧Semiconductor manufacturing equipment

300A, 300B‧‧‧Resin sealing device

302‧‧‧Fixed plate

303‧‧‧movable plate

304‧‧‧Fixed

304a, 305c‧‧‧Resin pathway

304b, 305b, CAV‧‧‧ cavity

305‧‧‧ movable mold

305a‧‧‧can

305v‧‧‧Vent

306, 352‧‧‧forming mold

307‧‧‧Drive mechanism

307a‧‧‧die opening and closing mechanism

307b‧‧‧resin pressurizing mechanism

308, 343‧‧‧Image recognition department

309‧‧‧Mark

309a‧‧‧ Information Formation

309b‧‧‧adhesive layer

309c‧‧‧ peeling paper

310, 311‧‧‧Reading Department

320‧‧‧Electroforming processing tank

321‧‧‧Electrolyzer

323‧‧‧master

324‧‧‧Electrocasting

330‧‧‧ball screw

331‧‧‧ball nut

332‧‧‧Main handling organization

333‧‧‧X direction guide

334‧‧‧Y-direction guide

335‧‧‧Deputy handling agency

336‧‧‧Light receiving section

337, Lb‧‧‧ condenser lens

338‧‧‧Reflector

339‧‧‧lighting

340, Ld‧‧‧Image Sensor

341‧‧‧Image Acquisition Department

344‧‧‧Female

345, 346, Lc‧‧‧ light guide

350‧‧‧ authentication function

354‧‧‧kit

360‧‧‧Stamping mechanism

362‧‧‧moving mechanism

370‧‧‧Control Department

372‧‧‧Memory Department

374‧‧‧Certification Information

376‧‧‧Device Information

378‧‧‧Display operation section

380‧‧‧ communication interface

382‧‧‧Port

390‧‧‧Terminal

501, 502, 503‧‧‧ user interface screens

512‧‧‧Life Information

513‧‧‧Error code

514‧‧‧ phone number

1021‧‧‧Identification information column

1022, 1041 ‧ ‧ ‧ Vendor Code Field

1023‧‧‧User Code Field

1024‧‧‧ Use target device code field

1025‧‧‧Status Bar

1026‧‧‧ Date of initial certification

1027‧‧‧ Final certification date and time column

1028‧‧‧Use the total number column

1042‧‧‧Contract type column

1043‧‧‧Contract status bar

1044‧‧‧Term of contract

1045‧‧‧ Total column of identification information

La‧‧‧ Light Guide

FIG. 1 is a schematic diagram for explaining the outline of a management system according to this embodiment.

Fig. 2 is a sequence diagram showing a processing procedure executed in the management system according to the present embodiment.

Fig. 3 is a schematic diagram showing an example of a device configuration of a management device constituting a management system according to this embodiment.

Fig. 4 is a schematic diagram showing an example of a data structure stored in the state information shown in Fig. 1.

FIG. 5 is a schematic diagram showing an example of a data structure stored in the seller management information shown in FIG. 1. FIG.

FIG. 6 is a schematic view showing a device cross section (XZ plane) of a resin sealing device for electronic components, which is an example of a semiconductor manufacturing device.

Fig. 7 is a perspective view showing the configuration of a forming die (a stationary die and a movable die) used in the resin sealing device shown in Fig. 6.

FIG. 8 is a schematic view showing another device cross section (YZ plane) of a resin sealing device for electronic components, which is an example of a semiconductor manufacturing device.

FIG. 9 is a schematic diagram showing a device cross section (YZ plane) of a resin sealing device for electronic components, which is an example of a semiconductor manufacturing device.

FIG. 10 is a schematic diagram for explaining an example of a method of creating a mark representing identification information used in the management system according to the present embodiment.

FIG. 11 is a schematic diagram showing an example of a program related to the addition of identification information between the management subject and the supply subject of the management system according to the present embodiment.

FIG. 12 is a schematic diagram showing a configuration example for realizing an authentication function in the management system according to the present embodiment.

FIG. 13 is a schematic diagram showing another configuration example for realizing the authentication function of the management system according to the present embodiment.

FIG. 14 is a schematic diagram showing an example of a user interface screen related to the authentication function of the management system according to the present embodiment.

An embodiment of the present invention will be described in detail with reference to the drawings. In addition, the same or equivalent parts in the drawings are denoted by the same reference numerals, and descriptions thereof will not be repeated.

<A. Overview of the structure and processing of a management system>

First, the configuration of the management system 1 according to this embodiment and the outline of the processing in the management system 1 will be described. In the following description, the production and distribution of interchangeable members used in a semiconductor manufacturing apparatus will be mainly described, but the management system 1 according to this embodiment is not limited to these ranges.

FIG. 1 is a schematic diagram for explaining the outline of the management system 1 according to this embodiment. Referring to FIG. 1, in the management system 1, a semiconductor manufacturing apparatus manufacturer (hereinafter also referred to as a “management body”) 10 that manufactures a semiconductor manufacturing apparatus 300 is mainly manufactured and supplied to a replaceable member 2 used in the semiconductor manufacturing apparatus 300. Or multiple sellers (hereinafter also referred to as "supply subjects") 20A, 20B, 20C, ..., and one or more users using the semiconductor manufacturing apparatus 300 (hereinafter also referred to as "used subjects") 30A, 30B, 30C, ... participate.

In this patent specification, the "user" or "usage body" refers to the body that uses the semiconductor manufacturing apparatus 300 in any form, and includes, for example, a semiconductor manufacturer, a semiconductor component manufacturer, and an assembly company Companies), OSAT (companies that carry out semiconductor entrusted packaging and testing), semiconductor factory companies (companies that specialize in manufacturing semiconductor wafers), etc.

In this patent specification, "replaceable member" includes any member that is detachably mounted on the semiconductor manufacturing apparatus 300, and typically means a member that is replaced in accordance with a manufactured product. The replaceable member is, for example, a forming die (mold) for forming a product into a predetermined shape, a transfer kit used as a carrier for a semi-product or a product in the semiconductor manufacturing apparatus 300, and the like. That is, the replaceable member includes at least one of a forming and conveying kit prepared for a model manufactured by the semiconductor manufacturing apparatus 300.

In this patent specification, the "seller" or "supply entity" refers to any entity that manufactures and / or sells any components used in the semiconductor manufacturing device 300, and "semiconductor manufacturing device manufacturer" or "management entity 10" Are different subjects. A "seller" or "supply entity" may also be referred to as a "third party".

In the following description, the supply bodies 20A, 20B, 20C, ... may be collectively referred to as "supply bodies 20", and the use bodies 30A, 30B, 30C, ... may be collectively referred to as "use bodies 30".

In the management system 1 according to this embodiment, the replaceable member 2 used in the semiconductor manufacturing apparatus 300 disposed in the use main body 30 may be managed by the management main body 10 (or considered to be qualitatively the same as the management main body 10). Produced and sold by an entity (for example, a affiliate managing the entity 10) may also be produced and sold by a supply entity 20. That is, the use body 30 may be a case where the replaceable member 2 can be purchased from either the management body 10 or the supply body 20.

However, regarding the management body 10 that manufactures the semiconductor manufacturing apparatus 300 or the replaceable component 2 (ie, a regular product) provided by the body that is qualitatively the same as the management body 10, of course, the quality is guaranteed, but the supply body 20 The supplied replaceable member 2 does not necessarily guarantee quality. Therefore, in the management system 1 of this embodiment, the management body 10 participates in the production of the replaceable member 2 in the supply body 20 and provides new value to the use body 30.

The management body 10 includes a management device 100 for performing main processing in the management method according to this embodiment. The management device 100 includes a database storing the status information 102 and a database storing the seller management information 104. Details of the status information 102 and the seller management information 104 will be described later.

FIG. 2 is a sequence diagram showing a processing program executed by the management system 1 according to the present embodiment. Referring to FIGS. 1 and 2, first, the semiconductor manufacturing apparatus 300 is supplied from the management body 10 to the use body 30 (step S2). At this time, it is also possible to supply the replaceable member 2 used in the semiconductor manufacturing apparatus 300 from the management body 10 to the use body 30 (step S4).

Then, with the use of the main body 30 accompanying the use of the semiconductor manufacturing apparatus 300, a new replaceable member 2 is required, and it is assumed that the new replaceable member 2 is ordered from the supply main body 20 instead of the management main body 10 (step S6).

In addition, between the management body 10 and the supply body 20, a predetermined contract is typically signed in advance, and it is regarded as forming a predetermined relationship between the parties. Such a predetermined contract includes, for example, matters concerning the use of the design information of the replaceable component 2 provided by the supply entity 20 from the management entity 10 and matters concerning the supply entity 20 selling the replaceable component 2 to any of the use entities 30 Matters concerning the use of information held by the management entity 10 and the supply entity 20, etc. The steps S8 to S20 shown below are performed according to the relationship between the management body 10 and the supply body 20.

Specifically, the supply main body 20 that receives the order of the interchangeable member 2 from any one of the main use main bodies 30 provides the management main body 10 with sales information 26 indicating the contents of the order (step S8). The sales information 26 includes not only information on the type and number of the replaceable component 2 that is accepted for order, but also information about the main body 30 who ordered the replaceable component 2 and information about the replaceable component that is used by the main body 30. Information and the like of the semiconductor manufacturing apparatus 300.

The management body 10 supplies the design information 24 of the exchangeable member 2 of the object to the supply body 20 based on the sales information 26 from the supply body 20 (step S10). The design information 24 includes design drawings, various parameters, and the like for making the replaceable component 2 that the supply body 20 accepts and orders. The supply main body 20 creates the replaceable member 2 based on the design information 24 from the management main body 10 (step S12). In step S12, the exchangeable member 2 is produced using an arbitrary production apparatus 200. As the production apparatus 200, any one or a plurality of processing apparatuses may be used.

The management body 10 updates the target replaceable component at an arbitrary timing before the production of the replaceable component 2, during the production of the replaceable component 2, and after the production of the replaceable component 2. Based on the sales information 26 from the supply body 20 2 is the status information 102 (step S14), and the identification information 22 is issued after updating the status information 102 to the supplier 20 (step S16).

Here, depending on the relationship between the management body 10 and the supply body 20, it is determined whether the identification information 22 of the supply body 20 can be issued or the status of the identification information 22 issued by the supply body 20. The management entity 10 refers to the seller management information 104 and determines the content of the identification information 22 to be distributed. The seller management information 104 includes content corresponding to the relationship formed between the management body 10 and the supply body 20.

The identification information 22 is information for specifying the corresponding interchangeable component 2 and basically uses a uniquely determined number. Typically, the identification information 22 uses a serial number or an authentication key composed of a predetermined number of characters or a combination of numbers. However, for example, when a plurality of replaceable members 2 of the same type are purchased by the same user 30, the same identification information 22 may be allocated to the replaceable members 2 of the same type purchased at one time.

The supply main body 20 adds identification information 22 issued by the management main body 10 to the produced replaceable member 2 (step S18). In addition to the identification information 22 of the replaceable member 2, a production device 200 for producing the replaceable member 2 may be used, or an additional mechanism 210 separate from the production device 200 may be used. Depending on the type of the identification information 22 to be issued, any one or a plurality of devices may be used. In the following description, for convenience of explanation, the production device 200 that provides the function of producing the replaceable member 2 and the additional mechanism 210 that provides the function of adding the identification information 22 to the replaceable member 2 will be described separately. However, a single device that can provide both of these functions can also be used.

The produced interchangeable member 2 is supplied to the use subject 30 by being provided with identification information 22. That is, the replaceable member 2 produced by the supply main body 20 is supplied to the use main body 30 after the identification information 22 is added (step S20).

The status information 102 updated in step S14 is information for managing each identification information 22 issued by the management entity 10 and includes at least whether the replaceable component 2 to which each identification information 22 is added is usable information. That is, the status information 102 indicates whether or not the semiconductor manufacturing apparatus 300 as a target user can effectively use the replaceable member 2 to which each identification information 22 is added. The status information 102 includes not only information indicating whether the replaceable component 2 to which each identification information 22 is added can be used effectively, but also conditions for using the replaceable component 2 as a target, such as the use of each of the replaceable components 2. Information on the number of times remaining, the time remaining before each interchangeable member 2 can be used, the type of semiconductor manufacturing apparatus 300 where each interchangeable member 2 can be used, and the like. An example of more detailed data structure regarding the status information 102 will be described in detail.

According to the steps S8 to S20 described above, the supply main body 20 guarantees the quality of the produced and provided interchangeable member 2. The replaceable member 2 supplied from the use body 30 is used in accordance with the procedure shown below.

First, the supplied main body 30 is used to mount the supplied interchangeable member 2 to the target semiconductor manufacturing apparatus 300 (step S22). In a state where it is mounted on the semiconductor manufacturing apparatus 300 or before mounting on the semiconductor manufacturing apparatus 300, the identification information 22 added to the replaceable member 2 is read (step S24). Regarding the method of reading the identification information 22, any method may be adopted in accordance with the type, shape, and additional position of the identification information 22. Examples of reading methods of the identification information 22 will be described later.

Next, an authentication process is performed based on the read identification information 22. Typically, the read identification information 22 is transmitted to the management body 10 (step S26). Then, the management body 10 responds to the status information 102 corresponding to the transmitted identification information 22 (step S28). Based on the status information 102 responded from the management body 10, it is determined whether or not the target interchangeable member 2 of the target semiconductor manufacturing apparatus 300 can be used (step S30). Only when it is determined that the replaceable member 2 of the target can be used, the replaceable member 2 of the target semiconductor manufacturing apparatus 300 can be used.

With the use of the interchangeable member 2 in the semiconductor manufacturing apparatus 300, information related to the use is collected. The use body 30 has a collection and transfer function that collects information on the use history of the semiconductor manufacturing apparatus 300 using the replaceable member 2 and transmits the information to the management apparatus 100. Specifically, the usage history of the replaceable member 2 in the semiconductor manufacturing apparatus 300 is collected (step S32). The collected usage history is then transmitted to the management entity 10 (step S34). At this time, the identification information 22 of the replaceable member 2 for specifying the object may be transmitted to the management body 10 together with the use history.

When the management entity 10 receives the usage history from the usage entity 30, based on the received usage history, the management entity 10 updates the status information 102 on the target replaceable member 2 (step S36). That is, the management device 100 updates the state where the replaceable member 2 used in the semiconductor manufacturing device 300 is assigned the corresponding identification information 22 based on the information about the use history of the semiconductor manufacturing device 300.

Then, the management entity 10 transmits the status information 102 indicating the content of the updated status information 102 to the use entity 30 (step S38). Based on the status information 102 responded from the management body 10, the use main body 30 determines whether or not the interchangeable member 2 of the target semiconductor manufacturing apparatus 300 can be used (step S40). In step S40, based on the status information 102 from the management body 10, it is determined at a suitable timing whether the target replaceable member 2 is available.

Hereinafter, as long as the same interchangeable member 2 is used, the processing of steps S32 to S40 is repeated.

According to the steps S22 to S40 described above, the management body 10 can perform appropriate maintenance in accordance with the deterioration and the like accompanying the use of the replaceable member 2 delivered to the use body 30.

In addition, the processes related to steps S24 to S40 are typically provided by the authentication function 350 (see FIG. 1) incorporated in the semiconductor manufacturing apparatus 300. Regarding the assembly form of the authentication function 350, an arbitrary method can be adopted. For example, it may be assembled as part of the function of the semiconductor manufacturing apparatus 300, or may be assembled as part of the function of the management apparatus that manages one or more semiconductor manufacturing apparatuses 300. Several assembly examples of the authentication function 350 will be described later.

<B. Configuration of Management Device 100>

Next, the configuration of the management device 100 arranged in the management body 10 will be described. The management device 100 mainly issues one or a plurality of types of identification information 22, and manages the status information 102 indicating the status of each issued identification information 22.

(b1: Device configuration of the management body 10)

FIG. 3 is a schematic diagram showing an example of a device configuration of the management device 100 constituting the management system 1 according to the present embodiment. Referring to FIG. 3, the management device 100 is a main component, including a processor 112, a main memory 114, an input unit 116, a display unit 118, an output unit 120, a status information database 122, a management information database 124, and two Secondary memory device 126 and communication unit 132. These components are connected to the internal bus 134.

The processor 112 is a computing body that executes processing required for the functions provided by the management device 100, and executes a program or a program module stored in the secondary memory device 126 to achieve a required function. The processor 112 may also be a multi-core and / or multi-processor, and according to the required load processing performance, the required number of cores or processors is set.

The main memory 114 is a working memory required by the processor 112 to execute programs. The main memory 114 stores the code or work data of the programs executed at one time.

The input unit 116 is a component that accepts operations from an operator and the like, and is assembled using, for example, a keyboard, a mouse, a touch panel, and the like. The display unit 118 is a component that presents information such as processing results to an operator or the like, and is assembled using, for example, a display or the like.

The output unit 120 is a component that makes the information in the management device 100 tangible and is output, and is assembled using, for example, a list machine. For example, when a form such as printing a character string indicating the identification information 22 issued by the management device 100 is used, the output unit 120 may be a part of a means for issuing the identification information 22.

The status information database 122 is a database that stores status information 102 (see FIG. 4), and the management information database 124 is a database that stores seller management information 104 (see FIG. 5). Details of the status information 102 and the seller management information 104 will be described later.

For the convenience of description, the state information database 122 and the management information database 124 are described as components different from the secondary memory device 126, but the area of the secondary memory device 126 can also be used to implement the state information database 122. Or management information database 124. Alternatively, the status information database 122 or the management information database 124 may be implemented on a server device different from the management device 100.

The secondary memory device 126 stores a distribution program module 128 and an authentication program module 130 for providing functions required not only in the operating system (not shown) but also in the management system 1 according to this embodiment. These program modules are read out as needed and executed by the processor 112.

The issuing program module 128 mainly provides the function of issuing one or a plurality of types of identification information 22 to the replaceable component 2 used in the semiconductor manufacturing apparatus 300. More specifically, the issuing program module 128 issues a certain type of identification information 22 in response to a request from the supply entity 20, and includes a command for adding registration of the issued identification information 22 to the status information 102.

The authentication program module 130 mainly provides a function of managing the status information 102 indicating the status of the issued identification information 22. More specifically, the authentication program module 130 responds to the request from the user 30, and responds to the requester in the registration contained in the status information 102, and according to the use history of the interchangeable member 2 transmitted from the user 30 After that, the status information corresponding to each identification information 22 is updated.

The communication unit 132 is a component for communicating with the supply main body 20 and / or the main body 30, and is assembled using, for example, a wired LAN communication interface, a wireless LAN communication interface, a public network communication interface, and the like. It is also possible to assemble a plurality of types or a plurality of communication sections 132 in a manner dependent on the number of the supply main bodies 20 and the use main bodies 30 that are communication objects, the communication form, and the like.

Hereinafter, examples of data structures of the status information 102 and the seller management information 104 stored in the management device 100 will be described.

(b2: Status information 102)

FIG. 4 is a schematic diagram showing an example of a data structure stored in the status information 102 shown in FIG. 1. Referring to FIG. 4, the status information 102 includes the seller code field 1022 corresponding to the identification information stored in each identification information field 1021 and the user code field 1023, the target device code field 1024, the status field 1025, and the initial authentication. The date and time column 1026, the final certification date and time column 1027, and the total number of used batches column 1028.

Basically, the identification information field 1021 is assigned a uniquely determined number. In the seller code column 1022, a code for specifying the supply main body 20 of the replaceable member 2 to which the corresponding identification information 22 is added is stored.

In the user code field 1023, a code for specifying the use subject 30 of the replaceable member 2 to which the corresponding identification information 22 is attached is stored. In the use target device code column 1024, a code for specifying a semiconductor manufacturing device 300 for making a target of the replaceable member 2 to which the corresponding identification information 22 is added is stored. In addition, when a plurality of semiconductor manufacturing apparatuses 300 are used, they may be stored in a plurality of such codes.

In the status column 1025, a status value indicating whether the replaceable component 2 to which the corresponding identification information 22 is attached can be used is stored. As an example of the status value, "Valid" indicating that the replaceable component 2 is usable, "Expired" indicating that the replaceable component 2 has become unusable, and status that the replaceable component 2 is not yet certified "Not Active", etc.

In the initial authentication date and time column 1026, the first date and time for judging whether the corresponding identification information 22 can be used is stored, and in the final authentication date and time column 1027, the last date and time for judging whether the corresponding identification information 22 can be used is stored. In the total number of used batches column 1028, the total number of times the semiconductor manufacturing apparatus 300 uses the replaceable component 2 to which the corresponding identification information 22 is added is stored.

A part of the information stored in the status information 102 may be created based on the sales information 26 (refer to FIG. 1 and FIG. 2) provided by the supply body 20. The information stored in the status information 102 is updated at any time based on the use history and the like transmitted from the use subject 30 to the management subject 10.

As shown by 2 in the lower column of the status information 102 shown in FIG. 4, although the identification information 22 itself has been issued, the status of the authentication processing of the replaceable component 2 to which the identification information 22 is added has not been implemented. Information indicating the contents of the issued identification information 22 is stored in the identification information field 1021 and the seller code field 1022, respectively. However, the information other than the status field 1025 may not be stored. In addition, as long as the information in the user code field 1023 and the target device code field 1024 can be obtained from the sales information 26, the information obtained in this way can also be created and stored.

(b3: Trafficker management information 104)

Fig. 5 is a schematic diagram showing an example of a data structure stored in the seller management information 104 shown in Fig. 1. Referring to FIG. 5, the seller management information 104 includes a contract type column 1042, a contract status column 1043, a contract term column 1044, and a total number of identification information issuance column 1045 corresponding to the seller type code stored in each seller code column 1041. .

In the seller code column 1041, a code for specifying the supply entity 20 that can issue the identification information 22 is stored. The codes stored in the seller code column 1041 are better combined with the codes stored in the seller code column 1022 of the status information 102 shown in FIG. 4.

In the contract type column 1042, a code for specifying the type of the relationship between the supply main body 20 and the management main body 10 indicated by the corresponding seller code is stored. In the contract status column 1043, a status value indicating the status of the relationship between the supply subject 20 and the management subject 10 indicated by the corresponding vendor code is stored. As examples of the status value, "Valid" indicating that the contract between the management entity 10 and the supply entity 20 is valid and that the identification information 22 can be issued, "Invalid" indicating that the status of the identification information 22 cannot be issued, and the like are used.

In the contract term field 1044, the validity period of the contract between the management entity 10 and the supply entity 20 indicated by the corresponding vendor code is stored. In the total number of identification information issuance column 1045, the number of identification information 22 issued so far to the supply entity 20 indicated by the corresponding seller code is stored.

The content of the seller management information 104 is changed, for example, by managing the relationship between the management entity 10 and the supply entity 20 (typically, the contract between the parties) (for example, new contract, update, change of content, termination of contract, etc.) Updated for an opportunity. In addition, the case where the identification information 22 is issued to any one of the supply entities 20 is also updated.

(b4: Design Information 24)

The design information 24 provided by the management body 10 to the single or multiple supply body 20 may be in an electronic form or a paper medium. Alternatively, it may be in the form of microfilm or the like. In the case where the design information 24 is provided in an electronic form, it is preferable to use a part of the management device 100 or use a server device different from the management device 100 to provide the design information 24 electronically.

In addition, even if the design information 24 is provided in a paper medium or a Microsoft tablet, it is preferable to arrange a management server or the like for searching or management of the provided design information 24.

<C. Attachment and Reading of Identification Information 22>

Next, a description will be given of a process of adding the identification information 22 issued by the management body 10 to the replaceable member 2 produced by the supply body 20 in the management system 1 according to this embodiment. The supply main body 20 adds the issued identification information 22 to the replaceable component 2 used in the semiconductor manufacturing apparatus 300 and produced based on the design information 24 provided by the management main body 10. A more specific processing procedure and the like regarding the additional steps of the identification information 22 will be described.

(c1: Addition of identification information 22)

In this patent specification, identification information 22 is added to the replaceable member 2, which means that the identification information 22 is incorporated into the replaceable member 2 in a form that can be reproduced after the fact. The information of the identification information 22 may be stored in any medium such as a visually recognizable pattern, a wireless signal, and an optical signal.

For example, as the visually recognizable pattern, an unaltered text string indicating the content of the identification information 22, or a mark, a mark (such as a bar code or a two-dimensional code), an image, etc. obtained by encoding the content of the identification information 22 may be used. The shape showing such a pattern may be formed on the surface of the replaceable member 2 or the like, and a film, a label, an adhesive tape, or the like to which a pattern is printed may be adhered to the replaceable member 2.

In the case where a wireless signal is used, it may be prepared in advance by storing an RF (Radio Frequency) tag in the replaceable member 2 or forming a circuit functioning as an RF tag in the replaceable member 2 for storage purposes in advance. Identification information 22.

When an optical signal is used, a hologram including a pattern indicating the content of the identification information 22 may be formed on the surface of the interchangeable member 2 or the hologram showing the pattern may be pasted to the replaceable member 2.

As described above, in the management system 1 according to this embodiment, the identification information 22 can be added to the replaceable member 2 by an arbitrary method. In this patent specification, the "additional mechanism" or "additional means" may include any marking device (for example, a printer, laser marker, etc.), a sticking device such as a film, label, tape, etc. Any device or mechanism for the position of the fixture. Furthermore, in a case where the operator directly attaches the identification information 22 to the replaceable member 2, the operator may be included in the “additional mechanism” or “additional means”.

The identification information 22 can be added to the replaceable member 2 in an arbitrary method. When the added identification information 22 is read, an appropriate reading method may be adopted in accordance with the additional form.

(c2: Reading method of identification information 22: one)

Next, an example of a method of reading the identification information 22 added to the replaceable member 2 will be described.

As an example of the semiconductor manufacturing apparatus 300, a resin sealing apparatus including an electronic component of a semiconductor wafer is assumed. Such a resin sealing device covers a semiconductor wafer mounted on a substrate (a lead frame, a printed circuit board, or the like) with a sealing resin. More specifically, a sealing resin is formed around a substrate on which a semiconductor wafer is mounted using a molding die, thereby completing a sealed substrate equivalent to a molded product. In this resin sealing device, the forming die corresponds to the replaceable member 2.

FIG. 6 is a schematic view showing a device cross section (XZ plane) of a resin sealing device 300A of an electronic component which is an example of the semiconductor manufacturing device 300. For convenience of explanation, in FIG. 6, a resin sealing device 300A composed of a single molding module is shown as an example. However, a plurality of resin sealing devices 300A may be arranged and connected to each other along the X direction.

The resin sealing device 300A includes: a fixed plate 302 fixed to the device body; and a movable plate 303 that is arranged to face the fixed plate 302 and is provided so as to be able to approach and move away from the fixed plate 302. The resin sealing device 300A has: a fixed mold (upper mold) 304, which is detachably mounted (i.e., replaceable) to the fixed disk 302; and a movable mold (lower mold) 305, which is mounted to a movable disk 303 Disassembly. The fixed mold 304 and the movable mold 305 together form a forming mold 306. The forming die 306 (fixed die 304 and movable die 305) corresponds to the replaceable member 2.

The resin sealing device 300A further includes a driving mechanism 307 including a reciprocating driving mechanism (die opening and closing mechanism) 307a and a resin pressing mechanism 307b including a movable platen 303. The mold opening and closing mechanism 307a locks the fixed mold 304 and the movable mold 305.

The mark 309 is arranged at a predetermined position on the surface of the forming die 306. The mark 309 includes an information formation surface 309 a indicating the corresponding identification information 22. A fine pattern representing the identification information 22 is formed on the information formation surface 309a by bumps and the like. The resin sealing device 300A includes an image recognition unit 308.

FIG. 7 is a perspective view showing the configuration of a molding die 306 (a fixed die 304 and a movable die 305) used in the resin sealing device 300A shown in FIG. 6. FIG. Referring to FIG. 7, the resin passage 304 a on the side of the fixed mold 304 (hereinafter also referred to as “fixed side”) and the cavity 304 b on the fixed side are formed in the fixed mold 304. A tank 305a to which a resin material is supplied, a cavity 305b on the side of the movable mold 305 (hereinafter also referred to as "movable side"), a resin passage 305c on the movable side connected to the cavity 305b on the movable side, and a vent hole 305v are formed in Movable mold 305.

In a state where the fixed mold 304 and the movable mold 305 are clamped, the tank 305a of the movable mold 305 communicates with the resin passage 304a on the fixed side, and the resin passage 304a of the fixed mold 304 communicates with the resin passage 305c of the movable mold 305. The tank 305a of the movable mold 305 communicates with the cavity 304b of the fixed mold 304 and the cavity 305b on the fixed side through the resin passage 304a and the resin passage 305c. During resin molding, the cavity 304b of the fixed mold 304 and the cavity 305b of the movable mold 305 are filled with a fluid resin such as a molten resin. The gas system remaining inside the cavity 304b and the cavity 305b is filled with the fluid resin, and is discharged out of the molding die 306 through the vent hole 305v.

FIG. 8 is a schematic view showing another device cross section (YZ plane) of a resin sealing device 300A of an electronic component, which is an example of the semiconductor manufacturing device 300. Referring to FIG. 8 (A), the resin sealing device 300A is provided with a position corresponding to the arrangement position of the molding die 306, and is provided for reading and identifying from a mark 309 (information forming surface 309a) arranged on the molding die 306. Reading section 310 of information 22. The two reading sections 310 are arranged in the resin sealing device 300A so as to correspond to the positions of the marks 309 arranged on each of the fixed mold 304 and the movable mold 305.

FIG. 8 (B) is an enlarged view of the reading section 310 shown in FIG. 8 (A). As shown in FIG. 8 (B), the reading unit 310 reads the identification information 22 optically from the mark 309 (information forming surface 309a).

Specifically, the light system representing the image of the information forming surface 309a passes through the light guide path La, the condenser lens Lb, and the light guide portion Lc and enters the image sensor Ld. The image sensor Ld is composed of, for example, a CCD (Charged Coupled Device), a CMOS (Complementary Metal Oxide Semiconductor) image sensor, or a line sensor. The image sensor Ld uses light corresponding to the image of the information formation surface 309 a as image data and outputs it to the image recognition unit 308. The image recognition unit 308 processes the image data, and outputs identification information 22 included in the image data.

In FIG. 8 (B), as an example, a configuration including a condenser lens Lb, a light guide portion Lc, and an image sensor Ld is shown. However, a general-purpose digital camera may be used instead. However, as a digital camera, it is better to use one with heat resistance. Alternatively, it is better to add a cooling function to the digital camera in advance.

(c3: Reading method of identification information 22: Part 2)

Next, another example of a method of reading the identification information 22 added to the replaceable member 2 will be described.

As another example of the semiconductor manufacturing apparatus 300, a resin sealing apparatus of a compression molding method is conceived. A resin sealing device of a compression molding method has a cavity set in a lower mold. Since the above-mentioned forming mold is used in a high-temperature environment (for example, about 180 ° C.), a configuration example of a reading section suitable for use in a high-temperature environment will be described.

FIG. 9 is a schematic view showing a device cross section (YZ plane) of a resin sealing device 300 of an electronic component, which is an example of a semiconductor manufacturing device 300. For convenience of explanation, the resin sealing device 300B composed of a single molding module is shown as an example, but a plurality of resin sealing devices 300B may be arranged in the X direction and connected to each other.

Referring to FIG. 9, the resin sealing device 300B is provided with a main conveyance mechanism 332 that can move in the X direction and a sub conveyance mechanism 335 that can move in the Y direction. The ball nut 331 is attached to the main conveyance mechanism 332, and the ball nut 331 is engaged with the ball screw 330. An X-direction guide 333 extending in the X-direction and a Y-direction guide 334 extending in the -Y direction are provided.

The sub conveying mechanism 335 holds a substrate (not shown) on which a semiconductor wafer is mounted on the upper side, and supplies the substrate (not shown) to the lower surface of the fixed mold 304. A substrate supplied by a method such as suction or clamping is temporarily fixed under the fixed mold 304. The sub-conveying mechanism 335 holds a resin material such as a solid resin such as a sheet or powder or a liquid resin having fluidity at room temperature in a container provided on the lower side. The auxiliary conveyance mechanism 335 supplies the held resin material to the inside of the cavity CAV provided in the movable mold 305.

A female mold 344 having a cavity CAV is mounted on the movable mold 305. In the resin sealing device 300B, the female mold 344 also corresponds to the replaceable member 2. The mark 309 is arranged at a predetermined position on the surface of the female mold 344. The mark 309 includes an information formation surface 309 a indicating the corresponding identification information 22. The mark 309 is fixed to the female mold 344 by, for example, sticking or screwing.

The reading section 311 including the light receiving section 336, the light guiding section 346, and the image acquisition section 341 reads the identification information 22 optically from the mark 309 (information forming surface 309a).

The light receiving unit 336 is provided on the lower surface or side surface of the sub conveyance mechanism 335. The light receiving unit 336 includes a condenser lens 337 and a reflecting mirror 338. These members are preferably made of heat-resistant glass. The condenser lens 337 is disposed on the light incident side of the light receiving unit 336, and the ring-shaped illumination 339 is provided around the condenser lens 337.

The image acquisition section 341 including the image sensor 340 is provided in the main conveyance mechanism 332. The image sensor 340 is a light-receiving portion that receives light from a pattern formed on the interchangeable member 2 and is composed of, for example, a CCD, a CMOS image sensor, a line sensor, and the like. Instead of the image sensor 340, a general digital camera may be used. However, as a digital camera, it is better to use one with heat resistance. Alternatively, it is better to add a cooling function to the digital camera in advance.

The light representing the image of the information forming surface 309 a is collected by the light guide unit 345 and entering the condenser lens 337. The collected light is reflected by a mirror 338. The light reflected by the reflecting mirror 338 is incident on the image sensor 340 through the light guide section 346. In this manner, the reflecting mirror 338 is an optical member that bends the optical path from the pattern of the replaceable member 2 to the image sensor 340 in accordance with the use position of the replaceable member 2 in the semiconductor manufacturing apparatus 300.

By adopting such a configuration, the image sensor 340 can be kept away from the molding die, so that the image sensor 340 can be kept away from the high-temperature environment. As a result, the image sensor 340 is suppressed from becoming higher than the heat-resistant temperature.

The image sensor 340 uses light corresponding to the image of the information formation surface 309 a as image data and outputs it to the image recognition unit 343. The image recognition unit 343 processes the image data, and outputs identification information 22 included in the image data.

FIG. 9 shows a configuration example where the space from the light receiving section 336 to the image acquisition section 341 is used as the light guide section 346, but an optical fiber may be used instead as the light guide section 346. In this case, it is also possible to arrange the optical fiber inside a heat-resistant protective tube.

(c4: How to make marks)

Next, an example of a method of creating a mark indicating the identification information 22 will be described.

FIG. 10 is a schematic diagram for explaining an example of a method of creating a mark indicating the identification information 22 used in the management system 1 according to the present embodiment. On the information forming surface 309a (surface) of the mark 309, for example, an electroforming process (electroforming process) is used to form a fine pattern with high accuracy. As shown in FIG. 10 (D), finally, an adhesive layer 309b is formed on the back surface of the mark 309 to which the release paper 309c is adhered. After the supply main body 20 peels off the release paper 309c of the mark 309, the mark 309 can be adhered to the target replaceable member 2.

Fig. 10 (A) and Fig. 10 (B) schematically show the steps of the electroforming process. In this electroforming process, a master mold 323 corresponding to the identification information 22 is prepared in advance. Then, as shown in FIG. 10 (A), in the electrolytic cell 321 of the electroforming processing tank 320, a fixed voltage is applied from the outside to a metal (anode) 322 such as nickel and a mother mold (cathode) 23. By the applied voltage, metal ionization occurs at the anode, and electrodeposition by reduction of the metal occurs at the master mold 323. An electrocast 324 made of electrodeposited nickel is used as the body of the mark 309. The master mold 323 is preferably made by precision machining such as elliptical vibration cutting.

Next, as shown in FIG. 10 (B), the electroformed product 324 electrodeposited on the master mold 323 is peeled from the master mold 323. The electroformed product 324 is formed with a fine pattern corresponding to a pattern in which the surface shape of the master mold 323 is reversed. This fine pattern is used as part or all of the information forming surface 309a of the mark 309.

In FIG. 10 (C) and FIG. 10 (D), the steps of integrating the adhesive layer 309b and the release paper 309c on the back surface of the mark 309 are briefly shown. As shown in FIG. 10 (C), the adhesive layer 309b to which the release paper 309c is attached is adhered to the back surface of the electroformed product 324 (that is, the surface corresponding to the opposite side of the information forming surface 309a). Next, as shown in FIG. 10 (D), the release paper 309c is peeled from the mark 309, and then the mark 309 is adhered to the target replaceable member 2.

The mark 309 is formed into a thin sheet shape by electroforming as described above. For example, a mark 309 having a thickness of 0.05 to 0.1 μm can be produced. By forming such a thin sheet shape, it is possible to prevent the mark 309 attached to a certain replaceable member 2 from being peeled off and adhered to another replaceable member 2. That is, when the mark 309 that has been pasted once is peeled off, at least a part of the information forming surface 309a of the mark 309 is broken and cannot be used any more.

In this way, as a form of the additional step of the identification information 22, a mark 309 including an information forming surface 309a in which a pattern representing the issued identification information 22 is formed on the surface by electroforming is attached to the replaceable member 2. Then, the pattern formed on the information formation surface 309a included in the mark 309 is optically read, and the identification information 22 is specified from the pattern read optically.

(c5: Issuing and additional procedures for identification information 22)

In the management system 1 according to the present embodiment, the management device 100 manages whether or not each identification information can be effectively used. Therefore, it is not necessary to prevent copying of the identification information 22 added to the replaceable member 2. Therefore, the supply main body 20 can also be prepared to perform most of the steps required to add the identification information 22 issued by the management main body 10 to the replaceable component 2. Hereinafter, an example of a procedure shared between the management body 10 and the supply body 20 will be described.

FIG. 11 is a schematic diagram showing an example of a program related to the addition of identification information 22 between the management subject 10 and the supply subject 20 of the management system 1 according to the present embodiment.

In the program example shown in FIG. 11 (A), the management entity 10 issues identification information 22 and provides the issued identification information 22 to the supply entity 20 in the form of electronic information. The supply main body 20 uses a marking device such as a printer or a laser marker, and displays the identification information 22 supplied by the management main body 10 on the produced replaceable member 2. According to this method, a series of procedures from the distribution of the identification information 22 to the addition of the replaceable member 2 can be performed electronically with high efficiency.

In the program example shown in FIG. 11 (B), the management entity 10 issues identification information 22 and provides the issued identification information 22 to the supply entity 20 in the form of electronic information. The supply main body 20 uses an arbitrary label production device to make marks such as films, labels, tapes, etc. of the printed identification information 22 supplied from the management body 10, and then attaches the produced marks to the replaceable member 2. According to this method, since the mark corresponding to the added replaceable member 2 can be made in the supply main body 20, the identification information 22 can be added without hindering the function of the replaceable member 2.

In the program example shown in FIG. 11 (C), the management entity 10 issues identification information 22, and creates a mark indicating the issued identification information 22. The marking can be produced by electroforming as described with reference to FIG. 10. The supply body 20 is provided with a mark made by the management body 10. According to this method, delicate marks that are difficult to reuse can be used, and the possibility of unauthorized use is further reduced.

As an example, the method shown in FIG. 11 (A) to FIG. 11 (C) is illustrated, but it is not limited to this, and the relationship between the management entity 10 and the supply entity 20 may be adopted (typically a contract) The procedure.

<D. Authentication function 350>

Next, the authentication function 350 incorporated in the use main body 30 will be described. The authentication function 350 provides reading of the identification information 22 attached to the replaceable member 2 and determines whether or not the semiconductor manufacturing is permitted based on the status of the read identification information 22 obtained by referring to the status information 102 from the management device 100. The device 300 uses the function of the interchangeable member 2. That is, by referring to the status information 102 stored in the management device 100, the status information of the identification information 22 added to the replaceable member 2 is mounted on the semiconductor manufacturing device used in the use body 30 300. Then, according to the obtained status information, it is confirmed that the mounted replaceable member 2 is in a state in which the semiconductor manufacturing apparatus 300 can be used.

In addition, the authentication process may be performed every time the replaceable member 2 is mounted on the semiconductor manufacturing apparatus 300, or it may be performed every arbitrarily determined period.

Since the semiconductor manufacturing apparatus 300 is often used in a limited area such as a factory where the main body 30 is used, there is a case where the state information 102 stored in the management apparatus 100 that manages the main body 10 cannot be directly referred to. In consideration of such a background, the main body 30 may be configured with a device as shown below, for example.

(d1: First embodiment of the authentication function 350)

First, a configuration example in which the use main body 30 and the management main body 10 are connected via a network will be described. FIG. 12 is a schematic diagram showing a configuration example for realizing the authentication function 350 in the management system 1 according to this embodiment. In the configuration example shown in FIG. 12, the authentication function 350 obtains the status information of the read identification information 22 by exchanging data with the management device 100 via a network.

Referring to FIG. 12, an example in which two semiconductor manufacturing apparatuses 300-1 and 300-2 are arranged in the use main body 30 is shown. The semiconductor manufacturing apparatus 300-1 includes, for example, a stamping mechanism 360 and a conveying mechanism 362 related to semiconductor manufacturing. The semiconductor manufacturing apparatus 300-1 further includes a control section 370, a display operation section 378, and a communication interface 380.

The control unit 370 is typically composed of a personal computer or the like having a general-purpose architecture. That is, the control unit 370 is a basic computer element including a processor, a memory, a hard disk, and the like, and executes a predetermined program by the processor, which not only controls the basic operation of the semiconductor manufacturing apparatus 300-1, but also implements an authentication function 350 .

The storage unit 372 of the control unit 370 stores authentication information 374 and device information 376. These pieces of information are used for authentication processing based on the identification information 22 added to the replaceable member 2.

The display operation unit 378 accepts an operation by the operator, and presents the operator with a processing result in the control unit 370 and the like. The display operation unit 378 is typically composed of a display, a touch panel, a mouse, a keyboard, and the like.

The communication interface 380 exchanges information with the management device 100 of the management body 10 via the Internet or the like. As the communication interface 380, any communication method can be adopted. That is, as a transmission path for connection to the Internet, for example, wired communication such as an optical fiber or a DSL (Digital Subscriber Line) line, short-range wireless communication such as wireless LAN or Bluetooth (registered trademark), and LTE (Long Term Evolution) are listed. ) Or public wireless communications such as WiMAX.

As the authentication function 350 having the configuration shown in FIG. 12, the control unit 370 reads the identification information 22 attached to the replaceable member 2 (typically, the mold 352, the kit 354, and the like) mounted on the semiconductor manufacturing apparatus 300. When the identification information 22 is read, the configuration described with reference to FIGS. 6 to 9 described above may be employed. The control unit 370 transmits the identification information 22 read from the replaceable member 2 to the management body 10 (the management device 100) via the Internet. At this time, the control unit 370 transmits the device information 376 stored in the memory unit 372 in advance. The device information 376 includes information of the semiconductor manufacturing device 300-1 for a specific object, and the management body 10 also confirms that the transmitted identification information 22 is consistent with the semiconductor manufacturing device 300-1 of the target.

When the management body 10 (management device 100) receives the identification information 22 from the use body 30, it refers to the stored status information 102 and responds to the corresponding status information. The control unit 370 determines whether or not the replaceable member 2 installed in the semiconductor manufacturing apparatus 300-1 to be used can be used based on the status information responded from the management body 10 (the management device 100). Information, update certification information 374. On the other hand, when it is determined that the mounted interchangeable member 2 cannot be used, the control unit 370 stops the operation of the semiconductor manufacturing apparatus 300 or notifies the operator or the like. Through this exchange of information, the authentication function 350 is realized.

Since the semiconductor manufacturing apparatus 300-2 has the same device configuration as the semiconductor manufacturing apparatus 300-1, detailed description will not be repeated.

By adopting the device configuration shown in FIG. 12, since the authentication processing of the replaceable member 2 mounted on the semiconductor manufacturing device 300 can be realized in real time, and the status information can also be referred to in real time, it is possible to reduce Defects in the replaceable member 2 may be caused by production loss of the semiconductor manufacturing apparatus 300 and the like.

(d2: Second embodiment of the authentication function 350)

Next, a case where the semiconductor manufacturing apparatus 300 cannot be connected to the Internet or the like will be described. FIG. 13 is a schematic diagram showing another configuration example for realizing the authentication function 350 of the management system 1 according to the present embodiment.

The system configuration shown in FIG. 13 is different from the system configuration shown in FIG. 12 in that the port 382 is adopted instead of the communication interface 380. Since the other components are substantially the same, detailed description is not repeated.

The system configuration shown in FIG. 13 is accessed from the management device 100 of the management body 10 via a terminal 390 held by a service engineer. The service engineer is a technician belonging to the management entity 10 or the affiliated company of the management entity 10, and copes with various defects that occur while using the entity 30.

The terminal 390 is a portable computer such as a so-called smartphone or tablet computer, and is connected to the semiconductor manufacturing apparatus 300 via a port 382. The terminal 390 is typically capable of public wireless communication such as LTE or WiMAX.

In this configuration, the control unit 370 and the terminal 390 of the semiconductor manufacturing apparatus 300 cooperate to access the management apparatus 100 of the management body 10 to realize the authentication process of the identification information 22 read from the replaceable member 2. Since other processes and the like are the same as the system configuration shown in FIG. 12, detailed description will not be repeated.

(d3: Third Embodiment of Authentication Function 350)

12 and 13 show a configuration example of access from the use subject 30 to the management subject 10 via a network such as the Internet, but the present invention is not limited to this, and an arbitrary memory medium (for example, an optical memory medium) may be used. , Magnetic memory media, semiconductor memory media, etc.), copying part or all of the status information 102 stored in the management device 100 to the user body 30, thereby realizing the authentication function 350.

In this case, an arbitrary memory medium functions as a memory means for copying at least a part of the state information managed by the management device 100. The control unit 370 of the semiconductor manufacturing apparatus 300 determines the status information of the identification information 22 read from the replaceable member 2 with reference to the copied status information stored in the storage medium. In this way, the authentication function 350 obtains the status information of the read identification information 22 stored in the corresponding management device 100 by referring to a copied memory medium that stores at least a portion of the status information 102 managed by the management device 100. Status information.

(d4: Display output of authentication result)

It is preferable to notify the operator or the like of the user 30 of the authentication result of the authentication process as described above. As an output of such an authentication result, for example, a visual notification as shown below may be used.

FIG. 14 is a schematic diagram showing an example of a user interface screen related to the authentication function 350 of the management system 1 according to the present embodiment. The user interface screen shown in FIG. 14 is typically presented in a display operation section 378 (see FIGS. 11 and 12) of the semiconductor manufacturing apparatus 300.

FIG. 14 (A) shows a user interface 501 displayed after the replaceable member 2 is mounted on the semiconductor manufacturing apparatus 300 and the authentication process is started. The operator confirms the content of the user interface screen 501, and judges whether or not the installed replaceable component 2 is properly usable.

FIG. 14 (B) shows a user interface screen 502 displayed when the authentication process based on the identification information 22 read from the installed replaceable member 2 is successful. The user interface screen 502 may also display identification information 511 indicating the supply main body 20 of the replaceable member 2 that has been produced. In the case of managing the number of times of use of the replaceable member 2, it is also possible to create life information 512 that displays the remaining number of times that the replaceable member 2 can be used.

FIG. 14 (C) shows a user interface screen 503 displayed when the authentication process based on the identification information 22 read from the installed replaceable member 2 fails. On the user interface screen 503, an error code 513 that is helpful for the cause of the failure of the authentication process may also be displayed. In addition, the telephone number 514 of the support center, etc., which is the object of the countermeasures against the failure of the authentication process may also be displayed together.

The operator using the main body 30 transmits the error code 513 displayed on the user interface screen 503 to the support center, which can promptly investigate the cause and minimize manufacturing losses.

The user interface screen shown in FIG. 14 is an example, and it can be made to further prompt various information to the operator. In addition, it is also possible to assemble a function of automatically notifying the support center of the failure of the replaceable member 2 when a failure in the authentication process occurs.

(d5: Treatment if authentication fails)

As described above, when the authentication process based on the identification information 22 read from the replaceable member 2 fails, the user is presented with a user interface screen as shown in FIG. 14 (C). In addition, it is also possible to stop the operation of the semiconductor manufacturing apparatus 300 or to automatically transmit information about the replaceable member 2 that failed the authentication process to the management body 10.

That is, when the authentication function 350 incorporated in the management system 1 according to this embodiment is determined not to allow the use of the replaceable member 2 in the semiconductor manufacturing apparatus 300, one or more of the following processes may be executed.

(1) The operation of the semiconductor manufacturing apparatus 300 is stopped.

(2) Display of a warning message in the semiconductor manufacturing apparatus 300.

(3) Information is transmitted to the management device 100 about the replaceable member 2 which is decided not to allow use.

<E. Management system assembly form>

The management system 1 according to this embodiment is composed of a management subject 10, a one- or multiple-digit supply subject 20, and a one- or multiple-digit use subject 30. Since the supply main body 20 or the use main body 30 may be distributed in a plurality of places, the management device 100 disposed in the management main body 10 may not necessarily be single.

For example, it is also possible to make a configuration in which the main management device is located in a country where the management entity 10 is located, and one or a plurality of sub management devices are arranged to track the main management device. In this case, so-called mirroring or copying techniques can be used.

Furthermore, expediently, it is explained that the management device 100 is a single device, but it is not limited to this, and it can also be implemented as a management system 100 by using a part of a system such as a cloud computer that connects multiple computers via a network. Its function.

In this way, according to the management system 1 of the present embodiment, even any computing environment can be realized, and a well-known technology at the time of actual assembly can be used arbitrarily, or according to the law of the country or region where the actual assembly is performed Jin et al. Adopt arbitrary embodiments. The technical scope of the present invention is not limited to a specific embodiment, but may include any embodiment.

<F. Advantages>

Regarding the replaceable components of the forming molds or conveyance kits used in semiconductor manufacturing equipment, there are some so-called regular products provided by manufacturers or related companies that do not manufacture and sell semiconductor manufacturing equipment. The behavior of changing informal products. On the other hand, if a third party who has the technology to the extent that an informal product can be used utilizes the design information of the regular product, there is a possibility that a replaceable member of a quality that is comparable to the regular product can be produced. As for the customers of the semiconductor manufacturing apparatus, it is better not only from the manufacturer of the semiconductor manufacturing apparatus or its affiliated company, but also from a third party that quality-replaceable components can be obtained.

According to this embodiment, if a third party who provides an irregular product that has been considered to be poor in the past is used, it can provide new value to customers of semiconductor manufacturing equipment. In addition, even a replaceable component provided by a third party other than the manufacturer of the semiconductor manufacturing apparatus or its affiliated company can provide a structure to ensure its quality.

The embodiments of the present invention have been described, but the embodiments disclosed this time should be considered as examples and not restrictive. The scope of the present invention is based on the scope of the patent application, and intends to include all changes within the meaning and scope equivalent to the scope of the patent application.

Claims (12)

    A management system is a management system including a semiconductor manufacturing device, which includes: a management device that issues one or more types of identification information, and manages status information indicating the status of each issued identification information; additional means for providing information on The semiconductor manufacturing device uses identification information issued based on the replaceable component produced based on design information provided by the first main body that manages the management device; and the authentication means reads the identification attached to the replaceable component. Information, and based on the status of the read identification information obtained by referring to the status information from the management device, whether to allow the use of the replaceable component in the semiconductor manufacturing device is determined.         For example, if the management system of the first scope of the patent application is applied, it is determined whether the identification information can be issued to the second entity or whether Status of the identification information issued by the second entity.         For example, if the management system of the scope of patent application is applied for, the certification means decides that it is not allowed to stop the operation of the semiconductor manufacturing device when the semiconductor manufacturing device uses the replaceable component, At least one of displaying and transmitting to the management device information about the replaceable component which is decided not to allow use.         For example, the management system according to any one of claims 1 to 3, wherein the authentication means obtains the status information of the read identification information by exchanging data with the management device via a network.         For example, the management system according to any one of claims 1 to 3, wherein the authentication means is obtained by referring to a copying memory means stored in at least a part of the state information managed by the management device. The identification information corresponding to the status information stored by the management device.         If the management system of any one of claims 1 to 3 is applied for, the additional means is to install the component representing the issued identification information on the surface by electroforming to the replaceable component; the certification The means includes means for optically reading a pattern formed on the replaceable member, and identifying information from the pattern read optically.         For example, the management system of any one of claims 1 to 3, wherein the authentication means includes: a light receiving section for receiving light from a pattern formed on the interchangeable member; and an optical member corresponding to the The use position of the replaceable member in the semiconductor manufacturing apparatus bends the optical path from the pattern of the replaceable member to the light receiving portion.         If the management system of any one of claims 1 to 3 of the patent application scope further includes a collection and transmission means, the collection and transmission means collects information about the use history of the semiconductor manufacturing device using the replaceable component and reports to the management Device transmission; The management device updates the status of the corresponding identification information assigned to the replaceable component used in the semiconductor manufacturing device based on the information about the use history of the semiconductor manufacturing device.         For example, the management system according to any one of claims 1 to 3, wherein the replaceable component includes at least one of a forming mold and a transport kit prepared in accordance with a model manufactured by the semiconductor manufacturing apparatus.         A management method is a management method for managing replaceable components used in a semiconductor manufacturing apparatus, and includes: a issuing step for issuing one or more types of identification information; and a management step for managing a status indicating the status of each of the issued identification information. Status information; an additional step of adding issued identification information to a replaceable component made based on design information provided by the entity that manages the status information for use in the semiconductor manufacturing device; and a determining step of reading the Identification information is added to the replaceable component, and based on the status of the read identification information obtained by referring to the status information, it is determined whether the replaceable component is allowed to be used in the semiconductor manufacturing apparatus.         A management system is a management system including a semiconductor manufacturing device, including a management device. The management device is configured in a management body, issues one or more types of identification information to a replaceable component for use in the semiconductor manufacturing device, and manages Status information indicating the status of each issued identification information, the identification information is issued in accordance with the relationship between the supply entity making the replaceable component and the management entity; including authentication means, the authentication means is added with the identification When the replaceable component of the information is installed in the semiconductor manufacturing device, the identification information of the installed replaceable component is read, and the status of the read identification information obtained by referring to the status information from the management device is obtained , Decide whether to allow the use of the interchangeable member in the semiconductor manufacturing apparatus.         A management method is a management method for managing replaceable components used in a semiconductor manufacturing apparatus, and includes a issuing step. The issuing step is a management entity that issues one or more types of replaceable components for use in the semiconductor manufacturing apparatus. Identification information, which is issued in response to the relationship between the supply entity that made the replaceable component and the management entity; and includes: a management step that manages status information indicating the status of the issued identification information; read The taking step is to read the identification information of the installed replaceable component when the replaceable component to which the identification information is attached is installed in the semiconductor manufacturing device; and the determining step is based on the obtained by referring to the status information. The status of the read identification information determines whether the replaceable component is allowed to be used in the semiconductor manufacturing apparatus.