KR20180022564A - Management system and management method - Google Patents

Abstract

The present invention provides a new configuration for realizing a new method capable of providing a new value to a customer of a semiconductor manufacturing apparatus by utilizing a third party who provides a non-standard product which is thought to be undesirable. A management system includes a management device which issues one or a plurality of identification information and manages state information showing the state of each identification information which is issued, an adding means for adding the issued identification information to a replacement member manufactured according to design information provided from a first subject to manage the management device for being used in the semiconductor manufacturing apparatus, and an authentication means for reading the identification information added to the replacement member and determining whether to allow the usage of the replacement member in the semiconductor manufacturing apparatus based on the read state of the identification information which is acquired by referring to the state information from the management device.

Description

{MANAGEMENT SYSTEM AND MANAGEMENT METHOD}

The present invention relates to a management system including a semiconductor manufacturing apparatus and a management method for managing a replaceable member used in the semiconductor manufacturing apparatus.

Generally, in a semiconductor manufacturing apparatus, various kinds of reflux members (for example, a mold (molding die) and a carrier kit) are selectively mounted according to the type and manufacturing conditions. Such a ring member is also a consumable item, and it is necessary to appropriately manage the use history and the like.

As a technique related to such a method of managing a ring member, for example, Japanese Patent Application Laid-Open No. 2003-001340 discloses a method for managing mold member information of a user, And accesses the salesperson using the ID of the purchased mold to transmit the mold information of the mold stored in the salesperson to the user side for registration. By adopting such a configuration, it becomes unnecessary to input troublesome mold information which is needed every time the user purchases a mold, and as a result, it is possible to reduce an input operation mistake that occurs when complicated data input is performed, It is possible to unify about the mold information exchanged between the respective apparatuses included in the mold management system and to verify whether or not the mold supplied by the salesperson and the mold reached in the user's hand completely match .

As described above, along with the advancement of information communication technologies, networking has also been advanced in a manufacturing site where semiconductor manufacturing apparatuses and the like are disposed.

Regarding a mold for use in a semiconductor manufacturing apparatus or a transfer kit called a transfer kit, it is not a so-called regular product provided by a maker of a semiconductor manufacturing apparatus or its affiliated company, but a third party who manufactures and sells a non- May be carried out. Such irregular products can not reflect the design information and the like used in manufacturing the regular product and therefore can not maintain the same quality as the regular product and thus cause generation of defective products or cause any incompatibility with the semiconductor manufacturing apparatus itself There is work.

Japanese Patent Application Laid-Open No. 2003-001340

It is an object of the present invention to provide a configuration capable of constantly maintaining the quality of a reflex member provided by a maker of a semiconductor manufacturing apparatus or a refill member provided by a third party other than the affiliated company using network technology .

According to some aspects of the present invention, a management system including a semiconductor manufacturing apparatus is provided. The management system includes a management device that issues one or a plurality of pieces of identification information and manages status information indicating the status of each piece of issued identification information, a first management device for managing the management device, An adding means for adding the issued identification information to the replacement member manufactured according to the design information provided from the subject and the identification information added to the replacement member, And an authentication means for determining whether or not to permit the use of the refill member in the semiconductor manufacturing apparatus based on the state of the read identification information acquired by referring to the information.

Preferably, in accordance with the relationship between the first subject and the second subject that adds identification information to the replacement member, whether or not the identification information for the second subject is allowed to be issued or not, The state of the issued identification information is determined.

Preferably, when the authentication means determines that the use of the pivoting member in the semiconductor manufacturing apparatus is not permitted, the authentication means stops the operation of the semiconductor manufacturing apparatus, the display of the warning message in the semiconductor manufacturing apparatus, And transmission of information on the member to the management apparatus.

Preferably, the authentication means acquires status information of the read identification information by exchanging data with the management apparatus via the network.

Preferably, the authentication means acquires status information stored in the management apparatus corresponding to the read identification information by referring to the storage means for storing at least a part of the copy (copy) of the status information managed by the management apparatus.

Preferably, the attaching means may be configured such that a member having a pattern representing the issued identification information formed on its surface by electroforming is attached to the reflex member, and the authenticating means optically reads the pattern formed on the reflex member And means for identifying the identification information from the optically read pattern.

Preferably, the authenticating means includes a light receiving portion that receives light from a pattern formed on the pivot member, and a light receiving portion that bends the optical path from the pattern of the pivot member to the light receiving portion in response to the use position of the pivot member in the semiconductor manufacturing apparatus And an optical member.

Preferably, the management system further includes a collection and transmission means for collecting information on the use history of the semiconductor manufacturing apparatus in which the pivot member is used and transmitting the collected information to the management apparatus, And updates the state of the identification information corresponding to the reflex member used in the semiconductor manufacturing apparatus.

Preferably, the reflex member includes at least one of a molding frame and a carrier kit, which is prepared in response to the kind of product produced by the semiconductor manufacturing apparatus.

According to another aspect of the present invention, there is provided a management method for managing a reflex member used in a semiconductor manufacturing apparatus. The management method includes: a step of issuing one or a plurality of identification information; a step of managing state information indicating the state of each issued identification information; a step of managing the state information A step of adding the issued identification information to the reflex member manufactured in accordance with the information; and a step of reading the identification information added to the reflex member and reading the identification information added to the state of the read identification information And determining whether or not the use of the pivot member in the semiconductor manufacturing apparatus is permitted.

According to another aspect of the present invention, there is provided a management system including a semiconductor manufacturing apparatus. The management system is a management apparatus that is disposed in a management subject and issues one or a plurality of identification information to the pivot member for use in the semiconductor manufacturing apparatus and manages status information indicating the status of each issued identification information . The identification information is issued in accordance with the relationship between the supplier and the management subject making the refill member. The management system reads the identification information of the mounted reflex member when the refill member to which the identification information is attached is attached to the semiconductor manufacturing apparatus, and reads the identification information of the mounted refill member by referring to the status information from the management apparatus And an authentication means for determining whether the use of the pivot member in the semiconductor manufacturing apparatus is permitted or not based on the state of the pivot member.

According to still another aspect of the present invention, there is provided a management method for managing a reflex member used in a semiconductor manufacturing apparatus. The management method includes a step of issuing one or a plurality of pieces of identification information to the cymbal member for use in the semiconductor manufacturing apparatus in the management subject. The identification information is issued in accordance with the relationship between the supplier and the management subject making the refill member. The management method includes the steps of: managing status information indicating the status of each issued identification information; reading identification information of the mounted replacement member when the identification information is attached to the semiconductor manufacturing apparatus; And a step of determining whether or not the use of the recursive member in the semiconductor manufacturing apparatus is permitted based on the state of the read identification information acquired by referring to the state information.

These and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

According to the present invention, a new value can be provided to a customer of a semiconductor manufacturing apparatus by utilizing a third party who provides a non-standard product which is conventionally thought to be undesirable. Further, a structure for assuring the quality can be provided even for a member of a semiconductor manufacturing apparatus or a ring member provided by a third party other than the affiliated company.

1 is a schematic diagram for explaining an overview of a management system according to the present embodiment;
2 is a sequence diagram showing a processing procedure executed in the management system according to the present embodiment.
3 is a schematic diagram showing an example of the configuration of a management apparatus constituting a management system according to the present embodiment;
FIG. 4 is a schematic diagram showing an example of a data structure stored in the state information shown in FIG. 1; FIG.
FIG. 5 is a schematic diagram showing an example of a data structure stored in the vendor management information shown in FIG. 1; FIG.
6 is a schematic diagram showing a device section (XZ plane) of a resin sealing apparatus for an electronic part, which is an example of a semiconductor manufacturing apparatus.
Fig. 7 is a perspective view showing a configuration of a molding frame (a fixed frame and a movable frame) used in the resin sealing apparatus shown in Fig. 6; Fig.
8 is a schematic diagram showing another apparatus section (YZ plane) of a resin sealing apparatus of an electronic part which is an example of a semiconductor manufacturing apparatus.
9 is a schematic diagram showing a device cross section (YZ plane) of a resin sealing device of an electronic part, which is an example of a semiconductor manufacturing device.
10 is a schematic diagram for explaining an example of a method of producing a marking expression indicating identification information used in the management system according to the present embodiment.
11 is a schematic diagram showing an example of a sequence of adding identification information between a management subject and a supplier in the management system according to the present embodiment;
12 is a schematic diagram showing a configuration example for realizing the authentication function in the management system according to the present embodiment.
13 is a schematic diagram showing another configuration example for realizing the authentication function in the management system according to the present embodiment.
FIG. 14 is a schematic diagram showing an example of a user interface screen relating to an authentication function in the management system according to the present embodiment; FIG.

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail with reference to the drawings. The same or equivalent portions in the drawings are denoted by the same reference numerals, and description thereof will not be repeated.

<A. Overview of management system configuration and processing>

First, the configuration of the management system 1 according to the present embodiment and the outline of the processing in the management system 1 will be described. In the following description, mainly the manufacturing and distribution of the refill member used in the semiconductor manufacturing apparatus will be described, but the management system 1 according to the present embodiment is not limited to these ranges.

1 is a schematic diagram for explaining an outline of a management system 1 according to the present embodiment. 1, the management system 1 mainly includes a semiconductor manufacturing apparatus maker 10 (hereinafter also referred to as a &quot; management entity &quot;) that manufactures a semiconductor manufacturing apparatus 300, a semiconductor manufacturing apparatus 300, 20A, 20B, 20C, ...) for manufacturing and supplying the refill member 2 to be used in the semiconductor manufacturing apparatus 300 and one or a plurality of vendors (hereinafter also referred to as " A plurality of users (hereinafter also referred to as "users") 30A, 30B, 30C, ... are involved.

In the present specification, the term &quot; user &quot; or &quot; use subject &quot; refers to a subject that uses the semiconductor manufacturing apparatus 300 in an arbitrary form, for example, a semiconductor maker, a semiconductor device maker, (Companies that undertake semiconductor package and testing business), and foundry companies (companies that specialize in the manufacture of semiconductor chips).

In this specification, the &quot; exchangeable member &quot; includes any member detachably mountable to the semiconductor manufacturing apparatus 300, and typically means a member that is exchanged in response to a product to be manufactured. The refill member includes, for example, a molding die (metal mold) for molding the product into a predetermined shape, a conveyance kit used as a semifinished product in the semiconductor manufacturing apparatus 300, or a conveying carrier for the product. That is, the reflex member may include at least one of a molding frame and a carrier kit that is prepared in response to the type of product manufactured by the semiconductor manufacturing apparatus 300.

In this specification, the term &quot; vendor &quot; or &quot; supplier &quot; includes any entity that manufactures and / or sells any member used in the semiconductor manufacturing apparatus 300, (10) ". The "vendor" or "supplier" may be referred to as a "third party".

In the following description, the supply subjects 20A, 20B, 20C, ... may be collectively referred to as the "supply subject 20", and the use subjects 30A, 30B, 30C, There is work.

The pivot member 2 used in the semiconductor manufacturing apparatus 300 disposed in the use subject 30 in the management system 1 according to the present embodiment is configured such that the management subject 10 (or the management subject 10) (For example, an affiliate company of the management entity 10)) that is considered to be substantially the same as the business entity 20, and may be produced and sold by the supplier 20. That is, the use subject 30 may be able to purchase the exchangeable material 2 from either the management subject 10 or the supply subject 20.

However, regarding the management subject 10 that manufactures the semiconductor manufacturing apparatus 300 or the replacement material 2 (that is, the regular article) provided by the subject that is considered to be substantially the same as the management subject 10, Quality is surely guaranteed, but quality can not always be assured with respect to the refill member 2 provided by the supplier 20. Therefore, in the management system 1 according to the present embodiment, since the management subject 10 participates in the production of the refill member 2 in the supply subject 20, a new value is provided to the use subject 30 do.

The management subject 10 has the management apparatus 100 for executing the main processing of the management method according to the present embodiment. The management apparatus 100 has a database for holding status information 102 and a database for holding vendor management information 104. [ Details of the status information 102 and the vendor management information 104 will be described later.

2 is a sequence diagram showing a processing procedure executed in the management system 1 according to the present embodiment. Referring to Figs. 1 and 2, first, the semiconductor manufacturing apparatus 300 is delivered from the management subject 10 to the use subject 30 (step S2). At this time, a refill member 2 used in the semiconductor manufacturing apparatus 300 may be delivered from the management subject 10 to the use subject 30 (step S4).

Thereafter, as the semiconductor manufacturing apparatus 300 is used in the use subject 30, a new pivot member 2 is required. Therefore, the new pivot member 2 is not replaced with any new one It is assumed that the pivot member 2 has been ordered (step S6).

It is assumed that a predetermined contract is typically established between the management subject 10 and the supplier 20 and a predetermined relationship is established between the parties. Such a predetermined contract includes, for example, a matter related to the use of the design information of the refill member 2 provided from the managing subject 10 by the supplying subject 20, 30, the matters relating to selling the reflex member 2, matters concerning the handling of information held by the management subject 10 and the supplying subject 20, and the like. Steps S8 to S20 described below are executed in accordance with the relationship between the management subject 10 and the supplier 20.

Specifically, the supplier 20, which has received the order for the replacement member 2 from one of the users 30, provides the management subject 10 with the sales information 26 indicating the contents of the order S8). The sales information 26 includes information on the user 30 who ordered the pivot member 2 and information on the user 30 that has ordered the pedometer 2 in addition to information such as the type and number of the prizewinner 2 that received the order , Information on the semiconductor manufacturing apparatus 300 in which the subject refractory member is used, and the like.

The management subject 10 provides the supply subject 20 with the design information 24 of the subject's pivot member 2 based on the sales information 26 from the supply subject 20 (step S10). The design information 24 includes a design drawing and various parameters for manufacturing the pivot member 2 ordered by the supplier 20. The supplier 20 manufactures the refill member 2 in accordance with the design information 24 from the management subject 10 (step S12). In step S12, the pivot member 2 is manufactured using an arbitrary manufacturing apparatus 200. [ As the manufacturing apparatus 200, any one or a plurality of processing apparatuses may be used.

The management subject 10 can obtain sales information 26 from the supplier 20 at arbitrary timing after the production of the refill member 2 during the manufacture of the refill member 2 before the refill member 2 is manufactured, (Step S14), the status information 102 is updated with respect to the supplying subject 20, and the identification information 22 is updated after the updating of the status information 102 with respect to the subject 2 (step S14) (Step S16).

Here, in accordance with the relationship between the management subject 10 and the supply subject 20, the issuance of the identification information 22 to the supply subject 20 or the issuance of the identification information 22 (issued to the supply subject 20) Is determined. The management subject 10 refers to the vendor management information 104 and determines the content of the identification information 22 to be issued and the like. The vendor management information 104 includes contents corresponding to the relationship formed between the management main body 10 and each of the supply main bodies 20. [

The identification information 22 is information for specifying the corresponding pivot member 2, and basically, a number uniquely determined is used. Typically, the identification information 22 is a serial number or an authentication key, which is composed of a predetermined number of letters or numbers. However, for example, when the same user 30 purchases a plurality of the same type of the pivot member 2, the common identification information 22 is assigned to the pivot member 2 of the type purchased at one time .

The supplier 20 adds the identification information 22 issued by the management subject 10 to the manufactured pivot member 2 (step S18). The identification information 22 may be added to the pivot member 2 by using the manufacturing apparatus 200 for manufacturing the pivot member 2 or by using the additional mechanism 210 which is separate from the manufacturing apparatus 200 good. Any one or a plurality of apparatuses may be used depending on the kind of the identification information 22 to be issued. In the following description, for the sake of convenience of explanation, it is assumed that a manufacturing apparatus 200 that provides a function of manufacturing the pivoting member 2, and an attachment mechanism (not shown) for providing the function of adding the identification information 22 to the pivoting member 2 210 will be described separately. However, a single device capable of providing these two functions together may be used.

The manufactured pivot member 2 becomes attachable to the use subject 30 by adding the identification information 22 thereto. That is, the identification information 22 is added to the refill member 2 manufactured by the supplier 20, and then the refill member 2 is delivered to the user 30 (step S20).

The state information 102 updated in the step S14 is information for managing each of the identification information 22 issued by the management subject 10 and is at least the information of the identification information 22 to which the identification information 22 is added, Is available or not. That is, the state information 102 indicates whether or not the semiconductor manufacturing apparatus 300 of the target user can effectively use the pendulous member 2 to which the identification information 22 is added. The condition information 102 includes information indicating whether or not the reflex member 2 to which the identification information 22 is added can be effectively used, Information such as the remaining number of times each of the pivotal members 2 can be used, the remaining time when each pivotal member 2 can be used, the type of semiconductor manufacturing apparatus 300 that can use each pivotal member 2, and the like . An example of a more detailed data structure of the state information 102 will be described in detail.

By the steps S8 to S20 described above, the quality of the pivot member 2 manufactured and provided by the supply main body 20 is guaranteed. The pivot member 2 delivered to the use subject 30 is used according to the following process.

First, the use subject 30 mounts the loaded pivot member 2 to the target semiconductor manufacturing apparatus 300 (step S22). The identification information 22 added to the pivot member 2 is read out before being mounted on the semiconductor manufacturing apparatus 300 or mounted on the semiconductor manufacturing apparatus 300 (step S24). Regarding the method of reading the identification information 22, an arbitrary method can be employed in accordance with the type, shape, and additional position of the identification information 22. Examples of some reading methods of the identification information 22 will be described later.

Next, authentication processing is performed based on the read identification information 22. Typically, the read identification information 22 is transmitted to the management subject 10 (step S26). Then, the management subject 10 responds to the status information 102 corresponding to the transmitted identification information 22 (step S28). Based on the state information 102 responded from the management subject 10, it is determined whether or not the object of use in the subject semiconductor manufacturing apparatus 300 is the use of the pivot member 2 (step S30). It is possible to use the reflux member 2 in the target semiconductor manufacturing apparatus 300 only when it is determined that the use of the reflux member 2 of the object is possible.

As the pivoting member 2 is used in the semiconductor manufacturing apparatus 300, information on its use is collected. The user 30 has a collecting and transmitting function of collecting information on the use history of the semiconductor manufacturing apparatus 300 in which the pivoting member 2 is used and transmitting the collected information to the managing apparatus 100. [ Specifically, the use history of the reflex member 2 in the semiconductor manufacturing apparatus 300 is collected (step S32), and the collected usage history is transmitted to the management subject 10 (step S34). At this time, the identification information 22 for specifying the subject's pivot member 2 may be transmitted to the management subject 10 together with the use history.

When the management subject 10 receives the usage history from the usage subject 30, the management subject 10 updates the status information 102 about the subject's pivot member 2 based on the received usage history (step S36). That is, the management apparatus 100 determines the state of the identification information 22 associated with the pivot member 2 used in the semiconductor manufacturing apparatus 300, based on the information on the use history of the semiconductor manufacturing apparatus 300 .

The management subject 10 then transmits the status information 102 indicating the content of the updated status information 102 to the usage subject 30 (step S38). The use subject 30 of the subject semiconductor manufacturing apparatus 300 determines whether or not the subject is capable of using the pivoting member 2 based on the status information 102 responded from the management subject 10 ). In step S40, based on the state information 102 from the management subject 10, the usability of the subject's pivot member 2 is judged at an appropriate timing.

Hereinafter, as long as the same reflux member 2 is used, the processes of steps S32 to S40 are repeated.

The maintenance subject 10 can appropriately perform maintenance in accordance with the deterioration accompanying the use of the pivot member 2 supplied to the use subject 30 by the above-described steps S22 to S40.

The processes of steps S24 to S40 are typically provided by an authentication function 350 (see Fig. 1) implemented in the semiconductor manufacturing apparatus 300. [ As for the mounting form of the authentication function 350, any method can be adopted. For example, the semiconductor manufacturing apparatus 300 may be mounted as a part of the functions of the semiconductor manufacturing apparatus 300, or may be implemented as a part of the functions of the managing apparatus for managing the semiconductor manufacturing apparatus 300 or the like. Some practical funerals of the authentication function 350 will be described later.

<B. Configuration of Management Device 100>

Next, the configuration of the management apparatus 100 arranged in the management subject 10 will be described. The management apparatus 100 mainly issues one or a plurality of identification information 22 and manages the status information 102 indicating the status of each issued identification information 22. [

(b1: device configuration of the management subject 10)

3 is a schematic diagram showing an example of the configuration of the management apparatus 100 constituting the management system 1 according to the present embodiment. 3, the management apparatus 100 includes a processor 112, a main memory 114, an input unit 116, a display unit 118, an output unit 120, A state information database 122, a management information database 124, a secondary storage unit 126, and a communication unit 132. [ These components are connected to the internal bus 134.

The processor 112 is a computation subject that executes processing required for a function provided by the management apparatus 100 and realizes necessary functions by executing a program or a program module stored in the secondary storage unit 126. [ The processor 112 may be a multicore and / or multiprocessor, and the required number of cores or processors is set in response to the required load processing capability.

The main memory 114 provides the working memory required by the processor 112 to execute the program. The main memory 114 primarily maintains a code or working data of a program to be executed.

The input unit 116 is a component that accepts an operation from an operator or the like, and is implemented using, for example, a keyboard, a mouse, a touch panel, or the like. The display unit 118 is a component that presents information such as a processing result to an operator or the like, and is implemented using, for example, a display.

The output unit 120 is a component that types and outputs information in the management apparatus 100, and is implemented using, for example, a printer or the like. For example, in the case of adopting the form of printing a character string or the like representing the identification information 22 issued by the management apparatus 100, the output unit 120 may be a part of the means for issuing the identification information 22 .

The state information database 122 is a database that holds state information 102 (see FIG. 4), and the management information database 124 is a database that holds vendor management information 104 (see FIG. 5). Details of the status information 102 and the vendor management information 104 will be described later.

Although the state information database 122 and the management information database 124 are provided as components different from the secondary storage 126 for convenience of explanation, the state information database 122 or the management information database 124 may be stored in the secondary storage Or may be realized by using a part of the device 126. [ Alternatively, the status information database 122 or the management information database 124 may be realized on a server apparatus separate from the management apparatus 100. [

The secondary storage device 126 includes an issuance program module 128 and an authentication program module 130 for providing necessary functions in the management system 1 according to the present embodiment in addition to an operating system . These program modules are read on demand and executed by the processor 112. [

The issuance program module 128 mainly provides a function of issuing one or a plurality of pieces of identification information 22 to the pivot member 2 for use in the semiconductor manufacturing apparatus 300. [ More specifically, the issuance program module 128 issues one of the identification information 22 in response to a request from the supplying subject 20, and issues an entry To the state information 102. [0031]

The authentication program module 130 mainly provides a function of managing status information 102 indicating the status of each issued identification information 22. More specifically, in response to a request from the use subject 30, the authentication program module 130 responds to the necessity among the entries included in the status information 102, The state information corresponding to each piece of identification information 22 is updated on the basis of the history of use of the pivot member 2 and the like.

The communication unit 132 is a component for communicating with the providing subject 20 and / or the using subject 30 and is implemented using, for example, a wired LAN communication interface, a wireless LAN communication interface, a public network communication interface . A plurality of types or a plurality of communication units 132 may be mounted depending on the number and the communication form of the supply subject 20 and the use subject 30 to be communicated.

Hereinafter, the data structure of the state information 102 and the vendor management information 104 held by the management apparatus 100 is shown.

(b2: status information 102)

Fig. 4 is a schematic diagram showing an example of a data structure stored in the state information 102 shown in Fig. 4, the status information 102 includes a vender code column (column) 1022, a user code column 1023, and a vender code column 1023, which correspond to the identification information stored in each of the identification information columns 1021, A used device code field 1024, a status field 1025, a first authentication date and time field 1026, a final authentication date field 1027, and a used lot total number field 1028.

In the identification information field 1021, basically, numbers uniquely determined are assigned. In the vendor code field 1022, a code for specifying the supply subject 20 that produced the refill member 2 to which the corresponding identification information 22 is added is stored.

In the user code field 1023, codes for specifying the user 30 using the reflex member 2 to which the corresponding identification information 22 is added are stored. A code for specifying the semiconductor manufacturing apparatus 300 (destination) where the refill member 2 to which the corresponding identification information 22 is added is stored in the use destination apparatus code field 1024 . When there are a plurality of semiconductor manufacturing apparatuses 300 in use, a plurality of these codes may be stored.

In the status column 1025, status values indicating the use of the reflexive member 2 to which the corresponding identification information 22 is added are stored. "Valid" indicating that the pivoting member 2 can be used, "Expired" indicating that the pivoting member 2 is already in an unusable state, and "Expired" indicating that the pivoting member 2 is in an unusable state, Quot; Not Active &quot; indicating that the user has not yet been authenticated is used.

The first authentication date and time field 1026 stores the first date and time when the use and judgment is judged with respect to the corresponding identification information 22 and the last authentication date and time field 1027 indicates the use identification information 22 with respect to the corresponding identification information 22. [ Is stored. The used lot number column 1028 stores the number of times the recursive member 2 to which the corresponding identification information 22 is added is used in the semiconductor manufacturing apparatus 300.

A part of the information stored in the state information 102 may be produced based on the sales information 26 (see Figs. 1 and 2) provided from the supplier 20. The information stored in the status information 102 is updated from time to time on the basis of the use history or the like transmitted from the use subject 30 to the management subject 10.

The identification information 22 itself is issued as shown in two of the barriers (lower column) of the status information 102 shown in Fig. 4, The information indicating the contents of the issued identification information 22 is stored in the identification information field 1021 and the vendor code field 1022 respectively. However, in the status field 1025, The information may not be stored in the other fields. Further, the acquired information may be stored as long as it can acquire the information of the user code field 1023 and the use device code field 1024 from the sales information 26.

(b3: vendor management information 104)

5 is a schematic diagram showing an example of a data structure stored in the vendor management information 104 shown in FIG. 5, the vendor management information 104 includes a contract classification column 1042, a contract status column 1043, and a contract term column 1043, which correspond to the vendor code stored in each of the vendor code column 1041 1044), and an identification information issuing total number field 1045.

In the vendor code field 1041, a code for specifying the supply subject 20 capable of issuing the identification information 22 is stored. It is preferable that the code stored in the vendor code field 1041 is common to the code stored in the vendor code field 1022 of the state information 102 shown in Fig.

A code for specifying the category of the relationship between the supplier 10 and the supplier 20 indicated by the corresponding vendor code is stored in the contract classification column (kind column) 1042. The contract status column 1043 stores a status value indicating the status of the relationship between the supply subject 20 and the management subject 10 indicated by the corresponding vendor code. As an example of the status value, &quot; Valid &quot; indicating that the contract between the management subject 10 and the supplying subject 20 is valid and that the identification information 22 can be issued, and the identification information 22 are issued &Quot; Invalid &quot; or the like is used to indicate that it can not be used.

The contract expiration date field 1044 stores an expiration date of the contract between the management subject 10 and the supplier 20 indicated by the corresponding vendor code. The identification information issuing total number field 1045 stores the number of identification information 22 issued so far for the supplying subject 20 indicated by the corresponding vendor code.

The contents of the vendor management information 104 are used to change the relationship between the management subject 10 and the supply subject 20 (typically, a contract between the parties) is changed (for example, Change of contents, termination of contract, etc.). It is also updated when the identification information 22 is issued to any one of the suppliers 20.

(b4: design information 24)

The design information 24 provided by the management subject 10 to one or a plurality of the suppliers 20 may be an electronic format or a paper medium. Alternatively, a microfilm or the like may be used. When the design information 24 is provided in an electronic format, the design information 24 may be electronically generated by using a part of the management apparatus 100 or by using a server apparatus different from the management apparatus 100 It is desirable to provide a configuration for providing the data.

In addition, even when the design information 24 is provided as a paper medium or a microfilm, it is preferable to arrange a management server or the like for searching or managing the provided design information 24. [

<C. Addition and Reading of Identification Information 22>

Next, in the management system 1 according to the present embodiment, the identification information 22 issued by the management subject 10 is added to the pivot member 2 manufactured by the supplier 20 The processing will be described. The supplier 20 is configured to supply the issued identification information 22 to the refill member 2 manufactured in accordance with the design information 24 provided from the management subject 10 for use in the semiconductor manufacturing apparatus 300 . A more specific processing procedure regarding the addition process of the identification information 22 will be described.

(c1: addition of identification information 22)

In this specification, the addition of the identification information 22 to the pivot member 2 means that the identification information 22 is embroidered on the pivot member 2 in a form that can be reproduced later. The information itself of the identification information 22 may be maintained through an arbitrary medium such as a visible pattern, a radio signal, or an optical signal.

For example, the visible pattern may be a character string that represents the content of the identification information 22 or a character or mark (for example, a barcode or a two-dimensional code Etc.), an image, and the like. A shape showing such a pattern may be formed on the surface of the pivot member 2 or a film, a label, a tape or the like having a pattern printed thereon may be attached to the pivot member 2.

In the case of using a radio signal, a radio frequency (RF) tag is embedded in the pivot member 2, or a circuit functioning as an RF tag is formed in the pivot member 2, Information 22 may be stored in advance.

When a light signal is used, a hologram including a pattern indicating the contents of the identification information 22 is formed on the surface of the pivot member 2, or a hologram indicating a pattern is attached to the pivot member 2 good.

As described above, in the management system 1 according to the present embodiment, the identification information 22 is added to the pivot member 2 by an arbitrary method. In this specification, the &quot; additional mechanism &quot; or &quot; attaching means &quot; means any attaching device such as a marking device (for example, each popular stamping device, a laser marker, ) To a predetermined position, as shown in Fig. Further, when the operator directly adds the identification information 22 to the pivot member 2, the operator can be included in the &quot; additional mechanism &quot; or &quot; additional means &quot;.

The identification information 22 can be added to the reflex member 2 by an arbitrary method, and when reading the added identification information 22, an appropriate reading method may be employed in response to the additional information.

(c2: method of reading identification information 22: (1)

Next, an example of a method of reading the identification information 22 added to the pivot member 2 will be described.

As an example of the semiconductor manufacturing apparatus 300, a resin sealing apparatus for an electronic part including a semiconductor chip is assumed. In such a resin-sealing apparatus, a semiconductor chip mounted on a substrate (lead frame, printed substrate, etc.) is covered with a sealing resin. More specifically, a sealing resin corresponding to a molded article is completed by molding a sealing resin around a substrate on which a semiconductor chip is mounted using a molding die. In such a resin-sealing apparatus, the forming mold corresponds to the reflux member 2.

Fig. 6 is a schematic diagram showing a device cross section (XZ plane) of the resin sealing apparatus 300A of an electronic part, which is an example of the semiconductor manufacturing apparatus 300. Fig. For convenience of explanation, Fig. 6 exemplifies the resin sealing apparatus 300A comprising a single molding module, but a plurality of resin sealing apparatuses 300A may be arranged along the X-direction and connected to each other.

The resin sealing apparatus 300A includes a fixed base 302 fixed to the apparatus main body and a movable base 303 arranged to be opposed to the fixed base 302 and to be brought into contact with and separated from the fixed base 302 ). The resin sealing apparatus 300A includes a fixed mold 304 mounted on the fixed base 302 so as to be detachable from the fixed base 302 so as to be removable from the fixed base 302, And a movable mold (lower mold) The fixed frame 304 and the movable frame 305 constitute a forming frame 306 in combination. The mold frame 306 (the fixed frame 304 and the movable frame 305) corresponds to the pivot member 2.

The resin sealing apparatus 300A also has a drive mechanism 307 including a reciprocating drive mechanism (mold opening and closing mechanism 307a) and a resin pressurizing mechanism 307b of the movable plate 303. [ The frame opening / closing mechanism 307a closes the fixed frame 304 and the movable frame 305. [

A mark 309 is arranged at a predetermined position on the surface of the mold frame 306. The mark 309 includes an information formation surface 309a representing the corresponding identification information 22. On the information forming surface 309a, a fine pattern representing the identification information 22 is formed by unevenness or the like. The resin-sealing apparatus 300A has an image recognition unit 308. The image-

Fig. 7 is a perspective view showing the configuration of the mold frame 306 (the fixed frame 304 and the movable frame 305) used in the resin sealing apparatus 300A shown in Fig. Referring to Fig. 7, a resin passage 304a on the side of the fixed frame 304 (hereinafter also referred to as &quot; fixed side &quot;) and a fixed side cavity 304b are formed in the fixed frame 304. Fig. On the other hand, the movable frame 305 is provided with a port 305a to which a resin material is supplied, a cavity 305b of the side of the movable frame 305 (hereinafter also referred to as a "movable side"), Side resin passage 305c and an air vent 305v, which are connected to the movable-side resin passage 305c.

The port 305a of the movable frame 305 and the fixed side resin passage 304a communicate with each other while the fixed frame 304 and the movable frame 305 are closed and the resin passage 304a and the resin passage 305c of the movable frame 305 communicate with each other. In addition, the port 305a of the movable frame 305 communicates with the cavity 304b of the fixed frame 304 and the cavity 305b of the movable side via the resin passage 304a and the resin passage 305c. A fluid resin such as a molten resin is filled in the cavities 304b of the fixed mold 304 and the cavities 305b of the movable mold 305 during resin molding. The gas remaining in the cavity 304b and the cavity 305b is discharged to the outside of the mold 306 through the air vent 305v as the fluid resin is filled.

8 is a schematic diagram showing another apparatus section (YZ plane) of the resin sealing apparatus 300A of the electronic component which is an example of the semiconductor manufacturing apparatus 300. As shown in Fig. 8A, a marking 309 (information forming surface 309a) arranged in the forming die 306 corresponds to the position of the forming die 306 in the resin sealing apparatus 300A A reading unit 310 for reading the identification information 22 is provided. The two reading units 310 are arranged in the resin sealing apparatus 300A in correspondence with the positions of the respective markings 309 arranged in the fixed frame 304 and the movable frame 305. [

8 (B) shows an enlarged view of the reading unit 310 shown in Fig. 8 (A). As shown in Fig. 8 (B), the reading unit 310 optically reads the identification information 22 from the mark 309 (information forming surface 309a).

Specifically, the light representing the image on the information forming surface 309a is incident on the image sensor Ld through the light guide passage La, the condenser lens Lb, and the light guiding portion Lc. The image sensor Ld is composed of, for example, a CCD (Charge Coupled Device), a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a line sensor or the like. The image sensor Ld outputs light corresponding to the image on the information formation surface 309a to the image recognition unit 308 as image data. The image recognition unit 308 processes the image data to output the identification information 22 included in the image data.

8 (B) shows an example in which the light-collecting lens Lb, the light-guiding unit Lc and the image sensor Ld are used as an example, but a general-purpose digital camera may be used instead . However, it is preferable that a digital camera having heat resistance is employed. Alternatively, it is preferable to add a cooling function to the digital camera.

(c3: Reading method of identification information 22: 2)

Next, another example of the reading method of the identification information 22 added to the pivot member 2 will be described.

As another example of the semiconductor manufacturing apparatus 300, a compression molding type resin sealing apparatus is assumed. In a compression molding type resin sealing apparatus, a cavity is provided in a lower mold. Since the above-described mold is used in a high temperature environment (for example, about 180 DEG C), a configuration example of the reading unit suitable for use in this high temperature environment will be described.

9 is a schematic diagram showing a device cross section (YZ plane) of the resin sealing device 300B of an electronic part, which is an example of the semiconductor manufacturing apparatus 300. Fig. For convenience of explanation, the resin sealing apparatus 300B made of a single molding module is exemplified, but a plurality of resin sealing apparatuses 300B may be arranged along the X direction and connected to each other.

Referring to Fig. 9, in the resin sealing apparatus 300B, a main transport mechanism 332 movable along the X direction and a sub transport mechanism 335 movable along the Y direction are arranged. A ball nut 331 is attached to the main transport mechanism 332 and the ball nut 331 is engaged with the ball screw 330. An X-direction guide rail 333 extending in the X-direction and a Y-direction guide rail 334 extending in the -Y direction are provided.

The sub-transport mechanism 335 holds the substrate (not shown) on which the semiconductor chip is mounted on the upper side and supplies it to the lower surface of the fixed frame 304. At the lower surface of the fixed frame 304, the substrate supplied by a method such as attraction or clamping is temporarily fixed. The sub conveying mechanism 335 holds a resin material such as a solid resin such as a sheet or a powdered particle or a liquid resin having fluidity at room temperature on a container or the like provided on the lower side. The sub-transport mechanism 335 supplies the held resin material to the cavity (CAV) provided in the movable frame 305. [

In the movable frame 305, a cavity block 344 having a cavity CAV is attached. In the resin sealing apparatus 300B, the cavity block 344 also corresponds to the reflux member 2. A mark 309 is disposed at a predetermined position on the surface of the cavity block 344. [ The mark 309 includes an information formation surface 309a representing the corresponding identification information 22. The mark 309 is fixed to the cavity block 344 by, for example, attachment, screwing, or the like.

The reading section 311 including the light receiving section 336, the light guiding section 346 and the image obtaining section 341 optically reads the identification information 22 from the mark 309 (information forming surface 309a).

The light receiving portion 336 is provided on the lower surface or the side surface of the subordinate conveying mechanism 335. The light receiving section 336 includes a condenser lens 337 and a reflecting mirror 338. [ All of these are preferably constituted by heat-resistant glass. A light collecting lens 337 is disposed on the light incident side of the light receiving section 336 and an annular light 339 is provided around the light collecting lens 337.

The main transport mechanism 332 is provided with an image acquisition section 341 having an image sensor 340. The image sensor 340 is a light-receiving unit that receives light from a pattern formed on the pivot member 2, and is composed of, for example, a CCD, a CMOS image sensor, or a line sensor. Instead of the image sensor 340, a general-purpose digital camera may be used. However, it is preferable that a digital camera having heat resistance is employed. Alternatively, it is preferable to add a cooling function to the digital camera.

Light representing the image on the information formation surface 309a enters the condenser lens 337 via the light guiding portion 345 and is condensed. The condensed light is reflected by the reflecting mirror 338. The light reflected by the reflecting mirror 338 passes through the light guiding portion 346 and enters the image sensor 340. The reflecting mirror 338 is provided with an optical member for bending the optical path from the pattern of the pivot member 2 to the image sensor 340 in response to the use position of the pivot member 2 in the semiconductor manufacturing apparatus 300. [ to be.

By adopting such a configuration, the image sensor 340 can be detached from the mold, and thus the image sensor 340 can be detached under a high temperature environment. Thus, the image sensor 340 is prevented from becoming the heat-resistant temperature or higher.

The image sensor 340 outputs light corresponding to the image on the information formation surface 309a to the image recognition unit 343 as image data. The image recognition unit 343 processes the image data, and the identification information 22 included in the image data is output.

9 shows a configuration in which a space from the light receiving section 336 to the image obtaining section 341 is employed as the light guiding section 346. Alternatively, even if the optical fiber is employed as the light guiding section 346 good. In this case, the optical fiber may be disposed inside the protective tube having heat resistance.

(c4: How to make a mark)

Next, an example of a method of producing a landmark representing the identification information 22 will be described.

Fig. 10 is a schematic diagram for explaining an example of a method of producing a landmark representing the identification information 22 used in the management system 1 according to the present embodiment. On the information forming surface 309a (surface) of the mark 309, a fine pattern with high precision is formed by electroforming (electroforming), for example. As shown in Fig. 10 (D), finally, on the back side of the marking 309, an adhesive layer 309b having a release paper 309c adhered to its surface is formed. The main supplier 20 can peel off the release paper 309c of the mark 309 and attach the mark 309 to the target pivot member 2. [

Figs. 10 (A) and 10 (B) show the steps of the electric pole machining in a simplified manner. In this electric pole machining, a model 323 corresponding to the identification information 22 is prepared in advance. As shown in Fig. 10 (A), an electrolytic bath 321 of the electrolytic processing bath 320 is provided with an electrolytic bath 322 between a metal (anode) 322 such as nickel and a model (cathode) A constant voltage is applied. Ionization of the metal occurs at the anode by the applied voltage, and electrodeposition by metal reduction occurs at the model 323. A preform 324 constituted by electrodeposited nickel is used as the body of the marking 309. The model 323 is preferably manufactured by precision machining such as elliptical vibration cutting.

Next, as shown in Fig. 10 (B), the preform 324 electrodeposited on the pattern 323 is peeled from the pattern 323. In the preform 324, a fine pattern corresponding to a pattern obtained by inverting the surface shape of the pattern 323 is formed. This fine pattern is used as part or all of the information forming surface 309a of the mark 309. [

Figs. 10C and 10D schematically show the step of integrating the adhesive layer 309b and the release paper 309c on the back surface of the mark 309. Fig. An adhesive layer 309b on which a release paper 309c is attached is provided on the back surface of the preform 324 (that is, the surface opposite to the information forming surface 309a) as shown in Fig. 10 (C) . Next, as shown in Fig. 10 (D), the release paper 309c is removed from the marking 309, and then the marking 309 is attached to the object to be inspected.

The mark 309 is formed in a thin sheet shape by electroforming as described above. For example, a marking 309 having a thickness of 0.05 to 0.1 m can be produced. Such a thin sheet is formed in a thin sheet shape, so that the mark 309 attached to any one of the pivotal members 2 can be prevented from being attached to another pivotal member 2. That is, once the attached mark 309 is peeled off, at least the part of the mark 309 that is the information forming surface 309a is damaged, and the use of the mark 309 is disabled again.

In this way, as a form of the adding process of the identifying information 22, the marking 309 including the information forming surface 309a on the surface of which the pattern representing the issued identification information 22 is formed by electroforming, (2). Then, the pattern formed on the information formation surface 309a included in the mark 309 is optically read, and the identification information 22 is specified from the optically read pattern.

(c5: issuance and addition of identification information 22)

The management system 1 according to the present embodiment manages whether or not the management information can effectively be used for each identification information in the management apparatus 100 and therefore the identification information 22 added to the pivot member 2 It is not necessarily a copy protection measure. Therefore, most of the steps necessary for adding the identification information 22 issued by the management subject 10 to the replaceable member 2 may be performed by the supply subject 20. Hereinafter, an example of the order of sharing between the management subject 10 and the supplier 20 will be described.

Fig. 11 is a schematic diagram showing an example of a sequence relating to the addition of the identification information 22 between the management subject 10 and the supply subject 20 in the management system 1 according to the present embodiment.

In the example shown in Fig. 11A, the management subject 10 issues the identification information 22 and provides the issued identification information 22 to the supply subject 20 in the form of electronic information. The supplier 20 uses the marking device such as a marking machine or a laser marker to mark the identification information 22 supplied from the management subject 10 on the produced pendant member 2. According to this method, a series of procedures from the issuance of the identification information 22 to the addition to the replacement member 2 can be performed electronically, which is efficient.

In the example shown in Fig. 11B, the management subject 10 issues the identification information 22 and provides the issued identification information 22 to the supplier 20 in the form of electronic information. The supplier 20 uses the optional label making device to produce markings such as film, label, tape and the like on which the identification information 22 supplied from the management subject 10 is printed, To the member (2). According to this method, since the mark corresponding to the added pivot member 2 can be produced in the supply main body 20, the identification information 22 can be added without hindering the function of the pivot member 2 have.

In the example shown in Fig. 11C, the management subject 10 issues the identification information 22 and produces a marking indicating the issued identification information 22. [ As described with reference to Fig. 10, electroplate machining can be used for manufacturing the marking. A mark produced by the management subject 10 is provided to the supply subject 20. According to this method, it is possible to use a precise marking which is difficult to be reused, and the possibility of illegal use can be further reduced.

11 (A) to 11 (C) are exemplified. However, the relationship between the management subject 10 and the supply subject 20 (typically, a contract) is not limited to this, Can be adopted.

<D. Authentication function 350>

Next, the authentication function 350 mounted on the use subject 30 will be described. The authentication function 350 reads the identification information 22 added to the pivot member 2 and reads the identification information 22 acquired by referring to the status information 102 from the management apparatus 100 The function of determining whether or not the pivot member 2 is permitted to be used in the semiconductor manufacturing apparatus 300 is provided based on the state of the pivot member 22 as shown in Fig. That is, by referring to the state information 102 held by the management apparatus 100, the identification information 22 added to the pivot member 2 mounted on the semiconductor manufacturing apparatus 300 used in the use subject 30, And confirms that the mounted pivot member 2 can be used in the semiconductor manufacturing apparatus 300 based on the acquired state information.

The authentication process may be performed each time when the pivot member 2 is mounted to the semiconductor manufacturing apparatus 300, or may be performed every predetermined period.

Since the semiconductor manufacturing apparatus 300 is often used in a limited area such as the factory of the use subject 30, the state information 102 maintained by the management apparatus 100 of the management subject 10 can be referred to directly I can not even. In consideration of such a background, in the use subject 30, for example, the following apparatus configuration can be adopted.

(d1: Actual funeral 1 of the authentication function 350)

First, a configuration example in which the use subject 30 and the management subject 10 are connected via a network will be described. 12 is a schematic diagram showing a configuration example for realizing the authentication function 350 in the management system 1 according to the present embodiment. 12, the authentication function 350 acquires status information of the read identification information 22 by exchanging data with the management apparatus 100 via the network.

Referring to Fig. 12, there is shown an example in which two semiconductor manufacturing apparatuses 300-1 and 300-2 are disposed in the main body 30 of use. The semiconductor manufacturing apparatus 300-1 has, for example, a press mechanism 360 and a transport mechanism 362 for manufacturing a semiconductor. The semiconductor manufacturing apparatus 300-1 further includes a control section 370, a display operating section 378, and a communication interface 380. [

The control unit 370 is typically constituted by a personal computer or the like having a general-purpose architecture. That is, the control unit 370 has basic computer elements such as a processor, a memory, and a hard disk. By executing a predetermined program, the processor 370 controls the basic operation of the semiconductor manufacturing apparatus 300-1, (350).

The storage unit 372 of the control unit 370 stores authentication information 374 and device information 376. [ These pieces of information are used for authentication processing based on the identification information 22 added to the pivot member 2. [

The display control unit 378 accepts the operation of the operator, and presents the results of processing and the like in the control unit 370 to the operator. The display control unit 378 typically comprises a display, a touch panel, a mouse, a keyboard, and the like.

The communication interface 380 exchanges information with the management apparatus 100 of the management subject 10 via the Internet or the like. As the communication interface 380, any communication method can be employed. That is, as a transmission path for connecting to the Internet work, for example, a wired communication such as an optical fiber or a DSL (Digital Subscriber Line) line, a short-range wireless communication such as a wireless LAN or Bluetooth And public wireless communication such as WiMAX.

12, the control unit 370 controls the operation of the semiconductor manufacturing apparatus 300 such that the semiconductor manufacturing apparatus 300 is mounted on the semiconductor manufacturing apparatus 300. The semiconductor manufacturing apparatus 300 includes a molding member 352 and a kit 354, ), And the like). When reading the identification information 22, the configuration as described above with reference to Figs. 6 to 9 can be adopted. The control unit 370 transmits the identification information 22 read from the pivot member 2 to the management subject 10 (management apparatus 100) via the Internet. At this time, the control unit 370 transmits the device information 376 stored in advance in the storage unit 372 together. The device information 376 includes information for specifying the target semiconductor manufacturing apparatus 300-1 and the management subject 10 analyzes the identification information 22 transmitted and the semiconductor manufacturing apparatus 300 -1) is also confirmed.

When the management subject 10 (management apparatus 100) receives the identification information 22 from the use subject 30, the management subject 10 responds to the corresponding status information with reference to the held status information 102. [ The control unit 370 determines whether or not the usability of the reflex member 2 mounted on the target semiconductor manufacturing apparatus 300-1 is determined based on the state information received from the management subject 10 (management apparatus 100) When it is judged that the information is usable, the authentication information 374 is updated based on the information. On the other hand, when it is determined that the mounted pivot member 2 can not be used, the control unit 370 stops the operation of the semiconductor manufacturing apparatus 300 or notifies an operator or the like. The authentication function 350 is realized by exchanging such information.

Since the semiconductor manufacturing apparatus 300-2 has the same structure as the semiconductor manufacturing apparatus 300-1, detailed description thereof will not be repeated.

12, it is possible to realize real-time authentication processing for the pivot member 2 mounted on the semiconductor manufacturing apparatus 300, and to make reference to the status information in real time It is possible to reduce the possibility of production loss or the like in the semiconductor manufacturing apparatus 300 due to the incompatibility occurring in the pivot member 2. [

(d2: Actual funeral 2 of the authentication function 350)

Next, a case where the semiconductor manufacturing apparatus 300 can not access the Internet or the like will be described. 13 is a schematic diagram showing another configuration example for realizing the authentication function 350 in the management system 1 according to the present embodiment.

The system configuration shown in Fig. 13 differs from the system configuration shown in Fig. 12 only in that a link port 382 is used in place of the communication interface 380. [ Since the other components are substantially the same, the detailed description is not repeated.

In the system configuration shown in FIG. 13, the management apparatus 100 of the management subject 10 is accessed through the terminal 390 held by the service engineer. The service engineer is a technician belonging to the management subject 10 or the related company of the management subject 10 and copes with various incompatibilities occurring in the use subject 30.

The terminal 390 is a portable computer such as a so-called smart phone or tablet, and is connected to the semiconductor manufacturing apparatus 300 via the link port 382. The terminal 390 is typically capable of public wireless communications such as LTE and WiMAX.

In this configuration, the control unit 370 and the terminal 390 of the semiconductor manufacturing apparatus 300 cooperate with each other to access the management apparatus 100 of the management subject 10 to identify the identification information 22). The other processes and the like are the same as the system configuration shown in Fig. 12, and thus the detailed description thereof will not be repeated.

(d3: Actual funeral 3 of the authentication function 350)

12 and 13 illustrate an example in which the main body 30 is accessed to the main body 10 via a network such as the Internet. However, the present invention is not limited to this, and any storage medium (for example, The authentication function 350 is realized by copying part or all of the status information 102 held by the management apparatus 100 to the use subject 30 by using the medium management server 30, the medium, the magnetic storage medium, the semiconductor storage medium, It is also good.

In this case, the arbitrary storage medium functions as storage means for storing at least a partial replica of the status information managed by the management apparatus 100. [ The control unit 370 of the semiconductor manufacturing apparatus 300 refers to the status information of the copy stored in the storage medium and determines the status information of the identification information 22 read from the pivot member 2 do. As described above, the authentication function 350 refers to the storage medium storing the duplication of at least a part of the status information 102 managed by the management apparatus 100, and transmits the read identification information 22 to the corresponding management apparatus ( 100) of the status information.

(d4: display output of authentication result)

It is preferable to notify the operator of the user 30 or the like of the execution result of the authentication processing as described above. As the output of such an authentication result, for example, the following visual notification may be used.

14 is a schematic diagram showing an example of a user interface screen related to the authentication function 350 in the management system 1 according to the present embodiment. The user interface screen shown in Fig. 14 is typically presented on the display operating portion 378 (see Figs. 11 and 12) of the semiconductor manufacturing apparatus 300. Fig.

14A shows a user interface screen 501 displayed immediately after the pivot member 2 is mounted on the semiconductor manufacturing apparatus 300 and authentication processing is started. The operator confirms the contents of the user interface screen 501 and judges whether or not the mounted pivot member 2 can appropriately use it.

14B shows the user interface screen 502 displayed when the authentication process based on the identification information 22 read from the mounted pivot member 2 is successful. In the user interface screen 502, the identification information 511 indicating the supply subject 20 making the subject pivot member 2 may be displayed. When the number of times of use of the pivot member 2 is managed, the life information 512 such as the remaining number of times that the pivot member 2 can be used may be displayed.

Fig. 14C shows the user interface screen 503 displayed when the authentication process based on the identification information 22 read from the mounted pivot member 2 fails. In the user interface screen 503, an error code 513 may be displayed to help search for the cause of the authentication process failure. Also, the telephone number 514 and the like to the support center, which is a place for consulting the countermeasure against the failure of the authentication processing, may also be displayed.

The operator of the use subject 30 can transmit the error code 513 displayed on the user interface screen 503 to the support center so that the cause can be promptly sought and the manufacturing loss can be minimized.

The user interface screen shown in Fig. 14 is an example, and various types of information may be presented to the operator. In addition, when there is an incompatibility with respect to the pivot member 2, which is a failure of the authentication process, a function of automatically notifying the support center of its contents may be implemented.

(d5: processing in case of authentication failure)

As described above, when the authentication process based on the identification information 22 read from the pivot member 2 fails, the user interface screen as shown in Fig. 14 (C) may be presented to the user. Alternatively, the operation of the semiconductor manufacturing apparatus 300 may be stopped, or the information on the refractory member 2 that fails the authentication processing may be automatically transmitted to the management subject 10. [

That is, if it is determined that the use of the pivot member 2 in the semiconductor manufacturing apparatus 300 is not permitted, the authentication function 350 mounted on the management system 1 according to the present embodiment may include one or a plurality of May be performed.

(1) Operation stop of the semiconductor manufacturing apparatus 300.

(2) Display of a warning message in the semiconductor manufacturing apparatus 300.

(3) Transmission of information on the replacement member 2 determined to be unusable to the management apparatus 100.

<E. Implementation of management system>

The management system 1 according to the present embodiment is composed of a management main body 10, one or a plurality of supply main bodies 20 and one or a plurality of use main bodies 30. [ It is not limited that the management apparatus 100 arranged in the management subject 10 is simple since there are a large number of the distribution subject 20 or the use subject 30 in some cases.

For example, it is also possible to arrange a main management apparatus in a country in which the management subject 10 is located, and arrange one or a plurality of subordinate management apparatuses that follow the main management apparatus good. In this case, a technique of mirroring or replication can be used.

In addition, the management apparatus 100 is not limited to this. For example, the management apparatus 100 may use a part of a system, such as a so-called cloud computer, May be realized.

As described above, the management system 1 according to the present embodiment can be realized in any computing environment, and can be realized by arbitrarily using a known technology at the time of actual implementation, or in a country or a region An arbitrary mounting form can be adopted. The technical scope of the present invention is not limited to a specific mounting form, but may include any mounting form.

<F. Benefits>

Regarding a mold for use in a semiconductor manufacturing apparatus or a transfer kit called a transfer kit, it is not a so-called regular product provided by a maker of a semiconductor manufacturing apparatus or its affiliated company, but a third party who manufactures and sells a non- May be carried out. On the other hand, if the design information of the regular product can be used by a third party having a skill capable of producing the non-formal product, there is a possibility that the quality member having the quality comparable to the regular product can be produced. From the viewpoint of a customer of a semiconductor manufacturing apparatus, it is preferable that a quality-guaranteed replacement member can be obtained from a third party as well as a maker of the semiconductor manufacturing apparatus or an affiliated company thereof.

According to the present embodiment, a new value can be provided to a customer of a semiconductor manufacturing apparatus by utilizing a third party who provides an unqualified product which is conventionally thought to be undesirable. Further, a structure for assuring the quality can be provided even for a member of a semiconductor manufacturing apparatus or a ring member provided by a third party other than the affiliated company.

While the embodiments of the present invention have been described, it should be understood that the embodiments disclosed herein are illustrative and non-restrictive in all respects. It is intended that the scope of the invention be indicated by the appended claims and that all changes which come within the meaning and range of equivalency of the claims are intended to be embraced therein.

1: Management System
2:
10: management subject
20, 20A, 20B, 20C ... : Supplier
22, 511: identification information
24: Design information
26: Sales information
30, 30A, 30B, 30C ... : Subject of use
100: management device
102: Status information
104: Vendor management information
112: Processor
114: main memory
116:
118:
120: Output section
122: Status information database
124: Management information database
126: secondary storage
128: Issued program module
130: authentication program module
132:
134: Internal bus
200: Production apparatus
210:
300: Semiconductor manufacturing apparatus
300A, 300B: resin sealing device
302: Fixed bar
303:
304: Fixing table
304a, 305c: resin passage
304b, 305b, CAV: cavity
305: movable frame
305a: port
305v: Air vent
306, 352: Molding frame
307:
307a: frame opening / closing mechanism
307b: resin pressurizing mechanism
308, 343:
309: Marking
309a: information forming side
309b: Adhesive layer
309c:
310, 311:
320: Electroplating machine
321: electrolytic bath
323: Model
324: Preformed product
330: Ball Screw
331: Ball nut
332:
333: X-direction guide rail
334: Y-direction guide rail
335: Sub-
336:
337, Lb: condensing lens
338: Reflector
339: Lighting
340, Ld: Image sensor
341:
344: Cavity block
345 and 346, and Lc:
350: Authentication function
354: Kit
360: Press mechanism
362:
370:
372:
374: Authentication Information
376: Device Information
378:
380: Communication interface
382: Link port
390: terminal
501, 502, 503: User Interface Screen
512: Lifetime information
513: Error code
514: Telephone number
1021: Identification information
1022, 1041: What is a vendor code?
1023: User code
1024: Usable device code
1025: What is status?
1026: What is the first authentication period?
1027: What is the final authentication date and time?
1028: The total number of used lots
1042: Agreement type
1043: Contract status
1044: Contract due date
1045: What is the total number of issued identification information?
La: The light path

Claims (12)

A management system including a semiconductor manufacturing apparatus,
A management apparatus that issues one or a plurality of identification information and manages status information indicating a status of each issued identification information;
An adding means for adding the issued identification information to the reflex member manufactured in accordance with the design information provided from the first main body for managing the management apparatus for use in the semiconductor manufacturing apparatus,
And the control unit reads the identification information added to the reflex member and acquires the identification information of the reflex member from the semiconductor manufacturing apparatus of the reflex member based on the state of the read identification information acquired by referring to the status information from the management apparatus And an authentication means for deciding whether or not to permit use. The method according to claim 1,
In accordance with the relationship between the first subject and the second subject that adds the identification information to the reflex member, the issuance of the identification information for the second subject or the issuance of the identification information to the second subject And the status of the identification information is determined. The method according to claim 1,
Wherein the authentication means determines that the operation of the semiconductor manufacturing apparatus is stopped, the warning message is displayed on the semiconductor manufacturing apparatus, and that the use is not permitted if the use of the reflex member in the semiconductor manufacturing apparatus is not permitted And transmitting at least one of information on the reflex member to the management apparatus. 4. The method according to any one of claims 1 to 3,
Wherein the authentication means acquires status information of the read identification information by exchanging data with the management apparatus via a network. 4. The method according to any one of claims 1 to 3,
The authentication means acquires state information stored in the management apparatus corresponding to the read identification information by referring to the storage means for storing at least a part of the state information managed by the management apparatus Management system. 4. The method according to any one of claims 1 to 3,
Wherein the attaching means attaches a member, which is formed on the surface by the electroforming process, to the above-described pattern indicating the issued identification information,
Wherein the authentication means includes means for optically reading a pattern formed on the reflex member and specifying identification information from an optically read pattern. The method according to claim 6,
The authentication means,
A light receiving unit that receives light from a pattern formed on the pivot member,
And an optical member for bending an optical path from the pattern of the reflex member to the light receiving portion in response to a use position of the reflex member in the semiconductor manufacturing apparatus. 4. The method according to any one of claims 1 to 3,
Further comprising a collecting and transmitting means for collecting information on the use history of the semiconductor manufacturing apparatus in which the reflex member is used and transmitting the collecting information to the managing apparatus,
Wherein the management apparatus updates the state of the identification information corresponding to the refill member used in the semiconductor manufacturing apparatus based on the information on the use history of the semiconductor manufacturing apparatus. 4. The method according to any one of claims 1 to 3,
Wherein the refill member includes at least one of a molding frame and a carrier kit that is prepared in response to a type of product manufactured by the semiconductor manufacturing apparatus. A management method for managing a refill member used in a semiconductor manufacturing apparatus,
Issuing one or a plurality of pieces of identification information;
Managing status information indicating the status of each issued identification information;
Adding the issued identification information to a replacement member manufactured in accordance with design information provided from a main body for managing the state information for use in the semiconductor manufacturing apparatus;
Wherein the identification information added to the reflex member is read and the permission or rejection of use of the reflex member by the semiconductor manufacturing apparatus is determined based on the state of the read identification information acquired by referring to the status information The method comprising the steps of: A management system including a semiconductor manufacturing apparatus,
And a management device that is disposed in the management subject and issues one or a plurality of identification information to the pivot member for use in the semiconductor manufacturing apparatus and manages status information indicating the status of each issued identification information , The identification information is issued in response to a relationship between the supplier and the management subject making the reflex member,
Wherein when the identification information is attached to the semiconductor manufacturing apparatus, the identification information of the mounted replacement member is read, and when the identification information is attached to the semiconductor manufacturing apparatus, And an authentication unit that determines whether or not the use of the reflex member in the semiconductor manufacturing apparatus is permitted based on the state of the semiconductor manufacturing apparatus. A management method for managing a refill member used in a semiconductor manufacturing apparatus,
And a step of issuing one or a plurality of pieces of identification information to the cymbal member for use in the semiconductor manufacturing apparatus in the management subject, wherein the identification information is information for identifying the cymbal member Issued in response to a relationship,
Managing status information indicating the status of each issued identification information;
Reading the identification information of the mounted reflex member when the refill member to which the identification information is added is attached to the semiconductor manufacturing apparatus,
And determining whether or not the use of the reflex member in the semiconductor manufacturing apparatus is permitted based on the state of the read identification information acquired by referring to the status information.

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