JP2004259004A - Data processor using three-dimensional code, data processing method using three-dimensional code, data processing program using three-dimensional code, and article, tag and package having three-dimensional code - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a product using a three-dimensional code capable of including further more article information, and a data processor using the three-dimensional code. <P>SOLUTION: The data processor using a three-dimensional code comprises a three-dimensional code reading means and a corresponding processing execution means. The three-dimensional code reading means reads article information related to an article, which is expressed by a three-dimensional code consisting of a plurality of marks three-dimensionally arranged on a physical space. The corresponding processing execution means executes a predetermined processing in conformation to the read article information. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a data processing apparatus using a three-dimensional code, a data processing method using a three-dimensional code, an article, a tag, and a package having the three-dimensional code, and in particular, data using a three-dimensional code including article information. The present invention relates to a processing device, a data processing method using a three-dimensional code, a data processing program using a three-dimensional code, an article, a tag, and a package having the three-dimensional code.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, product information management has been performed using a barcode. Further, in addition to barcodes, which are one-dimensional codes, two-dimensional codes are also widely used. The two-dimensional code includes, for example, a data matrix code and a QR code. The data matrix code includes an L-shaped alignment mark and a timing mark, and information data is included in a two-dimensional data area. The QR code includes a cutout mark and a timing mark, and includes information data in a two-dimensional data area. Since a two-dimensional code has a larger amount of information than a one-dimensional bar code, it can include information other than numbers as it is (for example, see Patent Document 1).
[0003]
For example, when a two-dimensional code is printed on a product itself and various information about the product is included in the two-dimensional code, when a product has a defect or the like, the cause of the defect or the like can be pursued. . In particular, if a manufacturing lot number is included in the barcode as manufacturing history information, it is possible to determine in which lot the product was manufactured, and the manufacturer of the product determines the manufacturing lot number or the like in which the defect occurred. Based on this, it is possible to pursue the cause of a problem in manufacturing control or the like.
[0004]
Further, in order to increase the amount of information by a two-dimensional code, an identification code composed of a combination of graphics of different colors or a combination of black graphics of different tones has been proposed (for example, see Patent Document 2). The identification code is a two-dimensional code. The identification code increases the amount of information by including three-dimensional information in a pseudo manner using two or more types of color or tone figures.
[0005]
[Patent Document 1]
JP-A-11-232370 (paragraph number 0012, FIG. 2)
[0006]
[Patent Document 2]
JP-A-8-263580 (paragraph number 0004, FIG. 1)
[0007]
[Problems to be solved by the invention]
However, the one-dimensional code and the two-dimensional code have a large amount of information for various types of management, but also have a limited amount.
[0008]
For example, individual management of each product, that is, management of each product may require a more information to be included in the two-dimensional code. There is naturally a limit in increasing the area of the two-dimensional code due to the size of the product itself or the size of the area on the product surface for printing the two-dimensional code, etc. A lot of information cannot be easily included in a two-dimensional code. Even if a tag attached to a product is provided with a two-dimensional code, a large amount of information cannot be included in the two-dimensional code because the size of the tag is naturally limited.
Also, the identification code of a combination of figures having different colors or the like may cause a reading error in which the difference in the colors or the like cannot be accurately read by the reading device, and there is a limit in including a large amount of information due to the difference in the colors and the like. Was.
[0009]
[Means for Solving the Problems]
Therefore, an object of the present invention is to provide a data processing device using a code capable of including more article information, an article using the code, and the like.
A data processing device using a three-dimensional code according to the present invention is a three-dimensional code reader that reads article information associated with an article expressed by a three-dimensional code composed of a plurality of marks arranged three-dimensionally in a physical space. Means for executing predetermined processing corresponding to the read article information.
[0010]
The data processing method using the three-dimensional code of the present invention reads article information associated with an article represented by a three-dimensional code composed of a plurality of marks arranged three-dimensionally in a physical space, and reads the article information. A predetermined process is executed according to the article information.
The data processing program using the three-dimensional code of the present invention is determined in advance in correspondence with the article information associated with the article expressed by the three-dimensional code including a plurality of marks arranged three-dimensionally in the physical space. Execute the specified processing.
According to such a configuration, it is possible to realize a data processing device using a code capable of including more article information.
[0011]
In the article having the three-dimensional code according to the present invention, article information represented by a three-dimensional code including a plurality of marks arranged three-dimensionally in a physical space is provided in the article.
In the tag having the three-dimensional code according to the present invention, article information expressed by a three-dimensional code including a plurality of marks arranged three-dimensionally in a physical space is provided in the tag attached to the article.
In the package having the three-dimensional code of the present invention, the article information expressed by the three-dimensional code including a plurality of marks arranged three-dimensionally in the physical space is provided in the article package.
According to such a configuration, it is possible to realize an article or the like using a code code capable of including more article information.
[0012]
Further, in the data processing device using a three-dimensional code according to the present invention, it is preferable that each of the plurality of marks is three-dimensionally arranged in a layer of a light-transmitting material.
Further, in the data processing device using the three-dimensional code of the present invention, it is preferable that the light transmitting material is a glass material.
In the data processing device using the three-dimensional code according to the present invention, it is desirable that the glass material is silicon oxide.
According to such a configuration, the information of the three-dimensional mark can be easily read optically.
[0013]
In the data processing device using the three-dimensional code according to the present invention, it is preferable that the article information is article manufacturing history information.
According to such a configuration, manufacturing history management using more information can be performed.
[0014]
In the data processing device using the three-dimensional code according to the present invention, it is preferable that the article information is quality information of the article.
According to such a configuration, it is possible to perform quality control using more information.
[0015]
In the data processing device using the three-dimensional code according to the present invention, it is preferable that the article information is article distribution history information.
According to such a configuration, physical distribution management using more information can be performed.
[0016]
In the data processing device using the three-dimensional code of the present invention, the article is a semiconductor device, and the three-dimensional code is provided in the semiconductor device, or in a tag attached to the semiconductor device or in a package. Is desirable.
According to such a configuration, it is possible to realize a data processing device using a code that can include more information about the semiconductor device.
[0017]
In the data processing device using the three-dimensional code according to the present invention, it is preferable that the semiconductor device is a liquid crystal panel device.
According to such a configuration, it is possible to realize a data processing device using a code that can include more information about the liquid crystal panel.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
1 to 9 are diagrams for explaining the present embodiment. FIG. 1 is a partial explanatory diagram for explaining a state in which the three-dimensional code according to the present embodiment is incorporated in a semiconductor device 100 such as a liquid crystal panel. FIG. 2 is a partial plan view for explaining a state in which the three-dimensional code according to the present embodiment is incorporated in a semiconductor device 100 such as a liquid crystal panel. FIG. 3 is a partial side view for explaining a state in which the three-dimensional code according to the present embodiment is incorporated in a semiconductor device 100 such as a liquid crystal panel.
[0019]
1 to 3, reference numeral 101 denotes a layer made of a glass material provided on the semiconductor device 100 on which various circuits are formed. The glass layer 101, which is a light-transmitting material, may be separately formed in order to incorporate a three-dimensional code into the glass layer 101 when the semiconductor device 100 is manufactured. The portion of silicon oxide (SiO ₂ ) Layer. A plurality of marks a are formed in the glass layer 101. The three-dimensional code is formed in the semiconductor device 100 including the glass layer 101 and near the surface of the semiconductor device 100.
[0020]
As shown in FIG. 3, a plurality of marks a are a first mark group A1 including a plurality of marks at a predetermined depth d0 from the surface 102 of the glass layer 101, and a further predetermined mark from the first mark group A1. The second mark group A2 includes a plurality of marks at a depth d1, and the third mark group A3 further includes a plurality of marks at a predetermined depth d1 from the second mark group A2. Each mark group is composed of nine marks a. The three-dimensional code according to the present embodiment is described as an example in which three layers are provided for simplicity, and each layer on a two-dimensional plane has nine marks. The number of marks in each layer may be larger.
[0021]
As shown in FIGS. 1 to 3, the plurality of marks are formed and arranged at predetermined intervals in a three-dimensional XYZ axis direction in a physical space. Each mark is formed with an adjacent mark at an interval w1 in the X-axis direction, an interval h1 in the Y-axis direction, and an interval d1 in the Z-axis direction. In each layer, nine marks are arranged on the grid, so that the three-dimensional mark has a depth d2 twice the spacing d1, a width w2 twice the spacing w1, and a spacing h1. Has a depth of h2 twice as large as As described above, each layer on a two-dimensional plane parallel to the surface of the glass layer 101 includes a plurality of marks at predetermined positions having a predetermined interval from each other, and the presence or absence of each mark indicates the presence or absence of information. Express. That is, “0” or “1” is expressed depending on whether or not there is a mark at a predetermined position in the three-dimensional space.
[0022]
The information indicated by the three-dimensional code may represent one information or a plurality of information corresponding to each layer, or may represent one information or a plurality of information by combining marks of the three layers. You may do so. For example, each layer has 9 bits of information, that is, 8 bits of information and 1 bit of parity information, and the 3D code of 3 layers represents one bit of 8 bits of one alphanumeric character. May be defined as having three pieces of information, or may be defined as having a total of 27 bits of information by combining three layers. Information can be freely defined.
[0023]
Such a three-dimensional mark is optically scanned for each layer from above the surface 102 of the semiconductor device 100 to detect the presence / absence of the mark, and by performing this for all the layers, all the three-dimensional codes are obtained. Information can be read. In the example of FIGS. 1 to 3, for example, optical scanning is performed by focusing on the depth position of the first mark layer A1 to detect the presence or absence of a mark at a predetermined position. By detecting the presence / absence of a mark in each of the second mark layer A2 and the third mark layer A3 as well, the information of the three-dimensional mark can be read. The method of reading a three-dimensional mark will be described later in further detail.
[0024]
Next, a method of forming a mark in each layer will be described.
FIG. 4 is a system configuration diagram showing the entire configuration of the marking device. As shown in FIG. 4, the marking device 150 includes a computer device 151 such as a personal computer, a memory device 152 connected to the computer device 151, and a mark forming device 200 connected to the computer device 151. The memory device 152 includes a database in which various types of information for each product for writing the three-dimensional code into the semiconductor device 100 as an article, that is, data on product information associated with the product is stored. The computer 151 reads, from the memory device 152, data corresponding to the product to which the three-dimensional code is to be written, and supplies the read data to the mark forming device 200. Write the three-dimensional code to
[0025]
As the information of the three-dimensional code, for example, if the manufacturing history information in the manufacturing line of the semiconductor device 100 is to be written into the semiconductor device 100, the computer 151 reads the information on the manufacturing from the memory device 152 and outputs the information as the three-dimensional code. Is converted into data for writing, and then supplied to the mark forming apparatus 200. The mark forming apparatus 200 forms a mark as a three-dimensional code based on the received data in the semiconductor device 100, specifically, in the glass layer 101. The manufacturing history information is information such as a manufacturing factory, a manufacturing line number, a manufacturing date and time, and material information.
[0026]
Further, the quality information of the semiconductor device 100 may be written into the semiconductor device 100 as the information of the three-dimensional mark by using the marking device of FIG. The quality information is information such as various inspection result data and quality management information. Furthermore, if the logistics history information is to be written into the semiconductor device 100 as the information of the three-dimensional mark, the logistics history information may be similarly written to the semiconductor device 100 using the marking device of FIG. The distribution history information is information such as a shipping factory, a warehouse name, a delivery method and a delivery date.
[0027]
Each mark can be formed by condensing a laser beam from above the glass layer 101 into the glass layer 101, which is a light transmitting material, at a predetermined depth. As a method of forming a mark inside the glass, for example, a method described in JP-A-11-267861 can be used.
[0028]
Specifically, a three-dimensional mark is formed in the glass layer using a mark forming apparatus 200 as shown in FIG. FIG. 5 is a configuration diagram showing a configuration of a mark forming apparatus for forming a mark in the glass layer 101. 5, the mark forming apparatus 200 includes a laser light source 211, a beam shaper 212, two galvano mirrors 213, and an fθ lens 214. As the laser light source 211, a fourth harmonic (a pulse width of about 10 ns) of a YLF laser is used. As the fθ lens 214, for example, a lens having a focal length of 50 mm is used.
[0029]
The laser light emitted from the laser light source 211 passes through the beam shaper 212 and the two galvanometer mirrors 213 and enters the fθ lens 214. laser beam 203 emitted from fθ lens 214 is condensed at a predetermined depth position inside glass layer 101 of the semiconductor device. Here, the reason why the fθ lens 214 is used is to focus the laser beam 203 at a position at a certain depth from the surface 102 of the glass layer 101. By controlling the focusing position in the XY directions in the glass layer 101 on the semiconductor device 100, a mark in one layer can be formed at a predetermined position. Since the position of the layer can be controlled by controlling the light condensing position in the Z direction, which is the depth direction, the position control in the Z direction and the position control in the XY directions can be combined to form a three-dimensional space. In, marks can be generated at desired positions in a plurality of layers. Control of the condensing position in the Z direction is realized by controlling the position of the fθ lens 214 in the Z axis direction, and control of the condensing position in the XY directions is realized by controlling the angle of the two galvanometer mirrors 213. can do. The interval between the mark and the adjacent mark is, for example, 40 μm (micrometer).
[0030]
The mark is formed in the glass layer 101 by condensing the laser beam to cause a change in the optical properties of the glass layer 101 which is a light transmitting material. Accordingly, a mark of a desired size and shape is generated in the glass layer 101 by appropriately controlling the irradiation energy of the laser light and the aperture of the laser light.
[0031]
FIG. 6 shows the processing of the marking device 150. FIG. 6 is a flowchart illustrating an example of a processing flow of the computer device 151 in the marking device 150. 6 is executed after the semiconductor device 100 to which the three-dimensional code is written is set at a predetermined position of the mark forming apparatus 200 and product information to be written is specified.
[0032]
First, product information to be written as a three-dimensional code in the set semiconductor device 100, for example, manufacturing history information, is read from the database of the memory device 152 (step (hereinafter, step is abbreviated as S) 11). The mark forming apparatus 200 performs data conversion for writing the read information as a three-dimensional code (S12). Then, the computer device 151 supplies the converted data to the mark forming device 200 (S13). In this way, the manufacturing history information and the like are read from the database by the computer device 151, and the three-dimensional code including the manufacturing history information and the like is formed in the semiconductor device 100 by the mark forming device 200.
[0033]
Next, a three-dimensional code reader that reads data of a three-dimensional code formed in the glass layer 101 will be described.
FIG. 7 is a system configuration diagram showing the overall configuration of the three-dimensional code reader 250. As shown in FIG. 7, the three-dimensional code reader 250 includes a computer 251 such as a personal computer, a memory 252 connected to the computer 251, and a mark reader 300 connected to the computer 251. . The memory device 252 includes a processing content corresponding to the data of the three-dimensional code read by the mark reading device 300, for example, a database in which a program or the like is stored. The computer 251 executes predetermined processing corresponding to the three-dimensional code read from the memory device 252. As the predetermined processing content, outputs predetermined data based on the read three-dimensional code information, and outputs a predetermined program execution instruction based on the read three-dimensional code information And so on.
[0034]
FIG. 8 is a configuration diagram illustrating a configuration of the mark reading device 300. The mark reading device 300 includes a semiconductor laser 301 that outputs reading laser light, a polarizing beam splitter 302, a collimator lens 303 that converts light reflected by the beam splitter 302 (reflected light) into parallel light, and a quarter wavelength. It includes a plate 304, an objective lens 305, and a reading sensor 306. The laser light 307 emitted from the semiconductor laser 301 is reflected by the beam splitter 302 by changing, for example, the P-polarized light component of the components of the laser light 307 by 90 degrees, and enters the collimator lens 303. The collimator lens 303 converts the laser light 307 into parallel light, and the parallel light is converted into circularly polarized light by the quarter-wave plate 304. The circularly polarized laser light is focused by the objective lens 305 at a position at a predetermined depth of the glass layer 101 of the semiconductor device 100. If there is a mark at that position, the reflected light travels back toward the objective lens 305, passes through the quarter-wave plate 304 and the collimator lens 303, is further reflected by the beam splitter 302, and is read. An image is formed on the detection surface of the sensor 306.
[0035]
Reading of the three-dimensional code is performed by scanning in the plane direction of the glass layer 101, that is, in the XY axis direction, while controlling the position in the depth direction of the glass layer 101, that is, in the Z axis direction. The three-dimensional code is read by scanning two-dimensionally in each layer in order from the first layer to the third layer or from the third layer to the first layer. “0” and “1” are determined based on the presence or absence of a mark at a predetermined position.
[0036]
Specifically, the distance and the focal length from the semiconductor laser 301 to the depth position in the glass layer 101 are controlled so that the reflected light 307 forms an image at the position, that is, the depth of each layer in the glass layer 101. The focal length can be realized by, for example, changing the wavelength of the laser beam 307, adjusting the position of the objective lens 305, and the like. In order to change the wavelength of the laser light, for example, the switching may be performed using a plurality of semiconductor lasers. Instead of adjusting the position of the objective lens 305, the focal length may be changed by switching using a plurality of objective lenses.
[0037]
FIG. 9 shows the processing of the three-dimensional code reader 250. FIG. 9 is a flowchart illustrating an example of a processing flow of the computer device 251 in the three-dimensional code reading device 250. The process of FIG. 9 is executed after the semiconductor device 100 on which the three-dimensional code is written is set at a predetermined position of the mark reading device 300 and an instruction to read information is issued.
[0038]
First, the computer 251 scans each layer of the set three-dimensional code portion of the semiconductor device 100 to read data by supplying a scan command to the mark reading device 300 (S21). The data read by the mark reading device 300 is supplied to the computer 251, and a corresponding processing content is searched from the database of the memory device 252 based on the data read by the mark reading device 300 (S22). Next, in S23, the processing contents searched and extracted are executed as corresponding processing executing means. For example, if the three-dimensional code includes manufacturing history information, the computer 251 communicates with a production management computer (not shown) to obtain manufacturing-related information related to the semiconductor device 100, and Processing such as displaying the acquired manufacturing information on the display device is performed.
[0039]
In this case, since the three-dimensional code can include a lot of information, a lot of manufacturing-related information can be obtained.
As described above, according to the present embodiment, it is possible to realize an article using a three-dimensional code, which can include more article information, and a data processing device using the three-dimensional code.
[0040]
(Second embodiment)
FIG. 10 to FIG. 12 are diagrams for explaining a state in which the three-dimensional code according to the present embodiment is three-dimensionally formed on a glass substrate by using a printing technique. FIG. 10 is a partial explanatory diagram for explaining a state in which the three-dimensional code according to the present embodiment is provided on a semiconductor device 100 such as a liquid crystal panel. FIG. 11 is a partial plan view for explaining a state in which the three-dimensional code according to the present embodiment is provided on a semiconductor device 100 such as a liquid crystal panel. FIG. 12 is a partial side view for explaining a state in which the three-dimensional code according to the present embodiment is provided on a semiconductor device 100 such as a liquid crystal panel. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
[0041]
10 to 12, reference numeral 101 denotes a glass layer provided on the semiconductor device 100 on which various circuits are formed. On a surface 102 of a glass layer 101 which is a light transmitting material, a laminated acrylic resin layer 103 including a plurality of marks forming a three-dimensional code is provided. The method for forming the acrylic resin layer 103 will be described later. A plurality of marks b are formed in the acrylic resin layer 103.
[0042]
As shown in FIG. 12, the plurality of marks b are provided in the acrylic resin layer 103 by a printing method described later. A first mark group B1 including a plurality of marks at a predetermined depth d3 from the surface 104 of the acrylic resin layer 103, and a second mark group including a plurality of marks at a predetermined depth d3 from the first mark group B1. The mark group B2 includes a third mark group B3 including a plurality of marks at a predetermined depth d3 from the second mark group B2. As shown in FIG. 12, the first mark group B1 is provided on the first layer 106, the second mark group B2 is provided on the second layer 107, and the third mark group B3 is provided on the third layer 108. Have been. For simplicity, the three-dimensional code according to the present embodiment will be described as an example in which there are three layers, and each layer on a two-dimensional plane has nine marks, as in the above-described embodiment. .
[0043]
The plurality of marks are formed at predetermined intervals in the three-dimensional XYZ axis direction in the physical space, as shown in FIGS. Each mark is formed with an adjacent mark at an interval w3 in the X-axis direction, an interval h3 in the Y-axis direction, and an interval d3 in the Z-axis direction. In each layer, nine marks are arranged on the grid, so that the three-dimensional mark has a depth of d4, twice the spacing d3, a width of w4, twice the spacing w3, and a spacing h3. Has a depth of h4 twice that of As described above, each layer on a two-dimensional plane parallel to the surface of the glass layer 101 includes a plurality of marks at predetermined positions having a predetermined interval from each other, and the presence or absence of each mark indicates the presence or absence of information. Express. That is, “0” or “1” is expressed depending on whether or not there is a mark at a predetermined position in the three-dimensional space.
[0044]
The information indicated by the three-dimensional code may represent one information or a plurality of information corresponding to each layer, or may represent one information or a plurality of information by combining marks of the three layers. You may do so. For example, each layer has 9 bits of information, that is, 8 bits of information and 1 bit of parity information, and the 3D code of 3 layers represents one bit of 8 bits of one alphanumeric character. May be defined as having three pieces of information, or may be defined as having a total of 27 bits of information by combining three layers. Information can be freely defined.
[0045]
Next, a method of forming a mark in each layer will be described.
Each layer is formed on the glass layer 101 in the order of the third layer, the second layer, and the first layer. First, the mark b of the third layer 108 is printed on the surface 102 of the glass layer 101 using an ink jet printer. After printing the mark b, the third layer 108 is formed by applying an acrylic resin 110 thereon to a thickness of d3. The mark b of the second layer 107 is printed on the acrylic resin 110 of the third layer 108 using an ink jet printer. After printing the mark b, the second layer 107 is formed by applying an acrylic resin 110 thereon to a thickness of d3. The mark b of the first layer 106 is printed on the acrylic resin 110 of the second layer 107 by using an ink jet printer. After printing the mark b, the first layer 106 is formed by applying an acrylic resin 110 thereon to a thickness of d3.
[0046]
The ink material for printing as a mark is ink described in JP-A-2002-348509, ink described in JP-A-2002-146245, and The ink described in JP-A-7965 is used. The ink described in JP-A-2002-348509 is an ink used for an ink jet printer in which at least a part of a member in contact with the ink is made of glass or further silicon or silicon oxide, and contains an alkali metal in the ink. The total amount is 700 ppm or less, and the specific quaternary phosphonium ion is contained in an amount of 30% or more based on the equivalent of the anionic compound contained in the ink. The ink described in JP-A-2002-146245 is an ink composition for an ink jet printer containing at least a colorant, a film-forming resin, and a lower alcohol having 4 or less carbon atoms. ² / G of carbon black having a BET specific surface area of substantially no ketone solvent. The ink described in JP-A-2000-7965 is an ink-jet ink obtained by dispersing at least a pigment as a coloring agent in an aqueous liquid, wherein a metal oxide fine particle precursor or a metal oxide fine particle is contained in the liquid. It contains.
[0047]
The marks provided in such a manner that they are three-dimensionally stacked in physical space can be read out by using the three-dimensional code reader 250 shown in FIGS. The principle and method of reading have been described in the first embodiment, and therefore, the description is omitted in this embodiment.
As described above, according to the present embodiment, it is possible to realize an article using a three-dimensional code and the like and a data processing device using the three-dimensional code that can include more article information. . In particular, by providing more production history information, quality information, distribution history information, and the like as three-dimensional mark information on articles and the like than before, production management, quality management, distribution management based on more information than before. And so on.
[0048]
In the two embodiments described above, examples of the semiconductor device have been described. Although the semiconductor device includes a semiconductor chip, a liquid crystal panel, and the like, the present invention is not limited to these semiconductor devices, but can be applied to various articles.
In the above-described two embodiments, the mark of the uppermost layer is provided in the glass layer, but the mark of the uppermost layer may be provided on the glass surface.
[0049]
Furthermore, in addition to providing the three-dimensional code on the article itself, a tag (tag) attached to the article and a package (including a case or the like) for wrapping the article are provided with the above-described three-dimensional code. Is also good. In that case, a three-dimensional code including various kinds of article information is embedded in the tag or the like.
[0050]
The mark according to the present invention only needs to be optically readable, and may have a shape other than the shape described in the above-described embodiment.
In addition, the arrangement pattern and the number of the plurality of marks may be any optically readable patterns. And a number.
[0051]
Further, in the above-described embodiment, the layer provided with the mark is a glass material and an acrylic material. The material may be other than the materials described above.
[0052]
Furthermore, alignment marks, cutout marks, timing marks, and the like included in the two-dimensional code may be provided on any of the layers as marks.
In addition, information indicating an upper layer mark group near the surface of the article and information indicating a lower layer mark group above the upper layer are separated, and the upper layer mark group indicates general information, and the lower layer mark group is A three-dimensional mark may be used, such as additional information of general information or hidden information. For example, it is possible to include, as additional information or the like, license permission information of an article indicating that the license has been correctly received.
The present invention is not limited to the above-described embodiment, and various changes and modifications can be made without departing from the spirit of the present invention.
[Brief description of the drawings]
FIG. 1 is a partial explanatory diagram illustrating a three-dimensional code according to a first embodiment.
FIG. 2 is a partial plan view for explaining a three-dimensional code according to the first embodiment.
FIG. 3 is a partial side view for explaining the three-dimensional code of the first embodiment.
FIG. 4 is a system configuration diagram showing an overall configuration of the marking device according to the first embodiment.
FIG. 5 is a configuration diagram illustrating a configuration of a mark forming apparatus according to the first embodiment.
FIG. 6 is a flowchart of a process performed by the marking device according to the first embodiment;
FIG. 7 is a configuration diagram of a three-dimensional code reader system according to the first embodiment.
FIG. 8 is a configuration diagram illustrating a configuration of a mark reading device according to the first embodiment.
FIG. 9 is a flowchart of a process performed by the three-dimensional code reader according to the first embodiment;
FIG. 10 is a partial explanatory diagram for explaining a three-dimensional code according to the second embodiment.
FIG. 11 is a partial plan view illustrating a three-dimensional code according to the second embodiment.
FIG. 12 is a partial side view for explaining a three-dimensional code according to the second embodiment.
[Explanation of symbols]
Reference Signs List 100 semiconductor device, 101 glass layer, 102 glass layer surface, a mark

Claims (14)

Represented by a three-dimensional code consisting of a plurality of marks arranged three-dimensionally in physical space, three-dimensional code reading means for reading article information associated with the article,
A data processing device using a three-dimensional code, comprising: a corresponding process executing means for executing a predetermined process in accordance with the read article information. The data processing device using a three-dimensional code, wherein the plurality of marks are respectively three-dimensionally arranged in a layer of a light transmitting material. The data processing device according to claim 2, wherein the light transmitting material is a glass material. The data processing apparatus using a three-dimensional code according to claim 3, wherein the glass material is silicon oxide. The data processing apparatus using a three-dimensional code according to any one of claims 1 to 4, wherein the article information is manufacturing history information of the article. The data processing apparatus according to claim 1, wherein the article information is quality information of the article. The data processing apparatus using a three-dimensional code according to any one of claims 1 to 4, wherein the article information is distribution history information of the article. The article is a semiconductor device,
The three-dimensional code according to claim 1, wherein the three-dimensional code is provided in the semiconductor device, in a tag attached to the semiconductor device, or in a package. Data processing device using codes. 9. The data processing device according to claim 8, wherein the semiconductor device is a liquid crystal panel device. Read the article information associated with the article, represented by a three-dimensional code consisting of a plurality of marks arranged three-dimensionally in physical space,
A data processing method using a three-dimensional code, wherein a predetermined process is executed according to the read article information. A three-dimensional code represented by a three-dimensional code consisting of a plurality of marks arranged three-dimensionally in a physical space, executing a predetermined process corresponding to article information associated with the article. Data processing program using. An article having a three-dimensional code, wherein article information represented by a three-dimensional code composed of a plurality of marks arranged three-dimensionally in a physical space is provided in the article. A tag having a three-dimensional code, wherein article information expressed by a three-dimensional code including a plurality of marks arranged three-dimensionally in a physical space is provided in a tag attached to the article. A package having a three-dimensional code, wherein article information represented by a three-dimensional code including a plurality of marks arranged three-dimensionally in a physical space is provided in a package of the article.

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