TW201809617A - Manufacturing method for heat flow measuring device - Google Patents

Abstract

In a thermocouple sheet formation step (S10), a thermocouple sheet (200) is formed by a thermocouple (20), and a first insulating sheet (210) and a second insulating sheet (220) that cover both surfaces of the thermocouple. In a heat flux sensor member preparation step (S20), an insulating base material (100) in which conductive pastes (131, 141) are embedded, a front surface protection member (110) having a front surface wiring pattern (111), and a back surface protection member (120) having a back surface wiring pattern (121) are prepared. In a laminate formation step (S30), at a position where the front surface protection member and the back surface protection member extend from the insulating base material in the planar direction, the thermocouple sheet is positioned on the opposite side to the front surface protection member among the back surface protection member. In an integration pressing step (S40), the laminate is heated under pressure in the lamination direction, thereby integrally forming the heat flux sensor (10) and the thermocouple.

Description

Manufacturing method of heat flow measuring device [Cross-reference of related applications]

This case is based on Japanese application No. 2016-104500 filed on May 25, 2016, the right to claim its priority, and is incorporated into this specification with reference to all the contents of the patent application.

The present invention relates to a method for manufacturing a heat flux measuring device in which a heat flux sensor and a thermocouple are integrally formed.

Conventionally, there has been known a heat flux sensor which is formed in a thin plate shape and outputs a signal corresponding to a heat flux flowing between one surface and the other surface of the thickness.

Patent Document 1 describes a heat flow measurement device that simultaneously forms an electrically independent plural heat flux sensor in a process of manufacturing a single multilayer substrate. This heat flow measurement device is designed to reduce the performance of a plurality of heat flux sensors.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2016-11950

The heat flow measurement device described in Patent Document 1 can measure the heat flow generated from the inside of the measurement object by being mounted on the surface of the measurement object. However, the heat flow on the surface of the measurement object is affected by the heat generated inside the measurement object, and is also affected by changes in the temperature of the outside air. Therefore, the heat flow measurement device outputs a signal corresponding to the heat generated inside the measurement object, and also outputs a signal corresponding to a change in the outside air temperature. Therefore, in a heat flow measurement in which a heat flow measurement device is mounted on a surface of a measurement object, a signal that changes in response to a change in outside air temperature becomes a temperature drift, and therefore it is difficult to detect the heat generated inside the measurement object.

As a countermeasure, it is considered that the heat flow measurement device includes a thermocouple in addition to a heat flux sensor. If a thermocouple is used to detect the temperature change on the surface of an object caused by a change in the outside air temperature, the signal output from the heat flux sensor and the signal output from the thermocouple can be used to determine the temperature of the object. The signal reduces the effects of temperature drift.

When the heat flux measuring device is provided with a heat flux sensor and a thermocouple, there are the following problems.

(1) Assuming that a heat flux sensor and a thermocouple are stacked in the thickness direction and arranged, the thickness of the heat flow measurement device becomes large. When such a heat flow measurement device is attached to the surface of a measurement object, the air flow near the surface of the measurement object is disturbed. Therefore, the output signal of the heat flux sensor and the output signal of the thermocouple will not accurately correspond to the surface of the measurement object caused by the heat generated inside the measurement object. Heat flow and the heat flow on the surface of the measurement object caused by the change of the outside air temperature. Therefore, in such an arrangement, it is difficult for the heat flow measurement device to accurately detect the heat generated inside the measurement object.

(2) Assuming that the heat flux sensor and the thermocouple are arranged at positions separated from each other in the plane direction, the heat flux detected by the heat flux sensor and the temperature change detected by the thermocouple become the measurement targets, respectively. Heat flux and temperature change at different locations. At this time, the signal of the thermocouple and the signal of the heat flux sensor will not become the counterpart. Therefore, in such a configuration, it is difficult for the heat flow measurement device to reduce the influence of temperature drift based on the signal of the heat flux sensor.

An object of the present invention is to provide a method for manufacturing a heat flow measurement device capable of accurately detecting a heat flow of a measurement object.

In the first aspect of the present invention, a method for manufacturing a heat flow measuring device includes a process of forming a thermocouple sheet, and the thermoelectric thermocouple sheet includes a first conductor connected to a metal having different thermoelectric power. The thermocouple at the junction with the second conductor, the first insulating sheet covering the first conductor and the second conductor from one side in a direction crossing the direction in which the first conductor and the second conductor are juxtaposed, and the first insulating sheet and the first insulating sheet A second insulating sheet covering the first conductor and the second conductor on the opposite sides; a plurality of conductive adhesives having different thermoelectric powers to form a heat flux sensor are embedded in a plurality of through-hole insulating base materials, and a plurality of conductive materials are prepared. A surface wiring pattern in which the ends of one of the thickness directions of the insulating base material are connected to each other, and one surface of the thickness direction of the insulating base material and the surface wiring pattern are connected to each other. Surface protection member, a back wiring pattern connected to the other end portion in the thickness direction of the insulating base material of the plurality of conductive adhesives, and a back surface protection pattern covering the other side in the thickness direction of the insulation base material and the back wiring pattern. Component engineering; in the position where the surface protective member and the back protective member extend from the insulating substrate toward the surface, a thermocouple sheet is arranged on the opposite side of the back protective member from the surface protective member, or between the surface protective member and the back protective member A process of arranging thermocouple sheets between them to form a laminate; and heating the laminate while pressing it in the lamination direction, and solid-state sintering a plurality of conductive adhesives embedded in a plurality of through holes of an insulating substrate as a plurality of A conductive body, and electrically connecting the conductive body with the surface wiring pattern and the back wiring pattern, and crimping the insulating substrate with the surface protection member, the back protection member and the thermocouple sheet to integrally form the heat flux sensor and the thermocouple engineering.

Accordingly, the thickness of the heat flux sensor provided in the heat flow measurement device can be made the same as that of the thermocouple sheet, and the thickness of the heat flow measurement device can be reduced. Therefore, when the heat flow measuring device is attached to the surface of the measurement target, it is possible to suppress the disorder of the air flow near the surface of the measurement target. Therefore, the heat flow measurement device can accurately detect the heat flow of the measurement object based on the output signal of the heat flux sensor and the output signal of the thermocouple to reduce temperature drift caused by changes in the outside air temperature.

In addition, according to such a manufacturing method, a heat flow measurement device can be formed by performing a single pressurization process on an insulating substrate, a surface protective member, a back protective member, a thermocouple sheet, and the like. Therefore, it is possible to suppress the occurrence of wrinkles in members such as an insulating base material, a surface protective member, a back protective member, and a thermocouple sheet. Breaks or gaps.

1‧‧‧ heat flow measuring device

2‧‧‧Measurement object

3‧‧‧ surface

4‧‧‧ heat source

10‧‧‧ Heat Flux Sensor

11‧‧‧ recess

12‧‧‧ side

20‧‧‧Thermocouple

21‧‧‧The first conductor

22‧‧‧ 2nd Conductor

23‧‧‧ Junction

24‧‧‧ the first pad

25‧‧‧ 2nd pad

26‧‧‧ 1st pad

27‧‧‧ 2nd pad

30‧‧‧Testing Department

31‧‧‧Wiring

32‧‧‧ Wiring

33‧‧‧shielded wire

34‧‧‧Wiring

35‧‧‧ Wiring

36‧‧‧Wiring

37‧‧‧ Ground

40‧‧‧Jig base

41‧‧‧End positioning fixture

42‧‧‧ Middle positioning fixture

43‧‧‧Screw

44‧‧‧Gully

45‧‧‧Gully

46‧‧‧Suppression fixture

51‧‧‧The first release paper

52‧‧‧Second Release Paper

53‧‧‧The third release paper

54‧‧‧4th release paper

61‧‧‧The first buffer material

62‧‧‧Second cushioning material

70‧‧‧Pressing machine

71‧‧‧Lower side pressure plate

72‧‧‧Upper pressure plate

100‧‧‧ insulating substrate

100a‧‧‧ surface

100b‧‧‧ back

101‧‧‧The first through hole

102‧‧‧ 2nd through hole

110‧‧‧Surface protection member

110a‧‧‧face

111‧‧‧ surface wiring pattern

120‧‧‧back protection member

120a‧‧‧ surface

120b‧‧‧ noodles

121‧‧‧ back wiring pattern

122‧‧‧Extended wiring

123‧‧‧Extended wiring

124‧‧‧ Pad

125‧‧‧ Pad

130‧‧‧The first inter-level connecting member

131‧‧‧The first conductive adhesive

140‧‧‧Second-level connecting member

141‧‧‧Second conductive adhesive

200‧‧‧thermocouple sheet

200b‧‧‧ noodles

201‧‧‧one piece

210‧‧‧The first insulation sheet

220‧‧‧Second insulation sheet

230‧‧‧Insulation sheet for short circuit prevention

T1‧‧‧thickness

T2‧‧‧thickness

[FIG. 1] A diagram schematically showing a state where a heat flow measurement device according to a first embodiment of the present invention is mounted on a measurement object.

[FIG. 2] A schematic view of the II-II cross section of FIG. 1. [FIG.

[Fig. 3] A graph showing the output characteristics of a heat flux sensor and the output characteristics of a thermocouple constituting a heat flow measurement device is schematically shown.

[FIG. 4] A plan view of a heat flow measurement device according to the first embodiment.

[Fig. 5] V-V sectional view of Fig. 4.

6 is a flowchart of a method for manufacturing a heat flow measurement device according to the first embodiment.

7 is a flowchart of a method of manufacturing a thermocouple sheet constituting a heat flow measurement device.

[Fig. 8] An explanatory diagram of a method for manufacturing a thermocouple sheet constituting a heat flow measurement device.

[FIG. 9] A sectional view taken along the line IX-IX in FIG. 8.

[Fig. 10] An explanatory diagram of a method for manufacturing a thermocouple sheet constituting a heat flow measurement device.

[FIG. 11] An explanatory diagram of a method for manufacturing a thermocouple sheet constituting a heat flow measurement device.

[Fig. 12] An explanatory diagram of a method for manufacturing a thermocouple sheet constituting a heat flow measurement device.

13 is an explanatory diagram of a method for manufacturing a thermocouple sheet constituting a heat flow measurement device.

[FIG. 14] An explanatory diagram of a method of manufacturing a thermocouple sheet constituting a heat flow measurement device.

[Fig. 15] A schematic diagram of a member constituting a heat flux sensor of a heat flow measurement device.

[FIG. 16] An explanatory diagram of a method for manufacturing a heat flow measurement device.

[FIG. 17] An explanatory diagram of a method for manufacturing a heat flow measurement device.

[FIG. 18] A cross-sectional view of a heat flow measurement device according to a second embodiment of the present invention.

19 is a plan view in the XIX direction of FIG. 18.

[FIG. 20] An explanatory diagram of a method for manufacturing a heat flow measurement device according to a second embodiment.

21 A plan view of a thermocouple constituting a heat flow measurement device according to a third embodiment of the present invention.

[FIG. 22] A plan view of a thermocouple constituting a heat flow measurement device according to a fourth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that in the following embodiments, the same or equal parts will be described with the same reference numerals.

(First Embodiment)

The first embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the heat flow measurement device 1 of this embodiment is a heat flux sensor 10 and a thermocouple 20 that are integrally formed.

The heat flux sensor 10 includes an insulating substrate 100, a surface protective member 110 covering one surface of the insulating substrate 100 in the thickness direction, and a back protective member 120 covering the other surface. A plurality of interlayer connection members 130 and 140 composed of metals having different thermoelectric powers are embedded in the insulating base material 100 to exert the Seebeck effect. A surface wiring pattern 111 and a back wiring pattern 121 are formed on the surface protection member 110 and the back protection member 120 so as to connect the plurality of interlayer connection members 130 and 140 in series. The heat flux sensor 10 outputs a signal corresponding to the thermoelectromotive force generated in the interlayer connection members 130 and 140 in response to the heat flux flowing between one surface and the other surface in the thickness direction. The thickness direction of the heat flux sensor 10 is a lamination direction of the insulating base material 100, the surface protective member 110, and the back protective member 120. In addition, the interlayer connection members 130 and 140 according to the present embodiment correspond to "conductors" described in the scope of the patent application.

The thermocouple sheet 200 includes a thermocouple 20, a first insulating sheet 210, and a second insulating sheet 220. The thermocouple 20 is formed by joining the first conductor 21 and the second conductor 22. The first conductor 21 and the second conductor 22 are each made of a metal foil having a different thermoelectric power. A portion where the first conductor 21 and the second conductor 22 are joined is referred to as a joint portion 23. The thermocouple 20 outputs a signal corresponding to the thermoelectromotive force of the thermocouple 20 due to the temperature difference between the junction 23 and the detection section 30 connected to the first conductor 21 and the second conductor 22 through the wirings 34 and 35. . First insulating sheet 210 The thermocouple 20 is covered from one side of a direction that intersects the direction in which the first conductor 21 and the second conductor 22 are arranged side by side. The second insulating sheet 220 covers the thermocouple 20 from the side opposite to the first insulating sheet 210. The detailed structure of the heat flux sensor 10 and the thermocouple sheet 200 will be described later.

The heat flow measurement device 1 can be used by being mounted on the surface 3 of the measurement target 2. In addition, in FIG. 2, the heat generation source 4 inside the measurement target 2 is revealed in a dotted pattern.

The wirings 31 and 32 respectively connected to the pads 124 and 125 at the ends of the rear wiring pattern 121 included in the heat flux sensor 10 are connected to the detection unit 30 through the inside of the tubular shielded wire 33. The wirings 34 and 35 respectively connected to the first conductor 21 and the second conductor 22 included in the thermocouple 20 are also connected to the detection unit 30 through the inside of the tubular shielded wire 33. Thereby, the output signal of the heat flux sensor 10 and the output signal of the thermocouple 20 are input to the detection section 30.

The detection unit 30 is composed of a microcomputer and its peripheral devices. The detection unit 30 is based on the output signal of the heat flux sensor 10 and the output signal of the thermocouple 20, and the heat generated by the heat generation source 4 inside the measurement object 2 is transmitted from the inside of the measurement object 2 to the surface 3 , The heat flow on the surface 3 can be measured. The detection unit 30 can calculate the amount of heat generated by the heat generating source 4 of the measurement object 2 based on the heat flow measured on the surface 3 of the measurement object 2.

The shielded wire 33 has a conductor for preventing invasion of electromagnetic waves from the outside. The conductor included in the shielded wire 33 is formed in a cylindrical shape so as to surround the wiring inside the shielded wire 33, and is electrically connected through the wiring 36 and the like. Next to the measurement object 2. The conductors of the shielded wire 33 are preferably connected to the ground 37. As a result, noise on the voltage signals output by the heat flux sensor 10 and the thermocouple 20 can be reduced.

In FIG. 3, an example of an output signal of the thermocouple 20 detected by the detection unit 30 is revealed in a solid line A mode, and an example of an output signal of the heat flux sensor 10 at this time is revealed in a solid line B mode.

In this example, the outside air temperature is set to gradually rise from time t0 to time t4, and gradually decrease from time t4 to time t8. The temperature of the detection unit 30 is almost constant from time t0 to time t8.

The temperature of the surface 3 of the measurement object 2 rises with an increase in the outside air temperature, and decreases with a decrease in the outside air temperature. Therefore, as shown by the solid line A, the output signal of the thermocouple 20 gradually rises from time t0 to time t4, and gradually decreases from time t4 to time t8.

On the other hand, the heat flux on the surface 3 of the measurement object 2 flows from the outside air side to the measurement object 2 as the outside air temperature rises, and flows from the measurement object 2 side as the outside air temperature decreases. To the outside air side. Therefore, as shown by the solid line B, the output signal of the heat flux sensor 10 gradually decreases from time t0 to time t4, and gradually rises from time t4 to time t8. That is, the output signal of the thermocouple 20 and the output signal of the heat flux sensor 10 show a reverse behavior with respect to the heat flow on the surface 3 of the measurement object 2 according to a change in the outside air temperature.

Here, it is assumed that heat is generated in the heat generation source 4 inside the measurement target 2 between time t1 and time t2 and between time t5 and time t6. At this time, the heat generated in the heat generating source 4 is removed from the inside of the measurement target 2. The part is transmitted to the surface 3 and a heat flow is generated on the surface 3. Therefore, between time t1 and time t2, both the output signal of the thermocouple 20 and the output signal of the heat flux sensor 10 rise. Between time t2 and time t3, the output signal of the thermocouple 20 and the heat flux The output signals of the sensors 10 all decrease. In addition, between time t5 and time t6, the output signal of the thermocouple 20 and the output signal of the heat flux sensor 10 both rise. Between time t6 and time t7, the output signal of the thermocouple 20 and the heat flux The output signals of the sensors 10 all decrease. That is, the output signal of the thermocouple 20 and the output signal of the heat flux sensor 10 indicate that the heat generated in the heat generation source 4 inside the measurement object 2 is propagated inside the measurement object 2 and the measurement object is The heat flow on the surface 3 of the object 2 moves in the same direction.

Therefore, the detection unit 30 compares the output signal of the heat flux sensor 10 with the output signal of the thermocouple 20 to remove the heat flow on the surface 3 of the measurement object 2 according to the change in the outside air temperature. The heat generated in the heat generation source 4 inside is measured only for the heat flow on the surface 3 of the measurement target 2.

Next, the structures of the heat flux sensor 10 and the thermocouple sheet 200 included in the heat flow measurement device 1 will be described.

As shown in FIGS. 4 and 5, the heat flux sensor 10 includes an insulating base material 100, a surface protective member 110, and a back protective member 120 integrated. Although the integration is performed, the first layer is internally integrated. The connection member 130 and the second inter-layer connection member 140 are alternately connected in series.

The insulating substrate 100 is made of a flexible thermoplastic resin film or a thermosetting resin film, and has a plate shape. For insulating substrates 100, a plurality of first through-holes 101 and a plurality of second through-holes 102 penetrating in the thickness direction are formed.

A first interlayer connection member 130 is embedded in the first through hole 101, and a second interlayer connection member 140 is embedded in the second through hole 102. That is, in the insulating base material 100, the 1st interlayer connection member 130 and the 2nd interlayer connection member 140 are arrange | positioned so that it may mutually overlap.

The first interlayer connection member 130 and the second interlayer connection member 140 are made of a thermoelectric material such as a metal or a semiconductor having different thermoelectric powers, so as to exert the Seebeck effect. For example, the first interlayer connection member 130 is made of a solid-phase sintered metal compound so that the powder constituting the P-type Bi-Sb-Te alloy powder maintains the crystal structure of the plurality of metal atoms before sintering. As another example, the second interlayer connection member 140 is made of a solid-phase sintered metal compound so that the powder of the N-type Bi-Te alloy is maintained and the crystalline structure of the plurality of metal atoms is maintained before sintering.

In addition, in FIG. 4, the first and second interlayer connection members 130 and 140 are hidden from view by a surface wiring pattern 111 described later. However, for convenience of explanation, the positions of the first and second interlayer connection members 130 and 140 are indicated by dashed lines, and hatching is applied thereto.

The surface protection member 110 covers the surface 100 a of the insulating base material 100. The surface protection member 110 is made of a flexible thermoplastic resin film or a thermosetting resin film. In addition, the surface protection member 110 is longer than the insulating base material 100 in one of the squares in the plane direction, and extends from the insulating base material 100 in one of the plane directions.

The surface protection member 110 faces the insulating base material 100 A plurality of patterned surface wiring patterns 111 such as copper foil are formed on the surface 110a side. In FIG. 4, the surface protection member 110 is assumed to be transparent or translucent, and the positions of the plurality of surface wiring patterns 111 are described by solid lines. The plurality of surface wiring patterns 111 are electrically connected to one end portion of the first interlayer connection member 130 and one end portion of the second interlayer connection member 140 adjacent thereto.

The back surface protection member 120 covers the back surface 100 b of the insulating base material 100. The back surface protection member 120 is made of a flexible thermoplastic resin film or a thermosetting resin film. In addition, the back surface protection member 120 is longer than the insulating base material 100 in one of the squares in the plane direction, and extends from the insulating base material 100 in one of the plane directions. In addition, the back surface protection member 120 extends longer than the surface protection member 110.

On the back protective member 120, a plurality of back wiring patterns 121 patterned, such as copper foil, are formed on the side 120a facing the insulating base material 100. The plurality of back wiring patterns 121 are electrically connected to the other end portion of the first interlayer connection member 130 and the other end portion of the second interlayer connection member 140 adjacent thereto.

The first interlayer connection member 130 and the second interlayer connection member 140 which are adjacent to each other are connected in such a manner that the front wiring pattern 111 and the rear wiring pattern 121 are alternately folded back. In this way, the first interlayer connection member 130 and the second interlayer connection member 140 are connected in series by the front wiring pattern 111 and the back wiring pattern 121.

In the rear wiring pattern 121, an extension wiring that becomes the end of the first interlayer connection member 130 and the second interlayer connection member 140 connected in series. 122 and 123 are provided at a position where the back surface protective member 120 extends in one of the plane directions than the insulating base material 100. Where the back protective member 120 extends longer than the front protective member 110, the extension wirings 122 and 123 of the back wiring pattern 121 are exposed to the outside air. The extension wirings 122 and 123 are exposed to the outside air, and are pad portions 124 and 125 that function as terminals for connecting the wirings.

When the heat flux sensor 10 generates a heat flux between one surface and the other surface in the thickness direction, one end of the first and second interlayer connection members 130 and 140 and the other end There will be a temperature difference between the parts. At this time, a thermoelectromotive force is generated in the first and second interlayer connection members 130 and 140 by the Seebeck effect. The heat flux sensor 10 outputs the thermoelectromotive force as a sensor signal (for example, a voltage signal).

Next, the structure of the thermocouple sheet 200 will be described.

The thermocouple sheet 200 has a structure in which the thermocouple 20, the first insulating sheet 210, and the second insulating sheet 220 are integrated. The thermocouple 20 is a first conductor 21 and a second conductor 22 made of metals with mutually different thermoelectric powers by welding or the like so as to exert the Seebeck effect. Where the first conductor 21 and the second conductor 22 are joined, the joining portion 23 is used to detect the temperature. The first conductor 21 and the second conductor 22 of the present embodiment are made of metal foil.

The first insulating sheet 210 is made of a flexible thermoplastic resin film or a thermosetting resin film, and has a plate shape. The first insulating sheet 210 covers the thermocouple 20 from one side of a direction crossing the direction in which the first conductor 21 and the second conductor 22 are juxtaposed. The second insulating sheet 220 covers the thermocouple 20 from the side opposite to the first insulating sheet 210. The first insulating sheet 210 is in the plane direction. One is formed to be longer than the second insulating sheet 220 and extends from the second insulating sheet 220 in one of the planar directions.

Where the first insulating sheet 210 extends longer than the second insulating sheet 220, the first conductor 21 and the second conductor 22 constituting the thermocouple 20 are exposed to the outside air. The first conductor 21 and the second conductor 22 are exposed to outside air, and have pad portions 24 and 25 that function as terminals for connecting wiring.

When the thermocouple 20 generates a temperature difference between the joint 23 and the detection unit 30, a thermoelectromotive force is generated at the joint 23 by the Seebeck effect. The thermocouple 20 outputs the thermoelectromotive force as a sensor signal (for example, a voltage signal).

The thermocouple sheet 200 is fixed to a position where the surface protective member 110 and the back protective member 120 extend from the insulating base material 100 in the planar direction. Here, the insulating base material 100 constituting the heat flux sensor 10 has a recessed portion 11 recessed from the side 12 on the thermocouple sheet 200 side to the interlayer connection members 130 and 140 side. The junction portion 23 of the thermocouple 20 included in the thermocouple sheet 200 is inserted into the recessed portion 11 of the insulating base material 100. Therefore, the distance between the first and second interlayer connection members 130 and 140 of the heat flux sensor 10 and the joint portion 23 of the thermocouple 20 is short.

In the present embodiment, the back surface protective member 120 is bent at the position extending from the insulating base material 100 in the plane direction, is bent toward the surface protective member 110 side, and is in close contact with the surface protective member 110. The thermocouple sheet 200 is fixed in a position where the surface protective member 110 and the back protective member 120 are in close contact, and is fixed to the back protective member 120 on the side opposite to the surface protective member 110. In this state, a plurality of interlayer connection members 130 and 140 are disposed on the heat flux sensor 10. The surface 120b on the opposite side of the back protective member 120 from the insulating base material 100 is aligned with the surface 200b on the opposite side of the back protective member 120 in the thermocouple sheet 200 where the junction portion 23 is disposed on the thermocouple sheet 200.

Furthermore, the "alignment of the two surfaces in this specification" in this specification includes a state of slight deviation due to manufacturing tolerances or changes over time, in addition to the state where the two surfaces are aligned on the same plane.

The thickness of the thermocouple sheet 200 is the same as, or thinner than, the thickness of the insulating substrate 100. Therefore, the heat flow measurement device 1 is a thickness T1 where the thermocouple sheet 200 is provided, and a thickness T2 where the heat flux sensor 10 is provided.

Next, a method for manufacturing the heat flow measurement device 1 will be described. It should be noted that this manufacturing method is one in which a plurality of heat flow measurement devices are manufactured simultaneously.

As shown in FIG. 6, the manufacturing method includes a thermocouple sheet formation process S10, a heat flux sensor component preparation process S20, a layered body formation process S30, and an integrated pressurization process S40.

First, in the manufacturing method of the heat flow measurement device 1, the thermocouple sheet formation process S10 is demonstrated. In the thermocouple sheet formation process S10, the thermocouple sheet 200 is formed by the thermocouple preparation process S11, the thermocouple laminate formation process S12, the pressurization process S13, and the cutting process S14 shown in FIG.

In the thermocouple preparation process S11, the first conductor 21 and the second conductor 22 composed of metal foils having different thermoelectric powers are prepared, and the front ends of the first conductor 21 and the second conductor 22 are welded to form a joint portion 23 by welding. Thereby, the thermocouple 20 is prepared.

Next, in the thermocouple layered body forming process S12, as shown in FIGS. 8 and 9, a first release paper 51 and a second insulating sheet 220 are arranged on a jig base 40 formed in a predetermined size. Furthermore, with respect to the jig base 40 from above, the end positioning jig 41 and the intermediate positioning jig 42 are fixed by screws 43. As the first release paper 51, for example, a thermosetting resin sheet or a thermoplastic resin sheet formed of a fluorene resin or the like is used. As the second insulating sheet 220, for example, a thermosetting resin sheet or a thermoplastic resin sheet formed of a fluorene resin having an adhesive layer on the front and back surfaces is used. Further, a plurality of groove portions 44 and 45 for positioning the thermocouple 20 are provided on the end positioning jig 41 and the middle positioning jig 42. A plurality of thermocouples 20 are disposed on the second insulating sheet 220 corresponding to the plurality of groove portions 44 and 45. Furthermore, the plurality of thermocouples 20 are arranged in a direction in which a plurality of groove portions 44 and 45 respectively provided on the end positioning fixture 41 and the middle positioning fixture 42 are arranged side by side, and the middle positioning fixture 42 is held so as to face each other.

Next, as shown in FIG. 10, the fixture base 40 is fixed to the fixture base 40 from the first release paper 51, the second insulating sheet 220, and the thermocouple 20 by screws 43. This prevents the position of the first release paper 51, the second insulating sheet 220, and the thermocouple 20 from deviating. Thereafter, the intermediate positioning jig 42 is removed from the jig base 40.

Next, as shown in FIG. 11, a first insulating sheet 210 is disposed on the first release paper 51, the second insulating sheet 220, and the thermocouple 20. Thereby, a laminated body of the thermocouple 20 is formed. As the first insulating sheet 210, for example, a thermosetting resin sheet or a thermoplastic resin sheet formed of a fluorene resin having an adhesive layer on the front and back surfaces is used.

Next, as shown in FIG. 12, the jig base 40 is set on The press machine 70 further includes a second release paper 52 and a first buffer material 61 on the first insulating sheet 210. As the second release paper 52, for example, a thermosetting resin sheet or a thermoplastic resin sheet made of a fluorene resin or the like is used. As the first buffer material 61, for example, Teflon (registered trademark) is used.

Next, in the pressurizing process S13, the laminated body of the thermocouple 20 is heated in the laminating direction by the press 70, and the first insulating sheet 210 and the thermocouple 20 and the second insulating sheet 220 are pressure-bonded. . The pressure of the press 70 at this time is, for example, 2 MPa or more, and the temperature is 300 ° C or more. Thereby, the adhesive layers of the first insulating sheet 210 and the second insulating sheet 220 are bonded to each other to form an integrated sheet 201 in a state shown in FIG. 13.

Next, in the cutting process S14, the integrated sheet 201 is cut at the positions shown by the dotted lines C1 to C4 in FIG. 13. Thereby, as shown in FIG. 14, a thermocouple sheet 200 formed into a predetermined mounting size is formed.

Next, in the manufacturing method of the heat flow measurement device 1, the heat flux sensor member preparation process S20 is demonstrated.

As shown in FIGS. 15 (A), (B), and (C), in the heat flux sensor member preparation process S20, an insulating base material 100, a surface wiring pattern 111, a surface protection member 110, and a back wiring pattern 121 are prepared. And the back protection member 120.

As shown in FIG. 15 (B), the insulating base material 100 is a plurality of conductive pastes 131 and 141 having different thermoelectric powers to form the heat flux sensor 10 and embedded in the plurality of through holes 101 and 102. The insulating base material 100 may be constituted by a plurality of layers, or may be constituted by a single layer.

An example of a method of manufacturing the insulating base material 100 will be described. first First, for the insulating base material 100, a plurality of first through holes 101 are formed by a drill, a laser, or the like. The plurality of first through holes 101 are filled with a first conductive paste 131 for forming a first interlayer connection member 130 by solid-phase sintering. In addition, as a method (apparatus) for filling the first conductive paste 131 in the first through-hole 101, the method (apparatus) described in Japanese Patent Application No. 2010-50356 of the applicant may be adopted.

To simplify the description, the insulating base material 100 is placed on a suction sheet (not shown) placed on a holding stand (not shown). Then, the first conductive paste 131 is filled in the first through hole 101 while the first conductive paste 131 is melted. As a result, most of the organic solvent of the first conductive paste 131 is adsorbed by the adsorption paper, and the powder of the alloy is closely arranged in the first through hole 101.

In addition, as the first conductive paste 131, an alloy solvent such as Bi-Sb-Te, which maintains a predetermined crystal structure of metal atoms, and an organic solvent such as paraffin oil are used for gelation.

Next, for the insulating base material 100, a plurality of second through holes 102 are formed by a drill, a laser, or the like. The plurality of second through holes 102 are formed so as to be located between two adjacent first through holes 101 in the plurality of first through holes 101. The plurality of second through holes 102 are filled with a second conductive paste 141 for forming the second interlayer connection member 140 by solid-phase sintering. The filling of the second conductive paste 141 can be performed by the filling method with the first conductive paste 131 described above.

In addition, as the second conductive paste 141, an alloy powder of Bi-Te which maintains a predetermined crystal structure with a metal atom different from the metal atoms constituting the first conductive paste 131 is added, and an organic solvent such as terpinene is used to add Line gelator. As the organic solvent of the second conductive paste 141, paraffin or the like may be used.

As shown in FIG. 15 (A), the surface wiring pattern 111 is connected to one end of one of the thickness directions of the insulating base material 100 of the plurality of conductive adhesives 131 and 141. The surface protective member 110 covers one surface in the thickness direction of the insulating base material 100 and the surface wiring pattern 111. The surface protection member 110 is longer in the plane direction than the insulating base material 100.

An example of a method of manufacturing the surface wiring pattern 111 and the surface protection member 110 will be described. First, a copper foil or the like is formed on at least the surface of the surface protective member 110 that faces the insulating base material 100. Then, the copper foil is appropriately patterned to form a surface wiring pattern 111 for the surface protective member 110.

As shown in FIG. 15 (C), the rear wiring pattern 121 is connected to the other end portions of the insulating substrate 100 in the thickness direction of the plurality of conductive adhesives 131 and 141. The back protective member 120 covers the other surface in the thickness direction of the insulating base material 100 and the back wiring pattern 121. The back surface protection member 120 is longer in the plane direction than the insulating base material 100 and the surface protection member 110.

An example of a method of manufacturing the back wiring pattern 121 and the back protective member 120 will be described. First, a copper foil or the like is formed on at least the surface of the back surface protective member 120 that faces the insulating base material 100. Then, the copper foil is appropriately patterned to form a back wiring pattern 121 for the back protective member 120.

Next, in the manufacturing method of the heat flow measurement device 1, The laminated body formation process S30 is demonstrated.

As shown in FIGS. 16 and 17, a third release paper 53 is placed on the lower pressure plate 71 of the press, and a thermocouple sheet 200 shown in FIG. 14 is placed thereon. Next, on the third release paper 53 disposed on the lower pressure plate 71 and the thermocouple sheet 200, a back protective member 120 on the back wiring pattern 121 is laminated to form. After that, an insulating base material 100 and a surface protection member 110 forming a surface wiring pattern 111 are sequentially laminated on the rear wiring pattern 121. Further, a fourth release paper 54 and a second cushioning material 62 are arranged on the surface protection member 110. Further, as the third and fourth release papers 53 and 54, for example, a thermosetting resin sheet or a thermoplastic resin sheet formed of a fluorene resin or the like is used. As the second buffer material 62, for example, Teflon is used.

Thereby, the thermocouple sheet 200 is located at a position where the surface protective member 110 and the back protective member 120 extend from the insulating base material 100 in the plane direction, and is disposed on the side of the back protective member 120 opposite to the surface protective member 110. At this time, it is assumed that at least the conductive adhesives 131 and 141 are arranged on the surface 120b of the back protective member 120 on the side opposite to the insulating base material 100 and the surface 200b of the thermocouple sheet 200 on the opposite side to the back protective member 120. At least the joints 23 are arranged in a state of being aligned. In addition, it is preferable that the entire surface of the surface 120b of the back protective member 120 on the side opposite to the insulating substrate 100 and the entire surface of the surface 200b of the thermocouple sheet 200 on the opposite side to the back protective member 120 be aligned. . In addition, the joint portion 23 of the thermocouple 20 included in the thermocouple sheet 200 enters the recessed portion 11 of the insulating base material 100, and the joint portion 23 and the conductive pastes 131 and 141 are arranged close to each other. In this way, a laminated body is formed.

In addition, in this manual, "Because", in addition to aligning the two on the same plane, it also includes a state of slight deviation due to manufacturing tolerances. In addition, the state of "the state where the entire surface is aligned and aligned" includes not only the state where the entire surface is aligned on the same plane, but also a state of slight deviation due to manufacturing tolerances.

Next, in the manufacturing method of the heat flow measurement device 1, the integrated pressurization process S40 is demonstrated. In the integrated pressurizing process S40, the laminated body disposed between the lower pressurizing plate 71 and the upper pressurizing plate 72 of the presser is heated while being pressurized in a lamination direction in a vacuum. The pressure of the press at this time is, for example, 10 MPa or more, and the temperature is 320 ° C or more. Accordingly, the plurality of first and second conductive pastes 131 and 141 embedded in the plurality of through holes 101 and 102 of the insulating base material 100 are solid-state sintered to form the plurality of first and second interlayer connection members 130 and 140. The first and second interlayer connection members 130 and 140 are electrically connected to the front wiring pattern 111 and the back wiring pattern 121. Furthermore, the insulating base material 100 and the front surface protection member 110, the back surface protection member 120, and the thermocouple sheet 200 are pressure-bonded. By this one-time integrated pressurizing process S40, the laminated body is integrated, and the heat flux sensor 10 and the thermocouple 20 are integrally formed.

The plurality of heat flow measurement devices manufactured by the above-described manufacturing method are divided into a single heat flow measurement device 1 in subsequent processes.

The heat flow measurement device 1 according to the first embodiment described above can exhibit the following effects.

(1) In the heat flow measurement device 1 of the first embodiment, the thermocouple sheet 200 is fixed to a position where the surface protective member 110 or the back protective member 120 extends from the insulating base material 100 in the plane direction.

As a result, the thickness of the heat flow measurement device 1 can be reduced compared to a structure in which the heat flux sensor 10 and the thermocouple 20 are stacked and arranged in the thickness direction. Therefore, when the heat flow measurement device 1 is mounted on the surface 3 of the measurement target 2, it is possible to suppress the air flow in the vicinity of the surface 3 of the measurement target 2. Therefore, the heat flow measurement device 1 can accurately detect the heat flow of the measurement object 2 based on the output signal of the heat flux sensor 10 and the output signal of the thermocouple 20 to reduce temperature drift caused by changes in the outside air temperature. .

In addition, by fixing the thermocouple sheet 200 at a position where the surface protective member 110 or the back protective member 120 extends from the insulating base material 100 in the plane direction, the heat flux sensor 10 and the thermocouple 20 can be disposed close to each other in the plane direction. position. Therefore, the heat flux sensor 10 and the thermocouple 20 respectively detect a heat flow and a temperature at almost the same position of the measurement target 2. Therefore, the signal of the thermocouple 20 and the signal of the heat flux sensor 10 correspond to each other. As a result, the heat flow measurement device 1 can reduce the influence of temperature drift according to the signal of the heat flux sensor 10.

(2) In the first embodiment, the surface 120b on the side opposite to the insulating substrate 100 of the back surface protective member 120 where the plurality of interlayer connection members 130 and 140 are arranged in the heat flux sensor 10 and the thermocouple sheet In the thermocouple sheet 200 where the joint portion 23 is arranged in 200, the surface 200b on the opposite side of the back surface protective member 120 is aligned.

Accordingly, when the heat flow measurement device 1 is mounted on the surface 3 of the measurement object 2, the junction portion 23 of the heat flux sensor 10 and the thermocouple 20 is brought close to the surface 3 of the measurement object 2, and the heat can be measured. Flux sensor 10 and heat The galvanic sheet 200 is in close contact with the surface 3 of the measurement target 2. Therefore, the heat flow measurement device 1 can accurately detect the heat flow characteristics of the measurement object 2 based on the output signal of the heat flux sensor 10 and the output signal of the thermocouple 20.

(3) In the first embodiment, the thickness T1 where the thermocouple sheet is provided is within a range of the thickness T2 where the heat flux sensor 10 is provided.

Accordingly, the thickness of the heat flow measurement device 1 can be reduced within the range of the thickness T2 of the heat flux sensor 10. Therefore, when the heat flow measurement device 1 is mounted on the surface 3 of the measurement target 2, it is possible to suppress the air flow in the vicinity of the surface 3 of the measurement target 2.

(4) In the first embodiment, the joint portion 23 of the thermocouple 20 included in the thermocouple sheet 200 is inserted into the recessed portion 11 of the insulating base material 100.

According to this, the heat flow measurement device 1 can measure the heat flow and the temperature of the measurement object 2 at almost the same place by making the distance between the interlayer connection members 130 and 140 of the heat flux sensor 10 and the joint 23 of the thermocouple 20 close. temperature. Therefore, the heat flow measurement device 1 can accurately detect the heat flow characteristics of the measurement object 2 based on the output signal of the heat flux sensor 10 and the output signal of the thermocouple 20.

The manufacturing method of the heat flow measurement device 1 of the first embodiment can exhibit the following effects.

(5) In the manufacturing method of the heat flow measurement device 1 according to the first embodiment, the rear surface protective member 110 and the rear surface protective member 120 extend from the insulating base material 100 in the surface direction to the rear surface protective member 120. A thermocouple sheet 200 is disposed on the side opposite to the surface protection member 110 to form a laminate, and the laminate is heated while being pressed in the laminate direction. At this time, the solid-state sintered conductive pastes 131 and 141 are used as the interlayer connection members 130 and 140. Furthermore, the interlayer connection members 130 and 140 are electrically connected to the surface wiring pattern 111 and the back wiring pattern 121, and the insulating base material 100 and the surface protection member 110, the back protection member 120, and the thermocouple sheet 200 are crimped. Thereby, the heat flux sensor 10 and the thermocouple 20 are integrally formed.

Accordingly, the thickness of the heat flux sensor 10 included in the heat flow measurement device 1 can be made the same as the thickness of the thermocouple sheet 200 and the thickness of the heat flow measurement device 1 can be reduced. Therefore, when the heat flow measurement device 1 is mounted on the surface 3 of the measurement target 2, it is possible to suppress the air flow in the vicinity of the surface 3 of the measurement target 2. Therefore, the heat flow measurement device 1 can accurately detect the heat flow of the measurement object 2 based on the output signal of the heat flux sensor 10 and the output signal of the thermocouple 20 to reduce temperature drift caused by changes in the outside air temperature. .

In addition, according to this manufacturing method, the heat-flow measurement device 1 can be formed by performing a single pressurization process on the insulating base material 100, the surface protective member 110, the back protective member 120, the thermocouple sheet 200, and the like. Therefore, it is possible to suppress the occurrence of wrinkles, gaps, and the like in members such as the insulating base material 100, the surface protective member 110, the back protective member 120, and the thermocouple sheet 200.

(6) In the manufacturing method of the first embodiment, when the laminated body is subjected to the integrated pressurizing process S40, at least a conductive adhesive is arranged on the surface 120b of the back protective member 120 on the side opposite to the insulating base material 100. 131 and 141 are opposite to the thermocouple sheet 200 and the back protection member 120 The side surface 200b is in a state where at least the joint portion 23 is arranged in a consistent manner.

According to this, when the heat flow measuring device 1 is mounted on the surface 3 of the measurement object 2, the joint portion 23 of the heat flux sensor 10 and the thermocouple 20 is brought close to the surface 3 of the measurement object 2, and the heat can be obtained. The flux sensor 10 and the thermocouple sheet 200 are in close contact with the surface 3 of the measurement object 2. Therefore, the heat flow measurement device 1 can accurately detect the heat flow characteristics of the measurement object 2 based on the output signal of the heat flux sensor 10 and the output signal of the thermocouple 20.

(7) In the manufacturing method of the first embodiment, when the laminated body formation process S30 is performed, the joint portion 23 of the thermocouple 20 included in the thermocouple sheet 200 is caused to enter the recessed portion 11 included in the insulating base material 100.

Accordingly, the heat flow measurement device 1 can measure the heat flow and temperature of the measurement object 2 at almost the same position because the distances between the interlayer connection members 130 and 140 of the heat flux sensor 10 and the junction portion 23 of the thermocouple 20 are close. . Therefore, the heat flow measurement device 1 can accurately detect the heat flow characteristics of the measurement object 2 based on the output signal of the heat flux sensor 10 and the output signal of the thermocouple 20.

(8) In the manufacturing method of the first embodiment, in the thermocouple sheet formation process S10, the first insulating sheet 210 is arranged on one side of the thermocouple 20 and the second insulating sheet 220 is arranged on the other side. The laminated body of the thermocouple 20 is heated while being pressed in the laminating direction, and the first insulating sheet 210 and the thermocouple 20 and the second insulating sheet 220 are crimped together.

Accordingly, even in the case where a thinner one is used as the thermocouple 20, this process can be easily performed. Therefore, it is arrange | positioned at the position which the surface protection member 110 or the back surface protection member 120 extended from the insulating base material 100 to the surface direction. In the case of the thermocouple sheet 200, the positioning of the thermocouple 200 of the heat flux sensor 10 can be performed accurately and easily.

(Second Embodiment)

A second embodiment of the present invention will be described. The second embodiment is different from the first embodiment in that the arrangement of the thermocouple sheet 200 is the same as that of the first embodiment, so only the parts different from the first embodiment will be described.

As shown in FIG. 18 and FIG. 19, the thermocouple sheet 200 constituting the heat flow measurement device 1 of the second embodiment is located at a position where the surface protective member 110 and the back protective member 120 extend from the insulating base material 100 in the plane direction, It is fixed between the front surface protection member 110 and the back surface protection member 120. In this state, the surface 120 b on the side opposite to the insulating base material 100 of the back protective member 120 where the plurality of interlayer connection members 130 and 140 are disposed on the heat flux sensor 10, and the joint portion 23 is disposed on the thermocouple sheet 200. In the thermocouple sheet 200, the surface 120 b on the opposite side of the back protective member 120 is aligned.

In addition, a short-circuit prevention insulating sheet 230 is provided between the thermocouple sheet 200 and the back surface protective member 120. The short-circuit prevention insulating sheet 230 prevents the pad portions 24 and 25 of the thermocouple 20 included in the thermocouple sheet 200 from short-circuiting with the pad portions 124 and 125 of the back wiring pattern 121 exposed from the second insulating sheet 220 included in the thermocouple sheet 200. Situation.

The thickness of the thermocouple sheet 200 and the short-circuit-proof insulating sheet 230 is the same as or less than the thickness of the insulating base material 100. Therefore, the heat flow measuring device 1 is a thickness T1 where the thermocouple sheet 200 is provided. Within the thickness T2 where the heat flux sensor 10 is provided.

Next, a method for manufacturing the heat flow measurement device 1 according to the second embodiment will be described.

The manufacturing method of the second embodiment is also the same as the first embodiment, and includes a thermocouple sheet formation process S10, a heat flux sensor component preparation process S20, a layered body formation process S30, and an integrated pressurization process S40. The thermocouple sheet formation process S10 and the heat flux sensor component preparation process S20 and the integrated pressurization process S40 are the same processes as those described in the first embodiment.

In the layered body forming process S30 of the second embodiment, as shown in FIG. 20, the rear surface of the rear wiring pattern 121 is formed on the third release paper 53 disposed on the lower pressure plate 71 of the press. Protection member 120. An insulating substrate 100 and a thermocouple sheet 200 are arranged side by side on the back protection member 120, a surface protection member 110 forming a surface wiring pattern 111 is disposed thereon, and a fourth release paper 54 and a second cushioning material 62 are disposed thereon .

As a result, the thermocouple sheet 200 is disposed between the surface protection member 110 and the back surface protection member 120 in a position where the surface protection member 110 and the back surface protection member 120 extend from the insulating base material 100 in the plane direction. At this time, it is assumed that at least the conductive adhesives 131 and 141 are arranged on the surface 120b of the back protective member 120 on the side opposite to the insulating substrate 100, and the surface 120b of the back protective member 120 on the opposite side to the thermocouple sheet 200 Where at least the joint portion 23 is arranged, the alignment is aligned with the state on almost the same plane. Furthermore, it is preferable that the entire surface of the surface 120b of the back protective member 120 on the side opposite to the insulating base material 100 and the entire surface of the back protective member 120 on the opposite side of the thermocouple sheet 200 be aligned. . 200 thermocouple pieces The joining portion 23 of the thermocouple 20 enters the recessed portion 11 of the insulating base material 100, and the joining portion 23 and the conductive pastes 131 and 141 are arranged close to each other. In this way, a laminated body is formed.

Next, in the integrated pressurizing process S40, the laminated body disposed between the lower pressurizing plate 71 and the upper pressurizing plate 72 of the press is heated in a vacuum while pressing in the laminating direction. Accordingly, the plurality of first and second conductive pastes 131 and 141 embedded in the plurality of through holes 101 and 102 of the insulating base material 100 are solid-state sintered to form the plurality of first and second interlayer connection members 130 and 140. The first and second interlayer connection members 130 and 140 are electrically connected to the front wiring pattern 111 and the back wiring pattern 121. Furthermore, the insulating base material 100 and the front surface protection member 110, the back surface protection member 120, and the thermocouple sheet 200 are pressure-bonded. By this one-time integrated pressurizing process S40, the laminated body is integrated, and the heat flux sensor 10 and the thermocouple 20 are integrally formed.

The heat flow measurement device 1 according to the second embodiment described above is a surface 120b on the opposite side of the back surface protection member 120 from the insulating base material 100 of the back surface protective member 120 where the plurality of interlayer connection members 130 and 140 are arranged in the heat flux sensor 10 and In the back surface protective member 120 where the junction portion 23 is disposed of the thermocouple sheet 200, the surface 120b on the opposite side of the thermocouple sheet 200 is aligned.

With this structure, it is possible to bring the junction portion 23 of the thermocouple 20 closer to the measurement, as compared with a structure in which the thermocouple 20 is stacked on the surface opposite to the measurement target 2 in the heat flux sensor 10 and installed. Surface 3 of the object 2. In addition, the heat flux sensor 10 and the thermocouple sheet 200 can be brought into close contact with the surface 3 of the measurement object 2. Therefore, the heat flow measuring device 1 can correctly determine the output signal of the heat flux sensor 10 and the output signal of the thermocouple 20 The heat flow characteristics of the measurement object 2 were detected.

(Third Embodiment)

A third embodiment of the present invention will be described. The third embodiment is different from the first embodiment in that the structure of the thermocouple 20 of the thermocouple sheet 200 is changed. The other structures are the same as those of the first and second embodiments, and therefore are different only from the first and second embodiments. Will be explained.

In FIG. 21, only the thermocouple 20 included in the thermocouple sheet 200 constituting the heat flow measurement device 1 is disclosed. The thermocouple 20 is a first conductor 21 and a second conductor 22 composed of metal foils having mutually different thermoelectric powers by welding or the like. Where the first conductor 21 and the second conductor 22 are joined, the joining portion 23 is used to detect the temperature. The first conductor 21 has a first pad portion 24 for wiring connection at an end portion on the side opposite to the joint portion 23. The second conductor 22 has a second pad portion 25 for wiring connection at an end portion on the side opposite to the joint portion 23. Here, the thermocouple 20 according to the third embodiment has a width W1 of the first conductor 21 other than the first pad portion 24, which is narrower than a width W2 of the first pad portion 24. The width W3 of the second conductor 22 other than the second pad portion 25 is narrower than the width W4 of the second pad portion 25. When the thermocouple 20 generates a temperature difference between the joint 23 and the detection unit 30, the thermoelectromotive force generated in the joint 23 by the Seebeck effect is output as a sensor signal.

In the third embodiment, the heat capacity of the first conductor 21 other than the first pad portion 24 and the heat capacity of the second conductor 22 other than the second pad portion 25 can be reduced by the aforementioned structure. Therefore, when a temperature difference occurs between the junction portion 23 and the detection portion 30 in the thermocouple 20, the heat transfer from the junction portion 23 is suppressed. To the first conductor 21 and the second conductor 22. Therefore, it is suppressed that the thermoelectromotive force generated in the joint portion 23 is reduced due to the heat transfer from the joint portion 23 to the first conductor 21 and the second conductor 22. Therefore, the thermocouple 20 can accurately detect the temperature of the joint portion 23.

Furthermore, even in the third embodiment, the thermocouple sheet 200 is formed by covering the thermocouple 20 from both sides with the first insulating sheet 210 and the second insulating sheet 220 in the same manner as in the first and second embodiments. Therefore, even in a situation where the width W1 of the first conductor 21 other than the first pad portion 24 and the width W3 of the second conductor 22 other than the second pad portion 25 are reduced, the thermocouple sheet can be easily performed. 200 processing. Therefore, when the thermocouple sheet 200 is disposed at a position where the surface protective member 110 or the back protective member 120 extends from the insulating base material 100 in the planar direction, the positioning of the thermocouple 200 of the heat flux sensor 10 can be performed accurately and easily.

(Fourth Embodiment)

A fourth embodiment of the present invention will be described. The fourth embodiment is also a modification of the structure of the thermocouple 20 included in the thermocouple sheet 200 compared to the first embodiment. The other structures are the same as those of the first and second embodiments, so they are only different from the first and second embodiments. Will be explained.

In FIG. 22, only the thermocouple 20 included in the thermocouple sheet 200 constituting the heat flow measurement device 1 is disclosed. The thermocouple 20 is a first conductor 21 and a second conductor 22 which are formed by welding linear members having mutually different thermoelectric powers by welding or the like. Where the first conductor 21 and the second conductor 22 are joined, the joining portion 23 is used to detect the temperature. The first conductor 21 is bonded to the first conductor 21 by welding or the like. A first pad 26 for wiring connection is attached to an end on the opposite side of the portion 23. In addition, a second pad 27 for wiring connection is attached to the second conductor 22 at an end opposite to the joint portion 23 by welding or the like. The width W5 of the first conductor 21 made of a linear member is narrower than the width W6 of the first pad 26. The width W7 of the second conductor 22 made of a linear member is narrower than the width W8 of the second pad 27. When the thermocouple 20 generates a temperature difference between the joint 23 and the detection unit 30, the thermoelectromotive force generated in the joint 23 by the Seebeck effect is output as a sensor signal.

In the fourth embodiment, the heat capacity of the first conductor 21 can be reduced and the heat capacity of the second conductor can be reduced by the aforementioned structure. Therefore, when a temperature difference occurs between the junction portion 23 and the detection portion 30 in the thermocouple 20, the heat of the junction portion 23 is suppressed from being transmitted to the first conductor 21 and the second conductor 22. Therefore, it is suppressed that the thermoelectromotive force generated in the joint portion 23 due to heat transfer from the joint portion 23 to the first conductor 21 and the second conductor 22 is reduced, so that the thermocouple 20 can accurately detect the temperature of the joint portion 23.

Furthermore, even in the fourth embodiment, the thermocouple sheet 200 is formed by covering the thermocouple 20 from both sides with the first insulating sheet 210 and the second insulating sheet 220 in the same manner as in the first to third embodiments. Therefore, even in a situation where the width W5 of the first conductor 21 and the width W7 of the second conductor 22 are reduced, the processing of the thermocouple sheet 200 can be easily performed. Therefore, when the thermocouple sheet 200 is disposed at a position where the surface protective member 110 or the back protective member 120 extends from the insulating base material 100 in the planar direction, the positioning of the thermocouple 200 of the heat flux sensor 10 can be performed accurately and easily.

(Other embodiments) The present invention is not limited to the aforementioned embodiments, and may be appropriately changed within the scope described in the patent application scope. In addition, the foregoing embodiments are not independent of each other, and may be appropriately combined except for the case where it is obviously impossible to combine. In addition, in each of the foregoing embodiments, of course, the elements constituting the embodiments are not necessarily necessary except for those in which the conditions are specifically stated to be necessary and the conditions which are necessary in principle. In addition, in each of the foregoing embodiments, when referring to numerical values such as the number, value, quantity, and range of the constituent elements of the embodiment, in addition to the situation where it is explicitly required, and the situation where the specific number is clearly limited in principle, etc Is not limited to a specific number. In addition, in each of the foregoing embodiments, the shape and positional relationship of the constituent elements and the like are not limited to the shape, position, etc., except for the state explicitly stated and the principle is limited to a specific shape, positional relationship, etc. Location relationship, etc.

For example, in the embodiment described above, the heat flow measurement device is installed on the surface of the measurement object and is used by the user. However, the heat flow measurement device may be embedded in the measurement object and used.

(to sum up)

According to the first aspect shown in part or all of the above-mentioned embodiment, a method for manufacturing a heat flow measuring device includes a process of forming a thermocouple sheet, and the thermoelectric thermocouple sheet has a connection having a different thermoelectric power. A thermocouple at a junction of the first conductor and the second conductor made of metal, a first insulating sheet covering the first conductor and the second conductor from one side in a direction crossing the direction in which the first conductor and the second conductor are arranged side by side, And from the first insulating sheet A second insulating sheet covering the first conductor and the second conductor on the opposite side; an insulating base material in which a plurality of conductive glues having different thermoelectric powers are embedded in a plurality of through-holes to form a heat flux sensor, and a plurality of conductive materials are prepared. A surface wiring pattern connecting the ends of one of the thickness directions of the insulating base material to each other, a surface protection member covering one surface of the insulating base material in the thickness direction and the surface wiring pattern, and the insulating base of a plurality of conductive adhesives The back wiring pattern connecting the other ends in the thickness direction of the material and the back surface protecting member covering the other surface in the thickness direction of the insulating substrate and the back wiring pattern; In the position where the insulating base material extends in the surface direction, a thermocouple sheet is arranged on the opposite side of the back protection member from the surface protection member, or a thermocouple sheet is disposed between the surface protection member and the back protection member to form a laminate. ; And heating the laminate while pressing it in the direction of lamination, solid-state sintering a plurality of conductive adhesives embedded in a plurality of through holes of an insulating substrate, As a plurality of electrical conductors, the electrical conductors are electrically connected to the surface wiring pattern and the back wiring pattern, and the insulation substrate and the surface protection member, the back protection member and the thermocouple sheet are pressure-bonded to form a heat flux sensor and a thermoelectric body integrally. Even works.

According to the second aspect, the thermocouple sheet is disposed at a position where the surface protective member and the back protective member extend from the insulating base material in a plane direction, and is disposed on the opposite side of the back protective member from the surface protective member. When a heat flux sensor and a thermocouple are integrally formed by heating the laminated body while pressing it in the lamination direction, it is assumed that the back surface protective member is provided with conductivity on a surface opposite to the insulating substrate. The glued portion is in a state of being aligned with the portion where the joint portion is arranged on the surface of the thermocouple sheet opposite to the back surface protection member.

According to this, when the heat flow measuring device is mounted on the surface of a measurement object, the junction between the heat flux sensor and the thermocouple is brought close to the surface of the measurement object, and the heat flux sensor and the thermocouple can be made close to each other. The sheet is in close contact with the surface of the measurement object. Therefore, the heat flow measurement device can accurately detect the heat flow characteristics of the measurement object based on the output signal of the heat flux sensor and the output signal of the thermocouple.

According to a third aspect, the thermocouple sheet is disposed between the surface protection member and the back surface protection member in a position where the surface protection member and the back surface protection member extend from the insulating substrate in a plane direction. When forming a heat flux sensor and a thermocouple sheet integrally while heating the laminated body while pressing it in the lamination direction, it is assumed that the back protective member is arranged to conduct electricity on the surface opposite to the insulating substrate The position of the adhesive is aligned with the position where the joint is arranged on the surface of the back protective member on the side opposite to the thermocouple sheet.

The heat flow measuring device manufactured by this manufacturing method can also make the junction portion of the thermocouple closer to the structure in which a thermocouple is stacked and installed on the surface opposite to the measurement object in the heat flux sensor. Measure the surface of the object. In addition, the heat flux sensor and the thermocouple sheet can be brought into close contact with the surface of the measurement object. Therefore, the heat flow measurement device can accurately detect the heat flow characteristics of the measurement object based on the output signal of the heat flux sensor and the output signal of the thermocouple.

According to a fourth aspect, the insulating base material has a recessed portion that is recessed from the edge of the thermocouple sheet side toward the conductor side. The thermocouple sheet is arranged at a position where the surface protection member and the back protection member extend from the insulating base material in the plane direction, so as to form a laminate, the junction portion of the thermocouple that the thermocouple sheet has, It enters the state of the recessed part which an insulating base material has.

Accordingly, since the distance between the interlayer connection member of the heat flux sensor and the junction of the thermocouple is close, the heat flow measurement device can measure the heat flow and temperature at almost the same point of the measurement object. Therefore, the heat flow measurement device can accurately detect the heat flow characteristics of the measurement object based on the output signal of the heat flux sensor and the output signal of the thermocouple.

According to a fifth aspect, a method of forming a thermocouple sheet includes a process of preparing a thermocouple for connecting a first conductor and a second conductor; and arranging a first side of a direction in which the first conductor and the second conductor cross each other. 1 insulating sheet, a process of arranging a second insulating sheet on the other side to form a thermocouple layered body; and heating the thermocouple layered body while pressing it in the lamination direction, and crimping the first insulating sheet and the thermocouple Works with 2nd insulation sheet.

According to this, even in the case where the thermocouple is narrowed, this process can be easily performed. Therefore, when the thermocouple sheet is disposed at a position where the surface protective member or the back protective member extends from the insulating substrate in the plane direction, the positioning of the thermocouple of the heat flux sensor can be performed accurately and easily.

According to a sixth aspect, the first conductor and the second conductor system of the thermocouple are made of metal foil. The first guide system has a first pad portion for wiring connection at an end portion opposite to the joint portion. The second guide system has a second pad portion for wiring connection at an end portion opposite to the joint portion. The width of the first conductor other than the first pad portion is narrower than the width of the first pad portion. The width of the second conductor other than the second pad portion is narrower than the width of the second pad portion.

Accordingly, the heat capacity of the first conductor other than the first pad portion is reduced, and the heat capacity of the second conductor other than the second pad portion is reduced. Therefore, suppress the connection The heat of the junction is transmitted to the first conductor and the second conductor. Therefore, the thermocouple can accurately detect the temperature of the joint.

According to a seventh aspect, the first conductor and the second conductor system of the thermocouple are composed of linear members. A first pad for wiring connection is attached to the first conductor at an end on the side opposite to the joint. A second pad for wiring connection is attached to the end of the second conductor on the side opposite to the joint.

As a result, the heat capacity of the first conductor and the second conductor becomes small, so that the state where the heat of the joint portion is transmitted to the first conductor and the second conductor is suppressed. Therefore, the thermocouple can accurately detect the temperature of the joint.

Claims (10)

A method for manufacturing a heat flow measuring device, comprising a process (S10) of forming a thermocouple sheet (200), the thermocouple sheet (200) having a first conductor connected to a metal composed of metals having different thermoelectric power ( 21) The thermocouple (20) of the junction (23) with the second conductor (22), covers the first conductor and the first conductor from one side in a direction crossing the direction in which the first conductor and the second conductor are juxtaposed. A two-conductor first insulating sheet (210) and a second insulating sheet (220) covering the first conductor and the second conductor from a side opposite to the first insulating sheet; and a heat flux sensor ( 10) A plurality of conductive adhesives (131, 141) having different thermoelectric powers are buried in the insulating base material (100) of the plurality of through holes (101, 102), and the thickness direction of the aforementioned insulating base material of the plurality of conductive adhesives One of the surface wiring patterns (111) whose ends are connected to each other, one surface (100a) covering the thickness direction of the insulating base material, a surface protection member (110) of the surface wiring pattern, and a plurality of conductive adhesives. A rear surface connecting the other ends in the thickness direction of the insulating substrate A pattern (121) and a process (S20) covering the other surface (100b) in the thickness direction of the insulating base material and the back protection member (120) of the back wiring pattern; the surface protection member and the back protection member In a position extending from the insulating base material in a plane direction, the thermocouple sheet is disposed on the opposite side of the back protective member from the surface protective member, or the thermocouple sheet is disposed between the surface protective member and the back protective member. , The step of forming a laminated body (S30); and heating the laminated body while pressing it in the laminating direction, and solid-state sintering the plurality of conductive pastes embedded in the plurality of through-holes of the insulating base material as the A plurality of conductors (130, 140), and electrically connecting the conductors with the surface wiring pattern and the back wiring pattern, and crimping the insulating substrate with the surface protection member, the back protection member, and the thermocouple sheet, A process of integrally forming the aforementioned heat flux sensor and the aforementioned thermocouple (S40). The method for manufacturing a heat flow measurement device according to item 1 of the scope of patent application, wherein, when the laminate is formed, the surface protection member and the back surface protection member extend from the insulating base material in a plane direction to The thermocouple sheet is disposed on the opposite side of the back surface protection member from the surface protection member; when the laminated body is heated while being pressed in the lamination direction to integrally form the heat flux sensor and the thermocouple, It is assumed that the conductive adhesive is arranged on the surface (120b) on the side opposite to the insulating base material of the back protective member, and on the surface (200b) on the side opposite to the back protective member of the thermocouple sheet. The state where the aforementioned joints are aligned is arranged. The manufacturing method of the heat flow measurement device as described in the scope of patent application item 1, wherein: When the laminated body is formed, the thermocouple sheet is disposed between the surface protective member and the back protective member in a position where the surface protective member and the back protective member extend from the insulating substrate in a planar direction; When the laminated body is heated while being pressed in the laminating direction to integrally form the heat flux sensor and the thermocouple, the back protective member is positioned on a surface opposite to the insulating base material. The position where the conductive adhesive is disposed is aligned with the position where the bonding portion is disposed on the surface of the back surface protective member on the side opposite to the thermocouple sheet. The method for manufacturing a heat flow measurement device according to any one of claims 1 to 3, wherein the insulating base material is prepared to have a side (12) from the thermocouple sheet side to the conductor side. A recessed portion (11); the thermocouple sheet is disposed at a position where the surface protection member and the back surface protection member extend from the insulating base material in a plane direction, and when the laminate is formed, the thermocouple sheet is formed The joint portion of the thermocouple is brought into a state of the recess portion of the insulating base material. The method for manufacturing a heat flow measuring device according to any one of claims 1 to 3, wherein forming the thermocouple sheet includes preparing a device having a connection between the first conductor and the second conductor. Engineering of the aforementioned thermocouple of the aforementioned joint (S11); The process of forming a thermocouple laminate on one side of the direction where the first conductor and the second conductor intersect side by side, and arranging the second insulation sheet on the other side to form a thermocouple laminate (S12) ; And a process of pressing the thermocouple layered body in a lamination direction while heating, and crimping the first insulating sheet, the thermocouple, and the second insulating sheet (S13). The method for manufacturing a heat flow measuring device according to item 4 of the scope of patent application, wherein forming the thermocouple sheet includes preparing the thermocouple having the junction portion connecting the first conductor and the second conductor. Process (S11); arranging the first insulating sheet on one side of a direction in which the first conductor and the second conductor are arranged side by side, and arranging the second insulating sheet on the other side to form a thermocouple laminate A process (S12); and a process in which the thermocouple layered body is heated in the lamination direction while being pressed, and the first insulating sheet and the thermocouple and the second insulating sheet are crimped together (S13). The method for manufacturing a heat flow measuring device according to any one of claims 1 to 3, wherein in forming the thermocouple sheet, the first conductor and the second conductor of the thermocouple are A metal foil is to be prepared; the first conductor is provided at an end portion on the side opposite to the joint portion. The first pad portion (24) for wiring connection; the second conductor is a second pad portion (25) for wiring connection at an end opposite to the joint portion; The width of the first conductor is narrower than the width of the first pad portion, and the width of the second conductor other than the second pad portion is narrower than the width of the second pad portion. The method for manufacturing a heat flow measuring device according to item 4 of the scope of the patent application, wherein in forming the thermocouple sheet, the first conductor and the second conductor of the thermocouple are prepared by metal foil; The first conductor is provided with a first pad portion (24) for wiring connection at an end portion opposite to the joint portion, and the second conductor is provided with a wiring connection at an end portion opposite to the joint portion. The second pad portion (25); the width of the first conductor other than the first pad portion is narrower than the width of the first pad portion; the width of the second conductor except the second pad portion Is narrower than the width of the second pad portion. The method for manufacturing a heat flow measuring device according to any one of claims 1 to 3, wherein in forming the thermocouple sheet, the first conductor of the thermocouple is formed. The second conductor is prepared by a linear member. The first conductor is provided with a first pad (26) for wiring connection at an end opposite to the joint portion. The second conductor is provided on the second conductor. A second pad (27) for wiring connection is attached to an end portion on the side opposite to the joint portion. The method for manufacturing a heat flow measuring device according to item 4 of the scope of patent application, wherein in forming the thermocouple sheet, the first conductor and the second conductor of the thermocouple are prepared by a linear member. ; The first conductor is provided with a first pad (26) for wiring connection at an end opposite to the joint; and the second conductor is provided with a wiring connection at an end opposite to the joint. Used 2nd pad (27).