200847361 九、發明說明： 【發明所屬之技術領域】 本發明是關於電氣元件載板，特別是關於一整合 有被動元件之電氣元件載板及其製造方法。 【先前技術】 電氣元件載板廣泛應用於電子産品中，其用以承 載半導體等電氣元件並爲所述電氣元件提供電性連 接，如圖1所示現有之一電氣元件載板10，該電氣 元件載板10爲一印刷電路板（PCB)，該電氣元件載 板10内部整合有被動元件12，該被動元件12爲電 容、電感電阻等電氣元件。所述被動元件12被嵌置 於所述電氣元件載板10内部，並通過設置於該電氣 元件載板内部之電路電連接至該電氣元件載板之表 面，從而與外部電路及電氣元件相電連接。然而，於 該電氣元件載板10中被動元件12被嵌置於該電氣元 件載板10内部，製造工藝複雜，成本高；同時，無 法將一些具有較大之電阻值、電容值或電感值之被動 元件嵌置於所述電氣元件載板10内部，限制其使用 範圍。 【發明内容】 有鑒於此，有必要提供一種成本低且適用範圍廣 之電氣元件載板。 還有必要提供一種工藝簡單之製造所述電氣元 6 200847361 件載板之方法。 種黾氣元件載板，其包括： 一基體，該基體包括一基層及一導電層，所述基 層上開設有至少一凹槽，所述導電層形成於所述 基層開設有凹槽之一面； 至少一被動元件，該被動元件收容於所述凹槽 内， 填充材料，該填充材料填充於所述凹槽内，包覆 所述被動元件。 一種電氣元件載板之製造方法，其包括以下步 驟： 提供一基層，於所述基層上開設有至少一凹槽； 於所述基層上形成有凹槽之一面形成一導電層； 提供至少一被動元件，將被動元件置入所述基層 之凹槽中； 將一填充材料填充凹槽並將其内之被動元件包 覆。 相較於先前技術，所述電氣元件載板及其製造方 法中使用於基體之基層上設置凹槽，將被動元件設置 於該凹槽内，從而使得所述元件能够容易之整合至所 述基體中丨其結構簡單’製作容易，成本低廉"同時， 使得所述被動元件之測試與更換容易，提高了可靠 性；此外，所述被動元件可以是所需要之任咅大小及 形狀，所述凹槽對應所述被動元件而形成所需要之大 7 200847361 小及形狀’從而提兩了該電氣元件載板之適用範圍。 【實施方式】 請參閱圖2及圖3，本發明電氣元件載板1〇〇之 第一較佳實施例。該電氣元件載板100包括一基體 110、至少一被動元件12〇及填充材料130。 所述基體110爲一印刷電路板，其可以是業界所 使用之任何一種電路板，如酚醛樹脂覆銅箔板、環氧 樹脂覆銅羯板、玻璃佈-環氧樹脂覆銅箔板、聚酰亞 胺樹脂覆銅箔板、覆銅箔聚四氟乙婦玻璃佈層壓板、 陶瓷基板、氮氧化鋁基板（A1N)、碳化矽基板（sic)等 電路板。該基體110包括基層112、導電層114及防 焊層116，所述導電層114設置於所述基層112上， 所述防焊層116設置於所述導電層114上。所述導電 層114上设置由多個焊點114a，所述焊點114a暴露 於所述防焊層116之表面。 所述基體11〇上設置有一凹槽118，該凹槽118 貫穿防焊層116及導電層114形成於所述基層ι12 上，該凹槽118可以爲方形、圓形或者其他任意幾何 形狀’該凹槽118包括槽底113及槽壁115。優選地， 可於該凹槽118之槽底113及槽壁115上設置相互導 通之電路（圖未示），該電路與所述導電層114電性連 接，用以將收容於所述凹槽118内之被動元件12〇 與該基體110電性連接。 所述被動元件120收容於基體；u〇之凹槽118 8 200847361 内。優選地，將所述被動元件 電性連接。該被動元件12〇C基體no 子元件，其主要用於產生/節：：:電：及電… 干擾、過遽電流雜質等功能。此外，所述 部也可通過其他電性連接件(圖未示)與外 ; 件或者電路相電連接，如將所述被動元件 之二脚未示)朝凹槽118之開口方向設置，使 塊或者導電膠等電連接件將其與其他電氣元 二連接，從而縮㉟電連接距離，從而降低功耗减少 干擾。 所述填充材料130填充於所述收容有被動元件 120之凹槽118内，將被動元件12〇包覆。該填充材 料130可采用於常態下絕緣之凝膠、樹脂、高分子聚 合物等材料。 本貝施例中’采用於電氣元件載板1 〇〇之基體 11 〇上°又置凹槽118 ’將被動元件12 0收容於該凹槽 118内。於該被動元件ι2〇收容至該凹槽n8後，可 檢測其是否安裝到位，如果安裝到位則將填充材料 填充至所述凹槽118内用以保護被動元件12〇; 反之，則重新安裝所述被動元件12〇直至其被可靠之 設置於所述基體之凹槽118内，因此，被動元件12〇 之檢測容易且更換方便。同時，所述凹槽118之大小 及深度可隨被動元件12〇之大小而設置選擇不同之 規格，從而使其可適應於整合各種不同之被動元件 9 200847361 120至基體ι10内，從而提高其適用範圍。此外，該 種結構之電氣元件載板1〇〇只需於其基體11〇上開設 一凹槽118，將被動元件120收容於所述凹槽\ = 内’結構簡單，製造成本低。 本實施例電氣元件載板100之製造方法如下： 提供一基層112,於該基層112之一表面上開設 至少一凹槽118，·該凹槽Π8可以是所希望之任意形 狀，如矩形、圓形、橢圓形、菱形等形狀。 優選地，可於該凹槽118内佈設電路，並保證該 凹槽118内之電路通過該凹槽118之側壁延伸至所述 基層112之上表面上。 隨後，提供一導電層114，將導電層114設置於 所述基層112上設置有凹槽118之一面。優選地，將 其與所述凹槽118内之電路相電連接。其中，所述導 電層114可采用壓延方式形成於所述基層Μ]上。爲 保證該電氣兀件載板100於使用過程中導電層上相 鄰之電路，不發生搭焊之現象，可於該導電^ ιΐ4 之外部覆盍一層防焊層116，該防焊層116於焊接過 程中對液態焊錫不具有親和力，所述防焊層ιι6還將 導電層114除焊點114a之其他位置覆蓋，從而保證 114導電層不被過快之氧化。至此，便得到了所述電 氣元件載板100之基體110。 將至、被動元件120置入所述基體㈣基層 112之凹槽118中。優選地，將該被動元件12〇與佈 200847361 設於槽118内之電路相電連接。 試，該測試用於檢二“亥電氣元件載板_之測 路或者斷路之狀况可 試。光學測試采用掃描之方= 之方式測 100每-層之間之抑/式找出该電氣元件載板 氣連接，勺；A私 电子測試用於檢測所有之電 乱連接包括被動元件120之電氣連接。200847361 IX. Description of the Invention: [Technical Field] The present invention relates to an electrical component carrier, and more particularly to an electrical component carrier incorporating a passive component and a method of fabricating the same. [Prior Art] The electrical component carrier is widely used in electronic products for carrying electrical components such as semiconductors and providing electrical connection to the electrical components. As shown in FIG. 1, one of the existing electrical component carriers 10, the electrical The component carrier 10 is a printed circuit board (PCB). The electrical component carrier 10 is internally integrated with a passive component 12, which is an electrical component such as a capacitor or an inductor. The passive component 12 is embedded in the electrical component carrier 10 and electrically connected to the surface of the electrical component carrier through a circuit disposed inside the electrical component carrier to electrically connect the external circuit and the electrical component connection. However, in the electrical component carrier 10, the passive component 12 is embedded in the electrical component carrier 10, and the manufacturing process is complicated and costly; at the same time, some of the larger resistance values, capacitance values, or inductance values cannot be obtained. A passive component is embedded inside the electrical component carrier 10 to limit its range of use. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an electrical component carrier having a low cost and a wide range of applications. It is also necessary to provide a method of manufacturing the electrical component 6 200847361 carrier. a helium component carrier, comprising: a substrate, the substrate comprising a base layer and a conductive layer, the base layer is provided with at least one groove, and the conductive layer is formed on one side of the base layer with a groove; At least one passive component, the passive component is received in the recess, and a filling material is filled in the recess to cover the passive component. A manufacturing method of an electrical component carrier board, comprising the steps of: providing a base layer, wherein at least one groove is formed on the base layer; forming a conductive layer on one side of the groove formed on the base layer; providing at least one passive An element that places a passive component into a recess of the base layer; a fill material fills the recess and encloses the passive component therein. Compared with the prior art, the electrical component carrier and the manufacturing method thereof are provided with a groove on the base layer of the base body, and the passive component is disposed in the groove, so that the component can be easily integrated into the base body. The middle cymbal has a simple structure, which is easy to manufacture and low in cost, and at the same time, makes the testing and replacement of the passive component easy, and improves reliability; further, the passive component can be any required size and shape. The groove corresponds to the passive component to form the required large size and the shape of the electrical component carrier board. [Embodiment] Referring to Figures 2 and 3, a first preferred embodiment of the electrical component carrier board 1 of the present invention. The electrical component carrier 100 includes a substrate 110, at least one passive component 12A, and a filler material 130. The substrate 110 is a printed circuit board, which can be any kind of circuit board used in the industry, such as a phenolic resin copper clad plate, an epoxy resin coated copper plate, a glass cloth - an epoxy resin copper clad plate, a poly A circuit board such as an imide resin copper clad laminate, a copper clad polytetrafluoroethylene glass cloth laminate, a ceramic substrate, an aluminum oxynitride substrate (A1N), or a tantalum carbide substrate (sic). The substrate 110 includes a base layer 112, a conductive layer 114, and a solder resist layer 116. The conductive layer 114 is disposed on the base layer 112, and the solder resist layer 116 is disposed on the conductive layer 114. A plurality of solder joints 114a are disposed on the conductive layer 114, and the solder joints 114a are exposed on the surface of the solder resist layer 116. A groove 118 is formed on the base 11 , and the groove 118 is formed on the base layer ι12 through the solder resist layer 116 and the conductive layer 114 . The groove 118 may be square, circular or any other geometric shape. The groove 118 includes a groove bottom 113 and a groove wall 115. Preferably, a circuit (not shown) that is electrically connected to each other is disposed on the groove bottom 113 and the groove wall 115 of the groove 118. The circuit is electrically connected to the conductive layer 114 for receiving the groove. The passive component 12A in the 118 is electrically connected to the base 110. The passive component 120 is received in the base; the recess 117 8 200847361. Preferably, the passive components are electrically connected. The passive component 12 〇 C base no sub-component, which is mainly used to generate / section::: electricity: and electricity ... interference, excessive current impurities and other functions. In addition, the portion can also be electrically connected to the external component or circuit by other electrical connectors (not shown), such as the two legs of the passive component are not shown) toward the opening of the recess 118. Blocks or conductive adhesives and other electrical connectors connect them to other electrical components, thereby reducing the electrical connection distance, thereby reducing power consumption and reducing interference. The filling material 130 is filled in the recess 118 in which the passive component 120 is housed, and the passive component 12 is covered. The filler material 130 can be used as a material such as a gel, a resin, a polymer, or the like which is normally insulated. In the embodiment of the present invention, the passive element 120 is housed in the recess 118 by the base 11 of the electrical component carrier 1 and the recess 118'. After the passive component ι2 is received in the recess n8, it can be detected whether it is mounted in place, and if it is installed in place, a filling material is filled into the recess 118 to protect the passive component 12; otherwise, the device is reinstalled. The passive component 12 is described until it is securely disposed within the recess 118 of the substrate. Therefore, the passive component 12 is easily detected and easily replaced. At the same time, the size and depth of the groove 118 can be set differently according to the size of the passive component 12〇, so that it can be adapted to integrate various passive components 9 200847361 120 into the base ι10, thereby improving the application. range. In addition, the electrical component carrier 1 of the structure only needs to have a recess 118 formed in the base 11 ,, and the passive component 120 is received in the recess \ = inner </ /> structure is simple, and the manufacturing cost is low. The manufacturing method of the electrical component carrier 100 of the present embodiment is as follows: A base layer 112 is provided, and at least one groove 118 is formed on one surface of the base layer 112. The groove Π8 may be any desired shape, such as a rectangle or a circle. Shape, ellipse, diamond shape, etc. Preferably, circuitry is disposed within the recess 118 and the circuitry within the recess 118 extends through the sidewalls of the recess 118 to the upper surface of the base layer 112. Subsequently, a conductive layer 114 is provided, and the conductive layer 114 is disposed on the base layer 112 with one surface of the recess 118. Preferably, it is electrically coupled to circuitry within the recess 118. The conductive layer 114 may be formed on the base layer by calendering. In order to ensure that the electrical component carrier 100 is adjacent to the circuit on the conductive layer during use, no lap welding occurs, and a solder resist layer 116 may be coated on the outside of the conductive layer 4, and the solder resist layer 116 is There is no affinity for the liquid solder during the soldering process, and the solder resist layer ι6 also covers the conductive layer 114 at other locations except the solder joint 114a, thereby ensuring that the 114 conductive layer is not oxidized too quickly. Thus, the base 110 of the electric component carrier 100 is obtained. The passive component 120 is placed into the recess 118 of the base (12) base layer 112. Preferably, the passive component 12A is electrically coupled to the circuitry of the cloth 200847361 disposed within the slot 118. Test, this test is used to check the condition of the measurement or disconnection of the "Hai Electric component carrier board". The optical test uses the method of scanning the square = the method of measuring 100 per-layer to find the electrical The component carrier is gas-connected, and the scoop; A private electronic test is used to detect all electrical connections including the electrical connection of the passive component 120.
測試合格後，將填充材料130填充至所述凹枰 118内包覆被動元件12G，心保護被動元件120。曰 此外’可將填充材料130充滿所述凹槽118内，並使 其表面與所述基層112之表面共面。 該電氣元件載板1〇〇之製造過程令各個工藝步 驟簡單，容易實現。 請參閱圖4及圖5，本發明電氣元件載板之第二 較佳實施例，該電氣元件載板200與電氣元件載板 100相似，其中相同部分采用相同之標號，於此將不 再冗述。該電氣元件載板200與電氣元件載板1〇〇 之區別於： 所述設置於基層112上之凹槽118内設置有隔板 117，所述隔板117爲一由多塊平板縱橫交錯形成之 網格狀栅欄，該隔板117將所述凹槽118内之空間分 隔成多個相互隔離之容室118a，可將多個被動元件 120分別設置於所述容室U8a中。該隔板117之頂 面111與所述基層112之表面相平齊，所述導電層 11 200847361 114形成於所述基層112之表面及隔板117之頂面。 可以理解，所述隔板117也可以是和所述基層112 爲一整體結構。 傳統之載板爲了滿足多引脚電氣元件之安裝及 SMT工藝需求，將焊點U4a並采用陣列式排佈（bga)， 如此便可提供更多之焊點U4a供多具有陣列式引脚 之電氣元件快速之安裝。本實施例中采用於基層112 之凹槽118内設置一隔板117，該隔板117位於每個 相鄰之被動元件120之間。所述導電層114設置於所 述基層112之表面及隔板117之頂面m，從而使得 於基層112之凹槽118所於之位置處也可設置多個焊 點114a從而與設置於基層112之焊點114a列式排佈 之焊點’從而滿足多引脚電氣元件與SMT工藝之需 求。從而不僅將被動元件120整合於該電氣元件載板 内’同日守還可與傳統之載板一樣，可以將焊點設置成 陣列式’從而滿足多引脚元件安裝之需求，同時應用 於SMT之生産工藝，提高其生產效率。 本實施例電氣元件載板200之製造方法如下： 提供一基層112,於該基層112之一表面上開設 一凹槽118。優選地’於該凹槽118内佈設電路，並 保證該凹槽118内之電路通該凹槽Π8之侧壁延伸至 所述基層112之上表面上； 提供一隔板117,將隔板117設置於所述基層ιΐ2 之凹槽118内，所述隔板117將所述凹槽118分9成多 12 200847361 個容室118a ; 提七、導電層n4，所述導電層設置於所述基層 上開α又有凹槽118之表面及隔板η?之頂面m 上，優選地，將所述導電層114與所述凹槽ιΐ8内之 電路相電連接； /於所述導電層114、基層112及隔板Η?之頂面 上开^成防焊層1 1 6，至此，便得到了所述電氣元件載 板200之基體11〇。 提供多個被動元件120，將每一被動元件12〇分 別置入由隔板及凹槽118形成之容室118a内。優選 地將所述被動元件12〇與佈設於所述凹槽118内之電 路相電連接； 爲提南産品之良率，對該電氣元件載板2〇〇之測 试及測试方法采用與電氣元件載板1 〇〇之測試方法 相同。 測試合格後’將一填充材料130填充於凹槽118 内’並包覆所述被動元件12〇，並將所述隔板117與 所述基層112相粘接。 邊電氣元件載板200之製造過程中各個工藝步 驟簡單，容易實現。 可以理解，該製造方法中，所述隔板117也可以 是與所述基層112爲一體之結構。即，於基層112 上形成多個相互隔離之呈陣列式排佈之容室，所述每 一被動元件120分別位於每一容室内。其製造方法同 13 200847361 電氣元件載板200之製造方法相同。 此外，芩閱圖6所示，爲提高本發明電氣元件載 板之生産效率，提供一種多個電氣元件載板200批量 製造之方法，其包括一下步驟： 提么、整體結構之基層112，於該基層i i 2上開 a又夕個相互間隔一定距離之凹槽U 8 ; 提供夕個被動元件120，將所述被動元件12〇置 入所述凹槽118内； 將一填充材料將所述每一容置有被動元件12〇 之凹槽118填充； 隨後，米用壓延或電解之方法於所述基層112 上形成一導電層。 最後，裁切該基層112形成多個單一之之電氣元 件載板200，從而提高生產效率。 可以理解，本發明也可適用於多層電氣元件載板 之使用，請參閱圖7，本發明電氣元件載板之第三較 佳實施例，本實施例電氣元件載板3〇〇采用將類似於 電氣元件載板200及電氣元件載板1〇〇之基體 以其凹槽118相互背離之方式連接於一起，從而構成 一雙面結構之電氣元件載板3〇〇，該電氣元件載板 300上下表面之間之電連接可以通過設置於所述基 體110内之過孔119來實現。可以理解該電氣元件載 板300也可以是兩個電氣元件載板2〇〇或者兩個電氣 元件載板100以上述方式粘接於一起形成。 十 14 200847361 本貝把例’采用多層電氣元件載板，從而提高基 層112之表面利用率，提高電氣元件載板之承載能 力。 可以理解，本實施例中，還可於兩個基體110 之間添加一電磁屏蔽層。 知上所述，本發明符合發明專利要件，爰依法提 出專利申請。惟’以上所述者僅為本發明之較佳實施 ，，，本發明之範圍並不以上述實施方式為限，舉凡 I白本案技蟄之人士援依本發明之精神所作之等效 ;飾或變化，皆應涵蓋於以下中請專利範圍内。 【圖式簡單說明】 圖1係現有之-種電氣元件之剖視圖。 二；&'本$明電氣凡件載板第—較佳實施例之俯視 =;3係本&明電氣元件餘第—㈣實施例之剖視 Ξ;4係本發明電氣元件餘第二較佳實施例之俯視 圖5係本發明電裔 — 圖； _載板弟二較佳實施例之剖視 =係本發明多個 圖7係本發明雷名— 、不思圖， 圖。 …件餘第三㈣實施例之剖視 【主要元件符號說明】 15 200847361 (習知） 電氣元件載板 (本發明） 電氣元件載板 100、200 基層 焊點 凹槽 槽壁 填充材料 頂面 過孔 被動元件 12 基體 110 導電層 114 防焊層 116 槽底 113 被動元件 120 隔板 117 容室 118a 16After passing the test, the filling material 130 is filled into the recess 118 to cover the passive component 12G, and the passive element 120 is protected. Further, the filler material 130 may be filled in the recess 118 and its surface may be coplanar with the surface of the base layer 112. The manufacturing process of the electrical component carrier 1 is simple and easy to implement. Referring to FIG. 4 and FIG. 5, in a second preferred embodiment of the electrical component carrier of the present invention, the electrical component carrier 200 is similar to the electrical component carrier 100, wherein the same parts are given the same reference numerals, and no longer redundant. Said. The electrical component carrier 200 is different from the electrical component carrier 1 . The spacer 118 is disposed in the recess 118 disposed on the base layer 112. The spacer 117 is formed by a plurality of flat plates. The grid-like fence partitions the space in the recess 118 into a plurality of mutually isolated chambers 118a, and a plurality of passive components 120 are respectively disposed in the chamber U8a. The top surface 111 of the spacer 117 is flush with the surface of the base layer 112, and the conductive layer 11 200847361 114 is formed on the surface of the base layer 112 and the top surface of the spacer 117. It can be understood that the partition 117 may also be a unitary structure with the base layer 112. In order to meet the requirements of multi-pin electrical components installation and SMT process, the solder joint U4a is arranged in an array (bga), so that more solder joints U4a can be provided for the array pins. Quick installation of electrical components. In the present embodiment, a spacer 117 is disposed in the recess 118 of the base layer 112, and the spacer 117 is located between each adjacent passive component 120. The conductive layer 114 is disposed on the surface of the base layer 112 and the top surface m of the spacer 117, so that a plurality of solder joints 114a may be disposed at the position of the recess 118 of the base layer 112 to be disposed on the base layer 112. Solder joints 114a are arranged in a solder joint 'to meet the needs of multi-pin electrical components and SMT processes. Therefore, not only the passive component 120 is integrated into the carrier of the electrical component, but also the same as the conventional carrier board, the solder joints can be arranged in an array to meet the requirements of multi-pin component mounting, and applied to SMT. Production process to improve its production efficiency. The manufacturing method of the electrical component carrier 200 of the present embodiment is as follows: A base layer 112 is provided, and a recess 118 is formed on one surface of the base layer 112. Preferably, a circuit is disposed in the recess 118, and the circuit in the recess 118 is secured to the upper surface of the base layer 112 through the sidewall of the recess ;8; a spacer 117 is provided to provide the spacer 117 The conductive layer is disposed on the base layer. Preferably, the conductive layer 114 is electrically connected to the circuit in the recess ι 8; The solder resist layer 1 16 is opened on the top surface of the base layer 112 and the spacers. Thus, the base 11 of the electrical component carrier 200 is obtained. A plurality of passive components 120 are provided, with each passive component 12 being placed into a chamber 118a formed by a partition and a recess 118, respectively. Preferably, the passive component 12 is electrically connected to a circuit disposed in the recess 118; for the yield of the product, the test and test method of the electrical component carrier 2 is used The test method for the electrical component carrier 1 is the same. After passing the test, a filling material 130 is filled in the recess 118 and the passive element 12 is covered, and the spacer 117 is bonded to the base layer 112. The various process steps in the manufacturing process of the side electrical component carrier 200 are simple and easy to implement. It is to be understood that in the manufacturing method, the spacer 117 may be formed integrally with the base layer 112. That is, a plurality of mutually spaced apart arrays of chambers are formed on the base layer 112, and each of the passive components 120 is located in each of the chambers. The manufacturing method is the same as that of the 13 200847361 electrical component carrier 200. In addition, as shown in FIG. 6, in order to improve the production efficiency of the electrical component carrier of the present invention, a method for mass production of a plurality of electrical component carriers 200 is provided, which includes the following steps: The base layer ii 2 is opened with a groove U 8 spaced apart from each other by a distance; a passive component 120 is provided, and the passive component 12 is placed into the recess 118; Each of the recesses 118 in which the passive component 12 is received is filled; subsequently, a conductive layer is formed on the base layer 112 by calendering or electrolysis. Finally, the base layer 112 is cut to form a plurality of individual electrical component carriers 200, thereby increasing production efficiency. It can be understood that the present invention is also applicable to the use of a multi-layer electrical component carrier. Referring to FIG. 7, a third preferred embodiment of the electrical component carrier of the present invention, the electrical component carrier 3 of the present embodiment is similar to The bases of the electrical component carrier 200 and the electrical component carrier 1 are connected together with their recesses 118 facing away from each other to form a double-sided electrical component carrier 3, which is mounted on the upper and lower sides of the electrical component carrier 300 Electrical connection between the surfaces can be achieved by vias 119 disposed in the substrate 110. It is to be understood that the electrical component carrier 300 may be formed by bonding two electrical component carriers 2 or two electrical component carriers 100 together in the manner described above. 10 14 200847361 This example uses a multi-layer electrical component carrier to increase the surface utilization of the base layer 112 and improve the load carrying capacity of the electrical component carrier. It can be understood that, in this embodiment, an electromagnetic shielding layer can also be added between the two substrates 110. As described above, the present invention complies with the requirements of the invention patent, and proposes a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art of the present invention are equivalent to the spirit of the present invention; Or changes, should be covered in the scope of the following patents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of a prior art electrical component. II; & 'The present invention is the top view of the preferred embodiment of the present invention. FIG. 3 is a cross-sectional view of the embodiment of the present invention. FIG. 4 is a cross-sectional view of the embodiment; The top view of the preferred embodiment is shown in Fig. 5 of the present invention. Fig. 5 is a cross-sectional view of a preferred embodiment of the present invention. Fig. 7 is a cross-sectional view of the present invention. Section 3 (four) embodiment of the cross section [main component symbol description] 15 200847361 (conventional) electrical component carrier board (invention) electrical component carrier board 100, 200 base layer solder joint groove groove wall filling material top surface Hole Passive Element 12 Base 110 Conductive Layer 114 Solder Mask 116 Slot 113 Passive Element 120 Partition 117 Chamber 118a 16