TW201809020A - Curable composition, cured product production method, and cured product therefrom - Google Patents
Curable composition, cured product production method, and cured product therefrom Download PDFInfo
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- TW201809020A TW201809020A TW106110860A TW106110860A TW201809020A TW 201809020 A TW201809020 A TW 201809020A TW 106110860 A TW106110860 A TW 106110860A TW 106110860 A TW106110860 A TW 106110860A TW 201809020 A TW201809020 A TW 201809020A
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- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000876 trifluoromethoxy group Chemical group FC(F)(F)O* 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920006305 unsaturated polyester Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
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- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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Abstract
Description
本發明係有關硬化性組成物、硬化物之製造方法及其硬化物,詳細為有關硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。 The present invention relates to a curable composition, a method for producing a cured product, and a cured product thereof, and more specifically to a curable composition, a method for producing a cured product, and a cured product having a high glass transition temperature and excellent adhesion.
硬化性組成物係使用於油墨、塗料、各種塗覆劑、接著劑、光學構件等的領域。關於這種硬化性組成物之改良,有各種的報告。 The curable composition is used in the fields of inks, coatings, various coating agents, adhesives, and optical members. There have been various reports on the improvement of such hardenable compositions.
例如下述專利文獻1~4中提案含有陽離子聚合性成分及自由基聚合性成分之能量線硬化性組成物及其硬化物。具體而言,專利文獻1中,提案初期硬化性及接著性優異的偏光板用接著劑組成物。又,專利文獻2、3中,提案即使以透濕度低之樹脂薄膜作為保護膜時,光照射後,也能快速展現接著力,且經過一定時間後對於各種力,接著力為良好,耐久試驗後亦不發生問題,耐濕熱試驗結束後之接著力亦良好之低黏度的光硬化性接著劑。此外,專利文獻4中,提案含有不飽和脂環式環氧酯化合物可兼具高耐熱性或高折射率化與透明性的活性能量線聚合 性樹脂組成物。 For example, in the following Patent Documents 1 to 4, an energy ray-curable composition containing a cation polymerizable component and a radical polymerizable component and a cured product thereof are proposed. Specifically, Patent Document 1 proposes an adhesive composition for a polarizing plate having excellent initial hardenability and adhesion. Further, in Patent Documents 2 and 3, even when a resin film with low moisture permeability is used as a protective film, the adhesion force can be quickly exhibited after light irradiation, and after a certain period of time, various adhesion forces are good, and the durability test is good. No problem occurred afterwards, and the light-curing adhesive with low viscosity was also good in adhesion after the end of the moist-heat resistance test. In addition, Patent Document 4 proposes an active energy ray polymerization containing an unsaturated alicyclic epoxy ester compound that can have both high heat resistance, high refractive index, and transparency. Sexual resin composition.
專利文獻1:日本特開2014-105218號公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2014-105218
專利文獻2:日本特開2015-040283號公報 Patent Document 2: Japanese Patent Application Laid-Open No. 2015-040283
專利文獻3:日本特開2015-143352號公報 Patent Document 3: Japanese Patent Laid-Open No. 2015-143352
專利文獻4:日本特開2015-168757號公報 Patent Document 4: Japanese Patent Application Laid-Open No. 2015-168757
但是,即使為專利文獻1~4所提案之硬化性組成物,對於硬化性及密著性,亦有不一定能夠滿足的情況,現狀為期望能夠高度兼具硬化性及密著性之新穎的硬化性組成物。 However, even with the curable composition proposed in Patent Documents 1 to 4, there is a case where the curability and adhesion may not be satisfied. The current situation is to expect a novel, highly curable composition. Hardening composition.
因此,本發明之目的為提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法、及其硬化物。 Therefore, an object of the present invention is to provide a hardened composition having a high glass transition temperature and excellent adhesion, a method for producing a hardened product, and a hardened product thereof.
本發明者等人為了解決上述課題而精心探討的結果,發現若為具有特定組成之硬化性組成物時,即可克服上述課題,而完成本發明。 As a result of careful study by the present inventors in order to solve the above-mentioned problems, it has been found that if the curable composition has a specific composition, the above-mentioned problems can be overcome and the present invention has been completed.
亦即,本發明之硬化性組成物,其係含有:
陽離子聚合性成分(A)、陽離子聚合起始劑(B)、自由基聚合性成分(C)、自由基聚合起始劑(D)及選自由下述式(I)
本發明之硬化性組成物中,前述陽離子聚合性成分(A)為進一步含有脂環式環氧化合物(A3)為佳。又,本發明之硬化性組成物中,前述分子量200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物之環氧丙基化物(A1)中之多元醇為具有縮合環的多元醇為佳。此外,本發明之硬化性組成物中,前述聚合物(E)為由前述式(I)表示之單體及前述式(II)表示之單體所得的聚合物,前述式(I)中之X為碳原子數6~12之芳基,前述式(II)中之X’為碳原子數1~7之烷基,前述烷基經環氧基取代為佳。又,前述陽離子聚合性成分(A)為30~70質量份,前述陽離子聚合起始劑(B)為0.001~10質量份,前述自由基聚合性成分(C)為30~60質量份,前述自由基聚合起始劑(D)為1~10質量份,前述聚合物(E) 為1~20質量份,且前述陽離子聚合性成分(A)與前述自由基聚合性成分(C)與前述聚合物(E)之合計為100質量份為佳。 In the curable composition of the present invention, the cationically polymerizable component (A) preferably further contains an alicyclic epoxy compound (A3). In the curable composition of the present invention, the polyhydric alcohol in the glycidyl alcohol of the polyhydric alcohol having a molecular weight of 200 or more or the glycidyl oxide (A1) of the polyalkylene oxide adduct has a condensation A cyclic polyol is preferred. In the curable composition of the present invention, the polymer (E) is a polymer obtained from a monomer represented by the formula (I) and a monomer represented by the formula (II), and X is an aryl group having 6 to 12 carbon atoms, X 'in the formula (II) is an alkyl group having 1 to 7 carbon atoms, and the alkyl group is preferably substituted with an epoxy group. The cationically polymerizable component (A) is 30 to 70 parts by mass, the cationically polymerizable initiator (B) is 0.001 to 10 parts by mass, and the radically polymerizable component (C) is 30 to 60 parts by mass. The radical polymerization initiator (D) is 1 to 10 parts by mass, and the aforementioned polymer (E) It is preferably 1 to 20 parts by mass, and the total of the cationically polymerizable component (A), the radically polymerizable component (C), and the polymer (E) is preferably 100 parts by mass.
本發明之硬化物之製造方法,其係將活性能量線照射或加熱本發明之硬化性組成物者。 The method for producing a cured product of the present invention is one in which active energy rays are irradiated or heated to the curable composition of the present invention.
本發明之硬化物係本發明之硬化性組成物的硬化物。 The cured product of the present invention is a cured product of the curable composition of the present invention.
依據本發明時,可提供硬化物之玻璃轉移溫度高,密著性優異的硬化性組成物、硬化物之製造方法及其硬化物。本發明之硬化性組成物,特別是可用於接著劑。 According to the present invention, a hardened composition having a high glass transition temperature and excellent adhesion, a method for producing a hardened product, and a hardened product thereof can be provided. The curable composition of the present invention is particularly useful as an adhesive.
以下詳細說明本發明之硬化性組成物。 Hereinafter, the curable composition of the present invention will be described in detail.
本發明之硬化性組成物,其係含有:陽離子聚合性成分(A)、陽離子聚合起始劑(B)、自由基聚合性成分(C)、自由基聚合起始劑(D)及選自由下述式(I)表示之單體所得之聚合物、由下述式(II)表示之單體所得之聚合物、選自下述式(I)表示之單體之二種以上之單體所得之聚合物、選自下述式(II)表示之單體之二種以上之單體所得之聚合物、及選自下述式(I)表示之單體及下述式(II)表示之單體所得之聚合物所成群組之重量 平均分子量1,000~30,000的聚合物(E)。本發明之硬化性組成物中,陽離子聚合性成分(A)係以分子量200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物之環氧丙基化物(A1)及氧雜環丁烷化合物(A2)作為必須成分,自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)、或碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2)作為必須成分。 The curable composition of the present invention contains a cationically polymerizable component (A), a cation polymerization initiator (B), a radical polymerizable component (C), a radical polymerization initiator (D), and a component selected from the group consisting of A polymer obtained from a monomer represented by the following formula (I), a polymer obtained from a monomer represented by the following formula (II), two or more monomers selected from the monomers represented by the following formula (I) The polymer obtained, a polymer obtained from two or more monomers selected from the monomers represented by the following formula (II), and a polymer selected from the monomers represented by the following formula (I) and represented by the following formula (II) The weight of the group of polymers obtained from the monomers Polymer (E) with an average molecular weight of 1,000 to 30,000. In the curable composition of the present invention, the cationically polymerizable component (A) is an epoxypropylated product of a polyhydric alcohol having a molecular weight of 200 or more, or an epoxypropylated product (A1) of a polyhydric alcohol alkylene oxide adduct, and An oxetane compound (A2) is an essential component, and the radical polymerizable component (C) is acrylic acid having a compound (C1) having an epoxy group and an ethylenically unsaturated group, or an alcohol having 2 to 20 carbon atoms An ester or a methacrylate (C2) of an alcohol having 2 to 20 carbon atoms is an essential component.
在此,式(I)中,X為碳原子數1~7之烷基、碳原子數1~7之烷氧基、碳原子數6~12之芳基、碳原子數6~12之芳氧基或碳原子數6~10之脂環式烴基,或此等之基中的氫原子為經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群組之1種以上之基所取代者。 Here, in the formula (I), X is an alkyl group having 1 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, and an aromatic group having 6 to 12 carbon atoms. An oxygen group or an alicyclic hydrocarbon group having 6 to 10 carbon atoms, or a hydrogen atom in these groups is one or more selected from the group consisting of an epoxy group, an oxetanyl group, a hydroxyl group, and a carboxyl group. Replaced by the base.
在此,式(II)中,R1表示氫原子、甲基或鹵素原子,X’為碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基,或此等之基中的氫原子為經選 自由環氧基、氧雜環丁烷基、羥基及羧基所成群組之1種以上之基所取代者。 Here, in Formula (II), R 1 represents a hydrogen atom, a methyl group, or a halogen atom, and X ′ is an alkyl group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, or 6 to 10 carbon atoms. An alicyclic hydrocarbon group or a hydrogen atom in these groups is substituted with one or more types of groups selected from the group consisting of an epoxy group, an oxetanyl group, a hydroxyl group, and a carboxyl group.
本發明之硬化性組成物的陽離子聚合性成分(A)係藉由以能量線照射或加熱活性化的陽離子聚合起始劑,產生高分子化或交聯反應的化合物。可列舉環氧化合物、氧雜環丁烷化合物、乙烯醚化合物等。 The cationically polymerizable component (A) of the curable composition of the present invention is a compound that generates a polymerization or cross-linking reaction by activating or activating a cationic polymerization initiator with energy rays. Examples thereof include epoxy compounds, oxetane compounds, and vinyl ether compounds.
本發明之硬化性組成物的陽離子聚合性成分(A)係以分子量200以上之多元醇的環氧丙基化物或多元醇環氧烷加成物的環氧丙基化物(A1)及氧雜環丁烷化合物(A2)作為必須成分,但是也可使用其他的環氧化合物,例如脂環式環氧化合物(A3)及芳香族環氧化合物(A4)等。 The cationically polymerizable component (A) of the curable composition of the present invention is an epoxypropylate (A1) and an oxalate of a polyhydric alcohol or a polyhydric alcohol alkylene oxide adduct of a molecular weight of 200 or more. The cyclobutane compound (A2) is an essential component, but other epoxy compounds such as an alicyclic epoxy compound (A3) and an aromatic epoxy compound (A4) can also be used.
上述分子量200以上之多元醇之環氧丙基化物、或多元醇環氧烷加成物的環氧丙基化物(A1),可列舉將多元醇或多元醇環氧烷加成物進行環氧丙基化者,且環氧丙基化物的分子量為200以上。 Examples of the epoxy-propylated product of a polyhydric alcohol having a molecular weight of 200 or more or the epoxy-propylated product (A1) of a polyhydric alcohol alkylene oxide adduct include epoxy resins obtained by polyhydric alcohols or polyalkylene oxide adducts. Propylated, and the molecular weight of the epoxy propylate is 200 or more.
上述分子量200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物的環氧丙基化物(A1),可列舉1,4-丁二醇二環氧丙醚、1,6-己二醇二環氧丙醚、新戊二醇二環氧丙醚、丙三醇之三環氧丙醚、三羥甲基丙烷之三環氧丙醚、山梨醣醇之四環氧丙醚、二季戊四醇之六環氧丙醚、聚乙二醇之二環氧丙醚、聚丙二醇之二環氧丙醚、二環戊二烯二甲醇二環氧丙醚等之多元醇之環氧丙醚,及將1種或2種以上之環氧烷與丙二醇、三羥甲基丙 烷、丙三醇等之脂肪族多元醇進行加成所得之聚醚多元醇的聚環氧丙醚化物、脂肪族長鏈二元酸之二環氧丙酯。 Examples of the glycidyl alcohol of the polyol having a molecular weight of 200 or more, or the glycidyl oxide (A1) of the polyol alkylene oxide adduct include 1,4-butanediol diglycidyl ether, 1, 6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, triglycidyl ether of glycerol, triglycidyl ether of trimethylolpropane, tetraepoxy of sorbitol Propylene ether, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, dicyclopentadiene dimethanol diglycidyl ether, etc. Oxypropyl ether, and one or two or more alkylene oxides, propylene glycol, and trimethylolpropane A polyglycidyl etherate of a polyether polyol obtained by addition of an aliphatic polyhydric alcohol such as alkane and glycerol, and a dipropylene glycol of an aliphatic long-chain dibasic acid.
多元醇之環氧丙基化物、或多元醇環氧烷加成物之環氧丙基化物(A1),進一步可列舉脂肪族高級醇之單環氧丙醚或高級脂肪酸之環氧丙基酯、環氧化大豆油、環氧基硬脂酸辛酯、環氧基硬脂酸丁酯、環氧化大豆油、環氧化聚丁二烯等。 The glycidyl alcohol of a polyhydric alcohol or the glycidyl alcohol (A1) of an alkylene oxide adduct of a polyhydric alcohol may further include a monoglycidyl ether of an aliphatic higher alcohol or a glycidyl ester of a higher fatty acid. , Epoxidized soybean oil, octyl epoxy stearate, butyl epoxy stearate, epoxidized soybean oil, epoxidized polybutadiene, etc.
分子量200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物的環氧丙基化物(A1)係含有飽和縮合環者,可提高硬化物之硬化性及密著性,故較佳。 Glycidyl compounds of polyhydric alcohols having a molecular weight of 200 or more, or glycidyl epoxides (A1) of polyhydric alcohol alkylene oxide adducts contain saturated condensed rings, which can improve the hardenability and adhesion of the cured product. It is better.
上述分子量200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物的環氧丙基化物(A1)可使用市售品,可列舉例如DenacolEX-121、DenacolEX-171、DenacolEX-192、DenacolEX-211、DenacolEX-212、DenacolEX-313、DenacolEX-314、DenacolEX-321、DenacolEX-411、DenacolEX-421、DenacolEX-512、DenacolEX-521、DenacolEX-611、DenacolEX-612、DenacolEX-614、DenacolEX-622、DenacolEX-810、DenacolEX-811、DenacolEX-850、DenacolEX-851、DenacolEX-821、DenacolEX-830、DenacolEX-832、DenacolEX-841、DenacolEX-861、DenacolEX-911、DenacolEX-941、DenacolEX-920、DenacolEX-931(nagasechemtex(股)公司製);Epolite M-1230、Epolite 40E、Epolite100E、Epolite 200E、Epolite400E、 Epolite70P、Epolite200P、Epolite400P、Epolite1500NP、Epolite1600、Epolite80MF、Epolite100MF(共榮社化學(股)公司製)、ADEKA GLYCIROL ED-503、ADEKA GLYCIROL ED-503G、ADEKA GLYCIROL ED-506、ADEKA GLYCIROL ED-523T、ADEKA RESIN EP-4088S、ADEKA RESIN EP-4080E((股)ADEKA公司製)等。 Commercially available products can be used as the glycidyl epoxides of the above-mentioned polyhydric alcohols having a molecular weight of 200 or more, or the glycidyl epoxide adducts of polyols (A1), and examples include DenacolEX-121, DenacolEX-171, and DenacolEX. -192, DenacolEX-211, DenacolEX-212, DenacolEX-313, DenacolEX-314, DenacolEX-321, DenacolEX-411, DenacolEX-421, DenacolEX-512, DenacolEX-521, DenacolEX-611, DenacolEX-612, DenacolEX-614 , DenacolEX-622, DenacolEX-810, DenacolEX-811, DenacolEX-850, DenacolEX-851, DenacolEX-821, DenacolEX-830, DenacolEX-832, DenacolEX-841, DenacolEX-861, DenacolEX-911, DenacolEX-941, DenacolEX-911 -920, DenacolEX-931 (produced by nagasechemtex); Epolite M-1230, Epolite 40E, Epolite100E, Epolite 200E, Epolite400E, Epolite70P, Epolite200P, Epolite400P, Epolite1500NP, Epolite1600, Epolite80MF, Epolite100MF (Kyoeisha Chemical Co., Ltd.), ADEKA GLYCIROL ED-503, ADEKA GLYCIROL ED-503G, ADEKA GLYCIROL ED-506, ADEKA GLYCIROL RESIN EP-4088S, ADEKA RESIN EP-4080E ((share) made by ADEKA Corporation), etc.
上述氧雜環丁烷化合物(A2)可列舉3,7-雙(3-氧環丁基)-5-氧雜-壬烷、1,4-雙[(3-乙基-3-氧環丁基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧環丁基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧環丁基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧環丁基甲基)醚、三乙二醇雙(3-乙基-3-氧環丁基甲基)醚、四乙二醇雙(3-乙基-3-氧環丁基甲基)醚、1,4-雙(3-乙基-3-氧環丁基甲氧基)丁烷、1,6-雙(3-乙基-3-氧環丁基甲氧基)己烷等之二官能脂肪族氧雜環丁烷化合物、3-乙基-3-[(苯氧基)甲基]氧雜環丁烷、3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(2-乙基己氧基甲基)氧雜環丁烷、3-乙基-3-(羥基甲基)氧雜環丁烷、3-乙基-3-(氯甲基)氧雜環丁烷等之一官能氧雜環丁烷化合物等。此等可1種單獨使用或組合2種以上使用。上述氧雜環丁烷化合物(A2)之中,多官能性氧雜環丁烷化合物因硬化物之玻璃轉移溫度高,故較佳。 Examples of the oxetane compound (A2) include 3,7-bis (3-oxocyclobutyl) -5-oxa-nonane and 1,4-bis [(3-ethyl-3-oxo Butylmethoxy) methyl] benzene, 1,2-bis [(3-ethyl-3-oxocyclobutylmethoxy) methyl] ethane, 1,3-bis [(3-ethyl-3-oxy Cyclobutylmethoxy) methyl] propane, ethylene glycol bis (3-ethyl-3-oxocyclobutylmethyl) ether, triethylene glycol bis (3-ethyl-3-oxocyclobutylmethyl) ether, tetra Ethylene glycol bis (3-ethyl-3-oxocyclobutylmethyl) ether, 1,4-bis (3-ethyl-3-oxocyclobutylmethoxy) butane, 1,6-bis (3-ethyl Difunctional aliphatic oxetane compounds such as phenyl-3-oxocyclobutylmethoxy) hexane, 3-ethyl-3-[(phenoxy) methyl] oxetane, 3-ethyl 3- (hexyloxymethyl) oxetane, 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane, 3-ethyl-3- (hydroxyl A functional oxetane compound such as methyl) oxetane, 3-ethyl-3- (chloromethyl) oxetane, and the like. These can be used individually by 1 type or in combination of 2 or more types. Among the oxetane compounds (A2), the polyfunctional oxetane compound is preferred because the glass transition temperature of the cured product is high.
上述氧雜環丁烷化合物(A2)可使用市售品,可列舉例如2-羥基乙基乙烯醚、二乙二醇單乙烯醚、 4-羥基丁基乙烯醚(丸善石油化學(股)公司製);ARON OXETANE OXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211、OXT-212(東亞合成(股)公司製)、ETERNACOLL OXBP、OXTP(宇部興產(股)公司製)等。 As the oxetane compound (A2), a commercially available product can be used, and examples thereof include 2-hydroxyethyl vinyl ether, diethylene glycol monovinyl ether, 4-Hydroxybutyl vinyl ether (manufactured by Maruzan Petrochemical Co., Ltd.); ARON OXETANE OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (East Asia Synthetic (shares ), Etc.), ETERNACOLL OXBP, OXTP (made by Ube Kosan Co., Ltd.).
上述脂環式環氧化合物(A3)係指環氧乙烷環不經由鍵結基而直接鍵結於飽和環者。脂環式環氧化合物(A3)之具體例,可列舉藉由將具有至少1個脂環式環之多元醇的聚環氧丙醚化物或含有環己烯或環戊烯環之化合物以氧化劑進行環氧化所得的含有環己烯氧化物或環戊烯氧化物的化合物。可列舉例如3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯、6-甲基-3,4-環氧基環己基甲基-6-甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-3-甲基環己基甲基-3,4-環氧基-3-甲基環己烷羧酸酯、3,4-環氧基-5-甲基環己基甲基-3,4-環氧基-5-甲基環己烷羧酸酯、雙(3,4-環氧基環己基甲基)己二酸酯、3,4-環氧基-6-甲基環己烷羧酸酯、亞甲基雙(3,4-環氧基環己烷)、丙烷-2,2-二基-雙(3,4-環氧基環己烷)、2,2-雙(3,4-環氧基環己基)丙烷、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧基環己烷羧酸酯)、環氧基六氫鄰苯二甲酸二辛酯、環氧基六氫鄰苯二甲酸二-2-乙基己酯、1-環氧基乙基-3,4-環氧基環己烷、1,2-環氧基-2-環氧基乙基環己烷、α-蒎烯氧化物、檸檬烯二氧化物等。脂環式環氧化合物(A3)從提 高密著性的觀點,較佳為3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯或3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯。 The above-mentioned alicyclic epoxy compound (A3) refers to one in which an ethylene oxide ring is directly bonded to a saturated ring without a bonding group. Specific examples of the alicyclic epoxy compound (A3) include a polyoxypropylene etherate of a polyol having at least one alicyclic ring or a compound containing a cyclohexene or cyclopentene ring as an oxidizing agent. A compound containing cyclohexene oxide or cyclopentene oxide obtained by epoxidation. Examples thereof include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy Methyl-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3, 4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl -3,4-epoxy-5-methylcyclohexanecarboxylate, bis (3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-formyl Methylcyclohexanecarboxylate, methylenebis (3,4-epoxycyclohexane), propane-2,2-diyl-bis (3,4-epoxycyclohexane), 2, 2-bis (3,4-epoxycyclohexyl) propane, dicyclopentadiene diepoxide, ethylidene bis (3,4-epoxycyclohexanecarboxylate), epoxy hexa Dioctyl hydrophthalate, di-2-ethylhexyl hexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2- Epoxy-2-epoxyethylcyclohexane, α-pinene oxide, limonene dioxide, and the like. The alicyclic epoxy compound (A3) is extracted from From the viewpoint of high adhesion, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate or 3,4-epoxy-1-methylcyclohexyl- 3,4-epoxy-1-methylhexanecarboxylic acid ester.
上述脂環式環氧化合物(A3)可使用市售品,可列舉例如CELLOXID2021P、CELLOXID2081、CELLOXID2000、CELLOXID3000((股)DAICEL公司製)等。 A commercial item can be used for the said alicyclic epoxy compound (A3), For example, CELLOXID2021P, CELLOXID2081, CELLOXID2000, CELLOXID3000 (made by DAICEL), etc. are mentioned.
上述芳香族環氧化合物(A4)係指含有芳香環的環氧化合物,而芳香族環氧化合物(A4)之具體例,可列舉酚、甲酚、丁酚等具有至少1個芳香族環的多元酚或、其環氧烷加成物之單/聚環氧丙醚化物,可列舉例如雙酚A、雙酚F、或此等再加成環氧烷之化合物之環氧丙醚化物或環氧基酚醛清漆樹脂;間苯二酚或氫醌、兒茶酚等之具有2個以上之酚性羥基的芳香族化合物之單/聚環氧丙醚化物;苯基二甲醇或苯基二乙醇、苯基二丁醇等之具有2個以上之醇性羥基之芳香族化合物之環氧丙醚化物;苯二甲酸、對苯二甲酸、偏苯三甲酸等之具有2個以上之羧酸的多元酸芳香族化合物之環氧丙基酯、苯甲酸之環氧丙基酯、苯乙烯氧化物或二乙烯基苯之環氧化物等。 The above-mentioned aromatic epoxy compound (A4) refers to an epoxy compound containing an aromatic ring, and specific examples of the aromatic epoxy compound (A4) include phenol, cresol, and butylphenol having at least one aromatic ring. Examples of the polyhydric phenol or the mono / polypropylene oxide etherate of an alkylene oxide adduct include bisphenol A, bisphenol F, or a propylene oxide etherified compound of these compounds and an alkylene oxide adduct. Epoxy novolac resins; mono / polyglycidyl etherate of aromatic compounds with more than two phenolic hydroxyl groups, such as resorcinol or hydroquinone, catechol, etc .; phenyldimethanol or phenyldihydride Glycidyl etherate of aromatic compounds having two or more alcoholic hydroxyl groups, such as ethanol and phenyl dibutanol; carboxylic acids having two or more such as phthalic acid, terephthalic acid, trimellitic acid, etc. The polypropyl acid aromatic compounds of epoxy propyl esters, benzoic acid propylene oxide esters, styrene oxide or divinylbenzene epoxy oxide.
上述芳香族環氧化合物(A4)可使用市售品,可列舉例如DenacolEX-146、DenacolEX-147、DenacolEX-201、DenacolEX-203、DenacolEX-711、DenacolEX-721、On Court EX-1020、On Court EX-1030、On Court EX-1040、On Court EX-1050、On Court EX- 1051、On Court EX-1010、On Court EX-1011、On Court 1012(nagase chemtex(股)公司製);OGSOL PG-100、OGSOL EG-200、OGSOLEG-210、OGSOL EG-250(大阪氣體化學(股)公司製);HP4032、HP4032D、HP4700(DIC(股)公司製);ESN-475V(新日鐵住金化學(股)公司製);EpikoteYX8800(三菱化學(股)公司製);Marproof G-0105SA、Marproof G-0130SP(日油(股)公司製);EPICLONN-665、EPICLONHP-7200(DIC(股)公司製);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H、NC-7000L(日本化藥(股)公司製);ADEKA RESIN EP-4000、ADEKA RESINEP-4005、ADEKA RESIN EP-4100、ADEKA RESIN EP-4901((股)ADEKA公司製);TECHMORE VG-3101L((股)Printec公司製)等。上述芳香族環氧化合物(A4)中,多官能者因硬化性優異,故較佳。 As the aromatic epoxy compound (A4), a commercially available product can be used, and examples thereof include DenacolEX-146, DenacolEX-147, DenacolEX-201, DenacolEX-203, DenacolEX-711, DenacolEX-721, On Court EX-1020, On Court EX-1030, On Court EX-1040, On Court EX-1050, On Court EX- 1051, On Court EX-1010, On Court EX-1011, On Court 1012 (produced by nagase chemtex); OGSOL PG-100, OGSOL EG-200, OGSOLEG-210, OGSOL EG-250 (Osaka Gas Chemical ( Shares) company system); HP4032, HP4032D, HP4700 (manufactured by DIC (stock) company); ESN-475V (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.); EpikoteYX8800 (manufactured by Mitsubishi Chemical (stock) company); Marproof G- 0105SA, Marproof G-0130SP (manufactured by Japan Petroleum Corporation); EPICLONN-665, EPICLONHP-7200 (manufactured by DIC Corporation); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD- 1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (made by Nippon Kayaku Co., Ltd.); ADEKA RESIN EP-4000, ADEKA RESINEP-4005, ADEKA RESIN EP-4100, ADEKA RESIN EP-4901 (made by ADEKA); TECHMORE VG-3101L (made by Printec). Among the above-mentioned aromatic epoxy compounds (A4), polyfunctional ones are preferred because they are excellent in hardenability.
上述乙烯醚化合物可列舉例如二乙二醇單乙烯醚、三乙二醇二乙烯醚、n-十二烷基乙烯醚、環己基乙烯醚、2-乙基己基乙烯醚、2-氯乙基乙烯醚、乙基乙烯醚、異丁基乙烯醚、三乙二醇乙烯醚、2-羥基乙基乙烯醚、4-羥基丁基乙烯醚、1,6-環己烷二甲醇單乙烯醚、乙二醇二乙烯醚、1,4-丁二醇二乙烯醚、1,6-環己烷二甲醇二乙烯醚等。 Examples of the vinyl ether compound include diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, and 2-chloroethyl Vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether, Ethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexane dimethanol divinyl ether, and the like.
上述陽離子聚合性成分(A)中,上述分子量 200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物之環氧丙基化物(A1)、氧雜環丁烷化合物(A2)、脂環式環氧化合物(A3)、芳香族環氧化合物(A4)及乙烯醚化合物之使用比例係相對於陽離子聚合性成分(A)100質量份時,分子量200以上之多元醇的環氧丙基化物、或多元醇環氧烷加成物之環氧丙基化物(A1)40~70質量份、氧雜環丁烷化合物(A2)30~60質量份、脂環式環氧化合物(A3)0~50質量份、芳香族環氧化合物(A4)0~30質量份、乙烯醚化合物0~20質量份,可提高黏度、塗佈性、反應性及硬化性,故較佳。 In the cationically polymerizable component (A), the molecular weight Epoxypropyl compounds of polyhydric alcohols of 200 or more, epoxypropyl compounds (A1), oxetane compounds (A2), and alicyclic epoxy compounds (A3) of polyol alkylene oxide adducts The use ratio of the aromatic epoxy compound (A4) and vinyl ether compound is based on 100 parts by mass of the cationically polymerizable component (A), a glycidyl alcohol of a polyhydric alcohol having a molecular weight of 200 or more, or a polyhydric alcohol alkylene oxide. 40 to 70 parts by mass of the epoxy propyl compound (A1) of the adduct, 30 to 60 parts by mass of the oxetane compound (A2), 0 to 50 parts by mass of the alicyclic epoxy compound (A3), aromatic 0-30 parts by mass of the epoxy compound (A4) and 0-20 parts by mass of the vinyl ether compound are preferable because they can improve viscosity, coatability, reactivity, and hardenability.
本發明之硬化性組成物的陽離子聚合起始劑(B)係指藉由能量線照射或加熱可釋放使陽離子聚合開始之物質的化合物時,皆可使用,較佳為藉由能量線照射釋放出路易斯酸之鎓鹽的複鹽或其衍生物。此化合物之代表性者,可列舉下述通式、[A]r+[B]r-表示之陽離子與陰離子的鹽。 The cationic polymerization initiator (B) of the curable composition of the present invention refers to a compound that releases a substance that initiates cationic polymerization by irradiation with energy rays or heating, and is preferably released by irradiation with energy rays. A double salt of an onium salt of a Lewis acid or a derivative thereof. Representative examples of this compound include salts of cations and anions represented by the following general formula and [A] r + [B] r- .
此處,陽離子[A]r+較佳為鎓類,其構造例如可以下述通式[(R2)aQ]r+表示。 Here, the cation [A] r + is preferably an onium, and its structure can be represented, for example, by the following general formula [(R 2 ) a Q] r + .
再者,此處,R2係碳原子數為1~60,且可含有幾個碳原子以外之原子的有機基。a為1~5之整數。a個之R2可各自獨立為相同或相異。又,至少1個為具有芳香 環之如上述的有機基為佳。Q為選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N=N所成群之原子或原子團。又,陽離子[A]r+中之Q的原子價為q時,r=a-q之關係(惟,N=N視為原子價0)必須成立。 Here, R 2 is an organic group having 1 to 60 carbon atoms and may contain atoms other than several carbon atoms. a is an integer from 1 to 5. Each of R 2 of a may be independently the same or different. Moreover, it is preferable that at least one is an organic group as mentioned above which has an aromatic ring. Q is an atom or a group of atoms selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, N = N. When the atomic valence of Q in the cation [A] r + is q, the relationship of r = aq (however, N = N is regarded as atomic valence 0) must be established.
又,陰離子[B]r-較佳為鹵化物錯合物,其構造例如可以下述通式[LYb]r-表示。 The anion [B] r- is preferably a halide complex, and its structure can be represented by the following general formula [LY b ] r- .
此外,在此,L為鹵化物錯合物之中心原子的金屬或半金屬(Metalloid),其係B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co等。Y為鹵素原子。b為3~7之整數。又,陰離子[B]r-中之L的原子價當作p時,r=b-p之關係必須成立。 In addition, here, L is a metal or semimetal (Metalloid) which is the central atom of a halide complex, which is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co, etc. Y is a halogen atom. b is an integer from 3 to 7. When the atomic valence of L in the anion [B] r- is taken as p, the relationship of r = bp must be established.
上述通式之陰離子[LYb]r-的具體例,可列舉肆(五氟苯基)硼酸根、四(3,5-二氟-4-甲氧基苯基)硼酸根、四氟硼酸根(BF4)-、六氟磷酸根(PF6)-、六氟銻酸根(SbF6)-、六氟砷酸根(AsF6)-、六氯銻酸根(SbCl6)-等。 Specific examples of the anion [LY b ] r- of the above general formula include tetrakis (pentafluorophenyl) borate, tetra (3,5-difluoro-4-methoxyphenyl) borate, and tetrafluoroborate root (BF 4) -, hexafluorophosphate (PF 6) -, hexafluoroantimonate (SbF 6) -, hexafluoroarsenate (AsF 6) -, hexachloro antimonate (SbCl 6) - and the like.
又,陰離子[B]r-亦可使用下述通式[LYb-1(OH)]r-表示之構造者。L、Y、b係與上述相同。又,其他可使用之陰離子,可列舉過氯酸離子(ClO4)-、三氟甲基亞硫酸離子(CF3SO3)-、氟磺酸離子(FSO3)-、甲苯磺酸陰離子、三硝基苯磺酸陰離子、樟腦磺酸根、九氟丁烷磺酸根、十六氟辛烷磺酸根、四芳基硼酸根、肆(五氟苯基)硼酸根 等。 The anion [B] r- may also be a structure represented by the following general formula [LY b-1 (OH)] r- . L, Y, and b are the same as described above. In addition, other usable anions include perchlorate ion (ClO 4 ) - , trifluoromethylsulfite ion (CF 3 SO 3 ) - , fluorosulfonic acid ion (FSO 3 ) - , toluenesulfonic acid anion, Trinitrobenzene sulfonate anion, camphor sulfonate, nonafluorobutane sulfonate, hexafluorooctane sulfonate, tetraarylborate, and (pentafluorophenyl) borate.
本發明之硬化性組成物中,如此鎓鹽之中,以使用下述(甲)~(丙)之芳香族鎓鹽特別有效。可由此等之中以1種單獨使用或混合2種以上使用。 Among the onium salts of the curable composition of the present invention, it is particularly effective to use the following onium salts of (a) to (c). Among these, one kind may be used alone or two or more kinds may be used in combination.
(甲)苯基重氮鎓六氟磷酸鹽、4-甲氧基苯基重氮鎓六氟銻酸鹽、4-甲基苯基重氮鎓六氟磷酸鹽等之芳基重氮鎓鹽 (A) Aryldiazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate, etc.
(乙)二苯基錪六氟銻酸鹽、二(4-甲基苯基)錪六氟磷酸鹽、二(4-tert-丁基苯基)錪六氟磷酸鹽、甲苯基異丙苯基錪肆(五氟苯基)硼酸鹽等之二芳基錪鹽 (B) Diphenylfluorene hexafluoroantimonate, bis (4-methylphenyl) fluorene hexafluorophosphate, bis (4-tert-butylphenyl) fluorene hexafluorophosphate, tolylcumene Diarylsulfonium salt
(丙)下述群I或群II表示之鋶陽離子與六氟銻離子、六氟磷酸根離子、肆(五氟苯基)硼酸根離子等之鋶鹽 (C) A sulfonium salt of a sulfonium cation and a hexafluoroantimony ion, a hexafluorophosphate ion, a (pentafluorophenyl) borate ion, etc. represented by the following group I or group II
<群I>
<群II>
又,其他較佳者可列舉(η5-2,4-環戊二烯-1-基)[(1,2,3,4,5,6-η)-(1-甲基乙基)苯〕-鐵-六氟磷酸鹽等之鐵-芳烴錯合物、或參(乙醯丙酮)鋁、參(乙醯乙酸乙酯)鋁、參(水楊醛)鋁等之鋁錯合物與三苯基矽烷醇等之矽烷醇類的混合物;噻吩鎓鹽、四氫噻吩鐵鹽(thiolanium)、苄基銨、吡啶鎓鹽、鉼鹽(hydrazinium)等之鹽;二乙烯三胺、三乙烯三胺、四乙烯五胺等之聚烷基多胺類;1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷、異佛爾酮二胺等之脂環式多胺類;m-苯二甲胺、二胺基二苯基甲烷、二胺基二苯基碸等之芳香族多胺類;藉由一般方法使上述多胺類與苯基環氧丙醚、丁基環氧丙醚、雙酚A-二環氧丙醚、雙酚F-二環氧丙 醚等之環氧丙醚類或羧酸之環氧丙基酯類等的各種環氧樹脂反應所製造的聚環氧基加成改質物;藉由一般方法使上述有機多胺類與鄰苯二甲酸、間苯二甲酸、二聚酸等之羧酸類反應所製造的醯胺化改質物;藉由一般方法使上述多胺類與甲醛等之醛類及酚、甲酚、二甲酚、第三丁基酚、間苯二酚等之於核具有至少一個醛化反應性場所的酚類反應所製造的曼尼希(Mannich)化改質物;多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚酸、二聚酸等之脂肪族二羧酸類;鄰苯二甲酸、對苯二甲酸、間苯二甲酸、萘二羧酸等之芳香族二羧酸類;環己烷二羧酸等之脂環式二羧酸類;偏苯三甲酸、均苯三甲酸(Trimesic Acid)、蓖麻油脂肪酸之三聚物等之三羧酸類;均苯四酸等之四羧酸類等)之酸酐;雙氰胺、咪唑類、羧酸酯、磺酸酯、胺醯亞胺等。 Other preferred examples include (η 5 -2,4-cyclopentadien-1-yl) [(1,2,3,4,5,6-η)-(1-methylethyl) Benzene] -iron-aromatic hydrocarbon complexes such as iron-hexafluorophosphate, or aluminum complexes of ginseng (ethylacetone) aluminum, ginseng (ethylacetate) aluminum, ginseng (salicylaldehyde) aluminum, etc. Mixtures with silanols such as triphenylsilanol; salts of thienylium, thiolanium, benzylammonium, pyridinium, hydrazinium, etc .; diethylenetriamine, triamine Polyalkyl polyamines such as ethylenetriamine, tetraethylenepentamine, etc .; 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, isophor Alicyclic polyamines such as ketodiamine; aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane, diaminodiphenylphosphonium, etc .; the above polyamines are made by a general method Glycidyl ethers such as phenylglycidyl ether, butylglycidyl ether, bisphenol A-glycidyl ether, bisphenol F-glycidyl ether or carboxylic acid Polyepoxy addition modification produced by reaction of various epoxy resins such as esters; the above-mentioned organic polyamines are combined with phthalic acid and m-benzene by a general method Modified amidines produced by the reaction of carboxylic acids such as formic acid and dimer acid; the above-mentioned polyamines and aldehydes such as formaldehyde and phenol, cresol, xylenol, third butylphenol, Resorcinol is a Mannich modification produced by a phenol reaction with at least one aldolization site in the core; polycarboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, Adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyl adipic acid, 3-methyl adipic acid, 3 -Methyl glutaric acid, 2-methyl suberic acid, 3,8-dimethylsebacic acid, 3,7-dimethylsebacic acid, hydrogenated dimer acid, dimer acid, etc. Carboxylic acids; aromatic dicarboxylic acids such as phthalic acid, terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, etc .; cycloaliphatic dicarboxylic acids such as cyclohexanedicarboxylic acid; trimellitic acid, Tricarboxylic acids such as trimesic acid and castor oil fatty acid terpolymers; tricarboxylic acids such as pyromellitic acid; tetracarboxylic acids such as pyromellitic acid; dicyandiamide, imidazoles, carboxylic acid esters, sulfonic acid esters Amine .
此等之中,就實用面與提高光感度的觀點,使用芳香族錪鹽、芳香族鋶鹽、鐵-芳烴錯合物為佳;相對於陽離子聚合起始劑(B)100質量%,又更佳為含有至少0.1質量%以上之具有下述構造之芳香族鋶鹽。 Among these, it is preferable to use an aromatic sulfonium salt, an aromatic sulfonium salt, and an iron-aromatic hydrocarbon complex from the viewpoint of practicality and improvement of light sensitivity; and 100% by mass of the cationic polymerization initiator (B), and It is more preferable that the aromatic sulfonium salt has the following structure and contains at least 0.1% by mass or more.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19及R20各自獨立地表示氫原子、鹵素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或碳原子數2~10之酯基,R21、R22、R23及R24各自獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基,R25表示氫原子、鹵素原子、碳原子數1~10之烷基或選自下述化學式(A)~(C)中的任一取代基,Anq-表示q價的陰離子,p表示使電荷為中性的係數。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19, and R 20 each independently represent a hydrogen atom, a halogen atom, and a carbon number of 1 to Alkyl group of 10, alkoxy group of 1 to 10 carbon atoms, or ester group of 2 to 10 carbon atoms, and R 21 , R 22 , R 23, and R 24 each independently represent a hydrogen atom, a halogen atom, or a carbon atom 1 to 10 alkyl groups, R 25 represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or any substituent selected from the following chemical formulae (A) to (C), and An q- represents q Valence anion, p represents a coefficient which makes the charge neutral.
此處,式中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39各自獨立地表示氫原子、鹵素原子、碳原子數1~10之烷基、碳原子數1~10之烷氧基或 碳原子數2~10之酯基,R30、R31、R32、R33及R34各自獨立地表示氫原子、鹵素原子或碳原子數1~10之烷基。 Here, in the formula, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38, and R 39 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, and 1 to 10 carbon atoms R 30 , R 31 , R 32 , R 33, and R 34 each independently represent a hydrogen atom, a halogen atom, or an alkyl group having 1 to 10 carbon atoms.
上述通式(1)表示之化合物中,R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之鹵素原子,可列舉氟、氯、溴、碘等。 Among the compounds represented by the general formula (1), R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38 and R 39 Examples of the atom include fluorine, chlorine, bromine, and iodine.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R25、R26、R27、R28、R29、R30、R31、R32、R33、R34、R35、R36、R37、R38及R39表示之碳原子數1~10之烷基,可列舉甲基、乙基、丙基、異丙基、丁基、s-丁基、t-丁基、異丁基、戊基、異戊基、t-戊基、己基、環己基、庚基、辛基、壬基、乙基辛基、2-甲氧基乙基、3-甲氧基丙基、4-甲氧基丁基、2-丁氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、2-甲硫基乙基、氟甲基、二氟甲基、三氟甲基、氯甲基、二氯甲基、三氯甲基、溴甲基、二溴甲基、三溴甲基、二氟乙基、三氯乙基、二氯二氟乙基、五氟乙基、七氟丙基、九氟丁基、十氟戊基、十三氟己基、十五氟庚基、十七氟辛基、甲氧基甲基、1,2-環氧基乙基、甲氧基乙基、甲氧基乙氧基甲基、甲硫基甲基、乙氧基乙基、丁氧基甲基、t-丁硫基甲基、4-戊烯氧基甲基、三氯乙氧基甲基、雙(2-氯乙氧基)甲基、甲氧基環己基、1-(2-氯乙氧基)乙基、1-甲基-1-甲氧基乙基、乙 基二硫乙基、三甲基甲矽烷基乙基、t-丁基二甲基甲矽烷氧基甲基、2-(三甲基甲矽烷基)乙氧基甲基、t-丁氧基羰基甲基、乙氧基羰基甲基、乙基羰基甲基、t-丁氧基羰基甲基、丙烯醯氧基乙基、甲基丙烯醯氧基乙基、2-甲基-2-金剛烷氧基羰基甲基、乙醯基乙基、2-甲氧基-1-丙烯基、羥基甲基、2-羥基乙基、1-羥基乙基、2-羥基丙基、3-羥基丙基、3-羥基丁基、4-羥基丁基、1,2-二羥基乙基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 36 , R 37 , R 38, and R 39 each represent an alkyl group having 1 to 10 carbon atoms, and examples thereof Methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, pentyl, isopentyl, t-pentyl, hexyl, cyclohexyl, heptyl, Octyl, nonyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl, 2-butoxyethyl, methoxyethoxyethyl Methyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, difluoromethyl, trifluoromethyl, chloromethyl, dichloro Methyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichlorodifluoroethyl, pentafluoroethyl, heptafluoropropyl, nine Fluorobutyl, decafluoropentyl, tridecylhexyl, pentafluoroheptyl, heptafluorooctyl, methoxymethyl, 1,2-epoxyethyl, methoxyethyl, methoxy Ethoxy Methyl, methylthiomethyl, ethoxyethyl, butoxymethyl, t-butylthiomethyl, 4-pentenyloxymethyl, trichloroethoxymethyl, bis (2- (Chloroethoxy) methyl, methoxycyclohexyl, 1- (2-chloroethoxy) ethyl, 1-methyl-1-methoxyethyl, ethyldithioethyl, trimethyl Silylethyl, t-butyldimethylsilyloxymethyl, 2- (trimethylsilyl) ethoxymethyl, t-butoxycarbonylmethyl, ethoxycarbonylmethyl Methyl, ethylcarbonylmethyl, t-butoxycarbonylmethyl, propenyloxyethyl, methacryloxyethyl, 2-methyl-2-adamantyloxycarbonylmethyl, acetamidine Ethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl, 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxybutyl, 4 -Hydroxybutyl, 1,2-dihydroxyethyl, and the like.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數1~10之烷氧基,可列舉甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、s-丁氧基、t-丁氧基、異丁氧基、戊氧基、異戊氧基、t-戊氧基、己氧基、環己氧基、環己基甲氧基、四氫呋喃氧基、四氫吡喃氧基、2-甲氧基乙氧基、3-甲氧基丙氧基、4-甲氧基丁氧基、2-丁氧基乙氧基、甲氧基乙氧基乙氧基、甲氧基乙氧基乙氧基乙氧基、3-甲氧基丁氧基、2-甲硫基乙氧基、三氟甲氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , R 29 , R 35 , R 36 , R 37 , R 38 and R 39 having an alkoxy group having 1 to 10 carbon atoms include methoxy, ethoxy, propoxy, isopropoxy, Butoxy, s-butoxy, t-butoxy, isobutoxy, pentyloxy, isopentyloxy, t-pentoxy, hexyloxy, cyclohexyloxy, cyclohexylmethoxy , Tetrahydrofuranoxy, tetrahydropyranyloxy, 2-methoxyethoxy, 3-methoxypropoxy, 4-methoxybutoxy, 2-butoxyethoxy, methoxy Ethoxyethoxy, methoxyethoxyethoxyethoxy, 3-methoxybutoxy, 2-methylthioethoxy, trifluoromethoxy and the like.
R11、R12、R13、R14、R15、R16、R17、R18、R19、R20、R21、R22、R23、R24、R26、R27、R28、R29、R35、R36、R37、R38及R39表示之碳原子數2~10之酯基,可列舉甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧基、二氯乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、t-丁基羰氧 基、甲氧基乙醯氧基、苯甲醯氧基等。 R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 , R 23 , R 24 , R 26 , R 27 , R 28 , An ester group having 2 to 10 carbon atoms represented by R 29 , R 29 , R 35 , R 36 , R 37 , R 38, and R 39 includes methoxycarbonyl, ethoxycarbonyl, isopropoxycarbonyl, and phenoxy Carbonyl, ethoxy, propionyl, butyloxy, chloroethoxy, dichloroethoxy, trichloroethoxy, trifluoroethoxy, t-butylcarbonyl Oxygen, methoxyethoxy, benzyloxy and the like.
相對於陽離子聚合性成分(A)與自由基聚合性成分(C)與聚合物(E)與之合計100質量份,陽離子聚合起始劑(B)之使用比例為陽離子聚合起始劑(B)0.001~10質量份,較佳為0.1~10質量份。太少時,容易變得硬化不足,過多時,有時對於硬化物之吸水率或硬化物強度等之諸物性有不良影響的情形。 The ratio of the cationic polymerization initiator (B) to the cationic polymerizable component (A), the radical polymerizable component (C), and the polymer (E) is 100 mass parts, and the cationic polymerization initiator (B ) 0.001 to 10 parts by mass, preferably 0.1 to 10 parts by mass. When it is too small, it may easily become insufficiently hardened, and when it is too large, it may adversely affect various physical properties such as the water absorption of the hardened material and the strength of the hardened material.
本發明之硬化性組成物的自由基聚合性成分(C)係以具有環氧基及乙烯性不飽和基之化合物(C1)或碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2)為必須成分。 The radically polymerizable component (C) of the curable composition of the present invention is an acrylate or an alcohol having 2 to 20 carbon atoms or a compound having an epoxy group and an ethylenically unsaturated group (C1) or an alcohol having 2 to 20 carbon atoms. ~ 20 alcohol methacrylate (C2) is an essential component.
上述具有環氧基及乙烯性不飽和基的化合物(C1),可列舉例如環氧基丙烯酸酯或環氧基甲基丙烯酸酯,具體而言,使以往公知之芳香族環氧樹脂、脂環式環氧樹脂、脂肪族環氧樹脂等與丙烯酸或甲基丙烯酸反應所得的丙烯酸酯。此等之環氧基丙烯酸酯或環氧基甲基丙烯酸酯之中,特佳為醇類之環氧丙醚的丙烯酸酯或甲基丙烯酸酯。 Examples of the compound (C1) having an epoxy group and an ethylenically unsaturated group include, for example, epoxy acrylate or epoxy methacrylate. Specifically, conventionally known aromatic epoxy resins and alicyclic rings are used. Acrylic acid esters obtained by reacting epoxy resins, aliphatic epoxy resins and the like with acrylic acid or methacrylic acid. Among these epoxy acrylates or epoxy methacrylates, particularly preferred are acrylates or methacrylates of glycidyl ethers of alcohols.
上述碳原子數2~20之醇的丙烯酸酯或碳原子數2~20之醇的甲基丙烯酸酯(C2),可列舉使分子中具有至少1個羥基的芳香族或脂肪族醇及其環氧烷加成物與丙烯酸或甲基丙烯酸反應所得的丙烯酸酯或甲基丙烯酸酯。具體而言,可列舉2-乙基己基丙烯酸酯、2-羥基乙基丙烯酸酯、2-羥基丙基丙烯酸酯、異戊基丙烯酸酯、月桂基丙 烯酸酯、十八烷基丙烯酸酯、異辛基丙烯酸酯、四氫糠基丙烯酸酯、異莰基丙烯酸酯、苄基丙烯酸酯、1,3-丁二醇二丙烯酸酯、1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、二乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、新戊二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇六丙烯酸酯、ε-己內酯改質二季戊四醇六丙烯酸酯、2-乙基己基甲基丙烯酸酯、2-羥基乙基甲基丙烯酸酯、2-羥基丙基甲基丙烯酸酯、異戊基甲基丙烯酸酯、月桂基甲基丙烯酸酯、十八烷基甲基丙烯酸酯、異辛基甲基丙烯酸酯、四氫糠基甲基丙烯酸酯、異莰基甲基丙烯酸酯、苄基甲基丙烯酸酯、1,3-丁二醇二甲基丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、1,6-己二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、新戊二醇二甲基丙烯酸酯、聚乙二醇二甲基丙烯酸酯、聚丙二醇二甲基丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、季戊四醇四甲基丙烯酸酯、二季戊四醇六甲基丙烯酸酯、ε-己內酯改質二季戊四醇六甲基丙烯酸酯等。又,此等之丙烯酸酯或甲基丙烯酸酯之中,特佳為多元醇之聚丙烯酸酯類或多元醇之聚甲基丙烯酸酯類。 Examples of the acrylate of the alcohol having 2 to 20 carbon atoms or the methacrylate (C2) of the alcohol having 2 to 20 carbon atoms include aromatic or aliphatic alcohols having at least one hydroxyl group in the molecule and their rings An acrylate or methacrylate obtained by reacting an oxane adduct with acrylic acid or methacrylic acid. Specific examples include 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, isoamyl acrylate, and lauryl propyl Enoate, octadecyl acrylate, isooctyl acrylate, tetrahydrofurfuryl acrylate, isofluorenyl acrylate, benzyl acrylate, 1,3-butanediol diacrylate, 1,4- Butanediol diacrylate, 1,6-hexanediol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, neopentyl glycol diacrylate, polyethylene glycol diacrylate, Polypropylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, ε-caprolactone modified dipentaerythritol hexaacrylate, 2-ethylhexyl methacrylate, 2 -Hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, isoamyl methacrylate, lauryl methacrylate, octadecyl methacrylate, isooctyl methacrylate , Tetrahydrofurfuryl methacrylate, isofluorenyl methacrylate, benzyl methacrylate, 1,3-butanediol dimethacrylate, 1,4-butanediol dimethacrylate , 1,6-hexanediol dimethacrylate, diethylene glycol dimethacrylate, triethyl Alcohol dimethacrylate, neopentyl glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, trimethylolpropane trimethacrylate, pentaerythritol tetramethyl Acrylate, dipentaerythritol hexamethacrylate, ε-caprolactone modified dipentaerythritol hexamethacrylate and the like. Among these acrylates or methacrylates, polyacrylates of polyhydric alcohols or polymethacrylates of polyhydric alcohols are particularly preferred.
上述自由基聚合性成分(C)可使用(C1)或(C2)以外,藉由能量線照射或加熱活性化之自由基聚合起始劑,進行高分子化或交聯反應的化合物,可列舉例如烯丙基胺基甲酸酯化合物、不飽和聚酯化合物、苯乙烯系 化合物等。自由基聚合性成分(C)中之上述(C1)成分及(C2)成分的比例,較佳為50質量%以上。 Examples of the radical polymerizable component (C) include compounds other than (C1) or (C2), which can be polymerized or cross-linked by a radical polymerization initiator activated by irradiation with energy rays or heating, and examples thereof include For example, allyl carbamate compounds, unsaturated polyester compounds, styrene Compounds etc. The ratio of the (C1) component and the (C2) component in the radical polymerizable component (C) is preferably 50% by mass or more.
本發明之硬化性組成物的自由基起始劑(D)無特別限制,可使用習知者。可使用例如苯乙酮系化合物、苄基系化合物、二苯甲酮系化合物、噻噸酮系化合物等之酮系化合物、肟系化合物等。 The radical initiator (D) of the curable composition of the present invention is not particularly limited, and a known one can be used. For example, acetophenone-based compounds, benzyl-based compounds, benzophenone-based compounds, thioxanthone-based compounds, ketone-based compounds, oxime-based compounds, and the like can be used.
本發明之硬化性組成物的聚合物(E)係選自由上述式(I)表示之單體所得之聚合物、由上述式(II)表示之單體所得之聚合物、選自由上述式(I)表示之單體之二種以上之單體所得之聚合物、選自由上述式(II)表示之單體之二種以上之單體所得之聚合物及由上述式(I)表示之單體及上述式(II)表示之單體所得之聚合物所成群組,且重量平均分子量以聚苯乙烯換算為1,000~30,000。 The polymer (E) of the curable composition of the present invention is selected from a polymer obtained from a monomer represented by the above formula (I), a polymer obtained from a monomer represented by the above formula (II), and selected from the above formula (II) I) A polymer obtained from two or more monomers represented by the monomer, a polymer selected from the group consisting of two or more monomers represented by the above formula (II), and a monomer represented by the above formula (I) And the polymer obtained from the monomer represented by the formula (II), and the weight average molecular weight is 1,000 to 30,000 in terms of polystyrene.
上述式(I)中之X表示之碳原子數1~7之烷基,可列舉甲基、乙基、丙基、iso-丙基、丁基、sec-丁基、tert-丁基、iso-丁基、戊基、iso-戊基、tert-戊基、己基、2-己基、3-己基、環己基、4-甲基環己基、庚基、2-庚基、3-庚基、iso-庚基、tert-庚基等。此等之中,從硬化性的觀點,碳原子數1~4之烷基或以選自由環氧基、氧雜環丁烷基、羥基及羧基所成群組之1種以上之基進行部分取代之碳原子數1~4之烷基為佳。 Examples of the alkyl group having 1 to 7 carbon atoms represented by X in the formula (I) include methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, and iso -Butyl, pentyl, iso-pentyl, tert-pentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl and the like. Among these, from the viewpoint of hardenability, an alkyl group having 1 to 4 carbon atoms or a part thereof is selected from one or more groups selected from the group consisting of an epoxy group, an oxetanyl group, a hydroxyl group, and a carboxyl group. Substituted alkyl groups having 1 to 4 carbon atoms are preferred.
上述式(I)中之X表示之碳原子數1~7之烷氧基,可列舉甲氧基、乙氧基、丙氧基、iso-丙氧基、丁氧 基、sec-丁氧基、tert-丁氧基、iso-丁氧基、戊氧基、iso-戊氧基、tert-戊氧基、己氧基、2-己氧基、3-己氧基、環己氧基、4-甲基環己氧基、庚氧基、2-庚氧基、3-庚氧基、iso-庚氧基、tert-庚氧基等。此等之中,從硬化性的觀點,碳原子數1~4之烷氧基或以選自由環氧基、氧雜環丁烷基、羥基及羧基所成群組之1種以上之基進行部分取代之碳原子數1~4之烷氧基為佳。 Examples of the alkoxy group having 1 to 7 carbon atoms represented by X in the formula (I) include methoxy, ethoxy, propoxy, iso-propoxy, and butoxy Group, sec-butoxy, tert-butoxy, iso-butoxy, pentyloxy, iso-pentoxy, tert-pentoxy, hexyloxy, 2-hexyloxy, 3-hexyloxy Group, cyclohexyloxy, 4-methylcyclohexyloxy, heptyloxy, 2-heptyloxy, 3-heptyloxy, iso-heptyloxy, tert-heptyloxy and the like. Among these, from the viewpoint of hardenability, an alkoxy group having 1 to 4 carbon atoms or one or more groups selected from the group consisting of an epoxy group, an oxetanyl group, a hydroxyl group, and a carboxyl group is performed. Partially substituted alkoxy groups having 1 to 4 carbon atoms are preferred.
上述式(I)中之X表示之碳原子數6~12之芳基,可列舉苯基、甲基苯基、萘基等。 Examples of the aryl group having 6 to 12 carbon atoms represented by X in the formula (I) include phenyl, methylphenyl, and naphthyl.
上述式(I)中之X表示之碳原子數6~12之芳氧基,可列舉苯氧基、甲基苯氧基、萘氧基等。 Examples of the aryloxy group having 6 to 12 carbon atoms represented by X in the formula (I) include a phenoxy group, a methylphenoxy group, and a naphthyloxy group.
上述式(I)中之X表示之碳原子數6~10之脂環式烴基,可列舉環己基、甲基環己基、降莰基、雙環戊基、雙環辛基、三甲基雙環庚基、三環辛基、三環癸基、螺辛基、螺雙環戊基、金剛烷基、異莰基等。 The alicyclic hydrocarbon group having 6 to 10 carbon atoms represented by X in the above formula (I) includes cyclohexyl, methylcyclohexyl, norbornyl, dicyclopentyl, bicyclooctyl, and trimethylbicycloheptyl , Tricyclooctyl, tricyclodecyl, spirooctyl, spirobicyclopentyl, adamantyl, isofluorenyl and the like.
此等之烷基、烷氧基、芳基、芳氧基及脂環式烴基,可為此等之基中的氫原子經選自由環氧基、氧雜環丁烷基、羥基及羧基所成群之1種以上之基所取代。 These alkyl, alkoxy, aryl, aryloxy, and alicyclic hydrocarbon groups may be selected from the group consisting of hydrogen atoms of epoxy, oxetanyl, hydroxy, and carboxyl groups. Replaced by a group of more than one type.
上述式(I)中,X之一部分為經環氧基或氧雜環丁烷基取代時之式(I)表示的單體,可列舉例如下述式(1)~(3)表示之單體。 In the above formula (I), a part of X is a monomer represented by the formula (I) when substituted with an epoxy group or an oxetanyl group, and examples thereof include monomers represented by the following formulas (1) to (3). body.
在此,式(1)中,R3表示氫原子或碳原子數1~6之烷基,m為1~6之整數。 Here, in formula (1), R 3 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and m is an integer of 1 to 6.
在此,式(2)中,R4表示氫原子或碳原子數1~6之烷基,n為1~6之整數。 Here, in Formula (2), R 4 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n is an integer of 1 to 6.
在此,式(3)中,R5表示氫原子或碳原子數1~6之烷基,s為1~6之整數。 Here, in formula (3), R 5 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and s is an integer of 1 to 6.
上述式(II)中,以R1所表示的鹵原子,可列舉氟、氯、溴、碘等。 Examples of the halogen atom represented by R 1 in the formula (II) include fluorine, chlorine, bromine, and iodine.
上述式(II)中,X’之碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基,可列舉與上述式(I)同樣者。 In the above formula (II), the alkyl group having 1 to 7 carbon atoms, the aryl group having 6 to 12 carbon atoms, or the alicyclic hydrocarbon group having 6 to 10 carbon atoms in X 'can be exemplified by the formula (I). The same.
上述式(II)中,X’之一部分經環氧基或氧雜環丁烷基取代時,作為式(II)所表示之單體,可列舉下述式(4)~(6)所表示者。 When a part of X 'in the above formula (II) is substituted with an epoxy group or an oxetanyl group, examples of the monomer represented by the formula (II) include the following formulae (4) to (6) By.
在此,式(4)中,R1係與上述式(II)相同,R6表示氫原子或碳原子數1~6之烷基,t為1~6之整數。 Here, in formula (4), R 1 is the same as the above formula (II), R 6 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and t is an integer of 1 to 6.
在此,式(5)中,R1係與上述式(II)相同,R7表示氫原子或碳原子數1~6之烷基,q為1~6之整數。 Here, in formula (5), R 1 is the same as the above formula (II), R 7 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and q is an integer of 1 to 6.
在此,式(6)中,R1係與上述式(II)相同,R8表示氫原子或碳原子數1~6之烷基,y為1~6之整數。 Here, in formula (6), R 1 is the same as the above formula (II), R 8 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and y is an integer of 1 to 6.
上述聚合物(E)中,構成聚合物之單體的使用比例係上述X為經選自由環氧基、環雜環丁烷基、羥基及羧基所成群之1種以上之基取代之碳原子數1~7之烷基、碳原子數6~12之芳基或碳原子數6~10之脂環式烴基時,使上述(I)或(II)表示之單體成為10~100質量%來使用,由於接著性提高,故較佳。 In the polymer (E), the proportion of the monomers constituting the polymer is such that X is a carbon substituted with one or more groups selected from the group consisting of an epoxy group, a cyclocyclobutane group, a hydroxyl group, and a carboxyl group. When an alkyl group having 1 to 7 atoms, an aryl group having 6 to 12 carbon atoms, or an alicyclic hydrocarbon group having 6 to 10 carbon atoms, the monomer represented by the above (I) or (II) is 10 to 100 mass % Is used, and it is preferable because the adhesion is improved.
本發明之硬化性組成物中,相對於陽離子聚 合性成分(A)與自由基聚合性成分(C)與聚合物(E)之合計為100質量份,上述陽離子聚合性成分(A)為30~70質量份,上述陽離子聚合起始劑(B)為0.001~10質量份,上述自由基聚合性成分(C)為30~60質量份,上述自由基聚合起始劑(D)為1~10質量份,上述聚合物(E)為1~20質量份為佳。在上述調配比例以外時,硬化物之硬化性及密著性有變差的疑慮。 The curable composition of the present invention is The total of the synthesizable component (A), the radical polymerizable component (C) and the polymer (E) is 100 parts by mass, the cationically polymerizable component (A) is 30 to 70 parts by mass, and the cation polymerization initiator ( B) is 0.001 to 10 parts by mass, the radical polymerizable component (C) is 30 to 60 parts by mass, the radical polymerization initiator (D) is 1 to 10 parts by mass, and the polymer (E) is 1 ~ 20 parts by mass is preferred. When the blending ratio is outside the above range, there is a concern that the hardenability and adhesiveness of the hardened material are deteriorated.
本發明之硬化性組成物中,可依需要進一步使用增感劑及/或增感助劑。增感劑係於較陽離子聚合起始劑(B)所顯示之極大吸收波長更長的波長顯示極大吸收,促進藉由陽離子聚合起始劑(B)之聚合起始反應的化合物。又,增感助劑係更進一步促進增感劑之作用的化合物。 In the curable composition of the present invention, a sensitizer and / or a sensitizer can be further used as required. The sensitizer is a compound that exhibits maximum absorption at a wavelength longer than the maximum absorption wavelength shown by the cationic polymerization initiator (B), and promotes the polymerization initiation reaction by the cationic polymerization initiator (B). The sensitizer is a compound that further promotes the action of the sensitizer.
增感劑及增感助劑可列舉蒽系化合物、萘系化合物等。 Examples of the sensitizer and the sensitizer include anthracene-based compounds and naphthalene-based compounds.
蒽系化合物可列舉例如下述式(7)表示者。 Examples of the anthracene-based compound include those represented by the following formula (7).
此處,式(7)中,R50及R51各自獨立地表示氫原子、碳原子數1~6之烷基或碳原子數2~12之烷氧基烷基,R52表示氫原子或碳原子數1~6之烷基。 Here, in formula (7), R 50 and R 51 each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or an alkoxyalkyl group having 2 to 12 carbon atoms, and R 52 represents a hydrogen atom or An alkyl group having 1 to 6 carbon atoms.
列舉上述式(7)表示之蒽系化合物之具體例時,有如以下的化合物。 Specific examples of the anthracene-based compound represented by the formula (7) include the following compounds.
可列舉例如9,10-二甲氧基蒽、9,10-二乙氧基蒽、9,10-二丙氧基蒽、9,10-二異丙氧基蒽、9,10-二丁氧基蒽、9,10-二戊氧基蒽、9,10-二己氧基蒽、9,10-雙(2-甲氧基乙氧基)蒽、9,10-雙(2-乙氧基乙氧基)蒽、9,10-雙(2-丁氧基乙氧基)蒽、9,10-雙(3-丁氧基丙氧基)蒽、2-甲基-或2-乙基-9,10-二甲氧基蒽、2-甲基-或2-乙基-9,10-二乙氧基蒽、2-甲基-或2-乙基-9,10-二丙氧基蒽、2-甲基-或2-乙基-9,10-二異丙氧基蒽、2-甲基-或2-乙基-9,10-二丁氧基蒽、2-甲基-或2-乙基-9,10-二戊氧基蒽、2-甲基-或2-乙基-9,10-二己氧基蒽等。 Examples include 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-diisopropoxyanthracene, 9,10-dibutyl Anthracene, 9,10-dipentoxyanthracene, 9,10-dihexyloxyanthracene, 9,10-bis (2-methoxyethoxy) anthracene, 9,10-bis (2-ethyl (Oxyethoxy) anthracene, 9,10-bis (2-butoxyethoxy) anthracene, 9,10-bis (3-butoxypropoxy) anthracene, 2-methyl- or 2- Ethyl-9,10-dimethoxyanthracene, 2-methyl- or 2-ethyl-9,10-diethoxyanthracene, 2-methyl- or 2-ethyl-9,10-di Propoxyanthracene, 2-methyl- or 2-ethyl-9,10-diisopropoxyanthracene, 2-methyl- or 2-ethyl-9,10-dibutoxyanthracene, 2- Methyl- or 2-ethyl-9,10-dipentoxyanthracene, 2-methyl- or 2-ethyl-9,10-dihexyloxyanthracene, and the like.
萘系化合物可列舉例如下述式(8)表示者。 Examples of the naphthalene-based compound include those represented by the following formula (8).
此處,式(8)中,R53及R54各自獨立地表示碳原子數1~6之烷基。 Here, in Formula (8), R 53 and R 54 each independently represent an alkyl group having 1 to 6 carbon atoms.
列舉上述式(8)表示之萘系化合物之具體例時,有如以下的化合物。 Specific examples of the naphthalene-based compound represented by the formula (8) include the following compounds.
可列舉例如4-甲氧基-1-萘酚、4-乙氧基-1-萘酚、4-丙氧基-1-萘酚、4-丁氧基-1-萘酚、4-己氧基-1-萘酚、1,4-二甲氧基萘、1-乙氧基-4-甲氧基萘、1,4-二乙氧基萘、1,4-二丙氧基萘、1,4-二丁氧基萘等。 Examples include 4-methoxy-1-naphthol, 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyl Oxy-1-naphthol, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene , 1,4-dibutoxynaphthalene and the like.
相對於上述陽離子聚合性成分(A)而言,增 感劑及增感助劑之使用比例無特別限定,只要在不阻礙本發明之目的的範圍內,大致以通常使用比例使用即可,例如相對於上述陽離子聚合性成分(A)100質量份,由提高硬化性的觀點,增感劑及增感助劑各自為0.1~3質量份為佳。 Compared with the above-mentioned cationically polymerizable component (A), The use ratio of the sensitizer and the sensitizing aid is not particularly limited, and it may be used in a generally used ratio within a range that does not hinder the object of the present invention, for example, with respect to 100 parts by mass of the cation polymerizable component (A), From the viewpoint of improving the hardenability, the sensitizer and the sensitizing aid are each preferably 0.1 to 3 parts by mass.
本發明之硬化性組成物中,可依需要使用矽烷偶合劑。矽烷偶合劑可使用例如二甲基二甲氧基矽烷、二甲基二乙氧基矽烷、甲基乙基二甲氧基矽烷、甲基乙基二乙氧基矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三甲氧基矽烷等之烷基官能性烷氧基矽烷、乙烯基三氯矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、烯丙基三甲氧基矽烷等之烯基官能性烷氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基甲基二甲氧基矽烷、2-甲基丙烯醯氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷、γ-環氧丙氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等之環氧基官能性烷氧基矽烷、N-β(胺基乙基)-γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷等之胺基官能性烷氧基矽烷、γ-巰基丙基三甲氧基矽烷等之巰基官能性烷氧基矽烷、四異丙烷氧化鈦、四正丁烷氧化鈦等之烷氧化鈦類、鈦二辛氧基雙(伸辛基甘醇酸鹽)、鈦二異丙氧基雙(乙基乙醯乙酸鹽)等 之鈦鉗合物類、四乙醯丙酮鋯、三丁氧基單乙醯丙酮鋯等之鋯鉗合物類、三丁氧基硬脂酸鋯等之鋯醯化物類、甲基三異氰酸酯矽烷等之異氰酸酯矽烷類等。 In the curable composition of the present invention, a silane coupling agent can be used as necessary. As the silane coupling agent, for example, dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane -Functional alkoxysilanes such as methyltriethoxysilane, ethyltrimethoxysilane, ethyltrimethoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethyl Alkenyl-functional alkoxysilanes such as oxysilane, allyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethyl Oxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyl Epoxy-functional alkoxysilanes such as trimethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N -Phenyl -amino-functional alkoxysilanes such as -γ-aminopropyltrimethoxysilane, mercapto-functional alkoxysilanes such as γ-mercaptopropyltrimethoxysilane, tetraisopropane titanium oxide, tetra-n-butane Titanium alkoxides such as titanium alkoxides, titanium dioctyloxybis (ethylene octyl glycolate), titanium diisopropoxybis (ethylacetamidine acetate), etc. Titanium clamp compounds, zirconium tetraacetammonium acetone zirconium, zirconium triacetoxyzirconium acetonate, zirconium triacetoxide, zirconium tributoxide, etc., methyl triisocyanate silane Isocyanate silanes, etc.
上述矽烷偶合劑之使用量並無特別限定,通常,相對於硬化性組成物中之固形物全部量100質量份,為0.01~20質量份的範圍。 The amount of the silane coupling agent used is not particularly limited, and it is generally in the range of 0.01 to 20 parts by mass based on 100 parts by mass of the total amount of solids in the curable composition.
於本發明之硬化性組成物,依需要藉由使用熱可塑性有機聚合物,亦可改善硬化物之特性。熱可塑性有機聚合物,可列舉例如聚苯乙烯、聚甲基丙烯酸甲酯、甲基丙烯酸甲酯丙烯酸乙酯共聚物、甲基丙烯酸甲酯甲基丙烯酸縮水甘油酯共聚物、聚(甲基)丙烯酸、苯乙烯-(甲基)丙烯酸共聚物、(甲基)丙烯酸-甲基丙烯酸甲酯共聚物、(甲基)丙烯酸縮水甘油酯-聚甲基(甲基)丙烯酸酯共聚物、聚乙烯基縮丁醛、纖維素酯、聚丙烯醯胺、飽和聚酯等。 In the curable composition of the present invention, the properties of the cured product can also be improved by using a thermoplastic organic polymer as required. Examples of the thermoplastic organic polymer include polystyrene, polymethyl methacrylate, methyl methacrylate copolymer, methyl methacrylate glycidyl methacrylate copolymer, and poly (meth) Acrylic acid, styrene- (meth) acrylic acid copolymer, (meth) acrylic acid-methyl methacrylate copolymer, glycidyl (meth) acrylate-polymeth (meth) acrylate copolymer, polyethylene Butyral, cellulose ester, polypropylene amidamine, saturated polyester, etc.
本發明之硬化性組成物中,亦可依需要進一步使用紫外線吸收劑、或於常溫為不活性,且因加熱至特定溫度/光照射/酸等會使保護基脫離而活性化,展現紫外線吸收能力的化合物。 In the hardenable composition of the present invention, an ultraviolet absorber may be further used as required, or it may be inactive at normal temperature, and the protective group may be activated by detachment by heating to a specific temperature / light irradiation / acid, etc., and exhibit ultraviolet absorption. Ability compound.
又,只要不損及本發明之效果時,可依需要添加多元醇、無機填料、有機填料、顏料、染料等之著色劑、消泡劑、增黏劑、界面活性劑、平坦劑、難燃劑、觸變劑、稀釋劑、可塑劑、安定劑、聚合抑制劑、紫外線吸收劑、抗氧化劑、抗靜電劑、流動調整劑、接著促進劑等 之各種樹脂添加物等。 In addition, as long as the effect of the present invention is not impaired, colorants, defoamers, tackifiers, surfactants, leveling agents, flame retardants, polyhydric alcohols, inorganic fillers, organic fillers, pigments, and dyes can be added as needed Agents, thixotropic agents, diluents, plasticizers, stabilizers, polymerization inhibitors, ultraviolet absorbers, antioxidants, antistatic agents, flow regulators, adhesion promoters, etc. Various resin additives, etc.
本發明之硬化性組成物中,無特別限定,可使用通常所用之可溶解或分散上述(A)、(B)、(C)、(D)及(E)之各成分的溶劑。溶劑可列舉例如甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等之酮類;乙醚、二噁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、丙二醇單甲醚、二丙二醇二甲醚等之醚系溶劑;乙酸甲酯、乙酸乙酯、乙酸-n-丙酯、乙酸異丙酯、乙酸n-丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯、2,2,4-三甲基-1,3-戊二醇異丁酸(Texanol)等之酯系溶劑;乙二醇單甲醚、乙二醇單乙醚等之溶纖劑系溶劑;甲醇、乙醇、異-或n-丙醇、異-或n-丁醇、戊醇等之醇系溶劑;乙二醇單甲基乙酸酯、乙二醇單乙基乙酸酯、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、二丙二醇單甲醚乙酸酯、乙酸3-甲氧基丁酯、丙酸乙氧基乙酯等之醚酯系溶劑;苯、甲苯、二甲苯等之BTX系溶劑;己烷、庚烷、辛烷、環己烷等之脂肪族烴系溶劑;松節油、D-檸檬烯、蒎烯等之萜烯系烴油;礦油精、Swasol#310(Cosmo松山石油(股)公司製)、Solvesso#100(Exxon化學公司)等之鏈烷烴系溶劑;四氯化碳、氯仿、三氯乙烯、二氯甲烷、1,2-二氯乙烷等之鹵化脂肪族烴系溶劑;氯苯等之鹵化芳香族烴系溶劑;碳酸丙烯酯、卡必醇系溶劑、苯胺、三乙胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基 乙醯胺、N-甲基吡咯烷酮、二甲基亞碸、水等。此等溶劑可使用1種或以2種以上之混合溶劑使用。 The curable composition of the present invention is not particularly limited, and a solvent generally used for dissolving or dispersing the components (A), (B), (C), (D), and (E) may be used. Examples of the solvent include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, and 2-heptanone; Ether solvents such as diethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether, and dipropylene glycol dimethyl ether; methyl acetate, Ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, 2,2,4-trimethyl-1,3 -Ester solvents such as pentanediol isobutyric acid (Texanol); cellulosic solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; methanol, ethanol, iso- or n-propanol, iso- Or alcohol solvents such as n-butanol and pentanol; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA) , Dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, ethoxyethyl propionate and other ether ester solvents; BTX solvents such as benzene, toluene, xylene; hexane, heptane , Aliphatic hydrocarbon solvents such as octane, cyclohexane; turpentine, D-limonene Terpene-based hydrocarbon oils such as terpinene and paraffin; paraffinic solvents such as mineral spirits, Swasol # 310 (manufactured by Cosmo Matsuyama Petroleum Co., Ltd.), Solvesso # 100 (Exxon Chemical Company), etc .; carbon tetrachloride, chloroform Halogenated aliphatic hydrocarbon solvents such as trichloroethylene, dichloromethane, 1,2-dichloroethane; halogenated aromatic hydrocarbon solvents such as chlorobenzene; propylene carbonate, carbitol solvents, aniline, Ethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N-dimethylformamide, N, N-dimethyl Acetylamine, N-methylpyrrolidone, dimethylsulfinium, water, and the like. These solvents may be used singly or in a mixture of two or more kinds.
本發明之硬化性組成物會提高硬化性、接著性、液體保存安定性,故水分量為5質量份以下較佳,又更佳為3質量份以下。水分過多時,有產生白濁或成分析出之疑慮,故不佳。 Since the hardenable composition of the present invention improves hardenability, adhesion, and liquid storage stability, the moisture content is preferably 5 parts by mass or less, and more preferably 3 parts by mass or less. When there is too much water, it may cause turbidity or analysis, so it is not good.
本發明之硬化性組成物以輥塗佈器、淋幕塗佈器、各種之印刷、浸漬等之公知手段適用於支撐基體上。又,可一旦施於薄膜等之支撐基體上後,轉印於其他支撐基體上,其適用方法並無限制。 The hardenable composition of the present invention is applied to a support substrate by a well-known means such as a roll coater, a curtain coater, and various printing and dipping methods. In addition, once it is applied to a supporting substrate such as a film, it can be transferred to another supporting substrate, and there is no limitation on the applicable method.
上述支撐基體之材料,無特別限制,可使用通常所使用者,可列舉例如玻璃等之無機材料;二乙醯基纖維素、三乙醯基纖維素(TAC)、丙醯基纖維素、丁醯基纖維素、乙醯基丙醯基纖維素、硝基纖維素等之纖維素酯;聚醯胺;聚醯亞胺;聚胺基甲酸酯;環氧樹脂;聚碳酸酯;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯、聚-1,4-環己烷二亞甲基聚對苯二甲酸酯、聚乙烯-1,2-二苯氧基乙烷-4,4’-二羧酸酯、聚對苯二甲酸丁二酯等之聚酯;聚苯乙烯;聚乙烯、聚丙烯、聚甲基戊烯等之聚烯烴;聚乙酸乙烯酯、聚氯乙烯、聚氟乙烯等之乙烯基化合物;聚甲基丙烯酸甲酯、聚丙烯酸酯等之丙烯酸系樹脂;聚碳酸酯;聚碸;聚醚碸;聚醚酮;聚醚醯亞胺;聚氧乙烯、降莰烯樹脂、環烯烴聚合物(COP)等之高分子材料。又,亦可對上述支撐基體進行電暈放電處 理、火焰處理、紫外線處理、高頻處理、輝光放電處理、活性電漿處理、雷射處理等之表面活性化處理。 The material of the above-mentioned support substrate is not particularly limited, and ordinary users can be used, and examples thereof include inorganic materials such as glass; diethyl cellulose, triethyl cellulose (TAC), propyl cellulose, and butyl cellulose. Cellulose esters of cellulose, ethoxypropyl cellulose, nitrocellulose, etc .; Polyamines; Polyimides; Polyurethanes; Epoxy Resins; Polycarbonates; Polyparaphenylene terephthalates Ethylene formate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene polyterephthalate, polyethylene-1,2- Diphenoxyethane-4,4'-dicarboxylate, polyesters such as polybutylene terephthalate; polystyrene; polyolefins such as polyethylene, polypropylene, polymethylpentene; Vinyl compounds such as polyvinyl acetate, polyvinyl chloride, and polyvinyl fluoride; acrylic resins such as polymethylmethacrylate and polyacrylate; polycarbonate; polyfluorene; polyetherfluorene; polyetherketone; poly Etherimide; polymer materials such as polyoxyethylene, norbornene resin, and cycloolefin polymer (COP). In addition, a corona discharge can be performed on the support substrate. Surface activation treatment such as heat treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, activated plasma treatment, laser treatment, etc.
藉由能量線照射本發明之硬化性組成物使硬化的方法中,能量線可列舉紫外線、電子線、X射線、放射線、高頻等,紫外線在經濟上最佳。紫外線之光源,可列舉紫外線雷射、水銀燈、氙雷射、金屬鹵素燈等。 In the method for curing by irradiating the curable composition of the present invention with energy rays, examples of the energy rays include ultraviolet rays, electron rays, X-rays, radiation, and high frequencies. Ultraviolet rays are most economically optimal. Examples of the ultraviolet light source include ultraviolet lasers, mercury lamps, xenon lasers, and metal halide lamps.
將本發明之硬化性組成物藉由加熱而硬化的方法的條件為70~250℃、1~100分鐘。可於預烤(PAB;Pre applied bake)之後加壓進行後烘烤(PEB;Post exposure bake);亦可以不同的數階段的溫度烘烤。加熱條件雖依各成分之種類及摻合比例而異,但例如70~180℃下,烘箱為5~15分鐘,加熱板則為1~5分鐘。然後,為了使塗膜硬化,藉由於180~250℃,較佳為200~250℃,於烘箱為30~90分鐘,加熱板則為5~30分鐘進行加熱處理,可得到硬化膜。 The conditions for the method of hardening the curable composition of the present invention by heating are 70 to 250 ° C. and 1 to 100 minutes. After pre-baking (PAB; Pre applied bake), it can be pressurized for post-baking (PEB; Post exposure bake). It can also be baked at different stages of temperature. Although the heating conditions vary depending on the type and blending ratio of each component, for example, at 70 to 180 ° C, the oven is 5 to 15 minutes, and the heating plate is 1 to 5 minutes. Then, in order to harden the coating film, a hardened film can be obtained by heating at 180 to 250 ° C, preferably 200 to 250 ° C, in an oven for 30 to 90 minutes, and for a heating plate for 5 to 30 minutes.
本發明之硬化性組成物或其硬化物之具體的用途,可列舉接著劑、眼鏡、以攝影用透鏡為代表之光學材料、塗料、塗覆劑、襯墊(lining)劑、油墨、阻劑、液狀阻劑、印刷版、彩色電視、PC監視器、行動資訊終端、數位相機、有機EL、觸控面板等之顯示元件、絕緣清漆、絕緣薄片、層合板、印刷基板、半導體裝置用/LED封裝用/液晶注入口用/有機EL用/光元件用/電絕緣用/電子零件用/分離膜用等之封裝劑、成形材料、油灰、玻璃纖維含浸劑、木粉填料、半導體用/太陽電池用等之鈍化膜、 層間絕緣膜、保護膜、液晶顯示裝置之背光所使用之稜鏡透鏡薄片、投影電視等之螢幕所使用之菲涅耳透鏡薄片、雙凸透鏡薄片等之透鏡薄片之透鏡部、或使用這種薄片之背光等、微透鏡等之光學透鏡、光學元件、光連接器、光波導、光學造形用鑄型劑等。 Specific uses of the curable composition of the present invention or its cured product include adhesives, glasses, optical materials typified by photographic lenses, coatings, coating agents, lining agents, inks, and resists. , Liquid resists, printing plates, color TVs, PC monitors, mobile information terminals, digital cameras, organic ELs, touch panels and other display elements, insulating varnishes, insulating sheets, laminates, printed boards, semiconductor devices / Packaging materials for LED encapsulation / liquid crystal injection port / organic EL / optical element / electrical insulation / electronic parts / separation film, molding materials, putty, glass fiber impregnating agent, wood powder filler, semiconductor / Passive film for solar cells, etc. Interlayer insulation film, protective film, lenticular lens sheet used in backlight of liquid crystal display devices, Fresnel lens sheet used in screens of projection televisions, lens parts such as lenticular lens sheets, or the like Backlights, optical lenses such as micro lenses, optical elements, optical connectors, optical waveguides, molding agents for optical shaping, etc.
顯示裝置可列舉於透明支撐體上依需要設置有底塗層、抗反射層、偏光元件層、相位差層、雙折射率層、光散射層、硬質塗層、潤滑層、保護層等之各層者,於各層可使用由本發明之硬化物所成的薄膜。 The display device can include various layers provided with a base coat, an anti-reflection layer, a polarizing element layer, a retardation layer, a birefringence layer, a light scattering layer, a hard coating layer, a lubricating layer, a protective layer, etc. on a transparent support as required. Alternatively, a thin film made of the cured product of the present invention can be used for each layer.
以下列舉實施例等更詳細說明本發明,但本發明不限定於此等實施例。 Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples.
以下述[表1]~[表3]所示之調配,將各成分充分地混合,得到各實施例1~15之硬化性組成物及比較例1~3之硬化性組成物。又,實施例及比較例之單位為質量份。 The components shown in the following [Table 1] to [Table 3] were sufficiently mixed to obtain the curable composition of each of Examples 1 to 15 and the curable composition of Comparative Examples 1 to 3. Moreover, the unit of an Example and a comparative example is a mass part.
陽離子聚合性成分(A)係使用下述化合物(A1-1)~(A1-3)、(A2-1)~(A3-1)。 The cationically polymerizable component (A) uses the following compounds (A1-1) to (A1-3) and (A2-1) to (A3-1).
化合物(A1-1):ADEKA RESINEP-4088L((股)ADEKA公司製) Compound (A1-1): ADEKA RESINEP-4088L ((shares) made by ADEKA)
化合物(A1-2):1,6-己二醇二環氧丙醚 Compound (A1-2): 1,6-hexanediol diglycidyl ether
化合物(A1-3):新戊二醇二環氧丙醚 Compound (A1-3): neopentyl glycol diglycidyl ether
化合物(A2-1):ARON OXETANE OXT-221(東亞合成(股)公司製) Compound (A2-1): ARON OXETANE OXT-221 (manufactured by Toa Kosei Co., Ltd.)
化合物(A3-1):CELLOXID2021P(脂環式環氧基:(股)DAICEL公司製) Compound (A3-1): CELLOXID2021P (alicyclic epoxy group: (manufactured by DAICEL))
陽離子聚合起始劑(B)使用下述化合物(B-1)。 As the cationic polymerization initiator (B), the following compound (B-1) was used.
化合物B-1:下述式(9)表示之化合物及下述式(10)表示之化合物之混合物的碳酸丙烯酯50%溶液 Compound B-1: a 50% solution of a propylene carbonate solution of a mixture of a compound represented by the following formula (9) and a compound represented by the following formula (10)
自由基聚合性成分(C)使用下述化合物(C2-1)~(C2-4)。 As the radical polymerizable component (C), the following compounds (C2-1) to (C2-4) were used.
化合物(C2-1):1,6-己二醇二丙烯酸酯 Compound (C2-1): 1,6-hexanediol diacrylate
化合物(C2-2):三環癸烷二甲醇二丙烯酸酯 Compound (C2-2): Tricyclodecane dimethanol diacrylate
化合物(C2-3):乙氧基化異三聚氰酸三丙烯酸酯 Compound (C2-3): ethoxylated isotricyanate triacrylate
化合物(C2-4):四氫糠基丙烯酸酯 Compound (C2-4): tetrahydrofurfuryl acrylate
自由基聚合起始劑(D)使用下述化合物(D-1)。 As the radical polymerization initiator (D), the following compound (D-1) was used.
化合物(D-1):IRGACURE184(BASF公司製) Compound (D-1): IRGACURE184 (manufactured by BASF)
聚合物(E)使用下述化合物(E-1)及(E-2)。 As the polymer (E), the following compounds (E-1) and (E-2) were used.
化合物(E-1):甲基甲基丙烯酸酯75質量份與環氧丙基甲基丙烯酸酯25質量份之共聚物(重量平均分子量7,000) Compound (E-1): a copolymer of 75 parts by mass of methmethacrylate and 25 parts by mass of glycidyl methacrylate (weight average molecular weight 7,000)
化合物(E-2):甲基甲基丙烯酸酯35質量份、苯乙烯35質量份及環氧丙基甲基丙烯酸酯30質量份之共聚物(重量平均分子量8,000) Compound (E-2): a copolymer of 35 parts by mass of methmethacrylate, 35 parts by mass of styrene, and 30 parts by mass of epoxypropylmethacrylate (weight average molecular weight 8,000)
關於所得之實施例1~15及比較例1~3之各硬化性組成物,依據下述步驟,評價玻璃轉移溫度(Tg)、彈性模數及密著性。結果一併記載於[表1]~[表3]。 Regarding each of the obtained hardenable compositions of Examples 1 to 15 and Comparative Examples 1 to 3, the glass transition temperature (Tg), elastic modulus, and adhesion were evaluated according to the following procedures. The results are described in [Table 1] to [Table 3].
將所得之實施例1~15及比較例1~3之各硬化性組成物分別以塗佈棒塗佈於聚對苯二甲酸乙二酯(PET)薄膜上形成30μm的厚度,使用金屬鹵素燈照射3000mJ/cm2之能量。24小時後,自薄膜取出接著劑硬化物,使用(股)Hitachi High-Tech Science製之黏彈性測量裝置(DMA7100),測量Tg及80℃下之彈性模數。 Each of the obtained hardening compositions of Examples 1 to 15 and Comparative Examples 1 to 3 were coated on a polyethylene terephthalate (PET) film with a coating rod to form a thickness of 30 μm, and a metal halide lamp was used. Irradiated with energy of 3000mJ / cm 2 . After 24 hours, the adhesive cured product was taken out from the film, and the viscoelasticity measuring device (DMA7100) manufactured by Hitachi High-Tech Science was used to measure Tg and the elastic modulus at 80 ° C.
將上述所得之實施例之組成物1~15與比較例之組成物1~3,各自塗佈於一片電暈處理PMMA薄膜(住友化學(股)公司製:Technolloy 125S001)後,使用層合機與另一片經電暈放電處理的COP(環烯烴聚合物、日本Zeon(股)公司製:型號Zeonor Film 14-060)薄膜貼合,使用無電極紫外光燈透過COP薄膜照射相當於1000mJ/cm2之光進行接著,以得到試驗片。對於所得之試驗片進行90度剝離試驗。 The compositions 1 to 15 of the examples obtained above and the compositions 1 to 3 of the comparative examples were each coated on a corona-treated PMMA film (Technolloy 125S001 manufactured by Sumitomo Chemical Co., Ltd.), and then a laminator was used. Laminated with another piece of COP (cycloolefin polymer, Japan Zeon Corporation: Model Zeonor Film 14-060) film that has been treated with corona discharge. The electrodeless ultraviolet light is equivalent to 1000mJ / cm through the COP film. The light of 2 was followed to obtain a test piece. The obtained test piece was subjected to a 90-degree peel test.
由[表1]~[表3],得知本發明之硬化性組成物係硬化物之玻璃轉移溫度高,密著性優異。 From [Table 1] to [Table 3], it is understood that the hardened composition-based hardened material of the present invention has a high glass transition temperature and excellent adhesion.
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