TW201803436A - Transfer method and mounting method - Google Patents

Abstract

The present invention addresses the problem of providing a technology of transferring a paste to an electronic component. As a means for solving the problem, a paste (11) is provided on a table (10), and an electronic component (13) is provided on a sheet (14). The table (10) and the sheet (14) are provided by having a space therebetween such that the paste (11) and the electronic component (13) are facing each other. The sheet (14) is warped so that the paste (11) and the electronic component (13) are close to each other, and the electronic component (13) is pressed to the paste (11). The paste (11) is adhered to the electronic component (13) by separating the electronic component (13) from the paste (11) that has been provided on the table (10).

Description

Transfer method and installation method

The invention relates to a transfer technology and a mounting technology using the transfer technology.

Japanese Patent Application Laid-Open No. 2011-82242 (Patent Document 1) describes a method for transferring a paste (adhesive) attached to a lower end of a transfer pin to a predetermined position on a substrate, and mounting (installing) electronic components at the position. technology.

Prior art literature Patent literature

Patent Document 1 Japanese Patent Application Publication No. 2011-82242

However, the technology described in Patent Document 1 requires a transfer pin that matches the size (ie, the amount of paste) of the electronic component, and must be exchanged for each electronic component. In addition, in order to transfer the paste to a predetermined position of the substrate and to mount electronic components in accordance with the position, it is necessary to align the position with high accuracy, and it takes time to adjust. As described above, when a step of transferring a paste to a substrate using a transfer pin is included, there is a possibility that productivity may decrease. Or in the case where a high positioning accuracy is required for the transfer device and the mounting device, the structure becomes complicated and the device price becomes high.

An object of the present invention is to provide a technology capable of transferring a paste to an electronic component. In addition, one object of the present invention, other objects, and novel features can be clearly understood from the description of the specification and the drawings of the appended drawings.

A brief description of the representative among the inventions disclosed in this case is as follows.

A transfer method according to one aspect of the present invention includes: (a) a step of placing a paste on a first installation portion; (b) a step of placing an electronic component on a second installation portion; (c) using The step of arranging the first setting portion and the second setting portion in a spaced manner in which the paste and the electronic component face each other; (d) the first setting portion or the second setting portion is elastic A step of gradually bending the sheet so that the paste and the electronic part are close to each other, and pressing the electronic part against the paste; and (e) moving the electronic part from the part provided in the first installation section to the part. The step of leaving the paste and attaching the paste to the electronic component. Accordingly, the paste can be transferred to an electronic component.

More preferably, in the step (a), the thickness of the paste is made uniform using a doctor blade. Accordingly, by adjusting the distance between the blade and the first installation portion, the thickness of the paste can be adjusted.

More preferably, in the step (b), a plurality of the electronic components are provided in the second installation portion, and in the step (d), the plurality of the electronic components are pressed against the paste at one time. Accordingly, the productivity can be improved more than in the case where the paste is transferred for each electronic component.

More preferably, in the step (a), the paste is provided on a first surface of the first installation portion, and in the step (b), the second surface of the second installation portion is provided. The electronic component is provided, and in the step (c), the first installation portion and the second installation portion are parallel to each other so that the first surface of the first installation portion and the second surface of the second installation portion are parallel to each other. The setting section is provided at intervals. Accordingly, the amount of the paste transferred to the electronic component can be easily adjusted.

More preferably, before the step (d), the sheet is formed into a flat state. In the step (d), a pressing portion having an end surface and a shape tapering toward the end surface is used, so that the end surface of the pressing portion is flat. The sheet in the state is parallel, and the sheet is pressed and bent by the pressing portion. According to this, it is possible to prevent the sheet from being broken at the edge portion of the end surface of the pressing portion.

More preferably, the first installation portion is a table, the second installation portion is the sheet, and in the step (d), the sheet is made to face the paste from a side opposite to a side where the electronic component is provided. bending. Accordingly, the electronic component can be pressed against the paste. More preferably, the paste provided on the workbench is maintained at a predetermined temperature by a temperature adjustment mechanism attached to the workbench. Accordingly, the viscosity of the paste is stabilized, and the quality of the transfer can be improved.

More preferably, the first setting portion is the sheet, the second setting portion is a table, and in the step (d), the sheet is oriented toward the electronic component from an opposite side to a side on which the paste is provided. bending. Accordingly, the paste can be pressed against the electronic component. In other words, the electronic component can be pressed against the paste relatively.

In the mounting method including the transfer method, after the step (e), it is more preferable to mount the electronic component on a substrate via the paste. Accordingly, the electronic component can be mounted on the substrate without transferring the paste to the substrate.

A brief description of the representative among the inventions disclosed in this case is as follows. According to a transfer method of a solution of the present invention, a paste can be transferred to an electronic part.

10‧‧‧Workbench

11‧‧‧ paste

13‧‧‧Electronic parts

14‧‧‧ sheet

FIG. 1 is a schematic explanatory diagram of a mounting method (transfer method) according to an embodiment of the present invention.

FIG. 2 is a schematic explanatory diagram of a mounting method (transfer method) subsequent to FIG. 1. FIG.

FIG. 3 is a schematic explanatory diagram of a mounting method (transfer method) subsequent to FIG. 2.

FIG. 4 is a schematic explanatory diagram of a mounting method (transfer method) subsequent to FIG. 3.

FIG. 5 is a schematic explanatory diagram of a mounting method (transfer method) subsequent to FIG. 4.

FIG. 6 is a schematic explanatory diagram of a mounting method subsequent to FIG. 5.

FIG. 7 is a schematic explanatory diagram of a mounting method (transfer method) according to another embodiment of the present invention.

FIG. 8 is a schematic explanatory diagram of a mounting method (transfer method) subsequent to FIG. 7.

FIG. 9 is a schematic explanatory diagram of a mounting method (transfer method) subsequent to FIG. 8.

FIG. 10 is a schematic explanatory diagram of a mounting method (transfer method) subsequent to FIG. 9.

FIG. 11 is a schematic explanatory diagram of a mounting method (transfer method) subsequent to FIG. 10.

In the following embodiments of the present invention, if necessary, it will be divided into a plurality of paragraphs and the like for explanation. In principle, they are not mutually independent, but one is a modification or details of one or all of them. And other relationships. Therefore, in all the drawings, members having the same function are given the same reference numerals, and redundant descriptions are omitted. In addition, the number of constituent elements (including the number, numerical value, amount, range, and the like) is not limited to a specific number, except for a case where it is specifically stated or a case where it is clearly limited to a specific number in principle. It is a specific number or more. In addition, when referring to the shapes of the constituent elements and the like, except for the case where it is specifically stated and the case where it is clearly clear in principle that it is not the case, etc., it is assumed to include substantially similar or similar shapes.

(First Embodiment)

A mounting method including a transfer method according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6. 1 to 6 are schematic explanatory diagrams of the mounting method. In this embodiment, the transfer process of the present invention is applied to a mounting step (bonding step) included in a manufacturing method of a semiconductor device (electronic device). That is, the paste 11 is transferred to the electronic component 13 (FIG. 5), and this electronic component 13 is mounted on the substrate 16 (FIG. 6). Electronic parts In terms of 13, semiconductor wafers (IC wafers, LED wafers, etc.) are used. As the substrate 16, a ceramic substrate, a printed substrate, a lead frame, or the like is used.

First, as shown in FIG. 1, a transfer table 10 is prepared as a paste installation section (first installation section) in which a paste 11 is provided. The table 10 has a flat surface 10a (the upper surface in the figure) and is fixed. The paste 11 is, for example, ejected from a dispenser (not shown) and is placed on the surface 10a. In this embodiment, an anisotropic conductive paste is used as the paste 11. The anisotropic conductive paste is one in which conductive particles are contained in a thermosetting resin. The conductive particles include solder particles or a metal film formed on the surface of the resin particles. A temperature adjustment mechanism (not shown) may be added to the table 10. By this, the temperature adjustment mechanism maintains the paste 11 provided on the workbench 10 at a predetermined temperature, stabilizes the viscosity of the paste 11 and can improve the quality of the transfer.

Next, as shown in FIG. 2, the thickness of the paste 11 is adjusted, and the paste 11 is set on the table 10. Specifically, in a state where the paste 11 is placed on the surface 10 a of the table 10, the scrape 12 is used to move the paste 11 to expand the paste 11 into a surface shape, and the thickness is uniform (the paste 11 is formed). film). At this time, the size of the paste 11 formed in a planar shape on the table 10 is larger than the area occupied by the plurality of electronic components 13 (FIG. 3) provided on the sheet 14. By adjusting the distance between the scraper blade 12 (front end) and the surface 10 a of the table 10 (the amount of pressing of the scraper blade 12), the thickness of the paste 11 can be adjusted. By making the thickness of the paste 11 uniform in advance, it becomes easy to adjust the amount of the paste 11 transferred to the electronic component 13.

Next, as shown in FIG. 3, an elastic sheet 14 is prepared as a component installation portion (second installation portion) in which the electronic component 13 is provided. electronic The component 13 has a surface 13b (lower surface in the figure) on which the electrode 13a (see FIG. 6) is provided as an external connection terminal, and a surface 13c (upper surface) on the opposite side. The sheet 14 has a surface 14a (lower surface in the figure) and a surface 14b (upper surface) on the opposite side. Here, the surface 13 c of the electronic component 13 and the surface 14 a of the sheet 14 are in contact with each other, so that the electronic component 13 is provided (attached) to the sheet 14.

In the present embodiment, when a plurality of semiconductor wafers serving as the electronic components 13 are provided on the sheet 14, first, the sheet 14 (for example, an adhesive sheet such as a dicing sheet) is attached to the semiconductor wafer. Here, the sheet 14 is made flat, and a semiconductor wafer is attached to the center of the sheet 14. By using a sheet holding portion such as a clamp ring (a structure in which the outer peripheral portion of the sheet 14 is sandwiched by the inner ring and the outer ring), the sheet 14 is held in a stretched and flat state. Next, when the sheet 14 is cut together with the semiconductor wafer, and then the sheet 14 is expanded, a plurality of electronic components 13 are provided in a central portion of the sheet 14.

As shown in FIG. 3, the pressing portion is a head 15 for transfer. The head portion 15 is configured to be reciprocally movable by a known driving mechanism such as a linear motor or a ball screw mechanism (upward and downward movement in the figure). Thereby, the head 15 can be approached or moved away from the fixed table 10. The head portion 15 has an end surface 15 a (the lower surface in the figure) and an inclined surface 15 b (a chamfered portion), and is formed into a shape that is tapered toward the end surface 15 a. When the sheet 14 is pressed by the head 15, the head 15 can prevent the sheet 14 from being broken at the edge of the end surface 15 a of the head 15.

Next, as shown in FIG. 3, the table 10 and the sheet 14 are arranged at intervals with the paste 11 and the electronic component 13 facing each other. Here, the surface 10a of the table 10 and the surface 14a of the sheet 14 are formed. In a parallel manner, the table 10 and the sheet 14 are arranged at intervals. Accordingly, when the electronic component 13 is pressed against the thinned paste 11, the amount of the paste 11 transferred to the electronic component 13 can be easily adjusted. Further, the sheet 14 and the head portion 15 are provided at intervals with the surface 14 b of the sheet 14 and the end surface 15 a of the head portion 15 parallel to each other.

Therefore, as shown in FIG. 3, the sheet 14 on which the electronic component 13 is provided is disposed above the table 10 on which the thinned paste 11 is provided, and the head 15 is disposed above the sheet 14. In the present embodiment, the standby state is set when the positions (standby position) of the table 10, the sheet 14, and the head 15 are located.

Next, as shown in FIG. 4, the sheet 14 is gradually bent so that the paste 11 and the electronic component 13 are close to each other, and the electronic component 13 is pressed against the paste 11. Specifically, from the state shown in FIG. 3, the head portion 15 is used to lower the head portion 15 to bend the sheet 14 from the side opposite to the side on which the electronic components 13 are provided. Thereby, the electronic component 13 can be pressed against the paste 11. At this time, the end surface 15 a of the head 15 is made parallel to the flat sheet 14, and the sheet 14 is pressed by the head 15 to bend the sheet 14. With this, the amount of movement of the head portion 15 can easily adjust the amount of the paste 11 transferred to the electronic component 13.

Further, the outer peripheral portion of the sheet 14 is placed in a standby position to bend the sheet 14. In this embodiment, since the clamp ring is fixed and the sheet 14 (other peripheral portion) is held thereon, the outer peripheral portion of the sheet 14 is in the standby position. Accordingly, the center portion of the sheet 14 can be projected toward the paste 11 in a state where the outer peripheral portion of the sheet 14 is in the standby position. That is, the electronic component 13 can be pressed from the sheet 14 to the paste 11. In addition, the outer peripheral portion of the sheet 14 may be vacuum-sucked to be held in the standby position.

The plurality of electronic components 13 are pressed toward the paste 11 at a time. As a result, productivity can be improved more than when the paste 11 is transferred by the electronic component 13. In the present embodiment, the size of the end surface 15 a of the head 15 is larger than the area (planar area) occupied by the plurality of electronic components 13 provided on the sheet 14. According to such a head portion 15, a plurality of electronic components 13 can be transferred (coated) with the paste 11 at one time.

Next, as shown in FIG. 5, the electronic component 13 is separated from the paste 11 provided on the table 10 to attach the paste 11 to the electronic component 13. Specifically, the head portion 15 is moved upward from the table 10 (to be gradually raised) until the bent sheet 14 returns to the standby state. That is, the electronic component 13 attached to the sheet 14 is peeled from the paste 11 provided on the table 10. In this case, the paste 11 may be adhered to the surface 13 b of the electrode 13 a on which the electronic component 13 is provided.

In this way, the paste 11 can be transferred to the electronic component 13 attached to the sheet 14. In addition, in order to confirm whether the paste 11 is transferred to the electronic component 13, the image data captured from the camera may be analyzed.

Thereafter, as shown in FIG. 6, the electronic component 13 is mounted on the substrate 16 via the paste 11. Specifically, the case where the paste 11 is an anisotropic conductive paste containing solder particles 11b (conductive particles) in the thermosetting resin 11a will be described. First, the electrode 16 a (pattern) of the substrate 16 and the electrode 13 a of the electronic component 13 are opposed to each other, and the electronic component 13 is arranged on the substrate 16. Next, the solder particles 11b are melted by a heater, for example, to about 160 ° C. The molten solder particles 11b gradually adhere to each other between the electrode 13a and the electrode 16a. Next, the temperature of the heater is lowered to about 140 ° C., thereby thermosetting the thermosetting resin 11 a.

In this way, the electronic component 13 can be mounted on the substrate 16. The electrode 13a of the electronic component 13 and the electrode 16a of the substrate 16 are electrically connected by the paste 11 (solder particles 11b). According to the mounting method of this embodiment, when the paste 11 is transferred to a predetermined position (electrode 16a) of the substrate 16, and then the electrode 13a of the electronic component 13 is mounted according to the position, the number of alignment can be reduced, which can be achieved. Increase in productivity and accuracy.

In addition, the case where the anisotropic conductive paste containing the metal film (conductive particle) in which the metal film was formed in the resin particle surface in the thermosetting resin 11a may be used as the paste 11. In this case, as long as the electronic component 13 is disposed on the substrate 16, the substrate 16 is pressurized by the heater while the electronic component 13 is pressurized, so that the electrode 13a and the electrode 16a are sandwiched with the conductive particles so as to be thermosetting. The resin 11a may be thermally cured.

(Second Embodiment)

A mounting method including a transfer method according to an embodiment of the present invention will be described with reference to FIGS. 7 to 11. 7 to 11 are schematic explanatory diagrams of a mounting method. In the first embodiment (refer to FIG. 3), the case where the paste setting section provided with the paste 11 is set as the table 10 and the part setting section provided with the electronic components 13 is set as the sheet 14 has been described. On the other hand, in this embodiment (refer to FIG. 9), there is a difference in that the paste setting portion is set to the sheet 30 and the component setting portion is set to the table 31. The following description focuses on the differences.

First, as shown in FIG. 7, a sheet 30 having elasticity is prepared as a paste setting portion on which the paste 11 is provided. The sheet 30 has a surface 30a (upper surface in the figure) and a surface 30b (lower surface) on the opposite side. About this sheet 30, For example, a cut sheet or an extended sheet can be used. The sheet 30 in the state shown in FIG. 7 is laid on the upper surface of a table (not shown). The paste 11 is discharged from, for example, a dispenser (not shown), and is placed on (placed on) the surface 30 a of the sheet 30. In this embodiment, an anisotropic conductive paste is used as the paste 11.

Next, as shown in FIG. 8, the thickness of the paste 11 is adjusted to set the paste U11 on the sheet 30. Specifically, in a state where the paste 11 is placed on the surface 30 a of the sheet 30, the scraper 12 is used to move the paste 11 to expand the paste 11 into a planar shape to make the thickness uniform (a film of the paste 11). Here, the paste 11 is provided in the center of the sheet 30. At this time, the plan view of the paste 11 formed on the sheet 30 is larger than the area occupied by the plurality of electronic components 13 (FIG. 9) provided on the table 31.

Next, as shown in FIG. 9, a transfer table 31 is prepared with a component installation portion provided with the electronic component 13. This table 31 has a flat surface 31a (bottom in the figure) and is fixed. Here, the surface 13c of the electronic component 13 is opposed to the surface 31a of the table 31, and the electronic component 13 is provided on the table 31 via a sheet 32 (for example, an adhesive sheet such as a cutting sheet). At this time, for example, the sheet 31 to which the electronic component 13 is attached can be held by the surface 31 a of the table 31.

As shown in FIG. 9, a transfer head 15 is prepared on the pressing portion side. The head portion 15 having the end surface 15a (in the figure, the upper surface) is configured to be reciprocated by a known driving mechanism such as a linear motor or a ball screw mechanism (in the figure, it moves up and down). Thereby, the head 15 can be approached or moved away from the fixed table 31.

However, the sheet 30 and the table 31 are arranged at intervals with the paste 11 and the electronic component 13 facing each other. Here, the sheet 30 and the table 31 are provided at intervals with the surface 30 a of the sheet 30 and the surface 31 a of the table 31 parallel to each other.

Therefore, as shown in FIG. 9, the electronic component 13 provided on the surface 31 a of the table 31 is disposed above the sheet 30 provided with the film 11 of the paste 11, and the head portion 15 is disposed below the sheet 30. In the present embodiment, the standby state is set when the positions (standby position) of the table 31, the sheet 30, and the head 15 are located.

Next, as shown in FIG. 10, the sheet 30 is gradually bent so that the paste 11 and the electronic component 13 are close to each other, and the paste 11 is pressed against the electronic component 13. Specifically, using the head portion 15, the head portion 15 is raised from the side opposite to the side on which the paste 11 is provided so as to face the electronic component 13 and the sheet 30 is bent. Thereby, the electronic component 13 can be pressed relatively to the paste 11.

Here, the sheet 30 is bent so that the outer peripheral part of the sheet 30 is in a standby position. The outer peripheral portion of the sheet 30 can be held in a standby position by, for example, vacuum suction. Accordingly, when the outer peripheral portion of the sheet 30 is in the standby position, the central portion of the sheet 30 can be made to protrude toward the electronic component 13 by the head portion 15. That is, the paste 11 can be protruded from the sheet 30 and pressed against the electronic component 13.

The plurality of electronic components 13 are pressed toward the paste 11 at one time. Accordingly, the productivity can be improved more than the case where the paste 11 is transferred for each electronic component 13. In this embodiment, the size of the end surface 15a of the head 15 is made larger than the plural number provided on the table 31. The area (planar area) occupied by each electronic component 13 is also large. According to such a head portion 15, the paste 11 can be transferred to a plurality of electronic components 13 at a time.

Next, as shown in FIG. 11, the paste 11 is separated from the electronic component 13 provided on the table 31 to attach the paste 11 to the electronic component 13. Specifically, the head 15 is gradually separated (gradually lowered) downward from the table 31 until the curved sheet 30 is returned to the standby state. That is, the paste 11 provided on the sheet 30 is peeled from the electronic component 13 provided on the table 31. In this case, the paste 11 may be adhered to the surface 13 b of the electrode 13 a on which the electronic component 13 is provided.

In this way, the paste 11 can be transferred to the electronic component 13 provided on the table 31. Thereafter, as described with reference to FIG. 6, the electronic component 13 is mounted on the substrate 16 via the paste 11. Accordingly, even if the paste 11 is not transferred to the substrate 16, the electronic component 13 can be mounted on the substrate 16. Therefore, as in the first embodiment, productivity and accuracy can be improved.

As mentioned above, the present invention has been specifically described based on the embodiments. The present invention is not limited by the foregoing embodiments, and it is needless to say that various changes can be made without departing from the gist thereof.

In the foregoing embodiment, the case where it is applied to a semiconductor wafer as a component has been described. However, it is not limited to this. As far as parts are concerned, as long as they are attached to a sheet (for example, a wafer-like part), electronics such as semiconductor wafers, chip resistors, chip capacitors, and chip inductors can also be applied. Components.

In the foregoing embodiment, the case where the paste is applied to an anisotropic conductive paste has been described. However, it is not limited to this. As far as the paste is concerned, solder, flux, and the like can also be applied.

In the foregoing embodiment, the case where the paste is transferred to a plurality of electronic components at one time has been described. However, the present invention is not limited to this, and the paste can be transferred to one electronic component.

10‧‧‧Workbench

10a‧‧‧ surface of workbench 10

11‧‧‧ paste

13‧‧‧Electronic parts

14‧‧‧ sheet

14a‧‧‧ surface of sheet 14

14b‧‧‧ surface of sheet 14

15‧‧‧ head

15a‧‧‧face

15b‧‧‧ bevel

Claims (9)

A transfer method, comprising: (a) a step of setting a paste on a first setting portion; (b) a step of setting an electronic part on a second setting portion; (c) using the aforementioned paste and the aforementioned electron The method of parts facing each other, a step of arranging the first setting portion and the second setting portion at intervals; (d) the first setting portion or the second setting portion is a sheet having elasticity, and the paste A method in which the agent approaches the electronic component, gradually bending the sheet, and pressing the electronic component against the paste; and (e) leaving the electronic component away from the paste provided in the first installation portion, The step of attaching the paste to the electronic component. The transfer method according to claim 1, wherein in the step (a), the thickness of the paste is uniformed using a doctor blade. For example, the transfer method of claim 1, wherein in the step (b), a plurality of the electronic components are provided in the second setting portion, and in the step (d), the plurality of electronic components are provided to the paste at one time.剂 Pressing. The transfer method according to claim 1, wherein in the step (a), the paste is provided on a first surface of the first installation section, In the step (b), the electronic component is provided on a second surface of the second installation portion. In the step (c), the first surface of the first installation portion and the second installation portion are provided. The second surface is parallel to each other, and the first installation portion and the second installation portion are provided at intervals. The transfer method according to claim 1, wherein before the step (d), the sheet is formed into a flat state, and in the step (d), a pressing portion having an end surface and forming a shape tapering toward the end surface is used to make the aforementioned The end surface of the pressing portion is parallel to the sheet in a flat state, and the sheet is pressed and bent by the pressing portion. The transfer method according to any one of claims 1 to 5, wherein the first setting portion is a table, the second setting portion is the sheet, and in the step (d), the side from which the electronic part is provided is provided. Bend the sheet so that the opposite side is facing the paste. The transfer method according to claim 6, wherein the paste provided on the workbench is maintained at a predetermined temperature by a temperature adjustment mechanism attached to the workbench. The transfer method according to any one of claims 1 to 5, wherein the first setting portion is the aforementioned sheet, the second setting portion is a table, and in the step (d), the side from which the paste is provided is provided. The sheet is bent in such a manner that the opposite side of the sheet faces the electronic component. A mounting method is a mounting method including the transfer method according to any one of claims 1 to 8, wherein the electronic component is mounted on a substrate through the paste after the step (e).