TW201501215A - Method and apparatus for joining sealing sheet - Google Patents

Abstract

A sealing sheet, obtained by half-cutting a sealing sheet larger than a semiconductor substrate in the shape of the semiconductor substrate and forming a sealing-sheet piece, is mounted on an attachment jig and tension is applied to the sealing sheet, and the attachment jig is superposed on a first holding table to temporarily crimp the semiconductor substrate and the sealing-sheet piece. The semiconductor substrate, which has been integrated with the sealing-sheet piece gripped by the attachment jig, is then placed on a second holding table, the entire attachment jig is contained inside a pressure-reducing chamber, and the sealing-sheet piece is pressed in a reduced-pressure state to achieve final crimping of the semiconductor substrate.

Description

Sealing sheet attaching method and sealing sheet attaching device

The present invention relates to a sealing sheet attaching method and a sealing sheet attaching apparatus in which a plurality of semiconductor elements formed by attaching a sealing sheet formed of a sealing layer composed of a resin composition to a semiconductor substrate and sealed.

After the periphery of one semiconductor wafer is surrounded by the frame, the first sealing resin sheet and the second sealing resin sheet which are formed of the prepreg impregnated with the resin are sandwiched from the respective surfaces of the semiconductor wafer. The semiconductor wafer is sealed to manufacture a semiconductor device (see Patent Document 1).

[Patent Document 1] Japanese Patent Laid-Open No. Hei 5-291319

However, the above conventional methods cause the following problems.

In other words, in recent years, there has been a trend toward miniaturization of semiconductor devices due to the high-density mounting required for rapid advancement of applications. Therefore, since the semiconductor wafer is individually sealed with a resin by the dicing process, the semiconductor element is individually sealed with a resin, so that the production amount is lowered and the production efficiency is lowered.

The present invention has been made in view of such circumstances, and a main object thereof is to provide a sealing sheet attaching method and a sealing sheet attaching apparatus which can adhere a sealing sheet to a semiconductor substrate with good efficiency.

Then, in order to solve the problem, the inventors of the present invention repeated experiments, simulations, and efforts to investigate the results of the research, and obtained the following findings.

Attempts were made to attach a single sheet of the sealing sheet formed with a sealing layer to the entire surface of the semiconductor substrate. However, this method creates the following new problems.

That is, a sealing sheet having a thickness of the covering semiconductor element is formed, and it is considered to have rigidity at first glance. However, in general, the sealing sheet in the cooling management has moderate flexibility once it returns to room temperature at the time of use. Therefore, when the sealing sheet is formed to cover the size of a plurality of semiconductor elements distributed on the semiconductor substrate, bending or warping occurs in the sealing sheet.

Therefore, when the sealing sheet in a state in which bending or the like is applied is attached to the semiconductor substrate, wrinkles are generated or a positional deviation of the bonding occurs. The generation of wrinkles causes pores in the sealing layer to cause defects in the product. Further, when the sealing sheet is bent or warped, thermal expansion or contraction stress acting on the sealing layer during the heat treatment and the cooling treatment locally acts on the semiconductor substrate, causing damage to the semiconductor substrate.

Further, in order to achieve such an object, the present invention adopts the following configuration.

That is, a sealing sheet attaching method is a sealing sheet in which a release layer composed of a resin composition is formed on a release liner. Attached to the semiconductor substrate, the sealing sheet attaching method is characterized in that the tension applying process is performed by gripping an outer edge of a support portion that supports the sealing piece, and applying tension to the sealing piece, the sealing piece cutting the sealing piece into The shape of the semiconductor substrate is equal to or smaller than the shape of the semiconductor substrate; and the attaching process is such that the sealing die and the semiconductor substrate are opposed to each other, and the sealing die is pressed and attached to the semiconductor substrate.

(Action: Efficacy) According to the above method, by applying tension to the outer edge of the support portion of the support sealing sheet, it is possible to correct the bending or warpage of the sealing sheet. Therefore, it is possible to suppress breakage of the semiconductor substrate and occurrence of voids due to wrinkles or warpage. Further, compared with the conventional method of sealing each of the semiconductor elements by the sealing sheet, the sealing sheet can be attached to all the semiconductor elements on the semiconductor substrate for sealing, so that the processing speed can be improved. Further, in the present invention, the sealing pellet is in a state in which the sealing layer is attached with a release liner.

Further, in the above-described tension imparting process, for example, a tension can be applied to the sealing sheet by the attaching jig. Regarding the embodiment in which the attachment jig is used, there are roughly two forms.

In one embodiment, a single piece of sealing sheet that is larger than a semiconductor substrate is used. That is, the monolithic sealing sheet is formed into a sealing piece which is half-cut into a shape of a semiconductor substrate.

Alternatively, a plurality of chips half-cut into small pieces are formed in a distribution region of a plurality of semiconductor elements formed on the semiconductor substrate with an area smaller than an area of the distribution region and aligned around a broken line of the plurality of semiconductor elements. Seal the piece.

According to these embodiments, by applying tension to the sealing sheet It can directly apply tension to the sealing layer in the shape of a sealed piece. Therefore, the sealing layer can be peeled off from the release liner and attached to the semiconductor substrate, whereby generation of wrinkles can be suppressed.

In other embodiments, a semiconductor substrate is used. Large release liner. In other words, while sealing the distribution region of the plurality of semiconductor elements formed on the semiconductor substrate, the sealing piece having a size cut to a size equal to or smaller than the shape of the semiconductor substrate is temporarily adhered to the single-piece release liner larger than the semiconductor substrate. The release liner is attached to the attachment jig to impart tension.

Or, a plurality of semiconductors to be formed on a semiconductor substrate a plurality of sealing sheets which are semi-cut into small pieces in a distribution area of the element with a smaller area than the area of the distribution area and which are aligned around the breaking lines of the plurality of semiconductor elements are temporarily adhered to the release liner, and the release liner is The pad is attached to the attached fixture to impart tension.

According to these embodiments, by applying a release liner The force can indirectly impart tension to the sealing piece.

Further, in each of the above embodiments, it is preferable to attach the treatment The semiconductor wafer is attached to the semiconductor substrate while being placed in the decompression chamber while being held by the holding stage of the semiconductor substrate, while pressing the sealing piece while depressurizing the decompression chamber.

According to this method, the removable piece and the half are included Air bubbles at the interface of the conductor substrate. Therefore, the voids generated when the hardening treatment of the sealing layer is performed can be more surely avoided.

Moreover, in order to achieve such a purpose, the present invention adopts the following The composition.

That is, a sealing sheet attaching device is a sealing sheet in which a sealing layer composed of a resin composition is formed on a release liner, and is attached to a semiconductor substrate, and the sealing sheet attaching device is characterized by: maintaining The holder holds the semiconductor substrate, and attaches the jig to a support portion that supports the sealing sheet in a shape of a sealing piece that is half-cut into a size smaller than a shape of the semiconductor substrate, and the tension is applied to the sealing sheet. And an attaching mechanism that presses a sealing sheet held by the attaching jig to attach a sealing layer having a sealing piece shape to the semiconductor substrate.

Alternatively, a sealing sheet attaching device is obtained by attaching a sealing sheet in which a sealing layer composed of a resin composition is formed on a release liner to a semiconductor substrate, and the sealing sheet attaching device is characterized by: a holding table, Holding the semiconductor substrate; attaching the jig, holding a support portion of the single-piece release liner larger than the semiconductor substrate, and applying tension to the release liner, the semiconductor substrate being temporarily adhered to the semiconductor A sealing piece having a size of a substrate or less; and an attaching mechanism that presses the release liner held by the attaching jig to attach the sealing piece to the semiconductor substrate.

Moreover, in each of the above configurations, it is preferable to include a decompression chamber that houses a holding table that overlaps with the attachment jig, and to arrange the attachment mechanism in the decompression chamber.

According to this configuration, each of the above embodiments can be suitably carried out.

According to the sealing sheet attaching method and the sealing sheet attaching device of the present invention, the sealing sheet can be attached to the plurality of semiconductor elements formed on the semiconductor substrate with good efficiency without offset.

20‧‧ ‧ fixture mounting platform

21‧‧‧1st transport agency

23‧‧‧1st holding station

24‧‧‧2nd transport agency

25‧‧‧ Attachment

45‧‧‧2nd holding table

46‧‧‧Decompression chamber

59‧‧‧ Press plate

60‧‧‧heater

70‧‧‧ Attachment fixture

72‧‧‧ splint

T‧‧‧ Sealing film

C‧‧‧Semiconductor components

CT‧‧‧ Sealed Pieces

M‧‧‧ sealing layer

S1, S2‧‧‧ release liner

W‧‧‧Semiconductor substrate

P‧‧‧Position pin

Fig. 1 is a perspective view showing a raw material roll of a sealing sheet.

Figure 2 is a longitudinal sectional view of the sealing sheet.

Fig. 3 is a perspective view showing the constitution of the attachment jig.

Fig. 4 is a front view showing the constitution of the attachment jig.

Fig. 5 is a front view showing the overall configuration of the sealing sheet attaching device.

Fig. 6 is a plan view showing the overall configuration of a sealing sheet attaching device.

Fig. 7 is a partial cross-sectional view showing a decompression chamber constituting an attachment mechanism.

Fig. 8 is a plan view showing a sealing sheet formed with a sealing piece.

Fig. 9 is a view showing an operation of providing a sealing sheet to an attachment jig.

Fig. 10 is a view showing an operation of providing a sealing sheet to an attachment jig.

Fig. 11 is a plan view showing a state in which a sealing sheet is placed on a bonding jig.

Fig. 12 is a view showing an operation of temporarily crimping a sealing piece to a semiconductor substrate.

Fig. 13 is a view showing an operation of temporarily crimping a sealing piece to a semiconductor substrate.

Fig. 14 is a view showing a conveyance state of a semiconductor substrate in which a sealing piece is temporarily crimped.

Fig. 15 is a view showing an operation of fixing and sealing a sealing piece to a semiconductor substrate.

Fig. 16 is a view showing an action of fixing and sealing a sealing piece to a semiconductor substrate.

Fig. 17 is a view showing the operation of removing the unnecessary sealing layer and the first release liner.

Fig. 18 is a plan view showing a sealing piece formed on a sealing sheet of a modification.

19 is a plan view showing a state in which a sealing piece of a modification is fixedly pressed against a semiconductor substrate.

[Best Mode for Carrying Out the Invention]

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

<sealing sheet>

For example, as shown in FIGS. 1 and 2, the sealing sheet T is supplied from a raw material roll around which a long sealing sheet T is wound. Further, in the sealing sheet T, the first release liner S1 for protection and the second release liner S2 are attached to both surfaces of the seal layer M composed of the resin composition. Further, the sealing layer M corresponds to the resin layer of the present invention.

The sealing layer M is formed into a sheet shape from a sealing material. Examples of the sealing material include thermosetting resin, epoxy resin, thermosetting polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester. A thermosetting resin such as a resin, a diallyl phthalate resin, or a thermosetting urethane resin. Moreover, the thermosetting resin and the thermosetting resin composition containing an additive in an appropriate ratio are also mentioned as a sealing material.

Examples of the additive include a filler, a phosphor, and the like. Examples of the filler include inorganic fine particles such as silica, titania, talc, alumina, aluminum nitride, and tantalum nitride, for example, silicone particles. Etc. Organic particles and so on. The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor that converts blue light into yellow light, a red phosphor that converts blue light into red light, and the like. Examples of the yellow phosphor include a garnet-type phosphor such as Y ₃ Al ₅ O ₁₂ :Ce (YAG (yttrium aluminum garnet): Ce). Examples of the red phosphor include a nitride phosphor such as CaAlSiN ₃ :Eu or CaSiN ₂ :Eu.

The sealing layer M is adjusted to a half before sealing the semiconductor element The solid shape, specifically, when the sealing material contains a thermosetting resin, can be adjusted, for example, before the complete curing (C-stage), that is, in the semi-hardening (B-stage) state.

The size of the sealing layer M can be based on the semiconductor element and the substrate Set appropriately according to the size. Specifically, when the sealing sheet is prepared as a long piece, the length of the sealing layer in the left-right direction, that is, the width is, for example, 100 mm or more, preferably 200 mm or more, for example, 1500 mm or less, preferably 700 mm or less. Further, the thickness of the sealing layer can be appropriately set in accordance with the size of the semiconductor element, and is, for example, 30 μm or more, preferably 100 μm or more, and for example, 3000 μm or less, preferably 1,000 μm or less.

Examples of the first release liner S1 and the second release liner S2 include For example, a polymer sheet such as a polyethylene sheet, a polyester sheet (PET or the like), a polystyrene sheet, a polycarbonate sheet, a polyimide sheet, or the like, for example, a ceramic sheet such as a metal foil or the like. It can also be implemented on the contact surface of the release liner which is in contact with the sealing layer Release treatment such as fluorine treatment. The size of the first release liner and the second release liner can be appropriately set depending on the peeling conditions, and the thickness is, for example, 15 μm or more, preferably 25 μm or more, and is, for example, 125 μm or less, or preferably 75 μm or less.

<attach fixture>

The attachment jig is roughly divided to provide tension to the sealing sheets of the following two aspects. In one embodiment, the attaching jig directly imparts tension to a single-piece sealing sheet that is cut into a rectangular or square quadrangular shape than a semiconductor substrate.

In other embodiments, the attachment jig is a sealing piece having a predetermined shape that is cut into a size smaller than the shape of the semiconductor substrate, and is temporarily adhered to the rectangular release liner larger than the semiconductor substrate. The peeling piece is configured to impart tension and indirectly impart tension to the sealing sheet. Hereinafter, the specific configuration of the attached jig will be described in detail. Further, in the present embodiment, the sealing pellet is in a state in which the sealing layer is attached with a release liner.

Fig. 3 is a perspective view of the attachment jig, and Fig. 4 is a front view of the attachment jig.

The attaching jig 70 is provided with a splint 72 and a splice plate 74 at opposite ends of the rectangular frame frame 71. The clamp plate 72 is biased by the coil spring 73 in the direction in which the joint plate 74 is pressed. Further, the receiving plate 74 is formed in an inverted L shape, and the front end of the ball shaft 76 that penetrates the fixing block 75 fixed to the bottom surface of the frame frame 71 is abutted against one lower side of the receiving plate 74. The adapter plate 74 is biased outwardly by the coil spring 77 between the ball shaft 76 and the fixed block 75. Further, the nut 78 is screwed to the other end side of the ball shaft 76. Constructed by When the nut 78 is rotated forward and backward, the protruding distance of the ball shaft 76 is changed, and the outward biasing force of the clamping plate 72 and the receiving plate 74 can be adjusted.

<Sealing sheet attachment device>

Fig. 5 is a front view of the sealing sheet attaching device, and Fig. 6 is a plan view of the sealing sheet attaching device.

The sealing sheet attaching device is provided with the jig mounting table 20, the first conveying mechanism 21, the first holding table 23, the second conveying mechanism 24, the attaching mechanism 25, and the like.

The jig mounting table 20 is configured to keep the attaching jig 70 horizontal.

The first transport mechanism 21 is provided at the distal end of the adsorption unit that can horizontally move and move up and down, and has an adsorption pad 26. That is, the first movable table 28 is provided to move along the guide rail R1 extending along the frame 27 extending in the lateral direction of the apparatus body. A guide rail R2 that is horizontally held toward the front and rear of the apparatus body is attached to a lower portion of the first movable table 28. There is provided an adsorption unit that is movable up and down along the vertical frame, and the vertical frame is suspended and supported by the second movable table 30 that can move back and forth along the guide rail R2.

Further, two cameras 34 are provided below the path in which the first transport mechanism 21 transports toward the inside of the device. The camera 34 captures the position of the sealing piece CT held by the attaching jig 70 and the outer shape of the attaching jig 70, and transmits the image data to the control unit.

The first holding stage 23 is constituted by a chuck table having a shape larger than that of the semiconductor substrate W. The first holding stage 23 is configured to rotate about the vertical axis and to align the semiconductor substrate W. Further, the first holding stage 23 is a pair of the mounting position where the semiconductor substrate W is covered along the guide rail 38 and the inside of the device. It is constructed by quasi-position and reciprocating movement.

2 cameras 39 are mounted above the alignment position, shooting half The outer shape of the conductor substrate W and the break line (scribe line) are transmitted to the control unit 100.

The second transport mechanism 24 is provided with a moving device on the guide rail R3 The movable table 42 reaches the side of the sheet attaching mechanism 25 along the frame 41 extending in the lateral direction of the apparatus body. An adsorption pad 44 is provided at an end of the adsorption unit that can be moved up and down along the vertical frame 43 supported by the movable table 42. The second transport mechanism 24 is configured to reciprocate between the first holding stage 23 and the second holding stage 45 which will be described later.

The attaching mechanism 25 is a second holding stand as shown in FIGS. 7 and 15 45, decompression chamber 46 and the like.

The second holding base 45 is housed above and below the decompression chamber 46. A pair of upper housings 46A and 46B are lower housings 46B.

Moreover, the lower casing 46B is configured to be along the guide rail 48. The receiving position of the semiconductor substrate W on the front side of the body reciprocates between the receiving position of the upper substrate 46A and the lower side of the upper casing 46A.

The upper casing 46A constituting the decompression chamber 46 is provided on the lift Moving mechanism 50. The lifting and lowering drive mechanism 50 is provided with a movable table 53 which is movable up and down along a rail 52 disposed longitudinally on the back of the vertical wall 51; a movable frame 54 supported by the movable table 53 in an adjustable height; and an arm 55, It extends forward from the movable frame 54. An upper casing 46A is attached to a support shaft 56 that extends downward from the front end portion of the arm 55.

The movable table 53 is caused by the screw shaft 57 by the motor 58 The feed is raised and lowered by rotating forward and backward. Also, inside the upper casing 46A, There is a pressing plate 59 that can be raised and lowered. A heater 60 is embedded in the pressing plate 59.

<Sealing sheet attachment treatment>

Next, the operation of attaching the sealing piece formed on the sealing sheet to one of the semiconductor substrates by the above-described attaching device will be described in detail. Further, in the present embodiment, as shown in FIG. 8, the sealing piece CT which is half-cut into a semiconductor substrate W in a single piece of the sealing sheet T larger than the semiconductor substrate W is attached to the semiconductor substrate W. For example, the description will be given.

First, the nut 78 of the attaching jig 70 is rotated to adjust the outward biasing force so as to impart a predetermined tension in accordance with the size of the sealing sheet T.

As shown in FIG. 9, the splint 72 is opened against the spring biasing force to mount the sealing sheet T on the frame frame 71. Thereafter, as shown in FIGS. 10 and 11, the splint 72 is closed and both ends of the sealing sheet T are gripped. At this time, the sealing sheet T can be held at both ends, and an appropriate tension which does not cause slack or bending can be imparted. That is, both ends of the sealing sheet T function as a support portion.

The second release liner S2 is peeled off from the back surface of the sealing sheet T and the sealing piece CT, and the attachment jig 70 is placed on the jig mounting table 20. The frame frame 71 to which the jig 70 is attached is sucked and held by the first transport mechanism 21, and is transported to the upper side of the camera 34. When the first conveying mechanism 21 reaches the upper side of the camera 34, the outer shape of the first conveying mechanism 21 and the layout image of the sealing piece CT are taken. The image data is transmitted to the control unit. When the photographing process is completed, the first transport mechanism 21 moves to the first holding table 23 while the attaching and holding jig 70 is being sucked and held.

The applicator 70 is placed on the jig mounting table 20 At the same time, as shown in FIG. 6, the semiconductor substrate W on which a plurality of semiconductor elements C are formed is placed on the first holding stage 23. The first holding stage 23 that adsorbs and holds the semiconductor substrate W is moved to the aligned position, and the surface is photographed by the camera 39. The captured image data is transmitted to the control unit.

When the photographing process is completed, the first holding stage 23 returns to the set position. Set. Here, the arrangement outline of the sealing die CT in the outline of the attaching jig 70 obtained by the image analyzing process of the control unit coincides with the inner dimension of the breaking line width of the semiconductor element of the semiconductor substrate W, and is covered. The alignment of the semiconductor substrate W is performed in such a manner that the distribution region of the semiconductor element is entirely planar. The first holding stage 23 is rotated about the longitudinal axis for alignment. In addition, the distribution area is a region DA in which a predetermined plurality of semiconductor elements singulating a semiconductor substrate are arranged and the planned cutting line of the outermost peripheral portion is included as indicated by a one-dot chain line in FIG. 6 .

When the alignment of the semiconductor substrate W is completed, the first holding stage is made The semiconductor substrate W on the 23 is opposed to the attaching jig 70, and as shown in FIG. 12, the attaching jig 70 is lowered to a predetermined height. At this time, as shown in FIG. 13, the positioning pin P which is erected on the first holding stage 23 is engaged with the positioning hole 79 of the attachment jig 70 to perform alignment. In this state, a predetermined load is applied to the sealing piece CT to temporarily press it to the semiconductor substrate W. At this time, the semiconductor substrate W is held by the sealing jig via the sealing piece CT and the sealing sheet T. When the temporary crimping of the semiconductor wafer W by the sealing piece CT is completed, the first conveying mechanism 21 returns to the jig mounting table 20 side.

As shown in FIG. 14, the second transfer mechanism 24 adsorbs the attachment jig 70. It is transported and placed on the second holding stage 45. At this time, In the same manner as when the first holding table 23 is provided, the positioning pin P formed on the second holding table 45 is engaged with the positioning hole 79 formed by the frame frame 71 to which the jig 70 is attached, and is aligned.

When the semiconductor substrate W is placed on the second holding stage 45, 2 The transport mechanism 24 rises and returns to the first holding stage 23 side. The second holding stage 45 moves to the lower side of the upper casing 46A together with the attaching jig 70 in a state in which the semiconductor substrate W is adsorbed and held.

As shown in FIG. 15, the lower case in which the second holding stage 45 is housed is provided 46B moves to the lower side of the upper casing 46A, and as shown in Fig. 16, a decompression chamber 46 is formed. The inside of the decompression chamber 46 is depressurized, and the sealing sheet T is fixedly and pressure-bonded to the semiconductor substrate W while being heated by the pressing plate 59.

When the fixed crimping is completed, the second holding stage 45 is moved to the base The board's delivery position is cooled for a given time. Then, as shown in FIG. 17, the attaching jig 70 is sucked and raised by the second transfer mechanism 24, and the sealing layer M whose adhesive force is lowered remains on the side of the first release liner S1. Stripped from the semiconductor substrate W. In the above, a series of processing is completed, and the same processing is repeated.

According to the above implementation device, by using the attachment jig 70 clip The portion of the sealing sheet T protruding from the outer shape of the semiconductor substrate W can be attached to the semiconductor substrate W in a state where the sealing sheet T and the sealing sheet CT are given an appropriate tension without bending or warping. . In other words, since the sealing sheet T and the sealing piece CT are not slack at the time of attaching, it is possible to suppress the bubble from being contained in the adhesion interface with the semiconductor substrate W or wrinkles. As a result, there is no occurrence of voids in the sealing layer M or damage to the semiconductor substrate W.

Moreover, the sealed die CT is smaller in size than the semiconductor substrate W, Therefore, the operation at the time of attachment is easy. That is, it is possible to more reliably suppress the bubble from being contained in the adhesion interface between the semiconductor substrate W and the sealing piece CT.

Further, the present invention can also be carried out in the following aspects.

(1) In the above embodiment, the sealing piece CT is not limited to the semi-conductive The shape of the bulk substrate W. For example, as shown in FIG. 18, it is also possible that the distribution area of the plurality of semiconductor elements C formed on the semiconductor substrate W is smaller than the area of the distribution area, and the alignment around the plurality of semiconductor elements C is aligned. The line is cut into small pieces into a small piece of sealed piece CT. That is, the sealing piece CT is semi-cutted from the single piece of sealing sheet T by aligning the line size on the inner side of the dividing line width. Therefore, both ends of the single-piece sealing sheet T function as a supported portion that is sandwiched.

According to this embodiment, as shown in FIG. The semiconductor device C is sealed by a sealing layer M of a sealed die shape in a small distributed area unit divided on the bulk substrate W. Therefore, the warpage of the semiconductor substrate W due to thermal expansion or contraction of the sealing layer M at the time of the hardening treatment can be suppressed. In other words, when one of the sealing sheets of the semiconductor substrate shape is attached to the semiconductor substrate W, the shrinkage stress concentrates toward the center of the semiconductor substrate W, so that warpage is likely to occur in the semiconductor substrate W. However, in the case where the plurality of pieces of the sealing piece CT are divided and attached to the semiconductor substrate W, since the sealing layers M are each contracted, the contraction stress is dispersed. Therefore, warpage and breakage of the semiconductor substrate W can be suppressed.

In addition, the sealing piece CT can also be cut into The sealing piece CT of a predetermined shape is temporarily adhered to a release liner cut into a larger size than the semiconductor substrate in a predetermined arrangement. In this case, The one-piece release liner functions as a support portion. Further, when the sealing piece CT is temporarily adhered to the single-layer release liner, the release liner may be temporarily adhered while the first release liner S1 is adhered, or the first release liner may be used. S1 is peeled off from the sealing layer M to temporarily adhere the sealing layer M to the release liner.

When the sealing piece CT is temporarily adhered to the release liner and used, the sealing piece CT having different characteristics can be attached to the semiconductor substrate W. For example, the sealing pieces CT having different shrinkage ratios of the sealing layer M can be used in a region where the warpage of the semiconductor substrate W is likely to occur and a region which is less likely to occur. For example, in a portion where warpage is likely to occur, a sealing piece CT in which the sealing layer M having a shrinkage ratio smaller than that of the sealing piece CT attached to the other portion is formed is attached. According to this method, the amount of warpage of the semiconductor substrate W can be adjusted.

(2) In the above embodiments, the clamp plate 72 and the joint plate 74 may be provided on the four sides of the attachment jig 70 to uniformly apply outward tension from the square to the seal piece T or the release liner.

(3) In the above embodiments, the shape of the semiconductor substrate W is not limited to a circular shape. Therefore, the semiconductor substrate W may be a square shape including a square or a rectangle. Further, the sealing piece CT can appropriately match the shape of the semiconductor substrate W.

[Industrial availability]

As described above, the present invention is suitable for attaching a sealing sheet with good efficiency without deviation over a plurality of semiconductor elements formed on a semiconductor substrate.

25‧‧‧ Attachment

45‧‧‧2nd holding table

46‧‧‧Decompression chamber

46A‧‧‧Upper casing

46B‧‧‧Upper casing

59‧‧‧ Press plate

60‧‧‧heater

72‧‧‧ splint

P‧‧‧Position pin

Claims (9)

A sealing sheet attaching method in which a sealing sheet in which a sealing layer composed of a resin composition is formed in a release liner is attached to a semiconductor substrate, and the sealing sheet attaching method is characterized by: a tension imparting process, Holding the outer edge of the support portion supporting the sealing piece, and applying tension to the sealing piece, the sealing piece is formed by cutting the sealing piece into a size smaller than a shape of the semiconductor substrate; and attaching the sealing piece The semiconductor substrate is placed opposite to the semiconductor substrate, and the sealing piece is pressed and attached to the semiconductor substrate. The sealing sheet attaching method of claim 1, wherein the tension applying process attaches the sealing sheet formed with a sealing piece semi-cut into the shape of the semiconductor substrate to a single piece of sealing sheet larger than the semiconductor substrate. In the jig, the attaching process is performed by peeling off the sealing layer of the sealing piece shape from the release liner attached to the sealing sheet of the attaching jig, and attaching it to the semiconductor substrate. The sealing sheet attaching method of claim 1, wherein the tension applying process applies a tension by attaching a single sealing sheet to the attaching jig, the plurality of the semiconductors formed on the semiconductor substrate In the distribution area of the element, a plurality of sealing sheets which are semi-cut into small pieces are formed in an area smaller than the area of the distribution area and aligned around the breaking lines of the plurality of semiconductor elements, and the attaching process is performed from the mounting. The release liner of the sealing sheet to which the jig is attached is peeled off from the sealing sheet-shaped sealing layer and attached to the semiconductor substrate. The sealing sheet attaching method according to claim 1, wherein the tension applying process temporarily covers a sealing piece formed in a size of the semiconductor substrate in a distribution area of a plurality of semiconductor elements formed on the semiconductor substrate. Adhering to the single-piece release liner larger than the semiconductor substrate, the release liner is attached to the attachment jig to impart tension, and the attachment process is to seal the small piece from the release liner attached to the attachment jig. It is peeled off and attached to a semiconductor substrate. The sealing sheet attaching method of claim 1, wherein the tension applying process is formed in a distribution area of the plurality of semiconductor elements of the semiconductor substrate to be smaller than an area of the distribution area and to surround the plurality of semiconductor elements in alignment The plurality of pieces of the sealing piece which are half-cut into small pieces are temporarily adhered to the release liner, and the release liner is attached to the attachment jig to impart tension, and the attachment process is attached from the attachment process. A release liner is provided to peel off the sealing piece and attach it to the semiconductor substrate. The sealing sheet attaching method according to claim 1, wherein the attaching process is performed by laminating the attaching jig and a holding table for holding the semiconductor substrate, and accommodating the decompression chamber, and decompressing the decompression chamber The small piece is pressed and attached to the semiconductor substrate. A sealing sheet attaching device is a sealing sheet in which a sealing layer composed of a resin composition is formed on a release liner, and is attached to a semiconductor substrate. The sealing sheet attaching device is characterized in that: a holding table is provided Holding the aforementioned semiconductor substrate; The attachment jig is a support portion that supports the sealing sheet in a sealing piece shape in which the sealing sheet is half-cut into a size smaller than a semiconductor substrate, and the tension is applied to the sealing sheet; and the attaching mechanism is The sealing sheet held by the attaching jig is pressed to attach a sealing layer having a sealing piece shape to the semiconductor substrate. A sealing sheet attaching device is a sealing sheet in which a sealing layer composed of a resin composition is formed on a release liner, and is attached to a semiconductor substrate. The sealing sheet attaching device is characterized in that: a holding table is held The semiconductor substrate; the attachment jig, which holds a support portion of the single-piece release liner larger than the semiconductor substrate, and applies tension to the release liner, and the semiconductor substrate is temporarily adhered and cut into the shape of the semiconductor substrate The sealing piece of the following dimensions; and the attaching mechanism presses the release liner held by the attachment jig to attach the sealing piece to the semiconductor substrate. The sealing sheet attaching device according to claim 7 or 8, comprising a decompression chamber that houses a holding table that overlaps with the attaching jig, and includes an attaching mechanism in the decompression chamber.