WO2014167948A1 - Method for attaching sealing sheet and apparatus for attaching sealing sheet - Google Patents

Method for attaching sealing sheet and apparatus for attaching sealing sheet Download PDF

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Publication number
WO2014167948A1
WO2014167948A1 PCT/JP2014/057176 JP2014057176W WO2014167948A1 WO 2014167948 A1 WO2014167948 A1 WO 2014167948A1 JP 2014057176 W JP2014057176 W JP 2014057176W WO 2014167948 A1 WO2014167948 A1 WO 2014167948A1
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WO
WIPO (PCT)
Prior art keywords
sealing sheet
semiconductor substrate
sticking
sealing
jig
Prior art date
Application number
PCT/JP2014/057176
Other languages
French (fr)
Japanese (ja)
Inventor
橋本　淳
伸一郎 森
山本　雅之
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to KR1020157031060A priority Critical patent/KR20150143539A/en
Priority to CN201480019211.8A priority patent/CN105074891A/en
Priority to SG11201508197UA priority patent/SG11201508197UA/en
Publication of WO2014167948A1 publication Critical patent/WO2014167948A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

  • the present invention relates to a sealing sheet attaching method and a sealing sheet attaching apparatus for attaching and sealing a sealing sheet on which a sealing layer made of a resin composition is formed on a plurality of semiconductor elements formed on a semiconductor substrate. .
  • the first sealing resin sheet and the second sealing resin sheet made of prepreg impregnated with resin are sandwiched between both surfaces of the semiconductor chip.
  • a semiconductor device is manufactured by sealing a semiconductor chip (see Patent Document 1).
  • semiconductor devices tend to be miniaturized due to the demand for high-density mounting accompanying rapid development of applications. Therefore, after the semiconductor wafer is divided into semiconductor elements by the dicing process, the semiconductor elements are individually sealed with resin, resulting in a problem that throughput is lowered and production efficiency is lowered.
  • the main objective is to provide the sealing sheet sticking method and sealing sheet sticking apparatus which can stick a sealing sheet efficiently to a semiconductor substrate.
  • the present inventors obtained the following knowledge as a result of intensive studies by repeating experiments and simulations in order to solve the inconvenience.
  • the sealing sheet on which the sealing layer having a thickness covering the semiconductor element is formed seems to have rigidity at first glance.
  • a sealing sheet that is generally cooled and managed has moderate flexibility when returned to room temperature during use. Therefore, when the sealing sheet is sized to cover a plurality of semiconductor elements distributed on the semiconductor substrate, the sealing sheet is bent or warped.
  • This invention has the following configuration in order to achieve such an object.
  • a sealing sheet affixing method for affixing a sealing sheet formed of a resin composition on a release liner to a semiconductor substrate, Grasping the outer edge of the support part that supports the sealing sheet piece cut into the size of the semiconductor substrate below the size of the semiconductor substrate, and applying a tension to apply tension to the sealing sheet piece, A pasting process in which the sealing sheet piece and the semiconductor substrate are arranged opposite to each other, and the sealing sheet piece is pressed and attached to the semiconductor substrate; It is provided with.
  • bending or warping of the sealing sheet is corrected by gripping the outer edge of the support portion that supports the sealing sheet and applying tension. Therefore, damage to the semiconductor substrate and generation of voids caused by wrinkles and warpage can be suppressed.
  • the sealing sheet can be attached and sealed over all the semiconductor elements on the semiconductor substrate. Can be improved.
  • a sealing sheet piece means the form of the state by which the peeling liner was attached to the sealing layer.
  • a tension may be applied to the sealing sheet using a sticking jig.
  • a sticking jig there are roughly two forms.
  • a single-sheet sealing sheet that is larger than a semiconductor substrate is used. That is, a sealing sheet piece half-cut into the shape of a semiconductor substrate is formed on the single-sheet sealing sheet.
  • a plurality of semiconductor elements formed on a semiconductor substrate having a smaller area than the area of the distribution area and half-cut into small pieces in accordance with a dividing line surrounding the plurality of semiconductor elements.
  • a sealing sheet piece is formed.
  • a release liner that is larger than the semiconductor substrate is used. That is, while covering a distribution region of a plurality of semiconductor elements formed on a semiconductor substrate, a sealing sheet piece cut in advance to a size equal to or smaller than the shape of the semiconductor substrate is larger than the semiconductor substrate. Temporarily adhere to the release liner, and the release liner is attached to a sticking jig to apply tension.
  • a plurality of semiconductor elements formed on a semiconductor substrate having a smaller area than the area of the distribution area and half-cut into small pieces in accordance with a dividing line surrounding the plurality of semiconductor elements.
  • the sealing sheet piece is temporarily bonded to the release liner, and the release liner is attached to a sticking jig to apply tension.
  • a sticking jig is overlaid on a holding table that holds a semiconductor substrate and is stored in a decompression chamber, and the sealing sheet piece is pressed and pasted onto the semiconductor substrate while decompressing the decompression chamber. It is preferable.
  • the present invention has the following configuration in order to achieve such an object.
  • a sealing sheet attaching device for attaching a sealing sheet formed of a resin composition to a release liner on a semiconductor substrate, A holding table for holding the semiconductor substrate; Gripping the supporting part that supports the sealing sheet half-cut from the sealing sheet to the shape of the sealing sheet piece having a size equal to or less than the shape of the semiconductor substrate, and applying a tension to the sealing sheet; and An affixing mechanism for affixing a sealing sheet piece-shaped sealing layer to a semiconductor substrate by pressing the sealing sheet held by the affixing jig; It is provided with.
  • a sealing sheet attaching device that attaches a sealing sheet formed of a resin composition to a release liner on a semiconductor substrate, A holding table for holding the semiconductor substrate; Gluing treatment for holding a supporting portion of a release liner of a large-sized single wafer than the semiconductor substrate to which a sealing sheet piece cut to a size equal to or smaller than the shape of the semiconductor substrate is temporarily bonded, and applying tension to the release liner Ingredients, An affixing mechanism for affixing the sealing sheet piece to the semiconductor substrate by pressing the release liner held by the affixing jig; It is provided with.
  • the sealing sheet can be efficiently attached without deviation over a plurality of semiconductor elements formed on the semiconductor substrate.
  • the sealing sheet T is supplied with the raw fabric roll which wound the elongate sealing sheet T, for example, as shown in FIG.1 and FIG.2. Moreover, the said sealing sheet T is equipped with protective 1st peeling liner S1 and 2nd peeling liner S2 on both surfaces of the sealing layer M which consists of a resin composition.
  • the sealing layer M corresponds to the resin layer of the present invention.
  • the sealing layer M is formed into a sheet shape from a sealing material.
  • the sealing material include thermosetting silicone resin, epoxy resin, thermosetting polyimide resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, thermosetting urethane resin, and the like.
  • a curable resin is mentioned.
  • the above-mentioned thermosetting resin and the thermosetting resin composition which contains an additive in an appropriate ratio can also be mentioned.
  • Examples of the additive include a filler and a phosphor.
  • Examples of the filler include inorganic fine particles such as silica, titania, talc, alumina, aluminum nitride, and silicon nitride, and organic fine particles such as silicone particles.
  • the phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light. .
  • Examples of the yellow phosphor include garnet phosphors such as Y 3 Al 5 O 12 : Ce (YAG (yttrium, aluminum, garnet): Ce).
  • Examples of the red phosphor include nitride phosphors such as CaAlSiN 3 : Eu and CaSiN 2 : Eu.
  • the sealing layer M is adjusted to a semi-solid state before sealing the semiconductor element. Specifically, when the sealing material contains a thermosetting resin, for example, complete curing (C It is adjusted before being staged, that is, in a semi-cured (B stage) state.
  • a thermosetting resin for example, complete curing (C It is adjusted before being staged, that is, in a semi-cured (B stage) state.
  • the dimensions of the sealing layer M are appropriately set according to the dimensions of the semiconductor element and the substrate. Specifically, when the sealing sheet is prepared as a long sheet, the length in the left-right direction of the sealing layer, that is, the width is, for example, 100 mm or more, preferably 200 mm or more, for example, 1500 mm. Hereinafter, it is preferably 700 mm or less.
  • the thickness of the sealing layer is appropriately set according to the size of the semiconductor element, and is, for example, 30 ⁇ m or more, preferably 100 ⁇ m or more, and for example, 3000 ⁇ m or less, preferably 1000 ⁇ m or less.
  • first release liner S1 and the second release liner S2 include polymer sheets such as polyethylene sheets, polyester sheets (such as PET), polystyrene sheets, polycarbonate sheets, and polyimide sheets, such as ceramic sheets, such as metal foil. It is done.
  • the contact surface in contact with the sealing layer can be subjected to a release treatment such as a fluorine treatment.
  • the dimensions of the first release liner and the second release liner are appropriately set according to the release conditions, and the thickness is, for example, 15 ⁇ m or more, preferably 25 ⁇ m or more, and for example, 125 ⁇ m or less, preferably 75 ⁇ m. It is as follows.
  • the sticking jig is roughly configured to apply tension to the sealing sheet of the following two modes.
  • the sticking jig directly applies tension to a single-sheet sealing sheet larger than a semiconductor substrate cut into a rectangle including a rectangle or a square.
  • the sticking jig is a peel-off sheet in which a sealing sheet piece having a predetermined shape cut to a size equal to or smaller than the shape of the semiconductor substrate is temporarily bonded to a rectangular release liner larger than the semiconductor substrate in the same manner as the sealing sheet.
  • a tension is applied to the sheet, and a tension is indirectly applied to the sealing sheet.
  • a sealing sheet piece says the form of the state by which the peeling liner was attached to the sealing layer.
  • FIG. 3 is a perspective view of the sticking jig
  • FIG. 4 is a front view of the sticking jig.
  • the affixing jig 70 includes a clamp plate 72 and a receiving plate 74 at opposite ends of a rectangular frame 71.
  • the clamp 72 plate is biased in a direction of pressing the receiving plate 74 by a coil spring 73.
  • the receiving plate 74 has an inverted L shape, and a tip of a ball shaft 76 penetrating a fixed block 75 fixed to the bottom surface of the frame frame 71 is brought into contact with one lower portion thereof.
  • the receiving plate 74 is biased outward by a coil spring 77 between the ball shaft 76 and the fixed block 75.
  • a nut 78 is screwed to the other end side of the ball shaft 76. By rotating the nut 78 forward and backward, the protruding distance of the ball shaft 76 changes, and the outward biasing force of the clamp plate 72 and the receiving plate 74 can be adjusted.
  • FIG. 5 is a front view of the sealing sheet sticking apparatus
  • FIG. 6 is a plan view of the sealing sheet sticking apparatus.
  • the sealing sheet sticking device is provided with a jig mounting table 20, a first transport mechanism 21, a first holding table 23, a second transport mechanism 24, a sticking mechanism 25, and the like.
  • the jig mounting table 20 is configured to hold the attaching jig 70 horizontally.
  • the first transport mechanism 21 includes a suction pad 26 at the tip of a suction unit that can move horizontally and move up and down, back and forth, and right and left. That is, a first movable base 28 that moves on the guide rail R1 along the frame 27 extending in the lateral direction of the apparatus main body is provided. A guide rail R2 that is horizontally held toward the front and rear of the apparatus main body is attached to the lower portion of the first movable base 28. A suction unit is provided that can move up and down along a vertical frame that is suspended and supported by a second movable base 30 that can move back and forth along the guide rail R2.
  • the camera 34 images the position of the sealing sheet piece CT held by the attaching jig 70 and the outer shape of the attaching jig 70 and transmits the image data to the control unit.
  • the first holding table 23 is a chuck table that is larger than the semiconductor substrate W.
  • the first holding table 23 is configured to rotate around the vertical axis to align the semiconductor substrate W. Further, the first holding table 23 is configured to reciprocate along the guide rail 38 over the mounting position of the semiconductor substrate W and the alignment position on the back side of the apparatus.
  • Two cameras 39 are provided above the alignment position, take an image of the outer shape and cutting line (scribe line) of the semiconductor substrate W, and transmit both image data to the control unit 100.
  • the second transport mechanism 24 includes a movable base 42 that moves the apparatus on a guide rail R3 that reaches the sheet sticking mechanism 25 side along a frame 41 that extends in the lateral direction of the apparatus main body.
  • a suction pad 44 is provided at the tip of the suction unit that can be moved up and down along a vertical frame 43 that is suspended and supported by the movable table 42.
  • the second transport mechanism 24 is configured to reciprocate from the first holding table 23 to the second holding table 45.
  • the pasting mechanism 25 includes a second holding table 45 and a decompression chamber 46 as shown in FIGS.
  • the second holding table 45 is accommodated in the lower housing 46B among the upper and lower upper housings 46A and 46B constituting the decompression chamber 46.
  • the lower housing 46B is configured to reciprocate between the receiving position of the semiconductor substrate W on the front side of the apparatus main body and below the upper housing 46A along the guide rail 48.
  • the upper and lower housings 46A constituting the decompression chamber 46 are provided in the lift drive mechanism 50.
  • the elevating drive mechanism 50 includes a movable base 53 that can be moved up and down along a rail 52 that is vertically arranged on the back of a vertical wall 51, a movable frame 54 that is supported on the movable base 53 so that the height can be adjusted, and the movable frame 53.
  • An arm 55 extending forward from the frame 54 is provided.
  • An upper housing 46A is mounted on a support shaft 56 that extends downward from the tip of the arm 55.
  • the movable base 53 is adapted to be screwed up and down by rotating the screw shaft 57 forward and backward by a motor 58.
  • a push plate 59 that can be raised and lowered is housed inside the upper housing 46A.
  • a heater 60 is embedded in the pressing plate 59.
  • the nut 78 of the attaching jig 70 is rotated to adjust the outward spring biasing force so that a predetermined tension is applied according to the size of the sealing sheet T.
  • the clamp plate 72 is opened against the spring bias, and the sealing sheet T is placed on the frame frame 71. Thereafter, as shown in FIGS. 10 and 11, the clamp plate 72 is closed and both ends of the sealing sheet T are gripped. At this time, an appropriate tension is applied to the sealing sheet T gripped at both ends so that no slack or deflection occurs. That is, both ends of the sealing sheet T function as support parts.
  • the 2nd peeling liner S2 is peeled from the back surface of sealing sheet T and sealing sheet piece CT, and the sticking jig
  • tool 70 is mounted in the jig mounting base 20.
  • the first conveying mechanism 21 sucks and holds the frame 71 of the attaching jig 70 and conveys it above the camera 34.
  • the outer shape of the first transport mechanism 21 and the layout image of the sealing sheet piece CT are captured.
  • the image data is transmitted to the control unit.
  • the first transport mechanism 21 moves onto the first holding table 23 while holding the sticking jig 70 by suction.
  • the attaching jig 70 is placed on the jig placing table 20
  • the semiconductor substrate W on which the plurality of semiconductor elements C are formed is placed on the first holding table 23. Is done.
  • the first holding table 23 holding the semiconductor substrate W by suction moves to the alignment position, and the surface of the first holding table 23 is imaged by the camera 39.
  • the captured image data is transmitted to the control unit.
  • the first holding stage 23 returns to the placement position.
  • the outline of the layout of the sealing sheet piece CT in the outline of the attaching jig 70 obtained by the image analysis processing of the control unit matches the size inside the dividing line width of the semiconductor element of the semiconductor substrate W
  • the semiconductor substrate W is aligned so as to cover the entire surface of the semiconductor element distribution region. Alignment is performed by rotating the first holding table 23 around the vertical axis.
  • the distribution region is a region DA in which a plurality of semiconductor elements scheduled to be separated into semiconductor substrates are arranged, and as shown by a one-dot chain line in FIG. is there.
  • the semiconductor substrate W on the first holding table 23 and the attaching jig 70 are opposed to each other, and the attaching jig 70 is lowered to a predetermined height as shown in FIG.
  • the positioning pins P erected on the first holding table 23 engage with the positioning holes 79 of the attaching jig 70 and are aligned.
  • a predetermined load is applied to the sealing sheet CT and temporarily bonded to the semiconductor substrate W.
  • the semiconductor substrate W is held by the sticking jig via the sealing sheet piece CT and the sealing sheet T.
  • the first transport mechanism 21 returns to the jig mounting table 20 side.
  • the second transport mechanism 24 sucks the sticking jig 70 and transports and places it on the second holding table 45 as shown in FIG. At this time, the positioning pins P formed on the second holding table 45 are inserted into the positioning holes 79 formed in the frame frame 71 of the attaching jig 70 in the same manner as when the attaching jig 70 is set on the first holding table 23. Engage and align.
  • the second transport mechanism 24 rises and returns to the first holding table 23 side.
  • the second holding table 45 moves to the lower portion of the upper housing 46A together with the attaching jig 70 while holding the semiconductor substrate W by suction.
  • the lower housing 46B housing the second holding table 45 is moved to below the upper housing 46A to form the decompression chamber 46 as shown in FIG.
  • the inside of the decompression chamber 46 is decompressed, and the sealing sheet T is finally bonded to the semiconductor substrate W while being heated by the pressing plate 59.
  • the second holding table 45 is moved to the delivery position of the substrate and cooled for a predetermined time. Thereafter, as shown in FIG. 17, by adsorbing and raising the sticking jig 70 by the second transport mechanism 24, an unnecessary sealing layer M with reduced adhesive strength remains on the first release liner S ⁇ b> 1 side. And peeled off from the semiconductor substrate W. Thus, a series of processing is completed, and the same processing is repeated.
  • the sealing sheet T and the sealing sheet piece CT are bent or warped by clamping the portion of the sealing sheet T protruding from the outer shape of the semiconductor substrate W with the attaching jig 70 as a support portion.
  • the sealing sheet piece CT can be attached to the semiconductor substrate W in a state where an appropriate tension that does not occur is applied. That is, since the sealing sheet T and the sealing sheet piece CT are not loosened at the time of sticking, it is possible to suppress the occurrence of bubbles or the generation of wrinkles at the adhesive interface with the semiconductor substrate W. As a result, no void is generated in the sealing layer M and the semiconductor substrate W is not damaged.
  • the sealing sheet piece CT is smaller in size than the semiconductor substrate W, it is easy to handle at the time of pasting. That is, it is possible to more reliably suppress the entrainment of bubbles at the bonding interface between the semiconductor substrate W and the sealing sheet piece CT.
  • the present invention can also be implemented in the following forms.
  • the sealing sheet piece CT is not limited to the shape of the semiconductor substrate W.
  • the distribution region of the plurality of semiconductor elements C formed on the semiconductor substrate W has an area smaller than the area of the distribution region and a dividing line that surrounds the plurality of semiconductor elements C.
  • a plurality of sealing sheet pieces CT that are half-cut into small pieces may be used. That is, the sealing sheet piece CT is half-cut from the single-sheet sealing sheet T in accordance with the size of the line inside the dividing line width. Therefore, the both ends of the sheet sealing sheet T function as a support part for clamping.
  • the semiconductor element C is sealed by the sealing layer M in the form of a sealing sheet piece in units of small distribution regions divided on the semiconductor substrate W. Therefore, warpage of the semiconductor substrate W due to thermal expansion or contraction during the curing process of the sealing layer M can be suppressed. That is, when a single sealing sheet in the shape of a semiconductor substrate is attached to the semiconductor substrate W, shrinkage stress concentrates toward the center of the semiconductor substrate W, so that the semiconductor substrate W is likely to warp. However, when the sealing sheet M is divided into a plurality of sealing sheet pieces CT and attached to the semiconductor substrate W, the sealing layer M contracts individually, so that the contraction stress is dispersed. Therefore, warpage and breakage of the semiconductor substrate W can be suppressed.
  • the sealing sheet piece CT is used by temporarily adhering the sealing sheet piece CT cut in a predetermined shape in advance to a release liner of a sheet cut larger than the semiconductor substrate W in a predetermined layout. Also good.
  • the sheet peeling liner functions as a support portion.
  • the sealing sheet piece CT When the sealing sheet piece CT is temporarily bonded to the release liner of the single wafer, it may be temporarily bonded to the release liner with the first release liner S1 attached thereto, or the first release liner S1 may be sealed.
  • the sealing layer M may be temporarily bonded to the release liner by peeling from the stop layer M.
  • the sealing sheet piece CT When the sealing sheet piece CT is temporarily bonded to the release liner and used, the sealing sheet piece CT having different characteristics can be attached to the semiconductor substrate W. For example, by using sealing sheet pieces CT having different shrinkage rates of the sealing layer M, the semiconductor substrate W is selectively used in a region where warpage is likely to occur and a region where it is difficult to occur. For example, the sealing sheet piece CT in which the sealing layer M having a smaller shrinkage rate than the sealing layer M of the sealing sheet piece CT to be attached to another part is attached to a part where warpage is likely to occur. According to this method, the warpage amount of the semiconductor substrate W can be adjusted.
  • the clamp plate 71 and the receiving plate 74 are provided on the four sides of the sticking jig 70 so as to uniformly apply outward tension to the sealing sheet T or the release liner from four directions. May be.
  • the shape of the semiconductor substrate W is not limited to a circle. Therefore, the semiconductor substrate W may be a square including a square or a rectangle.
  • the sealing sheet piece CT is appropriately matched with the shape of the semiconductor substrate W.
  • the present invention is suitable for efficiently affixing a sealing sheet without unevenness over a plurality of semiconductor elements formed on a semiconductor substrate.

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A sealing sheet, obtained by half-cutting a sealing sheet larger than a semiconductor substrate in the shape of the semiconductor substrate and forming a sealing-sheet piece, is mounted on an attachment jig and tension is applied to the sealing sheet, and the attachment jig is superposed on a first holding table to temporarily crimp the semiconductor substrate and the sealing-sheet piece. The semiconductor substrate, which has been integrated with the sealing-sheet piece gripped by the attachment jig, is then placed on a second holding table, the entire attachment jig is contained inside a pressure-reducing chamber, and the sealing-sheet piece is pressed in a reduced-pressure state to achieve final crimping of the semiconductor substrate.

Description

封止シート貼付け方法および封止シート貼付け装置Sealing sheet attaching method and sealing sheet attaching apparatus
　本発明は、半導体基板上に形成された複数個の半導体素子に樹脂組成物による封止層の形成された封止シートを貼り付けて封止する封止シート貼付け方法および封止シート貼付け装置に関する。 The present invention relates to a sealing sheet attaching method and a sealing sheet attaching apparatus for attaching and sealing a sealing sheet on which a sealing layer made of a resin composition is formed on a plurality of semiconductor elements formed on a semiconductor substrate. .
　１個の半導体チップの周りを枠体で囲んだ後に、樹脂を含浸させたプリプレグから成る第１の封止用樹脂シートと第２の封止用樹脂シートによって当該半導体チップの両面のそれぞれか挟み込み、半導体チップを封止して半導体装置を製造している（特許文献１を参照）。 After enclosing one semiconductor chip with a frame, the first sealing resin sheet and the second sealing resin sheet made of prepreg impregnated with resin are sandwiched between both surfaces of the semiconductor chip. A semiconductor device is manufactured by sealing a semiconductor chip (see Patent Document 1).
特開平５－２９１３１９号公報JP-A-5-291319
　しかしながら、上記従来方法では次のような問題が生じている。 However, the above conventional method has the following problems.
　すなわち、近年、アプリケーションの急速な進歩に伴う高密度実装の要求により、半導体装置が小型化される傾向にある。したがって、ダイシング処理によって半導体ウエハを半導体素子に分断した後に、半導体素子を個々に樹脂で封止しているので、スループットが低下し、ひいては生産効率を低下させるといった不都合が生じている。 That is, in recent years, semiconductor devices tend to be miniaturized due to the demand for high-density mounting accompanying rapid development of applications. Therefore, after the semiconductor wafer is divided into semiconductor elements by the dicing process, the semiconductor elements are individually sealed with resin, resulting in a problem that throughput is lowered and production efficiency is lowered.
　本発明はこのような事情に鑑みてなされたものであって、半導体基板に封止シートを効率よく貼り付けることが可能な封止シート貼付け方法および封止シート貼付け装置を提供することを主たる目的とする。 This invention is made | formed in view of such a situation, Comprising: The main objective is to provide the sealing sheet sticking method and sealing sheet sticking apparatus which can stick a sealing sheet efficiently to a semiconductor substrate. And
　そこで、本発明者たちは、当該不都合を解決するために、実験やシミュレーションを繰り返して鋭意検討した結果、以下の知見を得た。 Therefore, the present inventors obtained the following knowledge as a result of intensive studies by repeating experiments and simulations in order to solve the inconvenience.
　封止層が形成された枚葉の封止シートを半導体基板の全面に貼り付けることを試みた。しかしながら、当該方法では、次のような新たな問題が発生した。 An attempt was made to attach a single-sheet sealing sheet on which a sealing layer was formed to the entire surface of the semiconductor substrate. However, this method has the following new problem.
　すなわち、半導体素子を被覆する厚みを有する封止層が形成された封止シートは、一見すれば剛性を有しているように思える。しかしながら、一般に冷却管理されている封止シートは、使用時に室温まで戻されると適度の柔軟性を有する。それ故に、封止シートが、半導体基板上に分布した複数個の半導体素子を被覆するサイズになると、当該封止シートに撓みや反りが発生する。 That is, the sealing sheet on which the sealing layer having a thickness covering the semiconductor element is formed seems to have rigidity at first glance. However, a sealing sheet that is generally cooled and managed has moderate flexibility when returned to room temperature during use. Therefore, when the sealing sheet is sized to cover a plurality of semiconductor elements distributed on the semiconductor substrate, the sealing sheet is bent or warped.
　したがって、撓みなどの発生した状態の封止シートを半導体基板に貼り付けた場合、皺が発生したり、或いは、貼り合わせの位置ズレが生じたりする。皺の発生は、封止層にボイドを発生させて製品不良を招く。また、封止シートに撓みや反りが生じていると、加熱処理時および冷却処理時に封止層に作用する熱膨張または収縮応力が半導体基板に局部的に作用し、半導体基板を破損させるといった問題が発生した。 Therefore, when the sealing sheet in a state where the bending is generated is pasted on the semiconductor substrate, wrinkles are generated or the bonding position is shifted. The generation of wrinkles causes voids in the sealing layer and causes product defects. In addition, when the sealing sheet is bent or warped, the thermal expansion or contraction stress that acts on the sealing layer during the heat treatment and the cooling treatment locally acts on the semiconductor substrate, thereby damaging the semiconductor substrate. There has occurred.
　この発明は、このような目的を達成するために、次のような構成をとる。 This invention has the following configuration in order to achieve such an object.
　すなわち、剥離ライナに樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け方法であって、
　前記封止シートを半導体基板の形状以下のサイズに切断した封止シート片を支持する支持部の外縁を把持し、当該封止シート片に張力を付与する張力付与過程と、
　前記封止シート片と半導体基板を対向配置し、当該封止シート片を押圧して半導体基板に貼り付ける貼付け過程と、
　を備えたことを特徴とする。 That is, a sealing sheet affixing method for affixing a sealing sheet formed of a resin composition on a release liner to a semiconductor substrate,
Grasping the outer edge of the support part that supports the sealing sheet piece cut into the size of the semiconductor substrate below the size of the semiconductor substrate, and applying a tension to apply tension to the sealing sheet piece,
A pasting process in which the sealing sheet piece and the semiconductor substrate are arranged opposite to each other, and the sealing sheet piece is pressed and attached to the semiconductor substrate;
It is provided with.
　（作用・効果）　上記方法によれば、封止シートを支持する支持部の外縁を把持して張力を付与することにより、封止シートの撓みや反りが矯正される。したがって、皺や反りによって生じる半導体基板の破損およびボイドの発生を抑制することができる。また、従来の１個の半導体素子ごとに封止シートで封止する方法に比べて、半導体基板上の全ての半導体素子にわたって封止シートを貼り付けて封止することができるので、処理速度を向上させることができる。なお、本発明において、封止シート片とは、封止層に剥離ライナが添設された状態の形態をいう。 (Action / Effect) According to the above method, bending or warping of the sealing sheet is corrected by gripping the outer edge of the support portion that supports the sealing sheet and applying tension. Therefore, damage to the semiconductor substrate and generation of voids caused by wrinkles and warpage can be suppressed. In addition, compared to the conventional method of sealing each semiconductor element with a sealing sheet, the sealing sheet can be attached and sealed over all the semiconductor elements on the semiconductor substrate. Can be improved. In addition, in this invention, a sealing sheet piece means the form of the state by which the peeling liner was attached to the sealing layer.
　なお、上記張力付与過程では、例えば、貼付け治具を利用して封止シートに張力を付与してもよい。貼付け治具を利用した実施形態として、大きく分けて２形態ある。 In the above tension application process, for example, a tension may be applied to the sealing sheet using a sticking jig. As an embodiment using a sticking jig, there are roughly two forms.
　一実施形態として、半導体基板よりも大形の枚葉の封止シートを利用する。すなわち、当該枚葉の封止シートに半導体基板の形状にハーフカットした封止シート片を形成する。 As an embodiment, a single-sheet sealing sheet that is larger than a semiconductor substrate is used. That is, a sealing sheet piece half-cut into the shape of a semiconductor substrate is formed on the single-sheet sealing sheet.
　または、半導体基板に形成された複数個の半導体素子の分布領域に当該分布領域の面積よりも小さい面積で、かつ、複数個の半導体素子を囲う分断ラインに合わせて小片にハーフカットした複数枚の封止シート片を形成する。 Alternatively, a plurality of semiconductor elements formed on a semiconductor substrate having a smaller area than the area of the distribution area and half-cut into small pieces in accordance with a dividing line surrounding the plurality of semiconductor elements. A sealing sheet piece is formed.
　これらの実施形態によれば、封止シートに張力を付与することにより、封止シート片形状の封止層に直接に張力を付与することができる。したがって、剥離ライナから封止層を剥離しながら半導体基板に貼り付けることにより、皺の発生を抑制することができる。 According to these embodiments, by applying tension to the sealing sheet, it is possible to directly apply tension to the sealing sheet piece-shaped sealing layer. Therefore, generation | occurrence | production of a flaw can be suppressed by affixing on a semiconductor substrate, peeling a sealing layer from a peeling liner.
　他の実施形態として、半導体基板よりも大形の剥離ライナを利用する。すなわち、半導体基板に形成された複数個の半導体素子の分布領域を被覆しつつも、当該半導体基板の形状以下のサイズに予め切断した封止シート片を当該半導体基板よりも大形の枚葉の剥離ライナに仮接着し、当該剥離ライナを貼付け治具に装着して張力を付与する。 As another embodiment, a release liner that is larger than the semiconductor substrate is used. That is, while covering a distribution region of a plurality of semiconductor elements formed on a semiconductor substrate, a sealing sheet piece cut in advance to a size equal to or smaller than the shape of the semiconductor substrate is larger than the semiconductor substrate. Temporarily adhere to the release liner, and the release liner is attached to a sticking jig to apply tension.
　または、半導体基板に形成された複数個の半導体素子の分布領域に当該分布領域の面積よりも小さい面積で、かつ、複数個の半導体素子を囲う分断ラインに合わせて小片にハーフカットした複数枚の封止シート片を剥離ライナに仮接着し、当該剥離ライナを貼付け治具に装着して張力を付与する。 Alternatively, a plurality of semiconductor elements formed on a semiconductor substrate having a smaller area than the area of the distribution area and half-cut into small pieces in accordance with a dividing line surrounding the plurality of semiconductor elements. The sealing sheet piece is temporarily bonded to the release liner, and the release liner is attached to a sticking jig to apply tension.
　これらの実施形態によれば、剥離ライナに張力を付与することにより、封止シート片に間接的に張力を付与することができる。 According to these embodiments, it is possible to indirectly apply tension to the sealing sheet piece by applying tension to the release liner.
　なお、上記各実施形態において、半導体基板を保持する保持テーブルに貼付け治具を重ね合わせて減圧室に収納し、当該減圧室を減圧しながら前記封止シート片を押圧して半導体基板に貼り付けることが好ましい。 In each of the above embodiments, a sticking jig is overlaid on a holding table that holds a semiconductor substrate and is stored in a decompression chamber, and the sealing sheet piece is pressed and pasted onto the semiconductor substrate while decompressing the decompression chamber. It is preferable.
　この方法によれば、封止シート片と半導体基板の接着界面に含まれる気泡が除去される。したがって、封止層の硬化処理を行ったときに生じるボイドの発生をより確実に回避することができる。 According to this method, bubbles contained in the adhesive interface between the sealing sheet piece and the semiconductor substrate are removed. Therefore, it is possible to more reliably avoid the generation of voids that occur when the sealing layer is cured.
　また、この発明は、このような目的を達成するために、次のような構成をとる。 Also, the present invention has the following configuration in order to achieve such an object.
　すなわち、剥離ライナに樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け装置であって、
　前記半導体基板を保持する保持テーブルと、
　前記封止シートから半導体基板の形状以下のサイズの封止シート片形状にハーフカットされた当該封止シートを支持する支持部を把持し、当該封止シートに張力を付与する貼付け治具と、
　前記貼付け治具に把持された封止シートを押圧して封止シート片形状の封止層を半導体基板に貼り付ける貼付け機構と、
　を備えたことを特徴とする。 That is, a sealing sheet attaching device for attaching a sealing sheet formed of a resin composition to a release liner on a semiconductor substrate,
A holding table for holding the semiconductor substrate;
Gripping the supporting part that supports the sealing sheet half-cut from the sealing sheet to the shape of the sealing sheet piece having a size equal to or less than the shape of the semiconductor substrate, and applying a tension to the sealing sheet; and
An affixing mechanism for affixing a sealing sheet piece-shaped sealing layer to a semiconductor substrate by pressing the sealing sheet held by the affixing jig;
It is provided with.
　または、剥離ライナに樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け装置であって、
　前記半導体基板を保持する保持テーブルと、
　前記半導体基板の形状以下のサイズに切断された封止シート片を仮接着した当該半導体基板よりも大形の枚葉の剥離ライナの支持部を把持し、当該剥離ライナに張力を付与する貼付け治具と、
　前記貼付け治具に把持された剥離ライナを押圧して半導体基板に封止シート片を貼り付ける貼付け機構と、
　を備えたことを特徴とする。 Alternatively, a sealing sheet attaching device that attaches a sealing sheet formed of a resin composition to a release liner on a semiconductor substrate,
A holding table for holding the semiconductor substrate;
Gluing treatment for holding a supporting portion of a release liner of a large-sized single wafer than the semiconductor substrate to which a sealing sheet piece cut to a size equal to or smaller than the shape of the semiconductor substrate is temporarily bonded, and applying tension to the release liner Ingredients,
An affixing mechanism for affixing the sealing sheet piece to the semiconductor substrate by pressing the release liner held by the affixing jig;
It is provided with.
　なお、上記各構成において、貼付け治具を重ね合わせた保持テーブルを収納する減圧室を備えるとともに、貼付け機構を当該減圧室に配備することが好ましい。 In addition, in each said structure, while providing the decompression chamber which accommodates the holding table which piled up the sticking jig | tool, it is preferable to arrange | position a sticking mechanism in the said decompression chamber.
　この構成によれば、上記各実施形態を好適に実施することができる。 According to this configuration, the above embodiments can be suitably implemented.
　本発明の封止シート貼付け方法および封止シート貼付け装置によれば、半導体基板に形成された複数個の半導体素子にわたって偏りなく封止シートを効率よく貼り付けることができる。 According to the sealing sheet sticking method and the sealing sheet sticking apparatus of the present invention, the sealing sheet can be efficiently attached without deviation over a plurality of semiconductor elements formed on the semiconductor substrate.
封止シートの原反ロールを示す斜視図である。It is a perspective view which shows the original fabric roll of a sealing sheet. 封止シートの縦断面図である。It is a longitudinal cross-sectional view of a sealing sheet. 貼付け治具の構成を示す斜視図である。It is a perspective view which shows the structure of a sticking jig | tool. 貼付け治具の構成を示す正面図である。It is a front view which shows the structure of a sticking jig | tool. 封止シート貼付け装置の全体構成を示す正面図である。It is a front view which shows the whole structure of a sealing sheet sticking apparatus. 封止シート貼付け装置の全体構成を示す平面図である。It is a top view which shows the whole structure of a sealing sheet sticking apparatus. 貼付け機構を構成する減圧室の部分断面図である。It is a fragmentary sectional view of the decompression room which constitutes a pasting mechanism. 封止シート片の形成された封止シートを示す平面図である。It is a top view which shows the sealing sheet in which the sealing sheet piece was formed. 貼付け治具に封止シートをセットする動作を示す図である。It is a figure which shows the operation | movement which sets a sealing sheet to a sticking jig | tool. 貼付け治具に封止シートをセットする動作を示す図である。It is a figure which shows the operation | movement which sets a sealing sheet to a sticking jig | tool. 貼付け治具に封止シートをセットした状態を示す平面図である。It is a top view which shows the state which set the sealing sheet to the sticking jig | tool. 半導体基板に封止シート片を仮圧着する動作を示す図である。It is a figure which shows the operation | movement which carries out pressure bonding of the sealing sheet piece to a semiconductor substrate. 半導体基板に封止シート片を仮圧着する動作を示す図である。It is a figure which shows the operation | movement which carries out pressure bonding of the sealing sheet piece to a semiconductor substrate. 封止シート片の仮圧着された半導体基板の搬送状態を示す図である。It is a figure which shows the conveyance state of the semiconductor substrate by which the sealing sheet piece was temporarily crimped | bonded. 半導体基板に封止シート片を本圧着する動作を示す図である。It is a figure which shows the operation | movement which carries out this pressure bonding of the sealing sheet piece to a semiconductor substrate. 半導体基板に封止シート片を本圧着する動作を示す図である。It is a figure which shows the operation | movement which carries out this pressure bonding of the sealing sheet piece to a semiconductor substrate. 不要な封止層と第１剥離ライナを除去する動作を示す図である。It is a figure which shows the operation | movement which removes an unnecessary sealing layer and a 1st peeling liner. 変形例の封止シートに形成された封止シート片を示す平面図である。It is a top view which shows the sealing sheet piece formed in the sealing sheet of a modification. 変形例の封止シート片を半導体基板に本圧着した状態を示す平面図である。It is a top view which shows the state which pressure-bonded the sealing sheet piece of the modification to the semiconductor substrate.
　２０　…　治具載置台
　２１　…　第１搬送機構
　２３　…　第１保持テーブル
　２４　…　第２搬送機構
　２５　…　貼付け機構
　４５　…　第２保持テーブル　
　４６　…　減圧室
　５９　…　押圧プレート
　６０　…　ヒータ
　７０　…　貼付け治具
　　Ｔ　…　封止シート
　　Ｃ　…　半導体素子
　ＣＴ　…　封止シート片
　　Ｍ　…　封止層
　Ｓ１，Ｓ２…剥離ライナ
　　Ｗ　…　半導体基板 DESCRIPTION OF SYMBOLS 20 ... Jig mounting base 21 ... 1st conveyance mechanism 23 ... 1st holding table 24 ... 2nd conveyance mechanism 25 ... Pasting mechanism 45 ... 2nd holding table
46 ... Decompression chamber 59 ... Pressing plate 60 ... Heater 70 ... Attaching jig T ... Sealing sheet C ... Semiconductor element CT ... Sealing sheet piece M ... Sealing layer S1, S2 ... Release liner W ... Semiconductor substrate
　以下、図面を参照して本発明の一実施例を説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
　＜封止シート＞
　封止シートＴは、例えば、図１および図２に示すように、長尺の封止シートＴを巻き回した原反ロールで供給される。また、当該封止シートＴは、樹脂組成物からなる封止層Ｍの両面に保護用の第１剥離ライナＳ１および第２剥離ライナＳ２が添設されている。なお、封止層Ｍは、本発明の樹脂層に相当する。 <Sealing sheet>
The sealing sheet T is supplied with the raw fabric roll which wound the elongate sealing sheet T, for example, as shown in FIG.1 and FIG.2. Moreover, the said sealing sheet T is equipped with protective 1st peeling liner S1 and 2nd peeling liner S2 on both surfaces of the sealing layer M which consists of a resin composition. The sealing layer M corresponds to the resin layer of the present invention.
　封止層Ｍは、封止材料からシート形状に形成されている。封止材料としては、例えば、熱硬化性シリコーン樹脂、エポキシ樹脂、熱硬化性ポリイミド樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、不飽和ポリエステル樹脂、ジアリルフタレート樹脂、熱硬化性ウレタン樹脂、などの熱硬化性樹脂が挙げられる。また、封止材料として、上記した熱硬化性樹脂と、添加剤を適宜の割合で含有する熱硬化性樹脂組成物を挙げることもできる。 The sealing layer M is formed into a sheet shape from a sealing material. Examples of the sealing material include thermosetting silicone resin, epoxy resin, thermosetting polyimide resin, phenol resin, urea resin, melamine resin, unsaturated polyester resin, diallyl phthalate resin, thermosetting urethane resin, and the like. A curable resin is mentioned. Moreover, as a sealing material, the above-mentioned thermosetting resin and the thermosetting resin composition which contains an additive in an appropriate ratio can also be mentioned.
　添加剤としては、例えば、充填剤、蛍光体などが挙げられる。充填剤としては、例えば、シリカ、チタニア、タルク、アルミナ、窒化アルミニウム、窒化ケイ素などの無機微粒子、例えば、シリコーン粒子、などの有機微粒子などが挙げられる。蛍光体は、波長変換機能を有しており、例えば、青色光を黄色光に変換することのできる黄色蛍光体、青色光を赤色光に変化することのできる赤色蛍光体などを挙げることができる。黄色蛍光体としては、例えば、Ｙ３Ａｌ５Ｏ１２：Ｃｅ（ＹＡＧ（イットリウム・アルミニウム・ガーネット）：Ｃｅ）などのガーネット型蛍光体が挙げられる。赤色蛍光体としては、例えば、ＣａＡｌＳｉＮ３：Ｅｕ、ＣａＳｉＮ２：Ｅｕなどの窒化物蛍光体などが挙げられる。 Examples of the additive include a filler and a phosphor. Examples of the filler include inorganic fine particles such as silica, titania, talc, alumina, aluminum nitride, and silicon nitride, and organic fine particles such as silicone particles. The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light. . Examples of the yellow phosphor include garnet phosphors such as Y 3 Al 5 O 12 : Ce (YAG (yttrium, aluminum, garnet): Ce). Examples of the red phosphor include nitride phosphors such as CaAlSiN 3 : Eu and CaSiN 2 : Eu.
　封止層Ｍは、半導体素子を封止する前において、半固形状に調整されており、具体的には、封止材料が熱硬化性樹脂を含有する場合には、例えば、完全硬化（Ｃステージ化）する前、つまり、半硬化（Ｂステージ）状態で調整されている。 The sealing layer M is adjusted to a semi-solid state before sealing the semiconductor element. Specifically, when the sealing material contains a thermosetting resin, for example, complete curing (C It is adjusted before being staged, that is, in a semi-cured (B stage) state.
　封止層Ｍの寸法は、半導体素子および基板の寸法に応じて適宜に設定されている。具体的には、封止シートが長尺のシートとして用意される場合における封止層の左右方向における長さ、つまり、幅は、例えば、１００ｍｍ以上、好ましくは、２００ｍｍ以上であり、例えば、１５００ｍｍ以下、好ましくは、７００ｍｍ以下である。また、封止層の厚みは、半導体素子に寸法に対応して適宜に設定され、例えば、３０μｍ以上、好ましくは、１００μｍ以上であり、また、例えば、３０００μｍ以下、好ましくは、１０００μｍ以下である。 The dimensions of the sealing layer M are appropriately set according to the dimensions of the semiconductor element and the substrate. Specifically, when the sealing sheet is prepared as a long sheet, the length in the left-right direction of the sealing layer, that is, the width is, for example, 100 mm or more, preferably 200 mm or more, for example, 1500 mm. Hereinafter, it is preferably 700 mm or less. The thickness of the sealing layer is appropriately set according to the size of the semiconductor element, and is, for example, 30 μm or more, preferably 100 μm or more, and for example, 3000 μm or less, preferably 1000 μm or less.
　第１剥離ライナＳ１および第２剥離ライナＳ２は、例えば、ポリエチレンシート、ポリエステルシート（ＰＥＴなど）、ポリスチレンシート、ポリカーボネートシート、ポリイミドシートなどのポリマーシート、例えば、セラミックシート、例えば、金属箔などが挙げられる。剥離ライナにおいて、封止層と接触する接触面には、フッ素処理などの離型処理を施すこともできる。第１剥離ライナおよび第２剥離ライナの寸法は、剥離条件に応じて適宜に設定され、厚みが、例えば、１５μｍ以上、好ましくは、２５μｍ以上であり、また、例えば、１２５μｍ以下、好ましくは、７５μｍ以下である。 Examples of the first release liner S1 and the second release liner S2 include polymer sheets such as polyethylene sheets, polyester sheets (such as PET), polystyrene sheets, polycarbonate sheets, and polyimide sheets, such as ceramic sheets, such as metal foil. It is done. In the release liner, the contact surface in contact with the sealing layer can be subjected to a release treatment such as a fluorine treatment. The dimensions of the first release liner and the second release liner are appropriately set according to the release conditions, and the thickness is, for example, 15 μm or more, preferably 25 μm or more, and for example, 125 μm or less, preferably 75 μm. It is as follows.
　＜貼付け治具＞
　貼付け治具は、大きく分けて次の２態様の封止シートに張力を付与するように構成されている。一実施形態として、貼付け治具は、長方形や正方形を含む四角形に切断した半導体基板よりも大きい枚葉の封止シートに直接に張力を付与する。 <Attaching jig>
The sticking jig is roughly configured to apply tension to the sealing sheet of the following two modes. As one embodiment, the sticking jig directly applies tension to a single-sheet sealing sheet larger than a semiconductor substrate cut into a rectangle including a rectangle or a square.
　他の実施形態として、貼付け治具は、封止シートと同様に半導体基板よりも大きい四角形の剥離ライナに半導体基板の形状以下のサイズに切断した所定形状の封止シート片を仮接着した当該剥離シートに張力を付与し、間接的に封止シートに張力を付与する。以下、貼付け治具の具体的な構成について詳述する。なお、本実施例において、封止シート片は、封止層に剥離ライナが添設された状態の形態をいう。 As another embodiment, the sticking jig is a peel-off sheet in which a sealing sheet piece having a predetermined shape cut to a size equal to or smaller than the shape of the semiconductor substrate is temporarily bonded to a rectangular release liner larger than the semiconductor substrate in the same manner as the sealing sheet. A tension is applied to the sheet, and a tension is indirectly applied to the sealing sheet. Hereinafter, a specific configuration of the attaching jig will be described in detail. In addition, in a present Example, a sealing sheet piece says the form of the state by which the peeling liner was attached to the sealing layer.
　図３は貼付け治具の斜視図、図４は貼付け治具の正面図である。 3 is a perspective view of the sticking jig, and FIG. 4 is a front view of the sticking jig.
　貼付け治具７０は、矩形のフレーム枠７１の対向する両端にクランプ板７２と受け板７４を備えている。クランプ７２板は、コイルバネ７３によって受け板７４を押圧する方向に付勢されている。また、受け板７４は、逆Ｌ字形状をしており、その一方の下部寄りにフレーム枠７１の底面に固定された固定ブロック７５を貫通するボール軸７６の先端が当接されている。当該ボール軸７６と固定ブロック７５の間のコイルバネ７７によって、受け板７４が外向きにバネ付勢されている。また、当該ボール軸７６の他端側にはナット７８が螺合されている。当該ナット７８を正逆転することにより、ボール軸７６の突き出し距離が変化し、クランプ板７２と受け板７４の外向きの付勢力が調整可能に構成されている。 The affixing jig 70 includes a clamp plate 72 and a receiving plate 74 at opposite ends of a rectangular frame 71. The clamp 72 plate is biased in a direction of pressing the receiving plate 74 by a coil spring 73. Further, the receiving plate 74 has an inverted L shape, and a tip of a ball shaft 76 penetrating a fixed block 75 fixed to the bottom surface of the frame frame 71 is brought into contact with one lower portion thereof. The receiving plate 74 is biased outward by a coil spring 77 between the ball shaft 76 and the fixed block 75. A nut 78 is screwed to the other end side of the ball shaft 76. By rotating the nut 78 forward and backward, the protruding distance of the ball shaft 76 changes, and the outward biasing force of the clamp plate 72 and the receiving plate 74 can be adjusted.
　＜封止シート貼付け装置＞ <Seal sheet pasting device>
　図５は封止シート貼付け装置の正面図、図６は、封止シート貼付け装置の平面図である。 FIG. 5 is a front view of the sealing sheet sticking apparatus, and FIG. 6 is a plan view of the sealing sheet sticking apparatus.
　封止シート貼付け装置は、治具載置台２０、第１搬送機構２１、第１保持テーブル２３、第２搬送機構２４および貼付け機構２５などが配備されている。 The sealing sheet sticking device is provided with a jig mounting table 20, a first transport mechanism 21, a first holding table 23, a second transport mechanism 24, a sticking mechanism 25, and the like.
　治具載置台２０は、貼付け治具７０を水平に保持するよう構成されている。 The jig mounting table 20 is configured to hold the attaching jig 70 horizontally.
　第１搬送機構２１は、前後左右に水平移動および昇降可能な吸着ユニットの先端に吸着パッド２６を備えている。すなわち、装置本体の横方向に伸びるフレーム２７に沿ったガイドレールＲ１上を移動する第１可動台２８を備える。装置本体の前後に向けて水平保持されたガイドレールＲ２が第１可動台２８の下部に装着されている。ガイドレールＲ２に沿って前後に移動可能な第２可動台３０に懸垂支持された縦フレームに沿って昇降可能な吸着ユニットを備えている。 The first transport mechanism 21 includes a suction pad 26 at the tip of a suction unit that can move horizontally and move up and down, back and forth, and right and left. That is, a first movable base 28 that moves on the guide rail R1 along the frame 27 extending in the lateral direction of the apparatus main body is provided. A guide rail R2 that is horizontally held toward the front and rear of the apparatus main body is attached to the lower portion of the first movable base 28. A suction unit is provided that can move up and down along a vertical frame that is suspended and supported by a second movable base 30 that can move back and forth along the guide rail R2.
　なお、装置奥側への第１搬送機構２１の搬送経路の下方に２台のカメラ３４が配備されている。当該カメラ３４は、貼付け治具７０に把持されている封止シート片ＣＴの位置と貼付け治具７０の外形を撮像し、当該画像データを制御部に送信する。 Note that two cameras 34 are provided below the transport path of the first transport mechanism 21 to the back side of the apparatus. The camera 34 images the position of the sealing sheet piece CT held by the attaching jig 70 and the outer shape of the attaching jig 70 and transmits the image data to the control unit.
　第１保持テーブル２３は、半導体基板Ｗよりも大形のチャックテーブルで構成されている。第１保持テーブル２３は、縦軸周りに回転し、半導体基板Ｗのアライメントを行うよう構成されている。また、第１保持テーブル２３は、ガイドレール３８に沿って半導体基板Ｗの載置位置と装置奥側のアライメント位置とにわたって往復移動するように構成されている。 The first holding table 23 is a chuck table that is larger than the semiconductor substrate W. The first holding table 23 is configured to rotate around the vertical axis to align the semiconductor substrate W. Further, the first holding table 23 is configured to reciprocate along the guide rail 38 over the mounting position of the semiconductor substrate W and the alignment position on the back side of the apparatus.
　アライメント位置の上方には、２台のカメラ３９が配備されており、半導体基板Ｗの外形および分断ライン（スクライブライン）を撮像し、両画像データを制御部１００に送信する。 Two cameras 39 are provided above the alignment position, take an image of the outer shape and cutting line (scribe line) of the semiconductor substrate W, and transmit both image data to the control unit 100.
　第２搬送機構２４は、装置本体の横方向に伸びるフレーム４１に沿ってシート貼付け機構２５側まで達するガイドレールＲ３上を装置移動する可動台４２を備える。当該可動台４２に懸垂支持された縦フレーム４３に沿って昇降可能な吸着ユニットの先端に吸着パッド４４を備えている。第２搬送機構２４は、第１保持テーブル２３から第２保持テーブル４５までを往復移動するよう構成されている。 The second transport mechanism 24 includes a movable base 42 that moves the apparatus on a guide rail R3 that reaches the sheet sticking mechanism 25 side along a frame 41 that extends in the lateral direction of the apparatus main body. A suction pad 44 is provided at the tip of the suction unit that can be moved up and down along a vertical frame 43 that is suspended and supported by the movable table 42. The second transport mechanism 24 is configured to reciprocate from the first holding table 23 to the second holding table 45.
　貼付け機構２５は、図７および図１５に示すように第２保持テーブル４５および減圧室４６などから構成されている。 The pasting mechanism 25 includes a second holding table 45 and a decompression chamber 46 as shown in FIGS.
　第２保持テーブル４５は、減圧室４６を構成する上下一対の上ハウジング４６Ａと下ハウジング４６Ｂのうち、下ハウジング４６Ｂに収納されている。 The second holding table 45 is accommodated in the lower housing 46B among the upper and lower upper housings 46A and 46B constituting the decompression chamber 46.
　また、下ハウジング４６Ｂは、ガイドレール４８に沿って、装置本体の前側の半導体基板Ｗの受け取り位置と上ハウジング４６Ａの下方の間を往復移動するよう構成されている。 Further, the lower housing 46B is configured to reciprocate between the receiving position of the semiconductor substrate W on the front side of the apparatus main body and below the upper housing 46A along the guide rail 48.
　減圧室４６を構成する上ハウジング４６Ａには、昇降駆動機構５０に備えてられている。この昇降駆動機構５０は、縦壁５１の背部に縦向きに配置されたレール５２に沿って昇降可能な可動台５３、この可動台５３に高さ調節可能に支持された可動枠５４、この可動枠５４から前方に向けて延出されたアーム５５を備えている。このアーム５５の先端部から下方に延出する支軸５６に上ハウジング４６Ａが装着されている。 The upper and lower housings 46A constituting the decompression chamber 46 are provided in the lift drive mechanism 50. The elevating drive mechanism 50 includes a movable base 53 that can be moved up and down along a rail 52 that is vertically arranged on the back of a vertical wall 51, a movable frame 54 that is supported on the movable base 53 so that the height can be adjusted, and the movable frame 53. An arm 55 extending forward from the frame 54 is provided. An upper housing 46A is mounted on a support shaft 56 that extends downward from the tip of the arm 55.
　可動台５３は、ネジ軸５７をモータ５８によって正逆転することでねじ送り昇降されるようになっている。また、上ハウジング４６Ａの内部には、昇降可能な押圧プレート５９が内装されている。当該押圧プレート５９には、ヒータ６０が埋設されている。 The movable base 53 is adapted to be screwed up and down by rotating the screw shaft 57 forward and backward by a motor 58. A push plate 59 that can be raised and lowered is housed inside the upper housing 46A. A heater 60 is embedded in the pressing plate 59.
　＜封止シート貼付け処理＞
　次に、上記貼付け装置によって半導体基板に封止シートに形成された封止シート片を貼り付ける一連の動作について詳述する。なお、本実施例では、図８に示すように、半導体基板Ｗよりも大形の枚葉の封止シートＴに半導体基板Ｗの形状にハーフカットした封止シート片ＣＴを半導体基板Ｗに貼り付ける場合を例にとって説明する。 <Sealing sheet pasting process>
Next, a series of operations for attaching the sealing sheet piece formed on the sealing sheet to the semiconductor substrate by the attaching device will be described in detail. In this embodiment, as shown in FIG. 8, a sealing sheet piece CT that is half-cut into the shape of the semiconductor substrate W is pasted on the semiconductor substrate W on a single-layer sealing sheet T larger than the semiconductor substrate W. The case of attaching will be described as an example.
　先ず、封止シートＴのサイズに応じて予め決めた張力が付与されるように、貼付け治具７０のナット７８を回動させて外向きバネ付勢力を調整する。 First, the nut 78 of the attaching jig 70 is rotated to adjust the outward spring biasing force so that a predetermined tension is applied according to the size of the sealing sheet T.
　図９に示すように、バネ付勢に抗してクランプ板７２を開放し、封止シートＴをフレーム枠７１に載置する。その後に、図１０および図１１に示すように、クランプ板７２を閉じて封止シートＴの両端を把持する。このとき、両端を把持された封止シートＴに弛みや撓みの生じない適度な張力が付与される。すなわち、封止シートＴの両端が、支持部として機能する。 As shown in FIG. 9, the clamp plate 72 is opened against the spring bias, and the sealing sheet T is placed on the frame frame 71. Thereafter, as shown in FIGS. 10 and 11, the clamp plate 72 is closed and both ends of the sealing sheet T are gripped. At this time, an appropriate tension is applied to the sealing sheet T gripped at both ends so that no slack or deflection occurs. That is, both ends of the sealing sheet T function as support parts.
　封止シートＴおよび封止シート片ＣＴの裏面から第２剥離ライナＳ２を剥離し、貼付け治具７０を治具載置台２０に載置する。第１搬送機構２１によって貼付け治具７０のフレーム枠７１が吸着保持され、カメラ３４の上方に搬送される。カメラ３４の上方に第１搬送機構２１が達すると、第１搬送機構２１の外形および封止シート片ＣＴのレイアウト画像が撮像される。当該画像データが制御部に送信される。撮像処理が完了すると、第１搬送機構２１は、貼付け治具７０を吸着保持したまま、第１保持テーブル２３上へと移動する。 2nd peeling liner S2 is peeled from the back surface of sealing sheet T and sealing sheet piece CT, and the sticking jig | tool 70 is mounted in the jig mounting base 20. FIG. The first conveying mechanism 21 sucks and holds the frame 71 of the attaching jig 70 and conveys it above the camera 34. When the first transport mechanism 21 reaches above the camera 34, the outer shape of the first transport mechanism 21 and the layout image of the sealing sheet piece CT are captured. The image data is transmitted to the control unit. When the imaging process is completed, the first transport mechanism 21 moves onto the first holding table 23 while holding the sticking jig 70 by suction.
　貼付け治具７０が治具載置台２０に載置されると略同時に、図６に示すように、第１保持テーブル２３に複数個の半導体素子Ｃが表面に形成された半導体基板Ｗが載置される。半導体基板Ｗを吸着保持した第１保持テーブル２３は、アライメント位置に移動し、カメラ３９によって表面が撮像される。撮像された画像データは、制御部へと送信される。 As shown in FIG. 6, when the attaching jig 70 is placed on the jig placing table 20, the semiconductor substrate W on which the plurality of semiconductor elements C are formed is placed on the first holding table 23. Is done. The first holding table 23 holding the semiconductor substrate W by suction moves to the alignment position, and the surface of the first holding table 23 is imaged by the camera 39. The captured image data is transmitted to the control unit.
　撮像処理が完了すると、第１保持ステージ２３は、載置位置に戻る。ここで、制御部の画像解析処理により求めた貼付け治具７０の輪郭の中の封止シート片ＣＴのレイアウトの輪郭と半導体基板Ｗの半導体素子の分断ライン幅の内側のサイズとが合致し、かつ、半導体素子の分布領域の全面を覆うように、半導体基板Ｗのアライメントを行う。第１保持テーブル２３を縦軸周りに回転させてアライメントを行う。ここで分布領域とは、半導体基板を個片化する予定の複数個の半導体素子が配置されており、図６の一点鎖線で示すように、その最外周部の切断予定ラインを含む領域ＤＡである。 When the imaging process is completed, the first holding stage 23 returns to the placement position. Here, the outline of the layout of the sealing sheet piece CT in the outline of the attaching jig 70 obtained by the image analysis processing of the control unit matches the size inside the dividing line width of the semiconductor element of the semiconductor substrate W, The semiconductor substrate W is aligned so as to cover the entire surface of the semiconductor element distribution region. Alignment is performed by rotating the first holding table 23 around the vertical axis. Here, the distribution region is a region DA in which a plurality of semiconductor elements scheduled to be separated into semiconductor substrates are arranged, and as shown by a one-dot chain line in FIG. is there.
　半導体基板Ｗのアライメントが完了すると、第１保持テーブル２３上の半導体基板Ｗと貼付け治具７０を対向させ、図１２に示すように、貼付け治具７０を所定高さまで下降させる。このとき、図１３に示すように、第１保持テーブル２３に立設された位置決めピンＰが、貼付け治具７０の位置決め孔７９に係合し、位置合わせされる。この状態で、封止シートＣＴに所定荷重をかけて半導体基板Ｗに仮圧着する。この時点で、封止シート片ＣＴと封止シートＴを介して貼付け治具に半導体基板Ｗは保持されている。半導体基板Ｗへの封止シート片ＣＴの仮圧着が完了すると、第１搬送機構２１は、治具載置台２０側に戻る。 When the alignment of the semiconductor substrate W is completed, the semiconductor substrate W on the first holding table 23 and the attaching jig 70 are opposed to each other, and the attaching jig 70 is lowered to a predetermined height as shown in FIG. At this time, as shown in FIG. 13, the positioning pins P erected on the first holding table 23 engage with the positioning holes 79 of the attaching jig 70 and are aligned. In this state, a predetermined load is applied to the sealing sheet CT and temporarily bonded to the semiconductor substrate W. At this time, the semiconductor substrate W is held by the sticking jig via the sealing sheet piece CT and the sealing sheet T. When the temporary pressure bonding of the sealing sheet piece CT to the semiconductor substrate W is completed, the first transport mechanism 21 returns to the jig mounting table 20 side.
　第２搬送機構２４は、図１４に示すように、貼付け治具７０を吸着して第２保持テーブル４５に搬送および載置する。このとき、第１保持テーブル２３に貼付け治具７０をセットしたとき同じように、貼付け治具７０のフレーム枠７１に形成された位置決め孔７９に第２保持テーブル４５に形成された位置決めピンＰが係合し、位置合わせされる。 The second transport mechanism 24 sucks the sticking jig 70 and transports and places it on the second holding table 45 as shown in FIG. At this time, the positioning pins P formed on the second holding table 45 are inserted into the positioning holes 79 formed in the frame frame 71 of the attaching jig 70 in the same manner as when the attaching jig 70 is set on the first holding table 23. Engage and align.
　半導体基板Ｗが第２保持テーブル４５に載置されると、第２搬送機構２４は上昇して第１保持テーブル２３側に戻る。第２保持テーブル４５は、半導体基板Ｗを吸着保持したまま、貼付け治具７０とともに上ハウジング４６Ａの下方まで移動する。 When the semiconductor substrate W is placed on the second holding table 45, the second transport mechanism 24 rises and returns to the first holding table 23 side. The second holding table 45 moves to the lower portion of the upper housing 46A together with the attaching jig 70 while holding the semiconductor substrate W by suction.
　図１５に示すように、　第２保持テーブル４５を収納している下ハウジング４６Ｂを上ハウジング４６Ａの下方まで移動させ、図１６に示すように、減圧室４６を形成する。減圧室４６内を減圧するとともに、押圧プレート５９で加熱しながら封止シートＴを半導体基板Ｗに本圧着する。 As shown in FIG. 15, the lower housing 46B housing the second holding table 45 is moved to below the upper housing 46A to form the decompression chamber 46 as shown in FIG. The inside of the decompression chamber 46 is decompressed, and the sealing sheet T is finally bonded to the semiconductor substrate W while being heated by the pressing plate 59.
　本圧着が完了すると、第２保持テーブル４５を基板の受け渡し位置に移動させ、所定時時間冷却する。その後、図１７に示すように、第２搬送機構２４によって貼付け治具７０を吸着して上昇させることにより、接着力の低下している不要な封止層Ｍが第１剥離ライナＳ１側に残って半導体基板Ｗから剥離される。以上で一連の処理が完了し、同じ処理が繰り返される。 When the main press bonding is completed, the second holding table 45 is moved to the delivery position of the substrate and cooled for a predetermined time. Thereafter, as shown in FIG. 17, by adsorbing and raising the sticking jig 70 by the second transport mechanism 24, an unnecessary sealing layer M with reduced adhesive strength remains on the first release liner S <b> 1 side. And peeled off from the semiconductor substrate W. Thus, a series of processing is completed, and the same processing is repeated.
　上述の実施装置によれば、半導体基板Ｗの外形からはみ出る封止シートＴの部位を支持部として貼付け治具７０によってクランプすることにより、封止シートＴおよび封止シート片ＣＴに撓みや反りが生じない適度な張力を付与した状態で半導体基板Ｗに封止シート片ＣＴを貼り付けることができる。すなわち、封止シートＴおよび封止シート片ＣＴは貼付時に弛んでいないので、半導体基板Ｗとの接着界面に気泡が巻き込んだり、或いは、皺が発生したりするのを抑制することができる。その結果、封止層Ｍにボイドが発生したり、半導体基板Ｗを破損させたりすることがない。 According to the above-described implementation apparatus, the sealing sheet T and the sealing sheet piece CT are bent or warped by clamping the portion of the sealing sheet T protruding from the outer shape of the semiconductor substrate W with the attaching jig 70 as a support portion. The sealing sheet piece CT can be attached to the semiconductor substrate W in a state where an appropriate tension that does not occur is applied. That is, since the sealing sheet T and the sealing sheet piece CT are not loosened at the time of sticking, it is possible to suppress the occurrence of bubbles or the generation of wrinkles at the adhesive interface with the semiconductor substrate W. As a result, no void is generated in the sealing layer M and the semiconductor substrate W is not damaged.
　また、封止シート片ＣＴは、半導体基板Ｗよりもサイズが小さいので、貼付け時の取り扱いが容易である。すなわち、半導体基板Ｗと封止シート片ＣＴの接着界面への気泡の巻き込みをより確実に抑制することができる。 Moreover, since the sealing sheet piece CT is smaller in size than the semiconductor substrate W, it is easy to handle at the time of pasting. That is, it is possible to more reliably suppress the entrainment of bubbles at the bonding interface between the semiconductor substrate W and the sealing sheet piece CT.
　なお、本発明は以下のような形態で実施することもできる。 The present invention can also be implemented in the following forms.
　（１）上記実施例において、封止シート片ＣＴは、半導体基板Ｗの形状に限定されるものではない。例えば、図１８に示すように、半導体基板Ｗに形成された複数個の半導体素子Ｃの分布領域に当該分布領域の面積よりも小さい面積で、かつ、複数個の半導体素子Ｃを囲う分断ラインに合わせて小片にハーフカットした複数枚の封止シート片ＣＴであってもよい。すなわち、分断ライン幅の内側のラインのサイズ以下に合わせて枚葉の封止シートＴから封止シート片ＣＴをハーフカットする。したがって、枚葉の封止シートＴの両端がクランプさえる支持部として機能する。 (1) In the above embodiment, the sealing sheet piece CT is not limited to the shape of the semiconductor substrate W. For example, as shown in FIG. 18, the distribution region of the plurality of semiconductor elements C formed on the semiconductor substrate W has an area smaller than the area of the distribution region and a dividing line that surrounds the plurality of semiconductor elements C. A plurality of sealing sheet pieces CT that are half-cut into small pieces may be used. That is, the sealing sheet piece CT is half-cut from the single-sheet sealing sheet T in accordance with the size of the line inside the dividing line width. Therefore, the both ends of the sheet sealing sheet T function as a support part for clamping.
　この実施形態によれば、図１９に示すように、半導体基板Ｗ上で分割された小さい分布領域単位で半導体素子Ｃが、封止シート片形状の封止層Ｍによって封止される。したがって、封止層Ｍの硬化処理時の熱膨張または収縮による半導体基板Ｗの反りを抑制することができる。すなわち、半導体基板形状の１枚の封止シートを半導体基板Ｗに貼り付けた場合、半導体基板Ｗの中心に向けて収縮応力が集中するので、半導体基板Ｗに反りが発生しやすい。しかしながら、複数枚の封止シート片ＣＴに分割して半導体基板Ｗに貼り付けた場合、封止層Ｍが個々に収縮するので、収縮応力が分散される。したがって、半導体基板Ｗの反りおよび破損を抑制することができる。 According to this embodiment, as shown in FIG. 19, the semiconductor element C is sealed by the sealing layer M in the form of a sealing sheet piece in units of small distribution regions divided on the semiconductor substrate W. Therefore, warpage of the semiconductor substrate W due to thermal expansion or contraction during the curing process of the sealing layer M can be suppressed. That is, when a single sealing sheet in the shape of a semiconductor substrate is attached to the semiconductor substrate W, shrinkage stress concentrates toward the center of the semiconductor substrate W, so that the semiconductor substrate W is likely to warp. However, when the sealing sheet M is divided into a plurality of sealing sheet pieces CT and attached to the semiconductor substrate W, the sealing layer M contracts individually, so that the contraction stress is dispersed. Therefore, warpage and breakage of the semiconductor substrate W can be suppressed.
　また、封止シート片ＣＴは、半導体基板Ｗよりも大形に切断した枚葉の剥離ライナに、予め所定形状に切断した封止シート片ＣＴを決められたレイアウトで仮接着して利用してもよい。この場合、枚葉の剥離ライナが支持部として機能する。なお、枚葉の当該剥離ライナに封止シート片ＣＴを仮接着するとき、第１剥離ライナＳ１を添接したまま剥離ライナに仮接着してもよいし、或いは、第１剥離ライナＳ１を封止層Ｍから剥離して封止層Ｍを剥離ライナに仮接着させてもよい。 Further, the sealing sheet piece CT is used by temporarily adhering the sealing sheet piece CT cut in a predetermined shape in advance to a release liner of a sheet cut larger than the semiconductor substrate W in a predetermined layout. Also good. In this case, the sheet peeling liner functions as a support portion. When the sealing sheet piece CT is temporarily bonded to the release liner of the single wafer, it may be temporarily bonded to the release liner with the first release liner S1 attached thereto, or the first release liner S1 may be sealed. The sealing layer M may be temporarily bonded to the release liner by peeling from the stop layer M.
　剥離ライナに封止シート片ＣＴを仮接着して利用する場合、特性の異なる封止シート片ＣＴを半導体基板Ｗに貼り付けることができる。例えば、封止層Ｍの収縮率の異なる封止シート片ＣＴを利用し、半導体基板Ｗの反りの発生しやすい領域と発生しにくい領域で使い分ける。例えば、反りの発生し易い部分に他の部分に貼り付ける封止シート片ＣＴの封止層Ｍよりも収縮率の小さい封止層Ｍの形成された封止シート片ＣＴを貼り付ける。この方法によれば、半導体基板Ｗの反り量を調整することができる。 When the sealing sheet piece CT is temporarily bonded to the release liner and used, the sealing sheet piece CT having different characteristics can be attached to the semiconductor substrate W. For example, by using sealing sheet pieces CT having different shrinkage rates of the sealing layer M, the semiconductor substrate W is selectively used in a region where warpage is likely to occur and a region where it is difficult to occur. For example, the sealing sheet piece CT in which the sealing layer M having a smaller shrinkage rate than the sealing layer M of the sealing sheet piece CT to be attached to another part is attached to a part where warpage is likely to occur. According to this method, the warpage amount of the semiconductor substrate W can be adjusted.
　（２）上記各実施例において、貼付け治具７０の四辺にクランプ板７１と受け板７４を設けて、封止シートＴまたは剥離ライナに四方から外向きの張力を均等に付与するように構成してもよい。 (2) In each of the above-described embodiments, the clamp plate 71 and the receiving plate 74 are provided on the four sides of the sticking jig 70 so as to uniformly apply outward tension to the sealing sheet T or the release liner from four directions. May be.
　（３）上記各実施例において、半導体基板Ｗの形状は、円形に限定されない。したがって、半導体基板Ｗは、正方形または長方形などを含む四角形であってもよい。なお、封止シート片ＣＴは、半導体基板Ｗの形状に適宜に合わせられる。 (3) In each of the above embodiments, the shape of the semiconductor substrate W is not limited to a circle. Therefore, the semiconductor substrate W may be a square including a square or a rectangle. The sealing sheet piece CT is appropriately matched with the shape of the semiconductor substrate W.
　以上のように、本発明は、半導体基板に形成された複数個の半導体素子にわたって偏りなく封止シートを効率よく貼り付けるのに適している。 As described above, the present invention is suitable for efficiently affixing a sealing sheet without unevenness over a plurality of semiconductor elements formed on a semiconductor substrate.

Claims (9)

  1. 　剥離ライナに樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け方法であって、
    　前記封止シートを半導体基板の形状以下のサイズに切断した封止シート片を支持する支持部の外縁を把持し、当該封止シート片に張力を付与する張力付与過程と、
    　前記封止シート片と半導体基板を対向配置し、当該封止シート片を押圧して半導体基板に貼り付ける貼付け過程と、
    　を備えたことを特徴とする封止シート貼付け方法。     A sealing sheet affixing method for affixing a sealing sheet formed of a resin composition to a release liner on a semiconductor substrate,
    Grasping the outer edge of the support part that supports the sealing sheet piece cut into the size of the semiconductor substrate below the size of the semiconductor substrate, and applying a tension to apply tension to the sealing sheet piece,
    A pasting process in which the sealing sheet piece and the semiconductor substrate are arranged opposite to each other, and the sealing sheet piece is pressed and attached to the semiconductor substrate;
    The sealing sheet sticking method characterized by having provided.
  2. 　請求項１に記載の封止シート貼付け方法において、
    　前記張力付与過程は、半導体基板よりも大形の枚葉の封止シートに当該半導体基板の形状にハーフカットした封止シート片の形成された当該封止シートを貼付け治具に装着して張力を付与し、
    　前記貼付け過程は、貼付け治具に装着された封止シートの剥離ライナから封止シート片形状の封止層を剥離して半導体基板に貼り付ける
    　ことを特徴とする封止シート貼付け方法。     In the sealing sheet sticking method of Claim 1,
    The tension applying process is performed by attaching the sealing sheet on which a sealing sheet piece half-cut into the shape of the semiconductor substrate is attached to a sticking jig to a sealing sheet that is larger than the semiconductor substrate. And grant
    The said sticking process peels off the sealing layer of sealing sheet piece shape from the peeling liner of the sealing sheet with which the sticking jig | tool was mounted | worn, and sticks it on a semiconductor substrate. The sealing sheet sticking method characterized by the above-mentioned.
  3. 　請求項１に記載の封止シート貼付け方法において、
    　前記張力付与過程は、半導体基板に形成された複数個の半導体素子の分布領域に当該分布領域の面積よりも小さい面積で、かつ、複数個の半導体素子を囲う分断ラインに合わせて小片にハーフカットした複数枚の封止シート片の形成された枚葉の封止シートを貼付け治具に装着して張力を付与し、
    　前記貼付け過程は、貼付け治具に装着された封止シートの剥離ライナから封止シート片形状の封止層を剥離して半導体基板に貼り付ける
    　ことを特徴とする封止シート貼付け方法。     In the sealing sheet sticking method of Claim 1,
    The tension applying process is performed by dividing a plurality of semiconductor elements formed on a semiconductor substrate into a small area in accordance with a dividing line surrounding the plurality of semiconductor elements and having an area smaller than the area of the distribution area. A plurality of sealing sheet pieces formed with a single sheet of sealing sheet attached to a sticking jig to apply tension,
    The said sticking process peels off the sealing layer of sealing sheet piece shape from the peeling liner of the sealing sheet with which the sticking jig | tool was mounted | worn, and sticks it on a semiconductor substrate. The sealing sheet sticking method characterized by the above-mentioned.
  4. 　請求項１に記載の封止シート貼付け方法において、
    　前記張力付与過程は、半導体基板に形成された複数個の半導体素子の分布領域を被覆しつつも、当該半導体基板の形状以下のサイズに予め切断した封止シート片を当該半導体基板よりも大形の枚葉の剥離ライナに仮接着し、
    　前記剥離ライナを貼付け治具に装着して張力を付与し、
    　前記貼付け過程は、貼付け治具に装着された剥離ライナから封止シート片を剥離して半導体基板に貼り付ける
    　ことを特徴とする封止シート貼付け方法。     In the sealing sheet sticking method of Claim 1,
    The tension applying process covers a distribution region of a plurality of semiconductor elements formed on a semiconductor substrate, and a sealing sheet piece cut in advance to a size equal to or smaller than the shape of the semiconductor substrate is larger than the semiconductor substrate. Temporarily bonded to the release liner
    Attaching the release liner to a sticking jig to give tension,
    The said sticking process peels a sealing sheet piece from the peeling liner with which the sticking jig was mounted | worn, and sticks it on a semiconductor substrate. The sealing sheet sticking method characterized by the above-mentioned.
  5. 　請求項１に記載の封止シート貼付け方法において、
    　前記張力付与過程は、半導体基板に形成された複数個の半導体素子の分布領域に当該分布領域の面積よりも小さい面積で、かつ、複数個の半導体素子を囲う分断ラインに合わせて小片にハーフカットした複数枚の封止シート片を剥離ライナに仮接着し、
    　前記剥離ライナを貼付け治具に装着して張力を付与し、
    　前記貼付け過程は、貼付け治具に装着された剥離ライナから封止シート片を剥離して半導体基板に貼り付ける
    　ことを特徴とする封止シート貼付け方法。     In the sealing sheet sticking method of Claim 1,
    The tension applying process is performed by dividing a plurality of semiconductor elements formed on a semiconductor substrate into a small area in accordance with a dividing line surrounding the plurality of semiconductor elements and having an area smaller than the area of the distribution area. Temporarily bonding the plurality of sealing sheet pieces to the release liner,
    Attaching the release liner to a sticking jig to give tension,
    The said sticking process peels a sealing sheet piece from the peeling liner with which the sticking jig was mounted | worn, and sticks it on a semiconductor substrate. The sealing sheet sticking method characterized by the above-mentioned.
  6. 　請求項１に記載の封止シート貼付け方法において、
    　前記貼付け過程は、半導体基板を保持する保持テーブルに貼付け治具を重ね合わせて減圧室に収納し、当該減圧室を減圧しながら前記封止シート片を押圧して半導体基板に貼り付ける
    　ことを特徴とする封止シート貼付け方法。     In the sealing sheet sticking method of Claim 1,
    The pasting process is characterized in that a pasting jig is superposed on a holding table for holding a semiconductor substrate and stored in a decompression chamber, and the sealing sheet piece is pressed and pasted on the semiconductor substrate while decompressing the decompression chamber. Sealing sheet affixing method.
  7. 　剥離ライナに樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け装置であって、
    　前記半導体基板を保持する保持テーブルと、
    　前記封止シートから半導体基板の形状以下のサイズの封止シート片形状にハーフカットされた当該封止シートを支持する支持部を把持し、当該封止シートに張力を付与する貼付け治具と、
    　前記貼付け治具に把持された封止シートを押圧して封止シート片形状の封止層を半導体基板に貼り付ける貼付け機構と、
    　を備えたことを特徴とする封止シート貼付け装置。     A sealing sheet affixing device for affixing a sealing sheet formed of a resin composition on a release liner to a semiconductor substrate,
    A holding table for holding the semiconductor substrate;
    Gripping the supporting part that supports the sealing sheet half-cut from the sealing sheet to the shape of the sealing sheet piece having a size equal to or less than the shape of the semiconductor substrate, and applying a tension to the sealing sheet; and
    An affixing mechanism for affixing a sealing sheet piece-shaped sealing layer to a semiconductor substrate by pressing the sealing sheet held by the affixing jig;
    The sealing sheet sticking apparatus characterized by having provided.
  8. 　剥離ライナに樹脂組成物からなる封止層の形成された封止シートを半導体基板に貼り付ける封止シート貼付け装置であって、
    　前記半導体基板を保持する保持テーブルと、
    　前記半導体基板の形状以下のサイズに切断された封止シート片を仮接着した当該半導体基板よりも大形の枚葉の剥離ライナの支持部を把持し、当該剥離ライナに張力を付与する貼付け治具と、
    　前記貼付け治具に把持された剥離ライナを押圧して半導体基板に封止シート片を貼り付ける貼付け機構と、
    　を備えたことを特徴とする封止シート貼付け装置。     A sealing sheet affixing device for affixing a sealing sheet formed of a resin composition on a release liner to a semiconductor substrate,
    A holding table for holding the semiconductor substrate;
    Gluing treatment for holding a supporting portion of a release liner of a large-sized single wafer than the semiconductor substrate to which a sealing sheet piece cut to a size equal to or smaller than the shape of the semiconductor substrate is temporarily bonded, and applying tension to the release liner Ingredients,
    An affixing mechanism for affixing the sealing sheet piece to the semiconductor substrate by pressing the release liner held by the affixing jig;
    The sealing sheet sticking apparatus characterized by having provided.
  9. 　請求項７または請求項８に記載の封止シート貼付け装置において、
    　前記貼付け治具を重ね合わせた保持テーブルを収納する減圧室を備え、
    　前記減圧室に貼付け機構を備えた
    　ことを特徴とする封止シート貼付け装置。     In the sealing sheet sticking apparatus according to claim 7 or claim 8,
    A decompression chamber for storing a holding table on which the pasting jig is superposed;
    The sealing sheet sticking apparatus characterized by having a sticking mechanism in the decompression chamber.
PCT/JP2014/057176 2013-04-08 2014-03-17 Method for attaching sealing sheet and apparatus for attaching sealing sheet WO2014167948A1 (en)

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