KR20150143539A - Method for attaching sealing sheet and apparatus for attaching sealing sheet - Google Patents

Abstract

A sealing sheet having half-cut sealing sheet pieces formed in the shape of the semiconductor substrate is formed on the sealing sheet larger than the semiconductor substrate. The sealing sheet is attached to the attachment jig to give a tensile force. The attachment jig is superimposed on the first holding table, Pressurize the side. Thereafter, the semiconductor substrate integrated with the sealing sheet piece gripped by the attachment jig is placed on the second holding table, and the sealing sheet piece is accommodated in the decompression chamber for each of the attachment jigs to pressurize the sealing sheet piece, do.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a sealing sheet attaching method,

The present invention relates to a sealing sheet attaching method and a sealing sheet attaching apparatus which attach and seal a sealing sheet formed with a sealing layer of a resin composition to a plurality of semiconductor elements formed on a semiconductor substrate.

A first resin sheet for sealing and a second resin sheet for sealing each including a prepreg impregnated with a resin are attached to both surfaces of the semiconductor chip so as to seal the semiconductor chip, (See Patent Document 1).

Japanese Patent Application Laid-Open No. 5-291319

However, the above-mentioned conventional method causes the following problems.

That is, in recent years, semiconductor devices tend to be miniaturized due to the demand for high-density packaging accompanied by rapid advances in applications. Therefore, after the semiconductor wafer is divided into the semiconductor elements by the dicing process, the semiconductor elements are individually sealed with the resin, so that the throughput is lowered and, furthermore, the production efficiency is lowered.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and its main object is to provide a sealing sheet attaching method and an apparatus for attaching a sealing sheet which can efficiently attach a sealing sheet to a semiconductor substrate.

Therefore, in order to solve the problem, the present inventors repeatedly conducted experiments and simulations, and as a result, obtained the following findings.

An attempt was made to attach a single sheet of sealing sheet with a sealing layer to the entire surface of the semiconductor substrate. However, in this method, the following new problems have arisen.

That is, the sealing sheet provided with the sealing layer having the thickness for covering the semiconductor element is considered to have rigidity at first. However, the sealing sheet which is generally cooled and controlled has adequate flexibility when it is returned to room temperature in use. As a result, when the sealing sheet becomes large enough to cover a plurality of semiconductor elements distributed on the semiconductor substrate, the sealing sheet is subject to stiction or warpage.

Therefore, when the sealing sheet in a state in which stitching or the like is formed is adhered to the semiconductor substrate, wrinkles occur or the position of the bonding is shifted. Creation of wrinkles causes voids in the sealing layer, resulting in product defects. Further, if the sealing sheet is struck or warped, thermal expansion or shrinkage stress acting on the sealing layer during the heat treatment and the cooling treatment locally acts on the semiconductor substrate, causing a problem that the semiconductor substrate is damaged.

In order to achieve the above object, the present invention adopts the following configuration.

That is, a sealing sheet attaching method for attaching a sealing sheet having a sealing layer containing a resin composition to a release liner to a semiconductor substrate,

A tension imparting step of grasping an outer edge of a supporting portion for supporting a sealing sheet piece cut into a size equal to or smaller than the shape of the semiconductor substrate and imparting tension to the sealing sheet piece;

And a step of placing the sealing sheet piece and the semiconductor substrate facing each other and pressing the sealing sheet piece to adhere to the semiconductor substrate.

(Action and Effect) According to the above method, the outer edge of the support portion supporting the seal sheet is grasped to give a tension, whereby the seal or warpage of the seal sheet is corrected. Therefore, damage to the semiconductor substrate and generation of voids caused by wrinkles and warpage can be suppressed. Further, as compared with the conventional sealing method using a sealing sheet for each semiconductor element, the sealing sheet can be attached and sealed over all the semiconductor elements on the semiconductor substrate, so that the processing speed can be improved. In the present invention, the sealing sheet member refers to a state in which a release liner is provided on the sealing layer.

In addition, in the tension imparting process, for example, tension may be applied to the sealing sheet by using an attachment jig. As an embodiment using an attachment jig, there are two types of embodiments.

As one embodiment, a sheet-like sheet that is larger than a semiconductor substrate is used. That is, a half-cut sealing sheet piece in the form of a semiconductor substrate is formed on the single sheet of sealing sheet.

Alternatively, a plurality of sealing sheet pieces half-cut with small pieces are formed in the distribution regions of the plurality of semiconductor elements formed on the semiconductor substrate so as to match the division lines surrounding the plurality of semiconductor elements with an area smaller than the area of the distribution region .

According to these embodiments, by applying tension to the sealing sheet, it is possible to directly apply a tension to the sealing sheet-shaped sealing layer. Therefore, the occurrence of wrinkles can be suppressed by attaching to the semiconductor substrate while peeling the sealing layer from the release liner.

As another embodiment, a release liner larger than the semiconductor substrate is used. That is, a sealing sheet piece previously cut to a size equal to or smaller than the shape of the semiconductor substrate is adhered to a sheet separating liner larger than the semiconductor substrate while covering the distribution region of a plurality of semiconductor elements formed on the semiconductor substrate, Is attached to the attachment jig to impart tension.

Alternatively, a plurality of sealing sheet pieces half-cut into small pieces in a distribution area of a plurality of semiconductor elements formed on a semiconductor substrate so as to correspond to division lines surrounding an area of the distribution area and surrounding a plurality of semiconductor elements, And the release liner is attached to the attachment jig to impart tension thereto.

According to these embodiments, it is possible to indirectly apply tension to the sealing sheet piece by applying tension to the release liner.

Further, in each of the above-described embodiments, it is preferable that the attachment jig is stacked on the holding table holding the semiconductor substrate and stored in the vacuum chamber, and the sealing sheet piece is pressed on the semiconductor substrate while depressurizing the vacuum chamber.

According to this method, bubbles included in the bonding interface between the sealing sheet piece and the semiconductor substrate are removed. Therefore, it is possible to more reliably avoid generation of voids that occurs when the sealing layer is cured.

Further, in order to achieve this object, the present invention adopts the following configuration.

That is, a sealing sheet attaching apparatus for attaching a sealing sheet having a sealing layer containing a resin composition to a release liner to a semiconductor substrate,

A holding table for holding the semiconductor substrate;

An attachment jig for gripping a support portion for supporting the half-cut sealing sheet in a shape of a sealing sheet having a size equal to or smaller than the shape of the semiconductor substrate from the sealing sheet and for applying a tension to the sealing sheet,

And a mounting mechanism for pressing the sealing sheet gripped by the attachment jig to attach the sealing layer in the form of a sealing sheet to the semiconductor substrate.

Alternatively, a sealing sheet attaching apparatus for attaching a sealing sheet, on which a sealing layer containing a resin composition is formed, to a release liner is attached to a semiconductor substrate,

A holding table for holding the semiconductor substrate;

An attachment jig for gripping a supporting portion of a sheet separating liner larger than the semiconductor substrate to which the sealing sheet piece cut to a size equal to or smaller than the shape of the semiconductor substrate is adhered and applying a tension to the separating liner,

And an attaching mechanism for attaching the sealing sheet piece to the semiconductor substrate by pressing the release liner gripped by the attaching jig.

In each of the above-described structures, it is preferable to provide a decompression chamber for accommodating the holding table in which the attachment jigs are superimposed, and to dispose the attachment mechanism in the decompression chamber.

According to this configuration, each of the above-described embodiments can be appropriately performed.

INDUSTRIAL APPLICABILITY According to the sealing sheet attaching method and the sealing sheet attaching apparatus of the present invention, it is possible to efficiently attach the sealing sheet over a plurality of semiconductor elements formed on a semiconductor substrate without tilting.

1 is a perspective view showing a raw roll of a sealing sheet.
2 is a longitudinal sectional view of the sealing sheet.
3 is a perspective view showing the structure of the attachment jig.
4 is a front view showing the structure of the attachment jig.
5 is a front view showing an overall configuration of a sealing sheet attaching apparatus.
6 is a plan view showing the entire configuration of a sealing sheet attaching apparatus.
7 is a partial sectional view of the decompression chamber constituting the attachment mechanism.
8 is a plan view showing a sealing sheet on which a sealing sheet piece is formed.
9 is a view showing the operation of setting the sealing sheet to the attachment jig.
10 is a view showing the operation of setting the sealing sheet to the attachment jig.
11 is a plan view showing a state in which a sealing sheet is set on an attachment jig.
12 is a view showing an operation of press-fitting a sealing sheet piece onto a semiconductor substrate.
13 is a diagram showing an operation of press-fitting a sealing sheet piece onto a semiconductor substrate.
14 is a view showing the conveying state of the semiconductor substrate on which the sealing sheet piece is pressed.
Fig. 15 is a view showing an operation of pressing and sealing a sealing sheet piece on a semiconductor substrate. Fig.
16 is a diagram showing an operation of compressing and bonding a sealing sheet piece to a semiconductor substrate.
17 is a view showing an operation of removing the unnecessary sealing layer and the first peel liner.
18 is a plan view showing a sealing sheet piece formed on a sealing sheet of a modified example.
Fig. 19 is a plan view showing a state in which a sealing sheet piece of a modified example is originally squeezed onto a semiconductor substrate. Fig.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

<Seal sheet>

The sealing sheet T is fed, for example, as shown in Figs. 1 and 2, with a roll of the long sealing sheet T wound thereon. The sealing sheet T is provided with a first protective liner S1 and a second protective liner S2 on both sides of the sealing layer M containing the resin composition. The sealing layer (M) corresponds to the resin layer of the present invention.

The sealing layer (M) is formed in a sheet form from a sealing material. Examples of the sealing material include thermosetting resins such as a thermosetting silicone resin, an epoxy resin, a thermosetting polyimide resin, a phenol resin, a urea resin, a melamine resin, an unsaturated polyester resin, a diallyl phthalate resin and a thermosetting urethane resin. As the sealing material, a thermosetting resin composition containing the thermosetting resin and the additive in an appropriate ratio may be used.

Examples of the additive include fillers and phosphors. Examples of the filler include inorganic fine particles such as silica, titania, talc, alumina, aluminum nitride and silicon nitride, and organic fine particles such as silicon particles. The phosphor has a wavelength converting function, for example, a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light. Examples of the yellow phosphor include garnet type phosphors such as Y ₃ Al ₅ O ₁₂ : Ce (YAG (yttrium aluminum garnet): Ce). Examples of the red phosphor include nitride phosphors such as CaAlSiN ₃ : Eu and CaSiN ₂ : Eu.

The sealing layer M is adjusted to have a semi-rigid shape before sealing the semiconductor element. Specifically, when the sealing material contains a thermosetting resin, the sealing layer M is, for example, before being completely cured (C-staged) (B stage) state.

The dimensions of the sealing layer (M) are appropriately set according to the dimensions of the semiconductor element and the substrate. Specifically, the length, that is, the width in the left-right direction of the sealing layer in the case where the sealing sheet is prepared as a long sheet is, for example, 100 mm or more, preferably 200 mm or more, 700 mm or less. The thickness of the sealing layer is appropriately set in accordance with the dimensions of the semiconductor element and is, for example, 30 占 퐉 or more, preferably 100 占 퐉 or more, and, for example, 3000 占 퐉 or less, to be.

The first release liner S1 and the second release liner S2 may be formed of a polymer sheet such as a polyethylene sheet, a polyester sheet (PET or the like), a polystyrene sheet, a polycarbonate sheet or a polyimide sheet, For example, a ceramic sheet such as a metal foil can be cited. In the release liner, the contact surface contacting the sealing layer may be subjected to a release treatment such as fluorine treatment. The dimensions of the first release liner and the second release liner are appropriately set in accordance with the peeling condition, and the thickness is, for example, not less than 15 占 퐉, preferably not less than 25 占 퐉, Or less.

<Attachment jig>

The attachment jig is largely divided into two types and is configured to impart tension to the following two types of sealing sheets. In one embodiment, the attachment jig directly applies a tension to a single sheet of sealing sheet larger than a semiconductor substrate cut into a rectangle or square including a square.

In another embodiment, the attachment jig is provided with a tensile force applied to a release sheet of a predetermined shape cut out to a size equal to or smaller than the shape of the semiconductor substrate to a rectangular release liner larger than the semiconductor substrate, Thereby indirectly imparting tension to the sealing sheet. Hereinafter, the specific configuration of the attachment jig will be described in detail. In this embodiment, the sealing sheet piece refers to a state in which a release liner is provided on the sealing layer.

Fig. 3 is a perspective view of the attachment jig, and Fig. 4 is a front view of the attachment jig.

The attachment jig 70 includes a clamp plate 72 and a support plate 74 at opposite ends of the rectangular frame body 71. [ The clamp plate 72 is urged by the coil spring 73 in the direction of pressing the receiving plate 74. [ The support plate 74 has an inverted L shape and the tip end of the ball shaft 76 passing through the fixing block 75 fixed to the bottom surface of the frame body 71 is brought into contact with the lower portion of one side of the lower plate 74 have. The foot plate 74 is spring-biased in the outward direction by the coil spring 77 between the ball shaft 76 and the fixed block 75. [ A nut 78 is screwed on the other end side of the ball shaft 76. The projection distance of the ball shaft 76 is changed by rotating the nut 78 in the forward and reverse directions and the pressing force of the clamp plate 72 and the support plate 74 in the outward direction is adjustable.

&Lt; Sealing sheet attaching device >

Fig. 5 is a front view of the sealing sheet attaching apparatus, and Fig. 6 is a plan view of the sealing sheet attaching apparatus.

The sealing sheet attaching apparatus is provided with a jig mounting table 20, a first conveying mechanism 21, a first holding table 23, a second conveying mechanism 24, an attaching mechanism 25, and the like.

The jig mounting table 20 is configured to hold the attachment jig 70 horizontally.

The first transport mechanism 21 is provided with a suction pad 26 at the front end of a suction unit capable of horizontally moving and lifting up, down, left, and right. The first movable base 28 moves on the guide rail R1 along the frame 27 extending in the transverse direction of the apparatus main body. A guide rail R2 horizontally held in front of and behind the apparatus body is mounted on the lower portion of the first movable base 28. [ And a suction unit capable of ascending and descending along a vertical frame supported in a suspended manner on a second movable base (30) movable back and forth along the guide rail (R2).

Further, two cameras 34 are disposed below the conveying path of the first conveying mechanism 21 to the inside of the apparatus. The camera 34 picks up the position of the sealing sheet piece CT held by the attachment jig 70 and the outer shape of the attachment jig 70 and transmits the image data to the control unit.

The first holding table 23 is composed of a chuck table that is larger than the semiconductor substrate W. The first holding table 23 is configured to rotate about the vertical axis and perform alignment of the semiconductor substrate W. The first holding table 23 is configured to reciprocate along the guide rail 38 over the loading position of the semiconductor substrate W and the alignment position inside the apparatus.

Two cameras 39 are disposed above the alignment position to pick up the outer shape and division line (scribe line) of the semiconductor substrate W and transmit both image data to the control unit 100. [

The second conveying mechanism 24 is provided with a movable stand 42 for moving the apparatus on the guide rail R3 reaching the side of the sheet attaching mechanism 25 along the frame 41 extending in the transverse direction of the apparatus main body do. And a suction pad 44 is provided at the tip of the suction unit which can be moved up and down along the vertical frame 43 supported by the movable base 42 in a suspended manner. The second transport mechanism 24 is configured to reciprocate from the first holding table 23 to the second holding table 45. [

As shown in Figs. 7 and 15, the attachment mechanism 25 includes a second holding table 45, a pressure-reducing chamber 46, and the like.

The second holding table 45 is accommodated in the lower housing 46B of the upper housing pair 46A and the lower housing 46B constituting the decompression chamber 46.

The lower housing 46B is configured to reciprocate along the guide rail 48 between the receiving position of the front side semiconductor substrate W of the apparatus main body and the lower side of the upper housing 46A.

The elevating drive mechanism 50 is provided in the upper housing 46A constituting the decompression chamber 46. [ The elevating drive mechanism 50 includes a movable base 53 capable of elevating and descending along a rail 52 arranged in the longitudinal direction on the rear surface of the vertical wall 51, (54), and an arm (55) extending forward from the movable frame (54). An upper housing 46A is mounted on a support shaft 56 extending downward from the distal end of the arm 55. [

The movable base 53 is adapted to be vertically rotated by a motor 58 to move the screw shaft 57 up and down. Inside the upper housing 46A, a pressure plate 59 capable of elevating is incorporated. A heater 60 is embedded in the pressure plate 59.

<Sealing sheet attaching treatment>

Next, a series of operations for attaching the sealing sheet piece formed on the sealing sheet to the semiconductor substrate by the attaching device will be described in detail. 8, the half-cut sealing sheet piece CT in the shape of the semiconductor substrate W is attached to the sheet-like sheet T larger in size than the semiconductor substrate W in the thickness direction of the semiconductor substrate W. In this embodiment, (W) is described as an example.

First, the nut 78 of the attachment jig 70 is rotated so that a predetermined tension is given according to the size of the sealing sheet T, thereby adjusting the outward spring pressing force.

As shown in Fig. 9, the clamp plate 72 is opened against the spring force, and the sealing sheet T is loaded on the frame 71. Thereafter, as shown in Figs. 10 and 11, the clamp plate 72 is closed and both ends of the sealing sheet T are held. At this time, the sealing sheet T gripped at both ends is given an appropriate tension that does not cause loosening or sagging. That is, both ends of the sealing sheet T function as a supporting portion.

The second release liner S2 is peeled off from the back surface of the sealing sheet T and the sealing sheet piece CT and the attachment jig 70 is loaded on the jig mounting table 20. The frame 71 of the attachment jig 70 is sucked and held by the first transport mechanism 21 and transported to the upper side of the camera 34. [ When the first transporting mechanism 21 reaches the upper side of the camera 34, the outer shape of the first transporting mechanism 21 and the layout image of the sealing sheet piece CT are picked up. And the image data is transmitted to the control unit. When the imaging processing is completed, the first transport mechanism 21 moves onto the first holding table 23 while holding the attachment jig 70 by suction.

6, the first holding table 23 is provided with a plurality of semiconductor elements C formed on the surface of the semiconductor substrate W, and the semiconductor jig 70 is mounted on the jig mounting table 20, . The first holding table 23 holding and holding the semiconductor substrate W is moved to the alignment position and the surface is picked up by the camera 39. [ The captured image data is transmitted to the control unit.

When the imaging process is completed, the first holding stage 23 returns to the loading position. The contour of the layout of the sealing sheet piece CT in the outline of the attachment jig 70 obtained by the image analysis processing of the control unit is matched with the inner size of the division line width of the semiconductor element of the semiconductor substrate W, Alignment of the semiconductor substrate W is performed so as to cover the entire surface of the distribution region of the device. The first holding table 23 is rotated around the longitudinal axis to perform alignment. Here, the distribution region is a region DA including a line along which the substrate is to be divided at the outermost peripheral portion, as shown by the one-dot chain line in Fig. 6, in which a plurality of semiconductor elements to be separated into semiconductor substrates are disposed.

When the alignment of the semiconductor substrate W is completed, the semiconductor substrate W on the first holding table 23 and the attaching jig 70 are opposed to each other so that the attaching jig 70 is set at a predetermined height . At this time, as shown in Fig. 13, the positioning pins P erected on the first holding table 23 are engaged with the positioning holes 79 of the attachment jig 70, and aligned. In this state, a predetermined load is applied to the sealing sheet CT so as to be pressed against the semiconductor substrate W. At this point, the semiconductor wafer W is held in the attachment jig via the sealing sheet piece CT and the sealing sheet T. The first conveying mechanism 21 returns to the side of the jig mounting table 20 when the sealing sheet piece CT on the semiconductor substrate W is pressed.

As shown in Fig. 14, the second transport mechanism 24 sucks the attachment jig 70 and is transported and stacked on the second holding table 45. As shown in Fig. At this time, the second holding table 45 (45) is formed in the positioning hole 79 formed in the frame 71 of the attachment jig 70 so as to be the same as when the attachment jig 70 is set on the first holding table 23 The positioning pins P are engaged and aligned.

When the semiconductor substrate W is loaded on the second holding table 45, the second carrying mechanism 24 is moved upward and returned to the first holding table 23 side. The second holding table 45 moves to the lower side of the upper housing 46A together with the attachment jig 70 while sucking and holding the semiconductor substrate W. [

The lower housing 46B housing the second holding table 45 is moved to the lower side of the upper housing 46A as shown in Fig. 15 and the decompression chamber 46 . The inside of the decompression chamber 46 is depressurized and the sealing sheet T is tightly bonded to the semiconductor substrate W while heating with the pressing plate 59. [

When the main pressing is completed, the second holding table 45 is moved to the substrate transfer position and cooled for a predetermined time. Thereafter, as shown in Fig. 17, the unnecessary sealing layer M having a reduced adhesive force is attracted to the first release liner S1 by sucking up the attachment jig 70 by the second conveying mechanism 24, And is peeled off from the semiconductor substrate W. Thus, a series of processes is completed, and the same process is repeated.

The sealing sheet T and the sealing sheet piece CT are clamped by the attaching jig 70 as a supporting portion of the portion of the sealing sheet T which is evacuated from the outer shape of the semiconductor substrate W. [ It is possible to attach the sealing sheet piece CT to the semiconductor substrate W in a state in which an appropriate tensile force that does not cause stiction or warping is given. That is, since the sealing sheet T and the sealing sheet piece CT are not loosened at the time of adhering, it is possible to suppress the incorporation of air bubbles into the interface with the semiconductor substrate W or the occurrence of wrinkles. As a result, voids are not generated in the sealing layer (M) or the semiconductor substrate (W) is not damaged.

Further, since the sealing sheet piece CT is smaller in size than the semiconductor substrate W, handling at the time of adhering is easy. In other words, mixing of bubbles into the interface between the semiconductor substrate W and the sealing sheet piece CT can be suppressed more reliably.

Further, the present invention may be carried out in the following manner.

(1) In the above embodiment, the sealing sheet piece CT is not limited to the shape of the semiconductor substrate W. For example, as shown in Fig. 18, in a distribution area of a plurality of semiconductor elements C formed on a semiconductor substrate W, an area smaller than the area of the distribution area and surrounding a plurality of semiconductor elements C May be a plurality of sealing sheet pieces (CT) half-cut into small pieces in accordance with the dividing line. That is, the sealing sheet piece CT is cut half-cut from the single sealing sheet T by adjusting the size of the inner line of the division line width or less. Therefore, both ends of the sheet-like seal sheet T function as a support to be clamped.

According to this embodiment, as shown in Fig. 19, the semiconductor element C is sealed by the sealing layer M in the shape of a sealing sheet in a small distribution area unit divided on the semiconductor substrate W. Therefore, warping of the semiconductor substrate W due to thermal expansion or contraction during the curing treatment of the sealing layer (M) can be suppressed. That is, when one sealing sheet in the form of a semiconductor substrate is attached to the semiconductor substrate W, the shrinkage stress is concentrated toward the center of the semiconductor substrate W, so that the semiconductor substrate W is liable to be warped. However, in the case where the sealing sheet M is divided into a plurality of sealing sheet pieces CT and attached to the semiconductor substrate W, the sealing layers M are separately shrunk, so that the shrinking stress is dispersed. Therefore, warpage and breakage of the semiconductor substrate W can be suppressed.

The sealing sheet piece CT may be obtained by adhering a sealing sheet piece CT cut in a predetermined shape to a single sheet of the release liner cut larger than the semiconductor substrate W in a determined layout. In this case, a single release liner serves as a support. When the sealing sheet piece CT is adhered to the single sheet of the release liner, the release liner may be attached to the first release liner S1 or the first release liner S1 may be adhered to the seal layer M) to adhere the sealing layer (M) to the release liner.

When the sealing sheet piece CT is adhered to the release liner and used, the sealing sheet piece CT having different characteristics can be attached to the semiconductor substrate W. [ For example, a sealing sheet piece CT having different shrinkage ratios of the sealing layer M is used to divide the semiconductor substrate W into two areas, one of which is prone to warp and the other of which is hard to occur. For example, a sealing sheet piece CT on which a sealing layer M having a smaller shrinkage rate than the sealing layer M of the sealing sheet piece CT attached to the other portion is formed is attached to a portion where warpage is likely to occur. According to this method, the amount of deflection of the semiconductor substrate W can be adjusted.

(2) In each of the above embodiments, the clamp plate 71 and the support plate 74 are provided at four sides of the attachment jig 70, and the tension in the outward direction from all directions is uniformly applied to the seal sheet T or the release liner .

(3) In each of the above embodiments, the shape of the semiconductor substrate W is not limited to a circle. Therefore, the semiconductor substrate W may be a square including a square or a rectangle. In addition, the sealing sheet piece CT can be appropriately matched to the shape of the semiconductor substrate W.

INDUSTRIAL APPLICABILITY As described above, the present invention is suitable for efficiently attaching a sealing sheet without shifting over a plurality of semiconductor elements formed on a semiconductor substrate.

20: Jig stack
21: First conveying mechanism
23: first holding table
24: second conveying mechanism
25: Attachment Mechanism
45: second holding table
46: Decompression chamber
59: pressure plate
60: heater
70: Attachment jig
T: sealing sheet
C: Semiconductor device
CT: sealing sheet piece
M: sealing layer
S1, S2: peeling liner
W: semiconductor substrate

Claims (9)

A sealing sheet attaching method for attaching a sealing sheet having a sealing layer containing a resin composition to a release liner to a semiconductor substrate,
A tension imparting step of grasping an outer edge of a supporting portion for supporting a sealing sheet piece cut into a size equal to or smaller than the shape of the semiconductor substrate and imparting tension to the sealing sheet piece;
And a step of placing the sealing sheet piece and the semiconductor substrate facing each other and pressing the sealing sheet piece to adhere to the semiconductor substrate. The tension applying method according to claim 1, wherein the tension applying step is performed by attaching the sealing sheet having the half-cut sealing sheet piece formed in the shape of the semiconductor substrate to a sheet sheet larger than the semiconductor substrate,
Wherein the attaching step is to peel off the sealing layer in the form of a sealing sheet from the release liner of the sealing sheet mounted on the attachment jig and attach the sealing layer to the semiconductor substrate. The method of manufacturing a semiconductor device according to claim 1, wherein the tension imparting process is performed in such a manner that a distribution area of a plurality of semiconductor elements formed on a semiconductor substrate is smaller than an area of the distribution area, A single sheet of sealing sheet on which a plurality of sealing sheet pieces are formed is attached to the attachment jig to impart tension,
Wherein the attaching step is to peel off the sealing layer in the form of a sealing sheet from the release liner of the sealing sheet mounted on the attachment jig and attach the sealing layer to the semiconductor substrate. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the tension imparting process is a process of applying a tensile stress to a sealing sheet piece previously cut to a size equal to or smaller than the shape of the semiconductor substrate while covering a distribution area of a plurality of semiconductor elements formed on the semiconductor substrate, The release liner is adhered,
The release liner is attached to the attachment jig to impart tension,
Wherein the attaching step is such that the sealing sheet piece is peeled off from the release liner mounted on the attachment jig and attached to the semiconductor substrate. The method of manufacturing a semiconductor device according to claim 1, wherein the tension imparting process is performed in such a manner that a distribution area of a plurality of semiconductor elements formed on a semiconductor substrate is smaller than an area of the distribution area, A plurality of sealing sheet pieces are bonded to the release liner,
The release liner is attached to the attachment jig to impart tension,
Wherein the attaching step is such that the sealing sheet piece is peeled off from the release liner mounted on the attachment jig and attached to the semiconductor substrate. The method according to claim 1, characterized in that the attaching step is such that the attaching jig is superimposed on the holding table holding the semiconductor substrate and accommodated in the vacuum chamber, and the vacuum chamber is pressed against the vacuum chamber while the vacuum chamber is depressurized to be attached to the semiconductor substrate Of the sealing sheet. A sealing sheet attaching apparatus for attaching a sealing sheet on a release liner, on which a sealing layer containing a resin composition is formed, to a semiconductor substrate,
A holding table for holding the semiconductor substrate;
An attachment jig for gripping a support portion for supporting the half-cut sealing sheet in a shape of a sealing sheet having a size equal to or smaller than the shape of the semiconductor substrate from the sealing sheet and for applying a tension to the sealing sheet,
And a mounting mechanism for pressing the sealing sheet gripped by the attachment jig to adhere the sealing sheet-shaped sealing layer to the semiconductor substrate. A sealing sheet attaching apparatus for attaching a sealing sheet on a release liner, on which a sealing layer containing a resin composition is formed, to a semiconductor substrate,
A holding table for holding the semiconductor substrate;
An attachment jig for gripping a sheet peel-off liner supporting portion larger than the semiconductor substrate to which the sealing sheet piece cut to a size equal to or smaller than the shape of the semiconductor substrate is adhered, and to apply tension to the release liner,
And an attaching mechanism for attaching the sealing sheet piece to the semiconductor substrate by pressing the release liner gripped by the attaching jig. 9. The apparatus according to claim 7 or 8, further comprising a decompression chamber for accommodating the holding table in which the attachment jig is superimposed,
And an attaching mechanism to the decompression chamber.

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