TW201802461A - 藉由雷射都卜勒效應以檢測用於微電子或光學的晶圓之方法與系統 - Google Patents
藉由雷射都卜勒效應以檢測用於微電子或光學的晶圓之方法與系統 Download PDFInfo
- Publication number
- TW201802461A TW201802461A TW106110548A TW106110548A TW201802461A TW 201802461 A TW201802461 A TW 201802461A TW 106110548 A TW106110548 A TW 106110548A TW 106110548 A TW106110548 A TW 106110548A TW 201802461 A TW201802461 A TW 201802461A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- light
- volume
- measuring
- light source
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004377 microelectronic Methods 0.000 title claims description 7
- 235000012431 wafers Nutrition 0.000 title description 74
- 238000007689 inspection Methods 0.000 title description 6
- 230000000694 effects Effects 0.000 title description 2
- 230000007547 defect Effects 0.000 claims abstract description 50
- 238000005259 measurement Methods 0.000 claims abstract description 47
- 230000005693 optoelectronics Effects 0.000 claims abstract 2
- 230000003287 optical effect Effects 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 10
- 239000013307 optical fiber Substances 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 description 30
- 239000000758 substrate Substances 0.000 description 16
- 230000035945 sensitivity Effects 0.000 description 8
- 230000004907 flux Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000003595 mist Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 238000004599 local-density approximation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 229910017214 AsGa Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001446 dark-field microscopy Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000011896 sensitive detection Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??1652835 | 2016-03-31 | ||
| FR1652835A FR3049710B1 (fr) | 2016-03-31 | 2016-03-31 | Procede et systeme d'inspection par effet doppler laser de plaquettes pour la microelectronique ou l'optique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201802461A true TW201802461A (zh) | 2018-01-16 |
Family
ID=55863116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106110548A TW201802461A (zh) | 2016-03-31 | 2017-03-29 | 藉由雷射都卜勒效應以檢測用於微電子或光學的晶圓之方法與系統 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11092644B2 (enExample) |
| EP (1) | EP3436807B1 (enExample) |
| JP (1) | JP2019518197A (enExample) |
| KR (1) | KR20180123699A (enExample) |
| CN (1) | CN109073566B (enExample) |
| FR (1) | FR3049710B1 (enExample) |
| SG (1) | SG11201808303YA (enExample) |
| TW (1) | TW201802461A (enExample) |
| WO (1) | WO2017167573A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI718627B (zh) * | 2019-08-19 | 2021-02-11 | 崑山科技大學 | 以表面波頻率偵測材料表面瑕疵之方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7636401B2 (ja) * | 2019-09-20 | 2025-02-26 | ノードソン コーポレーション | レーザー干渉法システムおよび方法 |
| CN113503822B (zh) * | 2021-06-01 | 2023-08-18 | 南京中安半导体设备有限责任公司 | 晶圆厚度的测量方法及其测量装置 |
| EP4202423B1 (en) | 2021-12-23 | 2025-09-24 | Unity Semiconductor | A method and system for discriminating defects present on a frontside from defects present on a backside of a transparent substrate |
| EP4647746A1 (en) | 2024-05-07 | 2025-11-12 | Unity Semiconductor | Support for a dark field optical inspection system |
| CN120395592B (zh) * | 2025-07-03 | 2025-09-12 | 成都承奥科技有限公司 | 一种石墨环加工用高精度打磨检测设备及其使用方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02253166A (ja) * | 1989-03-27 | 1990-10-11 | Yuji Ikeda | 光ファイバレーザドップラ流速計の光学装置 |
| JP2711140B2 (ja) * | 1989-06-08 | 1998-02-10 | 三菱電機株式会社 | 徴細粒子測定装置 |
| US5343290A (en) * | 1992-06-11 | 1994-08-30 | International Business Machines Corporation | Surface particle detection using heterodyne interferometer |
| FR2699269B1 (fr) * | 1992-12-10 | 1995-01-13 | Merlin Gerin | Dispositif de mesure interferrométrique. |
| US5883714A (en) * | 1996-10-07 | 1999-03-16 | Phase Metrics | Method and apparatus for detecting defects on a disk using interferometric analysis on reflected light |
| JP3375876B2 (ja) * | 1998-02-06 | 2003-02-10 | 株式会社日立製作所 | 結晶欠陥計測方法及び結晶欠陥計測装置 |
| WO2002039099A2 (en) * | 2000-11-13 | 2002-05-16 | Koninklijke Philips Electronics N.V. | Measurement of surface defects |
| US7068363B2 (en) * | 2003-06-06 | 2006-06-27 | Kla-Tencor Technologies Corp. | Systems for inspection of patterned or unpatterned wafers and other specimen |
| US9909986B2 (en) * | 2003-10-15 | 2018-03-06 | Applied Research And Photonics, Inc. | Thickness determination and layer characterization using terahertz scanning reflectometry |
| US7420669B2 (en) * | 2004-07-01 | 2008-09-02 | Midwest Research Institute | Optic probe for semiconductor characterization |
| CN1740782B (zh) * | 2005-09-15 | 2010-04-28 | 中国科学院上海光学精密机械研究所 | 倾斜入射光散射式硅片表面缺陷检测仪 |
| FR2927175B1 (fr) * | 2008-02-05 | 2011-02-18 | Altatech Semiconductor | Dispositif d'inspection de plaquettes semi-conductrices |
| JP5520736B2 (ja) * | 2010-07-30 | 2014-06-11 | 株式会社日立ハイテクノロジーズ | 欠陥検査方法及び欠陥検査装置 |
| CN102937411B (zh) * | 2012-11-09 | 2015-01-21 | 清华大学 | 一种双频光栅干涉仪位移测量系统 |
| CN103322927B (zh) * | 2013-06-19 | 2016-04-20 | 清华大学 | 一种三自由度外差光栅干涉仪位移测量系统 |
| KR102609862B1 (ko) * | 2014-04-17 | 2023-12-04 | 펨토매트릭스, 인코포레이티드. | 웨이퍼 계측 기술들 |
| FR3026485B1 (fr) * | 2014-09-29 | 2016-09-23 | Altatech Semiconductor | Procede et systeme d'inspection de plaquettes pour l'electronique, l'optique ou l'optoelectronique |
| FR3026484B1 (fr) | 2014-09-29 | 2018-06-15 | Altatech Semiconductor | Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique |
-
2016
- 2016-03-31 FR FR1652835A patent/FR3049710B1/fr active Active
-
2017
- 2017-03-14 SG SG11201808303YA patent/SG11201808303YA/en unknown
- 2017-03-14 CN CN201780021710.4A patent/CN109073566B/zh active Active
- 2017-03-14 WO PCT/EP2017/055967 patent/WO2017167573A1/fr not_active Ceased
- 2017-03-14 KR KR1020187029770A patent/KR20180123699A/ko not_active Withdrawn
- 2017-03-14 US US16/087,056 patent/US11092644B2/en active Active
- 2017-03-14 EP EP17715055.4A patent/EP3436807B1/fr active Active
- 2017-03-14 JP JP2018551873A patent/JP2019518197A/ja active Pending
- 2017-03-29 TW TW106110548A patent/TW201802461A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI718627B (zh) * | 2019-08-19 | 2021-02-11 | 崑山科技大學 | 以表面波頻率偵測材料表面瑕疵之方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109073566B (zh) | 2022-07-19 |
| US11092644B2 (en) | 2021-08-17 |
| US20200271718A1 (en) | 2020-08-27 |
| WO2017167573A1 (fr) | 2017-10-05 |
| JP2019518197A (ja) | 2019-06-27 |
| CN109073566A (zh) | 2018-12-21 |
| KR20180123699A (ko) | 2018-11-19 |
| FR3049710A1 (fr) | 2017-10-06 |
| EP3436807B1 (fr) | 2020-12-02 |
| FR3049710B1 (fr) | 2020-06-19 |
| EP3436807A1 (fr) | 2019-02-06 |
| SG11201808303YA (en) | 2018-10-30 |
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