TW201737397A - Bonding apparatus, bonding system and bonding method wherein the adhering device includes a lamination room and an adhering device of an adhering room - Google Patents

Abstract

A novel adhering device that can laminate and attach substrates and supports with high precision is provided. The adhering device includes a lamination room (6) and an adhering device of an adhering room (7). The lamination room includes a position detection unit (21) and a position adjustment unit (22). The lamination room (6) laminates the substrate (42) and the support plate (41) that has undergone position adjustment.

Description

Adhesive device, adhesive system, and adhesive method

The present invention relates to an adhesive device, an adhesive system, and a pasting method.

With the increase in the functionality of mobile phones, digital AV devices, and IC cards, the semiconductor wafers (hereinafter referred to as wafers) are miniaturized and thinned, and the demand for high-concentration of wafers in the package is increasing. In order to achieve high integration of the wafer in the package, the thickness of the wafer must be reduced to a range of 25 to 150 μm.

However, the semiconductor wafer (hereinafter referred to as a wafer) which becomes a wafer pedestal is thinned by grinding, and the strength thereof is weak, and it is easy to cause cracks or warpage in the wafer. Further, since it is difficult to automatically transfer a wafer whose strength is weakened by thinning, it is necessary to carry out manpower transportation, and the processing thereof is complicated.

Therefore, a wafer support system has been developed in which a wafer to be ground is bonded to a plate made of glass or hard plastic called a support plate, thereby maintaining the strength of the wafer and preventing cracks from occurring. Wafer warpage. Since the wafer support system can maintain the strength of the wafer, The transfer of the thinned semiconductor wafer is automated.

The wafer and the support plate are bonded together using an adhesive tape, an adhesive containing a thermoplastic resin, or the like. After the wafer to which the support plate is pasted is thinned, the support plate is peeled off from the substrate before the wafer is cut.

Here, an adhesive device or the like which can improve the bonding precision of the support body and the substrate can be obtained.

Patent Document 1 discloses a bonding apparatus that is a bonding apparatus that bonds substrates to each other, and has a first holding portion that holds a first substrate on a lower surface, and is provided below the first holding portion. a second holding portion that holds the second substrate; a moving mechanism that moves the first holding portion or the second holding portion in a horizontal direction and a vertical direction; and the first holding portion is held in the first a first imaging unit that captures the second substrate of the holding unit, and a second imaging unit that images the first substrate held by the first holding unit, and at least the first imaging unit. The second camera unit or the second imaging unit is provided with an infrared camera.

Patent Document 2 discloses a bonding apparatus that is a bonding apparatus that bonds substrates to each other, and has a processing container for accommodating a first substrate and a second substrate, and a processing container that is joined to the processing container. The first holding portion of the first substrate is fixed to the processing container, and the first holding portion of the first substrate is provided below the first holding portion, and the second holding portion of the second substrate is held on the upper surface; a moving mechanism that moves the second holding portion in the horizontal direction and the vertical direction; the first holding portion is provided to the second base held by the second holding portion A first imaging unit that images the surface of the plate; and a second imaging unit that is provided in the second holding unit and that images the surface of the first substrate held by the first holding unit.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication No. 2015-18920 (published on January 29, 2015)

[Patent Document 2] Japanese Laid-Open Patent Publication No. 2015-18919 (published on January 29, 2015)

However, in the pasting apparatus described in the patent documents 1 and 2, each of the substrate and the support is imaged by the two imaging units, and the position of the substrate and the support is specified and adhered. Therefore, the alignment accuracy of the substrate and the support is lowered due to the difference in position specific accuracy of each imaging unit.

Further, in the overlapping portion of the pasting device which adheres the substrate to the support, a novel pasting device which can superimpose the substrate and the support with high precision is used for continuously manufacturing the laminated body with high precision.

The present invention has been made in view of the above problems, and an object thereof is to provide a novel one in which a substrate and a support can be superimposed and adhered with high precision. Adhesive devices and their associated technology.

In order to solve the above problems, the pasting device of the present invention includes: a stacking portion that overlaps a substrate and a support that supports the substrate; and an adhesive portion of the substrate and the support that are pasted and adhered to each other. The apparatus is characterized in that the overlapping portion includes a plurality of position detecting portions that detect positions of outer peripheral ends of the substrate and the support, and determine the respective substrates and the support. And a position adjustment unit that adjusts a position in a planar direction of each of the substrate and the support according to a position of the center point, and superimposes the position-adjusted substrate on the support.

Further, the pasting method of the present invention includes: a superimposing process in which a substrate and a support supporting the substrate are stacked in a stacked portion; and the stacked substrate and the support are in the adhesive portion The pasting method includes: a position detecting stage for detecting a position of an outer peripheral end portion of each of the substrate and the support body, and determining the substrate and the substrate a center point in each of the support bodies; a position adjustment phase that adjusts a position in a planar direction of each of the substrate and the support according to a position of the obtained center point; and a superposition stage The substrate in the adjusted position is superposed on the support.

According to the present invention, it is possible to provide a novel adhesive device capable of superimposing and adhering a substrate and a support with high precision and a related art thereof.

1‧‧‧adhesive system

2‧‧‧Adhesive device

3‧‧‧Holding room

4‧‧‧First external transfer unit (transport unit)

5‧‧‧First external transport section walking road

6‧‧‧Positioning room (stacking part)

7‧‧‧Adhesive room (adhesive part)

8‧‧‧ gate

9‧‧‧ Receiving window

10‧‧‧Internal Transport Department

11‧‧‧Internal transfer arm

12‧‧‧ Arm rotation axis

17a‧‧‧First camera

17b‧‧‧second camera

18a, 18b‧‧‧ area

19‧‧‧ Location Specific Department

21‧‧‧Location Detection Department

21a‧‧‧Laser illumination unit (position detection unit)

21'a‧‧‧Back screen (position detection department)

21b‧‧‧Lighting Department (Position Detection Department)

21'b‧‧‧CCD camera (position detection department)

21c‧‧‧Window (Location Detection Department)

22‧‧‧ Position adjustment unit (position adjustment unit)

22a‧‧‧Moving stage (position adjustment unit)

23‧‧‧ Spacer (holding section)

24‧‧‧Moving station (heating department)

24a‧‧‧Loading surface

25‧‧‧First Support Pin (Temporary Fixing Department)

26‧‧‧Pushing pin (temporary fixing)

26a‧‧‧Spring (temporary restraint)

26b‧‧‧Support shaft (temporary restraint)

31‧‧‧second support pin

32, 33‧‧‧ Pressurized plate

40‧‧‧Layered body

41‧‧‧support plate

41a‧‧‧cutting section

42‧‧‧Substrate

50‧‧‧FOUP opener

51‧‧‧ baking sheet

52‧‧‧Rotator

53‧‧‧pass line

54‧‧‧Second External Transport Department

55‧‧‧Second external transport section walking path

d ₃ ‧‧‧Overlap wide

d ₄ ‧‧‧width

O‧‧‧ Center Point

B‧‧‧Standby position of the internal transfer arm 11

C‧‧‧Adhesive Department Recruitment Location

Fig. 1 is a view showing the outline of an adhering device 2 according to an embodiment of the present invention.

Fig. 2 is a view showing the outline of the pasting system 1 including the sticking device 2 according to the embodiment of the present invention.

Fig. 3 is a view showing a schematic configuration of a holding chamber 3 in the pasting system 1 according to the embodiment of the present invention.

Fig. 4 is a view for explaining the arrangement of the laser irradiation portion 21a and the position adjusting portion 22 with respect to the support plate 41 used in the pasting system 1 according to the embodiment of the present invention.

Fig. 5 is a view for explaining the arrangement of the spacers 23 with respect to the support plate 41 used in the pasting system 1 in the embodiment of the present invention.

Fig. 6 is a view showing the internal configuration of the sticking device 2 including the internal transport unit 10 according to the embodiment of the present invention as seen from above.

Fig. 7 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 8 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 9 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 10 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 11 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 12 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 13 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 14 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 15 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 16 is a view for explaining the operation of the stacking chamber 6 in the pasting device 2 according to the embodiment of the present invention.

Fig. 17 is a view for explaining the operation of the pasting chamber 7 in the pasting device 2 according to the embodiment of the present invention.

Fig. 18 is a view for explaining the operation of the pasting chamber 7 in the pasting device 2 according to the embodiment of the present invention.

<Adhesive device>

The adhesive device of the present invention is configured to: provide a substrate, and a support supporting the substrate, and laminate the substrate on the substrate and the support a superimposed portion in which at least one of the layers of the body is superimposed; and the pasting device in which the substrate and the bonding portion of the support are pasted and adhered, the overlapping portion is provided with: a plurality of position detection a portion that detects a position of an outer peripheral end portion of each of the substrate and the support, and obtains a center point of each of the substrate and the support; and a position adjustment unit that is based on the position of the center point And adjusting a position in a planar direction of each of the substrate and the support, and superposing the position-adjusted substrate on the support.

[layered body]

First, a laminated body to be adhered by an adhesive device will be described. The laminated system is formed by laminating a substrate and a support supporting the substrate through an adhesive layer laminated on at least one of the substrate and the support. However, in the present embodiment, the subsequent layer is formed on the substrate side.

(substrate)

The substrate is supplied in a state of being thinned, conveyed, and mounted while being supported (adhered) on the support plate. The substrate is not limited to the wafer substrate, and may be any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate that is supported by a support plate.

(support plate)

The support plate (support) is a support for the support substrate, and is adhered to the substrate through the adhesive layer. Therefore, the support plate is thinned and conveyed on the substrate, In the process of manufacturing, etc., if it has the strength required to prevent damage or deformation of the substrate, it is preferable to be lighter. From the above viewpoints, the support plate is preferably made of glass, iridium, acrylic resin, ceramics or the like.

(following layer)

Next, the layer is formed by laminating the substrate and the support sheet, and is formed by applying an adhesive to at least one of the substrate and the support. The adhesive constituting the adhesive layer may contain, for example, a thermoplastic resin having improved thermal fluidity by heating as a bonding material. Examples of the thermoplastic resin include an acrylic resin, a styrene resin, a maleimide resin, a hydrocarbon resin, a thermoplastic elastomer, and a polyfluorene-based resin.

The method of forming the layer, that is, the method of applying the adhesive to the substrate or the support sheet, or the method of forming the adhesive tape by applying the adhesive to the substrate is not particularly limited, and the method of applying the adhesive is For the series, for example, a coating method such as a spin coating method, a dipping method, a hob method, a spray method, or a slit nozzle method.

The thickness of the layer may be appropriately set in accordance with the type of the substrate and the support plate to be pasted, the treatment of the substrate to be adhered, and the like, preferably in the range of 10 to 150 μm, and in the range of 15 to 100 μm. The inside is better.

However, when the support plate is peeled off from the substrate, the adhesive layer may be supplied to the adhesive layer to dissolve the adhesive layer. Thereby, the substrate can be separated from the support plate. In this case, if the support plate is formed with a through hole penetrating in the thickness direction, the through layer can be easily passed through the through hole. The agent is therefore ideal.

Further, another layer other than the adhesive layer may be separately formed between the substrate and the support plate as long as the adhesion between the two is not hindered. For example, a separation layer which is deteriorated by irradiation with light may be formed between the support plate and the adhesive layer. By forming the separation layer, the substrate is irradiated with light after the substrate is thinned, transported, or assembled, whereby the substrate and the support plate can be easily separated.

<Adhesive system 1>

Fig. 1 is a schematic view showing an adhesive device 2 according to an embodiment of the present invention, and Fig. 2 is a view showing an outline of an adhesive system 1 including the adhesive device 2.

The sticking device 2 according to the embodiment of the present invention shown in Fig. 1 includes a stacking chamber (overlap portion) 6 and an adhesive chamber (adhesive portion) 7, as shown in Fig. 2, in one embodiment, It can be incorporated into the pasting system 1 of the bonding substrate 42 and the support plate 41.

Moreover, as shown in FIG. 2, the pasting system 1 is comprised with the structure of the holding chamber 3, the 1st external conveyance part 4, and the 1st external conveyance part travel path 5 except the adhesive apparatus 2. The pasting device 2 is configured to include a stacking chamber 6 that can be decompressed, and an adhesive chamber 7 that can be decompressed.

In Fig. 2, the FOUP opener 50 provided in the pasting system 1 , the rotator 52 on which the adhesive layer 52 is applied to the substrate 42 , the baking sheet 51 which hardens the applied adhesive layer, and the second external transfer are additionally shown. The portion 54, the second external transfer portion traveling path 55, and the passage line 53 for delivering the substrate 42 to the first external transfer portion 4.

[holding room 3]

FIG. 3 is a view showing a schematic configuration of the holding chamber 3. As shown in FIG. 3, the holding chamber 3 is provided with an imaging unit (first imaging means, second imaging means) 17a, 17b, and a position specifying portion 19, and supports the support plate 41 or the substrate 42 before being stacked. In Fig. 3, the case where the support plate 41 is held is shown).

The imaging units 17a and 17b image the regions 18a and 18b including the mutually different end faces (the first end face and the second end face) of the support plate 41 held by the holding chamber 3, respectively. The regions 18a, 18b are preferably set, for example, on the approximately diagonal of the support plate 41 held in the holding chamber 3. The imaging units 17a and 17b may be, for example, a CCD camera. In FIG. 3, the upper surface of the support plate 41 has a circular shape, and a notch 41a for specifying the direction of the support plate 41 is provided in the region 18b of the support plate 41 imaged by the imaging unit 17b. As described above, in any of the imaging units 17a and 17b, the position of the notch portion 41a in the support plate 41 is specified.

The position specifying unit 19 detects the direction of the center point O of the support plate 41 held by the holding chamber 3 and the specific notch portion 41a based on the plurality of images captured by the imaging units 17a and 17b. Similarly to the support plate 41, the substrate 42 detects the position of the center point and specifies the position of the notch portion. The position specifying unit 19 calculates a virtual circle based on the image of the end surface of the circular plate, and detects the center point O. According to the detection technique of the center point O of the image of the end face, it is not necessary to use a well-known image processing. set.

In the pasting system 1 of the present embodiment, the position specifying unit 19 in the holding chamber 3 detects the center point of the substrate 42 and the support plate 41 by the two imaging units 17a and 17b, but for example, it is maintained. The method of the specific support plate 41 and the center point of the substrate 42 performed in the chamber 3 can also be performed by the same configuration as the position adjustment portion in the overlapping portion to be described later.

[First external transfer unit 4]

The first external transfer unit 4 has a configuration in which the support plate 41 , the substrate 42 , and the laminated body 40 are transported, and is configured such that the support plate 41 , the substrate 42 , and the laminated body 40 can be accommodated between the bonding device 2 . The first external transfer unit 4 moves on the first external transfer unit travel path 5. The first external transfer unit 4 and the first external transfer unit travel path 5 that function as described above can be prepared by a conventionally known technique.

In the first external transfer unit 4, each of the support plate 41 and the substrate 42 at the position where the center point and the notch portion are specified in the holding chamber 3 are placed in the four groups shown in FIG. 4(a). The position adjustment unit 22 is provided.

[stacking chamber 6]

As shown in FIG. 1 , the stacking chamber 6 provided in the pasting device 2 includes a position detecting unit 21, a position adjusting unit 22, a spacer (holding unit) 23, a stage unit (heating unit) 24, and a first Support pin (temporary fixing) 25. A pressing pin (temporary fixing portion) 26 and an internal conveying portion 10. Further, the stacking chamber 6 is provided with a pressure reducing portion (not shown), and after the support plate 41 and the substrate 42 are carried into the stacking chamber 6, the inside of the stacking chamber 6 can be placed in a reduced-pressure atmosphere. .

[Position detection unit 21]

The position detecting unit 21 shown in FIG. 1 is specifically placed on the set of position adjusting units 22 based on the position coordinates of the outer peripheral end portion of the support plate 41 specified by the laser irradiation unit 21a and the light receiving unit 21b. The offset of the center point O of the support plate 41. The position detecting unit 21 is provided outside the stacking chamber 6.

More specifically, as shown in FIG. 4( a ), the inside of the stacking chamber 6 includes a pair of laser irradiation units that face each other with a center point on which the support plate 41 and the substrate 42 are to be placed. 21a. In other words, the position detecting unit 21 sets the center point of the four laser irradiation units 21a as the center point of the reference in the superposition chamber 6.

Further, as shown in FIG. 1, the light receiving portion 21b is disposed on the lower side of the laser irradiation portion 21a in the Z direction. When the support plate 41 is placed on the one set of position adjustment unit 22, the outer peripheral end portion of the support plate 41 is disposed between the laser irradiation unit 21a and the light receiving unit 21b (Fig. 4(a)). Therefore, the light irradiated by the laser irradiation unit 21a toward the light receiving unit 21b is irradiated to the outer peripheral end portion of the support plate 41 on the X-Y plane in the Z direction, that is, in a direction perpendicular to the planar direction of the support plate 41.

Thereby, the branch that is placed on the position adjusting portion 22 is specified. The position coordinates of the outer peripheral end portion of the carrier 41 can detect the offset of the center point O of the support plate 41 placed on the set of position adjusting portions 22 from the center point of the reference. Here, the position detecting unit 21 can specify the offset of each center point based on the position coordinates obtained by irradiating the light perpendicularly to the plane direction of the support plate, so that the center of the support plate 41 can be specified with high precision. Point O, the offset from the center point that becomes the reference. Further, as described above, by the positional coordinates of the outer peripheral end portion of the specific support plate 41, it is possible to detect not only the positional deviation of the support plate 41 which may be generated by being transported by the first outer transfer portion 4, but also the detection The positional deviation due to the unevenness of the diameter of about 0.05 μm to 0.5 μm due to the individual difference of the support plates 41 is measured.

Further, as shown in FIG. 4(a), one of the four laser irradiation portions 21a irradiates light to the notch portion 41a of the support plate 41. Thereby, the positional deviation of the notch portion 41a is also detected. In the same manner, in the substrate 42, the positional deviation of the center point and the positional deviation of the notch portion are detected.

The light-receiving portion 21b transmits the window portion 21c that can externally confirm the inside of the superposed chamber 6, and detects the light of the laser irradiation portion 21a. Here, the window glass plate disposed in the window portion 21c is joined to the stacking chamber 6 so that the inside of the stacking chamber 6 is sealed. Thereby, the inside of the superposition chamber 6 can be placed in a reduced pressure environment while receiving light by the light receiving portion 21b provided outside the superposed chamber 6.

(Position detection unit of a modification)

The position detecting unit 21 included in the pasting device 2 is not limited to being provided A laser sensor having a light irradiation unit and a light receiving unit. As shown in FIG. 4(b), in the pasting device of the modification, the position detecting unit 21 may be, for example, at least three CCD (Charge Coupled Device) cameras 21'b, and the like. The back screen 21'a corresponding to the CCD camera 21'b is configured to specify the center point of the one set of position adjusting portions 22 and the position coordinates of the outer peripheral end portions of the support plate 41.

In addition, the CCD camera 21'b photographs an image of the outer peripheral end portion of the support plate 41 with the back screen 21'a disposed on the upper side in the Z direction as the background from the outside of the window portion 21c shown in FIG. Here, as shown in FIG. 4(b), one of the CCD cameras 21'b captures an image of the notch portion 41a.

The position detecting unit 21 specifies the position coordinates of the outer peripheral end portion of the support plate 41 based on the plurality of images captured by the three CCD cameras 21'b. In addition, the center point O is detected. The position detecting unit 21 specifies the position coordinates of the outer peripheral end portion based on the image of the outer peripheral end portion of the support plate 41, and detects the position of the center point O of the support plate 41 from the center point of the reference. Further, it is possible to detect the displacement of the position of the notch portion 41a when placed on the position adjusting portion 22 and the predetermined position at which the notch portion 41a should be disposed.

[Position adjustment unit 22]

The position adjusting unit 22 supports the support plate 41 and the substrate 42 to be aligned, and adjusts the positions of the support plate 41 and the substrate 42 by moving the movable stage 22a.

The movable stage 22a is movable in parallel in the X-Y plane, whereby one set of position adjustment sections 22 is moved in parallel with the plane directions of the support plates 41 and 42 (FIGS. 8 and 9). As a result, the center point O of the support plate 41 is moved to the center point of the four laser irradiation units 21a serving as the reference by the one position adjustment unit 22 based on the positional deviation detected by the position detecting unit 21. .

Further, the movable stage 22a is rotatable, and the support plate 41 placed on the position adjusting portion 22 is rotated about the center point O. Thereby, the position of the notch portion 41a of the support plate 41 is adjusted, and the direction of the support plate 41 is adjusted.

The position and direction of the center point of the substrate 42 are also adjusted in the same manner as the operation of adjusting the offset of the position of the center point O of the support plate 41.

Further, the movable stage 22a moves the one set of position adjusting sections 22 in the Z direction or more. Thereby, the one set of position adjustment sections 22 raises the support plate 41 (the substrate 42 when the alignment of the substrate 42 is first performed) to the position where the center point is adjusted, and raises the position which can be supported by the spacer 23 ( Figure 10). In other words, the one set of position adjusting sections 22 maintains the state in which the support plate 41 is aligned in the X-Y plane, moves in the Z direction, and directly feeds the support plate 41 to the spacer 23.

[spacer 23]

The spacer 23 is a member that holds the aligned support plate 41 (when the substrate 42 is aligned first, the substrate 42) so that the horizontal position is maintained without being changed. Fig. 5 is a view of the spacer 23 viewed from the upper side. The spacer 23 securely holds the support plate 41 by supporting a part of the peripheral edge portion of the support plate 41 from the lower side thereof. The spacer 23 is movable in the XY direction, that is, in the horizontal direction. When the support plate 41 is placed on the stage portion 24 and transported to the upper portion of the spacer 23, the spacer 23 is moved to a position where it does not overlap the support plate 41 at all. In the present specification, at this state, the spacer 23 is referred to as being "extracted position". After the support plate 41 is carried over above the spacer 23, it is returned to a position where the spacer 23 and the support plate 41 are overlapped so that the support plate 41 can be supported by the spacer 23. In the present specification, at this state, the spacer 23 is referred to as the "insertion position". Fig. 5 shows a state in which the spacer 23 is located at the "insertion position". The overlapping width d ₃ of each member of the spacer 23 supporting the support plate 41 and the support plate 41 when the spacer 23 is at the insertion position may be about 1 to 5 mm from the periphery to the inner side of the support plate 41 without limitation. More suitable for 5mm. Further, the size of the spacer 23 may be, for example, a lateral width d ₄ of 5 mm, but is not limited thereto.

The material of the spacer 23 is not particularly limited. For example, stainless steel (SUS) may be chamfered, and a resin coated with polytetrafluoroethylene or the like may be used.

[stage portion 24]

The stage unit (heating unit) 24 mounts the support plate 41 or the substrate 42 or the laminated body 40 which is superposed on each other.

The mounting surface of the support plate 41 and the like in the stage portion 24 is preferably It is formed by a resin such as polytetrafluoroethylene or PEEK in such a manner as not to damage the substrate. Further, it is preferable to form a groove on the mounting surface. When the groove is formed in the mounting surface, when the inside of the superposed chamber 6 is decompressed, it is possible to prevent gas from remaining between the support plate 41, the substrate 42 and the laminated body 40, and the mounting surface 24a.

Further, a heater (not shown) is built in the stage portion 24, and the contact surface between the substrate 42 and the stage portion 24 is heated. Thereby, the adhesive layer applied to the substrate 42 is made to flow.

The temperature of the mounting surface 24a is preferably heated to a temperature of at least room temperature or higher by, for example, low temperature adhesion (stickiness) of a thermoplastic resin as a bonding material of the adhesive layer to be heated to the glass. The temperature above the transfer point (Tg) is more preferable. By heating the adhesive layer to a temperature above the glass transition point of the thermoplastic resin, the thermal mobility of the layer is improved and the deformation is easy. Although it depends on the adhesive layer, that is, the material of the thermoplastic resin as the adhesive material, the temperature of the contact surface is preferably 23 to 220 ° C, and the heating time, that is, the pressing time is preferably 3 to 300 seconds. It is preferably 5 to 180 seconds.

In the embodiment, the stage portion 24 may be supported by the mounting surface 24a of the stage portion 24 without being in contact with the mounting surface 24a of the stage portion 24, and the substrate 42 having the adhesive layer formed thereon may be formed, or The support plate 41 is heated.

[temporary fixation]

The temporary fixing portion is provided by the first support pin 25 and the pressing pin 26 The support plate 41 and the substrate 42 are pressed to perform temporary fixation.

(first support pin 25)

The first support pin 25 is supported by the bottom surface of the support plate 41 and the substrate 42 and then carried into the stacking chamber 6. The first support pin 25 is arranged on the circle centered on the center point of the four laser irradiation units 21a as the reference, and at least three are arranged at equal intervals. Further, the material of the first support pin 25 is not particularly limited, and may be formed of aluminum or the like having excellent thermal conductivity, but is not limited thereto, and stainless steel or the like may be used.

(press pin 26)

The pressing pin 26 is first conveyed to the support plate 41 in the stacking chamber 6 or the substrate 42 is pressed toward the lower side in the Z direction. Similarly to the first support pin 25, the pressing pin 26 is attached to the position detecting portion 21 as At least three of the reference points are arranged on a circle centered on the center point of the four laser irradiation units 21a at equal intervals. Further, the front end portion of the pressing pin 26 is disposed to face the front end portion of each of the first support pins 25. As described above, by arranging the first support pin 25 and the pressing pin 26, the region of the support plate 41 after the adjusted position and the partial region of the substrate 42 after the adjusted position can be overlapped and sandwiched. Press. Therefore, the pressing force can be equally applied to the center point of the position-adjusted support plate 41 and the substrate 42 as a center. Therefore, it is possible to prevent the support plate 41 from being displaced from the substrate 42 and to smoothly perform the temporary fixing.

Wherein, the pressing pin 26 is abutted against the support plate 41 (or At the time of the upper surface of the substrate 42), it is biased to the lower side in the Z direction by a spring (elastic member) 26a. Further, the plurality of pressing pins 26 can be simultaneously moved up and down in the Z direction by the support shaft 26b. Here, since the pressing pin 26 does not move downward, the pressing pin 26 is located at the "standby position" in the present position at a position that is not in contact with the support plate 41 held by the spacer 23. On the other hand, the pressing pin 26 is moved downward, and as a result, the position of the support plate 41 held by the spacer 23 can be held by the spring 26a. In the present specification, the pressing pin 26 is referred to as the "pressing position".

[Internal transport unit 10]

The stacking chamber 6 is provided with the first support pin 25 and the press pin 26, whereby the temporarily supported support plate 41 and the substrate 42 are disposed between the adhesive chamber 7 and the laminate 40. Internal transfer unit (10 in Fig. 6).

The stacking chamber 6 and the pasting chamber 7 may be formed to have a structure in which the inside of one processing chamber is partitioned into the wall portions of the two processing chambers. Further, the overlapping chamber 6 and the adhesive chamber 7 may have a configuration in which the overlapping chamber 6 and the adhesive chamber 7 are in contact with each other without a gap on the respective side faces. At the boundary between the stacking chamber 6 and the pasting chamber 7, a gate 8 for receiving the laminated body 40 between the stacking chamber 6 and the pasting chamber 7 is provided. The gate 8 is controlled to open and close by means of a shutter. Further, in the stacking chamber 6, an openable and closable receiving window 9 for receiving the support plate 41, the substrate 42 and the laminated body 40 between the bonding device 2 and the first external transfer portion 4 is provided. The overlapping chamber 6 and the adhesive chamber 7 are respectively provided with well-known The decompression means (not shown) can independently control the state of the internal pressure of each chamber.

Since the adhesive chamber 7 has a decompressible configuration, the substrate 42 and the support plate 41 can be bonded to each other through the adhesive layer in a reduced-pressure atmosphere. The substrate 42 is pressure-bonded to the adhesive layer in a reduced-pressure atmosphere, whereby the adhesive layer can be prevented from entering the recess in a state where the air is not present in the recessed pattern of the surface of the substrate 42, so that it can be more reliably prevented. Air bubbles then form between the layer and the substrate 42.

The gate 8 is in a state in which the shutter is opened, so that the laminated body 40 that has been aligned can be moved from the stacking chamber 6 to the pasting chamber 7, and further, the laminated body 40 after joining can be made of the pasting chamber. 7 is formed by moving to the stacking chamber 6. Any one of the stacking chamber 6 and the pasting chamber 7 is also opened in a decompressed state, whereby the laminated body 40 before joining can be moved from the stacking chamber 6 to the pasting chamber 7 under reduced pressure. structure.

Fig. 6 is a configuration diagram showing the internal structure of the sticking device 2 including the internal transport unit 10 as viewed from above. The internal conveying unit 10 is not particularly limited as long as it can move the laminated body 40 between the overlapping chamber 6 and the bonding chamber 7. In the present embodiment, as shown in FIG. 6, the internal conveying unit 10 is constituted by the internal transfer arm 11 and the arm rotation shaft 12. The internal transfer unit 10 is formed by a mechanism that moves the laminated body 40 by the rotation of the arm rotating shaft 12 that supports the internal transfer arm 11 of the laminated body 40. As will be described in detail later, in the present embodiment, the two internal conveying portions 10 in which the rotating rotary shafts are common are provided. The arm rotation shaft 12 is provided on the side of the stacking chamber 6, but may be provided on the side of the adhesion chamber 7. Can be shortened in the stacking chamber 6 and the first external moving From the viewpoint of the stroke of the conveyance between the feeding portions 4, it is preferable that the arm rotating shaft 12 is formed on the side close to the side on which the receiving window 9 is formed. In FIG. 6, the two-point chain line indicated by "B" indicates the standby position of the internal transfer arm 11, and the two-point chain line indicated by "C" indicates the position of the internal transfer arm 11 at the pasting chamber 7 ( Adhesive part of the location).

The rotational speed of the internal transfer arm 11 sets the speed depending on the situation. Therefore, when the internal transfer arm 11 holds the laminated body 40, the internal transfer arm 11 can be rotated at a low speed, and when the laminated body 40 is not held, the internal transfer arm 11 can be rotated at a high speed. Further, the acceleration and deceleration can be controlled such that the start and stop of the rotation of the internal transfer arm 11 become smooth.

As shown in Fig. 6, the shutter 8 is formed such that the inner transfer arm 11 that rotates in the state in which the shutter is opened is transported to the wide portion of the adhesive portion receiving position C through the shutter 8. In the opening and closing of the shutter 8, a conventionally known means can be used, and for example, a gate valve structure can be applied.

[Adhesive chamber 7]

The adhesive chamber (adhesive portion) 7 is formed by laminating the support plate 41 and the substrate 42 which are laminated in the stacking chamber to form the laminated body 40. The adhesive chamber 7 is provided with a second support pin 31 and pressure plates 32 and 33.

The second support pin 31 receives the support plate 41 and the substrate 42 which are superposed on each other in the stacking chamber 6 by the internal transfer unit 10. Similarly to the first support pin 25, the second support pin 31 is disposed at equal intervals on a circle centered on the center points of the support plate 41 and the substrate 42.

In the pressure plates 32 and 33 provided in the adhesive chamber 7 A heater (not shown) is provided. Thereby, the support plate 41 and the substrate 42 can be sandwiched between the support plate 41 supported by the second support pin 31 and the substrate 42 and the pressure plates 32 and 33, and pressed.

[Operation of Adhesive Device 2]

Next, a schematic operation of attaching the support plate 41 and the substrate 42 in the pasting device 2 (the overlap chamber 6 and the pasting chamber 7) of the present embodiment will be described.

7 to 18 are views showing the operation of the pasting device 2 in the present embodiment by the state of the inside of the stacking chamber 6 and the pasting chamber 7. For convenience of explanation, the members for supporting and controlling each of the laser irradiation portion 21a, the spacer 23, and the pressing pin 26 are omitted.

(1. The support plate 41 is moved into the stacking chamber 6)

In the initial stage, the center point of the position adjusting portion 22 in the stacking chamber 6 before being carried into the support plate 41 is arranged to coincide with the center point of the four laser irradiation portions 21a in the XY plane (refer to FIG. 7). . In this state, the first external transfer unit 4 is used to pass through the receiving window 9 of the stacking chamber 6, and the support plate 41 is carried. Here, the support plate 41 is placed on the set of position adjustment units 22 by the first external transfer unit 4 with respect to the direction of the center point O and the notch portion 41a which are specified in the holding chamber 3, with reference to the direction of the center point O and the notch portion 41a. s position. In this stage, it is preferable that the spacer 23 is formed as the extraction position first, and the pressing pin 26 is first formed as the standby position.

(2. Position detection of the support plate 41)

Then, the four laser irradiation units 21a irradiate light to the outer peripheral end portion of the support plate 41 placed on the position adjustment unit 22, thereby detecting the center point of the four laser irradiation portions 21a and the support plate. The offset of the center point O of 41 (refer to Fig. 8). Further, the direction of the notch portion 41a of the support plate 41 is detected by one of the four laser irradiation portions 21a.

(3. Position adjustment of the support plate 41)

Then, the movable stage 22a is moved in parallel with the XY plane, and is placed at the center point O of the support plate 41 of the position adjustment unit 22 and the center point of the four laser irradiation units 21a (the superimposed reference The center point) adjusts the position in an overlapping manner (refer to Figure 9). Here, by rotating the movable stage 22a, the notch portion 41a of the support plate 41 is adjusted so as to face the predetermined direction.

(4. Receiving the support plate 41 of the spacer 23)

Next, the movable stage 22a moves the support plate 41 placed on the position adjustment unit 22 to a position above the spacer 23 in the Z direction and does not contact the pressing pin 26. Next, after the spacer 23 is moved to the insertion position, the movable stage 22a is moved to the side in the Z direction more than the spacer 23. Thereby, the position in the horizontal direction of the end support plate 41 is not changed by the spacer 23 (see FIG. 10). However, in the stage before the support plate 41 is moved in the Z direction, the respective portions of the laser irradiation portion 21a are moved to a position where they are not in contact with the support plate 41.

(5. The substrate 42 is moved into the stacking chamber 6)

Next, similarly to the case of the support plate 41, in this state, the first external transfer unit 4 is used, and the substrate 42 is carried through the receiving window 9 of the overlap chamber 6. Here, the substrate 42 is placed at a predetermined position on the one set of position adjustment portions 22 by the first external transfer unit 4 with respect to the direction of the center point and the notch portion which are specified in the holding chamber 3 (refer to the figure). 11). Thereafter, after the receiving window 9 is closed, the decompression of the overlapping chamber 6 is started. The decompression of the superposed chamber 6 may be performed in such a manner that the decompressed state of the superposed chamber 6 at the time when the temporary fixation is completed and the decompressed state of the adhesive chamber 7 are formed in substantially the same state. More suitable for 10Pa or less.

(6. Heating of the substrate 42)

Then, by moving the one set of position adjusting sections 22 toward the lower side in the Z direction, the substrate 42 is placed on the stage portion 24 and heated. Thereby, the adhesive layer formed on the upper surface of the substrate 42 is made to flow (see FIG. 12).

(7. Position detection of the substrate 42)

Then, in the same manner as in the case of the support plate 41, the four laser irradiation portions 21a irradiate light to the outer peripheral end portion of the substrate 42 placed on the position adjusting portion 22, thereby detecting four laser irradiation portions. The center point of 21a is offset from the center point of the substrate 42 (see Fig. 13). Further, the direction of the notch portion of the substrate 42 is detected by one of the four laser irradiation portions 21a.

(8. Position adjustment of the substrate 42)

Then, by moving the movable stage 22a in parallel with the XY plane, the center point of the substrate 42 placed on the position adjusting unit 22 and the center point of the four laser irradiation units 21a (the superimposed reference line) The center point is adjusted in a superimposed manner (see Fig. 14). Here, by rotating the movable stage 22a, the notch portion of the substrate 42 is adjusted so as to face the same predetermined direction as the support plate 41.

(9. Temporarily fixed)

Then, the pressing pin 26 is moved from the standby position to the pressing position by the support shaft 26b, whereby the support plate 41 supported by the spacer 23 is biased toward the lower side in the Z direction by the spring 26a. . Next, the substrate 42 placed on the one set of position adjusting portions 22 is moved to move the first support pin 25 toward the upper side in the Z direction. Thereby, the adhesive layer formed on the upper surface of the substrate 42 is moved to the near side of the bottom surface of the support plate 41 supported by the spacer 23. Thereafter, the spacer 23 is moved to the extraction position, whereby the support plate 41 and the substrate 42 are pressed by the first support pin 25 and the pressing pin 26 by the force applied by the spring 26a of the pressing pin 26 ( Refer to Figure 15). Thereby, the support plate 41 and the substrate 42 are superposed and temporarily fixed.

(10. End of stacking)

After the support plate 41 and the substrate 42 are overlapped, the pressing pin 26 is returned to the standby position. In addition, the first support pin 25 is placed in the Z direction Side movement. Thereby, the superposed support plate 41 and the board|substrate 42 are received in the internal conveyance part 10 (refer FIG. 16).

(11. The laminated body 40 is transferred to the pasting chamber 7)

Next, the shutter of the shutter 8 is opened, and the inner support portion 10 and the substrate 42 are transferred from the stacking chamber 6 to the pasting chamber 7 by the inner transfer portion 10. Here, the overlapping support plates 41 and 42 are attached to the bonding chamber 7, and are supported by the second support pins 31 (see Fig. 17).

(12. Adhesion of the support plate 41 and the substrate 42)

Next, in a state where the second support pin 31 is supported, the pressure plate 33 is lowered in the Z direction, thereby bringing it into contact with the upper surface of the support plate 41. Next, the second support pin 31 is lowered at the same speed as the pressure plate 33. Thereby, the support plate 41 and the substrate 42 are sandwiched between the pressure plates 32 and 33, and heated while being pressed (see FIG. 18). Thereby, the support plate 41 and the substrate 42 are adhered to form the laminated body 40.

<Paste method>

The pasting method of the embodiment of the present invention includes a superimposing process of superimposing the substrate 42 and the support plate 41 of the support substrate 42 in the stacking chamber 6; and supporting the substrates 42 and the substrates The bonding method of the bonding process of the bonding process in the bonding chamber 7 includes: detecting the position of the outer peripheral end of each of the substrate 42 and the supporting plate 41, and determining the position of the substrate 42 and the supporting plate 41. Position detection order of the center point in each And a position adjustment phase for adjusting a position in a planar direction of each of the substrate 42 and the support plate O according to the obtained position of the center point; and a stack of the substrate 42 and the support plate 41 of the adjusted position In phase.

Further, in the attaching method of the embodiment, it is preferable that at least one of the two faces of the substrate 42 and the support plate 41 facing each other is laminated with an adhesive layer, and in the overlapping step, the substrate 42 on which the adhesive layer is to be formed is formed. After the support plate 41 is heated, a part of the area of the substrate 42 and the support plate 41 at the adjusted position, and a part of the other of the substrate 42 and the support plate 41 at the adjusted position are The film is superposed, sandwiched, and pressed.

Further, in the pasting method of the embodiment, the position of the outer peripheral end portion of each of the substrate 42 and the support plate 41 may be detected in a direction perpendicular to the plane direction (X-Y direction) in the position detecting stage.

Further, in the above-described position adjustment step, the pasting step of the embodiment preferably moves in two directions parallel to the plane direction, thereby adjusting the position of the center point of each of the support plate 41 and the substrate 42 with the center The point is rotated centrally, thereby adjusting the respective directions of the substrate 42 and the support plate 41.

That is, in one embodiment, the lamination process and the pasting process of the pasting method can be carried out using the above-described pasting system 1 and adhesive device 2 of the present invention. Further, one embodiment of the pasting method of the present invention is based on the above-described pasting system 1 and the pasting device 2, and thus detailed description thereof will be omitted.

The present invention is not limited to the above embodiment, and Various changes are made within the scope of the claims. In other words, the embodiment obtained by combining the technical means that is appropriately changed within the scope of the claims is also included in the technical scope of the present invention.

[Industrial availability]

The present invention can improve the bonding precision of the substrate and the support under vacuum, and thus can be widely utilized in the field of manufacturing industrial products.

2‧‧‧Adhesive device

6‧‧‧Positioning room (stacking part)

7‧‧‧Adhesive room (adhesive part)

8‧‧‧ gate

10‧‧‧Internal Transport Department

21‧‧‧Location Detection Department

21a‧‧‧Laser illumination unit (position detection unit)

21b‧‧‧Lighting Department (Position Detection Department)

21c‧‧‧Window (Location Detection Department)

22‧‧‧ Position adjustment unit (position adjustment unit)

22a‧‧‧Moving stage (position adjustment unit)

23‧‧‧ Spacer (holding section)

24a‧‧‧Loading surface

25‧‧‧First Support Pin (Temporary Fixing Department)

26‧‧‧Pushing pin (temporary fixing)

26a‧‧‧Spring (temporary restraint)

26b‧‧‧Support shaft (temporary restraint)

31‧‧‧second support pin

32, 33‧‧‧ Pressurized plate

Claims (13)

An adhesive device comprising: a substrate; a superimposed portion overlapping the support supporting the substrate; and an adhesive portion of the substrate and the support adhered to each other, wherein the adhesive device is characterized by: The overlapping portion includes: a plurality of position detecting portions that detect a position of an outer peripheral end portion of each of the substrate and the support, and obtain a center point of each of the substrate and the support; The position adjustment unit adjusts a position in a planar direction of each of the substrate and the support according to a position of the center point, and superimposes the position-adjusted substrate on the support. The adhesive device according to claim 1, wherein the overlapping portion includes: a holding portion that holds one of the position-adjusted substrate and the support; and a temporary fixing portion; This is carried out by sandwiching and sandwiching the substrate or the partial region of the support in the holding portion and the other portion of the substrate and the support which are positionally adjusted. The adhesive device according to claim 2, wherein at least one of the two surfaces facing the substrate and the support has an adhesive layer, and the laminated portion is provided with the substrate and Support body Before the lamination, the substrate on which the above-mentioned adhesive layer is formed or the heating portion in which the support is heated is formed. The adhesive device of claim 1, wherein each of the plurality of position detecting portions detects an outer peripheral end of the substrate and the support by a direction perpendicular to the planar direction. position. The adhesive device of claim 1, wherein the position detecting unit is any one of a CCD (Charge Coupled Device) camera and a laser sensor. The adhesive device according to claim 1, wherein the position adjustment unit moves in two directions parallel to the planar direction, thereby adjusting a position of a center point of each of the substrate and the support. The center point is rotated centrally to adjust the direction of each of the substrate and the support. The adhesive device according to claim 2, wherein the position adjustment unit moves in a direction perpendicular to the planar direction, thereby transferring the support body and the substrate at the adjusted position To the above holding portion. The adhesive device according to any one of the items of the present invention, wherein the substrate and the support body have a circular shape in a top view, and a cutout portion is provided at an outer peripheral end portion. One of the position detecting units detects a position of the notch portion provided on the substrate and the support. An adhesive system characterized by: The adhesive device according to any one of claims 1 to 8, wherein the position specifying portion is located outside the adhesive device to determine a center point of the substrate and the support; and a transfer portion The substrate and the support for determining the center point are individually transported into the overlapping portion, and the position detecting portion detects the substrate and the support that are transported to the stacked portion by the transport portion. The offset of the center point specified by the position-specific portion of each of the bodies. An adhesive method comprising: a superimposing project of superposing a substrate and a support supporting the substrate in a superposed portion; and attaching the superposed substrate and the support to the adhesive portion The pasting engineering system includes: a position detecting stage for detecting a position of an outer peripheral end portion of each of the substrate and the support body, and determining the substrate and the support a center point in each of the bodies; a position adjustment phase that adjusts a position in a planar direction of each of the substrate and the support according to a position of the obtained center point; and a superposition stage, the system is adjusted The above substrate at the position is superposed on the above support. The pasting method of claim 10, wherein at least one of the two sides of the substrate and the support body facing each other a surface layer having an adhesive layer, wherein in the superposing step, after the substrate or the support body on which the adhesive layer is formed is heated, a part of the substrate and the support are adjusted at a position, Pressing is performed by sandwiching and sandwiching a part of the other of the substrate and the support in the adjusted position. The bonding method of claim 10, wherein in the position detecting stage, the position of the outer peripheral end of each of the substrate and the support is detected in a direction perpendicular to the planar direction. The bonding method according to any one of the items 10 to 12, wherein in the position adjustment step, the two sides are parallel to the planar direction, thereby adjusting each of the support and the substrate. The position of the center point in the middle is rotated about the center point, thereby adjusting the direction of each of the substrate and the support.