KR20160125259A - Producting system for liquid crystal on silicon and producting method for the same - Google Patents

Producting system for liquid crystal on silicon and producting method for the same Download PDF

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Publication number
KR20160125259A
KR20160125259A KR1020150056207A KR20150056207A KR20160125259A KR 20160125259 A KR20160125259 A KR 20160125259A KR 1020150056207 A KR1020150056207 A KR 1020150056207A KR 20150056207 A KR20150056207 A KR 20150056207A KR 20160125259 A KR20160125259 A KR 20160125259A
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South Korea
Prior art keywords
wafer
glass
liquid crystal
unit
loader
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KR1020150056207A
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Korean (ko)
Inventor
이상문
장동환
박병철
이재민
김정혁
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주식회사 셀코스
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Priority to KR1020150056207A priority Critical patent/KR20160125259A/en
Publication of KR20160125259A publication Critical patent/KR20160125259A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)

Abstract

An elcus panel manufacturing system and a method of manufacturing the same are disclosed. The disclosed elucosis panel manufacturing system includes a wafer loader on which a wafer on which an alignment film is deposited is loaded; A glass loader on which a glass on which an alignment film is deposited is loaded; A transfer unit for transferring the wafer and the glass; A first aligner that receives the wafer and the glass from the wafer loader and the glass loader, respectively, by the transfer unit, and adjusts the positions of the wafer and the glass; A dispenser for receiving the wafer from the first aligner by the transfer unit and applying the main sealant according to a pattern of each chip of the wafer; A liquid crystal display part for receiving the wafer from the dispenser by the transfer part and applying liquid crystal to each chip of the wafer; A seal unit for transferring the wafer from the liquid crystal shroud by the transfer unit, receiving the glass from the first aligner by the transfer unit, coalescing the wafer and the glass, and irradiating ultraviolet rays; And a controller for controlling the conveying unit, the first aligner, the dispenser, the liquid crystal decorating unit, and the sticking unit, wherein the wafer loader, the glass loader, the transfer unit, the first aligner, the dispenser, The application portion, the adhesion portion, and the control portion are disposed adjacent to each other to form an inline system.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for manufacturing a liquid crystal panel,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a system and a method for manufacturing the apparatus, and more particularly, to a system and a method for manufacturing the apparatus.

In general, Liquid Crystal on Silicon (LCoS) is a display in which a glass substrate is replaced with a silicon wafer in a conventional LCD (liquid crystal display) device and a circuit is formed thereon. That is, an LCD liquid crystal is placed on a silicon semiconductor, which is also referred to as a 'silicon upper layer liquid crystal'. Elcourse, a type of flat panel display (FPD) technology, is the next generation of the Michael display technology to build portable display systems.

Since the ELCOS forms a TFT on a silicon substrate and realizes a display using a liquid crystal, unlike an LCD that transmits light, the ELCOS produces a screen by reflecting light, It becomes possible.

With such an Elcus technology, it can be applied to a wide range of digital devices since it can be realized from a small screen to a large screen. In other words, it can be used as a medium and small-sized display such as a 20-inch monitor or a TV, a mobile phone, a digital camera, a notebook, a head-mounted display (HMD), a camcorder and the like.

The present invention can simplify the manufacturing process of the elucous panel, reduce the cost required for manufacturing the elucous panel, improve the yield of the elucous panel and improve the quality of the elucus panel. And a manufacturing method thereof.

In order to achieve the above object, the present invention provides a wafer loader in which a wafer on which an alignment film is deposited is loaded; A glass loader on which a glass on which an alignment film is deposited is loaded; A transfer unit for transferring the wafer and the glass; A first aligner that receives the wafer and the glass from the wafer loader and the glass loader, respectively, by the transfer unit, and adjusts the positions of the wafer and the glass; A dispenser for receiving the wafer from the first aligner by the transfer unit and applying the main sealant according to a pattern of each chip of the wafer; A liquid crystal display part for receiving the wafer from the dispenser by the transfer part and applying liquid crystal to each chip of the wafer; A seal unit for transferring the wafer from the liquid crystal shroud by the transfer unit, receiving the glass from the first aligner by the transfer unit, coalescing the wafer and the glass, and irradiating ultraviolet rays; And a control unit for controlling the conveying unit, the first aligner, the dispenser, the liquid crystal decorating unit, and the sticking unit.

In addition, the wafer loader, the glass loader, the transfer unit, the first aligner, the dispenser, the liquid crystal cap, the adhesion unit, and the control unit may be arranged to be in-line.

Here, the joining portion may include: a seating portion on which the wafer and the glass are respectively seated; A driving unit for driving the seating unit such that the wafer and the glass are adhered to each other; A chamber surrounding the seating part and defining a predetermined space therein; A vacuum pump connected to the chamber to bring the chamber into a vacuum state; And an ultraviolet module for irradiating ultraviolet rays toward the seating part.

In addition, the ultraviolet module may be disposed on the upper side of the chamber, and the driving unit may be disposed on the lower side of the chamber.

Furthermore, the seating portion may include a second aligner for adjusting the position of the wafer and the glass.

The mounting portion may include: a base for receiving the power from the driving unit and moving the wafer and the glass; And a transparent member which is fixedly disposed between the base and the ultraviolet module and coats the wafer and the glass together with the base and is made of a transparent material so that ultraviolet light irradiated from the ultraviolet module can be irradiated onto the wafer and the glass, . ≪ / RTI >

The conveying unit may include a body having a driving source; And a transfer arm having one end connected to one side of the body and the other end having a fixing portion capable of fixing the wafer and the glass.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: an alignment film deposition step of depositing an alignment film on a wafer and a glass; A main sealant applying step of applying a main sealant to the wafer according to a pattern of each chip; A liquid crystal applying step of applying liquid crystal to each chip of the wafer; A cementing step of cementing the wafer and the glass; And an ultraviolet light irradiation step of irradiating ultraviolet rays to the wafer and the glass which are attached to each other.

Baking the wafer and the glass after the ultraviolet light irradiation step; And separating the bonded wafer and the glass into respective chips.

The method may further include a first position adjusting step of adjusting the positions of the wafer and the glass so that the main sealant is applied to the wafer and the glass in a predetermined direction between the orientation film deposition step and the main sealant application step .

Further, in the liquid crystal application step, the liquid crystal may be applied using a DF (Drop Filling) method.

In addition, the cementing step and the ultraviolet ray irradiation step may be performed in one apparatus.

Furthermore, the cementing step and the ultraviolet irradiation step may be performed in a vacuum state.

The second position adjusting step, the joining step, and the ultraviolet irradiating step may further comprise a second position adjusting step of adjusting the positions of the wafer and the glass between the liquid crystal applying step and the joining step, Device. ≪ / RTI >

According to the system and method for manufacturing an elucous panel according to an embodiment of the present invention having the above-described structure, the manufacturing process of the elucous panel can be simplified and automated, In addition, it is possible to reduce the cost required for manufacturing the Elcus panel. In addition, the quality of the Elcos panel can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing an ELOCOS panel manufacturing system according to an embodiment of the present invention; FIG.
Fig. 2 is a schematic view showing the joining portion shown in Fig. 1. Fig.
Figs. 3 to 7 are enlarged views showing part III shown in Fig.
8 is a schematic view showing the second aligner shown in Figs. 3 to 7. Fig.
Figs. 9 and 10 are plan views showing the second aligner shown in Fig. 8. Fig.
11 is a flowchart showing a manufacturing method using an ELOCOS panel manufacturing system according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It is to be understood that the embodiments described below are provided for illustrative purposes only, and that the present invention may be embodied with various modifications and alterations. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention. In addition, the attached drawings are not drawn to scale in order to facilitate understanding of the invention, but the dimensions of some of the components may be exaggerated.

1, an ELOCOS panel manufacturing system 1 according to an embodiment of the present invention includes a wafer loader 10, a glass loader 20, a transfer unit 30, a first aligner an aligner 40, a dispenser 50, a liquid crystal cap 60, a cement 70, an Elcus panel loader 80, and a controller 90.

The wafer loader 10 and the glass loader 20 are disposed adjacent to a rail part 33 to be described later. A wafer W on which an alignment film is deposited is loaded on the wafer loader 10, The deposited glass (G) is loaded. That is, the wafer loader 10 and the glass loader 20 may be cassette loading equipment. The wafer W and the glass G thus stacked are transported to the respective devices by the transporting unit 30 to be described later to be manufactured by the elucose panel.

The transfer unit 30 transfers the wafer W and the glass G from one apparatus to another apparatus and includes a body 31, a transfer arm 32 and a rail 33 .

The body 31 includes a driving portion (not shown) and moves in the directions of arrows A and B along the rail portion 33 to be described later.

One end 32a of the transfer arm 32 is rotatably connected to the body 31 and the other end 32b is provided with a fixing unit for fixing one wafer W or one glass G do. 1, one end portion 32a of the transfer arm 32 is rotatably connected to the body 31 so that the transfer portion 32 transfers the processed wafer W from the dispenser 50, (W) is fixed to the other end 32b, and then it can be rotated by 180 degrees and transferred to the liquid crystal shroud 60.

The other end portion 32b of the transfer arm 32 is provided with a fixing portion for fixing one wafer W or one glass G and the fixing portion may include a vacuum adsorber.

The rail part 33 guides the path of movement of the body 31 and is disposed at a position adjacent to all the devices and the central part of the elucosis panel manufacturing system 1 according to the embodiment of the present invention. Accordingly, after the wafer W and the glass G are fixed by the transfer unit 30, the moving distance of the wafer W and the glass G can be minimized.

A first aligner (40) is disposed adjacent to the wafer loader (10) and the glass loader (20). The first aligner 40 receives the wafer W from the wafer loader 10 by the transfer unit 30 and adjusts the position of the transferred wafer W so that the main sealant and the liquid crystal So that it can be applied along the direction of the alignment film deposited on the wafer W.

Specifically, a predetermined notch is formed on the edge of the wafer W, and the first aligner 40 senses the notch to adjust the position of the wafer W.

The first aligner 40 receives the glass G from the glass loader 20 by the transfer unit 30 and adjusts the position of the transferred glass G so that the glass G is transferred to the wafer W. [ The orientation of the orientation film deposited on the glass G can correspond to the orientation of the orientation film deposited on the wafer W. [ At this time, the method of adjusting the position is the same as the method of adjusting the position of the wafer W described above.

The dispenser 50 is disposed adjacent to the first aligner 40 and receives the wafer W from the first aligner 40 by the transfer unit 30. Thereafter, the dispenser 50 applies the main sealant to the wafer W to bond the wafer W and the glass (G). At this time, the main sealant is applied to one surface of the wafer W according to the pattern of each chip of the wafer W.

The liquid crystal cap 60 is disposed adjacent to the dispenser 50 and receives the wafer W from the dispenser 50 by the transfer unit 30 and applies liquid crystal to each chip of the wafer W. For this purpose, the liquid crystal decorating part 60 may include DF (Drop Filling) equipment.

The bonding portion 70 is disposed adjacent to the liquid crystal decorating portion 60 and receives the wafer W from the liquid crystal decorating portion 60 by the transferring portion 30. Thereafter, the sticking portion 70 receives the glass G from the first aligner 40 by the conveying portion 30. At this time, the order of transferring the wafer W and the glass G may be such that the glass G is transferred first and then the wafer W is transferred in the reverse order. 2, the sticking portion 70 includes a seating portion 100, a driving portion 71, a chamber 72, a vacuum pump 73, and an ultraviolet module 70 for attaching the wafer W and the glass G to each other. (74).

The seating part 100 is disposed inside a chamber 72 to be described later, and the transferred wafer W and the glass G are seated thereon. 3, the seating part 100 includes a base 101, a supporting part 102, a transparent member 103 and a second aligner 110 for attaching the wafer W and the glass G together. .

The base 101 is a portion where one side is in contact with the wafer W and the other side is connected to the supporting portion 102. The base 101 can be moved toward the transparent member 103 by the supporting portion 102 and the wafer W and the glass G are moved together and the wafer W and the glass G The wafer W and the glass G are attached together with the transparent member 103 which applies a force in the upward direction and applies force in the downward direction.

The base 101 may include a protective member 101a at a portion contacting the wafer W to maintain flatness when the wafer W and the glass G are bonded. The protective member 101a is formed of an elastic material to prevent the wafer W and the glass G from being biased in one direction when the wafer W and the glass G are attached together. As a result, the wafer W and the glass G can be uniformly bonded together as a whole. In addition, the protective member 101a may contact one surface of the wafer W to prevent the wafer W from being damaged.

The supporting portion 102 is connected to a driving portion 71 to be described later and receives power from the driving portion 71 to move the base 101 to the transparent member 103 side.

The transparent member 103 is disposed between an ultraviolet module 74 and a base 101 to be described later and when the base 101 applies upward force to the wafer W and the glass G, Apply force to the lower side. The wafer W and the glass G are bonded together by the base 101 and the transparent member 103.

The transparent member 103 is preferably made of a transparent material so that ultraviolet rays irradiated from the ultraviolet module 74 provided on the upper part are transmitted to the wafer W and the glass G. [

3 and 8, when the base 101 moves the wafer W to a predetermined height, the second aligner 110 is moved to a position where the wafer W is separated from the wafer G W) and the glass (G). The second aligner 110 includes a fixed guide 111, an adjustment guide 112, a first pressing portion 113, a first pressable portion 114, a second pressured portion 115, (116).

The fixing guide 111 is fixed to the mounting part 100 and includes a wafer guide 111a formed to correspond to the edge of the wafer W and a glass guide 111b formed to correspond to the edge of the glass G . In addition, the fixed guide 111 is provided with a micrometer 111c for setting the initial length to correspond to the wafer and the glass.

The adjustment guide 112 includes a wafer guide 112a formed to correspond to the rim of the wafer W and a glass guide 112b formed to correspond to the rim of the glass G as well as the fixed guide 111. [ The adjustment guide 112 is moved away from the fixed guide 111 as indicated by the arrows C and D by the pressing portions 113 and 115 and the to-be-pressed portions 114 and 116 to be described later. Adjustment of the position of the wafer W and the glass G in accordance with such driving will be described later.

In this embodiment, the two fixing guides 111 and the adjusting guides 112 are provided to form two virtual circles V, but the present invention is not limited thereto. For example, one fixing guide and two adjusting guides may be arranged in a range of 120 °, and three fixing guides and three adjusting guides may be arranged in a range of 60 °, respectively. However, it is desirable to accurately adjust the positions of the wafer W and the glass G with a minimum number, so that it is preferable to determine the number of the fixed guides 111 and the adjustment guides 112 and the arrangement thereof .

The first pressing portion 113 applies a force to the first to-be-pressed portion 114 to rotate the inner disk 117 counterclockwise. Specifically, the first pressing portion 113 may include a power generating portion, such as a cylinder or a spring, for applying a linear force to the first to-be-pressed portion 114. By this generated power, the one end 113a of the first pressing portion 113 applies a force to the first to-be-pressed portion 114.

9 and 10, the second pressing portion 115 is provided on the upper side of the inner circular plate 117, and moves in the counterclockwise direction together with the inner circular plate 117 rotating counterclockwise. The second pressing portion 115 rotates along the inclined surface 116a of the second to-be-urged portion 116 formed at one end of the adjusting guide 112 and guides the adjusting guide 112 to the inside of the inner disk 117 Outward direction. As the adjustment guide 112 moves in the outer direction of the inner disk 117, the circumference of the imaginary circle V formed by the two fixed guides 111 and the two adjustment guides 112 becomes large .

Thereafter, when the first pressurizing portion 113 presses the first pressured portion 114, the inner disc 117 returns to its original position by a spring provided inside the inner disc 117, The adjusting guide 112 is moved inward of the inner disk 117 again while the second pressing portion 115 presses the second to-be-pressed portion 116. [ As the adjustment guide 112 moves inward of the inner disk 117, the circumference of the imaginary circle V formed by the two fixing guides 111 and the two adjusting guides 112 becomes small At this time, the wafer W and the glass G are guided by the wafer guide 111a and the glass guide 111b of the fixing guide 111 and the wafer guide 112a and the glass guide 112b of the adjusting guide 112, Secondary position is adjusted.

The driving unit 71 is provided below the seating unit 100 and includes a motor (not shown). The driving force of the motor is transmitted to the supporting portion 102 to move the base 101 upward.

The chamber 72 has a seat 100 inside and is connected to a vacuum pump 73. The chamber 72 is evacuated by the vacuum pump 73 when the wafer W and the glass G are attached to each other. Accordingly, when the wafer W and the glass G are attached to each other, air can be prevented from flowing into the respective chips, thereby improving the production yield of the elucose panel.

The ultraviolet module 74 is provided on the upper side of the seating part 100 and irradiates the wafer W and the glass G with ultraviolet rays to cure them when the wafer W and the glass G are attached.

It is also possible for the sticking portion 70 to have the driving portion 71 on the upper side and the ultraviolet ray module 74 on the lower side because the driving portion 71 and the ultraviolet ray module 74 are reversed in direction. However, it is preferable that the driving unit 71 and the ultraviolet module 74 are disposed in opposite directions to minimize the size of the sticking unit 70.

Since the liquid crystal is applied to the upper surface of the wafer W in this embodiment, the upper surface of the wafer W is arranged so as to face upward, and the glass G is arranged to adhere to the upper surface of the wafer W. Since the ultraviolet rays are irradiated toward the direction in which the glass G is disposed, the ultraviolet module 74 is disposed on the upper side of the wafer W and the glass G, and the driving unit 71 is provided with the ultraviolet module 74 And is arranged below the wafer W and the glass G in the opposite direction to the position where the wafer W is placed.

The ELCOS panel loader 80 transports and stacks the wafer W and the glass G which have been bonded together by the transfer unit 30. [ Such an Elcus panel loader 80 may also be a cassette loading device like the wafer loader 10 and the glass loader 20 described above.

The control unit 90 controls the transfer unit 30, the first aligner 40, the dispenser 50, the liquid crystal decorating unit 60, and the sticking unit 70 and includes an input unit (not shown) And a display unit (not shown) for informing the user of the operation status.

The arrangement of each of the devices of the system 1 according to the present invention is not limited to that shown in FIG. 1, and the devices may be arranged in a row or in a circle . That is, any arrangement is possible as long as these devices can be arranged in-line. However, in order to improve the manufacturing yield of the elucosis panel with the movement path of the transfer section 30 being the shortest, it is preferable to arrange the transfer path as shown in Fig. 1 or to arrange it in a circular shape.

Hereinafter, with reference to FIG. 9, a description will be given of a method of manufacturing an ELOCOS panel using the ELOCOS panel manufacturing system 1 according to an embodiment of the present invention.

First, an alignment film is deposited on the wafer W and the glass G (S1). Since the step of depositing the alignment film is a known technique, a detailed description thereof will be omitted.

Next, the wafer W and the glass (G) on which the alignment film is deposited are loaded on the wafer loader 10 and the glass loader 20, respectively. The step of loading the wafer W and the glass G onto the wafer loader 10 and the glass loader 20 may be carried out by a person or may be carried out by the transfer unit 30 of the present invention. Or may be performed automatically from an apparatus for depositing an alignment film on the glass (G).

Next, the operator controls the transfer unit 30 to transfer one wafer W from the wafer loader 10 to the first aligner 40 through the control unit 90. The worker controls the position of the wafer W by adjusting the position of the notch formed on the edge of the wafer W by the first aligner 40 having received the one wafer W through the control unit 90 (S2).

Next, the operator controls the transfer of the wafer W, whose position is adjusted through the control unit 90, to the dispenser 50 by the transfer unit 30. Subsequently, the dispenser 50, to which the wafer W has been transferred via the control unit 90, attaches the wafer W and the glass G to the main sealant according to the pattern of each chip of the wafer W. Then, (S3). At this time, unlike the related art, the ELOCOS panel manufacturing system 1 according to the embodiment of the present invention attaches the wafer W and the glass G after coating the liquid crystal on the wafer W, It is not necessary to form the liquid crystal injection hole of the liquid crystal cell. Therefore, the process of applying the main sealant to the wafer W can be simplified compared to the conventional method.

Next, the operator controls the wafer W coated with the main sealant through the control unit 90 to be transferred to the liquid crystal decorating unit 60 by the transfer unit 30. [ The liquid crystal decorating part 60 transferred with the wafer W applies liquid crystal to each chip of the wafer W using a DF (Drop Filling) equipment (S4).

Next, the worker is controlled such that the wafer W to which the liquid crystal is applied through the control unit 90 is transferred to the sticking unit 70 by the transferring unit 30 and is seated on the seating unit 100.

Here, the worker transports one glass G from the glass loader 20 to the first aligner 40 while the transporting unit 30 performs the above-described steps S3 through S4 through the control unit 90 , And adjusting the position of the glass (G) (S2). The operator can control the transfer unit 30 to transfer the glass G with the adjusted position through the control unit 90 to the seam unit 70 and seat the glass G on the seating unit 100.

The transfer process of the glass G is not limited to that described above and may be performed after the wafer W is transferred to the welded portion 70 and the wafer W is transferred to the first aligner 40 May be performed before.

Next, the operator places the wafer W coated with the liquid crystal by the transfer unit 30 through the control unit 90 and the inside of the chamber 72 of the sticking unit 70, to which the position-adjusted glass G is transferred, The vacuum pump 73 is controlled. As the wafer W and the glass G are bonded together in this vacuum state, air is hardly introduced into each chip of the elucosis panel. Hereinafter, the process of attaching the wafer W and the glass G while moving the base 101 upward will be described in detail with reference to FIG. 3 to FIG.

3, the wafer W and the glass G are seated at respective positions of the seating part 100, and the base 101 is held on the lower side of the wafer W without contacting the wafer W Wait.

Referring to FIG. 4, the base 101 moves upward by the support portion 102 and contacts the wafer W to support the wafer W. As shown in FIG. At this time, the lower surface of the wafer W comes into contact with the protective member 101a of the base 101, so that the damage can be minimized.

Referring to FIG. 5, the base 101 moves the wafer W upward to a height at which the wafer W can be positioned by the second aligner 110. In this step, the positions of the wafer W and the glass G are adjusted in the second order.

9 and 10, the adjustment guide 112 of the second aligner 110 is configured such that the first pressure member 113 applies a force to the first pressure member 115, The pressing member 115 moves to the outside of the inner disk 117 as a force is exerted on the second pressure member 116 so that the virtual guide 117 formed by the adjusting guide 112 and the fixing guide 111 The diameter of the circle V becomes large. At this time, the wafer W is positioned on the same plane as the wafer guide 111a of the fixed guide 111 and the wafer guide 112a of the adjustment guide 112. The glass G is seated on the same plane as the glass guide 111b of the fixing guide 111 and the glass guide 112b of the adjusting guide 112 when the glass G is seated on the seating part 100. [

In this state, as the first and second pressing members 113 and 115 press-release the first and second pressured members 114 and 116, the adjustment guide 112 moves toward the inside of the inner disk 117 Move. As a result, the diameter of the imaginary circle V formed by the adjustment guide 112 and the fixed guide 111 becomes small, and the rim of the wafer W is guided by the wafer guide 111a of the fixed guide 111, The edge of the glass G corresponds to the glass guide 111b of the fixing guide 111 and the glass guide 112b of the adjusting guide 112 So as to be adjusted at a predetermined angle. Thereby, the wafer W and the glass G are subjected to secondary position adjustment.

When the secondary position adjustment is completed, as shown in Fig. 6, the base 101 further moves upward, whereby the wafer W and the glass G are brought into contact with each other.

7, the operator moves the upper part of the wafer W until the glass G contacts the transparent member 103 disposed on the upper side of the base 101 through the control unit 90, And the glass G are bonded together (S5). At this time, the wafer W is supported by the protective member 101a of an elastic material, so that the wafer W and the glass G are prevented from being biased to one side. As a result, the wafer W and the glass G can be uniformly bonded together as a whole.

7, the ultraviolet light module 74 irradiates ultraviolet rays toward the wafer W and the glass G to cure the wafer W and the glass G (S6).

Thereafter, the operator causes the transfer unit 30 to transfer the wafer W and glass G (hereinafter referred to as "Elcus panel") attached through the control unit 90 to the elccus panel loader 80 .

The elucose panel transferred to the Elucos panel loader 80 is transferred to the baking apparatus and baked, whereby the liquid crystal is arranged at the position intended by the user (S7).

Thereafter, the baked El Corte panel is separated into unit chips by the operator (S8).

As described above, when the ELOCOS panel is manufactured using the ELOCOS panel manufacturing system according to an embodiment of the present invention, the ultraviolet module is included in the joint portion, and the liquid crystal is coated before the ELOCOS panel is separated into the unit chips The manufacturing process can be simplified and automated, thereby improving the production yield.

In addition, by adjusting the position of the wafer and the glass twice, it is possible to manufacture a high-quality Elcus panel.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

30; A transfer unit 40; The first aligner
50; Dispenser 60; Liquid crystal aspiration
70; A joint portion 74; Ultraviolet module
100; A seat portion 110; The second aligner
W; Wafer G; Glass

Claims (14)

A wafer loader on which a wafer on which an alignment film is deposited is loaded;
A glass loader on which a glass on which an alignment film is deposited is loaded;
A transfer unit for transferring the wafer and the glass;
A first aligner that receives the wafer and the glass from the wafer loader and the glass loader, respectively, by the transfer unit, and adjusts the positions of the wafer and the glass;
A dispenser for receiving the wafer from the first aligner by the transfer unit and applying the main sealant according to a pattern of each chip of the wafer;
A liquid crystal display part for receiving the wafer from the dispenser by the transfer part and applying liquid crystal to each chip of the wafer;
A seal unit for transferring the wafer from the liquid crystal shroud by the transfer unit, receiving the glass from the first aligner by the transfer unit, coalescing the wafer and the glass, and irradiating ultraviolet rays; And
And a controller for controlling the conveying unit, the first aligner, the dispenser, the liquid crystal decorating unit, and the sticking unit. The method according to claim 1,
Wherein the wafer loader, the glass loader, the transfer unit, the first aligner, the dispenser, the liquid crystal shroud, the adhesion unit, and the control unit are arranged in-line. system. The method according to claim 1,
[0027]
A seating part on which the wafer and the glass are respectively seated;
A driving unit for driving the seating unit such that the wafer and the glass are adhered to each other;
A chamber surrounding the seating part and defining a predetermined space therein;
A vacuum pump connected to the chamber to bring the chamber into a vacuum state; And
And an ultraviolet module for irradiating ultraviolet rays toward the seating part. The method of claim 3,
Wherein the ultraviolet module is disposed on the upper side of the chamber,
Wherein the driving unit is disposed below the chamber. The method of claim 3,
Wherein the seating part comprises a second aligner for adjusting the position of the wafer and the glass. The method of claim 3,
The seat (1)
A base for receiving the power from the driving unit and moving the wafer and the glass; And
And a transparent member made of a transparent material so that ultraviolet rays irradiated from the ultraviolet ray module can be irradiated onto the wafer and the glass, the transparent member being fixedly disposed between the base and the ultraviolet module, Wherein the system comprises: The method according to claim 1,
The transfer unit
A body provided with a driving source; And
Wherein the one end portion is connected to one side of the body and the other end portion includes a transfer arm having a fixing portion capable of fixing the wafer and the glass. An alignment film deposition step of depositing an alignment film on the wafer and the glass;
A main sealant applying step of applying a main sealant to the wafer according to a pattern of each chip;
A liquid crystal applying step of applying liquid crystal to each chip of the wafer;
A cementing step of cementing the wafer and the glass; And
And an ultraviolet light irradiation step of irradiating ultraviolet rays onto the coherent wafer and the glass. 9. The method of claim 8,
After the ultraviolet ray irradiation step,
Baking the wafer and the glass that have been cemented together; And
And separating the coalesced wafer and the glass into individual chips. 9. The method of claim 8,
And a first position adjusting step of adjusting the positions of the wafer and the glass so that the main sealant is applied to the wafer and the glass in a predetermined direction between the orientation film deposition step and the main sealant application step Wherein said method comprises the steps of: 9. The method of claim 8,
Wherein the liquid crystal is applied using a DF (Drop Filling) method in the liquid crystal application step. 9. The method of claim 8,
Wherein the cementing step and the ultraviolet irradiation step are performed in one apparatus. 9. The method of claim 8,
Wherein the cementing step and the ultraviolet irradiation step are performed in a vacuum state. 9. The method of claim 8,
Further comprising a second position adjustment step of adjusting the positions of the wafer and the glass between the liquid crystal application step and the adhesion step,
Wherein the second position adjustment step, the adhesion step, and the ultraviolet light irradiation step are performed in one apparatus.
KR1020150056207A 2015-04-21 2015-04-21 Producting system for liquid crystal on silicon and producting method for the same KR20160125259A (en)

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