JP2004296907A - Substrate laminating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate laminating apparatus having its excellent productivity/reliability wherein two substrates are held while positioning them accurately, and they can be laminated each other quickly without causing any positional discrepancy. <P>SOLUTION: A substrate holder 6 comprises an annular member having an opening portion 7 wherethrough substrates 4a, 4b and a laminating plate 3 can be passed, and first and second supporting portions 8, 9 for holding thereby the substrates 4a, 4b are attached to the annular member along the inner peripheral edge of the opening portion 7. Also, a phase-matching guide 11 corresponding to the notches of the substrates 4a, 4b is provided in the substrate holder 6. Further, center aligning guides 10 for centering thereby the substrates 4a, 4b are provided in the substrate holder 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate bonding apparatus for bonding two substrates in a reduced-pressure atmosphere, and in particular, an improvement is made to the configuration for holding a substrate during bonding.
[0002]
[Prior art]
Conventionally, in the field of chip size package semiconductor devices and optical discs, a process of bonding two substrates is adopted. For example, in semiconductor devices, an ultra-thin chip of 50 μm has appeared due to advances in three-dimensional mounting technology. In the manufacturing process, the back surface without the device is ground, and a wafer made of an insulator such as Si, GaAs, or alumina is used. Thinning is essential. In this grinding operation, the wafer is very thin, and the wafer is easily damaged. Therefore, after completing the wiring in the previous process, a reinforcing rigid body such as glass, bare wafer, or ceramic is bonded to the wafer with an adhesive layer such as a double-sided tape, and then the wafer is ground to a thickness of 50 μm. Yes. Also, in the field of optical discs, a type of attaching optical discs such as DVD and “Blu-ray Disc” which is the next generation standard has appeared. Against the backdrop of such a situation, there is a great interest in the technique of bonding two substrates.
[0003]
By the way, when the substrates are bonded, the substrates are bonded to each other by applying a predetermined pressure while being heated, so that voids (bubbles) may be generated between the substrates or in the adhesive layer, or the substrates may be deformed. . The generation of voids and the deformation of the substrate cause the recorded information to be unreproducible when the substrate is an optical disk. In addition, when the substrate is a semiconductor device, the substrate thickness after grinding becomes non-uniform or causes problems during grinding. Therefore, when bonding substrates, it is desired to suppress the generation of voids and the amount of substrate deformation, and to increase the bonding accuracy between substrates.
[0004]
For example, the substrate bonding apparatus shown in FIG. 8 is an apparatus for bonding two substrates 4a (lower side) and substrate 4b (upper side) having the same diameter under a reduced pressure atmosphere. Here, the vacuum vessel 22 is disposed, and the opening 22a is configured so that the valve bodies 20 and 23 close from above and below. Among these, the lower substrate holder 33 for holding the lower substrate 4 a is placed on the upper surface of the lower valve body 23. A lower drive mechanism 25 that integrally drives the lower substrate holder 33 and the valve body 23 is connected to the lower surface of the valve body 23. An upper substrate holder 21 that holds the upper substrate 4 b is disposed below the upper valve body 20. A holder driving mechanism 18 is connected to the upper substrate holder 21, and a valve driving mechanism 17 is connected above the valve body 20. An adhesive 5 made of double-sided tape or the like is attached to the opposing surfaces of the substrates 4a and 4b.
[0005]
In the substrate bonding apparatus having such a configuration, when the holder driving mechanism 18 and the lower driving mechanism 25 are driven, the upper substrate holder 21 performs a lowering operation, and the lower substrate holder 33 performs an ascending operation. The holders 21 and 33 are accommodated in the openings 22a of the vacuum vessel 22 while holding the substrates 4a and 4b. At this time, since the valve body 23 is also raised in synchronization with the lower substrate holder 33, the valve body 23 closes the lower portion of the opening 22a. Subsequently, the valve body 20 is lowered by the operation of the valve drive mechanism 17, and the valve body 20 closes the upper portion of the opening 22a. After the valve bodies 20 and 23 close the opening 22a of the vacuum vessel 22 in this way, the inside of the vacuum vessel 22 is depressurized in a predetermined reduced pressure atmosphere by an exhaust mechanism (not shown). In such a state, the upper substrate holder 21 is further lowered by the holder driving mechanism 18, the substrates 4 a and 4 b are brought into contact with each other and pressurized, and both are bonded together by the adhesive 5. According to the substrate bonding apparatus as described above, since the two substrates 4a and 4b can be bonded inside the opening 22a of the vacuum vessel 22 in a reduced pressure atmosphere, the adhesive 5 and the adhesive 5 There is no possibility that bubbles will be mixed between the substrate 4a and the substrate 4b. Therefore, generation of voids can be prevented between the substrates 4a and 4b, and excellent bonding accuracy can be obtained.
[0006]
[Patent Document 1]
JP 2000-315338 A
[Problems to be solved by the invention]
By the way, in order to increase the bonding accuracy of the substrates, it is important not only to eliminate voids but also to accurately align the substrates during bonding. However, in the above-described prior art, it is necessary to align the upper and lower substrate holders 21 and 33 and the substrates 4a and 4b held by the upper and lower substrate holders 21 and 33, respectively, and then perform alignment operations between the substrate holders 21 and 33. there were. For this reason, the number of operations is large, and there is a high possibility that a positional shift will occur. Therefore, careful work is required, and work time is increased. Further, in the above conventional example, the movements of the holders 21 and 33 are large because they move integrally with the valve bodies 20 and 23, and the substrates 4a and 4b are easily displaced from the substrate holders 21 and 33.
[0008]
The present invention has been proposed in order to solve such a problem. The purpose of the present invention is to hold two substrates while accurately positioning them so that they can be bonded quickly without causing a positional shift. It is an object of the present invention to provide a substrate bonding apparatus that is capable of excellent productivity and reliability.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, the present invention includes a vacuum vessel capable of maintaining a reduced pressure atmosphere, and a pressure receiving plate and a sticking plate that is movable in a direction in contact with and away from the pressure receiving plate in the vacuum vessel. Arranged facing each other, holding two substrates between these two plates with a predetermined interval, providing an adhesive layer on at least one of the opposing surfaces of the substrates, and moving the pasting plate A substrate bonding apparatus configured to bond two substrates by pressing the substrate against a pressure receiving plate has the following technical configuration.
[0010]
According to a first aspect of the present invention, a ring-shaped or frame-shaped substrate holder having an opening through which the substrate can pass is provided between the bonding plate and the pressure receiving plate, and the bonding plate is formed in the opening of the substrate holder. A first support portion that contacts and supports the outer periphery of the substrate close to the attachment plate and a second support portion that contacts and supports the outer periphery of the substrate close to the pressure receiving plate; A center alignment guide is provided to contact the outer periphery and bring out the center of the substrate.
[0011]
In the present invention as described above, since one substrate holder holds two substrates simultaneously, it is not necessary to prepare two substrate holders, and the work of attaching the substrate to the substrate holder can be simplified. Further, the alignment work between the substrate holders can be omitted. For this reason, the substrate is not easily displaced, and the two substrates can be bonded together accurately and quickly. Thereby, productivity and reliability in the substrate bonding apparatus are greatly improved.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an example of an embodiment of the present invention (hereinafter referred to as “embodiment”) will be specifically described with reference to the drawings.
[Configuration of Representative Embodiment]
Embodiments corresponding to the first to fifth aspects of the present invention will be described with reference to FIGS. 1 is a front view showing the overall configuration of the present embodiment, FIG. 2 is a plan view of the main part of the present embodiment, FIG. 3 is a perspective view of the main part of the present embodiment, and FIG. FIG. 5 is a side view of the first support part in the present embodiment, FIG. 6 is a side view of the second support part in the present embodiment, and FIG. 7 is an enlarged front view of the main part of the present embodiment. Note that this embodiment is an example in which the present invention is applied to an apparatus for bonding substrates 4a and 4b in a reduced-pressure atmosphere, similarly to the conventional example shown in FIG. Here, the lower substrate 4a is a wafer, and the upper substrate 4b is a reinforcing rigid body such as glass or ceramic.
[0013]
As shown in FIG. 1, in this embodiment, a vacuum container 1 capable of maintaining a reduced pressure atmosphere is provided. In this vacuum vessel 1, a pressure receiving plate 2 (upper side) and a pasting plate 3 (lower side) are arranged facing each other. A holder mounting portion 13 is formed between the plates 2 and 3, and a substrate holder 6 for holding the two substrates 4a and 4b at a predetermined interval is detachably disposed. In addition, as shown in FIG. 7, the adhesive 5 which consists of a double-sided tape etc. is provided in the board | substrate 4a among the opposing surfaces of board | substrate 4a, 4b. The pressure receiving plate 2 has a flat surface covering the reinforcing rigid body, and is made of a member having a material strength that matches the pressing load. The affixing plate 3 is movable in the direction in which it is in contact with and away from the pressure receiving plate 2, that is, in the vertical direction. The substrates 4a and 4b are bonded together.
[0014]
As shown in FIGS. 2 and 3, the substrate holder 6 is formed of a ring-shaped member having a circular opening 7 through which the substrates 4 a and 4 b and the attaching plate 3 can pass, and along the inner peripheral edge of the opening 7. Four first support portions 8 and six second support portions 9 are attached. These support parts 8 and 9 are comprised from the substantially rectangular nail | claw-shaped member, and the 1st support part 8 is arrange | positioned at equal intervals by 90 degree | times.
[0015]
In addition, two second support portions 9 are positioned so as to be separated from the phase alignment guide 11 by sandwiching two phase alignment guides 11 described later (located above the opening 7 in FIG. 2). Two first support portions 8 (positioned below the opening portion 7 in FIG. 2) are arranged two by two so as to sandwich the first support portion 8. The first support portion 8 is attached horizontally to the upper surface of the opening portion 7, whereas the second support portion 9 is attached horizontally to a position 3 mm higher than the upper surface of the opening portion 7. . The outer ends of the substrates 4a and 4b are engaged with the tip portions of the support portions 8 and 9 by about 1 mm, and the lower substrate 4a is contacted and supported by the first support portion 8 (see FIG. 5), thereby providing the second support. The upper substrate 4b is contacted and supported by the portion (see FIG. 6). Further, the first and second support portions 8 and 9 have a hinge structure, and the tip portions thereof are rotated in the vertical direction in the same manner as the moving direction of the attaching plate 3.
[0016]
Incidentally, the two substrates 4a and 4b have notches, and the substrate holder 6 is provided with a phase alignment guide 11 corresponding to the notches. The substrate holder 6 is provided with three centering guides 10 that come into contact with the outer circumferences of the substrates 4a and 4b to bring out the centers of the substrates 4a and 4b at equal intervals. More specifically, one is arranged at a position facing the phase alignment guide 11 and the other two are arranged with an angle of 120 degrees starting from this. These center alignment guides 10 are movable in the radial direction of the substrate holder 6 in accordance with the outer peripheral portions of the substrates 4a and 4b. Further, two plungers 12 detachably attached to a holder attaching portion 13 (shown in FIG. 1) are attached to both end portions of the substrate holder 6 so as to protrude outward.
[0017]
[Effect of representative embodiment]
The operational effects of the present embodiment having the above-described configuration are as follows. That is, when the first support portion 8 supports the lower substrate 4a and the second support portion supports the upper substrate 4b, the phasing guide 11 corresponds to the notches of the substrates 4a and 4b. The phases are aligned, and the three center alignment guides 10 are simultaneously in contact with the outer peripheral portions of the substrates 4a and 4b to perform center alignment. In this way, the positions of the substrates 4a and 4b are determined. In this state, the plunger 12 is inserted into the holder mounting portion 13, and the substrate holder 6 is disposed between the attaching plate 3 and the pressure receiving plate 2. Then, the affixing plate 3 moves up, pushes up the substrates 4a and 4b from below and presses them against the pressure receiving plate 2, and heats the adhesive 5 with a heater or the like to bond the two substrates 4a and 4b together. . In addition, the heating temperature by the affixing plate 3 is normally about 120 ° C., and is set to be equal to or lower than the heat resistance temperature of the adhesive 5.
[0018]
Note that when the attaching plate 3 pushes up the substrates 4a and 4b, the support portions 8 and 9 that support the substrates 4a and 4b have a hinge structure, so that they are flipped up by the outer edge portion of the attaching plate 3 to the outer periphery. Run away in the direction. And the front-end | tip part of the support parts 8 and 9 slips on the outer peripheral part of the affixing plate 3, and does not disturb the raise operation | movement of the affixing plate 3. FIG. The raised support portions 8 and 9 are restricted to the outer peripheral portion of the attaching plate 3 while the attaching plate 3 is raised, and the state is maintained, but the attaching plate 3 is lowered and the outer periphery of the plate 3 is maintained. When the part moves away from the tip parts of the support parts 8 and 9, the original horizontal state is restored.
[0019]
In the present embodiment as described above, the substrate holder 6 is an integral unit that holds both the two substrates 4a and 4b. Therefore, the mounting work of the substrates 4a and 4b is easy, and the number of members can be reduced as compared with the conventional example in which two substrate holders are prepared. Further, it is not necessary to align the substrate holders as in the conventional example. Further, since the substrate holder 6 is provided with the center alignment guide 10 and the phase alignment guide 11 separately from the support portions 8 and 9, the substrate holder 6 supports the substrates 4a and 4b and simultaneously performs center alignment and phase alignment. Two sheets can be put together. Moreover, since the substrate holder 6 can be inserted between the attaching plate 3 and the pressure receiving plate 2 while the substrates 4a and 4b are positioned, there is no fear that the substrates 4a and 4b are displaced, and the work can be performed. This can be done quickly and the working time can be shortened. According to the substrate bonding apparatus according to such an embodiment, the two substrates 4a and 4b can be bonded to each other in a reduced pressure atmosphere to suppress the generation of voids, and at the same time, the bonding of the substrates 4a and 4b can be accurately performed. Moreover, it becomes possible to carry out efficiently and productivity and reliability are greatly improved.
[0020]
Other Embodiment
The present invention is not limited to the above-described embodiment, and the configuration, material, number of arrangements, and the like of each member can be selected as appropriate, and the two substrates may have different diameter sizes. Further, in the case where the two substrates have orientation flats, an embodiment in which a phase alignment guide corresponding to the orientation flat is provided on the substrate holder is also included.
[0021]
【The invention's effect】
As described above, according to the substrate bonding apparatus of the present invention, the substrate holder is provided between the bonding plate and the pressure receiving plate, and the first support portion for supporting one substrate on the substrate holder; By providing a second support portion for supporting the other substrate and a center alignment guide for projecting the center of the substrate, the two substrates can be positioned at the same time, and quick bonding can be performed. Reliability is improved.
[Brief description of the drawings]
FIG. 1 is a front view of a representative embodiment according to the present invention.
FIG. 2 is a plan view of a main part of the embodiment.
FIG. 3 is a perspective view of a main part of the present embodiment.
4 is a cross-sectional view taken along line AA in FIG.
FIG. 5 is a side view of a first support portion in the present embodiment.
FIG. 6 is a side view of a second support portion in the present embodiment.
FIG. 7 is an enlarged front view of a main part of the present embodiment.
FIG. 8 is a front view illustrating a basic configuration of a conventional substrate bonding apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1,22 ... Vacuum container 2 ... Pressure receiving plate 3 ... Paste plate 4a ... Lower substrate 4b ... Upper substrate 5 ... Adhesive 6 ... Substrate holder 7 ... Opening portion 8 ... First support portion 9 ... Second Support section 10 ... Center alignment guide 11 ... Phase alignment guide 12 ... Plunger 13 ... Holder mounting section 17 ... Valve drive mechanism 18 ... Holder drive mechanisms 20, 23 ... Valve body 21 ... Upper substrate holder 33 ... Lower substrate holder

Claims (5)

A vacuum vessel capable of maintaining a reduced-pressure atmosphere is provided, and a pressure receiving plate and a pasting plate that can move in a direction in contact with and away from the pressure receiving plate are disposed oppositely in the vacuum vessel, and between these plates. The two substrates are held at a predetermined interval, an adhesive layer is provided on at least one of the opposing surfaces of the substrates, and the attachment plate moves to press the substrate against the pressure receiving plate. In a substrate bonding apparatus configured to bond a single substrate,
A ring-shaped or frame-shaped substrate holder having an opening through which the substrate can pass is provided between the attaching plate and the pressure receiving plate,
In the opening of the substrate holder, a first support portion that contacts and supports the outer periphery of the substrate on the side close to the pasting plate and a second support portion that contacts and supports the outer periphery of the substrate on the side close to the pressure receiving plate are installed. And
Further, the substrate holder is provided with a center alignment guide which comes into contact with the outer periphery of each substrate to bring out the center of the substrate. The substrate bonding apparatus according to claim 1, wherein the center alignment guide is movable in accordance with an outer peripheral portion of the substrate. 3. The substrate bonding apparatus according to claim 1, wherein when two substrates have notches or orientation flats, a phase alignment guide corresponding to the notches or orientation flats is provided on the substrate holder. The board | substrate bonding apparatus of any one of Claims 1-3 which arrange | positioned the holder attaching part which the said substrate holder can attach or detach between the said affixing plate and the said pressure receiving plate. The substrate bonding apparatus according to claim 1, wherein the first and second support portions are movable in the same direction as a movement direction of the attachment plate.

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