TW201736119A - 膜觸控感測器及其製造方法 - Google Patents
膜觸控感測器及其製造方法 Download PDFInfo
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- TW201736119A TW201736119A TW106100468A TW106100468A TW201736119A TW 201736119 A TW201736119 A TW 201736119A TW 106100468 A TW106100468 A TW 106100468A TW 106100468 A TW106100468 A TW 106100468A TW 201736119 A TW201736119 A TW 201736119A
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Abstract
本發明提供一種膜觸控感測器及其製造方法。膜觸控感測器包括分離層;保護層設置在分離層上;及電極圖案層,其係設置在保護層上並包含絕緣層,絕緣層係結合劑樹脂的固化層,結合劑樹脂包含(a-1)樹脂,其中至少一部分的酚性羥基或羧基係由酸可分解的基團保護、(a-2)丙烯酸系樹脂,其含有環氧基、及(a-3)丙烯酸系樹脂,其含有氧雜環丁烷基,使得能夠抑制可能發生在高溫沉積及退火製程中的熱損壞例如皺紋或絕緣層的裂痕,並顯著地減少在從載體基底剝離期間裂痕的發生率。
Description
本發明關於膜觸控感測器及其製造方法。
由於觸控輸入型態作為次世代輸入型態受到矚目,因而企圖於各種電子裝置中導入觸控輸入型態。因此,已踴躍地針對可適用於不同環境並做出正確觸控辨識之觸控感測器進行研究開發。
舉例來說,在具有觸控輸入型態顯示器之電子機裝置的情況中,達成超輕量、低電耗與攜帶性提升之超薄膜可撓式顯示器係作為次世代顯示器受到矚目,且因此需要發展可適用於這類顯示器之觸控感測器。
可撓式顯示器意味在可翹曲、折彎、或捲繞之可撓式基底上製造顯示器而不損失操作特性,且其技術已發展在例如可撓式LCD、可撓式OLED、電子紙及類似的形式之中。
為了使觸控輸入型態應用至這類可撓式顯示器,係要求具有優異的彎曲能力與復原力、與優良之可撓性及彈性的觸控感測器。
關於用以製造這類可撓式顯示器的膜觸控感測器,已提出包含配線埋在透光之樹脂基膜中的配線基底。
用以製造膜觸控感測器的方法包含:於載體基底上形成金屬配線之配線形成步驟、塗施透光的樹脂溶液至載體基底並乾燥藉此覆蓋金屬配線的積層製程、及將透光的樹脂溶液從載體基底剝離的剝離製程。
為了順利進行剝離製程,上述的製造方法使用一種方法,其中在基底的表面上預先形成諸如矽氧樹脂或氟樹脂之有機剝離劑;或例如類鑽(Diamond Like Carbon,DLC)薄膜、氧化鋯薄膜之無機剝離劑。然而,在以上方法中使用無機剝離劑的情況中,當使基膜及金屬配線從載體基底剝離時,基膜及金屬配線並未順利地從其上剝離,使得一部分的基膜及金屬配線殘留在載體基底上,且用作剝離劑的有機物質滲到基膜及金屬配線之表面上。
為了解決上述問題,韓國註冊專利公開號第1191865揭露一種方法,其中在製造具有金屬配線埋於其中之形式的可撓式基底的步驟中,藉由光或溶劑去除之犧牲層、金屬配線及聚合物材料(可撓式基底)係形成在載體基底上,且藉由利用光或溶劑移除之犧牲層,並藉此使金屬配線及聚合物材料(可撓式基底)從載體基底移除。
然而,上述方法具有在具有大尺寸的情況中,犧牲層在其移除製程中係難以移除、金屬配線係直接露出例如溶劑之液體、與多種類的基膜由於不可能進行高溫製程而可能不能使用的問題。
也有由於剝離期間供應至膜觸控感測器之壓力造成保護層、絕緣層、或類似物損壞的問題。
因此,本發明之一目的係提供膜觸控感測器,其包含用以覆蓋電極圖案層的保護層。
本發明之另一目的係提供膜觸控感測器,其能夠顯著地減少在從載體基底剝離期間裂痕的發生率。
此外,本發明之另一目的係提供膜觸控感測器,其由於包含具有優異之耐熱性的絕緣層,因此能夠抑制可能發生在高溫沉積及退火製程中的熱損壞例如皺紋或絕緣層的裂痕。
再者,本發明之另一目的係提供用以製造以上膜觸控感測器的方法。
本發明的以上目的將藉由以下特徵達成:
(1)一種膜觸控感測器,包括:一分離層;一保護層設置在該分離層上;及一電極圖案層,其係設置在該保護層上並包含一絕緣層,該絕緣層係一結合劑樹脂的一固化層,該結合劑樹脂包含(a-1)樹脂,其中至少一部分的一酚性羥基或一羧基係由一酸可分解的基團保護、(a-2)丙烯酸系樹脂,其含有一環氧基、及(a-3)丙烯酸系樹脂,其含有一氧雜環丁烷基。
(2)如以上(1)所述之膜觸控感測器,其中該(a-3)樹脂包含以式7表示的一重複單元如下: [式7](其中R1
、R2
及R3
係各自獨立地為氫或一甲基,且 R4
係從擇自由下式(1)至(3)所構成之群組的單體衍生出的結構: (其中R5
係從擇自由甲基丙烯酸((meth)acrylic acid)、2-(甲基)丙烯醯基羥乙基琥珀酸(2-(meth)acryloyloxyethyl succinate)、2-(甲基)丙烯醯氧乙基六氫苯二甲酸酯(2-(meth)acryloyloxyethyl hexahydrophthalate)、2-(甲基)丙烯醯基氧乙基酞酸酯(2-(meth)acryloyloxyethyl phthalate)、及2-(甲基)丙烯醯基羥乙基琥珀酸(2-(meth)acryloyloxyethyl succinate)所構成之群組的單體衍生出的結構, R6
係從以下式(4)表示之單體衍生出的結構,R7
係具有1至6個碳原子的伸烷基, R8
係具有1至6個碳原子的烷基,且 a=40至80 mol%,b=5至45 mol%,且c = 10至55 mol%。)
(3)如以上(1)所述之膜觸控感測器,其中該(a-3)樹脂具有5,000至30,000的重量平均分子量。
(4)如以上(1)所述之膜觸控感測器,其中相對於100重量份之全部該結合劑樹脂,該結合劑樹脂包含30至55重量份的該(a-1)樹脂、30至60重量份的該(a-2)樹脂、及1至25重量份的該(a-3)樹脂。
(5)如以上(1)所述之膜觸控感測器,其中電極圖案層包含:數個感測電極,其包含形成在一第一方向上的數個第一圖案與形成在一第二方向上的數個第二圖案;數個橋接電極,配置以彼此連接該些第二圖案的數個單元圖案,該些橋接電極係互相分開;及一絕緣層,設置在該些感測圖案與該些橋接電極之間。
(6)如以上(1)所述之膜觸控感測器,其中該絕緣層具有2.8至4.5 GPa的彈性模數。
(7)如以上(1)所述之膜觸控感測器,其中該絕緣層具有90%或更高的穿透率。
(8)如以上(1)所述之膜觸控感測器,更包括一基膜附加至該電極圖案層的一上側。
(9)一種用以製造一膜觸控感測器的方法,包括步驟:形成一分離層於一載體基底上;形成一保護層於該分離層上;形成一電極圖案層於該保護層上;及從該載體基底剝離該分離層,其中形成該電極圖案層的該步驟包括塗施一絕緣層形成組成,該絕緣層形成組成含有一結合劑樹脂,該結合劑樹脂包含(a-1)樹脂,其中至少一部分的一酚性羥基或一羧基係由一酸可分解的基團保護、(a-2)丙烯酸系樹脂,含有一環氧基、及(a-3)丙烯酸系樹脂,含有一氧雜環丁烷基。
(10)如以上(9)所述之用以製造該膜觸控感測器的方法,其中該絕緣層形成組成的該固化的進行包含預烘烤、曝光、顯影及後烘烤。
(11)如以上(10)所述之用以製造該膜觸控感測器的方法,其中該預烘烤係在80℃至140℃下進行20秒至1,000秒。
本發明的膜觸控感測器具有優異的耐熱性,因此能夠抑制可能發生在高溫沉積及退火製程中的熱損壞例如皺紋、裂痕、或諸如此類。藉此,係能夠達成由於進行高溫沉積及退火製程而具有較低抗耐性的電極圖案層。
本發明的膜觸控感測器能顯著地減少在從載體基底剝離期間裂痕的發生率。
本發明揭露一種膜觸控感測器及其製造方法。膜觸控感測器包括分離層;保護層設置在分離層上;及電極圖案層,其係設置在保護層上並包含絕緣層,絕緣層係結合劑樹脂的固化層,結合劑樹脂包含(a-1)樹脂,其中至少一部分的酚性羥基或羧基係由酸可分解的基團保護、(a-2)丙烯酸系樹脂,其含有環氧基、及(a-3)丙烯酸系樹脂,其含有氧雜環丁烷基,使得能夠抑制可能發生在高溫沉積及退火製程中的熱損壞例如皺紋或絕緣層的裂痕,並顯著地減少在從載體基底剝離期間裂痕的發生率。
以下將詳細說明本發明。
<膜觸控感測器>
本發明的膜觸控感測器包含一分離層、一保護層及一電極圖案層。
特別地,本發明的實施例將參照附隨的圖式詳細說明。
第1及2圖係繪示根據本發明的實施例之膜觸控感測器的示意剖面圖。
本發明的膜觸控感測器係藉由在一載體基底10上實行一製程以製備一層積板,並將製備的層積板分離自載體基底10所製造。一分離層20係形成以將層積板分離自載體基底10的一層膜。
分離層20用作覆蓋一電極圖案層40的一層膜,用以在分離自載體基底10之後保護電極圖案層40不會從分離層20移除。
分離層20可為一聚合物有機膜,並可由例如一聚合物製成,例如聚醯亞胺聚合物、聚乙烯醇聚合物、聚醯胺酸聚合物、聚醯胺聚合物、聚乙烯聚合物、聚苯乙烯聚合物、聚降冰片烯聚合物、苯基馬來醯亞胺共聚物、聚偶氮苯聚合物、聚苯肽醯胺聚合物、聚酯聚合物、聚甲基丙烯酸甲酯聚合物、聚芳基酸酯聚合物、桂皮酸鹽聚合物、香豆素聚合物、苄甲內醯胺聚合物、查耳酮聚合物、芳香乙炔聚合物,但不限於此。這些化合物可單獨使用或以其中的二或更多個的組合使用。
分離層20較佳係由具有1 N/25 mm之剝離強度的材料或上述的材料中對於載體基底10具有較小的剝離強度的材料製成,藉以能輕易地從載體基底10剝離,但不會從下述的一保護層30剝離。
分離層20較佳具有10至1000 nm的厚度,且更佳地具有50至500 nm的厚度。若分離層20厚度係小於10 nm,在塗施期間分離層20的均一性係下降,其使得電極圖案係不均勻地形成,其中由於局部性地提高剝離強度造成發生碎裂,或在從載體基底10分離之後膜觸控感測器的固化係不被控制。若其厚度超過1000 nm,剝離強度不會進一步地減少,且膜可撓性係降低。
保護層30係設置在分離層20上,且類似分離層20,覆蓋電極圖案層40以避免電極圖案層40被汙染,並避免電極圖案層40在從載體基底10分離期間破裂。
相關領域中已知的聚合物可用於保護層30但不限制於此,且保護層30可例如由有機絕緣層製成但不限制於此。
保護層30可由無機材料製成,且可例如為無機氧化物、無機氮化物、或類似物。舉例而言,無機氧化物可包含氧化矽、氧化鋁、氧化鈦、或類似物,且無機氮化物可包含氮化矽、氮化鈦、或類似物。以達到高穿透率的觀點中,較佳係使用氧化矽。
由無機材料製成的保護層30可具有優異的耐熱性以減少由於熱變化與熱壓造成的裂痕發生。藉此,係能夠達成藉由高溫沉積及退火製程而具有較低抗耐性之電極圖案層40.此外,保護層30具有優異的耐化學性以抑制分離層20的膨脹、剝離、或類似物。
電極圖案層40係設置在保護層30上。
電極圖案層40包含用以感測觸控的多數個感測電極,及複數個接墊電極。
感測電極及接墊電極可分別位在分離層上的感測區域與接墊區域上。然而,由於感測電極與接墊電極必須彼此電性連接,感測電極的至少一部分可位在接墊區域中,且接墊電極的至少一部分可位在感測區域中。
於此,感測區域意指對應於顯示部分的一區域,其上觸控係實行在膜觸控感測器中,且接墊區域意指對應於接墊部分的一區域。亦即,分離層上的感測區域意指對應於分離層上之顯示部分的一區域,且接墊區域意指對應於分離層上之接墊部分的一區域。
電極圖案層40的感測電極及接墊電極可使用任何材料而無限制,只要其是導電材料,並可例如擇自由銦錫氧化物(ITO)、銦鋅氧化物(IZO)、銦鋅錫氧化物(IZTO)、氧化鋅鋁(AZO)、氧化鋅鎵(GZO)、氧化氟化錫(FTO)、銦錫氧化物-銀-銦錫氧化物(ITO-Ag-ITO)、銦鋅氧化物-銀-銦鋅氧化物(IZO-Ag-IZO)、銦鋅錫氧化物-銀-銦鋅錫氧化物(IZTO-Ag-IZTO)、及氧化鋅鋁-銀-氧化鋅鋁(AZO-Ag-AZO)所構成之群組的金屬氧化物的材料製成;擇自由金(Au)、銀(Ag)、銅(Cu)、鉬(Mo)及銀-鈀-銅(APC)合金所構成之群組的金屬的材料製成;擇自由金、銀、銅、及鉛所構成之群組的金屬奈米線的材料製成;擇自由奈米碳管(CNT)及石墨稀(graphene)所構成之群組的碳基材料的材料製成;及擇自由聚(3,4-二氧乙基噻吩)(PEDOT)及聚苯胺(PANI)所構成之群組的導電聚合物材料的材料製成。這些化合物可單獨使用或以其中的二或更多個的組合使用,且較佳地,係使用銦錫氧化物。再者,可使用結晶銦錫氧化物與非結晶銦錫氧化物兩者。
感測電極的單元圖案可各自獨立地為例如三角形、四角形、五邊形、六邊形或七邊形或更多的多邊形。
此外,感測電極可包括規則圖案。規則圖案意指圖案的形式具有規律性。舉例來說,單元圖案可各自獨立地包括網形式,例如矩形或方形,或是如六邊形之形式的圖案。
再者,感測電極可包括不規則圖案。不規則圖案意指圖案的形式不具有規律性。
當感測電極是以例如金屬奈米線、碳基材料、聚合物材料及類似的材料製成時,感測電極可具有網狀結構。
當感測電極具有網狀結構時,由於訊號被依序傳送至彼此接觸的鄰近圖案,可達成具有高靈敏度的圖案。
感測電極的厚度未被特別限制,但考量膜觸控感測器的可撓性係以使用盡可能的薄膜為較佳。舉例來說,感測電極可具有100至500Å的厚度。同時,薄膜的一例子中,抗耐性的提高可能是問題,然而,由於本發明所提供的膜觸控感測器係具有上述作為蓋層之電極圖案層40,因此能夠藉由避免抗耐性提高來維持優異的敏感度。
為了感測觸控位置,電極圖案層40的感測電極係以兩個彼此不同的方向形成,且有必要讓在各方向上排列的電極彼此電性絕緣。為此,電極圖案層40包含一絕緣層43,藉此排列在任何一個方向上的電極能透過橋接電極彼此電性連接,同時維持與排列在不同方向上之電極的電性絕緣。
根據本發明之絕緣層43係為一結合劑樹脂的一固化層,結合劑樹脂包含:(a-1)樹脂,其中至少一部分的一酚性羥基或一羧基係由一酸可分解的基團保護;(a-2)丙烯酸系樹脂,含有一環氧基;及(a-3)丙烯酸系樹脂,含有一氧雜環丁烷基。
根據本發明之結合劑樹脂包含以下三個樹脂:(a-1)樹脂,其中至少一部分的一酚性羥基或一羧基係由一酸可分解的基團保護;(a-2)丙烯酸系樹脂,含有一環氧基;及(a-3)丙烯酸系樹脂,含有一氧雜環丁烷基。
藉由使用上述三個樹脂作為結合劑樹脂,由於優異的顯影性質,係能夠形成不會留下殘餘物的感光圖案。
彈性的絕緣層43可具有例如2.8至4.5 GPa的彈性模數。若其彈性模數係小於2.8 GPa,在形成電極期間皺紋可能發生在絕緣層43。若其彈性模數超過4.5 GPa,在從載體基底剝離期間可能發生裂痕。以上範圍中的彈性模數可例如藉由設定後烘烤溫度至150℃或更高獲得。在滿足優異之程度的皺紋抑制及剝離禁止結果的觀點上,其彈性模數較佳為3至4.2 GPa。
此外,根據本發明之絕緣層43具有非常高的穿透率。舉例來說,其穿透率可為90%或更高,較佳為95%或更多/高,且更佳地為97%或更高。以上範圍中的穿透率可例如藉由設定後烘烤溫度至150℃至250℃獲得。
此外,由於絕緣層43具有高的耐熱性,係能夠抑制熱損壞例如皺紋、裂痕、及色彩改變,其可能發生在形成例如ITO、或類似物之材料的感測電極期間的高溫沉積與退火製程中。此外,絕緣層43對於在形成感測電極的期間其可能被曝露出的多種溶劑例如蝕刻劑與顯影溶液具有優異的耐溶劑性,並對與絕緣層43接觸的感測電極及橋接電極具有優異的黏著性。
(a-1)樹脂在曝光期間進行因光酸產生劑賦予溶解性於固化圖案的功能。
(a-1)樹脂係包含一官能基的一樹脂,官能基中之一酚性羥基或一羧基的至少一部分係被一酸可分解的基團保護,且官能基並未被特別限制而可包含例如由包括以下式1、2、3及4表示的至少一個單體所聚合的樹脂: [式1](其中R係具有1至6個碳原子的烷基或酮基,並可以具有1至6個碳原子的烷基、具有1至6個碳原子的烷氧基、具有4至8個碳原子的環烷氧基、或具有6至16個碳原子的芳基取代。) [式2](其中R1
係氫或甲基,且R2
係具有1至6個碳原子的烷基或具有4至8個碳原子的環烷基。) [式3](其中R1
係氫或甲基,R2
係具有3至8個碳原子的伸烷基,且R3
係具有1至6個碳原子的烷基或具有4至8個碳原子的環烷基。) [式4](其中R1
係氫或甲基,R2
具有1至6個碳原子的伸烷基或具有4至8個碳原子的環伸烷基,且R3
係具有1至6個碳原子的烷基或具有4至8個碳原子的環烷基。)
在(a-1)樹脂中,藉由以式1至4表示之單體所形成的重複單元可適當地與根據可被共聚合之必要的其它單體的特定種類或類似物混合,因此其含量與混合比例並未特別限制。舉例來說,就形成期望的圖案而論,對於全部的(a-1)樹脂,所包含且聚合之重複單元的量較佳係20至60 mol%,且較佳為30至60 mol%。
(a-1)樹脂可更包含由具有酚性羥基或羧基之單體形成的重複單元,其並未以酸可分解的基團保護。此單體的例子可包含具有羧基之乙烯性不飽和單體。
具有羧基的乙烯性不飽和單體(b1)的具體實例可包括:單羧酸,諸如丙烯酸、甲基丙烯酸、巴豆酸等;二羧酸例如富馬酸、中康酸、衣康酸等等及其無水物;二羧酸的酸酐;及在其兩端處具有羧基和羥基(hydroxide group)之聚合物的單(甲基)丙烯酸酯,例如ω-羧基聚己內酯單(甲基)丙烯酸酯等等,且較佳為丙烯酸和甲基丙烯酸。這些化合物可單獨使用或以其中的二或更多個的組合使用。
(a-1)樹脂可同時更包括可與上述單體共聚合之至少一個額外的單體而被聚合。舉例來說,可使用芳族乙烯基化合物,例如苯乙烯、乙烯基甲苯、甲基苯乙烯、對氯苯乙烯、鄰-甲氧基苯乙烯、間-甲氧基苯乙烯、對甲氧基苯乙烯、鄰-乙烯基苄基甲基醚、間-乙烯基苄基甲基醚、對-乙烯基苄基甲基醚、鄰-乙烯基苄基縮水甘油醚、間-乙烯基苄基縮水甘油醚、對乙烯基苄基縮水甘油基醚等;N-取代的馬來醯亞胺化合物,例如N-環己基馬來醯亞胺、N-苄基馬來醯亞胺、N-苯基馬來醯亞胺、N-鄰羥基苯基馬來醯亞胺、N-間羥基苯基馬來醯亞胺、N-對羥基苯基馬來醯亞胺、N-鄰甲基苯基馬來醯亞胺、N-間甲基苯基馬來醯亞胺、N-對甲基苯基馬來醯亞胺、N-鄰甲氧基苯基馬來醯亞胺、N-間甲氧基苯基馬來醯亞胺、N-對甲氧基苯基馬來醯亞胺等;烷基(甲基)丙烯酸酯,例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸仲丁酯、(甲基)丙烯酸叔丁酯等;脂環族(甲基)丙烯酸酯,例如環戊基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯、2-甲基環己基(甲基)丙烯酸酯、三環[5.2.1.0.2.6]癸烷-8-基(甲基)丙烯酸酯、2-二環戊氧基乙基(甲基)丙烯酸酯、異冰片基(甲基)丙烯酸酯等;羥乙基(甲基)丙烯酸酯,例如2-羥乙基(甲基)丙烯酸酯、2-羥丙基(甲基)丙烯酸酯、4-羥基丁基(甲基)丙烯酸酯、2-羥基-3-苯氧丙基(甲基)丙烯酸酯、N-羥乙基丙烯醯胺等;芳基(甲基)丙烯酸酯,例如(甲基)丙烯酸苯酯、(甲基)丙烯酸苄酯等;不飽和的氧雜環丁烷化合物,例如3-(甲基丙烯醯氧基甲基)氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-3-乙基氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-2-三氟甲基氧雜環丁烷、3-(甲基丙烯醯氧基甲基)-2-苯基氧雜環丁烷、2-(甲基丙烯醯氧基甲基)氧雜環丁烷、2-(甲基丙烯醯氧基甲基)-4-三氟甲基氧雜環丁烷等。這些化合物可單獨使用或以其中的二或更多個的組合使用。
就改善剩餘膜比例並減少殘餘物而論,(a-1)樹脂較佳係具有5,000至35,000的重量平均分子量,且較佳具有5,000至20,000的重量平均分子量。
根據本發明之丙烯酸系樹脂(a-2)係含有環氧基的樹脂,並使樹脂組成能夠被熱固化,使得能夠形成具有更高耐受性的圖案。舉例來說,熱固化可在後烘烤製程中進行。
為了引入環氧基至丙烯酸系樹脂中,根據本發明之一實施例的丙烯酸系樹脂(a-2)可藉由包含以下式5所表示之單體所聚合: [式5](其中R1
係氫或甲基;R2
係具有1至6個碳原子的伸烷基;R3
及R4
係各自獨立地為氫或具有1至6個碳原子的烷基,或係彼此彼此連接以形成具有3至8個碳原子的環;且m係1至6之整數。)
以式5表示之單體包含鄰近R2
的氧原子。當鏈包含氧原子,單一鍵之旋轉的半徑係增加以降低玻璃轉變溫度,並藉此提升流動性且利於製程。
再者,在式5中,單體的長度可透過m的調整來控制,且形成穿過其中之圖案的斜度可被調整。在此例中,藉由降低圖案的斜度,係能夠避免沉積透光的電極期間固化膜之分層或裂痕之發生。
此外,作為本發明之一實施例,根據本發明之(a-2)樹脂可藉由包含以下式6所表示之單體所聚合,以使環氧基可被引入其中: [式6](其中R1
係氫或甲基;R2
係具有1至6個碳原子的伸烷基;R3
及R4
係各自獨立地為氫或具有1至6個碳原子的烷基,或係彼此連接以形成具有3至8個碳原子的環)。
以式6表示的單體具有提升將被聚合之樹脂中的穿透率的優點。
在(a-2)樹脂中,含有環氧基的重複單元,舉例來說,藉由以式5或6表示之單體形成的重複單元可適當地與根據可被共聚合之必要的其它單體的特定種類或類似物混合,因此其含量與混合比例並未特別限制。舉例來說,就提升透光性與製程中的容易度,及盡量增大藉由調整圖案的斜度避免在沉積透光的電極期間固化膜中發生裂痕的效果而論,對於全部的(a-2)樹脂,所包含且聚合之重複單元的量較佳係5至60 mol%。
(a-2)樹脂可藉由使用以式5或6表示之單體以外的相關領域中已知之能形成丙烯酸系樹脂的單體聚合。可使用(a-1)樹脂中可被共聚合的單體例子作為特定例子的單體。
就提升顯影性質並減少殘餘物而論,含有環氧基的(a-2)丙烯酸系樹脂較佳具有5,000至40,000的重量平均分子量,且較佳具有15,000至30,000的重量平均分子量。
根據本發明之含有氧雜環丁烷基的(a-3)丙烯酸系樹脂係用以提升顯影性質及老化穩定性。
根據本發明之含有氧雜環丁烷基的(a-3)丙烯酸系樹脂可包含以下式7表示的重複單元: [式7](其中R1
、R2
及R3
係各自獨立地為氫或甲基,且R4
係從擇自由下式(1)至(3)所構成之群組的單體衍生出的結構: (其中R5
係從擇自由甲基丙烯酸((meth)acrylic acid)、2-(甲基)丙烯醯基羥乙基琥珀酸(2-(meth)acryloyloxyethyl succinate)、2-(甲基)丙烯醯氧乙基六氫苯二甲酸酯(2-(meth)acryloyloxyethyl hexahydrophthalate)、2-(甲基)丙烯醯基氧乙基酞酸酯(2-(meth)acryloyloxyethyl phthalate)、及2-(甲基)丙烯醯基羥乙基琥珀酸(2-(meth)acryloyloxyethyl succinate)所構成之群組的單體衍生出的結構, R6
係從以下式(4)表示之單體衍生出的結構,R7
係具有1至6個碳原子的伸烷基, R8
係具有1至6個碳原子的烷基,且 a = 40至80 mol%,b = 5至45 mol%,且c = 10至55 mol%)。
就減少殘餘物及由於增進的顯影性質而提升老化穩定性而論,含有氧雜環丁烷基的(a-3)丙烯酸系樹脂具有5,000至30,000之重量平均分子量為較佳,且較佳具有8,000至20,000之重量平均分子量。
當以上述三種樹脂混合根據本發明之結合劑樹脂,可顯著地提升顯影性質而不降低圖案化能,並藉此減少殘餘物。
在根據本發明之結合劑樹脂中,三種樹脂的混合比例並未被特別限制,但就提升剩餘膜比例及老化穩定性而論,所包含之(a-1)、(a-2)及(a-3)樹脂係以對於100重量份之全部的結合劑樹脂,(a-1)樹脂為30至55重量份,(a-2)樹脂為30至60重量份,且(a-3)樹脂為1至25重量份的混合重量比例為較佳 。
絕緣層43的厚度並未特別限制,且一般係在0.1至100 µm的範圍內,較佳在0.5至50 µm的範圍內,且更佳在0.5至30 µm的範圍內。
感測電極可包含形成在第一方向上的第一圖案41、藉由其分離的單元圖案所形成在第二方向上的第二圖案42、及連接第二圖案其被分離之單元圖案的橋接圖案44。
絕緣層43可以島形式只位在橋接圖案44與第一圖案41的交錯部分處,並可以層形成位在包含橋接圖案44與第一圖案41之交錯部分的層處。當絕緣層43係以層形式設置時,橋接圖案44可透過形成在絕緣層43中的接觸孔洞45連接至第二圖案42。
圖案的積層順序並未特別限制,並可依序以第一圖案41與第二圖案42、絕緣層43、及橋接圖案44的順序積層。或者,係依序以橋接圖案44、絕緣層43、及第一圖案41與第二圖案42的順序積層。
本發明的膜觸控感測器可附加至電極圖案層40上側的基膜50.
基膜50可使用由廣泛使用在相關領域中的任何材料但不特別限制於其製成的透光膜。舉例來說,基膜可由擇自由以下物質所構成之群組其中任一者製成:纖維素酯(例如:三乙酸纖維素、丙酸纖維素、丁酸纖維素、醋酸丙酸纖維素及硝化纖維素)、聚醯亞胺、聚碳酸酯、聚酯(例如:聚對酞酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸-1,4-環己二甲酯、聚乙烯1,2-二苯氧乙烷-4,4’-乙二酸酯以及聚對苯二甲酸丁二酯)、聚苯乙烯(例如:間規聚苯乙烯)、聚烯(例如:聚丙烯、聚乙烯以及聚甲基戊烯)、聚碸、聚醚碸、聚芳酯、聚醚醯亞胺、聚甲基丙烯酸甲酯、聚醚醚酮、聚乙烯醇以及聚氯乙烯,其可單獨使用或作為混合物使用。
再者,透光膜可為等向性膜或延遲膜。
當透光膜係等向性膜時,平面延遲(Ro,Ro = [(nx - ny) × d],nx及ny表示膜平面主要折射率(平面折射率),nz表示膜之厚度方向的折射率,且d表示薄膜的厚度)為40 nm或更小,且較佳為15 nm或更小,且厚度方向的延遲(Rth, Rth = [(nx + ny)/2 - nz] × d)範圍從-90 nm至+75nm,較佳地,為-80 nm至+60 nm,且更佳地為-70 nm至+45 nm。
延遲膜是以包含聚合物膜之單軸延伸或雙軸延伸、聚合物塗佈及液晶塗佈的製程所製造的膜,且通常用於改善或控制顯示器中之例如視角補償、色覺改良、漏光改良、顏色調整的光學特性。
此外,也可使用偏光片作為基膜50.
偏光板可為其中偏光器保護膜附加在聚乙烯醇偏光器的一個或兩個表面的型態。
此外,可使用保護膜作為基膜50.
保護膜可以是其中黏著層形成在由聚合物樹脂製成之膜的至少一表面上的膜、或者是具有自我黏著性(例如聚丙烯)的膜、且可被用於保護膜觸控感測器的表面並改善可工作性。
基膜50較佳具有85%或更高,且較佳為90%或更高的光穿透率。此外,由JIS K7136來測量,基膜50較佳具有10%或更低,且較佳為7%或更低的總霧度值。
基膜50的厚度並未限制,但較佳為30至150 µm,且更佳為70至120 µm。
基膜50可透過感壓黏著層60被附加。
感壓黏著層60意指黏著層或接合層。
可使用黏著劑或接合劑、相關領域中已知的任何一般的黏著劑接合劑,而未特別限制於此。舉例來說,可使用熱固或光可固化的黏著劑或接合劑例如聚酯、聚醚、胺甲酸乙酯(urethane)、環氧、矽氧樹脂(silicone)、丙烯酸系黏著劑。
本發明的膜觸控感測器可更包含鈍層70在電極圖案層40與基膜50在之間。
鈍層70用以避免電極圖案層40被外部環境的水、空氣等等汙染。
鈍層70可使用例如為氧化矽金屬氧化物、含有丙烯酸系樹脂的透光的絕緣層形成組成、熱固樹脂組成、或類似物形成期望的圖案。
鈍層可具有適當的厚度,例如2,000 nm或更小。因此,舉例來說,其厚度可為0至2,000 nm。
<影像顯示裝置>
再者,本發明具有提供包含上述之膜觸控感測器的影像顯示裝置的目的。
本發明的膜觸控感測器可應用至一般的液晶顯示裝置,以及,其它不同的影像顯示裝置例如電激發光顯示裝置、電漿顯示裝置、電激發光發射顯示裝置、或類似物。
再者,本發明的膜觸控感測器具有優異的彎曲性質,使得影像顯示裝置可為可撓式影像顯示裝置。
<用以製造i膜觸控感測器的方法>
再者,本發明提供用以製造膜觸控感測器的方法。
第3及4圖繪示根據本發明之一實施例的用以製造膜觸控感測器的方法的製程的示意圖,其繪示當包含以下描述之形成鈍層及附加基膜的步驟之一實施例,但本發明並不限於此。
之後,本發明之用以製造膜觸控感測器的方法將參照附隨的第3及4圖詳細說明。
首先,如第3(a)圖中所繪示,分離層20係形成在載體基底10上。
載體基底10只要其提供適當的強度而對熱與化學處理上毫無影響,使得在製程期間基底不會輕易地被彎曲或歪曲但可被固定,可由任何材料製成而未特別限制。舉例來說,可使用玻璃、石英、矽晶圓、SUS、等等,並較佳使用玻璃。
分離層20可由上述的聚合物材料製成。
當電極圖案層40係由金屬材料時,從載體基底10剝離可能為困難的。然而,在形成分離層20期間,由於分離層20可輕易地從載體基底10剝離,因此能夠由於減低在從載體基底10剝離期間施加至觸控感測器的撞擊,而減少例如在電極圖案層40中之損壞的問題。
在將剝離期間造成之物理損壞最少化之觀點中,分離層20對於載體基底10較佳具有1 N/25 mm或更低的剝離強度。
形成分離層20的方法並未特別限制,但可包含相關領域中已知的任何一般方法,例如,狹縫塗佈法、刮刀塗佈法、旋塗法、流延法、微型凹版塗佈法、凹版塗佈法、棒塗法、輥塗法、線棒塗佈法、浸塗法、噴塗法、網印刷法、凹版印刷法、彈性印刷法、平版印刷法、噴墨塗佈法、分配器印刷法、噴嘴塗佈法、毛細管塗佈法、或諸如此類。
在藉由上述製程形成分離層20之後,發明的方法可更進行額外的固化製程。
固化分離層20的方法並未特別限制,但可包含光固化製程、熱固化製程或這些製程兩者。在實行光固化製程與熱固化製程兩者的一例子中,其順序並未特別限制。
接著,如第3(b)圖中所繪示,保護層30形成在分離層20上。
保護層30可由上述的材料製成,且形成其的方法並未特別限制,但可包含相關領域中已知的任何一般方法,例如物理沉積法、化學沉積法、電漿沉積法、電漿聚合法、熱沉積法、,熱氧化法、兩性氧化法、集離子束沉積法、網印刷法、凹版印刷法、彈性印刷法、平版印刷法、噴墨塗佈法、分配器印刷法、及諸如此類。
然後,如第3(c)圖中所繪示,電極圖案層40形成在保護層30上。
形成電極圖案層40的步驟包括塗施一絕緣層形成組成,其含有一結合劑樹脂。結合劑樹脂包含:(a-1)一樹脂,其中至少一部分的一酚性羥基或一羧基係由一酸可分解的基團保護;(a-2)一丙烯酸系樹脂,其含有一環氧基;及(a-3)一丙烯酸系樹脂,其含有一氧雜環丁烷基。
結合劑樹脂可使用上述的結合劑樹脂。
根據本發明之結合劑樹脂的含量並未被特別限制,只要其能夠完全表現出其功效,但其所包含的量可對於組成的總重量為例如5至50重量百分比(wt. %),且較佳為10至40 wt. %。當所包含之結合劑樹脂的含量係在上述範圍內時,會有可最大化提升敏感度及分解能力同時具有適當之黏度的效果的優點。
根據本發明之絕緣層形成組成可更包含光酸產生劑與溶劑。
光酸產生劑是藉由照射活性光化射線或放射線來產生酸的化合物。
光酸產生劑的種類並沒有特別限定,但可包括例如重氮鹽類、鏻鹽類、鋶鹽類、錪鹽類、磺醯亞胺鹽類、磺酸肟類、重氮二碸類、二碸類、鄰硝基苯磺酸鹽類、三嗪類化合物。這些化合物可單獨使用或以其中的二或更多個的組合使用。
光酸產生劑的含量並未被特別限制,只要其能夠完全表現出其功效,但其所包含的量可對於100重量份之結合劑樹脂為例如0.1至20重量份,且較佳為0.5至10重量份。當所包含之光酸產生劑的含量係在上述範圍內時,會有可達成在塗施樹脂組成期間由於酸的催化作用造成的化學變化可充足地發生及均勻應用的優點。
在本發明中,樹脂組成如必要可更包含與光酸產生劑一起的敏化劑。
增感劑是促進光酸產生劑的分解以提昇敏感度的成分。根據本發明的敏化劑並沒有特別限定,但可包括例如多核芳族類化合物、呫噸類、氧葱酮類、花青類、氧喏類、噻嗪類、吖啶類、吖啶酮類、蒽醌類、方酸類、苯乙烯類、双苯乙烯類、香豆素類、蒽類化合物。這些化合物可單獨使用或以其中的二或更多個的組合使用。
根據本發明之敏化劑較佳係以下方式8所表示的化合物: [式8](其中R1
與R2
係各自獨立地為具有1至6個碳原子的烷基)
以式8表示的敏化劑較佳係以下方式9至11所表示的化合物。 [式9][式10][式11]
根據本發明之敏化劑的含量並未被特別限制,只要其能夠完全表現出其功效,但其所包含的量可對於100重量份之結合劑樹脂為例如0.01至60重量份,且較佳為0.5至10重量份。當所包含之敏化劑的含量係在上述範圍內時,會有可最大化光譜致敏作用造成之敏感度及穿透率提升的效果的優點。
溶劑的種類並沒有特別限定,但只要其具有適合的乾燥速度且能溶解上述成分,並在溶劑蒸發後可形成均勻且平滑的塗膜,可使用任何溶劑。
溶劑的具體例可包括,列舉醚類、醋酸類、酯類、酮類、醯胺類、內酯類等,其可單獨使用或以其中的二或更多個的組合使用。
醚類的具體例可包含乙二醇單烷基醚,例如乙二醇單甲醚、乙二醇單乙醚、乙二醇單丙醚、乙二醇單丁醚等等;乙二醇二烷基醚,例如乙二醇二甲醚、乙二醇二乙醚、乙二醇二丙醚等等;丙二醇單烷基醚,例如丙二醇單甲醚、丙二醇單乙醚、丙二醇單丙醚、丙二醇單丁醚等等;丙二醇二烷基醚,例如丙二醇二甲醚、丙二醇二乙醚、二乙二醇單甲醚、二乙二醇單乙醚等等;二乙二醇二烷基醚,例如二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇乙基甲醚等等;二丙二醇單烷基醚,例如二丙二醇單甲醚、二丙二醇單乙醚、二丙二醇單丙醚、二丙二醇單丁醚等等;以及二丙二醇二烷基醚,例如二丙二醇二甲醚、二丙二醇二乙醚、二丙二醇乙基甲醚,或類似物。
醋酸類的具體例可包含乙二醇單烷基醚醋酸酯,例如乙二醇單甲醚醋酸酯、乙二醇單乙醚醋酸酯、乙二醇單丙醚醋酸酯、乙二醇單丁醚醋酸酯等等;丙二醇單烷基醚醋酸酯例如丙二醇單甲醚醋酸酯、丙二醇單乙醚醋酸酯、丙二醇單丙醚醋酸酯、丙二醇單丁醚醋酸酯等等;二乙二醇單烷基醚醋酸酯例如二乙二醇單甲醚醋酸酯、二乙二醇單乙醚醋酸酯、二乙二醇單丙醚醋酸酯、二乙二醇單丁醚醋酸酯等等;二丙二醇單烷基醚醋酸酯,例如二丙二醇單甲醚醋酸酯、二丙二醇單乙醚醋酸酯、二丙二醇單丙醚醋酸酯、二丙二醇單丁醚醋酸酯等等;丙二醇二烷醋酸酯,例如丙二醇甲基乙基醋酸酯,或類似物。
酯類的具體例可包含乳酸甲酯、乳酸乙酯、乳酸正丙酯、乳酸異丙酯、乳酸正丁酯、乳酸異丁酯、乳酸正戊酯、乳酸異戊酯、醋酸正丁酯、醋酸異丁酯、醋酸正戊酯、醋酸異戊酯、醋酸正己酯、2-乙基己基醋酸酯、丙酸乙酯、丙酸正丙酯、丙酸異丙酯、丙酸正丁酯、丙酸異丁酯、丁酸甲酯、丁酸乙酯、丁酸正丙酯、丁酸異丙酯、丁酸正丁酯羥基醋酸乙酯、2-羥基-2-甲基丙酸乙酯、2-羥基-3-甲基丁酸乙酯、甲氧基醋酸乙酯、乙氧基醋酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、3-甲氧基丁基醋酸酯、3-甲基-3-甲氧基丁基醋酸酯、3-甲基-3-甲氧基丁基丙酸酯、3-甲基-3-甲氧基丁基丁酸酯、乙醯醋酸甲酯、乙醯醋酸乙酯、纖維甲酯、纖維乙酯、二乙二醇甲基乙基酯,或類似物。
酮類的具體例可包含甲乙酮、甲丙酮、甲基正丁酮、甲基異丁基酮、2-庚酮、3-庚酮、4-庚酮、環己酮,或類似物。
醯胺類的具體例可包含N-甲基甲醯胺、N,N-二甲基甲醯胺、N-甲基乙醯胺、N,N-二甲基乙醯胺、N-甲基吡咯烷酮,或類似物。
內酯類的具體例可包含γ-丁內酯。
在絕緣層的可應用性以及膜厚度的均勻性而論,較佳使用丙二醇甲醚醋酸酯、二乙二醇甲基乙基酯或其混合物。
溶劑的含量並未被特別限制,只要其能夠完全表現出其功效,但其所包含的量可對於組成的總重量為例如40至90 wt. %,且較佳為50至80 wt. %。當所包含之溶劑的含量係在40 wt. %或更多,但少於或等於90 wt. %的範圍內時,由於其固形物的含量與黏度可維持在適當的水準,會有提升塗佈性質的優點。
同時,在不脫離本發明目的的範圍內,除了溶劑,根據本發明之絕緣層形成組成可更包含添加劑例如相關領域中一般使用的鹼性化合物、界面活性劑、黏著促進劑、熱交聯劑、光穩定劑、光固化促進劑、光暈防止劑(調平劑)、及消泡劑。
鹼性化合物的種類並未特別限制,且可選擇並使用用作化學增輻型光阻之化合物的任何一個。其具體例可包含脂肪族胺、芳香族胺、雜環胺、四級氫氧化銨、羧酸的四級銨鹽,或類似物。這些化合物可單獨使用或以其中的二或更多個的組合使用。
脂肪族胺的具體例可包括三甲胺、二乙胺、三乙胺、二-正丙胺、三-正丙胺、二-正戊胺、三-正戊胺、二乙醇胺、三乙醇胺、二環己胺、二環己基甲胺,或類似物。
芳香族胺的具體例s可包括苯胺、苯甲胺、N,N-二甲基苯胺、二苯胺,或類似物。
雜環胺的特定範例可包括吡啶、2-甲基吡啶、4-甲基吡啶、2-乙基吡啶、4-乙基吡啶、2-苯基吡啶、4-苯基吡啶、N-甲基-4-苯基吡啶、4-二甲基胺基吡啶、咪唑、苯並咪唑、4-甲基咪唑、2-苯基苯並咪唑、2,4,5-三苯基咪唑、尼古丁、菸鹼酸、菸鹼酸醯胺、喹啉、8-氧基喹啉、吡嗪、吡唑、噠嗪、嘌呤、吡咯啶、哌啶、1,5-二氮雜雙環[4.3.0]-5-降伯烯、1,8-二氮雜雙環[5.3.0]-7-十一烯,或類似物。
四級氫氧化銨的具體例可包括四甲基氫氧化銨、四乙基氫氧化銨、四-正丁基氫氧化銨、四-正己基氫氧化銨,或類似物。
羧酸的四級銨鹽的具體例可包括四甲基醋酸銨、四甲基苯甲酸銨、四-正丁基醋酸銨、四-正丁基苯甲酸銨,或類似物。
鹼性化合物的含量在能夠進行其功效的範圍內並不特別限制。舉例來說,所包含之鹼性化合物可對於100重量份之結合劑樹脂為0.001至1重量份的量,且較佳為0.005至0.5重量份的量。當所包含之鹼性化合物的含量係對於100重量份之結合劑樹脂為0.001或更高之重量份,但少於或等於1重量份的範圍內時,會有可形成具有利之耐熱性與耐溶劑性的介層絕緣層的優點。
界面活性劑係提升絕緣層形成組成之黏著性的成分。
界面活性劑的類型不特別受限,但可包括各種界面活性劑,例如含氟界面活性劑、非離子性界面活性劑、陽離子界面活性劑、陰離子界面活性劑以及矽氧樹脂界面活性劑,或諸如此類,其單獨或以其二或更多個組合而使用。界面活性劑的種類並未特別限制,並可使用各種界面活性劑例如含氟界面活性劑、非離子性界面活性劑、陽離子界面活性劑、陰離子界面活性劑及矽氧樹脂界面活性劑。這些界面活性劑可單獨使用或以其中的二或更多個的組合使用。
含氟界面活性劑的具體例子可包含MAGAFAC F171、F172、F173、F176、F177、F141、F142、F143、F144、R30、F437、F475、F479、F482、F554、F780及F781(商標名,由DIC公司製造)、FLUORAD FC430、FC431及FC171(商標名,由Sumitomo 3M股份有限公司製造)、SURFLON S-382、SC-101、SC-103、SC-104、SC-105、SC1068、SC-381、SC-383、S393及KH-40(商標名,由Asahi Glass股份有限公司製造)、SOLSPERSE 20000(商標名,由Lubrizol Japan Limited製造)。
非離子界面活性劑的具體例可包括:甘油、三羥甲丙烷及三羥甲乙烷,及其乙氧基化物或丙氧基化物(例如,甘油丙氧基化物或甘油乙氧基化物)等等;例如PLURONIC L10、L31、L61、L62、10R5、17R2以及25R2,以及TETRONIC 304、701、704、901、904以及150R1(商標名,由BASF製造)之聚氧乙烯月桂醚、聚氧乙烯硬脂醚、聚氧乙烯油烯醚、聚氧乙烯辛基苯醚、聚氧乙烯壬基苯醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯、去水山梨醇脂肪酸酯,或諸如此類。
陽離子界面活性劑的具體例可包含酞青素修飾的化合物,例如EFKA-745(商標名,由Morishita &股份有限公司製造)、有機矽氧烷聚合物,例如KP341(商標名,由Shin-Etsu化學股份有限公司製造)、(甲基)丙烯酸(共)聚合物,例如POLYFLOW編號75、編號90、編號95(商標名,由Kyoeisha化學股份有限公司製造)、W001(商標名,由Yusho化學股份有限公司製造)、或類似物。
陰離子界面活性劑的具體例可包括W004、W005、W017(商標名,由Yusho股份有限公司製造)。
矽氧樹脂界面活性劑的具體例例可包括TORAY SILICONE DC3PA、SH7PA、DC11PA、SH21PA、SH28PA、SH29PA、SH30PA以及SH8400(商標名,由Dow Corning Toray股份有限公司製造)、TSF-4440、4300、4445、4460及4452(商標名,由Momentive Performance Materials Inc.製造)、KP341、KF6001以及KF6002(商標名,由Shin-Etsu化學股份有限公司製造)、BYK307、323以及330(商標名,由BYK Chemie公司製造)、或類似物。
界面活性劑的含量在能夠進行其功效的範圍內並不特別限制。舉例來說,所包含之界面活性劑可對於100重量份之結合劑樹脂為0.01至5重量份的量,且較佳為0.05至3重量份的量。當所包含之界面活性劑的含量係對於100重量份之結合劑樹脂為0.01或更高之重量份,但少於或等於5重量份的範圍內時,會有可最大化提升黏著性之效果的優點。
黏著促進劑可提升與矽化合物及金屬的黏著性,矽化合物例如為矽、氧化矽、氮化矽等等,金屬例如金、銅、鋁等等,並對調整錐角係有用的。
黏著促進劑的種類並未特別限制,且其具體例可包含矽烷耦合劑或硫醇化合物,且較佳為矽烷耦合劑。
矽烷耦合劑的種類並未特別限制,且其具體例可包含γ-胺基丙基三甲氧基矽烷、γ-胺基丙基三乙氧基矽烷、γ-環氧丙氧基丙基三烷氧基矽烷、γ-環氧丙氧基丙基烷基二烷氧基矽烷、γ-甲基丙烯醯基氧基丙基三烷氧基矽烷、γ-甲基丙烯醯基氧基丙基烷基二烷氧基矽烷、γ-氯丙基三烷氧基矽烷、γ-巰基丙基三烷氧基矽烷、β-(3,4-環氧環己基)乙基三烷氧基矽烷、乙烯基三烷氧基矽烷、或類似物,較佳為γ-環氧丙氧基丙基三烷氧基矽烷或γ-甲基丙烯醯基氧基丙基三烷氧基矽烷,且更佳為γ-環氧丙氧基丙基三烷氧基矽烷。這些化合物可單獨使用或以其中的二或更多個的組合使用。
黏著促進劑的含量在能夠進行其功效的範圍內並不特別限制。舉例來說,所包含之黏著促進劑可對於100重量份之結合劑樹脂為0.1至20重量份的量,且較佳為0.5至10重量份的量。當所包含之黏著促進劑的含量係對於100重量份之結合劑樹脂為0.1或更高之重量份,但少於或等於20重量份的範圍內時,會有可最大化提升與絕緣層的黏著性及調變錐角之效果的優點。
熱交聯劑係用作組成的成分,其能使當形成絕緣層時經由UV光照射及熱處理的交聯反應能平順地發生,並藉此提升耐熱性。
熱交聯劑的種類並未特別限制,且其具體例可包含聚丙烯酸酯樹脂、環氧樹脂、酚樹脂、三聚氰胺樹脂、有機酸、胺化合物、無水化合物、或類似物。這些樹脂及化合物可單獨使用或以其中的二或更多個的組合使用。
熱交聯劑的含量在能夠進行其功效的範圍內並不特別限制。舉例來說,所包含之熱交聯劑可對於100重量份之結合劑樹脂為0.01至5重量份的量,且較佳為0.1至3重量份的量。當所包含之熱交聯劑的含量係對於100重量份之結合劑樹脂為0.01或更高之重量份,但少於或等於5重量份的範圍內時,會有可最大化提升耐熱性之效果的優點。
光穩定劑係提升絕緣層形成組成之耐光性的成分。
光穩定劑的種類並未特別限制,且其具體例可包含苯並三唑、三嗪、二苯基甲酮、受阻胺基醚及受阻胺化合物等等。這些化合物可單獨使用或以其中的二或更多個的組合使用。
光穩定劑的含量在能夠進行其功效的範圍內並不特別限制。舉例來說,所包含之光穩定劑可對於100重量份之結合劑樹脂為0.01至5重量份的量,且較佳為0.1至3重量份的量。當所包含之光穩定劑的含量係對於100重量份之結合劑樹脂為0.01或更高之重量份,但少於或等於5重量份的範圍內時,會有可最大化提升耐光性之效果的優點。
絕緣層形成組成的供應方法並未特別限制,並可包含例如使用狹縫噴嘴的塗佈方法例如噴塗法、輥塗法、使用噴嘴的或放電塗佈法等等、旋轉塗施法例如中央滴旋法、擠塗法、或棒塗方法等等,其二或更多個之組合可在塗佈期間被使用。
供應之膜的厚度係根據供應方法、組成中之固含量的濃度、其黏度、及諸如此類,但通常可供應使得在乾燥之後膜係具有0.5至100 μm的厚度。
供應之組成的固化可包含例如預烘烤步驟、選擇性曝光及顯影絕緣層形成組成以形成圖案的步驟、及後烘烤步驟。
預烘烤是藉由應用真空、紅外線或熱來揮發溶劑的製程,以在形成塗膜之後獲得沒有流動性的塗層薄膜。
加熱條件係取決於個別成分的種類或其組合,例如,但可以80至140℃的溫度進行20至1,000秒,較佳以90至130℃的溫度進行60至300秒,且更佳以100至120℃的溫度進行60至180秒。當預烘烤的加熱條件係在上述範圍中時,係能夠得到和緩的圖案角度(約30°至45°)及優異的敏感度(例如,40 mJ或更低)。
接著,選擇性曝光製程可藉由照射準分子雷射束、遠UV光、UV光、可見光、電子束、X光或g射線(波長:436 nm)、i射線(波長:365 nm)、及h射線(波長:405 nm)、或其組合來進行。曝光可藉由接觸式、接近式或投射式曝光方法、及諸如此類來進行。
在本發明中,使用鹼性顯影劑進行顯影之後,係將絕緣層形成組成進行後烘烤(高溫燒成)步驟。熱交聯劑與類似物係供應至用以高溫燒成的絕緣層形成組成中作為成分。
後烘烤步驟可使用加熱設備例如熱板或烘箱於150至350℃進行30分鐘至3小時,較佳地於180℃至250℃進行20分鐘至50分鐘,且更佳於180至210℃進行20鐘至40分鐘。在完整的加熱處理之後,可獲得完全交聯及固化的圖案。當預烘烤的加熱條件係在上述範圍中時,係能夠得到具有最佳化水準之彈性模數及高穿透率的絕緣層。
若必要,感光樹脂組成的固化可藉由更包括在後烘烤之前的中間烘烤來進行。在此情況中,圖案角度的調整與敏感度可更容易地實行。
中間烘烤可以110至180℃進行5分鐘至30分鐘,且較佳以130至150℃進行5分鐘至10分鐘。當中間烘烤的執行條件係在上述範圍內時,圖案角度之調整與提升敏感度之效果可最大化。
更具體而言,形成電極圖案層40的步驟更包含形成感測電極的步驟。
其形成順序並未特別限制,並可依第一電極41與第二電極42、絕緣層43與橋接電極44此順序形成。或者,可依橋接電極44、絕緣層43與第一電極41及第二電極42此順序形成。
感測電極可以根據與以上述材料來形成保護層30之方法相同的方法形成。
在確保電極圖案層40具有低抗耐性的觀點中,電極圖案層40較佳地係通過150℃至250℃的高溫製程形成。具體而言,舉例來說,電極圖案層40可藉由在150℃至250℃的沉積製程形成,或可以室溫沉積及在150℃至250℃的加熱處理形成,但不限於此。
接著,如在第4(f)圖中所繪示,分離層20從載體基底10剝離。
透過上述製程可獲得層積板,其中分離層20、保護層30、電極圖案層40與絕緣層43係依此序積層在載體基底10上。然後,分離層20係從載體基底10剝離,如此層積板可用作膜觸控感測器。
本發明之製造膜觸控感測器的方法可更包含如第4(d)及4(e)圖中所繪示之附加基膜50在電極圖案層40上的步驟。具體而言,發明的方法可更包含形成感壓黏著層60在電極圖案層40上的步驟,及附加基膜50在感壓黏著層60上的步驟。
在此情況中,剝離製程可在附加基膜50之前或之後進行。第4圖繪示基膜50附加之後進行剝離製程的情況。
感壓黏著層60可由上述黏著劑或接合劑製成,並可藉由使用例如狹縫塗佈法、刮刀塗佈法、旋塗法、流延法、微型凹版塗佈法、凹版塗佈法、棒塗法、輥塗法、線棒塗佈法、浸塗法、噴塗法、網印刷法、凹版印刷法、彈性印刷法、平版印刷法、噴墨塗佈法、分配器印刷法、噴嘴塗佈法、毛細管塗佈法、或諸如此類的方法塗施黏著劑或接合劑至電極圖案層40,並然後將其乾燥且固化來形成。
在以抑制剝離製程期間膜觸控感測器中之裂痕的發生的觀點中,感壓黏著層60較佳具有上述範圍中的彈性模數與剝離強度。
此外,發明的方法可更包含如在第3(c)圖中所繪示之形成鈍層70在電極圖案層40上的步驟。
鈍層70可以根據與以上述材料來形成保護層30之方法相同的方法形成。
如上所述,係提出較佳實施例以更具體描述本發明。然而,以下例子只是給予用來說明本發明且相關領域中的通常知識者將明顯地了解在本發明的範圍及精神中的各種替代及修飾方案。此替代及修飾方案當然包括在附隨的申請專利範圍中。
實施例與比較例
(1)絕緣層形成組成
列示在下表1中的成分係以顯示的量(重量份)混合以製備絕緣層形成組成。 [表 1]
1.結合劑樹脂(a、b與c為莫耳比例)
A1-1:a/b = 60/40,Mw=12,000
A1-2:a/b/c = 60/25/15, Mw=12,000
A1-3:a/b/c = 55/15/30,Mw=11,000
A1-4:a/b/c = 55/15/30,Mw=11,000
A2-1,A2-2:
A2-1:a/b/c/d = 15/10/50/25 Mw=25,000
A2-2:a/b/c/d = 20/15/30/35,Mw=25,000
A2-3,A2-4:
A2-3:a/b/c/d = 15/10/50/25,Mw=25,000
A2-4:a/b/c/d = 20/15/30/35,Mw=25,000
A3:
A3-1:a/b/c = 60/20/20,Mw= 9000
A3-2:a/b/c = 60/10/30,Mw= 9000
A3-3:a/b/c = 50/20/30,Mw= 9000
2.光酸產生劑:
3.光敏化劑:
4.溶劑
D1:丙二醇甲基乙基醋酸酯
D2:二乙二醇甲基乙基酯
5.鹼性化合物:二環己基甲胺
6.矽烷耦合劑:γ-環氧丙氧基丙基三烷氧基矽烷
7.界面活性劑:G1:SH-8400 (Dow Corning公司),G2:F-475 (DIC公司)
(2)膜觸控感測器
具有700 µm之厚度的鈉鈣玻璃係用作載體基底,且透過塗佈器將藉由依濃度10 wt. %將50重量份之三聚氰胺樹脂與50重量份之桂皮酸鹽樹脂稀釋在丙二醇單甲醚醋酸酯(PGMEA)中所製備得之用以形成分離層的組成物以300 nm之厚度供應至載體基底,並以150℃乾燥30分鐘以形成分離層。
藉由旋轉塗佈器以2 µm的厚度將用於形成第二保護層的組成物(藉由混合4重量份的多官能性丙烯酸單體以及60重量份的環氧樹脂、並將混合物加於溶劑中來製備,其中將30重量份的二乙二醇甲乙醚(MEDG)、40重量份的PGME以及30重量份的3-甲氧基丁醇混合在一起以就固體成分而言具有20重量份的比例)塗佈至電極圖型層,以具有200 mJ/cm2
強度的UV光照射以於其上執行光固化,並在200℃乾燥並固化30分鐘以形成第二保護層。然後,用以形成保護層的組成物(藉由混合40重量份之多官能基丙烯醯單體及60重量份之環氧樹脂,並將混合物加入其中30重量份之二乙二醇甲乙醚(MEDG)、40重量份之PGMEA、與30重量份之3-甲氧丁醇混合在一起的溶劑中所製備得,以具有就固形物含量而言具有20重量份的比例)藉由塗佈器以2 µm之厚度供應至分離層,以具有200 mJ/cm2
之強度UV射線照射其上來實行光固化,並以200℃進行乾燥與固化30分鐘以形保護層。
以25℃之室溫沉積ITO在保護層上至厚度35 nm,並以230℃退火ITO層30藉此形成數個第一與第二圖案。
使用實施例與比較例的組成物形成絕緣層在第一與第二圖案上。以旋塗器供應2 µm之厚度的組成物,並在對流乾燥爐中以110℃預烘烤2分鐘。之後,以接近式對準器曝光層40 mj/cm2
(以i射束為基準),並以2.38%之TMAH的顯影溶液顯影。在顯影之後,層係進行基於電子線(g、h與i射束)之300 mJ/cm2
的漂白曝光。
之後,藉由對流乾燥爐以200℃進行後烘烤30分鐘以形成絕緣層。
然而,實施例17、18與19中,預烘烤溫度係分別設定為140℃、150℃與255℃。
橋接圖案以銀、銅、與鈀合金形成在絕緣層上,並透過形成在絕緣層中的接觸孔洞連接至第二圖案。
然後,鈍層以矽絕緣材料(SiO2
)形成在電極圖案層上。
之後,藉由點滴器將包含50重量份之含有作為聚合反應起始劑之SP500及作為調平劑之KRM230的CEL2021P(3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯(3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate))、20重量份的新戊二醇二縮水甘油醚(neopentyl glycol diglycidylether; NPGDGE)、10重量份之1,6-己二醇二丙烯酸酯(1,6-hexanediol diacrylate)、5重量份的三羥甲基丙烷三丙烯酸酯(trimethylolpropane triacrylate)、10重量份之作為黏著性促進劑的KRM0273及以及5重量份之4-HBVE作為稀釋的單體的黏著劑組成物供應在具有60 µm之厚度的TAC膜與絕緣層之間的鈍層上,並藉由輥貼合機壓合以形成黏著層以具有2 μm的厚度。黏著層以具有10 mW/cm2
之強度的UV射線照射100秒以將近彼此接觸,在乾燥爐中以80℃乾燥10分鐘,並然後在室溫離開。
實驗例
1.敏感度之量測
實施例與比較例的感光樹脂組成係以旋轉器供應至具有0.7 mm之厚度的玻璃基底,並在加熱板上於100℃加熱125秒以揮發溶劑,藉此形成具有4.0 μm之厚度的感光樹脂組成層。
之後,為了獲得具有10 μm之直徑的接觸孔洞圖案,藉由使用具有10 μm大小之露出部分的方形圖案開口的遮罩的i射束步進器(NSR-205i11D,由Nikon公司製造)來執行曝光。
在曝光之後,使用2.38%四甲基氫氧化銨水溶液作為顯影溶液,於23℃將基底進行浸置式顯影40秒,並接著在乾燥爐中於230℃加熱該基底30分鐘以獲得固化的膜。
隨後,將基板垂直切割,並選擇用以在各組成物中形成10 μm之接觸孔洞的曝光量作為敏感度。
2.穿透率之量測
藉由光譜儀測量從實驗例1獲得之膜在400 nm的穿透率。量測結果顯示在下表2中。
3.圖案角度之量測
垂直切割從實驗例1獲得之圖案,並從光學掃描式電子顯微(SEM)照片算出與基板的角度。量測結果顯示在下表2中。
4.橋接圖案之黏著性的評估
在從實驗例1獲得之膜上進行濺鍍厚度分別為2500Å與1350Å的Ag-Pd-Cu (APC)合金或ITO以形成橋接圖案,並使用ASTM D3359的方法在橋接圖案上畫出100個具有1 cm x 1 cm之尺寸的格子單元。然後,使用黏著性評量膠帶(3M公司,610)根據以下標準重複執行三次圖案挑出之評量。評量的結果顯示在下表2。
5B:塗膜之切割角落部分處未觀察到圖案挑出,且塗膜之格子中未觀察到剝離。
4B:角落部分處觀察到輕微的圖案挑出,且對於所有格子之5%或更少之範圍內的格子中發生剝離。
3B:角落部分處觀察到圖案挑出及粉碎,且對於所有格子之15%或更少之範圍內的格子中發生剝離。
2B:格子中也觀察到圖案挑出及粉碎,且對於所有格子之超過15%但少於35%之範圍內的格子中發生剝離。
1B:觀察到大條紋形式之圖案挑出,且對於所有格子之超過35%但少於65%之範圍內的格子中發生剝離。
0B:於所有格子之超過65%之範圍內的格子中發生剝離而造成不良之黏著性。
5.彈性模數之量測
作為從實施例與比較例中製備的膜觸控感測器的獨立製程,藉由如實施例與比較例之相同方式只形成絕緣層在具有700 µm之厚度的鈉鈣玻璃上。根據KS M ISO 6721-4之方法量測彈性模數。量測結果顯示在下表2中
6.評量剝離之後是否發生裂痕
3M # 55膠帶(具有25 mm之寬度與10 cm之長度)被分別附在實施例與比較例中製備的膜觸控感測器上,並然後以切割器切割膠帶(寬度25 mm)的周圍。抓住膠帶的末部,且膜觸控感測器從載體基底剝離以根據以下標準視覺觀察裂痕是否發生傳送至膠帶的塗膜中,且觀察結果顯示在下表2中。
○:沒有裂痕的狀態
×:發生裂痕的狀態
7.熱穩定性之評量
作為從實施例與比較例中製備的膜觸控感測器的獨立製程,藉由如實施例與比較例之相同方式只形成絕緣層在作為載體基底之具有700 µm之厚度的鈉鈣玻璃上。之後,更以230℃加熱玻璃20分鐘以根據以下標準量測穿透率的變化,且量測結果顯示在下表2中。
○:3ΔT%或更低
△:4至8ΔT%
×:9ΔT%或更高
8.耐溶劑性之評量
作為從實施例與比較例中製備的膜觸控感測器的獨立製程,藉由如實施例與比較例之相同方式只形成絕緣層在作為載體基底之具有700 µm之厚度的鈉鈣玻璃上。之後,將玻璃浸在丙二醇單甲醚醋酸酯中並以100℃加熱30分鐘,然後根據以下標準量測膜之厚度在加熱前後的變化,且量測結果顯示在下表2中。
○:超過98%
△:95%至98%
×:少於95%
9.抗耐性之評估
作為從實施例與比較例中製備的膜觸控感測器的獨立製程,藉由如實施例與比較例之相同方式只形成絕緣層在作為載體基底之具有700 µm之厚度的鈉鈣玻璃上。之後,在絕緣層上進行ITO濺鍍以具有1,000 Å之厚度,然後根據以下標準量測膜皺紋狀態的變化,且量測結果顯示在下表2中。
○:沒有皺紋的狀態
×:發生皺紋的狀態
10.耐蝕刻性的評估
作為從實施例與比較例中製備的膜觸控感測器的獨立製程,藉由如實施例與比較例之相同方式只形成絕緣層在作為載體基底之具有700 µm之厚度的鈉鈣玻璃上。隨後,將玻璃浸入在60℃之ITO蝕刻劑(MA-SO2,由Dongwoo Fine-Chem.公司製造)10分鐘,然後量測並以百分比表現出膜厚度在浸泡前後的變化,且量測結果顯示在下表2中。
○:超過98%
△:95%至98%
×:少於95% [表 2]
參照以上表2,可看見實施例的膜觸控感測器具有優異的裂痕避免效果及優異的敏感度、橋接圖案的黏著性、絕緣層的穿透率、耐熱性與耐溶劑性,比較例之膜觸控感測器表現出一個或更多個較不好的結果。
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。
10‧‧‧載體基底,
20‧‧‧分離層
30‧‧‧保護層
40‧‧‧電極圖案層
41‧‧‧第一圖案
42‧‧‧第二圖案
43‧‧‧絕緣層
44‧‧‧橋接電極
45‧‧‧接觸孔洞
50‧‧‧基膜
60‧‧‧感壓黏著層、鈍層
20‧‧‧分離層
30‧‧‧保護層
40‧‧‧電極圖案層
41‧‧‧第一圖案
42‧‧‧第二圖案
43‧‧‧絕緣層
44‧‧‧橋接電極
45‧‧‧接觸孔洞
50‧‧‧基膜
60‧‧‧感壓黏著層、鈍層
本發明之以上或其它目的、特徵與其它優點將從以下配合所附圖式的詳細說明更清楚地被了解,其中: 第1圖係繪示根據本發明之一實施例的膜觸控感測器的示意剖面圖; 第2圖係繪示根據本發明之其它實施例的膜觸控感測器的示意剖面圖; 第3圖係繪示根據本發明之一實施例的用以製造膜觸控感測器的方法的製程的示意圖;及 第4圖係繪示根據本發明之其它實施例的用以製造膜觸控感測器的方法的製程的示意圖。
20‧‧‧分離層
30‧‧‧保護層
40‧‧‧電極圖案層
41‧‧‧第一圖案
42‧‧‧第二圖案
43‧‧‧絕緣層
44‧‧‧橋接電極
45‧‧‧接觸孔洞
Claims (11)
- 一種膜觸控感測器,包括: 一分離層; 一保護層,設置在該分離層上;及 一電極圖案層,其係設置在該保護層上並包含一絕緣層,該絕緣層係一結合劑樹脂的一固化層,該結合劑樹脂包含(a-1)樹脂,其中至少一部分的一酚性羥基或一羧基係由一酸可分解的基團保護、(a-2)丙烯酸系樹脂,含有一環氧基、及(a-3)丙烯酸系樹脂,含有一氧雜環丁烷基。
- 如申請專利範圍第1項所述之膜觸控感測器,其中該(a-3)樹脂包含以式7表示的一重複單元如下: [式7](其中R1 、R2 及R3 係各自獨立地為氫或一甲基,且 R4 係從一單體衍生出的一結構,該單體擇自由下方式(1)至式(3)所構成之群組: (其中R5 係從一單體衍生出的一結構,該單體擇自由甲基丙烯酸((meth)acrylic acid)、2-(甲基)丙烯醯基羥乙基琥珀酸(2-(meth)acryloyloxyethyl succinate)、2-(甲基)丙烯醯氧乙基六氫苯二甲酸酯(2-(meth)acryloyloxyethyl hexahydrophthalate)及2-(甲基)丙烯醯基氧乙基酞酸酯(2-(meth)acryloyloxyethyl phthalate)所構成之群組。 R6 係從一單體衍生出的一結構,該單體以式(4)表示如下,R7 係具有1至6個碳原子的伸烷基, R8 係具有1至6個碳原子的烷基,且 a=40至80 mol%,b=5至45 mol%,且c = 10至55 mol%。)
- 如申請專利範圍第1項所述之膜觸控感測器,其中該(a-3)樹脂具有5,000至30,000的重量平均分子量。
- 如申請專利範圍第1項所述之膜觸控感測器,其中相對於100重量份之全部該結合劑樹脂,該結合劑樹脂包含30至55重量份的該(a-1)樹脂、30至60重量份的該(a-2)樹脂、及1至25重量份的該(a-3)樹脂。
- 如申請專利範圍第1項所述之膜觸控感測器,其中電極圖案層包含: 數個感測電極,包含形成在一第一方向上的數個第一圖案與形成在一第二方向上的數個第二圖案; 數個橋接電極,配置以彼此連接該些第二圖案的數個單元圖案,該些橋接電極係互相分開;及 一絕緣層,設置在該些感測圖案與該些橋接電極之間。
- 如申請專利範圍第1項所述之膜觸控感測器,其中該絕緣層具有2.8至4.5 GPa的彈性模數。
- 如申請專利範圍第1項所述之膜觸控感測器,其中該絕緣層具有90%或更高的穿透率。
- 如申請專利範圍第1項所述之膜觸控感測器,更包括一基膜,附加至該電極圖案層的一上側。
- 一種用以製造一膜觸控感測器的方法,包括步驟: 形成一分離層於一載體基底上; 形成一保護層於該分離層上; 形成一電極圖案層於該保護層上;及 從該載體基底剝離該分離層, 其中形成該電極圖案層的該步驟包括塗施一絕緣層形成組成,該絕緣層形成組成含有一結合劑樹脂,該結合劑樹脂包含(a-1)一樹脂,其中至少一部分的一酚性羥基或一羧基係由一酸可分解的基團保護、(a-2)一丙烯酸系樹脂,含有一環氧基、及(a-3)一丙烯酸系樹脂,含有一氧雜環丁烷基。
- 如申請專利範圍第9項所述之用以製造該膜觸控感測器的方法,其中該絕緣層形成組成的該固化的進行包含預烘烤、曝光、顯影及後烘烤。
- 如申請專利範圍第10項所述之用以製造該膜觸控感測器的方法,其中該預烘烤係在80℃至140℃下進行20秒至1,000秒。
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