TW201732910A - Chuck platform capable of preventing clogging caused by intrusion of liquid - Google Patents

Chuck platform capable of preventing clogging caused by intrusion of liquid Download PDF

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Publication number
TW201732910A
TW201732910A TW105140456A TW105140456A TW201732910A TW 201732910 A TW201732910 A TW 201732910A TW 105140456 A TW105140456 A TW 105140456A TW 105140456 A TW105140456 A TW 105140456A TW 201732910 A TW201732910 A TW 201732910A
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Taiwan
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frame
workpiece
unit
frame support
support portion
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TW105140456A
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Chinese (zh)
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Takeomi Fukuoka
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Disco Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

To provide a chuck platform capable of preventing clogging caused by intrusion of liquid. A chucking platform (10, 38) is provided on a processing device (2) for processing a plate-like workpiece (11), the chucking platform is used for holding a workpiece unit (1) composed of a workpiece, an annular frame (15) surrounding the workpiece, and an adhesive tape which is attached to the workpiece and the frame. The chuck platform comprises a main body part (42) having a holding surface (42a) for sucking and holding the workpiece through the adhesive tape; and a frame support part (48) which is on the outer side to support the frame. The frame support part is formed to have a smaller outer diameter than that of the frame, and if the frame support part is overlaid by the frame in such a way that the outer edge (15a) of the frame protrudes toward the outside of the frame support part, the upper portion of the main body part and the frame support part will be entirely covered by the workpiece unit.

Description

夾盤平台 Chuck platform

本發明有關吸引、保持板狀的被加工物之夾盤平台(chuck table)。 The present invention relates to a chuck table for attracting and holding a sheet-like workpiece.

在將半導體晶圓或封裝基板等被加工物予以加工之加工裝置中,例如會設置將被加工物以負壓(真空)吸引、保持之夾盤平台。藉由此夾盤平台吸引、保持被加工物,藉此能夠以充分高的精度來加工被加工物。 In a processing apparatus that processes a workpiece such as a semiconductor wafer or a package substrate, for example, a chuck platform that sucks and holds a workpiece under a vacuum (vacuum) is provided. By sucking and holding the workpiece by the chuck platform, the workpiece can be processed with sufficiently high precision.

近年來,為了更容易取放加工前後的被加工物,形成被加工物單元(框單元)的機會逐漸增加,該被加工物單元是將直徑比被加工物還大的黏著膠帶貼附於被加工物,而在黏著膠帶的外緣部固定環狀的框而成。在此情形下,夾盤平台,係構成為能夠保持被加工物單元的全體(例如參照專利文獻1)。 In recent years, in order to facilitate the handling of workpieces before and after processing, there is an increasing opportunity to form a workpiece unit (frame unit) which is attached to an adhesive tape having a larger diameter than the workpiece. The processed object is formed by fixing a ring-shaped frame to the outer edge portion of the adhesive tape. In this case, the chuck platform is configured to be able to hold the entire workpiece unit (for example, refer to Patent Document 1).

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

〔專利文獻1〕日本特開2010-21464號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-21464

於上述被加工物的加工時,為了促進加工屑的排出或各部的冷卻等,一般而言會對被加工物及工具供給純水等加工液。然而,由於在被加工物單元與夾盤平台之間有些微的間隙,故含有加工屑之加工液會被吸進此間隙,而有夾盤平台(特別是負壓的傳達路徑)容易堵塞這樣的問題。 In the processing of the workpiece, in order to promote the discharge of machining chips or the cooling of each part, a machining liquid such as pure water is generally supplied to the workpiece and the tool. However, since there is a slight gap between the workpiece unit and the chuck platform, the machining fluid containing the machining waste is sucked into the gap, and the chuck platform (especially the negative pressure transmission path) is easily blocked. The problem.

本發明係有鑑於此問題點而研發,其目的在於提供一種能夠防止從間隙侵入的液體所造成之堵塞之夾盤平台。 The present invention has been made in view of the above problems, and an object thereof is to provide a chuck platform capable of preventing clogging caused by a liquid intruding from a gap.

按照本發明之一態樣,提供一種夾盤平台,係設於對板狀的被加工物做加工之加工裝置,而保持由該被加工物、及圍繞該被加工物之環狀的框、及貼附於該被加工物及該框之黏著膠帶所構成的被加工物單元之夾盤平台,其特徵為,具備:本體部,具有隔著該黏著膠帶而吸引保持該被加工物之保持面;及框支撐部,在該本體部的外側支撐該框;該框支撐部,形成為外徑比該框還小,若以該框的外緣朝該框支撐部的外側突出之方式將該框重疊於該框支撐部,則該本體部及該框支撐部的上面全體會受到該被加工物單元覆蓋。 According to an aspect of the present invention, a chuck platform is provided which is provided in a processing apparatus for processing a plate-shaped workpiece, and holds a frame and a ring-shaped frame surrounding the workpiece, And a chuck platform attached to the workpiece and the workpiece unit formed of the adhesive tape of the frame, characterized in that the main body has a main body portion that is held by the adhesive tape to hold and hold the workpiece. And the frame support portion supports the frame outside the body portion; the frame support portion is formed to have an outer diameter smaller than the frame, and the outer edge of the frame protrudes toward the outer side of the frame support portion When the frame is overlapped with the frame supporting portion, the entire upper surface of the main body portion and the frame supporting portion is covered by the workpiece unit.

本發明之一態樣中,較佳是,該框支撐部,更具備磁力產生部,當該框由強磁性材料所形成的情形下,將該框藉由磁力吸附而保持。 In one aspect of the invention, preferably, the frame supporting portion further includes a magnetic force generating portion, and when the frame is formed of a ferromagnetic material, the frame is held by magnetic attraction.

此外,本發明之一態樣中,較佳是,該框支撐部,從比該本體部的外周側面的該保持面還低之位置朝外側延伸,在該框支撐部與該保持面之間形成有高低差。 Further, in an aspect of the invention, preferably, the frame supporting portion extends outward from a position lower than the holding surface of the outer peripheral side surface of the main body portion, between the frame supporting portion and the holding surface Formed a height difference.

此外,本發明之一態樣中,較佳是,該框支撐部的一部分被切除。 Further, in an aspect of the invention, it is preferable that a part of the frame supporting portion is cut away.

本發明之一態樣之夾盤平台,具備具有保持被加工物的保持面之本體部、及外徑比框還小之框支撐部,故若以框的外緣朝框支撐部的外側突出之方式將框重疊於框支撐部,則本體部及框支撐部的上面全體會受到被加工物單元覆蓋。 A chuck platform according to an aspect of the present invention includes a main body portion having a holding surface for holding a workpiece and a frame supporting portion having a smaller outer diameter than the frame. Therefore, the outer edge of the frame protrudes toward the outer side of the frame supporting portion. When the frame is superposed on the frame supporting portion, the entire upper surface of the main body portion and the frame supporting portion is covered by the workpiece unit.

如此一來,被供給至被加工物單元之液體會變得難以流落至框支撐部,能夠防止液體對於被加工物單元與框支撐部之間隙的侵入。也就是說,按照本發明一態樣之夾盤平台,能夠防止從間隙侵入的液體所造成之保持面的堵塞。 As a result, the liquid supplied to the workpiece unit becomes difficult to flow to the frame support portion, and the intrusion of the liquid into the gap between the workpiece unit and the frame support portion can be prevented. That is to say, according to the chuck platform of one aspect of the present invention, it is possible to prevent clogging of the holding surface caused by the liquid intruding from the gap.

2‧‧‧切割裝置(加工裝置) 2‧‧‧Cutting device (processing device)

4‧‧‧基台 4‧‧‧Abutment

4a,4b‧‧‧開口 4a, 4b‧‧‧ openings

6‧‧‧X軸移動平台 6‧‧‧X-axis mobile platform

8‧‧‧防塵防滴罩 8‧‧‧Dust-proof drip shield

10,38‧‧‧夾盤平台 10,38‧‧‧Chuck platform

12‧‧‧切割單元(加工單元) 12‧‧‧Cutting unit (processing unit)

14‧‧‧支撐構造 14‧‧‧Support structure

16‧‧‧切割單元移動機構 16‧‧‧Cutting unit moving mechanism

18‧‧‧Y軸導軌 18‧‧‧Y-axis guide

20‧‧‧Y軸移動板 20‧‧‧Y-axis moving board

22‧‧‧Y軸滾珠螺桿 22‧‧‧Y-axis ball screw

24‧‧‧Z軸導軌 24‧‧‧Z-axis guide

26‧‧‧Z軸移動板 26‧‧‧Z-axis moving board

28‧‧‧Z軸滾珠螺桿 28‧‧‧Z-axis ball screw

30‧‧‧Z軸脈衝電動機 30‧‧‧Z-axis pulse motor

32‧‧‧相機(拍攝單元) 32‧‧‧Camera (shooting unit)

34‧‧‧切割刀 34‧‧‧Cutting knife

35‧‧‧噴嘴 35‧‧‧Nozzles

36‧‧‧洗淨單元 36‧‧‧cleaning unit

40‧‧‧噴嘴 40‧‧‧ nozzle

42‧‧‧本體部 42‧‧‧ Body Department

42a‧‧‧保持面 42a‧‧‧ Keep face

42b‧‧‧外周側面 42b‧‧‧ peripheral side

44‧‧‧框體 44‧‧‧ frame

44a‧‧‧開口 44a‧‧‧ openings

44b‧‧‧通路 44b‧‧‧ pathway

46‧‧‧吸引板 46‧‧‧Attraction board

48‧‧‧框支撐部 48‧‧‧Box support

48a‧‧‧外緣 48a‧‧‧Outer edge

48b‧‧‧中心 48b‧‧ Center

48c‧‧‧距離 48c‧‧‧distance

48d‧‧‧切除部 48d‧‧‧Resection

50‧‧‧磁鐵(磁力產生部) 50‧‧‧ Magnet (magnetic generation unit)

1‧‧‧被加工物單元(框單元) 1‧‧‧Processed material unit (frame unit)

11‧‧‧被加工物 11‧‧‧Processed objects

13‧‧‧黏著膠帶 13‧‧‧Adhesive tape

15‧‧‧框 15‧‧‧ box

15a‧‧‧外緣 15a‧‧‧ outer edge

15b‧‧‧中心 15b‧‧ Centre

15c‧‧‧距離 15c‧‧‧distance

〔圖1〕具備夾盤平台之切割裝置的構成例模型示意 立體圖。 [Fig. 1] A schematic diagram showing a configuration example of a cutting device having a chuck platform Stereo picture.

〔圖2〕被加工物單元的構成例模型示意平面圖。 Fig. 2 is a schematic plan view showing a configuration example of a workpiece unit.

〔圖3〕夾盤平台的構成例模型示意平面圖。 Fig. 3 is a schematic plan view showing a configuration example of a chuck platform.

〔圖4〕圖4(A)為將被加工物單元以夾盤平台予以保持之狀態模型示意平面圖,圖4(B)為被吸引、保持於夾盤平台之被加工物受到切割的情況模型示意部分截面側面圖。 [Fig. 4] Fig. 4(A) is a schematic plan view showing a state in which a workpiece unit is held by a chuck platform, and Fig. 4(B) is a model in which a workpiece to be sucked and held on a chuck platform is cut. A schematic partial cross-sectional side view.

參照所附圖面,說明本發明一態樣之實施形態。圖1為具備本實施形態的夾盤平台之切割裝置的構成例模型示意立體圖。另,本實施形態中,雖舉切割裝置為例來說明,但本發明之加工裝置亦可為磨削裝置、研磨裝置等。 An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a schematic perspective view showing a configuration example of a cutting device including a chuck platform of the embodiment. Further, in the present embodiment, the cutting device is described as an example, but the processing device of the present invention may be a grinding device, a polishing device, or the like.

如圖1所示,切割裝置(加工裝置)2,具備支撐各構造之基台4。在基台4的上面,於X軸方向(前後方向、加工饋送方向)形成有長的矩形狀的開口4a。在此開口4a內,設有X軸移動平台6、令X軸移動平台6朝X軸方向移動之X軸移動機構(未圖示)、及覆蓋X軸移動機構之防塵防滴罩8。 As shown in Fig. 1, a cutting device (processing device) 2 is provided with a base 4 that supports each structure. On the upper surface of the base 4, a long rectangular opening 4a is formed in the X-axis direction (front-rear direction, processing feed direction). In the opening 4a, an X-axis moving platform 6, an X-axis moving mechanism (not shown) for moving the X-axis moving platform 6 in the X-axis direction, and a dust drip-proof cover 8 covering the X-axis moving mechanism are provided.

X軸移動機構,具備平行於X軸方向之一對X軸導軌(未圖示),X軸移動平台6可滑動地安裝於X軸導軌。在X軸移動平台6的下面側,設有螺帽部(未圖示),在此螺帽部,螺合有平行於X軸導軌之X軸滾珠 螺桿(未圖示)。 The X-axis moving mechanism has one of an X-axis guide rail (not shown) parallel to the X-axis direction, and the X-axis moving platform 6 is slidably attached to the X-axis guide rail. On the lower side of the X-axis moving platform 6, a nut portion (not shown) is provided, in which the X-axis ball parallel to the X-axis guide is screwed Screw (not shown).

在X軸滾珠螺桿的一端部,連結有X軸脈衝電動機(未圖示)。藉由X軸脈衝電動機令X軸滾珠螺桿旋轉,藉此X軸移動平台6會沿著X軸導軌朝X軸方向移動。 An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. The X-axis ball screw is rotated by the X-axis pulse motor, whereby the X-axis moving platform 6 moves in the X-axis direction along the X-axis guide.

在X軸移動平台6上,設有吸引、保持被加工物單元(框單元)1之夾盤平台10。夾盤平台10,連結至電動機等旋轉驅動源(未圖示),繞著平行於Z軸方向(鉛直方向)之旋轉軸旋轉。此外,夾盤平台10,藉由上述X軸移動機構而朝X軸方向被加工饋送。有關夾盤平台10的細節後述之。 On the X-axis moving platform 6, a chuck platform 10 that sucks and holds the workpiece unit (frame unit) 1 is provided. The chuck table 10 is coupled to a rotary drive source (not shown) such as a motor and rotates about a rotation axis parallel to the Z-axis direction (vertical direction). Further, the chuck table 10 is processed and fed in the X-axis direction by the above-described X-axis moving mechanism. Details regarding the chuck platform 10 will be described later.

圖2為被加工物單元1的構成例模型示意平面圖。被加工物單元1,包含板狀的被加工物11。被加工物11,例如為由矽等半導體材料所成之圓形的半導體晶圓,其上面(表面)側,被以格子狀排列之分割預定線(切割道(street))區隔成複數個區域。 Fig. 2 is a schematic plan view showing a configuration example of the workpiece unit 1. The workpiece unit 1 includes a plate-shaped workpiece 11 . The workpiece 11 is, for example, a circular semiconductor wafer made of a semiconductor material such as tantalum, and the upper surface (surface) side is divided into a plurality of predetermined dividing lines (streets) arranged in a lattice pattern. region.

在被加工物11的下面(背面)側,貼附有直徑比被加工物11還大之黏著膠帶13。在黏著膠帶13的外緣部,固定有環狀的框15。也就是說,在被加工物11及框15,貼附有1片黏著膠帶13,被加工物11隔著此黏著膠帶13而被支撐於框15。 On the lower surface (back surface) side of the workpiece 11, an adhesive tape 13 having a larger diameter than the workpiece 11 is attached. An annular frame 15 is fixed to the outer edge portion of the adhesive tape 13. In other words, one piece of the adhesive tape 13 is attached to the workpiece 11 and the frame 15, and the workpiece 11 is supported by the frame 15 via the adhesive tape 13.

另,本實施形態中,雖將由矽等半導體材料所成之圓形的半導體晶圓訂為被加工物11,但被加工物11的材質、形狀等並無限制。例如,亦能使用封裝基 板、陶瓷基板、玻璃基板、樹脂基板、金屬基板等作為被加工物11。 In the present embodiment, a circular semiconductor wafer made of a semiconductor material such as germanium is formed as the workpiece 11, but the material, shape, and the like of the workpiece 11 are not limited. For example, a package base can also be used. A plate, a ceramic substrate, a glass substrate, a resin substrate, a metal substrate, or the like is used as the workpiece 11.

在基台4的上面,以橫跨開口4a的方式配置有門型的支撐構造14,其支撐對被加工物11做切割加工之切割單元(加工單元)12。在支撐構造14的前面上部,設有令切割單元12朝Y軸方向(左右方向;分度(indexing)饋送方向)及Z軸方向移動之切割單元移動機構16。 On the upper surface of the base 4, a gate-shaped support structure 14 that supports a cutting unit (machining unit) 12 that cuts the workpiece 11 is disposed so as to straddle the opening 4a. A cutting unit moving mechanism 16 that moves the cutting unit 12 in the Y-axis direction (left-right direction; indexing feed direction) and the Z-axis direction is provided on the front upper portion of the support structure 14.

切割單元移動機構16,具備配置於支撐構造14的前面而平行於Y軸方向之一對Y軸導軌18。在Y軸導軌18,可滑動地安裝有構成切割單元移動機構16之Y軸移動板20。 The cutting unit moving mechanism 16 includes a pair of Y-axis guide rails 18 disposed on the front surface of the support structure 14 and parallel to the Y-axis direction. A Y-axis moving plate 20 constituting the cutting unit moving mechanism 16 is slidably attached to the Y-axis guide rail 18.

在Y軸移動板20的背面側(後面側),設有螺帽部(未圖示),在此螺帽部,螺合有平行於Y軸導軌18之Y軸滾珠螺桿22。在Y軸滾珠螺桿22的一端部,連結有Y軸脈衝電動機(未圖示)。藉由Y軸脈衝電動機令Y軸滾珠螺桿22旋轉,則Y軸移動板20會沿著Y軸導軌18朝Y軸方向移動。 A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 20, and a Y-axis ball screw 22 parallel to the Y-axis guide rail 18 is screwed to the nut portion. A Y-axis pulse motor (not shown) is connected to one end portion of the Y-axis ball screw 22. When the Y-axis pulse motor 22 rotates the Y-axis ball screw 22, the Y-axis moving plate 20 moves in the Y-axis direction along the Y-axis guide rail 18.

在Y軸移動板20的表面(前面),設有平行於Z軸方向之一對Z軸導軌24。在Z軸導軌24,可滑動地安裝有Z軸移動板26。 On the surface (front surface) of the Y-axis moving plate 20, a pair of Z-axis guide rails 24 are provided in parallel with the Z-axis direction. A Z-axis moving plate 26 is slidably mounted on the Z-axis guide rail 24.

在Z軸移動板26的背面側(後面側),設有螺帽部(未圖示),在此螺帽部,螺合有平行於Z軸導軌24之Z軸滾珠螺桿28。在Z軸滾珠螺桿28的一端部,連 結有Z軸脈衝電動機30。藉由Z軸脈衝電動機30令Z軸滾珠螺桿28旋轉,則Z軸移動板26會沿著Z軸導軌24朝Z軸方向移動。 A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 26, and a Z-axis ball screw 28 parallel to the Z-axis guide 24 is screwed to the nut portion. At one end of the Z-axis ball screw 28, A Z-axis pulse motor 30 is coupled. When the Z-axis pulse motor 28 rotates the Z-axis ball screw 28, the Z-axis moving plate 26 moves in the Z-axis direction along the Z-axis guide 24.

在Z軸移動板26的下部,設有對被加工物11做切割加工之切割單元12。此外,在與切割單元12鄰接之位置,設置有拍攝被加工物11的上面側之相機(拍攝單元)32。藉由切割單元移動機構16,若令Y軸移動板20朝Y軸方向移動,則切割單元12及相機32被分度饋送,若令Z軸移動板26朝Z軸方向移動,則切割單元12及相機32升降。 In the lower portion of the Z-axis moving plate 26, a cutting unit 12 for cutting the workpiece 11 is provided. Further, at a position adjacent to the cutting unit 12, a camera (photographing unit) 32 that photographs the upper surface side of the workpiece 11 is provided. By cutting the unit moving mechanism 16, when the Y-axis moving plate 20 is moved in the Y-axis direction, the cutting unit 12 and the camera 32 are indexed, and if the Z-axis moving plate 26 is moved in the Z-axis direction, the cutting unit 12 And the camera 32 is raised and lowered.

切割單元12,具備圓環狀的切割刀34,其裝配於構成平行於Y軸方向的旋轉軸之心軸(spindle)的一端側。在心軸的另一端側連結有電動機等旋轉驅動源(未圖示),令裝配於心軸之切割刀34旋轉。此外,在切割刀34的鄰近,配置有對切割刀34及被加工物11供給純水等切割液(加工液)之噴嘴35。 The cutting unit 12 is provided with an annular cutter 34 attached to one end side of a spindle constituting a rotation axis parallel to the Y-axis direction. A rotary drive source (not shown) such as a motor is coupled to the other end side of the mandrel, and the cutter blade 34 attached to the spindle is rotated. Further, in the vicinity of the dicing blade 34, a nozzle 35 for supplying a cutting liquid (working fluid) such as pure water to the dicing blade 34 and the workpiece 11 is disposed.

在與開口4a鄰接之位置,形成有圓形的開口4b。在開口4b內,配置有將被加工物11洗淨之洗淨單元36。洗淨單元36,包含吸引、保持被加工物單元1之夾盤平台38、及朝向被加工物11噴射洗淨用的流體之噴嘴40。夾盤平台38,連結至電動機等旋轉驅動源(未圖示),繞著平行於Z軸方向之旋轉軸旋轉。有關夾盤平台38的細節後述之。 At a position adjacent to the opening 4a, a circular opening 4b is formed. In the opening 4b, a washing unit 36 that washes the workpiece 11 is disposed. The cleaning unit 36 includes a chuck table 38 that sucks and holds the workpiece unit 1, and a nozzle 40 that ejects the fluid for washing toward the workpiece 11. The chuck table 38 is coupled to a rotary drive source (not shown) such as a motor and rotates about a rotation axis parallel to the Z-axis direction. Details regarding the chuck platform 38 will be described later.

當藉由像這樣構成的切割裝置2對被加工物 11做切割加工時,首先,將被加工物單元1搬入並令其保持於夾盤平台10。接著,令夾盤平台10與切割單元12相對地移動、旋轉,將切割刀34的位置契合至作為加工對象之分割預定線的延長線上。 When the workpiece is processed by the cutting device 2 configured as described above When the cutting process is performed, first, the workpiece unit 1 is carried in and held on the chuck table 10. Next, the chuck table 10 is moved and rotated relative to the cutting unit 12, and the position of the cutter blade 34 is fitted to the extension line of the planned dividing line to be processed.

其後,令切割刀34下降至可和被加工物11接觸之高度並且令其旋轉,又,一面供給切割液一面令夾盤平台10相對於加工對象之分割預定線而言平行地移動。如此一來,便能對被加工物11沿著分割預定線做切割加工。切割加工後的被加工物11,例如從夾盤平台10被搬出,藉由洗淨單元36被洗淨。 Thereafter, the cutter blade 34 is lowered to a height at which it can come into contact with the workpiece 11 and rotated, and the cutting liquid is supplied while the chuck table 10 is moved in parallel with respect to the planned dividing line of the workpiece. In this way, the workpiece 11 can be cut along the line to be divided. The workpiece 11 after the cutting process is carried out, for example, from the chuck table 10, and is washed by the cleaning unit 36.

圖3為夾盤平台10,38的構成例模型示意平面圖。 3 is a schematic plan view showing a configuration example of the chuck platforms 10, 38.

夾盤平台10,38,具備本體部42。本體部42,包含由不鏽鋼或鋁等金屬所形成之圓盤狀的框體44。在框體44的上面中央部,形成有圓形的開口44a,在此開口44a內,嵌入有和開口44a的形狀相符之吸引板46。 The chuck platforms 10, 38 are provided with a body portion 42. The main body portion 42 includes a disk-shaped frame body 44 formed of a metal such as stainless steel or aluminum. A circular opening 44a is formed in the central portion of the upper surface of the frame 44, and an attraction plate 46 conforming to the shape of the opening 44a is fitted in the opening 44a.

吸引板46,例如是藉由多孔質材料而形成為板狀,其上面成為隔著黏著膠帶13而吸引、保持被加工物11之保持面42a。開口44a,通過形成於框體44的內部之通路44b(參照圖4(B))而與吸引源(未圖示)連接。藉由令吸引源的負壓(真空)作用於吸引板46,在保持面42a會產生用以吸引被加工物11之吸引力。 The suction plate 46 is formed in a plate shape by a porous material, for example, and the upper surface thereof is a holding surface 42a that sucks and holds the workpiece 11 via the adhesive tape 13 . The opening 44a is connected to a suction source (not shown) through a passage 44b (see FIG. 4(B)) formed inside the casing 44. By applying a negative pressure (vacuum) of the suction source to the suction plate 46, an attractive force for attracting the workpiece 11 is generated on the holding surface 42a.

在本體部42的外周側面42b(框體44的側面),設有用以支撐框15之框支撐部48。此框支撐部 48,例如使用不鏽鋼或鋁等金屬而形成為板狀。此外,在框支撐部48,配置有產生磁力之磁鐵(磁力產生部)50,當框11是由強磁性材料所成的情形下,能夠藉由此磁鐵50的磁力來吸附而保持框11。另,作為磁鐵50,可使用電磁鐵及永久磁鐵的任一種。 A frame supporting portion 48 for supporting the frame 15 is provided on the outer peripheral side surface 42b of the main body portion 42 (the side surface of the frame body 44). This frame support 48 is formed into a plate shape using, for example, a metal such as stainless steel or aluminum. Further, a magnet (magnetic force generating portion) 50 that generates a magnetic force is disposed in the frame supporting portion 48. When the frame 11 is made of a ferromagnetic material, the frame 11 can be held by the magnetic force of the magnet 50. Further, as the magnet 50, any of an electromagnet and a permanent magnet can be used.

框支撐部48,代表性者,係形成為將外緣48a側予以部分地切除而成之圓環狀。從框支撐部48的外緣48a至中心48b之距離48c,比從構成被加工物單元1之框15的外緣15a至中心15b之距離15c還小。也就是說,框支撐部48,形成為外徑比框15還小。 The frame support portion 48 is typically formed in an annular shape in which the outer edge 48a side is partially cut away. The distance 48c from the outer edge 48a of the frame supporting portion 48 to the center 48b is smaller than the distance 15c from the outer edge 15a to the center 15b of the frame 15 constituting the workpiece unit 1. That is, the frame supporting portion 48 is formed to have an outer diameter smaller than the frame 15.

像這樣,將框支撐部48的外徑做成比框15還小,藉此能夠以被加工物單元1來覆蓋本體部42及框支撐部48的上面全體。亦即,能夠令被加工物單元1發揮如傘般的功能,故尤其是被供給至被加工物單元1的上面之液體(切割液或洗淨用的流體)會變得難以侵入至被加工物單元1與框支撐部48之間隙。 In this manner, the outer diameter of the frame supporting portion 48 is made smaller than the frame 15, whereby the entire upper surface of the main body portion 42 and the frame supporting portion 48 can be covered by the workpiece unit 1. In other words, since the workpiece unit 1 can function as an umbrella, it is particularly difficult to invade the liquid (the cutting fluid or the cleaning fluid) supplied to the upper surface of the workpiece unit 1 to be processed. The gap between the object unit 1 and the frame support portion 48.

此外,框支撐部48,從比外周側面42b的保持面42a還低的位置朝向外側延伸(參照圖4(B)),在保持面42a與框支撐部48之間形成有高低差。因此,即使液體循著黏著膠帶13等而浸入至被加工物單元1與框支撐部48之間隙,此液體的大部分也會在高低差與黏著膠帶13之間隙滴落,而不會爬上高低差。亦即,藉由此高低差可阻止液體的侵入,故液體幾乎不會到達保持面42a。 Further, the frame supporting portion 48 extends outward from a position lower than the holding surface 42a of the outer circumferential side surface 42b (see FIG. 4(B)), and a level difference is formed between the holding surface 42a and the frame supporting portion 48. Therefore, even if the liquid is immersed in the gap between the workpiece unit 1 and the frame supporting portion 48 following the adhesive tape 13 or the like, most of the liquid will drip in the gap between the height difference and the adhesive tape 13, without climbing up. Height difference. That is, the intrusion of the liquid can be prevented by the height difference, so that the liquid hardly reaches the holding surface 42a.

又,框支撐部48的一部分被切除,故液體侵入至被加工物單元1與框支撐部48之間隙的機率變得更低,此外,侵入至間隙的液體亦會通過切除部48d而容易地被排出。另,本實施形態中,從外緣48a到達至本體部42之4個深的切除部48d大致以等間隔設置,但切除部48的形狀、數量、配置等能夠任意變更。 Further, since a part of the frame supporting portion 48 is cut off, the probability of the liquid intruding into the gap between the workpiece unit 1 and the frame supporting portion 48 becomes lower, and the liquid that has entered the gap is also easily passed through the cutout portion 48d. It is discharged. In the present embodiment, the four deep cut portions 48d reaching the main body portion 42 from the outer edge 48a are provided at substantially equal intervals, but the shape, number, arrangement, and the like of the cut portions 48 can be arbitrarily changed.

圖4(A)為將被加工物單元1以夾盤平台10,38予以保持之狀態模型示意平面圖。如圖4(A)所示,若以框15的外緣15a會朝框支撐部48的外側突出之方式來將框15重疊於框支撐部48,則本體部42及框支撐部48的上面全體會受到被加工物單元1覆蓋。 Fig. 4(A) is a schematic plan view showing a state in which the workpiece unit 1 is held by the chuck platforms 10, 38. As shown in FIG. 4(A), when the outer peripheral edge 15a of the frame 15 protrudes toward the outer side of the frame supporting portion 48, the frame 15 is superposed on the frame supporting portion 48, and the upper surface of the main body portion 42 and the frame supporting portion 48 are provided. The whole is covered by the workpiece unit 1.

圖4(B)為被吸引、保持於夾盤平台10之被加工物11受到切割的情況模型示意部分截面側面圖。如圖4(B)所示,當令旋轉之切割刀34切入至被加工物11時,切割液21係被供給至被加工物11及切割刀34。 Fig. 4(B) is a schematic partial cross-sectional side view showing a state in which the workpiece 11 sucked and held on the chuck table 10 is cut. As shown in FIG. 4(B), when the rotary cutter 34 is cut into the workpiece 11, the cutting liquid 21 is supplied to the workpiece 11 and the cutter blade 34.

如上述般,本體部42及框支撐部48的上面全體受到被加工物單元1覆蓋。故,被加工物單元1,對於切割液21而言會實現如傘一般的功用。如此一來,在受到被加工物單元1覆蓋之框支撐部48等,切割液21會變得難以附著,而防止切割液21對於被加工物單元1與框支撐部48之間隙的侵入。 As described above, the entire upper surface of the main body portion 42 and the frame support portion 48 are covered by the workpiece unit 1. Therefore, the workpiece unit 1 realizes the function as an umbrella for the cutting liquid 21. In this manner, the cutting liquid 21 is less likely to adhere to the frame supporting portion 48 and the like which are covered by the workpiece unit 1, and the cutting liquid 21 is prevented from entering the gap between the workpiece unit 1 and the frame supporting portion 48.

像以上這樣,本實施形態之夾盤平台10,38,具備具有保持被加工物11的保持面42a之本體部42、及外徑比框15還小之框支撐部48,故若以框15的 外緣15a朝框支撐部48的外側突出之方式將框15重疊於框支撐部48,則本體部42及框支撐部48的上面全體會受到被加工物單元1覆蓋。 As described above, the chuck platforms 10 and 38 of the present embodiment include the main body portion 42 having the holding surface 42a for holding the workpiece 11 and the frame supporting portion 48 having an outer diameter smaller than the frame 15, so that the frame 15 is of When the outer edge 15a protrudes toward the outer side of the frame supporting portion 48, the frame 15 is superposed on the frame supporting portion 48, and the entire upper surface of the main body portion 42 and the frame supporting portion 48 is covered by the workpiece unit 1.

如此一來,被供給至被加工物單元1之液體會變得難以流落至框支撐部48,能夠防止液體對於被加工物單元1與框支撐部48之間隙的侵入。也就是說,按照本實施形態之夾盤平台10,38,能夠防止從間隙侵入的液體所造成之保持面42a的堵塞。 As a result, the liquid supplied to the workpiece unit 1 becomes difficult to flow to the frame supporting portion 48, and the intrusion of the liquid into the gap between the workpiece unit 1 and the frame supporting portion 48 can be prevented. In other words, according to the chuck platforms 10 and 38 of the present embodiment, clogging of the holding surface 42a by the liquid intruding from the gap can be prevented.

另,本發明並不限定於上述實施形態之記載,可做各種變更而實施。例如,上述實施形態中,示例了藉由磁鐵(磁力產生部)50來吸附、保持框15之框支撐部48,但框支撐部48亦可構成為藉由負壓(真空)而能夠吸引、保持框15。 Further, the present invention is not limited to the description of the above embodiments, and can be implemented in various modifications. For example, in the above-described embodiment, the frame supporting portion 48 of the frame 15 is adsorbed and held by the magnet (magnetic force generating portion) 50. However, the frame supporting portion 48 may be configured to be attracted by a vacuum (vacuum). Hold box 15.

此外,上述實施形態中,說明了一種切割裝置(加工裝置)2,具備於切割加工(加工)時保持被加工物單元1之夾盤平台10、及於洗淨時保持被加工物單元1之夾盤平台38,但本發明之夾盤平台的使用態樣並無特別的限制。例如,亦可僅使用1台本發明之夾盤平台來構成加工裝置。 Further, in the above-described embodiment, a cutting device (processing device) 2 is provided which includes the chuck table 10 for holding the workpiece unit 1 during cutting processing (processing) and the workpiece unit 1 during cleaning. The chuck platform 38, but the use aspect of the chuck platform of the present invention is not particularly limited. For example, it is also possible to use only one chuck platform of the present invention to constitute a processing apparatus.

其他上述實施形態之構造、方法等,凡是不脫離本發明目的之範圍,均能適當變更而實施。 The structures, methods, and the like of the above-described embodiments can be appropriately modified and implemented without departing from the scope of the invention.

1‧‧‧被加工物單元(框單元) 1‧‧‧Processed material unit (frame unit)

10,38‧‧‧夾盤平台 10,38‧‧‧Chuck platform

11‧‧‧被加工物 11‧‧‧Processed objects

12‧‧‧切割單元(加工單元) 12‧‧‧Cutting unit (processing unit)

13‧‧‧黏著膠帶 13‧‧‧Adhesive tape

15‧‧‧框 15‧‧‧ box

15a‧‧‧外緣 15a‧‧‧ outer edge

21‧‧‧切割液 21‧‧‧ cutting fluid

34‧‧‧切割刀 34‧‧‧Cutting knife

42‧‧‧本體部 42‧‧‧ Body Department

42a‧‧‧保持面 42a‧‧‧ Keep face

42b‧‧‧外周側面 42b‧‧‧ peripheral side

44‧‧‧框體 44‧‧‧ frame

44a‧‧‧開口 44a‧‧‧ openings

44b‧‧‧通路 44b‧‧‧ pathway

46‧‧‧吸引板 46‧‧‧Attraction board

48‧‧‧框支撐部 48‧‧‧Box support

48a‧‧‧外緣 48a‧‧‧Outer edge

48d‧‧‧切除部 48d‧‧‧Resection

50‧‧‧磁鐵(磁力產生部) 50‧‧‧ Magnet (magnetic generation unit)

Claims (4)

一種夾盤平台,設於對板狀的被加工物做加工之加工裝置,而保持由該被加工物、及圍繞該被加工物之環狀的框、及貼附於該被加工物及該框之黏著膠帶所構成的被加工物單元之夾盤平台,其特徵為,具備:本體部,具有隔著該黏著膠帶而吸引保持該被加工物之保持面;及框支撐部,在該本體部的外側支撐該框;該框支撐部,形成為外徑比該框還小,若以該框的外緣朝該框支撐部的外側突出之方式將該框重疊於該框支撐部,則該本體部及該框支撐部的上面全體會受到該被加工物單元覆蓋。 A chucking platform provided in a processing device for processing a plate-shaped workpiece, and holding the workpiece, a ring-shaped frame surrounding the workpiece, and attached to the workpiece and the workpiece The chuck platform of the workpiece unit formed by the adhesive tape of the frame, comprising: a main body portion having a holding surface for sucking and holding the workpiece through the adhesive tape; and a frame supporting portion on the body The outer side of the portion supports the frame; the frame support portion is formed to have an outer diameter smaller than the frame, and if the outer edge of the frame protrudes toward the outer side of the frame support portion, the frame is superposed on the frame support portion. The main body portion and the entire upper surface of the frame support portion are covered by the workpiece unit. 如申請專利範圍第1項所述之夾盤平台,其中,該框支撐部,更具備磁力產生部,當該框由強磁性材料所形成的情形下,將該框藉由磁力吸附而保持。 The chuck platform according to claim 1, wherein the frame support portion further includes a magnetic force generating portion, and when the frame is formed of a ferromagnetic material, the frame is held by magnetic attraction. 如申請專利範圍第1項或第2項所述之夾盤平台,其中,該框支撐部,從比該本體部的外周側面的該保持面還低之位置朝外側延伸,在該框支撐部與該保持面之間形成有高低差。 The chuck platform according to claim 1 or 2, wherein the frame support portion extends outward from a position lower than the holding surface of the outer peripheral side surface of the main body portion, and the frame support portion A height difference is formed between the holding surface and the holding surface. 如申請專利範圍第1項或第2項所述之夾盤平台,其中,該框支撐部的一部分被切除。 The chuck platform of claim 1 or 2, wherein a portion of the frame support portion is cut away.
TW105140456A 2016-01-22 2016-12-07 Chuck platform capable of preventing clogging caused by intrusion of liquid TW201732910A (en)

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